Wafer sensor and imaging method

The wafer-type sensor addresses illumination and reflection issues by integrating a diffusing substrate surface with light sources, ensuring uniform illumination and improved imaging quality without additional components or external support.

WO2026126853A1 Publication Date: 2026-06-18TOKYO ELECTRON LTD
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
TOKYO ELECTRON LTD
Filing Date
2025-12-01
Publication Date
2026-06-18

AI Technical Summary

⚠Technical Problem

Existing wafer-type sensors face challenges in efficiently illuminating objects while minimizing strong light reflections, which can interfere with imaging quality and require separate components for light diffusion and transmission.

⚗Method used

A wafer-type sensor design featuring a substrate with a light-transmitting portion and integrated light sources, where the substrate surface includes a first light-diffusing portion to diffuse light evenly, reducing strong light reflections and eliminating the need for additional diffusion components.

🎯Benefits of technology

The design allows for uniform illumination of objects, suppressing reflections and enhancing imaging quality by diffusing light through irregularities formed on the substrate surface, enabling stable operation without external control or power sources.

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Abstract

A wafer sensor according to an exemplary embodiment of the present invention is provided with a substrate, an imaging device, and at least one light source. The substrate contains a light-transmitting portion. The imaging device is disposed above the substrate so as to capture an image of an object below the substrate via the light-transmitting portion. The at least one light source is disposed above the substrate so as to irradiate the object with light via the light-transmitting portion. The light-transmitting portion has a light diffusion portion on a surface facing the at least one light source.
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