Substrate processing device

Abstract

This substrate processing device comprises: a first conveyance device that is provided with a pair of first attachment members to which a pair of conveyors are respectively attached, a first width modification unit which moves the first attachment members in a width direction to modify a conveyance width, and a first clamp part which clamps a substrate; a second conveyance device that is provided with a pair of second attachment members to which a pair of conveyors are respectively attached, a second width modification unit which moves the second attachment members in the width direction to modify a conveyance width, and a second clamp part which clamps a substrate; two first guide shafts that extend in the width direction across the first conveyance device and the second conveyance device so as to guide the movement of the first attachment members and that are disposed spaced apart in the substrate conveyance direction; and two second guide shafts that extend in the width direction across the first conveyance device and the second conveyance device so as to guide the movement of the second attachment members and that are disposed spaced apart in the conveyance direction.

Description

Substrate processing apparatus 【0001】 This specification discloses a substrate processing apparatus. 【0002】 Conventionally, a substrate processing apparatus has been proposed that performs operations such as component mounting on substrates conveyed on a first conveyance path and a second conveyance path that are parallel to each other (see, for example, Patent Document 1). In this apparatus, by moving one of the pair of conveyors constituting each conveyance path by different ball screw mechanisms, the interval (conveyance width) between the conveyors of each conveyance path can be independently changed. Further, the lower ends of the support portions that support the movable conveyors of each conveyance path are respectively attached to sliders that slide on rails. 【0003】 Japanese Patent Application Laid-Open No. 2012-019097 【0004】 In a configuration using rails for guiding the movable conveyor as in the above-described apparatus, not only is accuracy required for installing the rails, but it is also disadvantageous in terms of cost. Further, since the same rails are shared for guiding the movable conveyors of different conveyance paths, there is also a possibility that operations such as clamping of the substrate performed on one conveyance path may affect the other conveyance path. 【0005】 The main object of the present disclosure is to more appropriately configure guides for changing the conveyance width in two parallel conveyance paths. 【0006】 The present disclosure has taken the following means to achieve the above main object. 【0007】The substrate handling apparatus of this disclosure is a substrate handling apparatus for performing work on a substrate being transported on a first transport path and a second transport path, comprising: a first transport device constituting the first transport path, comprising: a pair of first mounting members each to which a pair of conveyors arranged spaced apart in the width direction of the substrate are attached; a first width changing unit for changing the transport width by moving at least one of the first mounting members in the width direction; and a first clamping unit for clamping the substrate; a second transport device constituting the second transport path parallel to the first transport path, comprising: a pair of second mounting members each to which a pair of conveyors arranged spaced apart in the width direction of the substrate are attached; a second width changing unit for changing the transport width by moving at least one of the second mounting members in the width direction; and a second clamping unit for clamping the substrate; and two first guide shafts extending in the width direction across the first transport device and the second transport device and spaced apart in the transport direction of the substrate so as to guide the movement of the first mounting members. The gist of the invention is that it comprises two second guide shafts that extend in the width direction across the first and second conveying devices and are spaced apart in the conveying direction, so as to guide the movement of the second mounting member. 【0008】 In the substrate handling apparatus of this disclosure, the movement of the first mounting member can be appropriately performed using two first guide shafts, and the movement of the second mounting member can be appropriately performed using two second guide shafts. Furthermore, each guide shaft does not require the same level of installation precision as guide rails, making installation easy and typically cost-effective. Moreover, by using separate guide shafts for the movement of the first and second mounting members, the operation of one conveying device can be prevented from affecting the other conveying device. Therefore, guides for changing the conveying width can be configured more appropriately in two parallel conveying paths. 【0009】 A schematic diagram of the mounting device 10. A block diagram showing the control configuration of the mounting device 10. A perspective view of the substrate transport device 20. A top view of the substrate transport device 20. A schematic diagram of the substrate transport device 20. An explanatory diagram showing the operation of the substrate transport device 20. An explanatory diagram showing the operation of the substrate transport device 20. 【0010】 Embodiments of this disclosure will be described with reference to the drawings. Figure 1 is a schematic diagram of the mounting device 10. Figure 2 is a block diagram showing the configuration related to the control of the mounting device 10. In this embodiment, the left-right direction (X-axis), front-back direction (Y-axis), and up-down direction (Z-axis) are as shown in Figure 1. 【0011】 The mounting device 10 picks up components and mounts them onto a substrate S, and comprises a base 11, a feeder 12, a mounting head 13, a moving device 15, a parts camera 16, a mark camera 17, a substrate transport device 20, and a control device 18 (see Figure 2). Multiple mounting devices 10 are arranged in a line in the substrate transport direction (X-axis direction) to form a mounting line. The mounting line, including the mounting devices 10, is managed by a control device (not shown). 【0012】 The feeder 12 is mounted on a feeder stand installed on the base 11 so as to be aligned in the left-right direction (X-axis direction). The feeder 12 has a reel around which a tape for containing components is wound. Multiple cavities for containing components are formed on the tape at equal intervals. Components in the cavities are exposed when the film covering the surface of the tape is peeled off in front of the component supply position, and are picked up (suctioned) by the mounting head 13. 【0013】 The mounting head 13 is equipped with one or more nozzles 14 (suction members) that use negative pressure to pick up (suction) parts. The mounting head 13 is configured as a rotary head in which a plurality of nozzles 14 are mounted so as to be circumferentially rotatable, and a nozzle 14 at a predetermined rotational position can be raised and lowered in the Z-axis direction (vertical direction). The mounting head 13 picks up parts supplied to the supply position by the feeder 12 with the nozzles 14 and mounts them to the mounting position on the substrate S. The moving device 15 moves the mounting head 13 forward, backward, left and right (XY axis direction) along the XY plane (horizontal plane). 【0014】The parts camera 16 is mounted on the base 11 and captures images of the parts and other objects to be imaged from below, and outputs the captured images to the control device 18. The mark camera 17 is located below the mounting head 13 and moves together with the mounting head 13 in the forward, backward, left, and right directions (XY axis directions) by the moving device 15. The mark camera 17 captures images of the marks and other objects to be imaged on the substrate S from above and outputs the captured images to the control device 18. 【0015】 The substrate transport device 20 is equipped with a pair of belt conveyors spaced apart in the Y-axis direction (front-to-back direction) as shown in Figure 1, and drives the belt conveyors to transport the substrate S in the X-axis direction (transport direction). Once transported to each transport path, the substrate S is clamped and components are mounted on it. The substrate transport device 20 is also configured with two pairs of belt conveyors, that is, two parallel transport paths formed by the pairs of belt conveyors, namely a first transport path and a second transport path, allowing for independent transport and clamping of the substrate S. Further details of the substrate transport device 20 will be described later. 【0016】 The control device 18 is configured as a microprocessor centered around a CPU (not shown), and in addition to the CPU, it includes ROM, RAM, input / output interfaces, etc. The control device 18 outputs various control signals to the feeder 12, mounting head 13, moving device 15, parts camera 16, mark camera 17, and board transport device 20. The control device 18 also receives various signals from the feeder 12, mounting head 13, moving device 15, and board transport device 20, as well as images captured by the parts camera 16 and mark camera 17. The control device 18 is communicated with a management device (not shown). The control device 18 receives jobs from the management device and performs component mounting processing on the board S according to the received jobs. 【0017】The details of the substrate transport device 20 are described below. The substrate transport device 20 comprises a first transport device 21, a second transport device 41, two first guide shafts 61 and 62, and two second guide shafts 63 and 64. These are provided on a flat base plate 11a attached to a base 11. The first transport device 21 constitutes the first transport path on the front side in the Y-axis direction. The second transport device 41 constitutes the second transport path on the rear side in the Y-axis direction. Figure 3 is a perspective view of the substrate transport device 20. Figure 4 is a top view of the substrate transport device 20. Figure 5 is a schematic configuration diagram of the substrate transport device 20, showing the configuration of the substrate transport device 20 as viewed from the right side in the X-axis direction, with some parts excluded. In Figures 3 to 5, the guide shafts 61 to 64 are shown in color. 【0018】 The first conveying device 21 comprises a pair of belt conveyors 22, a pair of mounting plates 24, a width changing section 25, a pair of clamp plates 28 (only one is shown in Figure 3), and a clamp drive unit 30. Each belt conveyor 22 comprises a plurality of pulleys, including a drive pulley 22a (only one is shown in Figure 3), and a belt stretched across the plurality of pulleys on which the widthwise end of the substrate S is placed. The first conveying device 21 includes a drive unit for driving each belt conveyor 22, which comprises a drive shaft 23 connected to each drive pulley 22a, and a drive motor 23m (see Figure 2) that rotates the drive shaft 23. The drive shaft 23 extends in the Y-axis direction across the first conveying device 21 and the second conveying device 41. Each belt conveyor 22 rotates each belt by rotating each drive pulley 22a via the drive shaft 23 driven by the drive motor 23m, thereby conveying the substrate S in the X-axis direction. 【0019】A pair of mounting plates 24 are provided in the Y-axis direction (front-to-back direction), and a belt conveyor 22 is attached to each. Each mounting plate 24 is formed in a gate-like shape having a portion extending in the X-axis direction and portions extending downward in the Z-axis direction from both ends in the X-axis direction, and is supported by two first guide shafts 61 and 62 in the portions extending downward in the Z-axis direction. Pulleys for each belt conveyor 22 and clamp plates 28 are attached to each mounting plate 24, mainly on the upper side. Of the pair of mounting plates 24, the front mounting plate in the Y-axis direction is called mounting plate 24F, and the rear mounting plate is called mounting plate 24R. The front mounting plate 24F is configured as a fixed plate that cannot be moved. The rear mounting plate 24R is configured as a movable plate that can move in the Y-axis direction. 【0020】 The width changing section 25 changes the transport width of the first transport path (the distance between the pair of belt conveyors 22 in the Y-axis direction) by moving the mounting plate 24R. The width changing section 25 includes, for example, a ball screw 26 which is a drive shaft for moving the mounting plate 24R, a nut 26a screwed onto the ball screw 26, and a drive motor 26m (see Figure 2) that rotates the ball screw 26. The ball screw 26 extends in the Y-axis direction across the first transport device 21 and the second transport device 41. The mounting plate 24R is connected to the nut 26a and moves in the Y-axis direction as the ball screw 26 rotates due to the drive of the drive motor 26m. In the first transport device 21, the transport width of the first transport path is changed by moving the belt conveyor 22 attached to the mounting plate 24R in the Y-axis direction using the width changing section 25, with the belt conveyor 22 attached to the mounting plate 24F as the reference for the transport width. In the substrate transport device 20, the range (maximum value) that can be set as the transport width of the first transport path can be set to one of several stages via an operation panel (not shown). For example, it can be set to one of several stages, such as a first range where the maximum transport width is width W1, a second range where the maximum transport width is width W2 (<W1), and a third range where the maximum transport width is width W3 (<W2). 【0021】Each pair of clamp plates 28 is attached to the mounting surface (inner surface) of the belt conveyor 22 on the pair of mounting plates 24 via a pair of support parts 28a that are spaced apart in the X-axis direction so as to be able to move up and down in the Z-axis direction. The clamp plate 28 is a substantially rectangular plate member with its long side parallel to the X-axis direction, and in its initial state, its upper end (upper side) is slightly lower than the mounting surface (conveying surface) of the substrate S on the belt conveyor 22. The clamp plate 28 also includes a rod-shaped contact pin 28b that protrudes downward from the lower end approximately in the center in the X-axis direction, and a pair of springs 28c attached to the lower ends of both ends in the X-axis direction. The lower end of the contact pin 28b is arranged so as to be able to contact the upper surface of the backup plate 31 of the clamp drive unit 30. The pair of springs 28c are spaced apart in the X-axis direction, with their upper ends supported by the clamp plate 28 and their lower ends supported by the mounting plate 24, biasing the clamp plate 28 downward. Furthermore, a retaining member 24a is attached to the upper end of each mounting plate 24F, 24R, extending along its entire length in the X-axis direction, so as to face the upper end of each clamp plate 28. 【0022】The clamp drive unit 30 pushes up a pair of clamp plates 28 for clamping the substrate S via a single backup plate 31. As shown in Figure 5, the clamp drive unit 30 comprises a backup plate 31, a mounting plate 32, a ball screw mechanism 33, a drive motor 35, and a pair of lifting guides 37. The backup plate 31 is a rectangular plate member whose long side is parallel to the Y-axis direction when viewed from above, and whose upper surface can contact the lower ends of each contact pin 28b (a pair of contact pins 28b) of the pair of clamp plates 28. The mounting plate 32 is a rectangular plate member whose length in the X-axis direction is approximately the same as that of the backup plate 31 and whose length in the Y-axis direction is shorter, and the backup plate 31 is detachably attached to its upper surface. The ball screw mechanism 33 comprises a ball screw 34 whose upper end is connected to the lower surface of the backup plate 31 via the mounting plate 32, and a pulley 34a fixed to a nut screwed onto the ball screw 34. The drive motor 35 is equipped with a pulley 35a fixed to the rotating shaft and transmits driving force to the ball screw mechanism 33 via a belt 36 stretched between the pulley 35a and the pulley 34a, causing the ball screw 34 to move in the Z-axis direction and raise and lower the backup plate 31 (mounting plate 32). A pair of lifting guides 37 are provided in the Y-axis direction, with a guide shaft 38 whose upper end is connected to the lower surface of the backup plate 31 via the mounting plate 32, and which is configured to move back and forth in the Z-axis direction. The pair of lifting guides 37 are provided in the Y-axis direction, sandwiching the ball screw mechanism 33 and the drive motor 35. The lifting guides 37 guide the raising and lowering of the ball screw 34 by the back and forth movement of the guide shaft 38. 【0023】 The second conveying device 41 has the same configuration as the first conveying device 21, with some exceptions. For this reason, the reference numerals for the components of the second conveying device 41 that are the same as those of the first conveying device 21 are changed from the 20s to the 40s and from the 30s to the 50s, respectively. 【0024】The second conveying device 41 includes a pair of belt conveyors 42, a pair of mounting plates 44 (44F, 44R), a width changing section 45, a pair of clamp plates 48, and a clamp drive section 50. The pair of belt conveyors 42 are driven by a drive motor 43m, which rotates each belt via a drive shaft 43, thereby conveying the substrate S in the X-axis direction. In the second conveying device 41, the front mounting plate 44F differs from the mounting plate 24F of the first conveying device 21 in that it is configured as a movable plate that can move in the Y-axis direction. However, after the mounting plate 44F moves to a position adjacent to the mounting plate 24R at the maximum conveying width (W1, W2, W3 mentioned above) that can be set in the first conveying device 21, its position is maintained as a reference for the conveying width of the second conveying path and it does not move frequently. In other words, the second conveying device 41 changes the conveying width of the second conveying path by moving the belt conveyor 42 attached to the mounting plate 44R in the Y-axis direction, using the belt conveyor 22 attached to the mounting plate 44F as the reference for the conveying width. 【0025】The width-changing section 45 includes a ball screw 46, a nut (not shown) screwed onto the ball screw 46, and a drive motor 46m (see Figure 2) for rotating the ball screw 46, in order to move the mounting plate 44F. The width-changing section 45 also includes a ball screw 47, a nut 47a screwed onto the ball screw 47, and a drive motor 47m (see Figure 2) for rotating the ball screw 47, in order to move the mounting plate 44R. The pair of clamp plates 48 are configured in the same way as the clamp plate 28. The clamp drive unit 50 is a unit in which the same components as the clamp drive unit 30 are arranged on a plate 50a (see Figure 5), and is fixed on the base plate 11a by attaching the plate 50a to one of the multiple mounting positions (not shown) provided on the base plate 11a. As mentioned above, this is because the maximum transport width in the first transport device 21 can be set. The smaller the transport width, the closer the clamp drive unit 50 is mounted to the first transport device 21, and the more the second transport path is positioned to be closer to the first transport device 21 when clamping the substrate S. This allows the second transport path to be as close to the feeder 12 as possible, shortening the travel distance of the mounting head 13 and improving mounting efficiency. Thus, the clamp drive unit 50 is configured similarly to the clamp drive unit 30, except that the mounting position can be changed for each unit. 【0026】 The first guide shafts 61 and 62 guide the movement of the mounting plate 24R of the first conveying device 21 and extend in the Y-axis direction across the first conveying device 21 and the second conveying device 41. The first guide shafts 61 and 62 are linear shafts to which linear bushings 61a and 62a, respectively, are attached, which are slidable in the axial direction. The linear bushings 61a and 62a are connected to one end (left end) and the other end (right end) of the mounting plate 24R in the X-axis direction, respectively. 【0027】The second guide shafts 63 and 64 guide the movement of the mounting plates 44F and 44R of the second conveying device 41 and extend in the Y-axis direction across the first conveying device 21 and the second conveying device 41. The second guide shafts 63 and 64 are linear shafts to which linear bushings 63a, 63b, 64a, and 64b, respectively, are attached, which are slidable in the axial direction. The linear bushings 63a and 64a are connected to one end (left end) and the other end (right end) of the mounting plate 44F in the X-axis direction, respectively. The linear bushings 63b and 64b are connected to one end (left end) and the other end (right end) of the mounting plate 44R in the X-axis direction, respectively. 【0028】 In this embodiment, the first guide shaft 61 and the second guide shaft 63 are arranged vertically at one end in the X-axis direction, with the first guide shaft 61 on top. The first guide shaft 62 and the second guide shaft 64 are arranged vertically at the other end in the X-axis direction, with the first guide shaft 62 on top. The substrate transport device 20 includes a pair of support blocks 65 and 66 fixed to the base plate 11a at one end in the X-axis direction, and a pair of support blocks 67 and 68 fixed to the base plate 11a at the other end in the X-axis direction. The first guide shaft 61 and the second guide shaft 63 are supported by support block 65 at the front end in the Y-axis direction, and by support block 66 at the rear end in the Y-axis direction. The first guide shaft 62 and the second guide shaft 64 are supported by support block 67 at the front end in the Y-axis direction, and by support block 68 at the rear end in the Y-axis direction. 【0029】The mounting plate 24F of the first transport device 21 has support holes for rotatably supporting one end of the drive shafts 23 and 43, support holes for rotatably supporting one end of the ball screws 26, 46, and 47, and mounting holes for attaching to the first guide shafts 61 and 62. The mounting plate 24R has through holes for inserting the drive shafts 23 and 43, connecting holes for inserting the ball screw 26 and connecting the nut 26a, through holes for inserting the ball screws 46 and 47, connecting hole 24b (see Figure 5) for inserting the first guide shaft 61 and connecting the linear bush 61a, and connecting hole 24c for inserting the first guide shaft 62 and connecting the linear bush 62a. Each mounting plate 24F and 24R is formed so that its lower end is at a height above the second guide shafts 63 and 64. 【0030】 Furthermore, the mounting plate 44F of the second transport device 41 has through holes through which the drive shafts 23 and 43 are inserted, a connecting hole through which the ball screw 46 is inserted and a nut is connected, through holes through which the ball screws 26 and 47 are inserted, through holes 44b (see Figure 5) and 44c (not shown) through which the first guide shafts 61 and 62 are inserted, a connecting hole 44d (see Figure 5) through which the second guide shaft 63 is inserted and a linear bush 63a is connected, and a connecting hole 44e (not shown) through which the second guide shaft 64 is inserted and a linear bush 64a is connected. Furthermore, the mounting plate 44R has through holes through which the drive shafts 23 and 43 are inserted, a connecting hole through which the ball screw 47 is inserted and a nut 47a is connected, through holes through which the ball screws 26 and 46 are inserted respectively, an through hole 44f through which the first guide shaft 61 is inserted (see Figure 5), an through hole 44g through which the first guide shaft 62 is inserted, a connecting hole 44h through which the second guide shaft 63 is inserted and a linear bush 63b is connected (see Figure 5), and a connecting hole 44i through which the second guide shaft 64 is inserted and a linear bush 64b is connected (not shown). 【0031】Next, the operation of the mounting apparatus 10 configured in this way, in particular, the operation of the substrate transport apparatus 20 when clamping the substrate S, will be explained. Figures 6 and 7 are explanatory diagrams showing the operation of the substrate transport apparatus 20. Figure 6 shows that both the substrate S transported by the first transport apparatus 21 and the substrate S transported by the second transport apparatus 41 are being clamped. That is, in the first transport apparatus 21, the ball screw 34 is advanced upward in the Z-axis direction by the drive of the clamp drive unit 30 (drive motor 35), raising the backup plate 31 (mounting plate 32). As a result, the substrate S is pushed up by the pair of clamp plates 28 via a pair of contact pins 28b that abut the upper surface of the backup plate 31, and the substrate S is clamped by being held between them and the pressing member 24a. Similarly, in the second transport apparatus 41, the ball screw 54 is advanced upward in the Z-axis direction by the drive of the clamp drive unit 50 (drive motor 55), raising the backup plate 51 (mounting plate 52). This allows the pair of clamping plates 48 to push up the substrate S via a pair of contact pins 48b that contact the upper surface of the backup plate 51, and clamp the substrate S by gripping it between them and the pressing member 44a. 【0032】 Furthermore, Figure 7A shows a state in which the first transport device 21 is clamping the substrate S and the second transport device 41 is not clamping the substrate S. Figure 7B shows a state in which the second transport device 41 is clamping the substrate S and the first transport device 21 is not clamping the substrate S. As described above, in the substrate transport device 20, the first transport device 21 and the second transport device 41 can transport and clamp the substrate S independently of each other. For this reason, while the first transport device 21 is clamping the substrate S, the second transport device 41 transports the substrate S (see Figure 7A) and clamps the substrate S (see Figure 6), or while the second transport device 41 is clamping the substrate S, the first transport device 21 transports the substrate S (see Figure 7B) and clamps the substrate S (see Figure 6). Furthermore, while the first transport device 21 and the second transport device 41 are clamping the substrate S (see Figure 6), the second transport device 41 may release the clamp on the substrate S (see Figure 7A), or the first transport device 21 may release the clamp on the substrate S (see Figure 7B). 【0033】In this embodiment, first guide shafts 61 and 62 are used to guide the mounting plate 24R of the first transport device 21, and second guide shafts 63 and 64 are used to guide the mounting plates 44F and 44R of the second transport device 41. That is, the first transport device 21 and the second transport device 41 use separate guide shafts to guide each mounting plate. Therefore, vibrations and deformations that occur in the mounting plate 24R and the first guide shafts 61 and 62 due to clamping and releasing the substrate S in the first transport device 21 can be prevented from affecting the clamping of the substrate S in the second transport device 41. Similarly, vibrations and deformations that occur in the mounting plate 44F and 44R and the second guide shafts 63 and 64 due to clamping and releasing the substrate S in the second transport device 41 can be prevented from affecting the clamping of the substrate S in the first transport device 21. Therefore, it is possible to prevent misalignment and vibrations from occurring in the clamped substrate S, which would reduce the accuracy of component mounting. 【0034】 Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. The first conveying device 21 of this embodiment corresponds to the first conveying device of the present disclosure, the second conveying device 41 corresponds to the second conveying device, the first guide shafts 61 and 62 correspond to the first guide shaft, and the second guide shafts 63 and 64 correspond to the first guide shaft. The support blocks 65 and 66 correspond to a pair of one-end support members, and the support blocks 67 and 68 correspond to a pair of other-end support members. The ball screw 26 corresponds to the drive shaft of the first conveying device, and the ball screws 46 and 47 correspond to the drive shaft of the second conveying device. 【0035】In the implementation device 10 of the embodiment described above, the mounting plate 24 (first mounting member) to which the belt conveyor 22 (first conveyor) is attached can be appropriately moved using two first guide shafts 61 and 62. In addition, the mounting plate 44 (second mounting member) to which the belt conveyor 42 (second conveyor) is attached can be appropriately moved using two second guide shafts 63 and 64. Furthermore, each guide shaft 61 to 64 does not require the same level of installation precision as guide rails (linear rails) and is easy to install. For example, when using guide rails, higher precision is required for adjusting the parallelism between guide rails and the perpendicularity of the mounting plate (support leg) relative to the guide rails compared to when using guide shafts. Also, even when using four guide shafts 61 to 64, it is usually more cost-effective than using two (a pair) of guide rails. Furthermore, by using separate guide shafts for the movement of the mounting plate 24 and the movement of the mounting plate 44, it is possible to suppress the influence of the operation of one conveying device on the other conveying device. Therefore, the guides for changing the transport width can be configured more appropriately in the two transport paths. 【0036】 Furthermore, in the first transport device 21, the clamp plate 28 and the clamp drive unit 30 (first clamp unit) push up the substrate S and clamp the substrate S between the pressing member 24a (part of the first mounting member) of the mounting plate 24. In the second transport device 41, the clamp plate 48 and the clamp drive unit 50 (second clamp unit) push up the substrate S and clamp the substrate S between the pressing member 44a (part of the second mounting member) of the mounting plate 44. In this configuration, since the mounting plate 24 and the mounting plate 44 receive the load during clamping, using a common guide shaft would cause them to have a significant impact on each other, so it is highly significant to use separate guide shafts to suppress this impact. 【0037】Furthermore, the first guide shafts 61, 62 and the second guide shafts 63, 64 are arranged one above the other on the left end (one end) and right end (the other end) in the X-axis direction (conveying direction). This makes it possible to suppress an increase in the width of the first conveying device 21 and the second conveying device 41 in the X-axis direction. 【0038】 Furthermore, the substrate transport device 20 includes a pair of support blocks 65, 66 that support both ends of the first guide shaft 61 and both ends of the second guide shaft 63, respectively, and a pair of support blocks 67, 68 that support both ends of the first guide shaft 62 and both ends of the second guide shaft 64, respectively. Therefore, since the support blocks of each guide shaft can be shared, a simple support configuration with a reduced number of parts can be achieved. 【0039】 Furthermore, the second transport device 41 has connecting holes 44d and 44e formed on the mounting plate 44F for slidably connecting to the second guide shafts 63 and 64, and insertion holes 44b and 44c with an inner diameter larger than the outer diameter of the first guide shafts 61 and 62, respectively, on the left and right sides in the X-axis direction. In addition, the second transport device 41 has connecting holes 44h and 44i formed on the mounting plate 44R for slidably connecting to the second guide shafts 63 and 64, and insertion holes 44f and 44g with an inner diameter larger than the outer diameter of the first guide shafts 61 and 62, respectively, on the left and right sides in the X-axis direction. Furthermore, the first conveying device 21 has connecting holes 24b and 24c formed on the left and right sides in the X-axis direction, respectively, in the mounting plate 24R for slidably connecting to the first guide shafts 61 and 62, and the lower end of the mounting plate 24R is positioned at a height above the second guide shafts 63 and 64. Therefore, the mounting plate 24R is made small so that the lower end in the Z-axis direction (height direction) does not interfere with the second guide shafts 63 and 64, and there is no need to form an insertion hole for the second guide shaft, thus reducing costs. 【0040】Furthermore, the first transport device 21 has a width changing section 25 (first width changing section) which has one ball screw 26 (drive shaft) that moves the mounting plate 24R. Similarly, the second transport device 41 has a width changing section 45 (second width changing section) which has ball screws 46 and 47 (drive shafts) that move the mounting plates 44F and 44R respectively. The first guide shafts 61 and 62 and the second guide shafts 63 and 64 are arranged so as to place the ball screws 26, 46, and 47 between them in the X-axis direction. In other words, the substrate transport device 20 has the ball screws 26, 46, and 47 arranged on the central side in the X-axis direction, and the first guide shafts 61 and 62 and the second guide shafts 63 and 64 arranged on both ends. As a result, the substrate transport device 20 can properly change the width by suppressing tilting in the movement of each mounting plate 24R, 44F, and 44R by the ball screws 26, 46, and 47. 【0041】 It goes without saying that this disclosure is not limited in any way to the embodiments described above, and can be implemented in various forms as long as they fall within the technical scope of this disclosure. 【0042】 In this embodiment, the substrate transport device 20 has drive shafts (ball screws 26, 46, 47) arranged on the central side in the X-axis direction and guide shafts (61-64) arranged on both ends, but the device is not limited to this arrangement. For example, the guide shafts may be arranged on the central side in the X-axis direction and the drive shafts may be arranged on both ends, or any other arrangement may be used. 【0043】In the embodiment, the mounting plate 24R of the first transfer device 21 is configured to be small so as not to interfere with the second guide shafts 63 and 64, but it is not limited to this. For example, the second guide shafts 63 and 64 may be arranged above the first guide shafts 61 and 62, and the mounting plates 44F and 44R of the second transfer device 41 may be configured to be small so that the lower end sides in the Z-axis direction do not interfere with the first guide shafts 61 and 62, and the insertion holes for the first guide shafts 61 and 62 may not be formed. Alternatively, the mounting plates 24R, 44F, and 44R may be formed to have the same height in the Z-axis direction. The mounting plate 24R may be formed with insertion holes for the second guide shafts 63 and 64, and the mounting plates 44F and 44R may be formed with insertion holes for the first guide shafts 61 and 62. 【0044】 In the embodiment, both ends of the first guide shaft 61 and the second guide shaft 63 are supported by the support blocks 65 and 66, but they may be supported by separate support blocks respectively. Also, both ends of the first guide shaft 62 and the second guide shaft 64 are supported by the support blocks 67 and 68, but they may be supported by separate support blocks respectively. 【0045】 In the embodiment, the first guide shafts 61 and 62 and the second guide shafts 63 and 64 are arranged one above the other vertically, that is, in a vertical arrangement, but it is not limited to this. For example, the first guide shafts 61 and 62 and the second guide shafts 63 and 64 may be arranged side by side horizontally, that is, in a horizontal arrangement. 【0046】In the embodiment, the first transfer device 21 clamps the substrate S between the clamp plate 28 and a part of the mounting plate 24 (pressing member 24a), but it is not limited thereto. Also, the second transfer device 41 clamps the substrate S between the clamp plate 48 and a part of the mounting plate 44 (pressing member 44a), but it is not limited thereto. That is, the first transfer device 21 and the second transfer device 41 are not limited to clamping the substrate S using a part of the mounting plates 24 and 44, and the substrate S may be clamped in any configuration. Even in a configuration where a part of the mounting plates 24 and 44 is not used for clamping the substrate S, in order to suppress the influence of vibrations of one transfer device on the other transfer device, there is a significance in using separate guide shafts as in the present disclosure. 【0047】 In the embodiment, in the first transfer device 21, the mounting plate 24F is fixed immovably and the mounting plate 24R is made movable, but it is not limited thereto. For example, both the mounting plates 24F and 24R may be made movable. Also, in the second transfer device 41, both the mounting plates 24F and 24R are made movable, but it is not limited thereto. For example, the mounting plate 44F may be fixed immovably and the mounting plate 44R may be made movable. 【0048】 In the embodiment, as the substrate working device, the mounting device 10 that performs the component mounting work on the substrate S is exemplified, but it is not limited thereto. For example, any substrate working device may be applied as long as it performs work on the substrate S conveyed in two transfer paths, such as a printing device that performs printing work such as soldering on the substrate S or an inspection device that performs inspection work on the substrate S. 【0049】 The present disclosure can be used in a substrate working device that performs work on a substrate conveyed in two transfer paths. 【0050】10 Mounting device, 11 Base, 11a Base plate, 12 Feeder, 13 Mounting head, 14 Nozzle, 15 Moving device, 16 Parts camera, 17 Mark camera, 18 Control device, 20 Substrate transport device, 21 First transport device, 22, 42 Belt conveyor, 22a, 42a Drive pulley, 23, 43 Drive shaft, 23m, 43m Drive motor, 24, 24F, 24R, 44, 44F, 44R Mounting plate, 24a, 44a Pressing member, 24b, 24c, 44d, 44e, 44h, 44i Connecting hole, 25, 45 Width changing part, 26, 46, 47 Ball screw, 26a, 47a Nut, 26m, 46m, 47m Drive motor, 28, 48 Clamp plate, 28a, 48a Support parts, 28b, 48b Contact pins, 28c, 48c Springs, 30, 50 Clamp drive unit, 31, 51 Backup plate, 32, 52 Mounting plate, 33, 53 Ball screw mechanism, 34, 54 Ball screw, 34a, 54a Pulley, 35, 55 Drive motor, 35b, 55b Pulley, 36, 56 Belt, 37, 57 Lifting guide, 38, 58 Guide shaft, 41 Second transport device, 44b, 44c, 44f, 44g Through hole, 61, 62 First guide shaft, 63, 64 Second guide shaft, 65, 66, 67, 68 Support block, S Substrate.

Claims

1. A substrate handling device for performing work on substrates transported on a first transport path and a second transport path, comprising: a first transport device constituting the first transport path, comprising: a pair of first mounting members each to which a pair of conveyors arranged spaced apart in the width direction of the substrate are attached; a first width changing unit for changing the transport width by moving at least one of the first mounting members in the width direction; and a first clamping unit for clamping the substrate; a second transport device constituting the second transport path parallel to the first transport path, comprising: a pair of second mounting members each to which a pair of conveyors arranged spaced apart in the width direction of the substrate are attached; a second width changing unit for changing the transport width by moving at least one of the second mounting members in the width direction; and a second clamping unit for clamping the substrate; and two first guide shafts extending in the width direction across the first transport device and the second transport device and spaced apart in the transport direction of the substrate to guide the movement of the first mounting members. A substrate handling device comprising: two second guide shafts that extend in the width direction across the first transport device and the second transport device and are spaced apart in the transport direction so as to guide the movement of the second mounting member; 2. The substrate handling apparatus according to claim 1, wherein the first conveying apparatus has a first clamping section that pushes up the substrate and clamps the substrate between itself and a part of the first mounting member, and the second conveying apparatus has a second clamping section that pushes up the substrate and clamps the substrate between itself and a part of the second mounting member.

3. The substrate handling apparatus according to claim 1 or 2, wherein the first guide shaft and the second guide shaft are arranged side by side, one above the other, at one end and the other end in the transport direction.

4. A substrate handling apparatus according to claim 3, comprising: a pair of one-end support members that support both ends of one first guide shaft and both ends of one second guide shaft at one end in the transport direction; and a pair of other-end support members that support both ends of one first guide shaft and both ends of one second guide shaft at the other end in the transport direction.

5. The substrate handling apparatus according to claim 3, wherein the second conveying apparatus has a connecting hole formed on one end and the other end of the second mounting member for slidably connecting to the second guide shaft, and an insertion hole with an inner diameter larger than the outer diameter of the first guide shaft formed above the connecting hole for the insertion of the first guide shaft, and the first conveying apparatus has a connecting hole formed on one end and the other end of the first mounting member for slidably connecting to the first guide shaft, and the lower end of the first mounting member is formed to be at a height above the second guide shaft.

6. The substrate handling apparatus according to claim 3, wherein the first conveying device has one or more drive shafts that extend in the width direction across the first conveying device and the second conveying device for moving the first mounting member, the second conveying device has one or more drive shafts that extend in the width direction across the first conveying device and the second conveying device for moving the second mounting member, and the two first guide shafts and the two second guide shafts are arranged so as to accommodate the drive shafts of the first conveying device and the drive shafts of the second conveying device in the conveying direction.

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