Film
A (meth)acrylic resin and alumina particle film with optimized particle size and roundness distribution addresses adhesive failure and conductivity issues, offering a thin, highly adhesive, and thermally conductive solution for heat dissipation.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- SUMITOMO CHEM CO LTD
- Filing Date
- 2025-11-25
- Publication Date
- 2026-06-04
AI Technical Summary
Existing heat dissipation materials used between electronic components and heat sinks face issues with adhesive failure due to shear stress, leading to decreased thermal conductivity, especially when thick, and there is a need for a thin, highly adhesive, and thermally conductive film to improve heat dissipation.
A film composed of a (meth)acrylic resin and alumina particles, where alumina particles constitute 50% or more of the solid content, with specific particle size distribution and roundness, ensuring a thickness-to-particle size ratio that enhances adhesion and thermal conductivity.
The film provides excellent adhesion and thermal conductivity, maintaining high performance even in thin films less than 100 μm, addressing the adhesive failure and conductivity issues of previous materials.
Smart Images
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