Heat dissipation apparatus

Abstract

Disclosed in the present application is a heat dissipation apparatus for removing heat generated by a heating component. The heat dissipation apparatus comprises a first heat dissipation plate, which comprises a plate body, a plurality of first heat dissipation fins, and a plurality of first punched slots. The plate body comprises a first surface and a second surface arranged opposite each other. The plurality of first heat dissipation fins are arranged at intervals from one other and protrude from the first surface; each first heat dissipation fin comprises at least two first slope portions and a first peak portion connected between two first slope portions, the first peak portion comprising a flat surface. The plurality of first punched slots are located directly below the plurality of first heat dissipation fins, and penetrate the first surface and the second surface.

Description

Heat dissipation device Technical Field

[0001] This application relates to a heat dissipation structure, and more particularly to a heat dissipation device with an integrated structure. Background Technology

[0002] Some heat dissipation structures incorporate cooling devices such as fans to quickly reduce the high temperatures generated by electronic components. However, these devices are isolated from the heat-generating components, and the indirect cooling effect is quite limited, failing to provide effective heat dissipation. Therefore, some manufacturers have developed vapor chambers that attach to electronic components, such as CPUs, GPUs, or LEDs—components that generate heat. These vapor chambers utilize fluid absorption to lower the component's temperature, allowing it to maintain normal operation. However, traditional vapor chambers have limited thickness, which is insufficient to handle the heat generated by today's high-performance processors. Therefore, traditional vapor chambers can only improve heat dissipation by stacking multiple layers to increase thickness, but this often fails to meet the actual internal space requirements and increases equipment costs. In view of this, how to configure a heat dissipation device that can significantly improve heat dissipation within a limited space is a pressing issue that needs to be addressed. Technical issues

[0003] One objective of this application is to provide a heat dissipation device that can increase structural strength and has an integrally molded structure. Technical solutions

[0004] To solve the above problems, the technical solution provided in this application is as follows:

[0005] This application provides a heat dissipation device for removing heat generated by a heat-generating component. The heat dissipation device includes a first heat dissipation plate, comprising a plate body, a plurality of first heat dissipation ridges, and a plurality of first grooves. The plate body includes a first surface and a second surface disposed opposite to each other. The plurality of first heat dissipation ridges are arranged at intervals and protrude from the first surface, and each first heat dissipation ridge includes at least two first slopes and a first peak top connecting the two first slopes, the first peak top including a flat surface. The plurality of first grooves are respectively located directly below the plurality of first heat dissipation ridges and penetrate the first surface and the second surface.

[0006] Preferably, the heat dissipation device further includes a heat-conducting plate, which includes a chamber, an upper surface and a lower surface disposed opposite to each other, and a flow channel structure, wherein the heating component is attached to the lower surface, the first heat dissipation plate is disposed on the upper surface, and the flow channel structure is disposed in the chamber and filled with a fluid for absorbing heat generated from the heating component.

[0007] Preferably, the heat dissipation device further includes a second heat dissipation plate, and the second heat dissipation plate includes a plate body, a plurality of second heat dissipation ridges and a plurality of second grooves, wherein each of the second heat dissipation ridges includes at least two second slopes and a second peak top connected between the two second slopes, the second peak top includes a flat surface and a fixed surface disposed opposite to each other, and the first heat dissipation plate and the second heat dissipation plate are stacked on each other to form a heat dissipation module.

[0008] Preferably, multiple heat dissipation modules are stacked on the heat conduction plate.

[0009] Preferably, the overall thickness of the first heat sink and the second heat sink is at least three times greater than the thickness of the heat-conducting plate.

[0010] Preferably, the first heat dissipation ridge and the second heat dissipation ridge each include a plurality of reverse-arranged concave and convex teeth.

[0011] Preferably, the flat surface of the peak of the first heat dissipation ridge is fixed to the upper surface of the heat-conducting plate.

[0012] Preferably, the heat dissipation device further includes at least one heat pipe, which includes a first connecting section and a second connecting section disposed opposite to each other, wherein the first connecting section is fixed to the heat conduction plate, and the second connecting section is fixed to the first heat dissipation ridge of the first heat dissipation plate.

[0013] Preferably, the heat dissipation device further includes at least one heat pipe, which includes a first connecting section and a second connecting section disposed opposite to each other, wherein the first peak top also includes a fixing surface, the fixing surface of the first peak top is disposed opposite to the flat surface of the first peak top, and the first connecting section is fixed to the fixing surface of the first peak top, and the second connecting section is fixed to the fixing surface of the second peak top.

[0014] Preferably, the heat dissipation device further includes at least one heat pipe, which includes a first connecting section and a second connecting section disposed opposite to each other, wherein the first connecting section or the second connecting section is fixed to the first heat dissipation ridge of the first heat dissipation plate. Beneficial effects

[0015] This application provides a heat dissipation device that uses stamping technology to integrally form a first heat dissipation plate having a first heat dissipation ridge, a first groove, concave and convex teeth and fins. Its complete and independent single structure can effectively achieve heat dissipation effect, and can be stacked with a second heat dissipation plate to form a heat dissipation module. It can also be used in conjunction with heat pipes. This not only avoids the problem of easy structural damage caused by secondary processing cutting process, but also increases structural strength and greatly improves heat dissipation effect. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments or prior art, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 is a schematic diagram of the side structure of a heat dissipation device according to an embodiment of this application.

[0018] Figure 2 is a three-dimensional structural diagram of a heat dissipation device according to an embodiment of this application.

[0019] Figure 3 is a three-dimensional structural diagram of a heat dissipation device according to an embodiment of this application.

[0020] Figure 4 is a three-dimensional structural diagram of a heat dissipation device according to an embodiment of this application.

[0021] Figure 5 is a side structural schematic diagram of a heat dissipation device according to an embodiment of this application.

[0022] Figure 6 is a side structural schematic diagram of a heat dissipation device according to an embodiment of this application.

[0023] Figure 7 is a three-dimensional structural diagram of a heat dissipation device according to an embodiment of this application.

[0024] Figure 8 is a three-dimensional structural diagram of a heat dissipation device according to an embodiment of this application.

[0025] Figure 9 is a three-dimensional structural diagram of a heat dissipation device according to an embodiment of this application. Embodiments of the present invention

[0026] The following descriptions of the embodiments are based on the accompanying illustrations, illustrating specific embodiments in which this application can be implemented. Directional terms used in this application, such as [up], [down], [front], [back], [left], [right], [inner], [outer], [side], etc., are merely for reference to the accompanying drawings. Therefore, the directional terms used are for illustration and understanding of this application, and not for limiting this application. In the figures, structurally similar units are denoted by the same reference numerals. In the figures, the thickness of some layers and regions is exaggerated for clarity and ease of description. That is, the dimensions and thicknesses of each component shown in the figures are arbitrarily shown, but this application is not limited thereto.

[0027] This application is specifically described with reference to the following examples, which are merely illustrative. Various modifications and refinements can be made by those skilled in the art without departing from the spirit and scope of this disclosure. Therefore, the scope of protection of this disclosure shall be determined by the appended claims. Throughout the specification and claims, unless explicitly stated otherwise, the words “a” and “described” mean that such a description includes “a or at least one” of the stated components or ingredients. Furthermore, as used in this application, the singular article also includes a description of a plurality of components or ingredients unless it is clearly apparent from the specific context that a plurality is excluded. Moreover, when applied in this description and throughout the claims below, unless explicitly stated otherwise, “in which” may mean both “in which” and “on which”.

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0029] This application provides a heat dissipation device for removing heat generated by a heat-generating component. Specifically, the heat-generating component can be, for example, a central processing unit, a graphics processing unit, or a light-emitting component that generates heat, but is not limited to these. Referring to Figure 1, Figure 1 is a side view of a heat dissipation device 1 according to an embodiment of this application. As shown in Figure 1, the heat dissipation device 1 provided by this application includes a first heat dissipation plate 10. The first heat dissipation plate 10 is made of a metallic material, its metal alloy, or its covalent metal, such as copper, aluminum, or an alloy of any composition thereof, or for example, aluminum nitride, graphite aluminum, graphene aluminum, graphene copper, carbon nanotube aluminum, carbon nanotube copper, aluminum silicon carbon, diamond aluminum, etc. Specifically, the first heat dissipation plate 10 includes a plate body 100, a plurality of first heat dissipation ridges 11, and a plurality of first grooves 12. The plate body 100 is a flat planar plate, including a first surface 101 and a second surface 102 arranged vertically opposite each other. Preferably, a plurality of first heat dissipation ridges 11 are arranged in rows spaced apart from each other and protrude upward from the first surface 101, with the plurality of first heat dissipation ridges 11 in each row aligned with each other. In some embodiments, the plurality of first heat dissipation ridges 11 are formed by a stamping process of the plate 100, forming an approximately trapezoidal or triangular structure and a groove 12 penetrating the first surface 101 and the second surface 102 (as shown in FIG. 2, detailed later). In addition, there are separating channels 15 between adjacent rows of first heat dissipation ridges 11 (as shown in FIG. 2), which form interconnected airflow channels with the grooves 12. Specifically, each first heat dissipation ridge 11 is hollowed out from the first surface 101 of the body 100, and the hollowed-out space is adjacent to and located directly above the groove 12. That is, the first heat dissipation ridges 11 and the plate 100 together constitute a single, complete individual structure.

[0030] As shown in Figure 1, the first heat dissipation ridge 11 includes a first peak 111, two first slopes 113, and connecting ends 112 formed on the two first slopes 113. Specifically, the first peak 111 connects between the two first slopes 113 and includes a flat surface 111a and a fixed surface 111b disposed opposite to each other. In this embodiment, the two ends of the flat surface 111a extend to the two first slopes 113 on both sides to provide a larger flat area and a connection and fixation for the mating object. In other embodiments, the width of the flat surface 111a does not extend to the two first slopes 113 on both sides, but only occupies a portion of the top surface of the first peak 111; that is, a concave-convex surface (not shown) can also be formed between the flat surface 111a and the first slopes 113. The end of each first slope 113 near the plate 100 is defined as the connecting end 112, which is integrally formed on the plate 100. In some embodiments, the first heat dissipation ridge 11 further includes a plurality of protruding and recessed teeth 13, which are integrally formed on the outer and inner surfaces of the first slope 113 in opposite directions. In this embodiment, the plate 100 also includes a plurality of fins 14 protruding from the first surface 101 and arranged at intervals. The aforementioned plurality of protruding and recessed teeth 13 and the plurality of fins 14 are provided to increase the heat dissipation area, thereby improving the heat dissipation effect. It is particularly noteworthy that the protruding and recessed teeth 13, fins 14 and the first heat dissipation ridge 11 of the first heat dissipation plate 10 are integrally formed by the same stamping process, which simplifies the complexity of traditional manufacturing and reduces production costs, and avoids the problem of easy structural damage caused by secondary processing cutting processes, thereby increasing structural strength.

[0031] Referring again to Figure 1, the heat dissipation device 1 of this application includes a heat-conducting plate 30, which includes a chamber 31, an upper surface 301 and a lower surface 302 disposed opposite to each other, and a flow channel structure 32. Specifically, the heating element 7 is attached to the lower surface 302, and the first heat sink 10 is disposed on the upper surface 301. It should be noted that the first heat sink 10 can be fixed to the upper surface 301 by soldering or thermal paste. In some embodiments, the chamber 31 is a closed vacuum chamber, and the flow channel structure 32 is disposed in the chamber 31 and filled with a fluid to absorb the heat generated from the heating element 7. The fluid can be water, amine water, sodium, methyl methacrylate, alcohol, etc., preferably water. In detail, when heat is conducted from the heat source (i.e., the heating element) to the chamber 31, the fluid in the chamber 31 will begin to vaporize in a low vacuum environment. When the vapor working fluid comes into contact with a relatively cold area, condensation will occur, releasing the heat accumulated during evaporation. The condensed liquid working fluid flows back to the evaporation heat source through the capillary effect of the microstructure. This complete operation process repeats continuously within the chamber, constituting the operation mode of the uniform temperature heat conduction plate. Preferably, the overall thickness T1 of the first heat dissipation plate 10 is at least 3 times greater than the thickness T2 of the heat conduction plate 30, and more preferably more than 10 times, to produce a faster and more efficient heat dissipation effect.

[0032] With the aforementioned heat dissipation device 1, the heat generated by the heat-generating component 7 (i.e., the processor) can be directly conducted to the heat-conducting plate 30, and the heat absorbed by the heat-conducting plate 30 can be quickly conducted through the first heat dissipation ridge 11, the toothed portion 13, and the fins 14 integrally formed on the first heat dissipation plate 10, achieving an effective cooling effect. In some embodiments, the heat dissipation device 1 can also be used in conjunction with a fan (not shown) to exhaust the heat inside the casing (not shown) containing the heat-generating component 7.

[0033] Referring to Figure 2, the heat dissipation device 1 further includes a second heat dissipation plate 20, which includes a plate body 200, a plurality of second heat dissipation ridges 21, and a plurality of second grooves 22. Specifically, each second heat dissipation ridge 21 includes two second slopes 213 and a second peak 211 connecting the two second slopes 213. The second peak 211 includes a flat surface 211a and a fixed surface 211b disposed opposite to each other. In addition, the second heat dissipation ridge 21 includes a plurality of opposingly arranged concave and convex teeth 23, and a plurality of fins 24 protruding from the plate body 200 and spaced apart are formed on the plate body 200. In this embodiment, the structure of the second heat dissipation plate 20 is the same as that of the various components of the first heat dissipation plate 10. In some embodiments, some structures of the second heat dissipation plate 20 may also be different from those of the first heat dissipation plate 10. For example, the length of the second peak 211 may be different from the length of the first peak 111, or the number of concave and convex teeth 23 may be different from the number of concave and convex teeth 13 (not shown), which may be determined according to the heat dissipation requirements. As shown in Figure 2, the first heat sink 10 and the second heat sink 20 can be stacked and fixed together by welding or adhesive through the first peak top 111 and the second peak top 211 to form a heat sink module 1A, which can significantly improve the heat dissipation effect on the heat-generating component 7. In particular, the mating of the flat surfaces 111a of the first peak top 111 and the flat surfaces 211a of the second peak top 211 can strengthen the reliability of the connection between the first heat sink 10 and the second heat sink 20 and reduce the difficulty of connection construction.

[0034] Referring to Figure 3, in some embodiments, multiple heat dissipation modules 1A can be stacked according to heat dissipation requirements, or another first heat dissipation plate 10 can be stacked on a heat dissipation module 1A. Specifically, each heat dissipation module 1A includes a first heat dissipation plate 10 and a second heat dissipation plate 20 stacked vertically, and the first heat dissipation plate 10 and the second heat dissipation plate 20 are welded and fixed together through a first peak top 111 and a second peak top 211 (as shown in Figures 2 and 3).

[0035] Referring to Figure 4, which is a three-dimensional structural schematic diagram of a heat dissipation device according to an embodiment of this application, the heat dissipation device 1 further includes a plurality of heat pipes 40 to improve heat conduction efficiency. Each heat pipe 40 includes a first connecting section 41 and a second connecting section 42 disposed opposite to each other. Specifically, the first connecting section 41 or the second connecting section 42 can be fixed to the first heat dissipation ridge 11 of the first heat dissipation plate 10 by welding technology, but the fixing method of the heat pipe 40 is not limited to this. As shown in Figure 4, the first connecting section 41 of the heat pipe 40 is fixed to the fixing surface 111b of the first peak top 111, and the second connecting section 42 is fixed to the fixing surface 211b of the second peak top 211. It should be noted that the first connecting section 41 and the second connecting section 42 of the heat pipe 40 can also be inserted between adjacent first heat dissipation ridges 11 or adjacent second heat dissipation ridges 21, both of which can achieve the heat conduction effect between the first heat dissipation plate 10 and the second heat dissipation plate 20. The heat dissipation device 1 of this application can greatly increase the heat dissipation effect by the arrangement of the heat pipes 40.

[0036] Referring to Figure 5, in this embodiment, the plurality of first heat dissipation ridges 11 of the first heat dissipation plate 10 are inverted and directly disposed on the upper surface 301 of the heat conduction plate 30. Specifically, the flat surface 111a of the first peak 111 of the first heat dissipation ridge 11 is fixed to the upper surface 301 of the heat conduction plate 30, which can also conduct heat from the heat conduction plate 30 to the entire first heat dissipation plate 10 to achieve a heat dissipation effect. As shown in Figure 5, the plate body 100 is spaced apart from the heat conduction plate 30, allowing for the additional placement of a second heat dissipation plate 20, another heat conduction plate (not shown), or other components on the plate body 100, which has a larger area, to achieve diverse usage configurations of the heat dissipation device 1.

[0037] Referring to Figure 6, in this embodiment, the first connecting section 41 of the heat pipe 40 is directly fixed to the heat-conducting plate 30, and the second connecting section 42 is fixed within the first heat-dissipating ridge 11 of the first heat sink 10. In some embodiments, the fixing surface 111b of the first heat-dissipating ridge 11 may be a flat surface to facilitate welding to the heat pipe 40. As shown in Figure 6, the first heat sink 10 is spaced apart from the heat-conducting plate 30 due to the arrangement of the heat pipe 40. With the above structure, the heat of the heat-conducting plate 30 can be conducted to the upper first heat sink 10 through the heat pipe 40, and there is a space between the first heat sink 10 and the heat-conducting plate 30, which can be used to install other electronic components to realize diverse usage forms of the heat dissipation device 1.

[0038] Referring to FIG7, in this embodiment, the uppermost first heat sink 10 is stacked on the heat dissipation module 1A in an inverted manner. As shown in FIG7, the first connecting section 41 of the heat pipe 40 is inserted between adjacent first heat dissipation ridges 11 of the uppermost first heat sink 10, and the second connecting section 42 is exposed outside the plate body 100 of the uppermost first heat sink 10 for connection to other heat dissipation components (not shown), thereby enabling diverse usage forms of the heat dissipation device 1.

[0039] Referring to Figure 8, in this embodiment, heat pipes 40 are further connected between the multiple stacked heat dissipation modules 1A. As shown in Figure 8, the first connecting section 41 of one of the heat pipes 40 can be exposed on the top of the upper heat dissipation module 1A and can be connected to other heat dissipation devices as needed. The second connecting section 42 of one of the heat pipes 40 is inserted in the space enclosed by the second peak top 211 and the second slope 213, while the second connecting section 42 of another heat pipe 40 is inserted between the second slope 213 of the first slope 113 of the stacked first heat dissipation plate 10 and the second heat dissipation plate 20. Both can achieve the function of conducting heat using the heat pipes 40.

[0040] Referring to Figure 9, in this embodiment, the first heat sink 10 and the second heat sink 20 stacked vertically can also be provided with multiple heat pipes 40. As shown in Figure 9, the second connecting section 42 of the heat pipe 40 can be exposed outside the upper first heat sink 10, while the other end of the heat pipe 40 is inserted into the second heat sink 20, both of which can achieve the function of conducting heat using the heat pipe 40.

[0041] In summary, the embodiments of this application provide a heat dissipation device, which uses stamping technology to integrally form a first heat dissipation plate having a first heat dissipation ridge, a first groove, concave and convex teeth and fins. Its complete and independent single structure can effectively achieve the heat dissipation effect, and can be stacked with a second heat dissipation plate to form a heat dissipation module. It can also be used in conjunction with heat pipes. This not only avoids the problem of easy structural damage caused by secondary processing cutting process, but also increases the structural strength and greatly improves the heat dissipation effect.

[0042] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0043] The embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipation device for removing heat generated by a heat-generating component, the heat dissipation device comprising: A first heat sink, comprising: A plate body, including a first surface and a second surface disposed opposite to each other; Multiple first heat dissipation ridges are arranged at intervals and protrude from the first surface, and each first heat dissipation ridge includes at least two first slopes and a first peak top connected between the two first slopes, the first peak top including a flat surface; Multiple first grooves are located directly below the multiple first heat dissipation ridges and penetrate the first surface and the second surface.

2. The heat dissipation device as claimed in claim 1 further includes a heat-conducting plate, the heat-conducting plate including a chamber, an upper surface and a lower surface disposed opposite to each other, and a flow channel structure, wherein the heat-generating component is attached to the lower surface, the first heat dissipation plate is disposed on the upper surface, and the flow channel structure is disposed in the chamber and filled with a fluid for absorbing heat generated from the heat-generating component.

3. The heat dissipation device as claimed in claim 2 further includes a second heat dissipation plate, and the second heat dissipation plate includes a plate body, a plurality of second heat dissipation ridges and a plurality of second grooves, wherein each of the second heat dissipation ridges includes at least two second slopes and a second peak top connected between the two second slopes, the second peak top includes a flat surface and a fixed surface disposed opposite to each other, and the first heat dissipation plate and the second heat dissipation plate are stacked on each other to form a heat dissipation module.

4. The heat dissipation device as claimed in claim 3, wherein a plurality of the heat dissipation modules are stacked on the heat-conducting plate.

5. The heat dissipation device as claimed in claim 3, wherein the overall thickness of the first heat dissipation plate and the second heat dissipation plate is at least three times greater than the thickness of the heat-conducting plate.

6. The heat dissipation device as claimed in claim 3, wherein the first heat dissipation ridge and the second heat dissipation ridge each include a plurality of reverse-arranged concave and convex teeth.

7. The heat dissipation device as claimed in claim 2, wherein the flat surface of the peak top of the first heat dissipation ridge is fixed to the upper surface of the heat-conducting plate.

8. The heat dissipation device as claimed in claim 2 further includes at least one heat pipe, which includes a first connecting section and a second connecting section disposed opposite to each other, wherein the first connecting section is fixed to the heat-conducting plate, and the second connecting section is fixed to the first heat dissipation ridge of the first heat dissipation plate.

9. The heat dissipation device as claimed in claim 3 further includes at least one heat pipe, which includes a first connecting section and a second connecting section disposed opposite to each other, wherein the first peak top further includes a fixing surface, the fixing surface of the first peak top is disposed opposite to the flat surface of the first peak top, and the first connecting section is fixed to the fixing surface of the first peak top, and the second connecting section is fixed to the fixing surface of the second peak top.

10. The heat dissipation device of claim 1 further includes at least one heat pipe, which includes a first connecting section and a second connecting section disposed opposite to each other, wherein the first connecting section or the second connecting section is fixed to the first heat dissipation ridge of the first heat dissipation plate.

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