Chiller system capable of controlling temperature of heat exchanger without tuning

Abstract

A chiller system capable of controlling the temperature of a heat exchanger without tuning, according to an embodiment of the present invention, comprises: a reservoir tank storing a fluid recovered from a semiconductor facility; a recovery line through which the recovered fluid is stored in the reservoir tank; a supply line through which the stored fluid is supplied to the semiconductor facility; a pump pumping the fluid to the semiconductor facility; and a heat exchanger temperature control system including a heat exchanger and a heat exchanger temperature control unit.

Description

Chiller system capable of heat exchanger temperature control without tuning

[0001] The present invention relates to a chiller system, and more specifically, to a chiller system capable of controlling the temperature of a heat exchanger without tuning.

[0002] As semiconductor device technology becomes increasingly sophisticated, the control precision of equipment applied to semiconductor manufacturing facilities is also becoming important.

[0003] Chillers are used to control the temperature of semiconductor manufacturing equipment.

[0004] Generally, a heat exchanger performs temperature control by exchanging the heat quantities of a relatively high-temperature fluid (hereinafter referred to as the high-temperature fluid) that cools the temperature of semiconductor process equipment and a relatively low-temperature fluid (hereinafter referred to as the low-temperature fluid) that cools it, respectively, within the heat exchanger.

[0005] For example, in semiconductor manufacturing equipment, a heat exchanger measures the outlet temperature of the controlled low-temperature or high-temperature fluid to maintain the temperature of a specific flow path at a desired value. Then, using the error from a preset temperature (i.e., the set temperature value), it performs a Proportional-Integral-Derivative (PID) control operation to calculate a result. Based on this calculated result, the flow rate of the non-controlled flow path is controlled, thereby controlling the temperature through the rate of change of transferred energy.

[0006] As an example, according to the conventional method, the process of controlling a high-temperature fluid into a low-temperature fluid through a heat exchanger is explained as follows.

[0007] First, the temperature to be controlled is measured using a temperature sensor that measures the outlet temperature of the high-temperature fluid. Then, a proportional-integral-derivative control operation is performed using the difference between the set temperature value and the measured temperature value as the input, and the valve is controlled using the result as the output to control the flow of the high-temperature fluid.

[0008] However, according to this existing method, it is not possible to respond quickly to changes in set temperature values ​​caused by changes in the semiconductor process.

[0009] For this reason, there is a disadvantage in that the proportional-integral-derivative constants must be tuned individually whenever the semiconductor process is changed. Additionally, changes to the proportional-integral-derivative control constants are required for each process temperature, and there is a disadvantage in that temperature hunting occurs when the set temperature value is changed.

[0010] In addition, conventional Proportional-Integral-Derivative (PID) control requires setting individual PID control constants according to the set temperature values. For example, if there are N process temperatures, N settings are required; rapid temperature control and reduced temperature hunting are possible only if the PID control constants are set to match the process temperatures.

[0011] Since the semiconductor manufacturing process involves significant temperature fluctuations, it is necessary to set and modify the respective proportional-integral-derivative control constants whenever the process changes, which leads to the problem of process time delays.

[0012] A related prior art document is Korean Patent Publication No. 10-2007-0048946, which discloses a chiller device for semiconductor process equipment.

[0013] The objective of the present invention is to provide a chiller system for semiconductor processes that enables heat exchanger temperature control without tuning.

[0014] The objects of the present invention are not limited to those mentioned above, and other unmentioned objects and advantages of the present invention may be understood from the following description and will be more clearly understood by the embodiments of the present invention. Furthermore, it will be readily apparent that the objects and advantages of the present invention can be realized by the means and combinations thereof set forth in the claims.

[0015] According to one aspect of the present invention, a chiller system capable of controlling the temperature of a heat exchanger without tuning can be provided for a chiller system for a semiconductor process.

[0016] A chiller system according to one embodiment includes: a reservoir tank for storing fluid recovered from a semiconductor facility; a recovery line for storing the fluid recovered from the semiconductor facility in the reservoir tank; a supply line for supplying the fluid stored in the reservoir tank to the semiconductor facility; a pump for pumping the fluid stored in the reservoir tank to the semiconductor facility; and a heat exchanger temperature control system comprising a heat exchanger for controlling the temperature of the fluid recovered from the semiconductor facility and a heat exchanger temperature control unit for controlling the temperature control function of the heat exchanger.

[0017] According to one embodiment, the heat exchanger may have a first flow path for flowing a fluid recovered from the semiconductor facility, and a second flow path for flowing a low-temperature or high-temperature heat exchange fluid that exchanges heat with the fluid to control the temperature of the fluid recovered from the semiconductor facility.

[0018] According to one embodiment, the heat exchanger temperature control system may further include: a bypass line, one end of which is connected to the recovery line upstream of the inlet of the heat exchanger and the other end of which is connected to the recovery line downstream of the outlet of the heat exchanger; and a 3-way valve located at one end of the bypass line, which controls the flow of fluid recovered from the semiconductor facility into the heat exchanger or the bypass line.

[0019] Additionally, the heat exchanger temperature control system may further include: a first temperature sensor located upstream of the position where the fluid recovered from the semiconductor facility flows into the 3-way valve and detecting the temperature of the fluid supplied to the heat exchanger; and a first flow sensor located upstream of the position where the fluid recovered from the semiconductor facility flows into the 3-way valve and detecting the flow rate of the fluid flowing along the recovery line.

[0020] Additionally, the heat exchanger temperature control system may further include: a second temperature sensor installed in a heat exchange fluid supply line through which the heat exchange fluid is supplied into the interior of the heat exchanger and which detects the temperature of the heat exchange fluid before heat exchange; and a second flow sensor installed in a heat exchange fluid recovery line through which the heat exchange fluid that has passed through the heat exchanger is recovered and which detects the flow rate of the heat exchange fluid recovered from the heat exchanger.

[0021] According to another embodiment, the heat exchanger temperature control system may further include: a bypass line, one end of which is connected to the heat exchange fluid supply line and the other end of which is connected to the heat exchange fluid recovery line, for bypassing the heat exchange fluid flowing to be supplied into the interior of the heat exchanger and recovering it to the heat exchange fluid recovery line; and a 3-way valve located at one end of the bypass line for controlling the flow of the heat exchange fluid to the heat exchanger or the bypass line.

[0022] Additionally, the heat exchanger temperature control system may further include: a first temperature sensor located upstream of the inlet of the heat exchanger and detecting the temperature of a fluid recovered from the semiconductor facility and supplied to the heat exchanger; and a first flow sensor located upstream of the inlet of the heat exchanger and detecting the flow rate of a fluid recovered from the semiconductor facility and supplied to the heat exchanger.

[0023] Additionally, the heat exchanger temperature control system may further include: a second temperature sensor installed in a heat exchange fluid supply line through which the heat exchange fluid is supplied into the interior of the heat exchanger, positioned upstream of the 3-way valve, and detecting the temperature of the heat exchange fluid; and a second flow sensor installed in a heat exchange fluid recovery line through which the heat exchange fluid that has passed through the heat exchanger is recovered, positioned downstream of the other end of the bypass line, and detecting the flow rate of the heat exchange fluid recovered from the heat exchanger.

[0024] According to one embodiment, the heat exchanger temperature control unit comprises: an input unit including a temperature input unit that receives temperature values ​​measured by the first and second temperature sensors and a flow rate input unit that receives flow rate values ​​measured by the first and second flow rate sensors; a fluid density and specific heat calculation unit that calculates the density and specific heat of a fluid using the temperature values ​​measured by the first and second temperature sensors input to the temperature input unit; and a heat quantity calculation unit that calculates the heat quantity of each flow path using the flow rate values ​​measured by the first and second flow rate sensors input to the flow rate input unit.

[0025] According to one embodiment, the device may further include a final supply temperature controller for controlling the temperature of the fluid supplied to the semiconductor facility.

[0026] According to one embodiment, a third temperature sensor may be further included, which is located at the inlet of the reservoir tank and detects the temperature of the fluid after heat exchange.

[0027] According to one embodiment, a fourth temperature sensor may be further included, which is located at the outlet of the final supply temperature control unit and detects the temperature of the fluid supplied to the semiconductor facility.

[0028] According to one embodiment, a pressure sensor may be further included that is located between the downstream end of the fourth temperature sensor and the inlet of the semiconductor facility and detects the pressure of the fluid supplied to the semiconductor facility through the supply line.

[0029] According to various embodiments, there is an advantage in being able to perform temperature control of the heat exchanger of a semiconductor process chiller system without tuning.

[0030] In addition to the effects described above, the specific effects of the present invention are described together with the specific details for implementing the invention below.

[0031] FIG. 1 is a conceptual diagram briefly illustrating a chiller system capable of controlling the temperature of a heat exchanger without tuning according to one embodiment.

[0032] FIG. 2 is a conceptual diagram briefly illustrating a heat exchanger temperature control system of a chiller system according to one embodiment.

[0033] FIG. 3 is a conceptual diagram illustrating in more detail a heat exchanger temperature control system of a chiller system according to one embodiment.

[0034] FIG. 4 is a conceptual diagram briefly illustrating a chiller system capable of heat exchanger temperature control without tuning according to another embodiment.

[0035] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings so that those skilled in the art can easily implement the invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein.

[0036] To clearly explain the present invention, parts unrelated to the description have been omitted, and the same reference numerals are assigned to identical or similar components throughout the specification. Additionally, some embodiments of the present invention are described in detail with reference to the exemplary drawings. In assigning reference numerals to the components of each drawing, identical components may have the same reference numeral whenever possible, even if they are shown in different drawings. Furthermore, in describing the present invention, if it is determined that a detailed description of related known components or functions could obscure the essence of the invention, such detailed description may be omitted.

[0037] In describing the components of the present invention, terms such as first, second, A, B, (a), (b), etc., may be used. These terms are intended only to distinguish the components from other components, and the nature, order, sequence, or number of the components are not limited by these terms. Where it is stated that a component is "connected," "combined," or "connected" to another component, it should be understood that the component may be directly connected or connected to the other component, but that other components may be "interposed" between each component, or that each component may be "connected," "combined," or "connected" through other components.

[0038] In addition, for convenience of explanation in implementing the present invention, the components may be described in detail; however, these components may be implemented within a single device or module, or a single component may be divided and implemented across multiple devices or modules.

[0039] As semiconductor device technology becomes increasingly sophisticated, the control precision of equipment applied to semiconductor manufacturing facilities is also becoming important.

[0040] A chiller can be used as a device to control the temperature of semiconductor manufacturing equipment.

[0041] Referring to the attached drawings, a chiller system capable of controlling the temperature of a heat exchanger without tuning according to various embodiments will be described below.

[0042] In the drawings, FIG. 1 is a conceptual diagram briefly illustrating a chiller system capable of heat exchanger temperature control without tuning according to one embodiment, FIG. 2 is a conceptual diagram briefly illustrating a heat exchanger temperature control system of a chiller system according to one embodiment, and FIG. 3 is a conceptual diagram more specifically illustrating a heat exchanger temperature control system of a chiller system according to one embodiment.

[0043] Referring to FIG. 1, a chiller system (1) according to one embodiment includes a reservoir tank (10) that stores fluid recovered from a semiconductor facility (2).

[0044] According to one embodiment, the chiller system (1) may further include a recovery line (20). The recovery line (20) refers to a piping line used for temperature control in a semiconductor facility (2) and for transporting and storing the recovered high-temperature fluid to the reservoir tank (10).

[0045] According to one embodiment, the chiller system (1) may further include a supply line (30). The supply line (30) refers to a piping line that recirculates the fluid stored in the reservoir tank (10) and supplies it to the semiconductor facility (2).

[0046] According to one embodiment, the chiller system (1) may further include a pump (40). The pump (40) refers to a hydraulic device that circulates the fluid stored in the reservoir tank (10) using the supply line (30) and pressurizes it to the semiconductor facility (2).

[0047] According to one embodiment, the chiller system (1) may further include a final supply temperature controller (50). The final supply temperature controller (50) may include a configuration of various output devices that control the temperature of the fluid to a temperature required by the semiconductor equipment. According to a preferred embodiment, the final supply temperature controller (50) may be configured to include a heater that heats the temperature of the fluid to a set temperature. Alternatively, the final supply temperature controller (50) may be a cooling device that cools the temperature of the fluid to a set temperature. Alternatively, the final supply temperature controller (50) may be configured to include a heat exchanger that controls the temperature of the fluid to a set temperature. Alternatively, the final supply temperature controller (50) may be configured to include a TEM block, etc.

[0048] The temperature-controlled fluid from the end supply temperature controller (50) can be supplied to the semiconductor facility (2) through the supply line (30).

[0049] A heat exchanger temperature control system (100) of a chiller system (1) according to one embodiment may include a heat exchanger (110) and a heat exchanger temperature control unit (200).

[0050] The heat exchanger (110) can heat exchange the recovered fluid with a high-temperature or low-temperature fluid (hereinafter referred to as the heat exchange fluid) flowing inside the heat exchanger (110) to control the temperature of the fluid recovered from the semiconductor facility (2).

[0051] As a preferred example, the heat exchanger (110) may have a first flow path (or first heat exchanger channel) (111) for flowing fluid recovered from the semiconductor facility (2). Additionally, the heat exchanger (110) may have a second flow path (or second heat exchanger channel) (112) for flowing a low-temperature or high-temperature fluid, i.e., a heat exchange fluid, which is heat exchanged with the fluid recovered from the semiconductor facility.

[0052] The heat exchanger temperature control unit (200) can calculate the heat amount of each flow path of the heat exchanger (110) and control the temperature of the fluid recovered from the semiconductor facility and circulating along the chiller system (1).

[0053] Referring to FIGS. 1 to 3, a heat exchanger temperature control system (100) according to one embodiment may further include a bypass line (113).

[0054] According to one embodiment, the bypass line (113) may be a piping line provided in the recovery line (20) by bypassing between the inlet and outlet of the heat exchanger (110).

[0055] As a preferred example, one end of the bypass line (113) may be connected to the recovery line (20) upstream of the inlet (121) of the heat exchanger (110). Additionally, the other end of the bypass line (113) may be connected to the recovery line (20) downstream of the outlet (122) of the heat exchanger (110).

[0056] Referring to FIGS. 1 to 3, a heat exchanger temperature control system (100) according to one embodiment may further include a 3-way valve (114).

[0057] According to one embodiment, a 3-way valve (114) may be located at one end of the bypass line (113).

[0058] The 3-way valve (114) can control the opening and closing of the flow path through which the fluid recovered from the semiconductor facility (2) flows to the heat exchanger (110) and / or the bypass line (113), and can be controlled according to the control command of the heat exchanger temperature control unit (200).

[0059] Referring to FIGS. 1 to 3, a heat exchanger temperature control system (100) according to one embodiment may include a first temperature sensor (141), a second temperature sensor (142), a first flow sensor (151), and a second flow sensor (152).

[0060] The first temperature sensor (141) can detect the temperature of the fluid being recovered along the recovery line (20) of the chiller system (1). According to one embodiment, the first temperature sensor (141) may be located upstream of the position where the fluid recovered from the semiconductor facility (2) flows into the 3-way valve (114).

[0061] The second temperature sensor (142) can detect the temperature of the heat exchange fluid. According to one embodiment, the second temperature sensor (142) may be installed in the heat exchange fluid supply line (131) through which the heat exchange fluid is supplied into the interior of the heat exchanger (110), and may detect the temperature of the heat exchange fluid before heat exchange.

[0062] The first flow sensor (151) can detect the flow rate of the fluid recovered along the recovery line (20) of the chiller system (1). According to one embodiment, the first flow sensor (151) may be located upstream of the position where the fluid recovered from the semiconductor facility (2) flows into the 3-way valve (114).

[0063] The second flow sensor (152) can detect the flow rate of the heat exchange fluid. According to one embodiment, the second flow sensor (152) can be installed in a heat exchange fluid recovery line (132) that recovers the heat exchange fluid that has passed through the heat exchanger (110), and can detect the flow rate of the heat exchange fluid recovered after completing heat exchange.

[0064] Referring to FIG. 2, in a heat exchanger temperature control system (100) according to one embodiment, the heat exchanger temperature control unit (200) may include an input unit (210) and a calculation unit (220).

[0065] According to one embodiment, the input unit (210) may include a temperature input unit (211) and a flow rate input unit (212). The temperature input unit (211) may receive temperature values ​​measured by first and second temperature sensors (141, 142). The flow rate input unit (212) may receive flow rate values ​​measured by first and second flow rate sensors (151, 152).

[0066] According to one embodiment, the calculation unit (220) may include a fluid density specific heat calculation unit (221) and a heat quantity calculation unit (222).

[0067] The fluid density and specific heat calculation unit (221) can calculate the density and specific heat of the fluid using the measured temperature values ​​from the first and second temperature sensors (141, 142) input to the temperature input unit (211).

[0068] The heat quantity calculation unit (222) can calculate the heat quantity of each flow path using the flow rate values ​​measured by the first and second flow rate sensors (1451, 152) input to the flow rate input unit (212).

[0069] In addition, according to a preferred embodiment, a third temperature sensor (143) may be further included, which is located at the inlet of the reservoir tank (10) and detects the temperature of the fluid flowing along the recovery line (20) to be stored in the reservoir tank (10) after heat exchange.

[0070] Additionally, according to a preferred embodiment, a fourth temperature sensor (144) may be further included, which is located at the outlet of the final supply temperature control unit (50) and detects the temperature of the fluid finally supplied to the semiconductor facility (2).

[0071] Additionally, according to a preferred embodiment, a pressure sensor (161) may be further included, which is located between the rear end of the fourth temperature sensor (144) and the inlet of the semiconductor facility (2) and detects the pressure of the fluid supplied to the semiconductor facility (2) through the supply line (30).

[0072] As configured in this way, according to the heat exchanger control system (100) of the chiller system (1) according to various embodiments, the 3-way valve (114) can be controlled without tuning for temperature control of the heat exchanger (120) of the chiller system (1) for semiconductor processes.

[0073] In order to preemptively control temperature changes during a semiconductor process, the heat quantity of a relatively low-temperature fluid and a relatively high-temperature fluid can be calculated. Then, by controlling the opening and closing operation of the 3-way valve (114), the heat quantity can be controlled with the heat quantity error as a macroscopic control value, and the temperature can be controlled with the temperature error as a microscopic control value by linking it with dependent control. As a result, the outlet temperature of the heat exchanger (110) can be stably controlled even in the event of disturbances such as sudden changes in the temperature and / or flow rate of each high-temperature fluid and low-temperature fluid, or changes in process temperature and process flow rate. Thus, according to various embodiments, there is an advantage of being able to stably control the outlet temperature by accurately controlling the heat quantity and recognizing changes in the heat quantity in advance, thereby preventing temperature hunting through macroscopic and rapid temperature control, and reducing fluctuations in the control temperature.

[0074] Hereinafter, a heat exchanger temperature control method using the heat exchanger control system (100) of the chiller system (1) of the present invention will be described.

[0075] A heat exchanger temperature control method according to one embodiment may include a temperature flow rate measurement step, a heat quantity calculation step, and a temperature control value calculation step. In the temperature flow rate measurement step, the temperature and flow rate of each flow path of the high-temperature fluid (hereinafter referred to as the high-temperature fluid) and the low-temperature fluid (hereinafter referred to as the low-temperature fluid) may be measured to calculate the heat quantity of the relatively high-temperature fluid (hereinafter referred to as the high-temperature fluid) and the relatively low-temperature fluid (hereinafter referred to as the low-temperature fluid) flowing into the heat exchanger. In the heat quantity calculation step, the density and specific heat of each fluid may be calculated from the measured temperature values ​​of each of the high-temperature fluid and the low-temperature fluid, and the heat quantity of each flow path may be calculated from the measured flow rate values. In the temperature control value calculation step, the temperature control value may be calculated using the difference in heat quantity of each of the high-temperature fluid and the low-temperature fluid flow paths to compensate for delay during heat exchanger temperature control. By inputting the temperature control value calculated in this manner to a heat exchanger temperature control unit, active control of the heat exchanger may be enabled without tuning.

[0076] According to one embodiment, the expected mixing temperature of each high-temperature fluid and low-temperature fluid flow path can be calculated by the following mathematical formula (1). The expected mixing temperature is input to a heat exchanger temperature control unit (more specifically, a heat quantity controller), and the heat quantity controller calculates a macroscopic control value by the mathematical formula (2). If the target temperature condition is not satisfied, the mathematical formula (3) is repeated to input the target control flow rate to one of the input terminals of the heat exchanger temperature control unit (more specifically, a temperature controller).

[0077] [Mathematical Formula 1]

[0078]

[0079] [Mathematical Formula 2]

[0080]

[0081] [Mathematical Formula 3]

[0082]

[0083] Here, m1: mass of the fluid, c1: specific heat of the fluid, T1: initial temperature of the fluid, m2: mass of the fluid for heat exchange, c2: specific heat of the fluid for heat exchange, T2: initial temperature of the fluid for heat exchange, Tc: calculated temperature, mf: target control flow rate, Tf: calculated target temperature, mc: calculated target flow rate, Tsv: target process temperature.

[0084] In addition, according to one embodiment, the temperature control value is input as the difference between the measured temperature value and the temperature value preset by the user, and the 3-way valve can be controlled by adding a control value to which a proportional gain is applied to the macroscopic control value of the heat quantity controller to a control value obtained by performing a proportional-integral-derivative operation on the difference value.

[0085] Meanwhile, FIG. 4 is a conceptual diagram briefly illustrating a chiller system capable of heat exchanger temperature control without tuning according to another embodiment.

[0086] Referring to FIG. 4, a chiller system (1) according to one embodiment may include a reservoir tank (10), a recovery line (20), a supply line (30), a pump (40), and a final supply temperature controller (50).

[0087] The reservoir tank (10) can store fluid recovered from the semiconductor facility (2).

[0088] The recovery line (20) is used for temperature control in the semiconductor facility (2) and can transfer the recovered high-temperature fluid to the reservoir tank (10).

[0089] The supply line (30) can recirculate the fluid stored in the reservoir tank (10) and supply it to the semiconductor facility (2).

[0090] The pump (40) can circulate the fluid stored in the reservoir tank (10) using the supply line (30) and pump it to the semiconductor facility (2).

[0091] The final supply temperature controller (50) can control the temperature of the fluid to the temperature required by the semiconductor equipment. According to various embodiments, the final supply temperature controller (50) may include a heater that heats the temperature of the fluid to a set temperature. Alternatively, the final supply temperature controller (50) may be a cooling device that cools the temperature of the fluid to a set temperature. Alternatively, the final supply temperature controller (50) may be configured to include a heat exchanger that controls the temperature of the fluid to a set temperature. Alternatively, the final supply temperature controller (50) may be configured to include a TEM block, etc.

[0092] Referring to FIG. 4, the illustrated chiller system (1) may include a heat exchanger temperature control system, a heat exchanger (110), and a heat exchanger temperature control unit (200).

[0093] The heat exchanger (110) can heat exchange the recovered fluid with a high or low temperature heat exchange fluid to control the temperature of the fluid recovered from the semiconductor facility (2).

[0094] The heat exchanger temperature control unit (200) can calculate the heat amount of each flow path of the heat exchanger (110) and control the temperature of the fluid recovered from the semiconductor facility and circulating along the chiller system (1).

[0095] Referring to FIG. 4, a heat exchanger temperature control system according to one embodiment may further include a bypass line (133).

[0096] According to one embodiment, one end of the bypass line (133) may be connected to the heat exchange fluid supply line (131). Additionally, the other end of the bypass line (133) may be connected to the heat exchange fluid recovery line (133). According to this structure, the bypass line (133) can bypass the heat exchange fluid flowing to be supplied into the interior of the heat exchanger (110) and recover it to the heat exchange fluid recovery line. As a result, the supply flow rate of the heat exchange fluid supplied into the interior of the heat exchanger (110) can be controlled.

[0097] Referring to FIG. 4, a heat exchanger temperature control system according to one embodiment may further include a 3-way valve (114).

[0098] According to one embodiment, a 3-way valve (114) may be located at one end (i.e., the inlet end) of the bypass line (113). The 3-way valve (114) can regulate the flow rate of the heat exchange fluid supplied to the heat exchanger (110) by controlling whether the heat exchange fluid is supplied to the heat exchanger (110) or flows through the bypass line (133) and is recovered to the heat exchange fluid recovery line (132). The operation of the 3-way valve (114) may be controlled according to a control command of the heat exchanger temperature control unit (200).

[0099] Referring to FIG. 4, a heat exchanger temperature control system according to one embodiment may include a first temperature sensor (141), a second temperature sensor (142), a first flow sensor (151), and a second flow sensor (152).

[0100] The first temperature sensor (141) can detect the temperature of the fluid being recovered along the recovery line (20) of the chiller system (1). According to one embodiment, the first temperature sensor (141) may be located upstream of the location where the fluid recovered from the semiconductor facility (2) flows into the heat exchanger (110).

[0101] The second temperature sensor (142) can detect the temperature of the heat exchange fluid. According to one embodiment, the second temperature sensor (142) may be installed in the heat exchange fluid supply line (131) through which the heat exchange fluid is supplied into the interior of the heat exchanger (110), and may detect the temperature of the heat exchange fluid before heat exchange. Preferably, the second temperature sensor (142) is located upstream of the 3-way valve (114) and may detect the temperature of the heat exchange fluid.

[0102] The first flow sensor (151) can detect the flow rate of the fluid recovered along the recovery line (20) of the chiller system (1). According to one embodiment, the first flow sensor (151) may be located upstream of the position where the fluid recovered from the semiconductor facility (2) flows into the heat exchanger (110).

[0103] The second flow sensor (152) can detect the flow rate of the heat exchange fluid. According to one embodiment, the second flow sensor (152) may be installed in a heat exchange fluid recovery line (132) that recovers the heat exchange fluid that has passed through the heat exchanger (110), and can detect the flow rate of the heat exchange fluid recovered after completing heat exchange. Preferably, the second flow sensor (152) is located at a rear end of the bypass line (133) and can detect the flow rate of the heat exchange fluid.

[0104] Meanwhile, the heat exchanger temperature control method using the heat exchanger control system of the chiller system (1) shown in FIG. 4 is identical or similar to the description given with reference to FIG. 1 to FIG. 3, so a redundant description will be omitted.

[0105] Referring to FIG. 4, the illustrated chiller system (1) may further include a third temperature sensor (143) located at the inlet of the reservoir tank (10) and detecting the temperature of the fluid after heat exchange.

[0106] According to one embodiment, the chiller system (1) may further include a fourth temperature sensor (144) located at the outlet of the final supply temperature control unit (50) and detecting the temperature of the fluid supplied to the semiconductor facility (2).

[0107] According to one embodiment, the chiller system (1) may further include a pressure sensor (161) located between the rear end of the fourth temperature sensor (144) and the inlet of the semiconductor facility (2), which detects the pressure of the fluid supplied to the semiconductor facility (2) through the supply line (30).

[0108] As described above, according to various embodiments, the heat quantity of cold water and hot water, or low-temperature and high-temperature brains, can be calculated for advance control of temperature changes during a semiconductor process. Furthermore, using a 3-way valve, the heat quantity can be controlled with the heat quantity error as a macroscopic control value, and the temperature can be controlled by linking the temperature error as a microscopic control value through dependent control. Accordingly, the outlet temperature can be stably controlled even in the event of disturbances, such as sudden changes in the temperature or flow rate of the cold water and hot water or low-temperature and high-temperature brain flow paths, or changes in process temperature or process flow rate. In addition, there is an advantageous technical effect of accurately controlling the heat quantity and recognizing changes in heat quantity in advance, thereby preventing temperature hunting through macroscopic and rapid temperature control, reducing fluctuations in the control temperature, and enabling stable control of the outlet temperature.

[0109] Although the present invention has been described above with reference to the illustrated drawings, the present invention is not limited by the embodiments and drawings disclosed in this specification, and it is obvious that various modifications can be made by those skilled in the art within the scope of the technical concept of the present invention.

Claims

1. A reservoir tank for storing fluid recovered from semiconductor equipment; A recovery line for storing the fluid recovered from the above semiconductor facility in the above reservoir tank; A supply line that supplies fluid stored in the above reservoir tank to the above semiconductor facility; A pump for pumping fluid stored in the reservoir tank to the semiconductor facility; and A heat exchanger for controlling the temperature of the fluid recovered from the above semiconductor facility, and A heat exchanger temperature control system comprising a heat exchanger temperature control unit that controls the temperature control function of the heat exchanger; A chiller system capable of heat exchanger temperature control without tuning, including 2. In Paragraph 1, The above heat exchanger is, A first flow path for flowing a fluid recovered from the semiconductor facility, and a second flow path for flowing a low-temperature or high-temperature heat exchange fluid that exchanges heat with the fluid to control the temperature of the fluid recovered from the semiconductor facility. A chiller system capable of heat exchanger temperature control without tuning.

3. In Paragraph 2, The above heat exchanger temperature control system is, A bypass line, one end of which is connected to the recovery line upstream of the inlet of the heat exchanger, and the other end of which is connected to the recovery line downstream of the outlet of the heat exchanger; and A chiller system capable of controlling the heat exchanger temperature without tuning, further comprising a 3-way valve that controls the flow of fluid recovered from the semiconductor facility to the heat exchanger and / or the bypass line.

4. In Paragraph 3, The above heat exchanger temperature control system is, A first temperature sensor located upstream of the position where the fluid recovered from the semiconductor facility flows into the 3-way valve and detects the temperature of the fluid supplied to the heat exchanger; and A chiller system capable of controlling the temperature of a heat exchanger without tuning, further comprising: a first flow sensor located upstream of the position where the fluid recovered from the semiconductor facility flows into the 3-way valve, and detecting the flow rate of the fluid flowing along the recovery line.

5. In Paragraph 4, The above heat exchanger temperature control system is, A second temperature sensor installed in a heat exchange fluid supply line through which the heat exchange fluid is supplied into the interior of the heat exchanger and detecting the temperature of the heat exchange fluid before heat exchange; and A chiller system capable of controlling the temperature of a heat exchanger without tuning, further comprising: a second flow sensor installed in a heat exchange fluid recovery line in which the heat exchange fluid that has passed through the heat exchanger is recovered, and which detects the flow rate of the heat exchange fluid recovered from the heat exchanger.

6. In Paragraph 2, The above heat exchanger temperature control system is, One end is connected to a heat exchange fluid supply line through which the heat exchange fluid is supplied into the interior of the heat exchanger, and the other end is connected to a heat exchange fluid recovery line through which the heat exchange fluid is recovered; a bypass line that bypasses the heat exchange fluid flowing to be supplied into the interior of the heat exchanger and recovers it to the heat exchange fluid recovery line; A chiller system capable of controlling the heat exchanger temperature without tuning, further comprising a 3-way valve that controls the flow of the heat exchange fluid into the heat exchanger and / or the bypass line.

7. In Paragraph 6, The above heat exchanger temperature control system is, A first temperature sensor located upstream of the inlet of the heat exchanger and detecting the temperature of the fluid recovered from the semiconductor facility and supplied to the heat exchanger; and A chiller system capable of controlling the temperature of a heat exchanger without tuning, further comprising: a first flow sensor located upstream of the inlet of the heat exchanger and detecting the flow rate of a fluid recovered from the semiconductor facility and supplied to the heat exchanger.

8. In Paragraph 7, The above heat exchanger temperature control system is, A second temperature sensor installed in a heat exchange fluid supply line through which the heat exchange fluid is supplied into the interior of the heat exchanger, positioned upstream of the 3-way valve, and detecting the temperature of the heat exchange fluid; and A chiller system capable of controlling the temperature of a heat exchanger without tuning, further comprising: a second flow sensor installed in a heat exchange fluid recovery line in which the heat exchange fluid that has passed through the heat exchanger is recovered, positioned at a downstream end of the bypass line and detecting the flow rate of the heat exchange fluid recovered from the heat exchanger.

9. In Paragraph 1, A chiller system capable of controlling the temperature of a heat exchanger without tuning, further comprising a final supply temperature controller that controls the temperature of the fluid supplied to the semiconductor facility.

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