Infrared imaging device coupling systems and methods
By integrating a conductive layer within the PCB recess to thermally couple the infrared focal plane array, the infrared imaging system achieves enhanced thermal management and electrical signal integrity, addressing thermal and structural challenges in infrared imaging.
WO2026128739A1 Publication Date: 2026-06-18TELEDYNE FLIR COMMERICAL SYST INC
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Patent Information
- Application Number
- PCT/US2025/059250
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-13
- Filing Date
- 2025-12-11
- Publication Date
- 2026-06-18
AI Technical Summary
Technical Problem
Infrared imaging systems face challenges in thermal management and electrical signal integrity due to the absence of effective thermal paths and long wire bonds, which can lead to radiometric errors and structural vulnerabilities.
Method used
Incorporating a conductive layer within the printed circuit board recess to thermally couple the infrared focal plane array, providing a thermal path and reducing wire bond length, thereby enhancing thermal uniformity and electrical signal integrity.
Benefits of technology
The solution improves thermal imaging characteristics by reducing radiometric errors and increases structural resilience through improved thermal uniformity and shorter wire bonds, leading to more reliable infrared imaging performance.
✦ Generated by Eureka AI based on patent content.
Abstract
Techniques are provided for facilitating infrared imaging device coupling systems and methods. In one example, an infrared imaging device includes a printed circuit board (PCB) having a recess defined therein. The infrared imaging device further includes a conductive layer disposed within the recess and configured to provide a thermal path. The infrared imaging device further includes an infrared focal plane array (FPA) disposed at least partially within the recess and disposed on and thermally coupled to the conductive layer. The infrared FPA includes a detector array comprising a plurality of infrared detectors. Each infrared detector is configured to detect electromagnetic radiation. The infrared FPA further includes a readout circuit configured to perform a readout to obtain image data from each of the plurality of infrared detectors. The readout circuit is disposed on the conductive layer. Related methods and systems are also provided.
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