Flexible electromagnetic wave absorber

A lightweight, flexible electromagnetic wave absorber with a single dielectric and absorber layer, utilizing a conductive polymer coating, addresses the challenges of conventional absorbers by achieving thin, efficient electromagnetic wave absorption on curved surfaces, reducing RCS effectively.

WO2026116952A1 Publication Date: 2026-06-04GSS CO LTD +1
5 Cites 0 Cited by

Patent Information

Application Number
PCT/KR2025/019691
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-10-14
Filing Date
2025-11-25
Publication Date
2026-06-04

AI Technical Summary

Technical Problem

Conventional electromagnetic wave absorbers are difficult to manufacture due to their complex structures, are heavy, and are not easily applicable to surfaces with many curved parts, limiting their effectiveness in reducing Radar Cross Section (RCS) for aircraft and drones.

Method used

A lightweight, flexible electromagnetic wave absorber composed of a single dielectric layer and a single absorber layer, which can be applied in a double-layer configuration using a conductive polymer coating, achieving excellent electromagnetic wave absorption performance without the need for multiple dielectric layers.

Benefits of technology

The absorber achieves a thin thickness of 1 mm or less, secures -4 dB performance when coated on one side and an additional -3 dB when coated on both sides, optimizing performance in the X-band and extending to the Ku-band, while being lightweight and easy to apply to curved surfaces, thus enhancing stealth capabilities.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The present invention provides a flexible electromagnetic wave absorber that is lightweight and bendable by being composed of a single dielectric layer and a single absorber layer, and thus can be easily applied for electromagnetic wave absorption of an aircraft. The flexible electromagnetic wave absorber according to the present invention comprises: a dielectric layer; an adhesive layer evenly distributed on the upper surface of the dielectric layer and bonded to the dielectric layer; a film layer on the upper surface of the adhesive layer, which is bonded to the adhesive layer; and a conductor layer applied in a predetermined shape onto the film layer.
Need to check novelty before this filing date? Find Prior Art