Leveling device, leveling apparatus, and leveling method for leveling apparatus

Abstract

Provided in the present application are a leveling device, a leveling apparatus, and a leveling method for a leveling apparatus, which can achieve efficient leveling. The leveling device comprises a bottom plate, a plurality of flexible leveling members, a carrying member and a plurality of leveling fasteners, wherein the bottom plate has a first surface; the plurality of flexible leveling members are all mounted on the first surface, each flexible leveling member can elastically deform in the height direction of the flexible leveling member, and a second fixing hole of each flexible leveling member is in communication with a first fixing hole of the bottom plate; the carrying member is mounted on the side of the plurality of flexible leveling members facing away from the first surface, the carrying member has a carrying surface facing away from the plurality of flexible leveling members, the carrying surface is configured to carry a member to be leveled, and each third fixing hole of the carrying member is in communication with the second fixing hole of one flexible leveling member; and each leveling fastener passes through one third fixing hole, one second fixing hole and one first fixing hole, and each leveling fastener is configured to adjust the height of one flexible leveling member.

Description

Leveling device, leveling equipment, and leveling method of leveling equipment

[0001] This application claims priority to Chinese Patent Application No. 202411921964.X, filed on December 23, 2024, with the China National Intellectual Property Administration, entitled “Leveling Device, Leveling Equipment and Leveling Method of Leveling Equipment”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of semiconductor fabrication technology, and in particular to a leveling device, a leveling apparatus, and a leveling method for the leveling apparatus. Background Technology

[0003] As chip manufacturing technology continues to evolve, the features of chips that need to be inspected are becoming increasingly smaller. In chip manufacturing, to ensure the precision and accuracy of chip wafers during inspection and processing, leveling devices are required to level the wafers. However, existing leveling devices are complex to operate and have low leveling efficiency, thus reducing chip production efficiency. Summary of the Invention

[0004] This application provides a leveling device, a leveling equipment, and a leveling method for the leveling equipment, which can achieve efficient leveling, help speed up the chip production cycle, and improve chip production efficiency.

[0005] In a first aspect, this application provides a leveling device, including a base plate, a plurality of flexible leveling components, a bearing component, and a plurality of leveling fasteners. The base plate has a first surface and is provided with a plurality of first fixing holes, which are spaced apart from each other, and the opening of each fixing hole is located on the first surface. The plurality of flexible leveling components are mounted on the base plate, each flexible leveling component is elastically deformable along its height direction, and each flexible leveling component is provided with a second fixing hole, which penetrates the flexible leveling component along its height direction and communicates with the first fixing hole. The carrier is installed on the side of the plurality of flexible leveling components facing away from the first surface. The carrier has a bearing surface facing away from the plurality of flexible leveling components. The bearing surface is used to bear the component to be leveled. The carrier is provided with a plurality of third fixing holes. Each third fixing hole penetrates the carrier along the thickness direction of the carrier and communicates with the second fixing hole of one of the flexible leveling components. Each leveling fastener passes through one of the third fixing holes, one of the second fixing holes of the flexible leveling component, and one of the first fixing holes. Each leveling fastener is used to adjust the height of one of the flexible leveling components. In the leveling device provided in this application, by tightening the leveling fasteners, the distance between the carrier and the first surface of the base plate can be changed, thereby squeezing the plurality of flexible leveling components and causing the height of the plurality of flexible leveling components to change, thereby providing leveling feed for the leveling device, changing the levelness of the bearing surface, and enabling the leveling device to perform leveling operation. This design offers several advantages. First, it enables the leveling device to integrate leveling and fastening, allowing for a single-step process. This reduces interference from fastening operations, achieving efficient leveling within a limited space and improving overall leveling efficiency. This, in turn, helps accelerate chip production cycles and increase production efficiency. Second, the leveling device comprises only a base plate, flexible leveling components, a carrier component, and leveling fasteners. Assembly between these components is achieved solely through the fasteners, resulting in a simple and compact structure. This enhances maintainability and facilitates servicing. Furthermore, the integrated leveling and fastening design ensures that the forces generated during leveling and fastening are collinear, preventing external torque and deformation of the carrier component due to bending torque. This minimizes the impact of leveling and fastening operations on the carrier component's morphological accuracy, ensuring optimal leveling performance.

[0006] In one possible implementation, each of the flexible leveling components includes a flexible base and a flexible ball table. The flexible base is mounted on the first surface and has a first sub-hole that penetrates the flexible base along its height direction and communicates with the first fixing hole. The flexible ball table is mounted on the side of the flexible base opposite to the first surface and has a second sub-hole that penetrates the flexible ball table along its height direction and communicates with the first sub-hole. The second fixing hole includes both the first and second sub-holes. The bearing member is located on the side of the flexible ball table opposite to the flexible base. Each leveling fastener passes through one first sub-hole and one second sub-hole. With this configuration, using a flexible base and a flexible ball table to form the flexible leveling component reduces the machining accuracy of the flexible leveling component and the assembly accuracy between the flexible leveling component and the base plate.

[0007] In one possible implementation, the flexible base is provided with a contact groove, the opening of which is located on the surface of the flexible base opposite to the first surface, and the contact groove communicates with the first sub-hole; the flexible ball table is located in the contact groove, and the flexible ball table has a contact surface facing the contact groove, the contact surface abutting against the groove wall surface. This configuration can reduce the assembly precision between the flexible ball table and the flexible base, thereby helping to reduce the assembly difficulty of the flexible leveling component.

[0008] In one possible implementation, the groove wall of the contact groove includes a bottom groove wall, a first side groove wall, and a second side groove wall. The first and second side groove wall walls are located on opposite sides of the bottom groove wall and are both connected to the bottom groove wall. The distance between the first and second side groove wall walls gradually increases along the direction from the bottom groove wall towards the opening of the contact groove. The contact surface is an arc surface; for example, the radius R of the contact surface is 20mm ≤ R ≤ 60mm. The contact surface abuts against both the first and second side groove wall walls. In this configuration, the contact surface and the groove wall of the contact groove are always in point contact. On the one hand, this reduces the requirements for the machining accuracy of the flexible ball table and the flexible base, thereby reducing the requirements for the assembly accuracy between the flexible ball table and the flexible base. On the other hand, it avoids the flexible ball table from generating bending torsional moments, thus preventing the load-bearing components placed on the flexible leveling component from deforming due to bending torsional moments, thereby helping to ensure a better leveling effect of the leveling device. Meanwhile, during the leveling process, the point contact between the contact surface and the groove wall ensures that the maximum stress point of the flexible ball table is always located on the contact surface of the flexible ball table, reducing local stress concentration and thus avoiding the generation of bending torsional moments. This also helps to prevent the load-bearing components from deforming due to bending torsional moments, ensuring a better leveling effect of the leveling device.

[0009] In one possible implementation, the included angle α between the bottom wall of the tank and the first tank wall is 90°≤α≤120°, and / or the included angle β between the bottom wall of the tank and the second tank wall is 90°≤β≤120°.

[0010] In one possible implementation, the flexible ball table has a first through hole located on the side of the flexible ball table near the flexible base, penetrating the flexible ball table along its thickness direction, and spaced apart from the second sub-hole. In this embodiment, the first through hole is an oblong hole. The length direction of the first through hole is parallel to the contact surface. With this configuration, the distance between the hole wall surface near the contact surface and the contact surface is the same, ensuring that the elastic force and elastic recovery force generated when the flexible ball table undergoes elastic deformation are basically the same. This avoids large deformations of the flexible leveling component during leveling, making the modal controllable and facilitating small deformation leveling of the leveling device.

[0011] In one possible implementation, there are two first through holes, located on opposite sides of the second sub-hole. This arrangement provides more deformation space for the flexible table tennis table, allowing it to better generate elastic force and elastic recovery force.

[0012] In one possible implementation, the flexible base is provided with a second through hole. The second through hole is located on the side of the flexible base near the flexible ball table and extends through the flexible base along its width direction, spaced apart from the first sub-hole. In this embodiment, the second through hole is an oblong hole. The length direction of the second through hole is parallel to the groove wall of the contact groove. With this configuration, the distance between the hole wall of the second through hole on the side near the groove wall of the contact groove and the groove wall of the contact groove is the same, ensuring that the elastic force and elastic recovery force generated when the flexible base undergoes elastic deformation are basically the same. This avoids large deformations of the flexible leveling component during the leveling process, making the modal controllable of the flexible leveling component and facilitating small deformation leveling of the leveling device.

[0013] In one possible implementation, there are two second through holes, located on opposite sides of the first sub-hole. This arrangement provides more deformation space for the flexible base, enabling it to better generate elastic force and elastic recovery force.

[0014] In one possible implementation, the elastic modulus of the flexible leveling component is less than or equal to 60 GPa, and the yield strength of the flexible base is greater than or equal to 600 MPa. For example, the flexible leveling component is made of a superelastic nickel-titanium alloy material to give the flexible leveling component as a whole high stiffness and high elasticity.

[0015] In one possible implementation, each of the leveling fasteners includes a head and a rod. The rod passes through a third fixing hole, a second fixing hole of the flexible leveling member, and a first fixing hole. The head is fixedly connected to the end of the rod facing away from the carrier member. The leveling device also includes multiple washers, each washer being sleeved on the rod of one of the leveling fasteners and clamped between the head of the leveling fastener and the carrier member. It is understood that the washers protect the carrier member, preventing its surface from being scratched by friction from the leveling fasteners. Simultaneously, the washers are made of non-metallic materials. During leveling, the friction between the washers and the leveling fasteners is friction between metallic and non-metallic materials, which does not generate metal shavings or other particles, thereby reducing pollution caused by metal friction in the leveling device and avoiding environmental impact.

[0016] In one possible implementation, the carrier further includes multiple mounting slots spaced apart from each other. The opening of each mounting slot is located on the bearing surface, and each mounting slot surrounds the periphery of one of the third fixing holes. The head of each leveling fastener is located within one mounting slot, and the surface of the head of each leveling fastener facing away from the rod is located between the bearing surface and the bottom wall of the mounting slot. This configuration prevents the leveling fastener from protruding relative to the bearing surface of the carrier, thus preventing it from affecting the connection reliability between the part to be leveled and the carrier, preventing the part to be leveled from falling off the carrier, and ensuring the normal operation of subsequent testing.

[0017] Secondly, this application also provides a leveling device, including a detector and a leveling apparatus as described in any of the preceding claims. Along the height direction of the leveling device, the detector is located on the side of the bearing surface opposite to the plurality of flexible leveling members and is used to detect the levelness of the bearing surface. In this embodiment, the height of the plurality of flexible leveling members can be adjusted according to the detection results of the detector, thereby achieving leveling of the leveling device.

[0018] In one possible implementation, the leveling device further includes a motion platform for driving the leveling device to move. In this configuration, the leveling device can move under the influence of the motion platform, thereby aligning the bearing surface of the leveling device with the testing instrument, facilitating the testing instrument's detection of the levelness of the bearing surface.

[0019] Thirdly, this application also provides a leveling method for a leveling device, comprising:

[0020] Step 1: Provide the leveling equipment as described above;

[0021] Step two: Use a testing instrument to check the levelness of the bearing surface;

[0022] Step 3: Adjust the height of the multiple leveling fasteners according to the detection results of the detector.

[0023] In one possible implementation, after performing step one and before performing step two, the leveling method of the leveling device further includes: pre-tightening the plurality of leveling fasteners.

[0024] In one possible implementation, step three includes: determining whether the levelness of the bearing surface is within a preset levelness range; if the levelness of the bearing surface is within the preset levelness range, stopping the adjustment of the plurality of leveling fasteners; if the levelness of the bearing surface is not within the preset levelness range, adjusting the plurality of leveling fasteners to adjust the height of the plurality of flexible leveling components, and then performing step two. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0026] Figure 1 is a structural schematic diagram of a leveling device provided in this application;

[0027] Figure 2 is a schematic diagram of the leveling device in the leveling equipment shown in Figure 1;

[0028] Figure 3 is an exploded structural diagram of the leveling device shown in Figure 2;

[0029] Figure 4 is a schematic diagram of the leveling device shown in Figure 2 after it has been cut open along point AA;

[0030] Figure 5 is a schematic diagram of the structure of the base plate in the leveling device shown in Figure 3;

[0031] Figure 6 is a schematic diagram of the flexible leveling component in the leveling device shown in Figure 3.

[0032] Figure 7 is a schematic diagram of the cross-sectional structure of the flexible leveling component shown in Figure 6 after it is cut open along BB.

[0033] Figure 8 is a schematic diagram of the flexible base in the flexible leveling component shown in Figure 6;

[0034] Figure 9 is a schematic diagram of the flexible ball table in the flexible leveling component shown in Figure 6;

[0035] Figure 10 is a schematic diagram of the structure of the bearing component in the leveling device shown in Figure 3;

[0036] Figure 11 is a flowchart of a leveling method for a leveling device provided in this application.

[0037] Explanation of reference numerals in the attached drawings: 10-Base plate; 100-Leveling device; 110-Housing; 120-Motion platform; 130-Leveling device; 140-Detector; 101-First surface; 102-Second surface; 103-Contact groove; 104-First fixing hole; 10a-First central shaft; 20-Flexible leveling component; 21-Flexible base; 22-Flexible ball table; 23-Second fixing hole; 20a-Second central shaft; 231-First sub-hole; 232-Second sub-hole; 211-Contact groove; 211a-First groove side wall; 211b-Second groove side wall; 211c-Groove bottom wall; 213-Second through hole; 22a-Support part; 22b-Abutment part; 222-First side surface; 223-Second side surface; 224-Contact surface; 225-First through hole; 30-Bearing component; 30a - Bearing surface; 31 - Third fixing hole; 32 - Assembly groove; 40 - Leveling fastener; 41 - Head; 42 - Rod; 50 - Washer. Detailed Implementation

[0038] The embodiments of this application are described below with reference to the accompanying drawings.

[0039] Please refer to Figure 1, which is a structural schematic diagram of a leveling device 100 provided in this application.

[0040] The leveling device 100 of this application can be used to level chip wafers, and can also be applied to other devices that require leveling, such as optical inspection devices and atomic force microscopes (AFM). The embodiments of this application do not impose strict limitations on this. For example, in chip manufacturing processes, the leveling device 100 can be used to level chip wafers to ensure the precision and accuracy of the wafers during inspection or processing. As another example, when using optical inspection devices to inspect the shape, size, and surface quality of a workpiece, the leveling device 100 in the optical inspection device can be used to adjust the position of the workpiece to reduce measurement errors and ensure the accuracy of the inspection results from the optical inspection device.

[0041] In this embodiment, the leveling device 100 may include a housing 110, a motion platform 120, a leveling device 130, and a detector 140. The motion platform 120, leveling device 130, and detector 140 are all installed within the housing 110. The motion platform 120 can move relative to the housing 110. The leveling device 130 is installed on the motion platform 120 and can move relative to the housing 110 under the influence of the motion platform 120. The leveling device 130 is used for leveling to ensure high accuracy and precision in the detection of the workpiece to be leveled subsequently placed on the leveling device 130. The detector 140 is located on the side of the leveling device 130 opposite to the motion platform 120. The detector 140 is used to detect the levelness of the leveling device 130. The leveling device 100 can level the leveling device 130 based on the levelness result detected by the detector 140. In other embodiments, the number of leveling devices 130 may also be multiple. At this time, multiple leveling devices 130 can perform leveling simultaneously or sequentially, and the embodiments of this application do not impose any restrictions on this.

[0042] Please refer to Figures 2 to 4. Figure 2 is a structural schematic diagram of the leveling device 130 in the leveling device 100 shown in Figure 1. Figure 3 is an exploded structural schematic diagram of the leveling device 130 shown in Figure 2. Figure 4 is a structural schematic diagram of the leveling device 130 shown in Figure 2 after being cut along line AA. Here, "cut along line AA" means cutting along the plane containing line AA; similar descriptions in the following text can be understood in the same way.

[0043] In this embodiment, the leveling device 130 includes a base plate 10, a plurality of flexible leveling components 20, a carrier component 30, a plurality of leveling fasteners 40, and a plurality of washers 50. Specifically, the plurality of flexible leveling components 20 are all mounted on the base plate 10 and are spaced apart from each other. The carrier component 30 is mounted on the side of the plurality of flexible leveling components 20 away from the base plate 10. Along the height direction of the leveling device 130, the carrier component 30 is spaced apart from the base plate 10. The carrier component 30 is used to support the component to be leveled (not shown in the figure). The plurality of leveling fasteners 40 are used to assemble the base plate 10, the plurality of flexible leveling components 20, and the carrier component 30. During the leveling process, rotating the leveling fastener 40 transmits its force through the carrier 30 to the flexible leveling component 20, causing the flexible leveling component 20 to undergo elastic deformation. This changes the height of the flexible leveling component 20, thereby altering the distance between the carrier 30 and the base plate 10. This adjustment ensures that the level of the carrier 30 meets the testing requirements. During this process, the washer 50 protects the surface of the carrier 30, preventing scratches caused by friction from the leveling fastener 40.

[0044] Please refer to Figures 4 and 5. Figure 5 is a schematic diagram of the structure of the base plate 10 in the leveling device 130 shown in Figure 3.

[0045] In this embodiment, the base plate 10 is mounted on the motion platform 120. In this embodiment, the base plate 10 is made of a metal material. For example, the base plate 10 can be made of aluminum alloy (such as Al 7075). Specifically, the base plate 10 has a first central axis 10a. The base plate 10 is rotationally symmetrical about the first central axis 10a. The base plate 10 also has a first surface 101 and a second surface 102. Along the thickness direction of the base plate 10, the first surface 101 and the second surface 102 are arranged opposite to each other.

[0046] The base plate 10 is also provided with a plurality of first fixing holes 104 and a plurality of contact grooves 103. The openings of the plurality of first fixing holes 104 and the plurality of contact grooves 103 are all located on the first surface 101. The plurality of first fixing holes 104 are spaced apart from each other. Each first fixing hole 104 is recessed from the first surface 101 in a direction away from the flexible leveling member 20. In this embodiment, the plurality of first fixing holes 104 penetrate the base plate along the thickness direction of the base plate 10 and are spaced apart from each other. For example, there are three first fixing holes 104. The diameter of the circumcircle formed by the centers of the three first fixing holes 104 is 230 mm, and the angle between the center of two adjacent first fixing holes 104 and the first central axis 10a of the base plate 10 is 120°. In this embodiment, each first fixing hole 104 is a threaded hole. The diameter of the internal thread of each first fixing hole 104 is 5 mm, and the pitch of each first fixing hole 104 is 0.5 mm.

[0047] Multiple contact grooves 103 are recessed from the first surface 101 toward the second surface 102. Each contact groove 103 is disposed around the periphery of a first fixing hole 104. In this embodiment, the multiple contact grooves 103 are spaced apart around the first central axis 10a of the base plate 10. For example, there are three contact grooves 103. The three contact grooves 103 are rotationally symmetrical about the first central axis 10a of the base plate 10.

[0048] Please refer to Figures 4, 6 and 7. Figure 6 is a structural schematic diagram of the flexible leveling component 20 in the leveling device 130 shown in Figure 3, and Figure 7 is a cross-sectional structural schematic diagram of the flexible leveling component 20 shown in Figure 6 after being cut along BB.

[0049] Multiple flexible leveling elements 20 are located on the side of the second surface 102 facing the first surface 101. These flexible leveling elements 20 are spaced apart around the first central axis 10a of the base plate 10. For example, there are three flexible leveling elements 20. These three flexible leveling elements 20 are arranged in a non-linear array. "Non-linear array arrangement" means that the three flexible leveling elements 20 are not arranged in a straight line, but rather form a non-linear array in a complex and irregular manner. In other embodiments, the number of flexible leveling elements 20 may be two, four, or more; the embodiments of this application do not strictly limit this. When there are two flexible leveling elements 20, the two flexible leveling elements 20 are located on opposite sides of the first central axis 10a of the base plate 10. When there are four or more flexible leveling elements 20, these four or more flexible leveling elements 20 may also be arranged in a non-linear array.

[0050] In this embodiment, each flexible leveling component 20 is mounted on a contact groove 103 of the base plate 10, and each flexible leveling component 20 can elastically deform along its height direction. In this embodiment, each flexible leveling component 20 has a second central axis 20a. Along the length direction of the flexible leveling component 20, each flexible leveling component 20 is mirror-symmetrical about the second central axis 20a.

[0051] Specifically, each flexible leveling component 20 is provided with a second fixing hole 23. The second fixing hole 23 penetrates the flexible leveling component 20 along its height direction and communicates with a first fixing hole 104 of the base plate 10. The center of the second fixing hole 23 coincides with the second central axis 20a of the flexible leveling component 20. Specifically, the second fixing hole 23 of each flexible leveling component 20 includes a first sub-hole 231 and a second sub-hole 232. The first sub-hole 231 is located on the side of the second sub-hole 232 facing the first surface 101 of the base plate 10 and communicates with the second sub-hole 232.

[0052] Each flexible leveling element 20 includes a flexible base 21 and a flexible ball table 22. The flexible base 21 of each flexible leveling element 20 is mounted on a first surface 101 and located within a contact groove 103 of the base plate 10. The flexible ball table 22 is mounted on the side of the flexible base 21 opposite to the first surface 101 of the base plate 10. Furthermore, exemplaryly, the elastic modulus of each flexible leveling element 20 is less than or equal to 60 GPa, and the yield strength of each flexible leveling element 20 is greater than or equal to 600 MPa. Specifically, the elastic modulus of the flexible base 21 is less than or equal to 60 GPa, and the yield strength of the flexible base 21 is greater than or equal to 600 MPa, and / or, the elastic modulus of the flexible ball table 22 is less than or equal to 60 GPa, and the yield strength of the flexible ball table 22 is greater than or equal to 600 MPa. In this embodiment, both the flexible base 21 and the flexible ball table 22 are made of a superelastic inner titanium alloy material, so that the flexible base 21 and the flexible ball table 22 have high stiffness and high elasticity, thereby giving the flexible leveling component 20 as a whole high stiffness and high elasticity. In some other embodiments, the flexible base 21 and the flexible ball table 22 may also be made of other materials with low elastic modulus and high yield height, so that the flexible base 21 and the flexible ball table 22 can have high stiffness and high elasticity, and the embodiments of this application do not strictly limit them.

[0053] Please refer to Figures 7 and 8. Figure 8 is a schematic diagram of the structure of the flexible base 21 in the flexible leveling component 20 shown in Figure 6.

[0054] In this embodiment, the flexible base 21 is provided with a first sub-hole 231 and a contact groove 211. The first sub-hole 231 penetrates the flexible base 21 along its height direction and communicates with the first fixing hole 104. The center of the first sub-hole 231 coincides with the central axis of the flexible base 21. The opening of the contact groove 211 is located on the surface of the flexible base 21 facing away from the first surface 101. The contact groove 211 is recessed from the surface of the flexible base 21 facing the flexible ball table 22 in a direction away from the flexible ball table 22, and penetrates both surfaces of the flexible base 21 in its width direction, communicating with the first sub-hole 231. For example, the cross-sectional shape of the contact groove 211 parallel to the height direction of the flexible base 21 is V-shaped.

[0055] Specifically, the groove wall of the contact groove 211 includes a first groove side wall 211a, a second groove side wall 211b, and a groove bottom wall 211c. The first groove side wall 211a and the second groove side wall 211b are located on opposite sides of the groove bottom wall 211c and are both connected to the groove bottom wall 211c. Along the direction from the groove bottom wall 211c towards the opening of the contact groove 211, the distance between the first groove side wall 211a and the second groove side wall 211b gradually increases. In other words, both the first groove side wall 211a and the second groove side wall 211b are inclined relative to the groove bottom wall 211c. The included angle α between the groove bottom wall 211c and the first groove side wall 211a is 90°≤α≤120°, and / or the included angle β between the groove bottom wall 211c and the second groove side wall 211b is 90°≤β≤120°. For example, the included angle α between the bottom wall surface 211c of the tank and the first side wall surface 211a of the tank is 120°, and the included angle β between the bottom wall surface 211c of the tank and the second side wall surface 211b of the tank is 120°.

[0056] In addition, the flexible base 21 is also provided with a second through hole 213. The second through hole 213 penetrates the flexible base 21 along its width direction and is located on the side of the flexible base 21 near the flexible ball table 22, and is spaced apart from the contact groove 211 and the first sub-hole 231. In this embodiment, the second through hole 213 is an oblong hole. The length direction of the second through hole 213 is parallel to the groove wall of the contact groove 211. With this configuration, the distance between the hole wall of the second through hole 213 on the side near the groove wall of the contact groove 211 and the groove wall of the contact groove 211 is the same, so as to ensure that the elastic force and elastic recovery force generated when the flexible base 21 undergoes elastic deformation are basically the same, thereby avoiding large deformation of the flexible leveling member 20 during the leveling process, making the mode controllable of the flexible leveling member 20, and helping to achieve small deformation leveling of the leveling device 130. For example, there are two second through holes 213. Along the length of the flexible base 21, two second through holes 213 are located on opposite sides of the first sub-hole 231. One second through hole 213 is positioned near the first groove sidewall 211a of the contact groove 211, and the other is positioned near the second groove sidewall 211b of the contact groove 211. When the flexible base 21 is compressed, it undergoes elastic deformation. At this time, the second through holes 213 provide deformation space for the flexible base 21, allowing it to better generate elastic force and elastic recovery force. In other embodiments, the number of second through holes 213 may be one, three, or more.

[0057] Please refer to Figures 6, 7 and 9. Figure 9 is a schematic diagram of the structure of the flexible ball table 22 in the flexible leveling component 20 shown in Figure 6.

[0058] In this embodiment, the flexible ball table 22 is located within the contact groove 211 of the flexible base 21. Exemplarily, the flexible ball table 22 is generally hemispherical. Specifically, the flexible ball table 22 has a second sub-hole 232. The second sub-hole 232 penetrates the flexible ball table 22 along its height direction (Z-axis direction in the figure) to communicate with the first sub-hole 231 of the flexible base 21. The center of the second sub-hole 232 coincides with the central axis of the flexible ball table 22. The flexible ball table 22 also includes a support portion 22a and an abutment portion 22b, with the abutment portion 22b fixedly connected to one side of the support portion 22a in the thickness direction. The support portion 22a supports the carrier member 30. The abutment portion 22b is located on the side of the support portion 22a facing the flexible base 21. Exemplarily, the abutment portion 22b is generally semi-circular.

[0059] In this embodiment, the abutment portion 22b is installed in the contact groove 211 of the flexible base 21, and the peripheral side surface of the abutment portion 22b abuts against the groove wall surface of the contact groove 211. The peripheral side surface of the abutment portion 22b includes a first side surface 222, a second side surface 223, and a contact surface 224. Along the thickness direction of the abutment portion 22b, the first side surface 222 and the second side surface 223 are spaced apart and arranged opposite to each other. The contact surface 224 is located on the side of the flexible ball table 22 facing the contact groove 211, and connects the first side surface 222, the second side surface 223, and the peripheral side surface of the support portion 22a, and abuts against the groove wall surface of the contact groove 211. In this embodiment, the contact surface 224 abuts against both the first groove side wall surface 211a and the second groove side wall surface 211b of the contact groove 211. For example, the contact surface 224 is an arc surface. Wherein, the radius R of the contact surface 224 is 20mm≤R≤60mm. For example, the radius R of the contact surface 224 is 35 mm.

[0060] It is understandable that, since the contact surface 224 is an arc surface, when the flexible ball table 22 is installed in the contact groove 211 of the flexible base 21, the contact surface 224 abuts against the first groove side wall 211a and the second groove side wall 211b of the contact groove 211. That is, the contact surface 224 and the groove wall of the contact groove 211 are always in point contact. On the one hand, this can reduce the requirements for the machining accuracy of the flexible ball table 22 and the flexible base 21, thereby reducing the requirements for the assembly accuracy between the flexible ball table 22 and the flexible base 21. On the other hand, it can prevent the flexible ball table 22 from generating bending torsional moment, thereby preventing the bearing 30 placed on the flexible leveling component 20 from deforming due to the influence of bending torsional moment, which helps to ensure that the leveling effect of the leveling device 130 is better. Meanwhile, during the leveling process, the point contact between the contact surface 224 and the groove wall of the contact groove 211 ensures that the maximum stress point of the flexible ball table 22 is always located on the contact surface 224 of the flexible ball table 22, reducing local stress concentration and thus avoiding the generation of bending torsional moments. This also helps to prevent the bearing member 30 from deforming due to bending torsional moments, ensuring that the leveling effect of the leveling device 130 is better.

[0061] In addition, the flexible ball table 22 is also provided with a first through hole 225. Specifically, the abutment portion 22b is provided with a first through hole 225. The first through hole 225 penetrates the abutment portion 22b of the flexible ball table 22 along the thickness direction of the abutment portion 22b of the flexible ball table 22, and is located on the side of the abutment portion 22b of the flexible ball table 22 near the flexible base 21, and is spaced apart from the second sub-hole 232.

[0062] In this embodiment, the first through hole 225 is an oblong hole. The length direction of the first through hole 225 is parallel to the contact surface 224. With this configuration, the distance between the hole wall surface of the first through hole 225 near the contact surface 224 and the contact surface 224 is the same, so as to ensure that the elastic force and elastic recovery force generated when the flexible ball table 22 undergoes elastic deformation are basically the same, thereby avoiding large deformation of the flexible leveling member 20 during the leveling process, making the modality of the flexible leveling member 20 controllable, and helping to achieve small deformation leveling of the leveling device 130. For example, there are two first through holes 225. The two first through holes 225 are located on opposite sides of the second sub-hole 232. When the flexible ball table 22 is compressed, the flexible ball table 22 will undergo elastic deformation. At this time, the first through hole 225 can provide deformation space for the flexible ball table 22, so that the flexible ball table 22 can better generate elastic force and elastic recovery force. In some other embodiments, the number of second through holes 213 can also be one, three or more.

[0063] Please refer to Figures 4 and 10. Figure 10 is a structural schematic diagram of the support member 30 in the leveling device 130 shown in Figure 3.

[0064] The support member 30 is located on the side of the plurality of flexible leveling members 20 opposite to the first surface 101 of the base plate 10. Specifically, the support member 30 is located on the side of the flexible ball table 22 of the plurality of flexible leveling members 20 opposite to the flexible base 21, and abuts against the support portion 22a of the flexible ball table 22 of the plurality of flexible leveling members 20. Exemplarily, the support member 30 is generally disk-shaped. The central axis of the support member 30 coincides with the first central axis 10a of the base plate 10.

[0065] The support member 30 has a support surface 30a that is opposite to the plurality of flexible leveling members 20. The support surface 30a is used to support the member to be leveled (not shown). Along the height direction of the leveling device 100, the detector 140 is located on the side of the support surface 30a that is opposite to the plurality of flexible leveling members 20, and is spaced apart from and opposite to the support surface 30a, so that the detector 140 can detect the levelness of the support surface 30a.

[0066] In this embodiment, the support member 30 is a wafer chuck. The support surface 30a is used to support the wafer. In some other embodiments, the support member 30 may also be other components used to support items that need to be leveled. For example, in an atomic force microscope, the support member 30 may also be a stage in a rotating device for leveling.

[0067] In this embodiment, the support member 30 is further provided with a plurality of third fixing holes 31 and a plurality of assembly slots 32. The plurality of third fixing holes 31 penetrate the support member 30 along its thickness direction and are spaced apart from each other. For example, there are three third fixing holes 31. Each third fixing hole 31 communicates with a second fixing hole 23 of a flexible leveling member 20. Furthermore, the center of each third fixing hole 31 coincides with the second central axis 20a of a flexible leveling member 20. With this configuration, the center of each third fixing hole 31, the center of the second fixing hole 23 of the flexible leveling member 20, and the center of a first fixing hole 104 all coincide.

[0068] The openings of the multiple assembly recesses 32 are all located on the bearing surface 30a. The multiple assembly recesses 32 are recessed from the bearing surface 30a toward the flexible ball table 22. Each assembly recess 32 is arranged around the periphery of a third fixing hole 31. The multiple assembly recesses 32 are used to install the washers 50 of the leveling device 130.

[0069] Please refer to Figure 4 again. Each leveling fastener 40 passes through a third fixing hole 31 of the carrier 30, a second fixing hole 23 of the flexible leveling component 20, and a first fixing hole of the base plate 10, and is fixed to the base plate 10, thereby assembling the carrier 30 and the flexible leveling component 20 with the base plate 10. Each leveling fastener 40 passes through a second sub-hole 232 and a first sub-hole 231 of the second fixing hole 23. Each leveling fastener 40 is used to adjust the height of a flexible leveling component 20.

[0070] It is understandable that since the center of each third fixing hole 31, the center of the second fixing hole 23 of a flexible leveling member 20, and the center of a first fixing hole 104 all coincide, when the leveling fastener 40 is used to adjust the distance between the carrier member 30 and the first surface 101 of the base plate 10, bending torque can be prevented, thereby avoiding deformation of the carrier member 30 due to bending torque, reducing the influence of the leveling fastener 40 on the shape of the carrier member 30 during the leveling and tightening process, and thus also helping to achieve small deformation leveling of the leveling device 130.

[0071] In this embodiment, each leveling fastener 40 is made of metal. For example, each leveling fastener 40 is made of titanium alloy. In this embodiment, each leveling fastener 40 is a screw. The thread specification of each leveling fastener 40 is M5, and the pitch is 0.5mm. Specifically, each leveling fastener 40 includes a head 41 and a rod 42, with the rod 42 fixedly connected to one side of the head 41. The rod 42 sequentially passes through a third fixing hole 31 in the carrier 30, a second fixing hole 23 in the flexible leveling member 20, and a first fixing hole 104 in the base plate 10, and is fixed to the base plate 10. The head 41 is fixedly connected to the end of the rod 42 facing away from the carrier 30. The head 41 of each leveling fastener 40 is located within an assembly recess 32 of the carrier 30, and the surface of the head 41 of each leveling fastener 40 facing away from the rod 42 is located between the bottom wall of the assembly recess 32 and the bearing surface 30a. With this setting, the leveling fastener 40 can be prevented from protruding relative to the bearing surface 30a of the bearing member 30, thereby preventing the leveling fastener 40 from affecting the connection reliability between the part to be leveled and the bearing member 30 placed on the bearing member 30, preventing the part to be leveled from falling off the bearing member 30, and thus ensuring the normal progress of subsequent testing.

[0072] Each washer 50 is fitted onto a leveling fastener 40 and located within an assembly recess 32 of the carrier 30. Specifically, each washer 50 is fitted onto the rod portion 42 of a leveling fastener 40 and clamped between the head 41 of the leveling fastener 40 and the carrier 30. For example, the washer 50 is made of a non-metallic material to protect the surface of the carrier 30 from scratches caused by friction from the leveling fastener 40. Furthermore, because the washer 50 is made of a non-metallic material, the friction between the washer 50 and the leveling fastener 40 during leveling is friction between metallic and non-metallic materials, which does not generate metal shavings or other particles. This reduces pollution caused by metal friction in the leveling device 130 and avoids environmental impact.

[0073] Please refer to Figure 4. During the assembly of the leveling device 130, firstly, the flexible base 21 of each flexible leveling component 20 is installed in the contact groove 103 of the base plate 10, and the first sub-hole 231 of the flexible base 21 corresponds to and communicates with the first fixing hole 104 in the contact groove 103. Then, the flexible ball platform 22 of each flexible leveling component 20 is installed in the contact groove 211 of the flexible base 21, and the second sub-hole 232 of the flexible ball platform 22 corresponds to and communicates with the first sub-hole 231 of the flexible base 21, thereby connecting the second fixing hole 23 with the first fixing hole 104, so as to facilitate the subsequent installation of the leveling fastener 40.

[0074] After the multiple flexible leveling components 20 are assembled with the base plate 10, the carrier 30 is placed on the side of the multiple flexible leveling components 20 away from the base plate 10, and each third fixing hole 31 of the carrier 30 corresponds to and communicates with the second fixing hole 23 of a flexible leveling component 20. Then, each washer 50 is fitted onto the rod portion 42 of a leveling fastener 40. The rod portion 42 of each leveling fastener 40 is then passed sequentially through the third fixing hole 31 of the carrier 30, the second sub-hole 232 of the flexible ball table 22, the first sub-hole 231 of the flexible base 21, and the first fixing hole 104 of the base plate 10. Finally, the leveling fastener 40 is tightened by the mutual engagement between the thread of the leveling fastener 40 and the thread of the first fixing hole 104, thereby fixing the leveling fastener 40 to the base plate 10 and completing the assembly between the carrier 30, the base plate 10, and the flexible leveling components 20. At this time, each washer 50 is located in an assembly recess 32 of the carrier 30, and between the head 41 of a leveling fastener 40 and the bottom wall of the assembly recess 32, so as to avoid the leveling fastener 40 from causing wear on the surface of the carrier 30 during the assembly process, thereby helping to extend the service life of the carrier 30.

[0075] In this embodiment, when the leveling fastener 40 is tightened, the distance between the carrier 30 and the first surface 101 of the base plate 10 changes, and multiple flexible leveling components 20 are compressed. This allows for adjustment of the height of the multiple flexible leveling components 20, thereby adjusting the levelness of the bearing surface 30a of the carrier 30 to meet the testing requirements. During this process, the force of the leveling fastener 40 is transmitted to the flexible ball table 22 via the carrier 30. The flexible ball table 22 undergoes elastic deformation under pressure and compresses the flexible base 21, causing the flexible base 21 to also undergo elastic deformation. This changes the overall height of the flexible leveling components 20, thereby adjusting the levelness of the bearing surface 30a of the carrier 30. In this setting, the tightening operation of the leveling device 130 is also the leveling operation, which allows the tightening operation and the leveling operation to be performed simultaneously. This not only enables the leveling device 130 to achieve efficient leveling, but also avoids interference from the leveling result of the secondary tightening operation, thereby achieving high-precision leveling of the leveling device 130 and ensuring better leveling effect of the leveling device 130.

[0076] It should be noted that during the actual leveling process, the operator first applies a certain pre-tightening force to each leveling fastener 40 to pre-tighten and fix it, and then uses the testing instrument 140 to test the levelness of the carrier 30. Then, based on the levelness result of the carrier 30 detected by the testing instrument 140, the pre-tightening force of multiple leveling fasteners 40 is adjusted sequentially to adjust the height of the flexible leveling component 20, thereby ensuring that the levelness of the carrier 30 meets the testing requirements.

[0077] In the leveling device 130 provided in this application, by tightening the leveling fastener 40, the distance between the carrier 30 and the first surface 101 of the base plate 10 can be changed, thereby compressing multiple flexible leveling elements 20 and causing a change in the height of the multiple flexible leveling elements 20. This provides leveling feed for the leveling device 130, changes the levelness of the carrier surface 30a, and enables the leveling device 130 to perform leveling operations. Under this configuration, on the one hand, the leveling device 130 can achieve an integrated leveling and fastening design, so that the leveling and fastening of the leveling device 130 can be completed in one go, thereby reducing the interference of the fastening operation on the leveling operation, achieving efficient leveling in a limited space, thereby improving the leveling efficiency of the leveling device 130, which helps to speed up the chip production cycle and improve chip production efficiency. On the other hand, the leveling device 130 has a simple and compact structure, which is conducive to improving the maintainability of the leveling device 130 and facilitating maintenance of the leveling device 130.

[0078] Meanwhile, the integrated leveling and fastening design of the leveling device 130 can also make the forces generated by leveling and fastening collinear, thereby avoiding the generation of external torque and preventing the bearing component 30 from deforming due to bending torque. This reduces the impact of leveling and fastening operations on the shape accuracy of the bearing component 30, ensuring that the leveling device 130 has a better leveling effect on the component to be leveled.

[0079] Furthermore, the flexible ball table 22 and flexible base 21 of the leveling device 130 have high rigidity, making the rigidity of the flexible ball table 22 and flexible base 21 controllable. This allows for control of the overall rigidity of the flexible leveling component 20, making the overall modal controllable of the leveling device 130. Consequently, the leveling device 130 will not deform when it moves at high speed under the drive of the motion platform 120. On the one hand, this improves the reliability of the leveling device 130, and on the other hand, it also helps to increase the measurement speed, thereby accelerating the chip production cycle and improving chip production efficiency.

[0080] This application also provides a leveling method for a leveling device 100.

[0081] Please refer to Figure 11, which is a flowchart of a leveling method of a leveling device 100 provided in this application.

[0082] Step S1: Provide leveling device 130.

[0083] Step 2 S2: Use the detector 140 to check the levelness of the bearing surface 30a.

[0084] After performing step S1 above and before performing step S2, the leveling method of the leveling device 100 further includes: pre-tightening multiple leveling fasteners 40.

[0085] Step 3 S3: Adjust multiple leveling fasteners 40 according to the detection results of the detector 140 to adjust the height of multiple flexible leveling parts 20.

[0086] Step S3 above includes: determining whether the levelness of the bearing surface 30a is within a preset levelness range. When the levelness of the bearing surface 30a is within the preset levelness range, stopping the adjustment of multiple leveling fasteners 40. When the levelness of the bearing surface 30a is not within the preset levelness range, adjusting multiple leveling fasteners 40 to adjust the height of multiple flexible leveling components 20, and proceeding to step S2.

[0087] The above are merely some embodiments and implementation methods of this application. The scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A leveling device, characterized in that, It includes a base plate, multiple flexible leveling components, a bearing component, and multiple leveling fasteners. The base plate has a first surface and multiple first fixing holes. The multiple first fixing holes are spaced apart from each other, and the opening of each fixing hole is located on the first surface. Multiple flexible leveling components are installed on the first surface. Each flexible leveling component can elastically deform along the height direction of the flexible leveling component. Each flexible leveling component is provided with a second fixing hole. The second fixing hole penetrates the flexible leveling component along the height direction of the flexible leveling component and communicates with the first fixing hole. The support member is installed on the side of the plurality of flexible leveling members opposite to the first surface. The support member has a support surface opposite to the plurality of flexible leveling members. The support surface is used to support the member to be leveled. The support member is provided with a plurality of third fixing holes. Each third fixing hole penetrates the support member along the thickness direction and communicates with the second fixing hole of one of the flexible leveling members. Each of the leveling fasteners is inserted through a third fixing hole, a second fixing hole of a flexible leveling member, and a first fixing hole, and each of the leveling fasteners is used to adjust the height of a flexible leveling member.

2. The leveling device according to claim 1, characterized in that, Each of the aforementioned flexible leveling components includes a flexible base and a flexible ball table. The flexible base is mounted on the base plate and has a first sub-hole. The first sub-hole penetrates the flexible base along its height direction and communicates with the first fixing hole. The flexible ball table is mounted on the side of the flexible base opposite to the first surface. The flexible ball table has a second sub-hole. The second sub-hole penetrates the flexible ball table along its height direction and communicates with the first sub-hole. The second fixing hole includes both the first sub-hole and the second sub-hole. The support member is located on the side of the flexible ball table away from the flexible base; Each of the leveling fasteners passes through a first sub-hole and a second sub-hole.

3. The leveling device according to claim 2, characterized in that, The flexible base is provided with a contact groove, the opening of the contact groove is located on the surface of the flexible base opposite to the first surface, and the contact groove is connected to the first sub-hole; The flexible ball table is located in the contact groove, and the flexible ball table has a contact surface facing the contact groove, the contact surface abutting against the groove wall surface of the contact groove.

4. The leveling device according to claim 3, characterized in that, The contact groove has a bottom wall surface, a first side wall surface, and a second side wall surface. The first side wall surface and the second side wall surface are located on opposite sides of the bottom wall surface and are both connected to the bottom wall surface. The distance between the first side wall surface and the second side wall surface gradually increases along the direction of the bottom wall surface towards the opening of the contact groove. The contact surface is an arc surface, and the contact surface abuts against both the first groove sidewall and the second groove sidewall.

5. The leveling device according to claim 4, characterized in that, The radius R of the contact surface is 20mm ≤ R ≤ 60mm.

6. The leveling device according to claim 4 or 5, characterized in that, The included angle α between the bottom wall of the tank and the first side wall of the tank is 90°≤α≤120°, and / or the included angle β between the bottom wall of the tank and the second side wall of the tank is 90°≤β≤120°.

7. The leveling device according to any one of claims 2 to 6, characterized in that, The flexible ball table is provided with a first through hole, which is located on the side of the flexible ball table close to the flexible base and penetrates the flexible ball table along the thickness direction, and is spaced apart from the second sub-hole.

8. The leveling device according to claim 7, characterized in that, There are two first through holes, which are located on opposite sides of the second sub-hole.

9. The leveling device according to any one of claims 3 to 8, characterized in that, The flexible base is provided with a second through hole, which is located on the side of the flexible base near the flexible ball table and extends through the flexible base along the width direction of the flexible base, and is spaced apart from the first sub-hole.

10. The leveling device according to claim 9, characterized in that, There are two second through holes, which are located on opposite sides of the first sub-hole.

11. The leveling device according to claim 1, characterized in that, The elastic modulus of the flexible leveling component is less than or equal to 60 GPa, and the yield strength of the flexible leveling component is greater than or equal to 600 MPa.

12. The leveling device according to claim 11, characterized in that, The flexible leveling component is made of a super-elastic nickel-titanium alloy material.

13. The leveling device according to claim 1, characterized in that, Each of the leveling fasteners includes a head and a rod, the rod passing through a third fixing hole, a second fixing hole of the flexible leveling member, and a first fixing hole, and the head is fixedly connected to the end of the rod away from the bearing member; The leveling device further includes a plurality of washers, each washer being fitted onto the rod portion of one of the leveling fasteners and clamped between the head of one of the leveling fasteners and the carrier.

14. The leveling device according to claim 13, characterized in that, The support member is also provided with a plurality of assembly slots, the plurality of assembly slots are spaced apart from each other, the opening of each assembly slot is located on the support surface, and each assembly slot is arranged around the periphery of one of the third fixing holes. The head of each of the leveling fasteners is located within one of the mounting slots, and the surface of the head of each of the leveling fasteners facing away from the rod is located between the bearing surface and the bottom wall of the mounting slot.

15. A leveling device, characterized in that, The device includes a detector and a leveling device as described in any one of claims 1 to 14. Along the height direction of the leveling device, the detector is located on the side of the bearing surface away from the plurality of flexible leveling members and is used to detect the levelness of the bearing surface.

16. The leveling device according to claim 15, characterized in that, The leveling device also includes a motion platform, which is used to drive the leveling device to move.

17. A leveling method for a leveling device, characterized in that, include: Step 1: Provide the leveling device as described in claim 15 or 16; Step two: Use a testing instrument to check the levelness of the bearing surface; Step 3: Adjust the height of the multiple leveling fasteners according to the detection results of the detector.

18. The leveling method of the leveling device according to claim 17, characterized in that, After performing step one and before performing step two, the leveling method of the leveling device further includes: pre-tightening the plurality of leveling fasteners.

19. The leveling method of the leveling device according to claim 17, characterized in that, Step three includes: determining whether the levelness of the bearing surface is within a preset levelness range; if the levelness of the bearing surface is within the preset levelness range, stopping the adjustment of multiple leveling fasteners; if the levelness of the bearing surface is not within the preset levelness range, adjusting multiple leveling fasteners to adjust the height of multiple flexible leveling components, and then proceeding to step two.

Images