A primer composition free of organic solvents and soluble in cutting oil

A primer composition with a nitrogen-containing compound and copper-based catalyst, soluble in cutting oil, addresses adhesion issues on low surface energy substrates, providing quick fixture and high shear strength for efficient laminated stack bonding.

WO2026128887A1PCT designated stage Publication Date: 2026-06-18HENKEL KGAA +1
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
HENKEL KGAA
Filing Date
2025-12-12
Publication Date
2026-06-18

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Abstract

The present invention relates to a primer composition that is soluble in cutting oil while being free of organic solvents. The primer composition when combined with an acrylic-based adhesive composition has high tensile strength and quick fixture times and is particularly useful on low surface energy or inactive metal substrates such as C5 electrical steel coated substrate. The primer composition includes a nitrogen-containing compound, a copper-based catalyst, and one or more monomer components, the monomer components including a mixture of hydroxypropyl methacrylate (HPMA) and 3,3,5-trimethylcyclohexyl methacrylate (TMCHMA).
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