Method for producing a camera, and camera for a motor vehicle
By employing image recognition to measure and adaptively position the camera's active surface and pins, the method reduces tolerance errors, achieving precise alignment and improved optical properties in camera manufacturing, especially for motor vehicle applications.
Patent Information
- Application Number
- PCT/EP2025/085529
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-17
- Filing Date
- 2025-12-04
- Publication Date
- 2026-06-25
AI Technical Summary
Existing camera manufacturing methods suffer from significant tolerance issues, including self-centering inaccuracies, imager module misalignment, and rotational errors, leading to suboptimal alignment and reduced precision in the positioning of the active surface and a camera, which are not addressed by the method disclosed in the method described in the method disclosed in the method step 501. The method described here results in a significantly reduced tolerance chain compared to previously known methods. Only the tolerances for the measurement accuracy of the image recognition method when measuring the orientation of the active surface and the remaining process accuracy when attaching the circuit board to the camera housing need to be considered. With this method, a desired concentricity and/or tilt angle can be achieved with much higher accuracy than with methods using longer tolerance chains. High tolerance accuracy between the active surface and a reference surface of the camera housing can be achieved. These advantages result primarily from the adaptive positioning of the circuit board within the camera housing. This ensures that the active surface of the image sensor is positioned almost perfectly within the camera housing.
The method involves using image recognition to measure the orientation of the active surface of the image sensor and the positions of the pins relative to the camera housing, allowing for adaptive positioning of the circuit board, which is then attached via a gripper system, and finally secured using riveting or soldering processes.
The method achieves significantly improved concentricity and reduced tilt angles in the manufactured camera, ensuring precise alignment and optical properties, particularly suitable for use in motor vehicles.
Smart Images
Figure EP2025085529_25062026_PF_FP_ABST
Abstract
Description
[0001] R. 416618
[0002] - 1 -
[0003] Description
[0004] title
[0005] Procedures for a camera and camera for a
[0006] The present invention relates to a method for manufacturing a camera and a camera for a motor vehicle according to the independent claims.
[0007] State of the art
[0008] DE 10 2021 212 985 A1 discloses a method for manufacturing a camera comprising the steps of: joining a circuit carrier and a metal frame on a surface of the circuit carrier that carries an image sensor to provide a circuit carrier arrangement; optically measuring the circuit carrier arrangement to determine the position of the image sensor on the circuit carrier; inserting a lens with lens housing into a camera housing, wherein the camera housing has a camera housing collar extending into the interior of the camera housing with a compression element arranged on a side facing the image sensor; and attaching the lens housing to the camera housing; optically measuring the lens attached to the camera housing to determine the focus and image plane tilt of the lens;Compression of the compression element depending on the optical measurement of the circuit carrier assembly and the optical measurement of the lens attached to the camera body to adjust the alignment of the lens to the circuit carrier assembly to be arranged on the camera body along one coordinate axis and along two rotation axes; arrangement of the circuit carrier assembly on the camera body and alignment along two further coordinate axes and one further rotation axis; and connection of the circuit carrier assembly and the camera body. R. 416618;
[0009] - 2 -
[0010] Disclosure of the invention
[0011] The present invention relates to a method for manufacturing a camera. The camera to be manufactured comprises a lens with a lens housing and at least one optical lens, a camera housing with at least two pins projecting in a direction away from the lens, and a circuit board with an imager module attached or attachable thereto. The circuit board is connected or connectable to the camera housing by means of the pins.
[0012] The method comprises the following steps: providing the camera housing; providing the printed circuit board, wherein an imager module comprising an image sensor is mounted on the printed circuit board and wherein the printed circuit board includes at least two receiving openings corresponding to the pins of the camera housing; inserting the printed circuit board into the camera housing, wherein the printed circuit board is held by means of a gripper system and wherein the pins of the camera housing are guided through the receiving openings of the printed circuit board; measuring the orientation of an active surface of the image sensor mounted on the printed circuit board with respect to the camera housing by means of an image recognition method; positioning the printed circuit board with respect to the camera housing by means of the gripper system taking into account the orientation of the measured active surface; and attaching the printed circuit board to the camera housing.
[0013] In other words, the printed circuit board is adaptively positioned using the method presented here. In a camera manufactured using this method, the pins are arranged eccentrically in the mounting holes of the circuit board. A camera manufactured using this method is particularly suitable for use in a motor vehicle.
[0014] The imager module can be attached to the circuit board, in particular by means of a soldered connection. The imager module can be attached to the circuit board, in particular by means of an adhesive connection. The imager module can be attached to the circuit board, in particular by means of wiring. R. 416618
[0015] - 3 -
[0016] The measurement of the orientation of the active area of the image sensor mounted on the circuit board using image recognition is performed, in particular, through a lens holder opening in the camera housing. For the measurement, the image sensor can, for example, be illuminated with a light source. The image sensor is illuminated, in particular, through the lens holder opening of the camera housing. The light source is, in particular, a white light source. The light source can be tuned with respect to the direction of the light emitted from the light source onto the image sensor. Alternatively, the light source is tuned, in particular, with respect to both a wavelength and a direction of the light emitted from the light source onto the image sensor. Images are captured from the illuminated image sensor. In this process, clear features of the image sensor can be detected. Based on such features, the orientation of the active area can be determined.
[0017] The mounting openings are to be understood specifically as mounting holes. The mounting openings can, for example, be cut into the circuit board. The mounting openings can, for example, be drilled into the circuit board.
[0018] The camera housing can have two or more pins. In particular, the camera housing has two pins. In particular, the camera housing has four pins. The circuit board has as many mounting holes as the camera housing of the camera to be manufactured has pins. Inserting the pins of the camera housing into the mounting holes of the circuit board serves in particular to connect the camera housing to the circuit board.
[0019] The advantage of the invention lies in a significantly reduced tolerance chain compared to previously known methods.
[0020] In previously known camera manufacturing methods, for example, the circuit board can self-center around the pins of the camera housing. Possible sources of error in such previously known methods include: a) The position of the active area relative to the imager module; R. 416618
[0021] - 4 - b) Floating the I mager module onto solder balls when soldering the imager module to the circuit board; c) Positioning the mounting holes in the circuit board relative to the position of solder pads; d) Centering the mounting holes around the pins of the camera housing when attaching, for example by crimping; e) Positioning the pins of the camera housing relative to the front of the camera housing (lens side).
[0022] A possible rotation of the active surface relative to at least one reference edge of the camera housing (called tilt or roll angle) can also result from the tolerances of previously known methods.
[0023] The method described here results in a significantly reduced tolerance chain compared to previously known methods. Only the tolerances for: f) the measurement accuracy of the image recognition method when measuring the orientation of the active surface; and g) the remaining process accuracy when attaching the circuit board to the camera housing need to be considered.
[0024] With this method, a desired concentricity and / or tilt angle can be achieved with much higher accuracy than with methods using longer tolerance chains. High tolerance accuracy between the active surface and a reference surface of the camera housing can be achieved. These advantages result primarily from the adaptive positioning of the circuit board within the camera housing. This ensures that the active surface of the image sensor is positioned almost perfectly within the camera housing.
[0025] In an advantageous embodiment, the measurement of the active surface provides for the determination of its orientation along a first axis (x-axis, image horizontal), its orientation along a second axis (y-axis, image vertical), and its rotation angle about a third axis (z-axis). In other words, the rotation angle of the active surface is a rotation of the active surface relative to an edge of the camera housing. The rotation angle is R. 416618
[0026] - 5 - spanned by an edge of the camera body and an edge of the active surface.
[0027] The advantage of this design is that the measurement results obtained in this way enable the determination of a suitable positioning of the circuit board in relation to the camera housing so well that the manufactured camera has a particularly good concentricity and a particularly low tilt angle.
[0028] In an advantageous embodiment, the method includes the following further step: determining the positions of the at least two pins with respect to at least one housing edge of the camera housing by means of an image recognition method. The determined positions of the at least two pins are then taken into account when positioning the circuit board with respect to the camera housing.
[0029] The positions of at least two pins can be determined, for example, by clamping the camera housing against a reference surface and using image recognition to measure the positions of the at least two pins relative to reference marks on the reference surface in a single image. For this measurement, the camera housing can be illuminated with a light source. The light source can be tuned to a specific wavelength and direction of light emitted onto the camera housing. The light source can also be a white light source. Images are captured of the illuminated camera housing. Features of the camera housing can be captured in this process. The light source can be tuned to the camera housing in such a way that clear features of the camera housing can be captured. The positions of the pins can be derived from the detected centers of the pin circles.
[0030] The advantage of this design is that, within the tolerance chain, the position of the pins relative to one side of the camera housing, a potential source of error, is eliminated or significantly reduced. This allows for considerably improved concentricity and an even lower roll angle in the manufactured camera. R. 416618
[0031] - 6 -
[0032] In an advantageous embodiment, a rectangle spanned by at least two pins is determined in a plane where at least two pins are present. This involves determining the orientation of the rectangle along a first axis (x-axis), its orientation along a second axis (y-axis), and its rotation angle about a third axis (z-axis). In other words, the rotation angle of the rectangle is a rotation of the rectangle relative to a reference edge of the camera housing. This rotation angle is defined by the reference edge of the camera housing and an edge of the rectangle.
[0033] The advantage of this design is that the measurement results obtained in this way allow for an even better determination of the positioning of the circuit board in relation to the camera housing, so that the manufactured camera has an even better concentricity and an even lower tilt angle.
[0034] In an advantageous embodiment, it is provided that the printed circuit board is attached to the camera housing by means of a riveting process or by means of a soldering process.
[0035] The crimping process allows the circuit board to be positioned advantageously and almost ideally via the mounting holes to the pins in the camera housing.
[0036] In an advantageous embodiment, the method includes the following further steps: inserting the lens into the camera housing; optically aligning the lens to the image sensor; and securing the lens in the camera housing.
[0037] This makes it advantageous to produce a camera with very good optical properties, in particular very good concentricity and a very low tilt angle.
[0038] The invention further relates to a camera for a motor vehicle. The camera comprises a lens with a lens housing and at least one optical lens; a camera housing with at least two lenses arranged in a manner consistent with R. 416618
[0039] - 7 -
[0040] Pins projecting in the direction away from the lens; and a printed circuit board with an imager module attached thereto, wherein the imager module comprises an image sensor, wherein the printed circuit board is connected to the camera housing by means of the pins, wherein the pins are inserted into at least two receiving openings of the printed circuit board; and wherein the pins are arranged eccentrically in the receiving openings of the printed circuit board.
[0041] In particular, a camera manufactured using the method described above is presented here.
[0042] The camera may still have a housing cover. The housing cover may be attached to the camera housing on the side facing away from the lens. The camera housing and the housing cover may be connected in such a way as to protect the camera from the ingress of media from the camera's environment. The camera housing and the housing cover may be connected by a material-fit or form-fit connection.
[0043] The camera described here may also include an electrical connector designed to electrically connect the circuit board. The circuit board is specifically designed to accommodate the image sensor. The circuit board may also accommodate other components, such as a camera connector, as well as other electronic components. Furthermore, the camera may also include at least one additional circuit board. Such an additional circuit board does not, in particular, include an image sensor.
[0044] It is understood that the features mentioned above and those to be explained below can be used not only in the combinations specified, but also in other combinations or on their own, without leaving the scope of the present invention.
[0045] Drawings R. 416618
[0046] - 8 -
[0047] Exemplary embodiments of the present invention are explained in more detail below with reference to the accompanying drawings. Identical reference numerals in the figures denote identical or equivalently acting elements. The figures show:
[0048] Figure 1 shows an embodiment of a camera;
[0049] Figure 2 shows the step of inserting the printed circuit board into the camera housing; Figure 3A shows an example of the position of the printed circuit board inserted into the camera housing before an adaptive adjustment of the positioning of the printed circuit board from direction A according to Figure 2;
[0050] Figure 3B shows an example of the position of the printed circuit board inserted into the camera housing before an adaptive adjustment of the positioning of the printed circuit board from direction B according to Figure 2;
[0051] Figure 4A shows an example of the position of the printed circuit board inserted into the camera housing after an adaptive adjustment of the positioning of the printed circuit board from direction A according to Figure 2;
[0052] Figure 4B shows an example of the position of the printed circuit board inserted into the camera housing after an adaptive adjustment of the positioning of the printed circuit board from direction B according to Figure 2;
[0053] Figure 5 shows an embodiment of a method for manufacturing a camera.
[0054] Figure 1 shows an example of a camera 100 for a motor vehicle. The camera 100 comprises the lens 101, which in turn has a lens housing 102 and at least one optical lens 103. The camera 100 further comprises the camera housing 111 with at least two pins 106-1 and 106-2 projecting in a direction away from the lens 101. The camera 100 also comprises the circuit board 107 with an imager module 108 mounted thereon, the imager module comprising an image sensor, and the circuit board 107 being connected to the camera housing 111 by means of pins 106-1 and 106-2. For this purpose, the pins are provided in at least two receiving openings 109-1 and 109-2 of the circuit board 107.
[0055] In the embodiment shown here, the lens 101 is inserted into the camera housing 111 and optically aligned with the image sensor. The lens 101 is inserted into a lens holder opening 104 of the camera housing 111. Furthermore, the lens 101 is secured in the camera housing 111. For this purpose, for example, an adhesive joint 105 can be provided. R. 416618
[0056] - 9 -
[0057] If, during a manufacturing process for camera 100, the circuit board were to center itself around the pins, the lateral position of the active area of the image sensor in the camera housing 111 could be subject to a certain tolerance along a first axis (x-axis) and along a second axis (y-axis). This could prevent the concentricity of the lens 101 in the camera housing 111, as indicated by the lines 110, from being achieved or ideally achieved. A rotation of the active area of the image sensor relative to reference edges of the camera housing (tilt angle) could also occur.
[0058] To significantly reduce both the tolerance chain for the concentricity of the lens 101 in the camera housing 111 and the tolerance chain for the tilt angle, the method 500 presented here and shown schematically in Figure 5 can be used to manufacture the camera 100. Figures 2 to 4 illustrate individual process steps of method 500 in more detail. In a camera 100 manufactured using this method 500, the circuit board 107 is adaptively positioned.
[0059] In method 500, the camera housing 101 is provided in a first step 501. In step 502, the circuit board 107 is provided, wherein an imager module 108 comprising an image sensor is attached to the circuit board 107, and wherein the circuit board includes at least two receiving openings 109-1, 109-2 corresponding to the pins of the camera housing 111. In step 503, the circuit board 107 is inserted into the camera housing 111. This step is illustrated in Figure 2. Arrow 301 indicates the insertion direction of the circuit board 107 into the camera housing 111. The circuit board 107 is held by means of a gripper system (not shown here), and the pins located in the camera housing 111 (not visible here) are guided through the receiving openings of the circuit board 107. When inserting 503, the image sensor with the active area 201 faces the lens holder opening 104.Arrow A in Figure 2 marks the viewing direction along which the component group consisting of camera housing 111 and inserted circuit board 107 is viewed in the following Figures 3A and 4A. Arrow B in Figure 2 marks the viewing direction along which the R. 416618 is viewed in the following Figures 3B and 4B.
[0060] - 10 -
[0061] The component group consisting of camera housing 111 and inserted circuit board 107 is viewed.
[0062] Figure 3A shows an example of the position of the printed circuit board 107 inserted into the camera housing 111 before adaptive adjustment of the positioning of the printed circuit board 107 from direction A (see arrow A in Figure 2). The printed circuit board 107 continues to be held by means of a gripper system not shown here. Now, in step 504 of the method 500, the orientation of an active surface 201 of the image sensor attached to the printed circuit board 107 with respect to the camera housing 111 is measured by means of an image recognition method.
[0063] During the measurement 504 of the active surface 201, an orientation of the active surface 201 along a first axis x, an orientation of the active surface 201 along a second axis y, and a rotation angle 204 of the active surface 201 about a third axis z can be determined. The rotation angle 204 is defined by the reference edge 205 of the camera housing 111 and an edge of the active surface 201, which is marked by the arrow 206.
[0064] Furthermore, as indicated in Figure 3A, in an optional step 505 the positions of the at least two pins 106-1, 106-2 with respect to at least one housing edge of the camera housing 111 can be determined by means of an image recognition method. The pins 106-1 and 106-2 and the recording openings 109-1 and 109-2 are not actually visible in this view and are therefore only indicated. Here, a rectangle 401 spanned by the at least two pins 106-1, 106-2 can be determined in a plane of the at least two pins 106-1, 106-2. An orientation 402 of the rectangle 401 along a first axis x, an orientation 403 of the rectangle 401 along a second axis y, and a rotation angle of the rectangle 401 about a third axis z can be determined.
[0065] Figure 3B shows the same component group as Figure 3A, but from direction B (see arrow B in Figure 2). It can be seen that pins 106-1 and 106-2 are still arranged symmetrically in the receiving openings 109-1 and 109-2. R. 416618
[0066] - 11 -
[0067] In step 506 of the process, the circuit board 107 is positioned relative to the camera housing 111. Here, the circuit board 107 is positioned using the gripper system (not shown), taking into account the orientation of the measured active surface 201. In other words, the position of the circuit board 107 is adaptively adjusted. This allows the active surface 201 of the image sensor to be positioned almost perfectly within the camera housing 111.
[0068] The positions of at least two pins 106-1 , 106-2, determined as described above, can be taken into account in positioning 506.
[0069] Figure 4A shows an example of the position of the circuit board inserted into the camera housing after positioning 506, i.e., after an adaptive adjustment of the circuit board's position from direction A (see arrow A in Figure 2). Again, pins 106-1 and 106-2 and the receiving openings 109-1 and 109-2 are not actually visible in this view and are therefore only indicated. The rectangle 401, defined by at least two pins 106-1 and 106-2, which, due to the positioning of the circuit board 107, is now aligned with its outer edges parallel to the edges of the camera housing 111, is also still indicated. Figure 4B shows the same example from direction B (see arrow A in Figure 2). Here, too, the gripper system, which still holds the circuit board 107, is not shown. In Figure 4B, the changed position of the circuit board 107 compared to Figure 3B is clearly recognizable.Furthermore, it can be clearly seen in Figures 4A and 4B that, due to the change in the position of the circuit board 107 in the camera housing 111, the pins 106-1 , 106-2 of the camera housing 111 are now arranged eccentrically in the receiving openings 109-1 , 109-2 of the circuit board 107.
[0070] In step 507 of the process 500, the circuit board is finally attached to the camera housing 111. This can be done, for example, by means of a riveting process or a soldering process.
[0071] Optionally, the procedure 500 can include the further steps of inserting 508 the lens 101 into the camera body 111; and optically aligning 509 the R. 416618
[0072] - 12 -
[0073] lens 101 to the image sensor and the attachment 510 of the lens 101 in the camera body 111 (see Figure 5).
Claims
R. 416618 - 13 - Claims 1. Method (500) for manufacturing a camera (100), wherein the camera (100) comprises a lens (101) with a lens housing (102) and at least one optical lens (103), a camera housing (111) with at least two pins (106-1, 106-2) projecting in a direction away from the lens (103), and a printed circuit board (107) with an imager module (108) mounted thereon, wherein the printed circuit board (107) is connected to the camera housing (111) by means of the pins (106-1, 106-2); wherein the method comprises the steps: • Deploying (501) the camera body (111); • Providing (502) the circuit board (107), wherein an imager module (108) comprising an image sensor is mounted on the circuit board (107) and wherein the circuit board (107) comprises at least two recording openings (109-1, 109-2) corresponding to the pins (106-1, 106-2) of the camera housing (111); • Inserting (503) the circuit board (107) into the camera housing (111), wherein the circuit board (107) is held by means of a gripper system and wherein the pins (106-1 , 106-2) of the camera housing (111) are guided through the receiving openings (109-1 , 109-2) of the circuit board (107); • Measurement (504) of an orientation of an active surface (201) of the image sensor mounted on the circuit board (107) in relation to the camera housing (111) by means of an image recognition method; • Positioning (506) of the circuit board (107) in relation to the camera housing (111) by means of the gripper system taking into account the orientation of the measured active surface (201); and • Attaching (507) the circuit board (107) to the camera housing (111).
2. Method (500) according to claim 1, wherein, in the measurement (504) of the active surface (201), an orientation of the active surface (201) along a first axis (x), an orientation of the active surface (201) along a second axis (y) and a rotation angle (204) of the active surface (201) about a third axis (z) is determined. R. 416618 - 14 - 3. Method (500) according to claim 1 or 2, comprising the further step of determining (505) positions of the at least two pins (106-1 , 106-2) in relation to at least one housing edge of the camera housing by means of an image recognition method; and wherein the determined positions of the at least two pins (106-1 , 106-2) are taken into account during the positioning (506).
4. Method (500) according to claim 3, wherein a rectangle (401) spanned by the at least two pins (106-1 , 106-2) is determined in a plane of the at least two pins (106-1 , 106-2); and wherein an orientation (402) of the rectangle (401) along a first axis (x), an orientation (403) of the rectangle (401) along a second axis (y) and a rotation angle (204) of the rectangle (401) about a third axis (z) is determined.
5. Method (500) according to one of the preceding claims, wherein the fastening (507) of the circuit board (107) to the camera housing (111) is carried out by means of a riveting process or by means of a soldering process.
6. Method (500) according to any of the preceding claims, wherein the method (500) further comprises the steps • of inserting (508) the lens (101) into the camera body (111); • the optical alignment (509) of the lens (101) to the image sensor; and • of the attachment (510) of the lens (101) in the camera body (111).
7. Camera (100) for a motor vehicle comprising: • a lens (101) with a lens housing (102) and at least one optical lens (103); • a camera body (111) with at least two pins (106-1 , 106-2) projecting in a direction away from the lens (103); and • a printed circuit board (107) with an imager module (108) attached thereto, wherein the imager module (108) comprises an image sensor, wherein the printed circuit board (107) is connected to the camera housing (111) by means of the pins (106-1 , 106-2), wherein the pins (106-1 , 106-2) are inserted into at least two receiving openings (109-1 , 109-2) of the printed circuit board (107); and wherein the pins (106-1 , 106-2) are arranged eccentrically in the receiving openings (109-1 , 109-2) of the printed circuit board (107).