Composition for surface treatment, method for producing surface-treated base material, and selective modification method
A surface treatment composition with specific functional groups and heat-activated compounds addresses the challenge of protecting and repairing oxidized substrate regions in semiconductor manufacturing by ensuring high selectivity and adhesion, enhancing process stability and yield.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- JSR CORPORATION
- Filing Date
- 2025-12-09
- Publication Date
- 2026-06-18
AI Technical Summary
In semiconductor manufacturing, the sidewalls and bottom surfaces of vias and trenches in interlayer insulating films oxidize during processing, making them difficult to protect or repair, which affects product quality and yield. Existing technologies struggle to provide selective protection or repair while ensuring excellent adhesion to subsequent layers and maintaining storage stability of the surface treatment composition.
A surface treatment composition comprising a compound with specific functional groups and a solvent, along with a compound that generates an acid or base upon heat, is used to selectively modify the substrate surface, forming a film with excellent adhesion and stability, allowing for selective protection or repair of substrate regions.
The composition achieves high selectivity and stability in modifying substrate surfaces, ensuring excellent adhesion to subsequent layers and improving the protection or repair of sensitive areas in semiconductor manufacturing processes.
Smart Images
Figure JP2025042958_18062026_PF_FP_ABST