Micro LED device and display apparatus

Abstract

The present disclosure provides a micro LED device and a display apparatus. The device comprises: a micro LED chip comprising a micro LED unit array consisting of a plurality of micro LED units; a first partition layer disposed on a light emission side of the micro LED chip, the first partition layer comprising a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro LED unit array, the first through-hole array comprising a plurality of groups of first through-holes, and each group of first through-holes comprising a first first through-hole, a second first through-hole, and a third first through-hole; a photoluminescent material layer of a first color and a photoluminescent material layer of a second color, the photoluminescent material layer of the first color being filled in the first first through-holes, and the photoluminescent material layer of the second color being filled in the second first through-holes; and a first light-absorbing layer, the first light-absorbing layer being filled in the third first through-holes, and the first light-absorbing layer being used to partially absorb light of a third color emitted by the micro LED units.

Description

Miniature LED devices and display devices

[0001] Cross-reference of related applications

[0002] This disclosure claims priority to Chinese invention patent application No. 202411941783.3, filed with the China National Intellectual Property Administration on December 26, 2024, entitled “Micro LED Device and Display Apparatus”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to the technical field of semiconductor Micro LED, and more specifically, to a micro LED device and display device. Background Technology

[0004] Micro-LED is a comprehensive technology that integrates novel display technology with light-emitting diode (LED) technology. It boasts advantages such as small size, high brightness, high resolution, and low power consumption, and is considered one of the most promising next-generation display and light-emitting devices. Currently, full-color Micro-LED displays can be achieved in various ways, one of which is color conversion. However, full-color Micro-LED devices achieved through color conversion still suffer from unsatisfactory display effects. Summary of the Invention

[0005] The present disclosure provides a micro LED device and display apparatus.

[0006] According to one aspect of the present disclosure, a micro-LED device is provided, wherein the micro-LED device includes: a micro-LED chip structure, the micro-LED chip structure including a micro-LED chip, the micro-LED chip including a micro-LED unit array composed of a plurality of micro-LED units; a first barrier layer disposed on the light-emitting side of the micro-LED chip, the first barrier layer including a first via array, the arrangement of the first via array corresponding to the arrangement of the micro-LED unit array, wherein the first via array includes multiple sets of first vias, each set of first vias including three first vias, the three first vias including a first first via, a second first via, and a third first via; a first color photoluminescent material layer and a second color photoluminescent material layer, the first color photoluminescent material layer filling the first first via in each set of first vias, the second color photoluminescent material layer filling the second first via in each set of first vias; a first light-absorbing layer, the first light-absorbing layer filling the third first via in each set of first vias, wherein the first light-absorbing layer is used to partially absorb a third color of light emitted by the micro-LED units.

[0007] Furthermore, the micro LED device also includes a second partition layer disposed on the first partition layer and including a second through-hole array. The second through-hole array is aligned with the first through-hole array and located above the first through-hole array. The second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes. Each set of second through-holes includes a first second through-hole aligned with the first first through-hole, a second second through-hole aligned with the second first through-hole, and a third second through-hole aligned with the third first through-hole.

[0008] Furthermore, the micro-LED device further includes at least one of a first filling portion, a second filling portion, and a third filling portion, wherein: the first filling portion is used to fill the first second through-hole in each group of second through-holes, and the first filling portion includes a first light-filtering layer that allows only light of a first color to pass through, a second light-absorbing layer or a transparent material for partially absorbing light of a third color; the second filling portion is used to fill the second second through-hole in each group of second through-holes, and the second filling portion includes a second light-filtering layer that allows only light of a second color to pass through, a second light-absorbing layer or a transparent material for partially absorbing light of a third color; the third filling portion is used to fill the third second through-hole in each group of second through-holes, and the third filling portion includes a third light-filtering layer that allows only light of a third color to pass through, a second light-absorbing layer or a transparent material for partially absorbing light of a third color.

[0009] Furthermore, the micro-LED device also includes a third light-absorbing layer disposed on the second barrier layer, wherein the third light-absorbing layer is used to partially absorb the third color light emitted by the micro-LED unit.

[0010] Furthermore, the micro-LED device also includes a fourth light-absorbing layer disposed between the first barrier layer and the second barrier layer, wherein the fourth light-absorbing layer is used to partially absorb the third color light emitted by the micro-LED unit.

[0011] Furthermore, the micro-LED device also includes a first reflective layer disposed on the second barrier layer, wherein the first reflective layer is used to partially reflect the third color light emitted by the micro-LED unit.

[0012] Furthermore, the micro-LED device also includes a second reflective layer disposed between the first barrier layer and the second barrier layer, wherein the second reflective layer is used to partially reflect the third color light emitted by the micro-LED unit.

[0013] Furthermore, the micro-LED device also includes a fifth light-absorbing layer disposed on the first barrier layer, wherein the fifth light-absorbing layer is used to partially absorb the third color light emitted by the micro-LED unit.

[0014] Furthermore, the micro-LED device also includes a third reflective layer disposed on the first barrier layer, wherein the third reflective layer is used to partially reflect the third color of light emitted by the micro-LED unit.

[0015] Furthermore, the micro-LED device also includes an insulating layer disposed between the first barrier layer and the micro-LED chip.

[0016] Furthermore, the micro LED device also includes a fourth reflective layer, which is disposed between the first barrier layer and the micro LED chip, wherein the fourth reflective layer is used to reflect light of the first color and light of the second color.

[0017] Furthermore, each microLED unit in the microLED unit array includes a first semiconductor layer on the light-emitting side, and the insulating layer is disposed between the first barrier layer and the first semiconductor layer.

[0018] Furthermore, the micro LED device also includes a transparent cover plate, which is disposed on the first partition layer, and the transparent cover plate and the micro LED chip are located on opposite sides of the first partition layer.

[0019] Furthermore, white light is obtained by combining light corresponding to the first color, light corresponding to the second color, and light corresponding to the third color, wherein the first color is red, the second color is green, and the third color is blue.

[0020] Furthermore, the micro LED chip structure also includes a driver chip, with the side of the micro LED chip opposite to the light-emitting side disposed on the driver chip. Alternatively, the micro LED chip structure also includes a driver chip and a flexible circuit board, with the side of the micro LED chip opposite to the light-emitting side disposed on the driver chip to form a micro LED module, and the micro LED module disposed on the flexible circuit board via the driver chip.

[0021] Furthermore, the material of the first barrier layer includes a visible light shielding material, the materials of the first color photoluminescent material layer and the second color photoluminescent material layer include at least one of group II-VI quantum dots, group III-V quantum dots, perovskite quantum dots and carbon quantum dots, and the material of the first light-absorbing layer includes an organic dye, nano-absorbing particles or inorganic oxide for absorbing the third color of light.

[0022] According to another aspect of the embodiments of this disclosure, a display device is also provided. The display device includes the aforementioned micro-LED device.

[0023] Using the technical solution of this disclosure, a first barrier layer is disposed on the light-emitting side of the micro LED chip and includes a first through-hole array. The arrangement of the first through-hole array corresponds to the arrangement of the micro LED unit array. Each group of first through-holes in the first through-hole array includes three first through-holes. A first color photoluminescent material layer, a second color photoluminescent material layer, and a first light-absorbing layer are respectively filled in the three first through-holes. The first light-absorbing layer is used to partially absorb the third color light emitted by the micro LED unit, thereby forming a micro LED device. In this micro-LED device, the third-color light emitted by the micro-LED units of the micro-LED chip excites the material in the first-color photoluminescent material layer to emit the first-color light, and the third-color light emitted by the micro-LED units of the micro-LED chip excites the material in the second-color photoluminescent material layer to emit the second-color light. Since the first light-absorbing layer can partially absorb the third-color light emitted by the micro-LED units, this reduces the over-emission of the third-color light caused by the direct emission of the third-color light from the micro-LED device. Therefore, it reduces color shift and poor color purity caused by over-emission, thereby improving the uniformity of the three colors of light emitted from the micro-LED device, enhancing the color purity of the micro-LED, and ultimately improving the display effect of the micro-LED device. Attached Figure Description

[0024] The above and other objects, features, and advantages of exemplary embodiments of the present disclosure will become readily apparent upon reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of the present disclosure are illustrated by way of example and not limitation, and like or corresponding reference numerals denote like or corresponding parts, wherein:

[0025] Figures 1 to 9 are schematic diagrams showing the structure of a micro LED device according to an embodiment of the present disclosure. Detailed Implementation

[0026] It should be noted that, unless otherwise specified, the embodiments and features described in this disclosure can be combined with each other. This disclosure will now be described in detail with reference to the accompanying drawings and embodiments.

[0027] It should be noted that the following detailed descriptions are illustrative and intended to provide further explanation of this disclosure. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains.

[0028] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways, rotated 90 degrees, or in other orientations, and the spatial relative descriptions used herein will be interpreted accordingly.

[0029] Exemplary embodiments according to this disclosure will now be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments may be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein. It should be understood that these embodiments are provided so that this disclosure will be thorough and complete, and that the concept of these exemplary embodiments will be fully conveyed to those skilled in the art. In the drawings, for clarity, the thickness of layers and regions has been enlarged, and the same reference numerals are used to denote the same devices, and therefore their description will be omitted.

[0030] This disclosure provides some embodiments of micro LED devices. Referring to Figures 1 to 9, which are schematic diagrams illustrating the structure of a micro LED device according to an embodiment of this disclosure, respectively.

[0031] Referring to FIG1, FIG1 is a schematic diagram showing the structure of a micro LED device 1 according to an embodiment of the present disclosure. As shown in FIG1, the micro LED device 1 includes: a micro LED chip structure, the micro LED chip structure including a micro LED chip 11, the micro LED chip 11 including a micro LED unit array 111 composed of a plurality of micro LED units 1111; a first partition layer 101, the first partition layer 101 being disposed on the light-emitting side of the micro LED chip 11, the first partition layer 101 including a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro LED unit array 111, wherein the first through-hole array includes a plurality of sets of first through-holes, each set of first through-holes including three first through-holes, the three first through-holes including a first first through-hole 10. 111. A second first through-hole 10112 and a third first through-hole 10113; a first-color photoluminescent material layer 1011 and a second-color photoluminescent material layer 1012, wherein the first-color photoluminescent material layer 1011 fills the first first through-hole 10111 in each group of first through-holes, and the second-color photoluminescent material layer 1012 fills the second first through-hole 10112 in each group of first through-holes; a first light-absorbing layer 1013, wherein the first light-absorbing layer 1013 fills the third first through-hole 10113 in each group of first through-holes, wherein the first light-absorbing layer 1013 is used to partially absorb the third-color light emitted by the micro LED unit.

[0032] It is worth noting that, for clarity, arrowed markers are used to indicate the location of the first through-hole to distinguish it from the filler in the first through-hole. Furthermore, for clarity and brevity, Figure 1 only shows one group of first through-holes included in the first through-hole array, comprising a first first through-hole 10111, a second first through-hole 10112, and a third first through-hole 10113. The number of groups of first through-holes shown in Figure 1 and the number of first through-holes in each group are merely illustrative and are not limited here, as long as they conform to the aforementioned correspondence between the first through-holes and the micro-LED unit array.

[0033] According to the technical solution of this embodiment, the first barrier layer 101 is disposed on the light-emitting side of the micro LED chip 11 and includes a first through-hole array. The arrangement of the first through-hole array corresponds to the arrangement of the micro LED unit array 111. Each group of first through-holes in the first through-hole array includes three first through-holes. A first-color photoluminescent material 1011, a second-color photoluminescent material layer 1012, and a first light-absorbing layer 1013 are respectively filled in the three first through-holes. The first light-absorbing layer 1013 is used to partially absorb the third-color light emitted by the micro LED unit 1111, thereby forming a micro LED device 1. In this micro-LED device 1, the third color light emitted by the micro-LED unit 1111 of the micro-LED chip 11 excites the material in the first color photoluminescent material layer 1011 to emit the first color light, and the third color light emitted by the micro-LED unit 111 of the micro-LED chip 11 excites the material in the second color photoluminescent material layer 1012 to emit the second color light. Since the first light-absorbing layer 1013 can partially absorb the third color light emitted by the micro-LED unit 1111, the over-emission of the third color light caused by the direct emission of the third color light emitted by the micro-LED unit 1111 from the micro-LED device 1 is reduced. Therefore, the color deviation and poor color purity caused by the over-emission of light are reduced, thereby improving the balance of the three colors of light emitted from the micro-LED device, improving the color purity of the micro-LED, and thus improving the display effect of the micro-LED device.

[0034] According to embodiments of this disclosure, the first barrier layer 101 can function as a grid, and the interior of the grid can be filled with a corresponding material. The material of the first barrier layer 101 may include a visible light shielding material, such as a matting material like black photoresist or a reflective material like a metal layer. The materials of the first-color photoluminescent material layer 1011 and the second-color photoluminescent material layer 1012 include at least one of group II-VI quantum dots, group III-V quantum dots, perovskite quantum dots, and carbon quantum dots. The material of the first light-absorbing layer 1013 includes organic dyes, nano-absorbing particles, or inorganic oxides for partially absorbing a third color of light, such as blue light, for example, zinc oxide nanoparticle photoresist.

[0035] According to an embodiment of this disclosure, as shown in FIG1, the microLED device 1 further includes an insulating layer 12 disposed between the first barrier layer 101 and the microLED chip 11. Furthermore, the microLED chip can be any microLED chip suitable for fabricating the microLED device; for example, the structure of the microLED chip can include a right-mounted structure, a flip-chip structure, or a vertical structure, etc., without limitation. Each microLED unit in the microLED unit array may include an exposed first semiconductor layer on its light-emitting side. Depending on the type of microLED device, in some embodiments, the first semiconductor layer may include an N-GaN layer; in other embodiments, the first semiconductor layer may include a P-GaN layer. As shown in FIG1, each microLED unit 1111 in the microLED unit array 111 may include a first semiconductor layer 11111 on its light-emitting side; therefore, the insulating layer 12 can be disposed between the first barrier layer 101 and the first semiconductor layer 11111. Therefore, the insulating layer 12 can isolate the micro LED chip 11, for example, the first semiconductor layer 11111, from the first color photoluminescent material layer 1011, the second color photoluminescent material layer 1012, and the first light-absorbing layer 1013, thereby protecting the first color photoluminescent material layer 1011, the second color photoluminescent material layer 1012, and the first light-absorbing layer 1013. The material of the insulating layer 12 may include any suitable polymeric organic material and inorganic oxide, such as silicon dioxide.

[0036] According to embodiments of this disclosure, the micro-LED device 1 may further include a transparent cover plate disposed on the first partition layer 101, with the transparent cover plate and the micro-LED chip 11 located on opposite sides of the first partition layer 101. The transparent cover plate protects the first color photoluminescent material layer 1011, the second color photoluminescent material layer 1012, and the first light-absorbing layer 1013 on the opposite side of the first partition layer 101 opposite to the micro-LED chip 11. The transparent cover plate may include any suitable cover plate such as a glass cover plate, a polyimide cover plate, or a sapphire cover plate.

[0037] According to embodiments of this disclosure, the first color of light refers to light within the wavelength range corresponding to the first color, the second color of light refers to light within the wavelength range corresponding to the second color, and the third color of light refers to light within the wavelength range corresponding to the third color. White light can be synthesized from the light corresponding to the first color, the light corresponding to the second color, and the light corresponding to the third color. The first color, the second color, and the third color can be three primary colors, for example, the first color is red, the second color is green, and the third color is blue.

[0038] According to embodiments of this disclosure, the micro LED chip structure further includes a driver chip, with one side of the micro LED chip 11 opposite to the light-emitting side disposed on the driver chip. Alternatively, the micro LED chip structure further includes a driver chip and a flexible circuit board, with one side of the micro LED chip 11 opposite to the light-emitting side disposed on the driver chip to form a micro LED module, and the micro LED module disposed on the flexible circuit board via the driver chip.

[0039] Referring to FIG2, FIG2 is a schematic diagram showing the structure of a micro LED device 2 according to another embodiment of the present disclosure. The difference between the micro LED device 2 shown in FIG2 and the micro LED device 1 shown in FIG1 is that the micro LED device 2 further includes a second partition layer 201. The second partition layer 201 is disposed on the first partition layer 101 and includes a second through-hole array. The second through-hole array is aligned with the first through-hole array and is located above the first through-hole array. The second through-hole array includes a plurality of second through-holes corresponding to the plurality of first through-holes. Each group of second through-holes includes a first second through-hole 20111 aligned with the first first through-hole 10111, a second second through-hole 20112 aligned with the second first through-hole 10112, and a third second through-hole 20113 aligned with the third first through-hole 10113.

[0040] According to embodiments of this disclosure, the material of the second barrier layer 201 may include a visible light shielding material, such as a matte material like black photoresist or a reflective material like a metal layer.

[0041] It is worth noting that, for clarity, arrowed markers are used to indicate the location of the second through-holes to distinguish them from the filler within them. Furthermore, for clarity and brevity, Figure 2 only shows one group of second through-holes in the second through-hole array, including a first second through-hole 20111, a second second through-hole 20112, and a third second through-hole 20113. The number of groups of second through-holes shown in Figure 2 and the number of second through-holes in each group are merely illustrative and are not limited here, as long as the correspondence between the first and second through-holes described above is maintained.

[0042] According to embodiments of this disclosure, the micro-LED device 2 further includes at least one of a first filling portion, a second filling portion, and a third filling portion, wherein: the first filling portion is used to fill the first second through-hole in each group of second through-holes, and the first filling portion includes a first light-filtering layer that allows only light of a first color to pass through, a second light-absorbing layer for partially absorbing light of a third color, or a transparent material; the second filling portion is used to fill the second second through-hole in each group of second through-holes, and the second filling portion includes a second light-filtering layer that allows only light of a second color to pass through, a second light-absorbing layer for partially absorbing light of a third color, or a transparent material; the third filling portion is used to fill the third second through-hole in each group of second through-holes, and the third filling portion includes a third light-filtering layer that allows only light of a third color to pass through, a second light-absorbing layer for partially absorbing light of a third color, or a transparent material.

[0043] According to embodiments of this disclosure, the material of the second light-absorbing layer includes organic dyes, nano-absorbing particles, or inorganic oxides for absorbing a third color of light, such as blue light, and the material of the second light-absorbing layer can be the same as the material of the first light-absorbing layer, for example, zinc oxide nanoparticle photoresist. The materials of the first filter layer, the second filter layer, and the third filter layer include organic dyes, nano-absorbing particles, or inorganic oxides. The transparent material can be, for example, any suitable material such as transparent resin.

[0044] As shown in Figure 2, the first filling portion fills the first second through-hole 20111 in each group of second through-holes, and the first filling portion includes a first filter layer 2011 that allows only light of the first color to pass through; the second filling portion fills the second second through-hole 20112 in each group of second through-holes, and the second filling portion includes a second filter layer 2012 that allows only light of the second color to pass through; the third filling portion fills the third second through-hole 20113 in each group of second through-holes, and the third filling portion includes a second light-absorbing layer 2013 for partially absorbing light of the third color.

[0045] According to the technical solution of this embodiment, since the second light-absorbing layer 2013 is aligned with the first light-absorbing layer 1013, the second light-absorbing layer 2013 can further enhance the absorption of the third color light (e.g., blue light) emitted by the micro LED unit 1111, thereby further reducing the light overflow (e.g., blue light overflow) caused by the third color light (e.g., blue light) emitted directly from the micro LED device, thus further improving the display effect of the micro LED device. Furthermore, when a second light-absorbing layer is filled in the first second through-hole 20111 and / or in the second second through-hole 20112, and when a portion of the third color light emitted by the micro-LED unit corresponding to the first color photoluminescent material layer 1011 and the second color photoluminescent material layer 1012 does not participate in exciting the photoluminescent material layer and leaks through the photoluminescent material layer, the second light-absorbing layer filled in the first second through-hole 20111 and / or in the second second through-hole 20112 can absorb the leaked portion of blue light. This reduces the mixing and output of the leaked portion of the third color light (e.g., blue light) with the first color light (e.g., red light) and the second color light (e.g., green light) emitted by exciting the photoluminescent material layer, thereby improving the color purity of the micro-LED and thus improving the display effect of the micro-LED device.

[0046] In the case where the micro-LED device 1 shown in FIG1 includes a transparent cover plate, according to an embodiment of the present disclosure, the transparent cover plate may be disposed on the second partition layer 201.

[0047] Referring to FIG3, FIG3 is a schematic diagram showing the structure of a micro-LED device 3 according to another embodiment of the present disclosure. The difference between the micro-LED device 3 shown in FIG3 and the micro-LED device 2 shown in FIG2 is that the micro-LED device 3 further includes a third light-absorbing layer 301, which is disposed on the second partition layer 201. The third light-absorbing layer 301 is used to partially absorb the third color light emitted by the micro-LED unit 1111. FIG3 shows the third light-absorbing layer 301 disposed on the second partition layer 201 when there is a filling portion in the second through hole. It should be understood that the third light-absorbing layer 301 can also be disposed on the second partition layer 201 when there is no filling portion in the second through hole.

[0048] According to embodiments of this disclosure, the material of the third light-absorbing layer 301 includes organic dyes, nano-absorbing particles, or inorganic oxides for absorbing a third color of light, such as blue light, and the material of the third light-absorbing layer 301 may be the same as the material of the first light-absorbing layer 1013 and the second light-absorbing layer 2013, for example, it may be zinc oxide nanoparticle photoresist.

[0049] According to the technical solution of this embodiment, the third light-absorbing layer 301 covers the first light-absorbing layer 1013. Therefore, the third light-absorbing layer 301 can partially absorb the third color light, such as blue light, emitted by the micro LED unit 1111 corresponding to the first light-absorbing layer 1013, thereby further reducing the blue light overflow caused by the blue light emitted directly from the micro LED device, thus further improving the display effect of the micro LED device. Furthermore, since the third light-absorbing layer 301 covers the first color photoluminescent material layer 1011 and the second color photoluminescent material layer 1012, when a portion of the blue light emitted by the micro-LED unit corresponding to these two photoluminescent material layers does not participate in exciting the photoluminescent material layer and leaks through the photoluminescent material layer, the third light-absorbing layer 301 can absorb the leaked portion of blue light. This reduces the mixing and output of the leaked blue light with the first color light (e.g., red light) and the second color light (e.g., green light) emitted by exciting the photoluminescent material layer, thereby improving the color purity of the micro-LED and thus improving the display effect of the micro-LED device.

[0050] In the case where the micro-LED device 2 shown in FIG2 includes a transparent cover plate, according to an embodiment of the present disclosure, the transparent cover plate may be disposed on the third light-absorbing layer 301.

[0051] Referring to FIG4, FIG4 is a schematic diagram showing the structure of a micro-LED device 4 according to another embodiment of the present disclosure. The difference between the micro-LED device 4 shown in FIG4 and the micro-LED device 2 shown in FIG2 is that the micro-LED device 4 further includes a fourth light-absorbing layer 401, which is disposed between the first barrier layer 101 and the second barrier layer 201. The fourth light-absorbing layer 401 is used to partially absorb the third color light emitted by the micro-LED unit. FIG4 shows the fourth light-absorbing layer 401 disposed on the second barrier layer 201 when a filling portion exists in the second through-hole. It should be understood that the fourth light-absorbing layer 401 can also be disposed on the second barrier layer 201 when no filling portion exists in the second through-hole.

[0052] According to embodiments of this disclosure, the material of the fourth light-absorbing layer 401 includes organic dyes, nano-absorbing particles, or inorganic oxides for absorbing a third color of light, such as blue light, and the material of the fourth light-absorbing layer 401 may be the same as the material of the first light-absorbing layer 1013, the second light-absorbing layer 2013, and the third light-absorbing layer 301, for example, it may be zinc oxide nanoparticle photoresist.

[0053] According to the technical solution of this embodiment, the fourth light-absorbing layer 401 covers the first light-absorbing layer 1013. Therefore, the fourth light-absorbing layer 401 can partially absorb the third color light, such as blue light, emitted by the micro LED unit 1111 corresponding to the first light-absorbing layer 1013, thereby further reducing the blue light overflow caused by the blue light emitted directly from the micro LED device, thus further improving the display effect of the micro LED device. Furthermore, since the fourth light-absorbing layer 401 covers the first color photoluminescent material layer 1011 and the second color photoluminescent material layer 1012, when a portion of the third color light emitted by the micro-LED unit corresponding to these two photoluminescent material layers does not participate in exciting the photoluminescent material layer and leaks through the photoluminescent material layer, the fourth light-absorbing layer 401 can absorb the leaked portion of blue light. This reduces the mixing and output of the leaked portion of blue light with the first color light (e.g., red light) and the second color light (e.g., green light) emitted by exciting the photoluminescent material layer, thereby improving the color purity of the micro-LED and thus improving the display effect of the micro-LED device.

[0054] Referring to FIG5, FIG5 is a schematic diagram showing the structure of a micro-LED device 5 according to another embodiment of the present disclosure. The difference between the micro-LED device 5 shown in FIG5 and the micro-LED device 2 shown in FIG2 is that the micro-LED device 5 further includes a first reflective layer 501 disposed on the second partition layer 201, wherein the first reflective layer 501 is used to partially reflect the third color light emitted by the micro-LED unit 1111. FIG5 shows the first reflective layer 501 disposed on the second partition layer 201 when there is a filling portion in the second through-hole. It should be understood that the first reflective layer 501 can also be disposed on the second partition layer 201 when there is no filling portion in the second through-hole.

[0055] According to an embodiment of the present disclosure, the material of the first reflective layer 501 includes a distributed Bragg reflector for partially reflecting light of a third color emitted by the micro LED unit 1111. The first reflective layer 501 may be, for example, a distributed Bragg reflector formed by alternating stacks of silicon dioxide layers and titanium dioxide layers.

[0056] According to the technical solution of this embodiment, since the first reflective layer 501 covers the first color photoluminescent material layer 1011 and the second color photoluminescent material layer 1012, when a portion of the third color light emitted by the micro LED unit 1111, such as blue light, does not participate in exciting the photoluminescent material layer and leaks through the photoluminescent material layer, the first reflective layer 501 can reflect the portion of blue light leaking from the first color photoluminescent material layer 1011, such as red light, back to the red photoluminescent material layer and re-participate in exciting the red photoluminescent material layer. A reflective layer 501 can reflect some of the blue light leaking from the second color photoluminescent material layer 1012 (e.g., green) back to the green photoluminescent material layer and re-excite the green photoluminescent material layer. This increases the amount of light participating in the excitation of the photoluminescent material layer, thereby increasing the amount of light emitted by the corresponding color of the photoluminescent material layer, thus improving the brightness of the micro-LED. It can also reduce the mixing output of the leaked light and the different colors of light emitted by the excitation of the photoluminescent material layer, thereby improving the color purity of the micro-LED and thus improving the display effect of the micro-LED device.

[0057] In the case where the micro-LED device 2 shown in FIG2 includes a transparent cover plate, according to an embodiment of the present disclosure, the transparent cover plate may be disposed on the first reflective layer 501.

[0058] Referring to FIG6, FIG6 is a schematic diagram showing the structure of a microLED device 6 according to another embodiment of the present disclosure. The difference between the microLED device 6 shown in FIG6 and the microLED device 2 shown in FIG2 is that the microLED device 6 further includes a second reflective layer 601 disposed between the first partition layer 101 and the second partition layer 201, wherein the second reflective layer 601 is used to partially reflect the third color light emitted by the microLED unit. FIG6 shows the second reflective layer 601 disposed on the second partition layer 201 when there is a filling portion in the second through-hole. It should be understood that the second reflective layer 601 can also be disposed on the second partition layer 201 when there is no filling portion in the second through-hole.

[0059] According to an embodiment of the present disclosure, the material of the second reflective layer 601 includes a distributed Bragg reflector film for partially reflecting light of a third color emitted by the micro LED unit 1111, and the material of the second reflective layer 601 may be the same as the material of the first reflective layer 501. For example, the second reflective layer 601 may be a distributed Bragg reflector film formed by alternating stacking of silicon dioxide layers and titanium dioxide layers.

[0060] According to the technical solution of this embodiment, since the second reflective layer 601 covers the first color photoluminescent material layer 1011 and the second color photoluminescent material layer 1012, when a portion of the third color light emitted by the micro LED unit 1111, such as blue light, does not participate in exciting the photoluminescent material layer and leaks through the photoluminescent material layer, the second reflective layer 601 can reflect the portion of blue light leaking from the first color photoluminescent material layer 1011, such as red light, back to the red photoluminescent material layer and re-participate in exciting the red photoluminescent material layer. The second reflective layer 601 can reflect some of the blue light leaking from the second color photoluminescent material layer 1012 (e.g., green) back to the green photoluminescent material layer and re-excite the green photoluminescent material layer. This increases the amount of light participating in the excitation of the photoluminescent material layer, thereby increasing the amount of light emitted by the corresponding color of the photoluminescent material layer, thus improving the brightness of the micro-LED. It can also reduce the mixing output of the leaked light and the different colors of light emitted by the excitation of the photoluminescent material layer, thereby improving the color purity of the micro-LED and thus improving the display effect of the micro-LED device.

[0061] Referring to FIG7, FIG7 is a schematic diagram showing the structure of a micro LED device 7 according to another embodiment of the present disclosure. The difference between the micro LED device 7 shown in FIG7 and the micro LED device 1 shown in FIG1 is that the micro LED device 7 further includes a fifth light-absorbing layer 701 disposed on the first barrier layer 101, wherein the fifth light-absorbing layer 701 is used to partially absorb the third color light emitted by the micro LED unit 1111.

[0062] According to embodiments of this disclosure, the material of the fifth light-absorbing layer 701 includes organic dyes, nano-absorbing particles, or inorganic oxides for absorbing a third color of light, such as blue light, and the material of the fifth light-absorbing layer 701 may be the same as the material of the first light-absorbing layer 1013, the second light-absorbing layer 2013, the third light-absorbing layer 301, and the fourth light-absorbing layer 401, for example, it may be zinc oxide nanoparticle photoresist.

[0063] According to the technical solution of this embodiment, the fifth light-absorbing layer 701 covers the first light-absorbing layer 1013. Therefore, the fifth light-absorbing layer 701 can partially absorb the third color light, such as blue light, emitted by the micro LED unit 1111 corresponding to the first light-absorbing layer 1013, thereby further reducing the blue light overflow caused by the direct emission of blue light from the micro LED device, and thus further improving the display effect of the micro LED device. Furthermore, since the fifth light-absorbing layer 701 covers the first color photoluminescent material layer 1011 and the second color photoluminescent material layer 1012, when a portion of the blue light emitted by the micro-LED unit corresponding to these two photoluminescent material layers does not participate in exciting the photoluminescent material layer and leaks through the photoluminescent material layer, the fifth light-absorbing layer 701 can absorb the leaked portion of blue light. This reduces the mixing and output of the leaked portion of blue light with the first color light (e.g., red light) and the second color light (e.g., green light) emitted by exciting the photoluminescent material layer, thereby improving the color purity of the micro-LED and thus improving the display effect of the micro-LED device.

[0064] In the case where the micro-LED device 1 shown in FIG1 includes a transparent cover plate, according to an embodiment of the present disclosure, the transparent cover plate may be disposed on the fifth light-absorbing layer 701.

[0065] Referring to FIG8, FIG8 is a schematic diagram showing the structure of a micro LED device 8 according to another embodiment of the present disclosure. The difference between the micro LED device 8 shown in FIG8 and the micro LED device 1 shown in FIG1 is that the micro LED device 8 further includes a third reflective layer 801 disposed on the first partition layer 101, wherein the third reflective layer 801 is used to partially reflect the third color light emitted by the micro LED unit 1111.

[0066] According to an embodiment of this disclosure, the material of the third reflective layer 801 includes a distributed Bragg reflector film for partially reflecting the third color light emitted by the micro LED unit 1111, and the material of the third reflective layer 801 may be the same as the material of the first reflective layer 501 and the second reflective layer 601. The third reflective layer 801 may, for example, be a distributed Bragg reflector film formed by alternating stacking of silicon dioxide layers and titanium dioxide layers.

[0067] According to the technical solution of this embodiment, since the third reflective layer 801 covers the first color photoluminescent material layer 1011 and the second color photoluminescent material layer 1012, when a portion of the third color light emitted by the micro LED unit 1111, such as blue light, does not participate in exciting the photoluminescent material layer and leaks through the photoluminescent material layer, the third reflective layer 801 can reflect the portion of blue light leaking from the first color photoluminescent material layer 1011, such as red light, back to the red photoluminescent material layer and re-participate in exciting the red photoluminescent material layer. The three-reflection layer 801 can reflect some of the blue light leaking from the second color photoluminescent material layer 1012 (e.g., green) back to the green photoluminescent material layer and re-excite the green photoluminescent material layer. This increases the amount of light participating in the excitation of the photoluminescent material layer, thereby increasing the amount of light emitted by the corresponding color of the photoluminescent material layer, thus improving the brightness of the micro-LED. It can also reduce the mixing output of the leaked light and the different colors of light emitted by the excitation of the photoluminescent material layer, thereby improving the color purity of the micro-LED and thus improving the display effect of the micro-LED device.

[0068] In the case where the micro-LED device 1 shown in FIG1 includes a transparent cover plate, according to an embodiment of the present disclosure, the transparent cover plate may be disposed on the third reflective layer 801.

[0069] Referring to FIG9, FIG9 is a schematic diagram showing the structure of a micro LED device 9 according to another embodiment of the present disclosure. The difference between the micro LED device 9 shown in FIG9 and the micro LED device 1 shown in FIG1 is that the micro LED device 9 further includes a fourth reflective layer 901, which is disposed between the first partition layer 101 and the micro LED chip 11, wherein the fourth reflective layer 901 is used to reflect light of a first color and light of a second color.

[0070] In the case of the micro-LED device 1 shown in FIG. 1, which includes an insulating layer 12, according to an embodiment of the present disclosure, the fourth reflective layer 901 may be disposed between the first insulating layer 101 and the insulating layer 12. The material of the fourth reflective layer 901 includes a distributed Bragg reflector for reflecting light of a first color and light of a second color. The fourth reflective layer 901 may, for example, be a distributed Bragg reflector formed by alternating stacks of silicon dioxide layers and titanium dioxide layers. It is worth noting that although the fourth reflective layer 901 is a distributed Bragg reflector formed by alternating stacks of silicon dioxide layers and titanium dioxide layers, just like the first, second, and third reflective layers, the number of silicon dioxide layers and titanium dioxide layers in the fourth reflective layer 901, as well as the thickness of each silicon dioxide layer and each titanium dioxide layer, are different from those of the first, second, and third reflective layers.

[0071] It is worth noting that the fourth reflective layer 901 may also exist in the aforementioned micro-LED devices 2, 3, 4, 5, 6, 7, 8. In these micro-LED devices, the positional relationship between the fourth reflective layer 901 and the insulating layer 12 and the first barrier layer 101 may be consistent with the positional relationship described above with reference to FIG9.

[0072] According to the technical solution of this embodiment, the fourth reflective layer 901 is located between the first partition layer 101 and the micro-LED chip 11 and covers the first color photoluminescent material layer 1011 and the second color photoluminescent material layer 1012. Since the fourth reflective layer 901 is used to reflect the first color light corresponding to the first color photoluminescent material layer 1011 and the second color light corresponding to the second color photoluminescent material layer 1012, light of a third color, such as blue, emitted from the micro-LED unit 1111 can pass through the fourth reflective layer 901. When the blue light emitted by the micro-LED unit excites the first color photoluminescent material layer, such as red, to emit red light, a portion of the emitted red light will be emitted towards the micro-LED unit 1111. The fourth reflective layer 901 can reflect this portion of red light towards the first color photoluminescent material layer, thereby increasing the light intensity of the color corresponding to the photoluminescent material layer. The amount of light emitted increases, thereby improving the brightness of the micro-LED and preventing some of the red light emitted toward the micro-LED unit from interfering with the blue light emitted by the micro-LED unit. Similarly, when the blue light emitted by the micro-LED unit excites a second-color photoluminescent material layer, such as green, to emit green light, some of the emitted green light will be emitted toward the micro-LED unit 1111. The fourth reflective layer 901 can reflect this portion of green light toward the second-color photoluminescent material layer, thereby increasing the amount of light emitted of the color corresponding to the photoluminescent material layer, thereby improving the brightness of the micro-LED and preventing some of the green light emitted toward the micro-LED unit from interfering with the blue light emitted by the micro-LED unit.

[0073] According to embodiments of this disclosure, the pixel size in the aforementioned micro-LED device is typically less than 50 micrometers.

[0074] This disclosure also provides a display device including the aforementioned LED device. This display device can be applied to flexible electronic devices to realize technologies such as Augmented Reality (AR), Virtual Reality (VR), Extended Reality (XR), and Mixed Reality (MR). For example, the micro-LED device can be a projection part of an electronic device, such as a projector or head-up display (HUD); or, for example, the micro-LED device can be a display part of an electronic device, such as a smartphone, smartwatch, laptop, tablet, dashcam, navigator, head-mounted device, or any device with a display screen.

[0075] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this disclosure. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms “comprising” and / or “including” are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0076] It should be understood that the phrase "an embodiment" or "one embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of this disclosure. Therefore, "in one embodiment" or "one embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. It should be understood that in the various embodiments of this disclosure, the sequence numbers of the above steps / processes do not imply a sequential order of execution; the execution order of each step / process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this disclosure. Moreover, the sequence numbers of the above embodiments of this disclosure are merely descriptive and do not represent the superiority or inferiority of the embodiments.

[0077] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this disclosure described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0078] The above description is merely a preferred embodiment of this disclosure and is not intended to limit this disclosure. Various modifications and variations can be made to this disclosure by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A micro-LED device, wherein, The micro LED device includes: A micro LED chip structure, wherein the micro LED chip structure includes a micro LED chip, and the micro LED chip includes a micro LED unit array composed of multiple micro LED units; A first barrier layer is disposed on the light-emitting side of the micro LED chip. The first barrier layer includes a first through-hole array, the arrangement of which corresponds to the arrangement of the micro LED unit array. The first through-hole array includes multiple sets of first through-holes, each set of which includes three first through-holes, the three first through-holes including a first first through-hole, a second first through-hole, and a third first through-hole. A first color photoluminescent material layer and a second color photoluminescent material layer, wherein the first color photoluminescent material layer fills the first first through hole in each group of first through holes, and the second color photoluminescent material layer fills the second first through hole in each group of first through holes; A first light-absorbing layer is filled in the third first through-hole in each group of first through-holes, wherein the first light-absorbing layer is used to partially absorb the third color of light emitted by the micro LED unit.

2. The micro-LED device of claim 1, wherein, The micro LED device further includes a second partition layer disposed on the first partition layer and including a second through-hole array. The second through-hole array is aligned with the first through-hole array and located above the first through-hole array. The second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes. Each set of second through-holes includes a first second through-hole aligned with the first first through-hole, a second second through-hole aligned with the second first through-hole, and a third second through-hole aligned with the third first through-hole.

3. The micro-LED device of claim 2, wherein, The micro LED device further includes at least one of a first filling portion, a second filling portion, and a third filling portion, wherein: The first filling portion is used to fill the first second through hole in each group of second through holes. The first filling portion includes a first filter layer that only allows light of the first color to pass through, a second light-absorbing layer for partially absorbing light of the third color, or a transparent material. The second filling portion is used to fill the second second through hole in each group of second through holes. The second filling portion includes a second filter layer that only allows light of the second color to pass through, a second light-absorbing layer for partially absorbing light of the third color, or a transparent material. The third filling portion is used to fill the third second through hole in each group of second through holes. The third filling portion includes a third filter layer that allows only the third color of light to pass through, a second light-absorbing layer for partially absorbing the third color of light, or a transparent material.

4. The micro-LED device of claim 2, wherein, The micro-LED device further includes a third light-absorbing layer disposed on the second barrier layer, wherein the third light-absorbing layer is used to partially absorb the third color of light emitted by the micro-LED unit.

5. The micro-LED device of claim 2, wherein, The micro-LED device further includes a fourth light-absorbing layer disposed between the first barrier layer and the second barrier layer, wherein the fourth light-absorbing layer is used to partially absorb the third color light emitted by the micro-LED unit.

6. The micro-LED device of claim 2, wherein, The micro-LED device further includes a first reflective layer disposed on the second barrier layer, wherein the first reflective layer is used to partially reflect the third color light emitted by the micro-LED unit.

7. The micro-LED device of claim 2, wherein, The microLED device further includes a second reflective layer disposed between the first barrier layer and the second barrier layer, wherein the second reflective layer is used to partially reflect the third color light emitted by the microLED unit.

8. The micro LED device according to claim 1, wherein, The micro-LED device further includes a fifth light-absorbing layer disposed on the first barrier layer, wherein the fifth light-absorbing layer is used to partially absorb the third color light emitted by the micro-LED unit.

9. The micro-LED device of claim 1, wherein, The micro-LED device further includes a third reflective layer disposed on the first barrier layer, wherein the third reflective layer is used to partially reflect the third color of light emitted by the micro-LED unit.

10. The micro-LED device of claim 1, wherein, The micro-LED device further includes an insulating layer disposed between the first barrier layer and the micro-LED chip.

11. The micro-LED device of claim 1, wherein, The micro LED device further includes a fourth reflective layer, which is disposed between the first barrier layer and the micro LED chip, wherein the fourth reflective layer is used to reflect light of the first color and light of the second color.

12. The micro-LED device of claim 10, wherein, Each microLED unit in the microLED unit array includes a first semiconductor layer on the light-emitting side, and the insulating layer is disposed between the first barrier layer and the first semiconductor layer.

13. The micro-LED device of claim 1, wherein, The micro LED device also includes a transparent cover plate, which is disposed on the first partition layer, and the transparent cover plate and the micro LED chip are located on opposite sides of the first partition layer.

14. The micro-LED device of claim 1, wherein, White light is obtained by combining light corresponding to the first color, light corresponding to the second color, and light corresponding to the third color, wherein the first color is red, the second color is green, and the third color is blue.

15. The micro-LED device of claim 1, wherein, The micro LED chip structure also includes a driver chip, with one side of the micro LED chip opposite to the light-emitting side disposed on the driver chip. Alternatively, the micro LED chip structure may further include a driver chip and a flexible circuit board. The side of the micro LED chip opposite to the light-emitting side is disposed on the driver chip to form a micro LED module, and the micro LED module is disposed on the flexible circuit board through the driver chip.

16. The micro-LED device of claim 1, wherein, The material of the first barrier layer includes a visible light shielding material, the materials of the first color photoluminescent material layer and the second color photoluminescent material layer include at least one of group II-VI quantum dots, group III-V quantum dots, perovskite quantum dots and carbon quantum dots, and the material of the first light-absorbing layer includes an organic dye, nano-absorbing particles or inorganic oxide for absorbing light of the third color.

17. A display device, wherein, The display device comprises the micro-LED device according to any one of claims 1 to 16.

Images