Electronic device comprising antenna

Abstract

According to various embodiments, an electronic device comprises: a housing; a substrate disposed in the housing and including a wireless communication circuit; a conductive structure spaced apart from the substrate in the housing and including a slot having a first length along a first direction; and a power supply line electrically connected to the wireless communication circuit and disposed to at least partially overlap the slot, wherein the power supply line is disposed to pass at least partially across the slot along a second direction perpendicular to the first direction, and the wireless communication circuit may be configured to transmit and / or receive a wireless signal in a first frequency band through the slot.

Description

Electronic device including an antenna

[0001] The embodiments of the present disclosure relate to an electronic device comprising an antenna.

[0002] An electronic device can communicate with an external electronic device using wireless communication technology. For example, wireless communication technology may include at least one of LTE (long term evolution) communication, 5G communication (or NR (new radio) communication), 6G communication, ultra-wideband (UWB) communication, Wi-Fi (wireless fidelity) communication, or Bluetooth communication. The electronic device may include at least one antenna for using the aforementioned wireless communication technologies. The antenna needs to be placed in the electronic device through an efficient design.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] The electronic device may include at least one antenna (e.g., an antenna structure or an antenna module). The at least one antenna may include a legacy antenna operating in a frequency band in the range of about 600 MHz to 6000 MHz, an ultra-wide band (UWB) antenna operating in a frequency band in the range of about 6 GHz to 8.5 GHz, a 6G antenna operating in a range of about 7 GHz to 8 GHz or about 14 GHz to 15 GHz, or a mmWave antenna operating in a frequency band in the range of about 3 GHz to 300 GHz. The frequency band in the range of about 14 GHz to 15 GHz corresponding to 6G is a new band that has not been applied to electronic devices to date, and thus the efficient placement of antennas operating in that band may be important.

[0005] An antenna (e.g., antenna radiator) used in an electronic device may include at least one of a metal bezel antenna using at least a portion of a metal frame (e.g., conductive side member), an LDS (laser direct structuring) antenna with a metal pattern imprinted on the surface of an injection molding (e.g., antenna carrier or dielectric structure), a modular antenna utilizing a pattern (or patch) on a substrate, an FPCB antenna, or an antenna using at least one of a conductive structure. To implement a 6G antenna using at least one of the above-described antennas, additional frequency tuning to support the corresponding band is required, which necessitates the mounting of additional electrical components and / or parts, and if used in conjunction with other frequency bands, loss of the existing supported frequency band may be expected. Furthermore, since the transmission loss in the 14GHz to 15GHz frequency band is relatively large compared to the legacy band, using a portion of the metal frame is advantageous in terms of loss; however, in this case, there may be difficulties in implementing an 8x8 MIMO (multiple-input and multiple-output) antenna that must be implemented with eight antennas through the entire metal frame.

[0006] In addition, when a 6G antenna is applied to an LDS antenna, it may be difficult to slim down the electronic device due to an increase in the thickness and / or volume of the electronic device.

[0007] Various embodiments of the present disclosure may provide an electronic device including an antenna provided through an efficient placement design.

[0008] Various embodiments may provide an electronic device comprising an antenna that operates through at least a portion of a previously deployed conductive structure.

[0009] Various embodiments may provide an electronic device including an antenna configured to operate in a new frequency band and capable of helping to slim down the electronic device.

[0010] However, the problems intended to be solved in this disclosure are not limited to those mentioned above, and may be expanded in various ways without departing from the spirit and scope of this disclosure.

[0011] According to various embodiments, the electronic device comprises a housing, a substrate disposed in the housing and having a wireless communication circuit disposed therein, a conductive structure including a slot spaced apart from the substrate in the housing and having a first length along a first direction, and a feed line electrically connected to the wireless communication circuit and disposed to overlap at least partially with the slot, wherein the feed line is disposed to cross at least partially the slot along a second direction perpendicular to the first direction, and the wireless communication circuit may be configured to transmit and / or receive a wireless signal in a first frequency band through the slot.

[0012] An electronic device according to exemplary embodiments of the present disclosure includes an antenna configured to operate in a specific frequency band through a feed line arranged to cross a slot of a conductive structure disposed in an internal space, thereby reducing the performance degradation of surrounding antennas due to interference and helping to slim down the electronic device.

[0013] In addition, various effects that can be identified directly or indirectly through this document may be provided.

[0014] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0015] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0016] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0017] FIG. 2a is a front perspective view of an electronic device according to various embodiments of the present disclosure.

[0018] FIG. 2b is a perspective view of the rear of the electronic device of FIG. 1 according to various embodiments of the present disclosure.

[0019] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2b according to various embodiments of the present disclosure.

[0020] FIG. 4a is a drawing showing a portion of the rear of an electronic device with a rear cover omitted according to various embodiments of the present disclosure.

[0021] FIG. 4b is a partial cross-sectional view of an electronic device shown along line 4b-4b of FIG. 4a according to various embodiments of the present disclosure.

[0022] FIGS. 4c and FIGS. 4d are partial cross-sectional views of an electronic device according to various embodiments of the present disclosure.

[0023] FIG. 5 is a schematic diagram illustrating the arrangement structure of slots and power supply lines of a conductive structure according to various embodiments of the present disclosure.

[0024] FIGS. 6a and 6b are graphs showing the radiation performance of an antenna using the feed line and slot of FIG. 4a according to various embodiments of the present disclosure.

[0025] FIG. 7 is a graph showing the frequency variation of an antenna according to a first length change of a slot according to various embodiments of the present disclosure.

[0026] FIGS. 8a to 8c are drawings showing the arrangement structure of a power supply line through a flexible printed circuit board (FPCB) according to various embodiments of the present disclosure.

[0027] FIG. 9 is a schematic diagram illustrating the arrangement structure of slots and power supply lines of a conductive structure according to various embodiments of the present disclosure.

[0028] FIG. 10 is a graph showing the radiation performance of an antenna using the feed line and slot of FIG. 9 according to various embodiments of the present disclosure.

[0029] FIG. 11 is a drawing illustrating the arrangement relationship between an antenna structure and a slot according to various embodiments of the present disclosure.

[0030] FIGS. 12a to 12c are drawings illustrating the arrangement relationships of slot(s) of various shapes and power supply lines according to various embodiments of the present disclosure.

[0031] FIG. 13 is a drawing illustrating a dual power supply structure through a single slot according to various embodiments of the present disclosure.

[0032] FIGS. 14a and FIGS. 14b are drawings illustrating current distributions generated based on the first power supply line and the second power supply line of FIG. 13 according to various embodiments of the present disclosure.

[0033] FIG. 14c is a graph showing the radiation performance of an antenna implemented through the dual feed structure of FIG. 13 according to various embodiments of the present disclosure.

[0034] FIGS. 15a and 15b are drawings illustrating the arrangement relationship between slots of a conductive structure and a power supply line arranged through a rear cover according to various embodiments of the present disclosure.

[0035] Hereinafter, embodiments of the present disclosure are described in detail with reference to the drawings so that those skilled in the art can easily practice them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0036] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0037] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0038] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0039] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0040] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0041] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0042] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0043] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0044] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0045] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) acquires sound through the input module (150), or through the sound output module (155), or through the electronic device (101) and 450

[0046] Sound can be output through an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly.

[0047] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0048] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0049] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0050] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0051] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0052] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0053] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0054] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0055] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0056] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0057] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0058] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0059] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0060] FIG. 2a is a front perspective view of an electronic device according to various embodiments of the present disclosure. FIG. 2b is a rear perspective view of the electronic device of FIG. 1 according to various embodiments of the present disclosure.

[0061] The electronic device (200) of FIGS. 2a and 2b may be at least partially similar to the electronic device (101) of FIG. 1, or may include other embodiments of the electronic device.

[0062] Referring to FIG. 2a and FIG. 2b, an electronic device (200) according to one embodiment may include a housing (210) comprising a first surface (or front) (210A), a second surface (or rear) (210B), and a side (210C) surrounding the space between the first surface (210A) and the second surface (210B). In other embodiments (not shown), the housing (210) may refer to a structure forming some of the first surface (210A), the second surface (210B), and the side (210C). According to one embodiment, the first surface (210A) may be formed by a front plate (202) (e.g., a glass plate or a polymer plate including various coating layers) in which at least a portion is substantially transparent. The second surface (210B) may be formed by a rear plate (211) that is substantially opaque. The rear plate (211) may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (210C) may be formed by a side bezel structure (or "side member") (218) comprising metal and / or polymer, which is combined with the front plate (202) and the rear plate (211). In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0063] In the illustrated embodiment, the front plate (202) may include a first region (210D) that curves seamlessly from the first surface (210A) toward the rear plate at both ends of the long edge of the front plate. In the illustrated embodiment (see FIG. 2b), the rear plate (211) may include a second region (210E) that curves seamlessly from the second surface (210B) toward the front plate at both ends of the long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) and the rear plate (211) may not include the first region and the second region, but may include only a flat plane positioned parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E) as above, and may have a second thickness that is thinner than the first thickness on the side that includes the first region or the second region.

[0064] According to one embodiment, the electronic device (200) may include at least one of a display (201), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., a key input device (217), or an indicator) or additionally include other components.

[0065] The display (201) may be exposed, for example, through a substantial portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202) forming the first surface (210A) and the first area (210D) of the side (210C). The display (201) may be combined with or placed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor module (204, 219) and / or at least a portion of the key input device (217) may be placed in the first area (210D) and / or the second area (210E).

[0066] The input device (203) may include a microphone. In some embodiments, the input device (203) may include a plurality of microphones positioned to detect the direction of sound. The sound output device (207, 214) may include speakers. The speakers may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone, speakers, and connector (208) may be positioned in the space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used for both the microphone and the speakers. In some embodiments, the sound output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates with the hole formed in the housing (210) excluded. In some embodiments, the electronic device (200) may include a tray member positioned through at least a portion of the side bezel structure (218).

[0067] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210). The fingerprint sensor (e.g., ultrasonic or optical fingerprint sensor) may be disposed below the display (201) on the first surface (210A). The electronic device (200) may further include at least one of an unillustrated sensor module, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).

[0068] The camera modules (205, 212, 213) may include a first camera device (205) disposed on a first surface (210A) of the electronic device (200), a second camera device (212) disposed on a second surface (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (200).

[0069] A key input device (217) may be placed on the side (210C) of the housing (210). In another embodiment, the electronic device (200) may not include some or all of the aforementioned key input devices (217), and the key input device (217) not included may be implemented in other forms, such as soft keys, on the display (201). In another embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0070] The indicator may be placed, for example, on a first surface (210A) of the housing (210). The indicator may, for example, provide status information of the electronic device (200) in the form of light. In another embodiment, the light-emitting element may, for example, provide a light source that is coupled with the operation of the camera module (205). The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0071] The connector hole (208) may include a first connector hole (208) capable of accommodating a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) capable of accommodating a connector for transmitting and receiving audio signals with an external electronic device.

[0072] Some of the camera modules (205, 212), some of the sensor modules (204, 219), or indicators may be positioned to be exposed through the display (201). For example, the camera module (205), sensor module (204), or indicator may be positioned to come into contact with the external environment through an opening or a transparent area perforated to the front plate (202) of the display (201) within the internal space of the electronic device (200). In one embodiment, the area where the display (201) and the camera module (205) face each other may be formed as a transparent area having a certain transmittance as part of the area for displaying content. In one embodiment, the transparent area may be formed to have a transmittance in the range of about 5% to about 20%. This transparent area may include an area that overlaps with the effective area (e.g., field of view area) of the camera module (205) through which light passes to form an image and generate an image by being formed by an image sensor. For example, the transparent area of ​​the display (201) may include an area with a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In another embodiment, some sensor modules (204) may be positioned to perform their functions without being visually exposed through the front plate (202) within the internal space of the electronic device. For example, in this case, the perforated opening may be unnecessary for the area of ​​the display (201) facing the sensor modules.

[0073] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2b according to various embodiments of the present disclosure.

[0074] Referring to FIG. 3, the electronic device (200) may include a side frame (218) (e.g., a side bezel structure or a side member), an extension member (2181) (e.g., a bracket, a support member or a support structure) extending from the side frame (218) into the internal space (2101) of the electronic device (200), a front cover (202) (e.g., a front plate, a first plate or a first cover) coupled to one side of the side frame (218), and a rear cover (211) (e.g., a rear plate, a second plate, a cover member or a second cover) coupled to the other side of the side frame (218) so as to face in the opposite direction to the front cover (202). In one embodiment, the electronic device (200) may include a housing (e.g., the housing (210) of FIG. 2a) (e.g., a housing structure) formed by combining the side frame (218), the front cover (202), and / or the rear cover (211). In one embodiment, the electronic device (200) may include a display (201) disposed in the internal space (2101) of a housing, a substrate (140), a camera module (212) disposed on the substrate (140), a battery (243), a sub-substrate (241) disposed spaced apart from the substrate (240) with the battery (243) in between, and a module assembly (242) (e.g., a speaker assembly, a microphone assembly, or an interface connector assembly) electrically connected to the substrate (240) and / or the sub-substrate (241). In some embodiments, at least one of the above-described components may be omitted, or at least one other component may be additionally included. At least one of the components of the electronic device (200) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 1 or the electronic device (200) of FIG. 2a, and redundant descriptions are omitted below.

[0075] According to various embodiments, the extension member (2181) may be disposed inside the electronic device (200) and connected to the side frame (218) or formed integrally with the side frame (218). The side frame (218) and / or the extension member (2181) may be formed from, for example, a metal material and / or a non-metal (e.g., a polymer) material. The extension member (2181) may have a display (201) attached to it to be supported by a first surface (218a), and a substrate (240), a sub-substrate (241), a module assembly (242), and a battery (243) disposed to be supported by a second surface (218b) facing in the opposite direction to the first surface (218a). The electronic device (200) may include a processor, memory, and / or an interface disposed on the substrate (240). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0076] Memory may include, for example, volatile memory or non-volatile memory.

[0077] The interface may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (200) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0078] The battery (243) is a device for supplying power to at least one component of the electronic device (120) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (243) may be positioned side-by-side so as to be substantially coplanar with, for example, the substrate (240) and / or the sub-substrate (241). The battery (243) may be embedded inside the electronic device (200). In some embodiments, the battery (243) may be detachably positioned from the electronic device (200).

[0079] According to various embodiments, the electronic device (200) may include at least one electrical connection device (245) for electrically connecting a substrate (240) and a sub-substrate (241), and / or a substrate (240) and a module assembly (242). In one embodiment, the at least one electrical connection device (245) may include a flexible printed circuit board (FPCB).

[0080] According to various embodiments, the electronic device (200) may include a conductive structure (250) (e.g., a conductive plate) positioned to cover at least a portion of the substrate (240), and a flexible substrate (260) (FPCB, flexible printed circuit board) positioned to face at least a portion of the conductive structure (250) and including a power supply line (262). In one embodiment, the conductive structure (250) is positioned to be close to or face at least a portion of the substrate (240) and may shield noise generated from electrical components of the substrate (240) or perform a heat dissipation function. In one embodiment, at least a portion of the conductive structure (250) may be fixed to an extension member (2181) through a fastening member such as a screw.

[0081] According to various embodiments, the conductive structure (250) may include a slot (251) formed to have a length (e.g., an opening, a slit, an opening, or a through hole). In one embodiment, the slot (251) may be formed in such a way that it penetrates from the upper surface of the conductive structure (250) to the back surface. In one embodiment, a flexible substrate (260) may be positioned so as to penetrate the opening (252) formed in the conductive structure (250) from the substrate (240) and be attached to the upper surface of the conductive structure (250). In one embodiment, the flexible substrate (260) may include a power supply line (262) (e.g., a conductive line, a conductive layer, a wiring structure, or a trace) that is electrically connected to the wireless communication circuit of the substrate (240) (e.g., the wireless communication module of FIG. 1) and is positioned to cross at least a portion of the slot (251). In one embodiment, the wireless communication circuit (192) may be configured to transmit and / or receive a wireless signal in a specific range of frequency bands (e.g., about 14 GHz to 15 GHz) through a feed line (262) and a slot (251). Accordingly, the slot (251) may operate as an antenna (e.g., a slot antenna) through a feed line (262) crossing the slot (251).

[0082] An antenna utilizing a slot (251) of a conductive structure (250) according to an exemplary embodiment of the present disclosure can be arranged separately from a metal bezel antenna set through at least a part of the side frame (218) of the electronic device (200) or other antenna structures (e.g., LDS antenna) that can be placed in the internal space of the electronic device (200), thereby reducing the degradation of radiation performance caused by interference that may occur when different antennas are formed by a single radiator, and by utilizing a part of the existing conductive structure (250), it can help to slim down the electronic device (200) and design the efficient placement of surrounding electrical components.

[0083] FIG. 4a is a drawing showing a portion of the rear of an electronic device with the rear cover omitted according to various embodiments of the present disclosure. FIG. 4b is a cross-sectional view of a portion of an electronic device shown along line 4b-4b of FIG. 4a according to various embodiments of the present disclosure.

[0084] Referring to FIGS. 4a and 4b, the electronic device (200) may include a substrate (240) having a wireless communication circuit (F) (e.g., a wireless communication module (192) of FIG. 1) disposed in an internal space (2101), a conductive structure (250) (e.g., a metal plate) spaced apart from the substrate (240) and having a slot (251), and a flexible substrate (260) having a feed line (262) electrically connected to the wireless communication circuit (F) and disposed to cross the slot (251). In one embodiment, the flexible substrate (260) may be electrically connected to the substrate (240) and disposed to cross the slot (251) on the upper surface of the conductive structure (250) after penetrating through the opening (252) of the conductive structure (250). In one embodiment, the flexible substrate (260) may include a dielectric substrate (261) and a feed line (262) (e.g., a conductive pattern) formed on the dielectric substrate (261). For example, through this arrangement structure of the flexible substrate (260), the feed line (262) may be positioned to cross the slot (251). In one embodiment, the flexible substrate (260) may be attached to the upper surface of the conductive structure (250) so that the feed line (262) is positioned in a location where it can be coupled with the conductive structure (250). In one embodiment, the flexible substrate (260) may be attached to the conductive structure (250) by bonding, taping, or fusion. In one embodiment, a wireless communication circuit (F) may be connected to the feed line (262) of the flexible substrate (260) through a wiring trace (2401) of the substrate (240). In some embodiments, the wireless communication circuit (F) may be directly connected to the feed line (262) of the flexible substrate (260) through an electrical connection structure (e.g., a connection structure of a connector and a receptacle).

[0085] According to various embodiments, the conductive structure (250) may be positioned to overlap at least partially with the substrate (240) when the substrate (240) (or slot (251)) is viewed from above. In this case, the slot (251) may be positioned to overlap at least partially with the substrate (240) when the substrate (240) is viewed from above. In some embodiments, the conductive structure (250) may be positioned so as not to overlap at least partially with the substrate (240) when the substrate (240) is viewed from above. In this case, the slot (251) may be positioned so as not to overlap at least partially with the substrate (240) when the substrate (240) is viewed from above. For example, even if the placement positions of the conductive structure (250) and the substrate (240) are different, the power supply line (262) can be positioned to cross the slot (251) of the conductive structure (250) through the flexible substrate (260) and can be electrically connected to the wireless communication circuit (F) of the substrate (240).

[0086] According to various embodiments, the feed line (262) of the flexible substrate (260) may be positioned to completely cross the slot (251) when the slot (251) is viewed from above (e.g., when the conductive structure (250) and / or the substrate (240) is viewed from above). In one embodiment, the feed line (262) is guided to cross the slot (251) through the dielectric substrate (261) of the flexible substrate (260) and may come into contact with the upper surface of the conductive structure (250) near the slot (251) through a physical connection process such as soldering. In some embodiments, the feed line (262) may be positioned to cross the slot (251) and remain in a coupling-capable state (e.g., electromagnetically connected) without physical contact with the conductive structure (250). In some embodiments, the flexible substrate (260) may be positioned so as to be attached to the back surface without penetrating the opening (252) of the conductive structure (250). In some embodiments, the flexible substrate (260) may be positioned on the upper surface of the conductive structure (250) by bypassing one side of the conductive structure (250). For example, if the conductive structure (250) is a shield can positioned on the substrate (240), the flexible substrate (260) may be positioned to cross a slot through the outer surface (e.g., upper surface) of the shield can from the outside of the shield can without the opening (252). In one embodiment, the conductive structure (250) may be replaced by at least one of a metal plate, bracket, shield can, interface connector cover, speaker cover, or socket cover positioned in the internal space (2101) of the electronic device (200).

[0087] According to various embodiments, the flexible substrate (260) may be positioned between the substrate (240) and the conductive structure (250) in such a way that it is attached to the inner surface of the conductive structure (250).

[0088] FIGS. 4c and FIGS. 4d are partial cross-sectional views of an electronic device according to various embodiments of the present disclosure.

[0089] A slot (251) according to an exemplary embodiment of the present disclosure may be formed in a conductive structure (250) for an antenna. The placement of such a slot (251) may result in a weakened rigidity of the conductive structure (250) or, (if the conductive structure (250) is a shield can) a concern regarding the ingress of foreign matter through the slot (251). To improve this, the following configuration may be additionally applied.

[0090] Referring to FIG. 4c, the electronic device (200) may further include a blocking member (2511) positioned to seal the slot (251) with the conductive structure (250) in between. In this case, the blocking member (2511) may be attached in the form of a sheet or tape to cover at least the slot (251) on the back of the conductive structure (250). For example, the blocking member (2511) may help block foreign substances from entering between the conductive structure (250) and the substrate (240) through the slot (251).

[0091] Referring to FIG. 4d, the electronic device (200) may include an injection molded product (2512) of a dielectric material that is filled into a slot (251) of a conductive structure (250). For example, the conductive structure (250) may have its rigidity reinforced and be helped to block the ingress of foreign substances from the outside through the injection molded product (2512) filled into the slot (251).

[0092] FIG. 5 is a schematic diagram illustrating the arrangement structure of slots and power supply lines of a conductive structure according to various embodiments of the present disclosure.

[0093] Referring to FIG. 5, an electronic device (e.g., the electronic device (200) of FIG. 4a) may include a flexible substrate (260) that is disposed in an internal space (e.g., the internal space (2101) of FIG. 4a) and includes a conductive structure (250) that includes a slot (251) and a feed line (262) disposed to cross the slot (251) of the conductive structure (250). In one embodiment, the electronic device (200) may include an antenna configured to transmit and / or receive a wireless signal in a specific frequency band (e.g., a frequency band in the range of about 14 GHz to 15 GHz) through the feed line (262) and the slot (251) that the feed line (262) crosses. In one embodiment, the slot (251) may be formed in a rectangular (e.g., rectangular) shape having a length. In some embodiments, the slot (251) may be formed with a modified shape having a length (e.g., a curved shape bent in at least one direction).

[0094] According to various embodiments, the slot (251) may be formed to have a first length (L1) and a first width (W1). In one embodiment, the slot (251) may be formed to have a first length (L1) along a first direction (e.g., direction ①) and a first width (W1) along a second direction (e.g., direction ②) perpendicular to the first direction (e.g., direction ①). In one embodiment, the feed line (262) of the flexible substrate (260) may be positioned to completely cross the slot (251) in a direction perpendicular to the first direction (e.g., direction ①) and parallel to the second direction (e.g., direction ②). In one embodiment, the feed line (262) may be formed to have a second width (W2) along the first direction (e.g., direction ①). In one embodiment, the feed line (262) may be positioned to cross a point in the range of about 20% to 30% of the total length of the slot (251) from the end of the slot (251) in a first direction (e.g., direction ①). In one embodiment, the first length (L1) may be set to have a length of half a wavelength (e.g., λ / 2) in the operating frequency band of the antenna. In one embodiment, the operating frequency band of the antenna may be determined through the first length (L1). In one embodiment, the operating frequency band of the antenna may be determined through the first width (W1). In one embodiment, the operating frequency band of the antenna may be determined through the second width (W2).

[0095] FIGS. 6a and 6b are graphs showing the radiation performance of an antenna using the feed line and slot of FIG. 4a according to various embodiments of the present disclosure.

[0096] FIG. 6a is a graph showing the standing wave ratio (S-parameter) of an antenna (e.g., a slot antenna) operating through the feed line (262) and slot (251) of FIG. 5, and it can be confirmed that the antenna operates smoothly by exhibiting a reflection loss of about -10dB or less in the frequency band of about 15GHz.

[0097] FIG. 6b is a graph showing the efficiency (e.g., gain) of an antenna operating through the feed line (262) and slot (251) of FIG. 5, and it can be confirmed that the antenna operates smoothly by achieving an efficiency of -10dB or more in the frequency band of about 15GHz.

[0098] FIG. 7 is a graph showing the frequency variation of an antenna according to a first length change of a slot according to various embodiments of the present disclosure.

[0099] Referring to FIG. 7, it can be seen that the antenna operating through the feed line (262) and slot (251) of FIG. 5 operates at a relatively lower frequency band when the first length (L1) of the slot (251) is 5.0 mm (e.g., graph 702) compared to when it is about 4.5 mm (e.g., graph 701). Furthermore, it can be seen that when the first length (L1) of the slot (251) is extended to 5.5 mm (e.g., graph 703), it operates at a relatively lower frequency band. This implies that the antenna formed such that the feed line (262) crosses the slot (251) can be assisted in frequency design so that the operating frequency band can be easily adjusted by changing the first length (L1) of the slot (251).

[0100] FIGS. 8a to 8c are drawings showing the arrangement structure of a power supply line through a flexible printed circuit board (FPCB) according to various embodiments of the present disclosure.

[0101] Referring to FIG. 8a, the flexible substrate (260) may include a feed line (262) disposed in a first layer of a dielectric substrate (261) (e.g., a plurality of insulating layers) and a first ground layer (263) disposed in a second layer different from the first layer and electrically connected to the ground of the substrate (240). In one embodiment, the first ground layer (263) may be located between the feed line (262) and the conductive structure (250). In one embodiment, the dielectric substrate (261) may be disposed to cross the slot (251). In one embodiment, the first ground layer (263) may be disposed from the substrate (240) up to just before crossing the slot (251) of the conductive structure (250). For example, the first ground layer (263) may be disposed so as not to overlap with the slot (251) when the slot (251) is viewed from above. In one embodiment, the first ground layer (263) is positioned just before crossing the slot (251) and may be physically connected to the conductive structure (250) via soldering or conductive bonding. In one embodiment, the feed line (262) may be physically connected to the conductive structure (250) via soldering or conductive bonding after crossing the slot (251). In some embodiments, when the conductive structure (250) is connected to the ground of the substrate (240), the portion of the first ground layer (263) overlapping with the conductive structure (250) may be omitted.

[0102] Referring to FIG. 8b, the flexible substrate (260) may include a power supply line (262) disposed on a first layer of a dielectric substrate (261) (e.g., a plurality of insulating layers), a first ground layer (263) disposed on a second layer different from the first layer and electrically connected to the ground of the substrate (240), and a second ground layer (264) disposed on a third layer different from the first and second layers with the power supply line in between. In one embodiment, the first ground layer (263) may be located between the power supply line (262) and a conductive structure (250). In one embodiment, the power supply line (262) may be located between the first ground layer (263) and the second ground layer (264). In one embodiment, the dielectric substrate (261) may be disposed to cross a slot (251). In one embodiment, the first ground layer (263) and the second ground layer (264) may be positioned from the substrate (240) up to just before crossing the slot (251) of the conductive structure (250). In one embodiment, the first ground layer (263) and the second ground layer (264) may be positioned so as not to overlap with the slot (251) when the slot (251) is viewed from above. In one embodiment, the first ground layer (263) and the second ground layer (264) may be positioned up to just before crossing the slot (251). In one embodiment, the first ground layer (263) may be physically connected to the conductive structure (250) through soldering or conductive bonding. In one embodiment, the power supply line (262) may be physically connected to the conductive structure (250) via soldering or conductive bonding after crossing the slot (251). In some embodiments, when the conductive structure (250) is connected to the ground of the substrate (240), the portion overlapping the conductive structure (250) of the first ground layer (263) and / or the second ground layer (264) may be omitted.

[0103] Referring to FIG. 8c, the flexible substrate (260) including the power supply line (262) may be replaced by a coaxial cable (270) that is connected to the wireless communication circuit of the substrate (240) (e.g., the wireless communication circuit (F) of FIG. 4b) and is positioned to cross the slot (251). In this case, the coaxial cable (270) may be physically connected to the conductive structure (250) via soldering or conductive bonding immediately before and after crossing the slot (251).

[0104] FIG. 9 is a schematic diagram illustrating the arrangement structure of slots and power supply lines of a conductive structure according to various embodiments of the present disclosure.

[0105] In describing the arrangement structure of the conductive structure (250) including the slot (251) of FIG. 9 and the power supply line (262) crossing the slot (251), the same reference numerals have been assigned to components substantially identical to the components of FIG. 5, and a detailed description thereof may be omitted.

[0106] Referring to FIG. 9, an electronic device (e.g., the electronic device (200) of FIG. 4a) may include a flexible substrate (260) that is disposed in an internal space (e.g., the internal space (2101) of FIG. 4a) and includes a conductive structure (250) that includes a slot (251) and a feed line (262) disposed to cross the slot (251) of the conductive structure (250). In one embodiment, the electronic device (200) may include an antenna configured to transmit and / or receive a wireless signal in a specific frequency band (e.g., a frequency band in the range of about 14 GHz to 15 GHz) through the feed line (262) and the slot (251) that the feed line (262) crosses.

[0107] According to various embodiments, the power supply line (262) may be positioned so that it does not completely cross the slot (251), and the end of the power supply line (262) overlaps with the slot (251) when the slot (251) is viewed from above. In this case, the end of the power supply line (262) and the edge of the slot (251) may be positioned to have a coupling gap (g). This arrangement structure of the power supply line (262) may be advantageous for the efficient utilization of the space for designing and placing surrounding electrical components when the power supply line (262) does not completely cross the slot (251).

[0108] FIG. 10 is a graph showing the radiation performance of an antenna using the feed line and slot of FIG. 9 according to various embodiments of the present disclosure.

[0109] Referring to FIG. 10, it can be confirmed that the antenna, positioned so that the feed line (262) does not completely cross the slot (251), operates smoothly as an antenna by having a reflection loss of about -10dB or less in the frequency range of about 17GHz. This means that the resonant frequency and impedance of the antenna can be changed through the coupling gap (g) between the edge of the slot (251) and the end of the feed line (262), and that matching to a specific frequency band is possible through a matching circuit having appropriate element values.

[0110] FIG. 11 is a drawing illustrating the arrangement relationship between an antenna structure and a slot according to various embodiments of the present disclosure.

[0111] In describing the arrangement structure of the conductive structure (250) including the slot (251) of FIG. 11 and the power supply line (262) crossing the slot (251), the same reference numerals have been assigned to components substantially identical to the components of FIG. 5, and a detailed description thereof may be omitted.

[0112] Referring to FIG. 11, an electronic device (e.g., the electronic device (200) of FIG. 4a) may include an antenna structure (300) (e.g., an antenna module) arranged to form a beam pattern outside the electronic device (200) through at least a portion of the slot (251) when the slot (251) is viewed from above. In one embodiment, the antenna structure (300) may include an antenna substrate (350) and a plurality of antenna elements (310, 320, 330, 340) arranged at specific intervals on the antenna substrate (350). In one embodiment, the plurality of antenna elements (310, 320, 330, 340) may include first, second, third, and fourth antenna elements (310, 320, 330, 340) that are sequentially spaced apart. However, it is not limited thereto, and two, three, or five or more antenna elements (310, 320, 330, 340) may be arranged. In one embodiment, the antenna structure (300) may include an antenna (e.g., array antenna (AR)) configured to transmit and / or receive a wireless signal in a specified frequency band (e.g., mmWave band) through the antenna elements (310, 320, 330, 340). In one embodiment, the antenna elements (310, 320, 330, 340) may be spaced apart in a direction parallel to the longitudinal direction of the slot (251) on the antenna substrate (350).

[0113] According to various embodiments, the feed line (262) may be positioned to cross the slot (251) at a location that does not overlap with the antenna elements (310, 320, 330, 340) when the slot (251) is viewed from above. Through this arrangement structure, the antenna structure (300) and the antenna using the slot (251) may not affect each other in terms of radiation performance. As illustrated, the feed line (262) is positioned to cross the slot (251) between the second antenna element (320) and the third antenna element (330), but in terms of arrangement design, the feed line (262) may also be positioned to cross the slot (251) between the first antenna element (310) and the second antenna element (320) or between the third antenna element (330) and the fourth antenna element (340).

[0114] FIGS. 12a to 12c are drawings illustrating the arrangement relationships of slot(s) of various shapes and power supply lines according to various embodiments of the present disclosure.

[0115] In describing the components of FIGS. 12a to 12c, components that are substantially identical to the components of FIG. 5 are given the same reference numerals, and a detailed description thereof may be omitted.

[0116] Referring to FIG. 12a, in one embodiment, a conductive structure (250) may include an additional slot (253) (e.g., a second slot) having a second length (L2) different from the first length (L1) and branching along a second direction (e.g., a second slot) from a slot (251) having a first length (L1). In one embodiment, a feed line (262) may be positioned to cross the slot (251) along the second direction (e.g., a second direction). In this case, the slot (251) may operate as a first antenna operating in a first frequency band through the first length (L1) and as a second antenna operating in a second frequency band different from the first frequency band through the second length (L2). In one embodiment, the first length (L1) may be set to have a length of half a wavelength (e.g., λ / 2) in the operating frequency band of the first antenna. In one embodiment, the second length (L2) may be set to have a length of half a wavelength (e.g., λ / 2) in the operating frequency band of the second antenna. In some embodiments, the feed line (262) may be positioned to cross an additional slot along the first direction.

[0117] Referring to FIG. 12b, in one embodiment, the conductive structure (250) may include a slot (251) having a first length (e.g., a first slot) and an additional slot (254) (e.g., a second slot) spaced apart from the slot and having a second length (L3) different from the first length (L1) in the same first direction (e.g., direction ①) as the slot (251). In one embodiment, a feed line (262) may be positioned to simultaneously cross the slot (251) and the additional slot (254) along the second direction (e.g., direction ②). In this case, the slot (251) and the additional slot (254) may operate as a first antenna operating in a first frequency band through the first length (L1) and a second antenna operating in a second frequency band different from the first frequency band through the second length (L2). In one embodiment, the first length (L1) may be set to have a length of half a wavelength (e.g., λ / 2) in the operating frequency band of the first antenna. In one embodiment, the second length (L2) may be set to have a length of half a wavelength (e.g., λ / 2) in the operating frequency band of the second antenna.

[0118] Referring to FIG. 12c, in one embodiment, a conductive structure (250) (e.g., a metal plate) may include a slot (255) (e.g., a slit) extending to one edge (2501). In this case, the slot (255) may have a length (L4) in a first direction (e.g., direction ①) and may be formed to be open at the edge (2501). In one embodiment, a feed line (262) may be positioned to cross the slot (255) along a second direction (e.g., direction ②) perpendicular to the first direction (e.g., direction ①). In one embodiment, the slot (255) may be operated as an antenna in a specific frequency band via the feed line (262). In one embodiment, the length (L4) of the slot (25) may be set to have a length of λ / 4 in the operating frequency band of the antenna.

[0119] FIG. 13 is a drawing illustrating a dual power supply structure through a single slot according to various embodiments of the present disclosure.

[0120] In describing the components of FIG. 13, the same reference numerals have been assigned to components that are substantially identical to the components of FIG. 5, and a detailed description thereof may be omitted.

[0121] Referring to FIG. 13, the slot (251) can be configured as a dual-band antenna operating in different frequency bands through two feed lines (262, 265) spaced apart to cross the slot (251). In one embodiment, the first feed line (262) may be positioned to cross the L / 2 point (F1) of the total length L of the slot (251), and the second feed line (265) may be positioned to cross the L / 4 point (F2) of the total length L of the slot (251). In this case, the slot (251) may be configured to operate in a first frequency band through the first feed line (262) and to operate in a second frequency band lower than the second frequency band through the second feed line (265).

[0122] FIGS. 14a and FIGS. 14b are drawings illustrating current distributions generated based on the first power supply line and the second power supply line of FIG. 13 according to various embodiments of the present disclosure.

[0123] Referring to FIGS. 14a and 14b, it can be seen that when the slit (251) is operated as a dual-band antenna through the two feed lines (262, 265) shown in FIG. 13, the current distribution (e.g., field) at the relative feed positions (F1, F2) is reduced. This may mean that even if the single slot (251) is fed through two spaced-apart feed lines (262, 265), the degradation of radiation performance due to mutual interference in the two frequency bands can be reduced.

[0124] FIG. 14c is a graph showing the radiation performance of an antenna implemented through the dual feed structure of FIG. 13 according to various embodiments of the present disclosure.

[0125] Referring to FIG. 14c, an antenna operating through two feed lines (262, 265) arranged to cross one slit (251) of FIG. 13 is found to resonate at approximately 15 GHz through the first feed line (262) (e.g., feed line (262) of FIG. 4a) and at approximately 12 GHz through the second feed line (265). Additionally, when power is applied through the first power supply line (262), the field distribution of the first power supply line (262) does not affect the second power supply line (265), and when power is applied through the second power supply line (265), the field distribution of the second power supply line (265) does not affect the first power supply line (262), and it can be confirmed that the isolation between ports is secured at a level of about 10 dB, which can be utilized in actual electronic devices when considering losses in wiring, etc.

[0126] FIGS. 15a and 15b are drawings illustrating the arrangement relationship between slots of a conductive structure and a power supply line arranged through a rear cover according to various embodiments of the present disclosure.

[0127] Referring to FIG. 15a, the electronic device (200) may include a substrate (240) and a conductive structure (250) spaced apart from the substrate (240) and including a slit (251). In one embodiment, the conductive structure (250) may include a flexible printed circuit board (FPCB) comprising a conductive plate or a conductive layer disposed in a manner attached to the inner surface (2111) of a cover member (211) (e.g., a rear cover) of the electronic device (200). In one embodiment, a flexible substrate (260) may be disposed to cross the slit (251) of the conductive structure (250) from the substrate (240), and a power supply line (262) disposed on the flexible substrate (260) may be disposed to cross the slit. For example, at least a portion of the flexible substrate (260) may be disposed in a manner attached to the conductive structure (250).

[0128] Referring to FIG. 15b, in one embodiment, the electronic device (200) may further include an additional antenna (280) (e.g., LDS antenna) (e.g., antenna structure) that radiates through a slit (251) of a conductive structure (250). The additional antenna (280) may include a conductive pattern that is placed in an antenna carrier (e.g., dielectric structure) placed in the internal space (2101) of the electronic device (200) and is electrically connected to a wireless communication circuit (e.g., wireless communication module (192) of FIG. 1). In some embodiments, the feed line (262) may be replaced by a conductive pattern of the additional antenna (280) that is placed across the slot (251) when the slot (251) is viewed from above.

[0129] According to various embodiments, an electronic device (e.g., electronic device (200) of FIG. 4a) comprises a housing (e.g., housing (210) of FIG. 2a), a substrate (e.g., substrate (240) of FIG. 4b) disposed in the housing and comprising a wireless communication circuit (e.g., wireless communication circuit (F) of FIG. 4b), a conductive structure (e.g., conductive structure (250) of FIG. 5) spaced apart from the substrate in the housing and comprising a slot (e.g., slot (251) of FIG. 5) having a first length (e.g., first length (L1) of FIG. 5) along a first direction, and a feed line (e.g., feed line (262) of FIG. 5) electrically connected to the wireless communication circuit and disposed to overlap at least partially with the slot, wherein the feed line is disposed to cross at least partially the slot along a second direction perpendicular to the first direction, and the wireless communication circuit transmits a wireless signal in a first frequency band through the slot. and / or can be configured to receive.

[0130] According to various embodiments, the power supply line may be positioned to completely cross the slot.

[0131] According to various embodiments, the feed line may be positioned so that its end overlaps the slot when the substrate is viewed from above.

[0132] According to various embodiments, the power supply line may be electromagnetically connected to the conductive structure.

[0133] According to various embodiments, the first frequency band can be determined through the first length of the slot.

[0134] According to various embodiments, the slot is formed to have a first width (e.g., the first width (W1) of FIG. 5) along the second direction, and the first frequency band can be determined according to the first width.

[0135] According to various embodiments, the power supply line is formed to have a second width (e.g., second width (W2)) along the first direction, and the first frequency band can be determined according to the second width.

[0136] According to various embodiments, the power supply line may be positioned to cross a point ranging from 20% to 30% of the total length of the slot from the end of the slot.

[0137] According to various embodiments, the power supply line is disposed on a first layer of a flexible substrate (FPCB) (e.g., the flexible substrate (260) of FIG. 4b), and the power supply line may be extended together as the flexible substrate extends from the substrate to the conductive structure.

[0138] According to various embodiments, a first ground layer (e.g., the first ground layer (263) of FIG. 8a) may be further included, disposed on the second layer of the flexible substrate and at least partially overlapping with the feed line.

[0139] According to various embodiments, a second ground layer (e.g., the second ground layer (264) of FIG. 8b) may be further included, which is positioned on a third layer opposite to the second layer with the first layer in between and overlaps at least partially with the power supply line.

[0140] According to various embodiments, the area corresponding to the slot may not have the first ground layer and the second ground layer disposed therein.

[0141] According to various embodiments, the conductive structure is electrically connected to the ground of the substrate, and the first ground layer may not be placed in the area where the flexible substrate overlaps with the conductive structure.

[0142] According to various embodiments, the power supply line may include a coaxial cable (e.g., the coaxial cable (270) of FIG. 8c).

[0143] According to various embodiments, the coaxial cables can be electrically connected to the conductive structure with the slots in between.

[0144] According to various embodiments, the conductive structure includes an additional slot (e.g., additional slot (253) of FIG. 12a) that branches out from the slot in the second direction and has a second length different from the first length (e.g., second length (L2) of FIG. 12a), and the wireless communication circuit may be configured to transmit and / or receive a wireless signal in a second frequency band through the additional slot.

[0145] According to various embodiments, the conductive structure includes an additional slot (e.g., additional slot (254) in FIG. 12b) having a second length different from the first length along the first direction at a position spaced apart from the slot, and the feed line is positioned to cross the first slot and the additional slot, and the wireless communication circuit may be configured to transmit and / or receive a wireless signal in a second frequency band through the additional slot.

[0146] According to various embodiments, the first frequency band may include a frequency band in the range of 14 GHz to 15 GHz.

[0147] According to various embodiments, the first length of the slot may be set to have a length of half a wavelength (λ / 2) in the first frequency band.

[0148] According to various embodiments, the conductive structure may include at least one of a metal plate, a bracket, a shield can, an interface connector cover, a speaker cover, or a socket cover.

[0149] Furthermore, the embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples provided to facilitate the explanation of the technical content according to the embodiments of the present disclosure and to aid in understanding the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Accordingly, the scope of the various embodiments of the present disclosure should be interpreted to include all modifications or variations derived based on the technical concept of the various embodiments of the present disclosure, in addition to the embodiments disclosed herein.

Claims

1. In an electronic device, Housing (210); A substrate (240) disposed in the above housing and including a wireless communication circuit (F); A conductive structure (250) including a slot (251) spaced apart from the substrate in the housing and having a first length (L1) along a first direction; and It includes a power supply line (262) that is electrically connected to the above wireless communication circuit and arranged to overlap at least partially with the slot, and The above power supply line is arranged to cross the slot at least partially along a second direction perpendicular to the first direction, and The above wireless communication circuit is an electronic device configured to transmit and / or receive a wireless signal in a first frequency band through the above slot.

2. In Paragraph 1, The above power supply line is an electronic device positioned to completely cross the above slot.

3. In Paragraph 1, The above-mentioned power supply line is an electronic device arranged such that, when the above-mentioned substrate is viewed from above, the end overlaps with the above-mentioned slot.

4. In Paragraph 1, The above power supply line is an electronic device electromagnetically connected to the above conductive structure.

5. In Paragraph 1, The above first frequency band is an electronic device determined through the above first length of the slot.

6. In Paragraph 1, The above slot is formed to have a first width (W1) along the second direction, and The above first frequency band is an electronic device determined according to the above first width.

7. In Paragraph 1, The above power supply line is formed to have a second width (W2) along the above first direction, and The above first frequency band is an electronic device determined according to the above second width.

8. In Paragraph 1, The above-mentioned power supply line is an electronic device positioned to cross a point ranging from 20% to 30% of the total length of the slot from the end of the slot.

9. In Paragraph 1, The above power supply line is placed on the first layer of the flexible substrate (FPCB) (260), and The above power supply line is an electronic device that extends together when the flexible substrate extends from the substrate to the conductive structure.

10. In Paragraph 9, An electronic device further comprising a first ground layer (263) disposed on the second layer of the flexible substrate and at least partially overlapping with the feed line.

11. In Paragraph 10, An electronic device further comprising a second ground layer (264) disposed on a third layer opposite to the second layer with the first layer in between, and at least partially overlapping with the power supply line.

12. In Paragraph 11, The region corresponding to the above slot is an electronic device in which the first ground layer and the second ground layer are not disposed.

13. In Paragraph 10, The conductive structure is electrically connected to the ground of the substrate, and An electronic device in which the first ground layer is not placed in the region where the flexible substrate overlaps with the conductive structure.

14. In Paragraph 1, The above power supply line is an electronic device including a coaxial cable (270).

15. In Paragraph 14, The above coaxial cable is an electronic device electrically connected to the above conductive structure with the above slot in between.

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