Apparatus for peeling thin film having NANO leds formed thereon and method therefor

Abstract

The present invention relates to an apparatus for peeling a thin film having nano LEDs formed thereon and a method therefor, wherein the thin film having nano LEDs formed thereon can be separated from a wafer by vacuum suction while moving in a radius of curvature along with a film laminated on the wafer, thus making it possible to increase the yield and lead time of micro / nano LEDs by separating the thin film from the wafer, and significantly reduce process costs incurred due to reuse of the wafer by minimizing damage to the wafer.

Description

Thin film peeling device and method on which nano LEDs are formed

[0001] The present invention relates to a thin film peeling apparatus and method having a nano LED formed thereon, and more specifically, to a thin film having a nano LED formed thereon configured to be peeled off by vacuum adsorption from a wafer while moving along a radius of curvature together with a film laminated to a wafer, thereby increasing the yield and lead time of micro / nano LEDs when peeling off the thin film from the wafer, and also minimizing wafer damage to significantly reduce process costs through wafer reuse.

[0002]

[0003] Generally, a silicon substrate wafer coated with a thin film of lithium niobate or lithium tantalum is the basic material for chip manufacturing.

[0004] The method for manufacturing semiconductor films such as lithium niobate and lithium tantalum is as follows.

[0005] Ion implantation is performed on an intermediate surface to concentrate the implanted ions within the thin film substrate to form an implantation layer, and then the thin film substrate is formed. After surface activation of the implantation layer and the silicon substrate, the two activated surfaces are combined to obtain a composite, and then the composite is processed and heat treatment is performed. During this process, bubbles are generated in the implantation layer, and as the heat treatment proceeds, bubbles continue to be generated in the implantation layer, causing the implantation layer to crack, the thin film substrate is peeled off from the silicon substrate, and a thin film layer is formed on the silicon substrate.

[0006] Based on this, 3 to 6-inch wafers can be obtained through additional processing.

[0007] However, because the materials of the silicon substrate and the film substrate are different, their coefficients of thermal expansion differ; consequently, since the deformations after heating during the processing differ, greater stress is generated at the bonding interface between the silicon substrate and the film substrate.

[0008] As a result, the bonded parts break easily, and the product yield decreases.

[0009] Currently, the solution to the aforementioned problem is a silicon substrate.

[0010] After bonding with the film substrate and before heat treatment, the film substrate is ground and thinned starting from the non-injection surface; that is, the pre-made thin film substrate body is ground.

[0011] As the amount of deformation decreases after heating, the stress between the film substrate and the silicon substrate decreases, and the fragmentation rate decreases.

[0012] However, the aforementioned method not only adds more steps than the existing process and increases process complexity, but also presents problems with the mass production and reuse of film substrates.

[0013] Taking these points into consideration, a thin film mechanical separation device was proposed in Chinese application publication number CN 113299576 A.

[0014] Upon examination, a conventional general thin film mechanical separation device comprises a working surface, a linear stretching component, and a movable block connected to a linear stretching component. The linear stretching component drives the movable block to move linearly in a direction perpendicular to the working surface. A first adsorption member is mounted on the bottom of the movable block, and a second adsorption member is installed on the working surface. The second adsorption member is configured to be positioned in the opposite direction to the first adsorption member.

[0015] However, a conventional general thin film mechanical separation device configured in this way has the disadvantage that when separating a film attached to a substrate through a first adsorption piece, the entire bottom surface of the film attached to the substrate is simultaneously separated from the substrate, making separation difficult due to the large surface area and potentially damaging the substrate during separation.

[0016] Prior art

[0017] Chinese Application Publication No. CN 113299576 A

[0018]

[0019] Accordingly, the present invention has been devised to resolve the aforementioned problems, and aims to provide a device and method for peeling off a thin film on which a nano LED is formed, configured to allow the thin film on which the nano LED is formed to be peeled off by vacuum adsorption from the wafer while moving along a radius of curvature together with a film laminated to the wafer, thereby increasing the yield and lead time of the micro / nano LED when peeling off the thin film from the wafer, and also minimizing wafer damage to significantly reduce process costs through wafer reuse.

[0020] Other objectives of the present invention will become clear as the technology progresses.

[0021]

[0022] The present invention, for achieving the above-mentioned purpose, is a film peeling device for semiconductor manufacturing that enables peeling of a film laminated on a wafer by driving in response to the control of a control unit, comprising: a film peeling frame (110) having an LM rail (113) installed transversely on its upper surface; and a film peeling supply unit (120) which is installed on the LM rail (113) via a supply LM block provided on its lower surface, and has a supply mounting plate (122) on its upper surface to allow a wafer laminated with a film to be mounted thereon, and is configured to be movable in one direction and the other direction along the LM rail (113). The invention is characterized by comprising: a film peeling means (130) installed on the upper surface of the film peeling frame (110) and configured to enable peeling by vacuum adsorbing the film from one side to the other while moving the film laminated on the wafer supplied through the film peeling supply unit (120) at a radius of curvature; and a film discharge unit (140) positioned opposite to the film peeling supply unit (120) by being installed on the LM rail (113) via a discharge LM block provided on the lower surface, and configured to be movable in one direction and the other direction along the LM rail (113) by having a discharge discharge plate (142) on the upper surface to attach and discharge the film peeled by the film peeling means (130).

[0023] In addition, the upper side of one side of the above-described film discharge section (140) is further provided with a film pressing means (150) such that a pressurizing roller (151), which is rotatably installed while the discharge plate (142) to which the film is attached moves in the other direction, rises and falls in response to the driving of a pressurizing forward / reverse drive motor or a pressurizing cylinder to pressurize the film and prevent the film from falling off the discharge plate (142).

[0024] Furthermore, another invention for achieving the aforementioned purpose is a method for peeling a film for semiconductor manufacturing that enables the peeling of a film laminated on a wafer, comprising: a supply step for supplying a wafer having a film laminated on its upper surface to a supply mounting plate of a supply unit for film peeling; an input step for introducing the supply mounting plate of the supply unit for film peeling to the lower side of a film peeling member; a lowering step for lowering the film peeling member to the upper side of the wafer having the film laminated on it; a peeling step for peeling the film by vacuum adsorption from one side to the other while the film peeling member moves along a peeling LM rail formed in a curved shape with a radius of curvature; an output plate input step for introducing the output plate of the film discharge unit to the middle side of the upper surface of the film peeling frame together with the return of the supply mounting plate; and a peeling film attachment step for attaching the peeled film to the upper side of the output plate while the film peeling member returns along the peeling LM rail. It is characterized by including a discharge step for discharging a film attached to a discharge plate.

[0025] In addition, it is characterized by further including a pressure roller lowering step for lowering the pressure roller of the film pressure part to pressurize the film attached to the discharge plate before the aforementioned discharge step.

[0026]

[0027] As described above, according to the thin film peeling apparatus and method having a nano LED formed thereon according to the present invention, the thin film having a nano LED formed thereon is configured to be peeled off by vacuum adsorption from the wafer while moving along with a film laminated to the wafer at a radius of curvature. As a result, the yield and lead time of the micro / nano LED can be increased by peeling the thin film from the wafer, and damage to the wafer can be minimized, thereby significantly reducing the process cost through wafer reuse.

[0028]

[0029] FIG. 1 is a perspective view illustrating a thin film peeling device having a nano LED formed thereon according to the present invention.

[0030] FIG. 2 is a front view illustrating a thin film peeling device having a nano LED formed thereon according to the present invention.

[0031] FIG. 3 is a plan view illustrating a thin film peeling device having a nano LED formed thereon according to the present invention.

[0032] FIG. 4 is a cross-sectional view showing a part of the supply section for film peeling of a thin film peeling device having a nano LED formed thereon according to the present invention.

[0033] FIG. 5 is a cross-sectional view showing a part of the film discharge section of a thin film peeling device having a nano LED formed thereon according to the present invention.

[0034]

[0035] Hereinafter, an example of a thin film peeling apparatus and a method having a nano LED formed thereon according to the present invention will be described in detail.

[0036] First, it should be noted that in the drawings, identical components or parts are denoted by the same reference numerals whenever possible. In describing the present invention, specific descriptions of related known functions or configurations are omitted to avoid obscuring the essence of the invention.

[0037] As described above, the thin film peeling apparatus and method having a nano LED formed thereon according to the present invention is configured to enable peeling by vacuum adsorption from a wafer while the thin film having a nano LED formed thereon is moving along a curvature radius together with a film laminated to the wafer, thereby minimizing damage to the wafer and enabling the wafer to be reused.

[0038] First, the thin film peeling device (100) having the above-described nano LED formed thereon is a device configured to enable peeling of a thin film having a nano LED formed thereon together with a film laminated on a wafer by driving in response to the control of a control unit, and comprises a film peeling frame (110) having an LM rail (113) installed transversely on its upper surface, a film peeling supply unit (120) installed on the LM rail (113) via a supply LM block provided on its lower surface, and having a supply mounting plate (122) on its upper surface to allow mounting of a wafer laminated with a film, and configured to be movable in one direction and the other direction along the LM rail (113), and a film peeling supply unit (120) installed on the upper surface of the film peeling frame (110) to enable peeling while vacuum-adsorbing the film from one side to the other side from the wafer while moving the film laminated on the wafer supplied through the film peeling supply unit (120) at a radius of curvature. It is configured to include a film peeling means (130) and a film discharge unit (140) positioned opposite to the film peeling supply unit (120) by being installed on the LM rail (113) via a discharge LM block provided on the bottom surface, and having a discharge discharge plate (142) on the top surface so as to attach and discharge the film peeled by the film peeling means (130), and being movable in one direction and the other direction along the LM rail (113).

[0039] In addition, a film pressing means (150) is further provided such that a pressurizing roller (151), which is installed on the upper surface of the above-mentioned film peeling frame (110) and positioned on one side of the upper part of the film discharge section (140) so as to be rotatable while the discharge plate (142) to which the film is attached moves in the other direction, rises and falls in response to the driving of a pressurizing forward / reverse drive motor or a pressurizing cylinder to pressurize the film and prevent the film from falling off the discharge plate (142).

[0040] Meanwhile, the above-described other invention is a method for peeling a film for semiconductor manufacturing that enables the peeling of a film laminated on a wafer, comprising: a supply step for supplying a wafer having a film laminated on its upper surface to a supply mounting plate of a film peeling supply unit; an input step for introducing the supply mounting plate of the film peeling supply unit into the lower side of a film peeling member; a lowering step for lowering the film peeling member toward the upper surface side of the wafer having the film laminated on it; a peeling step for peeling the film by vacuum adsorption from one side to the other while the film peeling member moves along a peeling LM rail formed in a curved shape with a radius of curvature; an output plate input step for introducing the output plate of the film discharge unit into the middle side of the upper surface of the film peeling frame together with the return of the supply mounting plate; a peeling film attachment step for attaching the peeled film to the upper surface side of the output plate while the film peeling member returns along the peeling LM rail; and on the output plate It is configured to include an ejection step for ejecting an attached film.

[0041] In addition, the method is configured to further include a pressure roller lowering step for lowering the pressure roller of the film pressure unit to pressurize the film attached to the discharge plate prior to the aforementioned discharge step.

[0042]

[0043] Hereinafter, the semiconductor manufacturing film peeling apparatus according to the present invention described above will be explained in more detail with reference to the attached drawings FIGS. 1 to 5.

[0044] First, the film peeling frame (110) of the semiconductor manufacturing film peeling device according to the present invention described above is configured to allow the film peeling supply unit (120) and the film discharge unit (140) to be installed on the front left and right sides of the upper surface.

[0045] That is, the above-described film peeling frame (110) is composed of a square-shaped film peeling frame (111) consisting of a plurality of vertical bars and a horizontal bar that fixes and connects the vertical bars to each other, and a film peeling plate (112) which is formed in a plate shape so as to be fixed to the upper surface of the film peeling frame (111) and so as to be installed horizontally on the upper surface of the LM rail (113), and is provided with a supply drive hole (not shown) and a discharge drive hole (not shown) drilled on the left and right sides of the plate.

[0046] The above-described supply unit (120) for film peeling is configured such that it is installed on an LM rail (113) formed on a film peeling plate (112) of the film peeling frame (110), has a supply LM block installed on its bottom surface to be installed on the LM rail (113), and a supply mounting plate is provided on its top surface to be mounted on a wafer laminated with film, and is configured to be movable along the LM rail (113) to the lower side of the film peeling means (130), which is the middle part of the film peeling plate (112) of the film peeling frame (110), by driving in response to the control of the control unit.

[0047] That is, the above-described film peeling supply unit (120) comprises: a supply moving plate (121) which is installed on the LM rail (113) of the film peeling frame (110) and is positioned on one side of the upper surface of the film peeling plate (112), and is equipped with a supply LM block (drawing reference number omitted) on its lower surface; a supply mounting plate (122) which is installed so as to be movable in one direction and the other direction on a guide bar (122a) for a mounting plate installed on the upper surface of the supply moving plate (121), and is provided in a plate shape so as to be mounted on the upper surface of a wafer laminated with film; a supply forward / reverse driving motor (123) which is fixedly installed on one side of the lower surface of the film peeling plate (112) of the film peeling frame (110) and is equipped with a supply pulley (drawing reference number omitted) on a supply driving shaft so as to be driven forward / reverse in response to the control of the control unit; and the film peeling It is composed of a supply ball screw (124) which is rotatably fixed at one end and connected to a supply pulley through a supply drive hole via a supply belt on one side of the upper surface of the plate (113), and the other end connected to the bottom surface of the supply moving plate (121) so as to move the supply moving plate (121) to the lower side of the film peeling means (130) in response to the driving of the supply forward / reverse drive motor (123); and a supply cylinder (125) which is fixedly installed on one side of the upper surface of the supply moving plate (121) so as to move the supply mounting plate (122) by driving the supply piston (125a) in response to the control of the control unit.

[0048] The above-described film peeling means (130) is installed on the upper surface of the film peeling plate (112) of the film peeling frame (110) and is positioned in the rear middle portion of the LM rail (113) so as to enable peeling by vacuum adsorbing the film from one side to the other while moving the film laminated on the wafer supplied through the film peeling supply unit (120) at a radius of curvature.

[0049] That is, the above-described film peeling means (130) is fixedly installed in the middle of the rear of the upper surface of the film peeling plate (112) of the film peeling frame (110), and comprises a peeling fixing bracket (131) having a lifting LM rail (131a) fixed longitudinally on the front, a peeling lifting plate (132) having a lifting LM block (drawing symbol omitted) installed on one side so as to be installed on the lifting LM rail (131a) of the peeling fixing bracket (131), a peeling guide member (133) fixed to the peeling lifting plate (132) having a curved peeling LM rail (133a) installed on the front, and a peeling LM block (drawing symbol omitted) installed on one side so as to be installed on the peeling LM rail (133a) of the peeling guide member (133). A peeling movable member (134), a film peeling member (135) having one side fixedly installed on one side of the bottom surface of the peeling movable member (134), and the other side having a curved peeling contact surface formed with multiple peeling holes so that the film laminated on the upper surface of the wafer can be peeled by vacuum adsorption from one side to the other while the peeling movable member (134) moves along the peeling LM rail (133a) with a radius of curvature, a lifting forward / reverse drive motor (136) fixedly installed on the rear side of the peeling fixed bracket (131) and equipped with a lifting pulley on a lifting drive shaft so as to be driven forward / reverse in response to the control of the control unit, and one end fixedly installed on the front side of the peeling fixed bracket (131) so as to be rotatable by being connected to the lifting pulley via a lifting belt, and the other end is the peeling A lifting ball screw (137) connected to one side of the lifting plate (132) and configured to lift the lifting plate (132) in response to the driving of the lifting forward / reverse drive motor (136), and a peeling forward / reverse drive motor (138) fixedly installed on one side of the upper surface of the peeling guide member (133) and configured to have a peeling pulley on the peeling drive shaft so as to be driven forward / reverse in response to the control of the control unit,It is composed of a peeling ball screw (139) having one end fixedly installed to be rotatable and connected to a peeling pulley via a peeling belt on the bottom surface of the peeling guide member (133), and the other end connected to the other side of the bottom surface of the peeling moving member (134) on which the film peeling member (135) is installed, so as to be moved along the peeling LM rail (133a) with a radius of curvature corresponding to the driving of the peeling forward / reverse drive motor (138).

[0050] The above-described film discharge unit (140) is positioned opposite to the film peeling supply unit (120) by being installed on the LM rail (113) via a discharge LM block provided on the bottom surface, and is provided with a discharge plate on the top surface so as to be able to attach and discharge the film peeled by the film peeling means (130) to the top surface and move along the LM rail (113) in one direction and the other direction.

[0051] That is, the above-described film discharge unit (140) is provided with a discharge movable plate (141) having a discharge LM block on its bottom surface so as to be positioned on the other side of the upper surface of the film peeling plate (112) by being installed on the LM rail (113) of the film peeling frame (110); a discharge discharge plate (142) provided in a plate shape so as to be movable in one direction and the other direction on a discharge plate guide bar (142a) installed on the upper surface of the discharge movable plate (141) so as to be able to attach the film peeled by the film peeling means (130) to the upper surface; a discharge forward / reverse drive motor (143) fixedly installed on the other side of the bottom surface of the film peeling plate (112) of the film peeling frame (110) and provided with a discharge pulley on the discharge drive shaft so as to be driven forward / reverse in response to the control of the control unit; and a discharge belt on the other side of the upper surface of the film peeling plate (112) It is composed of a discharge ball screw (144) which is rotatably connected to a discharge pulley through a discharge drive hole and has one end fixedly installed, and the other end connected to the bottom surface of the discharge movable plate (141) so as to move the discharge movable plate (141) in response to the driving of the discharge forward / reverse drive motor (143), and a discharge cylinder (145) which is fixedly installed on one side of the upper surface of the discharge movable plate (141) so as to move the discharge discharge plate (142) by driving the discharge piston (145a) in response to the control of the control unit.

[0052]

[0053] When intending to automatically peel off and discharge a thin film on which a nano LED is formed together with a film laminated on a wafer using the thin film peeling device on which a nano LED is formed according to the present invention configured as described above, first, as shown in the attached drawings FIGS. 1 to 5, a wafer on which a film is laminated on its upper surface is placed, that is, supplied, to the supply mounting plate (122) of the supply unit (120) for film peeling.

[0054] As described above, when a wafer with a film laminated on its upper surface is supplied to the supply mounting plate (122) of the supply unit (120) for film peeling, the supply forward / reverse drive motor (123) of the supply unit (120) for film peeling is driven in response to the control of the control unit, and then the supply cylinder (125) is driven, thereby causing the supply mounting plate (122) to be fed into the lower side of the film peeling means (130).

[0055] As described above, when the supply mounting plate (122) is fed into the lower side of the film peeling means (130), the lifting forward / reverse drive motor (136) of the film peeling means (130) is driven in response to the control of the control unit, causing the peeling moving member (134) to descend so that the peeling contact surface of the film peeling member (135) comes into contact with the upper surface of the film.

[0056] Subsequently, as the film peeling member (135) moves along the peeling LM rail (133a) with a radius of curvature in response to the driving of the peeling forward / reverse drive motor (138) of the film peeling means (30), the film laminated on the upper surface of the wafer is peeled by vacuum adsorption from one side to the other.

[0057] As described above, when the film is peeled by the film peeling member (135), the supply mounting plate (122) returns to its original position, and the discharge plate (142) is fed into the lower side of the film peeling means (140) in correspondence with the operation of the discharge forward / reverse drive motor (143) and the discharge cylinder (145) of the film discharge unit (140).

[0058] As described above, when the discharge plate (142) is introduced into the lower side of the film peeling means (130), the film peeling member (135) returns to a radius of curvature along the peeling LM rail (133a) in correspondence with the driving of the peeling forward / reverse drive motor (138) of the film peeling means (130), and the vacuum-adsorbed film is attached to the upper surface of the discharge plate (142).

[0059] Afterwards, the peeling of the film laminated on the upper surface of the wafer is completed in correspondence with the discharge of the discharge plate (142).

[0060] As described above, since the film peeling member is vacuum-adsorbed while moving along the peeling LM rail with a radius of curvature, the film is peeled from one side to the other, so the film can be safely peeled from the wafer, thereby minimizing damage to the wafer and enabling the wafer to be reused.

[0061] The foregoing description is merely an illustrative explanation of the technical concept of the present invention, and those skilled in the art to which the present invention pertains will be able to make various modifications and variations within the scope of the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention are intended to explain, not limit, the technical concept of the present invention, and the scope of the technical concept of the present invention is not limited by such embodiments. The scope of protection of the present invention shall be interpreted by the claims below, and all technical concepts within an equivalent scope shall be interpreted as being included within the scope of rights of the present invention.

Claims

1. A thin film peeling device having a nano LED formed thereon, which enables the thin film having a nano LED formed thereon to be peeled together with a film laminated to a wafer, A film peeling frame (110) having an LM rail (113) installed horizontally on the upper surface; A film peeling supply unit (120) that is installed on the LM rail (113) via a supply LM block provided on the bottom surface, and is provided with a supply mounting plate (122) on the top surface to allow a wafer laminated with a film to be mounted thereon, and is configured to be movable in one direction and the other direction along the LM rail (113); A film peeling means (130) installed on the upper surface of the film peeling frame (110) and configured to enable peeling while vacuum-adsorbing the film from one side to the other side from the wafer while moving the film laminated on the wafer supplied through the film peeling supply unit (120) at a radius of curvature; A film discharge unit (140) is positioned opposite to the film peeling supply unit (120) by being installed on the LM rail (113) via a discharge LM block provided on the bottom surface, and is provided with a discharge discharge plate (142) on the top surface to allow the film peeled by the film peeling means (130) to be attached and discharged, and is configured to be movable in one direction and the other direction along the LM rail (113). A thin film peeling device in which a nano LED is formed, characterized by including 2. In Paragraph 1, A thin film peeling device having a nano LED formed thereon, characterized in that a film pressing means (150) is further provided on the upper side of one side of the film discharge section (140), so as to prevent the film from falling off the discharge discharge plate (142) by pressing the film by raising and lowering the film in response to the driving of a pressurizing forward / reverse drive motor or a pressurizing cylinder, while the discharge discharge plate (142) to which the film is attached moves in the other direction.

3. In Paragraph 1, The above-mentioned supply unit (120) for film peeling comprises: a supply moving plate (121) which is installed on the LM rail (113) of the film peeling frame (110) and is positioned on one side of the upper surface of the film peeling frame (110) and is equipped with a supply LM block on its lower surface; a supply mounting plate (122) which is installed on a guide bar (122a) for a mounting plate installed on the upper surface of the supply moving plate (121) so as to be movable in one direction and the other direction, and is provided in a plate shape so as to be mounted on the upper surface of a wafer laminated with film; a supply forward / reverse driving motor (123) which is fixedly installed on one side of the lower surface of the film peeling frame (110) and is equipped with a supply pulley on a supply driving shaft so as to be driven forward / reverse in response to the control of the control unit; and a supply pulley connected to one side of the upper surface of the film peeling frame (110) via a supply belt and through a supply driving hole so as to be rotatable A thin film peeling device having a nano LED formed thereon, characterized by comprising: a supply ball screw (124) which is fixedly installed at one end and connected to the bottom surface of the supply moving plate (121) at the other end so as to move the supply moving plate (121) to the lower side of the film peeling means (130) in response to the driving of the supply forward / reverse driving motor (123); and a supply cylinder (125) which is fixedly installed on one side of the upper surface of the supply moving plate (121) so as to move the supply mounting plate (122) by driving the supply piston (125a) in response to the control of the control unit.

4. In Paragraph 1 or 3, The above film peeling means (130) is fixedly installed in the middle of the rear upper surface of the film peeling frame (110), and comprises a peeling fixing bracket (131) having a lifting LM rail (131a) fixed longitudinally on the front, a peeling lifting plate (132) having a lifting LM block installed on one side so as to be installed on the lifting LM rail (131a) of the peeling fixing bracket (131), a peeling guide member (133) fixed to the peeling lifting plate (132) having a curved peeling LM rail (133a) installed on the front, a peeling moving member (134) having a peeling LM block installed on one side so as to be installed on the peeling LM rail (133a) of the peeling guide member (133), and the peeling moving member (134) having a peeling LM block installed on one side so as to be installed on the peeling LM rail (133a) of the peeling guide member (133), and the peeling moving member (134). A film peeling member (135) having one side fixedly installed on one side of the bottom surface, and the other side having a curved peeling contact surface formed with multiple peeling holes so that the film laminated on the upper surface of the wafer can be peeled by vacuum adsorbing from one side to the other while the peeling moving member (134) moves along the peeling LM rail (133a) with a radius of curvature; a lifting forward / reverse driving motor (136) having a lifting pulley on a lifting drive shaft that is fixedly installed on the rear side of the peeling fixing bracket (131) and capable of forward / reverse driving in response to the control of the control unit; and one end of which is fixedly installed on the front side of the peeling fixing bracket (131) so as to be rotatable and connected to the lifting pulley via a lifting belt, and the other end connected to one side of the peeling lifting plate (132) so as to correspond to the driving of the lifting forward / reverse driving motor (136). A lifting ball screw (137) provided to lift the lifting plate (132) for peeling, a peeling forward / reverse drive motor (138) fixedly installed on one side of the upper surface of the peeling guide member (133) and equipped with a peeling pulley on the peeling drive shaft so as to be driven forward / reverse in response to the control of the control unit, and one end of which is fixedly installed on the lower surface of the peeling guide member (133) so as to be rotatable and connected to the peeling pulley via a peeling belt,A thin film peeling device having a nano LED formed thereon, characterized in that the other end is configured with a peeling ball screw (139) which is configured to allow the film peeling member (135) to be moved along the peeling LM rail (133a) with a radius of curvature in correspondence with the driving of the peeling forward / reverse drive motor (138), and the film peeling member (135) is connected to the other end of the bottom surface of the peeling moving member (134) installed on the bottom surface.

5. In Paragraph 1, The above film discharge unit (140) comprises: a discharge movable plate (141) having a discharge LM block on its bottom surface so as to be positioned on the other side of the upper surface of the film peeling frame (110) by being installed on the LM rail (113); a discharge discharge plate (142) installed in a plate shape so as to be movable in one direction and the other direction on a discharge plate guide bar (142a) installed on the upper surface of the discharge movable plate (141) so as to be able to attach the film peeled by the film peeling means (130) to the upper surface; a discharge forward / reverse drive motor (143) fixedly installed on the other side of the lower surface of the film peeling frame (110) and having a discharge pulley on the discharge drive shaft so as to be driven forward / reverse in response to the control of the control unit; and one end of which is fixedly installed on the other side of the upper surface of the film peeling frame (110) so as to be rotatable by being connected to the discharge pulley through a discharge drive hole via a discharge belt, and the other end A thin film peeling device for forming a nano LED, characterized by comprising: a discharge ball screw (144) connected to the bottom surface of the discharge movable plate (141) and configured to move the discharge movable plate (141) in response to the driving of the discharge forward / reverse driving motor (143); and a discharge cylinder (145) configured such that the discharge piston (145a) is fixedly connected to the bottom surface of the discharge discharge plate (142) by being fixedly installed on one side of the upper surface of the discharge movable plate (141) and configured to move the discharge discharge plate (142) in response to the control of the control unit.

6. A method for peeling off a thin film having a nano LED formed thereon, wherein the thin film having a nano LED formed thereon can be peeled off together with a film laminated to a wafer, A supply step for supplying a wafer having a film laminated on its upper surface to a supply mounting plate of a supply unit for film peeling; An input step for inserting a supply mounting plate of a supply unit for film peeling into the lower side of a film peeling member; A lowering step for lowering the film peeling member toward the upper surface of the wafer on which the film is laminated; A peeling step for peeling a film by vacuum adsorbing it from one side to the other while the film peeling member moves along a peeling LM rail formed in a curved shape with a radius of curvature; A discharge plate insertion step for inserting the discharge plate of the film discharge section into the middle of the upper surface of the film peeling frame together with the return of the supply mounting plate; A step for attaching a peeling film to the upper surface of a discharge plate while the film peeling member returns along a peeling LM rail; A discharge step for discharging a film attached to a discharge plate A method for peeling off a thin film on which a nano LED is formed, characterized by including 7. In Paragraph 6, A method for peeling off a thin film formed with a nano LED, characterized by further including a pressure roller lowering step for lowering a pressure roller of a film pressure part to pressurize a film attached to a discharge plate before the discharge step.

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