Satellite heat dissipation device and control system therefor
By employing loop heat pipe technology in satellite equipment and utilizing a flexible heat dissipation device that combines evaporators and condensers, the problem of limited heat dissipation capacity of satellite equipment has been solved, achieving efficient heat transfer and temperature control.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- ZTE CORP
- Filing Date
- 2025-08-04
- Publication Date
- 2026-07-02
AI Technical Summary
The heat dissipation requirements of satellite equipment increase with the increase of component power, but the maximum heat dissipation capacity of the heat dissipation device is limited by the space it occupies, resulting in insufficient heat dissipation capacity.
Using loop heat pipe technology, a flexible structure combining evaporators and condensers is employed. The evaporator is connected to the heating components, and the condenser is laid on the surface of the photovoltaic panel. The connection through the flexible structure forms an efficient heat dissipation cycle, utilizing the large surface area of the photovoltaic panel for heat dissipation.
Without occupying the internal space of the satellite equipment's main structure, it improves heat dissipation capacity and achieves efficient heat transfer and temperature control.
Smart Images

Figure CN2025112334_02072026_PF_FP_ABST
Abstract
Description
Satellite heat dissipation device and its control system
[0001] Cross-references to related applications
[0002] This application claims priority to Chinese Patent Application No. 202411917428.2, filed on December 24, 2024, entitled "Satellite Heat Dissipation Device and Control System Thereof", the entire contents of which are incorporated herein by reference. Technical Field
[0003] This application relates to the field of heat dissipation technology for electronic devices, and in particular to a satellite heat dissipation device and its control system. Background Technology
[0004] During the normal operation of satellite equipment, the higher the power of each component, the greater its heat dissipation requirements. However, the maximum heat dissipation capacity of the heat dissipation device is limited by the space it occupies; the larger the space, the stronger its maximum heat dissipation capacity, and vice versa. The main structure of the satellite equipment provides a limited amount of space for the heat dissipation device, which is not conducive to the heat dissipation of each component. Therefore, there is a need to provide a technical solution that can improve the heat dissipation capacity of satellite heat dissipation devices. Summary of the Invention
[0005] The purpose of this application is to provide a satellite heat dissipation device and its control system to solve the problem of how to improve the heat dissipation capacity of the satellite heat dissipation device.
[0006] In a first aspect, embodiments of this application provide a satellite heat dissipation device, comprising: an evaporator connected to a heating component of a first satellite device, used to convert a liquid working fluid in the evaporator into a gaseous working fluid when absorbing heat from the heating component, and to transfer the gaseous working fluid to a condenser, wherein the liquid working fluid is drawn from a reservoir; the condenser is disposed on the surface of a photovoltaic panel of the first satellite device, used to condense the received gaseous working fluid into the liquid working fluid, and to store the liquid working fluid in the reservoir; wherein the condenser includes condensation pipes and a flexible structure; each condensation pipe is laid on the surface of the photovoltaic panel, and any two adjacent condensation pipes are connected by the flexible structure.
[0007] Secondly, embodiments of this application provide a control system for a satellite heat dissipation device, including the satellite heat dissipation device as described in the first aspect, a temperature information acquisition device, and a control signal generation device; wherein: the temperature information acquisition device is used to acquire temperature information of the heat-generating component; the control signal generation device is used to generate a control signal for the satellite heat dissipation device based on the temperature information; the control signal is used to control the interception or release of gaseous working fluid into the condenser of the satellite heat dissipation device.
[0008] Thirdly, embodiments of this application provide a control method for a satellite heat dissipation device, comprising: collecting temperature information of a heat-generating component; generating a control signal for the satellite heat dissipation device based on the temperature information; and using the control signal to control the interception or release of a gaseous working fluid into the condenser of the satellite heat dissipation device.
[0009] Fourthly, embodiments of this application provide an electronic device, including a processor and a memory electrically connected to the processor, the memory storing a computer program, and the processor being used to call and execute the computer program from the memory to implement the control method for the satellite heat dissipation device described in the third aspect above.
[0010] Fifthly, embodiments of this application provide a computer-readable storage medium for storing a computer program that can be executed by a processor to implement the control method for the satellite heat dissipation device described in the third aspect above.
[0011] In a sixth aspect, embodiments of this application provide a computer program product, including a computer program that is executed by a processor to implement the control method for the satellite heat dissipation device described in the third aspect above.
[0012] The embodiments of this application adopt the following technical solution: an evaporator, connected to the heating component of the first satellite device, is used to convert the liquid working fluid in the evaporator into a gaseous working fluid when absorbing heat from the heating component, and to transfer the gaseous working fluid to the condenser, wherein the evaporator draws in the liquid working fluid from the reservoir; a condenser is disposed on the surface of the photovoltaic panel of the first satellite device, and is used to condense the received gaseous working fluid into a liquid working fluid, and to store the liquid working fluid in the reservoir; wherein the condenser includes condensation pipes and a flexible structure; each condensation pipe is laid on the surface of the photovoltaic panel, and any two adjacent condensation pipes are connected by a flexible structure. Attached Figure Description
[0013] To more clearly illustrate the technical solutions in one or more embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in one or more embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0014] Figure 1a is a schematic diagram of a satellite heat dissipation device according to an embodiment of this application;
[0015] Figure 1b is a structural schematic diagram of the first type of first satellite equipment;
[0016] Figure 2 is another structural schematic diagram of the first type of satellite equipment;
[0017] Figure 3 is a schematic diagram of the structure of the second type of first satellite equipment;
[0018] Figure 4 is a schematic diagram of the structure of the third type of first satellite equipment;
[0019] Figure 5 is a schematic diagram of the structure of the fourth type of first satellite equipment;
[0020] Figure 6 is a schematic diagram of the structure of the fifth type of first satellite equipment;
[0021] Figure 7 is a schematic block diagram of another satellite heat dissipation device according to an embodiment of this application;
[0022] Figure 8 is a partial structural schematic diagram of another satellite heat dissipation device according to an embodiment of the present application;
[0023] Figure 9 is another schematic block diagram of a satellite heat dissipation device according to an embodiment of the present application;
[0024] Figure 10 is a schematic block diagram of a condenser in another satellite heat dissipation device according to an embodiment of the present application;
[0025] Figure 11 is a schematic diagram of a condenser in another satellite heat dissipation device according to an embodiment of the present application;
[0026] Figure 12 is another schematic block diagram of a condenser in a different satellite heat dissipation device according to an embodiment of the present application;
[0027] Figure 13 is another structural schematic diagram of a condenser in a satellite heat dissipation device according to an embodiment of the present application;
[0028] Figure 14 is a schematic diagram of a first flexible structure in another satellite heat dissipation device according to an embodiment of the present application;
[0029] Figure 15 is a schematic diagram of a second flexible structure in another satellite heat dissipation device according to an embodiment of the present application;
[0030] Figure 16 is a schematic diagram of a third flexible structure in another satellite heat dissipation device according to an embodiment of the present application;
[0031] Figure 17 is a schematic diagram of a fourth flexible structure in another satellite heat dissipation device according to an embodiment of the present application;
[0032] Figure 18 is a schematic block diagram of a control system for a satellite heat dissipation device according to an embodiment of this application;
[0033] Figure 19 is a schematic block diagram of a control method for a satellite heat dissipation device according to an embodiment of this application;
[0034] Figure 20 is a schematic block diagram of a control system for another satellite heat dissipation device according to an embodiment of this application. Detailed Implementation
[0035] This application provides a satellite heat dissipation device and its control system.
[0036] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this application.
[0037] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and are not used to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein.
[0038] The inventive concept of this application is as follows: During the normal operation of satellite equipment, the higher the power of each component, the higher its heat dissipation requirements. However, the maximum heat dissipation capacity of the heat dissipation device is limited by the space occupied by the device; the larger the space occupied, the stronger its maximum heat dissipation capacity, and vice versa. The space available for the heat dissipation device in the main structure of the satellite equipment is limited, which is not conducive to the heat dissipation of each component. Based on this, there is a need to provide a technical solution to improve the heat dissipation capacity of satellite heat dissipation devices. To this end, this specification provides a technical solution that can solve the above problems, as detailed below.
[0039] Example 1
[0040] Figure 1a is a schematic diagram of a satellite heat dissipation device according to an embodiment of this application. Figure 1b is a structural schematic diagram of a first type of satellite device. The satellite heat dissipation device provided in Embodiment 1 of this application will now be described by way of example with reference to Figures 1a and 1b.
[0041] As shown in Figures 1a and 1b, Embodiment 1 of this application provides a satellite heat dissipation device, which includes an evaporator 102, a condenser 104, and a liquid reservoir 106.
[0042] Evaporator 102, connected to the heating component 110 of the first satellite device, is used to convert the liquid working fluid in evaporator 102 into a gaseous working fluid when absorbing heat from the heating component 110, and to transfer the gaseous working fluid to condenser 104, wherein evaporator 102 draws liquid working fluid from reservoir 106.
[0043] A condenser 104 is disposed on the surface of the photovoltaic panel 112 of the first satellite equipment, and is used to condense the received gaseous working fluid into a liquid working fluid and store the liquid working fluid in a liquid reservoir 106; wherein, the condenser includes a condensation pipe 1042 and a flexible structure 1044; each condensation pipe 1042 is laid on the surface of the photovoltaic panel 112, and any two adjacent condensation pipes 1042 are connected by the flexible structure 1044.
[0044] The satellite heat dissipation device provided in Embodiment 1 of this application can be a loop heat pipe. A loop heat pipe is a highly efficient two-phase heat transfer device, widely used in spacecraft, electronic equipment, and other fields for heat dissipation and temperature control. Loop heat pipes possess high heat transfer efficiency, long-distance heat transfer capability, and good temperature uniformity.
[0045] Evaporator 102 is a heat exchange device mainly used to convert liquid into gas. Its working principle is to transfer heat from a heat source to the liquid inside the evaporator, causing it to reach its boiling point and convert into steam. There can be one or more evaporators 102.
[0046] Condenser 104 is another type of heat exchange device, mainly used to cool gas or vapor and convert it into liquid. Its working principle is that the gas or vapor inside the condenser transfers heat to the cooling medium or radiates heat to the space environment, causing the gas or vapor to reach its condensation point and convert into liquid. There can be one or more condensers 104.
[0047] The gas and liquid inside the evaporator and condenser are called the working medium or working fluid. The working medium flows within the loop heat pipe, absorbs heat and boils, and releases heat and condenses. The working medium of the loop heat pipe can be ammonia, propylene, water, Freon, etc.
[0048] The condenser pipe 1042 refers to the piping system used to dissipate heat from the condenser 104 into the space environment through thermal radiation. There can be multiple condenser pipes 1042.
[0049] A flexible structure 1044 refers to a structure designed, selected in terms of materials, and manufactured to adapt to changes in the external environment and withstand a certain degree of deformation or vibration without causing structural failure or significant performance degradation. It typically possesses high adaptability and deformability, maintaining its function and stability under various complex conditions. The number of flexible structures 1044 can be one or more, determined by the number of condenser pipes 1042.
[0050] A liquid reservoir 106 is a container for storing liquid substances. There may be one or more liquid reservoirs 106.
[0051] As shown in Figure 1a, the evaporator 102 is connected to the condenser 104, and the output of the evaporator 102 is the input of the condenser 104. During the operation of the satellite heat dissipation device, the evaporator 102 absorbs heat from the heating component 110, converts the liquid working fluid in the evaporator 102 into a gaseous working fluid, and transfers the gaseous working fluid to the condenser 104.
[0052] The condenser 104 is connected to the liquid reservoir 106, and the output of the condenser 104 is the input of the liquid reservoir 106. During the operation of the satellite heat dissipation device, the condenser 104 condenses the received gaseous working fluid into a liquid working fluid and stores the liquid working fluid in the liquid reservoir 106.
[0053] The liquid reservoir 106 is connected to the evaporator 102, and the output of the liquid reservoir 106 is the input of the evaporator 102. During the operation of the satellite heat dissipation device, the evaporator 102 draws in liquid working fluid from the liquid reservoir 106.
[0054] That is, the evaporator 102, the condenser 104 and the liquid receiver 106 form a cycle, and the cycle process is: evaporator 102 → condenser 104 → liquid receiver 106 → evaporator 102.
[0055] Liquid working fluid refers to the liquid medium used in satellite heat dissipation devices to transfer heat or perform energy conversion. Gaseous working fluid refers to the gaseous medium used in satellite heat dissipation devices to transfer heat or perform energy conversion.
[0056] The gaseous and liquid working fluids can be the same substance in its gaseous and liquid states, respectively. Satellite heat dissipation devices utilize the latent heat of phase change during the transition between the gaseous and liquid states of this substance to achieve efficient heat transfer.
[0057] For example, the working gaseous substance is gaseous water, i.e., water vapor, and the working liquid substance is liquid water; or, the working gaseous substance is gaseous ammonia, i.e. ammonia gas, and the working liquid substance is liquid ammonia, and so on.
[0058] Furthermore, the liquid working medium in evaporator 102 and the liquid working medium in condenser 104 are the same liquid working medium. The liquid working medium in evaporator 102 undergoes a state transition from liquid to gas, that is, the liquid working medium is converted into a gaseous working medium. After the gaseous working medium reaches condenser 104, it undergoes a state transition from gaseous to liquid, that is, the gaseous working medium is converted into a liquid working medium. The above process can be regarded as the liquid working medium returning to its original state after undergoing two state transitions.
[0059] The satellite heat dissipation device provided in Embodiment 1 of this application can be applied to a first satellite device.
[0060] The first satellite device can be any type of artificial satellite. An artificial satellite is an object manufactured by humans and launched into orbit around the Earth or other celestial bodies. These satellites are typically launched into predetermined orbits by rockets and perform various tasks in orbit, such as communication, navigation, meteorological observation, Earth observation, and scientific research.
[0061] Figure 1b is a schematic diagram of the structure of the first type of satellite device. Figure 1b exemplarily illustrates the structure of a first satellite device, which includes: a main structure 108, a heat-generating component 110, and a photovoltaic panel 112.
[0062] The heat-generating component 110 can be an antenna module, or any other component that is installed in the main structure 108 and has a heat dissipation requirement.
[0063] For example, the heating component 110 is a phased array antenna module. A phased array antenna module is an antenna system that uses electronic means to control the phase and amplitude of each antenna element in an antenna array, thereby achieving beamforming and beam pointing.
[0064] Alternatively, the heating element 110 may be a computing or control device installed inside the main structure 108, and so on.
[0065] Photovoltaic panel 112 can be a solar photovoltaic panel that can be folded or unfolded in different states.
[0066] A solar photovoltaic (PV) panel is a device that directly converts sunlight into electrical energy. The core component of this device is a photovoltaic cell, typically made of semiconductor materials such as silicon. When sunlight shines on a photovoltaic cell, photon energy is absorbed by the semiconductor material, generating electron-hole pairs, which in turn create an electric current.
[0067] As shown in Figures 1a and 1b, the evaporator 102 can be connected to the heating component 110 of the first satellite device.
[0068] In some implementations, the heating element 110 may include a working surface and a non-working surface, and the evaporator 102 may be set on the non-working surface of the heating element 110, thereby avoiding interference with the normal operation of the heating element 110 during the heat dissipation process.
[0069] For example, the heating component 110 is an antenna module, which includes a working surface for transmitting and receiving electromagnetic wave signals. Other surfaces outside the working surface are non-working surfaces. The evaporator 102 can be disposed on one of the non-working surfaces of the antenna module.
[0070] In other implementations, considering that the structural limitations of the first satellite device may prevent the evaporator 102 from being directly attached to the heating element 110, the evaporator 102 can be placed in a predetermined area of the main structure 108 and connected to the heating element 110 via a heat pipe. In this way, the heat pipe can transfer heat from the heating element 110 to the evaporator 102.
[0071] The preset area can be a pre-determined area with available space inside the main structure 108.
[0072] A heat pipe is a highly efficient two-phase heat transfer device, widely used in fields such as heat dissipation for electronic equipment and thermal control for spacecraft. Heat pipes utilize gas-liquid phase change to achieve efficient heat transfer, exhibiting high thermal conductivity, high reliability, and excellent temperature uniformity.
[0073] According to the second law of thermodynamics, energy transfer and conversion processes in nature are irreversible and always proceed in the direction of increasing entropy. Specifically regarding thermal energy, it spontaneously flows from areas of higher temperature to areas of lower temperature. Since heat pipes can be used for heat transfer, they can automatically transfer heat from the relatively warmer end to the cooler end. Considering that the evaporator 102 itself does not have a heat source, its temperature is less than or equal to the temperature of the heating element 110. Therefore, the heat pipe can transfer heat from the heating element 110 to the evaporator 102.
[0074] As shown in Figures 1a and 1b, the condenser 104 can be disposed on the surface of the photovoltaic panel 112 of the first satellite equipment. The condenser includes condensation pipes 1042 and a flexible structure 1044; each condensation pipe 1042 is laid on the surface of the photovoltaic panel 112, and any two adjacent condensation pipes 1042 are connected by the flexible structure 1044.
[0075] Since the photovoltaic panel 112 is located outside the main structure 108, the condenser 104, which is set on the surface of the photovoltaic panel 112 of the first satellite equipment, is also located outside the main structure 108. It does not need to occupy the internal space of the main structure 108, and can make full use of the large surface area of the photovoltaic panel 112, which is conducive to improving the heat dissipation capacity of the satellite heat dissipation device.
[0076] Alternatively, the liquid receiver 106 can be located at the return port of the evaporator 102, or it can be located in the available space inside the main structure 108.
[0077] Figure 1b shows only the structure of one exemplary first satellite device. The following description, in conjunction with Figures 2-6, illustrates how the evaporator and condenser in the satellite heat dissipation device provided in Embodiment 1 of this application are configured for various first satellite devices with different structures.
[0078] Figure 2 is another structural schematic diagram of the first type of satellite device. Figure 2 exemplarily illustrates the structure of the aforementioned first type of satellite device in two different states. In one state, the solar photovoltaic panel 208 and the solar photovoltaic panel 210 are folded; in the other state, the solar photovoltaic panel 208 and the solar photovoltaic panel 210 are unfolded.
[0079] As shown in Figure 2, the first satellite equipment includes a main structure 206, an antenna module 202, an antenna module 204, a solar photovoltaic panel 208, and a solar photovoltaic panel 210.
[0080] Among them, solar photovoltaic panels 208 and 210 can be unfolded to both sides of the main structure 206, as shown in the upper part of Figure 2. Solar photovoltaic panels 208 and 210 can also be folded, as shown in the lower part of Figure 2.
[0081] In the satellite heat dissipation device provided in Embodiment 1 of this application: (a1) one or more evaporators can be connected to antenna module 202; (a2) one or more evaporators can be connected to antenna module 204; (a3) one or more condensers can be disposed on the surface of solar photovoltaic panel 208; (a4) one or more condensers can be disposed on the surface of solar photovoltaic panel 210.
[0082] Regarding point (a3) above, an example can be used for illustration: As shown in Figure 2, the solar photovoltaic panel 208 includes four panels connected in sequence: panel 1, panel 2, panel 3, and panel 4. When the solar photovoltaic panel 208 is unfolded, the included angle between any two adjacent panels is 180 degrees. When the solar photovoltaic panel 208 is folded, the included angle between any two adjacent panels is less than a preset angle threshold.
[0083] For example, the preset angle threshold can be 10°, or it can be other custom-configured angle thresholds.
[0084] A condenser is disposed on the surface of the solar photovoltaic panel 208. The condenser includes four condensation pipes: condensation pipe 1, condensation pipe 2, condensation pipe 3, and condensation pipe 4. The condenser also includes three flexible structures: flexible structure 1, flexible structure 2, and flexible structure 3.
[0085] Cooling pipe 1 is laid on the surface of panel 1 in photovoltaic panel 208, cooling pipe 2 is laid on the surface of panel 2 in photovoltaic panel 208, cooling pipe 3 is laid on the surface of panel 3 in photovoltaic panel 208, and cooling pipe 4 is laid on the surface of panel 4 in photovoltaic panel 208.
[0086] Condensing pipe 1 and condensing pipe 2 are connected by flexible structure 1, condensing pipe 2 and condensing pipe 3 are connected by flexible structure 2, and condensing pipe 3 and condensing pipe 4 are connected by flexible structure 3.
[0087] In this way, when the solar photovoltaic panel 208 is folded, the condensation pipes laid on the surface of each panel of the photovoltaic panel 208 are not affected by the folding. The flexible structure used to connect two adjacent condensation pipes will change with the angle between adjacent panels and is not easily damaged. Therefore, the connection between two adjacent condensation pipes can be avoided from being interrupted due to folding. As a result, the condensation pipes can safely use the large surface area of the solar photovoltaic panel 208 to help dissipate heat, thereby improving the heat dissipation capacity of the satellite heat dissipation device.
[0088] The above (a4) is the same as the above (a3), and can be referred to the corresponding explanation section, which will not be repeated here.
[0089] Figure 3 is a schematic diagram of the structure of the second type of first satellite equipment.
[0090] As shown in Figure 3, the first satellite equipment includes a main structure 304, an antenna module 302, and a solar photovoltaic panel 306.
[0091] Among them, the solar photovoltaic panel 306 can be unfolded to one side of the main structure 304, and the solar photovoltaic panel 306 can also be folded.
[0092] In the satellite heat dissipation device provided in Embodiment 1 of this application: (b1) one or more evaporators can be connected to the antenna module 302; (b2) one or more condensers can be disposed on the surface of the solar photovoltaic panel 306.
[0093] Regarding (b2) above, an example can be used for illustration: As shown in Figure 3, the solar photovoltaic panel 306 includes four panels connected in sequence: panel 1, panel 2, panel 3, and panel 4. When the solar photovoltaic panel 306 is unfolded, the included angle between any two adjacent panels is 180 degrees. When the solar photovoltaic panel 306 is folded, the included angle between any two adjacent panels is less than a preset angle threshold.
[0094] A condenser is disposed on the surface of a solar photovoltaic panel 306. The condenser includes four condensation pipes: condensation pipe 1, condensation pipe 2, condensation pipe 3 and condensation pipe 4. The condenser also includes three flexible structures: flexible structure 1, flexible structure 2 and flexible structure 3.
[0095] Cooling pipe 1 is laid on the surface of panel 1 in photovoltaic panel 306, cooling pipe 2 is laid on the surface of panel 2 in photovoltaic panel 306, cooling pipe 3 is laid on the surface of panel 3 in photovoltaic panel 306, and cooling pipe 4 is laid on the surface of panel 4 in photovoltaic panel 306.
[0096] Condensing pipe 1 and condensing pipe 2 are connected by flexible structure 1, condensing pipe 2 and condensing pipe 3 are connected by flexible structure 2, and condensing pipe 3 and condensing pipe 4 are connected by flexible structure 3.
[0097] In this way, when the solar photovoltaic panel 306 is folded, the condensation pipes laid on the surface of each panel of the photovoltaic panel 306 are not affected by the folding. The flexible structure used to connect two adjacent condensation pipes will change with the angle between adjacent panels and is not easily damaged. Therefore, the connection between two adjacent condensation pipes can be avoided from being interrupted due to folding. As a result, the condensation pipes can safely use the large surface area of the solar photovoltaic panel 306 to help dissipate heat, thereby improving the heat dissipation capacity of the satellite heat dissipation device.
[0098] Figure 4 is a schematic diagram of the structure of the third type of first satellite equipment.
[0099] As shown in Figure 4, the first satellite equipment includes a main structure 406, an antenna module 402, an antenna module 404, a solar photovoltaic panel 408, a solar photovoltaic panel 410, a solar photovoltaic panel 412, and a solar photovoltaic panel 414.
[0100] Among them, solar photovoltaic panels 408, 410, 412 and 414 can be unfolded in four different directions of the main structure 206, and solar photovoltaic panels 408, 410, 412 and 414 can also be folded.
[0101] In the satellite heat dissipation device provided in Embodiment 1 of this application: (c1) one or more evaporators can be connected to antenna module 402; (c2) one or more evaporators can be connected to antenna module 404; (c3) one or more condensers can be disposed on the surface of solar photovoltaic panel 408; (c4) one or more condensers can be disposed on the surface of solar photovoltaic panel 410; (c5) one or more condensers can be disposed on the surface of solar photovoltaic panel 412; (c6) one or more condensers can be disposed on the surface of solar photovoltaic panel 414.
[0102] Regarding (c3) above, an example can be used for illustration: As shown in Figure 4, the solar photovoltaic panel 408 includes four panels connected in sequence: panel 1, panel 2, panel 3, and panel 4. When the solar photovoltaic panel 408 is unfolded, the included angle between any two adjacent panels is 180 degrees. When the solar photovoltaic panel 408 is folded, the included angle between any two adjacent panels is less than a preset angle threshold.
[0103] A condenser is disposed on the surface of a solar photovoltaic panel 408. The condenser includes four condensation pipes: condensation pipe 1, condensation pipe 2, condensation pipe 3, and condensation pipe 4. The condenser also includes three flexible structures: flexible structure 1, flexible structure 2, and flexible structure 3.
[0104] Cooling pipe 1 is laid on the surface of panel 1 in photovoltaic panel 208, cooling pipe 2 is laid on the surface of panel 2 in photovoltaic panel 208, cooling pipe 3 is laid on the surface of panel 3 in photovoltaic panel 208, and cooling pipe 4 is laid on the surface of panel 4 in photovoltaic panel 208.
[0105] Condensing pipe 1 and condensing pipe 2 are connected by flexible structure 1, condensing pipe 2 and condensing pipe 3 are connected by flexible structure 2, and condensing pipe 3 and condensing pipe 4 are connected by flexible structure 3.
[0106] In this way, when the solar photovoltaic panel 408 is folded, the condensation pipes laid on the surface of each panel of the photovoltaic panel 408 are not affected by the folding. The flexible structure used to connect two adjacent condensation pipes will change with the angle between adjacent panels and is not easily damaged. Therefore, the connection between two adjacent condensation pipes can be avoided from being interrupted due to folding. As a result, the condensation pipes can safely use the large surface area of the solar photovoltaic panel 408 to help dissipate heat, thereby improving the heat dissipation capacity of the satellite heat dissipation device.
[0107] The above-mentioned (c4), (c5), and (c6) are all the same as the above-mentioned (c3) concept. Please refer to the corresponding explanation section for details. They will not be repeated here.
[0108] Figure 5 is a schematic diagram of the structure of the fourth type of first satellite equipment.
[0109] As shown in Figure 5, the first satellite equipment includes a main structure 506, an antenna module 502, an antenna module 504, a solar photovoltaic panel 508, and a solar photovoltaic panel 510.
[0110] Among them, solar photovoltaic panels 508 and 510 can be folded and unfolded.
[0111] In the satellite heat dissipation device provided in Embodiment 1 of this application: (d1) one or more evaporators can be connected to antenna module 502; (d2) one or more evaporators can be connected to antenna module 504; (d3) one or more condensers can be disposed on the surface of solar photovoltaic panel 508; (d4) one or more condensers can be disposed on the surface of solar photovoltaic panel 510.
[0112] Regarding (d3) above, an example can be used to illustrate this: As shown in Figure 5, the solar photovoltaic panel 508 includes multiple panels, each of which is triangular. When the solar photovoltaic panel 508 is unfolded, the included angle between any two adjacent panels is 180 degrees. When the solar photovoltaic panel 508 is folded, the included angle between any two adjacent panels is less than a preset angle threshold.
[0113] A condenser is disposed on the surface of a solar photovoltaic panel 508. The condenser includes N condensation pipes, where N is an integer greater than 1. The condenser also includes M flexible structures, where M is an integer greater than 1, and the value of M can be determined based on N.
[0114] In the N condenser pipes, each condenser pipe is laid on the surface of one panel of the photovoltaic panel 508. The arrangement order of the condenser pipes can be predetermined, and furthermore, in this arrangement, any two adjacent condenser pipes can be connected by one of the M flexible structures.
[0115] In this way, when the solar photovoltaic panel 508 is folded, the condensation pipes laid on the surface of each triangular panel of the photovoltaic panel 508 are not affected by the folding. The flexible structure used to connect two adjacent condensation pipes will change with the angle between adjacent panels and is not easily damaged. Therefore, the connection between two adjacent condensation pipes can be avoided from being interrupted due to folding. As a result, the condensation pipes can safely use the large surface area of the solar photovoltaic panel 508 to help dissipate heat, thereby improving the heat dissipation capacity of the satellite heat dissipation device.
[0116] The above-mentioned (d4) is the same as the above-mentioned (d3) concept, which can be referred to in the corresponding explanation section, and will not be repeated here.
[0117] Figure 6 is a structural schematic diagram of the fifth type of first satellite equipment.
[0118] As shown in Figure 6, the first satellite equipment includes a main structure 606, an antenna module 602, an antenna module 604, a solar photovoltaic panel 608, a solar photovoltaic panel 610, a solar photovoltaic panel 612, and a solar photovoltaic panel 614.
[0119] Among them, solar photovoltaic panels 608, 610, 612, and 614 can be folded and unfolded.
[0120] In the satellite heat dissipation device provided in Embodiment 1 of this application: (e1) one or more evaporators can be connected to antenna module 502; (e2) one or more evaporators can be connected to antenna module 504; (e3) one or more condensers can be disposed on the surface of solar photovoltaic panel 608; (e4) one or more condensers can be disposed on the surface of solar photovoltaic panel 610; (e5) one or more condensers can be disposed on the surface of solar photovoltaic panel 612; (e6) one or more condensers can be disposed on the surface of solar photovoltaic panel 614.
[0121] Regarding point (e3) above, an example can be used to illustrate this: As shown in Figure 6, the solar photovoltaic panel 608 includes multiple panels connected sequentially in a preset order. When the solar photovoltaic panel 608 is unfolded, the angle between any two adjacent panels is 180 degrees. When the solar photovoltaic panel 608 is folded, the angle between any two adjacent panels is less than a preset angle threshold.
[0122] A condenser is disposed on the surface of a solar photovoltaic panel 608. The condenser includes N condensation pipes, where N is an integer greater than 1. The condenser also includes M flexible structures, where M is an integer greater than 1, and the value of M can be determined based on N.
[0123] In the N condenser pipes, each condenser pipe is laid on the surface of one panel of the photovoltaic panel 608. Any two adjacent condenser pipes can be connected by one of the M flexible structures.
[0124] In this way, when the solar photovoltaic panel 608 is folded, the condensation pipes laid on the surface of each panel of the photovoltaic panel 608 are not affected by the folding. The flexible structure used to connect two adjacent condensation pipes will change with the angle between adjacent panels and is not easily damaged. Therefore, the connection between two adjacent condensation pipes can be avoided from being interrupted due to folding. As a result, the condensation pipes can safely use the large surface area of the solar photovoltaic panel 608 to help dissipate heat, thereby improving the heat dissipation capacity of the satellite heat dissipation device.
[0125] The above-mentioned (e4), (e5), and (e6) are all the same as the concept of (e3) mentioned above. Please refer to the corresponding explanation section for details. They will not be repeated here.
[0126] The structures of the various types of first satellite devices shown in Figures 2-6 are merely examples to facilitate understanding of how the satellite heat dissipation device provided in Embodiment 1 of this application is applied to the first satellite device, and do not constitute a limitation on the application scope of the satellite heat dissipation device provided in one or more embodiments of this application. The first satellite device can also be any other satellite device including a foldable photovoltaic panel, and the configuration can be determined according to the actual scenario. One or more embodiments of this application do not limit this.
[0127] In summary, the satellite heat dissipation device provided in this application connects the evaporator to the heat-generating components of the first satellite device and places the condenser on the surface of the photovoltaic panel. Each condenser pipe in the condenser is laid on one photovoltaic panel, and adjacent condenser pipes are connected by a flexible structure. This not only prevents damage to the condenser pipes when adjacent photovoltaic panels are folded and unfolded, but also makes full use of the relatively large surface area of the photovoltaic panel to help dissipate heat from the heat-generating components. Considering that the photovoltaic panel is located outside the main structure of the first satellite device, the condenser placed on the surface of the photovoltaic panel is also outside the main structure, which helps the satellite heat dissipation device improve its heat dissipation capacity without occupying more space in the main structure of the first satellite device.
[0128] Example 2
[0129] Embodiment 2 of this application provides another satellite heat dissipation device, which includes various components of the satellite heat dissipation device as shown in FIG1a. The various components and how the satellite heat dissipation device is disposed on the first satellite equipment can be referred to the corresponding description section of Embodiment 1.
[0130] The following describes an exemplary implementation of the satellite heat dissipation device provided in Embodiment 2 of this application, with reference to Figure 7.
[0131] In this implementation, the satellite heat dissipation device may also include gas pipelines and liquid pipelines.
[0132] Gas pipelines are pipeline systems used to transport gaseous media.
[0133] The role of the gas pipeline in the circulation is to collect and distribute the working gas that boils and evaporates in each evaporator. The gas pipeline can include gas collection and distribution structures.
[0134] Liquid pipelines refer to pipeline systems used to transport liquid media.
[0135] Gas and liquid lines can be placed according to the connection requirements between the evaporator and condenser and the available space inside the first satellite equipment.
[0136] For example, gas pipelines can be installed within the main structure of the first satellite device, or they can be installed on the photovoltaic panel of the first satellite device. Liquid pipelines can be installed within the main structure of the first satellite device, or they can be installed on the photovoltaic panel of the first satellite device.
[0137] In this satellite heat dissipation device, the evaporator is used to convert the liquid working fluid in the evaporator into a gaseous working fluid when absorbing heat from the heat-generating components, and then transfers the gaseous working fluid to the condenser through a gas pipeline. The evaporator draws in the liquid working fluid from the liquid reservoir.
[0138] The condenser is used to condense the received gaseous working fluid into a liquid working fluid, and then transfer the liquid working fluid to the receiver for storage through a liquid pipeline.
[0139] The number of evaporators can be set according to the number of heat-generating components that require heat dissipation.
[0140] The evaporator may contain a liquid storage chamber, a capillary suction core, and a working fluid inlet and outlet, etc.
[0141] The liquid storage chamber can be used to store liquid working fluid, regulate the flow of liquid working fluid, and prevent excessive evaporation of liquid working fluid in the evaporator, thus maintaining the heat transfer efficiency and stability of the system.
[0142] Capillary wicks can be used to provide capillary force to draw liquid working fluid from the reservoir, forming a closed loop between the evaporator, condenser, and reservoir. This ensures the effective flow of the liquid working fluid in the loop, thereby achieving efficient heat transfer.
[0143] The working fluid inlet and outlet refer to the points where liquid / gas working fluids flow in and out. These inlet and outlet points ensure the effective circulation of liquid and gas working fluids in the satellite heat dissipation device, thereby achieving efficient heat transfer.
[0144] The liquid working medium in the storage chamber is drawn into the evaporator by the capillary wick, where it is heated and evaporated to generate the corresponding gaseous working medium, which flows out from the working medium outlet.
[0145] The number of condensers can be set according to requirements.
[0146] The satellite cooling system may include one or more foldable condensers, or one or more fixed condensers.
[0147] A fixed condenser can be installed on the main structure of the first satellite device, thereby utilizing the side panel for radiative heat dissipation. A foldable condenser can be installed on the surface of the photovoltaic panel, and the foldable condenser includes condensation pipes and a flexible structure, as described in the corresponding section of Figure 1.
[0148] The exterior of each condenser can be coated with a high-emissivity material. A high-emissivity material is one that exhibits high thermal radiation emissivity within a specific wavelength range. Emissivity is the ratio of the thermal radiation power emitted by a material's surface to the thermal radiation power emitted by an ideal radiator at the same temperature. The higher the emissivity, the greater the thermal radiation power emitted by the material's surface. Emissivity is closely related to the surface properties of the material.
[0149] After being condensed by the condenser, the liquid working fluid flows into the liquid pipeline and then into the liquid receiver.
[0150] Figure 7 is a schematic block diagram of another satellite heat dissipation device according to an embodiment of the present application.
[0151] As shown in Figure 7, the satellite heat dissipation device includes: evaporator 702, evaporator 704, evaporator 706, evaporator 708, gas pipeline 710, condenser 712, condenser 714, condenser 716, condenser 718, liquid pipeline 720, and liquid reservoir 722.
[0152] Evaporators 702, 704, 706, and 708 are connected in parallel; condensers 712, 714, 716, and 718 are connected in parallel; evaporators 702, 704, 706, and 708 are connected in series with gas pipeline 710; condenser 712 is connected in series with liquid pipeline 710. The following are series connections: condenser 714 and liquid line 720 are connected in series; condenser 716 and liquid line 720 are connected in series; condenser 718 and liquid line 720 are connected in series; liquid line 720 and liquid receiver 722 are connected in series; liquid receiver 722 and evaporator 702 are connected in series; liquid receiver 722 and evaporator 704 are connected in series; liquid receiver 722 and evaporator 706 are connected in series; liquid receiver 722 and evaporator 708 are connected in series.
[0153] Evaporator 702 converts the liquid working fluid inside the evaporator 702 into a gaseous working fluid when receiving heat from the heating element, and transmits the gaseous working fluid through gas line 710 to one or more of the following: condenser 712, condenser 714, condenser 716 and condenser 718.
[0154] The liquid working fluid in the evaporator 702 is drawn from the liquid reservoir 722.
[0155] The condenser 712 condenses the received gaseous working fluid into a liquid working fluid, and then transmits the liquid working fluid to the liquid reservoir 722 for storage via the liquid pipeline 720.
[0156] Evaporators 704, 706, and 708 can be found in the corresponding description of evaporator 702; condensers 714, 716, and 718 can be found in the corresponding description of condenser 712.
[0157] In some implementations, the condenser is positioned on the first surface of the photovoltaic panel that is away from the natural light source.
[0158] A photovoltaic panel may include two surfaces. When the photovoltaic panel is in operation, the first surface of the photovoltaic panel faces away from the natural light source, while the second surface of the photovoltaic panel faces the natural light source.
[0159] The natural light source can be the sun. The second surface of the photovoltaic panel needs to absorb sunlight and convert light energy into electrical energy, which may cause heat to be generated on the second surface. In order to avoid the condenser set on the surface of the photovoltaic panel interfering with the photovoltaic panel's reception of sunlight, and to avoid the heat generated on the second surface interfering with the condensation operation of the condenser tube, the condenser in the satellite heat dissipation device provided in Embodiment 2 of this application can be set on the first surface of the photovoltaic panel, thus minimizing the mutual interference between the photovoltaic panel and the condenser tube.
[0160] In some implementations, the evaporator includes multiple evaporation components and heat pipes, with the multiple evaporation components connected by heat pipes; wherein, the heat pipes are used to transfer heat energy between the multiple evaporation components.
[0161] Taking an evaporator with two evaporation components as an example, this implementation is illustrated as follows: The evaporator includes a first evaporation component, a second evaporation component, and a heat pipe. The first evaporation component and the second evaporation component are connected by a heat pipe, which is used to transfer heat between the first evaporation component and the second evaporation component.
[0162] The first evaporation component can be connected to the heating component in the first satellite equipment. The first evaporation component, the first condenser, and the first liquid receiver can form a closed loop to help the heating component dissipate heat. The first evaporation component and the heating component are in contact in a first predetermined area of the heating component, and thus, the heat from the heating component is transferred to the first evaporation component through contact.
[0163] The second evaporation component can also be connected to the heating component. The second evaporation component, the second condenser, and the second liquid receiver can form another closed loop, which helps the heating component dissipate heat. The second evaporation component and the heating component are in contact in the second preset area of the heating component, and thus, the heat from the heating component is transferred to the second evaporation component through contact.
[0164] The first evaporator and the second evaporator can be independent circuits. This is because if the first evaporator and the second evaporator are connected in series or in parallel, and one of them is in an abnormal state and cannot work properly, such as a pipe leak, it may cause the other to also have a closed loop problem and be unable to complete the heat dissipation work.
[0165] The first evaporation component and the second evaporation component are connected by a heat pipe. If the first evaporation component is in an abnormal state and cannot work properly, the first preset area in the heating component may become hot due to the inability to dissipate heat properly, while the second preset area can maintain normal heat dissipation. As a result, the temperature at the end of the heat pipe closer to the first evaporation component will be higher than the temperature at the end closer to the second evaporation component.
[0166] The heat pipe can automatically transfer heat from the relatively high-temperature end of the heat pipe to the relatively low-temperature end of the heat pipe. Therefore, when the closed loop of the first evaporation component is broken, the heat pipe can transfer the heat that the first evaporation component cannot handle normally to the second evaporation component, and use the closed loop of the second evaporation component to dissipate heat.
[0167] Figure 8 is a partial structural schematic diagram of another satellite heat dissipation device according to an embodiment of the present application.
[0168] As shown in Figure 8, the evaporator in the satellite heat dissipation device includes a first evaporation component 802, a second evaporation component 806, and a heat pipe 810. The first evaporation component 802 and the second evaporation component 806 are connected by the heat pipe 810. The heat pipe 810 is used to transfer heat between the first evaporation component 802 and the second evaporation component 806.
[0169] In addition, the satellite heat dissipation device also includes a first liquid reservoir 804 and a second liquid reservoir 808. The return port of the first evaporation assembly 802 is connected to the first liquid reservoir 804. The return port of the second evaporation assembly 806 is connected to the second liquid reservoir 808.
[0170] The first evaporation assembly 802 can be connected to the heating element in the first satellite equipment. The first evaporation assembly 802, the first condenser, and the first liquid receiver 804 can form a closed loop to help the heating element dissipate heat. The first evaporation assembly 802 is in contact with the heating element in a first predetermined area of the heating element, and thus, the heat from the heating element is transferred to the first evaporation assembly 802 through contact. The heat pipe 810 can be embedded in the heat-conducting plate of the heating element.
[0171] The second evaporation assembly 806 can also be connected to the heating assembly. The second evaporation assembly 806, the second condenser, and the second liquid receiver 808 can form another closed loop, which helps the heating assembly dissipate heat. The second evaporation assembly 806 is in contact with the heating assembly in the second preset area of the heating assembly, and thus, the heat from the heating assembly is transferred to the second evaporation assembly 806 through contact.
[0172] When the first evaporation component 802 and the second evaporation component 806 are working properly, the two ends of the heat pipe 810 can be considered to be at the same temperature, and thus the heat pipe 810 does not need to transfer heat between the first and second evaporation components.
[0173] When the first evaporation component 802 malfunctions, the closed loop to which the first evaporation component 802 belongs is interrupted, and it cannot dissipate heat normally, while the second evaporation component 806 can work normally, the temperature of the end of the heat pipe 810 near the first evaporation component 802 will rise, while the temperature of the end of the heat pipe 810 near the second evaporation component 806 will remain unchanged. Thus, the heat pipe 810 can transfer the heat that the first evaporation component 802 cannot handle to the second evaporation component 806, and dissipate heat using the closed loop to which the second evaporation component 806 belongs.
[0174] When the second evaporation component 806 malfunctions, the closed loop to which the second evaporation component 806 belongs is interrupted, and it cannot dissipate heat normally, while the first evaporation component 802 can work normally, the end of the heat pipe 810 near the second evaporation component 806 will have a higher temperature, while the end of the heat pipe 810 near the first evaporation component 802 will have a constant temperature. Thus, the heat pipe 810 can transfer the heat that the second evaporation component 806 cannot handle to the first evaporation component 802, and dissipate heat using the closed loop to which the first evaporation component 802 belongs.
[0175] In this way, if a single closed loop fails while multiple closed loops are simultaneously dissipating heat from the heat-generating components, heat can be transferred through the heat pipes to prevent the heat-generating components from completely losing their heat dissipation channels, thereby enhancing the reliability of the heat dissipation system.
[0176] If the number of evaporation components in the evaporator is greater than two, the same concept can be applied as to the case where the number of evaporation components in the evaporator is two.
[0177] For example, the evaporator may contain three evaporation components: a first evaporation component, a second evaporation component, and a third evaporation component. The evaporator also includes heat pipes. The first, second, and third evaporation components are interconnected via heat pipes. The heat pipes are used to transfer heat between the first, second, and third evaporation components.
[0178] In the event of a malfunction in the first evaporation component, the heat pipe can transfer the heat that the first evaporation component cannot handle to the second and third evaporation components; in the event of a malfunction in the second evaporation component, the heat pipe can transfer the heat that the second evaporation component cannot handle to the first and third evaporation components; in the event of a malfunction in the third evaporation component, the heat pipe can transfer the heat that the third evaporation component cannot handle to the first and second evaporation components.
[0179] In some implementations, there are multiple heating elements, each with a different operating temperature; multiple evaporators; multiple condensers; and multiple liquid receivers; wherein the heat dissipation circuit of each heating element includes at least one evaporator, at least one condenser, and at least one liquid receiver.
[0180] If multiple heat-generating components share the same heat dissipation circuit, their temperatures may be controlled within similar ranges, meaning the temperature difference between any two heat-generating components is less than a preset threshold. Therefore, when there are multiple heat-generating components with different operating temperatures, a corresponding heat dissipation circuit can be configured for each component.
[0181] The evaporator, condenser, and liquid receiver can be grouped according to the operating temperature of the heating components. Each group is connected by its own gas and liquid pipelines. By grouping the evaporator, condenser, and liquid receiver, the heat dissipation circuits of different heating components are not interconnected. This facilitates temperature control of the heat dissipation circuit of each heating component based on its own operating temperature.
[0182] For example, there are two heating components: a first heating component and a second heating component. The satellite heat dissipation device includes: a first evaporator, a second evaporator, a first condenser, a second condenser, a first liquid reservoir, and a second liquid reservoir.
[0183] The heat dissipation circuit of the first heating component includes: a first evaporator, a first condenser, and a first liquid receiver.
[0184] The heat dissipation circuit of the second heating component includes: a second evaporator, a second condenser, and a second liquid receiver.
[0185] In this way, the heat dissipation circuit of the first heating element and the heat dissipation circuit of the second heating element are two independent loops with no connection between the two chambers. Each has its own evaporator, condenser and liquid receiver, which can prevent the first heating element and the second heating element with different operating temperatures from being controlled to similar temperatures.
[0186] Since the technical concept is the same, if the number of heating components is greater than two, you can refer to the corresponding explanation for the case where the number of heating components is two.
[0187] In the heat dissipation circuit of each heat-generating component, the number of evaporators can be one or more. In some implementations, multiple evaporators are used because the first satellite equipment operates in the extreme and harsh environment of space. If there is only one evaporator in a heat dissipation circuit, the evaporator may malfunction, causing the heat dissipation circuit to be interrupted and unable to dissipate heat normally. By setting multiple evaporators in a heat dissipation circuit and connecting them in parallel, the situation where the heat dissipation circuit is interrupted due to the malfunction of a single evaporator can be avoided. The same principle applies to the condenser and the liquid receiver.
[0188] In addition, the same liquid reservoir can be shared in the heat dissipation circuits of multiple heat-generating components with the same or similar operating temperatures.
[0189] Figure 9 is another schematic block diagram of a satellite heat dissipation device according to an embodiment of the present application. As shown in Figure 9, the satellite heat dissipation device includes: evaporator 902, evaporator 904, gas pipeline 906, condenser 908, condenser 910, liquid pipeline 912, evaporator 914, evaporator 916, gas pipeline 918, condenser 920, condenser 922, liquid pipeline 924, and liquid reservoir 926.
[0190] The heat dissipation circuit of the first heating component consists of the following components: evaporator 902, evaporator 904, gas pipeline 906, condenser 908, condenser 910, liquid pipeline 912, and liquid receiver 926.
[0191] The heat dissipation circuit of the second heating component consists of the following components: evaporator 914, evaporator 916, gas pipeline 918, condenser 920, condenser 922, liquid pipeline 924, and liquid receiver 926.
[0192] The heat dissipation circuit of the first heating element and the heat dissipation circuit of the second heating element share the liquid reservoir 926.
[0193] Each heat dissipation circuit can be used to dissipate heat from a corresponding heat-generating component. When the operating temperatures of multiple heat-generating components are the same or close, the same liquid reservoir can be shared in multiple heat dissipation circuits.
[0194] The evaporator and condenser can be grouped according to the structural location of the heating components and the radiative condensation area. Each group is connected by its own gas and liquid pipelines. This method can reduce the complexity and length of the piping. The radiative condensation area refers to the area where the condenser pipes are installed. The radiative condensation area can include the surface of the photovoltaic panel or a pre-defined area of the main structure of the first satellite device.
[0195] In addition, taking the heat dissipation circuit of the first heating component and the heat dissipation circuit of the second heating component as examples, the working temperature is close to that of the first heating component and the second heating component, and the difference between their working temperatures T1 and T2 is less than or equal to the preset temperature difference threshold T0.
[0196] In the heat dissipation circuit of the first heat-generating component, evaporators 902 and 904 are connected in parallel, and condensers 908 and 910 are connected in parallel. This ensures that even if evaporator 902 malfunctions, such as due to deteriorated thermal conductivity or poor contact, evaporator 904 can still function normally and dissipate heat from the first heat-generating component. Similarly, even if condenser 908 malfunctions, condenser 910 can still function normally and dissipate heat from the first heat-generating component.
[0197] In some implementations, a heat insulation structure is provided between the condensation pipe and the surface of the photovoltaic panel corresponding to the condensation pipe.
[0198] A heat insulation structure can be installed between the condenser pipes and the surface of the photovoltaic panel.
[0199] For example, the insulation structure can be a honeycomb panel, an insulation film, an aerogel, etc.
[0200] By installing a heat insulation structure, the heat generated by solar radiation and power generation from the photovoltaic panel can be prevented from being applied to the condenser pipes, thus avoiding interference with the exothermic condensation of the working fluid within the pipes. Furthermore, considering the structure of the condenser pipes, the actual contact area between the pipes and the photovoltaic panel is relatively small. Even with a heat insulation structure between them, the area of the photovoltaic panel without insulation is significantly larger than the area with insulation, therefore, it will not affect the heat dissipation of the photovoltaic panel itself.
[0201] There can be multiple condenser lines. These condenser lines can be connected in parallel. The flow path design of the condenser lines is not limited; it can be a parallel straight line, S-shaped, Tesla valve type, tree-branch type, etc.
[0202] Figure 10 is a schematic block diagram of a condenser in another satellite heat dissipation device according to an embodiment of the present application.
[0203] As shown in Figure 10, the condenser 1000 includes: condenser pipe 1002, condenser pipe 1004, condenser pipe 1006, and condenser pipe 1008, etc. Figure 10 only shows a portion of the condensing components in the condenser 1000 by way of example.
[0204] A condenser 1000 is disposed on the surface of the photovoltaic panel of the first satellite device. The photovoltaic panel comprises multiple panels, which are folded before the launch of the first satellite device and unfolded when the first satellite device is in operation.
[0205] The inlets and outlets of each condenser pipe in the condenser 1000 are connected to form a parallel pipe structure. Furthermore, the condenser pipes are connected by a flexible structure to accommodate the folding and unfolding of the photovoltaic panels.
[0206] The reason for setting up multiple condenser pipes in parallel is that the structure of the condenser pipes is fixed, and each condenser pipe can only be laid on one panel that is not affected by the folding of the photovoltaic panel. The number of condenser pipes is determined by the number of photovoltaic panels. By connecting the various condenser pipes in parallel, the surface of multiple panels of the photovoltaic panel can be fully utilized to help dissipate heat, and the amount of heat dissipation can be easily controlled.
[0207] In some implementations, the condenser also includes a valve; the valve is located at the inlet of the condenser line and is used to release the working gas in the open state and to intercept the working gas in the closed state.
[0208] Valves, also known as valves, are mechanical devices used to control the flow of fluids (such as liquids, gases, powders, or slurries). They regulate flow rate, pressure, and direction by opening, closing, or partially blocking fluid passages.
[0209] For example, the valve could be a solenoid valve.
[0210] The valves in the condenser can be installed at the inlet of the condenser line.
[0211] A valve in the open state means that the valve is fully or partially open, allowing fluid to flow freely through the valve passage. A valve in the closed state means that the valve is completely closed, preventing fluid from flowing through the valve passage.
[0212] When the valve is open, it allows the gaseous working fluid to pass through; when it is closed, it blocks the gaseous working fluid. By switching the valve's state, the total heat dissipation of the satellite's cooling system can be controlled.
[0213] The following describes one structure of a condenser with reference to Figure 11.
[0214] Figure 11 is a structural schematic diagram of a condenser in another satellite heat dissipation device according to an embodiment of the present application.
[0215] As shown in Figure 11, the condenser includes: valve 1102, condenser pipe 1104, flexible structure 1106, valve 1108, condenser pipe 1110, flexible structure 1112, valve 1114, condenser pipe 1116, flexible structure 1118, valve 1120, and condenser pipe 1122.
[0216] The valve 1102 is located at the input end of the condenser pipe 1104. When the valve 1102 is in the open state, it can allow the gaseous working medium to enter the condenser pipe 1104. When the valve 1102 is in the closed state, it can block the gaseous working medium so that it cannot enter the condenser pipe 1104.
[0217] Valve 1108 is disposed at the inlet of condenser line 1110. When valve 1108 is in the open state, valve 1108 can allow gaseous working fluid to enter condenser line 1110. When valve 1108 is in the closed state, valve 1108 can block gaseous working fluid so that gaseous working fluid cannot enter condenser line 1110.
[0218] Valve 1114 is located at the inlet of condenser line 1116. When valve 1114 is in the open state, it can allow gaseous working fluid to enter condenser line 1116. When valve 1114 is in the closed state, it can block gaseous working fluid from entering condenser line 1116.
[0219] The valve 1120 is disposed at the inlet of the condenser line 1122. When the valve 1120 is in the open state, the valve 1120 can allow the gaseous working medium to enter the condenser line 1122. When the valve 1120 is in the closed state, the valve 1120 can block the gaseous working medium so that the gaseous working medium cannot enter the condenser line 1122.
[0220] The condenser pipe 1104 and the condenser pipe 1110 can be connected by the flexible structure 1106, the condenser pipe 1110 and the condenser pipe 1116 can be connected by the flexible structure 1112, and the condenser pipe 1116 and the condenser pipe 1122 can be connected by the flexible structure 1118.
[0221] Next, another structure of the condenser will be illustrated with reference to Figures 12 and 13.
[0222] Figure 12 is another schematic block diagram of a condenser in a satellite heat dissipation device according to an embodiment of the present application; Figure 13 is another structural schematic diagram of a condenser in a satellite heat dissipation device according to an embodiment of the present application.
[0223] As shown in Figure 12, the condenser 1200 includes: condenser line 1202, condenser line 1204, condenser line 1206, and condenser line 1208, etc. Figure 12 only shows a portion of the condensing components in the condenser 1200 by way of example.
[0224] Condensing pipes 1202 and 1204 are pre-assigned to the first group, and condensing pipes 1206 and 1208 are pre-assigned to the second group.
[0225] In the first group, the input end of condenser pipe 1202 is connected to the input end of condenser pipe 1204, and the output end of condenser pipe 1202 is connected to the output end of condenser pipe 1204, that is, condenser pipe 1202 and condenser pipe 1204 are connected in parallel.
[0226] In the second group, the input end of condenser pipe 1206 is connected to the input end of condenser pipe 1208, and the output end of condenser pipe 1206 is connected to the output end of condenser pipe 1208, that is, condenser pipe 1206 and condenser pipe 1208 are connected in parallel.
[0227] The first and second groups are not connected, that is, there is no connection between condenser pipe 1202 and condenser pipe 1206, there is no connection between condenser pipe 1202 and condenser pipe 1208, there is no connection between condenser pipe 1204 and condenser pipe 1206, and there is no connection between condenser pipe 1204 and condenser pipe 1208.
[0228] By setting the parallel-connected condenser pipes 1202 and 1204 in an independent heat dissipation circuit, and setting the parallel-connected condenser pipes 1206 and 1208 in another independent heat dissipation circuit, the other heat dissipation circuit can be used to help dissipate heat if one heat dissipation circuit is interrupted, thereby avoiding the satellite device from completely stopping its operation due to heat dissipation failure.
[0229] As shown in Figure 13, the condenser includes: valve 1302, condenser pipe 1304, flexible structure 1306, valve 1308, condenser pipe 1310, flexible structure 1312, valve 1314, condenser pipe 1316, flexible structure 1318, valve 1320, and condenser pipe 1322.
[0230] The valve 1302 is located at the input end of the condenser pipe 1304. When the valve 1302 is in the open state, it can allow the gaseous working medium to enter the condenser pipe 1304. When the valve 1302 is in the closed state, it can block the gaseous working medium so that it cannot enter the condenser pipe 1304.
[0231] Valve 1308 is disposed at the input end of condenser line 1310. When valve 1308 is in the open state, valve 1308 can allow gaseous working fluid to enter condenser line 1310. When valve 1308 is in the closed state, valve 1308 can block gaseous working fluid so that gaseous working fluid cannot enter condenser line 1310.
[0232] Valve 1314 is disposed at the inlet of condenser line 1316. When valve 1314 is in the open state, valve 1314 can allow gaseous working fluid to enter condenser line 1316. When valve 1314 is in the closed state, valve 1314 can block gaseous working fluid so that gaseous working fluid cannot enter condenser line 1316.
[0233] Valve 1320 is disposed at the inlet of condenser line 1322. When valve 1320 is in the open state, valve 1320 can allow gaseous working fluid to enter condenser line 1322. When valve 1320 is in the closed state, valve 1320 can block gaseous working fluid so that gaseous working fluid cannot enter condenser line 1322.
[0234] The condenser pipe 1304 and the condenser pipe 1310 can be connected by the flexible structure 1306, and the condenser pipe 1316 and the condenser pipe 1322 can be connected by the flexible structure 1318.
[0235] It should be emphasized that although the condenser includes a flexible structure 1312, as shown in Figure 13, there is no connection between the condenser pipe 1310 and the condenser pipe 1316.
[0236] The connection relationships of the various condenser pipes in this condenser can be seen in the corresponding description in Figure 12.
[0237] In some implementations, the valve can be installed not only at the inlet of the condenser line, but also at the outlet of the condenser line.
[0238] In some implementations, the flexible structure includes at least one of the following: bellows, spiral spring coil, flexible material pipeline, and rotatable joint.
[0239] In the case of a folded photovoltaic panel, taking a photovoltaic panel consisting of a first panel and a second panel as an example: one condensing module laid on the first panel is unaffected by the folding of the photovoltaic panel. Similarly, another condensing module laid on the second panel is unaffected by the folding of the photovoltaic panel. When the photovoltaic panel is folded, the angle between the first and second panels is less than a preset angle threshold. In this case, the flexible structure changes with the angle between the first and second panels. This ensures that the connection between the two condensing modules is not interrupted by pipe damage caused by the folding of the photovoltaic panel. Therefore, the flexible structure helps the condenser better adapt to the structural deformation of the photovoltaic panel during folding and unfolding.
[0240] A corrugated pipe is a flexible pipe with a corrugated structure, made of materials such as metal and plastic.
[0241] Figure 14 is a schematic diagram of a first flexible structure in another satellite heat dissipation device according to an embodiment of the present application.
[0242] The flexible structure shown in Figure 14 can be a corrugated pipe.
[0243] A helical spring coil is a spiral spring structure made of metal tubing. The main characteristics of a helical spring coil are its elasticity and deformability, which allows it to deform when subjected to external forces.
[0244] Figure 15 is a schematic diagram of a second flexible structure in another satellite heat dissipation device according to an embodiment of the present application.
[0245] The flexible structure shown in Figure 15 can be a helical spring coil.
[0246] Flexible material piping is a piping system made of flexible materials that can deform under external forces to adapt to different installation environments and motion requirements. Flexible materials are generally non-metallic.
[0247] Figure 16 is a schematic diagram of a third flexible structure in another satellite heat dissipation device according to an embodiment of the present application.
[0248] The flexible structure shown in Figure 16 can be a flexible material pipeline.
[0249] When flexible material piping is used as a flexible structure to connect condenser piping, the portion of the non-flexible metal piping near the interface can be equipped with a limiting structure or a sealing and leak-proof structure, such as a multi-ring or labyrinth structure. The flexible material piping can be reinforced with a fastening structure to prevent working fluid leakage.
[0250] A rotatable joint is a mechanical connection device capable of rotational movement in both the axial and radial directions. It allows two or more components to rotate relative to each other while maintaining a connection, and is typically used in applications requiring frequent rotation or turning.
[0251] Figure 17 is a schematic diagram of a fourth flexible structure in another satellite heat dissipation device according to an embodiment of the present application.
[0252] The flexible structure shown in Figure 17 can be a rotatable joint.
[0253] The corrugated pipe, spiral spring coil, flexible material pipeline, and rotatable joint listed above are merely examples. The flexible structure can also be any other flexible component that can adapt to the structural deformation caused by the folding of photovoltaic panels. It can be configured and determined according to the actual scenario. One or more embodiments of this application are not limited here.
[0254] In some implementations, the condenser has multiple valves, each with a corresponding serial number, and the serial number of each valve matches the order in which the working gas passes through each valve.
[0255] With multiple valves in the open position, the gas medium passes through the valves corresponding to each valve in ascending order of their serial numbers.
[0256] For example, there are 3 valves. The first valve is numbered 1, the second valve is numbered 2, and the third valve is numbered 3. When the first, second, and third valves are all open, the gas working medium first passes through the first valve (numbered 1), then through the second valve (numbered 2), and finally through the third valve (numbered 3).
[0257] The smaller the serial number, the closer the valve corresponding to that serial number is to the main structure of the first satellite device, and the earlier the gas medium passes through that valve; the larger the serial number, the farther the valve corresponding to that serial number is from the main structure of the first satellite device, and the later the gas medium passes through that valve.
[0258] In some implementations, the valves are arranged in ascending order of their opening sequence and in descending order of their closing sequence.
[0259] Multiple valves are opened sequentially in ascending order of their serial numbers, and multiple valves are closed sequentially in descending order of their serial numbers.
[0260] When valves are open, valves with lower serial numbers are opened first; when valves are closed, valves with higher serial numbers are closed first. That is, when valves are open, those closer to the main structure of the first satellite device are opened first; when valves are closed, those farther from the main structure of the first satellite device are closed first.
[0261] For example, if there are 3 valves, with the first valve numbered 1, the second valve numbered 2, and the third valve numbered 3, the opening sequence of the three valves is: the first valve is opened first, followed by the second valve, and finally the third valve. The closing sequence of the three valves is: the third valve is opened first, followed by the second valve, and finally the first valve.
[0262] The reason for prioritizing the opening of valves with lower serial numbers when opening valves is that the serial number of each valve matches the order in which the gas working medium passes through each valve. That is, in the normal heat dissipation cycle, the gas working medium passes through the valves with lower serial numbers first, and then through the valves with higher serial numbers. Therefore, the opening sequence of multiple valves conforms to the flow sequence of the gas working medium, which helps to improve the start-up efficiency of the satellite heat dissipation device and reduce the flow pressure loss in the gas pipeline and liquid pipeline.
[0263] The reason for prioritizing the closure of valves with higher serial numbers when closing valves is that the heat source comes from the heating element. The evaporator is connected to the heating element. Prioritizing the closure of valves with higher serial numbers means that the remaining working fluid transmission distance in the available heat dissipation circuit is relatively short. Compared with prioritizing the closure of valves with lower serial numbers, the flow pressure loss is smaller and the heat dissipation efficiency is relatively higher.
[0264] Example 3
[0265] The above are satellite heat dissipation devices provided in the embodiments of this application. Based on the same idea, the embodiments of this application also provide a control system for a satellite heat dissipation device.
[0266] Figure 18 is a schematic block diagram of a control system for a satellite heat dissipation device according to an embodiment of this application. As shown in Figure 18, the control system 1800 of the satellite heat dissipation device includes a satellite heat dissipation device 1806 as provided in the aforementioned embodiments, a temperature information acquisition device 1802, and a control signal generation device 1804; wherein: the temperature information acquisition device 1804 is used to acquire temperature information of the heat-generating component; the control signal generation device 1806 is used to generate a control signal for the satellite heat dissipation device based on the temperature information; the control signal is used to control the interception or release of gaseous working fluid into the condenser of the satellite heat dissipation device.
[0267] Taking the antenna module as an example of the heat-generating component of the first satellite equipment: Considering that the transmit and receive power of the antenna module is not constant and fluctuates greatly according to the actual service situation, and the external heat flow environment is also very complex, in order to achieve constant control of the device temperature, a control strategy for the condenser valve can be configured.
[0268] The control strategy may include the correspondence between temperature information and control signals, or the correspondence between the change in two temperature information acquired in adjacent time periods and control signals, and so on.
[0269] In some implementations, when the control signal generating device 1806 generates a control signal for the satellite heat dissipation device based on temperature information, it performs the following steps: determining a second number of valves in the open state in the second time period based on temperature information collected in a first time period, temperature information collected in a second time period, and a first number of valves in the open state in the first time period; the first time period and the second time period are adjacent, and the first time period is located before the second time period; if the first number is greater than the second number, a first control signal for the valves in the condenser is generated based on the difference between the first number and the second number; if the first number is less than the second number, a second control signal for the valves in the condenser is generated based on the difference between the second number and the first number.
[0270] The first quantity can be an integer greater than or equal to 0, and the second quantity can be an integer greater than or equal to 0.
[0271] The following example, with reference to Table 1, illustrates how control signals are generated in this implementation.
[0272] Table 1 is a set of control strategies used in the control system of a satellite heat dissipation device according to an embodiment of this application.
[0273] This set of control strategies includes multiple control strategies.
[0274] Table 1
[0275] The first time period is adjacent to the second time period, and the first time period precedes the second time period. As shown in Table 1, the current period can be the second time period, and the previous period can be the first time period. The temperature information collected in the current period can be represented by ΔT, and the temperature information collected in the previous period can be represented by ΔT'. N is used to represent the first number of valves that were in the open state in the previous period. N can be an integer greater than or equal to 0, and T0 is used to represent the temperature control segment interval.
[0276] The temperature information ΔT' collected in the previous cycle can be the difference between the first temperature collected for the heating element in the previous cycle and the preset temperature threshold; the temperature information ΔT collected in this cycle can be the difference between the second temperature collected for the heating element in this cycle and the preset temperature threshold.
[0277] The temperature control segmentation interval can be regarded as a pre-configured temperature threshold, which is used to divide the temperature range. Each temperature range can be used as reference information during the temperature control process.
[0278] Based on the temperature information ΔT' collected in the previous cycle and the temperature control segment interval T0, we can determine which temperature range the temperature information ΔT' collected in the previous cycle falls within. Furthermore, we can determine which row in Table 1 the current control strategy should match.
[0279] Based on the temperature information ΔT collected in this cycle and the temperature control segment interval T0, it can be determined which temperature range the temperature information ΔT collected in this cycle falls within. Furthermore, it can be determined which column in Table 1 matches the current control strategy.
[0280] Therefore, based on the temperature information ΔT' collected in the previous cycle, the temperature information ΔT collected in the current cycle, and the temperature control segment interval T0, a unique control strategy can be obtained by querying the pre-configured Table 1.
[0281] For example, suppose the control strategy obtained from the query is "N-1", where N represents the first number of valves that were in the open state in the previous cycle. Since the value of N is known, based on the first number and the obtained control strategy, the second number of valves that will be in the open state in the current cycle according to this control strategy can be determined. That is, the second number is N-1. The value of the second number can be calculated based on the known value of the first number. If the calculated value of the second number is less than 0, it is taken as 0.
[0282] Therefore, based on the temperature information ΔT' collected in the previous cycle, the temperature information ΔT collected in this cycle, the temperature control segment interval T0, and the first quantity N, the second quantity can be determined.
[0283] If the first quantity is greater than the second quantity, a first control signal is generated for the valves in the condenser based on the difference between the first and second quantities. The first control signal can be a control signal for closing the valves, and the number of valves to be closed is the difference between the first and second quantities.
[0284] In addition, after determining the number of valves to be closed, the valves to be closed can be selected from largest to smallest according to their serial numbers, as can be found in the description of the corresponding valve serial numbers in the aforementioned embodiments.
[0285] If the first quantity equals the second quantity, it can be determined that there is no need to open or close the valve, so there is no need to generate a control signal.
[0286] If the first quantity is less than the second quantity, a second control signal is generated for the valves in the condenser based on the difference between the second and first quantities. The second control signal can be a control signal for opening the valves, and the number of valves to be opened is the difference between the second and first quantities.
[0287] In addition, after determining the number of valves to be opened, the valves to be opened can be selected in ascending order of their serial numbers, as described in the preceding embodiment regarding the corresponding valve serial numbers.
[0288] For example, in the case where a single heat-generating component in the first satellite device corresponds to multiple heat dissipation circuits in the satellite heat dissipation device, and each heat dissipation circuit is independent of the others, the valves in each heat dissipation circuit can be controlled one by one.
[0289] The multiple heat dissipation circuits include heat dissipation circuit A and heat dissipation circuit B. In the satellite heat dissipation system of the satellite heat dissipation device, a control signal generating device generates a second control signal. When this second control signal is used to open valves, the valves in heat dissipation circuit A can be opened first. After all valves in heat dissipation circuit A are open, if it is necessary to increase the number of valves to be opened, then the valves in heat dissipation circuit B can be opened. Conversely, in the satellite heat dissipation system of the satellite heat dissipation device, a control signal generating device generates a first control signal. When this first control signal is used to close valves, the valves in heat dissipation circuit B can be closed first. After all valves in heat dissipation circuit B are closed, if it is necessary to reduce the number of valves to be opened, then the valves in heat dissipation circuit A can be closed.
[0290] Example 4
[0291] Following the same logic as the control system of the satellite heat dissipation device provided in the above embodiments, this application also provides a control method for a satellite heat dissipation device, applied to the control system of the satellite heat dissipation device. The method includes: collecting temperature information of the heat-generating component; generating a control signal for the satellite heat dissipation device based on the temperature information; and using the control signal to control the interception or release of the gaseous working fluid into the condenser of the satellite heat dissipation device.
[0292] The implementation process of the control method for the satellite heat dissipation device can be illustrated below with reference to Figure 19.
[0293] Figure 19 is a schematic block diagram of a control method for a satellite heat dissipation device according to an embodiment of this application.
[0294] Step S1902: Obtain the current temperature difference.
[0295] The current temperature difference can be referred to the corresponding description of the temperature information collected in the second time period in the aforementioned embodiment.
[0296] Step S1904: Determine the valve operation mode based on the temperature difference of the current cycle and the temperature difference of the previous cycle.
[0297] The temperature difference of the previous cycle can be referred to the corresponding description of the temperature information collected in the first time cycle in the aforementioned embodiment.
[0298] This step can be referred to the corresponding description of the control signal generation device 1806 in the foregoing embodiments.
[0299] Step S1906, corresponding control valve.
[0300] This step involves controlling the valve according to the valve operation method determined in step S1904.
[0301] Step S1908: Periodic data reading.
[0302] By periodically reading data, the number of valves in the satellite heat dissipation device that are in the open state can be updated regularly, thereby controlling the total heat dissipation in the satellite heat dissipation device and making the actual temperature of the heat-generating components match its preset standard operating temperature.
[0303] Since the technical concept is the same, this embodiment is described in a relatively simple way. Please refer to the corresponding explanatory section in the above embodiment.
[0304] Example 5
[0305] Based on the same idea, this application also provides another control system for a satellite heat dissipation device, as shown in Figure 20. Figure 20 is a schematic block diagram of another control system for a satellite heat dissipation device according to an embodiment of this application.
[0306] The control system of the satellite heat dissipation device includes a processor 2010, a temperature sensor 2020, a satellite heat dissipation device 2030, a power supply 2040, and a valve 2050.
[0307] The temperature sensor 2020 can be installed at a temperature measurement point corresponding to the satellite heat dissipation device 2030 to measure the temperature at that point. The satellite heat dissipation device 2030 is connected to the power supply 2040 via a valve 2050. The processor 2010 is connected to both the temperature sensor 2020 and the valve 2050. The processor 2010 controls the opening and closing of the valve 2050 based on the temperature information received from the temperature sensor 2020. The processor 2010 also controls the power supply 2040 to supply power to the satellite heat dissipation device 2030.
[0308] In addition, the control system of satellite heat dissipation device for electronic equipment can vary greatly due to different configurations or performance. The number of each component in the control system of the aforementioned satellite heat dissipation device can be one or multiple.
[0309] Under the above operating environment, this application provides a control method for a satellite heat dissipation device. This method can be implemented by the processor 2010 shown in FIG20. The method can be referred to the corresponding description section of the above method embodiment.
[0310] In this embodiment of the application, the processor 2010 can perform the following steps: collecting temperature information of the heat-generating component; generating a control signal for the satellite heat dissipation device based on the temperature information; the control signal is used to control the interception or release of the gaseous working fluid into the condenser of the satellite heat dissipation device.
[0311] The aforementioned acquisition of temperature information of the heat-generating components can be achieved by the processor 2010 through the temperature sensor 2020. The aforementioned control of intercepting or allowing the gaseous working fluid to enter the condenser of the satellite heat dissipation device 2030 can be achieved by the processor 2010 through the opening and closing of the control valve 2050.
[0312] In this embodiment, a control signal is generated by generating temperature information to control the interception or release of the gaseous working fluid. This allows for flexible adjustment of the total heat dissipation of the satellite heat dissipation device, ensuring that the actual temperature of the heat-generating component matches the pre-configured standard operating temperature of the heat-generating component, which is beneficial for the stable operation of the heat-generating component.
[0313] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0314] The various embodiments in this application are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions of the method embodiments.
[0315] The above description is merely an embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this application should be included within the scope of the claims of this application.
Claims
1. A satellite heat dissipation device, comprising: An evaporator, connected to the heating element of the first satellite device, is used to convert the liquid working fluid in the evaporator into a gaseous working fluid when absorbing heat from the heating element, and to transfer the gaseous working fluid to a condenser, wherein the evaporator draws the liquid working fluid from a reservoir; The condenser is disposed on the surface of the photovoltaic panel of the first satellite device, and is used to condense the received gaseous working fluid into the liquid working fluid and store the liquid working fluid in the reservoir; wherein, the condenser includes condensation pipes and a flexible structure; each condensation pipe is laid on the surface of the photovoltaic panel, and any two adjacent condensation pipes are connected by the flexible structure.
2. The apparatus according to claim 1, wherein, The condenser is disposed on the first surface of the photovoltaic panel that is away from the natural light source.
3. The apparatus according to claim 1, wherein, The evaporator includes multiple evaporation components and heat pipes, and the multiple evaporation components are connected through the heat pipes; wherein... The heat pipe is used to transfer heat between the plurality of evaporation components.
4. The apparatus according to claim 1, wherein, The number of heating elements is multiple, each with a different operating temperature; the number of evaporators is multiple; the number of condensers is multiple; the number of liquid receivers is multiple; wherein, Each heat-generating component's heat dissipation circuit includes at least one evaporator, at least one condenser, and at least one liquid receiver.
5. The apparatus according to claim 1, wherein, A heat insulation structure is provided between the condensation pipe and the surface of the photovoltaic panel corresponding to the condensation pipe.
6. The apparatus according to claim 1, wherein, The condenser also includes valves; The valve is located at the input end of the condenser pipe and is used to release the gaseous working fluid when it is open and to intercept the gaseous working fluid when it is closed.
7. The apparatus according to claim 1, wherein, The flexible structure includes at least one of the following: a bellows, a spiral spring coil, a flexible material pipeline, or a rotatable joint.
8. The apparatus according to claim 6, wherein, The number of valves is multiple, and each valve has a corresponding serial number. The serial number of each valve matches the order in which the gas working medium passes through each valve.
9. The apparatus according to claim 8, wherein, In the opening sequence of the multiple valves, the valves are arranged in ascending order of their serial numbers, and in the closing sequence of the multiple valves, the valves are arranged in descending order of their serial numbers.
10. A control system for a satellite heat dissipation device, comprising the satellite heat dissipation device as described in any one of claims 1-9, a temperature information acquisition device, and a control signal generation device; wherein: The temperature information acquisition device is used to acquire the temperature information of the heating component; The control signal generating device is used to generate a control signal for the satellite heat dissipation device based on the temperature information; the control signal is used to control the interception or release of the gaseous working fluid into the condenser of the satellite heat dissipation device.