Radio-frequency signal generator and radio-frequency ablation device
By introducing a temperature compensation circuit and a genetic algorithm to optimize the oscillation filter circuit in the radio frequency signal generator, the problem of insufficient signal accuracy of the radio frequency signal generator was solved, the stability and consistency of the radio frequency ablation equipment were achieved, the ablation effect was improved and the cost was reduced.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- SHANGHAI GOLDEN LEAF MED TEC CO LTD
- Filing Date
- 2025-11-24
- Publication Date
- 2026-06-04
AI Technical Summary
Existing radio frequency signal generators suffer from insufficient signal accuracy in the medical field, resulting in poor radiofrequency ablation effects.
The oscillation filter circuit is optimized by employing a temperature compensation circuit and a genetic algorithm. Combined with a multi-channel signal source and power drive components, the voltage of the target component is adjusted by temperature detection, current detection, and voltage detectors to ensure signal stability and consistency.
It improves the accuracy and stability of radio frequency signals, ensures the ablation effect of radio frequency ablation equipment, reduces costs, and simplifies the debugging process.
Smart Images
Figure CN2025137205_04062026_PF_FP_ABST
Abstract
Description
Radio frequency signal generator and radio frequency ablation equipment
[0001] Cross-reference to related applications
[0002] This application claims priority to Chinese Patent Application No. 202411706568.5, filed on November 26, 2024, entitled "Radio Frequency Signal Generator and Radio Frequency Ablation Device", the entire contents of which are incorporated herein by reference. Technical Field
[0003] This application relates to the field of medical device technology, and more specifically, to a radio frequency signal generator and a radio frequency ablation device. Background Technology
[0004] In the medical field, radiofrequency ablation can be applied to the ablation of various tissues in the body. Radiofrequency ablation involves a radiofrequency signal generator emitting a radiofrequency signal, which is transmitted to a radiofrequency ablation catheter. The catheter then generates appropriate high temperatures to ablate the tissues. However, current radiofrequency signal generators have insufficient signal accuracy, which affects the effectiveness of radiofrequency ablation. Summary of the Invention
[0005] The purpose of this application is to provide a radio frequency signal generator and a radio frequency ablation device that can improve the accuracy of the radio frequency signal generated by the radio frequency signal generator.
[0006] In a first aspect, the present invention provides a radio frequency signal generator, comprising: a signal source; a power drive component connected to the signal source; a power output component connected to the power drive component; a data detector connected to the power output component; and a main controller connected to the data detector; wherein the power output component includes a temperature compensation circuit; the temperature compensation circuit is used to adjust the voltage of a target element connected in the power output component.
[0007] In this embodiment, considering that the circuit is generally set to a constant voltage at the static operating point, but the target component may operate at different temperatures due to ambient temperature or operation, the static operating current of the target component may change with temperature. If it operates for a long time or in an environment with poor heat dissipation, the output power and waveform of the target component may also fluctuate significantly. Therefore, by setting a temperature compensation circuit, the temperature of the target component can be compensated, thereby regulating the voltage and making the output waveform of the target component more stable, thus making its operation more stable. Furthermore, the energy output of the ablation tube that can be connected can be more accurate, thereby achieving a better and more accurate ablation effect.
[0008] In an optional embodiment, the temperature compensation circuit includes: a temperature detector, a current detector, a voltage detector, and a voltage controller; the temperature detector is used to collect temperature data of the target component; the current detector is used to collect current data of the target component; the voltage detector is used to collect voltage data of the target component; the voltage controller is electrically connected to the temperature detector, the current detector, and the voltage detector, and the voltage controller is used to adjust the voltage of the target component based on the temperature data, the current data, and the voltage data.
[0009] In the above embodiment, the temperature compensation circuit includes a temperature detector, a current detector, and a voltage detector. By combining the data obtained from multiple detectors to compensate the target component, the compensation can be more targeted, and the voltage adjustment of the target component can be more accurate.
[0010] In an optional implementation, the target component is a MOSFET; the temperature data includes the temperature change of the MOSFET; the current data includes the output current of the MOSFET; the voltage data includes the base voltage of the MOSFET; the temperature detector is used to detect the temperature change of the MOSFET; the voltage detector is connected to the base of the MOSFET and is used to acquire the base voltage of the MOSFET; the current detector is connected to the output terminal of the MOSFET and is used to acquire the output current of the MOSFET.
[0011] In an optional embodiment, the temperature compensation circuit further includes: a resistor control element with one end connected to the voltage controller and the other end connected to the base of the MOSFET; the voltage controller is configured to adjust the resistance value of the resistor control element according to the temperature change of the MOSFET and the output current of the MOSFET to adjust the voltage on the base of the MOSFET; and the voltage controller is further configured to adjust the voltage on the gate of the MOSFET and the gate-to-source voltage of the MOSFET by adjusting the voltage on the base of the MOSFET.
[0012] In an optional implementation, the resistance control element includes a digitally controlled potentiometer (DCP).
[0013] In the above embodiments, by configuring a resistor control element, the voltage can be adjusted by controlling the resistor in the circuit where the target element is located. The voltage adjustment is achieved by combining the current data obtained by the current detector with the adjustment of the resistor, making the voltage adjustment of the target element more precise.
[0014] In an optional embodiment, the power output component further includes: a first amplification circuit connected to the target element; the first amplification circuit includes: a first DC blocking capacitor and a second resistor connected in series.
[0015] In the above embodiments, by setting a first amplification circuit, even if the input signal is weak, the amplification process of the first amplification circuit can better meet the needs of subsequent temperature compensation processing for the target component.
[0016] In an optional embodiment, the power output component further includes: a second amplification circuit connected to the target element; the second amplification circuit includes: a third resistor, a second transformer, and a fourth resistor; the third resistor is connected to the primary side of the second transformer; and the fourth resistor is connected to the output terminal of the second transformer.
[0017] In the above embodiment, by setting a second amplification circuit, the output signal of the power output component can be made stronger, thereby making it easier for the subsequent data detector to detect the output signal of the power output component more accurately.
[0018] In an optional implementation, the main controller includes an oscillation filter circuit; wherein the target circuit parameters of the oscillation filter circuit are determined by a genetic algorithm.
[0019] In an optional implementation, the circuit parameters of the oscillating filter circuit are determined as follows: The initial total harmonic distortion (THD) of the circuit containing the oscillating filter circuit is calculated; if the initial THD is determined to be greater than the target value, iteration parameters are set; the iteration parameters include an iteration number threshold; a target genetic operator in the genetic algorithm is determined; the current THD is calculated based on the target genetic operator; if the current THD is determined to be less than the target value, the circuit parameters corresponding to the current THD are determined to be the target circuit parameters; if the current THD is determined to be not less than the target value, the target genetic operator is updated, and the current THD is calculated based on the updated target genetic operator; if the current THD is determined to be not less than the target value, and the iteration number is greater than the iteration number threshold, the iteration parameters are updated, and iteration is performed based on the updated iteration parameters.
[0020] In the above implementation, by combining genetic algorithms to adjust the parameters of the oscillation filter circuit, suitable parameters can be found quickly, shortening the time required for parameter adjustment. Furthermore, by incorporating temperature-compensated voltage regulation of the target component in the power output assembly, the data obtained by the main controller can also be more stable when its output signal is more stable. Based on more stable data, the ablation radio frequency output by the RF signal generator can also be more stable and accurate.
[0021] In an optional implementation, updating the target genetic operator includes updating the target genetic operator based on the difference between the current total harmonic distortion value and the target value.
[0022] In an optional implementation, the genetic operators in the genetic algorithm include random operations, crossover operations, and mutation operations; the crossover operations may include single-point crossover operations, two-point crossover operations, and three-point crossover operations; the mutation operations may include single-point mutation operations, two-point mutation operations, three-point mutation operations, and four-point mutation operations; updating the target genetic operator based on the difference between the current total harmonic distortion value and the target value includes: if the difference is within a first numerical interval, determining single-point crossover operations and single-point mutation operations as target genetic operators; if the difference is within a second numerical interval, determining two-point crossover operations and two-point mutation operations as target genetic operators; if the difference is within a third numerical interval, determining random operations, two-point crossover operations, and two-point mutation operations as target genetic operators; if the difference is within a fourth numerical interval, determining random operations, three-point crossover operations, and two-point mutation operations as target genetic operators; if the difference is within a fifth numerical interval, determining random operations, four-point crossover operations, and three-point mutation operations as target genetic operators.
[0023] In the above implementation, by selecting different genetic operators of the genetic algorithm based on the different differences, the iteration convergence speed can be improved, which in turn can improve the efficiency of determining circuit parameters based on the genetic algorithm.
[0024] In an optional implementation, the power drive component includes multiple sets of sub-power drive components; each set of the sub-power drive components is connected to the same signal source.
[0025] In an optional implementation, the sub-power drive component includes an amplitude adjustment unit and a power amplification unit.
[0026] In the above embodiments, by connecting multiple sets of sub-power drive components to the same signal source, the energy consistency of the multi-channel output can be better maintained while enabling the RF signal generator to operate in a multi-channel mode. Furthermore, using the same signal source can also reduce the number of components, making the cost of the RF signal generator relatively low and simplifying the debugging of the RF signal generator.
[0027] In an optional implementation, the power drive component includes multiple sets of sub-power drive components; the signal source includes a crystal oscillator and multiple direct digital frequency synthesizers (DDS) all connected to the crystal oscillator; wherein the number of DDS is the same as the number of sub-power drive components; and the sub-power drive components are connected one-to-one with the DDS.
[0028] In the above embodiments, since multiple direct digital frequency synthesizers are connected to the same crystal oscillator, the energy consistency of the multi-channel output can be better maintained when the radio frequency signal generator can operate in a multi-channel mode, since the signal source is based on the same crystal oscillator.
[0029] Secondly, the present invention provides a radiofrequency ablation device, including a radiofrequency ablation catheter and the aforementioned radiofrequency signal generator; wherein the radiofrequency ablation catheter is connected to the radiofrequency signal generator, and the radiofrequency ablation catheter is used to output radiofrequency energy based on the signal provided by the radiofrequency signal generator.
[0030] In the above embodiment, by setting a temperature compensation circuit, the temperature of the target component can be compensated, thereby regulating the voltage and making the waveform output by the target component more stable, thus making its operation more stable. Furthermore, the energy output of the ablation tube that can be connected to it can be more accurate, thereby achieving a better and more precise ablation effect. Attached Figure Description
[0031] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0032] Figure 1 is a block diagram of the radio frequency signal generator provided in an embodiment of this application;
[0033] Figure 2 is a block diagram of the temperature compensation circuit of the radio frequency signal generator provided in the embodiment of this application;
[0034] Figure 3 is a schematic diagram of the power output component of the radio frequency signal generator provided in the embodiment of this application;
[0035] Figure 4a is a schematic diagram of the temperature detector circuit of the temperature compensation circuit provided in the embodiment of this application;
[0036] Figure 4b is a schematic diagram of the current detector circuit of the temperature compensation circuit provided in the embodiment of this application;
[0037] Figure 4c is a circuit diagram of the voltage detector of the temperature compensation circuit provided in the embodiment of this application;
[0038] Figure 5a is a circuit diagram of the oscillation filter circuit provided in an embodiment of this application;
[0039] Figure 5b is another circuit diagram of the oscillation filter circuit provided in the embodiment of this application;
[0040] Figure 6 is a schematic diagram of the circuit parameter determination process of the oscillation filter circuit provided in the embodiment of this application;
[0041] Figure 7a is a schematic diagram of the cooperation circuit between the power drive component and the signal source provided in an embodiment of this application;
[0042] Figure 7b is a schematic diagram of another cooperating circuit of the power drive component and signal source provided in an embodiment of this application;
[0043] Figure 8 is another block diagram of the radio frequency signal generator provided in the embodiments of this application.
[0044] Icons: 110 - Signal source; 120 - Power drive component; 130 - Power output component; 131 - Temperature compensation circuit; 1311 - Temperature detector; 1312 - Current detector; 1313 - Voltage detector; 1314 - Voltage controller; 140 - Data detector; 150 - Main controller; 160 - Display; 161 - Button module; 162 - Display area; R1 - First resistor; T1 - First transformer; R2 - Second resistor; T2 - Second transformer; Q1 - MOSFET; R3 - Third resistor; R4 - Fourth resistor; R5 - Fifth resistor; R6 - Sixth resistor; R7 - Seventh resistor; R8 - Eighth resistor; C1 - First capacitor; C3 - Third capacitor; U1B - First operational amplifier; U2B - Second operational amplifier; U4 - Digital temperature probe. Detailed Implementation
[0045] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.
[0046] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this application, terms such as "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0047] Renal denervation (RDN) is an interventional surgical technique designed to treat hypertension. This technique lowers blood pressure by affecting the sympathetic nerve fibers surrounding the renal artery, thereby reducing the stimulation of the kidneys by the sympathetic nervous system. RDN involves placing an ablation electrode into the renal artery through a catheter and releasing energy such as radiofrequency, ultrasound, or heat to destroy the sympathetic nerve fibers.
[0048] The equipment used in RDN technology includes a mesh multi-electrode renal artery radiofrequency ablation catheter (referred to as an ablation catheter) and a radiofrequency signal generator (referred to as an ablation device). The radiofrequency ablation catheter and the radiofrequency signal generator work together to deliver radiofrequency energy to the inner wall of the renal artery, generating appropriate high temperatures to destroy or partially destroy the renal sympathetic nerves. The stability and accuracy of the signal emitted by the radiofrequency signal generator directly affect the effectiveness of RDN technology. Currently, the stability of the signal from radiofrequency signal generators is insufficient, which may lead to discrepancies between the radiofrequency energy output by the radiofrequency ablation catheter and the expected output.
[0049] Based on the above research, embodiments of this application can provide a radio frequency signal generator and a radio frequency ablation device, which can improve the stability and consistency of the signal from the radio frequency signal generator. The radio frequency signal generator and radio frequency ablation device of this application are described below with reference to some embodiments.
[0050] As shown in Figure 1, an embodiment of this application provides a radio frequency signal generator that may include: a signal source 110, a power drive component 120, a power output component 130, a data detector 140, and a main controller 150.
[0051] The signal source 110 is connected to the power drive component 120 and outputs a signal to the power drive component 120.
[0052] The power output component 130 can be connected to the power drive component 120 and outputs a signal after receiving it from the power drive component 120.
[0053] Data detector 140 can be connected to power output component 130 and can be used to detect the signal output by power output component 130. Exemplarily, data detector 140 may include a voltage detector, a current detector 1312, and a temperature detector 1311. The voltage detector can be used to detect the voltage value of the circuit where power output component 130 is located, the current detector 1312 can be used to detect the current value of the circuit where power output component 130 is located, and the temperature detector 1311 can be used to detect the temperature value of the circuit where power output component 130 is located.
[0054] Data detector 140 can be connected to main controller 150. Main controller 150 can acquire the data detected by data detector 140. Main controller 150 can also be connected to signal source 110.
[0055] In this embodiment, the power output component 130 may include a temperature compensation circuit 131 for adjusting the voltage of the target element connected in the power output component 130.
[0056] As the ambient temperature of the circuit containing the target component changes, the temperature of the target component may change. Alternatively, as the circuit containing the target component is used for a longer period of time, the temperature of each component in the circuit may also change. In this case, the operation of the target component may become unstable, which may also cause large fluctuations in the output power and output waveform of the target component.
[0057] The temperature compensation circuit 131 can adjust the voltage of the target component based on the temperature change of the target component, so that the voltage of the target component can be more stable under different temperatures.
[0058] For example, the voltage of the target component can be adjusted by adjusting the resistance of the circuit in which the target component is located.
[0059] The temperature compensation circuit 131 can compensate for the temperature changes mentioned above, so that the output power and output waveform of the target component can better meet the expectations, and thus make the target component work more stably.
[0060] In one embodiment, as shown in FIG2, the temperature compensation circuit 131 includes a temperature detector 1311, a current detector 1312, a voltage detector, and a voltage controller 1314.
[0061] Temperature detector 1311 can be used to collect temperature data of a target component. For example, temperature detector 1311 can monitor the temperature change of the target component according to a set time pattern.
[0062] The current detector 1312 can be used to collect current data of the target component. The current detector 1312 can also monitor the current of the circuit containing the target component according to a set time pattern.
[0063] A voltage detector can be used to collect voltage data from a target component. This voltage detector can also monitor the voltage of the circuit containing the target component according to a set time pattern.
[0064] The voltage controller 1314 can be electrically connected to the temperature detector 1311, the current detector 1312 and the voltage detector, and can obtain the detection data obtained by the temperature detector 1311, the current detector 1312 and the voltage detector.
[0065] The voltage controller 1314 is used to regulate the voltage of a target component based on temperature data, current data, and voltage data, so that the voltage of the target component remains relatively stable in different temperature environments.
[0066] For example, the voltage controller 1314 can be implemented as a microcontroller unit (MCU).
[0067] In the above embodiments, the temperature compensation circuit 131 includes a temperature detector 1311, a current detector 1312, and a voltage detector, which realizes the monitoring of the temperature, current, and voltage of the target component. This enables the monitoring of multiple types of information of the target component, and the voltage of the target component can be dynamically adjusted by combining the monitoring of multiple types of information of the target component, so that the adjustment of the voltage of the target component can be more accurate.
[0068] In one embodiment, the target component may be a MOSFET Q1.
[0069] Temperature data includes the temperature change of MOSFET Q1; current data includes the output current of MOSFET Q1; voltage data includes the base voltage of MOSFET Q1. Temperature detector 1311 can be used to detect the temperature change of MOSFET Q1; voltage detector connected to the base of MOSFET Q1 can be used to acquire the base voltage of MOSFET Q1; current detector 1312 connected to the output terminal of MOSFET Q1 can be used to acquire the output current of MOSFET Q1.
[0070] Optionally, as shown in Figures 3 and 4a, the temperature detector 1311 can be a digital temperature probe U4. This digital temperature probe U4 is used to detect the temperature change of the MOSFET Q1. Using the digital temperature probe U4 allows for high detection accuracy.
[0071] Optionally, as shown in Figures 3 and 4b, the current detector 1312 can be a high-side current sampler that samples the output current of the MOSFET Q1. Using high-side current sampling can better eliminate grounding interference, and the sampled output current of the MOSFET Q1 is sent to its connected microcontroller unit for processing. In the example shown in Figure 4b, the high-side current sampler may include a second operational amplifier U2B and four resistors: a fifth resistor R5, a sixth resistor R6, a seventh resistor R7, and an eighth resistor R8. The seventh resistor R7 and the eighth resistor R8 are connected in parallel to the non-inverting input of the second operational amplifier U2B, and the other end of the eighth resistor R8 is grounded. One end of the fifth resistor R5 is connected to the inverting input of the second operational amplifier U2B, and the other end of the fifth resistor R5 is connected to the output of the second operational amplifier U2B. The sixth resistor R6 is connected to the inverting input of the second operational amplifier U2B.
[0072] Alternatively, the voltage detector can be a circuit that uses high impedance to send the sampled voltage to its connected microcontroller unit for processing. As shown in Figures 3 and 4c, the voltage detector can be a base voltage acquirer, which can be implemented using a first operational amplifier U1B.
[0073] In this embodiment, the voltage of MOSFET Q1 can be adjusted by adjusting the resistance value in the circuit containing MOSFET Q1.
[0074] In an optional embodiment, the temperature compensation circuit 131 further includes: a resistor control element with one end connected to the voltage controller 1314 and the other end connected to the base of the MOSFET Q1; the voltage controller 1314 adjusts the resistance value of the resistor control element according to the temperature change of the MOSFET Q1 and the output current of the MOSFET Q1 to adjust the voltage on the base of the MOSFET Q1, and adjusts the voltage on the gate of the MOSFET Q1 and the voltage from the gate to the source of the MOSFET Q1 by adjusting the voltage on the base of the MOSFET Q1.
[0075] Optionally, the resistance control element includes digitally controlled potentiometers (DCPs).
[0076] The working principle of the temperature compensation circuit 131 is illustrated below using the example shown in Figure 3. The microcontroller unit can measure the temperature rise of MOSFET Q1 using the digital temperature probe U4, and simultaneously sample the output current of MOSFET Q1 using the high-side current sampler. This allows it to adjust the resistance of the digital control potentiometer, thereby adjusting the voltage across the base of MOSFET Q1. By providing feedback on the voltage applied to the base of MOSFET Q1, the voltage applied to the gate of MOSFET Q1 can be automatically adjusted, thus regulating the change in the gate-to-source (VGS) voltage of MOSFET Q1. Through this adjustment method, the static operating point of MOSFET Q1 can be kept stable, ensuring a stable waveform in the circuit containing MOSFET Q1.
[0077] By configuring a resistor control element, specifically a digitally controlled potentiometer, multi-level real-time adjustment is achieved, facilitating processing by the microcontroller unit. Voltage regulation can be achieved by controlling the resistor in the circuit containing the target component. Combining the current data obtained from the current detector 1312 with resistor adjustment enables multi-level regulation, allowing for more precise voltage control of the target component.
[0078] In this embodiment, each data detector 140 can communicate with the microcontroller unit using a communication protocol, which can reduce interference between signals.
[0079] To ensure greater signal stability in the circuit containing the power output component 130 and to facilitate better processing of subsequent signals, the power output component 130 may further include a first amplification circuit connected to the target component.
[0080] As shown in Figure 3, the first amplifier circuit includes: a first DC blocking capacitor and a second resistor R2 connected in series.
[0081] Taking the target component as MOS transistor Q1 as an example, as shown in Figure 3, the first amplifier circuit can be connected to the gate of MOS transistor Q1.
[0082] Taking the example shown in Figure 3, the working principle of the first amplifier circuit can be as follows: a positive half-cycle sine wave can be input at the input terminal of the power output component 130 and applied to the primary side of the dummy load first resistor R1 and the first transformer T1. A corresponding positive half-cycle sine wave is induced on the secondary side of the first transformer T1. This sine wave is applied to the gate of the MOS transistor Q1 through the first capacitor C1 and the second resistor R2 to achieve linear power amplification.
[0083] For example, the first capacitor C1 can be a DC blocking capacitor.
[0084] Under the action of the first amplifier circuit, even if the input signal is weak, the signal applied to the gate of the MOSFET Q1 can be made relatively stronger through the amplification process of the first amplifier circuit, which can better meet the needs of subsequent temperature compensation processing of the MOSFET Q1.
[0085] To make the signal output by the power output component 130 stronger, the power output component 130 may also include a second amplification circuit connected to the target element.
[0086] As shown in Figure 3, the second amplifier circuit includes a third resistor R3, a second transformer T2, and a fourth resistor R4; the third resistor R3 is connected to the primary side of the second transformer T2; and the fourth resistor R4 is connected to the output terminal of the second transformer T2.
[0087] The power amplification of the drive signal applied to the gate of MOSFET Q1 is discharged through VCC connected to the third capacitor C3. The current flows through MOSFET Q1 and the current-limiting third resistor R3 to the primary side of the second transformer T2, and then back to the ground terminal of the third capacitor C3, forming a complete closed loop.
[0088] The second transformer T2, through electromagnetic induction, outputs a voltage waveform corresponding to the primary side, which is then applied to resistor R6 of the high-side current sampler to amplify a sinusoidal signal.
[0089] By setting a second amplification circuit, the output signal of the power output component 130 can be made stronger, thereby making it easier for the subsequent data detector 140 to detect the output signal of the power output component 130 more accurately.
[0090] Including a temperature compensation circuit 131 in the power output component 130 can make the signal output by the power output component 130 more stable. However, if a more stable and accurate signal is required from the RF signal generator, the signal processed by the main controller 150 also needs to be stable in order to better improve the performance of the RF signal output by the RF signal generator. Under this requirement, the main controller 150 may include an oscillation filter circuit.
[0091] As shown in Figure 5a, the oscillation circuit may include a set of LC circuits connected in series and a set of LC circuits connected in parallel.
[0092] Optionally, as shown in Figure 5b, the inductor in the LC circuit can be composed of multiple coils connected in parallel, and the capacitor in the LC circuit can be composed of multiple capacitors connected in parallel. In the example shown in Figure 5b, the inductor in the LC circuit can be composed of four coils connected in parallel, and the capacitor in the LC circuit can be composed of four capacitors connected in parallel.
[0093] The target circuit parameters of the oscillation filter circuit are determined by a genetic algorithm.
[0094] As shown in Figure 6, the circuit parameters of the oscillation filter circuit are determined in the following way:
[0095] Step 210: Calculate the initial total harmonic distortion value of the circuit containing the oscillation filter circuit.
[0096] The initial total harmonic distortion (THD) is a parameter used to measure the ratio of harmonic components in the output signal to the original signal.
[0097] Alternatively, an ADC can be used to acquire voltage and current in real time, and the components of each harmonic can be obtained through Fourier transform (FFT). The initial total harmonic distortion value can be obtained based on the ratio of other harmonic components to the total signal.
[0098] Step 220: Determine whether the initial total harmonic distortion value is greater than the target value.
[0099] If the initial total harmonic distortion value is greater than the target value, then proceed to step 220.
[0100] The target value can be a value that can be set as needed; for example, the target value can be 5%, 7%, 10%, etc.
[0101] Step 230: Set the iteration parameters.
[0102] The iteration parameters can be the parameters used in the iterative process involved in the genetic algorithm.
[0103] Iteration parameters can include a threshold for the number of iterations. Other iteration parameters may include the number of variables, the number of chromosomes, initial circuit parameters, iteration termination conditions, and initial population.
[0104] The number of variables can be determined based on the number of parameters that need to be adjusted. In an oscillating filter circuit, if there are two sets of LC circuits, then there are four circuit parameters that need to be adjusted, so the number of variables can be determined to be 4.
[0105] The number of chromosomes can be selected based on actual needs; for example, the number of chromosomes can be set to a value less than 1000.
[0106] The initial circuit parameters can be the initial parameters of each component in the oscillation filter circuit.
[0107] Typically, L is an inductor that passes low frequencies and blocks high frequencies in a circuit. C is an inductor that passes high frequencies and blocks low frequencies, but if connected in parallel, its function is reversed. Given the rated load R and frequency f of the oscillation filter circuit, the initial values of L and C can be calculated using the formulas L = R / 2πf and C = 1 / 2πfR.
[0108] The iteration termination condition may include a reference threshold. The iteration can end when the calculated total harmonic distortion value is less than this reference threshold. This reference threshold may be equal to the aforementioned target value.
[0109] Step 240: Determine the target genetic operator in the genetic algorithm.
[0110] Genetic operators in genetic algorithms can include random operations, crossover operations, mutation operations, etc. Random operations can include, but are not limited to, compass rotation operations; crossover operations can include, but are not limited to, single-point operations; mutation operations can include, but are not limited to, random mutation operations.
[0111] Optionally, crossover operations can include single-point crossover, two-point crossover, three-point crossover, etc. Mutation operations can include single-point mutation, two-point mutation, three-point mutation, four-point mutation, etc.
[0112] Optionally, the target genetic operator can be determined based on the initial total harmonic distortion (THD) value. The target genetic operator may include one or more genetic operators from the genetic algorithm.
[0113] For example, the target genetic operator can be determined based on the difference between the initial total harmonic distortion value and the target value.
[0114] If the difference between the initial total harmonic distortion (THD) value and the target value is within the first numerical interval, single-point crossover and single-point mutation operations will be identified as the target genetic operators. If the difference is within the second numerical interval, double-point crossover and double-point mutation operations will be identified as the target genetic operators. If the difference is within the third numerical interval, random operation, double-point crossover, and double-point mutation operations will be identified as the target genetic operators. If the difference is within the fourth numerical interval, random operation, three-point crossover, and double-point mutation operations will be identified as the target genetic operators. If the difference is within the fifth numerical interval, random operation, four-point crossover, and three-point mutation operations will be identified as the target genetic operators.
[0115] In this embodiment, the aforementioned numerical intervals can be non-overlapping numerical intervals.
[0116] In one instance, if the difference between the initial total harmonic distortion (THD) value and the target value is within the range of (5%, 15%), then single-point crossover and single-point mutation operations can be identified as target genetic operators; if the difference is within the range of (15%, 30%), then double-point crossover and double-point mutation operations can be identified as target genetic operators; if the difference is within the range of (30%, 45%), then random operations, double-point crossover, and double-point mutation operations can be identified as target genetic operators; if the difference is within the range of (45%, 60%), then random operations, three-point crossover, and double-point mutation operations can be identified as target genetic operators; if the difference is greater than 60%, then random operations, four-point crossover, and three-point mutation operations can be identified as target genetic operators.
[0117] Step 250: Calculate the current total harmonic distortion value based on the target genetic operator.
[0118] Step 260: Determine whether the current total harmonic distortion value is less than the target value.
[0119] If the current total harmonic distortion (THD) value is less than the target value, the circuit parameters corresponding to the current THD value are determined as the target circuit parameters.
[0120] Step 270: Determine whether the number of iterations is greater than the iteration threshold.
[0121] If the current total harmonic distortion (THD) value is not less than the target value and the number of iterations is not greater than the iteration threshold, steps 240 and 250 are re-executed. The target genetic operator is updated, and the current THD value is calculated based on the updated target genetic operator. The recalculated current THD value is compared with the target value to determine the subsequent execution process. If the current THD value is less than the target value, the circuit parameters corresponding to the current THD value are determined as the target circuit parameters. If the current THD value is not less than the target value, steps 240 and 250 can be repeated. If the current THD value is not less than the target value and the number of iterations is greater than the iteration threshold, step 220 is re-executed.
[0122] For example, the target genetic operator can be updated based on the difference between the current total harmonic distortion value and the target value.
[0123] If the difference between the current total harmonic distortion (THD) value and the target value is within the first numerical interval, single-point crossover and single-point mutation operations will be identified as the target genetic operators. If the difference is within the second numerical interval, double-point crossover and double-point mutation operations will be identified as the target genetic operators. If the difference is within the third numerical interval, random operation, double-point crossover, and double-point mutation operations will be identified as the target genetic operators. If the difference is within the fourth numerical interval, random operation, three-point crossover, and double-point mutation operations will be identified as the target genetic operators. If the difference is within the fifth numerical interval, random operation, four-point crossover, and three-point mutation operations will be identified as the target genetic operators.
[0124] If the current total harmonic distortion value is not less than the target value and the number of iterations is greater than the iteration threshold, then step 220 is executed again to update the iteration parameters and iterate based on the updated iteration parameters.
[0125] By incorporating genetic algorithms to optimize the parameters of the oscillation filter circuit, suitable parameters can be quickly found, reducing the time required for parameter adjustment. Furthermore, by integrating temperature-compensated voltage regulation of the target component in the power output assembly 130, the data obtained by the main controller 150 can also be more stable when its output signal is more stable. Based on this more stable data, the ablation radio frequency output by the RF signal generator can also be more stable and accurate.
[0126] The radio frequency signal generator provided in this application embodiment can be used in the field of radio frequency ablation. It is typically designed for multi-channel operation, with each channel's signal source 110 and power amplifier circuit being independent. Even if each channel uses the same type of signal source 110, the output signal will differ due to the non-fixed phase of the crystal oscillator after power-on and slight frequency variations. This can lead to inconsistent frequencies and phases among the signal sources 110 in each channel.
[0127] In one embodiment, as shown in FIG7a, the power drive assembly 120 includes multiple sub-power drive assemblies; each sub-power drive assembly is connected to the same signal source 110.
[0128] For example, the sub-power drive component may include an amplitude adjustment unit and a power amplification unit.
[0129] Each set of amplitude adjustment units and power amplification units forms a channel with signal source 110.
[0130] In one example, the power drive assembly 120 may include six sub-power drive assemblies, which can form six independent channels.
[0131] In the example above, since all six channels use the same signal source 110, the consistency of each communication can be better maintained.
[0132] Optionally, the signal source 110 may include a crystal oscillator and a digital frequency synthesizer.
[0133] Optionally, the amplitude adjustment unit may include a digital potentiometer. The amplitude of the signal output from the signal source 110 is adjusted via the digital potentiometer.
[0134] By connecting multiple sub-power drive components to the same signal source 110, the energy consistency of the multi-channel output can be better maintained while enabling the RF signal generator to operate in a multi-channel mode. Furthermore, implementing the same signal source 110 can reduce the number of components, making the cost of the RF signal generator relatively low, and simplifying the debugging of the RF signal generator.
[0135] In another embodiment, as shown in FIG7b, the power drive assembly 120 includes multiple sets of sub-power drive assemblies.
[0136] The signal source 110 includes a crystal oscillator and multiple direct digital frequency synthesizers, all connected to the crystal oscillator.
[0137] The number of direct digital frequency synthesizers is the same as the number of sub-power drive components; the sub-power drive components are connected one-to-one with the direct digital frequency synthesizers.
[0138] In the example shown in Figure 7b, the power drive assembly 120 includes six sub-power drive assemblies, and the signal source 110 contains six direct digital frequency synthesizers.
[0139] Six direct digital frequency synthesizers are connected to the same crystal oscillator.
[0140] By connecting multiple direct digital frequency synthesizers to the same crystal oscillator, the energy consistency of the multi-channel output can be better maintained when the RF signal generator operates in a multi-channel mode, since the signal source is based on the same crystal oscillator.
[0141] Depending on the specific needs, the RF signal generator may also include other modules. For example, to better demonstrate the effect and real-time status of the RF signal generator, as shown in Figure 8, the RF signal generator may also include a display 160.
[0142] The display 160 may include a button module 161, a display area 162, etc.
[0143] This application provides a radiofrequency ablation device, which includes a radiofrequency ablation catheter and a radiofrequency signal generator.
[0144] The radiofrequency ablation catheter is connected to a radiofrequency signal generator, and the radiofrequency ablation catheter is used to output radiofrequency energy based on the signal provided by the radiofrequency signal generator.
[0145] The radio frequency signal generator involved in this embodiment is similar to the radio frequency signal generator described in the previous embodiments. Other details about the radio frequency signal generator in this embodiment can be found in the descriptions in the foregoing embodiments, and will not be repeated here.
[0146] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application. It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0147] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A radio frequency signal generator, characterized in that, include: Signal source; The power drive component connected to the signal source; The power output component connected to the power drive component; A data detector connected to the power output component; and The main controller is connected to the data detector; The power output component includes a temperature compensation circuit; the temperature compensation circuit is used to adjust the voltage of the target element connected in the power output component.
2. The radio frequency signal generator according to claim 1, characterized in that, The temperature compensation circuit includes: a temperature detector, a current detector, a voltage detector, and a voltage controller; The temperature detector is used to collect temperature data of the target component; The current detector is used to collect current data of the target component; The voltage detector is used to collect voltage data of the target component; The voltage controller is electrically connected to the temperature detector, the current detector, and the voltage detector. The voltage controller is used to adjust the voltage of the target element based on the temperature data, current data, and voltage data.
3. The radio frequency signal generator according to claim 2, characterized in that, The target component is a MOSFET; the temperature data includes the temperature change of the MOSFET; the current data includes the output current of the MOSFET; and the voltage data includes the base voltage of the MOSFET. The temperature detector is used to detect the temperature change of the MOS transistor; The voltage detector is connected to the base of the MOS transistor and is used to acquire the voltage at the base of the MOS transistor. The current detector is connected to the output terminal of the MOSFET and is used to collect the output current of the MOSFET.
4. The radio frequency signal generator according to claim 3, characterized in that, The temperature compensation circuit further includes a resistor control element with one end connected to the voltage controller and the other end connected to the base of the MOS transistor; The voltage controller is configured to adjust the resistance value of the resistor control element according to the temperature change of the MOSFET and the output current of the MOSFET, so as to adjust the voltage on the base of the MOSFET; and The voltage controller is configured to adjust the voltage at the gate of the MOS transistor and the gate-to-source voltage of the MOS transistor by adjusting the voltage at the base of the MOS transistor.
5. The radio frequency signal generator according to claim 1, characterized in that, The power output component further includes: a first amplifier circuit connected to the target element; The first amplifier circuit includes: a first DC blocking capacitor and a second resistor connected in series.
6. The radio frequency signal generator according to claim 1, characterized in that, The power output component further includes: a second amplifier circuit connected to the target element; The second amplifier circuit includes: a third resistor, a second transformer, and a fourth resistor; The third resistor is connected to the primary side of the second transformer; the fourth resistor is connected to the output terminal of the second transformer.
7. The radio frequency signal generator according to any one of claims 1-6, characterized in that, The overall controller includes an oscillation filter circuit; wherein the target circuit parameters of the oscillation filter circuit are determined by a genetic algorithm.
8. The radio frequency signal generator according to claim 7, characterized in that, in, The circuit parameters of the oscillation filter circuit are determined in the following way: Calculate the initial total harmonic distortion (THD) value of the circuit containing the oscillation filter circuit; If the initial total harmonic distortion (THD) value is determined to be greater than the target value, then an iteration parameter is set; wherein, the iteration parameter includes an iteration number threshold; Identify the target genetic operator in the genetic algorithm; wherein, the target genetic operator includes one or more genetic operators; Calculate the current total harmonic distortion value based on the target genetic operator; If the current total harmonic distortion (THD) value is determined to be less than the target value, then the circuit parameters corresponding to the current THD value are determined to be the target circuit parameters. If it is determined that the current total harmonic distortion value is not less than the target value, then the target genetic operator is updated, and the current total harmonic distortion value is calculated based on the updated target genetic operator. If the current total harmonic distortion value is determined to be not less than the target value and the number of iterations is greater than the number of iterations threshold, then the iteration parameters are updated, and iteration is performed based on the updated iteration parameters.
9. The radio frequency signal generator according to claim 8, characterized in that, The updating of the target genetic operator includes: The target genetic operator is updated based on the difference between the current total harmonic distortion value and the target value.
10. The radio frequency signal generator according to claim 9, characterized in that, The genetic operators in the genetic algorithm include randomization, crossover, and mutation; the crossover operation can include single-point crossover, two-point crossover, and three-point crossover; the mutation operation can include single-point mutation, two-point mutation, three-point mutation, and four-point mutation. The step of updating the target genetic operator based on the difference between the current total harmonic distortion value and the target value includes: If the difference is within the first numerical range, the single-point crossover operation and the single-point mutation operation will be determined as the target genetic operators. If the difference is within the second numerical range, the two-point crossover operation and the two-point mutation operation will be identified as the target genetic operators. If the difference is within the third numerical range, the random operation, the two-point crossover operation, and the two-point mutation operation will be determined as the target genetic operators. If the difference is within the fourth numerical range, the random operation, three-point crossover operation, and two-point mutation operation will be determined as the target genetic operators. If the difference is within the fifth numerical range, the random operation, four-point crossover operation, and three-point mutation operation will be determined as the target genetic operators.
11. The radio frequency signal generator according to any one of claims 1-6, characterized in that, The power drive component includes multiple sets of sub-power drive components; Each group of sub-power drive components is connected to the same signal source.
12. The radio frequency signal generator according to claim 11, characterized in that, The sub-power drive component includes: an amplitude adjustment unit and a power amplification unit.
13. The radio frequency signal generator according to any one of claims 1-6, characterized in that, The power drive component includes multiple sets of sub-power drive components; The signal source includes a crystal oscillator and multiple direct digital frequency synthesizers, each connected to the crystal oscillator; wherein the number of the direct digital frequency synthesizers is the same as the number of the sub-power drive components; The sub-power drive component is connected one-to-one with the direct digital frequency synthesizer.
14. A radiofrequency ablation device, characterized in that, Includes a radiofrequency ablation catheter and a radiofrequency signal generator as described in any one of claims 1-13; The radiofrequency ablation catheter is connected to the radiofrequency signal generator, and the radiofrequency ablation catheter is used to output radiofrequency energy based on the signal provided by the radiofrequency signal generator.