Temperature control collimator based on macro-micro combination of multi-stage thermoelectric cooling piece and method

Abstract

The present application belongs to the technical field of precision angle measuring instrument, and particularly relates to a temperature control autocollimator device and method based on macro-micro combination of multi-stage thermoelectric cooling piece. The device is composed of an autocollimator body, a global temperature sensing unit, a component temperature sensing unit, a high-power thermoelectric cooling unit, a component thermoelectric cooling unit, a circuit group and a microprocessor. The method uses the combination of global temperature sensing and component temperature sensing to obtain internal temperature information of the device, and controls the high-power thermoelectric cooling unit and the component thermoelectric cooling unit to work in stages and cooperatively by the microprocessor, so that the overall temperature of the device is quickly adjusted while the temperature of the key component is precisely controlled, thereby balancing the temperature control efficiency and the temperature control accuracy. The present application improves the temperature interference resistance, the measurement accuracy and the stability of the autocollimator device.

Description

Technical Field

[0001] This invention belongs to the technical field of precision angle measuring instruments, and relates to a temperature-controlled self-collimation device and method based on a macro-micro combination of multi-stage thermoelectric cooling elements. Background Technology

[0002] Autocollimators are precision angle measuring instruments with wide applications in advanced manufacturing, precision motion control, high-end equipment integration, and scientific research. However, in existing technologies, temperature changes in autocollimators cause thermal deformation of components and alterations in optical parameters such as the refractive index of glass and air, reducing the accuracy and stability of angle measurements.

[0003] For example, Chinese invention patent CN117367325A discloses a temperature-interference-resistant self-collimation device and method based on global temperature control. It utilizes a thermoelectric cooler and a temperature sensor to design a constant-temperature optical tube, and uses multiple constant-temperature optical tubes to fully cover the self-collimation measurement optical path. This device can reduce temperature fluctuations within the self-collimation system at specific temperature points. However, this device uses only a single type of thermoelectric cooler. When facing a wide range of temperature changes, the thermoelectric cooler needs to operate at high power to achieve global temperature control, which reduces the temperature control accuracy, making it difficult to balance both the temperature control range and accuracy.

[0004] For example, Chinese invention patent CN108592825A discloses a photoelectric self-collimation device and method based on differential compensation. It utilizes a spatially sufficiently close reference beam and a measurement beam to perform differential calculations, eliminating common-mode errors introduced by temperature. This device can reduce environmentally introduced drift and has high anti-interference capability. However, when the measurement plane mirror rotates at a large angle, the two beams can no longer propagate along the same optical path, limiting the compensation effect. If common-path propagation is required, the system needs to synchronously adjust the angle of the reference mirror when the measurement mirror rotates, making control difficult.

[0005] Therefore, there is an urgent need to propose a temperature control self-collimation device that can balance temperature control range and temperature control accuracy in order to solve the above-mentioned technical problems. Summary of the Invention

[0006] To address the aforementioned problems, a temperature control self-collimation device and method based on a macro-micro combination of multi-stage thermoelectric cooling elements are provided. A brief overview of the invention is given below to provide a basic understanding of certain aspects of the invention. It should be understood that this overview is not an exhaustive summary of the invention. It is not intended to identify key or essential parts of the invention, nor is it intended to limit the scope of the invention.

[0007] To address the problem that existing autocollimation devices are susceptible to the influence of changes in the working environment temperature, which leads to a decrease in measurement accuracy and stability, this invention proposes a temperature-controlled autocollimation device and method based on a macro-micro combination of multi-stage thermoelectric cooling elements.

[0008] This invention constructs a two-stage temperature control structure within the self-collimating device: rapid overall temperature adjustment and precise temperature control of key components. A global temperature sensing unit measures the overall temperature change within the device, while component temperature sensing units measure the local temperature changes of key components. A microprocessor controls thermoelectric coolers of different scales to work collaboratively based on the temperature detection results, achieving layered control of the internal temperature field. Specifically, the high-power thermoelectric cooler unit acts as the macroscopic temperature control actuator, rapidly adjusting the overall internal temperature of the device when there are large fluctuations in the external ambient temperature or significant temperature differences within the device, quickly establishing a stable overall thermal environment. The component thermoelectric cooler unit acts as the microscopic temperature control actuator, precisely controlling the temperature of key optical components after the overall temperature approaches the target temperature, suppressing local thermal drift, thermal deformation, and fluctuations in optical parameters such as glass refractive index and air refractive index caused by temperature changes.

[0009] This invention transforms the traditional single-stage temperature control method of a single thermoelectric cooler into a graded and coordinated temperature control method of thermoelectric coolers of different sizes. It can adopt segmented control, coordinated control, synchronous control or independent control modes as needed, thereby balancing temperature control efficiency and temperature control accuracy, improving the anti-temperature interference capability, angle measurement accuracy and stability of the autocollimation device, and solving the problem of the measurement performance degradation of existing autocollimation devices due to changes in ambient temperature.

[0010] The technical solution of this invention: The temperature control self-collimation device based on the macro-micro combination of multi-stage thermoelectric cooling chips includes: the self-collimation body includes: a laser source, a beam splitter, and a collimating objective lens arranged sequentially inside the device housing, and a CCD sensor is correspondingly arranged below the beam splitter. The self-collimating body is equipped with a temperature sensor and a thermoelectric cooling element of the corresponding element group on its components; The temperature sensors of the global group and the thermoelectric coolers of the high-power group are arranged inside the device housing; the temperature sensors of the global group, the thermoelectric coolers of the high-power group, the temperature sensors of the component group, and the thermoelectric coolers of the component group are all connected to the microprocessor through the circuit group.

[0011] Preferably, the global temperature sensor group includes a first global temperature sensor, a second global temperature sensor, a third global temperature sensor, and a fourth global temperature sensor, which are evenly arranged inside the device housing. The circuit group includes a global temperature acquisition circuit. The signals collected by the first global temperature sensor, the second global temperature sensor, the third global temperature sensor, and the fourth global temperature sensor are transmitted to the microprocessor through the global temperature acquisition circuit.

[0012] Preferred: The temperature sensor of the component group includes: a first element temperature sensor and a second element temperature sensor arranged on both sides of the laser source; a fourth element temperature sensor and a third element temperature sensor arranged on both sides of the beam splitter; a sixth element temperature sensor and a fifth element temperature sensor arranged on both sides of the collimating objective lens; and an eighth element temperature sensor and a seventh element temperature sensor arranged on both sides of the CCD sensor. The circuit group includes a component temperature acquisition circuit, which includes: a first component temperature acquisition circuit, a second component temperature acquisition circuit, a third component temperature acquisition circuit, and a fourth component temperature acquisition circuit; the first component temperature sensor and the second component temperature sensor are connected to the first component temperature acquisition circuit, the third component temperature sensor and the fourth component temperature sensor are connected to the second component temperature acquisition circuit, the fifth component temperature sensor and the sixth component temperature sensor are connected to the third component temperature acquisition circuit, and the seventh component temperature sensor and the eighth component temperature sensor are connected to the fourth component temperature acquisition circuit.

[0013] Preferably, the high-power thermoelectric cooling element includes: a first high-power thermoelectric cooling element and a second high-power thermoelectric cooling element located on the left and right sides of the CCD sensor; The circuit group includes a high-power drive circuit, and the first high-power thermoelectric cooler and the second high-power thermoelectric cooler are connected to the microprocessor through the high-power drive circuit.

[0014] Preferred: The thermoelectric cooler of the element group includes: a first thermoelectric cooler mounted on the laser light source, a second thermoelectric cooler mounted on the beam splitter, a third thermoelectric cooler mounted on the collimating objective lens, and a fourth thermoelectric cooler mounted on the CCD sensor; The circuit group includes a high-precision drive circuit, which includes: a first thermoelectric cooler connected to a first high-precision drive circuit, a second thermoelectric cooler connected to a second high-precision drive circuit, a third thermoelectric cooler connected to a third high-precision drive circuit, and a fourth thermoelectric cooler connected to a fourth high-precision drive circuit.

[0015] The temperature control self-collimation method based on the macro-micro combination of multi-stage thermoelectric cooling chips, using the aforementioned temperature control self-collimation device based on the macro-micro combination of multi-stage thermoelectric cooling chips, includes: segmented control, coordinated control, synchronous control, and independent control.

[0016] Preferred method: When using segmented control, the specific steps are as follows: Step a: The microprocessor sets the preset control temperature value T0 and the segmented control mode; Step b: The first global temperature sensor, the second global temperature sensor, the third global temperature sensor, and the fourth global temperature sensor perform temperature measurements; Step c: The microprocessor obtains the temperature measurement values ​​T1, T2, T3, and T4 through the global temperature acquisition circuit 11; Step d: Calculate the internal temperature value of the autocollimator, Tn = (T1 + T2 + T3 + T4) / 4; Step e: Compare the internal temperature value Tn obtained in step d with the preset control temperature value T0 set in step a, calculate the absolute value of the temperature difference |T0-Tn|, and determine whether the absolute value of the temperature difference is less than 1. If it is true, switch the control mode and proceed to step g; otherwise, continue the current control mode and proceed to step f. Step f: Compare Tn with T0 to determine whether Tn > T0 is true. If it is true, the microprocessor controls the first high-power thermoelectric cooler and the second high-power thermoelectric cooler to cool through the high-power drive circuit. Otherwise, the microprocessor controls the first high-power thermoelectric cooler and the second high-power thermoelectric cooler to heat through the high-power drive circuit. Step g: Turn off the high-power thermoelectric cooler and only drive the element thermoelectric cooler for element temperature control; Step h: Repeat step g to complete the internal temperature control of the autocollimator.

[0017] Preferred method: The specific steps when using collaborative control are as follows: Step a: The microprocessor sets the preset control temperature value T0 and the collaborative control mode; Step b: The first global temperature sensor, the second global temperature sensor, the third global temperature sensor, and the fourth global temperature sensor perform temperature measurements; Step c: The microprocessor obtains the temperature measurement values ​​T1, T2, T3, and T4 through the global temperature acquisition circuit 11; Step d: Calculate the internal temperature value of the autocollimator, Tn = (T1 + T2 + T3 + T4) / 4; Step e: Compare the internal temperature value Tn obtained in step d with the preset control temperature value T0 set in step a, calculate the absolute value of the temperature difference |T0-Tn|, and determine whether the absolute value of the temperature difference is less than 1. If it is true, switch the control mode and proceed to step g; otherwise, continue the current control mode and proceed to step f. Step f: Compare Tn with T0 to determine whether Tn > T0. If yes, the microprocessor controls the first high-power thermoelectric cooler, the second high-power thermoelectric cooler, the first high-precision drive circuit, the second high-precision drive circuit, the third high-precision drive circuit, and the fourth high-precision drive circuit to control the first element thermoelectric cooler, the second element thermoelectric cooler, the third element thermoelectric cooler, and the fourth element thermoelectric cooler to perform cooling through the high-power drive circuit. Otherwise, the microprocessor controls the first high-power thermoelectric cooler, the second high-power thermoelectric cooler, the first high-precision drive circuit, the second high-precision drive circuit, the third high-precision drive circuit, and the fourth high-precision drive circuit to control the first element thermoelectric cooler, the second element thermoelectric cooler, the third element thermoelectric cooler, and the fourth element thermoelectric cooler to perform heating through the high-power drive circuit. Step g: Turn off the high-power thermoelectric cooler, leaving only the element thermoelectric cooler for element temperature control; Step h: Repeat step g to complete the temperature control of the self-collimation device.

[0018] Preferred method: When using synchronous control, the specific steps are as follows: Step a: The microprocessor sets the preset control temperature value T0 and the synchronous control mode; Step b: Perform global temperature control; Step c: Repeat step c until the global temperature control meets the requirements, then proceed to step d; Step d: Temperature is measured by the first element temperature sensor, the second element temperature sensor, the third element temperature sensor, the fourth element temperature sensor, the fifth element temperature sensor, the sixth element temperature sensor, the seventh element temperature sensor, and the eighth element temperature sensor; Step e: The microprocessor obtains temperature measurement values ​​T5, T6, T7, T8, T9, T10, T11, and T12 through the first element temperature sampling circuit, the second element temperature sampling circuit, the third element temperature sampling circuit, and the fourth element temperature sampling circuit; Step f: Calculate the temperature value of the autocollimator element Tr=(T5+T6+T7+T8+T9+T10+T11+T12) / 8; Step g: Compare the element temperature value Tr obtained in step d with the preset control temperature value T0 set in step a, calculate the absolute value of the temperature difference |T0-Tr|, and determine whether the absolute value of the temperature difference is greater than 0.1. If yes, proceed to step f; otherwise, turn off the element thermoelectric cooling chip. In step f, Tr is compared with T0 to determine whether Tr > T0 is true. If it is true, the microprocessor controls the first thermoelectric cooler, the second thermoelectric cooler, the third thermoelectric cooler, and the fourth thermoelectric cooler to perform cooling through the first high-precision drive circuit, the second high-precision drive circuit, the third high-precision drive circuit, and the fourth high-precision drive circuit. Otherwise, the microprocessor controls the first thermoelectric cooler, the second thermoelectric cooler, the third thermoelectric cooler, and the fourth thermoelectric cooler to perform heating through the first high-precision drive circuit, the second high-precision drive circuit, the third high-precision drive circuit, and the fourth high-precision drive circuit. In step g, steps d through f are repeated to complete the temperature control of the self-collimation device.

[0019] Preferred method: When using independent control, the specific steps are as follows: Step a: The microprocessor sets the preset control temperature value T0 and the independent control mode; Step b: Perform global temperature control; Step c: Repeat step c until the global temperature control meets the requirements, then proceed to step d; Step d: Temperature is measured by the first element temperature sensor, the second element temperature sensor, the third element temperature sensor, the fourth element temperature sensor, the fifth element temperature sensor, the sixth element temperature sensor, the seventh element temperature sensor, and the eighth element temperature sensor; Step e: The microprocessor obtains temperature measurement values ​​T5, T6, T7, T8, T9, T10, T11, and T12 through the first element temperature sampling circuit, the second element temperature sampling circuit, the third element temperature sampling circuit, and the fourth element temperature sampling circuit; Step f: Calculate the temperature values ​​of laser source 1 (Tr1=(T5+T6) / 2), beam splitter prism 2 (Tr2=(T7+T8) / 2), collimating objective lens 3 (Tr3=(T9+T10) / 2), and CCD sensor 4 (Tr4=(T11+T12) / 2). Step g: Compare the component temperature values ​​Tr1, Tr2, Tr3 and Tr4 obtained in step d with the preset control temperature value T0 set in step a, calculate the absolute values ​​of the temperature differences |T0-Tr1|, |T0-Tr2|, |T0-Tr3| and |T0-Tr4| respectively, and determine whether the absolute value of the temperature difference is greater than 0.1. If yes, proceed to step f; otherwise, turn off the component thermoelectric cooling chip. In step f, Tr1 is compared with T0 to determine whether Tr1 > T0 is true. If it is true, the microprocessor controls the first element thermoelectric cooler to cool through the first high-precision drive circuit. Otherwise, the microprocessor controls the first element thermoelectric cooler to heat through the first high-precision drive circuit. Compare Tr2 with T0 to determine whether Tr2 > T0 is true. If it is true, the microprocessor controls the second element thermoelectric cooler to cool through the second high-precision drive circuit. Otherwise, the microprocessor controls the second element thermoelectric cooler to heat through the second high-precision drive circuit. Compare Tr3 with T0 to determine whether Tr3 > T0 is true. If it is true, the microprocessor controls the third element thermoelectric cooler to cool through the third high-precision drive circuit. Otherwise, the microprocessor controls the third element thermoelectric cooler to heat through the third high-precision drive circuit. Compare Tr4 with T0 to determine whether Tr4 > T0 is true. If it is true, the microprocessor controls the fourth element thermoelectric cooler to cool through the fourth high-precision drive circuit. Otherwise, the microprocessor controls the fourth element thermoelectric cooler to heat through the fourth high-precision drive circuit. In step g, steps d through f are repeated to complete the temperature control of the self-collimation device.

[0020] The present invention has the following beneficial effects: 1. This invention addresses the problem that existing autocollimation devices are susceptible to changes in ambient temperature, which can affect measurement accuracy and stability. The device utilizes two thermoelectric coolers of different sizes working in tandem. A high-power thermoelectric cooler rapidly lowers the internal temperature, while a low-power, high-precision thermoelectric cooler provides fine-tuning when the temperature difference is small. This allows the autocollimation device to intelligently switch cooling modes according to different temperature control requirements, balancing high efficiency and high precision in internal temperature control, thereby improving its resistance to temperature interference. Experimental data shows that this method can control the internal temperature of the autocollimation device within ±0.1℃, providing a temperature control scheme for autocollimation devices that can both rapidly cool and precisely control the temperature, thus improving the measurement accuracy and stability of the autocollimation device. This is one of the innovative aspects that distinguishes this invention from existing technologies.

[0021] 2. Compared to traditional autocollimation measurement methods, this invention is insensitive to the optical design and sensor selection of the autocollimator. Only the control parameters need to be adjusted, and the overall structure does not need to be changed with the autocollimator design. It can be adapted to various autocollimator structures, significantly reducing the difficulty of applying this method to autocollimators designed for different needs and uses. This is the second innovative point of this invention that distinguishes it from the prior art.

[0022] 3. The method of the present invention also has the following technical advantages: First, the temperature control hardware and algorithm of this method are designed independently and are not coupled with other modules of the autocollimator, which facilitates debugging and replacement. Secondly, this method has different temperature control methods for high-power thermoelectric coolers and high-precision thermoelectric coolers, making full use of their respective temperature control characteristics. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the temperature control self-collimation device based on the macro-micro combination of multi-stage thermoelectric cooling chips according to the present invention.

[0024] Figure 2 This is a schematic diagram of the global temperature sampling circuit in a specific embodiment.

[0025] Figure 3 This is a schematic diagram of the temperature sampling circuit of the first element in a specific embodiment.

[0026] Figure 4 This is a schematic diagram of the high-power drive circuit in a specific embodiment.

[0027] Figure 5 This is a schematic diagram of the first high-precision drive circuit in a specific embodiment.

[0028] Figure 6 This is a schematic diagram of the segmented control flow in a specific embodiment.

[0029] Figure 7 This is a schematic diagram of the collaborative control process in a specific embodiment.

[0030] Figure 8 This is a schematic diagram of the synchronization control process in a specific embodiment.

[0031] Figure 9 This is a schematic diagram of the independent control flow in a specific embodiment. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of this invention clearer, the invention is described below with reference to specific embodiments shown in the accompanying drawings. However, it should be understood that these descriptions are merely exemplary and not intended to limit the scope of the invention. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concept of the invention.

[0033] Example 1 Combination Figure 1-6 This embodiment describes a temperature control self-collimation device and its temperature control method based on a macro-micro combination of multi-stage thermoelectric cooling elements.

[0034] The temperature control self-collimation device based on the macro-micro combination of multi-stage thermoelectric coolers in this embodiment includes a self-collimation body, a global group of temperature sensors, a component group of temperature sensors, a high-power group of thermoelectric coolers, a component group of thermoelectric coolers, and a circuit group; the global group of temperature sensors, the high-power group of thermoelectric coolers, the component group of temperature sensors, and the component group of thermoelectric coolers are all connected to the microprocessor 10 through the circuit group.

[0035] The autocollimation unit includes a laser source 1, a beam splitter 2, a collimating objective lens 3, a CCD sensor 4, and a housing 5. The laser source 1, beam splitter 2, and collimating objective lens 3 are concentrically arranged from left to right on the upper inner side of the housing 5. The CCD sensor 4 is located inside the housing 5, corresponding to the beam splitter 2. The laser beam emitted from the laser source 1 is split into two beams after passing through the beam splitter 2, and the two beams are directed towards the collimating objective lens 3 and the CCD sensor 4, respectively.

[0036] The global temperature sensor group includes a first global temperature sensor 101, a second global temperature sensor 102, a third global temperature sensor 103, and a fourth global temperature sensor 104. The four sensors are evenly arranged at the four inner corners of the device housing 5 to collect the overall temperature distribution information inside the collimation device.

[0037] The temperature sensor array includes a first element temperature sensor 201, a second element temperature sensor 202, a third element temperature sensor 203, a fourth element temperature sensor 204, a fifth element temperature sensor 205, a sixth element temperature sensor 206, a seventh element temperature sensor 207, and an eighth element temperature sensor 208. Specifically, the first element temperature sensor 201 and the second element temperature sensor 202 are located on the upper and lower left sides of the laser source 1; the third element temperature sensor 203 and the fourth element temperature sensor 204 are located on the upper and lower left sides of the beam splitter prism 2; the fifth element temperature sensor 205 and the sixth element temperature sensor 206 are located on the upper and lower left sides of the collimating objective lens 3; and the seventh element temperature sensor 207 and the eighth element temperature sensor 208 are located on the upper left and right sides of the CCD sensor 4.

[0038] The high-power thermoelectric cooling element includes a first high-power thermoelectric cooling element 301 and a second high-power thermoelectric cooling element 302. The first high-power thermoelectric cooling element 301 and the second high-power thermoelectric cooling element 302 are respectively disposed on the left and right sides of the CCD sensor 4, and are used to quickly adjust the overall temperature inside the device.

[0039] The thermoelectric cooler of the component group includes a first thermoelectric cooler 401, a second thermoelectric cooler 402, a third thermoelectric cooler 403, and a fourth thermoelectric cooler 404. The first thermoelectric cooler 401 is mounted on the laser source 1, the second thermoelectric cooler 402 is mounted on the beam splitter 2, the third thermoelectric cooler 403 is mounted on the collimating objective lens 3, and the fourth thermoelectric cooler 404 is mounted on the CCD sensor 4, which is used to perform fine temperature regulation on each key optical component.

[0040] The circuit group includes a global temperature acquisition circuit 11, a component temperature acquisition circuit, a high-power drive circuit 31, and a high-precision drive circuit.

[0041] The global temperature acquisition circuit 11 is used to acquire and convert signals from the global group of temperature sensors. The signals acquired by the first global temperature sensor 101, the second global temperature sensor 102, the third global temperature sensor 103, and the fourth global temperature sensor 104 are transmitted to the microprocessor 10 after passing through the RV conversion circuit and AD unit in the global temperature acquisition circuit 11. The RV conversion circuit and AD unit are powered by the power supply unit.

[0042] The component temperature acquisition circuit includes a first component temperature acquisition circuit 21, a second component temperature acquisition circuit 22, a third component temperature acquisition circuit 23, and a fourth component temperature acquisition circuit 24. The first to fourth component temperature acquisition circuits 21 and 24 have the same structure, each including an RV conversion circuit, a first-stage differential operational amplifier circuit, a second-stage differential operational amplifier circuit, and a high-precision AD unit connected in sequence. The high-precision AD unit is connected to a reference voltage source. The RV conversion circuit, the first-stage differential operational amplifier circuit, the second-stage differential operational amplifier circuit, and the high-precision AD unit are all powered by a power supply unit, and the high-precision AD unit is connected to the microprocessor 10. The first component temperature sensor 201 and the second component temperature sensor 202 are connected to the first component temperature acquisition circuit 21; the third component temperature sensor 203 and the fourth component temperature sensor 204 are connected to the second component temperature acquisition circuit 22; the fifth component temperature sensor 205 and the sixth component temperature sensor 206 are connected to the third component temperature acquisition circuit 23; and the seventh component temperature sensor 207 and the eighth component temperature sensor 208 are connected to the fourth component temperature acquisition circuit 24.

[0043] The high-power drive circuit 31 includes an H-bridge circuit and a high-power DC power supply for it. The microprocessor 10, the H-bridge circuit, and the thermoelectric coolers of the high-power group are connected in sequence. The first high-power thermoelectric cooler 301 and the second high-power thermoelectric cooler 302 are both connected to the microprocessor 10 through the high-power drive circuit 31.

[0044] The high-precision drive circuit includes a first high-precision drive circuit 41, a second high-precision drive circuit 42, a third high-precision drive circuit 43, and a fourth high-precision drive circuit 44. The first to fourth high-precision drive circuits 41 have the same structure, each including a PWM signal conversion circuit and an H-bridge circuit connected in sequence. The PWM signal conversion circuit is powered by a power supply unit, a high-precision voltage source is connected to the H-bridge circuit, the microprocessor 10 is connected to the PWM signal conversion circuit, and the H-bridge circuit is connected to the corresponding thermoelectric cooler element group. Specifically, the first thermoelectric cooler element 401 is connected to the first high-precision drive circuit 41, the second thermoelectric cooler element 402 is connected to the second high-precision drive circuit 42, the third thermoelectric cooler element 403 is connected to the third high-precision drive circuit 43, and the fourth thermoelectric cooler element 404 is connected to the fourth high-precision drive circuit 44.

[0045] In this embodiment, a high-power thermoelectric cooler is used to rapidly regulate the overall internal temperature of the device, while a low-power, high-precision thermoelectric cooler is used for precise temperature regulation of key components such as the laser source, beam splitter, collimating objective lens, and CCD sensor. Through the synergistic effect of the two-stage thermoelectric coolers, both temperature control range and accuracy can be balanced, thereby improving the autocollimator's resistance to temperature disturbances and its angle measurement accuracy and stability. Experimental results show that this scheme can control the internal temperature of the autocollimator within ±0.1℃.

[0046] Based on the above-mentioned device, this embodiment adopts a segmented control method to achieve temperature control, and the specific steps are as follows: Step S1: The microprocessor 10 sets the preset control temperature value T0 and selects the segmented control mode; Step S2: The first global temperature sensor 101, the second global temperature sensor 102, the third global temperature sensor 103 and the fourth global temperature sensor 104 perform temperature measurement; Step S3: The microprocessor 10 obtains temperature measurement values ​​T1, T2, T3 and T4 through the global temperature acquisition circuit 11; Step S4: Calculate the average internal temperature of the autocollimator, Tn = (T1 + T2 + T3 + T4) / 4; Step S5: Compare the internal average temperature value Tn with the preset control temperature value T0, and calculate the absolute value of the temperature difference |T0-Tn|; if |T0-Tn|≥1℃, proceed to step S6; if |T0-Tn|<1℃, proceed to step S7. Step S6: Compare Tn with T0. If Tn > T0, the microprocessor 10 controls the first high-power thermoelectric cooler 301 and the second high-power thermoelectric cooler 302 to perform cooling through the high-power drive circuit 31; if Tn ≤ T0, the microprocessor 10 controls the first high-power thermoelectric cooler 301 and the second high-power thermoelectric cooler 302 to perform heating through the high-power drive circuit 31; after completion, return to step S2 to continue the loop. Step S7: Turn off the first high-power thermoelectric cooler 301 and the second high-power thermoelectric cooler 302, and drive only the first element thermoelectric cooler 401, the second element thermoelectric cooler 402, the third element thermoelectric cooler 403 and the fourth element thermoelectric cooler 404 to perform fine control of the element temperature, so as to complete the internal temperature control of the self-collimation device.

[0047] Example 2 Combination Figure 1-5 and Figure 7 This embodiment is described below. The structure, composition, connection relationship, and working principle of the temperature control self-collimation device based on the macro-micro combination of multi-stage thermoelectric cooling chips used in this embodiment are consistent with those of Embodiment 1 and have not changed. The only difference between this embodiment and Embodiment 1 is the temperature control method.

[0048] In this embodiment, based on the same device as in Embodiment 1, a collaborative control method is used to achieve temperature control. Compared to the segmented control strategy in Embodiment 1, which first uses the high-power thermoelectric cooler for overall adjustment and then switches to the component group for fine adjustment, this embodiment uses both the high-power thermoelectric cooler and the component thermoelectric cooler for adjustment during periods of large temperature difference to improve the temperature control response speed; when the overall temperature difference shrinks to the set threshold, the high-power thermoelectric cooler is turned off, and only the component thermoelectric cooler is retained for high-precision steady-state control.

[0049] The specific steps are as follows: Step S1: The microprocessor 10 sets the preset control temperature value T0 and selects the collaborative control mode; Step S2: The first global temperature sensor 101, the second global temperature sensor 102, the third global temperature sensor 103 and the fourth global temperature sensor 104 perform temperature measurement; Step S3: The microprocessor 10 obtains temperature measurement values ​​T1, T2, T3 and T4 through the global temperature acquisition circuit 11; Step S4: Calculate the average internal temperature of the autocollimator, Tn = (T1 + T2 + T3 + T4) / 4; Step S5: Compare the internal average temperature value Tn with the preset control temperature value T0, and calculate the absolute value of the temperature difference |T0-Tn|; if |T0-Tn|≥1℃, proceed to step S6; if |T0-Tn|<1℃, proceed to step S7. Step S6: Compare Tn with T0. If Tn > T0, the microprocessor 10 controls the first high-power thermoelectric cooler 301 and the second high-power thermoelectric cooler 302 to perform cooling through the high-power drive circuit 31. At the same time, it controls the first element thermoelectric cooler 401, the second element thermoelectric cooler 402, the third element thermoelectric cooler 403, and the fourth element thermoelectric cooler 404 to perform cooling through the first high-precision drive circuit 41, the second high-precision drive circuit 42, the third high-precision drive circuit 43, and the fourth high-precision drive circuit 44. If Tn≤T0, the microprocessor 10 controls the first high-power thermoelectric cooler 301 and the second high-power thermoelectric cooler 302 to heat through the high-power drive circuit 31, and simultaneously controls the first element thermoelectric cooler 401, the second element thermoelectric cooler 402, the third element thermoelectric cooler 403 and the fourth element thermoelectric cooler 404 to heat through the first high-precision drive circuit 41, the second high-precision drive circuit 42, the third high-precision drive circuit 43 and the fourth high-precision drive circuit 44; after completion, it returns to step S2 to continue the loop. Step S7: Turn off the first high-power thermoelectric cooler 301 and the second high-power thermoelectric cooler 302, and only keep the first element thermoelectric cooler 401, the second element thermoelectric cooler 402, the third element thermoelectric cooler 403 and the fourth element thermoelectric cooler 404 for element temperature control, so as to complete the temperature control of the self-collimation device.

[0050] Example 3 Combination Figure 1-5 and Figure 8 This embodiment is described below. The structure, composition, connection relationship, and working principle of the temperature control self-collimation device based on the macro-micro combination of multi-stage thermoelectric cooling chips used in this embodiment are consistent with those of Embodiment 1 and have not changed. The only difference between this embodiment and Embodiment 1 is the temperature control method.

[0051] In this embodiment, based on the same device as in Embodiment 1, a synchronous control method is used to achieve temperature control. This method first controls the overall temperature inside the device. After the overall temperature meets the requirements, the average temperature of each component is then uniformly and precisely adjusted, thereby taking into account both the establishment of the overall temperature field and the temperature control accuracy of key components.

[0052] The specific steps are as follows: Step S1: The microprocessor 10 sets the preset control temperature value T0 and selects the synchronous control mode; Step S2: Perform global temperature control; Step S3: Repeat step S2 until the global temperature control meets the requirements, then proceed to step S4; Step S4: Temperature sensor 201, temperature sensor 202, temperature sensor 203, temperature sensor 204, temperature sensor 205, temperature sensor 206, temperature sensor 207 and temperature sensor 208 measure the temperature. Step S5: The microprocessor 10 obtains temperature measurement values ​​T5, T6, T7, T8, T9, T10, T11 and T12 through the first element temperature sampling circuit 21, the second element temperature sampling circuit 22, the third element temperature sampling circuit 23 and the fourth element temperature sampling circuit 24; Step S6: Calculate the overall average temperature value of the autocollimator Tr=(T5+T6+T7+T8+T9+T10+T11+T12) / 8; Step S7: Compare the overall average temperature value Tr of the components with the preset control temperature value T0, and calculate the absolute value of the temperature difference |T0-Tr|; if |T0-Tr|>0.1℃, proceed to step S8; if |T0-Tr|≤0.1℃, turn off the first thermoelectric cooler 401, the second thermoelectric cooler 402, the third thermoelectric cooler 403 and the fourth thermoelectric cooler 404. Step S8: Compare Tr with T0. If Tr > T0, the microprocessor 10 controls the first element thermoelectric cooler 401, the second element thermoelectric cooler 402, the third element thermoelectric cooler 403, and the fourth element thermoelectric cooler 404 to perform cooling through the first high-precision drive circuit 41, the second high-precision drive circuit 42, the third high-precision drive circuit 43, and the fourth high-precision drive circuit 44. If Tr ≤ T0, the microprocessor 10 controls the first element thermoelectric cooler 401, the second element thermoelectric cooler 402, the third element thermoelectric cooler 403, and the fourth element thermoelectric cooler 404 to perform heating through the first high-precision drive circuit 41, the second high-precision drive circuit 42, the third high-precision drive circuit 43, and the fourth high-precision drive circuit 44. After completion, return to step S4 to continue the loop until the temperature control of the self-collimation device is completed.

[0053] Example 4 Combination Figure 1-5 and Figure 9 This embodiment is described below. The structure, composition, connection relationship, and working principle of the temperature control self-collimation device based on the macro-micro combination of multi-stage thermoelectric cooling chips used in this embodiment are consistent with those of Embodiment 1 and have not changed. The only difference between this embodiment and Embodiment 1 is the temperature control method.

[0054] In this embodiment, based on the same device as in Embodiment 1, an independent control method is used to achieve temperature control. After completing global temperature control, this method calculates the temperature values ​​of the laser source, beam splitter, collimating objective lens, and CCD sensor respectively, and drives the corresponding thermoelectric coolers to independently heat or cool, thereby achieving targeted and precise temperature control for different key components.

[0055] The specific steps are as follows: Step S1: The microprocessor 10 sets the preset control temperature value T0 and selects the independent control mode; Step S2: Perform global temperature control; Step S3: Repeat step S2 until the global temperature control meets the requirements, then proceed to step S4; Step S4: Temperature sensor 201, temperature sensor 202, temperature sensor 203, temperature sensor 204, temperature sensor 205, temperature sensor 206, temperature sensor 207 and temperature sensor 208 measure the temperature. Step S5: The microprocessor 10 obtains temperature measurement values ​​T5, T6, T7, T8, T9, T10, T11 and T12 through the first element temperature sampling circuit 21, the second element temperature sampling circuit 22, the third element temperature sampling circuit 23 and the fourth element temperature sampling circuit 24; Step S6: Calculate the temperature values ​​of each component respectively. The temperature value of laser source 1 is Tr1=(T5+T6) / 2, the temperature value of beam splitter 2 is Tr2=(T7+T8) / 2, the temperature value of collimating objective lens 3 is Tr3=(T9+T10) / 2, and the temperature value of CCD sensor 4 is Tr4=(T11+T12) / 2. Step S7: Compare Tr1, Tr2, Tr3 and Tr4 with the preset control temperature value T0 respectively, and calculate the absolute values ​​of the temperature differences |T0-Tr1|, |T0-Tr2|, |T0-Tr3| and |T0-Tr4|; if the absolute value of any temperature difference is greater than 0.1℃, proceed to step S8; if the absolute value of each temperature difference is not greater than 0.1℃, turn off the first element thermoelectric cooler 401, the second element thermoelectric cooler 402, the third element thermoelectric cooler 403 and the fourth element thermoelectric cooler 404. Step S8: Compare Tr1 with T0. If Tr1>T0, the microprocessor 10 controls the first element thermoelectric cooler 401 to perform cooling through the first high-precision drive circuit 41; if Tr1≤T0, the microprocessor 10 controls the first element thermoelectric cooler 401 to perform heating through the first high-precision drive circuit 41. Compare Tr2 with T0. If Tr2>T0, the microprocessor 10 controls the second element thermoelectric cooler 402 to perform cooling through the second high-precision drive circuit 42; if Tr2≤T0, the microprocessor 10 controls the second element thermoelectric cooler 402 to perform heating through the second high-precision drive circuit 42. Compare Tr3 with T0. If Tr3>T0, the microprocessor 10 controls the third element thermoelectric cooler 403 to perform cooling through the third high-precision drive circuit 43; if Tr3≤T0, the microprocessor 10 controls the third element thermoelectric cooler 403 to perform heating through the third high-precision drive circuit 43. Compare Tr4 with T0. If Tr4>T0, the microprocessor 10 controls the fourth element thermoelectric cooler 404 to perform cooling through the fourth high-precision drive circuit 44; if Tr4≤T0, the microprocessor 10 controls the fourth element thermoelectric cooler 404 to perform heating through the fourth high-precision drive circuit 44. After completion, return to step S4 and continue the loop until the temperature control of the self-collimation device is completed.

[0056] The innovation of this invention lies in its combination of the rapid cooling capability of a high-power thermoelectric cooler and the high-precision temperature control capability of a low-power thermoelectric cooler. Compared to methods that use only a single thermoelectric cooler for temperature control, it overcomes the limitations in efficiency and accuracy of traditional single thermoelectric coolers. It also improves the measurement accuracy of the self-collimation device.

[0057] Furthermore, this method is insensitive to the optical design and sensor selection of the autocollimator, requiring only adjustment of control parameters. The overall structure does not need to be changed with the autocollimator design, making it adaptable to various autocollimator structures. This significantly reduces the difficulty of applying this method to autocollimators designed for different needs and purposes.

[0058] Furthermore, the temperature control hardware and algorithm of this method are designed independently and are not coupled with other modules of the autocollimator, which facilitates debugging and replacement.

[0059] Finally, this method offers different temperature control approaches for high-power thermoelectric coolers and high-precision thermoelectric coolers, allowing full utilization of their respective temperature control characteristics.

[0060] Therefore, compared with traditional autocollimation devices, this invention provides a highly applicable temperature-controlled autocollimation device structure and various control methods, improving the measurement accuracy and stability of the autocollimation device.

[0061] It should be noted that in the above embodiments, as long as the technical solutions are not contradictory, they can be permuted and combined. Those skilled in the art can exhaust all possibilities based on the mathematical knowledge of permutation and combination. Therefore, the present invention will not describe the technical solutions after permutation and combination one by one, but it should be understood that the technical solutions after permutation and combination have been disclosed by the present invention.

[0062] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A temperature control self-collimation device based on macro-micro combination of multi-stage thermoelectric cooling elements, characterized in that: include: The self-collimating body includes: a laser source (1), a beam splitter (2), and a collimating objective lens (3) arranged sequentially inside the device housing (5), and a CCD sensor (4) is correspondingly arranged below the beam splitter (2). The self-collimating body is equipped with a temperature sensor and a thermoelectric cooling element of the corresponding element group on its components; The temperature sensors of the global group and the thermoelectric coolers of the high-power group are arranged inside the device housing (5); the temperature sensors of the global group, the thermoelectric coolers of the high-power group, the temperature sensors of the component group, and the thermoelectric coolers of the component group are all connected to the microprocessor (10) through the circuit group.

2. The temperature control self-collimation device based on macro-micro combination of multi-stage thermoelectric cooling elements according to claim 1, characterized in that: The global temperature sensor group includes: a first global temperature sensor (101), a second global temperature sensor (102), a third global temperature sensor (103), and a fourth global temperature sensor (104), which are evenly arranged inside the device housing (5); The circuit group includes a global temperature acquisition circuit (11). The signals collected by the first global temperature sensor (101), the second global temperature sensor (102), the third global temperature sensor (103), and the fourth global temperature sensor (104) are transmitted to the microprocessor (10) through the global temperature acquisition circuit (11).

3. The temperature control self-collimation device based on macro-micro combination of multi-stage thermoelectric cooling elements according to claim 2, characterized in that: The temperature sensor in the component group includes: The laser source (1) has a first element temperature sensor (201) and a second element temperature sensor (202) on both sides; the beam splitter (2) has a third element temperature sensor (203) and a fourth element temperature sensor (204) on both sides; the collimating objective lens (3) has a fifth element temperature sensor (205) and a sixth element temperature sensor (206) on both sides; and the CCD sensor (4) has a seventh element temperature sensor (207) and an eighth element temperature sensor (208) on both sides. The circuit group includes component temperature sampling circuits, which include: a first component temperature sampling circuit (21), a second component temperature sampling circuit (22), a third component temperature sampling circuit (23), and a fourth component temperature sampling circuit (24); a first component temperature sensor (201) and a second component temperature sensor (202) are connected to the first component temperature sampling circuit (21), a third component temperature sensor (203) and a fourth component temperature sensor (204) are connected to the second component temperature sampling circuit (22), a fifth component temperature sensor (205) and a sixth component temperature sensor (206) are connected to the third component temperature sampling circuit (23), and a seventh component temperature sensor (207) and an eighth component temperature sensor (208) are connected to the fourth component temperature sampling circuit (24).

4. The temperature control self-collimation device based on macro-micro combination of multi-stage thermoelectric cooling elements according to claim 3, characterized in that: The high-power thermoelectric cooling elements include: a first high-power thermoelectric cooling element (301) and a second high-power thermoelectric cooling element (302) located on the left and right sides of the CCD sensor (4); The circuit group includes a high-power drive circuit (31), and a first high-power thermoelectric cooler (301) and a second high-power thermoelectric cooler (302) are connected to the microprocessor (10) through the high-power drive circuit (31).

5. The temperature control self-collimation device based on macro-micro combination of multi-stage thermoelectric cooling elements according to claim 4, characterized in that: The thermoelectric cooling element group includes: a first thermoelectric cooling element (401) mounted on a laser light source (1), a second thermoelectric cooling element (402) mounted on a beam splitter (2), a third thermoelectric cooling element (403) mounted on a collimating objective lens (3), and a fourth thermoelectric cooling element (404) mounted on a CCD sensor (4). The circuit group includes a high-precision drive circuit, which includes: a first element thermoelectric cooler (401) connected to a first high-precision drive circuit (41), a second element thermoelectric cooler (402) connected to a second high-precision drive circuit (42), a third element thermoelectric cooler (403) connected to a third high-precision drive circuit (43), and a fourth element thermoelectric cooler (404) connected to a fourth high-precision drive circuit (44).

6. A temperature control self-collimation method based on macro-micro combination of multi-stage thermoelectric cooling elements, characterized in that: The temperature control self-collimation device based on macro-micro combination of multi-stage thermoelectric cooling chips as described in any one of claims 1-5 includes: segmented control, coordinated control, synchronous control, and independent control.

7. The temperature control self-collimation method based on macro-micro combination of multi-stage thermoelectric cooling elements according to claim 6, characterized in that: The specific steps for using segmented control are as follows: Step a: The microprocessor (10) sets the preset control temperature value T0 and the segmented control mode; Step b: The first global temperature sensor (101), the second global temperature sensor (102), the third global temperature sensor (103), and the fourth global temperature sensor (104) perform temperature measurement; Step c: The microprocessor (10) obtains temperature measurement values ​​T1, T2, T3, and T4 through the global temperature acquisition circuit 11; Step d: Calculate the internal temperature value of the autocollimator, Tn = (T1 + T2 + T3 + T4) / 4; Step e: Compare the internal temperature value Tn obtained in step d with the preset control temperature value T0 set in step a, calculate the absolute value of the temperature difference |T0-Tn|, and determine whether the absolute value of the temperature difference is less than 1. If it is true, switch the control mode and proceed to step g; otherwise, continue the current control mode and proceed to step f. Step f: Compare Tn with T0 to determine whether Tn > T0 is true. If it is true, the microprocessor (10) controls the first high-power thermoelectric cooler (301) and the second high-power thermoelectric cooler (302) to cool through the high-power drive circuit (31). Otherwise, the microprocessor (10) controls the first high-power thermoelectric cooler (301) and the second high-power thermoelectric cooler (302) to heat through the high-power drive circuit (31). Step g: Turn off the high-power thermoelectric cooler and only drive the element thermoelectric cooler for element temperature control; Step h: Repeat step g to complete the internal temperature control of the autocollimator.

8. The temperature control self-collimation method based on macro-micro combination of multi-stage thermoelectric cooling chips according to claim 6, characterized in that: The specific steps for using collaborative control are as follows: Step a: The microprocessor (10) sets the preset control temperature value T0 and the cooperative control mode; Step b: The first global temperature sensor (101), the second global temperature sensor (102), the third global temperature sensor (103), and the fourth global temperature sensor (104) perform temperature measurement; Step c: The microprocessor (10) obtains temperature measurement values ​​T1, T2, T3, and T4 through the global temperature acquisition circuit 11; Step d: Calculate the internal temperature value of the autocollimator, Tn = (T1 + T2 + T3 + T4) / 4; Step e: Compare the internal temperature value Tn obtained in step d with the preset control temperature value T0 set in step a, calculate the absolute value of the temperature difference |T0-Tn|, and determine whether the absolute value of the temperature difference is less than 1. If it is true, switch the control mode and proceed to step g; otherwise, continue the current control mode and proceed to step f. Step f: Compare Tn with T0 to determine whether Tn > T0 is true. If so, the microprocessor (10) controls the first high-power thermoelectric cooler (301) and the second high-power thermoelectric cooler (302) through the high-power drive circuit (31), and the first high-precision drive circuit (41), the second high-precision drive circuit (42), the third high-precision drive circuit (43), and the fourth high-precision drive circuit (44) control the first element thermoelectric cooler (401), the second element thermoelectric cooler (402), the third element thermoelectric cooler (403), and the fourth element thermoelectric cooler (404) through the high-power drive circuit (31). The thermoelectric cooling element (404) performs cooling; otherwise, the microprocessor (10) controls the first high-power thermoelectric cooling element (301) and the second high-power thermoelectric cooling element (302) through the high-power drive circuit (31), and the first high-precision drive circuit (41), the second high-precision drive circuit (42), the third high-precision drive circuit (43), and the fourth high-precision drive circuit (44) control the first element thermoelectric cooling element (401), the second element thermoelectric cooling element (402), the third element thermoelectric cooling element (403), and the fourth element thermoelectric cooling element (404) to perform heating. Step g: Turn off the high-power thermoelectric cooler, leaving only the element thermoelectric cooler for element temperature control; Step h: Repeat step g to complete the temperature control of the self-collimation device.

9. The temperature control self-collimation method based on macro-micro combination of multi-stage thermoelectric cooling elements according to claim 6, characterized in that: The specific steps for using synchronous control are as follows: Step a: The microprocessor (10) sets the preset control temperature value T0 and the synchronous control mode; Step b: Perform global temperature control; Step c: Repeat step c until the global temperature control meets the requirements, then proceed to step d; Step d: Temperature is measured by the first element temperature sensor (201), the second element temperature sensor (202), the third element temperature sensor (203), the fourth element temperature sensor (204), the fifth element temperature sensor (205), the sixth element temperature sensor (206), the seventh element temperature sensor (207), and the eighth element temperature sensor (208); Step e: The microprocessor (10) obtains temperature measurement values ​​T5, T6, T7, T8, T9, T10, T11, and T12 through the first element temperature sampling circuit (21), the second element temperature sampling circuit (22), the third element temperature sampling circuit (23), and the fourth element temperature sampling circuit (24); Step f: Calculate the temperature value of the autocollimator element Tr=(T5+T6+T7+T8+T9+T10+T11+T12) / 8; Step g: Compare the element temperature value Tr obtained in step d with the preset control temperature value T0 set in step a, calculate the absolute value of the temperature difference |T0-Tr|, and determine whether the absolute value of the temperature difference is greater than 0.

1. If yes, proceed to step f; otherwise, turn off the element thermoelectric cooling chip. In step f, Tr is compared with T0 to determine whether Tr > T0 is true. If it is true, the microprocessor (10) controls the first element thermoelectric cooler (401), the second element thermoelectric cooler (402), the third element thermoelectric cooler (403), and the fourth element thermoelectric cooler (404) to perform cooling through the first high-precision drive circuit (41), the second high-precision drive circuit (42), the third high-precision drive circuit (43), and the fourth high-precision drive circuit (44). Otherwise, the microprocessor (10) controls the first element thermoelectric cooler (401), the second element thermoelectric cooler (402), the third element thermoelectric cooler (403), and the fourth element thermoelectric cooler (404) to perform heating through the first high-precision drive circuit (41), the second high-precision drive circuit (42), the third high-precision drive circuit (43), and the fourth high-precision drive circuit (44). In step g, steps d through f are repeated to complete the temperature control of the self-collimation device.

10. The temperature control self-collimation method based on macro-micro combination of multi-stage thermoelectric cooling elements according to claim 6, characterized in that: The specific steps when using independent control are as follows: Step a: The microprocessor (10) sets the preset control temperature value T0 and the independent control mode; Step b: Perform global temperature control; Step c: Repeat step c until the global temperature control meets the requirements, then proceed to step d; Step d: Temperature measurement is performed by the first element temperature sensor (201), the second element temperature sensor (202), the third element temperature sensor (203), the fourth element temperature sensor (204), the fifth element temperature sensor (205), the sixth element temperature sensor (206), the seventh element temperature sensor (207), and the eighth element temperature sensor (208); Step e: The microprocessor (10) obtains temperature measurement values ​​T5, T6, T7, T8, T9, T10, T11, and T12 through the first element temperature sampling circuit (21), the second element temperature sampling circuit (22), the third element temperature sampling circuit (23), and the fourth element temperature sampling circuit (24); Step f: Calculate the temperature values ​​of laser source 1 (Tr1=(T5+T6) / 2), beam splitter prism 2 (Tr2=(T7+T8) / 2), collimating objective lens 3 (Tr3=(T9+T10) / 2), and CCD sensor 4 (Tr4=(T11+T12) / 2). Step g: Compare the component temperature values ​​Tr1, Tr2, Tr3 and Tr4 obtained in step d with the preset control temperature value T0 set in step a, calculate the absolute values ​​of the temperature differences |T0-Tr1|, |T0-Tr2|, |T0-Tr3| and |T0-Tr4| respectively, and determine whether the absolute value of the temperature difference is greater than 0.

1. If yes, proceed to step f; otherwise, turn off the component thermoelectric cooling chip. In step f, Tr1 is compared with T0 to determine whether Tr1 > T0 is true. If it is true, the microprocessor (10) controls the first element thermoelectric cooler (401) to cool through the first high-precision drive circuit (41). Otherwise, the microprocessor (10) controls the first element thermoelectric cooler (401) to heat through the first high-precision drive circuit (41). Compare Tr2 with T0 to determine whether Tr2 > T0 is true. If it is true, the microprocessor (10) controls the second element thermoelectric cooler (402) to cool through the second high-precision drive circuit (42). Otherwise, the microprocessor (10) controls the second element thermoelectric cooler (402) to heat through the second high-precision drive circuit (42). Compare Tr3 with T0 to determine whether Tr3 > T0 is true. If it is true, the microprocessor (10) controls the third element thermoelectric cooler (403) to cool through the third high-precision drive circuit (43). Otherwise, the microprocessor (10) controls the third element thermoelectric cooler (403) to heat through the third high-precision drive circuit (43). Compare Tr4 with T0 to determine whether Tr4 > T0 is true. If it is true, the microprocessor (10) controls the fourth element thermoelectric cooler (404) to cool through the fourth high-precision drive circuit (44). Otherwise, the microprocessor (10) controls the fourth element thermoelectric cooler (404) to heat through the fourth high-precision drive circuit (44). In step g, steps d through f are repeated to complete the temperature control of the self-collimation device.

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