Liquid ejecting head and liquid ejecting apparatus

Abstract

The present invention provides a liquid jet head and a liquid jetting device capable of suppressing uneven jetting speed in the nozzle configuration area, thereby suppressing the reduction of image quality. The liquid jet head (18) includes: a nozzle substrate (20) having a nozzle configuration area (1a); a flow path substrate (21) having a common flow path (4); a piezoelectric element substrate (9) having a separate flow path (13), a vibrating plate (7) and a piezoelectric element (8); a holding substrate (10); and a frame member (22) having other common flow paths (11). The flow path substrate (21) is larger in the short side direction than the piezoelectric element substrate (9) and the holding substrate (10). The flow path substrate (21) and the frame member (22) are joined in the short side direction directly or via a member thinner than the piezoelectric element substrate (9) on the outside of the piezoelectric element substrate (9) and the holding substrate (10). The common flow path (4) and other common flow paths (11) are joined to each other by an adhesive (5). The length (B) of the joint area (5a) of the common flow path (4) and other common flow paths (11) is longer than the length (A) of the nozzle configuration area (1a).

Description

Technical Field

[0001] This invention relates to liquid injection heads and liquid injection devices. Background Technology

[0002] Previously, liquid ejection heads were known to be used in inkjet image forming apparatuses. In order to achieve high image quality, it is necessary to reduce the unevenness of the liquid ejection velocity within the printhead.

[0003] As a liquid jetting head, a technique is conventionally known to be used to form piezoelectric elements for the nozzle on a silicon substrate at high density using MEMS (Micro-Electro-Mechanical Systems) processes. The liquid jetting head is assembled by bonding the nozzle substrate, flow path substrate, and frame components for supplying ink and holding the substrate to the piezoelectric element using adhesives or the like.

[0004] As adhesives used for bonding, examples include UV-curing adhesives, two-component room-temperature curing adhesives, and heat-curing adhesives. However, since adhesives used for bonding also come into contact with ink, adhesives with high ink resistance are required. Among such adhesives, heat-curing adhesives are sometimes used due to considerations of ink resistance and manufacturing cycle time. However, piezoelectric elements using MEMS technology, which are used as interlocking components, primarily use silicon materials, while frame components and the like use resin materials. When these different types of materials are bonded together by heat, residual stress is generated after bonding due to the difference in the linear expansion coefficients of the materials and the curing shrinkage of the adhesive (see [reference]). Figure 2 ).

[0005] To suppress the decrease in reliability of the liquid jet head caused by the aforementioned residual stress, a proposed structure includes a nozzle, a flow path component, a supply path component, and a heater. The coefficient of linear expansion of the supply path component is greater than that of the flow path component. The flow path component and the supply path component are joined by a thermosetting adhesive, and the heater is disposed on the supply path component (see, for example, "Patent Document 1"). According to this structure, the outer casing substrate can be heated by the heater, causing the outer casing substrate to expand. This reduces the residual stress caused by the difference in shrinkage between the outer casing substrate and the connecting substrate after the thermosetting adhesive has cured, thereby easily improving the reliability of the liquid jet head.

[0006] In the aforementioned technology, stress is applied to the vibrating plate by joining different types of materials together. Therefore, it is important to study the nozzle structure to control the stress in order to reduce the unevenness of the spray speed. However, in the conventional nozzle structure, the stress control based on the difference in linear expansion rate is not complete. As a result, there is a problem of uneven variation in the spray speed within the nozzle, which leads to a decrease in image quality.

[0007] In particular, the technology disclosed in "Patent Document 1" does not specify the wetting and spreading of the adhesive used in the joint between the flow path component and the supply path component. Assuming that the length of the flow path configuration area in the flow path component is shorter than the length of the nozzle configuration area, and the length of the adhesive wetting and spreading area is also shorter than the length of the nozzle configuration area, the following problem arises: the stress applied to each component during bonding and fixing differs along the length of the nozzle configuration area due to the difference in linear expansion rates, leading to increased unevenness in the spray velocity.

[0008] The purpose of this invention is to solve the above-mentioned problems and provide a liquid jet head that can suppress the degradation of image quality by suppressing the unevenness of the jet velocity in the nozzle configuration area.

[0009] [Patent Document 1] Japanese Patent Application Publication No. 2018-51768 Summary of the Invention

[0010] Claim 1 discloses an invention relating to a liquid jet head, characterized by comprising: a nozzle substrate having a nozzle configuration area for arranging a plurality of nozzles for jetting liquid; a flow path substrate having a common flow path communicating with the nozzles; a piezoelectric element substrate having an independent flow path communicating with the nozzles, a vibrating plate formed to cover the independent flow path, and a piezoelectric element disposed on the independent flow path; a holding substrate having a recess in the vibrating area of ​​the piezoelectric element; and a frame member having other common flow paths communicating with the common flow path, wherein the flow path substrate is larger in the short side direction than the piezoelectric element substrate and the holding substrate in the short side direction, the flow path substrate and the frame member are joined directly or via a component thinner than the piezoelectric element substrate on the outside of the piezoelectric element substrate and the holding substrate in the short side direction, the common flow path and the other common flow paths are joined together by an adhesive, and the length of the joint area of ​​the common flow path and the other common flow paths is longer than the length of the nozzle configuration area.

[0011] According to the present invention, since tensile stress generated during adhesive bonding and fixing is uniformly applied throughout the entire area of ​​the nozzle configuration region, uneven jetting speed near both ends can be suppressed, thus providing an inkjet head that can suppress uneven jetting speed in the nozzle configuration region and suppress image quality degradation. Attached Figure Description

[0012] Figure 1 The diagram shown is a schematic representation of a liquid jet head to which one embodiment of the present invention may be applied.

[0013] Figure 2 This is a schematic diagram illustrating the residual stress caused by the difference in linear expansion rates when two components are bonded together.

[0014] Figure 3 This is a schematic cross-sectional view of the periphery of the piezoelectric element used in one embodiment of the present invention.

[0015] Figure 4 This is a top view of the main parts of the existing nozzle substrate, flow path substrate, and frame components.

[0016] Figure 5 It means Figure 4 A schematic diagram showing the ejection speed of ink in the inkjet head.

[0017] Figure 6 This is a top view of the main parts of other existing nozzle substrates, flow path substrates, and frame components.

[0018] Figure 7 It means Figure 6 A schematic diagram showing the ejection speed of ink in the inkjet head.

[0019] Figure 8 This is a top view of the main parts of the nozzle substrate, flow path substrate, and frame component according to the first embodiment of the present invention.

[0020] Figure 9 It means Figure 8 A schematic diagram showing the ejection speed of ink in the inkjet head.

[0021] Figure 10 This is a top view of the main parts of the nozzle substrate, flow path substrate, and frame component according to the second embodiment of the present invention.

[0022] Figure 11 It means Figure 10 A schematic diagram showing the ejection speed of ink in the inkjet head.

[0023] Figure 12 This is a top view of the main parts of the nozzle substrate, flow path substrate, and frame component according to the second embodiment of the present invention.

[0024] Figure 13 This is a schematic front view of other liquid injection devices having the liquid injection head involved in various embodiments of the present invention.

[0025] Figure 14 This is a schematic front view illustrating a liquid injection unit of another liquid injection device having the liquid injection head according to various embodiments of the present invention.

[0026] Figure 15 This is a schematic top view of yet another liquid injection device having the liquid injection head according to various embodiments of the present invention.

[0027] Figure 16This is a schematic side view of yet another liquid injection device having the liquid injection head according to various embodiments of the present invention.

[0028] Figure 17 This is a schematic front view illustrating a liquid injection unit of yet another liquid injection device having the liquid injection head according to various embodiments of the present invention.

[0029] Figure 18 This is a schematic front view illustrating another liquid injection unit of another liquid injection device having the liquid injection head according to various embodiments of the present invention.

[0030] Figure 19 This is a schematic front view of an apparatus for manufacturing electrodes of yet another liquid jetting device having a liquid jetting head according to various embodiments of the present invention. Detailed Implementation

[0031] Figure 1 This is a schematic diagram of the ejection section of an inkjet head, which is a liquid ejection head according to one embodiment of the present invention. In this figure, the inkjet head 18 has a nozzle substrate 2 at its lower part, on which a plurality of nozzles 1 for ejecting ink are formed. Above the nozzle substrate 2, there is a flow path substrate 3, which is engaged with the nozzle substrate 2 and has individual flow paths 13 and a common flow path 4, and a separate liquid chamber 6 communicating with the individual flow paths 13. Above the separate liquid chamber 6 are provided: a piezoelectric element substrate 9, which has a vibrating plate 7 covering one surface of the separate liquid chamber 6 and a piezoelectric element 8 disposed on the vibrating plate 7 and generating driving force; a holding substrate 10, which holds the piezoelectric element substrate 9; and a frame member 12, which is engaged with the flow path substrate 3 and has a common flow path 11 communicating with the common flow path 4.

[0032] exist Figure 1 In the middle, the left and right directions are the short side directions of the inkjet head 18, and the depth direction (paper surface direction) is the long side direction of the inkjet head 18.

[0033] Here, the short side direction of the flow path substrate 3 is... Figure 1 The size in the left-right direction is larger than the size in the same direction of the piezoelectric element substrate 9 and the holding substrate 10. The flow path substrate 3 and the frame component 12 are in Figure 1 The piezoelectric element substrate 9 and the holding substrate 10 are directly bonded to each other. Alternatively, the flow path substrate 3 and the frame component 12 can be bonded using a component that is thinner than the piezoelectric element substrate 9.

[0034] On the surface of the flow path substrate 3 opposite to the surface where the frame member 12 is attached, a damping member 14 is provided, which has a damping function to absorb the pressure generated during ink jetting. In the above configuration, since the nozzle substrate 2, flow path substrate 3, piezoelectric element substrate 9, holding substrate 10, etc., require high-density fabrication of fine and complex patterns to obtain high image quality, the single-crystal silicon substrate is processed using semiconductor processing technology (photolithography, etching, etc.). The frame member 12 is manufactured at low cost because it does not require complex patterns, so it is molded from resin components (PPS, PPE, glass epoxy resin, etc.).

[0035] After machining and molding, the parts are positioned with high precision using optical alignment and locating pins, and then joined and fixed using adhesive 5. Examples of adhesive 5 used here include UV-curing adhesives, two-component room-temperature curing adhesives, and heat-curing adhesives; however, because they come into contact with ink, adhesives with high ink resistance are required. Therefore, considering the relationship between ink resistance and manufacturing cycle time, heat-curing adhesives are sometimes used. However, due to the difference in the linear expansion rates of the silicone and resin components being bonded, such as… Figure 2 As shown, there is a problem that causes uneven spraying speed and reduced image quality within the nozzle due to residual stress.

[0036] Figure 3 The diagram shows a cross-sectional view of the periphery of the piezoelectric element substrate 9. The piezoelectric element substrate 9 is constructed by covering a separate liquid chamber 6 with a vibrating plate 7, and placing a piezoelectric element 8 on the vibrating plate 7. The piezoelectric element 8 is formed by clamping a piezoelectric body 16 between a common electrode 17 (upper electrode) and an independent electrode 15 (lower electrode). When compressive stress is applied to the vibrating plate 7, the vibrating plate 7 becomes relaxed, making it easier to drive the piezoelectric element 8 and increasing its displacement. When tensile stress is applied to the vibrating plate 7, the vibrating plate 7 becomes tensile, making it difficult to drive the piezoelectric element 8 and reducing its displacement. Since the displacement of the piezoelectric element 8 is related to the jet velocity of the liquid, the jet velocity varies depending on the stress state acting on the vibrating plate 7.

[0037] Figure 4 This is a top view showing the main parts of the conventionally used nozzle substrate 2, flow path substrate 3, and frame component 12. Among these components, a nozzle arrangement area 1a, where a plurality of nozzles 1 are formed, is provided on the nozzle substrate 2. The nozzles 1 and the nozzle arrangement area 1a are provided over approximately the entire width of the nozzle substrate 2. Figure 4The central nozzle 1 and nozzle configuration area 1a are omitted from the illustration. A joining area 5a is provided in the frame component 12. This joining area 5a is the area where the flow path substrate 3 is joined to connect the common flow path 4 to the common flow path 11, that is, the area where the adhesive 5 is applied and the area where the adhesive 5 is wetted and diffused.

[0038] exist Figure 4 In the configuration, if the length of the nozzle arrangement region 1a is set as A (hereinafter also referred to as length A), and the length of the engagement region 5a is set as B (hereinafter also referred to as length B), then the length B of the engagement region 5a is configured to be shorter than the length A of the nozzle arrangement region 1a. In this specification, Figure 4 The left and right dimensions shown are taken as the "length". Dimensions orthogonal to the "length" are... Figure 4 The size in the vertical direction is described as "width".

[0039] In this configuration, while there is a difference between length A and length B, deformation occurs in the joint region 5a as described above due to the difference in the rate of linear expansion. Therefore, the position of nozzle 1 within the nozzle arrangement region 1a corresponding to the joint region 5a shifts significantly, but the displacement of nozzle 1 positioned away from the joint region 5a is smaller. When such a difference in displacement occurs, a stress difference is generated, resulting in a difference in injection velocity between the portion near the end of nozzle 1 and other portions.

[0040] Figure 5 express Figure 4 The configuration shown exhibits uneven jet velocity (the value obtained by dividing the velocity of each channel by the average velocity of the entire channel). From Figure 5 It can be seen that the tensile stress is stronger in the jet channel corresponding to the joint area 5a, resulting in a slower jet velocity. Conversely, the tensile stress is weaker in the jet paths near the two ends away from the joint area 5a, resulting in a faster jet velocity distribution near the two ends, as shown by symbol 19. Therefore, in the existing configuration, there is a significant uneven distribution of jet velocity in the central jet channel and the jet channels near the two ends, leading to a decrease in image quality.

[0041] Figure 6 The image shown is... Figure 4 In the configuration shown, the length A of the nozzle configuration area 1a is not changed, but the length B of the joining area 5a is greater than the length A. Furthermore, while making the lengths A and B approximately the same, a conventional example is provided where the lengths of the common flow paths 4A and 11A are longer than those of the common flow paths 4 and 11. Figure 7 This indicates uneven injection speed in the configuration.

[0042] In this configuration, with Figure 4Compared to the configuration shown, although the unevenness of the injection velocity is reduced, as Figure 7 As shown, the uneven upward trend of the jet velocity 19 near both ends is still quite large.

[0043] Hereinafter, a first embodiment of the present invention will be described to reduce the uneven velocity distribution of the jet velocity, which is the aforementioned problem point.

[0044] Figure 8 The image shown is a top view of the main parts of the nozzle substrate 20, flow path substrate 21, and frame member 22 according to the first embodiment of the present invention. In the nozzle substrate 20, a plurality of nozzles 1 are formed similarly to those in the nozzle substrate 2, and a nozzle arrangement region 1a is provided. In the flow path substrate 21, a plurality of nozzles 1 are formed similarly to those in the nozzle substrate 2, and a nozzle arrangement region 1a is provided. Figure 4 Similarly, two common flow paths 4 are provided. In addition, the icons of flow paths other than the common flow path 4 in the flow path substrate 21 are omitted. In the inkjet head 18, components 2, 3, and 12 are replaced by components 20, 21, and 22.

[0045] In frame component 22, there are two locations where... Figure 4 Similarly, the common flow path 11, which serves as another common flow path, has an opening 23 formed by a through hole at the center of the width direction of the frame member 22. The frame member 22 has a joint area 5a identical to that of the frame member 12, namely the area for applying the adhesive 5 and the area for wetting and spreading. The length B of the joint area 5a is configured to be longer than the length A of the nozzle arrangement area 1a. Furthermore, the length C of the common flow paths 4 and 11 is configured to be shorter than the length A.

[0046] According to this configuration, in the entire area of ​​the nozzle configuration region 1a, the tensile stress generated during the bonding and fixing of the adhesive 5 acts uniformly, therefore, as Figure 9 As shown, an inkjet head 18 can be provided that can suppress uneven jetting speeds 19 near both ends, suppress uneven jetting speeds within the nozzle arrangement region 1a, and suppress image quality degradation. Furthermore, the distance between the end of the nozzle arrangement region 1a and the end of the engagement region 5a, i.e., the difference between lengths A and B at the two ends, is preferably set to 1 mm or more. Additionally, since length C is shorter than length A, the inkjet head 18 can be miniaturized.

[0047] In addition, since the frame component 22 has an opening 23 in the central part, the tensile stress generated during bonding and fixing can be reduced, and the unevenness of the spray speed in the nozzle configuration area 1a can be further suppressed.

[0048] In addition, in order to reduce the effect of stress on the vibrating plate 7, such as Figure 1As shown, preferably, the frame member 22, like the frame member 12, is not bonded to the holding substrate 10. This suppresses uneven spray velocity. Even when bonded to the holding substrate 10, uneven spray velocity can be suppressed by bonding within a range wider (longer) than the nozzle configuration area 1a. Furthermore, it is preferable that the flow path substrate 3 and the frame member 12 are in... Figure 1 The inkjet head 18 shown is engaged at a position further outward than the diaphragm 7 in the short-side direction. This configuration reduces the stress on the diaphragm 7 and suppresses uneven jetting speed.

[0049] Figure 10 The diagram shows a top view of the main parts of the nozzle substrate 24, flow path substrate 25, and frame member 26 according to the second embodiment of the present invention. A plurality of nozzles 1 are formed in the nozzle substrate 24, and a nozzle arrangement region 1a is provided. In the flow path substrate 25, [the following is a description of the nozzle arrangement region 26, which is not directly related to the previous sentence]... Figure 6 Similarly, two common flow paths 4A are provided. Furthermore, the flow paths other than the common flow path 4A in the flow path substrate 25 are omitted from the diagram. In the frame component 26, there are two locations with... Figure 6 Similarly, the common flow path 11A, which serves as another common flow path, has an opening 23 at its center in the width direction. The frame member 26 has a joining region 5a, the length B of which is longer than the length A of the nozzle arrangement region 1a. The lengths C of the common flow paths 4A and 11A are also longer than the length A of the arrangement region 1a.

[0050] Based on this configuration, similarly to the first embodiment, an inkjet head 18 can be provided that can seal the area around the shared flow paths 4 and 11 using adhesive 5, such as... Figure 11 As shown, it can suppress uneven jetting speeds 19 near both ends, suppress uneven jetting speeds within the nozzle configuration area 1a, and suppress image quality degradation. Furthermore, since length C is longer than length A, ink can be supplied equally to all nozzles 1 within the nozzle configuration area 1a, further homogenizing the ink jetting speed.

[0051] Figure 12 The figure shown is a third embodiment of the present invention. This third embodiment is related to... Figure 8 Compared to the first embodiment shown, the only difference is that the bonding region 5a has an unbonded portion 5b without adhesive 5 applied to it, located on the outer side of the common flow paths 4 and 11 in the longitudinal direction; otherwise, the configuration is the same. Furthermore, the diagrams of flow paths other than the common flow path 4 in the flow path substrate 21 are omitted.

[0052] By configuring it in this way, the area in which the adhesive 5 is actually coated in the bonding region 5a is approximately equal to that in the nozzle configuration region 1a, and uniform tensile stress can be applied to the entire area of ​​the nozzle configuration region 1a, thereby further suppressing uneven spraying speed.

[0053] Furthermore, in the third embodiment, since the width of the unbonded portion 5b is the same as the width of the common flow path 11, the area in the bonding region 5a where the adhesive 5 is actually applied can be made closer to the area of ​​the nozzle arrangement region 1a. This allows uniform tensile stress to be applied to the entire area of ​​the nozzle arrangement region 1a, thereby further suppressing uneven spraying speed.

[0054] Furthermore, since the unbonded portion 5b extends to a position further outward than the nozzle arrangement area 1a in the length direction (the length D between the two outer ends of the unbonded portion 5b is longer than the length A), the area in the bonding area 5a where the adhesive 5 is actually applied can be made closer to the area of ​​the nozzle arrangement area 1a. This allows uniform tensile stress to be applied to the entire area of ​​the nozzle arrangement area 1a, thereby further suppressing uneven spraying speed.

[0055] Furthermore, since adhesive 5 is applied to the outer portion of the unbonded portion 5b along its length, the bonding area 5a forms a closed space that surrounds the unbonded portion 5b, thus reliably preventing ink leakage in the common flow paths 4 and 11.

[0056] Next, other liquid jetting devices equipped with inkjet heads 18 will be described.

[0057] like Figure 13 , Figure 14 As shown, the printing apparatus 500, which is a liquid jetting device, includes: an input means 501 for inputting a continuous medium 510 as the recording medium; and a guide transport means 503 for guiding and transporting the continuous medium 510 input by the input means 501 to the printing means 505. Furthermore, the printing apparatus 500 includes: a printing means 505 for performing a printing operation that jets liquid droplets from the continuous medium 510 to form an image; a drying means 507 for drying the continuous medium 510 with attached liquid droplets; and an output means 509 for outputting the continuous medium 510.

[0058] The continuous material 510 is fed out from the initial winding roller 511 of the input means 501, and is guided and conveyed by the rollers of the input means 501, the guide conveying means 503, the drying means 507, and the output means 509, and is wound onto the winding roller 591 of the output means 509. In the printing means 505, the continuous material 510 is conveyed on the transport guide member 559 facing the printhead unit 550, which is a liquid jetting unit, and the image is printed by the droplets ejected from the printhead unit 550.

[0059] The printing apparatus 500 has liquid jetting units 100A and 100B on the printhead unit 550, and each liquid jetting unit 100A and 100B is respectively mounted on a common base component 552.

[0060] When the arrangement direction of the inkjet heads 18 in a direction orthogonal to the continuous transport direction is set as the printhead arrangement direction, each liquid jetting unit 100A and 100B ejects droplets of the same color from the group of printhead rows 100A1 and 100A2 of liquid jetting unit 100A. Similarly, the group of printhead rows 100B1 and 100B2 of liquid jetting unit 100A, the group of printhead rows 100C1 and 100C2 of liquid jetting unit 100B, and the group of printhead rows 100D1 and 100D2 of liquid jetting unit 100B eject liquids of the desired color, respectively.

[0061] Next, based on Figure 15 as well as Figure 16 Another example of a printing apparatus that is a liquid jetting device according to the present invention will be described.

[0062] The printing apparatus 400, which is a liquid jetting device, is a serial printing apparatus. The carriage 403 reciprocates in the main scanning direction via the main scanning moving mechanism 493. The main scanning moving mechanism 493 includes a guide member 401, a main scanning motor 405, and a timing belt 408. The guide member 401 is mounted on the left and right side plates 491A and 491B, holding the carriage 403 in a movable position. The carriage 403 receives the driving force of the main scanning motor 405 via the timing belt 408 mounted between the drive pulley 406 and the driven pulley 407, thereby reciprocating in the main scanning direction.

[0063] A liquid jetting unit 440, which integrates an inkjet head 18 and a printhead reservoir 441, is mounted on a carriage 403. Here, the inkjet head 18 jets liquids of various colors, such as yellow (Y), cyan (C), magenta (M), and black (K). Furthermore, the inkjet head 18 is mounted with a nozzle array consisting of multiple nozzles arranged along a sub-scanning direction orthogonal to the main scanning direction, and with the liquid jetting direction downwards. The inkjet head 18 is connected to a liquid circulation device (not shown), which circulates and supplies the desired color of liquid to the inkjet head 18.

[0064] The printing apparatus 400 includes a transport mechanism 495 for transporting paper 410, which is the recording medium. The transport mechanism 495 has a transport belt 412 as a transport means and a sub-scanning motor 416 for driving the transport belt 412. The transport belt 412, which is a loop belt, is mounted between a transport roller 413 and a tension roller 414, adsorbs the paper 410, and transports it at a position opposite to the inkjet head 18. Adsorption is carried out by electrostatic adsorption or air suction, etc. The driving force of the sub-scanning motor 416 is transmitted via a synchronous belt 417 and a synchronous pulley 418, causing the transport belt 412 to move around in the sub-scanning direction.

[0065] On one side of the carriage 403 in the main scanning direction and on the side of the conveyor belt 412, a maintenance and recovery mechanism 420 for maintaining and recovering the inkjet head 18 is arranged. The maintenance and recovery mechanism 420 is composed, for example, a cover member 421 that covers the nozzle surface of the inkjet head 18 and a wiping member 422 that wipes the nozzle surface. In addition, the main scanning movement mechanism 493, the maintenance and recovery mechanism 420, and the transport mechanism 495 are mounted on a frame including side plates 491A, 491B and a back plate 491C.

[0066] In the printing apparatus 400 configured as described above, paper 410 is attracted by conveyor belt 412 and transported in the sub-scanning direction by the circular movement of conveyor belt 412. At this time, by moving carriage 403 in the main scanning direction and driving inkjet head 18 according to image signal, liquid is sprayed onto the stopped paper 410 to form an image.

[0067] Next, we will refer to Figure 17 The above liquid injection unit 440 is described.

[0068] The liquid jetting unit 440 consists of a frame portion consisting of side plates 491A, 491B and a back plate 491C, a main scanning movement mechanism 493, a carriage 403, an inkjet head 18 and other components that constitute the printing apparatus 400 as a liquid jetting device.

[0069] Alternatively, the liquid injection unit 440 may also be configured to further install the aforementioned maintenance and recovery mechanism 420 in, for example, the side plate 491B.

[0070] Next, according to Figure 18 To illustrate another example of a liquid injection unit according to an embodiment of the present invention.

[0071] Figure 18The liquid jetting unit 450 shown has an inkjet head 18 on which a flow path component 444 is mounted and a tube 456 connected to the flow path component 444. The flow path component 444 is disposed inside a cover 442, and a connector 443 for electrical connection with the inkjet head 18 is provided on the upper part of the flow path component 444. Alternatively, the configuration may include a printhead canister 441 instead of the flow path component 444.

[0072] In the liquid jetting units 100A, 100B, 440, 450, 550 including the inkjet head 18 described above, and in the printing apparatuses 400 and 500 which are liquid jetting devices, the same effect as that in the inkjet head 18 can be obtained.

[0073] In this invention, the liquid used only needs to have a viscosity and surface tension suitable for ejection from the liquid jet nozzle; its properties are not particularly limited, but it is preferred that the viscosity be below 30 MPa·s at room temperature and pressure or through heating and cooling. Specifically, this includes solvents such as water or organic solvents, colorants such as dyes and pigments, polymeric compounds, resins, functional materials such as surfactants, biocompatible materials such as DNA, amino acids and proteins, calcium, and edible materials such as natural pigments, including solutions, suspensions, emulsions, etc. For example, these can be used as inkjet inks, surface treatment liquids, and three-dimensional modeling material liquids.

[0074] Energy sources for jetting liquids include thermal actuators that use electrothermal conversion elements such as actuators (layered piezoelectric elements and thin-film piezoelectric elements) and heating resistors, and electrostatic actuators that consist of a vibrating plate and opposing electrodes.

[0075] "Liquid jet head" is not limited to the pressure generating mechanism used. For example, in addition to the piezoelectric actuators mentioned above (a stacked piezoelectric element may also be used), thermal actuators with electrothermal conversion elements such as heating resistors, electrostatic actuators consisting of a vibrating plate and a counter electrode, etc., may also be used.

[0076] A "liquid spraying unit" is an assembly of functional parts and mechanisms integrated into a liquid spraying head, including parts related to liquid discharge. For example, a "liquid spraying unit" includes at least one of the following components combined with a liquid spraying head: a nozzle tank, a carriage, a supply mechanism, a maintenance and recovery mechanism, a main scanning movement mechanism, and a liquid circulation device.

[0077] Here, integration refers to the mutual fixation of, for example, liquid injection heads and functional parts or mechanisms through fastening, bonding, or locking, whereby one is kept movable relative to the other. Furthermore, liquid injection heads and functional parts or mechanisms can also be assembled and disassembled.

[0078] The liquid injection unit includes a liquid injection unit that integrates a liquid injection head and a nozzle tank, as well as a liquid injection unit in which the two are connected to each other via pipes or the like. Here, a unit including a filter can be added between the liquid injection head and the nozzle tank of these liquid injection units.

[0079] In addition, as a liquid jetting unit, there are liquid jetting units that integrate the liquid jetting head and the carriage, and liquid jetting units that integrate the liquid jetting head, the carriage, and the main scanning movement mechanism. Furthermore, as a liquid jetting unit, there are also units that movably hold the liquid jetting head onto a guide member that forms part of the scanning movement mechanism, thereby integrating the liquid jetting head and the scanning movement mechanism.

[0080] As a liquid injection unit, a cover component, which is part of the maintenance and recovery mechanism, is fixed on the carriage on which the liquid injection head is mounted, thereby integrating the liquid injection head, carriage, and maintenance and recovery mechanism. Furthermore, as a liquid injection unit, a hose is connected to the liquid injection head, which is fitted with a nozzle canister or flow channel component, thereby integrating the liquid injection head and the supply mechanism. Liquid from the liquid storage source is supplied to the liquid injection head through this hose.

[0081] The main scanning movement mechanism also includes a guide component unit. The supply mechanism also includes a hose unit and a filling unit unit.

[0082] In this invention, the liquid injection unit is described in the context of a combination with a liquid injection head, but the liquid injection unit also includes a configuration that integrates a nozzle module or nozzle unit having the liquid injection head with the aforementioned functional parts and mechanisms.

[0083] The liquid spraying device includes a liquid spray head, a liquid spraying unit, a nozzle module, and a nozzle unit, and includes a liquid spraying device that drives the liquid spray head to spray liquid. The liquid spraying device is not only a device that can spray liquid relative to an object to which the liquid can adhere, but may also include a device that sprays liquid into a gas or liquid.

[0084] Liquid jetting devices may also include means for feeding, conveying, and discharging liquid-adherent materials, as well as other pre-treatment and post-treatment devices.

[0085] For example, examples of liquid jetting devices include image forming apparatuses that form images by jetting ink onto a recording medium, and three-dimensional modeling apparatuses that jet modeling liquid into a powder layer in which powder is formed in layers to shape a three-dimensional object.

[0086] Furthermore, liquid jetting devices are not limited to visualizing interesting images such as text and graphics through jetting liquid. For example, they also include creating graphics that are not inherently meaningful, as well as shaping three-dimensional images.

[0087] The aforementioned substances that can adhere to liquids refer to substances to which liquids can adhere at least temporarily, meaning substances that stick or permeate after adhesion. Specific examples include recording media such as paper, film, and cloth, as well as electronic components such as electronic substrates and piezoelectric elements, powder layers, organ models, and inspection units. Unless otherwise specified, this includes all substances to which liquids can adhere.

[0088] The material to which liquids can adhere is any material, such as paper, silk, fiber, cloth, leather, metal, plastic, glass, wood, ceramics, etc., even if the liquid can adhere temporarily.

[0089] A liquid jetting device comprises a liquid jetting head and a component on which liquid can adhere, which move relative to each other, but the moving component is not limited to either side. Specific examples include serial devices that move the liquid jetting head and linear devices that do not move the liquid jetting head.

[0090] In addition, as liquid spraying devices, examples include: a treatment liquid coating device that coats the surface of paper with a treatment liquid for purposes such as modifying the surface of paper, and sprays the treatment liquid onto the paper surface; and a spray granulation device that granulates the raw material particles by spraying a composition liquid formed by dispersing the raw material in a solution through a nozzle.

[0091] The liquid injection device of the present invention also includes an apparatus for manufacturing electrodes and electrochemical elements. The apparatus for manufacturing electrodes will be described below.

[0092] Figure 19 The diagram shown is a schematic representation of an example of an electrode manufacturing apparatus according to an embodiment of the present invention. The electrode manufacturing apparatus 700 is an apparatus for manufacturing an electrode comprising a layer having an electrode material by spraying a liquid composition using a liquid spraying unit including a liquid spraying head.

[0093] First, the means and process for forming the layer containing electrode material will be explained.

[0094] Figure 19The electrode manufacturing apparatus 700 shown includes a liquid jetting means of the liquid jetting unit of the present invention described above. By jetting a liquid composition from a liquid jetting head provided by the liquid jetting unit, the liquid composition is applied to the target object, forming a liquid composition layer. The target object (hereinafter, sometimes referred to as the "jetting target object") can be any object that forms a layer containing electrode material; there are no particular limitations, and it can be appropriately selected according to the purpose. Examples of target objects include electrode substrates (current collectors), active material layers, and layers containing solid electrode material. Alternatively, the target object can be an electrode composite material layer containing active material on an electrode substrate. Furthermore, as long as a layer containing electrode material can be formed on the jetting target object, the jetting means and jetting process can also be means and processes for forming a layer containing electrode material by directly jetting the liquid composition. The jetting means and jetting process can also be means and processes for forming a layer containing electrode material by indirectly jetting the liquid composition.

[0095] Next, the other components and processes will be explained.

[0096] Other components included in the apparatus for manufacturing the electrode composite layer are not particularly limited, as long as they do not impair the effects of the present invention, and can be appropriately selected according to the purpose. Similarly, other steps included in the method for manufacturing the electrode composite layer are not particularly limited, as long as they do not impair the effects of the present invention, and can be appropriately selected according to the purpose. For example, components and steps included in the apparatus and method for manufacturing the electrode composite layer may include heating mechanisms and heating steps.

[0097] Next, the heating method and heating process will be explained.

[0098] The heating mechanism included in the apparatus for manufacturing the electrode composite layer is a mechanism for heating the liquid composition sprayed by a spraying means. Furthermore, the heating step included in the method for manufacturing the electrode composite layer is a step for heating the liquid composition sprayed during the spraying step. By heating the liquid composition, the liquid composition can be dried.

[0099] Next, the structure for forming a layer containing electrode material by direct spraying of a liquid composition will be described. Here, as an example of an electrode manufacturing apparatus for forming a layer containing electrode material, an electrode manufacturing apparatus for forming an electrode composite material layer containing an active substance on an electrode substrate (current collector) will be described. Figure 19 As shown, the electrode manufacturing apparatus 700 includes a spraying process unit 110, which includes a process of applying a liquid composition to a printing substrate material 704 having a spraying target to form a liquid composition layer, and a heating process unit 130, which includes a heating process of heating the liquid composition layer to obtain an electrode composite material layer.

[0100] The electrode manufacturing apparatus 700 includes a conveying means 705 for conveying a printing substrate 704. The conveying means 705 conveys the printing substrate 704 in the order of the jetting process section 110 and the heating process section 130 at a preset speed. There are no particular limitations on the manufacturing method of the printing substrate material 704, which is the object to be jetted, such as having an active material layer; any known method can be appropriately selected. The jetting process section 110 includes a liquid jetting head 281a for performing the application process of applying a liquid composition to the printing substrate material 704, a receiving container 281b for containing a liquid composition 707, and a supply pipe 281c for supplying the liquid composition 707 in the receiving container 281b to the liquid jetting head 281a.

[0101] In the spraying process section 110, liquid composition 707 is sprayed from liquid spray head 281a and applied to printing substrate material 704 to form a thin film-like liquid composition layer. Furthermore, the receiving container 281b can be integrated with the electrode composite material layer manufacturing apparatus, or it can be removed from the electrode composite material layer manufacturing apparatus. Alternatively, the receiving container 281b can be an integrated container with the electrode composite material layer manufacturing apparatus, or it can be a container for adding to a receiving container that can be removed from the electrode composite material layer manufacturing apparatus.

[0102] The container 281b and the supply tube 281c can be chosen arbitrarily as long as they can stably contain and supply the liquid composition 707.

[0103] In the heating process section 130, a solvent removal process is performed to remove the solvent remaining in the liquid composition layer by heating. Specifically, drying is achieved by heating with the heating device 703 provided in the heating process section 130, thereby removing the solvent remaining in the liquid composition layer and forming the electrode composite material layer. Alternatively, the solvent removal process in the heating process section 130 can also be performed under reduced pressure.

[0104] There are no particular limitations on the heating device 703, and it can be appropriately selected according to the purpose. For example, substrate heaters, IR heaters, and hot air heaters can be used as heating devices 703. In addition, the heating device 703 may also be a device that combines at least two of the substrate heater, IR heater, and hot air heater. Furthermore, the heating temperature and heating time can be appropriately selected based on the boiling point of the solvent contained in the liquid composition 707 or the film thickness formed.

[0105] In the electrode manufacturing apparatus 700, the same liquid jet head as the inkjet head 18 described above is used as the liquid jet head 281a.

[0106] By using the electrode manufacturing apparatus 700 according to an embodiment of the present invention, a liquid composition can be sprayed onto a target location of an object to be sprayed. The electrode composite material layer can preferably be used as part of the structure of an electrochemical element, for example. There are no particular limitations on the components other than the electrode composite material layer in the electrochemical element, and known structures can be appropriately selected. Examples of components other than the electrode composite material layer include, for instance, a positive electrode, a negative electrode, and a separator.

[0107] The present invention can be described, for example, as follows.

[0108] [1] A liquid jetting head includes: a nozzle substrate having a nozzle configuration area for a plurality of nozzles for jetting liquid; a flow path substrate having a common flow path communicating with the nozzles; a piezoelectric element substrate having an independent flow path communicating with the nozzles, a vibrating plate formed to cover the independent flow path, and a piezoelectric element disposed on the independent flow path; a holding substrate having a recess in the vibrating area of ​​the piezoelectric element; and a frame member having other common flow paths communicating with the common flow path, wherein the size of the flow path substrate in the short side direction is greater than the size of the piezoelectric element substrate and the holding substrate in the short side direction, the flow path substrate and the frame member are joined directly or via a member thinner than the piezoelectric element substrate on the outside of the piezoelectric element substrate and the holding substrate in the short side direction, the common flow path and the other common flow paths are joined to each other by an adhesive, and the length of the joint area of ​​the common flow path and the other common flow paths is longer than the length of the nozzle configuration area.

[0109] [2] According to the liquid injection head of [1], the length of the common flow path and the other common flow paths is shorter than the length of the nozzle configuration area.

[0110] [3] According to the liquid injection head described in [1], the length of the common flow path and the other common flow paths is longer than the length of the nozzle configuration area.

[0111] [4] The liquid jet head according to any one of [1] to [3] is characterized in that: in the joint area, the portion outside the common flow path and the other common flow path includes an unbonded portion without adhesive.

[0112] [5] The liquid jet head according to [4] is characterized in that: the width of the unbonded portion is the same as the width of the common flow path and the other common flow paths.

[0113] [6] The liquid jet head according to [4] or [5] is characterized in that: the unbonded portion extends to a position outside the nozzle configuration area.

[0114] [7] The liquid spray head according to any one of [4] to [6] is characterized in that: an adhesive is applied to the outer side of the unbonded portion.

[0115] [8] The liquid jet head according to any one of [1] to [7] is characterized in that: the frame component and the retaining substrate are not directly joined.

[0116] [9] The liquid injection head according to any one of [1] to [8] is characterized in that: the frame component has an opening formed by a through port.

[0117]

[10] A liquid injection unit, characterized in that it has a liquid injection head as described in any one of [1] to [9].

[0118]

[11] A liquid injection device, characterized in that it has a liquid injection head as described in any one of [1] to [9].

[0119]

[12] A liquid injection device, characterized in that it has the liquid injection unit described in

[10] .

[0120] While the preferred embodiments of the present invention have been described above, the present invention is not limited to the specific embodiments described above. Various modifications and alterations can be made within the scope of the concept of the present invention as described in the scope of the claims, unless otherwise specified in the above description.

[0121] The effects described in the embodiments of this invention are merely examples of the best effects produced by this invention, and the effects of this invention are not limited to those described in the embodiments of this invention.

Claims

1. A liquid injection head, characterized in that... include: A nozzle substrate having a nozzle configuration area in which multiple nozzles for spraying liquid are configured; A flow path substrate having a common flow path in communication with the nozzle; A piezoelectric element substrate having an independent flow path communicating with the nozzle, a vibrating plate formed to cover the independent flow path, and a piezoelectric element disposed on the independent flow path; The substrate has a recess in the vibration region of the piezoelectric element, and Frame components having other common flow paths communicating with the common flow path. The size of the flow path substrate in the short side direction is greater than the size of the piezoelectric element substrate and the holding substrate in the short side direction. The flow path substrate and the frame component are joined in the short side direction directly or via a component thinner than the piezoelectric element substrate to the outside of the piezoelectric element substrate and the holding substrate. The common flow path is joined to the other common flow paths by an adhesive, and the length of the joint area between the common flow path and the other common flow paths is longer than the length of the nozzle configuration area.

2. The liquid injection head according to claim 1, characterized in that: The length of the shared flow path and the other shared flow paths is shorter than the length of the nozzle configuration area.

3. The liquid injection head according to claim 1, characterized in that: The length of the shared flow path and the other shared flow paths is longer than the length of the nozzle configuration area.

4. The liquid injection head according to claim 1, characterized in that: In the bonding area, the portion outside the common flow path and the other common flow paths includes an unbonded portion without adhesive coating.

5. The liquid injection head according to claim 4, characterized in that: The width of the unbonded portion is the same as the width of the common flow path and the other common flow paths.

6. The liquid injection head according to claim 4, characterized in that: The unbonded portion extends to a position further outward than the nozzle configuration area.

7. The liquid injection head according to claim 4, characterized in that: An adhesive is applied to the outer side of the unbonded portion.

8. The liquid injection head according to claim 1, characterized in that: The frame component and the retaining substrate are not directly joined.

9. The liquid injection head according to claim 1, characterized in that: The frame component has an opening formed by a through-hole.

10. A liquid injection unit, characterized in that: Includes the liquid injection head according to any one of claims 1 to 9.

11. A liquid injection device, characterized in that: Includes the liquid jet head according to any one of claims 1 to 9.

12. A liquid injection device, characterized in that: Includes the liquid injection unit as described in claim 10.

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