Antenna module and communication device

Abstract

An antenna module (100) comprises a first substrate (130A) and a second substrate (130B) including a side surface (137) connected to the first substrate (130A). The second substrate (130B) includes a connection communication via (155) disposed on the side surface (137) and extending in a columnar shape across the entirety of the side surface (137), a radiation element (121B), a ground electrode (GND2), and a power supply wiring line (170). The power supply wiring line (170) connects the radiation element (121B) and a portion of the connection communication via (155) that is on the side closer to the radiation element (121B) than the ground electrode (GND2).

Description

Antenna Module and Communication Device

[0001] The present disclosure relates to an antenna module and a communication device.

[0002] International Publication No. 2023 / 210118 (Patent Document 1) discloses an antenna module configured by connecting a first substrate and a second substrate each having an antenna element in an L shape. In this antenna module, connection electrodes of the same size are arranged on the connection surface of the first substrate with the second substrate and the connection surface of the second substrate with the first substrate, and the two connection electrodes are connected to supply a high-frequency signal from the first substrate to the radiation element of the second substrate via the two connection electrodes.

[0003] International Publication No. 2023 / 210118

[0004] In the configuration disclosed in International Publication No. 2023 / 210118 (Patent Document 1), in order to improve the connectivity of the transmission path of the high-frequency signal, it is conceivable to increase the size of the two connection electrodes to increase the contact area between the two connection electrodes. However, simply increasing the size of the two connection electrodes alone may cause a part of the two connection electrodes to function as a stub (so-called open stub) in which the tip is branched from the transmission path of the high-frequency signal and opened, and the transmission characteristics of the high-frequency signal may deteriorate.

[0005] The present disclosure has been made to solve the above problems, and an object thereof is to improve the connectivity of the transmission path of the high-frequency signal while maintaining the transmission characteristics of the high-frequency signal in a configuration for transmitting a high-frequency signal from a first substrate to a radiation element of a second substrate.

[0006] The antenna module according to this disclosure comprises a first flat substrate including a feeding surface which is a main surface on which a first connection electrode for transmitting a high-frequency signal is disposed, and a second flat substrate including a side surface connected to the feeding surface, and a first main surface and a second main surface facing each other and connected by the side surface. The second substrate includes a first connection via disposed on the side surface and connected to the first connection electrode, a first flat radiating element disposed along the first main surface, a flat ground electrode disposed along the second main surface in the region between the first radiating element and the second main surface, and a first wiring that connects the first connection via and the first feeding point of the first radiating element. The first connection via extends columnarly along the normal direction of the first main surface over the entire normal direction of the first main surface on the side surface. The first wiring is connected to the first connection via at the portion of the first connection via closer to the first radiating element than the ground electrode.

[0007] The communication device described herein is equipped with an on-board antenna module.

[0008] According to this disclosure, in a configuration in which a high-frequency signal from a first substrate is transmitted to a radiating element on a second substrate, it is possible to improve the connectivity of the high-frequency signal transmission path while maintaining the transmission characteristics of the high-frequency signal.

[0009] This is a block diagram of a communication device to which an antenna module is applied. This is a perspective view of the antenna module. This is a side view and partial side view (1) of the antenna module. This is a partial side view (1) of the antenna module. This is a partial side view (2) of the antenna module. This is a side view and partial side view (2) of the antenna module. This is a side view and partial side view (3) of the antenna module. This is a side view and partial side view (4) of the antenna module. This is a partial side view (3) of the antenna module.

[0010] The embodiments of this disclosure will be described in detail below with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and their descriptions will not be repeated.

[0011] (Basic Configuration of Communication Device) Figure 1 is an example of a block diagram of a communication device 10 to which the antenna module 100 according to this embodiment is applied. The communication device 10 is, for example, a mobile terminal such as a mobile phone, smartphone or tablet, or a personal computer equipped with communication functions. An example of the frequency band of radio waves used in the antenna module 100 according to this embodiment is, for example, millimeter-wave radio waves with center frequencies of 28 GHz, 39 GHz and 60 GHz, but it is also applicable to radio waves in frequency bands other than those mentioned above.

[0012] Referring to Figure 1, the communication device 10 comprises an antenna module 100 and a BBIC 200 which constitutes a baseband signal processing circuit. The antenna module 100 comprises an RFIC 110 which is an example of a power supply circuit and an antenna device 120. The communication device 10 upconverts the signal transmitted from the BBIC 200 to the antenna module 100 into a high-frequency signal and radiates it from the antenna device 120, and downconverts the high-frequency signal received by the antenna device 120 and processes the signal with the BBIC 200.

[0013] The antenna device 120 includes a dielectric substrate 105 having a substrate 130A (first substrate) and a substrate 130B (second substrate). At least one radiating element is arranged on each of the substrates 130A and 130B. In Figure 1, one example configuration is shown in which four radiating elements 121A are arranged on substrate 130A and four radiating elements 121B are arranged on substrate 130B, but the number of radiating elements arranged on each substrate is not limited to this. Substrate 130A does not need to have any radiating elements 121A. Also, in Figure 1, an example is shown in which the radiating elements are arranged in a one-dimensional array in a single row on each of the substrates 130A and 130B, but the radiating elements may be arranged in a two-dimensional array on each of the substrates 130A and 130B. Alternatively, each substrate may have a single radiating element. In this embodiment, the radiating elements 121A and 121B are patch antennas having a substantially square flat plate shape.

[0014] The RFIC 110 comprises switches 111A to 111H, 113A to 113H, 117A, and 117B, power amplifiers 112AT to 112HT, low-noise amplifiers 112AR to 112HR, attenuators 114A to 114H, phase shifters 115A to 115H, signal combiners / distributors 116A and 116B, mixers 118A and 118B, and amplification circuits 119A and 119B. Of these, the configuration of switches 111A to 111D, 113A to 113D, 117A, power amplifiers 112AT to 112DT, low-noise amplifiers 112AR to 112DR, attenuators 114A to 114D, phase shifters 115A to 115D, signal combiner / distributor 116A, mixer 118A, and amplification circuit 119A constitutes the circuit for the high-frequency signal radiated from the radiating element 121A on the circuit board 130A. Furthermore, the configuration of switches 111E-111H, 113E-113H, 117B, power amplifiers 112ET-112HT, low-noise amplifiers 112ER-112HR, attenuators 114E-114H, phase shifters 115E-115H, signal combiner / distributor 116B, mixer 118B, and amplification circuit 119B constitutes a circuit for high-frequency signals radiated from the radiating element 121B on the substrate 130B.

[0015] When transmitting a high-frequency signal, switches 111A to 111H and 113A to 113H are switched to the power amplifier 112AT to 112HT side, and switches 117A and 117B are connected to the transmitting amplifiers of the amplification circuits 119A and 119B. When receiving a high-frequency signal, switches 111A to 111H and 113A to 113H are switched to the low-noise amplifier 112AR to 112HR side, and switches 117A and 117B are connected to the receiving amplifiers of the amplification circuits 119A and 119B.

[0016] The signal transmitted from the BBIC200 is amplified by amplification circuits 119A and 119B and upconverted by mixers 118A and 118B. The upconverted high-frequency signal, the transmitted signal, is split into four by signal combiners / distributors 116A and 116B, and passes through the corresponding signal paths to supply power to different radiating elements 121A and 121B. By individually adjusting the phase shift of the phase shifters 115A to 115H placed in each signal path, the directivity of the radio waves output from the radiating elements on each board can be adjusted. In addition, attenuators 114A to 114D adjust the strength of the transmitted signal.

[0017] The received signals, which are high-frequency signals received by each radiating element 121A and 121B, are transmitted to the RFIC 110 and combined in the signal combiners / distributors 116A and 116B via four different signal paths. The combined received signals are down-converted by the mixers 118A and 118B, further amplified by the amplification circuits 119A and 119B, and then transmitted to the BBIC 200.

[0018] The RFIC 110 is formed, for example, as a single-chip integrated circuit component including the above circuit configuration. Alternatively, the devices corresponding to each radiating element 121A, 121B in the RFIC 110 (switch, power amplifier, low-noise amplifier, attenuator, phase shifter) may be formed as a single-chip integrated circuit component for each corresponding radiating element.

[0019] (Antenna Module Configuration) Next, the configuration of the antenna module 100 in this embodiment will be described in detail with reference to Figures 2 and 3.

[0020] Figure 2 is a perspective view of the antenna module 100. As described above, the antenna module 100 includes substrates 130A and 130B, radiating elements 121A and 121B, and an RFIC 110. The substrates 130A and 130B are, for example, multilayer resin substrates formed by laminating multiple resin layers made of resins such as epoxy and polyimide, multilayer resin substrates formed by laminating multiple resin layers made of liquid crystal polymer (LCP) having a lower dielectric constant, and multilayer resin substrates formed by laminating multiple resin layers made of fluororesin. Note that the substrates 130A and 130B do not necessarily have a multilayer structure and may be single-layer substrates.

[0021] Both substrates 130A and 130B have a flat plate shape. In the following description, the normal direction of substrate 130A is the Z-axis direction, the normal direction of substrate 130B is the X-axis direction, and the direction perpendicular to the Z-axis direction and the X-axis direction is the Y-axis direction.

[0022] In the antenna module 100, the side surface 137 of the substrate 130B is connected by soldering to the positive X-axis end of the main surface 132 of the substrate 130A. As a result, the cross-sectional shape of the substrates 130A and 130B when viewed from the Y-axis direction is approximately L-shaped.

[0023] In the following explanation, for the sake of ease of understanding, we will describe an example in which the radiating elements 121A and 121B are arranged so that they are exposed on the main surfaces 131 and 135 of the substrates 130A and 130B, respectively. However, the radiating elements 121A and 121B may also be arranged inside the substrates 130A and 130B, respectively.

[0024] Figure 3 shows a side perspective view of the antenna module 100 when viewed from the Y-axis direction (left figure (A)), and a partial side view of the antenna module 100 when viewed from the X-axis direction (right figure (B)). As described above, the antenna module 100 includes substrates 130A, 130B and RFIC 110.

[0025] The substrate 130A (first substrate) includes two main surfaces 131 and 132 that face each other. Furthermore, the substrate 130A includes a radiating element 121A, a ground electrode GND1, power supply wiring 141A and 141B, a connecting ground electrode 160, and a connecting communication electrode 165.

[0026] The radiating element 121A is positioned on one main surface 131 (the positive Z-axis direction) of the substrate 130A. The RFIC 110 is positioned on the other main surface 132 (the negative Z-axis direction) of the substrate 130A. The ground electrode GND1 is positioned in the layer between the radiating element 121A and the main surface 132 of the substrate 130A.

[0027] A high-frequency signal is transmitted from the RFIC 110 to the feed point SP1 of the radiating element 121A via the feed line 141A. The feed point SP1 of the radiating element 121A is located at a position offset from the center of the radiating element 121A in the negative direction of the X axis. When a high-frequency signal is supplied to the feed point SP1, radio waves with polarization in the X axis direction are radiated from the radiating element 121A in the positive direction of the Z axis.

[0028] The connection communication electrode 165 is located near the positive X-axis end of the main surface 132 of the substrate 130A. The connection communication electrode 165 is connected to the RFIC 110 via the power supply wiring 141B. Hereafter, the main surface 132 of the substrate 130A may be referred to as the "power supply surface 132".

[0029] The connecting ground electrode 160 is positioned on the power supply surface 132 of the substrate 130A, alongside the connecting communication electrode 165. In the example shown in Figure 3, one connecting ground electrode 160 is positioned on each side of the connecting communication electrode 165 in the Y-axis direction, with the 165 in between. The connecting ground electrode 160 is connected to the ground electrode GND1 via the grounding wire 180.

[0030] The substrate 130B (second substrate) includes a side surface 137 and two main surfaces 135 and 136 that face each other and are connected by the side surface 137. The side surface 137 of substrate 130B is connected by solder to the positive X-axis end of the power supply surface 132 of substrate 130A.

[0031] Furthermore, the substrate 130B includes a radiating element 121B, a grounding electrode GND2, a connecting grounding via 150, a connecting communication via 155, and a power supply wiring 170.

[0032] The connection communication via 155 (first connection via) is located on the side surface 137 of the substrate 130B and is connected to the connection communication electrode 165 of the substrate 130A by soldering. The connection communication via 155 extends in a columnar shape along the X-axis direction (normal direction to the main surface 135) across the entire X-axis direction (normal direction to the main surface 135) on the side surface 137 of the substrate 130B. That is, the connection communication via 155 has a columnar shape that penetrates from the main surface 135 to the main surface 136 on the side surface 137 of the substrate 130B.

[0033] The connecting ground via 150 is located on the side surface 137 of the substrate 130B and is connected to the connecting ground electrode 160 of the substrate 130A by soldering. Like the connecting communication via 155, the connecting ground via 150 has a columnar shape that penetrates from the main surface 135 to the main surface 136 on the side surface 137 of the substrate 130B.

[0034] The connecting communication via 155 and the connecting ground via 150 have a configuration in which a conductive material such as copper, solder, or conductive paste is placed on the inner surface of a semicircular through-hole when viewed from the X-axis direction.

[0035] The radiating element 121B is positioned on one of the main surfaces 135 (the surface located in the positive direction of the X-axis) of the substrate 130B. When viewed from the X-axis direction, the radiating element 121B has a roughly square shape overall, but a notch 125 is formed in the center of the side located in the positive direction of the Z-axis, recessed toward the negative direction of the Z-axis. In this embodiment, the tip of the notch 125 becomes the feed point SP2 (first feed point) of the radiating element 121B.

[0036] The ground electrode GND2 is positioned on the other main surface 136 of the substrate 130B (the surface located in the negative direction of the X-axis). Alternatively, the ground electrode GND2 may be positioned in the layer between the radiating element 121B and the main surface 136 of the substrate 130B.

[0037] The power supply wiring 170 (first wiring) is located on the same layer as the radiating element 121B on the substrate 130B. In this embodiment, since the radiating element 121B is located on the main surface 135 of the substrate 130B, the power supply wiring 170 is also located on the main surface 135 of the substrate 130B.

[0038] One end of the power supply wiring 170 is connected to the power supply point SP2 (the tip of the notch 125) of the radiating element 121B, and the other end of the power supply wiring 170 is connected to the positive X-axis end of the connection communication via 155. However, the other end of the power supply wiring 170 is not necessarily limited to being connected to the positive X-axis end of the connection communication via 155; it may be connected to any part of the connection communication via 155 that is closer to the radiating element 121B than the ground electrode GND2.

[0039] A high-frequency signal from the RFIC 110 is transmitted to the feed point SP2 (the tip of the notch 125) of the radiating element 121B via the feed line 141B and connecting communication electrode 165 of the substrate 130A, and via the connecting communication via 155 and feed line 170 of the substrate 130B. The feed point SP2 of the radiating element 121B is positioned offset from the center of the radiating element 121B in the positive Z-axis direction. As a result, when a high-frequency signal is supplied to the feed point SP2, radio waves with polarization in the Z-axis direction are radiated from the radiating element 121B in the positive X-axis direction.

[0040] As described above, in the antenna module 100 according to this embodiment, the side surface 137 of the substrate 130B is connected to the feed surface 132 of the substrate 130A. Connection communication vias 155 are arranged on the side surface 137 of the substrate 130B. Connection communication vias 155 are connected to connection communication electrodes 165A, which are arranged on the feed surface 132 of the substrate 130A, by soldering. Connection communication vias 155 are arranged over the entire Y-axis direction of the side surface 137. As a result, the Y-axis size of connection communication vias 155 is larger than the Y-axis size of connection communication electrodes 165A. Therefore, compared to the case where the Y-axis size of connection communication vias 155 is smaller than the Y-axis size of connection communication electrodes 165, the area for soldering connection between connection communication electrodes 165A and connection communication vias 155 can be increased, thereby improving connectivity between connection communication electrodes 165A and connection communication vias 155. This improves the connectivity of the high-frequency signal transmission path from connection communication electrodes 165 to the radiating element 121B.

[0041] Furthermore, the radiating element 121B is connected to the positive X-axis end of the connection communication via 155 via the power supply wiring 170. As a result, the connection communication via 155 functions as part of the high-frequency signal transmission path from the connection communication electrode 165 to the radiating element 121B throughout the entire Y-axis direction. This suppresses the functioning of a portion of the connection communication via 155 as an open stub, thus maintaining the high-frequency signal transmission characteristics from the connection communication electrode 165 to the radiating element 121B.

[0042] As a result of the above, the antenna module 100 according to this embodiment can improve the connectivity of the high-frequency signal transmission path from the connecting communication electrode 165 to the radiating element 121B while maintaining the transmission characteristics of the high-frequency signal from the connecting communication electrode 165 to the radiating element 121B.

[0043] "The "substrate 130A", "main surface (power supply surface) 132", and "connection communication electrode 165" in this embodiment may respectively correspond to the "first substrate", "power supply surface", and "first connection electrode" in the present disclosure. The "substrate 130B", "main surface 135", "main surface 136", and "side surface 137" in this embodiment may respectively correspond to the "second substrate", "first main surface", "second main surface", and "side surface" in the present disclosure. The "connection communication via 155", "radiating element 121B", "ground electrode GND2", and "power supply wiring 170" in this embodiment may respectively correspond to the "first connection via", "first radiating element", "ground electrode", and "first wiring" in the present disclosure. The "communication device 10" in this embodiment may correspond to the "communication device" in the present disclosure."

[0044] "(Modification Example 1) The antenna module 100 according to the above-described embodiment is of a so-called single polarization type, but the antenna module may be of a so-called dual polarization type."

[0045] "FIG. 4 is a partial side view of the antenna module 100A when viewed from the X-axis direction according to this Modification Example 1."

[0046] "The antenna module 100A is obtained by changing the substrates 130A and 130B of the above-described antenna module 100 to substrates 130AA and 130BA, respectively."

[0047] "The substrate 130AA is obtained by adding a connection communication electrode 165A (second connection electrode) and a connection ground electrode 160A to the above-described substrate 130A. The substrate 130BA is obtained by changing the radiating element 121B of the above-described substrate 130B to a radiating element 121BA, and further adding a connection communication via 155A (second connection via), a connection ground via 150A, and a power supply wiring 170A (second wiring)."

[0048] The connection communication electrode 165A and the connection ground electrode 160A are arranged on the power supply surface 132 of the substrate 130AA. The connection communication via 155A and the connection ground via 150A are arranged on the side surface 137 of the substrate 130BA. The connection communication via 155A and the connection ground via 150A are connected to the connection communication electrode 165A and the connection ground electrode 160A respectively by soldering.

[0049] In addition to the notch 125 described above, a notch 126 recessed in the positive Y-axis direction is formed in the central portion of the side located in the negative Y-axis direction of the radiation element 121BA.

[0050] The power supply wiring 170A is arranged on the same layer as the layer on which the power supply wiring 170 is arranged. One end of the power supply wiring 170A is connected to the tip portion of the notch 126 of the radiation element 121BA. The other end of the power supply wiring 170A is connected to the end on the positive X-axis side in the connection communication via 155A.

[0051] A high-frequency signal is transmitted from the RFIC 110 to the tip portion of the notch 126 of the radiation element 121BA through the connection communication electrode 165A of the substrate 130AA, the connection communication via 155A of the substrate 130BA, and the power supply wiring 170A. That is, the tip portion of the notch 126 of the radiation element 121BA becomes the power supply point SP3 (second power supply point) of the radiation element 121BA. The power supply point SP3 of the radiation element 121BA is arranged at a position offset in the positive Y-axis direction from the center of the radiation element 121BA. Thereby, when a high-frequency signal is supplied to the power supply point SP3, radio waves with the polarization direction in the Y-axis direction are radiated from the radiation element 121BA in the positive X-axis direction.

[0052] By providing the antenna module 100A having the above configuration, it is possible to support so-called dual polarization.

[0053] "Substrate 130AA" and "connection communication electrode 165A" in the first modification example 1 can respectively correspond to "first substrate" and "second connection electrode" in the present disclosure. "Substrate 130BA", "connection communication via 155A" and "power supply wiring 170A" in the first modification example 1 can respectively correspond to "second substrate", "second connection via" and "second wiring" in the present disclosure.

[0054] (Modification 2) In the above-described embodiment, a matching circuit may be added to the power supply wiring 170 of the substrate 130B to perform impedance matching between the power supply wiring 170 and the radiating element 121B.

[0055] Figure 5 is a partial side view of the antenna module 100B according to this modification 2, as seen from the X-axis direction. Antenna module 100B is the same as antenna module 100 above, but with the substrate 130B replaced by substrate 130BB. Substrate 130BB has a matching circuit 171 added to the substrate 130 above.

[0056] The matching circuit 171 is an open stub that branches off from the power supply wiring 170 in the positive direction of the Y-axis and has an open end.

[0057] By adding such a matching circuit 171, the impedance matching characteristics between the power supply wiring 170 and the radiating element 121B can be improved.

[0058] The "matching circuit 171" in this modified example 2 may correspond to the "matching circuit" in this disclosure.

[0059] (Modification 3) In the above embodiment, the connection communication via 155 and the radiating element 121B are connected via a power supply wiring 170 arranged on the same layer as the radiating element 121B. However, the connection communication via 155 and the radiating element 121B may also be connected via a power supply wiring arranged on a different layer from the radiating element 121B, and a power supply via connecting the power supply wiring to the radiating element 121B.

[0060] Figure 6 shows a side perspective view of the antenna module 100C according to this modified example 3, viewed from the Y-axis direction (left figure (A)), and a partial side view of the antenna module 100C, viewed from the X-axis direction (right figure (B)).

[0061] Antenna module 100C is the same as antenna module 100, but with the circuit board 130B replaced by circuit board 130BC. Circuit board 130BC is the same as circuit board 130, but with the radiating element 121B replaced by radiating element 121BC, and the power supply wiring 170 of circuit board 130 replaced by power supply wiring 170C and power supply via 172.

[0062] The radiating element 121BC has a substantially square shape when viewed from the X-axis direction. The radiating element 121BC does not have a notch like the notch 125 of the radiating element 121B described above.

[0063] The power supply wiring 170C is located in the layer between the radiating element 121BC and the ground electrode GND2 on the substrate 130BC. In other words, the power supply wiring 170C is located in a different layer from the layer on the substrate 130BC where the radiating element 121BC is located.

[0064] The power supply via 172 extends in the Y-axis direction and connects the power supply wiring 170C to the power supply point SP3 of the radiating element 121BC.

[0065] As described above, the connection communication via 155 and the radiating element 121BC may be connected via a power supply wiring 170C arranged on a different layer from the radiating element 121BC, and a power supply via 172 connecting the power supply wiring 170C and the radiating element 121BC.

[0066] By doing so, it becomes unnecessary to provide a notch in the radiating element 121BC, such as the notch 125 of the radiating element 121B, thereby improving the radiation pattern of the antenna.

[0067] Furthermore, the portion of the connecting communication via 155 that extends in the positive direction of the X-axis beyond the connection point with the power supply wiring 170C appears as a short open stub. However, if the length of this portion is sufficiently short compared to the wavelength of the high-frequency signal (for example, less than one-quarter of the wavelength), it will have virtually no effect on the antenna characteristics.

[0068] In this modified example 3, the "substrate 130BC," "power supply wiring 170C," and "power supply via 172" may correspond to the "second substrate," "first power supply line," and "first power supply via" in this disclosure, respectively.

[0069] (Modification 4) Although the antenna module 100 in the above-described embodiment was a so-called single-band type, the antenna module may also be a so-called dual-band type.

[0070] Figure 7 shows a side perspective view of the antenna module 100D according to this modified example 4, viewed from the Y-axis direction (left figure (A)), and a partial side view of the antenna module 100D, viewed from the X-axis direction (center figure (B), right figure (C)).

[0071] Antenna module 100D is the same as antenna module 100, but with the circuit boards 130A and 130B replaced by circuit boards 130AD and 130BD, respectively.

[0072] The substrate 130AD is the same as the substrate 130A described above, with the addition of a radiating element 122A, a connecting communication electrode 165D (second connecting electrode), and a connecting ground electrode 160D. The substrate 130BD is the same as the substrate 130B described above, with the power supply wiring 170 replaced by power supply wiring 170D, and further, with the addition of a radiating element 122B, a connecting communication via 155D (second connecting via), a connecting ground via 150D, a power supply wiring 170E, and a power supply via 173.

[0073] The radiating element 122A is positioned between the radiating element 121A and the ground electrode GND1. The size of the radiating element 122A is larger than the size of the radiating element 121A. The radiating element 122A is connected to the RFIC 110 by a separate power supply line from the radiating element 121A. When a high-frequency signal from the RFIC 110 is supplied to the radiating element 122A, radio waves with a frequency lower than the radiation frequency of the radiating element 121A are radiated from the radiating element 122A in the positive direction of the Z axis.

[0074] The connection communication electrode 165D and connection ground electrode 160D of substrate 130AD are located on the power supply surface 132 of substrate 130AD. The connection communication via 155D and connection ground via 150D of substrate 130BD are located on the side surface 137 of substrate 130BD. The connection communication via 155D and connection ground via 150D are connected to the connection communication electrode 165D and connection ground electrode 160D, respectively, by solder connections.

[0075] The power supply wiring 170D is located in the same layer as the radiating element 121B, and connects to the power supply point SP2 of the radiating element 121B and the connecting communication electrode 165.

[0076] The radiating element 122B is positioned between the radiating element 121B and the ground electrode GND2. The size of the radiating element 122B is larger than the size of the radiating element 121B. The radiating element 122B has a substantially square shape when viewed from the X-axis direction. The radiating element 122BC does not have a notch like the notch 125 of the radiating element 121B.

[0077] The power supply wiring 170E is located in the layer between the radiating element 122B and the ground electrode GND2 on the substrate 130BD. In other words, the power supply wiring 170E is located in a different layer on the substrate 130BD from the layer on which the radiating element 122BD is located.

[0078] The power supply via 173 extends in the Y-axis direction and connects the power supply wiring 170E to the power supply point SP4 of the radiating element 122B.

[0079] The high-frequency signal from the RFIC 110 is supplied to the radiating element 122B via the connecting communication electrode 165D, the power supply wiring 170E, and the power supply via 172, causing the radiating element 122B to emit radio waves with a frequency lower than the radiation frequency of the radiating element 121B in the positive direction of the X axis.

[0080] As described above, this disclosure can also be applied to so-called dual-band type antenna modules 100D.

[0081] In this modified example 4, "substrate 130AD" and "connection communication electrode 165D" may correspond to "first substrate" and "second connection electrode" in this disclosure, respectively. In this modified example 4, "substrate 130BD", "connection communication via 155D", "radiating element 122B", and "power supply wiring 170E and power supply via 172" may correspond to "second substrate", "second connection via", "second radiating element", and "second wiring" in this disclosure, respectively.

[0082] (Modification 5) Modification 5 describes a configuration in which the antenna module is miniaturized by fitting the protrusion of one substrate into the recess of the other substrate.

[0083] Figure 8 shows a side perspective view of the antenna module 100E according to this modified example 5, viewed from the Y-axis direction (left figure (A)), and a partial side view viewed from the X-axis direction (right figure (B)).

[0084] Antenna module 100E is the same as antenna module 100, but with the circuit boards 130A and 130B replaced by circuit boards 130AE and 130BE, respectively.

[0085] A recess is formed at the positive X-axis end of the power supply surface 132 of the substrate 130AE, which is recessed in the positive Z-axis direction and penetrates to the main surface 131. A convex portion is formed at the center of the Y-axis direction of the side surface 137 of the substrate 130BE, which protrudes in the positive Z-axis direction. As a result, when the substrate 130BE is viewed from above in the X-axis direction, the substrate 130BE has a roughly T-shape. The convex portion of the substrate 130BE fits into the recess of the substrate 130AE and is fitted into the recess of the substrate 130AE.

[0086] On the power supply surface 132 of the substrate 130AE, the connection communication electrode 165 and the connection ground electrode 160 are arranged on one side of the recess, and the connection communication electrode 165A and the connection ground electrode 160A are arranged on the other side.

[0087] On the side surface 137 of the substrate 130BE, a connection communication via 155 and a connection ground via 150 are arranged on one side of the protrusion, and a connection communication via 155A and a connection ground via 150A are arranged on the other side. The connection communication via 155 and the connection ground via 150 are connected to the connection communication electrode 165 and the connection ground electrode 160, respectively, by solder connections. The connection communication via 155A and the connection ground via 150A are connected to the connection communication electrode 165A and the connection ground electrode 160A, respectively, by solder connections.

[0088] The radiating element 121BE of the substrate 130BE is positioned on the main surface 135 of the substrate 130BE. A portion of the radiating element 121BE is positioned on a protruding portion of the substrate 130BE. In other words, when viewed from a plan view in the X-axis direction, a portion of the radiating element 121BE overlaps with the substrate 130AE.

[0089] The antenna module 100E according to this modified example 5 is a so-called dual-polarization type antenna module. Two feed points SP5 and SP6 are arranged on the radiating element 121BE of the substrate 130BE. Feed point SP5 is positioned offset from the center of the radiating element 121BE in the negative Z-axis direction. Feed point SP6 is positioned offset from the center of the radiating element 121BE in the negative Y-axis direction.

[0090] The power supply wiring 170G and power supply via 174 are arranged in the layer between the radiating element 121BE and the ground electrode GND2, and connect the connection communication via 155 to the power supply point SP5 of the radiating element 121BE.

[0091] The power supply wiring 170F and power supply via 175 are arranged in the layer between the radiating element 121BE and the ground electrode GND2, and connect the connection communication via 155A to the power supply point SP6 of the radiating element 121BE.

[0092] By adopting this configuration, the dimensions of the substrate 130BE in the Z-axis direction can be reduced, thereby enabling miniaturization of the device.

[0093] It should be noted that the antenna module must be a dual-polarization type; the configuration of Modification 6 can also be applied to single-polarization type antenna modules such as antenna modules 100 to 100E.

[0094] In this modified example 5, the "recess of substrate 130AE" and the "protrusion of substrate 130BE" may correspond to the "recess of the first substrate" and the "protrusion of the second substrate" in this disclosure, respectively. In this modified example 5, the "radiating element 121BE" may correspond to the "first radiating element" in this disclosure.

[0095] (Modification 6) In this modification 6, an example of an array antenna in which multiple substrates 130BE, as shown in Modification 5 of Figure 8, are arranged in the Y-axis direction will be described.

[0096] Figure 9 is a side view of the antenna module 100F according to this modified example 6, as seen from the X-axis direction. The antenna module 100F includes a substrate 130AF and a plurality of substrates 130BE. At the end of the substrate 130AF in the positive direction of the X-axis, a plurality of recesses are arranged in the Y-direction at predetermined distances apart. The protrusions of the plurality of substrates 130BE are arranged to fit into the plurality of recesses of the substrate 130AF, respectively.

[0097] Even with an antenna module 100F like the one shown in Figure 9, it is possible to miniaturize the device.

[0098] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The scope of the present invention is indicated by the claims rather than by the description of the embodiments above, and all modifications within the meaning and scope of the claims are intended to be included.

[0099] 10 Communication equipment, 100, 100A-100F Antenna module, 105 Dielectric substrate, 111A-111H, 113A-113H, 117A, 117B Switch, 112AR-112HR Low-noise amplifier, 112AT-112HT Power amplifier, 114A-114H Attenuator, 115A-115H Phase shifter, 116A, 116B Distributor, 118A, 118B Mixer, 119A, 119B Amplification circuit, 120 Antenna equipment, 121A-122BD Radiating element, 125, 125A, 126 Notches, 130, 130A, 130AA, 130AD, 130AE, 130AF, 130B, 130BA, 130BB, 130BC, 130BD, 130BE Substrate, 131, 132, 135, 136 Main surface, 137 Side surface, 141A, 141B, 170, 170A, 170C, 170D, 170E, 170F, 170G Power supply wiring, 150, 150A, 150D Connection ground via, 155, 155A, 155D Connection communication via, 160, 160A, 160D Connection ground electrode, 165, 165A, 165D Connection communication electrode, 171 Matching circuit, 172-175 Power supply via, 180 Grounding wiring, GND1, GND2; Grounding electrodes, SP1 to SP6; Power supply points.

Claims

1. An antenna module comprising: a first flat substrate including a feeding surface which is a main surface on which a first connecting electrode for transmitting a high-frequency signal is arranged; and a second flat substrate including a side surface connected to the feeding surface and a first main surface and a second main surface facing each other and connected by the side surface, wherein the second substrate includes: a first connecting via arranged on the side surface and connected to the first connecting electrode; a first flat radiating element arranged along the first main surface; a ground electrode arranged along the second main surface in the region between the first radiating element and the second main surface; and a first wiring connecting the first connecting via and the first feeding point of the first radiating element, wherein the first connecting via extends columnarly along the normal direction of the first main surface over the entire normal direction of the first main surface on the side surface, and the first wiring is connected to the first connecting via at a portion of the first connecting via closer to the first radiating element than the ground electrode.

2. The antenna module according to claim 1, wherein the second substrate is a laminate whose stacking direction is the normal direction to the first main surface, and the first wiring is arranged in the same layer on the second substrate as the layer on which the first radiating element is arranged.

3. The antenna module according to claim 1, wherein the second substrate is a laminate with the direction of lamination as the direction normal to the first main surface, and the first wiring includes a first feed line arranged in a layer different from the layer on which the first radiating element is arranged in the second substrate, and a first feed via extending in the direction normal to the first main surface.

4. The antenna module according to claim 1, wherein the first substrate further includes a second connection electrode arranged alongside the first connection electrode on the power supply surface, and the second substrate further includes a second connection via arranged alongside the first connection via on the side surface and connected to the second connection electrode of the first substrate, and a second wiring connecting the second connection via to the second power supply point of the first radiating element.

5. The antenna module according to claim 1, wherein the first substrate further includes a second connection electrode arranged alongside the first connection electrode on the power supply surface, the second substrate further includes a second connection via arranged alongside the first connection via on the side surface and connected to the second connection electrode of the first substrate, a second radiating element arranged between the first radiating element and the ground electrode, and a second wiring connecting the second connection via and the power supply point of the second radiating element.

6. The antenna module according to claim 1, wherein the second substrate further comprises a matching circuit connected to the first wiring.

7. The antenna module according to claim 2, wherein the first substrate has a recess formed in the direction normal to the power supply surface, the second substrate includes a convex portion that protrudes from the side surface on which the first connection via is arranged in the direction normal to the side surface and is arranged in the recess of the first substrate, and at least a part of the first radiating element is arranged on the convex portion.

8. The antenna module according to any one of claims 1 to 7, wherein a plurality of combinations of the first connecting electrode on the first substrate and the first connecting via, the first radiating element and the first wiring on the second substrate are arranged in a predetermined direction.

9. A communication device equipped with an antenna module according to any one of claims 1 to 7.

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