Housing, electronic device, and method for manufacturing housing

Abstract

Provided in the present application are a housing, an electronic device, and a method for manufacturing a housing. The present application relates to the technical field of electronic products. The housing may comprise an insulating substrate, an insulating layer, and a metal trace, wherein the metal trace is arranged on the insulating layer and forms a circuit structure, and the insulating substrate surrounds the insulating layer and the circuit structure. The housing further comprises an electrical connection structure, which is arranged on a surface of the insulating substrate and is connected to the metal trace through the insulating substrate. In addition, the insulating substrate of the present application extends into a gap of the circuit structure, and the insulating substrate is of an integrated structure. Since the insulating substrate, which is located in the gap of the circuit structure, and the peripheral insulating substrate form an integrated structure, the connection strength between the circuit structure and the insulating substrate can be improved, thereby improving the connection reliability. Compared with a method for embedding a circuit board in a slot, the present application can effectively suppress phenomena such as delamination and warping between the circuit structure and the peripheral insulating substrate.

Description

Housing, electronic device, method for manufacturing housing

[0001] This application claims priority to Chinese Patent Application No. 202411759481.4, filed with the State Intellectual Property Office of China on November 29, 2024, entitled "Housing, Electronic Device, Method for Preparing Housing", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic product technology, and more particularly to a housing, an electronic device comprising the housing, and a method for manufacturing the housing. Background Technology

[0003] With the development of communication technology, some electronic devices are becoming increasingly feature-rich, such as having wireless charging and Near Field Communication (NFC) functions. For example, as shown in Figure 1, the flexible printed circuit (FPC) 102 for the wireless charging coil and the NFC antenna 103 are both disposed between the mobile phone battery 104 and the mobile phone back cover 101. The wireless charging coil FPC 102 occupies a thickness of 0.15mm to 0.17mm in the mobile phone (as shown in the Z direction of Figure 1), and the NFC antenna 103 occupies a thickness of approximately 0.16mm in the mobile phone (as shown in the Z direction of Figure 1).

[0004] Internal space in electronic devices is precious. As shown in Figure 1, the structure can easily lead to a shortage of overall system resources. How to improve the utilization rate of internal space under the constraint of external thickness is a key issue currently facing electronic devices. Figure 2 shows a structure that can improve the utilization rate of internal space. In this structure, an embedding groove is provided on the inner surface of the back cover 101, and the wireless charging coil FPC 102 is embedded in the embedding groove.

[0005] The technology in Figure 2 forcibly integrates the wireless charging coil FPC102 of different materials with the back cover 101. Due to the different materials of the wireless charging coil FPC102 and the back cover 101, the process of embedding the wireless charging coil FPC102 is very difficult. In addition, because the wireless charging coil FPC102 and the back cover 101 are made of different materials, their coefficients of thermal expansion are quite different, which can easily lead to delamination, warping, bulging and other phenomena. Summary of the Invention

[0006] This application provides a housing, an electronic device having the housing, and a method for manufacturing the housing. The main objective is to provide a housing that includes a circuit layer and is integrally formed. When used in electronic devices, this housing can not only improve the utilization of internal space but also enhance the connection strength between the circuit layer and the housing substrate, suppressing phenomena such as circuit layer delamination and warping.

[0007] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0008] In one aspect, this application provides a housing that can be used in electronic devices, such as terminal devices.

[0009] The housing may include: an insulating substrate, an insulating layer, and metal traces. The metal traces are disposed on the insulating layer and form a circuit structure. The insulating substrate surrounds the insulating layer and the circuit structure. The circuit structure and the insulating layer can be collectively referred to as a circuit board. In other words, in this application, the circuit board is embedded in the insulating substrate and is enclosed by the insulating substrate.

[0010] Furthermore, the insulating substrate extends into the gaps of the circuit structure, and the insulating substrate is an integral structure. That is, the insulating medium used for electrically isolating different metal traces (i.e., the insulating substrate extending into the gaps of the circuit structure) and the surrounding insulating substrate are integrated. This can improve the connection strength between the circuit structure and the surrounding insulating substrate, and improve the connection reliability between the two. Compared with the method of using slotted embedded circuit boards, this application can effectively reduce the occurrence of delamination, warping and other phenomena between the circuit structure and the surrounding insulating substrate.

[0011] When using an embedded circuit board, the mechanical strength of the housing is reduced because the circuit board is embedded in the embedding groove. However, this application integrates the circuit board and the surrounding insulating substrate into a single structure, which can improve the mechanical strength of the housing. For example, if the housing is a mobile phone back cover, the mobile phone back cover can have strong anti-drop and anti-puncture performance.

[0012] In addition, existing technologies using embedded circuit boards embed multiple independent modules with different functions into the inner surface of the housing using slots. Considering tolerances, gaps exist between the devices and the slots, wasting housing area. Since the area of ​​the inner surface of the housing is limited, the number of integrated modules is also limited. However, this application integrates the devices into the housing during the manufacturing process, eliminating gaps. Therefore, the integration degree between the devices and the housing is higher, and the utilization rate of the housing is higher. Thus, more circuits can be integrated, enabling the housing to have multiple electrical functions, such as integrating not only wireless charging coils but also antennas and other signal lines.

[0013] In order to interconnect the metal traces embedded in the insulating substrate with the external structure (such as the mobile phone motherboard), an electrical connection structure is provided on the surface of the insulating substrate. The electrical connection structure passes through the insulating substrate and connects to the metal traces. For example, the electrical connection structure can be connected to the mobile phone motherboard, thereby realizing the interconnection between the circuit structure and the external structure (such as the mobile phone motherboard).

[0014] This application can fully utilize the surface of the insulating substrate to flexibly position the electrical connection structure. For example, when the casing is a mobile phone back cover, the battery is located inside the back cover. To avoid interference between the electrical connection structure and the battery, the electrical connection structure can be positioned close to the periphery of the battery. Alternatively, if the back cover has a motherboard, the electrical connection structure can be positioned close to the motherboard for easy electrical connection. In short, the electrical connection structure can be flexibly configured according to different scenario requirements.

[0015] In one feasible approach, the insulating matrix comprises a resin material.

[0016] The resin material has good fluidity. In feasible processes, a hot melt pressing process can be used to allow the resin material to flow into the gaps in the circuit structure, thereby integrating the insulating substrate in the circuit structure with the surrounding insulating substrate and improving the connection strength between the circuit structure and the surrounding insulating substrate.

[0017] In one possible implementation, the insulating layer has opposing first and second surfaces, and the circuit structure includes a first circuit structure disposed on the first surface; the thickness of the insulating substrate on the first surface is less than the thickness of the insulating substrate on the second surface; and an electrical connection structure is disposed on the surface of the insulating substrate adjacent to the first circuit structure.

[0018] The shell is applied to the back cover of a mobile phone, with the first surface facing the inside of the phone and the second surface facing the outside of the phone. The thickness of the insulating substrate on the first surface is less than the thickness of the insulating substrate on the second surface. In this way, a thicker outer insulating substrate can be used as a protective structure, thereby improving the protective function of the back cover of the mobile phone.

[0019] Since the electrical connection structure is located on the surface of the insulating substrate near the first circuit structure, and the first circuit structure is close to the inner wall of the phone's back cover, it can be connected to the motherboard inside the phone through the electrical connection structure located near the first circuit structure.

[0020] In one possible implementation, the circuit structure further includes a second circuit structure disposed on the second surface; the housing also includes a conductive channel penetrating the insulating layer and connecting the metal traces of the first circuit structure and the metal traces of the second circuit structure.

[0021] In this example, circuit structures (such as a first circuit structure and a second circuit structure) can be provided on both opposite surfaces of the insulating layer, which improves the circuit integration of the housing and makes the housing more functional. For example, it can integrate a wireless charging coil or an antenna.

[0022] In one possible implementation, the housing also includes electronic components disposed on the circuit structure, with the electronic components exposed on the insulating substrate.

[0023] This application implies that the housing provided can integrate not only circuitry but also electronic components, thus enhancing its functionality. For instance, when the housing is a mobile phone back cover, the electronic components include a temperature sensor. This temperature sensor is used to sense the user's temperature. By placing the temperature sensor on the back cover, which is relatively close to the user's body, the measurement accuracy of the temperature sensor can be improved, thereby enhancing the user experience.

[0024] In one possible implementation, the insulating substrate includes a straight section and a bent section, the bent section being arranged circumferentially along the straight section; a portion of the circuit structure and a portion of the insulating layer are disposed in the straight section; a portion of the circuit structure and a portion of the insulating layer are disposed in the bent section.

[0025] The substrate includes a straight section and a bent section. In this example, not only is the circuit board placed in the straight section, but the space in the bent section can also be fully utilized to place the circuit board in the bent section. In this way, more circuit layers can be laid out in the housing, increasing the integration density of the circuit layers and enabling the housing to have more electrical functions. For example, it can integrate not only wireless charging coils and various antennas, but also other signal lines.

[0026] In one possible implementation, the housing further includes a second wiring layer and a conductive channel, the second wiring layer being disposed on the second surface; the conductive channel penetrates the insulating layer and connects the first wiring layer and the second wiring layer.

[0027] In one possible implementation, the electrical connection structure includes a first flexible circuit board and a first connector; the first connector is connected to the first flexible circuit board, and the first flexible circuit board passes through an insulating substrate and is connected to a metal trace.

[0028] In this implementation, the electrical connection structure includes a flexible circuit board. When the electrical connection structure is connected to the mobile phone motherboard, the redundancy and flexibility of the flexible circuit board can improve the reliability of the electrical connection. For example, if the casing is impacted, the redundancy and flexibility of the flexible circuit board can reduce the probability of the electrical connection structure being subjected to a large impact, thereby improving the reliability of the electrical connection between the casing's circuit layer and the motherboard.

[0029] In one possible implementation, the electrical connection structure includes a second connector that connects to a metal trace through an insulating substrate.

[0030] In some examples, the second connector can be connected to a flexible circuit board, which in turn connects to a connector on the phone's motherboard. The redundancy and flexibility of the flexible circuit board can improve the reliability of the electrical connections.

[0031] In one possible implementation, the electrical connection structure includes a first pad disposed on the circuit structure and exposed through an insulating substrate.

[0032] When the first pad is used as the electrical connection structure, for example, a second pad can be set on the motherboard. The first and second pads can be electrically connected using conductive adhesive film. Using pads as the electrical connection structure not only simplifies the structure and reduces manufacturing costs, but also ensures higher electrical connection reliability.

[0033] In one possible implementation, the first pads are multiple, arranged side-by-side at intervals; the housing also includes idle pads that are not electrically connected to the first circuit layer, and the idle pads are arranged around the multiple first pads.

[0034] In one possible implementation, the electrical connection structure includes a conductive sheet that passes through an insulating substrate and is connected to a first circuit layer.

[0035] Using conductive sheets as the electrical connection structure is simple, easy to implement, and has a low manufacturing cost.

[0036] In one feasible approach, the insulating matrix comprises glass fiber material.

[0037] Fiberglass material can enhance the strength of the housing, making it highly reliable.

[0038] Secondly, this application provides an electronic device, which includes: a circuit board and a housing in any of the above implementations, wherein the circuit board is connected to an electrical connection structure in the housing.

[0039] Since the housing of an electronic device contains a circuit board with a circuit structure, compared to placing the circuit board outside the housing and then connecting it to the circuit board inside the electronic device, this application can reduce the thickness of the electronic device by absorbing the thickness of the circuit board in the thickness direction of the housing. In addition, the circuit structure integrated into the housing is integrated with the surrounding insulating substrate, that is, there is a strong connection between the circuit structure and the surrounding insulating substrate, which improves the connection reliability between the two. Compared with the method of using slotted embedded circuit board, this application can effectively reduce the occurrence of delamination, warping and other phenomena between the circuit structure and the insulating substrate.

[0040] In one possible implementation, the electronic device further includes a third connector, and the electrical connection structure includes a first flexible circuit board and a first connector, the first connector being connected to the first flexible circuit board; the first flexible circuit board is connected to a metal trace through an insulating substrate; the third connector is disposed on the circuit board, and the first connector is plugged into the third connector.

[0041] In this implementation, the electrical connection structure includes a flexible circuit board with redundancy and flexibility. The redundancy and flexibility of the flexible circuit board can improve the reliability of the electrical connection between the circuit board and the circuit layer in the housing.

[0042] In one possible implementation, the electronic device further includes a fourth connector and a second flexible circuit board. The electrical connection structure includes the second connector, which is connected to a metal trace through an insulating substrate. The fourth connector is disposed on the circuit board, and the second connector and the fourth connector are connected through the second flexible circuit board.

[0043] In this implementation, the connectors mounted on the housing and the connectors mounted on the circuit board are connected by a flexible circuit board. Similarly, the redundancy and flexibility of the flexible circuit board can improve the reliability of the electrical connection between the circuit board and the circuit layer in the housing.

[0044] In one possible implementation, the electronic device further includes a sixth connector, and the electrical connection structure includes a fifth connector that passes through an insulating substrate and is connected to a metal trace; the sixth connector is disposed on a circuit board, and the fifth connector is plugged into the sixth connector.

[0045] In some application scenarios, such as when there are few circuit signals, connectors can be used for plugging together.

[0046] In one possible implementation, the electronic device further includes a conductive film layer and a second pad. The electrical connection structure includes a first pad disposed on the circuit structure and exposed through an insulating substrate; a second pad disposed on a circuit board; a first side of the housing having the first pad is opposite to a second side of the circuit board having the second pad; the conductive film layer is located between the first and second sides, and the first pad is connected to the second pad through the conductive film layer.

[0047] In this implementation, a conductive film layer is used as the electrical connection structure between the circuit board and the circuit layer inside the housing. The conductive film layer occupies a small area, which can further reduce the thickness of the electronic device.

[0048] In one possible implementation, the first circuit layer includes at least one of a wireless charging coil, an antenna, and a short-range wireless communication coil. Of course, circuits with other functions can also be integrated into the circuit layer.

[0049] In one possible implementation, the electronic device also includes a battery and a camera; the camera penetrates the housing; the battery is located inside the electronic device and is positioned opposite the wireless charging coil; and there are multiple antennas surrounding the periphery of the camera.

[0050] For example, when the electronic device is a mobile phone, the phone casing has a camera. Multiple antennas located inside the casing can be arranged around the camera to make full use of the space.

[0051] When a wireless charging coil is integrated into the housing, the battery inside the electronic device can be positioned opposite the wireless charging coil, improving charging efficiency.

[0052] In one possible implementation, the housing also includes electronic components disposed on the circuit structure and exposed on the insulating substrate, and the electronic components are connected to the circuit board.

[0053] Thirdly, this application also provides a method for preparing a shell, which may include:

[0054] The metal layer in the core board to be processed is etched to form metal traces, and the metal traces form a circuit structure. The core board to be processed includes an insulating layer and a metal layer disposed on the insulating layer.

[0055] The structure, which includes an insulating layer and a circuit structure, is stacked between multiple layers of solid insulating films. The multiple layers of solid insulating films are heated and pressed together. The heated multiple layers of solid insulating films form a molten insulating substrate. The molten insulating substrate flows into the gaps in the circuit structure and is then cooled, so that the insulating substrate surrounds the insulating layer and the circuit structure.

[0056] When preparing the shell using this method, the metal layer of the core board to be processed is first etched to form metal traces; then the structure is sandwiched between multiple solid insulating films, and these solid insulating films are pressed together. Under certain temperature and pressure, these solid insulating films will melt, and the molten material will flow into the gaps of the circuit structure, so that the dielectric material filling the metal traces and the substrate that ultimately supports these structures are integrated. Compared with the method of slotting and embedding the circuit board in the shell, this application can improve the connection strength between the circuit board and the substrate.

[0057] In addition, since this application presses the circuit structure into the insulating substrate, applying this housing to terminal equipment can make higher space utilization within the equipment and accommodate more structures.

[0058] In one feasible approach, after etching the metal layer in the core board to be processed to form metal traces, the fabrication method further includes: setting electronic devices such that the electronic devices are exposed to the insulating substrate.

[0059] In some implementation processes, electronic devices can be integrated onto the housing; for example, these electronic devices can be various sensors.

[0060] In one possible implementation, the metal layer of the core board to be processed includes: a first metal layer disposed on one surface of the insulating layer and a second metal layer disposed on the other surface; etching the metal layer in the core board to be processed to form metal traces includes: etching the first metal layer to form a first metal trace, etching the second metal layer to form a second metal trace, and forming a conductive channel penetrating the insulating layer within the insulating layer.

[0061] In this example, the metal layers of the core board to be processed include a first metal layer and a second metal layer, which can be understood as a double-sided copper-clad board. This allows for the fabrication of double-sided circuit layers and increases the circuit integration density.

[0062] In one feasible manner, the fabrication method further includes, before stacking the structure comprising insulating layers and circuit structures between multiple layers of solid insulating films:

[0063] Fill the gaps in the circuit structure with insulating medium;

[0064] When a multilayer solid insulating film is heated to form a molten insulating matrix, the insulating medium melts to form a molten insulating medium.

[0065] In some structures, after etching to form the circuit structure, the gap depth in the circuit structure is relatively large. In order to avoid the occurrence of voids in the gap, an insulating medium can be used to fill the gap before pressing the solid insulating film. However, when the solid insulating film is heated after pressing, the insulating medium located in the gap will also melt and mix with the molten insulating film, so that the insulating medium located in the gap of the circuit layer structure is finally fused with the outer insulating medium. Attached Figure Description

[0066] Figure 1 is a partial structural diagram of an electronic device;

[0067] Figure 2 is a partial structural diagram of another electronic device;

[0068] Figure 3 is an exploded view of an electronic device provided in an embodiment of this application;

[0069] Figure 4 is a partial circuit diagram of an electronic device provided in an embodiment of this application;

[0070] Figure 5 is a cross-sectional view of Figure 3 (AA section);

[0071] Figure 6 is a top view of a housing provided in an embodiment of this application;

[0072] Figure 7 is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0073] Figure 8 is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0074] Figure 9 is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0075] Figure 10 is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0076] Figure 11 is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0077] Figure 12 is a schematic diagram of the outer wall structure of a shell provided in an embodiment of this application;

[0078] Figure 13 is a schematic diagram of a shell provided in an embodiment of this application;

[0079] Figure 14 is a BB cross-sectional view of Figure 13, showing the structural relationship with the internal structural components of the electronic device;

[0080] Figure 15 is a schematic diagram of a shell provided in an embodiment of this application;

[0081] Figure 16 is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0082] Figure 17 is a flowchart of a method for preparing a shell according to an embodiment of this application;

[0083] Figures 18 to 23 are schematic diagrams of the structure after each step is completed in the manufacturing process of a shell provided in the embodiments of this application;

[0084] Figure 24 is a schematic diagram of a shell structure provided in an embodiment of this application;

[0085] Figure 25 is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0086] Figure 26 is an exploded view of an electronic device provided in an embodiment of this application;

[0087] Figure 27 is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0088] Figure 28 is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0089] Figure 29 is an exploded view of an electronic device provided in an embodiment of this application;

[0090] Figure 30 is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0091] Figure 31 is a schematic diagram of the electrical connection structure of an electronic device provided in an embodiment of this application;

[0092] Figure 32 is a schematic diagram of the electrical connection structure of an electronic device provided in an embodiment of this application.

[0093] Reference numerals: 101-Phone back cover; 102-Wireless charging coil FPC; 103-NFC antenna; 104-Phone battery; 100-Display screen; 200-House, back cover; 300-Mid-frame; 400-Battery; 500-Circuit board; 600-Camera; 200A-Straight section; 200B-Bending section; 501-Main board; 502-Small board; 500A-Connector; 500B-Second solder pad; 11-Insulating substrate; 12-Circuit board; 13-Electrical connection structure; 14-Electronic components; 15-Solder resist layer; 11A-Straight section; 11B-Bending section; 121, 128-Insulating layer; 122-First circuit structure; 123-Second circuit structure; 124, 125, 127 - Conductive channels; 126 - Third circuit structure; 131, 134 - Flexible circuit board; 132, 133, 135, 136 - Connectors; 137 - First pad; 138 - Conductive film layer; 139 - Idle pad; 141 - Temperature sensor; 142 - Thermistor; 1221 - Metal trace; 1222 - Insulating medium; 10 - Core board to be processed; 20 - First metal layer; 30 - Second metal layer; 40 - Prepreg; 50 - Gap; 401 - Resin substrate; 402 - Glass fiber. Detailed Implementation

[0094] The solutions involved in the embodiments of this application will be described below with reference to the accompanying drawings.

[0095] This application provides an electronic device that may include a mobile phone, tablet computer, smart wearable products (e.g., smartwatches, smart bracelets), virtual reality (VR) devices, augmented reality (AR) devices, drones, or other terminal devices, or it may be a base station, television, router, automobile, or other devices. This application does not impose any special limitations on the specific form of the aforementioned electronic device.

[0096] As shown in Figure 3, the electronic device provided in this embodiment of the application takes a mobile phone as an example. The electronic device may include a display screen 100, a back cover 200 located on the back of the display screen 100 (distributed opposite to the display surface of the display screen 100), and a mid-frame 300 located between the display screen 100 and the back cover 200. The mid-frame 300 can support the display screen 100.

[0097] The display screen 100 can be a liquid crystal display (LCD), an organic light emitting diode (OLED) display, a micro (or mini) light-emitting diode (LED) display, or a quantum dot light-emitting diode (QLED) display, etc. This application does not limit the type of the above-mentioned display screen.

[0098] The aforementioned electronic device may also include at least one of the following: a processor electrically connected to the display screen 100, a sensor, a memory, a charging management module, a power management module, an antenna, a mobile communication module, a wireless communication module, an audio module, a speaker, a receiver, a microphone, a headphone jack, and a camera electrically connected to the processor.

[0099] As shown in Figure 3, the electronic device may also include a circuit board 500, on which electronic components such as the processor, memory, charging management module, and power management module in the above example can be integrated.

[0100] In some electronic devices, as shown in Figure 3, circuit board 500 may include a main board 501 and a secondary board 502. Some electronic components in the above example are disposed on the main board 501, while others are disposed on the secondary board 502.

[0101] As shown in Figure 3, the electronic device may also include a battery 400, which can power some components in the electronic device. The battery 400 is disposed between the display screen 100 and the back cover 200, which may also be referred to as a battery cover or housing 200.

[0102] With the development of communication technology, some electronic devices are becoming increasingly feature-rich, such as having wireless charging capabilities and Near Field Communication (NFC) functionality. For example, as shown in Figure 4, which provides a simplified illustration, an electronic device may include a wireless charging coil, an NFC antenna, an FPC signal line, and an RF antenna, all of which are electrically connected to the circuit board.

[0103] In some electronic devices, the wireless charging coil is integrated on a flexible printed circuit board (FPC), while the radio frequency antenna, NFC antenna, or other antennas are mounted on the housing. The wireless charging coil FPC or various antennas occupy the internal space of the electronic device, causing a shortage of overall system resources.

[0104] Based on this, this application provides some exemplary solutions for integrating wireless charging coils and various antennas, as described above, onto a circuit board, and integrally molding the circuit board inside the housing, such as integrally molding it inside the rear housing 200 as shown in Figure 3. This application is not limited to integrating the wireless charging coil, NFC antenna, FPC signal line, and RF antenna shown in Figure 4 into the housing; other circuits may also be used.

[0105] As shown in Figure 5, which can be a cross-sectional view along line AA of Figure 3, this example shows a cross-sectional structural view of housing 200 (or rear housing 200). Housing 200 includes an insulating substrate 11, within which a circuit board 12 is provided, the insulating substrate 11 surrounding the circuit board 12.

[0106] The circuit board 12 is located within the insulating substrate 11, or the circuit board 12 is located within the insulating substrate 11. This can be understood as the insulating substrate 11 surrounding the circuit board 12, meaning that the circuit board 12 is not exposed outside the insulating substrate 11.

[0107] As shown in Figure 5, the circuit board 12 may include an insulating layer 121 and a first circuit structure 122 disposed on the insulating layer 121. In some examples, at least one of the wireless charging coil, NFC antenna, FPC signal line and radio frequency antenna shown in Figure 4 may be integrated into the first circuit structure 122.

[0108] In other words, this application integrates some circuits in the electronic device inside the housing. Compared with using a separate circuit board to carry these circuits, the solution in this application can absorb the thickness of the circuit board by utilizing the thickness direction of the housing 200 (as shown in the Z direction of Figure 5).

[0109] In some structures, when the shell shown in Figure 5 is the same as the back shell 200 shown in Figure 1, the utilization rate of the internal space of the mobile phone can be improved, and the overall thickness (as shown in the Z direction of Figure 1) can be reduced, making room for other structures. For example, the size of the battery 400 can be increased, thereby increasing the capacity of the battery 400 and improving battery life. For example, the battery capacity can be increased by about 100mAh. Another example is that the size of the circuit board 500 can be increased, so that the circuit board 500 can carry more electronic components.

[0110] For example, integrating the wireless charging coil into the first circuit structure 122 shown in Figure 5 can save 0.15mm-0.17mm of thickness space; as another example, integrating the NFC antenna into the first circuit structure 122 shown in Figure 5 can save 0.16mm of thickness space.

[0111] The circuit structure provided on the insulating layer in this application example may include metal traces and a dielectric material for electrically isolating different metal traces. As shown in FIG5, in the first circuit structure 122, metal traces 1221 are included. In order to electrically insulate different metal traces 1221, dielectric material needs to be filled between different metal traces 1221. In the example of FIG5, the insulating layer 121 and the metal traces 1221 are not only covered by the insulating substrate 11, but the gaps between adjacent metal traces 1221 are also filled by the insulating substrate 11. That is, there is an insulating substrate 11 between adjacent metal traces 1221, or the insulating substrate 11 extends into the gaps between adjacent metal traces 1221, and the insulating substrate 11 is used to electrically isolate different metal traces 1221. In the example, the insulating substrate 11 is an integral structure.

[0112] This can be understood as follows: In the example shown in Figure 5, the insulating substrate 11 located between different metal traces 1221, and the insulating substrate 11 covering the insulating layer 121 and the metal traces 1221 are an integral structure.

[0113] The insulating substrate 11 located in the gap of the first circuit structure 122, and the insulating substrate 11 covering the insulating layer 121 and the first circuit structure 122 are an integral insulating substrate structure, which can be understood as:

[0114] In terms of materials, the insulating substrate 11 located in the gap of the first circuit structure 122 is made of the same material as the insulating substrate 11 covering the insulating layer 121 and the insulating substrate 11 covering the first circuit structure 122.

[0115] In the structure, the insulating substrate 11 located in the gap of the first line structure 122 will not have a significant interface with the insulating layer 121 and the insulating substrate 11 covering the first line structure 122.

[0116] In actual production, the metal layer on the core board to be processed is first etched to obtain metal traces 1221. There are gaps between different metal traces 1221. Then, a prepreg is pressed onto the metal traces 1221. The prepreg is heated to form a molten medium. The molten medium flows into the gaps between the metal traces 1221. After the molten medium cools, it forms an insulating substrate. Thus, the insulating substrate 11 located in the gap of the first circuit structure 122, and the insulating substrate 11 covering the insulating layer 121 and the first circuit structure 122 are an integral structure.

[0117] In this application example, as shown in Figure 5, since the insulating substrate 11 located in the gap of the first circuit structure 122 and the insulating substrate 11 covering the insulating layer 121 and the first circuit structure 122 are an integral structure, the circuit board 12 and the insulating substrate 11 given in this application can be regarded as an integral structure, that is, the housing 200 is an integral structure.

[0118] Furthermore, since the insulating substrate 11 located in the gap of the first circuit structure 122 and the insulating substrate 11 covering the insulating layer 121 and the first circuit structure 122 are integral structures, the connection strength between the circuit board 12 and the insulating substrate 11 can be improved, thereby enhancing the connection reliability between the circuit board 12 and the insulating substrate 11. Comparing Figure 2 and Figure 5 of this application, compared with the slotted embedded circuit board method in Figure 2, this application can suppress or even avoid delamination and warping between the circuit board 12 and the insulating substrate 11 by improving the connection strength between the circuit board 12 and the insulating substrate 11, thus improving the reliability of the housing.

[0119] Continuing to compare Figures 2 and 5, in Figure 2, an embedding groove is required inside the housing to accommodate the independent circuit board, that is, a groove needs to be opened inside the housing. The setting of this embedding groove will reduce the mechanical strength of the entire housing; however, in the example of this application in Figure 5, the circuit board 2 and the insulating substrate 11 are fused together, and thus, the mechanical strength will be significantly enhanced.

[0120] Comparing Figures 2 and 5, in the fabrication process of Figure 2, a module that can be embedded in the embedding slot is obtained, such as a wireless charging coil FPC carrying a wireless charging coil, which is then placed in the embedding slot. That is, in the structure of Figure 2, independent modules are embedded in the inner surface of the housing using slots. Since the area of ​​the inner surface of the housing is limited, the number of modules that can be placed is also limited. For example, in Figure 2, the wireless charging coil FPC occupies a large area, making it difficult to place other modules on the surface of the housing. However, in Figure 5 of this application, the space in multiple directions within the housing can be fully utilized, such as the thickness direction (Z direction), length direction (X direction), and width direction (Y direction) of the housing. Without increasing the size of the housing, more circuitry can be integrated. For example, in the example of Figure 6, Figure 6 shows that the circuitry structure integrated within the insulating substrate can include a wireless charging coil, antenna 1, antenna 2, antenna 3, antenna 4, and an NFC antenna, significantly giving the housing more electrical functions.

[0121] Alternatively, it can be understood that in the fabrication process shown in Figure 2, considering tolerance issues, there will be gaps between the device and the slot. Because of these gaps, the area of ​​the housing will be wasted, thus limiting the number of integrated modules. However, in this application, the device is integrated into the housing during the manufacturing process, eliminating gaps. Therefore, the integration degree between the device and the housing is higher, and the utilization rate of the housing is higher. As a result, more circuits can be integrated, enabling the housing to have multiple electrical functions.

[0122] Since the first circuit structure 122 and the circuit board 12 are located inside the insulating substrate 11, in order to connect the metal traces of the first circuit structure 122 to the structure external to the housing 200 (such as the motherboard 501 or the small board 502 in the electronic device shown in Figure 3), an electrical connection structure can be provided on the housing.

[0123] Returning to Figure 5, in this example, an electrical connection structure 13 is provided on the surface of the insulating substrate 11. This electrical connection structure 13 passes through the insulating substrate 11 and connects to the metal traces of the first circuit structure 122. For example, the electrical connection structure 13 can be connected to the motherboard inside the mobile phone to realize the interconnection between the first circuit structure 122 and the motherboard.

[0124] In this application example, the location of the electrical connection structure 13 can be flexibly configured based on the circuit structure. For example, as shown in Figures 5 and 6, Figure 6 simplifies the circuits that can be integrated into the first circuit structure. For instance, the first circuit structure 122 includes a wireless charging coil, and the electrical connection structure 13 for connecting the wireless charging coil to the motherboard can be located at the edge of the housing, close to the motherboard. Furthermore, since the housing and battery are positioned opposite each other, the electrical connection structure 13 can be positioned to avoid the battery, thus providing more space for the battery, increasing battery size and capacity, and improving the battery life of the electronic device.

[0125] In the example of Figure 5, the circuit structure disposed on the insulating layer 121 includes a first circuit structure 122. The insulating layer 121 has opposing first and second surfaces disposed along the direction of the housing thickness (Z direction as shown in Figure 5), and the first circuit structure 122 may be disposed on the first surface.

[0126] In some electronic devices, as shown in Figure 7, which illustrates a partial structural diagram of a housing application according to an example of this application, the first circuit structure 122 is closer to the inner wall of the housing than the insulating layer 121, and the electrical connection structure 13 can pass through the insulating substrate 11 and connect to the first circuit structure 122.

[0127] In other electronic devices, as shown in Figure 8, which illustrates a partial structural diagram of another housing application of the present application example in an electronic device, the first circuit structure 122 is further away from the inner wall of the housing than the insulating layer 121, that is, the first circuit structure 122 is closer to the outer wall of the housing than the insulating layer 121. In order to interconnect the first circuit structure 122 with structures disposed in the electronic device (such as the motherboard 501 or the small board 502), a conductive channel 124 can be provided in the insulating layer 121 as shown in Figure 8. The electrical connection structure 13 is connected to the conductive channel 124 to realize the interconnection between the first circuit structure 122 and the motherboard 501, or the interconnection between the first circuit structure 122 and the small board 502.

[0128] In the example shown in Figure 8, since the first circuit structure 122 is closer to the outer wall of the housing than the insulating layer 121, the heat dissipation effect can be improved.

[0129] Figure 9 is a cross-sectional view of another type of housing provided in an embodiment of this application. In this example, not only is a first circuit structure 122 provided on the first surface of the insulating layer 121, but a second circuit structure 123 is also provided on the second surface of the insulating layer 121. In order to realize the interconnection of the first circuit structure 122 and the second circuit structure 123, a conductive channel 125 is provided in the insulating layer 121, and the conductive channel 125 connects the metal traces of the first circuit structure 122 and the metal traces of the second circuit structure 123.

[0130] As shown in Figure 9, by setting a two-layer circuit structure, more circuits can be integrated, giving the housing more electrical functions. For example, the wireless charging coil can be integrated into the first circuit structure 122, and various antennas and other signal lines can be integrated into the second circuit structure 123. This application does not impose any special limitations on the circuit functions integrated into the first circuit structure 122 and the second circuit structure 123.

[0131] Figure 10 is a cross-sectional view of another housing according to an embodiment of this application. In this example, a multi-layered circuit structure is included, such as a first circuit structure 122, a second circuit structure 123, and a third circuit structure 126 that are stacked together. An insulating layer 121 is stacked between the first circuit structure 122 and the second circuit structure 123, and an insulating layer 127 is stacked between the second circuit structure 123 and the third circuit structure 126.

[0132] To achieve interconnection between the second circuit structure 123 and the third circuit structure 126, as shown in Figure 10, a conductive channel 127 is provided through the insulating layer 128, and the metal traces of the second circuit structure 123 and the metal traces of the third circuit structure 126 are connected through the conductive channel 127.

[0133] As shown in Figure 10, more wiring structures are set inside the housing, such as at least three layers of wiring structures. This allows for the integration of more circuits and further enhances the electrical function of the housing.

[0134] The housing in this application example is a multifunctional housing that not only has circuit functions but also needs to act as a protective shell to protect the internal structure of the electronic device.

[0135] Figure 11 shows a partial structural diagram of a housing application in an electronic device according to an example of this application. The housing 200 has opposing inner and outer wall surfaces, with the inner wall surface facing the inside of the electronic device and the outer wall surface facing the outside of the electronic device. The thickness H1 of the insulating substrate 11 near the outer wall surface is greater than the thickness H2 of the insulating substrate 11 near the inner wall surface. That is, the insulating substrate near the inside of the electronic device is thinner, and the insulating substrate near the outside of the electronic device is thicker. This thicker outer insulating substrate enhances the protective function of the housing and strengthens its mechanical strength, such as improving puncture resistance and impact resistance.

[0136] Referring again to Figure 11, in some examples, the first surface of the insulating layer 121 faces the inside of the electronic device, the second surface faces the outside of the electronic device, the electrical connection structure is disposed on the surface of the insulating substrate close to the first circuit structure, and the thickness of the insulating substrate 11 on the first surface is less than the thickness of the insulating substrate 11 on the second surface.

[0137] In the different examples above, the circuit structure is integrated inside the housing; in other examples, the electronic components may also be integrated onto the housing.

[0138] As shown in Figure 11, it also includes an electronic device 14, which is disposed on the circuit structure, such as on the first circuit structure 122, and passes through the insulating substrate 11 and is exposed. In this way, the electronic device 14 can be electrically connected to a circuit board (such as a motherboard or a small board) disposed outside the housing.

[0139] The electronic device 14 may include sensors, passive devices, or active devices of various functions. For example, as shown in FIG11, the electronic device 14 may include a temperature sensor 141 and a thermistor 142.

[0140] Since the electronic device 14 is mounted on the housing, some performance characteristics of the electronic device can be enhanced. For example, the electronic device includes a temperature sensor 141. Compared to mounting the temperature sensor 141 on the motherboard, the temperature sensor 141 in this application is closer to the outside of the housing, that is, closer to the user's skin. This allows for more accurate detection of skin temperature and improves detection accuracy.

[0141] In addition, the placement of these electronic devices 14 is also quite flexible. For example, in order to interconnect with the motherboard 501, they can be placed close to the motherboard 501; or, in order to interconnect with the small board 502, they can be placed close to the small board 502.

[0142] In some applications, the housing described above can be used in mobile phones. For example, as shown in Figure 12, a camera 600 is provided on the housing 200 of the mobile phone. Viewed from the outer wall of the housing 200, the housing 200 in this application example is a protective case. However, as shown in Figure 13, viewed from the inner wall of the housing 200, electronic devices 14 and electrical connection structures 13 integrated on the housing 200 can be seen. As shown in Figure 14, which is a structural diagram along the BB section of Figure 13, this application integrates circuit structures inside the housing.

[0143] Continuing with Figures 13 and 14, multiple antennas integrated into the circuit structure can surround the periphery of the camera 600. For example, the NFC antenna surrounds the camera 600, and multiple antennas are located around the periphery of the NFC antenna.

[0144] In some electronic devices, as shown in FIG15, the housing 200 may include not only a straight portion 200A but also a bent portion 200B to accommodate a curved display screen. Furthermore, as shown in FIG16, which is a cross-sectional view of another housing provided in an embodiment of this application, the insulating substrate 11 includes a straight portion 11A and a bent portion 11B, the bent portion 11B being disposed along the circumference of the straight portion 11A. It can be understood that a portion of the outer edge of the straight portion 11A has the bent portion 11B, or that the entire outer edge of the straight portion 11A has the bent portion 11B.

[0145] In some examples, the straight section 11A and the bent section 11B can be integrally molded parts.

[0146] In some housing embodiments, a circuit structure may be provided within the straight plate portion 11A of the insulating substrate 11; in other housing embodiments, as shown in FIG13, a partial circuit structure is provided within the straight plate portion 11A of the insulating substrate 11, and a partial circuit structure is provided within the bent portion 11B of the insulating substrate 11.

[0147] In the example shown in Figure 16, partial circuit structures are provided in both the straight section 11A and the bent section 11B. This makes full use of the space in the bent section 11B, increases the integration density of the circuit structure, and enables more electrical functions.

[0148] For example, in some implementations, a relatively small antenna can be integrated into the bend 11B.

[0149] The number of layers of the circuit structure set in the straight section 11A can be the same as the number of layers of the circuit structure set in the bending section 11B. For example, one layer, two layers, or more layers can be set in both sections.

[0150] To prevent the wiring structure in the bend 11B from reducing the strength of the bend 11B, in some examples, the number of wiring layers in the bend 11B can be less than the number of wiring layers in the straight section 11A. For example, two layers of wiring structure are provided in the straight section 11A, and one layer of wiring structure is provided in the bend 11B.

[0151] When the housing includes multiple bends 11B, the wiring structure can be provided in some of the bends 11B or in all of the bends 11B.

[0152] The number of layers of the wiring structure within multiple bends 11 can be the same or different.

[0153] This application also provides an exemplary method for preparing the aforementioned housing containing the circuit structure. Figure 17 is a process flow diagram of a housing preparation method according to an embodiment of this application, and the steps are as follows:

[0154] Step 1: Etch the metal layer in the core board to be processed to form metal traces. The metal traces form the circuit structure. The core board to be processed includes an insulating layer and a metal layer disposed on the insulating layer.

[0155] Step 2: Stack the structure containing the insulation layer and the circuit structure between multiple layers of solid insulating film, heat and press the multiple layers of solid insulating film together. After being heated, the multiple layers of solid insulating film form a molten insulating substrate. The molten insulating substrate flows into the gaps of the circuit structure and is then cooled, so that the insulating substrate surrounds the insulation layer and the circuit structure.

[0156] The following section details the manufacturing process of a shell, with reference to the accompanying drawings.

[0157] As shown in Figure 18, a core board 10 to be processed is obtained. The core board 10 to be processed can be a double-sided copper-clad core board as shown in Figure 18, or a single-sided copper-clad core board.

[0158] In one example, as shown in FIG18, the core board 10 to be processed includes an insulating layer 121, a first metal layer 20 located on one surface of the insulating layer 121, and a second metal layer 30 located on the other surface of the insulating layer 121.

[0159] For example, a 12.5µm thin dielectric thick copper FCCL can be used, wherein the insulating layer 121 is made of µm-level ultrathin polyimide to achieve the high flexibility of the ultrathin dielectric, and 35µm copper foil is bonded on the top and bottom of the dielectric to form a double-sided thick copper CCL.

[0160] In other methods, the insulating layer 121 can be a flexible substrate such as PI or PET, or a high-strength substrate such as glass fiber cloth, synthetic fiber cloth, or non-woven fabric.

[0161] As shown in Figure 19, the core board 10 to be processed is processed by drilling, electroplating and etching processes. The first metal layer 20 is processed into a first circuit structure 122, the second metal layer 30 is processed into a second circuit structure 123, and a conductive channel 125 connecting the first circuit structure 122 and the second circuit structure 123 is formed in the insulating layer 121.

[0162] After metal traces 1221 are formed by etching either the first metal layer 20 or the second metal layer 30, as shown in Figure 19, there are gaps 50 between the different metal traces 1221.

[0163] As shown in Figure 20, solid insulating films are attached to the upper and lower sides of the structure shown in Figure 19. For example, the solid insulating film can be a prepreg 40. For example, two prepregs 40 are attached to the upper part of the circuit board 12 and one prepreg 40 is attached to the lower part of the circuit board 12.

[0164] The prepreg 40 of this application example may include a resin substrate 401 and glass fiber 402 located within the resin substrate 401.

[0165] As shown in Figure 19, the line etching can be performed with a line width / spacing of 0.25mm / 0.08mm to achieve high-density lines.

[0166] As shown in Figure 21, a hot pressing molding process is used, such as a pressurized and heated process, utilizing the molten state of the prepreg 40 during hot pressing, which provides the conditions for shaping, and pressing the circuit board into a 3D shape using a mold. In some processes, the edges of the housing can also be bent, and the housing structure can also be formed, including a housing structure for mounting a camera.

[0167] This can be understood as follows: During the hot pressing process, referring to Figures 20 and 21, the resin substrate of the prepreg 40 melts and flows into the gap 50 between the metal traces, filling the gap 50. Furthermore, multiple prepregs 40 are thermally fused into an integral insulating substrate 11. Consequently, as shown in Figure 21, the dielectric and insulating substrate 11 located between different metal traces are connected as a single unit.

[0168] Therefore, the housing made using the method of this application not only integrates the circuit board inside the housing, but also integrates the circuit board and the insulating substrate of the housing into a single structure, thereby enhancing the connection strength between the circuit board and the insulating substrate and improving the reliability of the circuit board.

[0169] In some alternative processes, before performing the bonding of the prepreg 40 as shown in Figure 20, the steps shown in Figure 22 can be performed to fill the gaps 50 between the metal traces using a filling process, that is, to fill the gaps 50 with insulating medium 1222. For example, if the gap 50 is deep, the filling process can be performed first, and then the prepreg 40 can be bonded, which can avoid voids between the metal traces in the final circuit board.

[0170] For example, the insulating medium material used in the filling process can be a resin material, which is the same as the resin material of the prepreg 40.

[0171] After performing the filling process shown in Figure 22, the bonding prepreg 40 shown in Figure 20 and the hot pressing process shown in Figure 21 can be performed. During the hot pressing process shown in Figure 21, the resin material located in the gap shown in Figure 22 will also be hot-melted and fused with the hot-melted resin material of the prepreg 40. Thus, in the resulting structure, the insulating medium (such as resin material) located between different metal traces and the insulating substrate 11 are integrated.

[0172] After performing the steps shown in Figure 21, the electronic device 14 can be attached to the side of the insulating substrate 11 near the inside of the electronic device. In the structure obtained in Figure 21, the insulating substrate 11 has reserved space for the electronic device 14 to extend into the circuit structure so as to attach the electronic device 14.

[0173] In some feasible processes, as shown in Figure 23, a solder resist layer 15 can be provided on the side of the insulating substrate 11 near the inside of the electronic device. For example, the solder resist layer 15 can be obtained by spraying ink.

[0174] In other processes, the insulating substrate 11 near the outside of the electronic device in the structure obtained by the solder resist layer 15 shown in Figure 23 can be subjected to decorative surface treatments such as printing and spraying.

[0175] In addition, in some feasible processes, when performing the prepreg 40 bonding process shown in Figure 20, a thinner resin-coated copper sheet (RCC) can be bonded first, for example, a 10μm thick resin-coated copper sheet, and then a thicker ultra-thin fiberglass cloth can be bonded on the resin-coated copper sheet, for example, a 25μm thick ultra-thin fiberglass cloth.

[0176] This ensures that the gaps between metal traces are fully filled, preventing reliability defects such as voids within the gaps.

[0177] In different housings of this application example, an electrical connection structure is required to bring out the circuit structure integrated in the insulating substrate so as to electrically connect with the external circuit board. There are many ways to implement this electrical connection structure, and several examples are given below.

[0178] Figure 24 is a structural diagram of a housing according to an example of this application, illustrating an implementation of an electrical connection structure combining a flexible board and a rigid board. The electrical connection structure 13 includes a flexible circuit board 131 and a connector 132 (which may be called a first connector). The flexible circuit board 131 is connected to the connector 132. The flexible circuit board 131 (which may be called a first flexible circuit board) passes through the insulating substrate 11 and is connected to the metal traces within the insulating substrate 11. For example, in Figure 24, the flexible circuit board 131 passes through the insulating substrate 11 and is connected to the metal traces of the first circuit structure 122.

[0179] As shown in Figure 25, Figure 25 is a structural diagram of connecting the electrical connection structure 13 shown in Figure 24 to the circuit board. Connectors can be set on the circuit board. For example, connectors 500A (which can be called third connectors) can be set on the main board 501 and the small board 502 respectively. Connector 132 of the electrical connection structure 13 is inserted into connector 500A on the circuit board. Connector 132 and connector 500A can be board-to-board (BTB) connectors, thereby realizing the interconnection between the circuit board and the circuit structure inside the housing.

[0180] Figure 26 is a structural diagram of a housing according to an example of this application, illustrating another implementation of an electrical connection structure. The electrical connection structure 13 includes a connector 133 (which may be called a second connector), which passes through the insulating substrate 11 and connects to the metal traces within the insulating substrate 11. For example, in Figure 26, the connector 133 passes through the insulating substrate 11 and connects to the metal traces of the first circuit structure 122.

[0181] As shown in Figure 27, Figure 27 is a structural diagram of connecting the electrical connection structure 13 shown in Figure 26 to the circuit board. Connectors can be set on the circuit board. For example, connectors 500A (which can be called fourth connectors) can be set on the main board 501 and the small board 502 respectively. The connector 133 of the electrical connection structure 13 is connected to the connector 500A on the circuit board through the flexible circuit board 134 (which can be called the second flexible circuit board), so as to realize the interconnection between the circuit board and the circuit structure inside the housing.

[0182] For example, as shown in Figure 26, connectors 135 and 136 can be provided on the flexible circuit board 134. Connector 135 is connected to connector 133 of the electrical connection structure 13, and connector 136 is connected to connector 500A on the circuit board, thereby realizing the interconnection between the circuit structure inside the housing and the circuit board.

[0183] In the electrical connection structures shown in Figures 24 to 27, flexible circuit boards are used. Because flexible circuit boards have redundancy, good flexibility, and strong bendability, cushioning, and impact resistance, the reliability of the connection between the circuit structure and the circuit board can be improved.

[0184] For example, in some application scenarios, when the housing is subjected to external impact, the redundancy and buffering properties of the flexible circuit board can be used to weaken the impact of the buffering force on the circuit board and reduce the probability of the circuit structure and the electrical signal of the circuit board being disconnected.

[0185] Figure 28 is a structural diagram of a housing according to an example of this application, illustrating another implementation of the electrical connection structure. Connectors can be set on the circuit board. For example, connector 500A (sixth connector) and connector 133 (fifth connector) of the electrical connection structure 13 can be set on the main board 501 and the small board 502 respectively, and connected to connector 500A on the circuit board to realize the interconnection between the circuit board and the circuit structure inside the housing.

[0186] Figure 29 is a structural diagram of a housing according to an example of this application, illustrating another implementation of an electrical connection structure. Figure 30 is a structural diagram of connecting the electrical connection structure 13 shown in Figure 29 to a circuit board. In this example, the electrical connection structure 13 includes a first pad 137, which passes through the insulating substrate 11 and connects to the circuit structure.

[0187] A second pad 500B is provided on the circuit board 500 (e.g., motherboard 501 or small board 502). A first side of the housing with a first pad 137 is opposite to a second side of the circuit board 500 with a second pad 500B. A conductive film layer 138 is provided between the first and second sides, and the first pad 137 is connected to the second pad 500B through the conductive film layer 138. That is, this example can use a conductive film layer to electrically connect the circuit structure inside the circuit board and the housing. The black dots in the conductive film layer 138 in the examples of Figures 29 and 30 indicate conductive particles.

[0188] In some optional structures, the conductive film layer 138 can be an anisotropically conductive adhesive film (ACF). Anisotropically conductive adhesive film (ACF) can be understood as a thin film made by uniformly mixing tiny conductive particles and epoxy resin. When the film is placed between two pads and subjected to temperature and pressure for a period of time, an electrical path will be formed between the two pads.

[0189] Using conductive films such as anisotropic conductive film (ACF) will not exert large stress on the casing and circuit board, reducing the risk of casing deformation. In addition, thinner conductive films can be used, which means that the conductive film occupies a small area, especially in the thickness direction of the casing. For example, when this casing is used on the back cover of a mobile phone, the space saved by the conductive film can be used to increase the battery size, increase the battery capacity, and improve the phone's battery life.

[0190] Furthermore, conductive films such as anisotropic conductive films (ACF) can support a large number of electrical connections.

[0191] In some examples, anisotropic conductive film (ACF) can be fabricated as an electrical connection structure using the method shown in Figure 29. By placing the anisotropic conductive film ACF between the first surface of the first pad 137 and the second surface of the circuit board 500 where the second pad 500B is located, and applying temperature and pressure for a period of time, an electrical path will be formed between the two pads.

[0192] In the electrical connection structure shown in Figure 30, to further improve interconnect reliability, as shown in Figure 31, there are multiple first pads 137, which are arranged side by side with spacing. For example, the width of any first pad 137 can be d1, and the spacing between two adjacent first pads 137 can be d2, where d1 can be equal to d2.

[0193] Alternatively, in some examples, as shown in Figure 31, there are multiple second pads 500B, which are arranged side by side with spacing. The width of any second pad 500B can be d1, and the spacing between two adjacent second pads 500B can be d2, where d1 can be equal to d2.

[0194] The width of the first pad 137 or the second pad 500B in the above example can be understood as the width dimension being the dimension perpendicular to the extension direction of the pad.

[0195] To improve the interconnection reliability between the wiring structure within the housing and the circuit board, as shown in Figure 32, idle pads 139 may also be included. For example, idle pads 139 may be provided on the housing or the circuit board. The idle pads 139 are located around the periphery of multiple first pads and are not electrically connected to the wiring structure within the housing. The idle pads are also located around the periphery of multiple second pads and are not electrically connected to the circuit board. Placing the idle pads around the electrically functional pads (first or second pads) protects these pads and improves reliability.

[0196] The above examples illustrate several electrical connection structures, such as flexible circuit boards, connectors, and conductive film layers. Of course, other structures are also possible, such as conductive sheets.

[0197] In some electronic devices, these electrical connection structures can be used in the same device; for example, there may be not only connectors, but also flexible circuit boards and conductive film layers.

[0198] The above examples use a candybar phone as an example. In other examples, the examples of this application can also be applied to foldable phones, such as double-folding or triple-folding electronic devices.

[0199] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0200] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A housing characterized by, The housing comprises: an insulating base; an insulating layer and metal traces, the metal traces being disposed on the insulating layer, the metal traces forming a circuit structure, the insulating base surrounding the insulating layer and the circuit structure, and the insulating base extending into a gap of the circuit structure, the insulating base being a unitary structure; an electrical connection structure disposed on a surface of the insulating base, the electrical connection structure connecting the metal traces through the insulating base.

2. The housing of claim 1, wherein The insulating base comprises a resin material.

3. The housing according to claim 1 or 2, characterized in that The insulating layer has opposite first and second surfaces, the circuit structure comprising a first circuit structure disposed on the first surface; a thickness of the insulating base on the first surface is less than a thickness of the insulating base on the second surface; the electrical connection structure is disposed on a surface of the insulating base proximate to the first circuit structure.

4. The housing of claim 3, wherein: the circuit structure further comprises a second circuit structure disposed on the second surface; the housing further comprises an electrically conductive channel, the electrically conductive channel extending through the insulating layer, the electrically conductive channel connecting the metal traces of the first circuit structure and the metal traces of the second circuit structure.

5. The housing according to any one of claims 1-4, characterized in that, The housing further comprises: an electronic device, the electronic device being disposed on the circuit structure, and the electronic device being exposed by the insulating base.

6. The housing according to any one of claims 1-5, wherein, The insulating base comprises a straight portion and a bent portion, the bent portion being disposed along a circumference of the straight portion; part of the circuit structure and part of the insulating layer are disposed on the straight portion; part of the circuit structure and part of the insulating layer are disposed on a bent portion.

7. The housing according to any one of claims 1-6, wherein, The electrical connection structure comprises: a first flexible printed circuit board; a first connector, the first connector being connected to the first flexible printed circuit board; the first flexible printed circuit board connecting the metal traces through the insulating base.

8. The housing of any one of claims 1-7, wherein, The electrical connection structure comprises: a second connector, the second connector connecting the metal traces through the insulating base.

9. The housing of any one of claims 1-8, wherein, The electrical connection structure comprises: a first pad, the first pad being disposed on the circuit structure, the first pad being exposed by the insulating base.

10. The case of claim 9, wherein, The first pad has a plurality, the plurality of first pads being disposed side by side and spaced apart; The housing further comprises: a spare pad, the spare pad being disposed on a periphery of the plurality of first pads.

11. The housing of any one of claims 1-10, wherein, The insulating base comprises a glass fiber material.

12. An electronic device, comprising: The housing comprises: a circuit board; a housing, the housing comprising the housing of any one of claims 1-11, the circuit board being connected to the electrical connection structure.

13. The electronic device of claim 12, wherein, The electronic device further comprises a third connector; The electrical connection structure comprises: a first flexible printed circuit board; a first connector, the first flexible printed circuit board being connected to the first connector; the first flexible printed circuit board connecting the metal traces through the insulating base; the third connector being disposed on the circuit board, the first connector being plugged into the third connector.

14. The electronic device of claim 12 or 13, wherein, The electronic device further comprises a fourth connector and a second flexible printed circuit board; The electrical connection structure comprises: a second connector, the second connector connecting the metal traces through the first connector; The fourth connector is arranged on the circuit board, and the second connector is connected with the fourth connector through the second flexible circuit board.

15. The electronic device of any of claims 12-14, wherein, The electronic device further comprises a sixth connector; The electric connection structure comprises: A fifth connector is connected with the metal trace through the insulating base body; The sixth connector is arranged on the circuit board, and the fifth connector is plugged with the sixth connector.

16. The electronic device of any of claims 12-15, wherein, The electronic device further comprises a conductive film layer and a second pad; The electric connection structure comprises: A first pad is arranged on the circuit structure, and the first pad exposes the insulating base body; The second pad is arranged on the circuit board; A first surface of the shell with the first pad is opposite to a second surface of the circuit board with the second pad; The conductive film layer is located between the first surface and the second surface, and the first pad is connected with the second pad through the conductive film layer.

17. The electronic device of any of claims 12-16, wherein, The metal trace comprises at least one of a wireless charging coil, an antenna, and a near field communication coil.

18. The electronic device of claim 17, wherein, The electronic device further comprises a battery and a camera; The camera penetrates through the shell; The battery is located in the electronic device and is arranged opposite to the wireless charging coil; The antenna has a plurality of antennas surrounding the periphery of the camera.

19. A method of producing a case, characterized by, The preparation method comprises: Etching a metal layer in a core plate to form a metal trace, the metal trace forms a circuit structure, the core plate comprises an insulating layer and the metal layer arranged on the insulating layer; Stacking a structure comprising the insulating layer and the circuit structure between a plurality of solid-state insulating film pieces, heating and pressing the plurality of solid-state insulating film pieces, the plurality of solid-state insulating film pieces are heated to form a molten insulating base body, the molten insulating base body flows into the gap of the circuit structure, and then cooling, so that the insulating base body surrounds the insulating layer and the circuit structure.

20. The method of claim 19, wherein, After etching the metal layer in the core plate to form the metal trace, the preparation method further comprises: Arranging an electronic device so that the electronic device exposes the insulating base body.

21. The method of manufacturing according to claim 19 or 20, wherein, Before stacking the structure comprising the insulating layer and the circuit structure between the plurality of solid-state insulating film pieces, the preparation method further comprises: Filling an insulating medium in the gap of the circuit structure; When the plurality of solid-state insulating film pieces are heated to form a molten insulating base, the insulating medium is molten to form a molten insulating medium.

22. The method of any one of claims 19-21, wherein, The metal layer of the core plate comprises: a first metal layer arranged on one surface of the insulating layer, and a second metal layer arranged on the other surface of the insulating layer; Etching the metal layer in the core plate to form the metal trace comprises: Etching the first metal layer to form a first metal trace, etching the second metal layer to form a second metal trace, and forming a conductive channel penetrating through the insulating layer in the insulating layer.

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