Camera device and optical device comprising same

Abstract

An embodiment comprises: a lens driving device comprising a first circuit board comprising a first terminal, a base disposed on the first circuit board, and a second circuit board coupled to the base and comprising a second terminal; and a conductive adhesive for coupling the first terminal and the second terminal, wherein the second circuit board comprises a body disposed on the upper surface of the base, and a terminal part comprising a first portion bent from the body and disposed on the outer surface of the base and a second portion bent from the first portion and disposed below the lower surface of the base, and the second terminal comprises a first region disposed on the first portion of the terminal part and a second region disposed on the second portion of the terminal part.

Description

Camera device and optical device including the same

[0001] The embodiment relates to a camera device and an optical device including the same.

[0002] Since it is difficult to apply the voice coil motor (VCM) technology used in conventional camera modules to ultra-compact, low-power camera modules, research in this regard has been actively conducted.

[0003] The demand for and production of electronic products, such as smartphones and mobile phones equipped with cameras, are increasing. Mobile phone cameras are trending toward higher pixel counts and miniaturization, and accordingly, actuators are also becoming smaller, larger in diameter, and multi-functional. To implement high-pixel mobile phone cameras, improvements in camera performance and additional features such as autofocus, shutter shake reduction, and zoom capabilities are required.

[0004] The embodiment provides a camera device and an optical instrument that can reduce the size in a direction perpendicular to the optical axis and prevent cracking of the conductive adhesive connecting the terminal of the lens driving device and the terminal of the circuit board on which the image sensor is placed.

[0005] In addition, the embodiment provides a camera device and an optical device that can reduce the size of the camera device in a direction perpendicular to the optical axis and facilitate electrical connection between the circuit board of the lens driving device and the circuit board on which the image sensor is placed.

[0006] In addition, the embodiment provides a camera device and an optical device that can reduce the size and increase the reliability of the electrical connection between the terminals of the circuit board of the lens driving device and the terminals of the circuit board for mounting the image sensor.

[0007] A camera device according to an embodiment comprises: a first circuit board including a first terminal; a base disposed on the first circuit board; and a lens driving device including a second circuit board coupled to the base and including a second terminal; and a conductive adhesive for coupling the first terminal and the second terminal, wherein the second circuit board includes a body disposed on the upper surface of the base; and a terminal portion including a first portion folded from the body and disposed on the outer surface of the base, and a second portion folded from the first portion and disposed below the lower surface of the base, wherein the second terminal includes a first region disposed on the first portion of the terminal portion and a second region disposed on the second portion of the terminal portion.

[0008] A camera device according to another embodiment comprises: a first circuit board including a first terminal; a base disposed on the first circuit board; a body disposed on the base; a terminal portion folded from the body and disposed on the outer surface of the base; and a second circuit board including a second terminal disposed on the terminal portion; and a conductive adhesive that joins the first terminal and the second terminal, wherein the second circuit board includes a hole that penetrates the terminal portion and is connected to the second terminal, the conductive adhesive is disposed between the first terminal and the second terminal, and a portion of the conductive adhesive is disposed within the hole of the terminal portion.

[0009] A camera device according to another embodiment comprises: a first circuit board including a first terminal; a base disposed on the first circuit board; a body disposed on the base; a terminal portion folded from the body and disposed on the outer surface of the base; and a second circuit board including a second terminal disposed on the terminal portion; and a conductive adhesive disposed between the first terminal and the second terminal and joining the first terminal and the second terminal, wherein the first terminal is disposed on the side of the first circuit board and the second terminal is disposed on the first surface of the terminal portion facing the side of the first circuit board, and the first terminal of the first circuit board is located inside the second terminal of the second circuit board.

[0010] The embodiment can reduce the size in a direction perpendicular to the optical axis and prevent cracking of the conductive adhesive connecting the terminal of the lens driving device and the terminal of the circuit board on which the image sensor is placed.

[0011] The embodiment can improve the solderability of the conductive adhesive that combines the terminal of the lens driving device and the terminal of the circuit board on which the image sensor is placed, and can increase the bonding strength between the two.

[0012] In addition, in the embodiment, the outermost side of the circuit board can be designed so that it does not protrude outward from the side plate relative to the outer surface of the side plate of the cover member, and the size in the direction perpendicular to the optical axis direction of the camera device can be reduced.

[0013] In addition, in the embodiment, by injecting a conductive adhesive through a hole pad penetrating the terminal portion, electrical connection between a terminal formed on the rear surface of the terminal portion of the circuit board and a terminal positioned on the side of the circuit board can be facilitated.

[0014] In the embodiment, a conductive adhesive is filled in the space between the terminal of the circuit board of the lens driving device and the terminal of the circuit board to which the image sensor is electrically connected, thereby blocking the path for foreign substances to penetrate and preventing foreign substances from penetrating into the interior of the camera device.

[0015] In addition, in the embodiments, the solderability of the conductive adhesive can be improved, and the reliability of the electrical connection can be increased.

[0016] In addition, in the embodiment, the bonding strength of the conductive adhesive between the terminal of the terminal portion of the circuit board of the lens driving device and the terminal of the circuit board for mounting the image sensor can be increased, and thereby, reliability against impact can be improved.

[0017] FIG. 1 shows a camera device according to an embodiment.

[0018] Figure 2 is an exploded perspective view of the image sensor unit of Figure 1.

[0019] Figure 3 is an exploded perspective view of the lens driving device of Figure 1.

[0020] FIG. 4 is a perspective view of a lens driving device excluding the cover member.

[0021] FIG. 5a is a perspective view of a bobbin, an energizing member, and a coil.

[0022] FIG. 5b is a perspective view of a bobbin, a coil, and a sensing magnet.

[0023] FIG. 6a is a perspective view of a housing, yoke, magnet, circuit board, position sensor, and capacitor.

[0024] FIG. 6b is a combined perspective view of a housing, a support plate, a magnet, a circuit board, a position sensor, and a capacitor.

[0025] FIG. 7 is an exploded perspective view of a circuit board, a coil, and a base assembly.

[0026] FIG. 8 is a first perspective view of a coil, a circuit board, and a base assembly.

[0027] FIG. 9 is a second perspective view of a coil, a circuit board, and a base assembly.

[0028] FIG. 10 is a combined perspective view of a coil, a circuit board, and a base assembly.

[0029] Figure 11 is a plan view of the upper elastic member.

[0030] Figure 12 is a plan view of the lower elastic member.

[0031] Figure 13 shows the electrical connection of the circuit board, upper elastic member, coil, lower elastic member, and support member.

[0032] FIG. 14a is a cross-sectional view of the camera device in the AB direction of FIG. 1.

[0033] FIG. 14b is a cross-sectional view of the camera device in the CD direction of FIG. 1.

[0034] FIG. 14c is a cross-sectional view of the camera device in the EF direction of FIG. 1.

[0035] FIG. 15 is an enlarged view of a part of a cover member, a terminal portion of a circuit board, terminals of a circuit board, and a reinforcing member.

[0036] FIG. 16 shows a conductive adhesive that bonds the terminals of the circuit boards of FIG. 15.

[0037] Figure 17 is a partial enlarged view of Figure 14a.

[0038] FIG. 18 shows a camera device according to another embodiment.

[0039] FIG. 19 is an exploded perspective view of the image sensor part of FIG. 18.

[0040] FIG. 20 is an exploded perspective view of the lens driving device of FIG. 19.

[0041] FIG. 21 is a perspective view of the lens driving device of FIG. 19 excluding the cover member.

[0042] FIG. 22 is an exploded perspective view of the circuit board, coil, and base assembly of FIG. 20.

[0043] FIG. 23 is a first perspective view of the coil, circuit board, and base assembly of FIG. 20.

[0044] FIG. 24 is a second perspective view of the coil, circuit board, and base assembly of FIG. 20.

[0045] FIG. 25 is a combined perspective view of the coil, circuit board, and base assembly of FIG. 20.

[0046] FIG. 26 shows the electrical connection of the circuit board, upper elastic member, coil, lower elastic member, and support member of FIG. 20.

[0047] FIG. 27a is a cross-sectional view of the camera device in the AB direction of FIG. 18.

[0048] FIG. 27b is a cross-sectional view of the camera device in the CD direction of FIG. 18.

[0049] FIG. 27c is a cross-sectional view of the camera device in the EF direction of FIG. 18.

[0050] FIG. 28 is a partial enlarged view of the cover member, the terminal portion of the circuit board, the circuit board, and the reinforcing member of FIG. 20.

[0051] FIG. 29 shows the rear side of the terminal portion of the base and circuit board of FIG. 28.

[0052] FIG. 30 shows the cover member, terminals of the circuit board, and reinforcing member of FIG. 28.

[0053] FIG. 31 shows a conductive adhesive that combines the terminal of the terminal portion of FIG. 28 with the terminal of the circuit board.

[0054] Fig. 32 is a partial enlarged view of Fig. 27a.

[0055] FIG. 33 shows a camera device according to another embodiment.

[0056] FIG. 34 is an exploded perspective view of the image sensor part of FIG. 33.

[0057] FIG. 35 is an exploded perspective view of the lens driving device of FIG. 33.

[0058] FIG. 36 is a perspective view of the lens driving device of FIG. 33 excluding the cover member.

[0059] FIG. 37 is an exploded perspective view of the circuit board, coil, and base assembly of FIG. 35.

[0060] FIG. 38 is a first perspective view of the coil, circuit board, and base assembly of FIG. 35.

[0061] FIG. 39 is a second perspective view of the coil, circuit board, and base assembly of FIG. 35.

[0062] FIG. 40 is a combined perspective view of the coil, circuit board, and base assembly of FIG. 35.

[0063] FIG. 41 shows the electrical connection of the circuit board, upper elastic member, coil, lower elastic member, and support member of FIG. 35.

[0064] FIG. 42a is a cross-sectional view of the camera device in the AB direction of FIG. 33.

[0065] FIG. 42b is a cross-sectional view of the camera device in the CD direction of FIG. 33.

[0066] FIG. 42c is a cross-sectional view of the camera device in the EF direction of FIG. 33.

[0067] FIG. 43 is an enlarged view of a part of the cover member, the terminal portion of the circuit board, the circuit board, and the reinforcing member.

[0068] FIG. 44a is a bottom view of a reinforcing member, a terminal portion of a circuit board, a circuit board, and a conductive adhesive.

[0069] Fig. 44b is a partial enlarged view of Fig. 44a.

[0070] FIG. 45 shows the cover member, terminals of the circuit board, and reinforcing member of FIG. 43.

[0071] Figure 46 shows the rear side of the terminal portion of the circuit board of Figure 43.

[0072] Fig. 47 is a partial enlarged view of Fig. 42a.

[0073] FIG. 48a shows a terminal portion of the circuit board of FIG. 47 and a stacked cross-sectional view according to one embodiment of the circuit board.

[0074] FIG. 48b shows a stacked cross-sectional view according to another embodiment of the terminal portion of the circuit board and the terminal of the circuit board of FIG. 47.

[0075] FIG. 48c shows a stacked cross-sectional view according to another embodiment of the terminal portion of the circuit board and the terminal of the circuit board of FIG. 47.

[0076] FIG. 48d shows a stacked cross-sectional view according to another embodiment of the terminal portion of the circuit board and the terminal of the circuit board of FIG. 47.

[0077] FIG. 49 shows a perspective view of an optical device according to an embodiment.

[0078] Figure 50 shows a configuration diagram of the optical device illustrated in Figure 49.

[0079] The embodiments will become apparent below through the attached drawings and the description of the embodiments. In the description of the embodiments, where each layer (film), region, pattern, or structure is described as being formed "on" or "under" of the substrate, each layer (film), region, pad, or pattern, "on" and "under" include both being formed "directly" and "indirectly" through another layer. Furthermore, the reference for the "on" or "under" of each layer is described based on the drawings.

[0080] In the drawings, dimensions are exaggerated, omitted, or schematically depicted for convenience and clarity of explanation. Additionally, the dimensions of each component do not fully reflect their actual dimensions. Furthermore, the same reference numerals indicate the same element throughout the description of the drawings.

[0081] Hereinafter, a camera device according to an embodiment will be described as follows with reference to the attached drawings. For convenience of explanation, the camera device according to the embodiment is described using a Cartesian coordinate system (x, y, z), but may be described using other coordinate systems, and the embodiment is not limited thereto. In each drawing, the x-axis and y-axis represent directions perpendicular to the z-axis, which is the optical axis direction. The z-axis direction, which is the optical axis direction, may be expressed as any one of the 'first direction', 'second direction', and 'third direction', the x-axis direction may be expressed as another of the 'first direction', 'second direction', and 'third direction', and the y-axis direction may be expressed as the remaining other of the 'first direction', 'second direction', and 'third direction'.

[0082] Additionally, the X-axis can be expressed as either the "first horizontal axis" or the "second horizontal axis," and the X-axis direction can be expressed as either the "first horizontal direction" or the "second horizontal direction." The Y-axis can be expressed as the other of the "first horizontal axis" and the "second horizontal axis," and the Y-axis direction can be expressed as the other of the "first horizontal direction" and the "second horizontal direction."

[0083] In addition, the optical axis may be the optical axis of the lens. Or, for example, the optical axis may be an axis perpendicular to the imaging area (or sensor surface) of the image sensor and passing through the center of the imaging area (sensor surface). The direction of the optical axis may be the direction of the optical axis or a direction parallel to the optical axis. In addition, the expression "terminal" below may be replaced with a pad, electrode, or conductive layer. In addition, the expression "aperture" below may be replaced with "hollow" or "hole."

[0084] The camera device below may be replaced with a lens drive unit, VCM (Voice Coil Motor), actuator, lens moving device, "camera," "actuator," "camera module," "imaging device," or "photographer," and the term "coil" below may be replaced with a coil unit, and the term "elastic member" may be replaced with an elastic unit or a spring.

[0085] A camera device according to an embodiment can perform an 'auto-focusing function'. Here, the auto-focusing function refers to automatically focusing an image of a subject onto the image sensor surface. In addition, a camera device according to an embodiment can perform a 'shake correction function'. Here, the shake correction function refers to preventing the outline of a captured image from being formed clearly due to vibrations caused by the user's hand shake when capturing a still image.

[0086] FIG. 1 shows a camera device (200) according to an embodiment, FIG. 2 is an exploded perspective view of an image sensor unit (310) of FIG. 1, FIG. 3 is an exploded perspective view of a lens driving device (100) of FIG. 1, FIG. 4 is a perspective view of a lens driving device (100) excluding a cover member (300), FIG. 5a is a perspective view of a bobbin (110), a conductive member (20), and a coil (120), FIG. 5b is a perspective view of a bobbin (110), a coil (120), and a sensing magnet (180), FIG. 6a is a perspective view of a housing (140), a yoke (30), a magnet (130), a circuit board (190), a position sensor (170), and a capacitor (195), FIG. 6b is a perspective view of a housing (140), a support plate (11), a magnet (130), a circuit board (190), and a position FIG. 7 is a combined perspective view of a sensor (170) and a capacitor (195), FIG. 7 is a separated perspective view of a circuit board (250), a coil (230), and a base assembly (400), FIG. 8 is a first perspective view of a coil (230), a circuit board (250), and a base assembly (400), FIG. 9 is a second perspective view of a coil (230), a circuit board (250), and a base assembly (400), FIG. 10 is a combined perspective view of a coil (230), a circuit board (250), and a base assembly (400), FIG. 11 is a plan view of an upper elastic member (150), FIG. 12 is a plan view of a lower elastic member (160), FIG. 13 shows the electrical connection of a circuit board (190), an upper elastic member (150), a coil (120), a lower elastic member (160), and a support member (220), FIG. 14a is FIG. FIG. 1 is a cross-sectional view of the camera device (200) in the AB direction of FIG. 1, FIG. 14b is a cross-sectional view of the camera device (200) in the CD direction of FIG. 1, and FIG. 14c is a cross-sectional view of the camera device (200) in the EF direction of FIG. 1.

[0087] Referring to FIGS. 1 to 14c, the camera device (200) may include an image sensor unit (310) including an image sensor (810) and a lens driving device (100) disposed on the image sensor unit (310).

[0088] The lens driving device (100) may be expressed as a "Voice Coil Motor (VCM)," "Lens Driving Motor," "Lens Moving Device," "Actuator," "Auto Focus Actuator," "Image Stabilization Actuator," or "OIS Actuator." The lens driving device (100) may include an auto-focusing module for moving an AF moving part, such as a bobbin (110, or lens module), in the direction of the optical axis. The lens driving device (100) may include an OIS module for moving an OIS moving part, such as a housing (140), or a bobbin (or lens module), in a direction intersecting the direction of the optical axis or perpendicular to the direction of the optical axis.

[0089] The lens driving device (100) can be joined to the image sensor unit (310) by means of an adhesive (612). The lens driving device (100) can be joined to the circuit board (800) by means of an adhesive (612). The adhesive (612) can be placed between the upper surface of the lens driving device (100) and the circuit board (800).

[0090] The camera device (200) may further include a lens module (not shown) coupled to a lens driving device (100). The lens module may include a lens and / or a lens barrel. The lens module may be coupled to a bobbin (110) of the lens driving device (100). The lens module may include one or more lenses and a lens barrel that accommodates one or more lenses.

[0091] The image sensor unit (310) may include a circuit board (800), an image sensor (810) electrically connected to the circuit board (800), and a lens driving device (100) disposed on the circuit board (800) so as to face the image sensor (810).

[0092] The image sensor unit (310) may further include a filter (610) positioned between the image sensor (810) and the lens driving device (100) (e.g., a bobbin (110) or a lens barrel). The filter (610) may serve to block light of a specific frequency band from passing through the lens module from entering the image sensor (810). For example, the filter (610) may include an infrared filter.

[0093] The image sensor unit (310) may include a sensor base (600) for supporting a filter (610) and disposed on a circuit board (800). The sensor base (600) may be disposed between the lens driving device (100) and the circuit board (800). The sensor base (600) may be bonded to the upper surface of the circuit board (800) by an adhesive (620). The sensor base (600) may include an aperture (601) corresponding to at least one of the image sensor (810), the filter (610), or the lens module. The aperture (601) may penetrate the sensor base (600) in the direction of the optical axis. The aperture (601) may allow light passing through the lens module or the filter (610) to be incident on the image sensor (810). The sensor base (600) may include a mounting portion (500) for placing the filter (610). The mounting portion (500) may be in the form of a groove. The circuit board (800) may be a substrate, a printed circuit board, or a Flexible Printed Circuit Board (FPCB).

[0094] The image sensor unit (310) may include a control unit (830) disposed on a circuit board (800). The control unit (830) may be electrically connected to the circuit board (800). The control unit (830) may be in the form of a driver IC.

[0095] The image sensor unit (310) may further include a reinforcing member (280) that is coupled to the circuit board (800). The reinforcing member (280) may be placed under the circuit board (800). The reinforcing member (280) may be coupled to the lower surface of the circuit board (800). The upper surface of the reinforcing member (280) may be coupled to the lower surface of the circuit board (800) by means of an adhesive (281).

[0096] The circuit board (800) may include an opening (801) that corresponds to, opposes, or overlaps with the image sensor (810) in the direction of the optical axis. The opening (801) may be a through hole penetrating the circuit board (800) in the direction of the optical axis. The opening (801) may expose at least a portion of the reinforcing member (280), and the image sensor (810) may be placed on at least a portion of the reinforcing member (280) exposed by the opening (801). The image sensor (810) may be coupled with at least a portion of the reinforcing member (280) exposed by the opening (801). The image sensor (810) may be placed within the opening (801) of the circuit board (800). In another embodiment, the opening (801) may be omitted, and the image sensor (810) may be coupled with the upper surface of the circuit board (800).

[0097] The lens driving device (100) may include a fixed part and a movable OIS moving part. The OIS moving part may be movable in a direction intersecting the optical axis or perpendicular to the optical axis to perform OIS (Optical Image Stabilization). The lens driving device (100) may include a support member (220) that supports the OIS moving part with respect to the fixed part. The support member (220) may connect the fixed part and the OIS moving part.

[0098] The fixed part may be a fixed element. The fixed part may not move in a direction perpendicular to the optical axis direction during OIS operation. The fixed part may include a base (210). The fixed part may further include a configuration coupled to the base (210). The fixed part may include a base assembly (400). The base assembly (400) may include a base (210) and a configuration coupled to the base (210). The fixed part may include a circuit board (250) coupled to the base (210) and a coil (230) disposed on the circuit board (250). The coil (230) may be electrically connected to the circuit board (250) and may move the bobbin (110) in a direction perpendicular to the optical axis. Additionally, the fixed part may further include a position sensor (240) disposed on the circuit board (250).

[0099] The OIS moving part may include a housing (140). The OIS moving part may further include a configuration coupled to the housing (140). The OIS moving part may include a magnet (130) disposed in the housing (140). The OIS moving part may move by the interaction between the magnet (130) and the coil (230). The OIS moving part may further include a reinforcing member (30) coupled to the housing (140). The OIS moving part may include a circuit board (190) and a position sensor (170) disposed on the circuit board (190). The OIS moving part may further include a capacitor (195) disposed on the circuit board (190).

[0100] The lens driving device (100) may further include a ball member (12) positioned between the OIS moving part and the fixed part.

[0101] The OIS moving unit may include an AF moving unit. The AF moving unit may move in the direction of the optical axis for autofocus. The AF moving unit may include a bobbin (110). The AF moving unit may further include a configuration coupled with the bobbin (110). The AF moving unit may include a coil (120) disposed on the bobbin (110) and moving the bobbin (110) in the direction of the optical axis by interacting with magnet units (130A, 130B). The AF moving unit may include a sensing magnet (180). The AF moving unit may further include a conductive member (20).

[0102] The lens driving device (100) may include an "elastic member (150, 160)" that is coupled to the housing (140) and the bobbin (110) to support the AF moving part with respect to the housing (140). The elastic member (150, 160) can elastically support the bobbin (110) with respect to the housing (140) when the bobbin (110) moves in the direction of the optical axis.

[0103] The coil (120) can be represented as either of the "first and second coils," and the coil (230) can be represented as the other of the "first and second coils." The circuit board (250) can be represented as either of the "first and second circuit boards," and the circuit board (800) can be represented as the other of the "first and second circuit boards." The position sensor (170) can be represented as either of the "first and second position sensors," and the position sensor (240) can be represented as the other of the "first and second position sensors." The terminal (251) can be represented as either of the "first and second terminals," and the terminal (811) can be represented as the other of the "first and second terminals."

[0104] The bobbin (110) can be moved in the direction of the optical axis. The bobbin (110) can be placed inside the housing (140). The bobbin (110) can be placed within the cover member (300). The bobbin (110) can be moved in the direction of the optical axis (OA) or a first direction (e.g., the Z-axis direction) by electromagnetic interaction between the coil (120) and the magnet units (130A, 130B).

[0105] The bobbin (110) may include an opening (101) for mounting a lens or lens barrel. The opening (101) of the bobbin (110) may be a through hole penetrating the bobbin (110) in the optical axis direction. The opening (101) of the bobbin (110) may correspond to, oppose, or overlap with the opening (303) of the cover member (300) in the optical axis direction.

[0106] The bobbin (110) may include a plurality of sides. The bobbin (110) may include a coupling portion (121) for coupling with a coil (120). The coupling portion (121) may be in the form of a protrusion, but in other embodiments, it may be in the form of a groove. The coupling portion (121) may be disposed on each of the first and second sides of the bobbin (110) located opposite each other with respect to the optical axis.

[0107] The bobbin (110) may include a first coupling projection (111A) disposed on the upper surface of the bobbin (110) and coupled with a first inner frame (151) of an upper elastic member (150). The bobbin (110) may include a second coupling projection (111B) disposed on the lower surface of the bobbin (110) and coupled with a second inner frame (161) of a lower elastic member (160). A guide projection (122) for guiding a damper may be formed on the upper surface of the bobbin (110). The bobbin (110) may include a first stopper (112A) protruding from the upper surface of the bobbin (110). The bobbin (110) may include a second stopper (112B) protruding from the lower surface of the bobbin (110). The bobbin (110) may include a third stopper (112C) protruding from the outer side of the side of the bobbin (110).

[0108] The upper part of the bobbin (110) may protrude out of the opening (303) of the cover member (300). In another embodiment, the upper part of the bobbin (110) may not protrude out of the opening (303) of the cover member (300).

[0109] The coil (120) may be placed, coupled, or fixed to the bobbin (110). The coil (120) may be placed on or coupled to the outer surface of the bobbin (110). The coil (120) may be an AF drive coil for autofocusing. The coil (120) may include a first coil unit (120A) and a second coil unit (120B). The first coil unit (120A) may be placed on the first side of the bobbin (110), and the second coil unit (120B) may be placed on the first side of the bobbin (110).

[0110] The first coil unit (120A) may be a coil ring shape wound with respect to a first axis. The first axis may be perpendicular to the optical axis, pass through the optical axis, and be perpendicular to the first side of the bobbin (110). The first coil unit (120A) may be wound on the coupling portion (121) of the first side of the bobbin (110), and the second coil unit (120B) may be wound on the coupling portion (121) of the second side of the bobbin (110). The second coil unit (120B) may be a coil ring shape wound with respect to a second axis. The second axis may be perpendicular to the optical axis, pass through the optical axis, and be perpendicular to the second side of the bobbin (110). In another embodiment, the coil (120) may be a ring shape wound on the outer circumference of the bobbin (110) with respect to the optical axis.

[0111] The first coil unit (120A) and the second coil unit (120B) can be connected to each other. For example, one end of the first coil unit (120A) and one end of the second coil unit (120B) can be connected to each other.

[0112] The lens driving device (100) may include a conductive member (20) that is disposed on a bobbin (110) and electrically connects a first coil unit (120A) and a second coil unit (120B). The conductive member (20) may be coupled to the bobbin (110). At least a portion of the conductive member (20) may be inserted into the bobbin (110) or inserted into the bobbin (110). The conductive member (20) may include a first part (21) to which one end of a first coil unit (120A) is joined and which is positioned on the first side of the bobbin (110), a second part (22) to which one end of a second coil unit (120B) is joined and which is positioned on the second side of the bobbin (110), and a third part (23) connecting the first part (21) and the second part (22). One end of the first coil unit (120A) may be joined to the first part (21) of the conductive member (20) by solder (33A) (or conductive adhesive), and one end of the second coil unit (120B) may be joined to the second part (22) of the conductive member (20) by solder (33B) (or conductive adhesive). The third part (23) of the member (20) can be placed on the third side of the bobbin (110) located between the first side and the second side of the bobbin (110).

[0113] In another embodiment, the conductive member (20) may be omitted, and the first coil unit (120A) and the second coil unit (120B) may be electrically connected by an upper elastic member (150) or a lower elastic member (160). In yet another embodiment, the conductive member (20) may be omitted, and the first coil unit (120A) and the second coil unit (120) may be directly connected to each other.

[0114] The bobbin (110) may include a groove (125) for seating, inserting, fixing, or positioning a sensing magnet (180). The groove (125) may be recessed from the outer surface of the bobbin (110). The groove (125) may be positioned on the fourth side of the bobbin (110) located opposite the third side of the bobbin (110) with respect to the optical axis. The groove (125) may include at least one opening that is open to at least one of the upper or lower surface of the bobbin (110).

[0115] Power or a driving signal may be supplied to the coil (120). The power or driving signal supplied to the coil (120) may be a direct current signal or an alternating current signal, or may include both a direct current signal and an alternating current signal, and may be in the form of voltage or current. When a driving signal (e.g., driving current) is supplied to the coil (120), an electromagnetic force may be formed through electromagnetic interaction with the magnet units (130A, 130B), and the bobbin (110) may be moved in the direction of the optical axis (OA) by the electromagnetic force.

[0116] The sensing magnet (180) may be placed on the bobbin (110) or coupled with the bobbin (110). The sensing magnet (180) may provide a magnetic field for the position sensor (170) to detect. The sensing magnet (180) may be placed on the fourth side of the bobbin (110) to avoid spatial interference with the conductive member (20).

[0117] The lens driving device (100) may further include a balancing member (not shown) that is placed on or coupled to the bobbin (110). The balancing member may be for weight balancing with the sensing magnet (180). The balancing member may be referred to as a "weight balancing member" or a balancing magnet.

[0118] The housing (140) may be positioned on the inside of the cover member (300). The housing (140) may be positioned on the base (210) and may be spaced apart from the base (210). The housing (140) may accommodate a bobbin (110) on its inside. The housing (140) may support a magnet (130), a position sensor (170), and a circuit board (190).

[0119] The housing (140) may have a hollow column shape overall. For example, the housing (140) may include an opening (201) or a hollow. The opening (201) may be in the form of a through hole penetrating the housing (140) in the direction of the optical axis.

[0120] The housing (140) may include sides. The housing (140) may include a plurality of sides (41A to 41D). For example, the housing (140) may include first and second sides (41A, 41B) located opposite each other with respect to the optical axis, and a third side (41C) and a fourth side (41D) positioned between the first side (41A) and the second side (41B) and located opposite each other with respect to the optical axis.

[0121] The housing (140) may include a corner portion located between two adjacent sides. The cover member (300) may include side plates corresponding to the sides (41A to 41D) of the housing (140). The sides (41A to 41D) of the housing (140) may correspond to or opposite the sides of the bobbin (110).

[0122] The housing (140) may include a stopper (145) protruding from the upper surface of the housing (140). The housing (140) may include at least one stopper (146) protruding from at least one outer surface of at least one of the sides (41A to 41D) of the housing (140). The housing (140) may include a mounting groove (42) (or seating groove) for receiving a circuit board (190). The mounting groove (42) may be formed on any one (41D) of the sides (41A to 4D) of the housing (140) that corresponds to or opposes the fourth side of the bobbin (110). In another embodiment, the mounting groove (42) may be placed at a corner of the housing (140) depending on the placement position of the circuit board. The housing (140) may include a receiving groove (43) for receiving a magnet (130). The receiving groove (43) can be placed on the sides (41A to 41D) of the housing (140).

[0123] A relief portion (148) for avoiding spatial interference with a support member (220) may be formed at the corner portion of the housing (140). The housing (140) may include a first coupling projection (142) for coupling with a first outer frame (152) of an upper elastic member (150). The housing (140) may include a second coupling projection (143) for coupling with a second outer frame (162) of a lower elastic member (160).

[0124] The housing (140) may include a groove (48) for receiving at least a portion of the ball member (12). The groove (48) may be formed on the lower or bottom surface of the housing (140). The number of grooves (48) may correspond to or be equal to the number of ball members (12). For example, the housing (140) may include a plurality of grooves formed on the bottom surface of the housing (140) and spaced apart from each other.

[0125] The lens driving device (100) may be disposed in a housing (140) and may include a support plate (11) for supporting at least a portion of a ball member (12). The support plate (11) may be coupled to the housing (140). The support plate (11) may be inserted into the housing (140). The support plate (11) may be formed of metal. At least a portion of the support plate (11) may be exposed from the housing (140). The support plate (11) may include a portion exposed to a groove (48) of the housing (140). For example, the bottom of the groove (48) of the housing (140) may be the exposed portion of the support plate (11). The exposed portion of the support plate (11) may come into contact with at least a portion of the ball member (12). The support plate (11) may prevent the occurrence of dents or presses on the housing (140) by the ball member (11). The support plate (11) can be replaced with an "insert member."

[0126] The magnet (130) may be placed in the housing (140) or coupled to the housing (140). The magnet (130) may include a first magnet unit (130A) corresponding to or opposite to the first coil unit (120A) and a second magnet unit (130B) corresponding to or opposite to the second coil unit (120B). The first magnet unit (130A) may be placed on the first side (41A) of the housing (140), and the second magnet unit (130B) may be placed on the second side (41B) of the housing (140).

[0127] The lens driving device (100) includes two coil units (120A, 120B) and two magnet units (130A, 130B) for AF driving, but in other embodiments, the AF coil unit may be one or three or more, and the AF magnet unit may be one or three or more.

[0128] The magnet (130) may include a third magnet unit (130C) disposed on the third side of the housing (140). In the embodiment of FIG. 6, a driving magnet is not disposed on the fourth side of the housing (140) to avoid magnetic field interference with the magnet of an adjacent camera device, but in other embodiments, the magnet may include a magnet unit disposed on the fourth side of the housing (140). In yet another embodiment, a "balancing member" or "weight balancing member" may be disposed on the fourth side of the housing (140) to balance the weight with the third magnet unit (130C). In other embodiments, the magnet units may be disposed on the corner portion of the housing (140).

[0129] The OIS moving part may include a reinforcing member (30) disposed in the housing (140). The reinforcing member (30) may be coupled to the housing (140). The reinforcing member (30) may be formed of metal. The reinforcing member (30) may be inserted into the housing (140). At least a portion of the reinforcing member (30) may be exposed from the housing (140). The reinforcing member (30) may be disposed or coupled to at least one of the first to fourth sides (41A to 41D) of the housing (140). The reinforcing member (40) may include a top plate (30A) disposed on the magnet units (130A to 130C). Additionally, the reinforcing member (40) may include a side plate (30B) disposed on the outer surface of the magnet units (130A to 130C). The top plate (30A) and the side plate (30B) may be connected to each other. The reinforcing member (30) can serve to reinforce the strength of the housing (140). Additionally, the reinforcing member (30) can reduce the leakage magnetic flux of the magnet units (130A to 130C) and thereby serve as a yoke that increases the AF driving force or / and OIS driving force. In other embodiments, the reinforcing member (30) may be replaced with "yoke".

[0130] A circuit board (190) may be placed in a housing (140). A circuit board (190) may be coupled to a housing (140). A circuit board (190) may be placed on or coupled to a fourth side (41D) of a housing (140). A position sensor (170) may be placed in a housing (140).

[0131] The position sensor (170) may be placed on the circuit board (190) or mounted on the circuit board (190). For example, the position sensor (170) may be electrically connected to the circuit board (190) by means of a conductive adhesive or solder. In another embodiment, the circuit board (190) may be placed at a corner of the housing (140), the position sensor (170) may be placed at a corner of the housing (140), and the sensing magnet (180) may be located on either side of the bobbin (110) corresponding to or opposite the position sensor (170).

[0132] Referring to FIG. 13, the circuit board (190) may include a plurality of terminals (B1 to B6). The terminals (B1 to B6) of the circuit board (190) may be electrically connected to a position sensor (170). The position sensor (170) may be placed on a first surface of the circuit board (190), and the terminals (B1 to B6) may be placed on a second surface of the circuit board (190) which is opposite to the first surface of the circuit board (190). The first surface of the circuit board (190) may be any one surface of the circuit board (190) facing the bobbin (110). The second surface of the circuit board (190) may be a surface facing the side plate (302) of the cover member (300).

[0133] The first to fourth terminals (B1 to B4) may be located closer to the top of the circuit board (190) than to the bottom. The fifth and sixth terminals (B5, B6) may be located closer to the bottom of the circuit board (190) than to the top. For example, the circuit board (190) may be a printed circuit board or an FPCB. The circuit board (190) may include a circuit pattern or wiring (not shown) for electrically connecting the first to sixth terminals (B1 to B6) and the position sensor (170).

[0134] The position sensor (170) can detect displacement or position of the bobbin (110) in the direction of the optical axis. The sensing magnet (180) can move together with the bobbin (110), and the position sensor (170) can detect the strength of the magnetic field of the sensing magnet (180) and output an output signal. The position sensor (170) may be an integrated circuit (IC) including a Hall sensor. The position sensor (170) can output a driving signal to drive the coil (120).

[0135] For example, the position sensor (170) can receive a clock signal, a data signal, and a power signal from the control unit (830, 780) by using data communication using a protocol, such as I2C communication. The position sensor (170) may include first and second terminals for receiving a power signal, a third terminal for transmitting and receiving a clock signal, a fourth terminal for transmitting and receiving a data signal, and fifth and sixth terminals for supplying a driving signal to the coil (120).

[0136] Each of the first to fourth terminals of the position sensor (170) may be electrically connected to any one of the first to fourth terminals (B1 to B4) of the circuit board (190). Each of the fifth and sixth terminals of the position sensor (170) may be electrically connected to any one of the fifth and sixth terminals (B5, B6) of the circuit board (190). In another embodiment, the position sensor (170) may be implemented as a position detection sensor alone, such as a Hall sensor.

[0137] A capacitor (195) may be placed on a circuit board (190), and the capacitor (195) may be electrically connected to the circuit board (190). The capacitor (195) may be in the form of a chip. The capacitor (195) may be referred to as a "capacitive element" or a condenser. The capacitor (195) may be electrically connected to two terminals (e.g., B1, B2) of the circuit board (190) to supply power (or a driving signal) to the position sensor (170) from the outside. The capacitor (195) may be electrically connected in parallel to two terminals (e.g., B1, B2) of the circuit board (190). Alternatively, the capacitor (195) may be electrically connected in parallel to two terminals of the position sensor (170) to which power or a driving signal is supplied.

[0138] The capacitor (195) can act as a smoothing circuit to remove ripple components included in the power signal (GND, VDD) supplied to the position sensor (170) from the outside, thereby allowing a stable and uniform power signal to be supplied to the position sensor (170). Additionally, the capacitor (195) can protect the position sensor (170) from noise or static electricity of high frequency components introduced from the outside.

[0139] Referring to FIGS. 11 and 12, the elastic member may include at least one of an upper elastic member (150) and a lower elastic member (160). The upper elastic member (150) may be coupled to the upper, top, or upper surface of the bobbin (110) and the upper, top, or upper surface of the housing (140). The lower elastic member (160) may be coupled to the lower, bottom, or lower surface of the bobbin (110) and the lower, bottom, or lower surface of the housing (140). The upper elastic member (150) may include a first inner frame (151) coupled to the upper part of the bobbin (110), a first outer frame (152) coupled to the upper part of the housing (140), and a first frame connecting part (153) connecting the first inner frame (151) and the first outer frame (152). A hole (151A) may be formed in the first inner frame (151) to be coupled with the first coupling projection (111A) of the bobbin (110), and a hole (152A) may be formed in the first outer frame (152) to be coupled with the first coupling projection (142) of the housing (140). The upper elastic member (150) may include a protrusion (154) (or extension) extending from the first frame connecting part (153).

[0140] The lower elastic member (160) may include a second inner frame (161) coupled to the lower part of the bobbin (110), a second outer frame (162) coupled to the lower part of the housing (140), and a second frame connecting part (163) connecting the second inner frame (161) and the second outer frame (162). A hole (161A) may be formed in the second inner frame (161) for coupling with a second coupling projection (111B) of the bobbin (110), and a hole (162A) may be formed in the second outer frame (162) for coupling with a second coupling projection (143) of the housing (140).

[0141] The upper elastic member (150) may include a plurality of upper elastic units (150A to 150D) spaced apart from each other. In FIG. 11, the number of upper elastic units is 4, but in other embodiments, the number of upper elastic units may be 1, 2, 3, or 5 or more.

[0142] Each of the first to fourth upper elastic units (150A to 150D) can be directly bonded to any one of the first to fourth terminals (B1 to B4) of the circuit board (190) and electrically connected. At least a portion of each of the first to fourth upper elastic units (150A to 150D) can be placed in any one of the corresponding corner portions of the housing (140).

[0143] Each of the first to fourth upper elastic units (150A to 150D) may include an extension (7A to 7D) disposed on the fourth side (41D) of the housing (140) and coupled to any one of the first to fourth terminals (B1 to B4) of the circuit board (190). The extension (7A to 7D) may extend from the first outer frame (152) of each of the first to fourth upper elastic units (150A to 150D).

[0144] Each of the first and fourth upper elastic units (150A, 150D) may be in the form of two elastic units (150A1 and 150A2, 150D1 and 150D2) joined by solder or conductive adhesive, but in other embodiments, the two elastic units (150A1 and 150A2, 150D1 and 150D2) may be formed integrally.

[0145] The first outer frame (151) may include a first coupling part (520) coupled to the housing (140), a second coupling part (510) coupled to the support member (220), and a connecting part (530) connecting the first coupling part (520) and the second coupling part (510). The second coupling part (510) may be coupled to a part (e.g., the top) of the support member (220) by solder (901) or a conductive adhesive. A hole (58) may be formed in the second coupling part (510) for one end of the support member (220) to pass through.

[0146] The lower elastic member (160) may include a plurality of lower elastic units (160A to 160C). While FIG. 12 illustrates three lower elastic units spaced apart from each other, in other embodiments, the number of lower elastic units may be two or four or more.

[0147] The first lower elastic unit (160A) can be electrically bonded directly to the fifth terminal (B5) of the circuit board (190). The second lower elastic unit (160B) can be electrically bonded directly to the sixth terminal (B6) of the circuit board (190).

[0148] The first lower elastic unit (160A) may be electrically connected to the first coil unit (120A). The second inner frame (161) of the first lower elastic unit (160A) may include a bonding portion (9A) that is joined to the other end of the first coil unit (120A) by solder or conductive adhesive. The second lower elastic unit (160B) may be electrically connected to the second coil unit (120B). The second inner frame (161) of the second lower elastic unit (160B) may include a bonding portion (9B) that is joined to the other end of the second coil unit (120B) by solder or conductive adhesive.

[0149] The first lower elastic unit (160A) may include an extension (8A) that is coupled to the fifth terminal (B5) of the circuit board (190). The extension (8A) may extend from the second outer frame (162) of the first lower elastic unit (160A) toward the fifth pad (B5). The second lower elastic unit (160B) may include an extension (8B) that is coupled to the sixth terminal (B6) of the circuit board (190). The extension (8B) may extend from the second outer frame (162) of the second lower elastic unit (160B) toward the sixth pad (B6).

[0150] The upper elastic units (150A to 150D) and lower elastic units (160A, 160B) may be made of leaf springs. In other embodiments, the upper elastic units and lower elastic units may be implemented as coil springs, etc. The expressed "elastic unit (e.g., 150, or 160)" may be replaced with "spring," the "outer frame (e.g., 152, or 162)" may be replaced with "outer part," and the "inner frame (e.g., 151 or 161)" may be replaced with "inner part."

[0151] The support member (220) can support the housing (140) with respect to the base (210) so that the housing (140) can move in a direction perpendicular to the optical axis. The support member (220) can be combined with an upper elastic member (150). The support member (220) can electrically connect the upper elastic member (150) and the circuit board (250).

[0152] The support member (220) may include a plurality of support members (220A to 220D) spaced apart from each other. The support member (220) may be disposed in a corner portion of the housing (140). Each of the support members (220A to 220D) may be disposed in any one of the corresponding corner portions of the housing (140). The support members (220A to 220D) may electrically connect the circuit board (250) with any one of the corresponding upper elastic units (150A to 150D). Each of the support members (220A to 220D) may be coupled with any one of the first to fourth upper elastic units (150A to 150D) and may electrically connect any one of the corresponding terminals (251) of the circuit board (250) with any one of the corresponding upper elastic units (150A to 150D). One end of the support members (220A to 220D) can be directly connected or joined to the second joint (520) of the upper elastic member (150) by solder (901) (or conductive adhesive).

[0153] The upper elastic member (150), the lower elastic member (160), and the support member (220) may be formed of a conductive member, such as metal. The support members (220A to 220D) may be coil springs. In another embodiment, the support member (220) may be a spring with a twisted wire. In yet another embodiment, the support member (220) may be a suspension wire.

[0154] The support member (220) can be coupled with a terminal member (27) disposed on the base (210). The other end of the support member (220) can be electrically connected to the terminal member (27) by solder or conductive adhesive. The terminal member (27) can be electrically connected to the circuit board (250). The terminals (B1 to B4) of the circuit board (190) can be electrically connected to the circuit board (250) by upper elastic units (150A to 150D) and support members (220A to 220D). Each of the support members (220A to 220D) can be electrically connected to any one of the corresponding terminals (251) of the circuit board (250). The position sensor (170) can be electrically connected to the circuit board (250) through terminals (B1 to B4) of the circuit board (190), upper elastic units (150A to 150D), support members (220A to 220D), and terminal portion (27), and can receive a power signal from the circuit board (250), and can receive a clock signal and a data signal from the circuit board (250) or transmit them to the circuit board (250).

[0155] The base (210) may be placed below the housing (140). The base (210) may be spaced apart from the housing (140). The base (210) may be placed below the lower elastic member (160). The base (210) may be placed below the circuit board (250). The base (210) may include an opening (401) corresponding to the opening (101) of the bobbin (110), the opening (201) of the housing (140), or the opening (50A) of the circuit board (250). The base (210) may have a shape that matches or corresponds to the cover member (300). For example, the opening (401) of the base (210) may be in the form of a through hole penetrating the base (210) in the direction of the optical axis. The base (210) may include a step (211) for contacting or joining with the lower end of the side plate (302) of the cover member (300). Additionally, the base (210) may include a support portion (255) (or "support portion") for supporting the terminal portion (253) of the circuit board (250). The support portion (255) may be formed on the side of the base (210). The base (210) may include a number of support portions equal to the number of terminal surfaces (253). A protrusion (19) may be formed on the upper surface around the opening (401) of the base (210) for joining with the opening (201) of the circuit board (250).

[0156] The base (210) may include a support member (216) for supporting the ball member (12). The support member (216) may protrude from the upper surface of the base (210). The support member (216) may be formed integrally with the base (210). In other embodiments, the support member (216) may be formed as a separate member from the base (210), or it may be combined or assembled with the base (210). The support member (216) may be referred to as a "column member" or a "protrusion." The support member (216) may include a plurality of support members (216A to 216D). The number of support members may correspond to the number of ball members. The base (210) may include a groove (217, see FIG. 10) for receiving at least another part of the ball member (12).

[0157] The base (210) may include a support plate (51) for supporting at least another part of the ball member (12). The support plate (51) may be coupled to the base (210). The support plate (51) may be inserted into the base (210). The support plate (51) may be formed of metal. The support portion (216) of the base (210) may expose at least a part of the support plate (51). The support plate (51) may be exposed to a groove (217) of the support portion (216) and may form the bottom surface of the groove (217) of the support portion (216). The exposed part of the support plate (51) may come into contact with at least another part of the ball member (12). The support plate (51) may prevent the base (210) from being indented or pressed by the ball member (11). The support plate (51) may be replaced with an "insert member." The base (210) may include a guide portion (35) that protrudes from the upper surface of the base (210) and guides assembly with the circuit board (250).

[0158] The base (210) may include a reinforcing member (60). The reinforcing member (60) may be coupled to the base (210). The reinforcing member (60) may be formed of metal. The reinforcing member (60) may be inserted into the base (210). At least a portion of the reinforcing member (60) may be exposed from the base (210). In other embodiments, the reinforcing member (60) may not be exposed from the base (210). The reinforcing member (60) may be located below the coil units (230A to 230D) and may include a portion that overlaps with the coil units (230A to 230C). The reinforcing member (60) may serve to reinforce the strength of the base (210). Additionally, the reinforcing member (60) may reduce the leakage magnetic flux of the coil units (230A to 230D) and thereby act as a yoke that increases the OIS driving force. In another embodiment, the reinforcing member (60) may be replaced with a "yoke".

[0159] The lens driving device (100) may include a terminal portion (27) that is disposed on or coupled to the base (210). The terminal portion (27) may be inserted into the base (210). The terminal portion (27) may be referred to as an "insert terminal" or a "conductive member." The terminal portion (27) may be formed of a conductive material, such as a conductive metal. The terminal portion (27) may be disposed at a corner of the base (210). The base (210) may include the terminal portion (27).

[0160] The terminal portion (27) may include terminal portions (27A to 27D) corresponding to the support members (220A to 220D). The terminal portion (27) may overlap with the support member (220) in the direction of the optical axis. The base (210) may include sides corresponding to the sides (41A to 41D) of the housing (140). Additionally, the base (210) may include corner portions corresponding to the corner portions of the housing (140).

[0161] Terminal portions (27A to 27D) may be disposed at the corner portions of the base (210). The terminal portion (27) may include a through hole for the other end of the support member (220) to pass through. The other end of the support member (220) may be joined to the terminal portion (27) by solder or conductive adhesive. The terminal portion (27) may be electrically connected to the circuit board (250) by solder or conductive adhesive. In another embodiment, the terminal portion (27) may be omitted, and the other end of the support member (220) may be directly electrically connected to the circuit board (250).

[0162] The circuit board (250) may be placed below the housing (140). For example, the circuit board (250) may be placed on the base (210). The circuit board (250) may be placed on the upper surface (210A) of the base (210). The circuit board (250) may include an opening (50A) corresponding to the opening (102) of the bobbin (110), the opening (201) of the housing (140), or / and the opening (401) of the base (210). The opening (50A) of the circuit board (250) may be in the form of a through hole. The shape of the circuit board (250) may be a shape that matches or corresponds to the upper surface (210A) of the base (210), for example, a rectangular shape. The circuit board (250) may be a printed circuit board or a flexible printed circuit board.

[0163] A circuit board (250) may be placed on a base (210). The circuit board (250) may be coupled to the base (210). The circuit board (250) may include a guide groove (235) that corresponds to a guide portion (35) of the base (210) and is coupled to the guide portion (35) of the base (210). The circuit board (250) may include a body (25A) placed on the upper surface of the base (210) and at least one terminal portion (253) bent from the body (25A). The circuit board (250) may include two terminal portions (253) located opposite each other with respect to the body (25A). The terminal portion (253) may be placed on each of two sides located opposite each other of the body (25A).

[0164] The terminal portion (253) may be disposed on the outer surface of the side of the base (210). For example, the terminal portion (243) may be disposed on the outer surfaces of two sides of the base (210) located opposite each other with respect to the optical axis (OA).

[0165] The terminal portion (253) may be bent from the body (25A) toward the outer surface of the base (210). The terminal portion (253) may be referred to as a "terminal surface," "extension portion," or "bent portion." The circuit board (250) may include a plurality of terminals (251) disposed on the terminal portion (253). The plurality of terminals (251) may serve to receive an electrical signal from the outside or output an electrical signal to the outside. The circuit board (250) may include a relief portion (256) for avoiding spatial interference with the support portion (216) of the base (210). The circuit board (250) may include a pad (16) electrically connected to the terminal portion (27). The circuit board (250) may include pads (16A to 16D) that correspond to terminal portions (27A to 27D) and are electrically connected to the terminal portions (27A to 27D).

[0166] The coil (230) may be placed under the housing (140). The coil (230) may be placed on the circuit board (250). The coil (230) may correspond to, oppose, or overlap with the magnet (130) in the direction of the optical axis. The coil (230) may move the OIS moving part (e.g., housing (140)) in a direction perpendicular to the optical axis by means of an electromagnetic force resulting from interaction with the magnet (130). The OIS moving part may move in a direction perpendicular to the optical axis relative to the fixed part or tilt with respect to the optical axis.

[0167] The coil (230) may include a plurality of coil units (230A to 230C) corresponding to the magnet units (130A to 130C). Each of the coil units (230A to 230C) may face or overlap with any one of the corresponding magnet units (130A to 130C) in the direction of the optical axis. Each of the coil units (230A to 230C) may be wound in a ring shape. Each of the coil units (230A to 230C) may include a hollow.

[0168] Each of the coil units (230A to 230C) may be in the shape of a ring wound with respect to an axis parallel to the optical axis. In another embodiment, the coil (230) may be in the form of a circuit pattern coil or an FP (Fine pattern) coil formed on a "substrate" or "coil substrate". In yet another embodiment, the coil (230) may be formed integrally with the circuit board (250).

[0169] The coil units (230A to 230C) may be positioned adjacent to three of the four sides of the circuit board (250). In another embodiment, the coil units may be positioned in the corner area of ​​the circuit board (250). The coil (230) may be electrically connected to the circuit board (250). The circuit board (250) may include pads (3A to 3F) that are electrically connected to both ends of each of the coil units (230A to 230C). Additionally, the pads (3A to 3F) may be electrically connected to terminals (251) of the circuit board (250). Power or a driving signal may be supplied to the coil units (230A to 230D) from the circuit board (250). By the interaction between the magnet units (130A to 130C) and the coil units (230A to 230C), the housing (140) can move in a direction perpendicular to the optical axis, e.g., in the x-axis and / or y-axis direction, and thereby hand shake correction can be performed.

[0170] The position sensor (240) may be placed on the circuit board (250). The position sensor (240) may be electrically connected to the circuit board (250). For example, the position sensor (240) may be placed on the upper surface of the circuit board (250). In another embodiment, the position sensor (240) may be placed on the lower surface of the circuit board (250), and the base (210) may include a groove for receiving the position sensor (240).

[0171] The position sensor (240) can detect the displacement or position of the OIS moving part. The position sensor (240) can detect the displacement or position of the magnet (130). The position sensor (240) can detect the strength of the magnetic field of the magnet (130). The position sensor (240) may include a first sensor (240A) and a second sensor (240B) spaced apart from each other. The first and second sensors (240A, 240C) can detect the displacement or position of the OIS moving part in a direction perpendicular to the optical axis. The first sensor (240A) may face or overlap with any one of the first to third magnet units (130A to 130C) (e.g., 130A) in the direction of the optical axis. The second sensor (240A) may face or overlap with any other of the first to third magnet units (130A to 130C) in the direction of the optical axis (e.g., 130C). The first sensor (240A) can detect the strength of the magnetic field of the magnet unit (e.g., 130A) and output a first output signal. The second sensor (240B) can detect the strength of the magnetic field of the magnet unit (e.g., 130C) and output a second output signal. The displacement or position of the OIS moving part can be detected using the first and second output signals. Each of the first and second sensors (240A, 240B) may be a Hall sensor or a driver IC including a Hall sensor.

[0172] The first sensor (240A) may be located outside the hollow of the coil unit (230A) and on one side of the coil unit (230A). The second sensor (240B) may be located outside the hollow of the coil unit (230C) and on one side of the coil unit (230C). In another embodiment, the first sensor (240A) may be located inside the hollow of the coil unit (230A), and the second sensor (230B) may be located inside the hollow of the coil unit (230C).

[0173] The ball member (12) can be positioned between the housing (140) and the base (210). The ball member (12) can be positioned between the support plate (11) coupled to the housing (140) and the support plate (51) coupled to the base (210). The ball member (12) can support the OIS moving part and reduce the frictional force between the OIS moving part and the fixed part.

[0174] The lens driving device (100) may further include an insert member (70) that is positioned on or coupled to the base (210) and has an attractive force acting on the magnet (130) in the optical axis direction.

[0175] The insert member (70) may be positioned opposite or overlapping with the magnet (130) in the direction of the optical axis. For example, the insert member (70) may be located below the coil (230). The insert member (70) may be inserted into the base (210). The insert member (70) may be a magnetic material that adheres to the magnet. Due to the attractive force between the insert member (70) and the magnet (130), the OIS moving part (e.g., housing (140)) and the fixed part (e.g., base (210)) may press the ball member (12), and the OIS moving part may be stably supported by the ball member (12). The insert member (70) may be referred to as a "preload insert," "magnetic material," "holding magnet," or simply "magnet." In other embodiments, the ball member (12), support plates (11, 51), and insert member (70) may be omitted.

[0176] The base (210) may include a coupling portion (218) that is coupled with an insert member (70). The coupling portion (218) may be disposed on the inner surface of the base (210). The coupling portion (218) may protrude from the inner surface of the base (210). The coupling portion (218) may be disposed at the corners of the inner surface of the base (210). For example, the coupling portion (218) may include coupling portions (218A to 218D) disposed at the inner corners of the base (210).

[0177] The cover member (300) can accommodate an OIS moving part and a configuration coupled to the base (210) within a receiving space formed together with the base (210). The cover member (300) may include a top plate (301) and a side plate (302) connected to the top plate (301). The top plate (301) of the cover member (300) may include an opening (303) that exposes a lens (not shown) coupled to the bobbin (110) to external light. The side plate (302) of the cover member (300) may include an opening (304) that exposes a terminal (251) of the circuit board (250). The material of the cover member (300) may be a non-magnetic material (e.g., SUS material) to prevent the phenomenon of sticking to the magnet (130) during OIS operation. In another embodiment, the cover member (300) may be formed of a magnetic material and may function as a yoke to enhance the electromagnetic force between the coil (120) and the magnet (130).

[0178] The lens driving device (100) may include a first damper (not shown) positioned between an upper elastic member (150) and a bobbin (110) and in contact with the upper elastic member (150) and the bobbin (110). For example, the first damper may be in contact with the first frame connecting portion (153) of the upper elastic member (150) and the bobbin (110). For example, the first damper may be in contact with the extension portion (154) and the guide projection (122) of the bobbin (110). A groove may be formed in the guide projection (122) of the bobbin (110) to receive the first damper.

[0179] The lens driving device (110) may include a second damper (not shown) disposed between at least a portion of the housing (140) and the upper elastic member (150) (e.g., a first outer frame (152) or a second coupling part (520)). Additionally, the lens driving device (110) may further include a third damper (not shown) disposed between the support member (220) and the housing (140) and in contact with the support member (220) and the housing (140).

[0180] FIG. 15 is a partial enlarged view of a cover member (300), a terminal portion (253) of a circuit board (250), terminals (811) of a circuit board (800), and a reinforcing member (280); FIG. 16 shows a conductive adhesive (903) that combines the terminal (251) of the circuit board (250) of FIG. 15 and the terminal (811) of the circuit board (250); FIG. 17 is a partial enlarged view of FIG. 14a.

[0181] Referring to FIG. 9 and FIG. 15 to 17, the terminal portion (253) of the circuit board (250) may include a first portion (253A) that is bent from the body (25A) of the circuit board (250) and disposed on the outer surface of the base (210), and a second portion (253B) that is bent from the first portion (253A) and disposed below the outer surface of the base (210). The first portion (253A) of the terminal portion (253) may be coupled to the outer surface of the base (210). The first portion (253A) may be disposed on the support portion (255) of the base (210). The first portion (253A) of the terminal portion (253) may be coupled to the support portion (255) of the base (210).

[0182] The second part (253B) of the terminal portion (253) may be located below the lower surface of the base (210). The second part (253B) of the terminal portion (253) may be coupled to the lower surface of the base (210). The second part (253B) of the terminal portion (253) may be bent from the first part (253A) in a direction toward the optical axis. The distance between the optical axis and the second part (253B) may be smaller than the distance between the optical axis and the first part (253A). In the direction of the optical axis, the second part (253B) may overlap with the coil (230).

[0183] The terminal portion (253) may include a bent portion (253C) located between the first portion (253A) and the second portion (253B). The bent portion (253C) may connect the first portion (253A) and the second portion (253B). The bent portion (253C) may cover the portion where the outer surface of the base (210) and the lower surface of the base (210) meet.

[0184] The circuit board (250) may include a terminal (251) disposed on the terminal portion (253). The circuit board (250) may include a plurality of terminals (251-1 to 251-N, natural numbers for which N > 1). The plurality of terminals (251-1 to 251-N, natural numbers for which N > 1) may be spaced apart from each other in a direction parallel to the terminal portion (253). The plurality of terminals (251-1 to 251-N, natural numbers for which N > 1) may be spaced apart in a direction perpendicular to the optical axis direction and parallel to the first surface (53A) of the terminal portion (253).

[0185] The terminal (251) may be located inward in a direction perpendicular to the optical axis than the outer surface (302A) of the side plate (302) of the cover member (300). The terminal (251) may be exposed from the opening (304) of the side plate (302) of the cover member (300).

[0186] The terminal (251) may be disposed on the outer surface of the base (210) and on the lower surface of the base (210). The terminal (251) may include a portion that is bent in a direction toward the lower surface of the base (210) from the outer surface of the base (210).

[0187] The terminal (251) may be placed in the first part (253A) and the second part (253B) of the terminal portion (253) of the circuit board (250). At least a portion of the terminal (251) may overlap with the lower surface of the base (210) in the direction of the optical axis.

[0188] The terminal (251) may include a first region (251A) disposed in a first part (253A) of the terminal portion (253) of the circuit board (250) and a second region (251B) disposed in a second part (253B) of the terminal portion (253). The terminal (251) may include a third region (251C) disposed on a bent portion (253C) of the terminal portion (253) and connecting the first region (251A) and the second region (251B).

[0189] The first region (251A) may extend in the direction of the optical axis. The first region (251A) may extend from the upper surface of the base (210) toward the lower surface.

[0190] The second region (251B) may extend in a direction perpendicular to the optical axis direction, for example, in the X-axis direction. The second region (251B) may extend in a direction perpendicular to the outer surface of the base (210).

[0191] The length (L1) of the first region (251A) of the terminal (251) may be greater than the length (L2) of the second region (251B) of the terminal (251) extended by bending. L1 may be the length of the first region (251A) in the direction of the optical axis or in the direction from the upper surface of the base (210) toward the lower surface.

[0192] Additionally, the first region (251A) of the terminal (251) may include a portion where the conductive adhesive (903) is not placed. The length (L6) of the portion where the conductive adhesive (903) is not placed may be greater than the length (L2) of the second region (251B) of the terminal (251) that is bent and extended. L6 may be the length of the portion where the conductive adhesive (903) is not placed in the direction of the optical axis or in the direction from the upper surface of the base (210) toward the lower surface. This is to use the remaining portion of the first region (251A) that is not bonded with the conductive adhesive (903) as an electrical port (or connector) for testing the camera device (200). In other embodiments, L1 and L2 may be the same.

[0193] The terminal (251) may overlap with the terminal (811) of the circuit board (800) in the optical axis direction. The first region (251A) of the terminal (251) may overlap with the terminal (811) of the circuit board (800) in the optical axis direction. The second region (251B) of the terminal (251) may overlap with the terminal (811) of the circuit board (800) in the optical axis direction. The third region (251C) of the terminal (251) may overlap with the terminal (811) of the circuit board (800) in the optical axis direction. The second region (251B) of the terminal (251) may overlap with the coil (230) in the optical axis direction.

[0194] The camera device (200) may include a conductive adhesive (903) that joins the terminal (251) of the terminal portion (253) of the circuit board (250) and the terminal (811) of the circuit board (800). For example, the conductive adhesive (903) may be solder. The terminal (251) of the terminal portion (253) of the circuit board (250) and the terminal (811) of the circuit board (800) may be electrically connected by the conductive adhesive (903).

[0195] The circuit board (800) may include a plurality of terminals (811-1 to 811-N, natural numbers N>1) corresponding to a plurality of terminals (251-1 to 251-N) of the terminal portion (253). The plurality of terminals (811-1 to 811-N, natural numbers N>1) may be spaced apart from each other in the same direction as the arrangement direction of the plurality of terminals (251-1 to 251-N). The plurality of terminals (811-1 to 811-N) may be placed on the upper surface of the circuit board (800). They may be arranged parallel to at least one side of the upper surface of the circuit board (800). For example, referring to FIG. 1, the plurality of terminals (811-1 to 811-N) may be placed adjacent to at least one of two sides of the circuit board (800) located opposite each other with respect to the optical axis.

[0196] The conductive adhesive (903) can bond each of the plurality of terminals (811-1 to 811-N) of the circuit board (800) and each of the terminals (251-1 to 251-N) of the corresponding terminal portion (253) to each other.

[0197] The conductive adhesive (903) may be in contact with the first region (251A) and the second region (251B) of the terminal (251) of the terminal portion (253) of the circuit board (250). The conductive adhesive (903) may be in contact with the third region (251C) of the terminal (251) of the terminal portion (253) of the circuit board (250).

[0198] The conductive adhesive (903) may include a first region disposed outside the first region (251A) based on the first region (251A) of the terminal (251) and a second region disposed inside the first region (251A) of the terminal (251).

[0199] For example, the conductive adhesive (903) may include a first area (903A) positioned outside the front (29A) of the first area (251A) and a second area (903B) positioned inside the front (29A) of the first area (251A) of the terminal (251), based on the front (29A) of the first area (251A) of the terminal (251). The front (29A) of the terminal (251) may be the opposite side of the rear of the terminal (251) facing the outer surface of the base (210). The highest point of the first area (903A) may be located higher than the lowest point of the second area (903B).

[0200] The first region (903A) and the second region (903B) of the conductive adhesive (903) may overlap with the terminal (811) of the circuit board (800) in the optical axis direction. The first region (903A) and the second region (903B) of the conductive adhesive (903) may come into contact with the terminal (811) of the circuit board (800) in the optical axis direction. The second region (903B) of the conductive adhesive (903) may overlap with the coil (230) in the optical axis direction.

[0201] The first region (903A) of the conductive adhesive (903) may overlap with the side plate (302) of the cover member (300) in the direction of the optical axis. The second region (903B) of the conductive adhesive (903) may not overlap with the side plate (302) of the cover member (300) in the direction of the optical axis. The first region (903A) of the conductive adhesive (903) may be in contact with the front surface (29A) of the terminal (251). The second region (903B) of the conductive adhesive (903) may be in contact with the second region (251B) and the third region (251C) of the terminal (251). The conductive adhesive (903) can come into contact with all of the first to third regions (251A to 251C) of the terminal (251), and the contact area can be increased to improve the bonding strength and solderability between the terminal (251) of the circuit board (250) and the terminal (811) of the circuit board (800). As a result, in the embodiment, cracking of the conductive adhesive (903) can be prevented, the electrical connection between the terminal (251) of the circuit board (250) and the terminal (811) of the circuit board (800) can be prevented, and the reliability of the electrical connection can be increased.

[0202] The length (L3) of the first region (903A) of the conductive adhesive (903) may be smaller than the length (L4) of the second region (903B) of the conductive adhesive (903). L3 may be the length of the first region (903A) in a direction perpendicular to the optical axis or in a direction perpendicular to the outer surface of the base (210). L4 may be the length of the second region (903B) in a direction perpendicular to the optical axis or in a direction perpendicular to the outer surface of the base (210).

[0203] Since the length (L4) of the second region (903B) is greater than the length (L3) of the first region (903A), the bonding strength and solderability between the terminal (811) of the circuit board (800) and the terminal (251) of the circuit board (250) can be improved, and cracking of the conductive adhesive (903) can be prevented.

[0204] In addition, since the length (L3) of the first region (903A) is smaller than the length (L4) of the second region (903B), the degree to which the conductive adhesive (903) protrudes relative to the front surface (29A) of the first region (251A) of the terminal (251) can be reduced, and as a result, the length (L5) from the front surface (29A) of the first region (251A) of the terminal (251) to the side surface (805) of the circuit board (800) can be reduced.

[0205] The conductive adhesive (903) may not overlap with the outer surface (302A) of the side plate (302) of the cover member (300) in the direction of the optical axis. That is, in the embodiment, the side (815) of the circuit board (800) may be designed so that it does not protrude outward from the side plate (302) with respect to the outer surface (302A) of the side plate (302) of the cover member (300). In the embodiment, the size in the direction perpendicular to the optical axis of the camera device (200) may be reduced.

[0206] At least a portion of the adhesive (612) may be placed between the second portion (253B) of the terminal portion (253) and the circuit board (800). At least a portion of the adhesive (612) may be in contact with the second portion (253B) and the upper surface of the circuit board (800). At least a portion of the adhesive (612) may overlap with the second region (903B) of the conductive adhesive (903) in a direction perpendicular to the optical axis.

[0207] In the embodiment, when soldering for electrical connection between the terminal (251) of the terminal portion (253) of the circuit board (250) of the lens driving device (100) and the terminal (811) of the circuit board (800) to which the image sensor (810) is electrically connected, a part (251B, 251C) of the terminal (251) is placed on a part (253B, 253C) of the terminal portion (253) that is bent toward the lower surface of the base (210).

[0208] In the embodiment, the conductive adhesive (903) may be positioned further inward than the outer surface (302A) of the side plate (302) of the cover member (300), and thus the size in the direction perpendicular to the optical axis of the circuit board (800) may be designed to be the same as or smaller than the size in the direction perpendicular to the optical axis of the lens driving device (100).

[0209] FIG. 18 shows a camera device (1200) according to another embodiment, FIG. 19 is an exploded perspective view of the image sensor unit (1310) of FIG. 18, FIG. 20 is an exploded perspective view of the lens driving device (100-1) of FIG. 19, FIG. 21 is a perspective view of the lens driving device (100-1) of FIG. 19 excluding the cover member (300), FIG. 22 is an exploded perspective view of the circuit board (1250), coil (230), and base assembly (400) of FIG. 20, FIG. 23 is a first perspective view of the coil (230), circuit board (1250), and base assembly (400) of FIG. 20, FIG. 24 is a second perspective view of the coil (230), circuit board (1250), and base assembly (400) of FIG. 20, and FIG. 25 is FIG. 20 FIG. 26 is a combined perspective view of a coil (230), a circuit board (1250), and a base assembly (400), and FIG. 26 shows the electrical connection of the circuit board (1250), an upper elastic member (150), a coil (230), a lower elastic member (160), and a support member (220) of FIG. 20, FIG. 27a is a cross-sectional view of a camera device (1200) in the AB direction of FIG. 18, FIG. 27b is a cross-sectional view of a camera device (1200) in the CD direction of FIG. 18, and FIG. 27c is a cross-sectional view of a camera device (1200) in the EF direction of FIG. 18.

[0210] Referring to FIGS. 18 to 27c, the camera device (1200) may include an image sensor unit (1310) comprising an image sensor (810) and a lens driving device (100-1) disposed on the image sensor unit (1310). In FIGS. 18 to 27c, the same reference numerals as in FIGS. 1 to 14c indicate the same configurations, and descriptions of the same configurations are omitted.

[0211] The image sensor unit (1310) may include a circuit board (1800), an image sensor (810) electrically connected to the circuit board (1800), and a lens driving device (100-1) disposed on the circuit board (1800) so as to face the image sensor (810).

[0212] The image sensor unit (1310) may include a filter (610). The image sensor unit (1310) may include a sensor base (600). The image sensor unit (1310) may include a control unit (830). The image sensor unit (1310) may further include a reinforcing member (280) coupled to a circuit board (1800). The circuit board (1800) may include an opening (1801) that corresponds to, opposes, or overlaps with the image sensor (810) in the direction of the optical axis. The description of the image sensor (810), filter (610), sensor base (600), adhesive (281), and reinforcing member (280) disclosed in FIG. 2 may be applied or analogously applied to the configuration shown in FIG. 19. The description of the opening (801) in FIG. 2 may be applied or analogously applied to the opening (1801). In addition, the description of the lens driving device (100) of FIG. 1 may be applied or analogously applied to the lens driving device (100-1) of FIG. 19.

[0213] The circuit board (1250) may be placed below the housing (140). For example, the circuit board (1250) may be placed on the base (210). The circuit board (1250) may be placed on the upper surface (210A) of the base (210). The circuit board (1250) may include an opening (50A) corresponding to the opening (102) of the bobbin (110), the opening (201) of the housing (140), or / and the opening (401) of the base (210). The opening (50A) of the circuit board (1250) may be in the form of a through hole. The shape of the circuit board (1250) may be a shape that matches or corresponds to the upper surface (210A) of the base (210), for example, a rectangular shape. The circuit board (1250) may be a printed circuit board or a flexible printed circuit board.

[0214] A circuit board (1250) may be placed on a base (210). The circuit board (1250) may be coupled to the base (210). The circuit board (1250) may include a guide groove (235) that corresponds to a guide portion (35) of the base (210) and is coupled to the guide portion (35) of the base (210). The circuit board (1250) may include a body (25A) placed on the upper surface of the base (210) and at least one terminal portion (1253) bent from the body (25A). The circuit board (1250) may include two terminal portions (1253) located opposite each other with respect to the body (25A). The terminal portion (1253) may be placed on each of two sides located opposite each other of the body (25A).

[0215] The terminal portion (1253) may be positioned on the outer surface of the side of the base (210). For example, the terminal portion (243) may be positioned on the outer surfaces of two sides of the base (210) located opposite each other with respect to the optical axis (OA).

[0216] The terminal portion (1253) may be bent from the body (25A) toward the outer surface of the base (210). The terminal portion (1253) may be referred to as a "terminal surface," "extension portion," or "bent portion." The circuit board (1250) may include a plurality of terminals (1251) disposed on the terminal portion (1253). The plurality of terminals (1251) may serve to receive an electrical signal from the outside or output an electrical signal to the outside. The circuit board (1250) may include a relief portion (256) to avoid spatial interference with the support portion (216) of the base (210). The circuit board (1250) may include a pad (16) electrically connected to the terminal portion (27). The circuit board (1250) may include pads (16A to 16D) that correspond to terminal portions (27A to 27D) and are electrically connected to the terminal portions (27A to 27D). The description of the coil (230) and position sensor (240) of FIGS. 3 and 7 may be applied or analogously applied to the coil (230) and position sensor (240) of the embodiment of FIGS. 20 and 22.

[0217] FIG. 28 is a partial enlarged view of the cover member (300) of FIG. 20, the terminal portion (1253) of the circuit board (1250), the circuit board (1800), and the reinforcing member (280); FIG. 29 shows the rear view of the base (210) and the terminal portion (1253) of the circuit board (1250) of FIG. 28; FIG. 30 shows the cover member (300) of FIG. 28, the terminals (1811-1 to 1811-N, natural numbers such that N>1) of the circuit board (1800), and the reinforcing member (280); FIG. 31 shows a conductive adhesive (1903) that combines the terminal (1251) of the terminal portion (1253) of FIG. 28 and the terminal (1811) of the circuit board (1800); FIG. 32 is a partial enlarged view of FIG. 27a.

[0218] Referring to FIGS. 28 to 32, the circuit board (1250) may include a terminal (1251) disposed on a terminal portion (1253). The circuit board (1250) may include a plurality of terminals (1251-1 to 1251-N, natural numbers for which N > 1). The plurality of terminals (1251-1 to 1251-N, natural numbers for which N > 1) may be spaced apart from each other in a direction parallel to the terminal portion (1253). The plurality of terminals (1251-1 to 1251-N, natural numbers for which N > 1) may be spaced apart in a direction perpendicular to the optical axis and parallel to the first surface (1053A) of the terminal portion (1253). The terminal (1251) may be located inward in a direction perpendicular to the optical axis than the outer surface (302A) of the side plate (302) of the cover member (300). The terminal (1251) can be exposed from the opening (304) of the side plate (302) of the cover member (300).

[0219] A terminal (1251) may be placed on a first surface (1053A) of a terminal portion (1253). The first surface (1053A) of the terminal portion (1253) may be a surface facing the optical axis (OA). The first surface (1053A) may be a surface facing the side (1071) (or 1075A) of the circuit board (1800). The first surface (1053A) may be the rear or inner surface of the terminal portion (1253). The terminal (1251) may be located under the lower surface (219) of the base (210).

[0220] The terminal portion (1253) may include a first portion (1253A) (or upper portion) located higher than the lower surface (219) of the base (210) and a second portion (1253B) (or lower portion) located lower than the lower surface (219) of the base (210). The lower surface (219) of the base (210) may be the lowest surface of the base (210).

[0221] The first part (1253A) of the terminal part (1253) may overlap with the base (210) in a direction perpendicular to the optical axis direction or in a direction perpendicular to the rear side (1053A) (or front side (1053B), or the outer side of the base (210)) of the terminal part (1253).

[0222] The second part (1253B) of the terminal part (1253) may not overlap with the base (210) in a direction perpendicular to the optical axis direction or in a direction perpendicular to the rear side (1053A) (or front side (1053B)) of the terminal part (1253). The second part (1253B) of the terminal part (1253) may overlap with the circuit board (1800) in a direction perpendicular to the optical axis direction or in a direction perpendicular to the rear side (1053A) (or front side (1053B)) of the terminal part (1253). The second part (1253B) of the terminal part (1253) may protrude downward from the lower side (219) of the base (210).

[0223] The terminal (1251) may be placed in the second part (1253B) of the terminal section (1253). The terminal (1251) may not overlap with the base (210) in a direction perpendicular to the optical axis. The terminal (1251) may overlap with the side of the circuit board (1800) in a direction perpendicular to the optical axis.

[0224] The terminal (1251) may overlap with the terminal (1811) of the circuit board (1800) in a direction perpendicular to the optical axis direction. For example, the terminal (1251) of the circuit board (1250) may face or overlap with the terminal (1811) of the circuit board (1800) in a direction perpendicular to the rear side (1053A) (or front side (1053B)) of the terminal portion (1253).

[0225] The terminal (1251) may be placed in the second part (1253B) of the terminal section (1253). The terminal (1251) may be placed on the first surface (1053A) of the second part (1253B) of the terminal section (1253). The terminal (1251) may be placed adjacent to the lower end of the terminal section (1253).

[0226] A hole (1009) may be formed in the terminal (1251) of the terminal portion (1253). The hole (1009) may be formed in the second portion (1253B) of the terminal portion (1253). The hole (1009) may penetrate the terminal portion (1253).

[0227] The terminal portion (1251) may include through holes (1009-1 to 1009-N, a natural number such that N > 1) formed in a plurality of terminals (1251). A conductive layer or conductive film connected to the terminal (1251) may be formed inside the hole (1009) of the terminal portion (1251). The hole (1009) may be referred to as a "conductive hole" or a "hole pad." The hole (1009) may be formed in the second portion (1253B) of the terminal portion (1253). The hole (1009) may penetrate the second portion (1253B) of the terminal portion (1253). The hole (1009) can penetrate the first surface (1053A) of the second part (1253B) of the terminal part (1253) and the second surface (1053B) of the terminal part (1253). The second surface (1053B) of the terminal part (1253) may be the opposite side of the first surface (1053A). The second surface (1053B) may be the front or outer surface of the terminal part (1253).

[0228] The hole (1009) may overlap with the side of the circuit board (1800) in a direction perpendicular to the optical axis. The hole (1009) may overlap with the terminal (1811) of the circuit board (1800) in a direction perpendicular to the optical axis. The hole (1009) may be spaced apart from the bottom or lower surface of the terminal portion (1251). In another embodiment, the hole (1009) may be in contact with the bottom or lower surface of the terminal portion (1251). The terminal (1251) may be positioned around the hole (1009). The terminal (1251) may be positioned to surround the hole (1009).

[0229] Referring to FIG. 30, the circuit board (1800) may include a terminal (1811) corresponding to a terminal (1251) of the circuit board (1250). The terminal (1811) may be positioned on the side of the circuit board (1250). The terminal (1811) may be positioned further inside than the terminal portion (1253) with respect to the terminal portion (1253) of the circuit board (1250). The terminal (1811) of the circuit board (1800) may be positioned further inside than the terminal (1251) of the circuit board (1250). The optical axis (OA) may be positioned closer to the terminal (1811) than to the terminal (1251). The distance between the optical axis (OA) and the terminal (1811) of the circuit board (1800) may be smaller than the distance between the optical axis (OA) and the terminal (1251) of the circuit board (1250). The terminal (1811) can be located inside the rear (1053A) of the terminal section (1253).

[0230] The circuit board (1800) may include a plurality of terminals (1811-1 to 1811-N, natural numbers N>1) corresponding to a plurality of terminals (1251-1 to 1251-N) of the terminal portion (1253) of the circuit board (1250). The plurality of terminals (1811-1 to 1811-N, natural numbers N>1) may be spaced apart from each other in the same direction as the arrangement direction of the plurality of terminals (1251-1 to 1251-N).

[0231] A plurality of terminals (1811-1 to 1811-N) may be disposed on a side (1071) of a circuit board (1800). At this time, the side (1071) of the circuit board (1800) may be located between the upper surface of the circuit board (1800) and the lower surface of the circuit board (1800) facing the lens driving device (100-1) in the direction of the optical axis. The lower surface of the circuit board (1800) may be the opposite side of the upper surface of the circuit board (1800). For example, a plurality of terminals (1811-1 to 1811-N) may be disposed on at least one of two sides of the circuit board (1800) located opposite each other with respect to the optical axis (OA).

[0232] A circuit board (1800) may include a groove (1075) formed on a side (1071) of the circuit board (1800). The groove (1075) may be recessed from the side (1071) of the circuit board (1800). A terminal (1811) may be placed within the groove (1075) of the circuit board (1800). The groove (1075) may include a bottom surface (1075A) and a side (1075B) connecting the bottom surface (1075A) and the side (1071) of the circuit board (1800). The distance between the bottom surface (1075A) of the groove (1075) and the optical axis (OA) may be smaller than the distance between the side (1071) of the circuit board (1800) and the optical axis. A terminal (1811) may be placed on the bottom surface (1075A) of the groove (1075).

[0233] The terminal portion (1253) may overlap with the groove (1075) of the circuit board (1800) in the direction of the optical axis. A second portion (1253B) of the terminal portion (1253) may be placed within the groove (1075) of the circuit board (1800). The groove (1075) may include a first opening that opens to the upper surface of the circuit board (1800). The groove (1075) may include a second opening that opens to the lower surface of the circuit board (1800). Spatial interference between the terminal portion (1253) and the circuit board (1800) can be avoided by the first and second openings of the groove (1075).

[0234] The terminal (1251) of the terminal portion (1253) may be placed within the groove (1075) of the circuit board (1800). The second portion (1253B) of the terminal portion (1253) may overlap with the groove (1075) of the circuit board (1800) in the direction of the optical axis. The depth of the groove (1075) may be greater than the thickness of the terminal portion (1253). In another embodiment, the depth of the groove (1075) may be equal to the thickness of the terminal portion (1253). The depth of the groove (1075) may be the distance between the side (1071) of the circuit board (1800) and the bottom surface (1075A) of the groove (1075). For example, the depth of the groove (1075) may be the distance between the side (1071) of the circuit board (1800) and the bottom surface (1075A) of the groove (1075) in a direction perpendicular to the optical axis.

[0235] The second portion (1253B) of the terminal portion (1253) may be placed within the groove (1075) of the circuit board (1800), and the second surface (1053B) of the terminal portion (1253) may be located inside the side surface (1071) of the circuit board (1800) relative to the side surface (1071) of the circuit board (1800). That is, the second surface (1053B) of the terminal portion (1253) may not protrude outward relative to the side surface (1071) of the circuit board (1800). In another embodiment, the depth of the groove (1075) may be the same as the thickness of the terminal portion (1253).

[0236] The camera device (1200) may include a conductive adhesive (1903) that joins the terminal (1251) of the terminal portion (1253) of the circuit board (1250) and the terminal (1811) of the circuit board (1800). For example, the conductive adhesive (1903) may be solder or jet solder. The terminal (1251) of the terminal portion (1253) of the circuit board (1250) and the terminal (1811) of the circuit board (1800) may be electrically connected by the conductive adhesive (1903).

[0237] The conductive adhesive (1903) may be placed between the terminal (1251) of the terminal portion (1253) and the terminal (1811) of the circuit board (1800), and may be placed within the hole (1009) of the terminal portion (1253) of the circuit board (1250). A portion of the conductive adhesive (1903) may fill the hole (1009) of the terminal portion (352). In order to place the conductive adhesive (1903), the base (210) may not be placed between the second portion (1253B) of the terminal portion (1253) of the circuit board (1250) and the side (1071) of the circuit board (1800). The conductive adhesive (1903) may not overlap with the base (210) in a direction perpendicular to the optical axis or in a direction perpendicular to the rear surface (1053A) (or front surface (1053B), or the outer surface of the base (210)) of the terminal portion (1253).

[0238] Through a laser soldering process, such as jet soldering, a conductive adhesive (1903) can be filled into a hole (1009) of a terminal portion (1253) of a circuit board (1250) and placed between a terminal (1251) of the terminal portion (1253) and a terminal (1811) of the circuit board (1800).

[0239] The conductive adhesive (1903) may come into contact with the hole pad (1009), the terminal (1251) of the terminal portion (1253), and the terminal (1811) of the circuit board (1800). The conductive adhesive (1903) may be placed within the groove (1075) of the circuit board (1800). The conductive adhesive (1903) may overlap with the groove (1075) of the circuit board (1800) in the direction of the optical axis. The conductive adhesive (1903) may be placed inside the side (1071) relative to the side (1071) of the circuit board (1800).

[0240] The conductive adhesive (1903) may be located inside the outer surface (302A) of the side plate (302) of the cover member (300). The conductive adhesive (1903) may not overlap with the outer surface (302A) of the side plate (302) of the cover member (300) in the optical axis direction. The conductive adhesive (1903) may overlap with the coil (230) in the optical axis direction.

[0241] In the embodiment, the side (1071) of the circuit board (1800) can be designed so that it does not protrude outward from the side plate (302) with respect to the outer surface (302A) of the side plate (302) of the cover member (300). In the embodiment, the size can be reduced in a direction perpendicular to the optical axis direction of the camera device (1200).

[0242] In the embodiment, the conductive adhesive (1903) can be positioned inside the outer surface (302A) of the side plate (302) based on the outer surface (302A) of the side plate (302) of the cover member (300), and as a result, the size in the direction perpendicular to the optical axis of the circuit board (1800) can be designed to be the same as or smaller than the size in the direction perpendicular to the optical axis of the lens driving device (100-1).

[0243] The circuit board (1250) may include a pad (1008) disposed in a terminal portion (1253). An opening (304) of the cover member (300) may expose the pad (1008) and the conductive adhesive (1903). The opening (304) of the cover member (300) may overlap with the pad (1008), the conductive adhesive (1903), and the hole pad (1009) in a direction perpendicular to the optical axis direction.

[0244] The pad (1008) may be a test pad. The pad (1008) may be used as an electrical port (or connector) for testing the camera device (1200). The pad (1008) may be placed on the hole pad (1009) of the terminal section (1253). The pad (1008) may be placed on the first part (1253A) of the terminal section (1253).

[0245] The pad (1008) may be electrically connected to the terminal (1251). The terminal portion (1253) may include wiring for electrically connecting the pad (1008) and the terminal (1251). The pad (1008) may include pads (1008-1 to 1008-N) corresponding to the terminals (1251-1 to 1251-N) or the hole pads (1009-1 to 1009-N).

[0246] The diameter (D1) of the hole in the hole pad (1009) may be smaller than the length (D2) in the optical axis direction of the pad (1008). D2 may be the length in the vertical direction of the pad (1008). Additionally, the diameter (D1) of the hole in the hole pad (1009) may be smaller than the length in the direction perpendicular to the optical axis of the pad (1008) (or the length in the horizontal direction of the pad (1008). Additionally, the diameter (D1) of the hole in the hole pad (1009) may be smaller than or equal to the length in the optical axis direction (or the length in the vertical direction) of the terminal (1251). Additionally, the diameter (D1) of the hole in the hole pad (1009) may be smaller than or equal to the length (D3) in the direction perpendicular to the optical axis direction of the terminal (1251) (or the length in the horizontal direction).

[0247] In the embodiment, a terminal portion (1253) of the circuit board (1250) of the lens driving device (100-1) is placed within a groove (1075) formed on the side (1071) of the circuit board (1800) that is electrically connected to the image sensor (810), and a conductive adhesive (1903) is placed between a terminal (1251) formed on the rear surface (1053A) of the terminal portion (1253) and a terminal (1811) formed on the bottom surface of the groove (1075) of the circuit board (1800). As a result, in the embodiment, the conductive adhesive (1903) can be placed further inward than the outer surface (302A) of the side plate (302) of the cover member (300), and the size can be reduced in a direction perpendicular to the optical axis direction of the camera device (1200).

[0248] In addition, in the embodiment, by injecting a conductive adhesive through a hole pad (1009) penetrating the terminal portion (1253), electrical connection between a terminal (1251) formed on the rear surface (1053A) of the terminal portion (1253) of the circuit board (1250) and a terminal (1811) disposed on the side surface (1071) of the circuit board (1800) can be facilitated.

[0249] Referring to FIGS. 33 to 42c, the camera device (2200) may include an image sensor unit (2310) comprising an image sensor (810) and a lens driving device (100-2) disposed on the image sensor unit (2310). In FIGS. 33 to 42c, the same reference numerals as in FIGS. 1 to 14c indicate the same configurations, and descriptions of the same configurations are omitted.

[0250] The image sensor unit (2310) may include a circuit board (2800), an image sensor (810) electrically connected to the circuit board (2800), and a lens driving device (100-2) disposed on the circuit board (2800) so as to face the image sensor (810).

[0251] The image sensor unit (2310) may include a filter (610). The image sensor unit (2310) may include a sensor base (600). The image sensor unit (2310) may include a control unit (830). The image sensor unit (2310) may further include a reinforcing member (280) coupled to a circuit board (2800). The circuit board (2800) may include an opening (1801) that corresponds to, opposes, or overlaps with the image sensor (810) in the direction of the optical axis. The description of the image sensor (810), filter (610), sensor base (600), adhesive (281), and reinforcing member (280) disclosed in FIG. 2 may be applied or analogously applied to the configuration shown in FIG. 34. The description of the opening (801) in FIG. 2 may be applied or analogously applied to the opening (2801). In addition, the description of the lens driving device (100) of FIG. 1 may be applied or analogously applied to the lens driving device (100-2) of FIG. 33.

[0252] The circuit board (2250) may be placed below the housing (140). For example, the circuit board (2250) may be placed on the base (210). The circuit board (2250) may be placed on the upper surface (210A) of the base (210). The circuit board (2250) may include an opening (50A) corresponding to the opening (102) of the bobbin (110), the opening (201) of the housing (140), or / and the opening (401) of the base (210). The opening (50A) of the circuit board (2250) may be in the form of a through hole. The shape of the circuit board (2250) may be a shape that matches or corresponds to the upper surface (210A) of the base (210), for example, a rectangular shape. The circuit board (2250) may be a printed circuit board or a flexible printed circuit board.

[0253] A circuit board (2250) may be placed on a base (210). The circuit board (2250) may be coupled to the base (210). The circuit board (2250) may include a guide groove (235) that corresponds to a guide portion (35) of the base (210) and is coupled to the guide portion (35) of the base (210). The circuit board (2250) may include a body (25A) placed on the upper surface of the base (210) and at least one terminal portion (2253) bent from the body (25A). The circuit board (2250) may include two terminal portions (2253) located opposite each other with respect to the body (25A). The terminal portion (2253) may be placed on each of two sides located opposite each other of the body (25A).

[0254] The terminal portion (2253) may be disposed on the outer surface of the side of the base (210). For example, the terminal portion (2253) may be disposed on the outer surfaces of two sides of the base (210) located opposite each other with respect to the optical axis (OA).

[0255] The terminal portion (2253) may be bent from the body (25A) toward the outer surface of the base (210). The terminal portion (2253) may be referred to as a "terminal surface," "extension portion," or "bent portion." The circuit board (2250) may include a plurality of terminals (2251) disposed on the terminal portion (2253). The plurality of terminals (2251) may serve to receive an electrical signal from the outside or output an electrical signal to the outside. The circuit board (2250) may include a relief portion (256) to avoid spatial interference with the support portion (216) of the base (210). The circuit board (2250) may include a pad (16) electrically connected to the terminal portion (27). The circuit board (2250) may include pads (16A to 16D) that correspond to terminal portions (27A to 27D) and are electrically connected to the terminal portions (27A to 27D). The description of the coil (230) and position sensor (240) of FIGS. 3 and 7 may be applied or analogously applied to the coil (230) and position sensor (240) of the embodiment of FIGS. 35 and 38.

[0256] FIG. 43 is a partial enlarged view of a cover member (300), a terminal portion (2253) of a circuit board (2250), a circuit board (2800), and a reinforcing member (280); FIG. 44a is a bottom view of a reinforcing member (280), a terminal portion (2253) of a circuit board (2250), a circuit board (2800), and a conductive adhesive (2903); FIG. 44b is a partial enlarged view of FIG. 44a; FIG. 45 shows the cover member (300) of FIG. 43, terminals (2811-1 to 2811-N, natural numbers where N>1) of a circuit board (2800), and a reinforcing member (280); FIG. 46 shows the rear side of a terminal portion (2253) of a circuit board (2250) of FIG. 43; FIG. 47 is a partial enlarged view of FIG. 42a.

[0257] Referring to FIGS. 43 through 47, the circuit board (2250) may include a terminal (2251) disposed in a terminal portion (2253). The circuit board (2250) may include a plurality of terminals (2251-1 to 2251-N, natural numbers for which N > 1). The plurality of terminals (2251-1 to 2251-N, natural numbers for which N > 1) may be spaced apart from each other in a direction parallel to the terminal portion (2253). The plurality of terminals (2251-1 to 2251-N, natural numbers for which N > 1) may be spaced apart in a direction perpendicular to the optical axis direction and parallel to the first surface (2053A) of the terminal portion (2253).

[0258] The terminal (2251) may be located inward in a direction perpendicular to the optical axis than the outer surface (302A) of the side plate (302) of the cover member (300). The terminal (2251) may be exposed from the opening (304) of the side plate (302) of the cover member (300).

[0259] The terminal (2251) may be placed on the first surface (2053A) of the terminal portion (2253). The first surface (2053A) of the terminal portion (2253) may be a surface facing the optical axis. The first surface (2053A) may be a surface facing the side (2071) of the circuit board (2800). The first surface (2053A) may be the rear or inner surface of the terminal portion (2253). The terminal (2251) may be located below the lower surface (219) of the base (210).

[0260] The terminal portion (2253) may include a first portion (2253A) (or upper portion) located higher than the lower surface (219) of the base (210) and a second portion (2253B) (or lower portion) located lower than the lower surface (219) of the base (210). The lower surface (219) of the base (210) may be the lowest surface of the base (210).

[0261] The first part (2253A) of the terminal part (2253) may overlap with the base (210) in a direction perpendicular to the optical axis direction or in a direction perpendicular to the rear side (2053A) (or front side (2053B), or the outer side of the base (210)) of the terminal part (2253).

[0262] The second part (2253B) of the terminal part (2253) may not overlap with the base (210) in a direction perpendicular to the optical axis direction or in a direction perpendicular to the rear side (2053A) (or front side (2053B)) of the terminal part (2253). The second part (2253B) of the terminal part (2253) may overlap with the circuit board (2800) in a direction perpendicular to the optical axis direction or in a direction perpendicular to the rear side (2053A) (or front side (2053B)) of the terminal part (2253). The second part (2253B) of the terminal part (2253) may protrude downward from the lower side (219) of the base (210).

[0263] The terminal (2251) may be placed in the second part (2253B) of the terminal section (2253). The terminal (2251) may not overlap with the base (210) in a direction perpendicular to the optical axis. The terminal (2251) may overlap with the side of the circuit board (2800) in a direction perpendicular to the optical axis.

[0264] The terminal (2251) may overlap with the terminal (2811) of the circuit board (2800) in a direction perpendicular to the optical axis. The terminal (2251) of the circuit board (2250) may face or overlap with the terminal (2811) of the circuit board (2800) in a direction perpendicular to the terminal portion (2253). The terminal (2251) of the circuit board (2250) may face or overlap with the terminal (2811) of the circuit board (2800) in a direction perpendicular to the rear surface (2053A) (or front surface (2053B)) of the terminal portion (2253). Additionally, the terminal (2251) of the circuit board (2250) and the terminal (2811) of the circuit board (2800) may not overlap in a direction parallel to the outer surface of the base (210) or in the optical axis direction.

[0265] The terminal (2251) may be placed in the second part (2253B) of the terminal section (2253). The terminal (2251) may be placed on the first surface (2053A) of the second part (2253B) of the terminal section (2253). The terminal (2251) may be placed adjacent to the lower end of the terminal section (2253).

[0266] Referring to FIGS. 33 and 45, the circuit board (2800) may include a terminal (2811) corresponding to a terminal (2251) of the circuit board (2250). The terminal (2811) may be positioned on the side (2071) of the circuit board (2250). The terminal (2811) may be located inside the terminal portion (2253) with respect to the terminal portion (2253) of the circuit board (2250). The terminal (2811) of the circuit board (2800) may be positioned inside the terminal (2251) of the circuit board (2250). In this case, "inside" may be the direction in which the optical axis (OA) is located with respect to the terminal portion (2253).

[0267] The optical axis (OA) may be located closer to the terminal (2811) of the circuit board (2800) than to the terminal (2251) of the circuit board (2250). The distance between the optical axis (OA) and the terminal (2811) of the circuit board (2800) may be smaller than the distance between the optical axis (OA) and the terminal (2251) of the circuit board (2250). The terminal (2811) may be located further inside than the rear surface (2053A) of the terminal portion (2253).

[0268] The circuit board (2800) may include a plurality of terminals (2811-1 to 2811-N, natural numbers N>1) corresponding to a plurality of terminals (2251-1 to 2251-N) of the terminal portion (2253) of the circuit board (2250). The plurality of terminals (2811-1 to 2811-N, natural numbers N>1) may be spaced apart from each other in the same direction as the arrangement direction of the plurality of terminals (2251-1 to 2251-N).

[0269] A plurality of terminals (2811-1 to 2811-N) may be disposed on a side (2071) of a circuit board (2800). At this time, the side (2071) of the circuit board (2800) may be located between the upper surface of the circuit board (2800) and the lower surface of the circuit board (2800) facing the lens driving device (100-2) in the direction of the optical axis. The lower surface of the circuit board (2800) may be the opposite side of the upper surface of the circuit board (2800). For example, a plurality of terminals (2811-1 to 2811-N) may be disposed on at least one of two sides of the circuit board (2800) located opposite each other with respect to the optical axis (OA).

[0270] A circuit board (2800) may include a groove (2075) formed on a side (2071) of the circuit board (2800). The groove (2075) may be recessed from the side (2071) of the circuit board (2800). A terminal (2811) may be placed within the groove (2075) of the circuit board (2800). The groove (2075) may include a bottom surface (2075A) and a side (2075B) connecting the bottom surface (2075A) and the side (2071) of the circuit board (2800). The distance between the bottom surface (2075A) of the groove (2075) and the optical axis (OA) may be smaller than the distance between the side (2071) of the circuit board (2800) and the optical axis. A terminal (2811) may be placed on the bottom surface (2075A) of the groove (2075). The terminal (2811) may be exposed to at least one of the side (2071), bottom (2800A), and top (2800B) of the circuit board (2800).

[0271] The terminal (2811) may include a first portion (2081A) formed on the side (2071) of the circuit board (2800). The first portion (2081A) may be formed on the bottom surface (2075A) of the groove (2075) of the circuit board (2800). The first portion (2081A) may be exposed from the side (2071) of the circuit board (2800). The first portion (2081A) may be in a recessed or grooved shape from the side (2071) of the circuit board (2800). For example, the first portion (2081A) may be in a recessed or grooved shape from the bottom surface (2075A) of the groove (2075) of the circuit board (2800). For example, the first portion (2081A) may be in a curved shape. For example, the first part (2081A) may be semicircular or semi-elliptical. For example, the first part (2081A) may be in the form of a semicircular or semi-elliptical via.

[0272] The terminal (2811) may include a second part (2081B) formed on the lower surface (2800A) of the circuit board (2800). The second part (2081B) may be connected to the first part (2081A). The second part (2081B) may be connected to the lower or bottom portion of the first part (2081A). The second part (2081B) may be formed in an area of ​​the lower surface (2800A) of the circuit board (2800) adjacent to the first part (2081A). The second part (2081B) may be formed to surround the bottom portion of the first part (2081A).

[0273] The terminal (2811) may include a third part (2081C) formed on the upper surface (2800B) of the circuit board (2800). The third part (2081C) may be connected to the first part (2081A). The third part (2081C) may be connected to the upper or top surface of the first part (2081A). The third part (2081C) may be formed in an area of ​​the upper surface (2800B) of the circuit board (2800) adjacent to the first part (2081A). The third part (2081C) may be formed to surround the top surface of the first part (2081A). In another embodiment, the terminal (2811) may include at least one of the first to third parts (2081A to 2081C).

[0274] The terminal portion (2253) may overlap with the groove (2075) of the circuit board (2800) in the direction of the optical axis. A second portion (2253B) of the terminal portion (2253) may be placed within the groove (2075) of the circuit board (2800). The groove (2075) may include a first opening that opens toward the upper surface of the circuit board (2800). Spatial interference between the terminal portion (2253) and the circuit board (2800) can be avoided by the first opening of the groove (2075).

[0275] The terminal (2251) of the terminal portion (2253) may be placed within the groove (2075) of the circuit board (2800). The second portion (2253B) of the terminal portion (2253) may overlap with the groove (2075) of the circuit board (2800) in the direction of the optical axis. The depth of the groove (2075) may be greater than the thickness of the terminal portion (2253). In another embodiment, the depth of the groove (2075) may be equal to the thickness of the terminal portion (2253). The depth of the groove (2075) may be the distance between the side (2071) of the circuit board (2800) and the bottom surface (2075A) of the groove (2075) in a direction perpendicular to the direction of the optical axis.

[0276] The second portion (2253B) of the terminal portion (2253) may be placed within the groove (2075) of the circuit board (2800), and the second surface (2053B) of the terminal portion (2253) may be located inside the side surface (2071) of the circuit board (2800) relative to the side surface (2071) of the circuit board (2800). That is, the second surface (2053B) of the terminal portion (2253) may not protrude outward relative to the side surface (2071) of the circuit board (2800). In another embodiment, the depth of the groove (2075) may be the same as the thickness of the terminal portion (2253).

[0277] The camera device (2200) may include a conductive adhesive (2903) that joins the terminal (2251) of the terminal portion (2253) of the circuit board (2250) and the terminal (2811) of the circuit board (2800). For example, the conductive adhesive (2903) may be solder. The terminal (2251) of the terminal portion (2253) of the circuit board (2250) and the terminal (2811) of the circuit board (2800) may be electrically connected by the conductive adhesive (2903).

[0278] Referring to FIGS. 44a and FIGS. 44b, when the lens driving device (100-2) and the circuit board (2800) are combined by the adhesive (612), the conductive adhesive (2903) can be applied to the lower surface (2800A) of the circuit board (2800) and can be applied between the terminal (2251) of the terminal part (2253) and the terminal (2811) of the circuit board (2800).

[0279] In order to apply a conductive adhesive (2903) to the lower surface (2800A) of the circuit board (2800), the groove (2075) of the circuit board (2800) may include a second opening that opens to the lower surface (2800A) of the circuit board (2800).

[0280] Also, referring to FIG. 44B and FIG. 45, the reinforcing member (280) may include a relief portion (2048) that exposes a terminal (2811) of the circuit board (2800). The relief portion (2048) may be a recessed groove from the side of the reinforcing member (280). In another embodiment, the relief portion (2048) may be in the form of a hole. To apply a conductive adhesive (2903) to the lower surface of the circuit board (2800), the relief portion (2048) may be open to the upper and lower surfaces of the reinforcing member (280). The relief portion (2048) may expose the conductive adhesive (2903).

[0281] Additionally, the escape portion (2048) may be formed in a two-stage structure. For example, the escape portion (2048) may include a first groove (2048A) that is recessed from the side of the reinforcing member (280) and a second groove (2048B) that is recessed from the bottom surface of the first groove (2048B). This two-stage structure of the escape portion (2048) is intended to stably support the circuit board (2800) by maximizing the area where the reinforcing member (280) supports the circuit board (2800) by minimizing the area where the reinforcing member (280) escapes.

[0282] A conductive adhesive (2903) may be placed between a terminal (2251) of a terminal portion (2253) and a terminal (2811) of a circuit board (2800), and may be in contact with the terminal (2251) of the terminal portion (2253) and the terminal (2811) of the circuit board (2800). The conductive adhesive (2903) may be in contact with a first portion (2081A) of the terminal (2811). The conductive adhesive (2903) may be in contact with a second portion (2081B) of the terminal (2811). The conductive adhesive (2903) may be in contact with a third portion (2081C) of the terminal (2811).

[0283] In order to place the conductive adhesive (2903), the base (210) may not be placed between the second part (2253B) of the terminal portion (2253) of the circuit board (2250) and the side (2071) of the circuit board (2800). The conductive adhesive (2903) may not overlap with the base (210) in a direction perpendicular to the optical axis direction or in a direction perpendicular to the rear surface (2053A) (or front surface (2053B), or the outer surface of the base (210)) of the terminal portion (2253).

[0284] The conductive adhesive (2903) may be placed within the groove (2075) of the circuit board (2800). The conductive adhesive (2903) may overlap with the groove (2075) of the circuit board (2800) in the direction of the optical axis. The conductive adhesive (2903) may be placed inside the side (2071) relative to the side (2071) of the circuit board (2800).

[0285] The conductive adhesive (2903) may be located inside the outer surface (302A) of the side plate (302) of the cover member (300). The conductive adhesive (2903) may not overlap with the outer surface (302A) of the side plate (302) of the cover member (300) in the optical axis direction. The conductive adhesive (2903) may overlap with the coil (230) in the optical axis direction.

[0286] In the embodiment, the side (2071) of the circuit board (2800) can be designed so that it does not protrude outward from the side plate (302) with respect to the outer surface (302A) of the side plate (302) of the cover member (300). In the embodiment, the size can be reduced in a direction perpendicular to the optical axis direction of the camera device (2200).

[0287] In the embodiment, a conductive adhesive (2903) can be positioned inside the outer surface (302A) of the side plate (302) of the cover member (300) based on the outer surface (302A) of the side plate (302), and as a result, the size of the circuit board (2800) in a direction perpendicular to the optical axis can be designed to be the same as or smaller than the size in a direction perpendicular to the optical axis of the lens driving device (100-2).

[0288] The circuit board (2250) may include a pad (2008) disposed on the terminal portion (2253). An opening (304) of the cover member (300) may expose at least a portion of the second surface (2053B) of the terminal portion (2253). The opening (304) may expose the pad (2008) of the terminal portion (2253). The opening (304) of the cover member (300) may overlap with the pad (2008) in a direction perpendicular to the optical axis direction.

[0289] The pad (2008) may be a test pad. The pad (2008) may be used as an electrical port (or connector) for testing the camera device (2200). The pad (2008) may be positioned higher than the terminal (2251) of the terminal section (2253). The pad (2008) may be placed in the first part (2253A) of the terminal section (2253). In another embodiment, at least a portion of the pad (2008) may overlap with the terminal (2251) of the terminal section (2253) in a direction perpendicular to the optical axis direction.

[0290] The pad (2008) may be electrically connected to the terminal (2251). The terminal portion (2253) may include wiring for electrically connecting the pad (2008) and the terminal (2251). The pad (2008) may include pads (2008-1 to 2008-N) corresponding to the terminals (2251-1 to 2251-N).

[0291] FIG. 48a shows a stacked cross-sectional view according to one embodiment of the terminal portion (2253) of the circuit board (2250) and the circuit board (2800). In FIG. 48a, the stacked structure of the circuit board (2250) may be the same as the stacked structure of the terminal portion (2253).

[0292] Referring to FIG. 48a, the terminal portion (2253) may include an insulating layer (2005A), a first conductive layer (92-1) disposed on one side (or lower side) of the insulating layer (2005A), a second conductive layer (92-2) disposed on the other side (or upper side) of the insulating layer (2005A), and a terminal (2251) disposed on one side (or lower side) of the first conductive layer (92-1) and in contact with the first conductive layer (92-1).

[0293] The insulating layer (2005A) may be a flexible insulating layer. For example, the insulating layer (2005A) may include a flexible resin, such as polyimide. Each of the conductive layers (92-1, 92-2) may be a copper foil, wiring, or conductive pattern layer for transmitting electrical signals. For example, the conductive layers (92-1, 92-2) may be formed of a conductive metal, such as copper, aluminum, indium, gold, silver, tungsten, or an alloy of at least two of these.

[0294] The terminal portion (2253) may include a pad (2008) that is positioned on one side (or upper side) of the second conductive layer (92-2) and contacts the second conductive layer (92-2). The terminal portion (2253) may include a contact (95A) (or via) that connects the first conductive layer (92-1) and the second conductive layer (92-2). The contact (95A) may penetrate the insulating layer (2005A) to connect the first conductive layer (92-1) and the second conductive layer (92-2).

[0295] The terminal portion (2253) may include a first cover layer (2093A) disposed on the first conductive layer (92-1) and a second cover layer (2093B) disposed on the second conductive layer (92-2). Each of the cover layers (93A, 93B) may be formed of an insulating material, such as solder resist. The terminal portion (2253) may include a third cover layer (93C) that surrounds the bottom of the terminal portion (2253). The third cover layer (93C) may be connected to the first cover layer (2093A) and the second cover layer (2093B).

[0296] The circuit board (2800) may include a plurality of conductive layers (91-1 to 91-4). FIG. 20a illustrates four conductive layers stacked sequentially, but in other embodiments, the number of conductive layers may be two, three, or five or more.

[0297] The circuit board (2800) may include insulating layers (2006A to 2006C) disposed between a plurality of conductive layers. FIG. 48a illustrates three insulating layers disposed between the conductive layers, but in other embodiments, the number of insulating layers may be determined according to the number of conductive layers and may be one or more. The insulating layer may be replaced with "insulating film" or "insulating film." The insulating layer (2006B) may be a flexible insulating layer. For example, the insulating layer (2006B) may include a flexible resin, such as polyimide. Additionally, the insulating layers (2006A, 2006C) may be rigid insulating layers. The rigid insulating layer may include a rigid resin, such as prepreg. Additionally, for example, the rigid insulating layer may include at least one of prepreg and coverlay. For example, the coverlay may include resin. In addition, for example, the coverlay may include a resin and an adhesive. For example, the resin may be polyimide. For example, the coverlay may be formed in the form of a film or a sheet.

[0298] The circuit board (2800) may include a cover layer (2094A, 2094B) disposed on the outermost conductive layer (e.g., 91-1, 91-4) to protect the conductive layers (91-1 to 91-4) from external shocks, etc. For example, the circuit board (2800) may include a first cover layer (94A) disposed below the lowest conductive layer (91-1) and a second cover layer (94B) disposed on the uppermost conductive layer (91-4). The circuit board (2800) may include a contact or via connecting at least two of the conductive layers (91-1 to 91-4) to each other. In this case, the contact or via may penetrate at least one of the insulating layers (2006A to 2006C).

[0299] The circuit board (2800) may include a terminal (2811) that contacts at least one of the first to fourth conductive layers (91-1 to 91-4). For example, the terminal (2811) may contact the first to fourth conductive layers (91-1 to 91-4). For example, the terminal (2811) may be formed on the side (2071), bottom surface (2800A), or top surface (2800B) of the circuit board (2800) to contact at least one of the first to fourth conductive layers (91-1 to 91-4) by a plating process or the like. The terminal (2811) may include first to third portions (2081A to 2081C).

[0300] FIG. 48b shows a stacked cross-sectional view according to another embodiment of the terminal portion (2253) of the circuit board (2250) and the terminal (2251) of the circuit board (2800).

[0301] Referring to FIG. 48b, the terminal (2811D) of the circuit board (2800) may be formed as a step having a step in a direction perpendicular to the optical axis or perpendicular to the side (2071) of the circuit board (2800). A conductive adhesive (2903) may be in contact with the step of the terminal (2811D).

[0302] The terminal (2811D) may include a first region (2811D1) that overlaps with one or more of the plurality of conductive layers (91-1 to 91-4) in a direction perpendicular to the optical axis or perpendicular to the side (2071) of the circuit board (2800), and a second region (2811D2) that overlaps with the remaining conductive layers (91-1 to 91-4) in a direction perpendicular to the optical axis or perpendicular to the side (2071) of the circuit board (2800).

[0303] For example, the first region (2811D1) may overlap with two or three adjacent conductive layers (e.g., 91-3, 91-4) among the plurality of conductive layers (91-1 to 91-4) in a direction perpendicular to the optical axis or perpendicular to the side (2071) of the circuit board (2800). The second region (2811D2) may overlap with the remaining conductive layers (e.g., 91-1, 91-2) among the plurality of conductive layers (91-1 to 91-4) in a direction perpendicular to the optical axis or perpendicular to the side (2071) of the circuit board (2800).

[0304] There may be a step difference between the first region (2811D1) and the second region (2811D2) of the terminal (2811D) of the circuit board (2800) in a direction perpendicular to the optical axis or in a direction perpendicular to the side (2071) of the circuit board (2800).

[0305] The conductive adhesive (2903) can be in contact with the first region (2811D1) and the second region (2811D2) of the terminal (2811D). In FIG. 48b, the contact area between the conductive adhesive (2903) and the terminal (2811D) can be increased. As a result, in the embodiment, the solderability and bonding strength of the conductive adhesive (2903) can be improved, and the reliability of the electrical connection can be increased.

[0306] FIG. 48c shows a stacked cross-sectional view according to another embodiment of the terminal portion (2253) of the circuit board (2250) and the terminal (2251) of the circuit board (2800).

[0307] Referring to FIG. 48c, the terminal (2811E) of the circuit board (2800) may include the terminal (2811D) of FIG. 48b, and a second part (2081B) and a third part (2081C) of the terminal (2811). Compared to FIG. 48b, the contact area between the conductive adhesive (2903) and the terminal (2811E) may be further increased, the solderability and bondability of the conductive adhesive (2903) may be further improved, and the reliability of the electrical bond may be higher.

[0308] FIG. 48d shows a stacked cross-sectional view according to another embodiment of the terminal portion (2253) of the circuit board (2250) and the terminal (2251) of the circuit board (2800).

[0309] The terminal (2811F) of FIG. 48d may include a first part (2811A) of the terminal (2811), and the second part (811B) and third part (811C) of the terminal (2811) may be omitted.

[0310] In the embodiment, a terminal portion (2253) of the circuit board (2250) of the lens driving device (100-2) is disposed within a groove (2075) formed on the side (2071) of the circuit board (2800) that is electrically connected to the image sensor (810), and a conductive adhesive (2903) is disposed between a terminal (2251) formed on the rear surface (2053A) of the terminal portion (2253) and a terminal (2811) formed on the bottom surface of the groove (2075) of the circuit board (2800). As a result, in the embodiment, the conductive adhesive (2903) can be disposed inward from the outer surface (302A) of the side plate (302) of the cover member (300) relative to the outer surface (302A) of the side plate (302), and the size can be reduced in a direction perpendicular to the optical axis direction of the camera device (2200).

[0311] In addition, in the embodiment, the terminal (2251) of the terminal part (2253) and the terminal (2811) of the circuit board (2800) are arranged parallel to each other, and since a conductive adhesive (2903) is applied or injected into the space between the terminal (2251) and the terminal (2811), tilting of the lens driving device (100-2) caused by the injection process of the conductive adhesive can be prevented.

[0312] In addition, in the embodiment, the space between the terminal (2251) of the terminal part (2253) and the terminal (2811) of the circuit board (2800) is filled with a conductive adhesive (2903), so that the path for foreign substances to penetrate can be blocked, and thereby, foreign substances can be prevented from penetrating into the interior of the camera device (2200).

[0313] In addition, in the embodiment, the solderability of the conductive adhesive (2903) can be improved, and the reliability of the electrical bonding can be increased. In addition, in the embodiment, the bonding strength between the terminal (2251) of the terminal portion (2253) of the circuit board (2250) and the terminal (2811) of the circuit board (2800) by the conductive adhesive (2903) can be increased, and as a result, the reliability against impact can be improved.

[0314] In addition, the camera device (200) according to the embodiment may be included in an optical instrument that aims to increase the visual acuity of the eye by using light characteristics such as reflection, refraction, absorption, interference, and diffraction to form an image of an object in space, or to record and reproduce an image by a lens, or to perform optical measurement, propagation or transmission of an image, etc. For example, the optical instrument according to the embodiment may be a mobile phone, a smartphone, a portable smart device, a digital camera, a laptop computer, a digital broadcasting terminal, a PDA (Personal Digital Assistants), a PMP (Portable Multimedia Player), a navigation device, etc., but is not limited thereto, and any device for taking images or photos is possible.

[0315] FIG. 49 shows a perspective view of an optical device (200A) according to an embodiment, and FIG. 50 shows a configuration diagram of the optical device (200A) shown in FIG. 49.

[0316] Referring to FIGS. 49 and 50, the optical device (200A) may include a body (850), a wireless communication unit (710), an A / V input unit (720), a sensing unit (740), an input / output unit (750), a memory unit (760), an interface unit (770), a control unit (780), and a power supply unit (790).

[0317] The body (850) illustrated in FIG. 49 is in the form of a bar, but is not limited thereto and may have various structures such as a slide type, folder type, swing type, swivel type, etc., in which two or more sub-bodies are combined to move relative to each other.

[0318] The body (850) may include a case (casing, housing, cover, etc.) forming the exterior. For example, the body (850) may be divided into a front case (851) and a rear case (852). Various electronic components of the terminal may be embedded in the space formed between the front case (851) and the rear case (852).

[0319] The wireless communication unit (710) may be configured to include one or more modules that enable wireless communication between the optical device (200A) and the wireless communication system or between the optical device (200A) and the network where the optical device (200A) is located. For example, the wireless communication unit (710) may be configured to include a broadcast reception module (711), a mobile communication module (712), a wireless internet module (713), a short-range communication module (714), and a location information module (715).

[0320] The A / V (Audio / Video) input unit (720) is for inputting an audio signal or a video signal and may include a camera (721) and a microphone (722), etc. The camera (721) may include a camera device (200) according to the embodiment.

[0321] The sensing unit (740) can generate a sensing signal to control the operation of the optical device (200A) by detecting the current state of the optical device (200A), such as the open / closed state of the optical device (200A), the position of the optical device (200A), whether there is user contact, the orientation of the optical device (200A), and the acceleration / deceleration of the optical device (200A). For example, if the optical device (200A) is in the form of a slide phone, it can sense whether the slide phone is open or closed. In addition, it is responsible for sensing functions related to whether power is supplied by the power supply unit (790) and whether an external device is connected to the interface unit (770).

[0322] The input / output unit (750) is intended to generate input or output related to sight, hearing, or touch. The input / output unit (750) can generate input data for controlling the operation of the optical device (200A) and can also display information processed by the optical device (200A). The input / output unit (750) may include a keypad unit (730), a display module (751), an audio output module (752), and a touch screen panel (753). The keypad unit (730) can generate input data by keypad input.

[0323] The display module (751) may include a plurality of pixels whose color changes according to an electrical signal. For example, the display module (751) may include at least one of a liquid crystal display, a thin film transistor-liquid crystal display, an organic light-emitting diode, a flexible display, and a 3D display.

[0324] The sound output module (752) can output audio data received from the wireless communication unit (710) in call signal reception, call mode, recording mode, voice recognition mode, or broadcast reception mode, or output audio data stored in the memory unit (760).

[0325] The touch screen panel (753) can convert a change in capacitance caused by a user's touch on a specific area of ​​the touch screen into an electrical input signal.

[0326] The memory unit (760) may store a program for processing and controlling the control unit (780), and may temporarily store input / output data (e.g., phone book, message, audio, still image, photo, video, etc.). For example, the memory unit (760) may store an image captured by the camera (721), such as a photo or video.

[0327] The interface section (770) serves as a passage connecting to an external device connected to the optical device (200A). The interface section (770) receives data from the external device, supplies power to transmit it to each component inside the optical device (200A), or allows data inside the optical device (200A) to be transmitted to the external device. For example, the interface section (770) may include a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting a device equipped with an identification module, an audio I / O (Input / Output) port, a video I / O (Input / Output) port, and an earphone port.

[0328] The control unit (780) can control the overall operation of the optical device (200A). For example, the control unit (780) can perform related control and processing for voice calls, data communication, video calls, etc. The control unit (780) may be equipped with a multimedia module (781) for multimedia playback. The multimedia module (781) may be implemented within the control unit (180) or may be implemented separately from the control unit (780). The control unit (780) can perform pattern recognition processing to recognize handwriting input or drawing input performed on a touchscreen as characters and images, respectively.

[0329] The power supply unit (790) can receive external power or internal power under the control of the control unit (780) and supply power necessary for the operation of each component.

[0330] The features, structures, effects, etc. described in the embodiments above are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. exemplified in each embodiment may be combined or modified and implemented in other embodiments by a person skilled in the art to which the embodiments belong. Therefore, details regarding such combinations and modifications should be interpreted as being included within the scope of the present invention.

[0331] The embodiment can be used in camera devices and optical instruments that can reduce the size in a direction perpendicular to the optical axis and prevent cracking of the conductive adhesive connecting the terminal of the lens driving device and the terminal of the circuit board on which the image sensor is placed.

Claims

1. A first circuit board including a first terminal; A lens driving device comprising a base disposed on the first circuit board, and a second circuit board coupled to the base and including a second terminal; and A conductive adhesive comprising a first terminal and a second terminal, and The above second circuit board is, A body disposed on the upper surface of the above base; and A terminal portion comprising a first portion bent from the body and disposed on the outer surface of the base, and a second portion bent from the first portion and disposed below the lower surface of the base, The above second terminal is a camera device comprising a first region disposed in the first portion of the terminal portion and a second region disposed in the second portion of the terminal portion.

2. In Paragraph 1, The above terminal portion is a camera device including a bent portion located between the first portion and the second portion.

3. In Paragraph 1, The second terminal above includes a third region connecting the first region and the second region, and The above conductive adhesive is a camera device in contact with the first to third regions of the second terminal.

4. In Paragraph 1, The above conductive adhesive is, A first region disposed outside the first region based on the first region of the second terminal; and A camera device comprising a second region disposed inside the first region based on the first region of the second terminal.

5. In Paragraph 4, A camera device in which the length of the conductive adhesive in a direction perpendicular to the outer surface of the base is smaller than the length of the second region of the conductive adhesive in a direction perpendicular to the outer surface of the base.

6. In Paragraph 4, The above lens driving device is, A cover member comprising a top plate and a side plate connected to the top plate; and It includes a bobbin disposed within the cover member and disposed on the base, The above conductive adhesive is a camera device that does not overlap with the outer surface of the side plate of the cover member in the direction of the optical axis.

7. In Paragraph 6, The above lens driving device is a camera device comprising a coil that is electrically connected to the second circuit board and moves the bobbin in a direction perpendicular to the optical axis.

8. In Paragraph 7, The second region of the second terminal is a camera device that overlaps with the coil in the direction of the optical axis.

9. In Paragraph 1, A camera device in which the length of the first region of the second terminal in the direction from the upper surface to the lower surface of the base is greater than the length of the second region of the second terminal extended by bending.

10. In Paragraph 1, The first region of the second terminal includes a portion where the conductive adhesive is not disposed, and A camera device in which the length of the portion where the conductive adhesive is not disposed in the direction from the upper surface to the lower surface of the base is greater than the length of the second region of the second terminal that is bent and extended.

Images