Vapor chamber with three-dimensional heat dissipation structure

Abstract

Disclosed in the present application is a vapor chamber with a three-dimensional heat dissipation structure. The vapor chamber comprises a body, a flow channel structure and at least one heat dissipation structure, wherein the body comprises a chamber, at least one extension portion, and a first surface and a second surface arranged opposite each other; the extension portion is adjacent to the chamber; and the flow channel structure is arranged in the chamber, and is filled with a fluid for absorbing heat generated by a heating assembly. The heat dissipation structure is arranged on the extension portion and comprises a plurality of heat dissipation fins protruding from the first surface and used for conducting the heat absorbed by the flow channel structure from the heating assembly, and a plurality of hollowed-out portions are provided between each heat dissipation fin and the first surface.

Description

Heat-conducting plate with three-dimensional heat dissipation structure Technical Field

[0001] This application relates to a heat dissipation structure, and more particularly to a heat-conducting plate with a three-dimensional heat dissipation structure that utilizes fluid to absorb heat generated by electronic components and can circulate heat dissipation. Background Technology

[0002] Existing heat dissipation structures, in order to quickly dissipate heat generated by heat sources, incorporate devices such as water radiators, heat pipes, fans, or fins. However, these multiple media are typically connected by welding or bonding, and the connecting materials create thermal resistance, affecting heat dissipation efficiency. Therefore, some manufacturers have developed vapor chambers that attach to electronic components, such as CPUs, GPUs, or LEDs—components that generate heat—and utilize fluid to absorb heat, thereby lowering the temperature of the electronic components and enabling them to maintain normal operation. However, traditional vapor chambers are usually planar, occupying a large area, and if bent, the internal water channels are disrupted, making them unsuitable for the limited space inside a computer. Furthermore, the use of a single vapor chamber is insufficient to handle the heat generated by today's high-performance processors. Therefore, how to configure a heat dissipation structure that can significantly improve heat dissipation within a limited space is a pressing issue that needs to be addressed. Technical issues

[0003] The purpose of this application is to provide a heat-conducting plate that can absorb the heat generated by the heating component using a fluid and conduct the heat out through an integrally molded heat dissipation structure. Technical solutions

[0004] To solve the above problems, the technical solution provided in this application is as follows:

[0005] This application provides a heat-conducting plate for removing heat generated by a heating element. The heat-conducting plate includes a body, a flow channel structure, and at least one heat dissipation structure. The body includes a chamber, at least one extension, and a first surface and a second surface disposed opposite to each other. The extension is adjacent to the chamber, and the first surface and the second surface are disposed along the chamber and the extension, and the chamber is attached to the heating element. The flow channel structure is disposed in the chamber and is filled with a fluid to absorb heat generated by the heating element. The heat dissipation structure is disposed on the extension and includes a plurality of heat dissipation strips. The plurality of heat dissipation strips protrude from the first surface and are used to conduct the heat absorbed by the flow channel structure from the heating element, and each heat dissipation strip has a plurality of cutouts between itself and the first surface.

[0006] Preferably, the chamber includes a chamber wall surrounding the chamber, and the extension integrally extends from the chamber wall to conduct heat absorbed from the heat-generating component by the flow channel structure, wherein the heat dissipation structure, the extension and the chamber wall together constitute a single, complete structure.

[0007] Preferably, the plurality of heat dissipation strips are arranged in rows with intervals between them, and the row of heat dissipation strips closest to the chamber has a gap between it and the chamber.

[0008] Preferably, the chamber is provided with the extension on each of its two opposite sides, and each extension is provided with the heat dissipation structure.

[0009] Preferably, the two extensions are bent toward the first surface of the cavity relative to the cavity.

[0010] Preferably, there are multiple heat dissipation structures, with one heat dissipation structure disposed on the corresponding second surface of the extension and another heat dissipation structure disposed on the first surface.

[0011] Preferably, the material of the heat dissipation structure is the same as the material of the extension, and the material is a metallic material, an alloy of the metallic material, or a covalent metal thereof.

[0012] Preferably, the overall thickness of the heat dissipation structure is at least three times greater than the thickness of the body.

[0013] Preferably, the flow channel structure includes a capillary structure having a plurality of interconnected flow channels distributed within the chamber, and the chamber is a vacuum chamber.

[0014] Preferably, each heat sink includes two connecting ends connected to the first surface, at least two wavy portions, and a plurality of protruding and recessed teeth formed on at least one surface of the cross section of the at least two wavy portions.

[0015] Preferably, the wave portion has at least one wave crest and at least one wave trough connecting the wave crest, and the hollow portion is between the wave crest, the wave trough and the first surface.

[0016] Preferably, the trough is integrally formed in the extension, and the heat dissipation strip and the extension together constitute a single, complete structure.

[0017] Preferably, the heat dissipation structure further includes multiple slots penetrating the extension, and the multiple slots are respectively located directly below the multiple hollow portions.

[0018] Preferably, the heat dissipation structure further includes at least one heat pipe, a portion of which is fixed to the heat sink strip, and another portion of which extends out of the heat sink strip and is bent.

[0019] Preferably, multiple heat dissipation structures are stacked on the extension. Beneficial effects

[0020] The heat-conducting plate of this application has an integral and complete individual structure consisting of a cavity and a heat dissipation structure. It absorbs the heat generated by the heat-generating component by using the flow channel structure in the cavity, and directly conducts the heat out of the cavity wall through the stamped heat dissipation structure. This can significantly improve the heat dissipation effect, reduce production costs and strengthen the structural strength, and successfully solve the problem that the planar configuration of traditional heat spreaders is limited and cannot effectively dissipate heat and cool down. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 is a cross-sectional schematic diagram of a heat-conducting plate according to one embodiment of this application.

[0023] Figure 2 is a side view of a heat-conducting plate according to one embodiment of this application.

[0024] Figure 3 is a side view of a heat-conducting plate according to one embodiment of this application.

[0025] Figure 4 is a partial perspective view of the heat dissipation structure of one embodiment of this application.

[0026] Figure 5 is a side view of a heat-conducting plate according to one embodiment of this application.

[0027] Figure 6 is a top view of a heat-conducting plate according to one embodiment of this application.

[0028] Figure 7 is a side view of a heat-conducting plate according to one embodiment of this application. Embodiments of the present invention

[0029] The following descriptions of the embodiments are based on the accompanying illustrations, illustrating specific embodiments in which this application can be implemented. Directional terms used in this application, such as [up], [down], [front], [back], [left], [right], [inner], [outer], [side], etc., are merely for reference to the accompanying drawings. Therefore, the directional terms used are for illustration and understanding of this application, and not for limiting this application. In the figures, structurally similar units are denoted by the same reference numerals. In the figures, the thickness of some layers and regions is exaggerated for clarity and ease of description. That is, the dimensions and thicknesses of each component shown in the figures are arbitrarily shown, but this application is not limited thereto.

[0030] This application is specifically described with reference to the following examples, which are merely illustrative. Various modifications and refinements can be made by those skilled in the art without departing from the spirit and scope of this disclosure. Therefore, the scope of protection of this disclosure shall be determined by the appended claims. Throughout the specification and claims, unless explicitly stated otherwise, the words “a” and “described” mean that such a description includes “a or at least one” of the stated components or ingredients. Furthermore, as used in this application, the singular article also includes a description of a plurality of components or ingredients unless it is clearly apparent from the specific context that a plurality is excluded. Moreover, when applied in this description and throughout the claims below, unless explicitly stated otherwise, “in which” may mean both “in which” and “on which”.

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0032] This application provides a heat-conducting plate with a three-dimensional heat dissipation structure for removing heat generated by a heat-generating component. Specifically, the heat-generating component can be, for example, a central processing unit, a graphics processing unit, or a light-emitting component that generates heat, but is not limited to these. Referring to FIG1, FIG1 is a cross-sectional schematic diagram of a heat-conducting plate according to an embodiment of this application. As shown in FIG1, the heat-conducting plate 1 provided by this application includes a body 10, a flow channel structure 13, and multiple heat dissipation structures 15. In this embodiment, the body 10 is a flat planar plate and includes a chamber 11, two extensions 12, and a first surface 101 and a second surface 102 disposed opposite to each other. Preferably, the body 10 is made of a metallic material, or may be an alloy of such a metallic material or its covalent metal, such as aluminum or copper or an alloy of any composition thereof, or such as aluminum nitride, graphite aluminum, graphene aluminum, graphene copper, carbon nanotube aluminum, carbon nanotube copper, aluminum silicon carbide, diamond aluminum, and the internal chamber 11 can be formed by casting. The chamber 11 includes a chamber wall 111, which surrounds the chamber 11 and is made into a closed vacuum chamber by vacuum extraction. A first surface 101 and a second surface 102 are arranged vertically relative to the chamber 11 and are respectively disposed along the chamber 11 and the extension 12, with the chamber wall 111 spaced apart from the first surface 101 and the second surface 102. In some embodiments, a heating element 51 is attached to the second surface 102 at a location corresponding to the chamber 11, and the heating element 51 is disposed on a circuit board 52 (as shown in FIG. 2, as detailed below).

[0033] As shown in Figure 1, a flow channel structure 13 is formed within a chamber 11 to absorb heat generated from the heating element (described later). In some embodiments, the flow channel structure 13 includes a capillary structure 131 having a plurality of interconnected flow channels 132 distributed within the chamber 11, and the flow channels 132 are filled with a fluid 130. The fluid 130 may be water, ammonia, sodium, methyl methacrylate, alcohol, etc., preferably water. The principle of heat absorption by the flow channel structure 13 of this application is the same as the working principle of a vapor chamber familiar in the art. Specifically, when heat is conducted from the heat source (i.e., the heating element) to the chamber, the fluid within the chamber begins to vaporize in a low-vacuum environment. When the vaporized working fluid comes into contact with a cooler area, condensation occurs, releasing the heat accumulated during evaporation. The condensed liquid working fluid flows back to the evaporation heat source through the capillary effect of the microstructure. The complete operation process is repeated in the chamber, which constitutes the operation mode of the heat spreader.

[0034] Referring again to FIG1, the extension 12 is adjacent to the chamber 11. In this embodiment, the chamber walls 111 on the left and right sides of the chamber 11 extend outward to form two extensions 12, that is, the extensions 12 extend integrally from the chamber walls 111 to conduct heat absorbed from the heat-generating component 51 by the flow channel structure 13. In particular, as shown in FIG1, a heat dissipation structure 15 is disposed on each extension 12. In some embodiments, the heat dissipation structure 15 is integrally formed on the extension 12, that is, the heat dissipation structure 15, the extensions 12, and the chamber walls 111 together constitute a single, complete structure. Specifically, the heat dissipation structure 15 forms a plurality of heat dissipation strips 151 by a stamping process, and the plurality of heat dissipation strips 151 protrude upward on the first surface 101 to conduct heat absorbed from the heat-generating component 51 by the flow channel structure 13. Since the heat sink 151 is formed by stamping the extension 12, each heat sink 151 forms multiple hollow portions 153 directly between itself and the first surface 101 after stamping, and simultaneously forms multiple slots 154 penetrating the extension 12. Specifically, the multiple slots 154 are located directly below the corresponding hollow portions 153. The hollow portions 153 and slots 154 provide a flow path for the high temperature on the surface of the heat sink 151 and can improve the heat dissipation effect through the heat sink 151. In particular, the integrally formed heat sink 151, hollow portions 153 and slots 154 do not require secondary processing, which can significantly reduce production costs and avoid the problem of structural strength being easily damaged by secondary processing.

[0035] As shown in Figure 1, multiple heat dissipation strips 151 are arranged in rows with spacing between them. The end of the heat dissipation strip 151 closest to the cavity 11 is integrally formed on the first surface 101 of the cavity 11, and a gap G1 is provided between it and the cavity wall 111 of the cavity 11. The gap G1 increases the structural strength of the connection between the heat dissipation structure 15 and the cavity wall 111. The material of the heat dissipation structure 15 is the same as that of the extension 12, both being metallic materials, preferably aluminum. In some embodiments, the heat dissipation structure 15 has an overall thickness T1, which is at least three times greater than the thickness T2 of the body 10. Thickness T1 is the distance from the top of the heat dissipation strip 151 to the first surface 101, and thickness T2 is the distance from the first surface 101 to the second surface 102. It should be noted that the thickness ratio shown in Figure 1 is only an example. Preferably, the thickness T1 of the heat dissipation structure 15 is at least 10 times greater than the thickness T2 of the body 10 to achieve better heat dissipation efficiency.

[0036] Referring to Figure 2 in conjunction with Figure 1, Figure 2 is a side view of a heat-conducting plate according to another embodiment of this application. The main difference between the heat-conducting plate shown in Figure 2 and the heat-conducting plate shown in Figure 1 is that the two extensions 12 are bent. As shown in Figure 1, the spacing G1 also provides sufficient space between the heat dissipation structure 15 and the cavity wall 111, allowing the two extensions 12 to bend relative to the cavity 11 towards the direction above the first surface 101 of the cavity 11, forming an arc-shaped bend, thereby avoiding damage to the flow channel structure 13 within the cavity 11. In some embodiments, the two bent extensions 12 are substantially parallel to each other, but they can also be inverted trapezoids that expand outwards in the opposite direction (not shown). This application does not limit the bending form of the extensions 12. As shown in Figure 2, each heat dissipation strip 151 is integrally formed with multiple wave portions 152 and two connecting ends 1523 connected to the first surface 101 by a stamping process. Specifically, each wave portion 152 has a crest 1521 and a trough 1522 connecting the crest 1521, and the hollow portion 153 is located between the crest 1521, the trough 1522 and the first surface 101. In this embodiment, the trough 1522 is integrally formed in the extension portion 12, that is, the trough 1522 is embedded in the extension portion 12 and is part of the extension portion 12. Preferably, the shape of the crest 1521 is triangular or arc-shaped. In some embodiments, the heat dissipation structure 15 further includes a plurality of fins 155 protruding from the first surface 101 and arranged in rows at intervals to increase the heat dissipation area and improve the heat dissipation effect. The fins 155 and the heat dissipation strips 151 are integrally formed in the same stamping process, which can reduce production costs and increase structural strength.

[0037] Referring to Figure 3, which is a side view of a heat-conducting plate according to another embodiment of this application, as shown in Figure 3, heat dissipation structures 15 are respectively provided on the first surface 101 and the second surface 102 of the extension 12 to improve the heat dissipation effect. In this embodiment, another heat dissipation structure 15 with heat dissipation strips 151 can be additionally welded to the corresponding second surface 102 of the extension 12 by welding. It should be noted that the additional heat dissipation structure 15 provided on the second surface 102 is a separate component and is not integrally formed on the extension 12. In other embodiments, heat dissipation structures 15 can also be formed by stamping on the corresponding first surface 101 and the second surface 102 of the extension 12 using a stamping process.

[0038] Referring to Figure 4, which is a partial perspective view of a heat dissipation structure according to one embodiment of this application, the heat dissipation structure 15 includes a plurality of heat dissipation strips 151, each including a plurality of wave portions 152 having crests 1521 and troughs 1522, and a plurality of protruding and recessed teeth 156 formed on at least one surface of the cross-section of the wave portion 152. Furthermore, fins 155 are integrally stamped onto the extension portion 12. The arrangement of the fins 155 and the protruding and recessed teeth 156 increases the heat dissipation area and improves the heat dissipation effect. In this embodiment, the troughs 1522 of the wave portions 152 are suspended above the extension portion 12, allowing heat to be directly conducted from the outermost two ends of the heat dissipation strips 151, thus improving the efficiency of heat conduction.

[0039] Referring to Figure 5, which is a side view of a heat-conducting plate according to one embodiment of this application, as shown in Figure 5, the first surface 101 and the second surface 102 of the body 10 are arranged from bottom to top relative to the chamber 11, and the heating component 51 is attached to the first surface 101. Preferably, the two extensions 12 are bent from the chamber 11, and the heat dissipation strips 151 are formed by stamping outward from the first surface 101 of the corresponding extensions 12 using a stamping process, and the heat dissipation strips 151 of the two extensions 12 are symmetrically integrally formed on the extensions 12 in opposite directions. In this embodiment, since the heat dissipation strip 151 on one of the extensions 12 is stamped in a direction away from the other extension 12, more space is provided between the two extensions 12 to facilitate the further installation of other heat dissipation devices or components (not shown). In some embodiments, depending on the heat dissipation design requirements, the crests 1521 of the multiple wave portions 152 of the heat dissipation strip 151 may be misaligned and their height relative to the first surface 101 may be progressively reduced.

[0040] Referring to Figure 6, which is a top view of a heat-conducting plate according to one embodiment of this application, the heat dissipation structure 15 also includes at least one heat pipe 17. Specifically, a portion of the heat pipe 17 is inserted into the hollow portion 153, and another portion of the heat pipe 17 extends out of the hollow portion 153 and is bent. In this embodiment, the heat pipe 17 is disposed along the hollow portion 153 below each heat sink 151. The heat pipe 17 can further improve the efficiency of heat conduction. In other embodiments, the heat pipe 17 can also be fixed between adjacent heat sinks 151 by welding; this application is not limited to the position where the heat pipe 17 is fixed to the heat-conducting plate 1.

[0041] Referring to Figure 7, which is a side view of a heat-conducting plate according to one embodiment of this application, multiple heat-conducting plates 1 can be stacked through heat pipes 17. As shown in Figure 7, the extension 12 of the lower heat-conducting plate 1 can be stacked upwards within the hollow portion 153 via heat pipes 17, allowing for the placement of another heat-conducting plate 1 with a heat dissipation structure 15, thus achieving diverse usage states of the heat dissipation structure of this application. In the above embodiments, the heat-conducting plate 1 of this application can also be used in conjunction with a fan (not shown) to dissipate heat from the casing (not shown) containing the heat-generating component 51. In other embodiments, the heat dissipation structures 15 can be connected to each other via heat pipes 17, or another heat dissipation structure can be added by welding to form a larger effective heat dissipation area.

[0042] In summary, the heat-conducting plate of this application has an integral and complete individual structure consisting of a cavity and a heat dissipation structure. It absorbs the heat generated by the heat-generating components by utilizing the flow channel structure located in the cavity, and directly conducts the heat out of the cavity wall through the stamped heat dissipation structure. This can significantly improve the heat dissipation effect, reduce production costs and strengthen the structural strength, and successfully solve the problem that the planar configuration of traditional heat spreaders is limited and cannot effectively dissipate heat and cool down.

[0043] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0044] The embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat-conducting plate with a three-dimensional heat dissipation structure for removing heat generated by a heat-generating component, the heat-conducting plate comprising: A body includes a chamber, at least one extension, and a first surface and a second surface disposed opposite to each other, the extension being adjacent to the chamber, the first surface and the second surface being disposed along the chamber and the extension, and the chamber being attached to the heating element. A flow channel structure is disposed in the chamber and the flow channel structure is filled with a fluid to absorb heat generated from the heating element; as well as At least one heat dissipation structure is disposed on the extension and includes multiple heat dissipation strips. The multiple heat dissipation strips protrude from the first surface and are used to conduct the heat absorbed by the flow channel structure from the heat-generating component. Each heat dissipation strip has multiple hollow portions between itself and the first surface.

2. The heat-conducting plate with a three-dimensional heat dissipation structure as described in claim 1, wherein the chamber includes a chamber wall disposed around the chamber, and the extension integrally extends from the chamber wall to conduct heat absorbed from the heat-generating component by the flow channel structure, wherein the heat dissipation structure, the extension and the chamber wall together constitute a single, complete individual structure.

3. The heat-conducting plate with a three-dimensional heat dissipation structure as described in claim 2, wherein the plurality of heat dissipation strips are arranged in rows spaced apart from each other, and the row of heat dissipation strips closest to the chamber has a gap with the chamber.

4. The heat-conducting plate with a three-dimensional heat dissipation structure as described in claim 1, wherein the extension is provided on two opposite sides of the chamber, and the heat dissipation structure is provided on each extension.

5. The heat-conducting plate with a three-dimensional heat dissipation structure as described in claim 4, wherein the two extensions are bent relative to the cavity in a direction facing upwards toward the first surface of the cavity.

6. The heat-conducting plate with a three-dimensional heat dissipation structure as described in claim 1, wherein the number of heat dissipation structures is multiple, and one of the heat dissipation structures is disposed on the corresponding second surface of the extension, and another heat dissipation structure is disposed on the first surface.

7. The heat-conducting plate with a three-dimensional heat dissipation structure as described in claim 1, wherein the material of the heat dissipation structure is the same as the material of the extension, and the material is a metallic material, an alloy of the metallic material, or a covalent metal thereof.

8. The heat-conducting plate with a three-dimensional heat dissipation structure as described in claim 1, wherein the overall thickness of the heat dissipation structure is at least three times greater than the thickness of the body.

9. The heat-conducting plate with a three-dimensional heat dissipation structure as claimed in claim 1, wherein the flow channel structure includes a capillary structure having a plurality of interconnected flow channels distributed within the cavity, and the cavity is a vacuum chamber.

10. The heat-conducting plate with a three-dimensional heat dissipation structure as claimed in claim 1, wherein each heat dissipation strip includes two connecting ends connected to the first surface, at least two wavy portions, and a plurality of concave and convex teeth formed on at least one surface of the cross section of the at least two wavy portions.

11. The heat-conducting plate with a three-dimensional heat dissipation structure as claimed in claim 10, wherein the wave portion has at least one wave crest and at least one wave trough connecting the wave crest, and the hollow portion is between the wave crest, the wave trough and the first surface.

12. The heat-conducting plate with a three-dimensional heat dissipation structure as described in claim 11, wherein the trough is integrally formed in the extension, and the heat dissipation strip and the extension together constitute a single, complete individual structure.

13. The heat-conducting plate with a three-dimensional heat dissipation structure as described in claim 11, wherein the heat dissipation structure further includes a plurality of perforations penetrating the extension, and the plurality of perforations are respectively located directly below the plurality of hollow portions.

14. The heat-conducting plate with a three-dimensional heat dissipation structure as described in claim 1, wherein the heat dissipation structure further includes at least one heat pipe, a portion of which is fixed to the heat dissipation strip, and another portion of which extends out of the heat dissipation strip and is bent.

15. The heat-conducting plate with a three-dimensional heat dissipation structure as described in claim 1, wherein a plurality of heat dissipation structures are stacked on the extension, and the heat dissipation structure further includes at least one heat pipe, the two opposite ends of the heat pipe being respectively connected to the plurality of heat dissipation structures.

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