Infrared imaging device coupling systems and methods
By integrating a conductive layer within the PCB recess to thermally couple the infrared focal plane array, the infrared imaging system achieves enhanced thermal management and electrical signal integrity, addressing thermal and structural challenges in infrared imaging.
WO2026128739A1PCT designated stage Publication Date: 2026-06-18TELEDYNE FLIR COMMERICAL SYST INC
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- TELEDYNE FLIR COMMERICAL SYST INC
- Filing Date
- 2025-12-11
- Publication Date
- 2026-06-18
Smart Images
Figure US2025059250_18062026_PF_FP_ABST
Abstract
Techniques are provided for facilitating infrared imaging device coupling systems and methods. In one example, an infrared imaging device includes a printed circuit board (PCB) having a recess defined therein. The infrared imaging device further includes a conductive layer disposed within the recess and configured to provide a thermal path. The infrared imaging device further includes an infrared focal plane array (FPA) disposed at least partially within the recess and disposed on and thermally coupled to the conductive layer. The infrared FPA includes a detector array comprising a plurality of infrared detectors. Each infrared detector is configured to detect electromagnetic radiation. The infrared FPA further includes a readout circuit configured to perform a readout to obtain image data from each of the plurality of infrared detectors. The readout circuit is disposed on the conductive layer. Related methods and systems are also provided.
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