Electronic device
By introducing a combined structure of device units, heat dissipation components, thermally conductive fillers, and enclosures into electronic devices, the problem of poor heat dissipation of electronic components is solved, resulting in better heat dissipation and improved equipment performance.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- HUAWEI TECH CO LTD
- Filing Date
- 2025-11-11
- Publication Date
- 2026-07-02
AI Technical Summary
Electronic components suffer from poor heat dissipation during miniaturization and high-density processes, making it difficult to solve the heat dissipation challenges brought about by increased power density.
The system employs a combination structure of device units, heat dissipation components, thermally conductive fillers, and enclosure components. Through the thermally conductive connection between the enclosure components and the circuit board and heat dissipation components, multiple heat dissipation paths are formed, increasing the heat dissipation area and utilizing the thermally conductive fillers for heat transfer.
It improves the heat dissipation effect of electronic components, increases the heat dissipation area, and improves the overall performance of electronic devices.
Smart Images
Figure CN2025134153_02072026_PF_FP_ABST
Abstract
Description
An electronic device
[0001] Cross-references to related applications
[0002] This application claims priority to Chinese Patent Application No. 202411933744.9, filed on December 24, 2024, entitled "An Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field
[0003] This application relates to the field of terminal equipment technology, and more particularly to an electronic device. Background Technology
[0004] In recent years, with the miniaturization of electronic devices, various electronic components within these devices are developing towards smaller size and higher density. At the same time, the power consumption of these electronic components is also continuously increasing. This increasing power consumption and decreasing size lead to a continuous increase in the power density of electronic components, resulting in increasingly greater challenges to their heat dissipation. Summary of the Invention
[0005] This application provides an electronic device that has better heat dissipation for its electronic components.
[0006] In a first aspect, this application provides an electronic device comprising a first circuit board having a first surface and a second surface opposing each other along a thickness direction; the electronic device further comprising at least one of the first surface and the second surface being disposed thereon.
[0007] The device unit, heat dissipation assembly, thermally conductive filler, and enclosure are provided. The device unit is fixed to a first circuit board, and the heat dissipation assembly is disposed on the side of the device unit away from the first circuit board. The enclosure is connected between the first circuit board and the heat dissipation assembly and surrounds the device unit circumferentially. The enclosure, the first circuit board, the heat dissipation assembly, and the device unit form an accommodating space, and the thermally conductive filler is filled in the accommodating space.
[0008] In this design, the surface of the device unit facing the heat dissipation component is in contact with the heat dissipation component, which then dissipates heat from the device unit. Simultaneously, the device unit is thermally connected to the heat dissipation component via a thermally conductive filler, thus forming a heat dissipation path from the device unit to the thermally conductive filler and then from the thermally conductive filler to the heat dissipation component. This design increases the heat dissipation area of the device unit, thereby improving its heat dissipation performance and enhancing the performance of the electronic device.
[0009] In one possible embodiment, the enclosure is made of a thermally conductive material, and the enclosure is thermally connected to both the first circuit board and the heat dissipation assembly. Both the enclosure and the first circuit board can be used to form a heat dissipation path for the device unit, resulting in a larger heat dissipation area for the device unit.
[0010] In one possible embodiment, the enclosure component includes a cylindrical section with a uniform wall thickness at any point; one end of the cylindrical section is connected to a first circuit board, and the other end is connected to a heat dissipation assembly. This solution simplifies the structure of the enclosure component and reduces its processing difficulty and manufacturing cost.
[0011] In one possible embodiment, the end of the cylindrical segment facing the heat dissipation assembly has an extension that extends along the arrangement direction of the inner and outer walls of the cylindrical segment. The extension is used for thermally conductive connection to the heat dissipation assembly. Along the thickness direction of the first circuit board, the thickness of the extension is less than the thickness of the cylindrical segment. The extension can further increase the heat dissipation area of the enclosure member in the heat dissipation path, thereby further improving the heat dissipation effect of the device unit.
[0012] In one possible embodiment, the outer wall of the cylindrical segment has an extension that surrounds the cylindrical segment circumferentially. This structure of the enclosure facilitates the filling of a thermally conductive filler into the receiving space during the assembly of electronic devices.
[0013] In one possible embodiment, the inner wall of the cylindrical section has an extension, and a filling port is formed between the extension and the device unit, the filling port communicating with the receiving space. The enclosure component of this structure does not encroach on the fabric area and has less impact on the fabric.
[0014] In one possible embodiment, the thermally conductive filler includes at least one of thermally conductive adhesive, thermally conductive grease, and thermally conductive gel. When the thermally conductive filler includes thermally conductive adhesive, it can improve the heat dissipation of the device unit while simultaneously enhancing the structural strength of the electronic device.
[0015] In one possible embodiment, the thermal conductivity of the thermally conductive filler is greater than or equal to 1 W / (m·K) to achieve good thermal conductivity.
[0016] In one possible embodiment, the device unit includes multiple independent devices, each of which is in thermal contact with a heat dissipation component or with a thermally conductive filler.
[0017] In one possible embodiment, the device unit includes a second circuit board and one or more devices. The second circuit board is disposed on the first circuit board, and the one or more devices are disposed on the side of the second circuit board opposite to the first circuit board. That is, the device unit is an electronic module to reduce the size of the electronic device.
[0018] In one possible embodiment, the first circuit board is a printed circuit board, and the device unit is electrically connected to the printed circuit board.
[0019] In one possible embodiment, a copper layer is exposed on the surface of the printed circuit board, and the enclosure is soldered to the copper layer. This design provides better sealing of the containment space.
[0020] In one possible embodiment, the area of the heat dissipation component projected onto the first circuit board is larger than the area enclosed by the projected area of the enclosure member on the first circuit board, so as to optimize the heat dissipation effect of the device unit.
[0021] In one possible embodiment, the surface of the heat dissipation component facing the first circuit board is provided with a thermal interface material layer, and the device unit, the enclosure and the thermally conductive filler are connected to the heat dissipation component through the thermal interface material layer, thereby improving the heat dissipation effect of the electronic components. Attached Figure Description
[0022] Figure 1 is a schematic diagram of a partial structure of an electronic device;
[0023] Figure 2 is a partial structural schematic diagram of an electronic device provided in an embodiment of this application;
[0024] Figure 3 is a top view of the electronic device shown in Figure 2 without the heat dissipation components;
[0025] Figure 4 is a partial structural schematic diagram of another electronic device provided in an embodiment of this application;
[0026] Figure 5 is a partial structural schematic diagram of another electronic device provided in an embodiment of this application;
[0027] Figure 6 is a partial structural schematic diagram of an electronic device provided in an embodiment of this application;
[0028] Figure 7 is a partial structural schematic diagram of an electronic device provided in an embodiment of this application.
[0029] Reference numerals: 1-First circuit board; 1'-Circuit board; 21, 21'-Device unit; 211-Second circuit board; 212-Device; 22, 22'-Heat dissipation assembly; 23-Thermal conductive filler; 24-Blocking component; 241-Cylindrical section; 242-Extension; 3-Thermal interface material layer. Detailed Implementation
[0030] Electronic devices such as mobile phones, tablets (portable Android devices, Pads), personal computers (PCs), in-vehicle mobile devices, and computing centers are all developing towards miniaturization and high density. Heat dissipation of these electronic components has become a crucial aspect to consider in the design process. For example, Figure 1 shows a partial structural diagram of a traditional electronic device. As shown in Figure 1, this electronic device includes a heat dissipation component 22', a circuit board 1', and a device unit 21' disposed on the circuit board 1'. The device unit 21' is connected to the heat dissipation component 22' to achieve heat dissipation. This method can achieve heat dissipation for the device unit 21', but its limitations are also quite obvious. Specifically, in this method, only the surface of the device unit 21' facing the heat dissipation component 22' can be used for heat dissipation, limiting the heat dissipation area and resulting in poor heat dissipation effect for the device unit 21'.
[0031] Based on this, embodiments of this application provide an electronic device to improve the problem of poor heat dissipation of device units. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings.
[0032] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more” unless the context clearly indicates otherwise.
[0033] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.
[0034] Figure 2 is a partial structural schematic diagram of an electronic device provided in an embodiment of this application. As shown in Figure 2, the electronic device provided in this embodiment includes a first circuit board 1, which has a first surface a and a second surface b opposite to each other in the thickness direction. The electronic device also includes a device unit 21, a heat dissipation assembly 22, a thermally conductive filler 23, and a retaining member 24 disposed on at least one of the first surface a and the second surface b of the first circuit board 1. That is, the first surface a of the first circuit board 1 is provided with the device unit 21, the heat dissipation assembly 22, the thermally conductive filler 23, and the retaining member 24; or, the second surface b of the first circuit board 1 is provided with the device unit 21, the heat dissipation assembly 22, the thermally conductive filler 23, and the retaining member 24; or, the first surface a of the first circuit board 1 is provided with the device unit 21, the heat dissipation assembly 22, the thermally conductive filler 23, and the retaining member 24, and the second surface b of the first circuit board 1 is also provided with the device unit 21, the heat dissipation assembly 22, the thermally conductive filler 23, and the retaining member 24.
[0035] In this embodiment, the device unit 21, heat dissipation assembly 22, thermally conductive filler 23, and enclosure member 24 are provided on the first surface a of the first circuit board 1 as an example. Specifically, referring to Figure 2, the device unit 21 is fixed to the first surface a of the first circuit board 1, and the heat dissipation assembly 22 is disposed on the side of the device unit 21 facing away from the first circuit board 1. The enclosure member 24 is connected between the first circuit board 1 and the heat dissipation assembly 22, and surrounds the device unit 21 circumferentially, thereby forming an accommodating space between the enclosure member 24, the first circuit board 1, the heat dissipation assembly 22, and the device unit 21. The thermally conductive filler 23 fills this accommodating space. It is easy to understand that the thermally conductive filler 23 is in contact with both the device unit 21 and the heat dissipation assembly 22, and can exchange heat with both the device unit 21 and the heat dissipation assembly 22, thereby guiding the heat of the device unit 21 to the heat dissipation assembly 22, increasing the heat dissipation area, and improving the heat dissipation effect.
[0036] In this design, the surface of device unit 21 facing the heat dissipation assembly 22 is in contact with the heat dissipation assembly 22, and this surface serves to dissipate heat. Device unit 21 is thermally connected to the heat dissipation assembly 22 via thermally conductive filler 23, thus forming a heat dissipation path from device unit 21 to thermally conductive filler 23, and then from thermally conductive filler 23 to heat dissipation assembly 22. In other words, this design increases the heat dissipation area of device unit 21, resulting in better heat dissipation and thus improving the performance of the electronic device.
[0037] As shown in Figure 2, when specifically configuring the heat dissipation component 22, a thermal interface material layer 3 can be provided on the surface of the heat dissipation component 22 facing the first circuit board 1. The electronic components, the enclosure 24, and the thermally conductive filler 23 are all connected to the heat dissipation component 22 through the thermal interface material layer 3. The provision of the thermal interface material layer 3 can reduce the contact thermal resistance between the electronic components, the enclosure 24, and the thermally conductive filler 23 and the heat dissipation component 22, thereby improving the heat dissipation effect of the electronic components.
[0038] In some embodiments, the enclosure 24 is made of a thermally conductive material. The device unit 21 is thermally connected to the first circuit board 1, and the enclosure 24 is thermally connected to both the first circuit board 1 and the heat dissipation assembly 22. That is, the device unit 21 is connected to the first circuit board 1 and can exchange heat with it, while the enclosure 24 is connected to both the first circuit board 1 and the heat dissipation assembly 22, and can exchange heat with both. In this way, the heat generated by the device unit 21 can be transferred in three directions: to the heat dissipation assembly 22, the first circuit board 1, and the thermally conductive filler 23. Each surface of the device unit 21 can transfer heat to the heat dissipation assembly 22 through a corresponding heat dissipation path, resulting in a larger heat dissipation area and better heat dissipation effect.
[0039] Specifically, taking the perspective shown in Figure 2 as an example, the heat generated by the device unit 21 can be directly transferred upwards to the heat dissipation assembly 22; it can also be transferred laterally to the thermally conductive filler 23, and then from the thermally conductive filler 23 to the heat dissipation assembly 22. The thermally conductive filler 23 can also transfer the heat to the heat dissipation assembly 22 via the enclosure member 24. The heat generated by the device unit 21 can also be transferred downwards to the first circuit board 1, and then from the first circuit board 1 to the heat dissipation assembly 22 via the thermally conductive filler 23 and the enclosure member 24. This solution increases the heat dissipation area and heat dissipation path of the device unit 21, and can further improve the heat dissipation effect of the device unit 21.
[0040] Figure 3 is a top view of the electronic device shown in Figure 2, omitting the heat dissipation component 22. Referring to Figures 2, 3, and 4, in a specific implementation, the enclosure 24 includes a cylindrical segment 241 with equal wall thickness at all points. Along the thickness direction of the first circuit board 1, one end of the cylindrical segment 241 is connected to the first circuit board 1, and the other end is connected to the heat dissipation component 22. In this design, the enclosure 24 is easier to manufacture. For example, in a cross-section perpendicular to the thickness direction of the first circuit board 1, the outer contour of the enclosure 24 can be rectangular. Of course, in other implementations, the outer contour of the enclosure 24 can also be other shapes, such as other polygons or circles.
[0041] Figure 4 is a partial structural schematic diagram of another electronic device provided in an embodiment of this application. As shown in Figure 4, in some implementations, the cylindrical segment 241 has an extension 242 extending along the arrangement direction of the inner wall and outer wall of the cylindrical segment at one end facing the heat dissipation assembly 22. The extension 242 is used for thermally conductive connection with the heat dissipation assembly 22. In the thickness direction of the first circuit board 1, the thickness of the extension 242 is less than the thickness of the cylindrical segment 241. This solution further increases the heat dissipation area on the heat dissipation path where the enclosure member 24 is located, which can further improve the heat dissipation effect of the device unit 21. In addition, in the thickness direction of the first circuit board 1, the thickness of the extension 242 is less than the thickness of the cylindrical segment 241. While improving the heat dissipation effect of the device unit 21, it also helps to reduce the weight of the electronic device and save material costs.
[0042] In practice, the cylindrical section 241 and the extension 242 can be integrally formed, or the cylindrical section 241 and the extension 242 can be separate components that are fixedly connected together by welding or other means.
[0043] The extension 242 on the cylindrical section 241 can be implemented in various ways. In one specific implementation, as shown in Figure 4, the extension 242 is provided on the outer wall of the cylindrical section 241, and the extension 242 surrounds the cylindrical section 241 circumferentially. This solution can increase the heat dissipation area on the heat dissipation path where the enclosure 24 is located, thereby further improving the heat dissipation effect of the device unit 21, and also facilitates the filling of the accommodating space with thermally conductive filler 23 during the assembly of electronic devices.
[0044] Figure 5 is a partial structural schematic diagram of another electronic device provided in an embodiment of this application. As shown in Figure 5, in some other implementations, the inner wall of the cylindrical section 241 is provided with an extension 242, and a filling port O is formed between the extension 242 and the device unit 21. The filling port O communicates with the receiving space and is used to fill the receiving space with thermally conductive filler 23. In this solution, the extension 242 does not encroach on the layout area of the device unit 21, and has less impact on the layout.
[0045] In specific implementations, the filling port O can take various forms. In one specific implementation, as shown in Figure 5, the filling port O surrounds the device unit 21 circumferentially. In other implementations, the extension 242 partially contacts the device unit 21, and the filling port O is formed at the position where the extension 242 does not contact the device unit 21.
[0046] In some embodiments, both the inner and outer walls of the cylindrical segment 241 may be provided with extensions 242. Specifically, a filling port O is formed between the extension 242 on the inner wall of the cylindrical segment 241 and the device unit 21, and the filling port O communicates with the receiving space. The extension 242 on the outer wall of the cylindrical segment 241 surrounds the cylindrical segment 241 circumferentially.
[0047] When specifically setting the thermally conductive filler 23, the thermal conductivity of the thermally conductive filler 23 can be greater than or equal to 1 W / m·K to achieve good thermal conductivity. The thermally conductive filler 23 can be implemented in various ways. For example, in some embodiments, the thermally conductive filler 23 may include at least one of thermally conductive adhesive, thermally conductive grease, and thermally conductive gel. When the thermally conductive filler includes thermally conductive adhesive, the uncured thermally conductive adhesive can be a highly fluid two-component medium, such as heat-curing thermally conductive adhesive. The interfaces that the thermally conductive adhesive can contact include printed circuit board surfaces, metal housings, plastic encapsulations, magnetic core components, resistors, and capacitors, among others. When the thermally conductive filler includes thermally conductive adhesive, the thermally conductive filler 23 not only improves the heat dissipation effect of the device unit 21, but also adheres to the heat dissipation assembly 22, the first circuit board 1, the device unit, and the enclosure 24, thereby improving the structural strength of the electronic device. In other embodiments, the thermally conductive filler 23 includes liquid metal. Other implementations of the thermally conductive filler 23 are not listed here.
[0048] Referring to Figure 5, in some embodiments, the device unit 21 includes a second circuit board 211 and one or more devices 212, meaning the device unit 21 is an electronic module. Specifically, the second circuit board 211 is disposed on the first circuit board 1, and the one or more devices 212 are disposed on the side of the second circuit board 211 facing away from the first circuit board 1. In this design, the modularization of the devices 212 and the second circuit board 211 facilitates the miniaturization of the electronic device, thereby reducing its size. For example, in this case, the device unit 21 can be a power module, a power module, or a memory module, etc.
[0049] Please refer to the partial structural schematic diagram of the electronic device shown in Figure 6. In some other embodiments, the device unit 21 includes a plurality of independent devices 212, each device 212 being on the first circuit board and in thermal contact with the heat dissipation component 22 or in thermal contact with the thermally conductive filler 23.
[0050] For example, as shown in FIG6, the device unit 21 includes three independent devices 212, all of which are soldered to the first circuit board 1. One device 212 is in contact with the heat dissipation component 22 and can exchange heat with the heat dissipation component 22. The other two devices 212 have a dimension in the thickness direction of the first circuit board 1 that is smaller than the distance between the heat dissipation component 22 and the first circuit board 1. The thermally conductive filler 23 covers the two devices 212, and the two devices 212 are in thermally conductive contact with the thermally conductive filler 23.
[0051] In specific implementation, the aforementioned device 212 can be a resistor, inductor, capacitor, or computing module, etc.
[0052] The first circuit board 1 can be a printed circuit board, and the device unit 21 is electrically connected to the printed circuit board. It is easy to understand that the copper layer in the printed circuit board can also conduct heat while being electrically connected to the device unit 21.
[0053] There are various ways to connect the enclosure 24 to the printed circuit board. For example, in one specific implementation, the enclosure 24 can be soldered to the printed circuit board. Specifically, the enclosure 24 can be made of metal, such as copper or aluminum, and the surface of the printed circuit board has an exposed copper layer. The enclosure 24 is soldered to the exposed copper layer on the surface of the printed circuit board. Exemplarily, in this case, a method for manufacturing an electronic device may include the following steps: applying bright copper around the periphery of the device unit 21 on the printed circuit board to expose the copper layer; then, soldering the metal enclosure 24 to the bright copper area so that the enclosure 24, the first circuit board 1, and the device unit 21 together enclose a top-opening receiving space; then, filling the gaps in the receiving space with a thermally conductive filler 23; after the thermally conductive filler 23 has cured, the heat dissipation component 22 covers the opening of the receiving space and contacts the enclosure 24, the device unit 21, and the thermally conductive filler 23 through the thermal interface material layer 3.
[0054] In another specific implementation, one of the enclosure component 24 and the printed circuit board is provided with a snap-fit groove, and the other is provided with a protrusion. The protrusion is inserted into the snap-fit groove and snaps into the snap-fit groove, thereby realizing the fixed connection between the enclosure component 24 and the printed circuit board.
[0055] There are various ways to implement the heat dissipation component 22. In some embodiments, the heat dissipation component 22 may include a finned heat sink and / or a liquid-cooled heat sink; that is, the heat dissipation component 22 may include at least one of a finned heat sink (as shown in Figure 6) and a liquid-cooled heat sink (as shown in Figure 7). In other embodiments, the heat dissipation component 22 may include at least one of a heat pipe and a vapor chamber. Other implementations of the heat dissipation component will not be specifically exemplified here.
[0056] For example, the area of the heat dissipation component 22 projected onto the first circuit board 1 is larger than the area enclosed by the orthogonal projection of the enclosure member 24 onto the first circuit board 1. In this solution, the heat dissipation area of the heat dissipation component 22 is larger, which is beneficial to optimizing the heat dissipation effect of the device unit 21.
[0057] It is worth noting that when the first surface a of the first circuit board 1 is provided with device unit 21, heat dissipation component 22, thermally conductive filler 23 and enclosure member 24, and the second surface b of the first circuit board 1 is also provided with device unit 21, heat dissipation component 22, thermally conductive filler 23 and enclosure member 24, the structure of the device unit 21, heat dissipation component 22, thermally conductive filler 23 and enclosure member 24 provided on the first surface a can be the same as or different from the structure of the device unit 21, heat dissipation component 22, thermally conductive filler 23 and enclosure member 24 provided on the second surface b.
[0058] In one specific implementation, the device unit 21, heat dissipation assembly 22, thermally conductive filler 23, and enclosure member 24 disposed on the first surface a are all the structures shown in FIG. 7; the device unit 21, heat dissipation assembly 22, thermally conductive filler 23, and enclosure member 24 disposed on the second surface b are the same as the device unit 21, heat dissipation assembly 22, thermally conductive filler 23, and enclosure member 24 shown in FIG. 7. In another specific implementation, the device unit 21, heat dissipation assembly 22, thermally conductive filler 23, and enclosure member 24 disposed on the first surface a are all the structures shown in FIG. 6; the device unit 21, heat dissipation assembly 22, thermally conductive filler 23, and enclosure member 24 disposed on the second surface b are the same as the device unit 21, heat dissipation assembly 22, thermally conductive filler 23, and enclosure member 24 shown in FIG. 7. Obviously, this is not an exhaustive list. When the first surface a of the first circuit board 1 is provided with device unit 21, heat dissipation component 22, thermally conductive filler 23 and enclosure component 24, and the second surface b of the first circuit board 1 is also provided with device unit 21, heat dissipation component 22, thermally conductive filler 23 and enclosure component 24, other solutions can also be adopted for electronic devices, which will not be listed here.
[0059] It is worth noting that the electronic devices mentioned in this embodiment include, but are not limited to, mobile phones, tablet computers (portable Android devices, Pads), personal computers (PCs), in-vehicle mobile devices, and computing centers.
[0060] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.
Claims
1. An electronic device, characterized in that, The electronic device includes a first circuit board having a first surface and a second surface opposite each other in the thickness direction; the electronic device further includes at least one of the first surface and the second surface disposed thereon. The device unit includes a heat dissipation assembly, a thermally conductive filler, and a enclosure. The device unit is fixed to the first circuit board, and the heat dissipation assembly is disposed on the side of the device unit opposite to the first circuit board. The enclosure is connected between the first circuit board and the heat dissipation component and surrounds the device unit circumferentially. The enclosure, the first circuit board, the heat dissipation component and the device unit form an accommodating space, and the thermally conductive filler fills the accommodating space.
2. The electronic device as claimed in claim 1, characterized in that, The enclosure component is made of a thermally conductive material, and the enclosure component is thermally connected to both the first circuit board and the heat dissipation assembly.
3. The electronic device as described in claim 1 or 2, characterized in that, The enclosure component includes a cylindrical section, the wall thickness of which is equal at any point; one end of the cylindrical section is connected to the first circuit board, and the other end of the cylindrical section is connected to the heat dissipation component.
4. The electronic device as claimed in claim 3, characterized in that, The cylindrical section has an extension at one end facing the heat dissipation assembly, which extends along the arrangement direction of the inner wall and the outer wall of the cylindrical section. The extension is used for thermally conductive connection to the heat dissipation assembly. Along the thickness direction of the first circuit board, the thickness of the extension is less than the thickness of the cylindrical segment.
5. The electronic device as claimed in claim 4, characterized in that, The outer wall of the cylindrical section is provided with the extension portion, which surrounds the cylindrical section circumferentially.
6. The electronic device as claimed in claim 4 or 5, characterized in that, The inner wall of the cylindrical section is provided with the extension, and a filling port is formed between the extension and the device unit, and the filling port is in communication with the receiving space.
7. The electronic device according to any one of claims 1 to 6, characterized in that, The thermally conductive filler includes at least one of thermally conductive adhesive, thermally conductive grease, and thermally conductive gel.
8. The electronic device according to any one of claims 1 to 6, characterized in that, The thermal conductivity of the thermally conductive filler is greater than or equal to 1 W / (m·K).
9. The electronic device according to any one of claims 1 to 8, characterized in that, The device unit includes multiple independent devices, each of which is in thermal contact with the heat dissipation component or with the thermally conductive filler.
10. The electronic device according to any one of claims 1 to 8, characterized in that, The device unit includes a second circuit board and one or more devices, the second circuit board being disposed on the first circuit board, and the one or more devices being disposed on the side of the second circuit board opposite to the first circuit board.
11. The electronic device according to any one of claims 1 to 10, characterized in that, The first circuit board is a printed circuit board, and the device unit is electrically connected to the printed circuit board.
12. The electronic device as claimed in claim 11, characterized in that, The surface of the printed circuit board has an exposed copper layer, and the enclosure is welded to the copper layer.
13. The electronic device according to any one of claims 1 to 12, characterized in that, The area of the heat dissipation component projected onto the first circuit board is larger than the area enclosed by the projected area of the enclosure component projected onto the first circuit board.
14. The electronic device according to any one of claims 1 to 13, characterized in that, The heat dissipation component has a thermal interface material layer on the surface facing the first circuit board, and the device unit, the enclosure and the thermally conductive filler are connected to the heat dissipation component through the thermal interface material layer.