Cooling structure with adjustable cold plate position

Abstract

A cooling structure comprising: - A cold plate assembly comprising: - A cold plate, the cold plate comprising: - A first plate surface for facing one or more electronic components of the electronic board while facing away from the retention ring. - A heat dissipation structure. - A housing configured to create a liquid cooling chamber when assembled with the cold plate, the housing comprising: - A liquid inlet. - A liquid outlet being in liquid communication with the liquid inlet via the cooling chamber; - A retention ring comprising: - Mounting structures for mounting the retention ring to the electronic board. - A positioning system comprising: - An alignment mechanism. - Guiding means. The alignment mechanism and the guiding means are configured to limit the relative positioning of the retention ring and the cold plate assembly to two or more predefined positions along a first direction.

Description

[0001] Cooling structure with adjustable cold plate position

[0002] Field of the invention

[0003] This invention relates to the field of cooling structures and how to position cold plate assemblies for cooling of electronics such as CPUs or GPUs.

[0004] Background

[0005] The present disclosure relates to liquid cooling of computing devices and electronic boards such as PCBs or motherboards. It may more specifically be cooling of CPUs and GPUs of such board. In liquid cooling it is important to have thermal contact between a cold plate and the electronic device in need of cooling. Cold plates usually cool unevenly over the surface of the cold plate. In creating this thermal contact the placement of the cold plate onto an electronic device is very important in determining how effective the heat transfer from the electronic device to the cold plate is.

[0006] Cold plates within liquid cooling are normally fastened to a PCB by four screws fitting into four holes placed in a square of the PCB. The distance between the holes may vary depending on the PCB. Universal adapters for cold plates to fit onto various PCBs have been made as e.g. seen in the utility model CN201436836U. While such systems may fit several PCBs, the position of the cold plate or centre of the backplate body cannot be adjusted potentially leading to suboptimal cooling.

[0007] A system for displacing a cooling component is disclosed in US2024121915. Systems that allow for displacing a retention ring relative to a PCB have been developed e.g. the adaptor and off-set mounting kit from Thermal Grizzly. This system gives the possibility to off-set the cold plate. Using such off-set kits requires fixing multiple screws and understanding where to place the cold plate, which necessitates knowledge of the CPU to be cooled and the cold plate used placing significant responsibility for obtaining optimum cooling on the end user. Furthermore, finetuning the placement may be difficult due to lack of space for manoeuvring tools next to the cold plate assembly.

[0008] A summary of the invention

[0009] According to a first aspect of the invention, a cooling structure for cooling electronic components of an electronic board of a computer comprises:

[0010] - A cold plate assembly comprising: - A cold plate, the cold plate comprising:

[0011] - A first plate surface for facing one or more electronic components of the printed circuit board while facing away from the retention ring. - A heat dissipation structure.

[0012] - A housing configured to create a liquid cooling chamber when assembled with the cold plate, the housing comprising:

[0013] - A liquid inlet.

[0014] - A liquid outlet being in liquid communication with the liquid inlet via the cooling chamber;

[0015] - A retention ring comprising:

[0016] - Mounting structures for mounting the retention ring to the printed circuit board using connection means.

[0017] - A positioning system comprising:

[0018] - An alignment mechanism.

[0019] - Guiding means.

[0020] The alignment mechanism and the guiding means are configured to limit the relative positioning of the retention ring and the cold plate assembly to two or more predefined positions along a first direction.

[0021] By a cold plate is meant a component that provides a surface area for facing electronic components and being able to dissipate heat to the heat dissipation structure of the cold plate.

[0022] The heat dissipation structure is a feature of the cold plate designed to facilitate efficient heat transfer from the cold plate to the surrounding environment which may be a cooling liquid.

[0023] The first plate surface is facing away from the retention ring, when the cold plate assembly is assembled for use.

[0024] The heat dissipating structure may extend at least partially into the flow path of the cooling liquid flowing from the liquid inlet to the liquid outlet when the cold plate and the housing are assembled.

[0025] By a housing is meant a structural component that creates a liquid cooling chamber when assembled with the cold plate, providing a pathway for fluid flow. The housing may comprise / create at least two channels for guiding liquid into and out of the heat dissipation structure of the cold plate. Thus, the housing may comprise channels functioning as an inlet channel and an outlet channel.

[0026] A liquid inlet and a liquid outlet are components that enable the introduction and removal of coolant fluids within the system.

[0027] Mounting structures are features designed to secure the retention ring in place on an electronic board using connection means. Mounting structures may for example be thoroughgoing and / or threaded holes suitable for use with connection means such as screws.

[0028] The positioning system is a system configured to limit the relative positioning of the retention ring and cold plate assembly along a first direction.

[0029] Some of the advantages of this cooling structure are that it provides efficient heat dissipation from electronic components, allowing for improved performance and reliability. The use of liquid cooling enables precise control over temperature and reduces thermal gradients within the system. Furthermore, the positioning system ensures options for improving the accuracy of the alignment between the cold plate assembly and the electronic board, providing more effective cooling of electronic units of the electronic board.

[0030] In embodiments, the alignment mechanism is part of the housing and the guiding means are part of the retention ring.

[0031] This configuration simplifies the design and manufacturing process while maintaining the benefits of precise positioning.

[0032] In embodiments, the retention ring comprises a first ring surface facing the cold plate and a part of said first ring surface being parallel to the first plate surface when mounted to the first plate surface.

[0033] This arrangement enables the possibility of the cold plate assembly moving along the first ring surface while the first plate surface moves along the surface of the element to be cooled. In that way the contact between the cold plate and the computing unit will be maintained for the predefined steps. In embodiments the at least two predefined positions are positioned in a plane parallel to the first plate surface.

[0034] This configuration ensures that when the cold plate assembly is moved from one of the predefined positions to another predefined position the first plate surface will be moved along the plane of the first plate surface. As most computing units have a flat region on the top surface arranged to receive a cold plate, the cold plate can be positioned by moving the first plate surface along this surface while maintaining contact to the computing unit for all of the predefined positions.

[0035] Furthermore, the position of the cold plate can be adjusted while the cooling structure is assembled on an electronic board.

[0036] In embodiments, the alignment mechanism and the guiding means comprise directing means and stepwise means.

[0037] By directing means is meant a feature that only allow the retention ring and the cold plate assembly to move along one direction relative to each other.

[0038] By stepwise means is meant a feature favouring stepwise movement of the retention ring relative to the cold plate assembly. This may be realised in such a way that when the cold plate assembly and the retention ring are not affected by external forces they tend to move to one of the predefined positions due to the stepwise means.

[0039] By utilising stepwise means and directing means in combination at least two positions are predefined for the retention ring and the cold plate assembly to be positioned in relative to each other and the movement between the first predefined position and the second predefined position is guided to ensure ease of configuration and optionally reconfiguration.

[0040] In embodiments, the heat dissipation structure is making up at least part of the second surface facing opposite of the first plate surface. Hence, the heat dissipation structure may face the housing and be arranged in contact with a cooling liquid to facilitate heat transfer. Having heat dissipation structures on the second surface facing opposite of the first plate surface provides easy manufactory as microchannels can be cleaved in the cold plate.

[0041] In embodiments, the liquid inlet and outlet face toward the retention ring.

[0042] When the liquid inlet and outlet face towards the retention ring the cooling structure may be connected directly to a liquid pump in order to drive cooling liquid through the cold plate and minimize the risk of leakages of cooling liquid.

[0043] In embodiments, the cooling structure comprises a liquid pump.

[0044] Thus, the pump can drive cooling liquid trough the cold plate assembly and cool a computing unit.

[0045] In embodiments, the guiding means comprises one or more clamps, protrusions, rails, tracks, oblong holes, splits, screws, nails, grooves, end stops, parallel sides, or parallel sides with recesses.

[0046] In embodiments, cooling structure according to any of the preceding claims, wherein the alignment mechanism comprises one or more clamps, protrusions, rails, tracks, oblong holes, splits, screws, nails, grooves, end stops, parallel sides, or parallel sides with recesses.

[0047] These are examples of the form the guiding means and the alignment mechanism may take in order to provide at least two predefined positions. Any of the features may work as directing means and / or stepwise means.

[0048] In embodiments, the cold plate assembly is limited by the guiding means and alignment mechanism to move relative to the retention ring along one axis.

[0049] By moving along one direction the cooling structure can adjust the position of the cold plate assembly to provide cooling in multiple positions along this direction. Thus the cooling structure can be adjusted according to the computing unit that is to be cooled without the need to exchange the cold plate assembly. In embodiments, the cold plate assembly is limited by the guiding means and alignment mechanism to move relative to the retention ring along two axes.

[0050] Two axes provides more flexibility of positioning the cold plate assembly above the computing unit.

[0051] In a preferred variant the two axes along which the guiding means and alignment mechanism allow movement are perpendicular to each other.

[0052] In some variants the movement limitation of two axes are realized by arranging guiding means and alignment mechanisms of the same type at an angle with respect to each other. For example a first rail may limit movement along a first direction while a second and a third rail may be arranged perpendicularly to said first rail limiting the movement in a perpendicular direction but enabling various positions in a single plane. In other variants the features limiting the movement to two directions may be of different types.

[0053] In embodiments, the cooling structure comprises a radiator.

[0054] A radiator provides means for removing heat from the cooling liquid such that the cooling liquid can be circulated into the cooling structure again to remove heat from the cold plate.

[0055] In a second aspect a method for adjusting a cooling structure comprises the steps of: a. Obtaining a cooling structure comprising:

[0056] - A cold plate assembly comprising:

[0057] - A cold plate, said cold plate comprising:

[0058] - A first plate surface for facing one or more electronic components of said printed circuit board while facing away from said retention ring.

[0059] - A heat dissipation structure.

[0060] - A housing configured to create a liquid cooling chamber when assembled with said cold plate, said housing comprising:

[0061] - A liquid inlet.

[0062] - A liquid outlet being in liquid communication with said liquid inlet via said cooling chamber.

[0063] - A retention ring comprising: - Mounting structures for mounting said retention ring to said printed circuit board using connection means; and

[0064] - A positioning system comprising:

[0065] - An alignment mechanism,

[0066] - Guiding means,

[0067] wherein said alignment mechanism and said guiding means are configured to limit the relative positioning of said retention ring and said cold plate assembly to two or more predefined positions along a first direction.

[0068] b. Positioning the cold plate assembly in one of the at least two predefined positions relative to the retention ring.

[0069] Obtaining a cooling structure as above and positioning it in a predefined position may provide efficient heat dissipation from electronic components, allowing for improved performance and reliability. The use of liquid cooling enables precise control over temperature and reduces thermal gradients within the system. Furthermore, use of the positioning system ensures accurate alignment between the cold plate assembly and the electronic board, minimizing any potential issues with fluid flow or heat transfer.

[0070] In embodiments, the method further comprises the step of c. Attaching the cooling structure to an electronic board.

[0071] By such attachment efficient thermal contact to the computing unit to cool is ensured.

[0072] In embodiments, the method further comprising the step of d. Pumping cooling liquid through the cooling structure.

[0073] Pumping cooling liquid through the cooling structure enable heat exchanging such that heat is transferred from the electronic components to the cooling liquid which in turn transports the heat away from the cold plate such that the heat may transferred to the surroundings.

[0074] In the following specific examples according to aspects of the present disclosure will be explained in more detail with reference to the accompanying drawings. The present disclosure may, however, be embodied in different forms than depicted below, and should not be construed as limited to any examples set forth herein. Rather, any examples are provided so that the disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like reference numerals refer to like elements throughout. Like elementswill, thus, not be described in detail with respect to the description of each figure.

[0075] Summary of figures

[0076] Fig. 1 illustrates an angled view of a cooling structure according to an embodiment of the invention.

[0077] Fig. 2 illustrates a top view of a cooling structure according to an embodiment of the. Fig. 3 illustrates a side view of a cooling structure according to an embodiment of the invention.

[0078] Fig. 4 illustrates an angled view of a retention ring.

[0079] Fig. 5 illustrates a top view of a retention ring.

[0080] Fig. 6 illustrates an angled view of a cold plate.

[0081] Fig. 7 illustrates a zoom in of a region of the cold plate of Fig. 6.

[0082] Fig. 8 illustrates a top view of a housing of a cold plate assembly.

[0083] Fig. 9 illustrates an angled view of a housing of a cold plate assembly.

[0084] Fig. 10 illustrates a cooling structure comprising a pump and connection means. Fig. 11 illustrates the method of using a cooling structure to cool a computing unit. Fig. 12 illustrates a positioning system and a retention ring.

[0085] Detailed description of the invention

[0086] The cooling structure 10 comprises a retention ring 16 and a cold plate assembly 11 as illustrated in Fig. 1, Fig. 2, and Fig. 3 showing an embodiment of the cooling structure from different angles. The cold plate assembly 11 is comprised of a cold plate 12 and a housing 14. The cold plate 12 and the housing 14 of the cold plate assembly 11 may be integrated if produced in one piece but will normally be two separate elements and will throughout this application be regarded as two elements. The cold plate 12 has the function of transferring heat from the element to be cooled to a cooling liquid using a heat dissipation structure 30 when the cold plate 12 is arranged facing and contacting the element to be cooled.

[0087] The cold plate assembly 11 controls the distribution of cooling liquid such that heat is exchanged to the cooling liquid and transported away from the element to be cooled. The cold plate assembly 11 may be placed on a computing unit such as a CPU or GPU of a computer. These units produce a lot of heat that can be transported away to keep the temperature of the computing unit low and the computing unit in a working condition where the computing unit does not overheat as overheating may cause damage to the computing unit. As the CPU and GPU is normally what is cooled by a liquid cooling system, such as a cooling structure 10, the term computing unit to be cooled or element to be cooled is used throughout the application and is meant to comprise electronic device as CPUs, GPUs, printed circuit boards (PCBs), electronic boards, other electronic devices of a computer, or even other devices. The cooling structure 10 may be used to cool any such device and it does not have to be an element of a computer.

[0088] To circulate cooling liquid around the cold plate assembly 11 a liquid pump 40 may be used as shown in Fig. 10. The liquid pump 40 may be connected to the cooling structure 10 by direct contact or by tubes, pipes or similar.

[0089] The retention ring is illustrated in Fig. 4 and 5. The retention ring 16 of the cooling structure 10 has the function of securing the cooling structure 10 to the housing of the computing unit that is to be cooled or an electronic board as for example a printed circuit board comprising the computing unit that is to be cooled. The cold plate assembly 11 may be connected to the retention ring 16 such that when the retention ring 16 is secured to a PCB the cold plate assembly 11 is also secured to the PCB and the cold plate assembly 11 may only be able to move in two or more predefined steps.

[0090] Fig. 4 illustrates a retention ring 16 seen at an angle. The retention ring 16 comprises mounting structures 26. The function of the mounting structures 26 is to secure the retention ring 16 to the PCB or computing device for cooling. The mounting structures 26 may comprise screw holes, holes for bolts, clips, snaps, glue, and / or soldering. If the mounting structure is comprises of holes or the like the retention ring may be connected to the computing unit with connection means 27 like screws, bolt, nails, splits, or a similar element. The mounting structures 26 may be universal such that the retention ring 16 can be secured to multiple PCBs having different attaching mechanisms or different dimensions such as variations in the spacing of screws or holes. The mounting structures 26 being able to fit multiple PCBs may be obtained having oblong holes as illustrated in Fig. 4. When this retention ring 16 is secured with four screws the retention ring 16 will be locked in place for all positions of the screws sitting in the oblong holes of the mounting structures 26 of the retention ring 16. The mounting structures 26 may have any number of holes for e.g. screws such as one, two, three, four or more. The retention ring may be configured to accommodate various use cases of different PCBs or electronic boards to be cooled. The PCBs may be provided with screw holes in a square pattern but with different hole spacings for different PCBs. As shown in Fig. 5, the retention ring may be provided with mounting structures 26 embodied as screw holes being oblong along the direction toward the centre of the retention ring 16. Such oblong screw holes in the retention ring 16 ensures that the retention ring 16 may be secured to various PCBs having different holes spacings, as long as the hole spacings of the PCBs fall with in the range of positions accessible by translation of the screws along each of the oblong screw holes of the retention ring 16. While translation of the retention ring 16 is possible along each of the oblong screw holes, the retention ring 16 may be held in place by the combined action of the four mounting structures 26 matching the four screw holes of the PCB.

[0091] Moreover, the retention ring 16 has guiding means 24 such that the cold plate assembly 11 is able to be positioned in at least two predefined positions along the retention ring 16. The guiding means 24 may have many different forms or shapes. The guiding means 24 are used to guide the movement between the retention ring 16 and the cold plate assembly 11 such that the relative movement between the cold plate assembly 11 and the retention ring 16 is limited to one or two dimensions. The one or two dimensions or axes of allowed movement are perpendicular to a first surface of the cold plate 12 denoted the first plate surface 32 being the surface which is to face and contact a computing unit to be cooled. A cross sectional view of the first plate surface 32 is shown in figure 3. By limiting the movement of the cold plate to one or two directions the cold plate 12 may be displaced in predefined steps along the surface of the element to be cooled and the position of the cooling can be controlled in steps. As there are many different computing units different positions of a cold plate 12 may provide the most effective cooling of each respective computing unit. Thus a step for each of e.g. different classes of computing units may be manufactured in the cooling structure 10 such that the user does not need to figure out which position provides the most effective cooling for the users device, the manufacture can provide this information for example that step two is best for class A and step one is best for class B and so on.

[0092] A part of the guiding means 24 may be of the form of oblong holes in the retention ring 16 as illustrated in Fig. 4 and Fig. 5. Part of the alignment means may comprise protrusions and may fit into the holes of the retention ring 16 such that the retention ring 16 is free to move along one direction 28 relative to the cold plate assembly 11 but cannot move along other directions. The protrusions will have a maximum length to be displaced before contacting the end of the oblong holes of the retention ring 16, thus limiting the relative movement of the elements. The guiding means 24 will also comprise a part that provide stepwise movement along the direction 28, this part of the guiding means 24 will be described in more detail later.

[0093] Instead of oblong holes in the retention ring 16 of the cooling structure 10 the guiding means 24 may comprise two parallel sides of the retention ring 16 where the cold plate assembly 11 can slide along as illustrated in Fig. 4. The sides may comprise a stop in each end to mechanically limit the relative movement of the cold plate assembly 11 and the retention ring 16. When the guiding means 24 comprise two parallel sides of the retention ring 16 it may further comprise one or more protrusions or recesses for the cold plate assembly 11 to move in predefined steps along the two parallel sides. The parallel sides may thus be split in multiple sections with protrusions or recesses in between.

[0094] The guiding means may instead of parallel sides be comprised of four points of the retention ring arranged such that a housing of the cold plate assembly can slide along the four points in along a straight line. The four points may be positioned in the planes of two parallel sides with two point in each side.

[0095] In Fig. 4 and Fig. 5 a retention ring 16 is illustrated at different angles. The retention ring 16 has mounting structures 26 for securing the cooling structure 10 to the computing unit to be cooled or an element connected to the computing unit to be cooled. The guiding means 24 may comprise directing means 36 and stepwise means 38 as two separate elements for providing stepwise relative movement along one direction of the cold plate assembly 11 and the retention ring 16. The embodiment of the retention ring 16 shown in these figures comprise directing means in form of three oblong holes to limit the movement of the cold plate assembly 11 to one direction 28 and stepwise means 38 in the form of two recesses on each side of the retention ring 16 to limit the movement of the cold plate assembly 11 to these two predefined positions where a protrusion of the housing 14 of the cold plate assembly 11 fits into one of the recesses.

[0096] The retention ring 16 may be designed such that the housing 14 of the cold plate assembly 11 fits onto the retention ring 16 such that an alignment mechanism 22 of the cold plate assembly and the guiding means 24 of the retention ring are aligned and able to interact. The retention ring 16 has three openings for inlets and outlets of the cold plate assembly 11. These openings are not necessary as they may be placed on another side of the cold plate assembly 11 or outside the area of the retention ring 16. In such a case a liquid pump 40 may be connected through pipes or tubes.

[0097] For the cooling structure 10 illustrated in Fig. 1, 2 and 3 the cold plate assembly 11 may be connected to the retention ring 16 by being connected to a liquid pump 40 or a mechanical part. The mechanical part and the cold plate assembly 11 may be squeezed around the retention ring 16 but still be able to move in the predefined steps. This is one way of connecting the retention ring 16 with the cold plate assembly 11. In Fig. 10 the cooling structure 10 is illustrated together with a pump 40 placed on a surface of the retention ring opposite to the first ring surface and parts to connect the pump 40 to the cooling structure 10. As seen in Fig. 1 the housing 14 of the cold plate assembly 11 may comprise screw holes for securing the housing 14 to a liquid pump 40 by clamping the housing 14 and the liquid pump 40 around the retention ring 16 and therethrough connecting the cold plate assembly 11 with the retention ring 16. This connection should limit the movement of the cold plate assembly 11 relative to the retention ring 16 to two directions. In reality there will always be some play such that a small movement in a third direction may be possible but the connection is not suppose to provide more movement in the third direction than normal play. The third direction may be orthogonal to the first plate surface 32 of the cold plate assembly 11 intended to face the element to be cooled.

[0098] In an embodiment the guiding means 24 may be formed as one or more rails on the retention ring. The cold plate assembly comprises an alignment mechanism 22 that may fit together with the guiding means 24 and may be formed as one or more grooves to fit together with the guiding means 24.

[0099] In an embodiment the guiding means 24 may be formed as one or more grooves on the retention ring. The cold plate assembly comprises an alignment mechanism 22 that may fit together with the guiding means 24 and may be formed as one or more rails to fit together with the guiding means 24.

[0100] In this way the rail / groove may either be at the cold plate assembly 11 or the retention ring 16. The opposite element should then comprise a grove or recess for the rail such that the movement of the retention ring 16 relative to the cold plate assembly 11 is limited to one or two axes.

[0101] The housing 14 of the cold plate assembly 11 comprises an alignment mechanism 22 for allowing the cold plate 12 and the retention ring 16 to move in steps relative to each other along one or two directions. Thus, the alignment mechanism 22 should when the cooling structure 10 is assembled limit any movement the cold plate assembly 11 relative to the retention ring 16 in at least one direction. This at least one direction is preferably at least the direction orthogonal to the first plate surface of the cold plate 12 supposed to face the element to be cooled.

[0102] The alignment mechanism 22 is configured to interact with the guiding means 24 of the retention ring 16 such that the cold plate assembly 11 can move in predefined steps along the retention ring 16. The movement could also be described as the retention ring 16 being able to move in predefined steps along the cold plate assembly 11.

[0103] The alignment mechanism 22 may comprise directing means 36 and stepwise means 38 as two separate elements for providing stepwise relative movement along one direction of the cold plate assembly 11 and the retention ring 16. In the embodiment shown in Fig. 2 the alignment means 22 comprises three protrusions being the directing means 36 that fit into the guiding means 24 to limit the movement of the retention ring 16 relative to the cold plate assembly 11 to be along a single direction 28. The alignment mechanism further comprises stepwise means 38 in the form of a protrusion on each of two opposite sides of the cold plate assembly 11 positioned such that the protrusions fit into the recesses of the retention ring 16. Thus, protrusions and recesses may form the stepwise means 38.

[0104] The guiding means 24 of the retention ring 16 and the alignment mechanism 22 of the cold plate assembly 11 are interchangeable as the guiding means 24 and alignment mechanism 22 are to interact to ensure stepwise movement along one or two directions. In some embodiments the guiding means 24 may be a rail and the alignment mechanism 22 may be a groove for the rail to slide along and vice versa. Thus, the specific form of the guiding means 24 and the alignment mechanism 22 can vary a lot and have many different shapes providing the properties that the retention ring 16 and the cold plate assembly 11 can move relatively in predefined steps along one or two directions.

[0105] The alignment mechanism 22 and the guiding means 24 may comprise protrusions or recesses to provide movement in predefined steps of the retention ring 16 and the cold plate assembly 11. The features that ensure the stepwise movement may be the same features that limits the movement to one or two directions. One example of this is the case where the guiding means 24 are arranged on two opposite sides of the retention ring 16, the first side 42 and the second side 44 and has at least two recesses as illustrated in Fig. 4. The alignment mechanism 22 may then be a protrusion placed on each of two opposing surfaces 46 of the housing of the cold plate assembly 11 as illustrated in Fig. 8, the opposing surface 46 comprising the protrusions will be able to slide against the first 42 and the second 44 side of the retention ring 16. Thus, the guiding means 24 and alignment mechanism 22 limit the movement of the cold plate assembly 11 to one direction along the sides of the retention ring 16 and they also limit the movement to be in the steps where the protrusion of the housing fits into one of the recesses of the retention ring.

[0106] Another example where the directing means 36 and stepwise means 38 are integrated is when the guiding means 24 is a corrugated groove and the alignment mechanism 22 is a rail with one or more elastic protrusions that can be squeezed from one part of the corrugated groove to the next to create predefined steps. An embodiment having two such rails and two grooves is illustrated in Fig. 12. Alternatively the groove may be elastic such that the protrusions can be squeezed through the groove to another recess of the corrugated groove. Fig. 12 illustrates a retention ring 16 having corrugated grooves as the guiding means 22 and the alignment mechanism 24 formed as a rail of a cold plate assembly to interact with the guiding mean 22 to provide stepwise movement along one direction. For embodiments where the guiding means 24 are rails and grooves the cooling structure may comprise only one rail and one groove.

[0107] The alignment mechanism 22 of the cold plate assembly 11 and the guiding means 24 of the retention ring 16 may be configured such that the cold plate assembly 11 may move along a direction 28 parallel to the first plate surface of the cold plate 12. Thus, the cold plate assembly 11 may move compared to the retention ring 16 to obtain a more optimal cooling position for cooling electronic components on a PCB. The maximum relative movement between the retention ring 16 and the cold plate assembly 11 may be between 0,5 mm and 20 mm. The maximum relative movement between the retention ring 16 and the cold plate assembly 11 is preferably between 0,5 mm and 3 mm.

[0108] The alignment mechanism 22 and the guiding means 24 may be configured such that the cold plate assembly 11 can move along one or two directions and snaps into predefined steps. The snapping may be due to the alignment mechanism 22 and the guiding means 24 engaging to snap the cold plate assembly 11 and the retention ring 16 in a position. The engagement of the guiding means 24 and the alignment mechanism 22 may be comprised of protrusions and recesses to provide predefined snapping positions along the path of movement of the cold plate assembly 11.

[0109] Predefined positions can guide the user regarding how to position the cold plate 12 relative to the retention ring 16 to get the most effective cooling of e.g. a CPU. Thus, the user does not need to measure or know how to position a cold plate 12 on a PCB, the user can follow a manual of how to install the cold plate assembly 11 and which position the cold plate 12 should be snapped in.

[0110] The alignment mechanism 22 and the guiding means 24 may be configured such that the cold plate assembly 11 may be detached from the retention ring 16 and attached in another of the predefined positions of the cooling structure 10. Thus, the cold plate assembly 11 does not need to be able to slide along the retention ring 16. In a case where the cold plate assembly 11 is e.g. clicked off and on the retention ring 16 in a new position, the guiding means 24 may be holes for protrusions of the alignment mechanism 22 to fit into. The protrusions may then fit into additional holes for other predefined positions.

[0111] In another case where the cold plate assembly 11 may be clicked off and on the retention ring 16 in a new position, the guiding means 24 may be protrusions for fitting into holes of the alignment mechanism 22. The protrusions may then fit into additional holes for other predefined positions.

[0112] The guiding means 24 and alignment mechanism 22 may be comprised of screw holes and screws to attach the cold plate assembly 11 to the retention ring 16 in a specific position, and more screw holes could provide multiple predefined positions to connect the retention ring 16 and the cold plate assembly 11 together. The alignment mechanism 22 or the guiding means 24 does not need to be directly connected to respectively the cold plate assembly 11 and the retention ring 16 but may be a separate part like a split, screw, clip, nail, or beam. The cold plate assembly 11 may then be slid along the retention ring 16 and when the desired predefined position is obtained a split can be inserted through a hole of both the retention ring 16 and the cold plate assembly 11 to keep the cold plate assembly 11 and the retention ring 16 in place.

[0113] There may be extra parts in the system to provide the guiding means 24 e.g. if the predefined steps are in two directions the retention ring 16 may have guiding means 24 for guiding the cold plate assembly 11 along one direction 28 and another part of the cold plate assembly 11 may have another set of guiding means 24 for guiding the cold plate 12 and housing 14 of the cold plate assembly 11 in the other direction. This would provide a mechanical solution to get predefined steps in two directions.

[0114] The two directions or axes should not be parallel and may be orthogonal to each other.

[0115] The retention ring 16 may have a first ring surface and a second ring surface. The first ring surface may face towards the cold plate 12 and the second ring surface may face opposite the cold plate 12.

[0116] The cold plate 12 of the cold plate assembly 11 comprises a first plate surface configured to face towards the electronic elements that are to be cooled. The first plate surface may be flat or shaped to fit the electronic elements for cooling. The cold plate 12 of the cold plate assembly may comprise a second plate surface. The second plate surface is preferably flat for easier design of the housing 14 of the cold plate assembly 11 to place on top, but the second plate surface may have any suitable shape. The second plate surface faces away from the first plate surface. Thus the second plate surface will face away from the electronic element to be cooled when the cooling structure is attached to a computing unit. The second plate surface may face opposite of the first plate surface. The second plate surface may be partly comprised of the heat dissipation structure 30. The second plate surface may face the first ring surface of the retention ring 16.

[0117] The heat dissipation structure 30 may comprise microchannels, micro grooves, or another form of heat exchanger. The microchannels may be created by fins on the cold plate 12 and the housing 14 placed on top of the fins closing the top of the microchannels to create the microchannels. The heat dissipation structure 30 should provide a good heat transfer from the surface of the cold plate 12 facing the element to be cooled to the potential cooling liquid entering the cooling structure 10. This may be achieved by many different configurations known in the art where the preferred configuration is using fins formed from the cold plate 12.

[0118] The cold plate 12 may preferably be made from a material with a high heat conductivity such as copper, aluminium or another metal.

[0119] A cold plate 12 is illustrated in Fig. 6 and Fig. 7. Fig. 7 is a zoom in on part of the heat dissipation structure 30 of the cold plate 12 which for the illustrated embodiment has the form of fins. The cold plate 12 illustrated has multiple holes for attaching the housing 14 to the cold plate 12 such that a liquid-tight chamber is formed in between the cold plate 12 and the housing 14.

[0120] The cold plate 12 may be made of a material having a high heat conductivity such that heat can be exchanged effectively between a cooling liquid in thermal contact with the cold plate 12 and the element to be cooled in thermal contact with the cold plate 12. The electronic element to be cooled may be in thermal contact with the first plate surface of the cold plate 12 and cooling liquid may be in thermal contact of the cold plate 12 through a heat dissipation structure 30 of the cold plate 12.

[0121] Various designs for the heat dissipation structure 30 may be used and may provide effectively uniform cooling or non-uniform cooling where the heat transfer from the first plate surface of the cold plate 12 to the cooling liquid of the cold plate 12 varies and is optimized for specific areas of the cold plate 12.

[0122] The cold plate assembly 11 comprises a cold plate 12 and a housing 14. The housing 14 is configured to create a liquid chamber when assembled with the cold plate 12. The housing 14 furthermore comprise a liquid inlet 18 for receiving cooling liquid. The housing 14 of the cold plate assembly 11 further comprises a liquid outlet 20 for discharging cooling liquid such that heat can be transported away from the heat generating elements like the electronic elements of a PCB. The liquid inlet 18 and the liquid outlet 20 is in liquid communication with each other through channels of the heat dissipation structure 30 of the cold plate 12 The housing 14 is created to fit together with a cold plate 12 to form a liquid tight chamber for cooling liquid to enter through an inlet and exit through an outlet of the housing 14.

[0123] The liquid tight chamber may comprise an inlet channel, and an outlet channel, and micro channels.

[0124] The housing 14 of the cold plate assembly 11 may ensure that the cold plate assembly 11 is liquid tight such that no cooling liquid will be leaked from the cold plate assembly 11 which could make the system less effective. To prevent leaking cooling liquid the housing 14 may be made of plastic, rubber, silicone, metal or a similar material. The cold plate assembly 11 may if the housing 14 e.g. is made of plastic or metal comprise seals for preventing cooling liquid leaking.

[0125] A housing 14 of the cold plate assembly 11 is illustrated in Fig. 8 and Fig. 9. This housing 14 has two liquid outlets 20 and one liquid inlet 18. The liquid inlet 18 is centred and all the outlets and inlets are facing up away from the side where the cold plate 12 is to be attached. The illustrated housing 14 has screw holes for attaching the housing 14 to a pump 40 and is configured such that the retention ring 16 may be held in place in between the housing 14 and the pump 40. The housing 14 of the cold plate assembly 11 is illustrated having three protrusions and two flexible clamps as the alignment mechanism 22. The flexible clamp on the side ensures that the housing 14 will be forced to mainly be positioned in one of the two predefined positions which is defined by the recesses of the retention ring 16 which the protrusions fit into. In Fig. 2 the retention ring 16 comprises two recesses on two opposite sides which provide two predefined position of the cold plate assembly 11. There may be more recesses arranged as a continuous row of recesses. Having more recesses would require that the holes and end stops were adapted to the additional predefined positions which in this case is defined by the number of recesses.

[0126] The housing 14 of the cold plate assembly 11 is configured to be connected to a liquid pump 40 either through pipes / tubes or directly. In Fig. 8 and 9 the housing 14 is configured to be connected directly to a pump 40 as illustrated in Fig. 10. The inlet and outlets are to be liquid tight connected to the pump 40 which may be done using different connections e.g. using seals.

[0127] The cooling structure 10 may use a liquid pump 40 and a housing of the pump 40 for driving the cooling liquid through the cooling structure 10. The pump 40 may be positioned separated from the cooling structure 10 and connected to the assembly through pipes, tubes or channels. The cooling structure 10 may comprise the liquid pump 40 and the pump 40 may be placed on top of the retention ring 16. The pump 40 may connect to the cold plate assembly 11 through and / or around the retention ring 16 such that the pump 40 is in liquid connection with inlet and outlet of the cold plate assembly 11. The pump 40 may further comprise a liquid inlet 18 for receiving cooling liquid and a liquid outlet 20 for discharging cooling liquid for the cooling liquid to be cooled e.g. in a radiator system and returned to the cooling structure 10 for cooling of a computing unit.

[0128] Fig. 10 illustrates a cooling structure 10 and a liquid pump 40 comprising a housing. This system may be connected to a radiator and placed on a PCB such that the cold plate 12 is positioned adjacent to the computing unit to be cooled.

[0129] Fig. 10 illustrate a system where the pump 40 has one inlet and one outlet on a side of the pump 40. The inlet and outlet may be positioned on any side of the pump 40 as long as a radiator or similar can be connected to the inlet and outlet.

[0130] In general the invention can have many different embodiments with different shapes and features. Common for the embodiments is that they may comprise one or more inlets for the cold plate assembly 11 and one or more outlets. Furthermore, the cold plate assembly 11 may comprise one or more inlet channels and one or more outlet channels additional to a heat dissipation structure 30. The liquid tight chamber may comprise one or more inlet channels, one or more outlet channels, and microchannels. The one or more inlet channels may be in direct fluid connection / communication to one or more of the inlet channels. By direct fluid connection is understood fluid communication between two channels which is not mediated trough another set of pipes, tubes, or channels. If two components are in direct fluid connection it is to be understood that the two components are directly connected. The inlet channels may be in direct fluid contact with the heat dissipation structure 30. The heat dissipation structure 30 may be in direct fluid contact with the outlet channels. In such a configuration the inlet channel and the outlet channel may be in indirect fluid communication mediated via the heat dissipation structure 30. The outlet channel may be in direct fluid contact with the outlet. The outlet, inlet, outlet channels, inlet channels, and heat dissipation structure 30 separately may be formed by a combination of the cold plate 12 and the housing 14 of the cold plate 12 or only by one of these elements.

[0131] The cold plate assembly may comprise a visual indicator 50 to display or indicate which of the predefined positions the retention ring is positioned in. The retention ring may be positioned in one of two predefined positions which is e.g. the centre position. The visual indicator 50 may be formed as illustrated in Fig. 2 and Fig. 5 as one or more protrusions positioned on the retention ring. The example illustrated in Fig. 2 and 5 include 2 protrusions. The two protrusions are positioned and configured such that one protrusion can be seen as extending outside the area of the cold plate from a top or bottom view of the cooling structure when the retention ring is in the centre position. Atop view of the cooling structure is illustrated in Fig. 2 where the top of the housing is not shown. When the retention ring is positioned in the off-set predefined position both of the protrusions will be visible outside the area of the cold plate when viewed from the top or the bottom as illustrated in Fig. 2. From the position of the cold plate shown in Fig. 2 the cold plate may be moved to the right such that only one of the protrusions of the visual indicator 50 is outside the area of the cold plate. The visual indicator may be designed to have any other suitable form such as a small groove in housing or the cold plate, a hole in the retention ring that would be covered in one position and not in the other position. The effect of the visual indicator is to provide the user of the cooling structure to determined by visual inspection which of the predefined positions the cold plate is positioned in. Thus, the visual indicator provides information of the cooling system and the user may use this information to get the most optimal cooling position of the cooling structure to cool an electronic component.

[0132] The two or more predefined positions of the cold plate assembly relative to the retention ring may be a centred position for the cold plate and one or more off-set positions of the cold plate. Thus, when there are two predefined positions, the cold plate may be off-set along the off-set direction. In order to reposition the cold plate along other directions than the off-set direction the full cooling structure may be rotated before fastened to the electronic board such as a motherboard.

[0133] A method of positioning a cooling structure 10 in a predefined position to cool a computing unit is illustrated in figure 11. The method comprises the following steps: a. Obtaining a cooling structure.

[0134] b. Positioning the cold plate assembly in one of at least two predefined positions. c. Optionally attaching the cooling structure to an electronic board.

[0135] d. Optionally pumping cooling liquid through the cooling structure that further comprises a pump.

[0136] The cooling structure used in the method may be as described in any embodiment of the cooling structure of this application. The optional steps of the method are illustrated as dashed boxes. In step a. a cooling structure according to any embodiment of the cooling structure described in the application is obtained. Thus, there is a device that can be used to cool a computing unit. To cool a computing device with optimal cooling the cold plate assembly of the cooling structure may be positioned in one of the predefined positions and the position that provides the most efficient cooling of the element to be cooled. The most optimal cooling or the most efficient cooling may be defined as cooling the most at the point where the temperature is highest or cooling such that the maximum temperatures is kept below a certain threshold or cooling such that the average temperature is below a certain threshold. Thus one of the predefined positions of the cooling structure will most likely be cooling more efficiently than the other predefined positions of the cooling structure 10. The specific position of the cold plate assembly is defined by the manufacturer of the cooling structure and the manufacturer may state which positions are best suited for which computing devices. In that way the user does not need to test anything or know which position is the most optimal of the cooling structure, but can choose the one which is stated by the manufacturer. This makes the cooling structure user-friendly and easy to use and if the computing device is replaced the cooling structure can be adjusted to suit the new component.

[0137] In step b. of the method, the cold plate assembly is positioned in one of the at least two predefined positions created by the guiding means 24 and the alignment mechanism 22 of the cooling structure 10. The cooling structure may be obtained in one of the predefined positions, and if the cold plate assembly is in the right position there is no need to move the cold plate assembly. This is still considered to position the cooling structure in a predefined position.

[0138] Step c. of the method is optional and comprises attaching the cooling structure to a PCB. This makes it possible to cool a computing unit of a PCB as the cold plate may be placed in contact with the computing unit to cool. The steps b and c may be performed as first b and then c or first c and then b as the cold plate assembly can be moved to another predefined position while the cooling structure is installed on a PCB.

[0139] Step d. of the method comprises the step of pumping cooling liquid through the cooling structure such that heat may be removed from the cold plate and the computing unit. In this step the cooling structure comprise a pump to drive the cooling liquid and may further be connected to a radiator to remove the heat from the cooling liquid. The system may be a closed liquid-tight loop.

[0140] Below is a list of reference signs used in the detailed description of the present disclosure and in the drawings referred to in the detailed description of the present disclosure.

[0141] 10 Cooling structure

[0142] 11 Cold plate assembly

[0143] 12 Cold plate

[0144] 14 Housing of cold plate assembly

[0145] 16 Retention ring

[0146] 18 Liquid inlet

[0147] 20 Liquid outlet

[0148] 22 Alignment mechanism

[0149] 24 Guiding means

[0150] 26 Mounting structures

[0151] 27 Connection means

[0152] 28 Illustration of first direction

[0153] 30 Heat dissipation structure

[0154] 32 First plate surface

[0155] 34 First ring surface

[0156] 36 Directing means

[0157] 38 Stepwise means

[0158] 40 Liquid pump

[0159] 42 First side of retention ring

[0160] 44 Second surface of retention ring

[0161] 46 Opposing surfaces of cold plate housing

[0162] 50 Visual indicator a. Obtaining a cooling structure

[0163] b. Positioning the cooling structure in one of the at least two predefined positions c. Attaching the cooling structure to an electronic board

[0164] d. Pumping cooling liquid through the cooling structure

Claims

25Claims1. A cooling structure (io) for cooling electronic components of an electronic board of a computer, said cooling structure (io) comprising:- a cold plate assembly (n) comprising:- a cold plate (12), said cold plate (12) comprising:- a first plate surface (32) for facing one or more electronic components of said electronic board while facing away from a retention ring (16);- a heat dissipation structure (30);- a housing configured to create a liquid cooling chamber when assembled with said cold plate (12), said housing comprising:- a liquid inlet (18);- a liquid outlet (20) being in liquid communication with said liquid inlet (18) via said cooling chamber;- a retention ring (16) comprising:- mounting structures (26) for mounting said retention ring (16) to said electronic board using connection means (27); andcharacterized in that said cooling structure (10) comprises a positioning system comprising:- an alignment mechanism (22),- guiding means (24),wherein said alignment mechanism (22) and said guiding means (24) are configured to limit the relative positioning of said retention ring (16) and said cold plate assembly (11) to two or more predefined positions along a first direction.

2. A cooling structure (10) according to any of the preceding claims, wherein said alignment mechanism (22) being part of said housing and said guiding means (24) being part of said retention ring (16).3- A cooling structure (io) according to any of the preceding claims, wherein said alignment mechanism (22) and said guiding means (24) comprise directing means (36) and stepwise means (38).

4. A cooling structure (10) according to any of the preceding claims, wherein said retention ring (16) comprises a first ring surface (34) facing said cold plate (12) and a part of said first ring surface (34) being parallel to a first plate surface (32).

5. A cooling structure (10) according to any of the preceding claims, wherein said heat dissipation structure (30) is making up at least part of a second plate surface of said cold plate (12), wherein the second plate surface facing opposite of said first plate surface (32).

6. A cooling structure (10) according to any of the preceding claims, wherein said liquid inlet (18) and outlet face toward said retention ring (16).

7. A cooling structure (10) according to any of the preceding claims, wherein said cooling structure (10) comprises a liquid pump (40).

8. A cooling structure (10) according to any of the preceding claims, wherein said guiding means (24) comprise one or more clamps, protrusions, rails, tracks, oblong holes, splits, screws, nails, grooves, end stops, parallel sides, or parallel sides with recesses.

9. A cooling structure (10) according to any of the preceding claims, wherein said alignment mechanism (22) comprises one or more clamps, protrusions, rails, tracks, oblong holes, splits, screws, nails, grooves, end stops, parallel sides, or parallel sides with recesses.

10. A cooling structure (10) according to any of the preceding claims, wherein said cold plate assembly (11) is limited by said guiding means (24) and alignment mechanism (22) to move relative to said retention ring (16) along one axis.

11. A cooling structure (10) according to any of the claims 1-8, wherein said cold plate assembly (11) is limited by said guiding means (24) and alignment mechanism (22) to move relative to said retention ring (16) along two axes.

12. A cooling structure (10) according to any of the preceding claims, wherein said cold plate assembly (11) comprises a visual indicator (50) indicating which one of said predefined positions said retention ring (16) is occupying.13- A method for adjusting a cooling structure (io), the method comprising the steps of:a. Obtaining a cooling structure (io) comprising:- a cold plate assembly (n) comprising:- a cold plate (12), said cold plate (12) comprising:- a first plate surface (32) for facing one or more electronic components of said electronic board while facing away from a retention ring (16);- a heat dissipation structure (30);- a housing configured to create a liquid cooling chamber when assembled with said cold plate (12), said housing comprising:- a liquid inlet (18);- a liquid outlet (20) being in liquid communication with said liquid inlet (18) via said cooling chamber;- a retention ring (16) comprising:- mounting structures (26) for mounting said retention ring (16) to said electronic board using connection means (27); and- a positioning system comprising:- an alignment mechanism (22),- guiding means (24),wherein said alignment mechanism (22) and said guiding means (24) are configured to limit the relative positioning of said retention ring (16) and said cold plate assembly (11) to two or more predefined positions along a first direction. b. Positioning said cold plate assembly (11) in one of said at least two predefined positions relative to said retention ring (16).

14. The method according to claim 13, wherein the method further comprises the step of28c. Attaching said cooling structure (10) to an electronic board.

15. The method according to claim 13, wherein the method further comprises the step ofd. Pumping cooling liquid through said cooling structure (10).

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