Channel component, liquid ejection head, and recording device
The use of a resin film with a lower Young's modulus between adhesive layers in liquid ejection heads addresses adhesive strength and uniformity issues, improving durability by enhancing adhesive strength and reducing fractures.
WO2026116292A1PCT designated stage Publication Date: 2026-06-04KYOCERA CORP
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- KYOCERA CORP
- Filing Date
- 2025-11-25
- Publication Date
- 2026-06-04
AI Technical Summary
Technical Problem
Existing liquid ejection heads face issues with adhesive strength and uniformity at the interface between metal components, leading to potential adhesion defects and stress concentration, which can cause fractures.
Method used
A configuration involving a resin film with a lower Young's modulus interposed between adhesive layers bonded to metal surfaces of flow channel members, enhancing adhesive strength and reducing the likelihood of fractures.
Benefits of technology
The resin film improves adhesive strength by approximately 1.5 times, mitigating adhesion defects and stress concentration, thereby enhancing the durability and reliability of the liquid ejection head.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure JP2025040918_04062026_PF_FP_ABST
Abstract
In this channel component, a first channel member has a first surface and a portion of a channel. A second channel member has a second surface facing the first surface, and another portion of the channel. A first adhesive layer is bonded to the first surface. A second adhesive layer is bonded to the second surface. A resin film is bonded to the first adhesive layer and the second adhesive layer therebetween. The resin film has a Young's modulus lower than that of the first adhesive layer. The first surface is made of metal.
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