Method for the multi-stage production of electronic components on a substrate

Abstract

The invention relates to a method for the multi-stage production of an electronic component on a substrate (10), which passes through at least a first processing station (50) and a second processing station (60) of at least one production plant (100), wherein the substrate (10) is strip-shaped and flexible. The invention also relates to a production plant (100) for carrying out such a method. In order to align a second processing step carried out in the second processing station (60) to a first processing step carried out with a first processing tool (55) in the first processing station (50), a contrast region (21) is applied and / or introduced in the longitudinal direction (lo) on and / or into a surface of the substrate (10) at a first edge region (11) and / or a second edge region (12), and at least one marking structure (31, 32) is introduced into the contrast region (21). In the second processing station (60), a position of the marking structure (31, 32) in the transverse direction (tr) of the substrate (10) is detected, and positioning data of a second processing tool (61) are positioned and / or calibrated in the second processing station (60) relative to the position of the marking structure (31, 32).

Description

[0001] Heliatek GmbH P115W0

[0002] December 17, 2025

[0003] 1 / 31

[0004] Method for the multi-stage fabrication of electronic components on a substrate

[0005] The invention relates to a method for the multi-stage production of electronic components on a substrate that is ribbon-shaped and flexible, wherein the substrate passes through at least a first and a second processing station, and to a manufacturing plant for the multi-stage production of electronic components.

[0006] A particular problem with multi-stage laser processing systems is positioning the substrate to be processed as precisely as possible under different operating conditions and / or in different processing stations, and directing the laser beam as accurately as possible and with defined beam quality onto the respective surface areas to be processed. These problems become increasingly critical the smaller the structures to be created or modified on the substrate become.

[0007] One preferred application is the production of thin-film solar cells on a flexible substrate using a roll-to-roll process.

[0008] Thin-film solar cells are manufactured using multi-stage processes with production facilities that have several processing stations, through which a substrate passes sequentially. Thin-film solar cells have a rigid or flexible substrate that serves as a support for layer systems of thin films deposited on it. Thin-film solar cells, especially organic solar cells, consist of a multitude of cells separated by transition regions, made up of a sequence of thin films with at least one photoactive layer, which are preferably deposited in a vacuum or processed from a solution. Within the cells, the conversion of radiant energy into electrical energy takes place when irradiated with light. Heliatek GmbH P115W0

[0009] December 17, 2025

[0010] 2 / 31

[0011] Electrical connection can be achieved through metal layers, transparent conductive oxides and / or transparent conductive polymers.

[0012] To form individual cells, during manufacturing, individual layers of the layered system are structured, i.e., grooves are created, whereby material from a thin layer is removed to replace it, if necessary, with another material, for example, an electrically conductive material. Several separation lines or grooves are created in the layered system in a specific sequence. The separation lines must be precisely executed and must not overlap, as this can lead to electrical short circuits or open circuits, which can cause the failure of individual cells or the entire solar cell. Therefore, sufficiently large lateral safety distances are provided between adjacent separation lines during manufacturing. The larger the safety distances, the smaller the remaining area usable for energy generation.Precise placement of the dividing lines is therefore essential for the efficiency of thin-film solar cells.

[0013] DE 10 2004 014 046 Al discloses a photoactive device, in particular a solar cell, consisting of organic layers of one or more stacked pi-, ni- and / or pin- diodes.

[0014] In the production of thin-film solar cells using a roll-to-roll process, multiple such solar cells are applied sequentially to a ribbon-like, flexible substrate. The substrate is moved through several processing stations, each performing a processing operation, particularly a structuring operation. This requires extremely precise alignment, especially micrometer-accurate alignment, between the successive processing operations. The positioning of the processing tools relative to existing structures on the substrate is of particular importance. Heliatek GmbH P115W0

[0015] December 17, 2025

[0016] 3 / 31

[0017] DE 10 2012 223 289 B4 discloses a method and a manufacturing plant for the production of electronic components, in which a camera system captures the section of the substrate to be processed before each processing station and a subsequent laser processing operation is controlled depending on the camera signals or signals derived therefrom.

[0018] A disadvantage of the prior art, however, is that structures introduced or applied to the substrate are only inadequately detectable by camera systems due to weak optical contrast differences. This means that the positioning of sequential processing operations performed in multiple processing stations relative to each other, or the alignment relative to structures already present on the substrate, is not sufficiently precise. This particularly affects transparent substrates, such as those commonly used in the production of solar cells. Certain processing operations, such as laser structuring, however, require extremely precise alignment, especially micrometer-level accuracy.

[0019] The invention is therefore based on the objective of providing a method for the multi-stage production of an electronic component on a substrate, whereby the aforementioned disadvantages do not occur, and wherein it is particularly ensured that machining steps carried out successively with different machining tools in successive, in particular successively arranged, machining stations can be reliably and reproducibly aligned relative to each other with high accuracy.

[0020] In the production of thin-film solar cells using a roll-to-roll process, a multiple of these solar cells are applied sequentially to a ribbon-like, flexible substrate. The substrate is moved through several processing stations, each performing a processing operation, particularly a structuring operation. This requires extremely precise alignment, especially micrometer-precise alignment, between the successive processing operations. Heliatek GmbH P115W0

[0021] December 17, 2025

[0022] 4 / 31

[0023] The positioning of the machining tools relative to structures already present on the substrate is of particular importance in order to enable precise machining in successive machining steps.

[0024] The problem is solved by the subject matter of the independent claims. Advantageous embodiments result from the dependent claims.

[0025] The problem is solved in particular by providing a method for the multi-stage fabrication of an electronic component on a substrate, which passes through at least one first processing station and one second processing station of at least one manufacturing plant, wherein the substrate is ribbon-shaped and flexible. The method comprises the following steps: a) applying and / or introducing a contrast area at a first edge region and / or a second edge region in the longitudinal direction on and / or into a surface of the substrate; b) introducing at least one marking structure into the contrast area using a structuring tool; c) processing a section on the surface of the substrate in a first processing step with a first processing tool in the first processing station; d) transporting the substrate from the first processing station to the second processing station;e) Determining the position of the marking structure in the transverse direction of the substrate, and positioning and / or calibrating positioning data of a second machining tool in the second machining station relative to the position of the marking structure; and f) machining the section in a second machining step with the second machining tool in the second machining station.

[0026] In the context of the present invention, an electronic component also includes a semi-finished product of an electronic component. Heliatek GmbH P115W0

[0027] December 17, 2025

[0028] 5 / 31 According to the invention, it is preferably provided that the steps are carried out in a temporal sequence according to the order a ) , b ) , c ) , d) , e ) , f ), or alternatively according to the order a ) , c ) , b ) , d) , e ) , f ).

[0029] A ribbon-shaped substrate is understood to be, in particular, a rectangular substrate with a length and a width, where the length of the substrate is greater than the width. A flexible substrate is understood to be, in particular, a substrate that is bendable and / or stretchable within a certain range. Preferably, the substrate is bendable along its entire length about an axis running parallel to the substrate plane and perpendicular to the longitudinal direction, so that it can be wound into a roll with a bending radius of 1 m or less.

[0030] A contrast region is understood to be, in particular, a spatially defined surface area of ​​a substrate that exhibits different optical properties compared to the adjacent surface of the substrate, especially the rest of the substrate's surface. Preferably, the contrast region exhibits a contrast to the adjacent surface; in particular, the contrast region for electromagnetic radiation exhibits a different reflection and / or absorption coefficient in at least one wavelength range, preferably in the visible spectrum with adjacent UV and IR ranges, compared to the adjacent surface.

[0031] In a preferred embodiment, the contrast area is applied as a layer to the surface of the substrate. In an alternatively preferred embodiment, the contrast area is incorporated as a structure into the surface of the substrate.

[0032] A boundary region of a substrate is understood to be, in particular, a spatially delimited surface area of ​​the substrate that extends along an edge of the substrate. Preferably, the substrate has a first boundary region at one edge and a second boundary region at an opposite edge in the longitudinal direction. In a preferred embodiment, the first boundary region is Heliatek GmbH P115W0

[0033] December 17, 2025

[0034] 6 / 31 and / or the second edge area of ​​the substrate is not processed in the first processing step at the first processing station and / or in the second processing step at the second processing station.

[0035] The longitudinal direction (lo) of a ribbon-shaped substrate is defined by the longitudinal direction, in particular the direction of the longest extent of the ribbon-shaped substrate, which corresponds in particular to a direction of travel of the substrate in the production plant from a first processing station to a second processing station. The transverse direction (tr) of the substrate is correspondingly defined by a direction perpendicular to the longitudinal direction in the substrate plane.

[0036] A marking structure is understood to be, in particular, a spatially defined structure, preferably a two-dimensional or three-dimensional structure, within the contrast area. Preferably, the marking structure exhibits different optical properties compared to the adjacent surface of the contrast area, in particular a different reflection and / or absorption coefficient for electromagnetic radiation in at least one wavelength range.

[0037] In a preferred embodiment, the marking structure is incorporated into the contrast area. In an alternatively preferred embodiment, the marking structure is applied to the contrast area.

[0038] In a preferred embodiment, the dimensions of the marking structure in the transverse and / or longitudinal direction are smaller than the corresponding dimensions of the contrast area, with the marking structure preferably lying entirely within the contrast area. In a preferred embodiment, the contrast of the contrast area is designed such that a sensor or camera system can detect a difference between two surfaces; in particular, when the marking structure arranged in the contrast area is imaged with a sensor or camera system, differences in brightness are observed between images of the marking structure and the contrast area. Heliatek GmbH P115W0

[0039] December 17, 2025

[0040] 7 / 31

[0041] In a preferred embodiment, the marking structure is introduced by partially or completely removing corresponding parts of the contrast area. Thus, when corresponding parts of the contrast area are completely removed, exposing the substrate located beneath the contrast area, the marking structure exhibits the same optical properties as the substrate.

[0042] In a preferred embodiment, the marking structure is introduced by changing the optical properties of individual areas of the contrast area, in particular by changing the reflection and / or absorption coefficient for electromagnetic radiation in at least one wavelength range.

[0043] In a preferred embodiment, the marking structure is continuous in the longitudinal direction, preferably in the form of a line or strip running parallel to the edge of the substrate.

[0044] In an alternative preferred embodiment, the marking structure is not continuous in the longitudinal direction.

[0045] A processing step is understood to be an operation to be performed on the substrate, in particular structuring for the introduction of trench or parting line structures, especially by means of a laser, or for the application of structures, especially by etching, or a coating for the application of single or multiple layers. In a preferred embodiment, a processing step is laser structuring.

[0046] In a preferred embodiment, the marking structure is a two-dimensional structure, preferably a line, either continuous or broken, linearly curved or zigzag-shaped, an open or closed planar curve, in particular a polygon or an ellipse.

[0047] A section is understood to be, in particular, a flat area on the surface of the substrate next to the contrast area at the first edge area, especially the remaining Heliatek GmbH P115W0

[0048] December 17, 2025

[0049] 8 / 31

[0050] The surface of the substrate, wherein the section does not overlap with the contrast area at the first edge region. In particular, the section is arranged on the surface of the substrate between the contrast area at the first edge region and the contrast area at the second edge region, wherein the section does not overlap with the contrast areas, and in particular, the section lies outside the contrast area. Preferably, the section extends in the transverse direction substantially over the entire extent of the substrate less the transverse extent of the edge region occupied by the contrast area(s).

[0051] The inventive method for the multi-stage fabrication of an electronic component offers advantages compared to the prior art. By applying and / or introducing the contrast area at a first edge region and / or a second edge region in the longitudinal direction on a substrate surface and by introducing at least one marking structure into the contrast area, the positioning of the machining tools in subsequent machining stations is improved. In particular, the detection of the marking structure is more reliable due to the enhanced optical contrast to the contrast area. A suitable selection of the marking structures enables micrometer-precise positioning of machining tools relative to the marking in subsequent machining stations. Higher accuracy is achieved, especially on flexible substrates.For ribbon-like substrates, such as those used in a roll-to-roll process, the substrate is successively guided through the respective processing station. This method allows for the positioning of processing tools along the entire longitudinal extent of the substrate, adapting to random transverse variations in the substrate's path. A further advantage lies in the improved detection of marking structures on transparent substrates, especially transparent films, since marking structures applied in the contrast area can be detected with a high recognition rate in subsequent processes, enabling the alignment of subsequent processing steps. Heliatek GmbH P115W0.

[0052] December 17, 2025

[0053] 9 / 31

[0054] In a preferred embodiment, between steps a) and b), the position of the contrast area is detected, preferably by means of a camera system, wherein, based on the detected position of the contrast area, the at least one marking structure is introduced into the contrast area. The introduction of the at least one marking structure, in particular, creates a contrast between the contrast area and the at least one marking structure, preferably a visually detectable contrast.

[0055] In a preferred embodiment, in step e) the position of the marking structure is detected in the transverse direction and in the longitudinal direction of the substrate.

[0056] In a preferred embodiment, the substrate is transparent or largely transparent. This makes it more difficult to detect contrasts on the surface of the substrate.

[0057] In a preferred embodiment, at least two optoelectronic components are produced in series, at least in the longitudinal direction of the ribbon-shaped substrate.

[0058] In a preferred embodiment, a camera system, in particular a camera operating in the visible wavelength range of light or in the near-infrared range of light with an attached image recognition unit, is used to detect the position of the marking structure in step e). Alternatively, a radiation-sensitive sensor or photodetectors arranged in a transverse direction with an optional evaluation unit are used to detect the position of the marking structure.

[0059] According to a further development of the invention, it is provided that, prior to step c), in step cl), the position of the marking structure is detected in the transverse and longitudinal directions, and the first processing tool is positioned based on the detected position of the marking structure. In a preferred embodiment, the position of the marking structure in the transverse and longitudinal directions is detected by means of a camera system. Heliatek GmbH P115W0

[0060] December 17, 2025

[0061] 10 / 31

[0062] According to a further development of the invention, it is provided that before step a), preferably during or after unwinding the substrate from a roll, at least one longitudinally extending position of the substrate edge is detected in a step al), and based on the position of the substrate edge, the substrate is aligned in a transverse direction, in particular with respect to a pretreatment tool applying the contrast area.

[0063] According to a further development of the invention, it is provided that in step a) at least one start contrast area is applied to the surface of the substrate, wherein in step c) the position of the start contrast area is detected to determine a start position of the first processing step in the longitudinal direction.

[0064] A starting contrast region is understood to be, in particular, a spatially delimited surface area, especially of a substrate, that exhibits different optical properties compared to the adjacent surface, particularly for electromagnetic radiation, a different reflection and / or absorption coefficient in at least one wavelength range. Preferably, the starting contrast region is located outside the contrast region. This makes the starting contrast region visually clearly detectable in contrast to the contrast region. Alternatively, and preferably, the starting contrast region is located within the contrast region. Preferably, the starting contrast region is formed as a closed surface. Preferably, the starting contrast region has dimensions smaller than the transverse extent of the contrast region.

[0065] In a preferred embodiment, a circular or rectangular starting contrast area is applied to the surface of the substrate. Particularly in the case of a circular area, a clearly defined point within the circular area can be determined by optically capturing the area, especially with a camera system, using center of gravity determination, even if the circular area is blurred or incomplete. Preferably, in the first processing station, a Heliatek GmbH P115W0 is applied to the circular starting contrast area using the first processing tool.

[0066] December 17, 2025

[0067] 11 / 31 circular structure introduced, the center of which corresponds to the center of the circular area previously determined by means of centroid determination.

[0068] According to a further development of the invention, it is provided that in step b) a starting structure is introduced into the contrast area at the first edge area and / or the second edge area by means of the structuring tool, wherein in step e) the position of the starting structure is detected to determine a starting position of the second processing step in longitudinal direction ( lo).

[0069] A starting structure is understood to be, in particular, a spatially defined, preferably two-dimensional structure on a surface. Preferably, the starting structure has different optical properties compared to the adjacent surface, in particular a different reflection and / or absorption coefficient for electromagnetic radiation in at least one wavelength range. Preferably, the outer dimensions of the starting structure are smaller than the corresponding dimensions of the planar contrast area, so that the starting structure can be completely integrated within the contrast area.

[0070] According to a further development of the invention, it is provided that the first machining tool is used as a structuring tool.

[0071] According to a further development of the invention, the application of the contrast area to the first edge region and / or the second edge region on the surface of the substrate is carried out by means of a printing process. Preferably, the contrast area is applied by means of a direct high-pressure process, in particular a flexographic printing process.

[0072] In a preferred embodiment, a contrasting area with a color different from that of the substrate is printed onto the substrate, in particular onto the semi-transparent or opaque substrate. This results in a contrast between the Heliatek GmbH P115W0

[0073] December 17, 2025

[0074] 12 / 31

[0075] Contrast area and the surface of the substrate through different colors.

[0076] In a preferred embodiment, the contrast area is introduced into the surface of the substrate at the first edge region and / or the second edge region by means of a laser or a mechanical method.

[0077] According to a further development of the invention, the contrast area is applied as a strip in the longitudinal direction (l0) along the first edge region and / or the second edge region. In a preferred embodiment, the contrast area formed as a strip has a constant width.

[0078] According to a further development of the invention, it is provided that in step a) the contrast area is applied and / or introduced at the first edge area and the second edge area, and in step b) a first marking structure is introduced into the contrast area of ​​the first edge area and a second marking structure is introduced into the contrast area of ​​the second edge area, and wherein in step e) a position of the first marking structure and a position of the second marking structure are detected, a distance of the position of the first marking structure to the position of the second marking structure in the transverse direction is determined, and depending on the determined distance, a scaling in the transverse direction of the section to be processed in the second processing step is carried out.In particular, based on the determined distance, a scaling of a transverse extent of a structuring operation performed with the second processing tool is carried out.

[0079] Scaling is understood in particular to mean a size adjustment, whereby the extent of the section to be processed, in particular the extent of a structure to be introduced into the section with a processing tool, is reduced (in particular compressed) or increased (in particular stretched), corresponding to a deviation of the measured distance between the first and second marking structures from a predetermined distance. Preferably, the scaling is carried out exclusively in the transverse direction. Heliatek GmbH P115W0

[0080] December 17, 2025

[0081] 13 / 31 wherein the extent of the section to be machined remains unchanged in the longitudinal direction. Scaling the extent in a transverse direction in a second machining step carried out with the second machining tool is particularly advantageous on flexible substrates, since the substrates may be stretched or compressed in the transverse direction due to their flexibility, especially during or after transport to the second machining station.

[0082] According to a further development of the invention, it is provided that the introduction of the marking structure, the processing in the first processing step, and the processing in the second processing step are each carried out by means of a laser.

[0083] In a preferred embodiment, the substrate or the section of the substrate is transported after step c) by means of a transport device to the second processing station comprising the second processing tool. Preferably, the first processing station is arranged spatially separate from the second processing station. In a preferred embodiment, the first processing station is arranged in a first production plant and the second processing station in a spatially separate second production plant.

[0084] In a preferred embodiment, the first machining tool is the second machining tool, wherein preferably the transport device transports the substrate back to a starting position of the second machining step after completion of the first machining step.

[0085] The transport device can be designed as a type of conveyor belt or roller conveyor, on which the ribbon-like substrate is continuously transported from processing station to processing station. Alternatively or additionally, it can be provided that the substrate is wound into a roll after passing through a processing station, and this roll is then moved to the next processing station by means of a suitable transport vehicle, in particular a pallet truck, a forklift, a crane or an autonomously operating mobile robot, or by means of a stationary gripper arm.

[0086] December 17, 2025

[0087] 14 / 31 processing station, where the substrate wound onto a roll is unwound again and fed to the processing tool.

[0088] In a preferred embodiment, the first processing station is arranged in a first production plant and the second processing station is arranged in a second production plant that is spatially separate from the first. In an alternatively preferred embodiment, the first processing station and the second processing station form a single structural unit.

[0089] According to a further development of the invention, it is provided that in the first processing station, a first offset mark is introduced into the contrast area at the first edge region and / or the second edge region using the first processing tool, and in the second processing station, a second offset mark is introduced into the contrast area using the second processing tool, wherein a relative displacement of the second offset mark to the first offset mark is determined to detect an offset or drift, and the positioning of the second processing tool is adjusted to compensate for the offset or drift. Preferably, the first offset mark and the second offset mark are circular in shape.

[0090] A displacement mark, or in particular a drift mark, is understood to be a two-dimensional or spatially defined structure on the surface of the substrate. A displacement mark serves, in particular, to describe a deviation from a first position, specifically a position obtained by the second machining tool in the second machining station, from a position obtained by the first machining tool in the first machining station. The deviation can be the result of a discontinuous process, in particular a jump, or of a continuous process, in particular a drift.

[0091] Preferably, the offset mark has different optical properties compared to the adjacent surface, in particular a different reflection and / or absorption coefficient. Heliatek GmbH P115W0

[0092] December 17, 2025

[0093] 15 / 31 for electromagnetic radiation in at least one wavelength range. Preferably, the transverse dimension of the offset marker is smaller than the transverse dimension of the contrast area, whereby the offset marker can be placed completely within the contrast area. In particular, the transverse dimension of the offset marker is smaller than the transverse distance between the marking structure placed in the contrast area and the edge of the contrast area, whereby the offset marker can be placed next to the marking structure in the contrast area, preferably at a certain distance from the contrast area.

[0094] In a preferred embodiment, the dimensions of the first offset mark and the second offset mark are different; in particular, in the case of circular offset marks, the circle radius is different.

[0095] In a preferred embodiment, the second offset mark is placed in, on, around, or next to the first offset mark within the contrast area. In a preferred embodiment, the geometric shape of the first offset mark and the geometric shape of the second offset mark are different.

[0096] In a preferred embodiment, the substrate is aligned in a transverse direction in the second processing station after step d) and before step e), wherein at least one longitudinally extending position of the substrate edge is detected and the substrate is aligned in a transverse direction based on the position of the substrate edge in relation to the second processing tool.

[0097] In a preferred embodiment, the contrast area has a width in the transverse direction of 0.1% to 3%, preferably 0.3% to 1%, of the width of the substrate in the transverse direction. In a preferred embodiment, the contrast area has a transverse width of 1 mm to 10 mm, preferably 5 mm to 8 mm, most preferably 0.3 mm to 3 mm.

[0098] In a preferred embodiment, the contrast area is applied directly at the substrate edge. In an alternative embodiment, Heliatek GmbH P115W0

[0099] December 17, 2025

[0100] 16 / 31

[0101] In this embodiment, the contrast area is applied at a distance from the substrate edge; preferably, the distance of the contrast area to the substrate edge is at least 30% of the width of the contrast area in the transverse direction, or preferably at least 70% of the width of the contrast area in the transverse direction.

[0102] In a preferred embodiment, the contrast area is applied to the surface of the substrate using a bonding material, wherein the bonding material is arranged between the contrast area and the substrate.

[0103] A bonding material is understood to be, in particular, a material, preferably an adhesive, or a layer of a material, in particular an adhesive layer, by means of which an element is fixed, in particular glued, in particular two layers are glued together, so that these are bonded together in a manner that allows them to be connected.

[0104] In a preferred embodiment, the substrate is processed in at least one further processing station following the second processing station, with steps d) to f) being repeated in an analogous manner.

[0105] In a preferred embodiment, the substrate comprises a plurality of electronic components. The electronic components are arranged side by side and / or one behind the other on the substrate.

[0106] In a preferred embodiment, the method is used in a roll-to-roll process.

[0107] The object of the present invention is also achieved by providing a manufacturing system for the multi-stage production of an electronic component on a substrate, wherein the substrate is designed as a ribbon-shaped, flexible substrate, according to the method described above. The manufacturing system for carrying out the method has, in particular, the advantages already described in connection with the method. The manufacturing system comprises a pretreatment tool for applying a contrast area to a Heliatek GmbH P115W0

[0108] 17 . 12 . 2025

[0109] 17 / 31 first edge region and / or a second edge region on the surface of the substrate, a first processing station with a structuring tool for introducing at least one marking structure into the contrast area, and a first processing tool for processing a section on the surface of the substrate, as well as a second processing station with a second processing tool for processing the section, at least one camera system and at least one control unit connected to it, wherein the control unit is configured to control the second processing tool depending on the positions of marking structures introduced into the contrast area by means of the structuring tool as detected by the camera system. The manufacturing plant includes a transport device by means of which the substrate can be transported from the first processing station to the second processing station.

[0110] In a preferred embodiment, the structuring tool is the first machining tool.

[0111] In a preferred embodiment, the first processing station, in particular the structuring tool and / or the first processing tool, has at least one laser, wherein preferably the structuring tool and / or the first processing tool has an optical laser beam guidance and focusing device with galvanically driven deflection mirrors.

[0112] In a preferred embodiment, the pretreatment tool is a device for printing or applying the contrast area, in particular an inkjet printer, a rotary roll printer, or a laminating unit. In a particularly preferred embodiment, the pretreatment tool is a rotary roll printer with flexible printing plates. In particular, the pretreatment tool comprises at least one roller, preferably made of rubber, a reservoir for a liquid or pasty material, preferably a colored material, an ink supply unit arranged between the at least one roller and the reservoir, and a pressure device connected to the at least one roller, by means of which the roller can be pressed onto the substrate. Heliatek GmbH P115W0

[0113] 17.12.2025 18 / 31

[0114] In a preferred embodiment, the pretreatment tool is a device for structuring the contrast area, in particular a laser for laser structuring or a tool for mechanical structuring, in particular for the complete or partial removal of at least one upper layer of the contrast area.

[0115] In a preferred embodiment, the pretreatment tool is a device for structuring an area of ​​the substrate surface, wherein this structured area of ​​the substrate surface forms the contrast area.

[0116] In a preferred embodiment, the electronic component is an optoelectronic component. Preferably, the optoelectronic component comprises a substrate with a base electrode, a layer system with at least one photoactive layer, and a cover electrode, wherein the layer system is arranged between the base electrode and the cover electrode. Preferably, the substrate is a film. Preferably, the base electrode, the layer system, and the cover electrode are structured for electrical interconnection, preferably by laser structuring. In a preferred embodiment, layers of the layer system are structured in the first processing station and the second processing station.

[0117] An optoelectronic component is understood to be, in particular, a photovoltaic element, especially a solar cell. The photovoltaic element is preferably composed of several photovoltaic cells. The multiple photovoltaic cells can be arranged and / or interconnected in the optoelectronic component in different ways.

[0118] In a preferred embodiment, the electronic component is a flexible electronic component.

[0119] The invention is explained in more detail below with reference to the drawings, wherein identical or functionally equivalent elements are provided with the same reference numerals. The drawings show:

[0120] Fig. 1 is a schematic representation of an embodiment of a process with individual process steps for the multi-stage Heliatek GmbH P115W0

[0121] December 17, 2025

[0122] 19 / 31

[0123] Fabrication of an electronic component in top view on a substrate;

[0124] Fig. 2 shows a schematic representation of an embodiment of a method for the multi-stage production of an electronic component in a top view of a substrate with an additional starting contrast area;

[0125] Fig. 3 shows a schematic representation of an embodiment of a method for the multi-stage production of an electronic component in a top view of a substrate with start contrast area and start structure;

[0126] Fig. 4 shows a schematic representation of an embodiment of a method for the multi-stage production of an electronic component in a top view of a substrate with offset marks;

[0127] Fig. 5 shows a schematic representation of a first embodiment of a production plant; and Fig. 6 shows a schematic representation of a second embodiment of a production plant.

[0128] From leadership games

[0129] The exemplary embodiments relate to an optoelectronic component manufactured using a roll-to-roll process.

[0130] Fig. 1 shows a schematic representation of an embodiment of a method with individual process steps for the multi-stage fabrication of an electronic component in a top view of a substrate 10, wherein the substrate 10 is ribbon-shaped and flexible. In the method, the substrate 10 passes through at least a first processing station 50 and a second processing station 60.

[0131] In the process, in step a), a contrast area 21 was applied and / or introduced at a first edge area 11 and a second edge area 12 in the longitudinal direction (lo) on a surface of the substrate 10. Only a section of the substrate 10 is shown in the longitudinal direction (lo); in particular, the longitudinal extent of the substrate 10 (lo) is greater than its transverse extent (tr) (Fig. a1a). Heliatek GmbH P115W0

[0132] December 17, 2025

[0133] 20 / 31

[0134] In step b), a first marking structure 31 was introduced into the contrast area 21 at the first edge region 11 and a second marking structure 32 into the contrast area 21 at the second edge region 12 using a structuring tool (not shown) (Fig. 1b). In the present embodiment, the marking structures 31, 32 are each formed as a line extending in the longitudinal direction (l0).

[0135] In step c), a section 40 on the surface of the substrate 10 was machined in a first machining step using a first machining tool in the first machining station (not shown) (Fig. 1c). In the first machining step, in the present embodiment, several adjacent separation lines 41 arranged in the transverse direction (tr) of the substrate 10 were introduced into the surface of the substrate 10 or into a layer on the surface of the substrate 10 by means of ablation. The section 40 is limited in the longitudinal direction (lo) due to technical characteristics of the first machining tool (not shown).

[0136] After the substrate 10 was transported from the first processing station (not shown) to the second processing station (not shown) in step d), the position of the first marking structure 31 in the transverse direction (tr) of the substrate 10 was detected in step e), and a second processing tool (not shown) was positioned relative to the position of the marking structure 31 (Fig. Id). Subsequently, in step f), section 40 was processed in a second processing step with the second processing tool (not shown) in the second processing station 60.In this embodiment, section 40 was processed such that, at defined intervals and parallel to the separation lines 41, further separation lines 42 were introduced by ablation into the surface of the substrate 10, into the layer on the surface of the substrate 10, and / or into a further layer arranged on the surface of the substrate 10. Heliatek GmbH P115W0.

[0137] December 17, 2025

[0138] 21 / 31

[0139] In this embodiment, the contrast area 21 was applied as a strip in the longitudinal direction (lo ) along the first edge area 11.

[0140] In one embodiment of the invention, prior to step c) in a step cl, a position of the marking structure 31, 32 in transverse (tr) and longitudinal direction (lo) is detected and, based on the detected position of the marking structure 31, 32, a positioning of the first machining tool is carried out.

[0141] In a further embodiment of the invention, before step a), preferably during or after unwinding the substrate 10 from a roll, at least one longitudinally extending position (lo) of the substrate edge is detected in a step al), and based on the position of the substrate edge, the substrate 10 is aligned in a transverse direction (tr).

[0142] In a further embodiment of the invention, the introduction of the marking structure 31, 32, the processing in the first processing step, and the processing in the second processing step are each carried out by means of a laser.

[0143] In a further embodiment of the invention, the first machining tool is used as a structuring tool 54.

[0144] In a further embodiment of the invention, the contrast area 21 is applied to the surface of the substrate 10 at the first edge area 11 and / or the second edge area 12 by means of a printing process.

[0145] Fig. 2 shows a schematic representation of an embodiment of a method for the multi-stage fabrication of an electronic component in a top view of a substrate 10 with an additional starting contrast area 23. The method largely corresponds to that shown in Fig. 1.

[0146] In step a), a starting contrast area 23 was applied to the surface of the substrate 10. In the subsequent step c), the position of the starting contrast area 23 was determined to define a Heliatek GmbH P115W0

[0147] December 17, 2025

[0148] 22 / 31

[0149] Starting position of the first processing step in longitudinal direction (lo ) recorded .

[0150] In the present embodiment, a circular starting contrast area 23 is applied to the surface of the substrate 10. By optically detecting the circular area, in particular with a camera system, a clearly defined point in the area can be determined by means of center of gravity determination, even if the circular area is blurred or incomplete.

[0151] Fig. 3 shows a schematic representation of an embodiment of a method for the multi-stage fabrication of an electronic component in a top view of a substrate 10 with start contrast area 23 and start structure 24. The method largely corresponds to that shown in Fig. 1. In this embodiment, the method is shown at a time point after step c).

[0152] In step a), a contrast area 21 at the first edge area 11 and the second edge area 12 in the longitudinal direction (lo), as well as a starting contrast area 23, were applied to the surface of the substrate 10 by means of a printing process. In step b), a first marking structure 31 was introduced into the contrast area 21 of the first edge area 11, and a second marking structure 32 was introduced into the contrast area 21 of the second edge area 12. In step e), the position of the first marking structure 31 and the position of the second marking structure 32 were recorded, the transverse distance (tr) between the position of the first marking structure 31 and the position of the second marking structure 32 was determined, and, depending on the determined distance, a transverse scaling (tr) of the section 40 to be processed in the second processing step was carried out.In the first processing step, several adjacent separation lines 41, arranged in the transverse direction (tr) of the substrate 10, were introduced into a layer on the surface of the substrate 10 by means of ablation. In this embodiment, the layer is an electrode layer, a transport layer, or a photoactive layer of an optoelectronic device. Heliatek GmbH P115W0.

[0153] December 17, 2025

[0154] 23 / 31

[0155] Additionally, in step b), a start structure 24 was introduced into the contrast area 21 at the first edge area 11 using the structuring tool (not shown), wherein in step e), the position of the start structure 24 was determined to define a start position for the second processing step in the longitudinal direction (lo). In the present embodiment, the start structure 24 is designed as a circle, wherein in step e), the position of the start structure 24 was determined by determining the center of gravity of the circle.

[0156] Fig. 4 shows a schematic representation of an embodiment of a method for the multi-stage fabrication of an electronic component in a top view of a substrate with offset marks. The method largely corresponds to that shown in Fig. 1.

[0157] In this embodiment, the method after the second processing step is shown, wherein, during the first processing step, a first offset mark 25 was introduced into the contrast area 21 at the first edge area 11 in the first processing station (not shown) using the first processing tool (not shown), and before the second processing step, a second offset mark 26 was introduced into the contrast area 21 using the second processing tool (not shown). A relative displacement of the second offset mark 26 to the first offset mark 25 was determined to detect an offset or drift, and the positioning of the second processing tool (not shown) was adjusted to compensate for the offset or drift.In the present embodiment, the first offset mark 25 and the second offset mark 26 were each formed in a circular shape with different circle radii.

[0158] In this embodiment, in a first processing step, several separation lines 41 arranged side by side in the transverse direction (tr) of the substrate 10 were introduced into a layer arranged on the surface of the substrate 10 by means of ablation. In a second processing step, separation lines 42 were created across the entire width of the section 40 in the transverse direction (tr) at predetermined distances from the Heliatek GmbH P115W0

[0159] December 17, 2025

[0160] The separation lines 41 generated in the first processing step (24 / 31) are incorporated into a layer arranged on the surface of the substrate 10. The layer containing the separation lines 41 and the layer containing the separation lines 42 can be the same layer or different layers. The separation lines 41 were created using a laser in the first processing step, and the separation lines 42 were created using a laser in the second processing step.

[0161] In this embodiment, the layer is an electrode layer, a transport layer, or a photoactive layer of an optoelectronic component.

[0162] In one embodiment of the invention, as in all other embodiments described above, optional scaling in the transverse direction (tr) of the section 40 to be machined can be carried out in the second machining step.

[0163] Fig. 5 shows a schematic representation of a first embodiment of a manufacturing plant 100 for the multi-stage production of an electronic component on a substrate 10, which is designed as a ribbon-shaped, flexible substrate 10.

[0164] The substrate 10 is guided longitudinally through the production system 100. The production system 100 comprises a pretreatment tool 53 for applying and / or introducing a contrast area 21 at a first edge area 11 and / or a second edge area 12 on the surface of the substrate 10, a first processing station 50 with a structuring tool 54 for introducing at least one marking structure 31, 32 into the contrast area 21, and a first processing tool 55 for processing a section 40 on the surface of the substrate 10, as well as a second processing station 60 with a second processing tool 61 for processing the section 40, at least one camera system 62 and at least one control unit 80 connected to these.The control unit 80 is set up in such a way that, depending on the positions of the marking structures 31 , 32 introduced into the contrast area 21 by means of the structuring tool 54 and detected by the camera system 62, the Heliatek GmbH P115W0.

[0165] December 17, 2025

[0166] 25 / 31 to control the second processing tool 61. The production plant 100 further comprises a transport device 70, by means of which the substrate 10 can be transported from the first processing station 50 to the second processing station 60. In the present embodiment, the transport device 70 is designed as an arrangement of rollers forming a type of roller conveyor.

[0167] In the present embodiment, the structuring tool 54 and the first machining tool 55 are identical.

[0168] In a further embodiment of the invention, the pretreatment tool 53 comprises at least one roller, preferably having a rubber, a reservoir for a liquid or pasty paint, a paint supply unit arranged between the at least one roller and the reservoir, and a pressure device connected to the at least one roller, by means of which the roller can be pressed onto the substrate 10.

[0169] In the present embodiment, the substrate is wound into a roll after passing through the second processing station 60.

[0170] Fig. 6 shows a schematic representation of a second embodiment of a manufacturing plant 100 for the multi-stage production of an electronic component on a substrate 10, which is designed as a ribbon-shaped, flexible substrate 10, in a roll-to-roll process.

[0171] The manufacturing system 100 comprises a pretreatment tool 53, a first machining station 50 with a structuring tool 54 and a first machining tool 55 for machining a section 40 on the surface of the substrate 10. The pretreatment tool 53 is arranged in the first machining station 50. The manufacturing system 100 further comprises a second machining station 60 with a second machining tool 61 for machining the section 40, a camera system 62 and two control units 80, wherein the second control unit 80 connected to the second machining tool 61 is configured as follows: Heliatek GmbH P115W0

[0172] December 17, 2025

[0173] The second processing tool 61 is set up in 26 / 31, depending on the positions of the marking structures 31, 32 introduced into the contrast area 21 by means of the structuring tool 54 and detected by the camera system 62. The production plant 100 also includes a transport device 70, by means of which the substrate 10 can be transported from the first processing station 50 to the second processing station 60.

[0174] In the present embodiment, the substrate 10 is unwound from a roll, fed longitudinally to the first processing station 50, processed there, and then wound back onto a roll. The transport device 70 conveys the wound substrate 10 from the first processing station 50 to the second processing station 60, where it is unwound from the roll again for processing.

[0175] In a further embodiment of the invention, the first processing station 50 comprises a device, in particular a camera system (not shown), with which a position of the marking structure (31, 32) is detected in transverse (tr) and longitudinal direction (lo) and based on the detected position of the marking structure (31, 32) a positioning of the first processing tool (55) is carried out.

Claims

Heliatek GmbH P115W0 December 17, 2025 27 / 31 Patent claims 1. A method for the multi-stage fabrication of an electronic component on a substrate (10) which passes through at least a first processing station (50) and a second processing station (60) of at least one manufacturing plant (100), wherein the substrate (10) is ribbon-shaped and flexible, comprising the following steps: a) applying and / or introducing a contrast area (21) at a first edge area (11) and / or a second edge area (12) in the longitudinal direction (10) on and / or into a surface of the substrate (10); b) introducing at least one marking structure (31, 32) into the contrast area (21) by means of a structuring tool (54); c) machining a section (40) on the surface of the substrate (10) in a first machining step with a first machining tool (55) in the first machining station (50);d) Transporting the substrate (10) from the first processing station (50) to the second processing station (60); e) Determining the position of the marking structure (31, 32) in the transverse direction (tr) of the substrate (10), and positioning and / or calibrating positioning data of a second processing tool (61) in the second processing station (60) relative to the position of the marking structure (31, 32); and f) Processing the section (40) in a second processing step with the second processing tool (61) in the second processing station (60).

2. Method according to claim 1, wherein prior to step c) in a step cl) a position of the marking structure (31, 32) is detected in transverse (tr) and longitudinal direction (lo) and based on the detected position of the marking structure (31, 32) a positioning of the first machining tool (55) is carried out . Heliatek GmbH P115W0 December 17, 2025 28 / 31 3. Method according to claim 1 or 2, wherein, prior to step a), preferably during or after unwinding the substrate (10) from a roll, at least one longitudinally extending position (10) of the substrate edge is detected in a step al) and, based on the position of the substrate edge, the substrate (10) is aligned in a transverse direction (tr).

4. Method according to one of the preceding claims, wherein in step a) at least one start contrast area (23) is applied to the surface of the substrate (10), wherein in step c) the position of the start contrast area (23) is detected to determine a start position of the first processing step in the longitudinal direction (lo), and / or in step b) a start structure (24) is introduced into the contrast area (21) at the first edge area (11) and / or the second edge area (12) by means of the structuring tool (54), wherein in step e) the position of the start structure (24) is detected to determine a start position of the second processing step in the longitudinal direction (lo).

5. Method according to one of the preceding claims, wherein the first processing tool (55) is used as the structuring tool (54), and / or the application of the contrast area (21) to the first edge area (11) and / or the second edge area (12) on the surface of the substrate (10) is carried out by means of a printing process.

6. Method according to one of the preceding claims, wherein the contrast area (21) is applied as a strip in longitudinal direction (10) along the first edge area (11) and / or the second edge area (12).

7. Method according to one of the preceding claims, wherein in step a) the contrast area (21) is applied and / or introduced at the first edge area (11) and the second edge area (12), and in step b) a first marking structure (31) is applied to the contrast area (21) of the first edge area (11) and a second Heliatek GmbH P115W0 December 17, 2025 29 / 31 The marking structure (32) is placed in the contrast area (21) of the second boundary area (12), and in step e) a position of the first marking structure (31) and a position of the second marking structure (32) are recorded, a distance of the position of the first marking structure (31) to the position of the second marking structure (32) is determined in the transverse direction (tr), and depending on the determined distance, a scaling in the transverse direction (tr) of the section (40) to be processed in the second processing step is carried out.

8. Method according to one of the preceding claims, wherein the introduction of the marking structure (31, 32), the processing in the first processing step, and the processing in the second processing step are each carried out by means of a laser.

9. Method according to one of the preceding claims, wherein in the first processing station (50) a first offset mark (25) is introduced into the contrast area (21) at the first edge area (11) and / or the second edge area (12) by means of the first processing tool (55), and in the second processing station (60) a second offset mark (26) is introduced into the contrast area (21) by means of the second processing tool (61), wherein a relative displacement of the second offset mark (26) to the first offset mark (25) is determined to detect an offset or drift, and the positioning of the second processing tool (61) is adjusted to compensate for the offset or drift, wherein preferably the first offset mark (25) and the second offset mark (26) are circular.

10. Manufacturing plant (100) for the multi-stage production of an electronic component on a substrate (10), wherein the substrate (10) is designed as a ribbon-shaped, flexible substrate (10), according to a method according to any one of claims 1 to 9, wherein the manufacturing plant (100) comprises a pretreatment tool (53) for applying and / or introducing a contrast area (21) at a first edge area (11) and / or a second edge area (12) on and / or into the surface of the substrate (10), a first Heliatek GmbH P115W0 December 17, 2025 30 / 31 Processing station (50) with a structuring tool (54) for introducing at least one marking structure (31, 32) into the contrast area (21), and a first processing tool (55) for processing a section (40) on the surface of the substrate (10), as well as a second processing station (60) with a second processing tool (61) for processing the section (40), comprising at least one camera system (62) and at least one control unit (80) connected thereto, wherein the control unit (80) is configured to control the second processing tool (61) depending on the positions of marking structures (31, 32) introduced into the contrast area (21) by means of the structuring tool (54) detected by the camera system (62), and wherein the production plant (100) comprises a transport device (70),by means of which the substrate (10) can be transported from the first processing station (50) to the second processing station (60).

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