Inspection and measurement system and inspection and measurement method

Abstract

Provided is an inspection and measurement system which is provided for a module included in a substrate processing system, and which performs inspection and measurement of a substrate. The inspection and measurement system comprises: an inspection and measurement unit provided outside the module; a window provided through a ceiling part of the module from the outside to the inside of the module; and an inspection and measurement stage provided inside the module. The inspection and measurement unit includes an inspection and measurement device configured to inspect and measure, through the window, an inspection and measurement target position on the substrate placed on the inspection and measurement stage. The inspection and measurement unit and / or the inspection and measurement stage is provided with a moving mechanism configured to move a relative position between the inspection and measurement device and the inspection and measurement target position.

Claims

1. An inspection and measurement system for performing inspection and measurement of a substrate, provided for a module of a substrate processing system, comprising: an inspection and measurement unit provided outside the module; a window provided through the ceiling of the module from the outside to the inside; and an inspection and measurement stage provided inside the module, wherein the inspection and measurement unit has an inspection and measurement device that inspects and measures the position of the object to be inspected and measured on the substrate placed on the inspection and measurement stage via the window, and either or both of the inspection and measurement unit and the inspection and measurement stage are provided with a moving mechanism that moves the relative position between the inspection and measurement device and the substrate.

2. The inspection and measurement system according to claim 1, wherein the moving mechanism includes a rotating mechanism configured to rotate the substrate on the inspection and measurement stage.

3. The inspection and measurement system according to claim 2, wherein the moving mechanism includes a moving mechanism configured to move the inspection and measurement device in the inspection and measurement unit at least in the radial direction of the substrate.

4. The inspection and measurement system according to any one of claims 1 to 3, wherein the substrate is a substrate that has undergone a specific process in the substrate processing system, the inspection and measurement system further comprises a control unit, and the control unit performs control including: performing inspection and measurement of the substrate, evaluating the specific process from the results of the inspection and measurement, and adjusting the parameters of the specific process that contribute to the evaluation.

5. The inspection and measurement system according to any one of claims 1 to 3, wherein the substrate is a substrate before a specific process is performed in the substrate processing system, the inspection and measurement system further comprises a control unit, and the control unit performs control including: performing inspection and measurement of the substrate, and adjusting the parameters of the specific process based on the results of the inspection and measurement.

6. The inspection and measurement system according to claim 1, wherein the inspection and measurement unit is configured to be detachable from the ceiling portion of the module.

7. The inspection and measurement system according to claim 1, provided for a plurality of modules of the substrate processing system.

8. The inspection and measurement system according to claim 1, wherein the outside of the module is an atmospheric pressure environment, the inside of the module is a reduced pressure environment, and the inspection and measurement unit and the inspection and measurement stage are each provided with a standard sample for calibration of the inspection and measurement device.

9. The inspection and measurement system according to claim 1, further comprising a control unit, the inspection and measurement device comprising a focusing sensor configured to measure the height of the substrate, and the control unit performing control including measuring the height of the substrate at multiple points using the focusing sensor, and determining the warpage profile of the substrate from the heights of the multiple points on the substrate.

10. An inspection and measurement method for a substrate using an inspection and measurement system provided for a module of a substrate processing system, wherein the inspection and measurement system comprises: an inspection and measurement unit provided outside the module; a window provided through the ceiling of the module from the outside to the inside of the module; and an inspection and measurement stage provided inside the module, wherein the inspection and measurement unit has an inspection and measurement device configured to inspect and measure a target position on the substrate placed on the inspection and measurement stage via the window, and either or both of the inspection and measurement unit and the inspection and measurement stage are provided with a moving mechanism configured to move the relative position between the inspection and measurement device and the target position, and the inspection and measurement method comprises performing the inspection and measurement at a plurality of target positions on the substrate by moving the relative position between the inspection and measurement device and the substrate using the moving mechanism.

11. The inspection and measurement method according to claim 10, wherein the outside of the module is an atmospheric pressure environment, the inside of the module is a reduced pressure environment, the inspection and measurement unit and the inspection and measurement stage are each provided with a standard sample for calibration of the inspection and measurement device, and the inspection and measurement method includes performing an inspection and measurement on the standard sample provided in the inspection and measurement unit and an inspection and measurement on the standard sample provided in the inspection and measurement stage to calibrate the inspection and measurement device.

12. The inspection and measurement device has a focusing sensor configured to measure the height of the substrate, and the inspection and measurement method comprises measuring the height of the substrate at multiple points using the focusing sensor, and determining the warpage profile of the substrate from the heights of the multiple points on the substrate, according to claim 10.

13. The inspection and measurement method according to any one of claims 10 to 12, wherein the substrate is a substrate that has undergone a specific process, and the inspection and measurement method comprises: performing an inspection and measurement of the substrate; evaluating the specific process from the results of the inspection and measurement; and adjusting the parameters of the specific process that contribute to the evaluation.

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