Display module and manufacturing method therefor, and display device
By using an adhesive structure with ring-shaped dams and filler glue in the OLED foldable display module, the problems of repeated bonding and separation of adhesive paper and reduced breakage during the thinning process are solved, thus avoiding abnormal noise and mold marks, and improving the performance and stability of the display module.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- BOE TECHNOLOGY GROUP CO LTD
- Filing Date
- 2024-12-25
- Publication Date
- 2026-07-02
AI Technical Summary
During the thinning process of OLED foldable display modules, repeated bonding and separation of the adhesive tape can cause abnormal noises. The discontinuity on the back of the FPC reduces the absorption capacity of the adhesive tape, increasing the risk of mold printing on the whole machine.
An adhesive structure consisting of a ring-shaped dam and a filler adhesive is adopted, with the dam having a modulus greater than that of the filler adhesive. It surrounds the flexible circuit board and fills the discontinuity area, combined with a support structure and the circuit board, to improve the bonding strength and flatness.
This effectively avoids abnormal noises and mold printing problems, improves the performance and structural stability of the display module, and reduces costs and production cycle time.
Smart Images
Figure CN2024142238_02072026_PF_FP_ABST
Abstract
Description
A display module, its manufacturing method and display device Technical Field
[0001] This disclosure relates to the field of display technology, and in particular to a display module, its manufacturing method, and a display device. Background Technology
[0002] With the development of foldable display technology, the demand for thinner and lighter foldable terminal products is increasing. Organic Light Emitting Diode (OLED) foldable display modules, as key components, have a relatively large overall thickness due to their stacked structure, requiring thinning in conjunction with the overall device. When thinning the display module, the adhesive tape on the back of the flexible printed circuit (FPC) is also thinned simultaneously. However, the cover plate of the display module is mostly made of non-rigid materials. During use, the stress on the cover plate surface is transmitted to the inside of the module, causing the thinned adhesive tape to repeatedly bond and separate under the combined effect of thinning and external stress, producing abnormal noise. Simultaneously, the inherent discontinuity on the back of the FPC is reduced by the thinning of the adhesive tape, significantly increasing the molding risk of the entire device. Summary of the Invention
[0003] This disclosure provides a display module, its manufacturing method, and a display device, the specific solutions of which are as follows:
[0004] This disclosure provides a display module, comprising:
[0005] Flexible display panel, support structure, flexible circuit board and adhesive structure;
[0006] The flexible display panel includes a display area and a non-display area bent to the back of the display area, the non-display area including a bonding area bonded to the flexible circuit board; the support structure is located on the back of the display area, and the flexible circuit board is disposed on the side of the support structure opposite to the display area; the adhesive structure is located between the support structure and the flexible circuit board, and the surfaces of the adhesive structure opposite to each other are respectively bonded to the surfaces of the support structure and the flexible circuit board; the adhesive structure includes a first dam arranged in a ring shape, and a filler adhesive disposed within the first dam; the modulus of the first dam is greater than the modulus of the filler adhesive.
[0007] Optionally, in this embodiment of the disclosure, the first dam is disposed around the outermost edge of the flexible circuit board, and the first dam is spaced at a predetermined distance from the side edge of the support structure near the binding area.
[0008] Optionally, in this embodiment of the present disclosure, a driving chip is further included that is bonded to the flexible display panel in the non-display area; the adhesive structure further includes a second dam located between the first dam and the side edge of the support structure near the bonding area, and the side edge of the second dam near the bonding area overlaps with the side edge of the support structure near the bonding area; the orthographic projection of the driving chip on the support structure falls completely within the area of the orthographic projection of the second dam on the support structure.
[0009] Optionally, in this embodiment of the disclosure, there are at least two driving chips, and the second dam is divided into a first sub-dam that corresponds to each of the driving chips, and a second sub-dam located between two adjacent first sub-dams; the orthographic projection of the driving chip on the support structure falls completely within the area of the orthographic projection of the corresponding first sub-dam on the support structure.
[0010] Optionally, in this embodiment of the disclosure, the second dam is filled with the filler adhesive, and the portion of the filler adhesive located within the first sub-dam has a grooved surface on the side facing away from the display area.
[0011] Optionally, in this embodiment of the present disclosure, a heat-conducting part corresponding to the driving chip is further included; the heat-conducting part is disposed on the side of the support structure away from the display area, and the orthogonal projection of the heat-conducting part on the support structure falls completely within the area of the orthogonal projection of the second dam on the support structure.
[0012] Optionally, in an embodiment of this disclosure, the second dam is filled with thermally conductive adhesive, which completely covers the thermally conductive portion.
[0013] Optionally, in this embodiment of the disclosure, the flexible circuit board further includes at least one exposed copper portion; the adhesive structure further includes a third dam surrounding each exposed copper portion, and conductive adhesive filling each third dam; the conductive adhesive completely covers the corresponding exposed copper portion.
[0014] Accordingly, embodiments of this disclosure provide a display device, comprising:
[0015] Display modules as described in any of the above items.
[0016] Accordingly, this disclosure provides a method for manufacturing a display module, comprising:
[0017] A stacked structure is obtained, comprising a cover plate, a flexible display panel, and a support structure; the flexible display panel includes a display area and a non-display area surrounding the display area.
[0018] On the side of the support structure facing away from the display area, apply a first adhesive along a ring-shaped area and cure the first adhesive to obtain a first dam arranged in a ring shape.
[0019] Apply the second layer of glue inside the first dam;
[0020] In the non-display area, the flexible display panel is bonded to the flexible circuit board;
[0021] The flexible circuit board is bent to the side of the support structure away from the display area;
[0022] The second adhesive is cured to form a cured filler adhesive, resulting in an adhesive structure including the first dam and the filler adhesive; the surfaces of the adhesive structure that are disposed opposite to each other are respectively attached to the surfaces of the support structure and the flexible circuit board; the modulus of the first dam is greater than the modulus of the filler adhesive. Attached Figure Description
[0023] Figure 1 is a schematic diagram of one structure of a display module provided in an embodiment of this disclosure;
[0024] Figure 2 is a top view of one of the flexible display panels in Figure 1 when it is in a flattened state.
[0025] Figure 3 is a schematic diagram of one structure of the display module provided in an embodiment of this disclosure;
[0026] Figure 4 is a top view of one of the flexible display panels in Figure 3 when it is in a flattened state.
[0027] Figure 5 is a schematic diagram of one structure of the display module provided in an embodiment of this disclosure;
[0028] Figure 6 is a top view of one of the flexible display panels in Figure 5 when it is in a flattened state.
[0029] Figure 7 is a schematic diagram of one structure of the display module provided in an embodiment of this disclosure;
[0030] Figure 8 is a top view of one of the flexible display panels in Figure 7 when it is in a flattened state.
[0031] Figure 9 is a flowchart of one method for manufacturing a display module provided in an embodiment of this disclosure. Detailed Implementation
[0032] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. Furthermore, the embodiments and features in the embodiments of this disclosure can be combined with each other without conflict. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.
[0033] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “inner,” “outer,” “upper,” and “lower” are used only to indicate relative positional relationships; when the absolute position of the described objects changes, the relative positional relationship may also change accordingly.
[0034] It should be noted that the dimensions and shapes of the figures in the accompanying drawings do not reflect actual proportions and are intended only to illustrate the content of this disclosure. Furthermore, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.
[0035] In related technologies, to save overall space, conventional OLED modules often use 4 to 6 layers of rigid-flex PCBs with flexible boards, and some areas are single-layer or double-layer boards. These have significant gaps on the back side, which conventional adhesive tape cannot easily fill. In other words, conventional adhesive tape has weak gap-filling capabilities. Furthermore, the cover plate often deforms during use. Under repeated external stress, the adhesive tape at the gaps repeatedly adheres and splits, producing abnormal noise. Simultaneously, the presence of these gaps on the back side of the FPC increases the risk of mold defects in the entire device.
[0036] In view of this, the present disclosure provides a display module, a method for manufacturing the same, and a display device to avoid problems such as abnormal noise and mold marks, and to improve the performance of the display module.
[0037] Figure 1 shows a schematic diagram of one structure of the display module provided in an embodiment of this disclosure. Specifically, the display module includes:
[0038] Flexible display panel 20, support structure 30, flexible circuit board 40 and adhesive structure 50;
[0039] The flexible display panel 20 includes a display area AA and a non-display area BB bent to the back of the display area AA. The non-display area BB includes a bonding area CC that is bonded to the flexible circuit board 40. The support structure 30 is located on the back of the display area AA, and the flexible circuit board 40 is disposed on the side of the support structure 30 away from the display area AA. The adhesive structure 50 is located between the support structure 30 and the flexible circuit board 40, and the surfaces of the adhesive structure 50 that are disposed opposite to each other are respectively bonded to the surfaces of the support structure 30 and the flexible circuit board 40. The adhesive structure 50 includes a first dam 51 arranged in a ring shape and a filler adhesive 52 disposed within the first dam 51. The modulus of the first dam 51 is greater than the modulus of the filler adhesive 52.
[0040] In specific implementation, the display module provided in this embodiment includes a flexible display panel 20, a support structure 30, a flexible circuit board 40, and an adhesive structure 50. For example, the display module also includes a cover plate 10, which is located on one side of the light-emitting surface of the flexible display panel 20 and completely covers the flexible display panel 20, the support structure 30, and the flexible circuit board 40. In this way, the cover plate 10 can protect the flexible display panel 20 to a certain extent. Furthermore, the flexible display panel 20 includes a display area AA and a non-display area BB bent to the back of the display area AA. The non-display area BB includes a bonding area CC that is bonded to the flexible circuit board 40. Figure 1 shows a schematic diagram of one possible division of the display area AA, the non-display area BB, and the bonding area CC.
[0041] Furthermore, the support structure 30 is located on the back of the display area AA, and the flexible circuit board 40 is disposed on the side of the support structure 30 facing away from the display area AA. This ensures both the support performance and structural stability of the display module. In one exemplary embodiment, the support structure 30 includes pressure-sensitive adhesive (PSA), stainless steel (SUS), and copper (Cu) foil, which are sequentially stacked on the back of the display area AA. This ensures both the support performance and heat dissipation of the display module.
[0042] Furthermore, the adhesive structure 50 is located between the support structure 30 and the flexible circuit board 40, ensuring a good fit between them. The surfaces of the adhesive structure 50 are respectively bonded to the surfaces of the support structure 30 and the flexible circuit board 40, further ensuring adhesion. The adhesive structure 50 includes a first dam 51 arranged in a ring shape and a filler adhesive 52 disposed within the first dam 51; the modulus of the first dam 51 is greater than that of the filler adhesive 52. In practical applications, the first dam 51 mainly functions as a barrier, restricting the flow range of the filler adhesive 52; the filler adhesive 52 can fill the area enclosed by the first dam 51 and the recessed portion of the discontinuity on the back of the flexible circuit board. For example, the modulus range of the first dam 51 is 120 kPa to 130 kPa, and the modulus range of the filler adhesive 52 is 60 kPa to 70 kPa. In practical applications, adhesives of the desired modulus can be selected to prepare the first dam 51 and the filler adhesive 52; no limitation is made here. In one exemplary embodiment, the first dam 51 can be an ultraviolet (UV) curable adhesive, which can effectively define the area to be applied subsequently; the filler adhesive 52 can be an adhesive of the same material as the bending zone protectant (MCL) adhesive, and the corresponding adhesive has good flowability. In the actual preparation process, UV curing can be used to cure the adhesive used to prepare the first dam 51; for the curing process of the filler adhesive 52, for example, natural curing or heat curing can be used to cure the adhesive used to prepare the filler adhesive 52.
[0043] In the actual manufacturing process, the fluidity of the filler adhesive 52 can be fully utilized to effectively fill the gaps on the back of the flexible circuit board 40. This not only improves the bonding strength between the support structure 30 and the flexible circuit board 40, but also enhances the overall flatness of the back of the flexible circuit board 40, thereby avoiding problems such as abnormal noise and mold marks on the whole machine and improving the performance of the display module.
[0044] It should be noted that in the actual manufacturing process, a dispensing process can be used to set an adhesive structure 50 between the support structure 30 and the flexible circuit board 40. Compared with conventional adhesive tape, there is no need to add additional adhesive tape and corresponding release film, thereby reducing the cost of the display module to a certain extent. In addition, using the adhesive structure 50 can avoid abnormal noise and molding problems of the display module while ensuring the normal function of the display module. The reduction in display module cost can eliminate the need for the film removal process for the flexible circuit board 40, thereby reducing the production cycle time (TT) of the production line.
[0045] In this embodiment, the extension length of the first cofferdam 51 along the direction parallel to the plane of the supporting structure 30 ranges from 0.2 mm to 0.6 mm. Of course, the specific value of the extension length of the first cofferdam 51 along the direction parallel to the plane of the supporting structure 30 can be set according to actual application needs, and is not limited here. Furthermore, the extension length of the first cofferdam 51 along the direction perpendicular to the plane of the supporting structure 30 ranges from 0.05 mm to 0.2 mm. Of course, the specific value of the extension length of the first cofferdam 51 along the direction perpendicular to the plane of the supporting structure 30 can be set according to actual application needs, and is not limited here.
[0046] In this embodiment, the first cofferdam 51 and the first filler adhesive 52 are different in color. For example, the first cofferdam 51 is red, and the filler adhesive 52 is yellow. This makes it easier for users to effectively distinguish between the first cofferdam 51 and the filler adhesive 52. In the actual preparation process, different colored dyes can be added to the adhesives used to prepare the first cofferdam 51 and the filler adhesive 52 to make the corresponding structures exhibit different color zones. Of course, specific dyes can be selected according to actual application needs to control the specific colors of the first cofferdam 51 and the filler adhesive 52 accordingly, which is not limited here.
[0047] It should be noted that, in this embodiment, unless otherwise specified, the direction indicated by the arrow above the cover plate 10 is the direction of stress application. The corresponding area subjected to this stress undergoes deformation as shown in the figure. Once the stress is removed, the film layer in the corresponding area can return to its original state. In the final product of the actual manufactured display module, if there is no external stress, the relevant film layer of the display module does not deform. The relevant structural diagram is to more clearly show the adhesion between the adhesive structure and the support structure 30 at the deformation point.
[0048] In the embodiments disclosed herein, the adhesive structure 50 can be configured in several ways, but is not limited to these methods.
[0049] In one exemplary embodiment, the first dam 51 is disposed around the outermost edge of the flexible circuit board 40, and the first dam 51 is spaced at a predetermined distance from the side edge of the support structure 30 near the binding area CC.
[0050] Figure 2 shows one of the top views of the flexible display panel 20 in a flattened state during the fabrication of the display module shown in Figure 1. After bending the flexible circuit board 40 to the back of the display area AA, the display module shown in Figure 1 is formed. Specifically, in this display module, the first dam 51 is arranged around the outermost edge of the flexible circuit board 40, and the first dam 51 is separated from the edge of the support structure 30 near the bonding area CC by a preset distance. The specific value of the preset distance can be set according to the actual application needs and is not limited here. In addition, it should be noted that in the exemplary embodiment shown in Figure 2, the area of the support structure 30 corresponding to the display area AA also has multiple hollow structures to ensure the folding performance of the display module.
[0051] In one exemplary embodiment, the display module further includes a driving chip 60 bonded to the flexible display panel 20 in the non-display area BB; the adhesive structure 50 further includes a second dam 70 located between the first dam 51 and the side edge of the support structure 30 near the bonding area CC, and the side edge of the second dam 70 near the bonding area CC overlaps with the side edge of the support structure 30 near the bonding area CC; the orthographic projection of the driving chip 60 on the support structure 30 completely falls within the area of the orthographic projection of the second dam 70 on the support structure 30.
[0052] Referring to Figures 3 and 4, where Figure 3 is a schematic diagram of one structure of the display module provided in this embodiment, and Figure 4 is a top view of one structure when the flexible display panel 20 in Figure 3 is in a flattened state during the manufacturing process, the display module further includes a driver chip 60 bonded to the flexible display panel 20 in the non-display area BB. For example, the driver chip 60 may be a driver integrated circuit (DIC). Furthermore, in this exemplary embodiment, the adhesive structure 50 also includes a second dam 70 located between the first dam 51 and the edge of the support structure 30 near the bonding area CC. For example, the second dam 70 and the first dam 51 may be made of the same material. Additionally, the edge of the second dam 70 near the bonding area CC overlaps with the edge of the support structure 30 near the bonding area CC. In actual manufacturing, compared to the exemplary embodiment shown in Figure 1, the dispensing range can be expanded from the area where the first dam 51 is located to the edge of the support structure 30 near the bonding area CC. In this way, even if the user presses the area corresponding to the cover plate 10 and the driver chip 60, the stress at the location of the driver chip 60 can be effectively released by the glue filled in the second dam 70, thereby preventing the driver chip 60 from peeling or breaking and improving the performance of the display module.
[0053] In this embodiment of the disclosure, there are at least two driving chips 60, and the second dam 70 is divided into a first sub-dam 71 corresponding to each of the driving chips 60, and a second sub-dam 72 located between two adjacent first sub-dams 71; the orthographic projection of the driving chip 60 on the support structure 30 falls completely within the area of the orthographic projection of the corresponding first sub-dam 71 on the support structure 30.
[0054] In practical implementation, at least two driver chips 60 can be installed in the display module to ensure the driving performance of the display module. For example, the number of driver chips 60 can be two or three, depending on the actual application, and is not limited here.
[0055] Taking a display module with two driver chips 60 as an example, and referring to the exemplary embodiments shown in Figures 3 and 4, the second dam 70 is divided into first sub-dams 71, each corresponding to one of the driver chips 60, and second sub-dams 72 located between two adjacent first sub-dams 71; correspondingly, there are two first sub-dams 71 and one second sub-dam 72. In the actual manufacturing process, the adhesive used to prepare the first dam 51 and the adhesive used to prepare the second dam 70 can be of the same material, thus ensuring the manufacturing efficiency of the adhesive structure 50. Furthermore, the orthographic projection of the driver chip 60 on the support structure 30 completely falls within the area of the orthographic projection of the corresponding first sub-dam 71 on the support structure 30. In this way, even if the user presses the area of the cover plate 10 corresponding to the driver chip 60, the adhesive filled in the first sub-dam 71 can effectively release the stress at the location of the driver chip 60, thereby preventing the driver chip 60 from falling off or breaking, and improving the performance of the display module.
[0056] Referring again to the exemplary embodiments shown in Figures 3 and 4, the second dam 70 is filled with the filler adhesive 52, and the portion of the filler adhesive 52 located within the first sub-dam 71 has a groove 80 on the side of its surface facing away from the display area AA.
[0057] In the specific implementation process, while applying adhesive 52 to the area enclosed by the first dam 51, adhesive can also be applied to the area enclosed by the second dam 70, thereby improving the preparation efficiency of the adhesive structure 50. Furthermore, the portion of the adhesive 52 located within the first sub-dam 71 facing away from the display area AA is provided with a groove 80. This groove 80 effectively releases external pressure transmitted from the cover plate 10 surface during user operation, thus preventing stress concentration in the area where the driver chip 60 is located and effectively preventing external stress from causing the driver chip 60 to detach or break.
[0058] In one exemplary embodiment, the display module further includes a heat-conducting part 90 corresponding to the driving chip 60; the heat-conducting part 90 is disposed on the side of the support structure 30 away from the display area AA, and the orthographic projection of the heat-conducting part 90 on the support structure 30 completely falls within the area of the orthographic projection of the second dam 70 on the support structure 30.
[0059] Referring to Figures 5 and 6, where Figure 5 is a schematic diagram of one structure of the display module provided in this embodiment, and Figure 6 is a top view of one structure when the flexible display panel 20 in Figure 5 is in a flattened state during the manufacturing process, the display module further includes a heat-conducting part 90 corresponding to the driving chip 60. For example, the heat-conducting part 90 can be a graphite patch. Furthermore, the heat-conducting part 90 is disposed on the side of the support structure 30 away from the display area AA, and the orthogonal projection of the heat-conducting part 90 on the support structure 30 completely falls within the area of the orthogonal projection of the second dam 70 on the support structure 30. For example, the orthogonal projection of the driving chip 60 on the support structure 30 completely falls within the area of the orthogonal projection of the heat-conducting part 90 on the support structure 30. This improves the heat conduction effect at the location of the driving chip 60, effectively avoiding display abnormalities such as temperature drift caused by the heating of the driving chip 60.
[0060] In one exemplary embodiment, still referring to FIG5, the second dam 70 is filled with thermally conductive adhesive 91, which completely covers the thermally conductive part 90. In this way, the thermally conductive adhesive 91 and the thermally conductive part 90 further improve the heat conduction effect at the location of the driver chip 60, effectively avoiding display abnormalities such as temperature drift caused by the heat generated by the driver chip 60.
[0061] In one exemplary embodiment, the flexible circuit board 40 further includes at least one copper exposure portion 92; the adhesive structure 50 further includes a third dam 93 surrounding each copper exposure portion 92, and conductive adhesive 94 filled within each third dam 93; the conductive adhesive 94 completely covers the corresponding copper exposure portion 92.
[0062] It should be noted that in practical applications, due to the overall radio frequency requirements, the exposed copper area on the FPC surface needs to be grounded and connected to the copper foil or cover tape in the support structure 30. This cover tape can be located on the side of the driver chip 60 away from the display area AA and is used to shield the driver chip 60 from external electromagnetic interference, thereby ensuring the operating performance of the driver chip 60. In practical applications, due to electromagnetic interference (EMI) and the gap between the exposed copper area and the main body area of the FPC and the cover tape (CVL) opening, there is a risk that external stress may cause poor adhesion or insufficient adhesion area, resulting in the overall system failing the radio frequency test (Not Good, NG).
[0063] In specific implementation, the flexible circuit board 40 also includes at least one copper-exposed portion 92. This copper-exposed portion 92 can be one, two, or more, without limitation. Furthermore, the adhesive structure 50 includes third dams 93 surrounding each copper-exposed portion 92, and conductive adhesive 94 filling each third dam 93. In actual fabrication, the adhesive used to prepare the third dams 93 can be the same material used to prepare the first dams 51, thereby improving the fabrication efficiency of the adhesive structure 50. Moreover, due to the fluidity of the conductive adhesive 94 filling each third dam 93, the conductive adhesive 94 effectively fills the gaps in the corresponding areas of the copper-exposed portions 92, thereby improving the adhesion of the corresponding areas of the copper-exposed portions 92 and providing protection against abnormal noise and poor molding of the entire machine. Simultaneously, the conductive adhesive 94 can be grounded to the copper-exposed portions 92, thus achieving electromagnetic shielding and electrostatic shielding effects.
[0064] Referring to Figures 7 and 8, where Figure 7 is a schematic diagram of one structure of the display module provided in this embodiment, and Figure 8 is a top view of one structure of the flexible display panel 20 in Figure 7 in a flattened state during the manufacturing process, in the exemplary embodiments shown in Figures 7 and 8, the flexible circuit board 40 includes two copper drain portions 92 disposed on the side away from the bonding area CC. These two copper drain portions 92 are respectively disposed on the ends of the flexible circuit board 40 corresponding to the corresponding driving chips 60, effectively avoiding the influence of the copper drain portions 92 on the surrounding wiring layout.
[0065] In this embodiment, the display module may include other film layer structures besides the aforementioned film layers. For example, the display module further includes a back film 95 located on the side of the support structure 30 near the display area AA. This back film 95 is located between the support structure 30 and the flexible display panel 20, thereby ensuring the support performance of the flexible display panel 20. The display module also includes an adhesive layer 96 located between the cover plate 10 and the flexible display panel 20, which allows the cover plate 10 and the flexible display panel 20 to be bonded together. For example, the adhesive layer 96 may be an optically clear adhesive (OCA) or an optically clear resin (OCR). The display module also includes a light filter layer 97 located between the adhesive layer 96 and the flexible display panel 20. For example, the light filter layer 97 may be a polarizer or a color filter. Polarizing films are generally quite thick. When the filter layer 97 uses a color filter, a Color Filter On Encapsulation (COE) technology is employed to ensure a thin and light design for the display module. Of course, other film layer structures of the display module can be configured according to actual application needs. Specific configurations can be implemented by referring to relevant technologies, and are not limited here.
[0066] Based on the same disclosed concept, embodiments of this disclosure also provide a display device, which includes the display module as described above.
[0067] Since the principle by which this display device solves the problem is similar to that of the aforementioned display module, the implementation of this display device can refer to the implementation of the aforementioned display module, and the repeated parts will not be described again.
[0068] In specific implementations, the display device can be an OLED flexible display device. The display device provided in the embodiments of the present invention can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator. Other essential components of the display device are those that should be understood by those skilled in the art, and will not be described in detail here, nor should they be construed as limiting the present invention.
[0069] Based on the same disclosed concept, as shown in Figure 9, this disclosure also provides a method for manufacturing a display module, comprising:
[0070] S101: Obtain a stacked structure provided with a flexible display panel and a support structure; the flexible display panel includes a display area and a non-display area surrounding the display area;
[0071] S102: Apply a first adhesive to the surface of the support structure on the side opposite to the display area along a ring-shaped region, and cure the first adhesive to obtain a first dam arranged in a ring shape.
[0072] S103: Apply the second adhesive inside the first dam;
[0073] S104: In the non-display area, the flexible display panel is bonded to the flexible circuit board;
[0074] S105: Bend the flexible circuit board to the side of the support structure away from the display area;
[0075] S106: The second adhesive is cured to form a cured filler adhesive, resulting in an adhesive structure including the first dam and the filler adhesive; the surfaces of the adhesive structure that are disposed opposite to each other are respectively attached to the surfaces of the support structure and the flexible circuit board; the modulus of the first dam is greater than the modulus of the filler adhesive.
[0076] In the specific implementation process, steps S101 to S106 are implemented as follows:
[0077] First, the flexible display panel 20 is bonded to the cover plate 10 and the support structure 30 respectively, thereby obtaining a stacked structure comprising the cover plate 10, the flexible display panel 20, and the support structure 30. The flexible display panel 20 includes a display area and a non-display area BB surrounding the display area. Then, using a dispensing process, a first adhesive is applied along a ring-shaped area on the surface of the support structure 30 away from the display area, and the first adhesive is cured to obtain a first ring-shaped dam 51. For example, the first adhesive can be a high-modulus adhesive of the UV-curing type, applied along the ring-shaped area, and then cured using UV light to form the first ring-shaped dam 51. Then, a second adhesive is applied within the first dam 51 using a dispensing process.
[0078] Then, in the non-display area BB, the flexible display panel 20 is bonded to the flexible circuit board 40. The flexible circuit board 40 is then bent to the side of the support structure 30 away from the display area. Correspondingly, the back side of the flexible circuit board 40 is bonded to the support structure 30 via a first dam 51 and a second adhesive. Because the second adhesive has good fluidity, it can fully fill the gap on the back side of the flexible circuit board 40, ensuring the avoidance of abnormal noise and mold-related problems in the entire device. The second adhesive is then cured to form a cured filler adhesive 52, resulting in an adhesive structure 50 including the first dam 51 and the filler adhesive 52. For example, the second adhesive can be cured naturally or by heat curing. The modulus of the filler adhesive 52 is greater than that of the first dam 51. For example, the modulus of the first dam 51 ranges from 120 kPa to 130 kPa, and the modulus of the filler adhesive 52 ranges from 60 kPa to 70 kPa. Correspondingly, the filler adhesive 52 has good flowability. Moreover, the surfaces of the adhesive structure 50, which are positioned opposite each other, are respectively bonded to the surfaces of the support structure 30 and the flexible circuit board 40, thereby ensuring the structural stability of the display module.
[0079] Although preferred embodiments of this disclosure have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this disclosure.
[0080] Obviously, those skilled in the art can make various modifications and variations to this disclosure without departing from its spirit and scope. Therefore, if such modifications and variations fall within the scope of the claims of this disclosure and their equivalents, this disclosure is also intended to include such modifications and variations.
Claims
1. A display module, wherein, include: Flexible display panel, support structure, flexible circuit board and adhesive structure; The flexible display panel includes a display area and a non-display area bent to the back of the display area, the non-display area including a bonding area bonded to the flexible circuit board; the support structure is located on the back of the display area, and the flexible circuit board is disposed on the side of the support structure opposite to the display area; the adhesive structure is located between the support structure and the flexible circuit board, and the surfaces of the adhesive structure opposite to each other are respectively bonded to the surfaces of the support structure and the flexible circuit board; the adhesive structure includes a first dam arranged in a ring shape, and a filler adhesive disposed within the first dam; the modulus of the first dam is greater than the modulus of the filler adhesive.
2. The display module as described in claim 1, wherein, The first dam is arranged around the outermost edge of the flexible circuit board, and the first dam is spaced at a predetermined distance from the edge of the support structure near the binding area.
3. The display module as described in claim 2, wherein, It also includes a driver chip bonded to the flexible display panel in the non-display area; the adhesive structure also includes a second dam located between the first dam and the side edge of the support structure near the bonding area, and the side edge of the second dam near the bonding area overlaps with the side edge of the support structure near the bonding area; the orthographic projection of the driver chip on the support structure falls completely within the area of the orthographic projection of the second dam on the support structure.
4. The display module as described in claim 3, wherein, The driving chip is at least two, and the second dam is divided into a first sub-dam that corresponds to each of the driving chips, and a second sub-dam located between two adjacent first sub-dams; the orthographic projection of the driving chip on the support structure falls completely within the area of the orthographic projection of the corresponding first sub-dam on the support structure.
5. The display module as described in claim 4, wherein, The second dam is filled with the filler adhesive, and the portion of the filler adhesive located within the first sub-dam has a grooved surface on the side facing away from the display area.
6. The display module as described in claim 3, wherein, It also includes a heat-conducting part corresponding to the driving chip; the heat-conducting part is disposed on the side of the support structure away from the display area, and the orthogonal projection of the heat-conducting part on the support structure falls completely within the area of the orthogonal projection of the second dam on the support structure.
7. The display module as described in claim 6, wherein, The second dam is filled with thermally conductive adhesive, which completely covers the thermally conductive part.
8. The display module according to any one of claims 1-7, wherein, The flexible circuit board further includes at least one exposed copper portion; the adhesive structure further includes a third dam surrounding each exposed copper portion, and conductive adhesive filling each third dam; the conductive adhesive completely covers the corresponding exposed copper portion.
9. A display device, wherein, include: The display module as described in any one of claims 1-8.
10. A method for manufacturing a display module, wherein, include: A stacked structure is obtained, comprising a cover plate, a flexible display panel, and a support structure; the flexible display panel includes a display area and a non-display area surrounding the display area. On the side of the support structure facing away from the display area, apply a first adhesive along a ring-shaped area and cure the first adhesive to obtain a first dam arranged in a ring shape. Apply the second layer of glue inside the first dam; In the non-display area, the flexible display panel is bonded to the flexible circuit board; The flexible circuit board is bent to the side of the support structure away from the display area; The second adhesive is cured to form a cured filler adhesive, resulting in an adhesive structure including the first dam and the filler adhesive; the surfaces of the adhesive structure that are disposed opposite to each other are respectively attached to the surfaces of the support structure and the flexible circuit board; the modulus of the first dam is greater than the modulus of the filler adhesive.