Attenuator unit, bundled attenuator, installation method, microwave line, and quantum computer

Abstract

Disclosed in the present invention are an attenuator unit, a bundled attenuator, an installation method, a microwave line, and a quantum computer. The attenuator unit comprises: an attenuator chip, wherein one end of the attenuator chip is fixedly and electrically connected to a second inner conductor, and the other end of the second inner conductor is arranged axially and away from the attenuator chip, and is movably and electrically connected to a first inner conductor arranged axially; and the other end of the attenuator chip is fixedly and electrically connected to a third inner conductor, and the other end of the third inner conductor is arranged axially and away from the attenuator chip, and is movably and electrically connected to a fourth inner conductor arranged axially. By respectively connecting two coaxially arranged inner conductors to two sides of the attenuator chip, axial and radial positions of the attenuator chip are limited during connection of the attenuator unit, and relative rotation between a first connector and a second connector is prevented, thereby avoiding damage to the attenuator chip.

Description

An attenuator unit, a cluster attenuator, an installation method, a microwave circuit, and a quantum computer. Technical Field

[0001] This invention relates to the field of quantum computing, and more particularly to an attenuator unit, a clustered attenuator, an installation method, a microwave circuit, and a quantum computer. Background Technology

[0002] The cryogenic electronic devices of a superconducting quantum computer include passive devices such as attenuators, adapters, connectors, low-pass filters, and circulators. To ensure the normal operation of the superconducting quantum chip, the superconducting quantum chip and cryogenic electronic devices are usually placed inside an adiabatic vacuum tank with a temperature at the mK level provided by a dilution refrigerator. External control signals and power supplies are transmitted into the dilution refrigerator through several coaxial microwave cables.

[0003] There are two connection methods between the inner conductor and the attenuation chip: spring elastic connection and welding. The spring elastic connection is simple to install, but the spring elasticity will fail at a temperature of 10mK, resulting in poor contact between the inner conductor and the attenuation chip, which in turn will cause the microwave signal of the entire link to be blocked. The welding method is reliable, but since the size of the attenuation chip and the inner conductor is less than 1mm, and the size and position have a significant impact on the characteristic impedance of the attenuator, the characteristic impedance mismatch will cause microwave signal degradation and inaccurate data.

[0004] During installation and debugging, repeated disassembly and assembly are required. During this process, the connector will rotate along with the matching cable, causing the inner conductor of the attenuator to rotate together with the inner conductor of the connector, which can damage the attenuation chip. Summary of the Invention

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing an attenuator unit, a clustered attenuator, an installation method, a microwave circuit, and a quantum computer.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: an attenuator unit, comprising:

[0007] Attenuation chip;

[0008] One end of the attenuation chip is fixedly electrically connected to the second inner conductor, and the other end of the second inner conductor is arranged axially and away from the attenuation chip, and the other end is movably electrically connected to a first inner conductor arranged axially.

[0009] The other end of the attenuation chip is fixedly electrically connected to the third inner conductor, and the other end of the third inner conductor is axially disposed and facing away from the attenuation chip, and the other end is movably electrically connected to a fourth inner conductor disposed axially; this prevents the stress generated when the first inner conductor or the fourth inner conductor moves relative to the attenuation chip from being transmitted to the attenuation chip.

[0010] As a further description of the above technical solution: the attenuation chip is installed between the first connector and the second connector. The first connector is provided with a first outer conductor and a first insulator from the outside to the inside. The inner side of the first insulator is provided with a first inner conductor that is coaxial with the second inner conductor.

[0011] The second connector is provided with a second outer conductor and a second insulator from the outside to the inside, and a fourth inner conductor coaxial with the third inner conductor is provided inside the second insulator.

[0012] As a further description of the above technical solution: the second inner conductor and the third inner conductor are fixedly electrically connected to the attenuator chip, and the fixed electrical connection includes welding, bonding, and hot-melt connection;

[0013] The first inner conductor and the second inner conductor are connected by a movable electrical connection, and the third inner conductor and the fourth inner conductor are connected by a movable electrical connection. The movable electrical connection includes abutment, insertion, or connection by providing a conductive medium.

[0014] As a further description of the above technical solution: the attenuator unit also includes a positioning mechanism for positioning the attenuation chip. The positioning mechanism includes a first fixing frame and a second fixing frame. A guide rail is provided between the first fixing frame and the second fixing frame. The guide rail passes through the first fixing frame and the second fixing frame. The second inner conductor and the third inner conductor are connected by the positioning mechanism.

[0015] As a further description of the above technical solution: a third outer conductor is provided on the outside of the attenuation chip, the outer diameter of the third outer conductor is adapted to the inner diameter of the second outer conductor, and the third outer conductor is located between the first fixing frame and the second fixing frame to limit the position of the attenuation chip.

[0016] As a further description of the above technical solution: the inner sides of the first outer conductor and the second outer conductor are provided with a limiting portion extending radially inward, and the limiting portion is provided with at least one or more sliding grooves, which are adapted to the outer diameter shape of the first insulator or the second insulator.

[0017] As a further description of the above technical solution: the first insulator abuts against the first fixing frame, and the second insulator abuts against the second fixing frame.

[0018] It also includes a clustered attenuator, which is suitable for the attenuator unit described in any one of the above technical solutions, comprising:

[0019] A housing, on which a plurality of attenuator units are provided;

[0020] A cover plate is provided on one side of the housing. The housing and the cover plate are connected to form a volume cavity. An elastic component and the attenuator unit are placed inside the volume cavity. The elastic component is placed outside the first connector or the second connector.

[0021] As a further description of the above technical solution: the materials of the shell, the first outer conductor, the second outer conductor, the third outer conductor, the first inner conductor, the second inner conductor, the third inner conductor, and the fourth inner conductor are oxygen-free copper or non-magnetic beryllium copper, and the magnetic field strength is <10mGs.

[0022] It also includes a method for installing a clustered quick-connect attenuator, comprising:

[0023] S1. The second inner conductor and the third inner conductor are respectively installed on the first fixed frame and the second fixed frame of the positioning mechanism, and solder paste is applied to both ends of the attenuation chip. The attenuation chip is then fixed and electrically connected to both ends of the attenuation chip by blow soldering.

[0024] S2. A third outer conductor is placed between the first fixing frame and the second fixing frame, and the third outer conductor is positioned outside the attenuation chip for limiting engagement; the attenuation chip is soldered to the third outer conductor.

[0025] S3. Place the positioning mechanism, attenuation chip and third outer conductor inside the second connector, and mate the first connector with the second connector so that the first inner conductor and the second inner conductor are coaxially connected and the third inner conductor and the fourth inner conductor are coaxially connected, thus forming an attenuator unit.

[0026] As a further description of the above technical solution: an elastic component is installed on one side of several attenuator units and placed in a volumetric cavity formed by assembling a housing and a cover plate to obtain a clustered attenuator.

[0027] It also includes a microwave circuit, one end of which is provided with an attenuator unit as described in any of the above technical solutions.

[0028] It also includes a quantum computer, which is applicable to the attenuator unit and microwave circuit described in any of the above technical solutions.

[0029] The above technical solution has the following advantages or beneficial effects:

[0030] 1. Connect two coaxial inner conductors to both sides of the attenuation chip. When connecting the attenuator unit, limit the axial and radial positions of the attenuation chip to prevent relative rotation or movement caused by tolerance between the first connector and the second connector, or between the attenuator unit and the connector, so that stress is transmitted to the attenuation chip and damaged.

[0031] 2. The positioning mechanism and limiting part cooperate with the first insulator and the second insulator to limit the rotation of the first insulator and the second insulator, ensuring the coaxiality of the attenuation chip installation position, and preventing rotation during the insertion process with the connector. This ensures reliable connection between the inner conductor and the attenuation chip after repeated disassembly and assembly of the attenuator unit, ensuring normal microwave signal transmission of the attenuator unit, and further protecting the attenuation chip.

[0032] 3. The inner conductors welded on both sides of the attenuation chip are electrically connected to the inner conductors in the connector; this ensures that the chip is not affected by thermal expansion and contraction under the low temperature (<10mk, -273.15℃) and ultra-vacuum conditions (5E^-6mbar~1E^-7mbar) of the quantum computer, thus avoiding stress transmission to the attenuation chip and causing damage to it.

[0033] 4. The attenuator unit is assembled using a positioning mechanism to ensure high coaxiality between the inner conductor soldered on the attenuation chip and the first and fourth inner conductors during installation. The positioning mechanism also assists in the blow soldering of the attenuation chip and the inner conductor, improving the assembly accuracy of the attenuation chip and facilitating installation. Attached Figure Description

[0034] Figure 1 is a schematic diagram of the mating structure between the attenuator unit and the connector (right side) in this invention;

[0035] Figure 2 is a schematic diagram of the mating structure between the attenuator unit and the connector (right side) in this invention;

[0036] Figure 3 is a cross-sectional view of the attenuator unit in this invention;

[0037] Figure 4 is a perspective view of the positioning mechanism in this invention;

[0038] Figure 5 is a schematic diagram of the attenuation chip placed on the first fixing frame in this invention;

[0039] Figure 6 is a schematic diagram of the welding process in this invention;

[0040] Figure 7 is a schematic diagram of the welding process between the third outer conductor and the attenuation chip in this invention;

[0041] Figure 8 is a flowchart of the installation method of the attenuator unit in this invention.

[0042] Legend: 1. Housing; 2. Cover plate; 3. Elastic component; 4. First connector; 41. First outer conductor; 42. First insulator; 43. First inner conductor; 44. Second inner conductor; 5. Second connector; 51. Second outer conductor; 52. Second insulator; 53. Third inner conductor; 54. Limiting part; 55. Fourth inner conductor; 6. Positioning mechanism; 61. First fixing frame; 62. Second fixing frame; 63. Guide rail; 64. Slot; 65. Through hole; 7. Attenuation chip; 8. Third outer conductor; 9. Connector. Detailed Implementation

[0043] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0044] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0045] Referring to Figures 1-7, one embodiment of the present invention is provided:

[0046] An attenuator unit includes: an attenuation chip 7; one end of the attenuation chip 7 is fixedly electrically connected to a second inner conductor 44, the other end of the second inner conductor 44 is axially disposed and facing away from the attenuation chip, and the other end is movably electrically connected to an axially disposed first inner conductor 43; the other end of the attenuation chip is fixedly electrically connected to a third inner conductor 53, the other end of the third inner conductor 53 is axially disposed and facing away from the attenuation chip 7, and the other end is movably electrically connected to an axially disposed fourth inner conductor 55; to prevent stress generated when the first inner conductor 43 or the fourth inner conductor 55 moves relative to the attenuation chip 7 from being transmitted to the attenuation chip 7.

[0047] The applicant discovered in the research that the attenuator unit is used in conjunction with a connector. The mechanical interface of the attenuator unit must be consistent with the mechanical interface of the connector to achieve mechanical compatibility. There are two connection methods between the inner conductor and the attenuation chip: spring elastic connection and soldering. The spring elastic connection is simple to install, but the spring elasticity will fail at temperatures of 10mK, resulting in poor contact between the inner conductor and the attenuation chip, which in severe cases can lead to the entire link losing microwave signal. The soldering method is reliable, but because the size of the attenuation chip and the inner conductor is less than 1mm, and the size and position have a significant impact on the characteristic impedance of the attenuator unit, the soldering process is difficult to control, resulting in an extremely low yield. In addition, according to the basic principles of passive devices, characteristic impedance mismatch will cause microwave signal degradation and inaccurate data.

[0048] Furthermore, while the dilution refrigerator provides a low-temperature vacuum working environment for the superconducting quantum computer chip, it also generates mechanical vibrations due to the operation of the equipment itself. The dilution refrigerator takes 5 days to heat up and cool down once. Due to the special nature of the superconducting quantum computer itself, troubleshooting is relatively difficult. If the superconducting quantum computer cannot work properly due to poor contact of one of the attenuator units at a low temperature (<10mK), it is not possible to troubleshoot and replace the attenuator unit as easily as with other conventional equipment. Therefore, repeated disassembly and testing are required during the installation and debugging process. At the same time, during the disassembly and assembly process, the connector will rotate along with the matching cable, causing the inner conductor of the attenuator unit to rotate together with the inner conductor of the connector, which may lead to the risk of the inner conductor falling off and damage to the attenuation chip.

[0049] Two coaxial inner conductors are connected to both sides of the attenuation chip 7. When the attenuator unit is connected, the axial and radial positions of the attenuation chip 7 are limited to prevent relative movement between the attenuation chip and the first and fourth inner conductors, or movement caused by tolerance, during the process of the attenuator unit and the connector. This would prevent stress from being transmitted to the attenuation chip and causing damage to the attenuation chip.

[0050] The relative movements include radial rotation between the first and second inner conductors, axial movement between them, and oscillation at the end of the first inner conductor near the second inner conductor due to tolerance fit. This provides a movable electrical connection between the first and second inner conductors, preventing stress transmission to the attenuation chip 7.

[0051] Referring to Figure 3, the attenuation chip 7 is installed between the first connector 4 and the second connector 5. The first connector 4 is provided with a first outer conductor 41 and a first insulator 42 from the outside to the inside. The inner side of the first insulator 42 is provided with a first inner conductor 43 that is coaxial with the second inner conductor 44.

[0052] The second connector 5 is provided with a second outer conductor 51 and a second insulator 52 from the outside to the inside. A fourth inner conductor 55 coaxial with the third inner conductor 53 is provided on the inner side of the second insulator 52. The second inner conductor 44 and the third inner conductor 53 are fixedly electrically connected to the attenuator unit chip 7. The fixed electrical connection includes welding, bonding and hot melt connection. This application adopts welding, preferably blow welding.

[0053] The first inner conductor 43 and the second inner conductor 44 are connected by a movable electrical connection, and the third inner conductor 53 and the fourth inner conductor 55 are connected by a movable electrical connection. The movable electrical connection includes contact, insertion, or connection by a conductive medium.

[0054] When a conductive medium is used for connection, there is a gap between the first inner conductor 43 and the second inner conductor 44 for placing the conductive medium. The conductive medium can be an elastic conductive sheet, a conductive ring, or a solid colloid doped with conductive materials.

[0055] When using a plug-in connection, a round hole is made on the end face of the first inner conductor 43 or the fourth inner conductor 55 near the attenuation chip 7, so that the second inner conductor 44 is inserted into the inside of the first inner conductor 43 and the third inner conductor 53 is inserted into the inside of the fourth inner conductor 55.

[0056] Referring to Figures 4-5, the attenuator unit also includes a positioning mechanism 6 for positioning the attenuation chip 7. The positioning mechanism 6 includes a first fixing frame 61 and a second fixing frame 62. A guide rail 63 is provided between the first fixing frame 61 and the second fixing frame 62. The guide rail passes through the first fixing frame 61 and the second fixing frame 62. The second inner conductor 44 and the third inner conductor 53 are connected by the positioning mechanism.

[0057] In this embodiment, the coaxiality between the first fixing bracket 61 and the second fixing bracket 62 is limited by the guide rail 63 to ensure the installation position accuracy of the attenuation chip 7.

[0058] A slot 64 is provided on one side of the first fixing bracket 61 and the second fixing bracket 62 to limit the attenuation chip radially. A through hole 65 is provided on the end face of one side of the slot 64. A second inner conductor 44 is placed on the first fixing bracket 61, and a third inner conductor 53 is placed on the second fixing bracket 62. The second inner conductor 44 and the third inner conductor 53 limit the attenuation chip 7 axially, so that the attenuation chip 7 is soldered at the slot 64. The second inner conductor 44 and the third inner conductor 53 limit the position of the attenuation chip on the positioning mechanism and limit the coaxiality of the attenuation chip.

[0059] The third inner conductor 53 and the fourth inner conductor 55 are connected by a quick-connect fitting via the second fixing bracket 62. The second inner conductor 44 and the third inner conductor 53 are connected to the attenuation chip by welding. This ensures that the product is not affected by thermal expansion and contraction at low temperatures <10mK (-273.15℃) and in ultra-vacuum conditions (5E^-6mbar~1E^-7mbar). The positioning mechanism 6 ensures that the connection between the inner conductor and the attenuation chip is reliable after repeated disassembly and assembly of the attenuator unit, ensuring normal microwave signal transmission of the attenuator unit.

[0060] The inner sides of the first outer conductor 41 and the second outer conductor 51 are provided with a limiting part 54 extending radially inward. The limiting part 54 has at least one or more sliding grooves that are adapted to the outer diameter shape of the first insulator 42 or the second insulator 52. The first insulator 42 abuts against the first fixing frame 61, and the second insulator 52 abuts against the second fixing frame 62.

[0061] In this embodiment, the limiting part cooperates with the first insulator and the second insulator to limit the rotation of the first insulator and the second insulator, so as to prevent the first connector or the second connector from rotating during the insertion process with the connector, which would cause damage to the attenuation chip.

[0062] The limiting part 54 is a barb or platform that extends radially and inwardly, and axially limits the first insulator or the second insulator.

[0063] A limiting part is provided inside the first outer conductor and the second outer conductor, and two grooves are punched on the limiting part. The limiting part is used to fix the position of the first insulator or the second insulator moving axially, and the grooves of the limiting part are used to prevent the first insulator or the second insulator from rotating radially.

[0064] A third outer conductor is provided on the outside of the attenuation chip. The outer diameter of the third outer conductor is adapted to the inner diameter of the second outer conductor, and the third outer conductor is located between the first fixing frame and the second fixing frame to limit the position of the attenuation chip.

[0065] In this embodiment, barbs, knurling, or limiting steps are provided on the curved surfaces of the first inner conductor and the fourth inner conductor to ensure that the first inner conductor and the fourth inner conductor are assembled at the position of the connector mechanical interface insulator, ensuring that the dimensions of the connector mechanical interface position meet the requirements, and at the same time ensuring that the first inner conductor and the fourth inner conductor will not fall off; the first inner conductor and the second inner conductor are connected by a quick-connect method to prevent the second inner conductor from rotating when the first inner conductor rotates, causing the connection between the second inner conductor and the attenuation chip to break.

[0066] The housing 1, the first outer conductor 41, the second outer conductor 51, the third outer conductor 8, the first inner conductor 43, the second inner conductor 44, the third inner conductor 53, and the fourth inner conductor 55 are made of oxygen-free copper or non-magnetic beryllium copper, with a magnetic field strength <10mGs. This is to reduce the magnetocaloric effect caused by the high-density bundle fast-plug attenuator unit, and to increase heat dissipation, electrical isolation, and contact reliability in low-temperature environments.

[0067] Heat introduced from the outside by the cable is transferred to the housing through the first and second outer conductors, and then conducted to the dilution refrigeration system by the housing to achieve rapid heat dissipation. To improve the heat dissipation effect, the surfaces of the metal parts (e.g., housing 1, first outer conductor 41, second outer conductor 51, third outer conductor 8, first inner conductor 43, second inner conductor 44, third inner conductor 53, and fourth inner conductor 55) are mirror polished and gold-plated; at the same time, the attenuator unit and the connector must be in close contact, and the first and second outer conductors must be in close contact with the housing to increase the contact area and improve the heat dissipation effect.

[0068] A clustered attenuator unit includes: a housing 1, on which a plurality of attenuator units are disposed; a cover plate 2 is disposed on one side of the housing 1, and the housing 1 and the cover plate 2 are connected to form a volume cavity, and an elastic component 3 is placed inside the volume cavity, the elastic component 3 being placed outside a first connector 4 or a second connector 5.

[0069] In this embodiment, a volumetric cavity is formed by the installation and connection of the housing 1 and the cover plate 2 for placing the attenuator unit. One side of the housing 1 extends outward and has several through holes on one end face of the extension, allowing the connector to be inserted into the through holes and connected to the attenuator unit inside. The cover plate 2 has several through holes directly, corresponding to the positions of the through holes on the housing, for placing the other port of the attenuator unit. An elastic component 3 is placed inside the volumetric cavity. The elastic component 3 is sleeved on the outside of the first connector 4 or the second connector 5. The other end of the elastic component 3 contacts the housing or the cover plate, limiting the first connector 4 and the second connector 5 of the attenuator unit. The elastic component is made of spring, sheet, rubber pad, or other material with rebound function.

[0070] To meet the electrical performance requirements of the attenuator unit, the dimensional tolerances of the inner and outer conductors must be controlled within [-0.01, 0.01] mm, and the coaxiality of the inner and outer conductors must be controlled within [-0.01, 0.01] mm. The axial depth tolerance of each through-hole in the attenuator unit housing and cover plate must be controlled within [-0.01, 0.01] mm, and the hole spacing tolerance must be controlled within [-0.01, 0.01] mm. Relying on equipment to ensure component dimensional consistency is difficult to achieve; even a slight deviation in one dimension can lead to the attenuator unit and connector failing to mesh properly, resulting in structural failure. This embodiment effectively absorbs machining tolerances and overall assembly tolerances through elastic components. The axial tolerance of each through-hole in the attenuator unit can be widened from the original [-0.01, 0.01] mm to [-0.20, 0.20] mm, and the hole spacing tolerance can be widened from the original [-0.01, 0.01] mm to [-0.20, 0.20] mm, reducing machining difficulty and cost. The elastic components allow individual connectors to move freely up, down, left, and right, ensuring automatic and accurate alignment when connecting the attenuator unit to the connector during overall assembly, and effectively avoiding signal crosstalk problems from individual attenuator units. The integrated module effectively reduces installation space, allowing more attenuator units to be installed in the same space, and greatly simplifies installation.

[0071] Example 2

[0072] Referring to Figure 8, a method for installing a clustered attenuator unit includes:

[0073] S1. The second inner conductor and the third inner conductor are respectively installed on the first fixed frame and the second fixed frame of the positioning mechanism, and solder paste is applied to both ends of the attenuation chip. The attenuation chip is then fixed and electrically connected to both ends of the attenuation chip by blow soldering.

[0074] S2. The third outer conductor is placed between the first fixing frame and the second fixing frame, and the third outer conductor is located outside the attenuation chip for limiting cooperation. The attenuation chip and the third outer conductor are soldered together.

[0075] S3. Place the positioning mechanism, attenuation chip and third outer conductor inside the second connector, and mate the first connector with the second connector so that the first inner conductor and the second inner conductor are coaxially connected and the third inner conductor and the fourth inner conductor are coaxially connected, thus forming an attenuator unit.

[0076] In this embodiment, the second inner conductor and the third inner conductor are placed on the first fixed frame and the second fixed frame respectively, and then the attenuation chip is placed on the first fixed frame. The first fixed frame and the second fixed frame are closed along the guide rail so that the attenuation chip is connected between the second inner conductor and the third inner conductor.

[0077] Referring to Figures 6 and 7, apply solder paste to both sides of the attenuation chip, and use blow soldering to fix the second inner conductor and the third inner conductor. Connect the attenuation chip and the third outer conductor by resistance welding. Place the positioning mechanism between the first connector and the second connector and insert it. Insert the first inner conductor and the fourth inner conductor into the first fixing frame and the second fixing frame, and make the first insulator and the second insulator abut against the first fixing frame and the second fixing frame to complete the installation.

[0078] The substrate material of the attenuation chip is aluminum oxide, and the thin film resistor material is tantalum nitride.

[0079] In this embodiment, the attenuator unit requires a relatively small external size, which leads to a smaller size for the internal attenuation chip and inner conductor. Simultaneously, as a coaxial passive device, the coaxiality between the inner and outer conductors has a significant impact on the electrical performance of the attenuator unit; the coaxiality must be controlled within [-0.01, 0.01] mm. Therefore, precise control of the assembly dimensions of the attenuation chip and the inner and outer conductors is particularly important.

[0080] The second inner conductor is soldered to the attenuation chip. First, the second inner conductor is installed on the first fixing frame. Then, the attenuation chip is placed on the first fixing frame, and solder paste is applied to the soldering position. The third inner conductor is placed on the second fixing frame, and the second fixing frame is closed towards the first fixing frame. The second and third inner conductors cooperate with the attenuation chip. Hot air is blown downward from above the positioning mechanism to solder the second inner conductor, the third inner conductor and the attenuation chip 7 by hot air blowing (non-contact soldering).

[0081] Because the attenuation chip and the second inner conductor are relatively small and have a demanding structural position, high-frequency induction soldering and soldering irons cannot be used. After soldering, the first and second mounting brackets are separated, and the attenuation chip is removed.

[0082] The attenuation chip is soldered to the third outer conductor. The second inner conductor, soldered to the attenuation chip, is relatively close to the third outer conductor. If hot air soldering or high-frequency induction soldering is used to solder the third outer conductor, the solder on the second inner conductor will melt, causing the second inner conductor to shift out of position. To solve this problem, the soldering process for the third outer conductor is changed to resistance soldering. The other end of the attenuation chip is soldered to the third inner conductor using the same method.

[0083] After completion, the attenuation chip 7 and the third outer conductor 8 are placed between the first fixing frame 61 and the second fixing frame 62. The second inner conductor 44 is inserted into the first fixing frame 61, and the third inner conductor 53 is inserted into the second fixing frame 62. The third outer conductor 8 and the attenuation chip 7 are then limited by moving the guide rail again.

[0084] The first fixing frame 61 and the second fixing frame 62 of the positioning mechanism are integrally formed by machining center, which effectively ensures the dimensional tolerance of the through hole and the attenuation chip placement position of the second inner conductor and the third inner conductor. The dimensional tolerance can be controlled within [-0.002, 0.002] mm. The guide rail can ensure the accuracy of the movement position of the first fixing frame and the second fixing frame during use. The movement error is controlled within [-0.002, 0.002] mm. During use, the first fixing frame and the second fixing frame are placed flat on the work platform to ensure the positional accuracy of the assembly.

[0085] The positioning mechanism, attenuation chip, and third outer conductor are placed inside the second connector. The first connector 4 and the second connector 5 are fitted together and connected and fixed by welding. The first inner conductor 43 and the second inner conductor 44 are coaxially connected, and the third inner conductor 53 and the fourth inner conductor 55 are coaxially connected. The first insulator abuts against the first fixing frame 61, and the second insulator abuts against the second fixing frame 62, forming an attenuator unit.

[0086] By installing elastic components on one side of several attenuator units and placing them in a volumetric cavity formed by assembling a housing and a cover plate, a clustered attenuator unit is obtained.

[0087] One end of the attenuator unit is fitted with an elastic component 3, and several attenuator units are placed inside the housing 1. The housing 1 is connected to the cover plate 2 to encapsulate the attenuator unit. One side of the elastic component contacts the housing 1 or the cover plate 2, and the other end contacts the attenuator unit.

[0088] Example 3

[0089] The present invention also proposes a microwave circuit, which includes the attenuator units of the above embodiments. The specific structure of the attenuator unit is as described in the above embodiments. Since this microwave circuit adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here.

[0090] Example 4

[0091] The present invention also proposes a quantum computer, which includes an attenuator unit provided in the above embodiments. The specific structure of the attenuator unit is as described in the above embodiments. Since the present quantum computer adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0092] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An attenuator unit, characterized in that, include: Attenuation chip; One end of the attenuation chip is fixedly electrically connected to the second inner conductor, and the other end of the second inner conductor is arranged axially and away from the attenuation chip, and the other end is movably electrically connected to a first inner conductor arranged axially. The other end of the attenuation chip is fixedly electrically connected to the third inner conductor, and the other end of the third inner conductor is axially disposed and facing away from the attenuation chip, and the other end is movably electrically connected to a fourth inner conductor disposed axially; this prevents the stress generated when the first inner conductor or the fourth inner conductor moves relative to the attenuation chip from being transmitted to the attenuation chip.

2. The attenuator unit according to claim 1, characterized in that: The attenuation chip is installed between the first connector and the second connector. The first connector is provided with a first outer conductor and a first insulator from the outside to the inside. The inner side of the first insulator is provided with a first inner conductor that is coaxial with the second inner conductor. The second connector is provided with a second outer conductor and a second insulator from the outside to the inside, and a fourth inner conductor coaxial with the third inner conductor is provided inside the second insulator.

3. The attenuator cell of claim 2, wherein: The second inner conductor and the third inner conductor are fixedly electrically connected to the attenuator chip, and the fixed electrical connection includes welding, bonding, and hot-melt connection. The first inner conductor and the second inner conductor are connected by a movable electrical connection, and the third inner conductor and the fourth inner conductor are connected by a movable electrical connection. The movable electrical connection includes abutment, insertion, or connection by providing a conductive medium.

4. The attenuator cell of claim 2, wherein: The attenuator unit further includes a positioning mechanism for positioning the attenuation chip. The positioning mechanism includes a first fixing frame and a second fixing frame, with a guide rail disposed between the first fixing frame and the second fixing frame. The guide rail passes through the first fixing frame and the second fixing frame, and the second inner conductor and the third inner conductor are connected by the positioning mechanism.

5. The attenuator unit according to claim 4, characterized in that: A third outer conductor is provided on the outside of the attenuation chip. The outer diameter of the third outer conductor is adapted to the inner diameter of the second outer conductor, and the third outer conductor is located between the first fixing frame and the second fixing frame to limit the position of the attenuation chip.

6. The attenuator cell of claim 3, wherein: The inner sides of the first outer conductor and the second outer conductor are provided with a limiting portion extending radially inward, and the limiting portion has at least one or more grooves that are adapted to the outer diameter shape of the first insulator or the second insulator.

7. The attenuator cell of claim 4, wherein: The first insulator abuts against the first fixing frame, and the second insulator abuts against the second fixing frame.

8. A bundled attenuator, characterized by, The clustered attenuator is applicable to the attenuator unit of any one of claims 1-7, comprising: A housing, on which a plurality of attenuator units are provided; A cover plate is provided on one side of the housing. The housing and the cover plate are connected to form a volume cavity. An elastic component and the attenuator unit are placed inside the volume cavity. The elastic component is placed outside the first connector or the second connector.

9. The clustered attenuator of claim 8, wherein: The shell, the first outer conductor, the second outer conductor, the third outer conductor, the first inner conductor, the second inner conductor, the third inner conductor, and the fourth inner conductor are made of oxygen-free copper or non-magnetic beryllium copper, with a magnetic field strength of <10mGs.

10. A method of installing an attenuator unit, characterised by, include: S1. The second inner conductor and the third inner conductor are respectively installed on the first fixed frame and the second fixed frame of the positioning mechanism, and solder paste is applied to both ends of the attenuation chip. The attenuation chip is then fixed and electrically connected to both ends of the attenuation chip by blow soldering. S2. A third outer conductor is placed between the first fixing frame and the second fixing frame, and the third outer conductor is positioned outside the attenuation chip for limiting engagement; the attenuation chip is soldered to the third outer conductor. S3. Place the positioning mechanism, attenuation chip and third outer conductor inside the second connector, and mate the first connector with the second connector so that the first inner conductor and the second inner conductor are coaxially connected and the third inner conductor and the fourth inner conductor are coaxially connected, thus forming an attenuator unit.

11. A method of installing a bundled attenuator, characterized by, By mounting an elastic component on one side of several attenuator units as described in any one of claims 1 to 7 and placing them in a volumetric cavity formed by assembling a housing and a cover plate, a clustered attenuator is obtained.

12. A microwave line, characterised in that One end of the microwave line is provided with an attenuator unit as described in any one of claims 1 to 7 or a cluster attenuator as described in any one of claims 8 to 9.

13. A quantum computer, comprising: The quantum computer is applicable to the attenuator unit of any one of claims 1 to 7, the cluster attenuator of any one of claims 8 to 9, or the microwave circuit of claim 12.

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