Flexible substrate, liquid jet head, and liquid jet recording device

Abstract

A flexible substrate according to an embodiment of the present disclosure outputs a drive signal to be applied to a liquid jet head having a plurality of nozzles, and comprises: a substrate body part on a substrate surface; a substrate protruding part that is disposed in a notch region near an end on the substrate surface and is a portion protruding from the substrate body part on the substrate surface; one or a plurality of drive devices that are disposed on the substrate body part and generate a drive signal for jetting a liquid from the nozzles; a detection member disposed on the substrate protruding part; and first wiring that is electrically connected to the detection member and extends from above the substrate protruding part toward above the substrate body part.

Description

Flexible Substrate, Liquid Jet Head, and Liquid Jet Recording Apparatus

[0001] The present disclosure relates to a flexible substrate, a liquid jet head, and a liquid jet recording apparatus.

[0002] Liquid jet recording apparatuses equipped with liquid jet heads are used in various fields, and various types of liquid jet heads have been developed (see, for example, Patent Document 1).

[0003] Japanese Patent Application Laid-Open No. 2003-182056

[0004] In such liquid jet heads, generally, reducing manufacturing costs and ensuring printing quality are required. It is desirable to provide a flexible substrate, a liquid jet head, and a liquid jet recording apparatus capable of reducing manufacturing costs. Also, it is desirable to provide a flexible substrate, a liquid jet head, and a liquid jet recording apparatus capable of ensuring printing quality.

[0005] A first flexible substrate according to an embodiment of the present disclosure is a flexible substrate that outputs a drive signal to be applied to a liquid jet head having a plurality of nozzles, and includes a substrate main body portion on the substrate surface, a substrate protruding portion that is disposed within a notch region near an end on the substrate surface and is a portion protruding from the substrate main body portion on the substrate surface, one or more drive devices that are disposed on the substrate main body portion and generate a drive signal for ejecting liquid from the nozzles, a temperature detection element that is disposed on the substrate protruding portion and detects the temperature of the liquid, and a first wiring that is electrically connected to the temperature detection element and extends from the substrate protruding portion onto the substrate main body portion.

[0006] A second flexible substrate according to one embodiment of the present disclosure is a flexible substrate that outputs a drive signal to be applied to a liquid spray head having a plurality of nozzles, and comprises a substrate body portion on the substrate surface, a substrate protrusion portion which is a portion that is arranged in a notched region near the edge of the substrate surface and protrudes from the substrate body portion on the substrate surface, one or more drive devices which are arranged on the substrate body portion and generate a drive signal for spraying liquid from the nozzles, a conductive member arranged on the substrate protrusion portion, and a first wiring which is electrically connected to the conductive member and extends from the substrate protrusion portion toward the substrate body portion.

[0007] A liquid injection head according to one embodiment of the present disclosure comprises a first or second flexible substrate according to the above embodiment of the present disclosure, and an injection unit having a plurality of nozzles that eject liquid based on a drive signal output from the first or second flexible substrate.

[0008] A liquid injection recording device according to one embodiment of the present disclosure is equipped with a liquid injection head according to the above embodiment of the present disclosure.

[0009] According to one embodiment of the present disclosure, a first flexible substrate, and a liquid injection head and liquid injection recording device equipped with this first flexible substrate, it is possible to reduce manufacturing costs.

[0010] According to a second flexible substrate according to one embodiment of the present disclosure, and a liquid jet head and liquid jet recording device equipped with this second flexible substrate, it is possible to ensure print quality.

[0011] This is a block diagram showing a schematic configuration example of a liquid injection device according to one embodiment of the present disclosure. This is a schematic perspective view showing a schematic configuration example of the liquid injection head shown in Figure 1. This is a schematic cross-sectional view showing a schematic configuration example of the liquid injection head shown in Figure 2. This is a schematic plan view showing a schematic configuration example of the flexible substrate shown in Figures 2 and 3. This is a schematic cross-sectional view showing a schematic configuration example of the flexible substrate shown in Figure 4. This is a schematic plan view showing a partially enlarged detailed configuration example of the flexible substrate shown in Figure 4. This is a schematic plan view showing a partially enlarged detailed configuration example of the flexible substrate according to Modification 1. This is a schematic plan view showing a partially enlarged detailed configuration example of the flexible substrate according to Modification 2.

[0012] The embodiments of this disclosure will be described in detail below with reference to the drawings. The description will be in the following order: 1. Embodiment (Example of a flexible substrate equipped with a temperature detection element on a substrate protrusion) 2. Modifications Modification 1 (Example of a flexible substrate equipped with a liquid detection member on a substrate protrusion) Modification 2 (Example of a flexible substrate equipped with a conductive member on a substrate protrusion) 3. Other Modifications

[0013] <1. Embodiments> [Outline Configuration of Printer 5] Figure 1 is a block diagram showing an example of the schematic configuration of a printer 5 as a liquid jet recording device according to one embodiment of the present disclosure. Figure 2 is a schematic perspective view showing an example of the schematic configuration of the inkjet head 1 as a liquid jet head shown in Figure 1. Figure 3 is a schematic cross-sectional view (Y-Z cross-sectional view) showing an example of the configuration of the inkjet head 1 shown in Figure 2. Note that in each drawing used in this specification, the scale of each component has been appropriately changed in order to make each component recognizable.

[0014] Printer 5 is an inkjet printer that uses ink 9 (described later) to record (print) images, characters, etc., onto a recording medium (for example, recording paper P shown in Figure 1). As shown in Figure 1, printer 5 is equipped with an inkjet head 1, a print control unit 2, and an ink tank 3.

[0015] Furthermore, the inkjet head 1 corresponds to one specific example of the "liquid jet head" in this disclosure, and the printer 5 corresponds to one specific example of the "liquid jet recording device" in this disclosure. In addition, the ink 9 corresponds to one specific example of the "liquid" in this disclosure.

[0016] (A. Print Control Unit 2) The print control unit 2 supplies various types of information (data) to the inkjet head 1. Specifically, as shown in Figure 1, the print control unit 2 supplies print control signals Sc to the inkjet head 1 (such as the drive device 41, which will be described later). These print control signals Sc include, for example, image data, ejection timing signals, and power supply voltage for operating the inkjet head 1.

[0017] (B. Ink Tank 3) The ink tank 3 is a tank that houses the ink 9 inside. As shown in Figure 1, the ink 9 in this ink tank 3 is supplied to the inkjet head 1 (the ejection unit 11, which will be described later) via the ink supply pipe 30. The ink supply pipe 30 is made up of, for example, a flexible hose.

[0018] (C. Inkjet Head 1) The inkjet head 1, as shown by the dashed arrows in Figure 1, is a head that records images, characters, etc., by spraying (discharging) droplet-shaped ink 9 onto the recording paper P from a plurality of nozzle holes Hn, which will be described later. This inkjet head 1 includes, for example, one spray unit 11, one I / F (interface) board 12, four flexible boards 13a, 13b, 13c, 13d, and two cooling units 141, 142, as shown in Figures 2 and 3.

[0019] (C-1. I / F board 12) As shown in Figures 2 and 3, the I / F board 12 includes two connectors 10, four connectors 120a, 120b, 120c, and 120d, and a circuit layout area 121.

[0020] As shown in Figure 2, connector 10 is the part (connector part) that receives the aforementioned printing control signal Sc supplied from the printing control unit 2 to the inkjet head 1 (each of the flexible substrates 13a, 13b, 13c, and 13d, which will be described later). Connectors 120a, 120b, 120c, and 120d are parts (connector parts) that electrically connect the I / F board 12 to the flexible substrates 13a, 13b, 13c, and 13d, respectively.

[0021] The circuit layout area 121 is an area on the I / F board 12 where various circuits are arranged. Note that other areas on the I / F board 12 may also be provided with such circuit layout areas.

[0022] (C-2. Ink ejection section 11) As shown in Figure 1, the ink ejection section 11 has a plurality of nozzle holes Hn and is the part that ejects ink 9 from these nozzle holes Hn. The ejection of ink 9 is performed according to the drive signal Sd (drive voltage Vd) supplied from the drive device 41, which will be described later, on each of the flexible substrates 13a, 13b, 13c, and 13d (see Figure 1).

[0023] As shown in Figure 1, such an injection unit 11 is configured to include an actuator plate 111 and a nozzle plate 112.

[0024] (Nozzle Plate 112) The nozzle plate 112 is a plate made of a film material such as polyimide or a metal material, and as shown in Figure 1, it has the above-mentioned plurality of nozzle holes Hn. These nozzle holes Hn are formed in a row at predetermined intervals and are, for example, circular in shape. Each of these nozzle holes Hn corresponds to a specific example of a "nozzle" in this disclosure.

[0025] In the example of the injection unit 11 shown in Figure 2, the multiple nozzle holes Hn within the nozzle plate 112 are arranged in multiple nozzle rows (four nozzle rows) along the column direction (X-axis direction). Furthermore, these four nozzle rows are arranged side by side along a direction perpendicular to the column direction (Y-axis direction).

[0026] (Actuator Plate 111) The actuator plate 111 is a plate made of a piezoelectric material such as PZT (lead zirconate titanate). The actuator plate 111 is provided with a plurality of channels (pressure chambers). These channels are for applying pressure to the ink 9 and are arranged in a line parallel to each other at predetermined intervals. Each channel is defined by a drive wall (not shown) made of piezoelectric material and has a concave groove in cross-section.

[0027] Such channels contain ejection channels for ejecting ink 9 and dummy channels (non-ejection channels) that do not eject ink 9. In other words, the ejection channels are filled with ink 9, while the dummy channels are not. The ink 9 is filled into each ejection channel, for example, through a common channel that communicates with all such ejection channels. Furthermore, each ejection channel communicates individually with a nozzle hole Hn in the nozzle plate 112, while each dummy channel does not communicate with a nozzle hole Hn. These ejection channels and dummy channels are arranged alternately along the aforementioned column direction (X-axis direction).

[0028] Furthermore, drive electrodes are provided on the opposing inner surfaces of the drive wall described above. These drive electrodes include a common electrode (shared electrode) provided on the inner surface facing the discharge channel and an active electrode (individual electrode) provided on the inner surface facing the dummy channel. These drive electrodes are electrically connected to the drive device 41, which will be described later, via the flexible substrates 13a, 13b, 13c, and 13d. As a result, the drive voltage Vd (drive signal Sd) described above is applied from the drive device 41 to each drive electrode via the flexible substrates 13a, 13b, 13c, and 13d (see Figure 1).

[0029] (C-3. ​​Flexible substrates 13a, 13b, 13c, 13d) As shown in Figures 2 and 3, the flexible substrates 13a, 13b, 13c, and 13d are substrates that electrically connect the I / F substrate 12 and the injection unit 11. Each of these flexible substrates 13a, 13b, 13c, and 13d individually controls the ink injection operation of each of the four rows of nozzles on the nozzle plate 112 described above. In addition, as shown by the reference numerals P1a, P1b, P1c, and P1d in Figure 3, each of the flexible substrates 13a, 13b, 13c, and 13d is designed to be bent near the point where each flexible substrate 13a, 13b, 13c, and 13d connects to the injection unit 11 (near the crimping electrode 433). Furthermore, the crimping electrode 433 and the injection unit 11 are electrically connected to each other by, for example, thermocompression bonding using ACF (Anisotropic Conductive Film). Alternatively, for example, another flexible substrate having only wiring may be further crimped to the flexible substrates 13a, 13b, 13c, and 13d using ACF, and this other flexible substrate may be crimped to the injection unit 11 using ACF.

[0030] Each of these flexible substrates 13a, 13b, 13c, and 13d (on the wiring layer on the back side S2, which will be described later) has one or more drive devices 41 individually mounted on it (see Figure 3). Each of these drive devices 41 is a device that outputs a drive signal Sd (drive voltage Vd) for ejecting ink 9 from the nozzle holes Hn in the corresponding nozzle row of the ejection unit 11. Therefore, such drive signals Sd are output to the ejection unit 11 from each of the flexible substrates 13a, 13b, 13c, and 13d. Each of these drive devices 41 is, for example, composed of an ASIC (Application Specific Integrated Circuit).

[0031] Furthermore, each of these drive devices 41 is cooled by the cooling units 141 and 142 described above. Specifically, as shown in Figure 3, the cooling unit 141 is fixedly positioned between the drive devices 41 on the flexible substrates 13a and 13b, and each drive device 41 is cooled by pressing the cooling unit 141 against them. Similarly, the cooling unit 142 is fixedly positioned between the drive devices 41 on the flexible substrates 13c and 13d, and each drive device 41 is cooled by pressing the cooling unit 142 against them. Note that these cooling units 141 and 142 can be configured using various types of cooling mechanisms.

[0032] [Detailed Configuration of Flexible Substrates 13a, 13b, 13c, 13d] Next, with reference to Figures 1 to 3 as well as Figures 4 to 6, a detailed configuration example of the flexible substrates 13a, 13b, 13c, 13d described above will be explained.

[0033] Figure 4 is a schematic plan view (Z-X plan view) of the general configuration example of the flexible substrates 13a to 13d (hereinafter collectively referred to as flexible substrates 13 as appropriate) shown in Figures 2 and 3. Figure 5 is a schematic cross-sectional view (Y-Z cross-sectional view) of the general configuration example of the flexible substrate 13 shown in Figure 4. Figure 6 is a schematic plan view (Z-X plan view) of a partially enlarged detailed configuration example of the flexible substrate 13 shown in Figure 4.

[0034] First, this flexible substrate 13 is a double-sided substrate with a multi-layer structure including a surface S1 and a back surface S2. Specifically, this flexible substrate 13 has a multi-layer structure (two-layer structure) of wiring layers, including a first wiring layer on the surface S1 side and a second wiring layer on the back surface S2 side, which face each other along a direction (Y-axis direction) perpendicular to the substrate surface (Z-X plane).

[0035] Furthermore, the wiring layers in the flexible substrate 13 may have a structure of three or more layers, for example, including the first wiring layer and the second wiring layer described above.

[0036] As shown in Figures 4 to 6, the flexible substrate 13 has terminal portions 130a and 130b, a substrate body portion 131, and a substrate protrusion portion 132. The flexible substrate 13 also has one or more drive devices 41 (in this example, multiple drive devices 41), a temperature detection element 42, a temperature detection circuit 43, a pattern portion 44, surface mount components 45, a first wiring W1, and a second wiring W2.

[0037] As described above, the drive device 41 is arranged on the substrate of the flexible substrate 13 (on the first wiring layer on the back side S2). In the examples of Figures 4 and 6, multiple drive devices 41 are arranged side by side along the X-axis on the substrate of the flexible substrate 13.

[0038] Terminal portion 130a is located near the end of the flexible substrate 13 on the I / F substrate 12 side (see Figure 4) and includes a plurality of electrode terminals T for electrically connecting the flexible substrate 13 and the I / F substrate 12. Terminal portion 130b is located near the end of the flexible substrate 13 on the injection section 11 side (see Figures 4 and 6) and includes a plurality of crimp electrodes 433 for electrically connecting the flexible substrate 13 and the injection section 11. These terminal portions 130a and 130b are respectively located on the substrate body portion 131 of the flexible substrate 13, which will be described below.

[0039] The main body portion 131 is the main body portion on the substrate surface of the flexible substrate 13 (see Figures 4 and 6). On the other hand, the substrate protrusion portion 132 is located within the notched region Aca near the edge of the substrate surface of the flexible substrate 13 (in the example of Figures 4 and 6, near the terminal portion 130b), and is the portion that protrudes from the main body portion 131 on the substrate surface (see Figures 4 and 6).

[0040] Specifically, as shown in Figure 4, the substrate surface of the flexible substrate 13 has a pair of outlines L1 and L3 extending in the Z-axis direction and a pair of outlines L2 and L4 extending along the X-axis direction, which intersect each other at intersections. More specifically, the two outlines L1 and L2 intersect each other at intersection Pc, the two outlines L2 and L3 intersect each other at intersections, the two outlines L3 and L4 intersect each other at intersections, and the two outlines L4 and L1 intersect each other at intersections. Furthermore, notched region Aca is located inside the intersection Pc of the two outline lines L1 and L2 (towards the main body portion 131), notched region Acc is located inside the intersection of the two outline lines L2 and L3, notched region Accd is located inside the intersection of the two outline lines L3 and L4, and notched region Acb is located inside the intersection of the two outline lines L4 and L1. In the examples of Figures 4 and 6, the substrate protrusion 132 is located within notched region Aca, one of these four notched regions Aca, Acb, Acc, and Accd. Note that these notched regions Aca, Acb, Acc, and Accd correspond to the regions that were cut out during the formation process of the flexible substrate 13, and in the examples of Figures 4 and 6, they are located at the four corners of the substrate surface.

[0041] Each drive device 41 is arranged on the main body portion 131 of the flexible substrate 13, as shown in Figures 4 and 6. In this example, each drive device 41 is flip-chip mounted on the back surface S2 of the flexible substrate 13, as shown in Figure 5.

[0042] The temperature detection element 42 is an element for detecting the temperature of the ink 9 applied to the inkjet head 1, and is constructed using, for example, a thermistor element. As shown in Figures 4 and 6, this temperature detection element 42 is arranged on the substrate protrusion 132 of the flexible substrate 13. In this example, the temperature detection element 42 is surface-mounted on the surface S1 of the flexible substrate 13, as shown in Figure 5.

[0043] As shown in FIG. 6, the temperature detection circuit 43 is disposed on the substrate main body portion 131 of the flexible substrate 13, and is a circuit that detects the temperature of the ink 9 based on the detection result by the temperature detection element 42. This temperature detection circuit 43 includes, for example, an A / D (analog-digital) converter, a capacitive element, a resistive element, and the like.

[0044] As shown in FIG. 6, the pattern portion 44 is a portion corresponding to the patterns of various wirings including the second wiring W2 described later. Examples of the patterns of the various wirings include signal wiring patterns corresponding to wirings of various signals, power supply wiring patterns corresponding to wirings of various power supplies, ground wiring patterns corresponding to ground wirings, and the like.

[0045] The surface-mounted component 45 is a component mounted using the same mounting process (surface mounting process) as the above-described temperature detection element 42, and is, for example, a mounted component such as a capacitive element or a resistive element. That is, as shown in FIG. 5, this surface-mounted component 45 is surface-mounted on the surface S1 of the flexible substrate 13 together with the temperature detection element 42.

[0046] As shown in FIG. 6, the first wiring W1 is a wiring (pair of wirings) electrically connected to the temperature detection element 42, and extends from the substrate protruding portion 132 onto the substrate main body portion 131. Specifically, the first wiring W1 is a wiring that electrically connects between the temperature detection element 42 and the temperature detection circuit 43, and is routed in the vicinity of the outer shape on the substrate surface of the flexible substrate 13 (in the vicinity of the outer shape line L1). Further, as shown in FIG. 6, the first wiring W1 is disposed at a distance from each drive device 41 (via the pattern portion 44). Note that the first wiring W1 may be disposed on one side of the substrate surface, or may be disposed on both sides (both the front surface S1 and the back surface S2) of the substrate surface.

[0047] As shown in FIG. 6, the second wiring W2 is a wiring electrically connected to the drive device 41 and is disposed on the substrate main body portion 131. Here, in the example of FIG. 6, the first wiring W1 and the second wiring W2 are spaced apart from each other and thermally separated from each other. Specifically, for example, even when the wirings are at the same potential (for example, when electrically connected at a predetermined location), the first wiring W1 and the second wiring W2 are spaced apart from each other so as to reduce the thermal coupling therebetween.

[0048] Here, the above-described temperature detection element 42 corresponds to a specific example of the "detection member" in the present disclosure, and the above-described temperature detection circuit 43 corresponds to a specific example of the "detection circuit" in the present disclosure. Further, the above-described notch region Aca corresponds to a specific example of the "notch region" in the present disclosure, and the above-described outer shape lines L1 and L2 respectively correspond to specific examples of the "two outer shape lines" in the present disclosure. Further, the above-described terminal portion 130b corresponds to a specific example of the "terminal portion" in the present disclosure.

[0049] [Operation, Action, and Effect] (A. Basic Operation of Printer 5) In this printer 5, a recording operation (printing operation) of an image, characters, etc. on a recording medium (recording paper P, etc.) is performed by using an ejection operation of ink 9 by the following inkjet head 1. Specifically, in the inkjet head 1 of the present embodiment, an ejection operation of ink 9 using a shear mode is performed as follows.

[0050] First, each drive device 41 on each flexible substrate 13 (13a, 13b, 13c, 13d) applies a drive voltage Vd (drive signal Sd) to the above-described drive electrodes (common electrode and active electrode) in the actuator plate 111 in the ejection unit 11. Specifically, each drive device 41 applies a drive voltage Vd to each drive electrode disposed on a pair of drive walls that define the above-described ejection channel. As a result, each of these pair of drive walls is deformed so as to protrude toward the dummy channel side adjacent to its ejection channel.

[0051] At this time, the drive wall bends in a V-shape around its midpoint in the depth direction. This bending deformation of the drive wall causes the ejection channel to deform as if it were expanding. In this way, the volume of the ejection channel increases due to the bending deformation caused by the piezoelectric thickness sliding effect of the pair of drive walls. As a result of this increase in the volume of the ejection channel, the ink 9 is guided into the ejection channel.

[0052] Next, the ink 9, which has been guided into the ejection channel in this manner, propagates inside the ejection channel as a pressure wave. At the moment when this pressure wave reaches (or near the moment) the nozzle hole Hn of the nozzle plate 112, the drive voltage Vd applied to the drive electrode becomes 0 V. As a result, the drive wall recovers from the bent deformation state described above, and the volume of the ejection channel, which had increased, returns to its original size.

[0053] In this way, as the volume of the ejection channel returns to its original state, the pressure inside the ejection channel increases, and the ink 9 inside the ejection channel is pressurized. As a result, droplet-shaped ink 9 is ejected to the outside (towards the recording paper P) through the nozzle hole Hn (see Figure 1). In this way, the ink ejection operation (discharge operation) of the ink 9 in the inkjet head 1 is performed, and as a result, the recording operation of images, characters, etc. is performed on the recording paper P.

[0054] (B. Operation and Effects of Inkjet Head 1) Next, the operation and effects of the inkjet head 1 of this embodiment will be described in detail.

[0055] (B-1. Regarding conventional inkjet heads) First, in conventional inkjet heads, the actuator generally generates heat due to the drive current during operation, which warms the ink and reduces its viscosity. Therefore, in order to ensure stable print quality, it is necessary to set an appropriate drive voltage according to the ink temperature. For this reason, conventional inkjet heads employ a method in which a temperature sensing element is installed near the actuator, and the drive voltage is controlled by feeding back the ink temperature.

[0056] However, due to the miniaturization of inkjet heads in recent years, routing the lead wires (wiring) of the temperature sensing element has become difficult. Furthermore, there is a risk that these lead wires may get pinched by surrounding components during inkjet head assembly, leading to malfunction. In addition, there is a risk that these lead wires may come into contact with heat sources (such as drive devices), which can lead to false detection of ink temperature (a decrease in temperature detection accuracy).

[0057] Thus, with conventional inkjet heads (comparative example), the installation of a temperature detection element to detect the ink temperature is not easy, which may lead to increased manufacturing costs.

[0058] (B-2. Function and Effects) In contrast, the inkjet head 1 of this embodiment has the following configuration of the flexible substrate 13, which provides, for example, the following functions and effects.

[0059] In other words, in the flexible substrate 13 of this embodiment, a drive device 41 is arranged on the substrate body portion 131 on the substrate surface, and a temperature detection element 42 is arranged on the substrate protrusion portion 132, which is a portion that protrudes from the substrate body portion 131 on the substrate surface. Furthermore, a first wiring W1 electrically connected to this temperature detection element 42 extends from the substrate protrusion portion 132 toward the substrate body portion 131.

[0060] This results in the following differences compared to the comparative example described above, where the temperature sensing element is located outside the flexible substrate: For example, the difficulty in routing the lead wires (wiring) of the temperature sensing element 42, as mentioned above, is avoided, failures caused by the lead wires being pinched by surrounding materials during the assembly of the inkjet head 1 are avoided, and false temperature detections due to the lead wires contacting a heat source (such as the drive device 41) are avoided. As a result, the installation of the temperature sensing element 42 becomes easier, and in this embodiment, manufacturing costs can be reduced compared to the comparative example described above.

[0061] Furthermore, in this embodiment, a temperature detection circuit 43 is provided on the main substrate portion 131, and the first wiring W1 that electrically connects the temperature detection element 42 and the temperature detection circuit 43 is routed within an area near the outer edge of the substrate surface. This results in the following: In other words, the first wiring W1 can be routed to a location away from the heat source, such as the drive device 41, thereby suppressing thermal noise and improving the temperature detection accuracy of the ink 9.

[0062] Furthermore, in this embodiment, since the first wiring W1 is positioned at a distance from the drive device 41, the above-mentioned thermal noise can be further suppressed, and the temperature detection accuracy of the ink 9 can be further improved.

[0063] In addition, in this embodiment, a second wiring W2 is further provided on the substrate body 131, which is electrically connected to the drive device 41, and the first wiring W1 and the second wiring W2 are spaced apart from each other, as follows: That is, thermal coupling from the drive device 41 as a heat source can be reduced, and the above-mentioned thermal noise can be further suppressed, making it possible to further improve the temperature detection accuracy of the ink 9.

[0064] Furthermore, in this embodiment, since the first wiring W1 and the second wiring W2 are thermally separated from each other, the thermal coupling described above can be further reduced, and the thermal noise described above can be further suppressed, thereby making it possible to further improve the temperature detection accuracy of the ink 9.

[0065] Furthermore, in this embodiment, since the temperature detection element 42 and the other surface-mount components 45 mentioned above are surface-mounted on the same surface (surface S1) of the substrate, the following occurs. That is, since components that undergo the same mounting process are mounted on the same surface of the flexible substrate 13, these components can be mounted without providing additional mounting processes, thereby further reducing manufacturing costs. As a specific example, for instance, the first wiring W1 may be extended to the terminal portion 130a, and the temperature detection circuit 43 may be placed on the I / F board 12 or the board on the printer 5 side.

[0066] In addition, in this embodiment, since the substrate protrusion 132 including the temperature detection element 42 is located near the terminal portion 130b provided near the end of the substrate body portion 131, the following occurs. That is, the routing of the first wiring W1 described above becomes easier, making it possible to further reduce manufacturing costs.

[0067] <2. Modified Examples> Next, modified examples (Modified Examples 1 and 2) of the above embodiment will be described. In the following, components identical to those in the embodiment will be denoted by the same reference numerals, and their descriptions will be omitted as appropriate.

[0068] [Modification 1] Figure 7 is a schematic plan view (Z-X plan view) showing a detailed configuration example of the flexible substrate 13A according to Modification 1, partially enlarged. The flexible substrate 13A of this Modification 1 corresponds to the configuration of the flexible substrate 13 of the embodiment (see Figure 6), in which a liquid detection member 42A and a liquid detection circuit 43A are provided instead of the temperature detection element 42 and temperature detection circuit 43, respectively, while the other configurations are the same.

[0069] Here, the liquid detection member 42A corresponds to one specific example of the "detection member" in this disclosure, and the liquid detection circuit 43A corresponds to one specific example of the "detection circuit" in this disclosure.

[0070] The liquid detection member 42A is a component for detecting the ink 9 applied to the inkjet head 1. This is because if a conductive liquid such as ink 9 enters the inkjet head 1, it may cause electrical malfunctions or corrosion and damage to the components. Such a liquid detection member 42A is constructed using, for example, a capacitive, optical, or resistive detection element. As shown in Figure 7, the liquid detection member 42A is arranged on the substrate protrusion 132 of the flexible substrate 13A. Furthermore, the liquid detection member 42A is surface-mounted on the surface S1 of the flexible substrate 13A, similar to the temperature detection element 42 in the embodiment (see Figure 5).

[0071] As shown in Figure 7, the liquid detection circuit 43A is located on the main body portion 131 of the flexible substrate 13A and is a circuit that detects ink 9 based on the detection result of the liquid detection member 42A. When the liquid detection circuit 43A detects an amount of ink 9 exceeding a predetermined amount (i.e., ink contamination is detected), a signal prompting maintenance or replacement of the inkjet head 1 is output, for example, thereby enabling stable printing operation. Such a liquid detection member 42A is composed of, for example, an A / D converter, a capacitive element, a resistive element, etc.

[0072] Here, the flexible substrate 13A of the modified example 1 also has the same configuration as the flexible substrate 13 of the embodiment, as follows.

[0073] In other words, in this flexible substrate 13A, the drive device 41 is arranged on the substrate body portion 131 on the substrate surface, and the liquid detection member 42A is arranged on the substrate protrusion portion 132, which is a portion that protrudes from the substrate body portion 131 on the substrate surface. Furthermore, a first wiring W1 electrically connected to this liquid detection member 42A extends from the substrate protrusion portion 132 toward the substrate body portion 131.

[0074] As a result, in Modification 1, unlike the case where the liquid detection member is provided on the outside of the flexible substrate, as in the Comparative Example described above, the following occurs. Specifically, for example, the difficulty in routing the lead wires (wiring) of the liquid detection member 42A is avoided, failures caused by the lead wires being pinched by surrounding materials during the assembly of the inkjet head 1 are avoided, and false detection of ink 9 due to the lead wires coming into contact with a heat source (drive device 41, etc.) is avoided. As a result, the installation of the liquid detection member 42A becomes easier, and in this Modification 1 as well, it is possible to reduce manufacturing costs compared to the Comparative Example described above.

[0075] Furthermore, in this modified example 1, a liquid detection circuit 43A is further provided on the main substrate portion 131, and the first wiring W1 that electrically connects the liquid detection member 42A and the liquid detection circuit 43A is routed within an area near the outer edge of the substrate surface, as follows: That is, the first wiring W1 can be easily routed to a position away from the drive device 41 and other heat sources, thereby suppressing thermal noise and improving the detection accuracy of the ink 9.

[0076] [Modification 2] Figure 8 is a schematic plan view (Z-X plan view) showing a detailed configuration example of the flexible substrate 13B according to Modification 2, partially enlarged. In Figure 8, the area indicated by reference numeral P2 (near the FB land 42B, which will be described later) is shown in a partially enlarged view. The flexible substrate 13A of this Modification 2 corresponds to the configuration of the flexible substrate 13 of the embodiment (see Figure 6), in which an FG (frame ground) land 42B is provided instead of the temperature detection element 42, and the temperature detection circuit 43 is omitted, with the other configurations being the same.

[0077] Here, FG Land 42B corresponds to one specific example of a "conductive member" in this disclosure.

[0078] As shown in Figure 8, the FG land 42B is positioned on the substrate protrusion 132 of the flexible substrate 13B. Specifically, as shown in an enlarged view in the reference numeral P2 of Figure 8, the FG land 42B is positioned around the screw hole H2 that penetrates the flexible substrate 13B, and the first wiring W1 is electrically connected to the FG land 42B. This FG land 42B is a conductive member for electrically connecting the frame ground on the flexible substrate 13B and the housing of the inkjet head 1. By electrically connecting the housing of the inkjet head 1 in this way, a return path for noise (drive noise) in the drive signal Sd is secured.

[0079] Here, the flexible substrate 13B of the modified example 2 also has the same configuration as the flexible substrate 13 of the embodiment, as follows.

[0080] In other words, in this flexible substrate 13B, the drive device 41 is arranged on the substrate body portion 131 on the substrate surface, and the FG land 42B, which is a conductive member, is arranged on the substrate protrusion portion 132, which is a portion that protrudes from the substrate body portion 131 on the substrate surface. Furthermore, the first wiring W1, which is electrically connected to this FG land 42B, extends from the substrate protrusion portion 132 toward the substrate body portion 131.

[0081] As a result, in the modified example 2, for example, when the FG land 42B and the housing of the inkjet head 1 are electrically connected, it becomes easier to secure the return path for the drive noise compared to the case where the FG land 42B is provided on the main body of the circuit board 131. As a result, malfunctions caused by such drive noise are suppressed, making it possible to ensure print quality.

[0082] In this modified example 2, the FG land 42B was given as a specific example of the "conductive member" in this disclosure, but the invention is not limited to this example, and other conductive members may be provided instead.

[0083] <3. Other Modifications> The present disclosure has been described above with reference to embodiments and modifications, but the present disclosure is not limited to these embodiments, and various modifications are possible.

[0084] For example, in the above embodiments, specific examples of the configuration (shape, arrangement, number, etc.) of each component in the printer and inkjet head were given and explained, but the above embodiments are not the only ones that are described, and other shapes, arrangements, numbers, etc., may be used.

[0085] Specifically, in the above embodiments, for example, specific examples of configurations (shape, arrangement, number, etc.) of flexible substrates, drive devices, and various wiring patterns were described, but these configuration examples are not limited to those described in the above embodiments. For example, in the above embodiments, an example was described in which multiple drive substrates are provided in the inkjet head, but the invention is not limited to this example, and for example, only one drive substrate may be provided in the inkjet head. Also, in the above embodiments, an example was described in which multiple drive devices are provided on the drive substrate, but the invention is not limited to this example, and for example, only one drive device may be provided on the drive substrate. Furthermore, in the above embodiments, the shape of the drive device is rectangular, but the invention is not limited to this example, and for example, it may be square.

[0086] Furthermore, in the above embodiments, specific examples of configurations (shape, arrangement, number, etc.) of the substrate body, substrate protrusions, temperature detection element, liquid detection member, conductive member (FG land), first wiring, second wiring, and surface mount components have been described. However, these configuration examples are not limited to those described in the above embodiments. Specifically, for example, in the above embodiments, an example was described in which the drive device is arranged on the second surface of the flexible substrate. However, the example is not limited to this, and for example, the drive device may be arranged on the first surface of the flexible substrate.

[0087] Furthermore, various types of inkjet head structures can be applied. For example, a so-called side-chute type inkjet head may be used, which ejects ink 9 from the center of the extending direction of each ejection channel in the actuator plate 111. Alternatively, a so-called edge-chute type inkjet head may be used, which ejects ink 9 along the extending direction of each ejection channel. Moreover, the printer system is not limited to the systems described in the above embodiments, and various systems such as the MEMS (Micro Electro Mechanical Systems) system can be applied.

[0088] Furthermore, this disclosure can be applied to either a circulating inkjet head, which circulates the ink 9 between the ink tank and the inkjet head, or a non-circulating inkjet head, which does not circulate the ink 9.

[0089] Furthermore, the series of processes described in the above embodiments may be performed by hardware (circuits) or by software (programs). If performed by software, the software consists of a group of programs that cause the computer to execute each function. Each program may, for example, be pre-installed in the computer or installed on the computer from a network or recording medium.

[0090] Furthermore, while the above embodiments described a printer 5 (inkjet printer) as a specific example of the "liquid jet recording device" in this disclosure, the invention is not limited to this example, and the disclosure can be applied to other devices other than inkjet printers. In other words, the "liquid jet head" (inkjet head) of this disclosure may be applied to other devices other than inkjet printers. Specifically, for example, the "liquid jet head" of this disclosure may be applied to devices such as facsimile machines and on-demand printing machines.

[0091] In addition, the various examples described so far may be applied in any combination.

[0092] Furthermore, the effects described herein are merely illustrative and not limiting, and other effects may also occur.

[0093] Furthermore, the present disclosure may also take the following configurations: (1) A flexible substrate that outputs a drive signal to be applied to a liquid spray head having a plurality of nozzles, comprising: a substrate body portion on the substrate surface; a substrate protrusion portion disposed within a notched region near the edge of the substrate surface and being a portion that protrudes from the substrate body portion on the substrate surface; one or more drive devices disposed on the substrate body portion and generating the drive signal for spraying liquid from the nozzles; a detection member disposed on the substrate protrusion portion; and a first wiring that is electrically connected to the detection member and extends from the substrate protrusion portion toward the substrate body portion. (2) The flexible substrate according to (1), wherein a detection circuit is further provided on the substrate body portion, and the first wiring that electrically connects the detection member and the detection circuit is routed within a region near the outer shape of the substrate surface. (3) The flexible substrate according to (1) or (2), wherein the first wiring is disposed spaced apart from the drive devices. (4) A flexible substrate according to any one of (1) to (3) above, further comprising a second wiring arranged on the substrate body and electrically connected to the drive device, wherein the first wiring and the second wiring are spaced apart from each other. (5) A flexible substrate according to (4) above, wherein the first wiring and the second wiring are thermally separated from each other. (6) A flexible substrate according to any one of (1) to (5) above, wherein the detection member and other surface mount components are surface mounted on the first surface of the substrate surface, which is one of the first and second surfaces facing each other on the substrate surface. (7) A flexible substrate according to (6) above, wherein the drive device is flip-chip mounted on the second surface on the substrate surface. (8) A flexible substrate according to any one of (1) to (7) above, wherein two outlines on the substrate surface intersect each other at an intersection, and the notch region is located inside the intersection of the two outlines.(9) A flexible substrate according to any one of (1) to (8) above, wherein a terminal portion is further provided near the end of the substrate body portion, and the substrate protrusion is located near the terminal portion. (10) A flexible substrate according to any one of (1) to (9) above, wherein the detection member is a temperature detection element for detecting temperature, or a liquid detection member for detecting liquid. (11) A flexible substrate that outputs a drive signal to be applied to a liquid spray head having a plurality of nozzles, comprising: a substrate body portion on the substrate surface; a substrate protrusion portion disposed in a notched region near the end of the substrate surface and being a portion that protrudes from the substrate body portion on the substrate surface; one or more drive devices disposed on the substrate body portion and generating the drive signal for spraying liquid from the nozzles; a conductive member disposed on the substrate protrusion portion; and a first wiring that is electrically connected to the conductive member and extends from the substrate protrusion portion toward the substrate body portion. (12) A liquid spray head comprising a flexible substrate as described in any of (1) to (11) above, and a spray unit having a plurality of nozzles that sprays the liquid based on the drive signal output from the flexible substrate. (13) A liquid spray recording device comprising the liquid spray head as described in (12) above.

[0094] This application claims priority based on Japanese Patent Application No. 2024-207556, filed with the Japan Patent Office on 28 November 2024, and all contents of that application are incorporated herein by reference.

[0095] Those skilled in the art will understand that various modifications, combinations, subcombinations, and changes can be conceived depending on design requirements and other factors, and that these fall within the scope of the attached claims and their equivalents.

Claims

1. A flexible substrate that outputs a drive signal to be applied to a liquid spray head having multiple nozzles, comprising: a substrate body portion on the substrate surface; a substrate protrusion portion disposed within a cutout region near the edge of the substrate surface and being a portion that protrudes from the substrate body portion on the substrate surface; one or more drive devices disposed on the substrate body portion and generating the drive signal for spraying liquid from the nozzles; a detection member disposed on the substrate protrusion portion; and a first wiring that is electrically connected to the detection member and extends from the substrate protrusion portion toward the substrate body portion.

2. The flexible substrate according to claim 1, wherein a detection circuit is further provided on the substrate body, and the first wiring that electrically connects the detection member and the detection circuit is routed within an area near the outer shape of the substrate surface.

3. The flexible substrate according to claim 1 or 2, wherein the first wiring is arranged at a distance from the drive device.

4. The flexible substrate according to claim 1 or claim 2, further comprising a second wiring arranged on the substrate body and electrically connected to the drive device, wherein the first wiring and the second wiring are spaced apart from each other.

5. The flexible substrate according to claim 4, wherein the first wiring and the second wiring are thermally separated from each other.

6. The flexible substrate according to claim 1 or claim 2, wherein the detection member and other surface-mount components are surface-mounted on the first surface of the substrate, which is one of two opposing surfaces on the substrate surface.

7. The flexible substrate according to claim 6, wherein the drive device is flip-chip mounted on the second surface of the substrate.

8. The flexible substrate according to claim 1 or claim 2, wherein two outlines on the substrate surface intersect each other at an intersection, and the notched region is located inside the intersection of the two outlines.

9. The flexible substrate according to claim 1 or claim 2, wherein a terminal portion is further provided near the end of the substrate body, and the substrate protrusion is located near the terminal portion.

10. The flexible substrate according to claim 1 or 2, wherein the detection member is a temperature detection element for detecting temperature, or a liquid detection member for detecting liquid.

11. A flexible substrate that outputs a drive signal to be applied to a liquid spray head having multiple nozzles, comprising: a substrate body portion on the substrate surface; a substrate protrusion portion disposed within a cutout region near the edge of the substrate surface and being a portion that protrudes from the substrate body portion on the substrate surface; one or more drive devices disposed on the substrate body portion and generating the drive signal for spraying liquid from the nozzles; a conductive member disposed on the substrate protrusion portion; and a first wiring that is electrically connected to the conductive member and extends from the substrate protrusion portion toward the substrate body portion.

12. A liquid spray head comprising a flexible substrate according to claim 1 or claim 11, and a spray unit having a plurality of nozzles that sprays the liquid based on the drive signal output from the flexible substrate.

13. A liquid injection recording device comprising the liquid injection head described in claim 12.

Images