Electronic device and preparation method therefor

Abstract

The present application relates to the technical field of display devices. The present application provides an electronic device and a preparation method therefor. The electronic device comprises a housing and a screen; the housing comprises a middle frame and a rear cover; the screen comprises a cover plate and a display assembly; the middle frame is fixedly connected between the cover plate and the rear cover, and, together with the cover plate and the rear cover, enclosingly forms an accommodating space; and the display assembly is fixedly connected to the cover plate, and is located in the accommodating space. A gap is provided between a peripheral side surface of the display assembly and the middle frame. The electronic device further comprises an injection molded member, the injection molded member being fixedly connected to the cover plate, the display assembly and the middle frame, and the injection molded member filling the gap, such that the accommodating space is not in communication with the exterior by means of the gap. The injection molded member may be made of a glue-containing material, and molded by means of an injection molding process. The injection molded member may be viscous, and may be bonded between the middle frame and the display assembly at the same time, so as to seal the gap, thereby achieving the purpose of waterproofing. In addition, the bezel of the electronic device is relatively small, and the internal space can be fully utilized, thereby facilitating miniaturization of the electronic device.

Description

Electronic devices and their manufacturing methods

[0001] This application claims priority to Chinese Patent Application No. 202411697361.6, filed on November 25, 2024, with the China National Intellectual Property Administration, entitled “Electronic Device and Method of Manufacturing Thereof,” the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of display device technology, and in particular to an electronic device and a method for manufacturing the same. Background Technology

[0003] With technological advancements, display devices strive for more refined aesthetics, such as miniaturization and extremely small bezels around the display area, to provide a better user experience. However, this pursuit of a more refined appearance often necessitates modifications to the structural design of electronic devices, significantly posing challenges to their waterproof performance. Therefore, achieving both a better appearance and robust waterproofing capabilities is a pressing issue that needs to be addressed. Summary of the Invention

[0004] This application provides an electronic device with a good appearance and excellent waterproof capability, and a method for manufacturing the same.

[0005] In a first aspect, embodiments of this application provide an electronic device. The electronic device includes a housing and a screen. The housing includes a mid-frame and a rear cover. The screen includes a cover plate and a display component. The mid-frame is fixedly connected between the cover plate and the rear cover, and together with the cover plate and the rear cover, forms an accommodating space. The display component is fixedly connected to the cover plate and is located within the accommodating space. A gap exists between the peripheral side of the display component and the mid-frame. The electronic device also includes an injection-molded part, which is fixedly connected to the cover plate, the display component, and the mid-frame. The injection-molded part fills the gap, allowing the accommodating space to communicate with the outside without any gap.

[0006] Understandably, compared to the solution where the bottom surface of the cover plate is fixedly connected to the middle frame, the display component of this application can be fixedly connected to the peripheral side and the middle frame. The overlapping area S3 of the cover plate and the middle frame in the first direction can be greatly reduced, or the overlapping area S3 of the cover plate and the middle frame in the first direction can be directly eliminated. This can effectively reduce the "black border" of the electronic device, increase the screen ratio of the electronic device, and improve the user experience.

[0007] Injection-molded parts can be formed from adhesive-containing materials using an injection molding process. The injection-molded parts themselves are adhesive, allowing them to bond simultaneously to the mid-frame and display components. This seals the gap between the mid-frame and the peripheral surfaces of the display components, achieving waterproofing without the need for additional adhesive components to seal the gap. The injection-molded parts seal the gap between the peripheral surfaces of the display components and the mid-frame, preventing external moisture and / or dust from entering the enclosure and causing component failure or electronic equipment malfunction. Using injection-molded parts can improve the waterproofing capabilities of electronic devices.

[0008] Compared to dispensing and potting processes for waterproofing the screen and frame, dispensing processes have lower dimensional accuracy and require more processing space. In this embodiment, the injection-molded part is formed using injection molding, which allows for better dimensional control and eliminates the need for clearance with surrounding components. This means the internal space (accommodation space) of the electronic device can be fully utilized, contributing to a reduction in the device's size.

[0009] In some possible implementations, the inner side of the injection-molded part is bonded to the peripheral side of the display component, and the outer side of the injection-molded part is bonded to the middle frame. In this way, the injection-molded part not only effectively seals the gap between the peripheral side of the display component and the middle frame, but also serves to waterproof the display component, preventing moisture from eroding the interior of the display component from the peripheral side.

[0010] In some possible implementations, a cover plate is bonded to the upper surface of the injection molded part.

[0011] Understandably, the upper surface of the injection-molded part is bonded to the cover plate, and the bonding and fixing area between the injection-molded part and the screen is relatively large (the inner side of the injection-molded part is bonded to the peripheral side of the display component, and the upper surface is bonded to the cover plate), resulting in better connection strength between the injection-molded part and the screen. Furthermore, this can further enhance the sealing effect of the injection-molded part on gaps, reducing the risk of moisture entering the internal space of the electronic device through these gaps.

[0012] In some possible implementations, the injection-molded part is ring-shaped.

[0013] Understandably, the ring-shaped injection molded part can surround the display component, and the injection molded part can better seal the gap.

[0014] In some possible implementations, the material of the injection molded part includes one or more of thermosetting adhesives, UV-curing adhesives, and moisture-curing adhesives.

[0015] It is understandable that the material used in injection molding can be 100% glue, or a mixture of glue and other additives to enhance the physical properties (e.g., strength) of the injection molded part. For example, the glue content in the material used in the injection molded part is greater than 100%. This results in better adhesion of the injection molded part.

[0016] In some possible implementations, the lower surface of the injection-molded part can be used to support components of an electronic device.

[0017] Understandably, the lower surface of the injection-molded part can be used to support the components of the electronic device. The original requirement for a structure on the inner surface of the electronic device's casing to support these components can be eliminated. This not only saves space and improves the utilization of the internal space of the electronic device, but also simplifies the casing structure and reduces the number of processing steps.

[0018] In some possible implementations, the plastic part includes a first part and a second part, the first part filling the gap, and the second part being fixedly connected to the side of the first part near the back cover, the second part being used to carry the components of the electronic device.

[0019] Understandably, the first part fills the gap to achieve a seal. The side of the first part away from the second part forms the upper surface of the injection-molded part. The first part can be fixedly connected to the bottom surface of the middle frame, the cover plate, and the peripheral side of the display assembly. The second part is used to support the components of the electronic device.

[0020] In some possible implementations, the electronic device also includes a motherboard, which is fixedly connected to the second part.

[0021] Understandably, the injection-molded part can serve as a support step for the motherboard. Compared to the dispensing waterproofing solution, the motherboard in this embodiment does not need to avoid the injection-molded part and can be fixedly mounted on it. This results in a more compact arrangement of components within the internal space of the electronic device, which is beneficial for the miniaturization of the electronic device.

[0022] In some possible implementations, the second part is provided with a fixing groove with the opening of the fixing groove facing the rear cover, and the electronic device also includes screws that are fixedly connected in the fixing groove.

[0023] Understandably, after the second part is formed through injection molding, it can be further processed to form a mounting groove. The second part can then serve as a screw post for mounting screws. Screws are used to assist in securing components in electronic devices. For example, screws can be used to secure a motherboard.

[0024] In some possible implementations, the components of the electronic device include one or more of a motherboard, buttons, and sensors.

[0025] Understandably, the types of components carried by injection molded parts can be adjusted according to the component layout of electronic devices. Injection molded parts can be used not only to carry components that are entirely located in the housing space (such as motherboards, sensors, etc.), but also to carry buttons that are partially exposed outside the electronic device and partially located in the housing space.

[0026] In some possible implementations, there are multiple second parts, which are arranged at circumferential intervals along the first part.

[0027] It is understandable that when there are multiple second parts, these multiple second parts can be used to carry multiple devices. Specifically, one second part can carry one device, or multiple second parts can be used to carry one device. Arranging multiple second parts at intervals can achieve the goal of carrying devices while reducing the volume of the injection molded part, and can also avoid interfering with internal components of the electronic device, thereby improving the utilization rate of the internal space of the electronic device.

[0028] In some possible implementations, the first part and the second part are integrally formed structural components.

[0029] It is understandable that achieving an integrated structure through a one-piece molding process means that during the formation of one of the two components, that component is already connected to the other component, without requiring further processing (such as bonding, welding, snap-fit ​​connections, or screw connections) to join the two components together. The first and second parts of the injection molded part are integrally molded structural components, reducing manufacturing steps and improving production efficiency.

[0030] In some possible implementations, the second part and the display component are positioned opposite each other along the thickness direction of the cover plate.

[0031] It is understandable that, compared to the second part which is staggered from the display component in the thickness direction of the cover plate, the second part in this embodiment can be used to carry a larger area of ​​electronic devices.

[0032] In some possible implementations, the mid-frame has a mounting groove, with a portion of the opening located on the side of the mid-frame away from the rear cover and a portion located on the inner side of the mid-frame. The cover plate is fixedly connected to the mounting groove, and the electronic device also includes an adhesive component that is fixedly connected between the mid-frame and the cover plate in the thickness direction of the cover plate.

[0033] Understandably, adhesive connectors can be used to bond the screen and the casing, further strengthening the connection between them and reducing the risk of the screen pulling apart under mechanical force. This also improves the waterproof reliability of the injection-molded parts. Furthermore, by using adhesive connectors, the screen and mid-frame can be pre-fixed during the assembly process of electronic devices, facilitating the subsequent injection molding process. Pre-fixing the screen and mid-frame eliminates the need for additional angled connections, simplifying subsequent operations and reducing complexity.

[0034] In some possible implementations, the electronic device also includes a support member fixedly connected between the mid-frame and the cover plate, and the support member is connected to an adhesive.

[0035] Understandably, when the screen cover and mid-frame are pre-fixed by dispensing adhesive, the support can be used to support the cover, creating a larger space between the cover and mid-frame to accommodate the adhesive.

[0036] In some possible implementations, the electronic device further includes a driving component and an electrical connection component. The driving component is fixedly connected to the side of the display component away from the cover plate. One end of the electrical connection component is electrically connected to the display component, and the other end is electrically connected to the driving component. The electrical connection component is at least partially located between the display component and the mid-frame. An injection molded part covers the portion of the electrical connection component located between the display component and the mid-frame.

[0037] The electrical connection components may be partially located within the gap, with the injection-molded part encasing that portion of the electrical connection components within the gap. It is understood that the injection-molded part encasing the portion of the electrical connection components located between the display components and the mid-frame serves to waterproof this part of the electrical connection components, preventing moisture from corroding them and causing electrical connection failure.

[0038] In some possible implementations, the electrical connection assembly includes a bend, and the bend and the peripheral side of the display assembly enclose a space, with a portion of the injection-molded part filling the space. In this way, the injection-molded part can support the bend of the electrical connection assembly and also provide better sealing and waterproofing.

[0039] Secondly, embodiments of this application provide a method for manufacturing an electronic device, comprising:

[0040] The device provides a screen and a housing, wherein the housing includes a mid-frame and a back cover, and the screen includes a cover plate and a display component.

[0041] The screen cover is fixedly connected to the middle frame of the housing. The screen cover, the middle frame of the housing, and the back cover together enclose the receiving space. The display components of the screen are located within the receiving space, and there is a gap between the peripheral side of the display components and the middle frame.

[0042] Injection molding is used to form a molded part in the gap. The molded part is fixedly connected to the cover plate, display components and middle frame. The molded part is used to connect the receiving space with the outside world without gaps.

[0043] Understandably, during the manufacturing process of electronic devices, injection molding is used to form injection-molded parts to seal the gap between the peripheral side surface of the display component and the mid-frame. Compared to potting / dispensing processes for sealing gaps, injection molding produces more dimensionally stable injection-molded parts, effectively reducing assembly interference problems caused by dimensional fluctuations in potting. Furthermore, the display component can be fixedly connected to the peripheral side surface and the mid-frame. Compared to a solution where the bottom surface of the cover plate is fixedly connected to the mid-frame, the overlap area S3 between the cover plate and the mid-frame in the first direction can be significantly reduced, or even eliminated entirely. This effectively reduces the "black border" of the electronic device, increases the screen-to-body ratio, and improves the user experience.

[0044] In some possible implementations, after the "forming the injection molded part" step, the preparation method further includes:

[0045] A motherboard is provided, which is mounted on the surface of the injection molded part away from the cover plate, and the motherboard is located in the receiving space.

[0046] It is understandable that injection-molded parts can be used to support the motherboard of an electronic device. In other embodiments, injection-molded parts can also be used to support other components of the electronic device, such as sensors, buttons, etc. In this way, injection-molded parts can be used both to seal and waterproof the gap between the display components and the middle frame, and to support the components of the electronic device. The internal structure of the electronic device can be reduced, and the space originally used for the support structure can be used to install more other functional components, or it can help reduce the size of the electronic device.

[0047] In some possible implementations, the injection molded part material is one or more of thermosetting adhesives, UV-curing adhesives, and moisture-curing adhesives.

[0048] In this way, the injection molded part can be formed by injection molding of a material containing glue. The injection molded part itself can be adhesive, so it can be bonded to both the middle frame and the display component at the same time. This can seal the gap between the middle frame and the peripheral side of the display component, thereby achieving waterproofing without the need for additional adhesive parts to seal the gap. Attached Figure Description

[0049] To illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0050] Figure 1 is a partial cross-sectional view of one embodiment of an electronic device in a conventional technical solution;

[0051] Figure 2 is a schematic diagram of one embodiment of the electronic device provided in this application;

[0052] Figure 3 is a partially exploded view of one embodiment of the body shown in Figure 2;

[0053] Figure 4 is a partial structural diagram of the screen shown in Figure 3 from another angle;

[0054] Figure 5 is a structural schematic diagram of one embodiment of the middle frame shown in Figure 3;

[0055] Figure 6 is a partial cross-sectional view of one embodiment of the electronic device shown in Figure 2 at section line AA;

[0056] Figure 7 is a structural schematic diagram of another embodiment of the middle frame shown in Figure 3;

[0057] Figure 8 is a partial cross-sectional view of another embodiment of the electronic device shown in Figure 2 at section line AA. Detailed Implementation

[0058] The embodiments of this application are described below with reference to the accompanying drawings. The embodiments described herein are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0059] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. It should be understood that in this application, "electrical connection" can be understood as components physically contacting and conducting electricity; it can also be understood as a form of connection between different components in a circuit structure through physical lines that can transmit electrical signals, such as copper foil or wires on a printed circuit board (PCB). "Connection" and "connected" can both refer to a mechanical connection relationship or a physical connection relationship. For example, A connecting to B or A being connected to B can mean that there are fastening components (such as screws, bolts, rivets, etc.) between A and B, or that A and B are in contact with each other and are difficult to separate.

[0060] Furthermore, the term "fixed" in this document should be interpreted broadly. For example, "fixed" can mean direct fixing or indirect fixing through an intermediate medium. "Fixed" refers to connections where the relative positional relationship remains unchanged after connection. The directional terms used in the embodiments of this application, such as "upper" and "lower," are merely for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. "Multiple" refers to two or more.

[0061] In the description of the embodiments of this application, unless otherwise stated, " / " means "or". For example, A / B can mean A or B. The "and / or" in the text is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone. In addition, in the description of the embodiments of this application, "multiple" means two or more.

[0062] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of that feature.

[0063] References to "one embodiment" or "some embodiments" as used in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0064] It is understood that the specific embodiments described herein are merely for explaining the relevant invention and not for limiting the invention. It should also be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0065] The embodiments of this application are described below with reference to the accompanying drawings.

[0066] Figure 1 is a partial cross-sectional view of one embodiment of an electronic device 1000 in a conventional technical solution. Figure 1 illustrates that the screen 10 of the electronic device 1000 includes a cover plate 1, a display component 2, an electrical connection component 4, and a driving component 3, and shows the positional relationship between the cover plate 1, the display component 2, the driving component 3, the electrical connection component 4, and the housing 20.

[0067] As shown in Figure 1, in the assembly scheme of the screen 10 of the conventional electronic device 1000, the cover plate 1 is fixed to the housing 20 by adhesive 1004, and together with the housing 20, they enclose a receiving space 1001. The display component 2, the driving component 3, and the electrical connection component 4 are all disposed in the receiving space 1001. The driving component 3 is disposed on the back side of the display component 2. The back side of the display component 2 refers to the surface of the display component 2 away from the cover plate 1. One end of the electrical connection component 4 is fixedly connected to the display component 2, and the other end is fixedly connected to the driving component 3. The driving component 3 and the display component 2 are electrically connected through the electrical connection component 4. The electrical connection component 4 is at least partially located on the peripheral side 23 of the display component 2.

[0068] When the electronic device 1000 displays an image, a black border D will appear around the display area (Active Area, AA) of the screen 10. The black border D can be composed of non-displayable structures under the cover plate 1 (e.g., the non-display area of ​​the display panel, electrical connectors located on one side of the display component 2) S1, clearance gaps S2, and the adhesive area S3 between the cover plate 1 and the housing 20. It is understood that the ratio of the area of ​​the display area AA to the area of ​​the black border D can also be called the screen-to-body ratio. When the sum of the areas of the display area and the black border remains constant, the smaller the black border, the larger the display area, and the larger the screen-to-body ratio. Increasing the screen-to-body ratio of the electronic device 1000 is beneficial to improving the user experience.

[0069] It is understandable that the width of the "black border" D around the display area AA can be different. The width D of the "black border" refers to the width of the "black border" in the direction of the outer side of the accommodating space 1001 towards the side wall of the housing 20. For example, the width of the "black border" around the display area (AA) can be larger on the side where the electrical connection component 4 is located. It is understandable that the location of the electrical connection component 4 can be anywhere around the display area (AA), and is not limited to one side.

[0070] Figure 2 is a schematic diagram of one embodiment of the electronic device 1000 provided in this application. For ease of description, as shown in Figure 1, the length direction of the electronic device 1000 is defined as the X-axis. The width direction of the electronic device 1000 is defined as the Y-axis. The thickness direction of the electronic device 1000 is defined as the Z-axis. In other embodiments, the coordinate system can also be flexibly set according to other requirements.

[0071] Electronic device 1000 may include, but is not limited to, wearable devices such as smartwatches, sports watches, wristbands, augmented reality (AR) glasses, virtual reality (VR) glasses, or headphones. Electronic device 1000 may also be a mobile phone, tablet, or home appliance, etc. The electronic device 1000 shown in Figure 1 is described using a smartwatch as an example. It should be noted that Figure 1 only schematically illustrates some components included in electronic device 1000; the actual size, location, and structure of these components are not limited by the figure. The accompanying figures below also only schematically illustrate some components; the actual size, location, and structure of these components are not limited by the accompanying figures, and will not be elaborated further below.

[0072] As shown in Figure 2, the electronic device 1000 may include a watch body 100 and a watch strap 200. The watch strap 200 is connected to the watch body 100. Exemplarily, there may be two watch straps 200. The two watch straps 200 are respectively connected to both ends of the watch body 100. When a user wears the electronic device 1000, the watch straps 200 can be used to secure the watch body 100 to the user. In other embodiments, there may be only one watch strap 200.

[0073] Figure 3 is a partially exploded view of one embodiment of the body 100 shown in Figure 2.

[0074] As shown in Figures 2 and 3, the watch body 100 may include a screen 10, a housing 20, and an injection-molded part 30. The screen 10 may be mounted on the housing 20. The screen 10 may be used to display patterns. The screen 10 may be a flat screen or a curved screen.

[0075] Figure 4 is a partial structural diagram of the screen 10 shown in Figure 3 from another angle.

[0076] As shown in Figures 3 and 4, the screen 10 may include a cover plate 1, a display component 2, a driving component 3, and an electrical connection component 4. The display component 2 can be used to display images. The driving component 3 can be used to input driving signals to the display component 2. The electrical connection component 4 can be used to realize signal transmission between the driving component 3 and the display component 2.

[0077] For example, the cover plate 1 can be made of a light-transmitting material, such as transparent glass or polyimide. In this way, the cover plate 1 will not affect the display pattern of the display component 2.

[0078] In some embodiments, the display component 2 may include a top surface 21, a bottom surface 22, and a peripheral surface 23. The top surface 21 and the bottom surface 22 of the display component 2 are disposed opposite to each other. The peripheral surface 23 of the display component 2 is fixedly connected between the top surface 21 and the bottom surface 22 of the display component 2. The top surface 21 of the display component 2 is the side surface of the display component 2 used to display images. When the user uses the electronic device 1000, the top surface 21 of the display component 2 may face the user. Exemplarily, a cover plate 1 may be fixedly connected to the top surface 21 of the display component 2.

[0079] Exemplarily, the display assembly 2 may include a layered organic conductive adhesive (OCA) 24, a polarizer (POL) 25, and a display panel 26. The OCA 24 connects the cover plate 1 and the polarizer 25. The OCA 24 serves to bond the display assembly 2 and the cover plate 1. The polarizer 25 can be used to prevent glare or to allow light at a set angle to exit the screen 10. Exemplarily, along the Z-axis direction, from top to bottom, the cover plate 1, the OCA 24, the polarizer 25, and the display panel 26 are sequentially stacked. In other embodiments, the display assembly 2 may include more or fewer layers.

[0080] For example, the display panel 26 can be used to display patterns. The display panel 26 can be an organic light-emitting diode (OLED) display panel 26, or an active-matrix organic light-emitting diode (AMOLED) display panel 26, or a liquid crystal display (LCD) panel 26, etc.

[0081] In some embodiments, the driving component 3 may be electrically connected to the display component 2. The driving component 3 may be used to input driving signals to the display component 2. For example, the driving component 3 may be electrically connected to the display panel 26. The driving component 3 may be used to input driving signals to the display panel 26 to display an image. Exemplarily, the driving component 3 may include a circuit board 302 and a driving chip 301. The driving chip 301 is electrically connected to the circuit board 302. The circuit board 302 may be a printed circuit board (PCB) or a flexible printed circuit board (FPC). It is understood that the driving chip 301 may directly contact and be electrically connected to the electrical connection component 4; the driving chip 301 may also be indirectly electrically connected to the electrical connection component 4 through the circuit board 302. The circuit board 302 may also be used to realize signal transmission between the driving chip 301 and the motherboard 300 of the electronic device 1000.

[0082] In some embodiments, the driving component 3 may be fixedly connected to the bottom surface 22 of the display component 2. That is, the driving component 3 may be fixedly connected to the side of the display component 2 away from the cover plate 1. For example, the driving component 3 may be fixed to the surface of the display panel 26 away from the polarizer 25.

[0083] In some embodiments, one end of the electrical connection component 4 may be electrically connected to the display component 2, and the other end may be electrically connected to the driving component 3. The electrical connection component 4 can be used for signal transmission between the driving component 3 and the display component 2. For example, one end of the electrical connection component 4 may be fixedly connected to the display panel 26 and electrically connected to the display panel 26, and the other end may be fixedly connected to the driving component 3 and electrically connected to the driving chip 301.

[0084] For example, the electrical connection component 4 may include a chip-on-flex (COF) film, a flexible printed circuit (FPC), or other flexible electrical transport structures. In this way, the portion of the electrical connection component 4 on one side of the display component 2 can be bent, thereby facilitating the electrical connection between the driving component 3 and the display panel 26, which are stacked in the first direction. The electrical connection component 4 is less likely to detach from the driving component 3 or the display panel 26, resulting in better electrical connection reliability.

[0085] For example, the electrical connection component 4 may also include a conductive paste. The conductive paste is fluid before curing, allowing it to take on any shape on the surface of the surrounding structure, thereby facilitating the electrical connection between the stacked drive component 3 and the display panel 26. The electrical connection component 4 is less likely to detach from the drive component 3 or the display panel 26, resulting in better electrical connection reliability.

[0086] It is understood that the electrical connection component 4 may include one or more of COF, FPC, and conductive paste. Those skilled in the art can selectively configure it according to their needs.

[0087] In some embodiments, the housing 20 may include a middle frame 201 and a rear cover 202. The middle frame 201 and the rear cover 202 are detachably connected. In other embodiments, the middle frame 201 and the rear cover 202 may also be integrally formed structural components.

[0088] Figure 5 is a structural schematic diagram of one embodiment of the middle frame 201 shown in Figure 3.

[0089] As shown in Figure 5, the middle frame 201 can be annular. Exemplarily, the middle frame 201 may include a top surface 2011, a bottom surface 2012, an outer side surface 2013, and an inner side surface 2014. The top surface 2011 and the bottom surface 2012 of the middle frame 201 are disposed opposite to each other. The outer side surface 2013 and the inner side surface 2014 of the middle frame 201 are both fixedly connected between the top surface 2011 and the bottom surface 2012 of the middle frame 201. It can be understood that the outer side surface 2013 of the middle frame 201 can be part of the outer surface of the electronic device 1000. The inner side surface 2014 of the middle frame 201 can face the internal space of the electronic device 1000.

[0090] It is understood that a ring refers to a closed shape. For example, the projection of the inner side surface 2014 of the mid-frame 201 onto the XY plane can be a circle, rectangle, triangle, or other regular or irregular shape. And / or, the projection of the outer side surface 2013 of the mid-frame 201 onto the XY plane can be a circle, rectangle, triangle, or other regular or irregular shape. The projections of the inner side surface 2014 and the outer side surface 2013 of the mid-frame 201 onto the XY plane can be different shapes, and this application does not impose any limitations. It is understood that the shape of the screen 10 and the shape of the back cover 202 can be adjusted according to the shape of the mid-frame 201. This application does not impose any limitations on the shapes of the screen 10 and the back cover 202.

[0091] In some embodiments, the middle frame 201 is provided with a mounting groove 2015, with a portion of the opening of the mounting groove 2015 located on the side surface of the middle frame 201 away from the back cover 202 (top surface 2011 of the middle frame 201) and a portion located on the inner side surface 2014 of the middle frame 201.

[0092] In some embodiments, the middle frame 201 may be provided with a clearance groove 2016. The opening of the clearance groove 2016 may be located on the inner side surface 2014 of the middle frame 201.

[0093] Figure 6 is a partial cross-sectional view of one embodiment of the electronic device 1000 shown in Figure 2 at section line AA.

[0094] As shown in Figures 2 and 6, the screen 10 can be mounted on the housing 20. Exemplarily, the screen 10 can be spaced apart from the back cover 202, and the middle frame 201 connects the screen 10 and the back cover 202. Exemplarily, the middle frame 201 can be fixedly connected between the cover plate 1 and the back cover 202, and together with the cover plate 1 and the back cover 202, it forms an accommodating space 1001. When a user wears the electronic device 1000, the screen 10 can be located on the side of the watch body 100 facing away from the user's wrist skin, and the back cover 202 can be located on the side of the watch body 100 facing the user's wrist skin, with the back cover 202 in contact with the user's wrist skin.

[0095] In some embodiments, the display component 2 may be fixedly connected to the cover plate 1 and located within the receiving space 1001. Thus, the cover plate 1 and the housing 20 can be used to protect the display component 2. Exemplarily, the display component 2 may be fixedly connected to the bottom surface 11 of the cover plate 1. The bottom surface 11 of the cover plate 1 faces the receiving space 1001.

[0096] In some embodiments, the drive assembly 3 and the electrical connection assembly 4 may both be located in the receiving space 1001. The cover 1 and the housing 20 may also be used to protect the drive assembly 3 and the electrical connection assembly 4. Exemplarily, the receiving space 1001 may also be used to house other components of the electronic device 1000, such as the motherboard 300, battery, speaker, or microphone.

[0097] In some embodiments, the cover plate 1 can be fixedly connected within the mounting groove 2015. In this way, the cover plate 1 can be surrounded by the middle frame 201, and the top surface 21 of the cover plate 1 can be approximately flush with the top surface 2011 of the middle frame 201, preventing the cover plate 1 from protruding from the middle frame 201 and improving the aesthetics of the electronic device 1000. Furthermore, during the assembly process of the screen 10 and the middle frame 201, the mounting groove 2015 can serve as a positioning feature; the cover plate 1 and the mounting groove 2015 cooperate to achieve rapid assembly of the screen 10 and the middle frame 201.

[0098] In some embodiments, a gap 1002 exists between the peripheral side 23 of the display component 2 and the middle frame 201. An injection molded part 30 fills the gap 1002 and fixes the cover plate 1, the display component 2, and the middle frame 201. Thus, the display component 2 can be fixedly connected to the middle frame 201 of the housing 20 via the injection molded part 30, and consequently, the screen 10 can be fixedly connected to the middle frame 201. It is understood that compared to the scheme where the bottom surface 11 of the cover plate 1 is fixedly connected to the middle frame 201 (as shown in Figure 1, the cover plate 1 and the middle frame 201 have an overlapping area S3 in the first direction for bonding), in this embodiment, the display component 2 can be fixedly connected to the peripheral side 23 and the middle frame 201. The overlapping area S3 of the cover plate 1 and the middle frame 201 in the first direction can be greatly reduced, or the overlapping area S3 of the cover plate 1 and the middle frame 201 in the first direction can be directly eliminated. This effectively reduces the "black border" of the electronic device 1000, increases the screen-to-body ratio of the electronic device 1000, and improves the user experience.

[0099] In some embodiments, the injection molded part 30 can fill the gap 1002, so that the receiving space 1001 is not connected to the outside world through the gap 1002. In other words, the injection molded part 30 is used to seal the gap 1002 between the peripheral side 23 of the display component 2 and the middle frame 201, preventing external moisture and / or dust from entering the receiving space 1001 through the gap 1002, which could cause the components in the receiving space 1001 to fail, or the electronic device 1000 to malfunction. By providing the injection molded part 30, the waterproof capability of the electronic device 1000 can be improved.

[0100] It is understandable that the injection molded part 30 can be formed from a material containing adhesive through injection molding. The injection molded part 30 itself can be adhesive, thus it can be simultaneously bonded to the middle frame 201 and the display component 2, thereby sealing the gap 1002 between the middle frame 201 and the peripheral side surface 23 of the display component 2, achieving waterproofing without the need for additional adhesive components to seal the gap 1002. Compared to dispensing and potting processes for waterproofing the screen 10 and the middle frame 201, the dispensing process has lower dimensional accuracy and requires more processing space. In this embodiment, the injection molded part 30 is formed through injection molding, which allows for better dimensional control and eliminates the need for surrounding components to avoid it. That is, the internal space (accommodation space 1001) of the electronic device 1000 can be fully utilized, which helps reduce the size of the electronic device 1000.

[0101] For example, the material of the injection molded part 30 may include one or more of thermosetting adhesives, ultraviolet (UV) curing adhesives, and polyurethane reactive (PUR) curing adhesives. Chemically, the thermosetting adhesive may be an epoxy resin; the UV curing adhesive may be an acrylic resin; and the PUR curing adhesive may be a polyurethane resin. It is understood that the material used in the injection molded part 30 may be 100% adhesive, or it may be a mixture of adhesive and other additives to enhance the physical properties (e.g., strength) of the injection molded part 30. For example, the adhesive content in the material used in the injection molded part 30 is greater than 80%. This results in better adhesion of the injection molded part 30.

[0102] For example, the injection molded part 30 may be annular. The injection molded part 30 may include an upper surface 31, a lower surface 32, an inner surface 33, and an outer surface 34. The upper surface 31 and the lower surface 32 of the injection molded part 30 are disposed opposite to each other. The inner surface 33 and the outer surface 34 of the injection molded part 30 are both fixedly connected between the upper surface 31 and the lower surface 32 of the injection molded part 30. The upper surface 31 of the injection molded part 30 is located on the side of the lower surface 32 of the injection molded part 30 closer to the cover plate 1. For example, the projection of the inner surface 33 of the injection molded part 30 onto the XY plane may be a circle, a rectangle, a triangle, or other regular or irregular shape. And / or, the projection of the outer surface 34 of the injection molded part 30 onto the XY plane may be a circle, a rectangle, a triangle, or other regular or irregular shape. The projection of the inner side surface 33 of the injection molded part 30 onto the XY plane and the projection of the outer side surface 34 of the injection molded part 30 onto the XY plane can have different shapes, and this application does not impose any restrictions.

[0103] In some embodiments, the injection molded part 30 may be disposed around the display component 2 and cover the peripheral side surface 23 of the display component 2. Exemplarily, the inner side surface 33 of the injection molded part 30 is bonded to the peripheral side surface 23 of the display component 2, and the outer side surface 34 of the injection molded part 30 is bonded to the inner side surface 2014 of the middle frame 201. In this way, the injection molded part 30 can not only effectively seal the gap 1002 between the peripheral side surface 23 of the display component 2 and the middle frame 201, but also serve to waterproof the display component 2, preventing moisture from eroding the interior of the display component 2 from the peripheral side surface 23.

[0104] In some embodiments, the upper surface 31 of the injection molded part 30 can also be bonded to the cover plate 1. This results in a larger bonding and fixing area between the injection molded part 30 and the screen 10 (the inner side 33 of the injection molded part 30 is bonded to the peripheral side 23 of the display assembly 2, and the upper surface 31 is bonded to the cover plate 1), leading to better connection strength between the injection molded part 30 and the screen 10. Furthermore, this can further enhance the sealing effect of the injection molded part 30 on the gap 1002, reducing the risk of moisture entering the internal containment space 1001 of the electronic device 1000 through the gap 1002.

[0105] In some embodiments, the driving component 3 may be fixedly connected to the side of the display component 2 away from the cover plate 1. One end of the electrical connection component 4 is electrically connected to the display component 2, and the other end is electrically connected to the driving component 3. Exemplarily, the driving component 3 may be disposed on the bottom surface 22 of the display component 2. The electrical connection component 4 requires wiring from the peripheral side surface 23 of the display component 2 to achieve the electrical connection between the driving component 3 and the display component 2. The electrical connection component 4 is at least partially located between the peripheral side surface 23 of the display component 2 and the middle frame 201. In other words, in a second direction, at least a portion of the electrical connection component 4 is disposed opposite to the peripheral side surface 23 of the display component 2. The second direction is the direction of the receiving space 1001 towards the outside of the middle frame 201. It is understood that the electrical connection component 4, being at least partially located on the peripheral side surface 23 of the display component 2, may or may not contact the peripheral side surface 23 of the display component 2. Exemplarily, at least a portion of the electrical connection component 4 is located between the display component 2 and the middle frame 201.

[0106] In other embodiments, the electrical connection component 4 may not be located on the peripheral side 23 of the display component 2, but may be embedded within the display component 2. It is understood that the relationship between the electrical connection component 4 and the display component 2 can be designed according to requirements.

[0107] In some embodiments, the injection molded part 30 encloses the portion of the electrical connection assembly 4 located between the display assembly 2 and the middle frame 201. That is, the electrical connection assembly 4 may be partially located within the gap 1002, and the injection molded part 30 encloses the portion of the electrical connection assembly 4 located within the gap 1002. It is understood that the injection molded part 30 encloses the portion of the electrical connection assembly 4 located between the display assembly 2 and the middle frame 201 to achieve waterproofing of this portion of the electrical connection assembly 4, preventing moisture from corroding the electrical connection assembly 4 and causing electrical connection failure. For example, the electrical connection assembly 4 includes a bent portion 41, which may be located between the display assembly 2 and the middle frame 201. The bent portion 41 and the peripheral side surface 23 of the display assembly 2 may enclose a space 401, and a portion of the injection molded part 30 may fill the space 401. In this way, the injection molded part 30 can support the bent portion 41 of the electrical connection assembly 4 and also provide better sealing and waterproofing.

[0108] In other embodiments, the electrical connection component 4 may not pass between the display component 2 and the middle frame 201, or the electronic device 1000 may not have the electrical connection component 4, and the display component 2 may directly transmit electrical signals to the driving component 3 from the bottom surface 22.

[0109] In some embodiments, the bend 41 of the electrical connection assembly 4 may be located within the clearance groove 2016 of the middle frame 201. It is understood that providing the clearance groove 2016 in the middle frame 201 can accommodate the bend 41 of the electrical connection assembly 4, which is beneficial to reducing the size of the electronic device 1000.

[0110] In some embodiments, the injection molded part 30 can be used to support the components of the electronic device 1000. In this way, the structure that originally needed to be provided on the inner surface of the housing 20 of the electronic device 1000 for supporting the components can be eliminated, which not only saves this part of the space and improves the internal space utilization of the electronic device 1000, but also simplifies the structure of the housing 20 of the electronic device 1000 and reduces the processing steps of the housing 20.

[0111] For example, the injection molded part 30 can be used to carry one or more of the motherboard 300, buttons, and sensors of the electronic device 1000. It is understood that the types of devices carried by the injection molded part 30 can be adjusted according to the device arrangement of the electronic device 1000. The injection molded part 30 can be used not only to carry all devices located in the receiving space 1001 (such as the motherboard 300, sensors, etc.), but also to carry buttons that are partially exposed outside the electronic device 1000 and partially located in the receiving space 1001.

[0112] In some embodiments, the lower surface 32 of the injection molded part 30 can be used to support components of the electronic device 1000. The figure illustrates the injection molded part 30 supporting the motherboard 300 of the electronic device 1000. The injection molded part 30 can serve as a support step for the motherboard 300. It is understood that, compared to a dispensing waterproofing solution, the motherboard 300 in this embodiment does not need to avoid the injection molded part 30 and can be fixedly mounted on the injection molded part 30. This results in a more compact arrangement of components within the internal space of the electronic device 1000, which is beneficial for the miniaturization of the electronic device 1000.

[0113] In some embodiments, the injection molded part 30 may include a first portion 35 and a second portion 36 (schematically distinguished by dashed lines in the figure). The second portion 36 is fixedly connected to the side of the first portion 35 near the rear cover 202. The first portion 35 fills the gap 1002 to seal it. The side of the first portion 35 away from the second portion 36 forms the upper surface 31 of the injection molded part 30. The first portion 35 may be fixedly connected to the bottom surface 11 of the middle frame 201, the cover plate 1, and the peripheral side surface 23 of the display assembly 2. The second portion 36 is used to support components of the electronic device 1000.

[0114] In some embodiments, the first portion 35 may be annular. The second portion 36 may be annular or have other shapes. For example, there may be multiple second portions 36, which may be spaced apart along the circumference of the first portion 35. It is understood that when there are multiple second portions 36, they can be used to carry multiple devices. Specifically, one second portion 36 may carry one device, or multiple second portions 36 may be used to carry one device. The spaced arrangement of multiple second portions 36 can achieve the goal of carrying devices while reducing the volume of the injection molded part 30, and can also avoid interfering with internal components of the electronic device 1000, thereby improving the internal space utilization of the electronic device 1000.

[0115] In some embodiments, the second portion 36 may have a fixing groove 361. The opening of the fixing groove 361 may face the rear cover 202. The electronic device 1000 may also include screws (not shown), which are fixedly connected to the fixing groove 361. It is understood that after the second portion 36 is formed by injection molding, the second portion 36 may be further processed to form the fixing groove 361. The second portion 36 may serve as a screw post for mounting screws. The screws may be used to fix the motherboard 300. For example, the motherboard 300 may include a circuit board 310 and electronic components 320. The electronic components 320 may be disposed on the circuit board 310 and electrically connected to the circuit board 310. The electronic components 320 may be chips, capacitors, resistors, etc. The circuit board 310 may have a through hole 3101. One end of the screw may pass through the through hole 3101 and be fixedly connected to the fixing groove 361. The screws may be used to fix the circuit board 310 to the second portion 36. Understandably, screws can be used not only to secure the circuit board 310 of the motherboard 300, but also to secure other components; the specific configuration can be adjusted according to requirements.

[0116] In some embodiments, the first part 35 and the second part 36 can be integrally molded structural components. It is understood that obtaining an integral structure through an integral molding process means that during the formation of one of the two parts, that part is connected to the other part, without requiring further processing (such as bonding, welding, snap-fit ​​connections, or screw connections) to join the two parts together. The integrally molded structural components of the first part 35 and the second part 36 of the injection molded part 30 reduce manufacturing steps and improve production efficiency.

[0117] In other embodiments, the first part 35 and the second part 36 of the injection molded part 30 can also be prepared and molded separately in two processes.

[0118] In some embodiments, the second portion 36 may be disposed opposite to the display component 2 along the thickness direction of the cover plate 1. It is understood that, compared to the scheme in which the second portion 36 is disposed offset from the display component 2 in the thickness direction of the cover plate 1, the second portion 36 in this embodiment can be used to accommodate a larger area for the electronic device 1000.

[0119] In some embodiments, the injection molded part 30 may further include a third portion 37 (the first portion 35, the second portion 36, and the third portion 37 are schematically distinguished by dashed lines in the figure). The third portion 37 may be connected to the side of the first portion 35 closest to the cover plate 1. Exemplarily, a second gap 1003 may exist between the cover plate 1 and the middle frame 201. The third portion 37 may fill the second gap 1003 to seal the second gap 1003. It is understood that the injection molded part 30 may include the first portion 35 and the third portion 37, and the injection molded part 30 has a larger volume and a larger connection area between the screen 10 and the middle frame 201, resulting in better sealing and waterproofing performance. When the injection molded part 30 also includes the third portion 37, the surface of the third portion 37 away from the first portion 35 is the upper surface 31 of the injection molded part 30.

[0120] For example, the third part 37 may be at least partially fixedly connected between the bottom surface 11 of the cover plate 1 and the middle frame 201. For instance, the third part 37 may be partially fixedly connected between the bottom surface 11 of the cover plate 1 and the middle frame 201, and partially fixedly connected between the side surface 12 of the cover plate 1 and the middle frame 201.

[0121] Understandably, the second part 36 and the third part 37 of the injection molded part 30 can be selectively configured.

[0122] In some embodiments, during the assembly process, the screen 10 and the housing 20 can be fixed by clamping with a jig, so that the screen 10 and the housing 20 are relatively fixed, and then injection molding is performed from the side of the screen 10 facing the receiving space 1001 to form an injection molded part 30.

[0123] In some embodiments, the parts that are the same as those in the embodiments shown above will not be described again. Figure 7 is a structural schematic diagram of another embodiment of the middle frame 201 shown in Figure 3. Figure 8 is a partial cross-sectional view of another embodiment of the electronic device 1000 shown in Figure 2 at section line AA.

[0124] As shown in Figures 7 and 8, the electronic device 1000 may further include an adhesive component 400. The adhesive component 400 can be fixedly connected between the middle frame 201 and the cover plate 1. Exemplarily, the adhesive component 400 can be located within the mounting groove 2015 of the middle frame 201 and fixedly connected to the bottom surface 11 of the middle frame 201 and the cover plate 1. It is understood that the adhesive component 400 can be used to bond the screen 10 and the housing 20, further strengthening the connection between the screen 10 and the housing 20, reducing the likelihood of the screen 10 being pulled apart from the housing 20 under mechanical force, and improving the waterproof reliability of the injection molded part 30. Furthermore, by providing the adhesive component 400, the screen 10 and the middle frame 201 can be pre-fixed during the assembly process of the electronic device 1000, facilitating the subsequent injection molding process to form the injection molded part 30. Pre-fixing the screen 10 and the middle frame 201 eliminates the need for additional angled connections, which is beneficial for subsequent operations and reduces operational difficulty. In other embodiments, the adhesive 400 may also be fixedly connected to the side of the middle frame 201 and the cover plate 1.

[0125] For example, the adhesive 400 can be an adhesive (which is fluid between curing) or a backing adhesive (a solid with adhesive properties).

[0126] For example, the adhesive can be a thermosetting adhesive, a moisture-curing adhesive, or a UV-curing adhesive. From a chemical composition perspective, thermosetting adhesives can be epoxy adhesives; UV-curing adhesives are acrylic adhesives; and moisture-curing adhesives can be polyurethane adhesives. For example, the adhesive film can be an acrylic adhesive.

[0127] In some embodiments, the electronic device 1000 may further include a support member 500, which may be fixedly connected between the mid-frame 201 and the cover plate 1. The support member 500 may be connected to the adhesive member 400. Exemplarily, the support member 500 may be fixedly connected within the mounting groove 2015 of the mid-frame 201 and located between the bottom surface 11 of the mid-frame 201 and the cover plate 1. It is understood that when the cover plate 1 and the mid-frame 201 of the screen 10 are pre-fixed by dispensing adhesive, the support member 500 may be used to support the cover plate 1, so that there is a large space between the cover plate 1 and the mid-frame 201 to accommodate the adhesive.

[0128] In some embodiments, the support member 500 may be flexible. When the cover plate 1 and the middle frame 201 of the screen 10 are pre-fixed by dispensing adhesive, when the screen 10 is assembled to the housing 20, the relative position of the screen 10 and the housing 20 is fixed by applying pressure through the mold. The support member 500 can balance the pressure around the screen 10 through deformation, so that the screen 10 has a better level after the adhesive solidifies.

[0129] In some embodiments, there may be multiple support members 500, which are spaced apart along the circumferential direction of the housing 20. For example, the number of support members 500 may be even, with two support members 500 forming a group, and the two support members 500 in the same group may be symmetrical about the central axis of the housing 20.

[0130] This application illustrates the structure of several electronic devices 1000 with reference to the accompanying drawings. The electronic device 1000 includes a housing 20 and a screen 10. The housing 20 includes a middle frame 201 and a back cover 202. The screen 10 includes a cover plate 1 and a display component 2. The middle frame 201 is fixedly connected between the cover plate 1 and the back cover 202, and together with the cover plate 1 and the back cover 202, forms a receiving space 1001. The display component 2 is fixedly connected to the cover plate 1 and located within the receiving space 1001. A gap 1002 exists between the peripheral side 23 of the display component 2 and the middle frame 201. The electronic device 1000 also includes an injection-molded part 30, which is fixedly connected to the cover plate 1, the display component 2, and the middle frame 201. The plastic part fills the gap 1002, allowing the receiving space 1001 to communicate with the outside world without passing through the gap 1002.

[0131] It is understandable that the injection molded part 30 itself has adhesive capabilities, and can simultaneously fix the cover plate 1, the display component 2, and the middle frame 201. The display component 2 can be fixedly connected to the middle frame 201 of the outer shell 20 through the injection molded part 30, and thus the screen 10 can be fixedly connected to the middle frame 201. The display component 2 can be fixedly connected to the middle frame 201 on the peripheral side 23. Compared with the solution where the bottom surface 11 of the cover plate 1 is fixedly connected to the middle frame 201, the overlapping area S3 of the cover plate 1 and the middle frame 201 in the first direction can be greatly reduced, or the overlapping area S3 of the cover plate 1 and the middle frame 201 in the first direction can be directly eliminated, thereby effectively reducing the "black border" of the electronic device 1000, increasing the screen ratio of the electronic device 1000, and improving the user experience. The injection molded part 30 can fill the gap 1002, so that the accommodating space 1001 is connected to the outside without the gap 1002. In other words, the injection molded part 30 is used to seal the gap 1002 between the peripheral side 23 of the display component 2 and the middle frame 201, preventing external moisture and / or dust from entering the receiving space 1001 through the gap 1002, which could cause the components in the receiving space 1001 to fail or the electronic device 1000 to malfunction. By providing the injection molded part 30, the waterproof capability of the electronic device 1000 can be improved.

[0132] Several methods for manufacturing the electronic device 1000 are provided below. The methods for manufacturing the electronic device 1000 may include the following steps:

[0133] Step 1: Provide screen 10 and housing 20, wherein housing 20 includes mid-frame 201 and back cover 202, and screen 10 includes cover plate 1 and display component 2.

[0134] Step 2: Fix the cover plate 1 of the screen 10 to the middle frame 201 of the outer shell 20. The cover plate 1 of the screen 10, the middle frame of the outer shell and the back cover together form an accommodating space 1001. The display component 2 of the screen 10 is located in the accommodating space 1001. There is a gap 1002 between the peripheral side 23 of the display component 2 and the middle frame 201.

[0135] For example, in step two, the screen 10 and the housing 20 can be fixed by a clamp or by adhesive application / back adhesive.

[0136] Step 3: An injection molded part 30 is formed in the gap 1002 using an injection molding process. The plastic part is used to fix and connect the cover plate 1, the display component 2, and the middle frame 201. The injection molded part 30 is used to allow the accommodating space 1001 to communicate with the outside world without passing through the gap 1002.

[0137] Understandably, during the manufacturing process of the electronic device 1000, an injection-molded part 30 is formed through injection molding to seal the gap 1002 between the peripheral side surface 23 of the display component 2 and the middle frame 201. Compared to the potting / dispensing process for sealing the gap 1002, the injection-molded part 30 formed by injection molding has more stable dimensions, which can effectively reduce assembly interference problems caused by potting dimensional fluctuations. In addition, compared to the solution where the bottom surface 11 of the cover plate 1 is fixedly connected to the middle frame 201, in this embodiment, the display component 2 can be fixedly connected to the peripheral side surface 23 and the middle frame 201. The overlapping area S3 of the cover plate 1 and the middle frame 201 in the first direction can be greatly reduced, or the overlapping area S3 of the cover plate 1 and the middle frame 201 in the first direction can be directly eliminated, thereby effectively reducing the "black border" of the electronic device 1000, increasing the screen ratio of the electronic device 1000, and improving the user experience.

[0138] In some embodiments, after the step of "forming injection molded part 30", the preparation method further includes:

[0139] Step 4: Provide motherboard 300 and mount motherboard 300 on the surface of injection molded part 30 away from cover plate 1. Motherboard 300 is located in receiving space 1001.

[0140] It is understood that the injection molded part 30 can be used to support the motherboard 300 of the electronic device 1000. In other embodiments, the injection molded part 30 can also be used to support other components of the electronic device 1000, such as sensors, buttons, etc. In this way, the injection molded part 30 can be used both to seal and waterproof the gap 1002 between the display component 2 and the middle frame 201, and to support the components of the electronic device 1000. The internal structure of the electronic device 1000 can be reduced, and the space originally used for the support structure can be used to install more other functional components, or it can help reduce the size of the electronic device 1000.

[0141] In some embodiments, the injection molded part 30 can be made of one or more of thermosetting adhesives, UV adhesives, and PUR adhesives. Thus, the injection molded part 30 can be formed from an adhesive-containing material through an injection molding process. The injection molded part 30 itself can be adhesive, allowing it to be simultaneously bonded between the middle frame 201 and the display component 2, thereby sealing the gap 1002 between the middle frame 201 and the peripheral side surface 23 of the display component 2, achieving waterproofing without the need for additional adhesive components to seal the gap 1002.

[0142] It is understood that, without conflict, the embodiments and features in the embodiments of this application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of this application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0143] It is understood that all the above figures are exemplary illustrations of this application and do not represent the actual size of the product. Furthermore, the dimensional proportions between the components in the figures are not intended to limit the actual product of this application.

[0144] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device (1000), characterized in that, The device includes a housing (20) and a screen (10). The housing (20) includes a middle frame (201) and a back cover (202). The screen (10) includes a cover plate (1) and a display component (2). The middle frame (201) is fixedly connected between the cover plate (1) and the back cover (202), and together with the cover plate (1) and the back cover (202), it forms an accommodating space (1001). The display component (2) is fixedly connected to the cover plate (1) and is located within the accommodating space (1001). There is a gap (1002) between the peripheral side (23) of the display component (2) and the middle frame (201). The electronic device (1000) also includes an injection molded part (30), which is fixedly connected to the cover plate (1), the display component (2) and the middle frame (201). The injection molded part (30) fills the gap (1002) so that the accommodating space (1001) is not connected to the outside world through the gap (1002).

2. The electronic device (1000) as claimed in claim 1, characterized in that, The inner side (33) of the injection molded part (30) is bonded to the peripheral side (23) of the display component (2), and the outer side (34) of the injection molded part (30) is bonded to the middle frame (201).

3. The electronic device (1000) as claimed in claim 1, characterized in that, The cover plate (1) is bonded to the upper surface (31) of the injection molded part (30).

4. The electronic device (1000) as claimed in claim 2, characterized in that, The injection molded part (30) is ring-shaped.

5. The electronic device (1000) as described in any one of claims 1 to 4, characterized in that, The material of the injection molded part (30) includes one or more of thermosetting adhesives, UV curing adhesives and moisture curing adhesives.

6. The electronic device (1000) as claimed in any one of claims 1 to 5, characterized in that, The lower surface (32) of the injection molded part (30) can be used to support the components of the electronic device (1000).

7. The electronic device (1000) as claimed in any one of claims 1 to 3, characterized in that, The plastic part includes a first part (35) and a second part (36), the first part (35) filling the gap (1002), and the second part (36) being fixedly connected to the side of the first part (35) near the back cover (202). The second part (36) is used to carry the components of the electronic device (1000).

8. The electronic device (1000) as claimed in claim 7, characterized in that, The electronic device (1000) also includes a motherboard (300), which is fixedly connected to the second part (36).

9. The electronic device (1000) as claimed in claim 7, characterized in that, The second part (36) is provided with a fixing groove (361) with the opening of the fixing groove (361) facing the rear cover (202). The electronic device (1000) also includes screws, which are fixedly connected in the fixing groove (361).

10. The electronic device (1000) as claimed in any one of claims 1 to 7, characterized in that, The electronic device (1000) includes one or more of the following components: a motherboard (300), buttons, and sensors.

11. The electronic device (1000) as claimed in any one of claims 4 to 8, characterized in that, The second part (36) is multiple, and the multiple second parts (36) are arranged at circumferential intervals along the first part (35).

12. The electronic device (1000) as claimed in any one of claims 4 to 9, characterized in that, The first part (35) and the second part (36) are integrally formed structural components.

13. The electronic device (1000) as claimed in any one of claims 4 to 10, characterized in that, Along the thickness direction of the cover plate (1), the second part (36) and the display component (2) are arranged opposite to each other.

14. The electronic device (1000) as claimed in any one of claims 1 to 11, characterized in that, The middle frame (201) is provided with a mounting groove (2015), and a portion of the opening of the mounting groove (2015) is located on the side surface of the middle frame (201) away from the back cover (202), and a portion is located on the inner side surface (2014) of the middle frame (201). The cover plate (1) is fixedly connected to the mounting groove (2015). The electronic device (1000) also includes an adhesive (400). In the thickness direction of the cover plate (1), the adhesive (400) is fixedly connected between the middle frame (201) and the cover plate (1).

15. The electronic device (1000) as claimed in claim 14, characterized in that, The electronic device (1000) further includes a support member (500), which is fixedly connected between the middle frame (201) and the cover plate (1), and the support member (500) is connected to the adhesive member (400).

16. The electronic device (1000) as claimed in any one of claims 1 to 15, characterized in that, The electronic device (1000) further includes a driving component (3) and an electrical connection component (4). The driving component (3) is fixedly connected to the side of the display component (2) away from the cover plate (1). One end of the electrical connection component (4) is electrically connected to the display component (2), and the other end is electrically connected to the driving component (3). The electrical connection component (4) is at least partially located between the display component (2) and the middle frame (201). The injection molded part (30) encloses the portion of the electrical connection assembly (4) located between the display assembly (2) and the middle frame (201).

17. The electronic device (1000) according to claim 16, characterized in that, The electrical connection assembly (4) includes a bend (41), the bend (41) and the peripheral side (23) of the display assembly (2) enclose a space (401), and a portion of the injection molded part (30) fills the space (401).

18. A method for manufacturing an electronic device (1000), characterized in that, include: A screen (10) and a housing (20) are provided, wherein the housing (20) includes a mid-frame (201) and a back cover (202), and the screen (10) includes a cover plate (1) and a display assembly (2); The cover plate (1) of the screen (10) is fixedly connected to the middle frame (201) of the outer shell (20). The cover plate (1) of the screen (10), the middle frame (201) of the outer shell (20) and the back cover (202) together enclose the receiving space (1001). The display component (2) of the screen (10) is located in the receiving space (1001). There is a gap (1002) between the peripheral side (23) of the display component (2) and the middle frame (201). An injection molded part (30) is formed in the gap (1002) by injection molding process. The injection molded part (30) is fixedly connected to the cover plate (1), the display component (2) and the middle frame (201). The injection molded part (30) is used to make the receiving space (1001) and the outside world communicate without passing through the gap (1002).

19. The preparation method according to claim 18, characterized in that, After the step of "forming the injection molded part (30)", the preparation method further includes: A motherboard (300) is provided and mounted on the surface of the injection molded part (30) away from the cover plate (1), the motherboard (300) being located in the receiving space (1001).

20. The preparation method according to claim 18, characterized in that, The injection molded part (30) is made of one or more of thermosetting adhesives, UV curing adhesives and moisture curing adhesives.

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