Heat dissipation apparatus for server, and server

Abstract

The present application relates to the technical field of air-cooled heat dissipation devices, and discloses a heat dissipation apparatus for a server, and a server. The heat dissipation apparatus comprises at least one composite heat dissipation panel, at least one heat conductor and at least one air-cooled heat dissipation assembly. The composite heat dissipation panel is provided with a first surface, the first surface is used for abutting against a heat dissipation surface of a heating part, a liquid cooling cavity and a heat equalizing cavity are provided in the composite heat dissipation panel, and the heat equalizing cavity and the liquid cooling cavity are stacked in a direction away from the first surface. The portion of the heat conductor close to a first end of the heat conductor is arranged in the composite heat dissipation panel, and is located between the heat equalizing cavity and the liquid cooling cavity. The portion of the heat conductor close to a second end of the heat conductor is arranged in the air-cooled heat dissipation assembly. In this way, the heat dissipation uniformity of servers is improved, noise is reduced, and loss of data is avoided.

Description

Server cooling system and server

[0001] Cross-reference of related applications

[0002] This application claims priority to Chinese Patent Application No. 202411922162.0, filed on December 25, 2024, entitled “Server Heat Dissipation Device and Server”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of air-cooled heat dissipation equipment technology, specifically to server heat dissipation devices and servers. Background Technology

[0004] During server operation, the processor generates a significant amount of heat. When the internal temperature of the server becomes too high, the performance of the hardware components will be affected. For example, the processor may automatically reduce its frequency due to overheating, thereby reducing processing speed and impacting server efficiency. High temperatures accelerate the aging process of hardware, shortening the server's lifespan. Furthermore, high temperatures severely affect server stability, potentially leading to system crashes and data loss. Therefore, server heat dissipation is a crucial factor affecting the efficient operation of a server.

[0005] In related technologies, as processor manufacturing processes continue to improve, processor power consumption also increases, which in turn raises the requirements for heat sinks. Air cooling and liquid cooling are the mainstream heat dissipation methods for servers. In order to improve heat dissipation efficiency, air cooling radiators are becoming larger and larger; liquid cooling radiators increase the circulation speed of the cooling medium to improve heat dissipation efficiency.

[0006] However, the increased size of air-cooled radiators places higher demands on the overall chassis size, and the high temperature of the air passing through the processor leads to excessively high temperatures in components located behind the processor within the server, resulting in poor cooling performance and impacting the server's efficient operation. At the same time, the fan speed also increases, leading to increased server noise. On the other hand, liquid-cooled radiators often experience problems such as leakage or frequent CDU (Cooling Distribution Unit) failures, causing processor overheating and data loss issues on the server. Summary of the Invention

[0007] This application provides a server heat dissipation device and a server to improve server heat dissipation uniformity, reduce noise, and prevent data loss.

[0008] On one hand, this application provides a server heat dissipation device, including at least one composite heat sink, at least one heat conductor, and at least one air-cooled heat dissipation component. The composite heat sink has a first surface for contacting the heat dissipation surface of the heat-generating part. The composite heat sink is provided with a liquid cooling cavity and a heat spreader cavity, which are stacked in a direction away from the first surface. The portion of the heat conductor near its first end is disposed in the composite heat sink and located between the heat spreader cavity and the liquid cooling cavity. The portion of the heat conductor near its second end is disposed in the air-cooled heat dissipation component.

[0009] Beneficial effects: By abutting the first surface of the composite heat sink with the heat dissipation surface of the heat-generating component (such as a processor), the heat dissipation cavity and the liquid cooling cavity are stacked in a direction away from the first surface. The part of the heat conductor near its first end is placed inside the composite heat sink and located between the heat dissipation cavity and the liquid cooling cavity. Since the heat dissipation cavity continuously circulates between liquid and gas through a phase change medium, it can achieve rapid heat absorption and transfer, thereby enhancing the cooling effect of the composite heat sink on the heat dissipation surface of the heat-generating component. This allows the heat generated by the heat-generating component to be absorbed and transferred out by the composite heat sink in a timely manner and transferred to various parts of the composite heat sink.

[0010] Part of the heat on the composite heat sink is transferred to the air-cooled heat dissipation components through the heat conductor, and then dissipated through heat exchange by the airflow generated by the fan inside the server. The other part of the heat is absorbed by the cooling medium circulating in the liquid cooling cavity and discharged to the outside of the server with the cooling medium.

[0011] Because the cooling medium in the liquid cooling chamber carries away some of the heat generated by the heat-generating components, it reduces the amount of heat carried away by the airflow generated by the fan. As a result, the temperature rise of the airflow is reduced after passing through the air-cooled heat dissipation components and heat-generating components. Therefore, when passing through the components behind the heat-generating components, it can effectively cool the components at the back of the server. This allows for uniform temperature distribution among the various operating components within the server without increasing the fan size or fan speed, ensuring high server operating efficiency, improving server performance, and avoiding the problems of increased server chassis size and excessive server noise.

[0012] Secondly, when the liquid cooling circuit malfunctions or the server's environment experiences a power outage, and the cooling medium stops circulating, the server can adjust the fan speed to ensure that the heat-generating components can continue to operate, thus preventing the server from crashing due to overheating and causing data loss in a short period of time. Furthermore, in the event of a sudden power outage, the server can use its built-in power supply unit (such as a BBU, Battery Backup Unit) to provide short-term power to the system fans, allowing them to run for a certain period and preventing the heat-generating components from overheating. This gives the server time to save data and avoid data loss.

[0013] In some embodiments, the heat conductor is a heat pipe, and the portion of the heat pipe located within the composite heat sink is connected to the heat dissipation cavity.

[0014] In some embodiments, the height of the heat pipe gradually decreases from the second end to the first end along a third direction, wherein the third direction is perpendicular to the first surface.

[0015] In some embodiments, multiple heat conductors are provided, and the portions of the multiple heat conductors located within the composite heat sink are spaced apart along a first direction. The portions of the multiple heat conductors located within the composite heat sink all extend along a second direction, wherein the first direction is parallel to the first surface, and the second direction is perpendicular to the first direction and parallel to the first surface.

[0016] In some embodiments, the portion of the heat conductor located within the air-cooled heat dissipation assembly is flat along a third direction, wherein the third direction is perpendicular to the first surface; and / or, the portion of the heat conductor located within the composite heat dissipation plate is flat along a first direction, and the portion near the heat dissipation cavity is planar.

[0017] In some embodiments, heat exchange sections are provided on two inner surfaces of the heat exchange cavity, respectively near the first surface and the heat conductor, and the heat exchange sections are finned or porous.

[0018] In some embodiments, the composite heat sink includes a liquid cooling plate and a heat spreader plate. The first surface and the heat spreader cavity are both located on the heat spreader plate. The portion of the heat conductor near the first end is connected to the heat spreader plate. The liquid cooling cavity is located inside the liquid cooling plate. The surface of the heat spreader plate opposite to the first surface is the second surface. The second surface abuts against the liquid cooling plate. The liquid cooling plate and the heat spreader plate are detachably connected.

[0019] In some embodiments, at least a portion of the heat conductor located inside the composite heat sink protrudes from the second surface, and a groove is provided on the surface of the liquid cooling plate that contacts the second surface, the groove accommodating the portion of the heat conductor protruding from the second surface.

[0020] In some embodiments, a fixing frame is also included. The fixing frame is annular, and a fixing flange is provided on the edge of the liquid cooling plate. The inner edge of the fixing frame is pressed and engaged with the fixing flange. The fixing frame is used to fix and connect to the motherboard assembly.

[0021] In some embodiments, a first thermally conductive adhesive layer is provided between the groove and the heat conductor; and / or, a second thermally conductive adhesive layer is provided between the second surface and the liquid cooling plate.

[0022] In some embodiments, the system further includes multiple isolation chambers and multiple liquid cooling pipelines. The input and output ends of the liquid cooling chamber are connected to the liquid cooling pipelines. Each liquid cooling pipeline is disposed in a separate isolation chamber, which is used to connect to the motherboard assembly.

[0023] In some embodiments, a plurality of water-blocking ribs are provided at intervals along the direction in which the isolation tank extends.

[0024] In some embodiments, there are multiple composite heat sinks, each composite heat sink is connected to at least one heat conductor, and the liquid cooling cavities in the multiple composite heat sinks are connected in series and used to communicate with the cooling medium circuit.

[0025] In some embodiments, multiple air-cooled heat dissipation components are provided, and each air-cooled heat dissipation component is connected to a portion of the multiple heat conductors.

[0026] On the other hand, this application also provides a server, including: a server heat dissipation device as described in any of the above embodiments.

[0027] Beneficial effects: Since the server includes a server cooling system, it has the same effect as the server cooling system, so it will not be elaborated here. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the specific embodiments or related technologies of this application, the drawings used in the description of the specific embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0029] Figure 1 is an axonometric view of a server heat dissipation device according to an embodiment of this application;

[0030] Figure 2 is an axonometric view of a server heat dissipation device according to an embodiment of this application;

[0031] Figure 3 is a top view of a server heat dissipation device according to an embodiment of this application;

[0032] Figure 4 is a cross-sectional view of section AA in Figure 3;

[0033] Figure 5 is an axonometric view of a heat dissipation device for a server according to an embodiment of this application;

[0034] Figure 6 is an axonometric view of a liquid cooling plate in a server heat dissipation device according to an embodiment of this application;

[0035] Figure 7 is an axial view of the isolation tank and liquid cooling pipeline in a server heat dissipation device according to an embodiment of this application;

[0036] Figure 8 is an axial view of the isolation tank shell in a server heat dissipation device according to an embodiment of this application;

[0037] Figure 9 is an axial view of the bottom surface of the heat dissipation cavity in a server heat dissipation device according to an embodiment of this application;

[0038] Figure 10 is an axonometric view of the isolation tank in another server heat dissipation device according to an embodiment of this application.

[0039] Explanation of reference numerals in the attached drawings: X, first direction; Y, second direction; Z, third direction; 1, composite heat sink; 2, heat conductor; 3, air-cooled heat dissipation assembly; 4, isolation tank shell; 5, liquid cooling pipeline; 6, fixing frame; 11, first surface; 12, liquid cooling cavity; 13, heat dissipation cavity; 14, liquid cooling plate; 15, heat dissipation plate; 16, second surface; 17, groove; 121, liquid outlet; 122, liquid inlet; 131, high position area; 132, low position area; 21, heat pipe; 41, water baffle fin; 141, fixing flange. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0041] In related technologies, during server operation, the processor generates a significant amount of heat. When the internal temperature of the server becomes too high, the performance of the hardware components will be affected. For example, the processor may automatically reduce its frequency due to overheating, thereby reducing processing speed and impacting server operating efficiency. High-temperature environments accelerate the aging process of hardware, shortening the server's lifespan. Furthermore, high-temperature environments severely affect server stability, potentially leading to system crashes and data loss. Therefore, server heat dissipation is a crucial factor affecting the efficient operation of a server.

[0042] As processor manufacturing processes continue to improve, processor power consumption also increases, leading to higher demands on heat sinks. Air cooling and liquid cooling are the mainstream heat dissipation methods for servers. To improve heat dissipation efficiency, air coolers are becoming increasingly larger, while liquid coolers increase the circulation speed of the cooling medium to improve heat dissipation efficiency.

[0043] However, the increased size of air-cooled radiators places higher demands on the overall chassis size, and the high temperature of the air passing through the processor leads to excessively high temperatures in components located behind the processor within the server, resulting in poor cooling performance and impacting the server's efficient operation. At the same time, the fan speed also increases, leading to increased server noise. On the other hand, liquid-cooled radiators often experience problems such as leakage or frequent CDU (Cooling Distribution Unit) failures, causing processor overheating and data loss issues on the server.

[0044] Therefore, this application provides a server heat dissipation device and a server to improve the uniformity of server heat dissipation, reduce noise, and prevent data loss.

[0045] The embodiments of this application are described below with reference to Figures 1 to 10.

[0046] According to an embodiment of this application, a server heat dissipation device is provided, as shown in Figures 1 to 4, including at least one composite heat sink 1, a heat conductor 2, and an air-cooled heat dissipation component 3, the specific scheme of which is as follows.

[0047] As shown in Figure 1, at least one composite heat sink 1 is provided. In some embodiments, the composite heat sink 1 is a plate with good thermal conductivity, such as a copper plate or an aluminum plate. The composite heat sink 1 has a first surface 11, which is used to abut against the heat dissipation surface of the heat-generating component to achieve the fit between the first surface 11 and the heat-generating component and improve the heat exchange efficiency between the composite heat sink 1 and the heat-generating component. As shown in Figure 3, the composite heat sink 1 is provided with a liquid cooling cavity 12 and a heat dissipation cavity 13.

[0048] In some embodiments, the heat exchanger 13 can be a VC heat exchanger (VC, Vapor-Chamber, vacuum chamber heat exchanger technology); the heat exchanger 13 and the liquid cooling chamber 12 are stacked in a direction away from the first surface 11, and the liquid cooling chamber 12 is used to communicate with the cooling medium circuit to achieve liquid cooling.

[0049] As shown in Figure 4, at least one heat conductor 2 is provided, and the specific number can be selected and set according to the specific size of the composite heat sink 1. The part of the heat conductor 2 near its first end is set in the composite heat sink 1 and is located between the heat dissipation cavity 13 and the liquid cooling cavity 12 to exchange heat with the composite heat sink 1.

[0050] As shown in Figure 1, the air-cooled heat dissipation component 3 has an air-cooled heat dissipation structure. At least one air-cooled heat dissipation component 3 is provided, and the specific number can be selected based on the number of heat conductors 2 and the space available in the server. The portion of the heat conductor 2 near its second end is located within the air-cooled heat dissipation component 3 to provide air cooling for the heat conductor 2. In some embodiments, the air-cooled heat dissipation component 3 has fins or a porous honeycomb-shaped heat dissipation section, allowing heat to diffuse into the air through air intake. Of course, a fan can also be provided on the air-cooled heat dissipation component 3. Integrating the heat dissipation section and the fan into one unit can enhance the heat dissipation effect of the air-cooled heat dissipation component 3.

[0051] The aforementioned "first surface 11 is used to abut against the heat dissipation surface of the heat-generating part" means that the composite heat sink 1 is pressed against the heat dissipation surface of the heat-generating part under a certain pressure. The pressure can be set according to actual needs, and of course, the pressure value can also be 0. In some embodiments, the heat-generating part can be a processor, etc.

[0052] The heat conductor 2 can be a copper strip, aluminum strip, or heat pipe 21, or other objects with thermal conductivity.

[0053] In some embodiments, the liquid cooling cavity 12 can be a rectangular cavity, and a finned portion or a porous structure portion is provided on the surface of the liquid cooling cavity 12 near the first surface 11. The finned portion consists of multiple plates arranged side by side at intervals, which can enhance the heat exchange efficiency between the cooling medium and the composite heat dissipation plate 1 in the liquid cooling cavity 12. The porous structure portion can be a honeycomb-shaped heat-conducting surface with interconnected holes. Of course, the heat-conducting surface is made of heat-conducting metal wire welded together, which can also enhance the heat exchange efficiency between the cooling medium and the composite heat dissipation plate 1 in the liquid cooling cavity 12.

[0054] In some embodiments, a plurality of partitions are spaced apart in the liquid cooling cavity 12, and the partitions extend along the flow direction of the cooling medium in the liquid cooling cavity 12 to divide the liquid cooling cavity 12 into a plurality of liquid cooling channels. In some embodiments, the extension direction of the liquid cooling channels can be any direction.

[0055] As shown in Figure 1, taking the heat dissipation of the processor in the server as an example, the first surface 11 of the composite heat sink 1 is brought into contact with the heat-generating surface of the processor (in some embodiments, a thermally conductive silicone grease layer is provided between the first surface 11 and the processor to enhance the heat exchange efficiency), and the composite heat sink 1 is fixed by the fixing frame 6. The fixing frame 6 is connected to the motherboard in the server through an elastic element so that the composite heat sink 1 and the processor abut against each other under a certain pressure. The elastic element can be an elastic compression spring or a screw with a spring sleeve, etc.

[0056] The air-cooled heat dissipation component 3 is placed in the path of the air-cooled airflow inside the server, so that the air-cooled airflow can enter the air-cooled heat dissipation component 3 and cool it down. Of course, the air-cooled heat dissipation component 3 can also be integrated with the fan in the server. The input and output ends of the liquid cooling chamber 12 are connected to the cooling medium circuit, and the cooling medium is circulated through it, so that the server can be cooled down by air cooling and liquid cooling at the same time during the operation of the server.

[0057] In some embodiments, as shown in Figures 1 to 4, the first surface 11 of the composite heat sink 1 abuts against the heat dissipation surface of the processor, and the heat dissipation cavity 13 and the liquid cooling cavity 12 are stacked sequentially in a direction away from the first surface 11. The portion of the heat conductor 2 near its first end is disposed in the composite heat sink 1 and located between the heat dissipation cavity 13 and the liquid cooling cavity 12. Since the heat dissipation cavity continuously circulates between liquid and gas through a phase change medium, it can achieve rapid absorption and transfer of heat, thereby enhancing the cooling effect of the composite heat sink 1 on the heat dissipation surface of the processor. This allows the heat generated by the processor to be absorbed and transferred out by the composite heat sink 1 in a timely manner and transferred to various parts of the composite heat sink 1.

[0058] Part of the heat on the composite heat sink 1 is transferred to the air-cooled heat dissipation component 3 through the heat conductor 2, and is dissipated by heat exchange through the airflow generated by the fan in the server. The other part of the heat is absorbed by the cooling medium circulating in the liquid cooling cavity 12 and discharged to the outside of the server with the cooling medium.

[0059] Because the cooling medium in the liquid cooling cavity 12 carries away some of the heat generated by the processor, it reduces the heat carried away by the airflow generated by the fan. As a result, the temperature rise of the airflow after passing through the air-cooled heat dissipation component 3 and the processor is reduced. Therefore, when passing through the components behind the processor, it can effectively cool the components at the back of the server. This allows for uniformity of the ambient temperature of various operating components within the server without increasing the fan size or fan speed, ensuring high server operating efficiency, improving server performance, and avoiding the problems of increased server chassis size and excessive server noise.

[0060] Secondly, when the liquid cooling circuit malfunctions or the server's environment experiences a power outage, and the cooling medium stops circulating, the server can adjust the fan speed to ensure the processor continues to operate, thus preventing the server from crashing due to overheating and causing data loss in a short period of time. Furthermore, in the event of a sudden power outage, the server can use its built-in power supply unit (such as a BBU, Battery Backup Unit) to provide short-term power to the system fans, allowing them to run for a certain period and preventing the processor from overheating. This gives the server time to save data and avoid data loss.

[0061] Meanwhile, the heat generated by the processor is first exchanged through the heat conductor 2, and then through the liquid cooling cavity 12. Thus, in the event of a malfunction or power outage in the cooling medium circuit, the heat conductor 2, being closer to the first surface 11, can absorb the heat transferred from the processor more quickly and as much as possible, effectively cooling and dissipating the heat from the processor and ensuring its performance.

[0062] As shown in FIG4 in some embodiments, the heat conductor 2 is a heat pipe 21, and there is sintered copper powder inside the heat pipe 21. The sintered copper powder forms a large number of interconnected capillary channels, which can increase the contact area between the phase change medium and the inner wall of the heat pipe 21 and improve the heat exchange efficiency.

[0063] In some embodiments, a heat pipe 21 is used to connect the composite heat sink 1 and the air-cooled heat dissipation component 3. The phase change medium in the heat pipe 21 is heated at the composite heat sink 1 and turns into a gas. It is then transferred along the heat pipe 21 to the air-cooled heat dissipation component 3. After being cooled by air, it turns into a liquid and flows back to the composite heat sink 1, thereby achieving the function of heat conduction. The heat conduction rate is fast, which can improve the heat conduction efficiency and the air-cooling efficiency.

[0064] In some embodiments, as shown in FIG4, the heat conductor 2 is a heat pipe 21. The part of the heat pipe 21 located in the composite heat dissipation plate 1 is connected to the heat dissipation cavity 13. That is, the part of the heat pipe 21 located in the composite heat dissipation plate 1 is connected to the interior of the heat dissipation cavity 13. The phase change medium in the heat dissipation cavity 13 can directly enter the heat pipe 21 and be transferred to the air-cooled heat dissipation component 3 through the heat pipe 21 for cooling.

[0065] In some embodiments, the portion of the heat pipe 21 located within the composite heat sink 1 may be partially connected to the heat dissipation cavity 13 along its axial direction, or the entire portion of the heat pipe 21 may be connected to the heat dissipation cavity 13 along its axial direction. The connection method may be detachable, such as by inserting through a sliding sealing structure or by threaded sealing connection. Of course, the heat pipe 21 and the heat dissipation cavity 13 may be set as an integrally formed structure, which can avoid the risk of leakage of phase change medium.

[0066] In some embodiments, as shown in FIG4, by directly connecting the heat pipe 21 to the heat exchange cavity 13, the heat exchange cavity 13 does not need to absorb heat from the processor. After the phase change medium is converted into a gaseous state, it is converted into a liquid state at the inner top of the heat exchange cavity 13 away from the first surface 11. The heat is then transferred to the heat pipe 21 through the upper wall of the heat exchange plate, and a gaseous phase change medium is formed in the heat pipe 21, so that the heat is discharged from the external environment in the air-cooled heat dissipation assembly 3.

[0067] The heat absorbed by the heat-generating part of the processor by the heat vapor chamber 13 can be directly transferred into the heat pipe 21 after the phase change medium is converted into a gaseous state. The heat is then transferred to the air-cooled heat dissipation component 3 for air cooling, avoiding the need for the heat to undergo two phase changes between the heat vapor chamber and the heat pipe 21. This improves the heat transfer efficiency and enhances the air cooling effect.

[0068] In some embodiments, the height of the heat pipe 21 gradually decreases along the third direction Z from the second end to the first end, wherein the third direction Z is perpendicular to the first surface 11; that is, the height of the heat pipe 21 gradually decreases along the third direction Z as it extends from one end of the air-cooled heat dissipation assembly 3 toward the composite heat dissipation plate 1.

[0069] In some embodiments, by setting the height of the heat pipe 21 to gradually decrease from the second end to the first end along the third direction Z, it is possible to facilitate the reflux of the liquid phase change medium and the diffusion of the gaseous phase change medium toward the air-cooled heat dissipation component 3, thereby improving the heat exchange efficiency.

[0070] As shown in Figures 1 and 4 in some embodiments, multiple heat conductors 2 are provided. The portions of the multiple heat conductors 2 located within the composite heat sink 1 are spaced apart along the first direction X. The portions of the multiple heat conductors 2 located within the composite heat sink 1 all extend along the second direction Y. The first direction X is parallel to the first surface 11, and the second direction Y is perpendicular to the first direction X and parallel to the first surface 11. That is, the portions of the multiple heat conductors 2 located within the composite heat sink 1 are all equidistant from the first surface 11 and are uniformly distributed.

[0071] It is worth noting that although the portions of the multiple heat conductors 2 located inside the composite heat sink 1 extend along the second direction Y and are spaced apart in the first direction X, the arrangement of the portions of the multiple heat conductors 2 located outside the composite heat sink 1 is not restricted and can be adjusted according to requirements and space arrangement, but usually a smooth transition is made.

[0072] In some embodiments, as shown in FIG1, multiple air-cooled heat dissipation components 3 are provided, and each air-cooled heat dissipation component 3 is connected to a portion of the multiple heat conductors 2. In some embodiments, the number of heat conductors 2 connected to a composite heat dissipation plate 1 is 2 to 8, which can be any one of 2, 4, 6 and 8. As shown in FIG1, it can be 6. In this case, every 2 heat conductors 2 share one air-cooled heat dissipation component 3. As shown in FIG1, 6 heat conductors 2 are connected to each composite heat dissipation plate 1. The two heat conductors 2 in the middle are connected to one air-cooled heat dissipation component 3 located on one side of the composite heat dissipation plate 1 along the second direction Y. The remaining 4 heat conductors 2 are divided into two groups and connected to two air-cooled heat dissipation components 3 located on the other side of the composite heat dissipation plate 1 along the second direction Y.

[0073] Along the first direction X, the distance between any two adjacent heat conductors 2 is 2mm to 5mm, which can be any one of 2mm, 3mm, 4mm and 5mm, and can be 3mm.

[0074] In some embodiments, as shown in FIG1, by setting multiple heat conductors 2, which are spaced apart along the first direction X, and the portions of the multiple heat conductors 2 located in the composite heat sink 1 all extend along the second direction Y, the uniformity of the distribution of the heat conductors 2 in the composite heat sink 1 is ensured, which can improve the uniformity of heat exchange on the heat-generating surface of the processor and ensure the temperature uniformity of each part of the processor.

[0075] In some embodiments, as shown in FIG5, the portion of the heat conductor 2 located within the air-cooled heat dissipation assembly 3 is flat along the third direction Z, wherein the third direction Z is perpendicular to the first surface 11.

[0076] In some embodiments, since the space in the thickness direction of the server is generally 4.45cm, the space is relatively tight, and the thickness of the air-cooled heat dissipation component 3 is also relatively small. By setting the heat conductor 2 in the part of the air-cooled heat dissipation component 3 to be flat along the third direction Z, the space occupied by it in the thickness direction of the server can be reduced, the contact area between the heat conductor 2 and the air-cooled heat dissipation component 3 can be increased, and the air-cooling effect can be improved.

[0077] In some embodiments, as shown in FIG5, the portion of the heat conductor 2 located within the composite heat dissipation plate 1 is flat along the first direction X, and the portion near the heat dissipation cavity 13 is planar, that is, the cross-section of the heat conductor 2 is a combination of a rectangular lower part and a semi-circular upper part.

[0078] In some embodiments, the portion of the heat conductor 2 located within the composite heat sink 1 is flat along the first direction X, which increases the contact area between the heat conductor 2 and the composite heat sink 1 and improves the heat exchange efficiency. At the same time, the portion of the heat conductor 2 located within the composite heat sink 1 and near the heat dissipation cavity 13 is planar, which increases the contact area between the heat conductor 2 and the heat dissipation cavity 13 and further improves the heat exchange efficiency.

[0079] In some embodiments, heat exchange sections are provided on two inner surfaces of the heat exchange cavity 13, respectively close to the first surface 11 and the heat conductor 2. The heat exchange sections are finned or porous to increase the heat exchange area with the phase change medium.

[0080] In some embodiments, the heat exchange section is porous, and sintered copper powder can be provided inside the heat exchange cavity 13. The sintered copper powder forms a large number of interconnected capillary channels, which can increase the contact area between the phase change medium and the inner wall surface of the heat exchange cavity 13, thereby increasing the heat exchange efficiency.

[0081] In some embodiments, by providing heat exchange sections on both inner surfaces of the heat exchange cavity 13 near the first surface 11 and the heat conductor 2 respectively, the contact area with the phase change medium is increased, thereby improving the heat exchange efficiency between the phase change medium and the heat exchange cavity 13, and thus improving the heat dissipation efficiency of the composite heat sink 1; and the heat exchange section is finned or porous, with a simple structure and high heat exchange efficiency.

[0082] In some embodiments, as shown in FIG4, the composite heat sink 1 includes a liquid cooling plate 14 and a heat spreader 15. The first surface 11 and the heat spreader cavity 13 are both located on the heat spreader 15. As shown in FIG5, the portion of the heat conductor 2 near the first end is connected to the heat spreader 15. As shown in FIG4, the liquid cooling cavity 12 is located inside the liquid cooling plate 14. The surface of the heat spreader 15 opposite to the first surface 11 is the second surface 16. The second surface 16 abuts against the liquid cooling plate 14 to achieve heat transfer. The liquid cooling plate 14 and the heat spreader 15 are detachably connected to facilitate maintenance of either the liquid cooling plate 14 or the heat spreader 15.

[0083] In some embodiments, as shown in FIG4, the heat spreader 15 and the liquid cooling plate 14 are arranged to overlap and contact each other along the third direction Z. They can be elastically connected to the motherboard assembly through a fixing frame 6. Alternatively, the heat spreader 15 and the liquid cooling plate 14 can be connected to the motherboard assembly through a fixing frame 6 or other forms of fasteners.

[0084] In some embodiments, as shown in FIG4, by dividing the heat spreader 15 and the liquid cooling plate 14 into two overlapping parts, it is convenient to maintain the liquid cooling circulation system separately without shutting down the server; and the heat spreader 15 or the liquid cooling plate 14 can be replaced separately if either is damaged, which can reduce maintenance costs.

[0085] As shown in Figures 4 and 5 in some embodiments, at least a portion of the heat conductor 2 located inside the composite heat sink 1 protrudes from the second surface 16. As shown in Figure 6, a groove 17 is provided on the surface of the liquid cooling plate 14 that contacts the second surface 16, and the groove 17 accommodates the portion of the heat conductor 2 that protrudes from the second surface 16.

[0086] It is worth noting that at least a portion of the heat conductor 2 located inside the composite heat sink 1 protrudes from the second surface 16, indicating that a portion of the heat conductor 2 is embedded in the heat spreader 15, and another portion protrudes from the second surface 16 to be accommodated in the groove 17; alternatively, as shown in Figure 5, the surface of the heat conductor 2 near the heat spreader 15 is attached to or connected to the heat spreader 15, and the entire heat conductor 2 protrudes from the second surface 16 and is accommodated in the groove 17.

[0087] In some embodiments, the shape of the groove 17 matches the shape of the heat conductor 2 protruding from the second surface 16, and the number of grooves 17 also matches the number of heat conductors 2.

[0088] As shown in Figure 5, the cross-section of the heat conductor 2 located inside the composite heat sink 1 can be directional, arch-shaped (i.e., a square with a semi-circle at the top), or other shapes.

[0089] In some embodiments, as shown in Figures 4 to 6, by accommodating at least a portion of the heat conductor 2 located inside the composite heat dissipation plate 1 within the liquid cooling plate, not only can the relative positions of the liquid cooling plate and the heat spreader be positioned, but also the heat conductor 2 and the heat spreader can be easily maintained and repaired.

[0090] As shown in FIG4 in some embodiments, the server heat dissipation device further includes a fixing frame 6, which is annular. The edge of the liquid cooling plate 14 is provided with a fixing flange 141. The inner edge of the fixing frame 6 is press-fitted with the fixing flange 141. The fixing frame 6 is used to fix and connect to the motherboard assembly. In some embodiments, the fixing frame 6 and the motherboard assembly can be elastically connected by an elastic element or a bolt with a spring.

[0091] In some embodiments, the heat spreader 15 and the liquid cooling plate 14 are positioned and connected by the groove 17 and the heat conductor 2. A fixing flange 141 is provided at the edge of the liquid cooling plate 14, and it is pressed and fixed by the fixing frame 6. The fixing method is simple and easy to disassemble.

[0092] In some embodiments, a first thermally conductive adhesive layer is provided between the groove portion 17 and the heat conductor 2; and / or, a second thermally conductive adhesive layer is provided between the second surface 16 and the liquid cooling plate 14. In some embodiments, the first thermally conductive adhesive layer and the second thermally conductive adhesive layer are thermally conductive silicone grease or other thermally conductive adhesives.

[0093] In some embodiments, by providing a first thermally conductive adhesive layer between the groove 17 and the heat conductor 2, gaps between the heat conductor 2 and the groove 17 can be avoided, thereby improving the thermal conductivity efficiency; by providing a second thermally conductive adhesive layer between the second surface 16 and the liquid cooling plate 14, gaps between the second surface 16 and the liquid cooling plate 14 can be avoided, thereby avoiding affecting the thermal conductivity efficiency.

[0094] In some embodiments, as shown in Figures 1, 2, 7 and 8, the server heat dissipation device further includes multiple isolation tanks 4 and multiple liquid cooling pipes 5. The input and output ends of the liquid cooling cavity 12 are connected to the liquid cooling pipes 5. Each liquid cooling pipe 5 is respectively disposed in each isolation tank 4. The isolation tank 4 is used to connect to the motherboard assembly.

[0095] It should be noted that, as shown in Figure 3, the shape of the liquid cooling pipe 5 inside the server needs to be designed to avoid the shape of other components inside the server. For example, if a component is on the optimal route of the liquid cooling pipe 5, the liquid cooling pipe 5 needs to be bent to avoid it, and the bend should be designed with large rounded corners. Similarly, the air cooling heat dissipation component 3 also needs to be designed to avoid it. As shown in Figure 1, the air cooling heat dissipation component 3 is partially hollowed out.

[0096] In some embodiments, as shown in FIG8, the cross-section of the isolation tank shell 4 is U-shaped. The isolation tank shell 4 can be a plastic shell, or a shell made of aluminum or other materials. The isolation tank shell 4 and the liquid cooling pipeline 5 are connected by a snap-fit ​​structure, such as snap-fit ​​protrusions provided in the shell. The liquid cooling pipeline 5 can also be connected by adhesive bonding.

[0097] In some embodiments, by providing an isolation tank shell 4, the liquid cooling pipeline 5 can be fixed and its deformation resistance can be maintained.

[0098] In some embodiments, as shown in FIG10, a plurality of water-blocking ribs 41 are provided at intervals along the direction of extension of the isolation tank shell 4 inside the isolation tank shell 4; in some embodiments, the height of the water-blocking ribs 41 is 2mm to 3mm, which can be 3mm, and the spacing between the water-blocking ribs 41 is 30mm to 100mm, which can be any one of 30mm, 40mm, 50mm, 60mm, 70mm, 80mm, 90mm and 100mm.

[0099] In some embodiments, by providing multiple water-blocking ribs 41 at intervals within the isolation tank shell 4, a certain amount of liquid cooling medium can be stored when a minor leak occurs in the part of the liquid cooling pipeline 5 located within the isolation tank shell 4, preventing the liquid cooling medium from damaging the motherboard components; at the same time, it can enhance the deformation resistance of the isolation tank shell 4.

[0100] In some embodiments, as shown in FIG3, the composite heat sink 1 is provided with a liquid inlet 122 and a liquid outlet 121 at the top along the third direction Z, which are respectively connected to the liquid inlet end and the liquid outlet end of the liquid cooling cavity 12. The liquid inlet 122 and the liquid outlet 121 are respectively provided at both ends of the composite heat sink 1 along the second direction Y. The orientation of the liquid outlet 121 and the orientation of the liquid inlet 122 are the same as the second direction Y, and they are arranged opposite to each other, which can reduce the length of the composite heat sink 1 in the second direction Y.

[0101] In some embodiments, as shown in Figures 1 and 2, there are multiple composite heat sinks 1, each composite heat sink 1 is connected to at least one heat conductor 2, and the liquid cooling cavities 12 in the multiple composite heat sinks 1 are connected in series and used to communicate with the cooling medium circuit, so that multiple heat-generating components can be simultaneously liquid cooled, simplifying the design structure; in some embodiments, the number of composite heat sinks 1 is 2 to 4, specifically any one of 2, 3 and 4, and can be 2.

[0102] In some embodiments, by providing multiple composite heat sinks 1, multiple heat-generating components within the server can be cooled simultaneously.

[0103] In some embodiments, as shown in FIG9, the portion where the inner bottom surface of the heat exchanger 13 along the third direction Z overlaps with the portion where the heat pipes 21 along the third direction Z is the high-level region 131, and the portion where the inner bottom surface of the heat exchanger 13 along the third direction Z is misaligned with the portion where the heat pipes 21 along the third direction Z is the low-level region 132. The height of the high-level region 131 along the third direction Z is higher than that of the low-level region 132, so that the liquid phase change medium that can be easily refluxed is evenly distributed in the inner bottom of the heat exchanger 13.

[0104] In some embodiments, the low region 132 and the high region 131 are smoothly connected, i.e., tangentially connected, and the height of the low region 132 gradually decreases along the third direction Z in the direction away from the high region 131.

[0105] In some embodiments, the height difference between the high position region 131 and the low position region is between 1 mm and 3 mm, that is, the height difference between the edge of the low position region 132 near the high position region 131 and the edge of the low position region away from the high position region 131 is between 1 mm and 3 mm.

[0106] In some embodiments, a server heat dissipation device is provided according to the embodiments of this application, as shown in Figures 1 to 4, including at least one composite heat sink 1, a heat conductor 2 and an air-cooled heat dissipation component 3, the specific scheme of which is as follows.

[0107] As shown in Figure 1, at least one composite heat sink 1 is provided. In some embodiments, the composite heat sink 1 is a material with good thermal conductivity, such as a copper plate or an aluminum plate. The composite heat sink 1 has a first surface 11, which is used to abut against the heat dissipation surface of the heat-generating component to achieve the fit between the first surface 11 and the heat-generating component and improve the heat exchange efficiency between the composite heat sink 1 and the heat-generating component. As shown in Figure 3, the composite heat sink 1 is provided with a liquid cooling cavity 12 and a heat dissipation cavity 13. In some embodiments, the heat dissipation cavity 13 can be a VC heat dissipation cavity (VC, Vapor-Chamber, vacuum chamber heat dissipation technology). The heat dissipation cavity 13 and the liquid cooling cavity 12 are stacked in a direction away from the first surface 11. The liquid cooling cavity 12 is used to connect with the cooling medium circuit to achieve liquid cooling.

[0108] As shown in Figure 4, at least one heat conductor 2 is provided, and the specific number can be selected and set according to the specific size of the composite heat sink 1. The part of the heat conductor 2 near its first end is set in the composite heat sink 1 and is located between the heat dissipation cavity 13 and the liquid cooling cavity 12 to exchange heat with the composite heat sink 1.

[0109] As shown in Figure 1, the air-cooled heat dissipation component 3 has an air-cooled heat dissipation structure. At least one air-cooled heat dissipation component 3 is provided, and the specific number can be selected and set according to the number of heat conductors 2 and the space of the server. The part of the heat conductor 2 near its second end is set in the air-cooled heat dissipation component 3 to cool the heat conductor 2 by air cooling. In some embodiments, the air-cooled heat dissipation component 3 has fins or a porous honeycomb heat dissipation part, which diffuses heat into the air by air intake. Of course, a fan can also be provided on the air-cooled heat dissipation component 3. By integrating the heat dissipation part and the fan into one unit, the heat dissipation effect of the air-cooled heat dissipation component 3 can be enhanced.

[0110] In some embodiments, the liquid cooling cavity 12 can be a rectangular cavity, and a finned portion or a porous structure portion is provided on the surface of the liquid cooling cavity 12 near the first surface 11. In some embodiments, the finned portion is a plurality of plates arranged side by side at intervals, which can enhance the heat exchange efficiency between the cooling medium and the composite heat sink 1 in the liquid cooling cavity 12. The porous structure portion can be a honeycomb-shaped heat-conducting surface with interconnected holes. Of course, the heat-conducting surface is made of heat-conducting metal wire welded together, which can also enhance the heat exchange efficiency between the cooling medium and the composite heat sink 1 in the liquid cooling cavity 12.

[0111] In some embodiments, a plurality of partitions are spaced apart in the liquid cooling cavity 12, and the partitions extend along the flow direction of the cooling medium in the liquid cooling cavity 12 to divide the liquid cooling cavity 12 into a plurality of liquid cooling channels. In some embodiments, the extension direction of the liquid cooling channels can be any direction.

[0112] In some embodiments, as shown in FIG4, the heat conductor 2 is a heat pipe 21, and there is sintered copper powder inside the heat pipe 21. The sintered copper powder forms a large number of interconnected capillary channels, which can increase the contact area between the phase change medium and the inner wall of the heat pipe 21 and improve the heat exchange efficiency.

[0113] In some embodiments, as shown in FIG4, the heat conductor 2 is a heat pipe 21. The part of the heat pipe 21 located in the composite heat dissipation plate 1 is connected to the heat dissipation cavity 13. That is, the part of the heat pipe 21 located in the composite heat dissipation plate 1 is connected to the interior of the heat dissipation cavity 13. The phase change medium in the heat dissipation cavity 13 can directly enter the heat pipe 21 and be transferred to the air-cooled heat dissipation component 3 through the heat pipe 21 for cooling.

[0114] In some embodiments, the portion of the heat pipe 21 located within the composite heat sink 1 may be partially connected to the heat dissipation cavity 13 along its axial direction, or the entire portion of the heat pipe 21 may be connected to the heat dissipation cavity 13 along its axial direction. The connection method may be detachable, such as by inserting through a sliding sealing structure or by threaded sealing connection. Of course, the heat pipe 21 and the heat dissipation cavity 13 may be set as an integrally formed structure, which can avoid the risk of leakage of phase change medium.

[0115] In some embodiments, the height of the heat pipe 21 gradually decreases along the third direction Z from the second end to the first end, wherein the third direction Z is perpendicular to the first surface 11; that is, the height of the heat pipe 21 gradually decreases along the third direction Z as it extends from one end of the air-cooled heat dissipation assembly 3 toward the composite heat dissipation plate 1.

[0116] In some embodiments, as shown in Figures 1 and 4, multiple heat conductors 2 are provided. The portions of the multiple heat conductors 2 located within the composite heat sink 1 are spaced apart along the first direction X. The portions of the multiple heat conductors 2 located within the composite heat sink 1 all extend along the second direction Y. The first direction X is parallel to the first surface 11, and the second direction Y is perpendicular to the first direction X and parallel to the first surface 11. That is, the portions of the multiple heat conductors 2 located within the composite heat sink 1 are all equidistant from the first surface 11 and are uniformly distributed.

[0117] In some embodiments, as shown in FIG1, multiple air-cooled heat dissipation components 3 are provided, and each air-cooled heat dissipation component 3 is connected to a portion of the multiple heat conductors 2. In some embodiments, the number of heat conductors 2 connected to a composite heat dissipation plate 1 is 2 to 8, which can be any one of 2, 4, 6 and 8. As shown in FIG1, it can be 6. In this case, every 2 heat conductors 2 share one air-cooled heat dissipation component 3. As shown in FIG1, 6 heat conductors 2 are connected to each composite heat dissipation plate 1. The two heat conductors 2 in the middle are connected to one air-cooled heat dissipation component 3 located on one side of the composite heat dissipation plate 1 along the second direction Y. The remaining 4 heat conductors 2 are divided into two groups and connected to two air-cooled heat dissipation components 3 located on the other side of the composite heat dissipation plate 1 along the second direction Y.

[0118] In some embodiments, along the first direction X, the distance between any two adjacent heat conductors 2 is 2mm to 5mm, which can be any one of 2mm, 3mm, 4mm and 5mm, and can be 3mm.

[0119] In some embodiments, as shown in FIG5, the portion of the heat conductor 2 located within the air-cooled heat dissipation assembly 3 is flat along the third direction Z, wherein the third direction Z is perpendicular to the first surface 11.

[0120] In some embodiments, as shown in FIG5, the portion of the heat conductor 2 located within the composite heat dissipation plate 1 is flat along the first direction X, and the portion near the heat dissipation cavity 13 is planar, that is, the cross-section of the heat conductor 2 is a combination of a rectangular lower part and a semi-circular upper part.

[0121] In some embodiments, heat exchange sections are provided on two inner surfaces of the heat exchange cavity 13, respectively close to the first surface 11 and the heat conductor 2. The heat exchange sections are finned or porous to increase the heat exchange area with the phase change medium.

[0122] In some embodiments, the heat exchange section is porous, and sintered copper powder can be provided inside the heat exchange cavity 13. The sintered copper powder forms a large number of interconnected capillary channels, which can increase the contact area between the phase change medium and the inner wall surface of the heat exchange cavity 13, thereby increasing the heat exchange efficiency.

[0123] In some embodiments, as shown in FIG4, the composite heat sink 1 includes a liquid cooling plate 14 and a heat spreader 15. The first surface 11 and the heat spreader cavity 13 are both located on the heat spreader 15. As shown in FIG5, the portion of the heat conductor 2 near the first end is connected to the heat spreader 15. As shown in FIG4, the liquid cooling cavity 12 is located inside the liquid cooling plate 14. The surface of the heat spreader 15 opposite to the first surface 11 is the second surface 16. The second surface 16 abuts against the liquid cooling plate 14 to achieve heat transfer. The liquid cooling plate 14 and the heat spreader 15 are detachably connected to facilitate maintenance of either the liquid cooling plate 14 or the heat spreader 15.

[0124] In some embodiments, as shown in FIG4, the heat spreader 15 and the liquid cooling plate 14 are arranged to overlap and contact each other along the third direction Z. They can be elastically connected to the motherboard assembly through a fixing frame 6. Alternatively, the heat spreader 15 and the liquid cooling plate 14 can be connected to the motherboard assembly through a fixing frame 6 or other forms of fasteners.

[0125] In some embodiments, as shown in Figures 4 and 5, at least a portion of the heat conductor 2 located inside the composite heat sink 1 protrudes from the second surface 16. As shown in Figure 6, a groove 17 is provided on the surface of the liquid cooling plate 14 that contacts the second surface 16, and the groove 17 accommodates the portion of the heat conductor 2 that protrudes from the second surface 16.

[0126] It is worth noting that at least a portion of the heat conductor 2 located inside the composite heat sink 1 protrudes from the second surface 16, indicating that a portion of the heat conductor 2 is embedded in the heat spreader 15, and another portion protrudes from the second surface 16 to be accommodated in the groove 17; alternatively, as shown in Figure 5, the surface of the heat conductor 2 near the heat spreader 15 is attached to or connected to the heat spreader 15, and the entire heat conductor 2 protrudes from the second surface 16 and is accommodated in the groove 17.

[0127] In some embodiments, the shape of the groove 17 matches the shape of the heat conductor 2 protruding from the second surface 16, and the number of grooves 17 also matches the number of heat conductors 2.

[0128] As shown in Figure 5, the cross-section of the heat conductor 2 located inside the composite heat sink 1 can be directional, arch-shaped (i.e., a square with a semi-circle at the top), or other shapes.

[0129] In some embodiments, as shown in FIG4, the server heat dissipation device further includes a fixing frame 6, which is annular. The edge of the liquid cooling plate 14 is provided with a fixing flange 141. The inner edge of the fixing frame 6 is press-fitted with the fixing flange 141. The fixing frame 6 is used to fix and connect to the motherboard assembly. In some embodiments, the fixing frame 6 and the motherboard assembly can be elastically connected by an elastic element or a bolt with a spring.

[0130] In some embodiments, a first thermally conductive adhesive layer is provided between the groove portion 17 and the heat conductor 2; and / or, a second thermally conductive adhesive layer is provided between the second surface 16 and the liquid cooling plate 14. In some embodiments, the first thermally conductive adhesive layer and the second thermally conductive adhesive layer are thermally conductive silicone grease or other thermally conductive adhesives.

[0131] In some embodiments, as shown in Figures 1, 2, 7 and 8, the server heat dissipation device further includes multiple isolation tanks 4 and multiple liquid cooling pipes 5. The input and output ends of the liquid cooling cavity 12 are connected to the liquid cooling pipes 5. Each liquid cooling pipe 5 is respectively disposed in each isolation tank 4. The isolation tank 4 is used to connect to the motherboard assembly.

[0132] In some embodiments, as shown in FIG8, the cross-section of the isolation tank shell 4 is U-shaped. The isolation tank shell 4 can be a plastic shell, or a shell made of aluminum or other materials. The isolation tank shell 4 and the liquid cooling pipeline 5 are connected by a snap-fit ​​structure, such as snap-fit ​​protrusions provided in the shell. The liquid cooling pipeline 5 can also be connected by adhesive bonding.

[0133] In some embodiments, as shown in FIG10, a plurality of water-blocking ribs 41 are provided at intervals along the direction of extension of the isolation tank shell 4 inside the isolation tank shell 4; in some embodiments, the height of the water-blocking ribs 41 is 2mm to 3mm, which can be 3mm, and the spacing between the water-blocking ribs 41 is 30mm to 100mm, which can be any one of 30mm, 40mm, 50mm, 60mm, 70mm, 80mm, 90mm and 100mm.

[0134] In some embodiments, as shown in FIG3, the composite heat sink 1 is provided with a liquid inlet 122 and a liquid outlet 121 at the top along the third direction Z, which are respectively connected to the liquid inlet end and the liquid outlet end of the liquid cooling cavity 12. The liquid inlet 122 and the liquid outlet 121 are respectively provided at both ends of the composite heat sink 1 along the second direction Y. The orientation of the liquid outlet 121 and the orientation of the liquid inlet 122 are the same as the second direction Y, and they are arranged opposite to each other, which can reduce the length of the composite heat sink 1 in the second direction Y.

[0135] In some embodiments, as shown in Figures 1 and 2, there are multiple composite heat sinks 1, each composite heat sink 1 is connected to at least one heat conductor 2, and the liquid cooling cavities 12 in the multiple composite heat sinks 1 are connected in series and used to communicate with the cooling medium circuit, so that multiple heat-generating components can be simultaneously liquid cooled, simplifying the design structure; in some embodiments, the number of composite heat sinks 1 is 2 to 4, specifically any one of 2, 3 and 4, and can be 2.

[0136] In some embodiments, as shown in FIG9, the portion where the inner bottom surface of the heat exchanger 13 along the third direction Z overlaps with the portion where the heat pipes 21 along the third direction Z is the high-level region 131, and the portion where the inner bottom surface of the heat exchanger 13 along the third direction Z is misaligned with the portion where the heat pipes 21 along the third direction Z is the low-level region 132. The height of the high-level region 131 along the third direction Z is higher than that of the low-level region 132, so that the liquid phase change medium that can be easily refluxed is evenly distributed in the inner bottom of the heat exchanger 13.

[0137] In some embodiments, the low region 132 and the high region 131 are smoothly connected, i.e., tangentially connected, and the height of the low region 132 gradually decreases along the third direction Z in the direction away from the high region 131.

[0138] In some embodiments, the height difference between the high position region 131 and the low position region is between 1 mm and 3 mm, that is, the height difference between the edge of the low position region 132 near the high position region 131 and the edge of the low position region away from the high position region 131 is between 1 mm and 3 mm.

[0139] According to an embodiment of this application, in another aspect, a server is provided, including the server heat dissipation device in any of the above embodiments.

[0140] It should be noted that the server can be any of the following: mail server, database server, application server, web server, virtualization server, cloud computing server, web server, and dedicated server.

[0141] In some embodiments, since the server includes the server heat dissipation device described in the above embodiments, the server and the server heat dissipation device have the same technical effect, which will not be elaborated here.

[0142] Although embodiments of this application have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of this application, and all such modifications and variations fall within the scope defined by the appended claims.

Claims

1. A server heat dissipation device, characterized in that, include: At least one composite heat sink (1), the composite heat sink (1) has a first surface (11) for contacting the heat dissipation surface of the heat-generating part, the composite heat sink (1) is provided with a liquid cooling cavity (12) and a heat dissipation cavity (13), the heat dissipation cavity (13) and the liquid cooling cavity (12) are stacked in a direction away from the first surface (11); At least one heat conductor (2) is disposed in the composite heat dissipation plate (1) near its first end and located between the heat dissipation cavity (13) and the liquid cooling cavity (12); At least one air-cooled heat dissipation component (3), wherein the portion of the heat conductor (2) near its second end is disposed within the air-cooled heat dissipation component (3).

2. The server heat dissipation device according to claim 1, characterized in that, The heat conductor (2) is a heat pipe (21), and the part of the heat pipe (21) located inside the composite heat dissipation plate (1) is connected to the heat dissipation cavity (13).

3. The server heat dissipation device according to claim 2, characterized in that, The height of the heat pipe (21) gradually decreases from the second end to the first end along a third direction (Z), wherein the third direction (Z) is perpendicular to the first surface (11).

4. The server heat dissipation device according to claim 1, characterized in that, Multiple heat conductors (2) are provided. The portions of the multiple heat conductors (2) located in the composite heat dissipation plate (1) are spaced apart along the first direction (X). The portions of the multiple heat conductors (2) located in the composite heat dissipation plate (1) all extend along the second direction (Y). The first direction (X) is parallel to the first surface (11), and the second direction (Y) is perpendicular to the first direction (X) and parallel to the first surface (11).

5. The server heat dissipation device according to claim 4, characterized in that, The heat conductor (2) is located inside the air-cooled heat dissipation assembly (3) and is flat along the third direction (Z), wherein the third direction (Z) is perpendicular to the first surface (11); And / or, the portion of the heat conductor (2) located within the composite heat dissipation plate (1) is flat along the first direction (X), and the portion near the heat dissipation cavity (13) is planar.

6. The server heat dissipation device according to any one of claims 1 to 5, characterized in that, The heat exchange section is provided on two inner surfaces of the heat exchange cavity (13) that are close to the first surface (11) and the heat conductor (2), respectively. The heat exchange section is finned or porous.

7. The server heat dissipation device according to any one of claims 1 to 5, characterized in that, The composite heat dissipation plate (1) includes a liquid cooling plate (14) and a heat spreader plate (15). The first surface (11) and the heat spreader cavity (13) are both located on the heat spreader plate (15). The heat conductor (2) is connected to the heat spreader plate (15) near the first end. The liquid cooling cavity (12) is located inside the liquid cooling plate (14). The surface of the heat spreader plate (15) opposite to the first surface (11) is the second surface (16). The second surface (16) abuts against the liquid cooling plate (14). The liquid cooling plate (14) and the heat spreader plate (15) are detachably connected.

8. The server heat dissipation device according to claim 7, characterized in that, At least a portion of the heat conductor (2) located inside the composite heat sink (1) protrudes from the second surface (16). A groove (17) is provided on the surface of the liquid cooling plate (14) that contacts the second surface (16). The groove (17) accommodates the portion of the heat conductor (2) that protrudes from the second surface (16).

9. The server heat dissipation device according to claim 8, characterized in that, It also includes a fixing frame (6), which is annular. The edge of the liquid cooling plate (14) is provided with a fixing flange (141). The inner edge of the fixing frame (6) is pressed and engaged with the fixing flange (141). The fixing frame (6) is used to fix and connect with the motherboard assembly.

10. The server heat dissipation device according to claim 8, characterized in that, A first thermally conductive adhesive layer is provided between the groove (17) and the heat conductor (2); And / or, a second thermally conductive adhesive layer is provided between the second surface (16) and the liquid cooling plate (14).

11. The server heat dissipation device according to any one of claims 1 to 5, characterized in that, It also includes multiple isolation tanks (4) and multiple liquid cooling pipes (5). The input and output ends of the liquid cooling cavity (12) are connected to the liquid cooling pipes (5). Each of the liquid cooling pipes (5) is respectively arranged in each of the isolation tanks (4). The isolation tanks (4) are used to connect to the motherboard assembly.

12. The server heat dissipation device according to claim 11, characterized in that, Multiple water-blocking ribs (41) are provided at intervals inside the isolation tank shell (4) along the direction of extension of the isolation tank shell (4).

13. The server heat dissipation device according to any one of claims 1 to 5, characterized in that, There are multiple composite heat sinks (1), each composite heat sink (1) is connected to at least one heat conductor (2), and the liquid cooling cavities (12) in the multiple composite heat sinks (1) are connected in series and used to communicate with the cooling medium circuit.

14. The server heat dissipation device according to claim 13, characterized in that, Multiple air-cooled heat dissipation components (3) are provided, and each air-cooled heat dissipation component (3) is connected to a portion of a plurality of heat conductors (2).

15. The server heat dissipation device according to claim 1, characterized in that, The liquid cooling cavity (12) is a rectangular cavity, and a finned portion or a porous structure portion is provided on the surface of the liquid cooling cavity (12) near the first surface (11). The finned portion consists of multiple plates arranged side by side at intervals.

16. The server heat dissipation device according to claim 2, characterized in that, The heat pipe (21) contains sintered copper powder, which forms interconnected capillary channels.

17. The server heat dissipation device according to claim 1, characterized in that, The portion of the heat pipe (21) located within the composite heat sink (1) is either partially connected to the heat dissipation cavity (13) along its axial direction, or the entire portion along its axial direction is connected to the heat dissipation cavity (13). The connection method is either detachable or a one-piece molded structure.

18. The server heat dissipation device according to claim 1, characterized in that, The composite heat sink (1) is connected to 6 heat conductors (2). The two heat conductors (2) in the middle are connected to a wind-cooled heat sink assembly (3) located on one side of the composite heat sink (1) along the second direction (Y). The remaining 4 heat conductors (2) are divided into two groups and connected to two wind-cooled heat sink assemblies (3) located on the other side of the composite heat sink (1) along the second direction (Y).

19. The server heat dissipation device according to claim 1, characterized in that, The heat exchange chamber (13) is filled with sintered copper powder, which forms interconnected capillary channels.

20. A server, characterized in that, include: The server heat dissipation device as described in any one of claims 1 to 19.

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