Antenna module, antenna system and communication device

Abstract

The present application relates to the technical field of antennas. Provided in an embodiment are an antenna module, an antenna system and a communication device. The antenna module comprises at least one first antenna, at least one second antenna, a substrate portion and a side plate portion. The side plate portion protrudes from the substrate portion. The at least one second antenna is formed on the side plate portion as part of the side plate portion, and the side plate portion is used for reflecting electromagnetic waves of the first antenna. The second antenna is formed on the side plate portion as part of the side plate portion, such that the number of parts related to antennas is reduced, and the volume and the occupied space are reduced, thereby simplifying the antenna structure.

Description

Antenna modules, antenna systems and communication equipment

[0001] This application claims priority to Chinese patent application filed on December 27, 2024, with application number 202411983091.5 and entitled "Antenna Module, Antenna System and Communication Equipment", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of antenna technology, and in particular to an antenna module, antenna system and communication equipment. Background Technology

[0003] Communication equipment typically requires multiple types of antennas to achieve its communication functions. However, the separate layout of these antennas, along with the need for multiple structural components to support them, results in a large number of parts in the antenna assembly, leading to a large space occupation and cumbersome assembly. Summary of the Invention

[0004] This application provides an antenna module, an antenna system, and a communication device. Through the modular design of the antenna, the space occupied by the antenna can be reduced, and the assembly steps can be simplified.

[0005] In a first aspect, one embodiment of this application provides an antenna module, the antenna module including at least one first antenna, at least one second antenna, a substrate portion and a side plate portion; the side plate portion protrudes from the substrate portion; the at least one second antenna is formed on the side plate portion as part of the side plate portion, and the side plate portion is used to reflect electromagnetic waves from the first antenna.

[0006] The antenna module provided in this application has at least one second antenna formed as part of the side plate portion. That is, the side plate portion is integrally formed with the at least one second antenna in addition to reflecting the electromagnetic waves of the first antenna, thus achieving a modular antenna design. Since there is no need for additional components as radiators for the second antenna, nor for structural components supporting the second antenna, the number of antenna-related parts is reduced, the size and space occupied are decreased, which simplifies the antenna structure, promotes miniaturization of the antenna structure, and reduces the manufacturing cost of the antenna structure.

[0007] Since the second antenna is formed on the side plate, the second antenna on the side plate will not block the side of the first antenna away from the substrate, which helps to avoid or reduce interference between the second antenna and the first antenna, thereby improving the antenna performance of the antenna module.

[0008] Since the second antenna is formed as part of the side panel, it does not need to be assembled separately, simplifying the antenna structure assembly. When assembling the antenna module into the communication equipment, the antenna module can be directly connected to the connecting circuit board, heat sink, etc., reducing the assembly steps of the communication equipment, which helps to shorten the assembly time and thus improve the assembly efficiency of the communication equipment.

[0009] In application, both the first and second antennas need to be connected to the connecting circuit board for power supply. The first and second antennas are typically connected to the connecting circuit board via coaxial cable. Since the second antenna is formed in the side panel, the coaxial cable between the second antenna and the connecting circuit board can be connected in the side panel, which simplifies the coaxial cable wiring and further reduces the assembly steps of the communication equipment.

[0010] According to the first aspect, in one possible implementation, the at least one first antenna, the substrate portion, and the side plate portion are used to jointly constitute a directional antenna, and / or, the at least one second antenna includes an omnidirectional antenna.

[0011] In this possible implementation, the antenna module integrates both a directional antenna and an omnidirectional antenna, which helps to improve the antenna performance of the antenna module.

[0012] According to the first aspect, in one possible implementation, the side plate portion and the base plate portion together form a receiving space; the at least one first antenna is connected to the base plate portion and received in the receiving space.

[0013] In this possible implementation, the first antenna is housed in the housing space, that is, the side plate is arranged around the first antenna, which is beneficial to improve the reflection effect of the side plate on the electromagnetic waves emitted by the first antenna and increase the gain of the first antenna.

[0014] According to the first aspect, in one possible implementation, the substrate portion includes a thermally conductive structure for conducting heat generated by devices connected to the substrate portion.

[0015] In this possible implementation, the heat generated by the device can be conducted to the substrate and side plate through the heat-conducting structure, and the substrate and side plate can dissipate the heat, which helps to improve the heat dissipation capability of the antenna module.

[0016] According to the first aspect, in one possible implementation, the heat-conducting structure is located on the side of the substrate facing away from the first antenna. Since the heat-conducting structure is not located in the area where the first antenna and the second antenna are located, the heat-conducting structure will not affect or interfere with the first antenna and the second antenna.

[0017] According to the first aspect, in one possible implementation, the substrate portion has a connecting portion protruding from the side opposite to the first antenna, the connecting portion being connected to a heat sink.

[0018] In related technologies, there is a conflict between antenna performance and heat sink performance. Prioritizing antenna design will lead to a reduction in the size of the heat sink, which will result in a decrease in the heat sink's heat dissipation capacity. Conversely, prioritizing heat sink design will lead to a reduction in antenna space and a decrease in antenna performance.

[0019] In this possible implementation, the substrate portion includes a heat-conducting structure, and the heat sink can be connected to the substrate portion of the antenna module, so that the heat sink, substrate portion, and side plate portion are connected to form a heat dissipation unit. This increases the heat dissipation area, thereby improving the heat dissipation capacity of the antenna module. In addition, the substrate portion can serve as a support structure for the heat sink, thus eliminating the need for additional support frames or other structural components to support the heat sink.

[0020] According to the first aspect, in one possible implementation, at least one side plate of the side plate portion is further provided with a notch that penetrates the side plate in the thickness direction of the side plate.

[0021] In this possible implementation, the side plate has a notch, which can reduce the obstruction caused by the side plate in the radiation direction of the first antenna, and is beneficial to improving the gain of the first antenna.

[0022] According to the first aspect, in one possible implementation, the notch extends through the end face of the side plate portion away from the substrate portion to further reduce shading of the first antenna.

[0023] According to the first aspect, in one possible implementation, the average radiation intensity of the first antenna at the location of the notch is higher than the average radiation intensity of other areas of the side plate where the notch is located. The location of the notch is conducive to minimizing the obstruction of the first antenna by the side plate and improving the gain of the first antenna.

[0024] According to the first aspect, in one possible implementation, at least one second antenna is formed on the side plate portion between the notch and the substrate portion.

[0025] In this possible implementation, the side plate between the side of the notch closest to the substrate and the substrate can be used to set an omnidirectional antenna. This not only improves the utilization rate of the spare area of ​​the side plate, but also helps to increase the number of antennas in the antenna module, thereby further improving the integration of the antenna module.

[0026] According to the first aspect, in one possible implementation, at least one of the at least two second antennas is disposed in the corner region formed by two adjacent side plates of the side plate portion.

[0027] In this possible implementation, the corner position is located in the direction where the radiation of the first antenna is weakest. This helps to reduce the mutual influence and interference between the first antenna and the second antenna, and improves the antenna performance of the antenna module.

[0028] According to the first aspect, in one possible implementation, the mounting surface of the substrate portion facing away from the first antenna is configured to face the connecting circuit board and be fixedly connected to the connecting circuit board.

[0029] In this possible implementation, the substrate is assembled with the connecting circuit board via a mounting surface to support the connecting circuit board. This eliminates the need for a separate support frame to support the connecting circuit board, thereby reducing the number of parts and simplifying the assembly between the antenna structure and the connecting circuit board.

[0030] According to the first aspect, in one possible implementation, one end of the mounting surface is provided with a connecting groove for fixing the bracket.

[0031] In this possible implementation, since there is no need to set up a separate support frame to support the bracket, it is beneficial to further reduce the number of parts and simplify the assembly between the antenna structure and the bracket.

[0032] Secondly, one embodiment of this application provides an antenna system, which includes at least two antenna modules.

[0033] The antenna system provided in this application includes at least two antenna modules, thereby improving the integration of the antenna.

[0034] According to the second aspect, in one possible implementation, a structural element is sandwiched between at least two of the at least two antenna modules.

[0035] In this possible implementation, the antenna module can be used as a supporting structure for the structural component without the need for a separate supporting frame or the like to support the structural component.

[0036] According to the second aspect, in one possible implementation, the structural component includes at least one of a heat sink and a connecting circuit board.

[0037] In this possible implementation, the heat sink can improve the heat dissipation capacity of the antenna system, and the connecting circuit board is used for power connection with the antenna module.

[0038] According to the second aspect, in one possible implementation, the heat sink and the connecting circuit board are stacked in the thickness direction of the connecting circuit board, which is beneficial to improving the structural compactness of the antenna system, thereby facilitating the miniaturization of the antenna system.

[0039] According to the second aspect, in one possible implementation, at least one of the at least two antenna modules is connected to the heat dissipation device through a thermally conductive structure, and at least another of the at least two antenna modules is connected to the heat sink. The antenna modules can be connected to the heat sink to form a heat dissipation unit, which increases the heat dissipation area and thus helps to improve the heat dissipation capability of the antenna system.

[0040] Thirdly, one embodiment of this application also provides a communication device, including the antenna system provided in the second aspect.

[0041] Fourthly, one embodiment of this application also provides a communication device, which includes the antenna module described in the first aspect.

[0042] Compared to the discrete antenna layout of communication devices in related technologies, the communication device provided in this application, due to its modular antenna module design, significantly reduces the number of antenna-related parts. This helps to reduce the space occupied by the antenna structure, thereby facilitating the miniaturization of communication devices and reducing their manufacturing costs. The reduction in the number of antenna-related parts also simplifies the assembly of the communication device, shortens assembly time, and improves assembly efficiency.

[0043] According to the fourth aspect, in one possible implementation, the communication device further includes a connection circuit board, wherein at least one first antenna of the antenna module is electrically connected to the connection circuit board, and at least one second antenna of the antenna module is electrically connected to the connection circuit board.

[0044] According to the fourth aspect, in one possible implementation, the communication device further includes a heat sink fixedly connected to the substrate portion, the heat sink being located between the connecting circuit board and the substrate portion in the thickness direction of the connecting circuit board.

[0045] In this possible implementation, the antenna module can be connected to the heat sink to form a heat dissipation unit, increasing the heat dissipation area and thus improving the heat dissipation capability of the antenna system.

[0046] According to the fourth aspect, in one possible implementation, the communication device further includes a third antenna, which is fixed to the heat sink.

[0047] In this possible implementation, based on the heat sink's heat dissipation, the heat sink is used to carry or support a third antenna, thereby further improving the antenna performance and antenna integration of the communication equipment.

[0048] According to the fourth aspect, in one possible implementation, the number of antenna modules is at least two, and the connecting circuit board is located between the two antenna modules in the thickness direction of the connecting circuit board.

[0049] In this possible implementation, the dozen or so antenna components that are traditionally laid out separately are modularized. The entire communication device can be assembled by simply installing the antenna modules in the thickness direction of the connecting circuit board, with the connecting circuit board as the center. This simplifies the assembly of the communication device. Attached Figure Description

[0050] Figure 1 is a schematic diagram of an application scenario of a communication device and a communication base station provided in an embodiment of this application;

[0051] Figure 2 is an exploded perspective view of a communication device provided in one embodiment of this application;

[0052] Figure 3 is a further three-dimensional exploded view of the communication device shown in Figure 2;

[0053] Figure 4 is a perspective view of an antenna module provided in one embodiment of this application;

[0054] Figure 5 is a three-dimensional exploded view of the antenna module shown in Figure 3;

[0055] Figure 6A is a partial structural diagram of a communication device provided in an embodiment of this application, with the outer shell, base, and bracket removed;

[0056] Figure 6B is a schematic diagram of the communication device shown in Figure 6A from another perspective;

[0057] Figure 7 is a schematic diagram of a planar directional antenna in related technologies;

[0058] Figure 8 shows the gain curves of a single planar directional antenna for related technologies;

[0059] Figure 9 shows the gain curve of a planar directional antenna placed in a communication device, which is related to the technology.

[0060] Figure 10 shows the 3D radiation patterns of the first directional antenna and the second directional antenna;

[0061] Figure 11 shows the 3D radiation pattern of the third directional antenna;

[0062] Figure 12 shows the horizontal 2D radiation patterns of the first directional antenna, the second directional antenna, and the third directional antenna:

[0063] Figure 13 is a return loss curve of the first omnidirectional antenna and the sixth omnidirectional antenna provided in an embodiment of this application;

[0064] Figure 14 is a return loss curve of the second omnidirectional antenna and the fifth omnidirectional antenna provided in an embodiment of this application;

[0065] Figure 15 shows the return loss curves of the third and fourth omnidirectional antennas provided in one embodiment of this application.

[0066] Figure 16 is a perspective view of a communication device with its outer casing removed according to an embodiment of this application;

[0067] Figure 17 is an exploded perspective view of the connection circuit board, heat sink, first antenna module, and second antenna module provided in one embodiment of this application.

[0068] Figure 18 is a schematic diagram of the stacked arrangement of the second antenna module, heat sink, and connecting circuit board;

[0069] Figure 19 is a three-dimensional schematic diagram of the first antenna module;

[0070] Figure 20 is a schematic diagram of the stacked arrangement of the second antenna module and the connecting circuit board;

[0071] Figure 21 is a perspective view of a heat sink with a third antenna provided in one embodiment of this application.

[0072] Reference numerals: 200, Communication base station; 100, Communication equipment; 10, Housing; 20, Connecting circuit board; 21, First surface; 23, Second surface; 30, Antenna module; 31, First antenna; 33, Reflector; 331, Substrate portion; 3311, Mounting surface; 3312, First mounting boss; 3313, Connecting groove; 3314, Second mounting boss; 3315, Heat dissipation protrusion; 3316, Positioning protrusion; 3317, Thermally conductive layer; 318, Electrical connection plane; 3319, Conductive component; 333, Side plate portion; 3330, Notch; 3331, First side plate; 3332, Second side plate; 333, Third side plate; 3334, Fourth side plate; 334. Hollowed-out structure; 336. Reception space; 303. Second antenna; 337. First omnidirectional antenna; 339. Second omnidirectional antenna; 341. Third omnidirectional antenna; 343. Fourth omnidirectional antenna; 345. Fifth omnidirectional antenna; 347. Sixth omnidirectional antenna; 305. First antenna module; 307. Second antenna module; 40. Heat sink; 50. Fan mount; 60. Bracket; 71. First fixing component; 72. Second fixing component; 73. Third fixing component; 74. Fourth fixing component; 75. Component; 76. Third antenna; 400. Flat panel reflector; 500. Radiation source; 01-08. Coaxial cable; 011-018. Feed port. Detailed Implementation

[0073] For ease of understanding, the relevant technical terms involved in the embodiments of this application will be explained and described below.

[0074] An omnidirectional antenna is one that radiates uniformly in all 360° directions in the horizontal radiation pattern, which is commonly referred to as non-directional. In the vertical radiation pattern, it appears as a beam with a certain width. Generally, the smaller the beam width, the greater the gain.

[0075] A directional antenna is an antenna that emits and receives electromagnetic waves very strongly in one or several specific directions, while emitting and receiving electromagnetic waves in other directions is zero or very weak.

[0076] In microwave remote sensing, polarization is called polarization, which has two types: horizontal polarization and vertical polarization.

[0077] Horizontal polarization refers to the horizontal direction of electromagnetic wave vibration. Polarized waves whose polarization plane is perpendicular to the Earth's normal plane are called horizontally polarized waves. Their electric field direction is parallel to the Earth.

[0078] Vertical polarization refers to the direction of electromagnetic wave vibration being perpendicular to the ground. Polarized waves whose polarization plane is parallel to the Earth's normal plane are called vertical waves. Their electric field direction is perpendicular to the ground. Operating frequency band: Regardless of the type of antenna, it always operates within a certain frequency range (bandwidth). For example, an antenna supporting the B40 band operates within the frequency range of 2300MHz to 2400MHz; in other words, the antenna's operating frequency band includes the B40 band. The frequency range that meets the specifications can be considered the antenna's operating frequency band.

[0079] Parallelism: The parallelism defined in this application is not limited to absolute parallelism. This definition of parallelism can be understood as basic parallelism. It allows for situations where the parallelism is not absolute due to factors such as assembly tolerance, design tolerance, and structural flatness. It also allows for errors within a small angular range, such as within 10 degrees of assembly error. These can all be considered as parallel relationships.

[0080] Perpendicularity: The perpendicularity defined in this application is not limited to an absolute perpendicular intersection (with an included angle of 90 degrees). It is permissible for non-absolute perpendicular intersections caused by factors such as assembly tolerances, design tolerances, and structural flatness. It is permissible for errors within a small angular range, such as an assembly error range of 80 to 100 degrees, which can all be understood as a perpendicular relationship.

[0081] Communication equipment typically requires various types of antennas to achieve its communication functions. However, due to the separate layout of these antennas, multiple structural components are needed to support them. Each antenna usually requires its own bracket, fasteners, etc., resulting in a large number of components in the antenna assembly. This makes the antenna assembly process complex, time-consuming, and inefficient.

[0082] Taking a traditional cylindrical customer premises equipment (CPE) as an example, it includes a main support frame, a directional antenna reflector, a directional antenna radiator, a circuit board, multiple auxiliary supports, and various omnidirectional antennas. The directional antenna reflector and directional antenna radiator are used together to form a directional antenna. The main support frame supports the directional antenna reflector, directional antenna radiator, circuit board, and auxiliary supports. A directional antenna can also be called a high-gain antenna. An omnidirectional antenna can also be called a normal-gain antenna.

[0083] The directional antenna reflector, main support, and circuit board are fixed together. The circuit board is located between the directional antenna reflector and the main support in the thickness direction. Multiple auxiliary supports are fixedly connected to the main support. Various omnidirectional antennas can include bracket antennas, wall-mounted antennas, etc. The auxiliary supports are used to support wall-mounted antennas, etc. Because the corresponding omnidirectional and directional antennas need to be supported by the main and auxiliary supports, and because the assembly of each antenna also requires auxiliary materials, the number of antenna-related parts is large, the structure of the communication equipment is relatively complex, and the size of the communication equipment is increased. Auxiliary materials can include fasteners, adhesive layers, solder, etc.

[0084] In addition, since multiple antennas need to be laid out and assembled separately, this will undoubtedly increase the antenna assembly process, increase the assembly time of communication equipment, and affect the assembly efficiency.

[0085] Furthermore, for an antenna to perform well, it is best to avoid obstructions affecting its radiation direction. However, with the trend towards miniaturization, the space allocated for antenna placement in communication equipment is becoming increasingly limited. This leads to interference between multiple antennas, meaning significant mutual influence among them. For example, in some communication devices, multiple wall-mounted antennas are installed on the side of the directional antenna radiator away from the circuit board. These wall-mounted antennas obstruct the radiation direction of the first antenna, causing a decrease in the performance of the directional antenna.

[0086] All antennas require coaxial cable connections to the circuit board for power feeding. The variety and quantity of antennas, along with main and auxiliary supports, make coaxial cable wiring increasingly complex. As communication standards continue to improve, the number and types of antennas will increase, leading not only to increased interference between antennas and performance degradation, but also to insufficient clearance on the circuit board. Simultaneously, with the improvement of communication standards, the power consumption of communication equipment is constantly increasing, requiring larger heat sinks, further limiting the available space for antennas.

[0087] Based on this, this application provides an antenna module and related antenna system and communication equipment. Through the modular design of the antenna, the number of components in the antenna structure is reduced, the assembly process is reduced, and the assembly efficiency is improved.

[0088] The present application will now be described in more detail with reference to the accompanying drawings.

[0089] Referring to Figure 1, one embodiment of this application provides a communication device 100. The communication device 100 is used to interact with other devices, such as a communication base station 200. The communication device 100 can be a client terminal device. The communication device 100 is used to convert LTE or NR signals received from the communication base station 200 into WiFi signals, which are then emitted by a WiFi antenna for user terminals to access.

[0090] This application does not limit the communication device 100 to a client terminal device. The communication device 100 can also be other types of devices, such as a home gateway, wireless AP, home hotspot, smart speaker, vehicle-mounted device, mobile terminal, base station, etc.

[0091] Referring to Figures 2 and 3, the communication device 100 includes an antenna module 30. The antenna module 30 is used to radiate and receive electromagnetic waves. The communication device 100 may also include a housing 10, a connecting circuit board 20, a heat sink 40, a fan mount 50, and a bracket 60. The housing 10 may be cylindrical or other shapes, such as a square box or a circular box. In this embodiment, the cylindrical housing 10 may be made of an unshielded material, such as plastic. The housing 10 may have multiple through holes, which facilitate signal radiation from the antenna inside the communication device 100 and ventilation and heat dissipation inside the communication device 100.

[0092] The connecting circuit board 20, antenna module 30, heat sink 40, fan mount 50, and bracket 60 are all housed within the outer casing 10. The antenna module 30 is fixed to and electrically connected to the connecting circuit board 20. There are two antenna modules 30. The two antenna modules 30 are located on opposite sides of the connecting circuit board 20 along its thickness direction. The first antenna module 30 is located on the first side of the connecting circuit board 20, and the heat sink 40 is located between the first antenna module 30 and the connecting circuit board 20 for heat dissipation. The fan mount 50 and the second antenna module 30 are located on the second side of the connecting circuit board 20 and fixed to each other; the fan mount 50 is used to mount a fan for air cooling. The bracket 60 is fixed to at least one antenna module 30, and the connecting circuit board 20 is located between the fan mount 50 and the bracket 60. The bracket 60 can be used to mount a WiFi antenna and / or other types of antennas. It is understood that this application does not limit the number of antenna modules 30; the number of antenna modules 30 can be one or more.

[0093] The antenna module 30 is formed by modularizing the multiple antenna-related parts or components that are traditionally laid out separately. During assembly, the antenna module 30, heat sink 40, fan mount 50 and bracket 60 can be installed on both sides of the thickness direction of the connecting circuit board 20 as the center, and the assembly of the entire communication device 100 can be completed. Since there is no need to assemble multiple antennas separately, the assembly of the communication device 100 is convenient.

[0094] This application does not limit the structure of the communication device 100. For example, the communication device 100 may omit the housing 10, heat sink 40, fan base 50 and bracket 60.

[0095] In some embodiments, this application also provides a communication device 100, including an antenna system. The antenna system includes at least two antenna modules 30. A structural member is sandwiched between at least two of the at least two antenna modules 30. The antenna modules 30 can be used as support structures for the structural member without the need for a separate support frame or the like to support the structural member.

[0096] In some embodiments, the structural components include at least one of a heat sink 40 and a connecting circuit board 20. The heat sink 40 improves the heat dissipation capability of the antenna system, and the connecting circuit board 20 is used for power feeding connection to the antenna module 30.

[0097] In some implementations, the heat sink 40 and the connecting circuit board 20 are stacked in the thickness direction of the connecting circuit board 20, which helps to improve the structural compactness of the antenna system and thus facilitates the miniaturization of the antenna system.

[0098] In some embodiments, at least one of the at least two antenna modules 30 is connected to the heat dissipation device via a heat-conducting structure, and at least another of the at least two antenna modules 30 is connected to a heat sink 40.

[0099] Referring to Figures 4 and 5, the antenna module 30 includes at least one first antenna 31, at least one second antenna 303, a substrate portion 331, and a side plate portion 333. The side plate portion 333 protrudes from the substrate portion 331. At least one second antenna 303 is formed as part of the side plate portion 333, which is used to reflect electromagnetic waves from the first antenna 31.

[0100] The antenna module 30 provided in this application has at least one second antenna 303 formed as part of a side plate 333. That is, the side plate is integrally formed with at least one second antenna 303 in addition to reflecting the electromagnetic waves of the first antenna 31, thus achieving a modular antenna design. Since there is no need to set up additional components as radiators for the second antenna 303, nor is it necessary to set up structural components to support the second antenna 303, the number of antenna-related parts is reduced, the size and space occupied are decreased, which is beneficial for simplifying the antenna structure, promoting the miniaturization of the antenna structure, and reducing the manufacturing cost of the antenna structure.

[0101] Since the second antenna 303 is formed on the side plate portion 333, the second antenna 303 on the side plate portion 333 will not cause any obstruction to the side of the first antenna 31 away from the substrate portion 331, which is beneficial to avoid or reduce interference between the second antenna 303 and the first antenna 31, thereby improving the antenna performance of the antenna module 30.

[0102] Since the second antenna 303 is formed as part of the side plate 333, it does not need to be assembled separately, simplifying the antenna structure assembly. When assembling the antenna module 30 into the communication device 100, the antenna module 30 can be directly connected to the connecting circuit board 20, heat sink 40, etc., reducing the assembly steps of the communication device 100, which helps to shorten the assembly time of the communication device 100 and thus improve the assembly efficiency of the communication device 100.

[0103] In application, both the first antenna 31 and the second antenna 303 need to be connected to the connecting circuit board 20 for power supply. The first antenna 31, the second antenna 303, and the connecting circuit board 20 are typically connected via coaxial cable. Since the second antenna 303 is formed in the side plate portion 333, the coaxial cable between the second antenna 303 and the connecting circuit board 20 can be connected in the side plate portion 333, which helps to simplify the coaxial cable wiring, thereby further reducing the assembly steps of the communication device 100.

[0104] The substrate portion 331 and the side plate portion 333 are used to form the reflector 33. The first antenna 31, the substrate portion 331, and the side plate portion 333 are used together to form a directional antenna. At least one second antenna 303 includes an omnidirectional antenna.

[0105] The second antenna 303, along with the first antenna 31, can also be used to receive electromagnetic waves. The reflector 33 is used to direct electromagnetic waves emitted from the first antenna 31 to one or more specific directions for transmission, or to direct electromagnetic waves from one or more specific directions to the first antenna 31 for reception. The second antenna 303 is formed on the reflector 33. At least a portion of the reflector 33 serves as a radiator for the second antenna 303. The reflector 33 is also used for fixed connection to the connecting circuit board 20, fan mount 50, and bracket 60.

[0106] In some embodiments of this application, the second antenna 303 and the directional antenna can be cellular antennas. This application does not limit the type of the second antenna 303 and the directional antenna; the second antenna 303 and the directional antenna can also be WiFi antennas, etc.

[0107] In some embodiments of this application, the side plate portion 333 and the base plate portion 331 together form a receiving space 336 for receiving the first antenna 31. The receiving space 336 is a non-enclosed space, and the side plate portion 333 and the base plate portion 331 form an opening that communicates with the receiving space 336. The opening is disposed opposite to the base plate portion 331. Along the circumferential direction of the side plate portion 333, the side plate portion 333 can be a discontinuous structure. For example, the side plate portion 333 can include at least two side plates, two adjacent side plates are not physically connected in the circumferential direction of the side plate portion 333, and there is a hollow structure between the two adjacent side plates. The hollow structure between the two adjacent side plates can penetrate through the two end faces of the side plate portion 333 in the thickness direction of the base plate portion 331.

[0108] The substrate portion 331 is generally flat. The substrate portion 331 is generally parallel to the connecting circuit board 20. The substrate portion 331 is used to mount the first antenna 31. The side plate portion 333 is used to mount the second antenna 303. The overlap area between the orthographic projection of the side plate portion 333 onto the substrate portion 331 and the orthographic projection of the first antenna 31 onto the substrate portion 331 is zero. This ensures that the side plate portion 333 and the second antenna 303 on the side plate portion 333 do not obstruct the side of the first antenna 31 facing away from the substrate portion 331, which helps to avoid or reduce interference between the second antenna 303 and the directional antenna, and improves the gain of the directional antenna. In some embodiments, the side plate portion 333 may be omitted, and the second antenna 303 is formed on the substrate portion 331.

[0109] In some embodiments of this application, the side plate portion 333 includes at least one side plate, and the at least one side plate has a notch 3330 that penetrates the side plate in the thickness direction. The notch penetrates the end face of the side plate away from the substrate portion 331. The notch 3330 in the side plate portion 333 reduces the obstruction caused by the side plate portion 333 in the radiation direction of the first antenna 31 toward the side plate portion 333, which is beneficial to improving the gain of the first antenna 31.

[0110] The side plate portion 333 between the side of the notch 3330 closest to the substrate portion 331 and the substrate portion 331 can be used to house the second antenna 303. This improves the utilization rate of the unused area of ​​the side plate portion 333 and also helps to increase the number of antennas in the antenna module 30, thereby further improving the integration of the antenna module 30. It is understood that the notch 3330 can also extend from the side plate portion 333 to the substrate portion 331, or the notch 3330 can be omitted.

[0111] The average radiation intensity of the first antenna 31 at the notch 3330 is higher than the average radiation intensity of other areas of the side plate where the notch 3330 is located. The location of the notch 3330 is conducive to minimizing the obstruction of the first antenna 31 by the side plate 333 and improving the gain of the first antenna 31.

[0112] The region of strongest radiation intensity of the first antenna 31 is typically located at the midline of its longest edge in either the length or width direction. In some embodiments of this application, the notch 3330 is disposed towards the first antenna 31, and the midline of the longest edge of the first antenna 31 in either the length or width direction can pass through the corresponding notch 3330. This reduces the obstruction of radiation from the side plate portion 333 to the region of strongest radiation of the first antenna 31, thereby improving the gain of the directional antenna. It is understood that this application does not limit the position or number of notches 3330 in the side plate portion 333, nor does it limit the shape of the notches 3330.

[0113] At least one of the second antennas 303 is disposed in the corner area formed by two adjacent side plates of the side plate portion 333. The corner position is located in the direction where the radiation of the first antenna 31 is weakest. This helps to reduce the mutual influence and interference between the first antenna 31 and the second antenna 303, and helps to improve the antenna performance of the antenna module 30.

[0114] In some embodiments of this application, the substrate portion 331 is generally square, and at least one side plate of the side plate portion 333 includes a first side plate 3331, a second side plate 3332, a third side plate 3333, and a fourth side plate 3334. The first side plate 3331 and the third side plate 3333 are disposed opposite each other. The second side plate 3332 and the fourth side plate 3334 are disposed opposite each other. The second side plate 3332 is adjacent to and connected to the first side plate 3331. The second side plate 3332 is adjacent to and connected to the third side plate 3333. The fourth side plate 3334 is adjacent to and connected to the third side plate 3333. The second side plate 3332 is connected between the first side plate 3331 and the third side plate 3333. The fourth side plate 3334 is connected between the first side plate 3331 and the third side plate 3333. This application does not limit the shape of the substrate portion 331; the substrate portion 331 may also be a regular or irregular shape, such as a circle. This application does not limit the number, shape, or structure of the side plates.

[0115] The first side plate 3331, the second side plate 3332, the third side plate 3333, and the fourth side plate 3334 all have notches 3330. The first side plate 3331 and the third side plate 3333 extend along the width direction of the first antenna 31. The second side plate 3332 and the fourth side plate 3334 extend along the length direction of the first antenna 31. The centerline of the longest edge of the first antenna 31 in the width direction passes through the notches 3330 of the first side plate 3331 and the third side plate 3333. The centerline of the longest edge of the first antenna 31 in the length direction passes through the notches 3330 of the second side plate 3332 and the fourth side plate 3334.

[0116] The first antenna 31 may include a printed circuit board. The printed circuit board may arrange related circuits, antenna elements, etc., to form a directional antenna together with the reflector 33. The first antenna 31 is electrically connected to the connecting circuit board 20. In some embodiments of this application, the number of directional antennas is three, including a first directional antenna, a second directional antenna, and a third directional antenna. The first directional antenna, the second directional antenna, and the third directional antenna share the first antenna 31 and the reflector 33. The radiation directions of the first directional antenna and the second directional antenna are parallel to the thickness direction of the connecting circuit board 20. The radiation direction of the third directional antenna is perpendicular to the thickness direction of the connecting circuit board 20. It is understood that this application does not limit the number of directional antennas; the number of directional antennas can be at least one, and this application does not limit the radiation direction of the directional antennas.

[0117] The wiring configuration of the second antenna 303 can be defined by the hollow structure 334 formed in the side plate portion 333. In some embodiments of this application, the number of second antennas 303 is six, and the six second antennas 303 may include a first omnidirectional antenna 337, a second omnidirectional antenna 339, a third omnidirectional antenna 341, a fourth omnidirectional antenna 343, a fifth omnidirectional antenna 345, and a sixth omnidirectional antenna 347. The first omnidirectional antenna 337, the second omnidirectional antenna 339, the third omnidirectional antenna 341, the fourth omnidirectional antenna 343, the fifth omnidirectional antenna 345, and the sixth omnidirectional antenna 347 are all fed to the connecting circuit board 20 via coaxial lines. The wiring configuration of the first omnidirectional antenna 337, the second omnidirectional antenna 339, the third omnidirectional antenna 341, the fourth omnidirectional antenna 343, the fifth omnidirectional antenna 345, and the sixth omnidirectional antenna 347 is formed by forming multiple hollow structures 334 in the reflector 33. The first omnidirectional antenna 337, the second omnidirectional antenna 339, the third omnidirectional antenna 341, the fourth omnidirectional antenna 343, the fifth omnidirectional antenna 345, and the sixth omnidirectional antenna 347 share the side plate portion 333 of the reflector 33 as a radiator. This application does not limit the number of second antennas 303 formed on the reflector 33; for example, the reflector 33 may form at least one second antenna 303.

[0118] In some embodiments of this application, a first omnidirectional antenna 337 extends from a first side plate 3331 to a second side plate 3332, that is, the first omnidirectional antenna 337 is disposed at the corner formed by the first side plate 3331 and the second side plate 3332. A second omnidirectional antenna 339 is formed on the second side plate 3332. A third omnidirectional antenna 341 extends from the second side plate 3332 to a third side plate 3333, that is, the third omnidirectional antenna 341 is disposed at the corner formed by the third side plate 3333 and the second side plate 3332. A fourth omnidirectional antenna 343 extends from the third side plate 3333 to a fourth side plate 3334, that is, the fourth omnidirectional antenna 343 is disposed at the corner formed by the third side plate 3333 and the fourth side plate 3334. A fifth omnidirectional antenna 345 is formed on the fourth side plate 3334. The sixth omnidirectional antenna 347 extends from the fourth side plate 3334 to the first side plate 3331, that is, the sixth omnidirectional antenna 347 is located at the corner formed by the fourth side plate 3334 and the first side plate 3331.

[0119] The first omnidirectional antenna 337 is located at the corner formed by the first side plate 3331 and the second side plate 3332, the third omnidirectional antenna 341 is located at the corner formed by the third side plate 3333 and the second side plate 3332, the fourth omnidirectional antenna 343 is located at the corner formed by the third side plate 3333 and the fourth side plate 3334, and the sixth omnidirectional antenna 347 is located at the corner formed by the fourth side plate 3334 and the first side plate 3331. The corner position is located in the direction where the radiation of the first antenna 31 is weakest. This helps to reduce the mutual influence and interference between the second antenna 303 of the reflector 33 and the directional antenna, and helps to improve the antenna performance of the antenna module 30.

[0120] In some embodiments of this application, the second omnidirectional antenna 339 is located between the notch 3330 of the second side plate 3332 and the substrate portion 331, and the fifth omnidirectional antenna 345 is located between the notch 3330 of the fourth side plate 3334 and the substrate portion 331. In this way, the spare side plate portions 333 between the notch 3330 of the second side plate 3332 and the substrate portion 331, and between the notch 3330 of the fourth side plate 3334 and the substrate portion 331, can be fully utilized, which is beneficial to increasing the number of antennas in the antenna module 30 and further improving the integration level of the antenna module 30.

[0121] In some embodiments of this application, the first omnidirectional antenna 337 and the sixth omnidirectional antenna 347 can be low-band (LB) antennas; the second omnidirectional antenna 339 and the fifth omnidirectional antenna 345 are mid-high band (MHB) antennas; and the third omnidirectional antenna 341 and the fourth omnidirectional antenna 343 can be high-frequency antennas. This application does not limit the position of the second antenna 303 on the reflector 33. This application does not limit the structure, shape, or size of the second antenna 303, nor does it limit the type or operating frequency band of the second antenna 303.

[0122] Please refer to Figure 6A. Coaxial cable 01 connects the first omnidirectional antenna 337 and the connecting circuit board 20. The connection point between coaxial cable 01 and the first omnidirectional antenna 337 is the feed port 011. Coaxial cable 02 connects the second omnidirectional antenna 339 and the connecting circuit board 20. The connection point between coaxial cable 02 and the second omnidirectional antenna 339 is the feed port 012. Coaxial cable 03 connects the third omnidirectional antenna 341 and the connecting circuit board 20. The connection point between coaxial cable 01 and the third omnidirectional antenna 341 is the feed port 013. Coaxial cable 04 connects the fourth omnidirectional antenna 343 and the connecting circuit board 20. The connection point between coaxial cable 04 and the fourth omnidirectional antenna 343 is the feed port 014. Please refer to Figure 6B. Coaxial cable 05 connects the fifth omnidirectional antenna 345 and the connecting circuit board 20. The connection point between coaxial cable 05 and the fifth omnidirectional antenna 345 is the feed port 015. Coaxial cable 06 is connected between the sixth omnidirectional antenna 347 and the connecting circuit board 20. The connection point between coaxial cable 06 and the sixth omnidirectional antenna 347 is the feed port 016. Referring again to Figure 6A, coaxial cables 07 and 08 are both connected between the first antenna 31 and the connecting circuit board 20. The connection point between coaxial cable 07 and the first antenna 31 is the feed port 017. The connection point between coaxial cable 08 and the first antenna 31 is the feed port 018. Coaxial cable 07 is used to realize the feed connection between the first directional antenna and the connecting circuit board 20, and coaxial cable 08 is used to realize the feed connection between the second directional antenna and the connecting circuit board 20. The third directional antenna can also be fed to the connecting circuit board 20 via coaxial cables, but is not shown in Figure 6A. In this embodiment, the coaxial cables are fed to the corresponding antennas by welding. Feed ports 011 to 016 can all be located on the outer wall of the side plate 333 to facilitate feed connection operations, for example, by welding.

[0123] Since the first omnidirectional antenna 337 to the sixth omnidirectional antenna 347 are all formed on the side plate portion 333 of the reflector 33, the feed ports 011 to 016 can all be located on the outer wall of the side plate portion 333. When making feed connections, the coaxial cables 01 to 06 can be arranged along the outer wall of the side plate portion 333, which is beneficial for simplifying wiring. It is understood that each feed port can also be located on the inner wall of the side plate portion 333.

[0124] The reflector 33 can be a metal reflector 33, meaning the reflector 33 is made of metal. The reflector 33 can be formed using sheet metal processing, cutting processes, etc. For example, in some possible implementations, a metal plate is bent using sheet metal processing to form a substrate portion 331 and a side plate portion 333. Through cutting processes, various perforated structures 334 are formed in the side plate portion 333, thereby forming a wiring configuration for multiple omnidirectional antennas. This application does not limit the reflector 33 to a metal reflector 33; the reflector 33 can also be made of other materials, for example, it can be made using a printed circuit board, or, in some possible implementations, the reflector 33 includes a substrate and a metal layer covering the surface of the substrate.

[0125] Referring to Figure 7, in related communication equipment, there are planar directional antennas and related omnidirectional antennas. Planar directional antennas typically use planar reflectors, with the radiation source 500 of the planar directional antenna positioned on the planar reflector 400. Using a directional binary array with a director, a standalone related directional antenna, not placed within the related communication equipment, can achieve a peak gain of 13.4 dBi, as shown by lines A1 and A2 in Figure 8. However, when placed within a stacked system—that is, after the individual planar directional antenna has been debugged and is placed within the related communication equipment—the peak gain of the planar directional antenna generally deteriorates by about 1 dB due to the obstruction and mutual coupling effects of other related omnidirectional antennas, resulting in a peak gain of approximately 12.4 dBi.

[0126] To eliminate the negative impact of omnidirectional antennas on the gain of directional antennas in related technologies, the antenna module 30 provided in this application designs an irregularly shaped reflector 33 that is most conducive to the radiation of the directional antenna. Since the reflector 33 of the directional antenna is also routed as the radiator of the omnidirectional antenna, the second antenna 303 can avoid obstruction and mutual coupling of the directional antenna. As a result, the peak gain of the directional antenna of this application will not only not decrease but will increase to 14dBi, as shown by B1 and B2 in Figure 9. In Figure 9, curve B1 represents the gain of the first directional antenna, curve B2 represents the gain of the second directional antenna, and curve B3 represents the gain of the third directional antenna.

[0127] After the second antenna 303 and the directional antennas adopt a modular design, in some possible implementations, the normal peak gain of the three directional antennas can reach 14 dBi, and the lateral peak gain of the three directional antennas can reach 8 dBi. Figure 10 shows the 3D radiation pattern of the first and second directional antennas, and Figure 11 shows the 3D radiation pattern of the third directional antenna. Figure 12 shows the horizontal 2D radiation pattern of the first, second, and third directional antennas. The minimum horizontal gain of the directional antennas meets 5 dBi. Obviously, the modular design of the antennas is beneficial to improving the omnidirectional high gain of the directional antennas. Normal peak gain: refers to the peak gain in the direction where the radiation direction is perpendicular to the connecting circuit board 20 and in the horizontal plane; Lateral peak gain: refers to the peak gain in the direction where the radiation direction is parallel to the connecting circuit board 20 and in the horizontal plane.

[0128] Figure 13 is a return loss curve of the first omnidirectional antenna 337 and the sixth omnidirectional antenna 347 provided in one embodiment of this application; Figure 14 is a return loss curve of the second omnidirectional antenna 339 and the fifth omnidirectional antenna 345 provided in one embodiment of this application; Figure 15 is a return loss curve of the third omnidirectional antenna 341 and the fourth omnidirectional antenna 343 provided in one embodiment of this application. The first omnidirectional antenna 337 to the sixth omnidirectional antenna 347 reuse the reflector 33 of the directional antenna for wiring design, and the first omnidirectional antenna 337 to the sixth omnidirectional antenna 347 can meet the frequency band coverage requirements of the product.

[0129] In related technologies, circuit boards, heat sinks, etc., require additional support frames for support and assembly, resulting in a large number of parts in the communication equipment 100, complicated assembly steps, and increased overall cost.

[0130] Referring to Figures 16 and 17, in some embodiments of this application, two antenna modules 30 include a first antenna module 305 and a second antenna module 307, with a connecting circuit board 20 located between the first antenna module 305 and the second antenna module 307. The connecting circuit board 20 includes a first surface 21 and a second surface 23. The first surface 21 and the second surface 23 are disposed opposite each other in the thickness direction of the connecting circuit board 20. The first surface 21 faces the first antenna module 305 and is used for fixed connection with the reflector 33 of the first antenna module 305. The second surface 23 faces the second antenna module 307. The reflector 33 of the second antenna module 307 is used for fixed connection with the second surface 23. A heat sink 40 is located between the connecting circuit board 20 and the reflector 33 of the second antenna module 307. The reflector 33 also supports the connecting circuit board 20 and the heat sink 40, eliminating the need for a separate support frame to support the circuit board and the heat sink 40, thereby reducing the number of parts in the communication device 100 and facilitating miniaturization of the communication device 100.

[0131] The reflector 33 and the connecting circuit board 20 are stacked along the thickness direction of the connecting circuit board 20. The side of the reflector 33 facing the connecting circuit board 20 includes a mounting surface 3311, that is, the side of the substrate portion 331 away from the first antenna 31 includes a mounting surface 3311.

[0132] In related technologies, there is a conflict between antenna performance and heat sink performance. Prioritizing antenna design will lead to a reduction in the size of the heat sink, which will result in a decrease in the heat sink's heat dissipation capacity. Conversely, prioritizing heat sink design will lead to a reduction in antenna space and a decrease in antenna performance.

[0133] In some embodiments of this application, the substrate portion 331 includes a heat-conducting structure for conducting heat generated by devices connected to the substrate portion 331. Through the heat-conducting structure, heat generated by the devices can be conducted to the substrate portion 331 and the side plate portion 333, which can then dissipate the heat, thereby improving the heat dissipation capability of the antenna module.

[0134] In some embodiments of this application, the heat-conducting structure is located on the side of the substrate portion 331 facing away from the first antenna 31. Since the heat-conducting structure is not located in the area where the first antenna 31 and the second antenna 303 are located, the heat-conducting structure will not affect or interfere with the first antenna 31 and the second antenna 303.

[0135] In some embodiments of this application, the heat-conducting structure includes metal and / or other heat-conducting materials with high thermal conductivity. Referring to Figure 18, the heat sink 40 is located between the mounting surface 3311 of the connecting circuit board 20 and the second antenna module 307. The heat sink 40 is in contact with the mounting surface 3311 of the second antenna module 307, and the heat sink 40 is connected to the reflector 33 of the second antenna module 307 to form a heat dissipation unit. This increases the heat dissipation area of ​​the communication device 100, thereby improving the heat dissipation efficiency and heat dissipation capacity of the communication device 100. In the thickness direction of the connecting circuit board 20, since the heat sink 40 is sandwiched between the reflector 33 of the second antenna module 307 and the connecting circuit board 20, the reflector 33 is closer to the outside of the communication device 100 than the heat sink 40. The heat from the heat sink 40 can be conducted to the substrate portion 331 and the side plate portion 333, that is, the heat can be conducted to the reflector 33, and then dissipated from the reflector 33 to the outside of the communication device 100 through the outer shell 10 located at the far end of the heat sink 40. This is beneficial to increase the radiative heat transfer capability of the communication device 100 and to resolve the performance conflict between the antenna and the heat sink.

[0136] The communication device 100 also includes a device 75 (as shown in Figure 19) disposed on the connecting circuit board 20. The device 75 is located on the first surface 21. The device 75 generates heat during operation. The heat-conducting structure may further include a heat-conducting layer 3317, located between the device 75 and the mounting surface 3311 of the first antenna module 305. The device 75 contacts the mounting surface 3311 of the first antenna module 305 through the heat-conducting layer 3317. The reflector 33 is made of metal. Both the metal material and the heat-conducting layer 3317 have good thermal conductivity. The reflector 33 serves as both a reflector for the directional antenna and a heat sink to dissipate heat from the device 75 on the connecting circuit board 20. The heat generated by the device 75 can be conducted to the reflector 33 via the heat-conducting layer 3317, and then dissipated by the reflector 33.

[0137] Air has a large thermal resistance. If gaps are generated at the contact interface between the thermally conductive layer 3317 and the device 75, or between the thermally conductive layer 3317 and the reflector 33, the heat transfer efficiency will be affected.

[0138] Referring to Figures 19 and 20, the thermally conductive structure also includes a protruding heat dissipation bump 3315. In other words, the mounting surface 3311 has a heat dissipation bump 3315 protruding in a direction away from the first antenna 31. The thermally conductive layer 3317 is located between the heat dissipation bump 3315 and the device 75 in the thickness direction of the connecting circuit board 20. The heat dissipation bump 3315 is used to fit against the device 75 on the circuit board. The heat dissipation bump 3315 can improve the tightness between the thermally conductive layer 3317 and the device 75, which helps to reduce the gaps at the contact interface between the thermally conductive layer 3317 and the device 75, and between the thermally conductive layer 3317 and the mounting surface 3311 of the first antenna module 305, thus improving heat transfer efficiency and consequently improving the heat dissipation efficiency of the communication device 100. The material of the thermally conductive layer 3317 can be, but is not limited to, thermally conductive silicone or the like. Since the substrate portion 333 includes a heat-conducting structure, the reflector 33 can be used as a heat sink. The heat generated by the device 75 is conducted through the heat-conducting layer 3317 to the heat dissipation protrusion 3315 of the reflector 33, and the reflector 30 dissipates the heat.

[0139] The structure on the mounting surface 3311 of the first antenna module 305 may differ from the structure on the mounting surface 3311 of the second antenna module 307. In some embodiments of this application, referring to Figures 17 and 19, the mounting surface 3311 of the first antenna module 305 further includes a first mounting boss 3312 protruding towards the connecting circuit board 20. The first mounting boss 3312 is used for fixed connection with the connecting circuit board 20. The communication device 100 also includes a first fixing member 71, which passes through the base plate portion 331 of the second antenna module 307, the connecting circuit board 20, and the first mounting boss 3312, thereby fixing the first antenna module 305, the connecting circuit board 20, and the second antenna module 307 together. Because the first mounting boss 3312 has a certain height, it increases the contact area between the reflector 33 of the first antenna module 305 and the first fixing member 71, which is beneficial for strengthening the connection strength and stability between the circuit board and the reflector 33. It is understood that the first fixing member 71 may not be installed through the substrate portion 331 of the second antenna module 307, but may be directly installed through the first mounting boss 3312 connecting the circuit board 20 and the first antenna module 305.

[0140] The mounting surface 3311 of the first antenna module 305 is further provided with a second mounting boss 3314 protruding towards the connecting circuit board 20 for fixed connection with the fan mount 50. The communication device 100 also includes a second fixing member 72, which passes through the fan mount 50 and the second mounting boss 3314. Because the second mounting boss 3314 has a certain height, it helps to increase the contact area between the reflector 33 of the first antenna module and the second fixing member 72, thereby strengthening the connection strength and stability between the fan mount 50 and the reflector 33 of the first antenna module 305. The second fixing member 72 can be a bolt, etc. This application does not limit the connection method between the fan mount 50 and the mounting surface 3311 of the first antenna module 305; for example, it can also be welding, snap-fit, etc.

[0141] The mounting surface 3311 of the first antenna module 305 is further recessed with a connecting groove 3313 for fixed connection with the bracket 60. A portion of the bracket 60 can be accommodated within the connecting groove 3313. The communication device 100 also includes a third fixing member 73, which passes through the bracket 60 and the connecting groove 3313. The connecting groove 3313 penetrates the end face of the reflector 33 of the first antenna module 305 facing the bracket 60, and guides the bracket 60 into or out of the connecting groove 3313. When the bracket 60 and the reflector 33 of the first antenna module 305 are assembled together, the connecting groove 3313 can position the bracket 60, which helps improve the assembly efficiency of the communication device 100.

[0142] In this embodiment, the mounting surface 3311 is further provided with a connecting portion. The connecting portion includes a fourth fixing member 74 disposed on the mounting surface 3311, and the fourth fixing member 74 is fixedly connected to the heat sink 40. The fourth fixing member 74 can be a bolt, etc. This application does not limit the connection method between the heat sink 40 and the mounting surface 3311 of the first antenna module 305. For example, it can also be welding, snap-fit, etc. During assembly, the first antenna module 305, the connecting circuit board 20, the heat sink 40, etc. can be assembled into a first whole firstly, and then the reflector 33 of the second antenna module 307 can be fixedly connected to the heat sink 40. This is beneficial to improving the assembly efficiency of the communication equipment 100. This application does not limit the connection method between the heat sink 40, the first antenna module 305, the second antenna module 307, and the connecting circuit board 20. As long as the heat sink 40, the first antenna module 305, the second antenna module 307, and the connecting circuit board 20 can be connected together.

[0143] The base material of the reflector 33 can be a metal sheet. Fastening features, such as a first mounting boss 3312, a second mounting boss 3314, and fastening holes, can be constructed in the non-antenna wiring core area through structural design and machining, enabling the reflector 33 to serve as a support frame for the communication device 100. Then, the circuit board 20, heat sink 40, etc., are fixed and assembled using snap-fit ​​and screw connections. Simultaneously, the metal structure of the reflector 33 increases the rigidity of the communication device 100, providing reliable protection for the communication device 100.

[0144] In this embodiment, the connecting part further includes a positioning protrusion 3316, which is used to pass through the heat sink 40 to position the heat sink 40 when the first antenna module 305 and the heat sink 40 are assembled together, which helps to improve the assembly accuracy and assembly efficiency of the communication equipment 100.

[0145] When the antenna receives electromagnetic wave signals, a current is generated. If there is no grounding, this current may generate noise signals between the antenna and ground or between the antenna and conductive components, interfering with signal transmission and reception. Referring again to Figure 19, the reflector 33 includes an electrical connection plane 3318, which is used to electrically connect to the conductive component 3319 for grounding or shielding. Grounding provides a current loop for the antenna module, ensuring smooth current flow and thus reducing noise interference. The electrical connection plane 3318 can be disposed on the mounting surface 3311 or on the side plate portion 333 of the reflector 33. The conductive component 3319 may include conductive foam, conductive cloth, or other types of electrical connectors. In some embodiments of this application, the electrical connection plane 3318 may be constructed using sheet metal processes, but is not limited to this method.

[0146] In some embodiments, the structure on the mounting surface 3311 of the first antenna module 305 may be the same as the structure on the mounting surface 3311 of the second antenna module 307.

[0147] In some embodiments, referring to Figure 21, the communication device 100 further includes a third antenna 76, which is fixed to the heat sink 40. Based on the heat dissipation provided by the heat sink 40, the third antenna 76 is carried or supported by the heat sink 40 to further improve the antenna performance and antenna integration of the communication device 100. The third antenna 76 is located within the cavity of the heat sink 40, occupying the internal space of the heat sink 40 without occupying the external space, which is beneficial for further miniaturization of the communication device 100. There are two third antennas 76, which can be used for cellular functions or for WiFi functions. It is understood that this application does not limit the number of third antennas 76; there can be at least one third antenna 76.

[0148] It should be understood that expressions such as “comprising” and “may include” used in this application indicate the existence of the disclosed functions, operations, or constituent elements, and do not limit one or more additional functions, operations, and constituent elements. In this application, terms such as “comprising” and / or “having” are to be interpreted as indicating a particular characteristic, number, operation, constituent element, component, or combination thereof, but not to exclude the existence or possibility of adding one or more other characteristics, numbers, operations, constituent elements, components, or combinations thereof.

[0149] Furthermore, in this application, the expression "and / or" includes any and all combinations of the associated listed words. For example, the expression "A and / or B" may include A, may include B, or may include both A and B.

[0150] In this application, expressions including ordinal numbers such as "first" and "second" may modify the elements. However, such elements are not limited by the foregoing expressions. For example, the foregoing expressions do not limit the order and / or importance of the elements. The foregoing expressions are only used to distinguish one element from other elements. For example, "first user equipment" and "second user equipment" refer to different user equipment, although both "first user equipment" and "second user equipment" are user equipment. Similarly, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0151] When a component is referred to as "connected" or "accessed" to other components, it should be understood that this component not only connects directly to or accesses other components, but also that another component may exist between this component and other components. On the other hand, when a component is referred to as "directly connected" or "directly accessed" to other components, it should be understood that no component exists between them.

[0152] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An antenna module, characterized by The antenna module includes at least one first antenna, at least one second antenna, a base plate portion, and a side plate portion; The side plate portion protrudes from the base plate portion; The at least one second antenna is formed as part of the side plate portion, which is used to reflect the electromagnetic waves of the first antenna.

2. The antenna module of claim 1, wherein, The at least one first antenna, the substrate portion, and the side plate portion are used together to form a directional antenna, and / or, the at least one second antenna includes an omnidirectional antenna.

3. The antenna module according to claim 1 or 2, characterized in that, The side plate portion and the base plate portion together form a receiving space; the at least one first antenna is connected to the base plate portion and received in the receiving space.

4. The antenna module according to any of claims 1-3, characterized by The substrate includes a thermally conductive structure for conducting heat generated by devices connected to the substrate.

5. The antenna module of claim 4, wherein, The heat-conducting structure is located on the side of the substrate that faces away from the first antenna.

6. The antenna module of claim 4, wherein, The substrate has a connecting portion protruding on the side opposite to the first antenna, and the connecting portion is used to connect a heat sink.

7. The antenna module according to any of claims 1-6, characterized by The side plate portion includes at least one side plate further having a notch, the notch penetrating the side plate in the thickness direction.

8. The antenna module of claim 7, wherein, The notch penetrates the end face of the side plate away from the base plate.

9. The antenna module of claim 8, wherein, The average radiation intensity of the first antenna at the location of the gap is higher than the average radiation intensity of other areas of the side plate where the gap is located.

10. The antenna module according to any one of claims 7-9, characterized in that, At least one second antenna is formed in the side plate portion between the notch and the substrate portion.

11. The antenna module according to any of claims 1-10, characterized by At least one of the at least two second antennas is disposed in the corner area formed by two adjacent side plates of the side plate portion.

12. The antenna module according to any of claims 1-11, characterized by The mounting surface of the substrate portion facing away from the first antenna is positioned toward the connecting circuit board and is fixedly connected to the connecting circuit board.

13. The antenna module of claim 12, wherein, One end of the mounting surface is provided with a connecting groove, which is used to fix the bracket.

14. An antenna system, characterized in that, The antenna system includes at least two antenna modules.

15. The antenna system of claim 14, wherein, A structural component is sandwiched between at least two of the at least two antenna modules.

16. The antenna system according to claim 15, characterized in that, The structural component includes at least one of a heat sink and a connecting circuit board.

17. The antenna system of claim 16, wherein, The heat sink and the connecting circuit board are stacked in the thickness direction of the connecting circuit board.

18. The antenna system of claim 16, wherein, At least one of the at least two antenna modules is connected to the heat dissipation device via a thermally conductive structure, and at least another of the at least two antenna modules is connected to the heat sink.

19. A communication device, characterized by Including the antenna system according to any one of claims 14-18.

20. A communications device, characterized by The communication device includes an antenna module according to any one of claims 1-13.

21. The communication device of claim 20, wherein, The communication device further includes a connection circuit board, wherein at least one first antenna of the antenna module is electrically connected to the connection circuit board, and at least one second antenna of the antenna module is electrically connected to the connection circuit board.

22. The communication device of claim 21, wherein, The communication device further includes a heat sink, which is fixedly connected to the substrate portion and is located between the connecting circuit board and the substrate portion in the thickness direction of the connecting circuit board.

23. The communication device of claim 22, wherein, The communication device also includes a third antenna, which is fixed to the heat sink.

24. The communication device of any of claims 21-23, wherein, The number of antenna modules is at least two, and the connecting circuit board is located between the two antenna modules in the thickness direction of the connecting circuit board.

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