Electroluminescent panel, method for manufacturing same, and substrate for electroluminescent panel

The electroluminescent panel design with a ridge portion and thinner functional layer at the tip addresses side etching issues, improving yield and efficiency by preventing pattern defects during manufacturing.

WO2026133523A1PCT designated stage Publication Date: 2026-06-25SHARP KK
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
SHARP KK
Filing Date
2024-12-20
Publication Date
2026-06-25

AI Technical Summary

Technical Problem

Conventional electroluminescent panel manufacturing techniques suffer from side etching during the etching process, leading to pattern defects and decreased light-emitting efficiency, which affects the yield and performance of the panels.

Method used

The electroluminescent panel incorporates a ridge portion with a vertically standing tip that partitions the substrate into light-emitting regions, and the functional layer thickness is thinner at the tip than in the center, with a specific manufacturing method that includes applying a material coating and etching it to form a pattern at the pointed portion.

Benefits of technology

This approach effectively prevents side etching, enhancing the yield and light-emitting efficiency of the panels by ensuring precise patterning and minimizing defects.

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Abstract

The present disclosure provides a novel technology capable of suppressing reductions in yield and light-emission efficiency in an electroluminescent panel. In an electroluminescent panel (1), a ridge portion (22) that defines a light-emitting region (2) comprises a tip portion (222), a light-emitting layer (12) overlaps the tip portion (222) from above, and the thickness of the light-emitting layer (12) at the top of the tip portion (222) is zero or thinner than the thickness of the light-emitting region (2) at the center thereof.
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