Coil module, wireless charging apparatus and electronic device
By employing a single-sided wiring structure and support plate in the coil module, the problem of large coil thickness is solved, achieving a thinner coil module and more efficient power transmission, making it suitable for portable electronic devices.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD
- Filing Date
- 2025-12-02
- Publication Date
- 2026-07-02
AI Technical Summary
The coils in existing technologies are relatively thick, making it impossible to meet the need for thinner wireless power transmission modules with high efficiency at higher power levels.
A single-sided flexible circuit board is used to form a single-sided wiring structure by combining coil bundles and jumper assemblies with an isolation film, reducing the number of coil stacking layers and using a support plate and heat dissipation layer to improve power transmission efficiency.
This technology enables a reduction in the thickness of the coil module, improving charging efficiency, reducing temperature rise, and minimizing losses, thus meeting the demand for thinner designs in portable electronic devices.
Smart Images

Figure CN2025139286_02072026_PF_FP_ABST
Abstract
Description
Coil modules, wireless charging devices and electronic devices
[0001] This application claims priority to the patent application filed on December 24, 2024, with application number 202411920036.1 and entitled "Coil Module, Wireless Charging Device and Electronic Equipment", the entire contents of which are incorporated herein by reference. Technical Field
[0002] This application relates to the field of coils, and more particularly to a coil module, a wireless charging device equipped with the coil module, and an electronic device equipped with the coil module. Background Technology
[0003] Currently, portable mobile devices such as smartphones and smart wearables are increasingly using wireless charging in real-life scenarios. This wireless charging technology differs from wired connections in that it transmits power wirelessly without contact. Specifically, it uses electromagnetic induction or magnetic resonance between the contactless power receiver and receiver to charge the rechargeable battery of the portable mobile device. A coil is an essential component for this contactless power transmission; however, existing coils are generally traditional wire-wound coils. These traditional wire-wound coils are typically made by winding at least two overlapping layers, resulting in a relatively large thickness. This makes it impossible to meet the requirement of reducing coil thickness for high-efficiency wireless power transmission modules at higher power levels. Summary of the Invention
[0004] This application provides a coil module, which includes a coil assembly, a jumper assembly, and an insulating film. The coil assembly includes a first flexible circuit board and a coil bundle disposed on the first flexible circuit board. The coil bundle includes a first connecting end and a second connecting end. The first connecting end is located at one end of the coil bundle, and the second connecting end is located at the other end of the coil bundle. The first connecting end is located on the first flexible circuit board, and the second connecting end extends out of the edge of the first flexible circuit board. The jumper assembly includes a second flexible circuit board, a first wire bundle, and a second wire bundle. The first wire bundle and the second wire bundle are disposed on the second flexible circuit board at intervals. One end of the first wire bundle is connected to the first connecting end, and one end of the second wire bundle is connected to the second connecting end. The insulating film is attached to the surface of the first flexible circuit board facing the second flexible circuit board, and the jumper assembly is located on the side of the insulating film away from the first flexible circuit board.
[0005] This application also provides a wireless charging device, which includes a coil module, a housing, and a circuit board. The coil module and the circuit board are disposed within the housing. The coil module includes a coil assembly, a jumper assembly, and an insulating film. The coil assembly includes a first flexible circuit board and a coil bundle disposed on the first flexible circuit board. The coil bundle includes a first connecting end and a second connecting end. The first connecting end is located at one end of the coil bundle, and the second connecting end is located at the other end of the coil bundle. The first connecting end is located on the first flexible circuit board, and the second connecting end extends out of the edge of the first flexible circuit board. The jumper assembly includes a second flexible circuit board, a first wire bundle, and a second wire bundle. The first wire bundle and the second wire bundle are disposed on the second flexible circuit board at intervals. One end of the first wire bundle is connected to the first connecting end, and one end of the second wire bundle is connected to the second connecting end. The insulating film is attached to the surface of the first flexible circuit board facing the second flexible circuit board, and the jumper assembly is located on the side of the insulating film facing away from the first flexible circuit board. The coil module is electrically connected to the circuit board and is used for contactless power transmission.
[0006] This application also provides an electronic device, which includes a coil module, a housing, a battery, and a motherboard. The coil module, the motherboard, and the battery are all disposed within the housing, and the coil module is electrically connected to the motherboard. The coil module includes a coil assembly, a jumper assembly, and an insulating film. The coil assembly includes a first flexible circuit board and a coil bundle disposed on the first flexible circuit board. The coil bundle includes a first connecting end and a second connecting end. The first connecting end is located at one end of the coil bundle, and the second connecting end is located at the other end of the coil bundle. The first connecting end is located on the first flexible circuit board, and the second connecting end extends out of the edge of the first flexible circuit board. The jumper assembly includes a second flexible circuit board, a first wire bundle, and a second wire bundle. The first wire bundle and the second wire bundle are disposed on the second flexible circuit board at intervals. One end of the first wire bundle is connected to the first connecting end, and one end of the second wire bundle is connected to the second connecting end. The insulating film is attached to the surface of the first flexible circuit board facing the second flexible circuit board, and the jumper assembly is located on the side of the insulating film facing away from the first flexible circuit board. The coil module is used for contactless power reception, and the battery stores the power provided by the coil assembly. Attached Figure Description
[0007] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the implementation will be briefly introduced below. Obviously, the drawings described below are some implementations of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0008] Figure 1 is a three-dimensional structural diagram of the coil module provided in the first embodiment of this application.
[0009] Figure 2 is a three-dimensional exploded view of the coil module in Figure 1.
[0010] Figure 3 is a further three-dimensional structural exploded view of the coil module in Figure 2.
[0011] Figure 4 is a further three-dimensional structural exploded view of the coil module in Figure 3.
[0012] Figure 5 is a magnified three-dimensional view of the coil assembly, jumper assembly, and isolation membrane in Figure 3.
[0013] Figure 6 is an enlarged view of section VI in Figure 5.
[0014] Figure 7 is a magnified three-dimensional view of the coil assembly, jumper assembly, and insulating membrane in Figure 6 from another perspective.
[0015] Figure 8 is an enlarged view of part VIII in Figure 7.
[0016] Figure 9 is a three-dimensional exploded view of the coil assembly and jumper assembly in Figure 5.
[0017] Figure 10 is a magnified three-dimensional view of the jumper assembly in Figure 9.
[0018] Figure 11 is a three-dimensional exploded view of the jumper assembly in Figure 10.
[0019] Figure 12 is a three-dimensional structural diagram of the jumper assembly in Figure 11 from another perspective.
[0020] Figure 13 is a front structural diagram of the coil assembly and jumper assembly in Figure 5.
[0021] Figure 14 is an enlarged view of section XIV in Figure 13.
[0022] Figure 15 is a cross-sectional view along the XV-XV line in Figure 1.
[0023] Figure 16 is a partial enlarged view of the coil module in Figure 15.
[0024] Figure 17 is a front view of the coil assembly provided in the second embodiment of this application.
[0025] Figure 18 is an enlarged view of section XVIII in Figure 17.
[0026] Figure 19 is a front view of the coil assembly provided in the third embodiment of this application.
[0027] Figure 20 is an enlarged view of part XX in Figure 19.
[0028] Figure 21 is a partial cross-sectional schematic diagram of the coil module provided in the fourth embodiment of this application.
[0029] Figure 22 is an exploded three-dimensional structural diagram of the coil module provided in the fifth embodiment of this application.
[0030] Figure 23 is a three-dimensional structural schematic diagram of a wireless charging device provided in one embodiment of this application.
[0031] Figure 24 is a three-dimensional structural schematic diagram of an electronic device provided in another embodiment of this application.
[0032] Figure 25 is a schematic diagram showing the state of the wireless charging device in Figure 23 charging the electronic device in Figure 24.
[0033] Key designation: 100, Coil module; 30, Coil assembly; 32, First flexible circuit board; 320, First opening; 35, Coil bundle; 352, Coil section; 3522, Metal trace; 354, First connection terminal; 356, Second connection terminal; 40, Jumper assembly; 42, Second flexible circuit board; 422, First strip sheet; 424, Second strip sheet; 43, First covering film; 430, Clearance opening; 432, First covering section; 434, Second covering section; 44, First wire harness; 442, First solder point; 443, First solder section; 445, First electrical contact point; 45, Protective film; 452, First protective sheet ; 454, Second protective sheet; 456, Third protective sheet; 46, Second wiring harness; 462, Second welding point; 463, Second welding part; 465, Second electrical contact point; 50, Separating membrane; 52, Second opening; 60, Support plate; 62, Support surface; 620, Receiving groove; 622, First receiving section; 623, Alternating groove; 624, Second receiving section; 626, Third receiving section; 64, Connecting surface; 70, Heat dissipation layer; 80, Covering film; 300, Wireless charging device; 302, Housing; 304, Circuit board; 500, Electronic device; 502, Outer shell; 504, Main board; 506, Battery; 505, Display screen. Detailed Implementation
[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0035] Furthermore, the following descriptions of the embodiments are with reference to the accompanying illustrations, used to illustrate specific embodiments in which this application can be implemented. Directional terms used in this application, such as "up," "down," "front," "back," "left," "right," "inner," "outer," and "side," are merely for reference to the accompanying illustrations. Therefore, the use of directional terms is for better and clearer explanation and understanding of this application, and is not intended to indicate or imply that the referred device or element must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The term "natural state" refers to the state in which the device or element is not subjected to external forces, such as tension or pressure.
[0036] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed," "connected," "linked," and "set on" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0037] On one hand, this application provides a coil module, which includes:
[0038] A coil assembly includes a first flexible circuit board and a coil bundle disposed on the first flexible circuit board. The coil bundle includes a first connecting end and a second connecting end. The first connecting end is located at one end of the coil bundle, and the second connecting end is located at the other end of the coil bundle. The first connecting end is located on the first flexible circuit board, and the second connecting end extends out of the edge of the first flexible circuit board.
[0039] A jumper assembly, the jumper assembly including a second flexible circuit board, a first wire harness and a second wire harness, the first wire harness and the second wire harness being disposed at intervals on the second flexible circuit board, one end of the first wire harness being connected to a first connection terminal, one end of the second wire harness being connected to a second connection terminal, and;
[0040] An isolation membrane is attached to the surface of the first flexible circuit board facing the second flexible circuit board, and the jumper assembly is located on the side of the isolation membrane away from the first flexible circuit board.
[0041] Optionally, the first flexible circuit board has a first opening in the middle, the coil bundle is wound around the first opening, the first connecting end is located in the first opening, the isolation membrane has a second opening in the middle, the second opening is directly opposite the first opening, the first wire bundle passes through the second opening through the first welding part and is welded to the first connecting end, and the second wire bundle is welded to the second connecting end through the second welding part.
[0042] Optionally, one end of the first wire harness is provided with a first solder point, the first connection end is exposed on both sides of the first flexible circuit board, and the first solder point is soldered to the first connection end through the first solder part.
[0043] Optionally, one end of the second wire harness is provided with a second solder point, the second connection end extends out of the edge of the first flexible circuit board, and the second solder point is soldered to the second connection end through the second solder part.
[0044] Optionally, the second flexible circuit board includes a first strip and a second strip located at opposite ends thereon. One end of the first strip is connected to one end of the second strip. The width of the second strip is greater than the width of the first strip. The first wire harness is disposed on one side of the second flexible circuit board and is located on the first strip and the second strip. The second wire harness is disposed on the other side of the second flexible circuit board and is located on the second strip.
[0045] Optionally, the first welding point is located at the end of the first strip away from the second strip, and the second welding point is located at the end of the second wire harness close to the first strip.
[0046] Optionally, the first wire harness has a first electrical contact at one end away from the first welding point, and the first electrical contact is exposed on the outer peripheral surface of the support plate; the second wire harness has a second electrical contact at one end away from the second welding point, and the second electrical contact is exposed on the outer peripheral surface of the support plate.
[0047] Optionally, the first flexible circuit board is a circular flexible circuit board, and the first opening is a circular hole formed in the middle of the circular flexible circuit board, with the first opening coaxial with the first flexible circuit board.
[0048] Optionally, the coil bundle further includes a coil portion, with the first connecting end located at one end of the coil portion and the second connecting end located at the other end of the coil portion; the first connecting end is located on the inner circumferential surface of the first opening, and the second connecting end is located on the outer edge of the coil portion.
[0049] Optionally, the isolation membrane is a circular insulating sheet, the second opening is located in the middle of the isolation membrane, the second opening is coaxial with the isolation membrane, and the isolation membrane is aligned with the surface of the first flexible circuit board facing the jumper assembly.
[0050] Optionally, the length direction of the second flexible circuit board is parallel to the radial direction of the first flexible circuit board, and one end of the second flexible circuit board away from the center line of the first flexible circuit board extends out of the outer periphery of the first flexible circuit board.
[0051] Optionally, the jumper assembly further includes a first cover film covering one side of the second flexible circuit board and a protective film, wherein the first cover film is stacked between the isolation film and the second flexible circuit board, and the protective film covers the side of the second flexible circuit board opposite to the first cover film.
[0052] Optionally, the first covering film is provided with a clearance opening, and the second welding portion is accommodated in the clearance opening.
[0053] Optionally, the jumper assembly further includes a protective film, which includes a strip-shaped first protective sheet, a strip-shaped second protective sheet, and a third protective sheet, wherein the first protective sheet is connected between the second protective sheet and the third protective sheet; the first protective sheet covers the first strip-shaped sheet, the second protective sheet covers the second strip-shaped sheet, and the third protective sheet covers the first solder joint.
[0054] Optionally, the coil module further includes a support plate, the support plate includes a support surface, the support surface is provided with a receiving groove, the coil assembly is disposed on the support surface, and the jumper assembly is received in the receiving groove.
[0055] Optionally, the support plate further includes a connecting surface facing away from the support surface, one end of the receiving groove passes through the outer side of the support plate, and the side of the receiving groove away from the coil assembly passes through or is close to the connecting surface.
[0056] Optionally, the support plate has a relief groove on its support surface, the receiving groove is connected to the relief groove, the isolation film is received in the relief groove, or the isolation film and the first flexible circuit board are received in the relief groove.
[0057] Optionally, the coil module further includes a heat dissipation layer and a cover film, the heat dissipation layer being attached to the connection surface of the support plate, and the cover film covering the surface of the first flexible circuit board opposite to the heat dissipation layer.
[0058] On the other hand, this application also provides a wireless charging device, which includes a coil module, a housing, and a circuit board. The coil module and the circuit board are disposed inside the housing, and the coil module is electrically connected to the circuit board. The coil module is used for contactless power transmission.
[0059] On the other hand, this application also provides an electronic device, which includes a coil module, a housing, a battery and a motherboard. The coil module, the motherboard and the battery are all disposed in the housing. The coil module is electrically connected to the motherboard. The coil module is used for contactless power reception. The battery stores the power supplied by the coil module.
[0060] Please refer to Figures 1 to 4. The coil module 100 provided in the first embodiment of the present invention includes a coil assembly 30, a jumper assembly 40, an insulating film 50, a support plate 60, a heat dissipation layer 70, and a cover film 80. The coil assembly 30 includes a first flexible circuit board 32 and a coil bundle 35 disposed on the first flexible circuit board 32. The coil bundle 35 includes a coil portion 352, a first connecting end 354, and a second connecting end 356. The first connecting end 354 is located at one end of the coil bundle 35, and the second connecting end 356 is located at the other end of the coil bundle 35. Specifically, the first connecting end is disposed at one end of the coil portion 352, and the second connecting end 356 is disposed at the other end of the coil portion 352. The first connecting end 354 is located at one end of the first flexible circuit board 352, and the second connecting end 356 is disposed at the other end of the coil portion 352. On the flexible circuit board 32, the second connection end 356 extends out of the edge of the first flexible circuit board 32; the jumper assembly 40 includes the second flexible circuit board 42, the first wire harness 44 and the second wire harness 46, which are spaced apart on the second flexible circuit board 42. One end of the first wire harness 44 is connected to the first connection end 354, and one end of the second wire harness 46 is connected to the second connection end 356 to form a complete circuit; the isolation film 50 is attached to the surface of the first flexible circuit board 32 facing the second flexible circuit board 42, and the jumper assembly 40 is located on the side of the isolation film 50 away from the first flexible circuit board 32, that is, the isolation film 50 is located between the coil assembly 30 and the jumper assembly 40.
[0061] Understandably, the coil module 100 can be applied to contactless power receiving devices, which may be, but are not limited to, electronic devices such as mobile phones, smartwatches, tablets, or smart wearables. The coil module 100 can provide power to the battery of the contactless power receiving device. The coil module 100 can also be applied to contactless power transmitting devices, such as wireless charging devices, where the coil module 100 can charge the contactless power receiving device.
[0062] The first flexible circuit board 32 and the second flexible circuit board 42 of the coil module 100 provided by the present invention are separated by an isolation film 50. One end of the first wire harness 44 is connected to the first connection end 354 of the coil harness 35, and one end of the second wire harness 46 is connected to the second connection end 356 of the coil part 352 to form a complete circuit. Compared to existing wound coils that employ at least double-layer coil stacking with cover films attached to opposite sides of the coil and an adhesive layer applied to the surface of the cover films facing away from the coil, the coil module 100 provided by this invention uses only a coil bundle 35 disposed on a single-sided first flexible circuit board 32. Compared to the existing coils that use double-layer coil bundles, the coil module 100 of this invention reduces one layer of coil bundle, resulting in a thinner coil assembly 30 and thus a thinner overall coil module 100. Furthermore, the insulating film 50 of the coil module 100 of this invention replaces the cover film and adhesive layer on one side of the coil in the prior art, thereby reducing one film layer and further reducing the overall thickness of the coil module 100 to meet the trend of thinner electronic devices equipped with the coil module 100. Secondly, the single-sided wiring of the coil assembly 30 reduces the thickness of the remaining stacked layers, providing space for increasing the copper thickness of the wiring in the coil section 352. This reduces the AC resistance of the coil assembly 30, lowers the operating temperature of the coil assembly 30, improves temperature rise, increases charging efficiency, and reduces losses.
[0063] As shown in Figures 4-9, the first flexible circuit board 32 has a first opening 320 in the middle, the coil bundle 35 is wound around the first opening 320, the first connecting end 354 is located in the first opening 320, the isolation film 50 has a second opening 52 in the middle, the second opening 52 is directly opposite the first opening 320, the first wire bundle 44 passes through the first welding part 443 and passes through the second opening 52 to be welded to the first connecting end 354, and the second wire bundle 46 is welded to the second connecting end 356 through the second welding part 463. Specifically, one end of the first wire harness 44 is provided with a first solder point 442, and the first connecting end 354 is exposed on both sides of the first flexible circuit board 32. The first solder point 442 is soldered to the first connecting end 354 through the first solder part 443. One end of the second wire harness 46 is provided with a second solder point 462, and the second connecting end 356 extends out of the edge of the first flexible circuit board 32. The second solder point 462 is soldered to the second connecting end 356 through the second solder part 463, so as to realize that the coil harness 35 and the first wire harness 44 and the second wire harness 46 of the second flexible circuit board 42 form a circuit.
[0064] The first flexible circuit board 32 is a circular flexible circuit board. The first opening 320 is a circular hole formed in the middle of the circular flexible circuit board. The first opening 320 and the first flexible circuit board 32 are coaxial with line L. The coil section 352 includes multiple turns of metal traces 3522. The multiple turns of metal traces 3522 are formed by a single metal trace winding around one side of the first flexible circuit board 32 from the outside to the inside to form a spiral coil. The multiple turns of metal traces 3522 can be wound clockwise or counterclockwise. Since the multiple turns of metal traces 3522 can be wound clockwise or counterclockwise to form a spiral coil section 352, the routing of the metal traces 3522 is not limited, and the coil section 352 can be manufactured according to actual needs. In this embodiment, the multiple turns of metal traces 3522 can be wound clockwise. The multiple turns of metal traces 3522 are spaced apart from each other, each turn of metal trace 3522 is roughly circular, and the multiple turns of metal traces 3522 are coaxial with line L. The multi-turn metal trace 3522 can be exposed on opposite surfaces of the first flexible circuit board 32. The first connecting end 354 is located on the inner peripheral surface of the first opening 320, and the second connecting end 356 is located on the outer edge of the coil portion 352, with one end of the second connecting end 356 extending away from the metal trace 3522. In this embodiment, the cross-section of the metal trace 3522 is rectangular, which improves the heat dissipation performance, current carrying capacity, and space utilization of the metal trace 3522. In other embodiments, the cross-section of each turn of the metal trace 3522 can also be rectangular, polygonal, or elliptical. Since the metal trace 3522 can be quasi-circular, quasi-rectangular, quasi-polygonal, or quasi-elliptical, the coil portion 352 can be designed as a spiral coil of various shapes according to implementation needs.
[0065] Optionally, the isolation membrane 50 is a circular insulating sheet, with a second opening 52 located in the center of the isolation membrane 50. The second opening 52 is coaxial with the isolation membrane 50 along line L. The isolation membrane 50 is aligned with the surface of the first flexible circuit board 32 facing the jumper assembly 40, thereby completely insulating the first flexible circuit board 32 from the second flexible circuit board 42. The isolation membrane 50 may be, but is not limited to, an organic fiber sheet, a polymer insulating sheet, or a composite insulating sheet.
[0066] In other embodiments, the diameter of the second opening 52 of the isolation membrane 50 is smaller than the diameter of the first opening 320 of the first flexible circuit board 32. The isolation membrane 50 is provided with a through hole facing the first connection end 354, and the first welding part 443 passes through the through hole and is welded to the first connection end 354.
[0067] Optionally, the jumper assembly 40 further includes a first cover film 43 covering one side of the second flexible circuit board 42, and a protective film 45. The first cover film 43 is stacked between the isolation film 50 and the second flexible circuit board 42, and the protective film 45 covers the side of the second flexible circuit board 42 facing away from the first cover film 43. Specifically, the first cover film 43 covers the surface of the second flexible circuit board 42 facing the isolation film 50. The shape of the first cover film 43, the shape of the second flexible circuit board 42, and the shape of the protective film 45 are consistent. The second flexible circuit board 42 is sandwiched between the first cover film 43 and the protective film 45, and the first cover film 43 and the protective film 45 together protect the second flexible circuit board 42.
[0068] As shown in Figures 4 and 9-12, the second flexible circuit board 42 includes a first strip 422 and a second strip 424 located at opposite ends. One end of the first strip 422 is connected to one end of the second strip 424. The width of the second strip 424 is greater than the width of the first strip 422. A first wire harness 44 is disposed on one side of the second flexible circuit board 42, and the first wire harness 44 is located on both the first and second strips 422 and 424. A second wire harness 46 is disposed on the other side of the second flexible circuit board 42, and the second wire harness 46 is located on the second strip 424. Because the width of the first strip 422 of the second flexible circuit board 42 is smaller than the width of the second strip 424, and the second wire harness 46 is only disposed on the second strip 424, the area of the second flexible circuit board 42 is smaller. This not only reduces the volume occupied by the second flexible circuit board 42 in the coil module 100, which is beneficial to the miniaturization and thinning of the coil module 100, but also saves the materials required to manufacture the second flexible circuit board 42. The first welding point 442 is located at the end of the first strip 422 away from the second strip 424, and the second welding point 462 is located at the end of the second wire harness 46 close to the first strip 422. The end of the first wire harness 44 away from the first welding point 442 is provided with a first electrical contact 445, which protrudes from the outer peripheral surface of the support plate 60; the end of the second wire harness 46 away from the second welding point 462 is provided with a second electrical contact 465, which protrudes from the outer peripheral surface of the support plate 60; the first electrical contact 445 and the second electrical contact 465 are used to connect to the circuit system of the contactless charging device / device to be charged.
[0069] The length of the second flexible circuit board 42 is parallel to the radial direction of the first flexible circuit board 32, and one end of the second flexible circuit board 42, away from the center line of the first flexible circuit board 32, extends out of the outer periphery of the first flexible circuit board 32. Since the second flexible circuit board 42 extends radially along the first flexible circuit board 32, and both the first wire harness 44 and the second wire harness 46 extend radially along the first flexible circuit board 32, the lengths of the second flexible circuit board 42, the first wire harness 44, and the second wire harness 46 are all relatively short, which not only saves manufacturing materials but also improves charging efficiency. In this embodiment, the cross-section of the first wire harness 44 is rectangular.
[0070] In other embodiments, the cross-section of the first wire harness 44 may be, but is not limited to, circular, polygonal, or oblong. In other embodiments, the first flexible circuit board 32 may be, but is not limited to, rectangular, elliptical, polygonal, or irregular in shape.
[0071] The first cover film 43 is provided with a clearance opening 430, and the second welding part 463 is accommodated in the clearance opening 430 to facilitate the welding of the second welding part 463 to the second wire harness 46 and the second connection end 356. Specifically, the first cover film 43 is strip-shaped and includes a strip-shaped first cover segment 432 and a strip-shaped second cover segment 434. One end of the first cover segment 432 is connected to the end of the second cover segment 434. The shape of the first cover segment 432 is consistent with the shape of the first strip 422, and the shape of the second cover segment 434 is consistent with the shape of the second strip 424. The clearance opening 430 is located on the first cover film 43 near the first cover segment 432. When the first cover film 43 covers the second flexible circuit board 42, the first cover segment 432 covers the first strip 422, the second cover segment 434 covers the second strip 424, the first welding part 443 is located at the end of the first cover segment 432 opposite to the second cover segment 434, and the second welding part 463 is accommodated in the clearance opening 430. The first cover film 43 can be, but is not limited to, an ultra-thin black cover film, a polyimide film, or an FPC cover film.
[0072] A protective film 45 covers the surface of the second flexible circuit board 42 facing away from the first cover film 43. The protective film 45 is strip-shaped and includes a first protective sheet 452, a second protective sheet 454, and a third protective sheet 456. The first protective sheet 452 is connected between the second protective sheet 454 and the third protective sheet 456. The shape of the first protective sheet 452 is consistent with the shape of the first strip 422, the shape of the second protective sheet 454 is consistent with the shape of the second strip 424, and the shape of the third protective sheet 456 is consistent with the shape of the first solder joint 442. When the protective film 45 covers the surface of the second flexible circuit board 42 facing away from the first cover film 43, the first protective sheet 452 covers the first strip 422, the second protective sheet 454 covers the second strip 424, and the third protective sheet 456 covers the first solder joint 442. The protective film 45 can be, but is not limited to, an ultra-thin black cover film, a polyimide film, or an FPC cover film. In this embodiment, the protective film 45 is a polyester film. The thickness of the protective film 45 is between 3 μm and 7.5 μm.
[0073] As shown in Figures 12-14, the coil portion 352 is formed by multiple clockwise turns of a metal trace on the first flexible circuit board 32. That is, the metal trace on the first flexible circuit board is mainly made of rolled copper foil or electrolytic copper foil. The current flows out from the first electrical contact point 445 through the second wire bundle 46, the second solder point 462, the second solder part 463, the second connection end 356, and then along the multiple turns of the metal trace 3522, the first connection end 354, the first solder part 443, the first solder point 442, and the first wire bundle 44.
[0074] As shown in Figures 3 and 4, the support plate 60 includes a support surface 62 and a connecting surface 64 facing away from the support surface 62. The support surface 62 is provided with a receiving groove 620. The coil assembly 30 is disposed on the support surface 62, and the jumper assembly 40 is received in the receiving groove 620. The receiving groove 620 is a strip-shaped groove corresponding to the jumper assembly 40. One end of the receiving groove 620 passes through the outer side of the support plate 60, and the opposite end of the receiving groove 620 is close to the center of the support surface 62. The side of the receiving groove 620 away from the coil assembly 30 passes through the connecting surface 64. The width of the receiving groove 620 is greater than or equal to the width of the second flexible circuit board 42. The receiving groove 620 passes through the connecting surface 64 of the support plate 60 so that the second flexible circuit board 42 can be completely received within the receiving groove 620. That is, when the coil assembly 30 is placed on the support plate 60, the jumper assembly 40 is accommodated in the receiving groove 620, and the support surface 62 is supported by the insulating film 50, thereby reducing the thickness of the coil module 100. The shape of the support plate 60 may be the same as or different from the shape of the first flexible circuit board 32. In this embodiment, the support plate 60 is a rectangular nanocrystal. The support plate 60 may be, but is not limited to, a circular nanocrystal, a polygonal nanocrystal, an elliptical nanocrystal, or an irregularly shaped nanocrystal. The area of the support surface 62 is greater than or equal to the area of the first flexible circuit board 32, so that the first flexible circuit board 32 can fall entirely within the area of the support surface 62. The support plate 60 can absorb energy from the electromagnetic field and convert it into electrical energy, transmitting it to the receiving end to improve power transmission efficiency. Secondly, it enables power transmission over longer distances, expanding the application scenarios of wireless power transmission. Furthermore, the support plate 60 helps dissipate heat from the coil module 100, further improving power transmission speed and efficiency. The support plate 60 has high saturation magnetic flux density and relative permeability, significantly reducing the volume and mass of the magnetic coupling mechanism while maintaining shielding effectiveness, making it suitable for wireless charging environments of portable electronic devices. The support plate 60 also effectively reduces energy loss during power transmission, minimizing heat generation and electromagnetic interference to the environment surrounding the coil module 100. In other embodiments, the support plate 60 can also be made of materials other than nanocrystalline materials that possess the aforementioned effects.
[0075] The receiving groove 620 includes a first receiving section 622, a second receiving section 624, and a third receiving section 626 that are interconnected. The first receiving section 622 is located between the second receiving section 624 and the third receiving section 626. The third receiving section 626 is closer to the center of the support surface 62 than the second receiving section 624. One end of the second receiving section 624 away from the third receiving section 626 passes through the outer side of the support plate 60. The first receiving section 622 is used to receive the first strip 422, and the width of the first receiving section 622 is greater than or equal to the width of the first strip 422. The second receiving section 624 is used to receive the second strip 424, and the width of the second receiving section 624 is greater than or equal to the width of the second strip 424. The third receiving section 626 is used to receive the first welding point 442, and the width of the third receiving section 626 is greater than or equal to the width of the first welding point 442.
[0076] In this embodiment, the receiving groove 620 passes through the connecting surface 64, and the first cover film 43, the second flexible circuit board 42, and the protective film 45 are all housed in the receiving groove 620. It can be understood that the depth of the receiving groove 620 is greater than or equal to the sum of the thicknesses of the first cover film 43, the second flexible circuit board 42, and the protective film 45, and all three are housed within the receiving groove 620.
[0077] As shown in Figures 3 and 4, the heat dissipation layer 70 is attached to the connection surface 64 of the support plate 60, and the cover film 80 covers the surface of the first flexible circuit board 32 facing away from the heat dissipation layer 70. The heat dissipation layer 70 is used to dissipate heat from the coil assembly 30 during operation, preventing the coil assembly 30 from overheating, thereby protecting the normal operation of the coil assembly 30 and extending its service life. The shape of the heat dissipation layer 70 is consistent with the shape of the support plate 60 so that the heat dissipation layer 70 can completely fit the connection surface 64 of the support plate 60. In this embodiment, the heat dissipation layer 70 is a rectangular heat sink. Specifically, the heat dissipation layer 70 uses heat-dissipating graphite, thereby improving the heat dissipation efficiency of the coil module 100.
[0078] In other embodiments, the heat dissipation layer 70 may also be made of, but is not limited to, thermally conductive silicone pads, thermally conductive grease, ceramic layers, metal layers, or thermally conductive gel layers. A cover film 80 covers the surface of the coil assembly 30 opposite to the heat dissipation layer 70 and the support surface 62. The cover film 80 protects the coil assembly 30 and the support surface 62 of the support plate 60 from external corrosion, increases the wear resistance and contamination resistance of the coil module 100, and improves the reliability and service life of the coil module 100.
[0079] The shape of the cover film 80 is consistent with the shape of the support surface 62 of the support plate 60. In this embodiment, the cover film 80 is a rectangular film. In other embodiments, the cover film 80 can be, but is not limited to, a circular film, a polygonal film, an elliptical film, or an irregularly shaped film. The cover film 80 can be, but is not limited to, an ultra-thin black cover film, a polyimide film, or an FPC cover film. In this embodiment, the cover film 80 is a polyester film. The cover film 80 can protect the surface of the first flexible circuit board 32 from corrosion by external substances, increase the wear resistance and stain resistance of the coil part 352 and the first flexible circuit board 32, and improve the reliability and service life of the coil part 352 and the first flexible circuit board 32.
[0080] As shown in Figures 1-4 and 15-16, when assembling the coil module 100, the heat dissipation layer 70 is attached to the connection surface 64 of the support plate 60; the coil assembly 30 and the jumper assembly 40 are installed on the support surface 62 of the support plate 60, so that the isolation film 50 is attached to the support surface 62, and the jumper assembly 40 is accommodated in the receiving groove 620. Specifically, the first cover film 43, the second flexible circuit board 42 and the protective film 45 are all accommodated in the receiving groove 620, and the protective film 45 is attached to the heat dissipation layer 70 away from the surface of the second flexible circuit board 42, so that the first flexible circuit board 32 is supported on the support surface 62, thereby ensuring the flatness of the entire coil assembly 30, improving the wireless power transmission efficiency, improving the power transmission temperature rise of the coil module 100, thereby improving the user experience, and further reducing the thickness of the coil module 100. One end of the jumper assembly 40 away from the coil assembly 30 extends out of the outer side of the support plate 60, so that the first electrical contact point 445 and the second electrical contact point 465 are exposed; the cover film 80 is covered on the support surface 62 of the support plate 60 and the first flexible circuit board 32, so that the middle part of the cover film 80 is accommodated in the first opening 320 and the second opening 52.
[0081] Please refer to Figures 17 and 18. The structure of the coil module in the second embodiment of the present invention is similar to that in the first embodiment, except that the structure of the first flexible circuit board 32a in the second embodiment is slightly different from that in the first embodiment. Specifically, the first flexible circuit board 32a in the second embodiment is rectangular, and the coil portion 352a is roughly rectangular. A metal trace is formed by winding multiple turns of spaced metal trace from the outside to the inside on one side of the first flexible circuit board 32a. The multiple turns of metal trace form a spiral coil, and each turn of metal trace is roughly rectangular. The multiple turns of metal trace can be wound clockwise or counterclockwise. In this embodiment, the multiple turns of metal trace are wound clockwise.
[0082] In other embodiments, on one side of the first flexible circuit board 32a, a metal trace is wound counterclockwise from the outside to the inside to form multiple turns of spaced metal trace, which together form a spiral coil. Each turn of the metal trace is roughly rectangular. The direction of the metal trace is not limited, and the coil portion can be manufactured according to actual needs.
[0083] The function and beneficial effects of the coil module in the second embodiment are the same as those of the coil assembly in the first embodiment, and will not be repeated here.
[0084] As shown in Figures 19 and 20, the structure of the coil module in the third embodiment of the present invention is similar to that of the coil module in the first embodiment, except that the winding direction of the metal trace of the coil portion 352b in the third embodiment is opposite to that in the first embodiment. In the third embodiment, the coil portion 352b is formed by a single metal trace winding around one side of the first flexible circuit board 32 from the outside in to form a spiral coil, with multiple turns of the metal trace winding counterclockwise. The multiple turns of the metal trace are spaced apart from each other, each turn of the metal trace is approximately circular, and the multiple turns of the metal trace share a common axis.
[0085] The function and beneficial effects of the coil module in the third embodiment are the same as those of the coil assembly in the first embodiment, and will not be repeated here.
[0086] In other embodiments, the first flexible circuit board 32 may also be, but is not limited to, elliptical, polygonal, etc.; the metal traces of each coil portion may also be, but are not limited to, elliptical, polygonal, etc.
[0087] As shown in Figure 21, the structure of the coil module in the fourth embodiment of the present invention is similar to that in the first embodiment, except that the depth of the receiving groove 620 of the support plate 60 in the fourth embodiment is different from the depth of the receiving groove 620a of the support plate 60 in the first embodiment. Specifically, the receiving groove 620a in the fourth embodiment is located on the side away from the cover film 80 and close to the connecting surface 64, that is, the receiving groove 620a does not penetrate the connecting surface 64 of the support plate 60. When the coil assembly 30 is placed on the supporting surface 62 of the support plate 60, the protective film 45, the second flexible circuit board 42, and the first cover film 43 are all housed in the receiving groove 620a, and the first cover film 43 adheres to the supporting surface 62 to reduce the overall thickness of the coil module.
[0088] The function and beneficial effects of the coil module in the fourth embodiment are the same as those of the coil assembly in the first embodiment, and will not be repeated here.
[0089] As shown in Figure 22, the structure of the coil module in the fifth embodiment of this application is similar to that of the coil module in the first embodiment, except that: the support surface 62 of the support plate 60 in the fifth embodiment is provided with a recess 623, and the receiving groove 620 communicates with the recess 623; the isolation film 50 is received in the recess 623, or the isolation film 50 and the first flexible circuit board 32 are received in the recess 623. Specifically, if the depth of the recess 623 is greater than or equal to the thickness of the isolation film 50, when the coil assembly 30 is disposed on the support surface 62 of the support plate 60, the isolation film 50 is received in the recess 623, and the surface of the first flexible circuit board 32 facing the second flexible circuit board 42 is coplanar with the support surface 62, thereby further reducing the overall thickness of the coil module. If the depth of the recess 623 is equal to or greater than the sum of the thickness of the insulating film 50 and the thickness of the first flexible circuit board 32, when the coil assembly 30 is disposed on the support surface 62 of the support plate 60, both the insulating film 50 and the first flexible circuit board 32 are accommodated in the recess 623. The surface of the first flexible circuit board 32 facing away from the second flexible circuit board 42 is coplanar with the support surface 62, thereby further reducing the overall thickness of the coil module, improving wireless power transmission efficiency, further improving charging temperature rise, and enhancing user experience.
[0090] As shown in Figure 23, one embodiment of this application also provides a wireless charging device 300. The wireless charging device 300 includes a coil module 100, a housing 302, and a circuit board 304 as described in any of the above embodiments. The circuit board 304 and the coil module 100 are disposed within the housing 302. The coil module 100 is electrically connected to the circuit board 304 and is used for contactless power transmission. A charging platform is provided on the housing 302, and the coil module 100 is disposed on or near the inner surface of the charging platform. When the wireless charging device 300 charges a device placed on the charging platform, the coil module 100 generates a magnetic field. The coil in the device being charged undergoes electromagnetic induction with this magnetic field, thereby generating a current and converting electromagnetic energy into electrical energy to charge the battery in the device.
[0091] Because the coil module 100 is thinner, the overall thickness of the wireless charging device 300 can be reduced to meet the requirements of lightweight design of the wireless charging device 300.
[0092] As shown in Figure 24, another embodiment of this application provides an electronic device 500. The electronic device 500 includes a coil module 100, a housing 502, a motherboard 504, and a battery 506, as described in any of the above embodiments. The motherboard 504, battery 506, and coil module 100 are all disposed within the housing 502. The battery 506 and coil module 100 are electrically connected to the motherboard 504. The battery 506 provides power to the motherboard 504 and other electronic components. The coil module 100 is used for contactless power reception to provide power to the battery 506. When it is necessary to charge the battery 506 of the electronic device 500, the electronic device 500 is placed on the charging platform of a wireless charging device, so that the coil module 100 on the electronic device 500 faces the coil module of the wireless charging device. After the wireless charging device is powered on, the coil module 100 of the wireless charging device generates a changing magnetic field. The coil module 100 on the electronic device 500 senses this magnetic field and generates current to charge the battery 506.
[0093] Optionally, the coil module 100 is located near or disposed on the inner surface of the housing 502.
[0094] In this embodiment, the electronic device 500 is a mobile phone. The electronic device 500 also includes a display screen 505. The battery 506 can provide power to the display screen 505. The display screen 505 is electrically connected to the motherboard.
[0095] In other embodiments, the electronic device 500 may also be, but is not limited to, electronic products that need to be charged, such as tablet computers, smartwatches, or smart wearable devices, and various electronic products are provided with coil modules 100.
[0096] The coil module 100 in the electronic device 500 of this application is thinner, thereby reducing the overall thickness of the electronic device 500 to meet the requirements of lightweight design of the electronic device 500 and facilitating the layout of other electronic components within the electronic device 500.
[0097] As shown in Figure 25, when the wireless charging device 300 is used to charge the electronic device 500, the electronic device 500 is placed on the charging platform of the wireless charging device 300. The wireless charging device 300 is connected to an external power source. The coil module 100 of the wireless charging device 300 generates a magnetic field. The coil module 100 in the electronic device 500 senses the magnetic field and generates a current to charge the battery 506 of the electronic device 500.
[0098] The above are the implementation methods of the embodiments of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the embodiments of this application, and these improvements and modifications are also considered to be within the protection scope of this application.
Claims
1. A coil module, characterized by The coil module includes: A coil assembly includes a first flexible circuit board and a coil bundle disposed on the first flexible circuit board. The coil bundle includes a first connecting end and a second connecting end. The first connecting end is located at one end of the coil bundle, and the second connecting end is located at the other end of the coil bundle. The first connecting end is located on the first flexible circuit board, and the second connecting end extends out of the edge of the first flexible circuit board. A jumper assembly, the jumper assembly including a second flexible circuit board, a first wire harness and a second wire harness, the first wire harness and the second wire harness being disposed on the second flexible circuit board at intervals from each other, one end of the first wire harness being connected to a first connection terminal, one end of the second wire harness being connected to a second connection terminal, and; An isolation membrane is attached to the surface of the first flexible circuit board facing the second flexible circuit board, and the jumper assembly is located on the side of the isolation membrane away from the first flexible circuit board.
2. The coil module of claim 1, wherein, The first flexible circuit board has a first opening in the middle, the coil bundle is wound around the first opening, the first connecting end is located in the first opening, the isolation membrane has a second opening in the middle, the second opening is directly opposite the first opening, the first wire bundle passes through the second opening through the first welding part and is welded to the first connecting end, and the second wire bundle is welded to the second connecting end through the second welding part.
3. The coil module of claim 1, wherein, One end of the first wire harness is provided with a first solder point, and the first connecting end is exposed on both sides of the first flexible circuit board. The first solder point is soldered to the first connecting end through the first solder part.
4. The coil module of claim 3, wherein, One end of the second wire harness is provided with a second welding point, the second connection end extends out of the edge of the first flexible circuit board, and the second welding point is welded to the second connection end through the second welding part.
5. The coil module of claim 4, wherein, The second flexible circuit board includes a first strip and a second strip located at opposite ends thereon. One end of the first strip is connected to one end of the second strip. The width of the second strip is greater than the width of the first strip. The first wire harness is disposed on one side of the second flexible circuit board and is located on the first strip and the second strip. The second wire harness is disposed on the other side of the second flexible circuit board and is located on the second strip.
6. The coil module of claim 5, wherein, The first welding point is located at the end of the first strip away from the second strip, and the second welding point is located at the end of the second wire harness close to the first strip.
7. The coil module of claim 5, wherein, The first wire harness has a first electrical contact point at one end away from the first welding point, and the first electrical contact point is exposed on the outer peripheral surface of the support plate; the second wire harness has a second electrical contact point at one end away from the second welding point, and the second electrical contact point is exposed on the outer peripheral surface of the support plate.
8. The coil module of claim 2, wherein, The first flexible circuit board is a circular flexible circuit board, and the first opening is a circular hole opened in the middle of the circular flexible circuit board. The first opening is coaxial with the first flexible circuit board.
9. The coil module of claim 2, wherein, The coil bundle further includes a coil portion, with the first connecting end located at one end of the coil portion and the second connecting end located at the other end of the coil portion; the first connecting end is located on the inner circumferential surface of the first opening, and the second connecting end is located on the outer edge of the coil portion.
10. The coil module of claim 2, wherein, The isolation membrane is a circular insulating sheet, the second opening is located in the middle of the isolation membrane, the second opening is coaxial with the isolation membrane, and the isolation membrane is aligned with the surface of the first flexible circuit board facing the jumper assembly.
11. The coil module of claim 1, wherein, The length direction of the second flexible circuit board is parallel to the radial direction of the first flexible circuit board, and the end of the second flexible circuit board away from the center line of the first flexible circuit board extends out of the outer periphery of the first flexible circuit board.
12. The coil module of claim 2, wherein, The jumper assembly further includes a first cover film covering one side of the second flexible circuit board and a protective film, the first cover film being stacked between the isolation film and the second flexible circuit board, and the protective film covering the side of the second flexible circuit board opposite to the first cover film.
13. The coil module of claim 12, wherein, The first covering film has a clearance opening, and the second welding part is accommodated in the clearance opening.
14. The coil module of claim 5, wherein, The jumper assembly further includes a protective film comprising a strip-shaped first protective sheet, a strip-shaped second protective sheet, and a third protective sheet, wherein the first protective sheet is connected between the second protective sheet and the third protective sheet; the first protective sheet covers the first strip-shaped sheet, the second protective sheet covers the second strip-shaped sheet, and the third protective sheet covers the first solder joint.
15. The coil module of claim 3, wherein, The coil module further includes a support plate, the support plate includes a support surface, the support surface is provided with a receiving groove, the coil assembly is disposed on the support surface, and the jumper assembly is received in the receiving groove.
16. The coil module of claim 15, wherein, The support plate also includes a connecting surface facing away from the support surface, one end of the receiving groove passes through the outer side of the support plate, and the side of the receiving groove away from the coil assembly passes through or is close to the connecting surface.
17. The coil module of claim 15, wherein, The support plate has a relief groove on its support surface, the receiving groove is connected to the relief groove, the isolation film is received in the relief groove, or the isolation film and the first flexible circuit board are received in the relief groove.
18. The coil module of claim 15, wherein, The coil module further includes a heat dissipation layer and a cover film. The heat dissipation layer is attached to the connection surface of the support plate, and the cover film covers the surface of the first flexible circuit board away from the heat dissipation layer.
19. A wireless charging device, comprising: The wireless charging device includes a coil module, a housing, and a circuit board as described in any one of claims 1-18. The coil module and the circuit board are disposed within the housing. The coil module is electrically connected to the circuit board. The coil module is used for contactless power transmission.
20. An electronic device, comprising: The electronic device includes a coil module, a housing, a battery, and a motherboard as described in any one of claims 1-18. The coil module, the motherboard, and the battery are all disposed within the housing. The coil module is electrically connected to the motherboard. The coil module is used for contactless power reception. The battery stores the power supplied by the coil module.