Processing device and correction method

Abstract

Provided is a processing device having a processing chamber for processing a substrate, the processing device having a stage which includes a circular placement part where the substrate is to be placed and on which the substrate placed on the placement part is processed. The stage supports a ring-shaped member having an annular shape capable of surrounding the substrate placed on the placement part. A conveyance robot for conveying the substrate to the placement part has an end effector, which holds and conveys the substrate. The processing device is configured so as to execute: (A) a step in which the end effector is linearly moved together with a digital sensor from a first position toward a second position over the stage; (B) a step in which reference points located outside the periphery of the placement part are detected on the basis of digital results of a measurement by the digital sensor; (C) a step in which first correction control for correcting the position of the conveyance robot with respect to the processing chamber on the basis of the reference points is performed; (D) a step in which the end effector is linearly moved together with the digital sensor from the first position toward the second position that has been corrected, over the stage; (E) a step in which the inner periphery of the ring-shaped member is detected on the basis of digital results of a measurement by the digital sensor during the (D) step, and the periphery of the placement part is detected on the basis of the detected inner periphery; and (F) a step in which second correction control for correcting the position of the conveyance robot with respect to the processing chamber on the basis of the results of detection of the periphery of the placement part is performed.

Description

Processing Device and Correction Method

[0001] The present disclosure relates to a processing device and a correction method.

[0002] For example, in a manufacturing process such as a semiconductor device, a predetermined process such as an etching process is performed on a substrate such as a semiconductor wafer (hereinafter referred to as "wafer") by a substrate processing apparatus. Such a process is performed in a state where the substrate is placed on a stage in a processing chamber of the substrate processing apparatus.

[0003] In order to appropriately execute the process on the substrate by the substrate processing apparatus, it is necessary to accurately transfer the substrate to be processed to an appropriate position such as a stage. For this reason, so-called teaching is performed in which important positions (for example, the transfer position of the substrate) in a transfer robot that transfers the substrate to the substrate processing apparatus are stored as position coordinates in a control unit that controls the operation of the transfer robot.

[0004] The teaching of the transfer robot is performed based on the detection result of the peripheral position of the stage (specifically, based on the detection result of the peripheral position of the mounting portion on the stage where the substrate is placed). In this case, in order to accurately perform the teaching and obtain a desired processing result by the substrate processing apparatus, it is necessary to accurately detect the peripheral position of the stage. For example, as disclosed in Patent Document 1, etc., a method of detecting the peripheral position of the stage by scanning the periphery of the peripheral portion of the stage through a viewport with a position detection sensor provided above the outside of the processing chamber is known. However, in this method, it is necessary to provide a member for mounting a sensor such as a viewport in the substrate processing apparatus, and there is a risk that the member may affect the processing result. Also, when it is difficult to provide a viewport, the position detection sensor can be provided in the processing chamber, but in this case, reaction products adhere to the position detection sensor, leading to an increase in maintenance costs.

[0005] Japanese Patent Application Laid-Open No. 2021-92502

[0006] Given this background, there is a requirement to move the substrate holding part of the transport robot within the processing chamber together with a position detection sensor, and to perform teaching based on the measurement results from the sensor during this movement. Specifically, there is a requirement to perform an extend operation on a transport arm having a substrate holding part at its tip, and to perform teaching based on the measurement results from a position detection sensor mounted on or supported by the substrate holding part during this operation.

[0007] To accurately detect the peripheral position of the stage within a processing chamber, which has a complex structure and therefore many sources of noise and false detection, using such a method, it is preferable to use an analog sensor rather than a digital sensor for position detection. However, when using an analog sensor, signal delay is unavoidable due to the characteristics of analog signals, which makes it impossible to meet the high-precision synchronization requirements with the encoder of the drive unit that drives the transport arm, and thus makes it practically impossible to perform accurate teaching.

[0008] Therefore, in order to perform more accurate teaching by moving the substrate holding part of the transport arm as described above while satisfying the synchronization requirements of the drive unit's encoder, it is necessary to use a digital sensor that is less affected by signal delay.

[0009] However, for example, at the periphery of the stage in the processing chamber where etching is performed on a substrate, there are many structural noise factors affecting digital measurement results (e.g., sealing bands, dots, blast-treated areas, etc., provided on the electrostatic chuck that serves as the stage mounting area). Therefore, when using a digital sensor, there are many factors that cause false detection, making it difficult to accurately detect and determine the periphery position of the stage based on the measurement results, which may result in a decrease in the accuracy of position correction. Accordingly, this disclosure provides a processing apparatus and a position correction method that can accurately detect the periphery position of the stage and perform teaching, even when teaching is performed by moving a digital sensor with a transport robot inside the processing chamber.

[0010] One aspect of the present disclosure is a processing apparatus having a processing chamber for processing a substrate, comprising a stage including a circular mounting portion on which the substrate is placed, processing the substrate placed on the mounting portion, the stage supporting an annular member formed in an annular shape that can surround the substrate placed on the mounting portion, a transport robot for transporting the substrate to the mounting portion comprising an end effector, which holds and transports the substrate, and the processing apparatus comprising the steps of (A) moving the end effector linearly from a first position through the stage toward a second position together with a digital sensor, and (B) positioning outside the peripheral edge of the mounting portion based on the digital measurement result from the digital sensor during step (A) The system is configured to perform the following steps: (C) a step of detecting a reference point; (D) a step of performing a first correction control to correct the position of the transport robot relative to the processing chamber based on the reference point; (E) a step of moving the end effector together with the digital sensor in a straight line from the first position, passing over the stage, toward the corrected second position; (E) a step of detecting the inner end of the annular member based on the digital measurement result from the digital sensor during step (D), and detecting the circumferential end of the aforementioned mounting part with respect to the inner end; and (F) a step of performing a second correction control to correct the position of the transport robot relative to the processing chamber based on the detection result of the circumferential end of the aforementioned mounting part.

[0011] According to this disclosure, even when teaching is performed by moving a digital sensor with a transport robot within a processing chamber, it is possible to provide a substrate processing apparatus and a substrate control method that can accurately detect the peripheral edge position of the stage and perform teaching.

[0012] This is a plan view showing the schematic configuration of the wafer processing system, which is the processing apparatus according to this embodiment. This is a longitudinal cross-sectional view showing the schematic configuration of the substrate processing apparatus. This is a partially enlarged cross-sectional view of the stage. This is a schematic side view showing the configuration of the transfer robot. This is a bottom view showing the schematic configuration of the end effector. This is a flowchart to explain an example of the processing flow executed by the control device during teaching of the transfer robot. This is a flowchart to explain an example of the processing flow executed by the control device during teaching of the transfer robot. This is a diagram showing the relationship between the measurement results from the digital sensor and the height of the stage including the focus ring. This is a diagram to explain the main effects of this embodiment. This is a diagram to explain covering. This is a bottom view showing an example of a jig wafer.

[0013] The processing apparatus and correction method according to this embodiment will be described below with reference to the drawings. In this specification and the drawings, elements having substantially the same functional configuration are denoted by the same reference numerals, and redundant explanations will be omitted.

[0014] <Wafer Processing System> Figure 1 is a plan view showing a schematic configuration of the wafer processing system 1, which is a processing device according to this embodiment.

[0015] The wafer processing system 1 shown in Figure 1 applies a predetermined process, such as etching, to a wafer W, which serves as a substrate, using plasma under reduced pressure. This wafer processing system 1 has a configuration in which a carrier station 10, which loads and unloads a carrier C capable of accommodating multiple wafers W, and a processing station 11 equipped with multiple processing devices for applying the predetermined process to the wafers W under reduced pressure are integrally connected. The carrier station 10 and the processing station 11 are connected via two load lock devices 12 and 13.

[0016] The load lock devices 12 and 13 have load lock chambers 12a and 13a configured to switch between an atmospheric pressure atmosphere and a vacuum atmosphere. The load lock devices 12 and 13 are provided to connect the atmospheric pressure conveying device 20 and the vacuum conveying device 30, which will be described later.

[0017] The carrier station 10 includes an atmospheric pressure transport device 20 and a carrier mounting table 21. The carrier station 10 may also be provided with an aligner (not shown) for adjusting the orientation of the wafer W.

[0018] The atmospheric pressure transport device 20 has an atmospheric transport chamber 22 in which the interior is kept at atmospheric pressure. The atmospheric transport chamber 22 is connected to the load lock chambers 12a and 13a of the load lock devices 12 and 13 via gate valves G1 and G2. A transport mechanism 23 is provided inside the atmospheric transport chamber 22. The transport mechanism 23 can transport wafers W between the carrier C placed on the carrier mounting table 21 and the load lock chambers 12a and 13a under atmospheric pressure.

[0019] The transport mechanism 23 has a transport arm 23a, which includes, for example, a multi-joint arm with a wafer holding portion at its tip for holding the wafer W. The transport mechanism 23 is configured to transport the wafer W while holding it with the transport arm 23a.

[0020] The carrier mounting table 21 is located on the side of the atmospheric pressure transport device 20 opposite to the load lock devices 12 and 13. The wafers W in the carrier C placed on the carrier mounting table 21 are transported in and out of the atmospheric transport chamber 22 by the transport arm 23a of the transport mechanism 23 of the atmospheric pressure transport device 20.

[0021] The processing station 11 includes a vacuum transport device 30 and substrate processing devices 40 to 43.

[0022] The vacuum transfer device 30 has a vacuum transfer chamber 31 in which the chamber is kept in a reduced-pressure state (vacuum state). The vacuum transfer chamber 31 is connected to the load lock chambers 12a and 13a of the load lock devices 12 and 13 via gate valves G3 and G4. The vacuum transfer chamber 31 is also connected to the vacuum processing chambers 44 to 47, which will be described later, via gate valves G5 to G8. A transfer robot 32 for transporting wafers W is provided inside the vacuum transfer chamber 31. The transfer robot 32 loads and unloads wafers W to and from each of the substrate processing devices 40 to 43, specifically loading and unloading wafers W to and from each of the substrate processing devices 40 to 43 via the loading / unloading port 100a, which will be described later. The transfer robot 32 has a transfer arm 32a. Details of the configuration of the transfer robot 32 will be described later.

[0023] The substrate processing apparatuses 40 to 43 perform predetermined processes on the wafer W, such as film deposition, diffusion, and etching, under reduced pressure. In this embodiment, the substrate processing apparatuses 40 to 43 perform etching using plasma. Each of the substrate processing apparatuses 40 to 43 has a vacuum processing chamber 44 to 47 in which the etching process is performed on the wafer W under reduced pressure.

[0024] Furthermore, the wafer processing system 1 includes at least one control device 50. The control device 50 processes computer-executable instructions that cause the wafer processing system 1 to perform the various processes described herein. The control device 50 may be configured to control each element of the wafer processing system 1 to perform the various processes described herein. In one embodiment, some or all of the control device 50 may be included in the wafer processing system 1. The control device 50 may include a processing unit, a storage unit, and a communication interface. The control device 50 is implemented, for example, by a computer. The processing unit may be configured to read a program from the storage unit that provides logic or routines that enable various control operations, and to perform various control operations by executing the read program. This program may be stored in the storage unit in advance, or it may be retrieved via a medium M when needed. The retrieved program is stored in the storage unit and read from the storage unit and executed by the processing unit. The medium M may be various storage media read by a computer, or it may be a communication line connected to a communication interface. The storage medium may be temporary or non-temporary. The processing unit may be a CPU (Central Processing Unit) and may consist of one or more circuits. The storage unit may include RAM (Random Access Memory), ROM (Read Only Memory), HDD (Hard Disk Drive), SSD (Solid State Drive), or a combination thereof. The communication interface may communicate with the wafer processing system 1 via a communication line such as a LAN (Local Area Network). The control device 50 can function as a control unit that corrects the position of the transport robot 32 relative to the mounting unit 140a, described later, by controlling the transport arm 32a and digital sensor 300, described later.

[0025] <Substrate Processing Apparatus 40> Next, the substrate processing apparatus 40 will be described using Figures 2 and 3. Figure 2 is a longitudinal cross-sectional view showing the general configuration of the substrate processing apparatus 40. Figure 3 is a partially enlarged cross-sectional view of the stage, which will be described later.

[0026] As shown in Figure 2, the substrate processing apparatus 40 includes a processing chamber 100, a gas supply unit 120, an RF (Radio Frequency) power supply unit 130, and an exhaust system 140. Furthermore, the substrate processing apparatus 40 includes a stage 101 and a shower head 102.

[0027] The processing chamber 100 is a container configured to allow for reduced pressure inside, and constitutes a vacuum processing chamber 44. A wafer W loading / unloading port 100a is formed in the side wall of the processing chamber 100, and a gate valve G5, which serves as an opening / closing mechanism, is provided at the loading / unloading port 100a to open and close the loading / unloading port 100a.

[0028] Stage 101 is located in the lower region of the plasma processing space 100s within the processing chamber 100.

[0029] The stage 101 is configured to support the wafer W in the plasma processing space 100s. The stage 101 includes, for example, a lower electrode 103, an electrostatic chuck 104, an insulator 105, and a lifting pin 106. The stage 101 is also configured to support a focus ring 107 as an annular member. The stage 101 may or may not include the focus ring 107 as a component.

[0030] The lower electrode 103 is formed of a conductive material such as aluminum.

[0031] The electrostatic chuck 104 is provided on the lower electrode 103 and holds the wafer W by electrostatic force. The electrostatic chuck 104 has a circular mounting portion 104a on which the wafer W is placed. Specifically, the mounting portion 104a is formed in a circular shape in plan view in the center of the electrostatic chuck 104, on which the wafer W is placed on its upper surface. In the electrostatic chuck 104, the upper surface of the mounting portion 104a is formed to be higher than the upper surface of the outer periphery. A focus ring 107 is supported on the upper surface of the outer periphery surrounding the mounting portion 104a of the electrostatic chuck 104.

[0032] The mounting section 104a is provided with electrodes 108 for holding the wafer W by electrostatic adsorption. The electrostatic chuck 104 has a configuration in which the electrodes 108 are sandwiched between insulating materials made of insulating material.

[0033] A DC voltage from a DC power supply (not shown) is applied to the electrode 108. The resulting electrostatic force causes the wafer W to be attracted and held on the upper surface of the mounting portion 104a of the electrostatic chuck 104.

[0034] Furthermore, a heater 109 is embedded below the electrode 108 in the electrostatic chuck 104, serving as a temperature control unit for adjusting the temperature of the electrostatic chuck 104. The heater 109 adjusts the temperature of the wafer W held in the electrostatic chuck 104 by adjusting the temperature of the electrostatic chuck 104.

[0035] Furthermore, the mounting portion 104a of the electrostatic chuck 104 is formed to be smaller in diameter than the diameter of the wafer W, so that when the wafer W is placed on the upper surface of the mounting portion 104a, the peripheral edge of the wafer W protrudes from the mounting portion 104a.

[0036] As shown in Figure 3, a seal band 104b is provided on the peripheral edge of the upper surface of the mounting portion 104a of the electrostatic chuck 104, with a convex portion that protrudes upward and is formed in an annular shape along the peripheral edge. In addition, a plurality of columnar convex portions 104c are provided in the area on the upper surface of the mounting portion 104a that is inside the seal band 104b. The convex portions 104c prevent the wafer W from continuing to be attracted to the electrostatic chuck 104 by residual adsorption force when the voltage application to the electrode 108 is stopped. Furthermore, the seal band 104b prevents the processing gas from circulating between the wafer W supported by the convex portions 104c and the upper surface of the mounting portion 104a.

[0037] The seal band 104b and the protrusion 104c are formed as follows. Specifically, the upper surface of the mounting portion 104a, which was a flat surface, is blast-treated while the portion corresponding to the seal band 104b and the protrusion 104c is masked, thereby forming the seal band 104b and the protrusion 104c. In other words, the portion of the upper surface of the mounting portion 104a other than the seal band 104b and the protrusion 104c is the blast-treated portion.

[0038] The multiple protrusions 104c are provided, for example, at equal intervals. The protrusions 104c are formed in a cylindrical shape, for example, with a diameter of 300 μm to 500 μm and a height of 5 μm to 30 μm. The height of the seal band 104b is the same as that of the protrusions 104c.

[0039] As shown in Figure 2, the insulator 105 supports the lower electrode 103. The insulator 105 is, for example, a cylindrical member having an outer diameter equivalent to the outer diameter of the lower electrode 103, and is made of ceramic or the like, and supports the peripheral edge of the lower electrode 103.

[0040] The lifting pins 106 are columnar members that move up and down so as to protrude from the upper surface of the mounting portion 104a of the electrostatic chuck 104, and are made of, for example, ceramic. Three or more lifting pins 106 are provided along the circumferential direction of the electrostatic chuck 104, spaced apart from each other.

[0041] The lifting pin 106 is connected to a lifting mechanism 110 that raises and lowers the lifting pin 106. The lifting mechanism 110 includes, for example, a support member 111 that supports a plurality of lifting pins 106, and a drive unit 112 that generates a driving force to raise and lower the support member 111 and raise and lower the plurality of lifting pins 106. The drive unit 112 has a drive source such as a motor that generates the driving force.

[0042] The lifting pin 106 is inserted through a through hole 113 that extends downward from the mounting portion of the electrostatic chuck 104 to the bottom surface of the lower electrode 103.

[0043] The focus ring 107 is a member formed in an annular shape that can surround the outer periphery of the wafer W placed on the placement portion 104a, and is provided, for example, to improve the uniformity of plasma processing (in this example, plasma etching processing). The focus ring 107 is formed from a material appropriately selected according to the plasma processing to be performed, and is formed, for example, from silicon, silicon carbide, or quartz.

[0044] Further, the focus ring 107 has a step formed on its upper portion, and the outer peripheral portion is formed higher than the upper surface of the inner peripheral portion. In other words, the focus ring 107 has a flange portion 107a (see FIG. 3) that protrudes inward at the lower portion. The above-described step of the focus ring 107 is formed by an inclined surface 107b that slopes downward toward the inside. That is, the upper surface of the flange portion 107a of the inner peripheral portion of the focus ring 107 and the upper surface of the outer peripheral portion are connected by the inclined surface 107b. The flange portion 107a of the focus ring 107 is formed so as to creep under the peripheral edge portion of the wafer W that protrudes from the placement portion 104a of the electrostatic chuck 104.

[0045] This focus ring 107 is arranged substantially concentrically with the placement portion 104a of the electrostatic chuck 104 in a plan view. Further, the focus ring 107 is manufactured, for example, by grinding or the like so that the flange portion 107a is formed on the inner peripheral portion of a member having a flat upper surface and having an annular shape in a plan view. Therefore, the upper surface of the flange portion 107a of the inner peripheral portion of the focus ring 107 is rougher than the upper surface of the outer peripheral portion of the focus ring 107.

[0046] The shower head 102 has a function as an upper electrode and also functions as a shower head that supplies the processing gas from the gas supply unit 120 to the plasma processing space 100s. The shower head 102 is arranged above the stage 101 and constitutes a part of the ceiling portion of the processing chamber 100. Further, the shower head 102 has an electrode plate 114 arranged facing the inside of the processing chamber 100 and a support 115 provided above the electrode plate 114. Note that the shower head 102 is supported above the processing chamber 100 via an insulating shielding member 116.

[0047] The electrode plate 114 has a plurality of discharge holes 114a formed therein. The discharge holes 114a discharge a processing gas or the like into the plasma processing space 100s.

[0048] The support 115 detachably supports the electrode plate 114. Inside the support 115, a gas diffusion chamber 115a is formed. A plurality of gas flow holes 115b communicating with the discharge holes 114a are formed from the gas diffusion chamber 115a.

[0049] The gas supply unit 120 includes one or more gas supply sources 121 and one or more flow controllers 122. The gas supply unit 120 is configured to supply, for example, one or more processing gases or one or more cleaning gases from the corresponding gas supply sources 121 to the gas diffusion chamber 115a through the corresponding flow controllers 122.

[0050] In the substrate processing apparatus 40, the processing gas from the gas supply source 121 selected from one or more gas supply sources 121 is supplied to the gas diffusion chamber 115a through the flow controller 122. Then, the processing gas supplied to the gas diffusion chamber 115a is dispersed and supplied in a shower shape into the plasma processing space 100s through the gas flow holes 115b and the discharge holes 114a.

[0051] The RF power supply unit 130 includes, for example, two RF generation units 131a, 131b and two matching circuits 132a, 132b. The RF generation unit 131a and the RF generation unit 131b are each connected to the lower electrode 103 through the matching circuits 132a, 132b to supply RF power to the lower electrode.

[0052] The RF generation unit 131a generates and supplies RF power for plasma generation. The matching circuit 132a has a circuit for matching the output impedance of the RF generation unit 131a and the input impedance on the load (lower electrode 103) side.

[0053] The RF generation unit 131b generates and supplies RF power (high-frequency bias power) for attracting ions to the wafer W. The matching circuit 132b has a circuit for matching the output impedance of the RF generation unit 131b and the input impedance on the load (lower electrode 103) side.

[0054] The exhaust system 140 exhausts the plasma processing space 100s and has a vacuum pump. The exhaust system 140 is connected to an exhaust port 100c located at the bottom of the processing chamber 100.

[0055] The configurations of the substrate processing devices 41 to 43 are the same as those of the substrate processing device 40, so their explanation will be omitted. As described above, in addition to the focus ring 107, the area around the mounting portion 104a of the processing chamber 100 has a seal band 104b, a protrusion 104c, and a surface that has been blasted, and there is a structure that makes it difficult to directly sense the peripheral edge of the mounting portion 104a with a digital sensor.

[0056] <Wafer Processing> Next, the wafer processing performed by the wafer processing system 1 configured as described above will be explained. The following processing will be carried out under the control of the control device 50.

[0057] First, the wafer W is removed from the carrier C by the transport arm 23a of the transport mechanism 23, and the gate valve G1 is opened. Then, the wafer W is loaded into the load lock device 12 by the transport arm 23a.

[0058] Next, the gate valve G1 is closed, sealing the load lock device 12 and reducing the pressure.

[0059] When the pressure inside the load lock device 12 falls below a predetermined pressure, the gate valve G3 is opened, and the wafer W is received from the support part (not shown) inside the load lock device 12 by the transport arm 32a of the transport robot 32 and removed from the load lock device 12.

[0060] Next, after the gate valve G3 is closed, the gate valve for the processing apparatus that will perform the desired processing (in this case, the gate valve G5 for the substrate processing apparatus 40) is opened. Subsequently, the wafer W is transported by the transport arm 32a into the depressurized processing chamber 100 of the substrate processing apparatus 40. After that, the lifting pin 106 is raised and lowered, and the wafer W is placed on the mounting portion 104a of the electrostatic chuck 104.

[0061] Next, the gate valve G5 is closed, sealing the processing chamber 100 of the substrate processing apparatus 40, and the inside of the processing chamber 100 is depressurized to a predetermined vacuum level by the exhaust system 140. A DC voltage is also applied to the electrode 108 of the electrostatic chuck 104, causing the wafer W to be attracted and held to the electrostatic chuck 104 by electrostatic force.

[0062] Next, a processing gas is supplied from the gas supply unit 120 to the plasma processing space 100s via the shower head 102. Additionally, high-frequency power for plasma generation is supplied from the RF power supply unit 130 to the lower electrode 103, thereby exciting the processing gas and generating plasma. At this time, high-frequency power for ion pull-in is also supplied from the RF power supply unit 130 to the lower electrode 103. The generated plasma then performs a plasma etching process on the wafer W.

[0063] When the plasma etching process is completed, the supply of high-frequency power from the RF power supply unit 130 and the supply of processing gas from the gas supply unit 120 are stopped. Next, the application of DC voltage to the electrode 108 is stopped, and the adsorption and holding of the wafer W by the electrostatic chuck 104 is stopped.

[0064] Subsequently, the gate valve G5 of the processing chamber 100 is opened, and the wafer W is removed from the processing chamber 100 of the substrate processing apparatus 40 in the reverse order of loading the wafer W into the processing chamber 100, thus completing the series of wafer processing operations.

[0065] Before the next wafer W to be processed is brought into the processing chamber 100 of the substrate processing apparatus 40, cleaning gas is supplied to the processing chamber 100 and cleaning is performed.

[0066] <Transport Robot> Next, an example of a transport robot 32 will be described using Figures 4 and 5. Figure 4 is a schematic side view showing the configuration of the transport robot 32. Figure 5 is a bottom view showing an overview of the configuration of the end effector, which will be described later.

[0067] As shown in Figure 4, the transport robot 32 has a transport arm 32a and a base 32b, and is configured to transport wafers W while holding them with the transport arm 32a. The number of transport arms provided on the transport robot 32 may be multiple.

[0068] The transport arm 32a is equipped with an end effector 32c at its tip, which serves as a substrate holder, and is composed of, for example, a multi-joint arm. The base end of the transport arm 32a is pivotally supported on the base 32b.

[0069] The base 32b is provided with a drive mechanism 32d that generates a driving force for moving the end effector 32c. The drive mechanism 32d has a motor (not shown) as the drive unit that generates the driving force. The driving force generated by the drive mechanism 32d rotates the transport arm 32a around the central axis A of the base 32b, and moves the end effector 32c in the circumferential direction (θ direction in the figure) around the central axis A. In addition, the driving force generated by the drive mechanism 32d extends and retracts the transport arm 32a, and moves the end effector 32c linearly in the radial direction (R direction in the figure, etc.) around the central axis A of the base 32b. Furthermore, the driving force generated by the drive mechanism 32d moves the transport arm 32a in the vertical direction, and raises and lowers the end effector 32c. Furthermore, the motor of the drive mechanism 32d is equipped with an encoder (not shown), which allows for the determination of the amount of horizontal movement of the end effector 32c, that is, the horizontal position of the end effector 32c.

[0070] Furthermore, the end effector 32c is equipped with a digital sensor 300, which is a sensor that can detect the position of an object by sensing the object and generating a digital signal. Specifically, the digital sensor 300 is provided at the tip of the end effector 32c, and more specifically, as shown in Figure 5, the digital sensor 300 is provided at the tip of each of the bifurcated parts of the end effector 32c. In addition, each digital sensor 300 is provided so that the distance to line B is equal between the digital sensors 300. Line B is a line that extends in the direction in which the transport arm 32a extends and retracts and the end effector 32c moves linearly as described above, and is a line that passes through the center of the end effector 32c.

[0071] The digital sensor 300 can digitally detect, or measure, the position of the object to be detected. Specifically, the digital sensor 300 is composed of a known optical sensor or capacitive sensor capable of generating a digital signal. The digital sensor 300 outputs the digital measurement result digitally. Specifically, the digital sensor 300 outputs a Low signal when the amount of light or capacitance being sensed changes or falls below a predetermined value, and outputs a High signal when it does not change or is greater than the predetermined value. Alternatively, the digital sensor 300 may output a High signal when the amount of light or capacitance being sensed does not change or falls below a predetermined value, and a Low signal when it changes or is greater than the predetermined value. The digital sensor 300 outputs the digital detection result of the position of the object to be detected using such digital signals.

[0072] The digital sensor 300, in the case of an optical sensor, for example, includes a light-emitting element (not shown) that illuminates the object with light for distance measurement, and a light-receiving element, i.e., an optical sensor (not shown), that receives the reflected light from the light-emitting element. The transport robot 32, including the digital sensor 300, is controlled by the control device 50. The measurement results from the digital sensor 300 are output to the control device 50, for example, wirelessly.

[0073] <Operation of the wafer processing system 1 and processing of the control device 50 during teaching> Next, the operation of the wafer processing system 1 and the processing of the control device 50 during teaching of the transport robot 32 will be explained. During teaching of the transport robot 32, the wafer processing system 1 executes steps (A) to (F) under the control of the control device 50. Step (A): A step of moving the end effector 32c together with the digital sensor 300 from a first position to a second position, passing over the stage 101 (first extend operation). Step (B): A step of detecting a reference point located outside the peripheral edge of the mounting portion 104a of the electrostatic chuck 104 (hereinafter referred to as the "chuck peripheral edge") based on the digital measurement results from the digital sensor 300 during step (A). Step (C): A step of correcting the position of the transport robot 32 relative to the processing chamber 100 based on the above reference point (first correction control). Step (D): A step of moving the end effector 32c together with the digital sensor 300 from the first position to the corrected second position, passing over the stage 101 (second extend operation). Step (E): A step of detecting the inner circumference end of the focus ring 107 (hereinafter referred to as the "ring inner circumference end") based on the digital measurement results from the digital sensor 300 during step (D), and detecting the chuck circumference end with respect to the ring inner circumference end. Step (F): A step of correcting the position of the transport robot 32 relative to the processing chamber 100 based on the detection result of the chuck circumference end (second correction control).

[0074] The first correction control described above may include processes (A) and (B) in addition to process (C), and the second correction control described above may include processes (D) and (E) in addition to process (F). In other words, the control device 50 may perform a first correction control in which, in a first extend operation in which the transport arm 32a is moved within the processing chamber 100, the digital sensor 300 detects a reference point by sensing an area located outside the peripheral edge of the mounting part 104a, and corrects the position of the transport robot 32 with respect to the processing chamber 100 based on the reference point; and after the first correction control, in a second extend operation in which the transport arm 32a is moved within the processing chamber 100, the digital sensor 300 detects the position of the peripheral edge of the mounting part 104a by sensing an area moving from the reference point toward the mounting part 104a, and corrects the position of the transport robot 32 with respect to the processing chamber 100 based on the position of the peripheral edge.

[0075] The operation of the wafer processing system 1 and the processing of the control device 50 during the teaching of the transport robot 32 will be described in more detail below.

[0076] <Specific Examples of Operation of Wafer Processing System 1 and Processing of Control Device 50 During Teaching> Figures 6 and 7 are flowcharts illustrating an example of the processing flow performed by the control device 50 during the teaching of the transport robot 32. Figure 8 is a diagram showing the relationship between the measurement results from the digital sensor 300 and the height of the stage 101, including the focus ring 107. Figure 8 is a diagram that conveniently illustrates the measurement results in the first extend operation and the second extend operation, which will be described later. Furthermore, the teaching of the transport robot 32 is performed, for example, for each of the substrate processing devices 40 to 43 when the wafer processing system 1 is started up, with the inside of the vacuum transport chamber 31 and the processing chamber 100 under atmospheric pressure.

[0077] (Step S1) When teaching the transport robot 32, the control device 50 first sets the detection target to the area around the inner circumference of the ring, which is located outside the circumference of the mounting section 104a, as shown in Figure 6.

[0078] (Step S2) Next, the control device 50 controls the drive mechanism 32d of the transport robot 32, etc., and moves the end effector 32c together with the digital sensor 300 in a straight line from the retract position, which is the first position, across the stage 101 towards the extend position, which is the second position (first extend operation).

[0079] More specifically, the control device 50 moves the end effector 32c, on which the digital sensor 300 is mounted, linearly from the retract position, through the stage 101, to the extended position, which is a second position. The retract position is the position in which the transport arm 32a is retracted, and the digital sensor 300 is located on the side of the input / output 100a (hereinafter referred to as the "front side") relative to the focus ring 107. The extended position is the position in which the transport arm 32a is extended, and the digital sensor 300 is located on the side of the focus ring 107 that is further away from the input / output 100a (hereinafter referred to as the "back side").

[0080] Furthermore, during this movement, the control device 50 controls the digital sensor 300 and continues to digitally measure, i.e., sense, the inside of the processing chamber 100 as the detection target while the end effector 32c is moving. Specifically, during the above movement, the control device 50 continues to detect, i.e., sense, the distance from the digital sensor 300 to the detection target, at least in the area around the inner circumference of the ring, and more specifically, it continues to detect whether the distance has changed since the last detection. Then, based on the output from each digital sensor 300 and the output from the encoder of the motor of the drive mechanism 32d, the control device 50 acquires data D1 of the change, i.e., the distribution of the detection results by the digital sensor 300 in the direction of movement of the end effector 32c for each digital sensor 300. Figure 8 shows a part of the above data D1.

[0081] (Step S3) As shown in Figure 6, the control device 50 detects the inner circumference end of the ring, which was set as the target for detection in step S1, as the aforementioned reference point, based on the digital measurement results from the digital sensor 300 during the movement of the end effector 32c in step S2.

[0082] Specifically, the control device 50 detects the front and rear inner circumference ends of the ring in the direction of movement for each digital sensor 300, based on the data D1 obtained in step S2, which shows the progression, or distribution, of the detection results from the digital sensor 300 in the direction of movement of the end effector 32c. As a result, four inner circumference ends of the ring in the direction of movement are detected.

[0083] This detection is performed, for example, as follows. That is, a range R1 (see Figure 8) in which the inner circumference end of the ring can be located is set in advance for the data D1. The control device 50 detects the portion closest to the user within the range R1 in the data D1 where a change is detected by the digital sensor 300 as the inner circumference end of the ring on the user's side in the direction of movement. That is, the control device 50 detects the portion P1 in the data D1 where the output from the digital sensor 300 switches from a High signal to a Low signal as the end effector 32c moves, and the portion furthest downstream in the direction of movement as the inner circumference of the ring on the user's side in the direction of movement. The control device 50 also detects the portion furthest to the user within the range R1 in the data D1 where a change is detected by the digital sensor 300 as the inner circumference end of the ring on the user's side in the direction of movement. In other words, the control device 50 detects the portion within the range R1 in the data D1 in which the output from the digital sensor 300 switches from a Low signal to a High signal as the end effector 32c moves, and the upstream portion in the direction of movement, as the inner circumference of the ring on the near side in the direction of movement. That is, in the detection of step S3, the upper end of the inclined surface 107b of the focus ring 107 is detected as the inner circumference end of the ring. The upper surface of the portion of the focus ring 107 outside the inclined surface 107b is not processed during the manufacturing of the focus ring 107, so it is relatively stable and flat. Therefore, the detection result by the digital sensor 300 of the upper surface of the portion of the focus ring 107 outside the inclined surface 107b is constant regardless of position, so even when using a digital sensor, the upper end of the inclined surface 107b of the focus ring 107 can be easily detected without causing false detections, compared to the circumferential end of the mounting portion 104a where the seal band 104b, the protrusion 104c, and the blasted surface are located in close proximity.Furthermore, since the focus ring 107 is positioned on the front side (inlet side) of the processing chamber 100 compared to the mounting section 104a, even at a stage where the position correction accuracy of the transport robot 32 relative to the processing chamber 100 is not high, the risk of interference with the chamber's internal structure is low, and teaching control can be performed while ensuring greater safety. In addition, this detection detects, or calculates, the position coordinates of the inner circumference end of the ring. Specifically, the coordinate values ​​of the inner circumference end of the ring in the direction of movement of the end effector 32c and the coordinate values ​​of the inner circumference end of the ring in the horizontal plane in a direction perpendicular to the direction of movement are calculated.

[0084] The control device 50 may execute step S3 in parallel with step S2, or after step S2.

[0085] (Step S4) Next, the control device 50 calculates the amount of positional deviation of the end effector 32c relative to the mounting portion 104a of the electrostatic chuck 104, based on the ring inner circumference end (reference point) detected in step S3. Specifically, the control device 50 calculates, for example, the amount of positional deviation of the center of the focus ring 107 relative to the design value of the center of the mounting portion 104a of the electrostatic chuck 104 in the coordinate system of the end effector 32c, based on the four ring inner circumference end points detected in step S3. Since the focus ring 107 and the mounting portion 104a of the electrostatic chuck 104 are approximately concentric, in this step, the control device 50 roughly calculates the amount of positional deviation of the center of the mounting portion 104a of the electrostatic chuck 104 relative to the design value, based on the detection results in step S3.

[0086] (Step S5) Subsequently, the control device 50 performs position correction of the transport robot 32 relative to the processing chamber 100 based on the inner circumference end of the focus ring 107 calculated in step S3 (first correction control). Specifically, the control device 50 corrects the coordinate system of the end effector 32c (hereinafter referred to as the "tool coordinate system") so that the amount of positional deviation calculated in step S4 becomes zero, based on the four inner circumference end of the ring detected in step S3. Through the correction in this process, the tool coordinate system is roughly aligned with the mounting portion 104a of the electrostatic chuck 104.

[0087] (Step S6) The control device 50 also controls the drive mechanism 32d of the transport robot 32 to return the end effector 32c to the retract position. The control device 50 may perform step S6 in parallel with steps S4 and S5, or before or after steps S4 and S5.

[0088] (Step S7) Next, as shown in Figure 7, the control device 50 sets the detection target to the chuck peripheral end region (the region from the reference point toward the mounting portion 104a). Here, by determining the position of the focus ring 107 located around the mounting portion 104a through the first extend operation and the first correction control, it is possible to set the measurement area more accurately and perform extend operation and sensing in robot coordinates with higher precision.

[0089] (Step S8) Next, the control device 50 controls the drive mechanism 32d of the transport robot 32, etc., and moves the end effector 32c together with the digital sensor 300 in a straight line from the retract position, passing over the stage 101 towards the corrected extended position (second extend operation).

[0090] More specifically, the control device 50 moves the end effector 32c, which is equipped with a digital sensor 300, in a linear fashion from the retract position, through the stage 101, to the extended position on the corrected tool coordinate system.

[0091] Furthermore, during this movement, the control device 50 controls the digital sensor 300, similar to step S2, and continues to digitally measure the distance from the digital sensor 300 to the mounting portion 104a of the electrostatic chuck 104 and the detection target of the focus ring 107 while the end effector 32c is moving. Specifically, during the above movement, the control device 50 continues to perform detection, i.e., sensing, regarding the distance from the digital sensor 300 to the target point, at least in the peripheral end region of the chuck, and more specifically, it continues to detect whether the distance has changed since the last detection. Then, based on the output from each digital sensor 300 and the output from the encoder of the motor of the drive mechanism 32d, the control device 50 acquires data D2 (see Figure 8) of the change, i.e., the distribution of the detection results by the digital sensor 300 in the direction of movement of the end effector 32c for each digital sensor 300.

[0092] (Step S9) The control device 50 also detects the inner end of the focus ring 107 based on the digital measurement results from the digital sensor 300 during the movement of the end effector 32c in step S8.

[0093] Specifically, the control device 50 detects the front and rear inner circumference ends of the ring in the direction of movement for each digital sensor 300, based on the data D2 obtained in step S8, which shows the progression, or distribution, of the detection results from the digital sensor 300 in the direction of movement of the end effector 32c. As a result, four inner circumference ends of the ring in the direction of movement are detected. The manner of this detection is the same as in step S3.

[0094] (Step S10) Next, the control device 50 detects the chuck circumferential end, which was set as the detection target in step S7, using the ring inner circumferential end detected in step S9 as a reference. Since the position of the chuck circumferential end falls within a predetermined range with respect to the ring inner circumferential end, the chuck circumferential end is detected in this manner. Specifically in step S10, based on the data D2 obtained in step S8, which shows the transition, i.e., the distribution, of the detection results by the digital sensor 300 in the direction of movement of the end effector 32c, and the ring inner circumferential end detected in step S9, the front and back ring circumferential ends in the direction of movement are detected for each digital sensor 300. As a result, four chuck circumferential ends in the direction of movement are detected.

[0095] This detection is performed, for example, as follows. Specifically, for the data D2 described above, a range (sensing area) R2 (see Figure 8) in which the chuck circumferential end can be located is preset, based on the inner circumferential end of the ring. The range R2 is preset, for example, to be inside the inclined surface 107b of the focus ring 107 and outside the protrusion 104c of the mounting portion 104a of the electrostatic chuck 104 and the blasted processing portion.

[0096] The control device 50 detects the portion furthest in the range R2, based on the inner circumference end of the ring on the front side in the data D2, where the digital sensor 300 no longer detects any change due to movement, as the front chuck circumference end in the direction of movement. That is, the control device 50 detects the portion P2 in the uppermost part of the portion P2 in the direction of movement, where the output from the digital sensor 300 switches from a Low signal to a High signal due to the movement of the end effector 32c, as the front chuck circumference end in the direction of movement. Furthermore, the control device 50 detects the portion furthest in the range R2, based on the inner circumference end of the ring on the rear side in the data D2, where the digital sensor 300 no longer detects any change due to movement, as the rear chuck circumference end in the direction of movement. In other words, the control device 50 detects the portion of the data D2 within the range R2, which is based on the inner circumference end of the ring on the far side, where the output from the digital sensor 300 switches from a High signal to a Low signal as the end effector 32c moves, and which is the downstream portion in the direction of movement, as the chuck circumference end on the far side in the direction of movement. That is, in the detection of step S10, the circumference end of the seal band 104b provided on the mounting portion 104a of the electrostatic chuck 104 is detected as the chuck circumference end. The upper surface of the seal band 104b is relatively stable and flat. Therefore, the circumference end of the seal band 104b is easily detected. In addition, in this detection, the position coordinates of the chuck circumference end are detected, i.e., calculated. Specifically, the coordinate values ​​of the chuck circumference end in the direction of movement of the end effector 32c and the coordinate values ​​of the chuck circumference end in a direction perpendicular to the direction of movement in the horizontal plane are calculated.

[0097] As described above, the reason for setting range R2 is as follows: In the vicinity of the protrusion 104c or the blasted area of ​​the mounting portion 104a of the electrostatic chuck 104, similar to the vicinity of the chuck's peripheral edge, the measurement result by the digital sensor 300, which is moving with the end effector 32c as in step S8, changes with the movement of the end effector 32c. Range R2 is set as described above to prevent the vicinity of the protrusion 104c or the blasted area from being mistakenly detected as the chuck's peripheral edge.

[0098] The control device 50 may execute steps S9 and S10 in parallel with step S8, or after step S8.

[0099] (Step S11) Next, the control device 50 calculates the amount of positional deviation of the end effector 32c relative to the mounting portion 104a of the electrostatic chuck 104 based on the chuck peripheral edge detected in step S10. Specifically, the control device 50 calculates, for example, the amount of positional deviation of the center of the mounting portion 104a of the electrostatic chuck 104 relative to the design value in the coordinate system of the end effector 32c, based on the chuck peripheral edge detected in step S10.

[0100] (Step S12) The control device 50 then determines whether the amount of positional deviation calculated in step S11 is less than a specified value.

[0101] (Step S13) If the value is greater than or equal to the specified value (step S12, NO), the position of the transport robot 32 relative to the processing chamber 100 is corrected based on the peripheral edge of the mounting portion 104a of the electrostatic chuck 104 calculated in step S11 (second correction control). Specifically, the control device 50 corrects the tool coordinate system so that the positional deviation amount calculated in step S12 becomes zero, based on the four chuck peripheral edges detected in step S11, for example.

[0102] (Step S14) The control device 50 also controls the drive mechanism 32d of the transport robot 32 to return the end effector 32c to the retract position.

[0103] The control device 50 may execute step S13 in parallel with step S14, or before or after step S14.

[0104] After steps S13 and S14, the control device 50 returns the process to step S8.

[0105] On the other hand, if the amount of positional deviation calculated in step S11 does not exceed a specified value (step S12, NO), the series of processes is completed. If it is determined in step S12 that the amount exceeds the specified value multiple times in a row (for example, five times), the control device 50 may stop teaching and notify the error via a notification unit (not shown).

[0106] (Main Effects of This Embodiment) Figure 9 is a diagram illustrating the main effects of this embodiment. As described above, in this embodiment, the control device 50 detects the inner circumference end of the ring based on the detection result by the digital sensor 300 when the end effector 32c is moved linearly from the retract position to the extend position together with the digital sensor 300. At the same time, the control device 50 performs a first correction control based on the above detection result and then detects the chuck circumference end with respect to the inner circumference end of the ring. Therefore, even with teaching control using a digital sensor, it is possible to suppress the false detection of the protrusion 104c of the mounting portion 104a of the electrostatic chuck 104 or the vicinity of the blasted processing portion as the chuck circumference end.

[0107] Furthermore, in this embodiment, before moving the end effector 32c from the retract position to the extend position together with the digital sensor 300 in order to detect the chuck circumferential end, the inner circumferential end of the ring is detected and the position of the end effector 32c is roughly corrected based on the detection result. In other words, rough teaching based on the inner circumferential end of the ring is performed before the main teaching based on the chuck circumferential end. The reason for this is as follows: If the rough correction described above is not performed, as shown in Figure 9, the aforementioned line B (a line extending in the direction in which the end effector 32c moves linearly from the retract position to the extend position and passing through the center of the end effector 32c) may be significantly off-center from the mounting portion 104a of the electrostatic chuck 104. When it is significantly off-center in this way, the distance L from the inner circumferential end of the ring to the chuck circumferential end on line C, which is parallel to line B and coincides with the digital sensor 300 in a plan view, will be significantly different from when line B passes through the center of the electrostatic chuck 104. If the range R2 is not set wide as described above, it will not be possible to detect the chuck circumferential end with respect to the inner circumferential end of the ring. However, if the range R2 is wide, when using a digital sensor, there is a high possibility that the protrusion 104c of the mounting portion 104a of the electrostatic chuck 104 or the vicinity of the blasted processing area will be mistakenly detected as the chuck circumferential end. In contrast, in this embodiment, rough teaching based on the inner circumferential end of the ring is performed before this teaching, and the line B described above is brought close to the center of the mounting portion 104a of the electrostatic chuck 104, so it is not necessary to set the range R2 wide as described above. Therefore, even when using a digital sensor, there is a low possibility that the protrusion 104c of the mounting portion 104a of the electrostatic chuck 104 will be mistakenly detected as the chuck circumferential end.

[0108] Therefore, according to this embodiment, the peripheral edge position of the stage can be detected with greater accuracy based on the measurement results of the digital sensor 300, which is configured to be movable together with the end effector 32c of the transport robot 32. As a result, teaching of the transport robot based on the peripheral edge position of the stage can be made more accurate.

[0109] Furthermore, in this embodiment, the digital sensor 300 is provided at the tip of the end effector 32c. Therefore, the amount of movement of the end effector 32c for detecting the inner circumference end of the ring used in rough teaching, and the amount of movement of the end effector 32c for detecting the inner circumference end of the ring and the circumference end of the chuck used in this teaching can be minimized.

[0110] <Modified Example> In the above example, the inner circumference end of the ring was used as the reference point for rough teaching, but the outer circumference end of the focus ring 107 may also be used as the same reference point. However, by using the inner circumference end of the ring as the reference point for rough teaching, the reference point is closer to the outer circumference end of the chuck compared to the case where the outer circumference end of the focus ring 107 is used as the same reference point. As a result, the required sensing distance by robot control can be shortened, and the risk of false detection due to surface condition can be reduced. Therefore, by using the inner circumference end of the ring as the reference point, rough teaching can be performed with greater accuracy.

[0111] Furthermore, in the above example, teaching of the transport robot 32 was performed when the wafer processing system 1 was started up, but it may be performed at times other than startup, for example, during maintenance of the wafer processing system 1. When teaching of the transport robot 32 is performed during maintenance of the wafer processing system 1, the following effect is obtained by using the outer edge of the focus ring 107 as the reference point for rough teaching. That is, during maintenance, rough teaching can be performed more accurately by using the edge of the outer part of the focus ring 107, which is less prone to wear when the wafer W is processed, as the reference point, rather than the inner part of the focus ring 107, which is prone to wear when the wafer W is processed.

[0112] Furthermore, if the teaching of the transport robot 32 is performed during maintenance of the wafer processing system 1, the range R1 from the reference position may be changed according to the number of wafers processed by the processing module being taught, and specifically, the range R1 may be widened according to the number of wafers processed.

[0113] As shown in Figure 10, the stage 101 may further support a covering 400 as another annular member. In this case, the covering 400 may be used as a reference point for rough teaching. Specifically, the inner or outer circumferential end of the covering 400 may be used as the reference point. The covering 400 is an annular member supported by the stage 101 that can surround the outer circumference of the focus ring 107. The covering 400, like the focus ring 107, is positioned approximately concentrically with the mounting portion 104a of the electrostatic chuck 104 in plan view.

[0114] In the above example, the number of reference points detected for rough teaching was two for each digital sensor 300, one on the front side and one on the back side, but it may also be one point on either the front or back side. By using one point on the front side, the amount of movement of the end effector 32c for detecting the reference points used in rough teaching can be minimized. However, by setting the number of reference points to two for each digital sensor 300, the reliability of rough teaching based on the reference points can be ensured, for example, when the focus ring 107 is worn.

[0115] Furthermore, in the above example, the digital sensor 300 was mounted on the end effector 32c of the transport robot 32, but as shown in Figure 11, it may also be mounted on the jig wafer Wj which serves as a jig substrate. This simplifies the structure of the transport robot 32 (specifically the end effector 32c) compared to the case where the digital sensor 300 is mounted on the end effector 32c. The jig wafer Wj, for example, has a main body Wja that has the same shape as the product wafer, and a digital sensor 300 provided on the lower surface of the main body Wja.

[0116] When using the jig wafer Wj, to acquire the aforementioned data D1, the control device 50 moves the end effector 32c while holding the jig wafer Wj, and causes the digital sensor 300 on the jig wafer Wj to perform detection during the movement. The same procedure is followed when acquiring the aforementioned data D2 using the jig wafer Wj.

[0117] The embodiments disclosed herein should be considered in all respects as illustrative and not restrictive. The embodiments described above may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims. For example, the constituent elements of the embodiments described above can be combined in any way. Such any combination will naturally yield the functions and effects of each constituent element in the combination, as well as other functions and effects that will be apparent to those skilled in the art from the description herein.

[0118] Furthermore, the effects described herein are merely descriptive or illustrative and not limiting. In other words, the technology relating to this disclosure may produce other effects that are obvious to those skilled in the art from the description herein, in addition to or instead of the effects described herein.

[0119] Furthermore, the following configuration examples also fall within the technical scope of this disclosure.

[0120] (1) A processing apparatus having a processing chamber for processing a substrate, comprising a stage including a circular mounting portion on which a substrate is placed, processing the substrate placed on the mounting portion, the stage supporting an annular member formed in an annular shape that can surround the substrate placed on the mounting portion, a transport robot for transporting the substrate to the mounting portion comprising an end effector, which holds the substrate with the end effector for transport, the processing apparatus comprising: (A) moving the end effector linearly from a first position through the stage toward a second position together with a digital sensor, (B) detecting a reference point located outside the peripheral edge of the mounting portion based on the digital measurement result from the digital sensor during step (A), (C) performing a first correction control to correct the position of the transport robot relative to the processing chamber based on the reference point, and (D) moving the end effector linearly from the first position through the stage toward a corrected second position together with the digital sensor. A processing apparatus configured to perform the following steps: (E) detecting the inner end of the annular member based on the digital measurement results from the digital sensor during the step (D), and detecting the circumferential end of the mounting portion with respect to the inner end; and (F) performing a second correction control to correct the position of the transport robot relative to the processing chamber based on the detection results of the circumferential end of the mounting portion.(2) A processing apparatus having a processing chamber for processing a substrate, comprising: a stage including a circular mounting portion on which a substrate is placed within the processing chamber; an annular member formed in an annular shape that can surround the substrate placed on the mounting portion; a transport robot that transports the substrate to the mounting portion within the processing chamber by a transport arm having an end effector that holds the substrate; a digital sensor that is movably mounted by the transport arm and detects the position of a detection target by sensing the detection target; and a control unit that corrects the position of the transport robot relative to the mounting portion by controlling the transport arm and the digital sensor, wherein the control unit, in a first extend operation that moves the transport arm within the processing chamber, detects a reference point by sensing an area located outside the peripheral edge of the mounting portion with the digital sensor, and corrects the position of the transport robot relative to the processing chamber based on the reference point, A processing apparatus configured to perform a second correction control in which, after the first correction control, the transport arm is moved within the processing chamber, the position of the peripheral end of the aforementioned placement part is detected by sensing the region from the reference point toward the aforementioned placement part using the digital sensor, and the position of the transport robot relative to the processing chamber is corrected based on the position of the peripheral end. (3) The processing apparatus according to (1) or (2), wherein the reference point is the inner peripheral end of the annular member. (4) The processing apparatus according to (1) or (2), wherein the reference point is the outer peripheral end of the annular member. (5) The processing apparatus according to (1) or (2), wherein the stage supports another annular member formed in an annular shape that can surround the outer circumference of the annular member, and the reference point is the other annular member. (6) The processing apparatus according to any one of (1) to (5), wherein the number of reference points used in the first correction control is one point for each digital sensor. (7) The processing apparatus according to any one of (1) to (5), wherein the number of reference points used in the first correction control is two for each digital sensor. (8) The processing apparatus according to any one of (1) to (7), wherein the digital sensor is mounted on the tip of the end effector.(9) The processing apparatus according to any one of (1) to (7), wherein the digital sensor is mounted on a jig substrate held by the end effector. (10) The processing apparatus according to any one of (1) to (9), wherein the digital sensor is an optical or capacitive digital sensor. (11) A method for correcting a transport robot used in an apparatus having a processing chamber for processing a substrate, wherein the apparatus has a stage including a circular mounting portion on which a substrate is placed, and processes the substrate placed on the mounting portion, the stage supports an annular member formed in an annular shape that can surround the substrate placed on the mounting portion, the transport robot has an end effector, and transports the substrate by holding it with the end effector, and the correction method comprises: (A) moving the end effector together with a digital sensor from a first position through the stage toward a second position, (B) detecting a reference point located outside the peripheral edge of the mounting portion based on the digital measurement result from the digital sensor during step (A), (C) performing a first correction control to correct the position of the transport robot relative to the processing chamber based on the reference point, and (D) moving the end effector together with the digital sensor from the first position through the stage toward a corrected second position. (E) A correction method comprising the steps of detecting the inner end of the annular member based on the digital measurement result by the digital sensor during the step of (D), and detecting the circumferential end of the previously described mounting part with respect to the inner end; and (F) A second correction control step of correcting the position of the transport robot relative to the processing chamber based on the detection result of the circumferential end of the previously described mounting part. (12) The correction method according to (11), wherein the reference point is the inner end of the annular member. (13) The correction method according to (11), wherein the reference point is the outer end of the annular member. (14) The correction method according to (11), wherein the stage supports another annular member formed in an annular shape that can surround the outer circumference of the annular member, and the reference point is the other annular member.(15) The correction method according to any one of (11) to (14), wherein the number of reference points used in the first correction control is one point for each digital sensor. (16) The correction method according to any one of (11) to (14), wherein the number of reference points used in the first correction control is two points for each digital sensor. (17) The correction method according to any one of (11) to (16), wherein the digital sensor is mounted on the tip of the end effector. (18) The correction method according to any one of (11) to (16), wherein the digital sensor is mounted on a jig substrate held by the end effector. (19) The correction method according to any one of (11) to (18), wherein the digital sensor is an optical or capacitive digital sensor.

[0121] 1 Wafer processing system 32 Transfer robot 32a Transfer arm 32c End effector (substrate holding part) 50 Control device 100 Processing chamber 101 Stage 104a Mounting part 107 Focus ring 300 Digital sensor W Wafer

Claims

1. A processing apparatus having a processing chamber for processing a substrate, comprising a stage including a circular mounting section on which a substrate is placed, processing the substrate placed on the mounting section, the stage supporting an annular member formed in an annular shape that can surround the substrate placed on the mounting section, a transport robot for transporting the substrate to the mounting section comprising an end effector, which holds and transports the substrate, the processing apparatus comprising: (A) moving the end effector linearly from a first position through the stage toward a second position together with a digital sensor, (B) detecting a reference point located outside the peripheral edge of the mounting section based on the digital measurement result from the digital sensor during step (A), (C) performing a first correction control to correct the position of the transport robot relative to the processing chamber based on the reference point, and (D) moving the end effector linearly from the first position through the stage toward a corrected second position together with the digital sensor. A processing apparatus configured to perform the following steps: (E) detecting the inner end of the annular member based on the digital measurement results from the digital sensor during the step (D), and detecting the circumferential end of the mounting portion with respect to the inner end; and (F) performing a second correction control to correct the position of the transport robot relative to the processing chamber based on the detection results of the circumferential end of the mounting portion.

2. A processing apparatus having a processing chamber for processing a substrate, comprising: a stage including a circular mounting portion on which a substrate is placed within the processing chamber; an annular member formed in an annular shape that can surround the substrate placed on the mounting portion; a transport robot that transports the substrate to the mounting portion within the processing chamber by a transport arm having an end effector for holding the substrate; a digital sensor that is movably mounted by the transport arm and detects the position of a detection target by sensing the detection target; and a control unit that corrects the position of the transport robot relative to the mounting portion by controlling the transport arm and the digital sensor, wherein the control unit performs a first correction control in which, in a first extend operation that moves the transport arm within the processing chamber, a reference point is detected by sensing an area located outside the peripheral edge of the mounting portion with the digital sensor, and the position of the transport robot relative to the processing chamber is corrected based on the reference point, A processing apparatus configured to perform a second correction control in which, after the first correction control, the transport arm is moved within the processing chamber, the position of the peripheral end of the aforementioned placement part is detected by sensing the region from the reference point toward the aforementioned placement part using the digital sensor, and the position of the transport robot relative to the processing chamber is corrected based on the position of the peripheral end.

3. The apparatus according to claim 1 or 2, wherein the reference point is the inner circumferential end of the annular member.

4. The apparatus according to claim 1 or 2, wherein the reference point is the outer peripheral end of the annular member.

5. The apparatus according to claim 1 or 2, wherein the stage supports another annular member formed in an annular shape that can surround the outer circumference of the annular member, and the reference point is the other annular member.

6. The processing apparatus according to claim 1 or 2, wherein the number of reference points used in the first correction control is one point for each digital sensor.

7. The processing apparatus according to claim 1 or 2, wherein the number of reference points used in the first correction control is two points for each digital sensor.

8. The processing apparatus according to claim 1 or 2, wherein the digital sensor is mounted on the tip of the end effector.

9. The processing apparatus according to claim 1 or 2, wherein the digital sensor is mounted on a jig substrate held by the end effector.

10. The processing apparatus according to claim 1 or 2, wherein the digital sensor is an optical or capacitive digital sensor.

11. A method for correcting a transport robot used in a processing apparatus having a processing chamber for processing a substrate, wherein the processing apparatus has a stage including a circular mounting portion on which a substrate is placed, and processes the substrate placed on the mounting portion, the stage supports an annular member formed in an annular shape that can surround the substrate placed on the mounting portion, the transport robot has an end effector, and transports the substrate by holding it with the end effector, and the correction method comprises: (A) moving the end effector together with a digital sensor from a first position through the stage toward a second position, (B) detecting a reference point located outside the peripheral edge of the mounting portion based on the digital measurement result from the digital sensor during step (A), (C) performing a first correction control to correct the position of the transport robot relative to the processing chamber based on the reference point, and (D) moving the end effector together with the digital sensor from the first position through the stage toward a corrected second position. (E) A step of detecting the inner end of the annular member based on the digital measurement result by the digital sensor during the step (D), and detecting the circumferential end of the mounting part based on the inner end; and (F) A step of performing a second correction control to correct the position of the transport robot relative to the processing chamber based on the detection result of the circumferential end of the mounting part.

12. The correction method according to claim 11, wherein the reference point is the inner circumferential end of the annular member.

13. The correction method according to claim 11, wherein the reference point is the outer peripheral end of the annular member.

14. The correction method according to claim 11, wherein the stage supports another annular member formed in an annular shape that can surround the outer circumference of the annular member, and the reference point is the other annular member.

15. The correction method according to any one of claims 11 to 14, wherein the number of reference points used in the first correction control is one point for each digital sensor.

16. The correction method according to any one of claims 11 to 14, wherein the number of reference points used in the first correction control is two points for each digital sensor.

17. The correction method according to any one of claims 11 to 14, wherein the digital sensor is mounted on the tip of the end effector.

18. The correction method according to any one of claims 11 to 14, wherein the digital sensor is mounted on a jig substrate held by the end effector.

19. The correction method according to any one of claims 11 to 14, wherein the digital sensor is an optical or capacitive digital sensor.

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