Non-crosslinked submarine and high-voltage semiconductive cable composition
A non-crosslinked submarine and high-voltage semiconducting cable composition using specific resin and carbon black ratios, extruded without crosslinking, addresses environmental issues and maintains critical cable properties, enhancing eco-friendliness and efficiency.
WO2026134830A1PCT designated stage Publication Date: 2026-06-25THE SPACESHIP COMPANY
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- THE SPACESHIP COMPANY
- Filing Date
- 2025-12-02
- Publication Date
- 2026-06-25
Abstract
The present invention relates to a non-crosslinked submarine and high-voltage semiconductive cable composition and a non-crosslinked submarine and high-voltage semiconductive cable manufactured thereby, the composition comprising, on the basis of 100 parts by weight of a base resin, 15-45 parts by weight of carbon black, 1-5 parts by weight of a high-temperature antioxidant, and 1-5 parts by weight of a hydrolysis inhibitor. A cable can be manufactured through extrusion alone by using a non-crosslinkable compound composition, thereby eliminating a harmful gas problem caused by a crosslinking reaction of the compound composition and being environmentally friendly, and providing an advantageous economic effect through simplification of cable manufacturing by removal of the crosslinking process. In addition, it is possible to prepare a composition of a cable that has excellent electrical properties at a high temperature of 110-130 °C, and also can be used in various environments by ensuring properties such as heat resistance, cold resistance and salt water resistance. In addition, since plastic compounds are used to manufacture a cable through extrusion, the extrusion time is shortened and the stability of the cable itself can also be improved by manufacturing a cable through extrusion rather than by means of a coating method.
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