Transfer device

Abstract

This transfer device loads and unloads a substrate into and from a processing device that processes the substrate. The transfer device comprises: a body part which includes a load port on which a container that accommodates the substrate is placed, a first opening provided in a front wall, which is a side wall on the load port side, in a position corresponding to the container, a second opening provided in a rear wall, which is a side wall on the processing device side, a transfer robot that transfers the substrate between the first opening and the second opening, and a fan filter unit that supplies a gas from which particles have been filtered out, downward in a transfer space in which the transfer robot is accommodated; and a lower accommodation part provided below the load port. The transfer robot has a horizontal arm configured to be capable of transferring the substrate in a horizontal direction. A standby position of the transfer robot, which is an upper end position of the horizontal arm, is lower than lower end positions of the first opening and the second opening.

Description

Transfer device

[0001] The present disclosure relates to a transfer device.

[0002] Patent Document 1 discloses an EFEM (Equipment Front End Module) device for transferring a workpiece between a processing device side using a transfer robot provided inside a housing.

[0003] Japanese Unexamined Patent Application Publication No. 2023-22095

[0004] The technology according to the present disclosure is a transfer device for loading and unloading a substrate or the like to and from a processing device that processes a substrate, and provides a device that can contribute to reducing the device footprint.

[0005] One aspect of the present disclosure is a transfer device for loading and unloading a substrate to and from a processing device that processes a substrate, including a load port on which a container for accommodating the substrate is placed, a first opening provided at a position corresponding to the container on a front wall which is a side wall on the load port side, a second opening provided on a rear wall which is a side wall on the processing device side, a transfer robot for transferring the substrate between the first opening and the second opening, and a fan filter unit for supplying gas filtered for particles from above to below in a transfer space in which the transfer robot is accommodated, and a lower accommodation portion provided below the load port. The transfer robot has a horizontal arm configured to be able to transfer the substrate in a horizontal direction, and a standby position of the transfer robot, which is the upper end position of the horizontal arm, is below the lower end positions of the first opening and the second opening.

[0006] According to the present disclosure, it is possible to provide a transfer device for loading and unloading a substrate or the like to and from a processing device that processes a substrate, and a device that can contribute to reducing the device footprint.

[0007] This is a plan view showing the schematic of a wafer processing system equipped with a transport device according to the first embodiment. This is a cross-sectional view of the transport device showing the door in the closed position. This is a cross-sectional view of the transport device showing the door in the open position. This is a partially enlarged view of the rear surface of the front wall of the transport device. This is a front view of the transport robot. This is a cross-sectional view of a part of the transport device different from the parts shown in Figures 2 and 3. This is a cross-sectional view for explaining the configuration of the load port. This is a diagram for explaining the dimensions and height positions of the components of the transport device. This is a diagram for explaining the dimensions and height positions of the components of the transport device. This is a top view of the horizontal arm of the transport robot in the home position. This is a partially enlarged cross-sectional view for explaining the schematic of the transport device according to the second embodiment.

[0008] Semiconductor manufacturing equipment includes a processing unit for processing substrates and a transport unit. The transport unit includes an EFEM (Electromagnetic Frequency Electron Enzyme) device that uses a transport robot installed inside the housing to transfer materials such as substrates and consumable parts (e.g., focus rings) between the processing unit and the transport unit, as well as a load port connected to the EFEM device on which containers for substrates and consumable parts are placed. Such transport units have high demands, particularly for reducing the equipment footprint (occupied area) on-site.

[0009] Therefore, the technology disclosed herein provides a transport device for loading and unloading substrates and the like into a processing apparatus for processing substrates, which can contribute to reducing the footprint (occupied area) of the apparatus.

[0010] The conveying device according to this embodiment will be described below with reference to the drawings. In this specification and the drawings, elements having substantially the same functional configuration are denoted by the same reference numerals, and redundant explanations will be omitted. In the drawings, the X direction is the device depth direction, which is the direction in which the front wall and rear wall of the main body 102 of the conveying device 20 described later are aligned; the Y direction is the device width direction, which is the direction in which the multiple load ports 101 described later are aligned; and the Z direction is the vertical direction.

[0011] (First Embodiment) <Wafer Processing System 1> Figure 1 is a schematic plan view of a wafer processing system 1 equipped with a transport device according to the first embodiment.

[0012] As shown in Figure 1, the wafer processing system 1 comprises a processing unit 10 and a transport device 20. The processing unit 10 and the transport device 20 are installed adjacent to each other.

[0013] The processing apparatus 10 is a device for processing a semiconductor wafer (hereinafter referred to as "wafer") W as a substrate, and for example, has a processing module 30 and a vacuum transport module 40.

[0014] Multiple processing modules 30 are provided, for example. Each processing module 30 processes the wafer W under reduced pressure, i.e., a vacuum atmosphere. The processing performed by the processing module 30 includes, for example, film formation, etching, and impurity diffusion. Each processing module 30 also has a vacuum processing chamber 31 in which the above processing is performed on the wafer W in a room under a vacuum atmosphere. Each vacuum processing chamber 31 is connected to a vacuum transport chamber 41 of the vacuum transport module 40, described later, via a gate valve G1.

[0015] The vacuum transport module 40 has a vacuum transport chamber 41 in which the interior is maintained in a vacuum atmosphere. The vacuum transport chamber 41 is configured to be sealable and is formed to have a substantially polygonal shape (a quadrilateral shape in the example shown in the figure) in plan view. The vacuum transport chamber 41, which is connected to each processing module 30, is also connected to the load lock module 50 described later. Specifically, the vacuum transport chamber 41 is connected to the load lock chamber 51 of the load lock module 50 described later via a gate valve (not shown). A transport mechanism 42 for transporting wafers W is provided inside the vacuum transport chamber 41. The vacuum transport module 40 uses the transport mechanism 42 to transport wafers W to and from the vacuum transport chamber 41 to the vacuum processing chamber 31 and the load lock chamber 51.

[0016] Furthermore, the processing apparatus 10 is provided with a load lock module 50 at the end facing the transport device 20. For example, multiple load lock modules 50 are provided. Each load lock module 50 is for transferring wafers W between a vacuum atmosphere and a non-reduced pressure atmosphere, i.e., an atmospheric pressure atmosphere. Each load lock module 50 has a load lock chamber 51 configured to switch between an atmospheric pressure atmosphere and a vacuum atmosphere. The load lock chamber 51 is provided to connect the vacuum transport module 40 and the transport device 20.

[0017] The transfer device 20 is a device that loads and unloads wafers W to the processing device 10. Specifically, the transfer device 20 is configured to transfer wafers W between the FOUP (Front-Opening Unified Pod) 900, which is a container for housing multiple wafers W, and the processing device 10 without exposing the wafers W to the external atmosphere. This transfer device 20 has a load port 101 and a main body 102, which is also called an EFEM device.

[0018] The load port 101 is configured to accommodate the FOUP 900 and is provided in multiple locations (five in the example shown) along the width direction of the device (the X direction in the figure).

[0019] The main body 102 is positioned behind the load port 101 (positive Y-direction in the figure). Specifically, the main body 102 is positioned adjacent to the load port 101. The load lock chamber 51 is connected to the main body 102. Specifically, for example, the load lock chamber 51 is connected to the rear side (positive Y-direction in the figure). The interior of the main body 102 is maintained at atmospheric pressure. Inside the main body 102, there is a transport robot 110 that supports and transports wafers W. This transport robot 110 can transfer wafers W between the FOUP 900 placed on the load port 101 and the load lock chamber 51, etc.

[0020] Furthermore, the wafer processing system 1 is provided with at least one control device C. The control device C processes computer-executable instructions that cause the wafer processing system 1 to perform the various processes described herein. The control device C may be configured to control each element of the wafer processing system 1 to perform the various processes described herein. In one embodiment, some or all of the control device C may be included in the wafer processing system 1. The control device C may include a processing unit, a storage unit, and a communication interface. The control device C is implemented, for example, by a computer. The processing unit may be configured to read a program from the storage unit that provides logic or routines that enable various control operations, and to perform various control operations by executing the read program. This program may be stored in the storage unit in advance, or it may be obtained via a medium M when needed. The obtained program is stored in the storage unit and read from the storage unit and executed by the processing unit. The medium M may be various storage media readable by a computer, or it may be a communication line connected to a communication interface. The storage medium may be temporary or non-temporary. The processing unit may be a CPU (Central Processing Unit), or it may be one or more circuits. The storage unit may include RAM (Random Access Memory), ROM (Read Only Memory), HDD (Hard Disk Drive), SSD (Solid State Drive), or a combination thereof. The communication interface may communicate with the wafer processing system 1 via a communication line such as a LAN (Local Area Network).

[0021] <Wafer Processing> Next, the wafer processing performed by the wafer processing system 1 configured as described above will be explained. The following wafer processing will be performed under the control of the control device C.

[0022] First, the wafer W is removed from the FOUP 900 by the transport robot 110 and loaded into the load lock chamber 51 of the load lock module 50. Subsequently, the load lock chamber 51 is sealed and a vacuum is created.

[0023] Subsequently, the gate valve (not shown) on the vacuum transport chamber 41 side of the load lock chamber 51 is opened, and the wafer W is transported from the load lock chamber 51 to the vacuum transport chamber 41 by the transport mechanism 42.

[0024] Next, after the gate valve is closed, the gate valve G1 for the processing module 30 that performs the desired processing is opened. Subsequently, the wafer W is transported by the transport mechanism 42 into the vacuum processing chamber 31 of the target processing module 30. After that, the gate valve G1 is closed, and the desired processing is performed on the wafer W in the processing module 30.

[0025] After the desired processing is complete, the wafer W is returned from the vacuum processing chamber 31 to the FOUP 900 in the reverse order of its transfer from the FOUP 900 to the vacuum processing chamber 31. This completes the series of wafer processing operations.

[0026] <Conveying device 20> Figures 2 and 3 are cross-sectional views of the conveying device 20, respectively. Figure 2 shows the device when the door (described later) is closed, and Figure 3 shows the device when the door (described later) is open. Figure 4 is a partially enlarged view of the rear surface of the front wall of the conveying device 20. Figure 5 is a front view of the conveying robot 110. Figure 6 is a cross-sectional view of a part of the conveying device 20 that is different from the parts shown in Figures 2 and 3. Figure 7 is a cross-sectional view illustrating the configuration of the load port 101.

[0027] As described above, the transport device 20 has a load port 101 and a main body 102.

[0028] As shown in Figures 2 and 3, the load port 101 is connected to the main body 102 and has a mounting surface 101a on which the FOUP 900 is placed. The load port 101 is connected to the upper side of the front wall of the main body 102, that is, the side wall on the load port 101 side.

[0029] An opening 121 is provided in the front wall of the main body 102, that is, the side wall on the load port 101 side, into which the load port 101 is installed. The opening 121 is covered by a connecting plate 350, which will be described later, that is part of the load port 101. In this embodiment, this connecting plate 350 constitutes the front wall of the main body 102. A first opening 351 is provided in the front wall of the main body 102 at a position corresponding to the FOUP 900. Specifically, the first opening 351 is provided in the connecting plate 350 at a position that can face the FOUP 900 placed on the mounting surface 101a.

[0030] On the other hand, a second opening 122 is provided in the rear wall of the main body 102, that is, the side wall on the processing device 10 side. Specifically, the second opening 122 is provided in the rear wall of the main body 102 at a position corresponding to the load lock chamber 51. More specifically, the second opening 122 is provided in the rear wall of the main body 102 at a vertical position approximately the same as the transfer position within the load lock chamber 51. The transfer position within the load lock chamber 51 is the vertical position of the wafer W when the wafer W is transferred between the load lock chamber 51 and the transport robot 110.

[0031] Furthermore, the transport device 20 has a door 130 and a moving mechanism 140 as a lifting mechanism. The load port 101 may also have a door 130 and a moving mechanism 140.

[0032] Door 130 opens and closes the first opening 351. Door 130 is configured to unlock the lid 901, which is the door of FOUP 900, and to hold the lid 901. With the unlocked lid 901 being held by door 130, the lid 901 is opened when door 130 is opened. During the opening and closing operation of door 130, door 130 moves inside the main body 102 (specifically, inside the transport space S1 described later).

[0033] The moving mechanism 140 has the function of a lifting mechanism, which opens and closes the door 130 and the lid 901 and also raises and lowers them. This moving mechanism 140 includes, for example, an actuator 141, an arm 142, and a lifting body 143.

[0034] The actuator 141 drives the raising and lowering of the door 130. Specifically, the actuator 141 drives the raising and lowering of the lifting body 143 that supports the door 130 via the arm 142. The actuator 141 is installed inside the load port 101 so as to extend vertically (in the Z direction in Figures 2 and 3). The actuator 141 may be an electro-pneumatic actuator such as an air cylinder, or an electromechanical actuator.

[0035] The arms 142 support the door 130 and are driven by the actuator 141. A pair of arms 142 are provided along the width direction of the device (X direction in the figure), as shown in Figure 4, for example. The upper end of each arm 142 is connected to the door 130 which may be located inside the main body 102 (specifically, inside the transport space S1 described later), and the lower end of each arm 142 is connected via a lifting body 143 to the actuator 141 which is located inside the load port 101, i.e., outside the main body 102. In order to allow the arms 142 to be raised and lowered in this connected state, a slit 352 is provided in the connecting plate 350 which constitutes the front wall of the main body 102. That is, the connecting plate 350 which constitutes the front wall of the main body 102 is provided with a slit 352 which is configured so that the arm 142 can be inserted through and through which the arm 142 passes when it is raised and lowered. A slit 352 is provided for each arm 142, for example.

[0036] The lifting body 143 moves up and down along the actuator 141, that is, it moves vertically. The lifting body 143 is installed inside the load port 101.

[0037] The moving mechanism 140 is configured to allow the door 130 to move in the depth direction of the device (the Y direction in Figures 2 and 3). For example, an arm 142 that supports the door 130 is connected to a lifting body 143 so as to be movable in the front-rear direction.

[0038] The moving mechanism 140 also includes an actuator (not shown) that drives the forward and backward movement of the door 130. The moving mechanism 140 is controlled by the control device C, and specifically, the actuator and actuator 141 of the moving mechanism 140 are controlled by the control device C.

[0039] The transport device 20 also includes a door 150 and a lifting mechanism 160. The door 150 opens and closes the second opening 122. The lifting mechanism 160 raises and lowers the door 150 to open and close the second opening 122. The door 150 and the lifting mechanism 160 are installed inside the main body 102 (specifically inside the transport space S1, which will be described later). The lifting mechanism 160 has an actuator (not shown) that drives the raising and lowering of the door 150. The lifting mechanism 160 is controlled by a control device C, and specifically, the actuator of the lifting mechanism 160 is controlled by the control device C.

[0040] As described above, a transport robot 110 for supporting and transporting wafers W is provided inside the main body 102. Specifically, the space inside the main body 102 is divided vertically by a partition wall 124 into a lower transport space S1 and an upper storage space S2, and the transport robot 110 is housed in the transport space S1.

[0041] Specifically, the transport robot 110 transports the wafer W between the first opening 351 and the second opening 122, etc. As shown in Figure 5, this transport robot 110 includes a horizontal arm 170 and a vertical articulated arm 180 as transport arms.

[0042] The horizontal arm 170 is configured to transport wafers W in the horizontal direction. The horizontal arm 170 is, for example, a multi-joint arm and has a fork 171, a first arm 172, and a second arm 173.

[0043] The fork 171 supports the wafer W at its tip. The fork 171 is connected to the tip of the first arm 172 so as to be rotatable about an axis extending vertically (Z direction in the figure) at its base end (hereinafter referred to as the "vertical axis"). The first arm 172 is connected to the tip of the second arm 173 so as to be rotatable about the vertical axis at its base end. The second arm 173 is connected to the tip of the vertical articulated arm 180 so as to be rotatable about the vertical axis.

[0044] The vertical articulated arm 180 is composed of an articulated arm and is configured to be at least able to move up and down the horizontal arm 170. In the present embodiment, the vertical articulated arm 180 is configured to be able to move the horizontal arm in the vertical direction (Z direction in FIG. 5) and the apparatus width direction (X direction in FIG. 5). The vertical articulated arm 180 includes an arm 181 provided so as to be rotatable in the vertical direction and a base 183 connected to the arm 181 and fixed to the bottom surface of the conveyance space S1 (that is, the bottom wall of the main body 102).

[0045] The arm 181 includes, for example, a first arm 181a and a second arm 181b. The horizontal arm 170 is connected to the tip side of the first arm 181a. Also, the first arm 181a is rotatably connected to the tip side of the second arm 181b about an axis (hereinafter, “front-rear axis”) extending in the depth direction of the apparatus at the base end side thereof. The second arm 181b is rotatably connected to the upper end portion of the base 183 about the front-rear axis at the base end side thereof. The base 183 supports the horizontal arm 170 via the first arm 181a and the like. The base 183 has, for example, a pair of plate-like members 184 arranged in the depth direction of the apparatus as shown in FIGS. 2 and 3. The second arm 181b is pivotally supported between the pair of plate-like members 184.

[0046] Each of the plate-like members 184 extends along a vertical plane within the conveyance space S1. Also, each of the plate-like members 184 has a substantially isosceles triangular shape including a pair of long sides 184a extending along a vertical plane and a short side 184b connecting the pair of long sides 184a when viewed in the depth direction of the apparatus.

[0047] Furthermore, the conveyance device 20 has a lower accommodation portion 190 for accommodating various members below the load port 101 connected to the upper side of the front wall of the main body 102 as described above. Also, a third opening 125, which is an inlet / outlet for the wafer W to / from the lower accommodation portion 190, is provided in the front wall of the main body 102.

[0048] The lower accommodation part 190 has a plurality of accommodation parts stacked in the vertical direction, and includes, for example, an upper first accommodation part 191 and a lower second accommodation part 192. The first accommodation part 191 houses a function expansion module composed of at least one of a measurement module for measuring the film on the wafer W, an inspection module for inspecting defects in the wafer W, and an alignment module for adjusting the orientation position of the substrate. The third opening 125 is provided at a position corresponding to the first accommodation part 191 on the front wall of the main body part 102. The second accommodation part 192 houses electrical components. No opening such as the third opening 125 is provided for the second accommodation part 192. That is, among the first accommodation part 191 and the second accommodation part 192, an opening serving as an inlet / outlet for the wafer W is provided only for the first accommodation part 191 located on the upper side.

[0049] The measurement module or inspection module housed in the first accommodation part 191 includes, for example, a mounting table (not shown) configured to be movable horizontally with the wafer W placed thereon, and an imaging part (not shown) that images the wafer W moving horizontally on the mounting table. Instead of or in addition to this module, the measurement module or inspection module may include a module configured to image the wafer W supported by and moved horizontally by the transfer robot 110 inserted therein through the third opening 125 with an imaging part (not shown).

[0050] Also, in the transfer device 20, as shown in FIG. 6, the main body part 102 has a fan filter unit (FFU) 200 as a blower unit. The FFU 200 supplies a purified gas, that is, a gas filtered for particles, from above to below the transfer space S1. The FFU 200 is provided in the aforementioned accommodation space S2 and is supported by, for example, the partition wall 124. An opening 126a is formed in the partition wall 124, and the FFU 200 supplies the purified gas to the transfer space S1 through the opening 126a.

[0051] In this embodiment, one end of a supply pipe 210 for supplying an inert gas such as nitrogen gas to the containment space S2 is connected to the main body 102. A gas supply mechanism 211 is connected to the other end of the supply pipe 210. The gas supply mechanism 211 includes, for example, an inert gas supply source, a switching valve for switching the supply of inert gas on / off, a flow control valve for adjusting the flow rate of inert gas, and so on.

[0052] Because the supply pipe 210 described above is provided, in this embodiment, the FFU 200 supplies purified inert gas to the containment space S2.

[0053] Furthermore, in this embodiment, the transport space S1 and the containment space S2 constitute a circulation path for circulating inert gas inside the main body 102. The circulation path includes the transport space S1 and the containment space S2, as well as a return path 127. Through the circulation path, the purified inert gas is sent downward from the containment space S2 to the transport space S1 via the opening 126a by the FFU 200, reaches the lower end of the transport space S1, and is then returned to the containment space S2 via the return path 127.

[0054] Multiple return passages 127 may be provided. Each return passage 127 is provided to extend vertically. Multiple return passages 127 are provided, for example, along the rear surface of the front wall of the main body 102. Alternatively, or in addition to this, the return passages 127 may be provided along the front surface of the rear wall of the main body 102.

[0055] The inert gas introduced from the transport space S1 into the return path 127 is returned to the containment space S2 through an opening 128 provided in the partition wall 124 at a position corresponding to the return path 127. A fan 129 may be provided at the lower end of the return path 127. The fan 129 draws the inert gas that has reached the lower end of the transport space S1 into the return path 127, sends it upward, and returns it to the containment space S2.

[0056] Furthermore, the main body 102 is provided with an FFU 220 for exhausting gas from the transport space S1. The FFU 220 filters the gas in the transport space S1 and then discharges it outside the main body 102 (specifically, for example, into the cleanroom where the transport device 20 is installed) through the opening 126b.

[0057] As shown in Figure 7, the load port 101 includes a stage 300 and a reciprocating mechanism 310.

[0058] The stage 300 includes a mounting surface 101a for the FOUP 900 that houses the wafer W. Specifically, the upper surface of the stage 300 becomes the mounting surface 101a of the FOUP 900. The stage 300 supports the FOUP 900 on the mounting surface 101a. The stage 300 is provided with a nozzle 301 for supplying gas to the FOUP 900. Specifically, the nozzle 301 supplies an inert gas such as nitrogen gas into the FOUP 900 placed on the stage 300. This nozzle 301 is movable by a reciprocating mechanism 310, and specifically, it is movable together with the stage 300 which moves by the reciprocating mechanism 310.

[0059] The reciprocating mechanism 310 moves the stage 300 forward and backward in the horizontal direction. Specifically, the reciprocating mechanism 310 moves the stage 300 forward and backward relative to the first opening 351. More specifically, the reciprocating mechanism 310 moves the stage 300 between a forward position and a rear position. The forward position is the position where the FOUP 900 is transferred between the FOUP 900 transport device provided externally and the stage 300. The rear position is the position for transferring the wafer W between the FOUP 900 and the main body 102 through the first opening 351.

[0060] The reciprocating mechanism 310 includes, for example, a guide 311 and a support member 312. The guide 311 guides the movement of the stage 300 in the depth direction of the apparatus. Specifically, the guide 311 guides the movement of the support member 312, which supports the stage 300, in the front-rear direction. The support member 312 has the stage 300 connected to its upper end, and its lower end is connected to the guide 311 so as to be movable in the depth direction of the apparatus from which the guide 311 extends.

[0061] Furthermore, the load port 101 includes a connecting plate 350, an isolation cover 320, and a main cover 330.

[0062] The connecting plate 350 is attached to the main body 102 so as to cover the opening 121 when connected to the main body 102. The upper side of the connecting plate 350 extends outwards from above the main cover 330, which will be described later. Above the isolation cover 320 and the main cover 330, which will be described later, the aforementioned first opening 351, which is the loading and unloading port for the wafer W, is provided on the upper side of the connecting plate 350. The lower side of the connecting plate 350 extends so as to cover the rear surface of the isolation cover 320 and the rear surface of the main cover 330. Below the connecting plate 350, the aforementioned slit 352 is provided extending vertically.

[0063] The isolation cover 320 houses the moving mechanism 140. Specifically, the isolation cover 320 forms a housing space S3 for housing the actuator 141 and covers the slit 352. Specifically, the housing space S3 is formed by the connecting plate 350 which constitutes the front wall of the main body 102 and the isolation cover 320, and houses the portion of the moving mechanism 140 located outside the main body 102 (including the actuator 141). In addition, the isolation cover 320 specifically covers the slit 352 from the front. By providing the isolation cover 320, it is possible to suppress the leakage of gas from the transport space S1 of the main body 102 to the outside of the transport device 20.

[0064] The main cover 330 covers the retraction mechanism 310 and the isolation cover 320. In this embodiment, the main cover 330 covers the front wall and top wall of the isolation cover 320, but not the bottom wall. That is, the bottom wall 321 of the isolation cover 320 constitutes a part of the bottom surface of the load port 101.

[0065] The cover 330 forms a housing space S4 for housing the retraction mechanism 310 between the connecting plate 350 and the isolation cover 320 that constitute the front wall of the main body 102. The aforementioned nozzle 301 protrudes from the lower surface of the stage 300, with its lower part protruding into the housing space S4.

[0066] <Vertical Position and Dimensions of Components of the Conveying Device 20> Figures 8 and 9 are diagrams illustrating the vertical position and dimensions of the components of the conveying device 20. In Figures 8 and 9, the conveying robot 110 is located in its home position. Figure 10 is a top view of the horizontal arm 170 of the conveying robot 110 in its home position. The home position HP1 of the conveying robot 110 is a standby position and consists of the upper end position of the horizontal arm 170.

[0067] As shown in Figure 8, the home position HP1 of the transport robot 110 is below the lower end positions of the first opening 351 and the second opening 122. Specifically, the home position HP1 of the transport robot 110 is below the lower end positions of the first opening 351 and the second opening 122, respectively, and above the lower end position of the load port 101.

[0068] Furthermore, the transport robot 110 has a predetermined operating range MR in the vertical direction (Z direction in the figure). The operating range MR is the range through which the horizontal arm 170 can pass during the transport of the wafer W by the transport robot 110, and more specifically, the range through which the upper end position of the horizontal arm 170 can pass during the transport. The lower limit of the operating range MR of the transport robot 110 is defined by the uppermost housing unit among the multiple housing units of the transport device 20. Specifically, the lower limit of the operating range MR is defined by the first housing unit 191, and more specifically, by the third opening 125 corresponding to the first housing unit 191. The upper limit of the operating range MR is defined by the first opening 351, and more specifically, by the upper end position of the first opening 351.

[0069] Furthermore, the upper end position of the base 183 of the vertical articulated arm 180 of the transport robot 110 is higher than the upper end position of the lower housing section 190. Specifically, the upper end position of the base 183 is higher than the upper end position of the first housing section 191.

[0070] As mentioned above, the load port 101 is connected to the upper side of the front wall of the main body 102. In addition, as shown in Figure 8, the vertical dimension of the load port 101, which is the height and width L1, is defined by the actuator 141 of the door 130's moving mechanism 140. That is, the load port 101 is connected to a predetermined upper range of the front wall of the main body 102.

[0071] Specifically, the height and width L1 of the load port 101 is 20-30% of the height and width L2 of the transport space S1, and the lower end of the load port 101 is higher than the position P1 which is 40% of the length L2 from the lower end of the transport space S1. In other words, below the load port 101, a space equivalent to 40% of the height and width L2 of the transport space S1 is reserved for the storage section 192.

[0072] The height and width L3 of the housing section 192 (specifically, the distance from the upper end position of the first housing section 191 to the lower end position of the second housing section 192) is 40% to 50% of the height and width L2 of the transport space S1. Also, the height and width L4 of the first opening 351 is 10% to 20% of the height and width L2 of the transport space S1. The height and width L5 of the base 183 of the vertical articulated arm 180 of the transport robot 110 shown in Figure 9 is 50% or more of the height and width L2 of the transport space S1.

[0073] Furthermore, as shown in Figure 7 above, in the load port 101, the upper part of the actuator 141 of the moving mechanism 140 is positioned so as to overlap with the reciprocating mechanism 310 in the vertical direction (Z direction in the figure). Also, the reciprocating mechanism 310 and the isolation cover 320 partially overlap with each other in the vertical direction (Z direction in the figure). Specifically, the lower part of the guide 311 and support member 312 of the reciprocating mechanism 310 and the upper part of the isolation cover 320 are in approximately the same vertical position, and the top surface of the isolation cover 320 is positioned above the bottom surface of the guide 311. The upper part of the isolation cover 320 that overlaps with the reciprocating mechanism 310 in the vertical direction has a recess 322 that is recessed to the rear side (positive Y direction in the figure).

[0074] The side of the isolation cover 320's top wall facing the slit 352 is located above the upper end of the slit 352, and the side of the isolation cover 320's bottom wall facing the slit 352 is located below the lower end of the slit 352. The isolation cover 320 is provided such that a gap G is formed between the top wall of the isolation cover 320 and the nozzle 301. Specifically, the isolation cover 320 is provided such that a predetermined vertical gap G is formed between the top surface of the isolation cover 320 and the nozzle 301. This is to prevent interference between the isolation cover 320 and the nozzle 301 when the nozzle 301 moves in the front-rear direction together with the stage 300. The gap G is, for example, 10 mm to 20 mm. The gap between the bottom wall of the isolation cover 320 and the lower end of the actuator 141 is approximately zero. Also, the lower end surface of the lifting body 143 when it has descended to its lowest point and the lower end surface of the actuator 141 are approximately coincident.

[0075] When the lifting body 143 has descended to its lowest position, that is, when the door 130 has descended to its lowest position and is in the open position, the upper end of the door 130 is positioned slightly below the mounting surface 101a. This is to prevent the door 130 from interfering with the horizontal arm 170, which is inserted into the FOUP 900 through the first opening 351 on which the door 130 is provided, while minimizing the length of the actuator 141.

[0076] As shown in Figure 8, the aspect ratio (specifically L2 / D1) of the transport space S1 of the main body 102, which consists of the height width L2 and the depth width D1 which is the dimension in the depth direction of the device, is 3 to 5.

[0077] Furthermore, the depth width D2 of the base 183 of the vertical articulated arm 180 of the transport robot 110 is 50% to 80% of the depth width D1 of the transport space S1.

[0078] As mentioned above, since the load port 101 is connected to the upper side of the front wall of the main body 102, the first opening 351 is located on the upper side of the main body 102. That is, the first opening 351 is offset upward. Specifically, as shown in Figure 9, for example, the lower end of the first opening 351 is located above the midpoint P2 in the vertical direction of the transport space S1.

[0079] The vertical position of the second opening 122 is located between the upper and lower ends of the first opening 351. That is, the transport device 20 is provided with a horizontal transport zone Z that allows the transfer of wafers W between the FOUP 900 and the load lock chamber 51 to be performed solely by transport in a substantially horizontal direction. In this embodiment, the horizontal transport zone is the range through which the upper end of the horizontal arm 170 of the transport robot 110 can pass when directly transferring wafers W between the first opening 351 and the second opening 122. The vertical position of the horizontal transport zone Z is defined by the first opening 351; specifically, the upper end of the horizontal transport zone Z is defined by the upper end of the first opening 351, and the lower end of the horizontal transport zone Z is defined by the lower end of the first opening 351.

[0080] The vertical positional relationship between the first opening 351 and the second opening 122 may be such that the vertical center position of the first opening 351 and the vertical center position of the second opening 122 substantially coincide. Specifically, the vertical position of the 13th wafer W in the FOUP 900 placed on the mounting surface 101a may coincide with the vertical position of the wafer support surface in the load lock chamber 51 during wafer transfer. This makes it possible to optimize the wafer W transport throughput by the transport robot 110 between the first opening 351 and the second opening 122.

[0081] As shown in Figure 8, the height and width L6 of the upper space, which is the portion of the transport space S1 above the upper end of the first opening 351, is 20% or more of the height and width L2 of the transport space S1. This is because if the height and width L6 were less than 20% of the height and width L2, it would be impossible to make the vertical position of the first opening 351 approximately the same as that of the second opening 122, making it impossible to form the horizontal transport zone Z, or causing the main body 102 to become larger in the vertical direction.

[0082] Further explanation will be given regarding the home position of the transport robot 110. As shown in Figure 9, the home position HP1 of the transport robot 110 is higher than the midpoint P3 in the vertical direction of the load port 101. Note that the home position HP1 of the transport robot 110 may be lower than the vertical position of the mounting surface 101a.

[0083] The home position HP2 of the vertical articulated arm 180 of the transport robot 110 is a standby position and corresponds to the upper end position of the vertical articulated arm 180. The home position HP2 of the vertical articulated arm 180 does not substantially overlap with the moving mechanism 140 that opens and closes the door 130 in the vertical direction. Specifically, the home position HP2 of the vertical articulated arm 180 of the transport robot 110 does not substantially overlap with the portion of the moving mechanism 140 located within the transport space S1 in the vertical direction. More specifically, when the door 130 is closed, the home position HP2 of the vertical articulated arm 180 does not overlap at all with the portion of the moving mechanism 140 located within the transport space S1 in the vertical direction. However, when the door 130 is open, the home position HP2 of the vertical articulated arm 180 overlaps vertically with the lower end of the portion of the moving mechanism 140 located within the transport space S1.

[0084] Furthermore, as shown in Figure 10, in the horizontal arm 170 of the transport robot 110 located in the home position, the first arm 172 and the second arm 173 are oriented in the same direction, specifically extending along the depth direction of the device (the Y direction in the figure). However, in the horizontal arm 170 of the transport robot 110 located in the home position, the fork 171 is oriented differently from the first arm 172 and the second arm 173, specifically not extending along the front-rear direction. This makes it possible to minimize the dimensions of the horizontal arm in the home position in the depth direction of the device.

[0085] <Main Effects of This Embodiment> As described above, in this embodiment, since the conveying device 20 is equipped with a lower storage section 190 as described above, the capacity to accommodate components is improved. In other words, the component storage space outside the conveying space S1 can be increased without expanding the storage section above the conveying device 20. When considering further reduction of the footprint of the conveying device, the component storage capacity within the conveying space S1 decreases, so it is necessary to improve the component storage capacity outside the conveying space S1. In that case, if the component storage section above the conveying device 20 is expanded, it will not be possible to meet the height restriction conditions for installation on the manufacturing line, and the footprint cannot be reduced in substance. However, with the conveying device 20 according to this embodiment, the number of components that need to be placed in the conveying space S1 can be reduced without expanding the storage section above the conveying device 20, thus contributing to a reduction in the footprint of the conveying device 20. Furthermore, since the conveying device 20 according to this embodiment is equipped with a lower storage section 190 below the load port 101, the position of the load port 101 can be offset upward. As a result, the first opening 351, which is provided in correspondence with the FOUP 900 placed on the load port 101, and the horizontal transport zone Z defined by the first opening 351 can be positioned closer to the FFU 200. As a result, the controllability of the airflow in the horizontal transport zone Z by the FFU 200 is improved. Generally, the cleanliness of the transport space S1 is controlled by the downflow air (downward airflow) formed by the FFU 200. In order to prevent particles from adhering to the transported material (wafer), which would cause a significant decrease in productivity (in order to satisfy the desired cleanliness), it is necessary to form the desired airflow in the space between the FOUP 900 and the load lock chamber 51 within the transport space S1 where the wafer is transported. Therefore, if the lower housing section 190 is not provided, the footprint of the transport device 20 is not substantially reduced, and the vertical position of the load port 101 is not offset upward. In such cases, it is necessary to form the desired airflow by the FFU 200 in the transport space, which is a space with a larger volume, and in the space region further down.As a result, the higher the cleanliness requirement, the greater the airflow control required of the FFU 200, which necessitates a larger fan for the FFU. In contrast, the conveying device 20 in this embodiment includes a lower housing section 190 below the load port 101, allowing for a substantially reduced footprint and enabling the load port 101 to be offset upward. This allows the first opening 351 and the horizontal conveying zone Z defined by the first opening 351 to be positioned closer to the FFU 200, making the spatial area requiring airflow control by the FFU 200 smaller and closer to the FFU 200. As a result, the airflow controllability of the horizontal conveying zone Z in the FFU 200 is improved, effectively preventing productivity reductions caused by particles, and enabling the miniaturization of the fan mounted on the FFU 200, ultimately leading to further miniaturization of the conveying device 20. Furthermore, in the conveying device 20, the home position HP1 of the conveying robot 110 is below the lower end positions of the first opening 351 and the second opening 122. Therefore, the conveying robot 110, which is a particle source, is not permanently located within the horizontal conveying zone Z where airflow controllability is improved. Consequently, the required accuracy of the clean level can be suppressed in the horizontal conveying zone Z where airflow controllability is improved, and the airflow rate necessary to meet a predetermined clean level can be optimized. Thus, this embodiment contributes to further miniaturization of the FFU 200, and consequently, to miniaturization of the conveying device 20.

[0086] Furthermore, in this embodiment, as described above, by providing the lower housing section 190, the position of the load port 101 is offset upward, so that the first opening 351, which is provided in correspondence with the FOUP 900 placed on the load port 101, and the horizontal transport zone Z defined by the first opening 351 can be positioned closer to the FFU 200. However, as a result, the upper limit position of the required operating range MR in the vertical direction of the transport robot 110 becomes higher, which may reduce the throughput of the transport robot 110. In contrast, in this embodiment, the housing sections constituting the lower housing section 190 are stacked in the vertical direction, and the lower limit position of the required operating range MR is defined by the uppermost housing section. This optimizes the required operating range MR and contributes to reducing throughput. In other words, according to this embodiment, it is possible to provide a transport device that can contribute not only to reducing the footprint of the transport device 20 but also to reducing throughput.

[0087] In a transport device 20 equipped with a lower storage section 190, the required transport range may expand vertically. In this case, if the vertical position of the horizontal arm of the transport robot is controlled by a cylinder mechanism, there is a risk that the transport robot will become larger due to the increased size of the cylinder mechanism. In contrast, as in this embodiment, by including a vertical articulated arm 180 configured to raise and lower the horizontal arm 170 of the transport robot 110, it is possible to accommodate the expanded required transport range in the vertical direction without increasing the size of the transport robot 110.

[0088] Furthermore, in this embodiment, the vertical articulated arm 180 has an arm 181 that is rotatable in the vertical direction and a base 183 that is connected to the arm 181 and fixed to the bottom surface of the transport space S1. The upper end position of the base 183 is higher than the upper end position of the lower housing 190. Therefore, the arm 181 can be made sufficiently long, so even when the horizontal transport zone Z is located above, the vertical range of motion of the transport robot 110 can be secured while suppressing an increase in the number of links of the arm 181 (i.e., suppressing an increase in the size of the transport robot 110 in the depth direction of the device due to an increase in the number of links).

[0089] Furthermore, in this embodiment, as described above, the height and width L5 of the base 183 is 50% or more of the height and width L2 of the transport space S1. This makes it possible to maximize the length of the first arm 181a and other components that constitute the arm 181 connectable to the base 183, and to reduce the number of links in the arm 181, thereby minimizing the dimensions of the transport robot 110 in the depth direction of the device. Thus, it can contribute to further reducing the footprint of the transport device 20.

[0090] Furthermore, in this embodiment, the depth width D2 of the base 183 is 50% to 80% of the depth width D1 of the transport space S1. This makes it possible to minimize the dimensions of the transport robot 110 in the depth direction of the device. Thus, it can contribute to further reducing the footprint of the transport device 20.

[0091] In this embodiment, as described above, the plate-shaped member 184 constituting the base 183 is a substantially isosceles triangle with a pair of long sides. Therefore, the influence on the airflow due to downflow from the FFU 200 caused by the shape of the transport robot 110 can be minimized, and the airflow in the transport space S1 can be stabilized. This can contribute to reducing the rate of defective products caused by particles, i.e., improving productivity.

[0092] Furthermore, in this embodiment, the lower housing section 190 includes an upper first housing section 191 and a lower second housing section 192, and a third opening 125 is provided on the front wall of the main body section 102 at a position corresponding to the first housing section 191. Therefore, a function expansion module that involves operation of the wafer W, which was previously housed in the transport space or in a portion protruding from the transport space in the width direction of the device in conventional transport devices, can be housed in the first housing section 191 which overlaps with the load port 101 in a plan view. Accordingly, according to this embodiment, it is no longer necessary to house the function expansion module in the transport space or in a portion protruding from the transport space in the width direction of the device, thus contributing to a reduction in the footprint of the transport device 20 while ensuring functionality expandability.

[0093] In conventional conveying systems, it was difficult to achieve both on-site installation and functional expandability when reducing the footprint. In contrast, in this embodiment, the load port 101 is connected to the upper side of the front wall of the main body 102, and the height and width L1 of the load port 101 are defined by the actuator 141 of the door 130's moving mechanism 140. Therefore, a lower storage section 190 can be provided below the load port 101. The lower storage section 190 can accommodate components (e.g., electrical components) that were previously housed above the main body 102 in conventional conveying systems. Thus, according to this embodiment, the height and width of the conveying system 20 can be reduced. Consequently, there is no need to divide the conveying system 20 vertically for transport, and there is no need to assemble the divided parts, thus suppressing the length of construction time and cost increase during system startup. Furthermore, since a functional expansion module can be housed in the lower storage section 190, this embodiment ensures the functional expandability of the conveying system 20. Moreover, it is possible to suppress the increase in footprint required to house the functional expansion module, etc. In other words, according to this embodiment, it is possible to provide a transport device 20 that can ensure on-site installation and functional expandability even when the footprint is reduced.

[0094] Furthermore, in this embodiment, a vertical articulated arm 180 is used as a module to move the horizontal arm 170 of the transport robot 110 in the vertical direction and the device width direction. Therefore, compared to the case where a module is used that moves the horizontal arm in the vertical direction and the device width direction by a lifting body configured to move along a rail extending in the device width direction instead of the vertical articulated arm 180, the width of the main body 102 in the device depth direction can be shortened. In other words, according to this embodiment, because a vertical articulated arm 180 is used, the footprint of the transport device 20 in the front-rear direction can be reduced.

[0095] Furthermore, in the load port 101 according to this embodiment, as described above, the upper part of the actuator 141 of the moving mechanism 140 overlaps with the reciprocating mechanism 310 in the vertical direction. Therefore, a load port with a small height and width L1 can be provided. In other words, the height and width L1 of the load port 101 can be reduced. Consequently, the space height for installing the lower storage section 190 can be maximized, and as a result, the storage space provided by the lower storage section 190 can be made even larger.

[0096] Furthermore, in this embodiment, as described above, the reciprocating mechanism 310 and the isolation cover 320 partially overlap each other in the vertical direction in the load port 101. Therefore, the height width L1 of the load port 101 can be reduced. Consequently, the space height for installing the lower storage section 190 can be maximized, and as a result, the storage space provided by the lower storage section 190 can be further enlarged. Also, in this embodiment, as described above, the upper part of the isolation cover 320 that overlaps with the reciprocating mechanism 310 in the vertical direction has a recess that is recessed on the rear side (the positive Y-direction side in the figure). Therefore, the depth width of the load port 101 can be reduced.

[0097] Furthermore, in this embodiment, as described above, the main cover 330 covers the front wall and top wall of the isolation cover 320, but not the bottom wall. Therefore, the height and width L1 of the load port 101 can be reduced compared to the case where the main cover 330 also covers the bottom wall. Also, the bottom wall 321 of the isolation cover 320 constitutes a part of the bottom surface of the load port 101. Therefore, according to this embodiment, the height and width L1 of the load port 101 can be reduced compared to the case where the bottom surface of the isolation cover 320 is covered by the main cover 330 and the bottom surface of the main cover 330 forms the bottom surface of the load port 101. Consequently, the height and width of the lower storage section 190 can be maximized, and the storage space provided by the lower storage section 190 can be further enlarged.

[0098] Furthermore, in this embodiment, the vertical position of the second opening 122 relative to the load lock chamber 51 is between the upper and lower ends of the first opening 351 relative to the FOUP 900, and the aforementioned horizontal transport zone Z is provided. Therefore, throughput can be improved, contributing to increased productivity. Moreover, since the first opening 351 is located on the upper side of the main body 102, the horizontal transport zone Z is provided in the vicinity of the FFU 200, i.e., the vicinity of the FFU, where the airflow velocity is high and stable (i.e., the in-plane uniformity of the airflow is good). In addition, the home position HP1 of the transport robot 110 is lower than the lower end of the first opening 351. Therefore, the horizontal arm 170 does not enter during operations other than when transporting wafers W to the FOUP 900 or the load lock chamber 51 (for example, when transporting wafers W to the aforementioned function expansion module), thus improving the airflow stability in the space between the FOUP 900 and the load lock chamber 51. A stable airflow prevents particle churning, thus suppressing particle adhesion to the wafer W. Therefore, according to this embodiment, the risk of contamination of the wafer W within the FOUP 900 by particles can be reduced, contributing to a reduction in the rate of defective products and, i.e., improved productivity. However, if a horizontal transport zone Z is provided in the region near the FFU where the airflow velocity is high and stable, the airflow stability is significantly impaired when the home position HP1 of the transport robot 110, which has a complex shape, overlaps with the horizontal transport zone Z due to the high flow velocity in that region. This is a novel problem that was discovered when utilizing the upper region of the transport space S1 as the horizontal transport zone Z.

[0099] Furthermore, in this embodiment, a horizontal transport zone Z is provided as described above. Therefore, the time that wafers W pass through an area lower than the door 150 lifting mechanism 160, which is a source of particle generation, can be reduced, thereby contributing to improved productivity.

[0100] Furthermore, in this embodiment, the door 130's moving mechanism 140, which is a major cause of winding within the transport device 20, and the home position HP2 of the vertical articulated arm 180 of the transport robot 110 do not substantially overlap in the vertical direction. Therefore, the generation of winding airflow can be suppressed as much as possible. Consequently, the factors contributing to the risk of particle generation within the transport space S1 can be diversified, contributing to improved productivity.

[0101] Furthermore, in this embodiment, as described above, the lower limit of the required operating range MR of the transport robot 110 is defined by the third opening 125, which is the loading / unloading exit for the first housing section 191, located above the second housing section 192 and housing the function expansion module. In other words, while accommodating the expandability of functions such as wafer measurement and inspection, access of the horizontal arm 170 of the transport robot 110 to the bottom of the main body section 102, where particles may accumulate and contamination may occur due to winding, is restricted. Therefore, the particle generation rate can be suppressed, contributing to improved productivity. In addition, transport accuracy may be more stable when transporting above the bottom of the main body section 102 compared to transporting to the bottom. By housing the function expansion module in the upper first housing section 191, the transport accuracy for the module can be stabilized compared to when it is housed in the lower second housing section 192. In other words, defining the lower limit of the required operating range MR of the transport robot 110 by the third opening 125, which is the loading / unloading exit for the first housing section 191, is preferable from the viewpoint of the operability of the transport robot 110.

[0102] <Modification of the First Embodiment> In the above example, an inert gas was circulated inside the main body 102, but instead, dry air may be circulated. In this case, for example, dry air is supplied from the gas supply mechanism 211 to the containment space S2 via the supply pipe 210.

[0103] (Second Embodiment) <Conveying Device 20A> Figure 11 is a partially enlarged cross-sectional view illustrating the outline of the conveying device according to the second embodiment. As shown in Figure 11, the conveying device 20A according to this embodiment has a main body 102A having a particle collection mechanism 400 that extends vertically below the first opening 351 on the conveying space S1 side of its front wall. The particle collection mechanism 400 collects particles generated around the first opening 351, and for example, collects particles generated from the door 130 and the moving mechanism 140 when the door 130 is raised and lowered. The particle collection mechanism 400 includes a rear cover 410 and an exhaust fan 420.

[0104] The rear cover 410 is provided below the first opening 351 in the transport space S1 of the main body 102A. The rear cover 410 is a bottomed member that covers the slit 352 from the rear (positive side in the Y direction in the figure). This rear cover 410 is configured to accommodate the lowered door 130, lid 901, and arm 142 of the moving mechanism 140. Specifically, the rear cover 410 is configured to accommodate the lowered door 130, lid 901, and arm 142 between the connecting plate 350 that constitutes the front wall of the main body 102. The rear cover 410 may also cover the lower part of the opening 121 of the main body 102 and the slit 352 together. By providing such a rear cover 410, even if particles are generated from the door 130, lid 901, and moving mechanism 140 when the door 130 is raised or lowered, it is possible to suppress the adhesion of these particles to the wafer W. Furthermore, by providing the rear cover 410, it is possible to suppress particles that fall from the FOUP 900 from reaching further downwards. Therefore, it is possible to suppress particles that fall from the FOUP 900 from being swept up from the bottom of the main body 102A to the wafer transport area of ​​the wafer W.

[0105] The upper end position of the rear cover 410 coincides, for example, with the upper end position of the door 130 when it is lowered to its lowest point. This makes it possible to suppress the influence of the rear cover 410 on the first opening 351, even when the first opening 351 is offset upward and located in the vicinity of the FFU.

[0106] The lower vertical end, or bottom wall, of the rear cover 410 has an exhaust port 411 for exhausting gas from the space S5 covered by the rear cover 410, and an exhaust fan 420 is provided at the exhaust port 411. One end of an exhaust duct 430 is connected to the exhaust port 411. The other end of the exhaust duct opens near an FFU 220 (see Figure 6) that discharges gas from the transport space S1 to the outside of the main body 102A.

[0107] The exhaust from the exhaust fan 420 is discharged to the outside of the transport device 20 via the exhaust duct 430 and FFU 220, without passing through the transport space S1. By providing such an exhaust fan 420, an airflow is created that flows into the space S5 from the opening between the upper end of the rear cover 410 and the connecting plate 350 that constitutes the front wall of the main body 102, and is discharged from the exhaust port 411. Therefore, particles present near the opening can be collected more reliably. In addition, it is possible to suppress particles in space S5 from reaching the wafer transport area through the opening.

[0108] In this embodiment as well, the home position HP1 of the transport robot 110 is below the lower end positions of the first opening 351 and the second opening 122, and the transport robot 110, which is a particle source, is not permanently located within the horizontal transport zone Z. Furthermore, in this embodiment, the home position HP1 of the transport robot 110 overlaps with the particle collection mechanism 400 in the vertical direction (Z direction in the figure). Specifically, the home position HP1 of the transport robot 110 is located below the upper end position of the rear cover 410 and above the lower end position of the rear cover 410.

[0109] Incidentally, when the door 130 is opened and closed, i.e., when it is raised and lowered, particles that can be supplied from within the FOUP 900 are not collected by the particle collection mechanism 400, and there is a risk that they will be diffused upward within the transport space S1. In contrast, as described above, in this embodiment, the transport robot 110, which is the particle source, is not permanently located within the horizontal transport zone Z, and the home position HP1 of the transport robot 110 is overlapped vertically with the particle collection mechanism 400. Therefore, in the downflow from the FFU 200, the transport robot 110 acts as a flow resistance, strengthening the airflow toward the particle collection mechanism 400. This contributes to reducing the rate of defective products caused by particles, i.e., improving yield. Although not shown in the figures, in this embodiment as well, the transport device 20A is equipped with a lower storage section 190. Therefore, this contributes to reducing the footprint of the transport device 20A. Thus, according to this embodiment, it is possible to contribute to both footprint reduction and yield improvement.

[0110] When the atmosphere inside the cleanroom where the transport device 20A is installed is taken into the containment space S2, and this atmosphere is supplied to the transport space S1 via the FFU 200, corrosive gases may be generated from the wafer W. As a result, for example, residual gas on the wafer W processed by the processing device 10 may react with moisture in the atmosphere to generate corrosive gases.

[0111] By providing a rear cover 410 with an exhaust fan 420, it is possible to suppress the leakage of corrosive gases into the load port 101 through the slit 352. Furthermore, by providing an isolation cover 320, it is possible to reduce the number of components of the load port 101 that are exposed to corrosive gases, and to improve the exhaust efficiency of corrosive gases in the space S5 by the exhaust fan 420. Moreover, by providing a rear cover 410 with an exhaust fan 420 together with the isolation cover 320, it is possible to suppress the accumulation of corrosive gases in the containment space S3 formed by the isolation cover 320.

[0112] The load port 101 may have an air inlet 440 for supplying an inert gas to the containment space S3 covered by the isolation cover 320. This allows the containment space S3 to be under positive pressure relative to the space S5 covered by the rear cover 410, thereby suppressing the entry of corrosive gases into the containment space S3. Consequently, corrosion of components within the containment space S3 can be suppressed.

[0113] Multiple air inlets 440 may be provided. In this case, the air inlets 440 may be arranged vertically, or in addition to or instead of vertically, the air inlets 440 may be arranged in the width direction of the device. An inert gas is discharged from each air inlet 440, for example, backward and horizontally.

[0114] Furthermore, reducing the number of parts exposed to corrosive gases can reduce the number of parts that require corrosion-resistant treatment, thereby lowering costs.

[0115] <Other Modifications> As in the first embodiment and its modifications, even when circulating inert gas or dry air, a rear cover 410 may be provided on the conveying device as in the second embodiment. Also, in the above examples, no components are housed in the space above the housing space S2 of the FFU 200, but components may be housed thereto to the extent that it does not impair on-site installation.

[0116] The embodiments disclosed herein should be considered in all respects as illustrative and not restrictive. The embodiments described above may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims. For example, the constituent elements of the embodiments described above can be combined in any way. Such any combination will naturally yield the functions and effects of each constituent element in the combination, as well as other functions and effects that will be apparent to those skilled in the art from the description herein.

[0117] Furthermore, the effects described herein are merely descriptive or illustrative and not limiting. In other words, the technology relating to this disclosure may produce other effects that are obvious to those skilled in the art from the description herein, in addition to or instead of the effects described herein.

[0118] The following configuration examples also fall within the technical scope of this disclosure: (1) A transport device for loading and unloading substrates to and from a processing apparatus for processing substrates, comprising: a load port on which a container for containing substrates is placed; a main body having a first opening provided in the front wall, which is the side wall on the load port side, at a position corresponding to the container, a second opening provided in the rear wall, which is the side wall on the processing apparatus side, a transport robot for transporting the substrates between the first and second openings, and a fan filter unit that supplies a gas filtered of particles from above to below the transport space in which the transport robot is housed; and a lower housing section provided below the load port, wherein the transport robot has a horizontal arm configured to transport the substrates in the horizontal direction, and the standby position of the transport robot, which is the upper end position of the horizontal arm, is lower than the lower end positions of the first and second openings. (2) A transport device for loading and unloading substrates to and from a processing device for processing substrates, comprising: a load port on which a container for containing substrates is placed; a main body having a front wall which is the side wall on the load port side, at a position corresponding to the container, a second opening provided in the rear wall which is the side wall on the processing device side, a transport robot for transporting the substrates between the first opening and the second opening, and a fan filter unit which supplies a gas filtered of particles from above to below the transport space in which the transport robot is housed; and a lower housing provided below the load port, wherein the main body has a particle collection mechanism extending vertically below the first opening on the transport space side of the front wall, the transport robot has a horizontal arm configured to transport the substrates horizontally, and the standby position of the transport robot, which is the upper end position of the horizontal arm, is provided to overlap vertically with the particle collection mechanism.(3) A transport device for loading and unloading substrates to and from a processing device for processing substrates, comprising: a load port on which a container for containing substrates is placed; a main body having a first opening provided in the front wall, which is the side wall on the load port side, at a position corresponding to the container, a second opening provided in the rear wall, which is the side wall on the processing device side, a transport robot for transporting the substrates between the first opening and the second opening, and a fan filter unit for supplying a gas filtered of particles from above to below the transport space in which the transport robot is housed; and a lower storage section below the load port in which a plurality of storage sections are stacked vertically, wherein the transport robot has a predetermined range of motion required in the vertical direction, and the lower limit of the range of motion required is defined by the uppermost storage section among the plurality of storage sections. (4) The transport device according to (1) or (2), wherein the transport robot includes a vertical articulated arm configured to be able to move up and down the horizontal arm. (5) The conveying device according to (4), wherein the vertical articulated arm comprises an arm that is rotatable in the vertical direction and a base that is connected to the arm and fixed to the bottom surface of the conveying space, and the upper end position of the base is higher than the upper end position of the lower housing. (6) The conveying device according to (5), wherein the vertical dimension of the base is 50% or more of the vertical dimension of the conveying space. (7) The conveying device according to (5) or (6), wherein the dimension of the base in the device depth direction, which is from the front wall toward the rear wall, is 50% or more and 80% or less of the device depth direction dimension of the conveying space. (8) The conveying device according to any one of (5) to (7), wherein the base includes a pair of plate-shaped members that extend along a vertical plane in the conveying space, and the plate-shaped members are substantially isosceles triangular in shape, including a pair of long sides that extend along a vertical plane and a short side that connects the pair of long sides. (9) The conveying device according to any one of (1) to (8), wherein the lower storage section includes an upper first storage section and a lower second storage section. (10) The conveying device according to (1), wherein a third opening is provided in the front wall at a position corresponding to the first storage section.(11) The transport device according to (10), wherein the first housing contains a function expansion module comprising at least one of a measurement module for performing measurements on a film on a substrate, an inspection module for inspecting defects in the substrate, and an alignment module for adjusting the orientation position of the substrate, and the transport robot transports the substrate to the function expansion module through the third opening. (12) The transport device according to any one of (1) to (11), wherein the aspect ratio of the transport space of the main body, consisting of the vertical dimension and the device depth dimension, which is the direction from the front wall to the rear wall, is 3 to 5.

[0119] 10 Processing unit 20, 20A Transfer device 101 Load port 101a Mounting surface 102, 102A Main body 110 Transfer robot 170 Horizontal arm 122 Second opening 190 Lower housing section 200 FFU 351 First opening 400 Particle collection mechanism 900 FOUP W Wafer

Claims

A transport device for loading and unloading substrates into and from a processing device that processes substrates, A load port on which a container for housing the circuit board is placed, A main body comprising: a front wall which is the side wall on the load port side, having a first opening provided at a position corresponding to the container; a rear wall which is the side wall on the processing apparatus side; a transport robot for transporting the substrate between the first opening and the second opening; and a fan filter unit that supplies a gas filtered of particles from above to below the transport space in which the transport robot is housed; It comprises a lower housing section provided below the load port, The transport robot has a horizontal arm configured to transport the substrate in the horizontal direction, A transport device in which the standby position of the transport robot, which is the upper end position of the horizontal arm, is lower than the lower end positions of the first and second openings. 　 A transport device for loading and unloading substrates into and from a processing device that processes substrates, A load port on which a container for housing the circuit board is placed, A main body comprising: a front wall which is the side wall on the load port side, having a first opening provided at a position corresponding to the container; a rear wall which is the side wall on the processing apparatus side; a transport robot for transporting the substrate between the first opening and the second opening; and a fan filter unit that supplies a gas filtered of particles from above to below the transport space in which the transport robot is housed; It comprises a lower housing section provided below the load port, The main body has a particle collection mechanism that extends vertically below the first opening on the transport space side of the front wall, The transport robot has a horizontal arm configured to transport the substrate in the horizontal direction, A transport device in which the standby position of the transport robot, which is the upper end position of the horizontal arm, is provided to overlap vertically with the particle collection mechanism. 　 A transport device for loading and unloading substrates into and from a processing device that processes substrates, A load port on which a container for housing the circuit board is placed, A main body comprising: a front wall which is the side wall on the load port side, having a first opening provided at a position corresponding to the container; a rear wall which is the side wall on the processing apparatus side; a transport robot for transporting the substrate between the first opening and the second opening; and a fan filter unit that supplies a gas filtered of particles from above to below the transport space in which the transport robot is housed; The load port is located below a lower storage section in which a plurality of storage sections are stacked vertically, The aforementioned transport robot has a predetermined range of motion required in the vertical direction. The lower limit of the required operating range is defined by the uppermost storage unit among the plurality of storage units in the conveying device. 　 The transport device according to claim 1 or 2, wherein the transport robot includes a vertical articulated arm configured to raise and lower the horizontal arm. 　 The aforementioned vertical articulated arm comprises an arm that is rotatable in the vertical direction, and a base that is connected to the arm and fixed to the bottom surface of the transport space. The conveying device according to claim 4, wherein the upper end position of the base is higher than the upper end position of the lower housing portion. 　 The conveying device according to claim 5, wherein the vertical dimension of the base is 50% or more of the vertical dimension of the conveying space. 　 The conveying device according to claim 5, wherein the dimension of the base in the direction from the front wall to the rear wall, which is the device depth direction, is 50% or more and 80% or less of the dimension of the conveying space in the device depth direction. 　 The base includes a pair of plate-shaped members extending along a vertical plane within the transport space, The conveying device according to claim 5, wherein the plate-shaped member has a substantially isosceles triangular shape including a pair of long sides extending along a vertical plane and a short side connecting the pair of long sides. 　 The conveying device according to any one of claims 1 to 3, wherein the lower storage section includes an upper first storage section and a lower second storage section. 　 A third opening is provided in the front wall at a position corresponding to the first housing portion, the conveying device according to claim 9. 　 The first housing unit houses a function expansion module comprising at least one of the following: a measurement module for performing measurements on a film on a substrate, an inspection module for inspecting defects in the substrate, and an alignment module for adjusting the orientation position of the substrate. The transport device according to claim 10, wherein the transport robot transports the substrate to the function expansion module through the third opening. 　 The conveying device according to any one of claims 1 to 3, wherein the aspect ratio of the conveying space of the main body, consisting of the vertical dimension and the device depth dimension, which is the direction from the front wall to the rear wall, is 3 to 5.

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