Component supply device
By allowing for the flexible adjustment of stages to mounting tables based on component type, the device addresses inefficiencies in component supply, enhancing alignment and reducing unnecessary movements for optimized component placement.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- FUJI CORP
- Filing Date
- 2024-12-27
- Publication Date
- 2026-07-02
Smart Images

Figure JP2024046396_02072026_PF_FP_ABST
Abstract
Description
Component supply device
[0001] The present invention relates to a component supply device that holds components scattered on a stage by a holding head and places them on a mounting table.
[0002] The following patent document describes a component supply device that holds components scattered on a stage by a holding head and places them on a mounting table.
[0003] International Publication No. 2019 / 116442
[0004] The present invention is a component supply device that holds components scattered on a stage by a holding head and places them on a mounting table, and an object thereof is to appropriately supply components.
[0005] In order to solve the above problems, this specification includes a plurality of stages on which components are scattered, a holding head that holds components scattered on any one of the plurality of stages, and a plurality of mounting tables on which the components held by the holding head are placed. The mounting table on which the components held from the stage are placed is preset, and a component supply device is disclosed in which the ratio of the number of stages on which a predetermined component is scattered to the number of mounting tables on which the predetermined component is placed is arbitrarily set for each component.
[0006] In the present disclosure, the mounting table on which the components held from the stage are placed is preset, and the ratio of the number of stages on which a predetermined component is scattered to the number of mounting tables on which the predetermined component is placed is arbitrarily set for each component. Thus, by arbitrarily setting the ratio of the number of stages to the number of mounting tables for each component, it becomes possible to appropriately supply components.
[0007] This is a perspective view of a component mounting machine. This is a perspective view of a component mounting device of a component mounting machine. This is a perspective view of a loose component supply device. This is a perspective view of a component supply unit. This is a transparent view of a component supply unit. This is a transparent view of a component supply unit. This is a perspective view of a component scattering device. This is a perspective view of a component scattering device. This is a perspective view of a component holding head. This is a diagram of a component receiving member in which electronic circuit components are stored. This is a block diagram of the control device of a component mounting machine. This is a schematic diagram of a detection sensor that detects the floating of leaded components placed on a component receiving member. This is a schematic diagram of a detection sensor that detects the floating of leaded components placed on a component receiving member. This is a diagram showing leaded components of the same shape scattered on a stage. This is a diagram showing model data used for pattern matching. This is a schematic diagram showing the ratio of the number of stages to the number of component receiving members in a conventional system. This is a schematic diagram showing the ratio of the number of stages to the number of component receiving members in the present invention. This is a plan view and a side view of a component receiving member. This is a plan view of a component receiving member with one 2D code and a plan view of a component receiving member with six 2D codes.
[0008] Hereinafter, embodiments of the present invention will be described in detail with reference to the figures, as embodiments for carrying out the present invention.
[0009] Figure 1 shows a component mounting machine 10. The component mounting machine 10 is a device for mounting components onto a circuit board 12. The component mounting machine 10 comprises a main unit 20, a substrate transport and holding device 22, a component mounting device 24, imaging devices 26 and 28, a component supply device 30, a loose component supply device 32, and a control device (see Figure 11) 34. The circuit board 12 can be a circuit board or a three-dimensional structured substrate, and the circuit board can be a printed wiring board or a printed circuit board.
[0010] The main body of the device 20 is composed of a frame 40 and a beam 42 suspended on the frame 40. The substrate transport and holding device 22 is located in the center of the frame 40 in the front-rear direction and has a transport device 50 and a clamping device 52. The transport device 50 is a device for transporting the circuit substrate 12, and the clamping device 52 is a device for holding the circuit substrate 12. As a result, the substrate transport and holding device 22 transports the circuit substrate 12 and also holds the circuit substrate 12 fixedly in a predetermined position. In the following description, the transport direction of the circuit substrate 12 is referred to as the X direction, the horizontal direction perpendicular to that direction is referred to as the Y direction, and the vertical direction is referred to as the Z direction. In other words, the width direction of the component mounting machine 10 is the X direction, and the front-rear direction is the Y direction.
[0011] The parts mounting device 24 is mounted on the beam 42 and has two work heads 60 and 62 and a work head moving device 64. Each work head 60 and 62 is a rotary holding head and can hold multiple parts, for example, eight parts, simultaneously. Since the rotary holding head is a known type of head, it can be briefly described as having eight suction nozzles (not shown) arranged in an annular shape at equal pitches on a short cylindrical holder (not shown). As the holder rotates, each of the eight suction nozzles holds the part in a predetermined position. The work head moving device 64 has an X-direction moving device 68, a Y-direction moving device 70, and a Z-direction moving device 72. The X-direction moving device 68 and the Y-direction moving device 70 move the two work heads 60 and 62 together to any position on the frame 40. Furthermore, as shown in Figure 2, each work head 60, 62 is detachably attached to sliders 74, 76, and the Z-axis movement device 72 moves the sliders 74, 76 individually in the vertical direction. In other words, the work heads 60, 62 are moved individually in the vertical direction by the Z-axis movement device 72.
[0012] The imaging device 26 is mounted on the slider 74 with its orientation facing downwards and is moved in the X, Y, and Z directions together with the work head 60. This allows the imaging device 26 to image any position on the frame 40. As shown in Figure 1, the imaging device 28 is positioned with its orientation facing upwards between the substrate transport and holding device 22 and the parts supply device 30 on the frame 40. This allows the imaging device 28 to image the parts held by the suction nozzles of the work heads 60 and 62.
[0013] The parts supply device 30 is located at one end of the frame 40 in the front-rear direction. The parts supply device 30 includes a tray-type parts supply device 78 and a feeder-type parts supply device (not shown). The tray-type parts supply device 78 is a device that supplies parts in a state where they are placed on a tray. The feeder-type parts supply device is a device that supplies parts by tape feeder (not shown) or stick feeder (not shown).
[0014] The loose parts supply device 32 is located at the other end of the frame 40 in the front-rear direction. The loose parts supply device 32 is a device that aligns multiple parts that are scattered loosely and supplies the parts in an aligned state. In other words, it is a device that aligns multiple parts in any orientation to a predetermined orientation and supplies the parts in that predetermined orientation. The configuration of the parts supply device 32 will be described in detail below. The parts supplied by the parts supply device 30 and the loose parts supply device 32 include electronic circuit components, solar cell components, and power module components. Furthermore, electronic circuit components include parts with leads and parts without leads.
[0015] As shown in Figure 3, the loose parts supply device 32 includes a main body 80, a parts supply unit 82, an imaging device 84, and a parts transfer device 86.
[0016] The parts supply unit 82 includes a parts feeder 88, a parts scattering device (see Figure 4) 90, and a parts return device (see Figure 4) 92, with the parts feeder 88, parts scattering device 90, and parts return device 92 being integrally configured. The parts supply unit 82 is detachably mounted to the base 96 of the main body 80, and in the loose parts supply device 32, five parts supply units 82 are arranged in a single row in the X direction.
[0017] The parts feeder 88 is generally shaped like a rectangular box and is arranged to extend in the Y direction, as shown in Figures 4 and 5. The Y direction is described as the front-to-back direction of the parts feeder 88, and in the parts supply unit 82, the direction toward the side where the parts return device 92 is located is described as the front, and the direction toward the side where the parts feeder 88 is located is described as the rear.
[0018] The parts feeder 88 has openings on its top and front. The top opening serves as the parts input port 97, and the front opening serves as the parts discharge port 98. A slanted plate 104 is positioned below the input port 97 of the parts feeder 88. The slanted plate 104 is positioned so as to be inclined downward from the rear end face of the parts feeder 88 toward the center.
[0019] Furthermore, a conveyor device 106 is installed on the front side of the inclined plate 104, as shown in Figure 5. The conveyor device 106 is installed so as to be inclined upward from the front end of the inclined plate 104 toward the front of the parts feeder 88. The conveyor belt 112 of the conveyor device 106 rotates counterclockwise in Figure 5. In other words, the conveying direction by the conveyor device 106 is diagonally upward toward the front from the front end of the inclined plate 104.
[0020] Furthermore, an inclined plate 126 is provided below the front end of the conveyor device 106. The inclined plate 126 is positioned from the front end face of the parts feeder 88 toward the bottom of the conveyor device 106, with its rear end inclined diagonally downwards. In addition, an inclined plate 128 is provided below the inclined plate 126. The inclined plate 128 is inclined so that its front end is positioned downwards from below the central part of the conveyor device 106 toward the discharge port 98 of the parts feeder 88.
[0021] Furthermore, as shown in Figure 4, a pair of side frames 130 are assembled to the base 96. The pair of side frames 130 are positioned facing each other, parallel to each other, and extending in the Y direction. The distance between the pair of side frames 130 is slightly greater than the width dimension of the parts feeder 88, and the parts feeder 88 is detachably mounted between the pair of side frames 130.
[0022] The parts distribution device 90 includes a parts support member 150 and a parts support member moving device 152. The parts support member 150 is composed of a stage 156 and a pair of side wall portions 158. The stage 156 is generally a long plate shape and is positioned to extend forward from below the parts feeder 88 mounted between a pair of side frames 130. The upper surface of the stage 156 is generally horizontal and, as shown in Figure 5, is positioned with a small clearance from the front end of the inclined plate 128 of the parts feeder 88. The pair of side wall portions 158 are fixed upright on both sides of the longitudinal direction of the stage 156, as shown in Figure 4, and the upper ends of each side wall portion 158 extend upward from the upper surface of the stage 156.
[0023] Furthermore, the component support member moving device 152 slides the component support member 150 in the Y direction by the operation of the air cylinder (see Figure 11) 166. During this process, the component support member 150 moves between a stored state where it is stored below the component feeder 88 (see Figure 6) and an exposed state where it is exposed from below the component feeder 88 (see Figure 5).
[0024] As shown in Figure 7, the parts return device 92 includes a parts storage container 180 and a container swinging device 181. The parts storage container 180 is generally box-shaped, with an arc-shaped bottom. The parts storage container 180 is swingably held at the front end of the stage 156 of the parts support member 150 and swings when the container swinging device 181 is operated. During this time, the parts storage container 180 swings between a storage position with its opening facing upward (see Figure 7) and a return position with its opening facing the upper surface of the stage 156 of the parts support member 150 (see Figure 8).
[0025] As shown in Figure 3, the imaging device 84 includes a camera 290 and a camera moving device 292. The camera moving device 292 includes a guide rail 296 and a slider 298. The guide rail 296 is fixed to the main body 80 above the parts feeder 88 and extends in the width direction (X direction) of the loose parts feeder 32. The slider 298 is slidably mounted on the guide rail 296 and slides to any position by the operation of an electromagnetic motor (see Figure 11) 299. The camera 290 is mounted on the slider 298 facing downwards.
[0026] As shown in Figure 3, the parts transfer device 86 includes a parts holding head moving device 300, a parts holding head 302, and two shuttle devices 304.
[0027] The component holding head moving device 300 includes an X-direction moving device 310, a Y-direction moving device 312, and a Z-direction moving device 314. The Y-direction moving device 312 has a Y-slider 316 positioned above the component supply unit 82 so as to extend in the X direction, and the Y-slider 316 moves to any position in the Y direction by being driven by an electromagnetic motor (see Figure 11) 319. The X-direction moving device 310 has an X-slider 320 positioned on the side of the Y-slider 316, and the X-slider 320 moves to any position in the X direction by being driven by an electromagnetic motor (see Figure 11) 321. The Z-direction moving device 314 has a Z-slider 322 positioned on the side of the X-slider 320, and the Z-slider 322 moves to any position in the Z direction by being driven by an electromagnetic motor (see Figure 11) 323.
[0028] As shown in Figure 9, the part holding head 302 includes a head body 330, a suction nozzle 332, a nozzle swivel device 334, and a nozzle rotation device 335. The head body 330 is integrally formed with the Z slider 322. The suction nozzle 332 holds the part and is detachably mounted on the lower end of the holder 340. The holder 340 is bendable on the support shaft 344, and the holder 340 bends 90 degrees upward when the nozzle swivel device 334 is operated. As a result, the suction nozzle 332 mounted on the lower end of the holder 340 swivels 90 degrees and is positioned in the swiveled position. In other words, the suction nozzle 332 swivels between the non-swiveled position and the swiveled position when the nozzle swivel device 334 is operated. Of course, it is also possible to position and stop it at an angle between the non-swiveled position and the swiveled position. The nozzle rotation device 335 rotates the suction nozzle 332 around its axis.
[0029] Furthermore, as shown in Figure 3, each of the two shuttle devices 304 includes a parts carrier 388 and a parts carrier moving device 390, and is fixed to the main body 80, arranged laterally in front of the parts supply unit 82. Five parts receiving members 392 are mounted on the parts carrier 388 in a single row in the lateral direction, and parts are placed on each of the parts receiving members 392.
[0030] The loose parts supply device 32 is capable of supplying various parts, and various types of parts receiving members 392 are available depending on the shape of the parts. Here, as an example of an electronic circuit component supplied by the loose parts supply device 32, we will describe a parts receiving member 392 that corresponds to a leaded component 410, as shown in Figure 10. The leaded component 410 consists of a block-shaped component body 412 and two leads 414 protruding from the bottom surface of the component body 412.
[0031] Furthermore, the component receiving member 392 has a component receiving recess 416 shaped to match the lead component 410. The component receiving recess 416 is a stepped recess and consists of a main body receiving recess 418 that opens on the upper surface of the component receiving member 392 and a lead receiving recess 420 that opens on the bottom surface of the main body receiving recess 418. The lead component 410 is then inserted into the component receiving recess 416 with the lead 414 facing downwards. As a result, the lead 414 is inserted into the lead receiving recess 420, and the lead component 410 is placed inside the component receiving recess 416 with the component body 412 inserted into the main body receiving recess 418.
[0032] Furthermore, as shown in Figure 3, the parts carrier moving device 390 is a plate-shaped longitudinal member and is positioned on the front side of the parts supply unit 82 so as to extend in the front-rear direction. A parts carrier 388 is slidably mounted on the upper surface of the parts carrier moving device 390 in the front-rear direction and slides to any position in the front-rear direction by the drive of an electromagnetic motor (see Figure 11) 430. When the parts carrier 388 slides toward the parts supply unit 82, it slides to a parts receiving position located within the movement range of the parts holding head 302 by the parts holding head moving device 300. On the other hand, when the parts carrier 388 slides toward the parts supply unit 82, it slides to a parts supply position located within the movement range of the work heads 60 and 62 by the work head moving device 64.
[0033] Furthermore, the shuttle device 304 is equipped with a detection sensor 432. The detection sensor 432 detects vertical displacement of the lead component 410 placed on the component receiving member 392, that is, the lifting of the lead component 410 in the component receiving recess 416 of the component receiving member 392, and is composed of a light-emitting unit 434 and a light-receiving unit 436. The light-emitting unit 434 and the light-receiving unit 436 are located at the ends of the Y-direction moving device 312 and face each other with the two shuttle devices 304 in between. The light-receiving unit 436 receives the light emitted from the light-emitting unit 434.
[0034] Furthermore, the light-emitting unit 434 and the light-receiving unit 436 are positioned so that light passes over all the component receiving members 392 of the two shuttle devices 304, and the vertical displacement of the lead component placed on at least one of the component receiving members 392 is detected by the detection sensor 432. Specifically, as shown in Figure 12, the light-emitting unit 434 and the light-receiving unit 436 are positioned so that light passes slightly above the upper surface of the lead component 410 placed on the component receiving member 392, for example, 0.5 mm above. Note that there are a total of 10 component receiving members 392 in the two shuttle devices 304, but only 4 component receiving members 392 are shown in Figures 12 and 13.
[0035] Then, as the component receiving member 392 on which the lead component 410 is placed moves from the component receiving position where the lead component is placed in the component receiving recess 416 to the component supply position, it is detected whether or not the lead component on the component receiving member 392 is misaligned vertically. In other words, when the lead component 410 placed on the component receiving member 392 is not floating in the component receiving recess 416, as shown in Figure 12, the light emitted from the light emitting unit 434 is received by the light receiving unit 436, and it is determined that it is properly positioned and placed. On the other hand, when the lead component 410 placed on the component receiving member 392 is floating in the component receiving recess 416, as shown in Figure 13, the light emitted from the light emitting unit 434 is blocked by the vertically misaligned lead component 410, and it is determined that it is not properly positioned and placed. This makes it possible to appropriately determine whether or not the lead component placed on the component receiving member 392 is properly housed in the component receiving recess 416 in the correct orientation.
[0036] Furthermore, as shown in Figure 11, the control device 34 includes a central control device 450, a plurality of individual control devices (only one is shown in the figure) 452, and an image processing device 454. The central control device 450 is mainly composed of a computer and is connected to the substrate transport and holding device 22, the component mounting device 24, the imaging device 26, the imaging device 28, the component supply device 30, and the loose component supply device 32. In this way, the central control device 450 controls the substrate transport and holding device 22, the component mounting device 24, the imaging device 26, the imaging device 28, the component supply device 30, and the loose component supply device 32 in a centralized manner. The plurality of individual control devices 452 are mainly composed of computers and are provided corresponding to the substrate transport and holding device 22, the component mounting device 24, the imaging device 26, the imaging device 28, the component supply device 30, and the loose component supply device 32 (only the individual control device 452 corresponding to the loose component supply device 32 is shown in the figure).
[0037] The individual control device 452 of the loose parts supply device 32 is connected to the imaging device 84, the parts scattering device 90, the parts returning device 92, the parts holding head moving device 300, the parts holding head 302, and the shuttle device 304. This allows the individual control device 452 of the loose parts supply device 32 to control the imaging device 84, the parts scattering device 90, the parts returning device 92, the parts holding head moving device 300, the parts holding head 302, and the shuttle device 304. Furthermore, the image processing device 454 is connected to the camera 290 and processes the image data captured by the camera 290. This image processing device 454 is connected to the individual control device 452 of the loose parts supply device 32. As a result, the individual control device 452 of the loose parts supply device 32 acquires the image data captured by the camera 290.
[0038] Furthermore, the loose parts supply device 32 has a storage device 458. The storage device 458 is connected to an individual control device 452 and stores various information according to commands from the individual control device 452.
[0039] The component mounting machine 10 performs component mounting on the circuit board 12 held by the substrate transport and holding device 22, according to the configuration described above. Specifically, the circuit board 12 is transported to the work position and fixedly held there by the clamping device 52. Next, the imaging device 26 moves above the circuit board 12 and images the circuit board 12. This provides information regarding the error in the holding position of the circuit board 12. The component supply device 30 or the loose component supply device 32 supplies components at a predetermined supply position. The supply of components by the loose component supply device 32 will be explained in detail later. Then, either the work head 60 or 62 moves above the component supply position and holds the component with a suction nozzle. Subsequently, the work head 60 or 62 holding the component moves above the imaging device 28, and the imaging device 28 images the component held by the suction nozzle. This provides information regarding the error in the holding position of the component. Then, the work heads 60 and 62, which hold the components, move above the circuit board 12 and mount the components they are holding onto the circuit board 12, correcting for any errors in the holding position of the circuit board 12, errors in the holding position of the components, etc.
[0040] Next, the supply of parts by the loose parts supply device 32 will be explained. In the loose parts supply device 32, lead parts 410 are fed into the input port 97 of the parts supplyer 88 by an operator, and the fed lead parts 410 are supplied in a state where they are placed on the parts receiving member 392 of the parts carrier 388 by the operation of the parts supply unit 82 and the parts transfer device 86.
[0041] In detail, the operator feeds multiple lead parts 410 of the same type, that is, multiple lead parts 410 of the same shape, into the input opening 97 on the top surface of the parts feeder 88. At this time, the parts support member 150 is moved below the parts feeder 88 by the operation of the parts support member moving device 152 and is in a stored state (see Figure 6). When the parts support member 150 is stored, the parts storage container 180, which is located at the front end of the parts support member 150, is located in front of the parts feeder 88 and is in a position with the opening of the parts storage container 180 facing upward (storage position).
[0042] The lead component 410 introduced from the inlet 97 of the component feeder 88 falls onto the inclined plate 104 of the component feeder 88 and rolls down to the lower end on the front side of the inclined plate 104. At this time, the lead component 410 that has rolled down to the lower end on the front side of the inclined plate 104 accumulates between the lower end on the front side of the inclined plate 104 and the lower end on the rear side of the conveyor device 106. Then, the conveyor belt 112 of the conveyor device 106 rotates counterclockwise in FIG. 6. As a result, the lead components 410 accumulated between the inclined plate 104 and the conveyor belt 112 are conveyed obliquely upward by the conveyor belt 112.
[0043] Then, the lead component 410 conveyed by the conveyor belt 112 falls from the upper end on the front side of the conveyor device 106 onto the inclined plate 126. The lead component 410 that has fallen onto the inclined plate 126 rolls down backward on the inclined plate 126 and falls onto the inclined plate 128. The lead component 410 that has fallen onto the inclined plate 128 rolls forward and is discharged from the discharge port 98 on the front side of the component feeder 88.
[0044] As a result, the lead component 410 discharged from the discharge port 98 of the component feeder 88 is accommodated inside the component storage container 180. When a predetermined amount of the lead component 410 is discharged from the component feeder 88, that is, when the conveyor device 106 operates a certain amount, the conveyor device 106 stops. Next, the component support member 150 moves forward from the storage state by the operation of the component support member moving device 152.
[0045] When the component support member 150 has moved forward a predetermined amount from the storage state, the container swing device 181 of the component return device 92 operates, and the component storage container 180 swings. As a result, the posture of the component storage container 180 rapidly changes from the posture with the opening facing upward (storage posture) to the posture with the opening facing the stage 156 (return posture). At this time, the lead components 410 accommodated in the component storage container 180 are rapidly discharged toward the stage 156. As a result, lead components 410 of the same shape are scattered on the stage 156 as shown in FIG. 14 from the component storage container 180.
[0046] The lead components 410 of the same shape are scattered on the stage 156, but the lead components 410 are scattered on the stage 156 in roughly four orientations. Specifically, in the first orientation, the lead components 410 are scattered with the protruding surfaces of the leads 414 facing sideways and the two leads 414 generally aligned horizontally. In the second orientation, the lead components 410 are scattered with the protruding surfaces of the leads 414 facing sideways and the two leads 414 generally aligned vertically. In the third orientation, the lead components 410 are scattered with the protruding surfaces of the leads 414 facing upward. In the fourth orientation, the lead components 410 are scattered with two or more lead components 410 overlapping. The four positions in which the lead components 410 are scattered will be described as lead component 410a in the first position, lead component 410b in the second position, lead component 410c in the third position, and lead component 410d in the fourth position.
[0047] When the lead components 410 are scattered on the stage 156 as described above, the camera 290 of the imaging device 84 moves above the component support member 150 by the operation of the camera moving device 292. Then, the camera 290 images the lead components 410 of the same shape that are scattered on the stage 156. Since the field of view of the camera 290, that is, the imaging range, is wider than the stage 156, the camera 290 images the entire stage 156, that is, all the lead components 410 scattered on the stage 156, at once. In other words, the camera 290 images all the lead components 410 scattered on the stage 156 at once while keeping them within its imaging range. Then, based on the imaging data captured by the camera 290, the individual control device 452 identifies the lead components to be picked up by pattern matching.
[0048] Specifically, the individual control device 452 identifies the outer outline of the lead component 410 based on the imaging data of the lead component 410 captured by the camera 290, and calculates the shape of the upper surface of the lead component 410, that is, the shape from the viewpoint above the lead component 410. On the other hand, as shown in FIG. 15, the storage device 458 stores model data corresponding to the outer outline of the lead component 410a in the first posture.
[0049] Then, the individual control device 452 calculates the shape of the upper surface of the lead component 410 based on the imaging data of the lead component 410 captured by the camera 290, and determines whether the calculated shape of the upper surface of the lead component 410 matches the model data stored in the storage device 458. When the calculated shape of the upper surface of the lead component 410 matches the model data, the individual control device 452 sets the lead component 410 that matches the shape of the upper surface of the lead component 410 as the component to be picked up.
[0050] That is, the lead component 410a in the first posture is set as the component to be picked up, and the lead component 410b in the second posture, the lead component 410c in the third posture, and the lead component 410d in the fourth posture are not set as the components to be picked up. This is because in the lead component 410b in the second posture, the area of the upper surface is small, so the lead component 410b cannot be properly held by the suction nozzle 332. Also, in the lead component 410c in the third posture, the lead 414 is arranged on the upper surface, and the lead 414 gets in the way and the lead component 410c cannot be properly held by the suction nozzle 332. Also, in the lead component 410d in the fourth posture, due to reasons such as the upper surface of the lead component 410d not being horizontal, the lead component 410d cannot be properly held by the suction nozzle 332.
[0051] The individual control device 452 then calculates the position information of the lead component 410, which has been set as the component to be picked up, based on the imaging data. Next, based on the calculated position information of the component to be picked up, the component holding head 302 moves above the component to be picked up by the operation of the component holding head moving device 300, and the suction nozzle 332 picks up and holds the component to be picked up. Note that when the component to be picked up is picked up and held by the suction nozzle 332, the suction nozzle 332 is in a non-rotating position.
[0052] Next, after the suction nozzle 332 has grasped the lead component 410, which is the part to be picked up, the part holding head 302 moves above the part carrier 388. At this time, the part carrier 388 is moved to the part receiving position by the operation of the part carrier moving device 390. Also, as the part holding head 302 moves above the part carrier 388, the suction nozzle 332 rotates to the pivot position. The suction nozzle 332 rotates by the operation of the nozzle rotating device 335 so that the lead 414 of the lead component 410 held by the suction nozzle 332 in the pivot position faces downward in the vertical direction.
[0053] As the part holding head 302 moves above the part carrier 388, the part holding head 302 descends and inserts the lead part 410, with its lead 414 facing downward in the vertical direction, into the part receiving recess 416 of the part receiving member 392. As a result, the lead part 410 is placed on the part receiving member 392 with its lead 414 facing downward in the vertical direction, as shown in Figure 10. In this way, the part holding head 302 picks up the lead part 410 from the stage 156 and transfers the picked-up lead part 410 to the part receiving member 392.
[0054] Then, when the leaded component 410 is transferred to the component receiving member 392, the component carrier 388 moves to the component supply position by the operation of the component carrier moving device 390. Since the component supply position is located within the movement range of the work heads 60 and 62, the loose component supply device 32 supplies the leaded component 410 to the component mounting machine 10 at this position. In this way, the loose component supply device 32 supplies the leaded component 410 with the lead 414 facing downwards and the upper surface facing upwards, opposite the bottom surface to which the lead 414 is connected. Therefore, the suction nozzles of the work heads 60 and 62 can properly hold the leaded component 410.
[0055] Furthermore, when the lead component 410 is floating on the component receiving member 392, that is, when it is shifted vertically, the upper surface of the lead component 410 becomes inclined, as shown in Figure 13. In this state, the suction nozzles of the work heads 60 and 62 cannot properly hold the lead component 410. For this reason, as described above, the loose component supply device 32 uses the detection sensor 432 to determine whether the lead component 410 placed on the component receiving member 392 is shifted vertically. If it is determined that the lead component 410 placed on the component receiving member 392 is shifted vertically, the operation of the loose component supply device 32 stops and an error notification is issued. On the other hand, if it is determined that the lead component 410 placed on the component receiving member 392 is not shifted vertically, the component receiving member 392 supplies the lead component at the component supply position. Then, the suction nozzles of the work heads 60 and 62 hold the lead component 410 placed on the component receiving member 392, and the suction nozzles holding the lead component 410 perform the attachment work to the circuit board 12.
[0056] In this way, the loose parts supply device 32 supplies lead parts by having the part holding head 302 hold the lead parts 410 from the stage 156 and place them on the part receiving members 392. In the loose parts supply device 32, the part receiving members 392 on which the lead parts 410 held from the stage 156 are placed are predetermined. Specifically, as described above, the loose parts supply device 32 is equipped with five stages 156 and ten part receiving members 392. Conventionally, regardless of the type of part, the ratio of the number of stages 156 to the number of part receiving members 392 was set to a constant value. For this reason, conventionally, the ratio of the number of stages 156 to the number of part receiving members 392 was set to 1:2, and two part receiving members 392 were set for each stage 156. However, if the ratio of the number of stages 156 to the number of part receiving members 392 is set to a constant value regardless of the type of part, it is not possible to supply parts efficiently.
[0057] For details, please refer to Figure 16. While the loose component supply device 32 actually has five stages 156 and ten component receiving members 392, for the sake of simplicity, we will describe the case where three stages 156 and three component receiving members 392 are provided. Furthermore, for example, in order to create a predetermined circuit board 12 in the component mounting machine 10, 100 leaded components 410A and 1 leaded component 410B may be required. In such cases, where the number of leaded components 410A to be supplied is large and the number of leaded components 410B to be supplied is small, it is preferable that the leaded components 410A are supplied from two stages 156 and the leaded component 410B are supplied from one stage 156.
[0058] However, since leaded components 410A are small and many can be scattered on the stage 156, the probability of a leaded component 410A being in the first position among those scattered on the stage 156, that is, the probability of it being the component to be picked up, is high. On the other hand, since leaded components 410B are large and many can not be scattered on the stage 156, the probability of a leaded component 410B being in the first position among those scattered on the stage 156, that is, the probability of it being the component to be picked up, is low. For this reason, leaded components 410A are supplied from one stage 156a, and leaded components 410B are supplied from two stages 156b and 156c. In other words, leaded components 410A are scattered on one stage 156a, and leaded components 410B are scattered on two stages 156b and 156c.
[0059] In conventional methods, regardless of the type of part, the ratio of the number of stages 156 to the number of part receiving members 392 is set to 1:1. Therefore, part receiving member 392a is set as a platform for placing parts from stage 156a, part receiving member 392b is set as a platform for placing parts from stage 156b, and part receiving member 392c is set as a platform for placing parts from stage 156c. For this reason, part receiving member 392a has a part receiving recess 416A shaped to match the lead part 410A, and part receiving members 392b and 392c have part receiving recess 416B shaped to match the lead part 410B.
[0060] Thus, in the conventional method, regardless of the type of part, the ratio of the number of stages 156 to the number of part receiving members 392 is set to 1:1. However, since 100 lead parts 410A are needed, the part receiving member 392a needs to make 100 round trips between the part receiving position and the part supply position. On the other hand, since only one lead part 410B is needed, either the part receiving member 392b or the part receiving member 392c only needs to make one round trip between the part receiving position and the part supply position. In this way, if the part receiving member 392a makes 100 round trips to supply the lead part 410A, and either the part receiving member 392b or the part receiving member 392c makes only one round trip to supply the lead part 410B, then it is not possible to supply parts efficiently.
[0061] In light of these considerations, the ratio of the number of stages 156 to the number of component receiving members 392 in the loose component supply device 32 is arbitrarily set for each component. Specifically, as shown in Figure 17, component receiving members 392a and 392b are set as loading platforms on which components are placed from stage 156a, and component receiving member 392c is set as a loading platform on which components are placed from stage 156b and stage 156c. In other words, the ratio of the number of stages 156a on which lead components 410A are scattered to the number of component receiving members 392a and 392b on which lead components 410A are placed is set to 1:2. On the other hand, the ratio of the number of stages 156b and 156c on which lead components 410B are scattered to the number of component receiving members 392c on which lead components 410B are placed is set to 2:1.
[0062] Furthermore, component receiving recesses 416A shaped to match the lead component 410A are formed in component receiving members 392a and 392b, and component receiving recesses 416B shaped to match the lead component 410B are formed in component receiving member 392c. In addition, six component receiving recesses 416A are formed in each of component receiving members 392a and 392b. In this way, with respect to the lead component 410A, two component receiving members 392b and 392c are set for one stage 156a, and six component receiving recesses 416A are formed in each of the two component receiving members 392a and 392b, it is possible to significantly reduce the number of reciprocating movements of component receiving members 392a and 392b. Specifically, when six leaded components 410A are placed on the component receiving members 392a and 392b and then moved to the component supply device, the number of round trips of the component receiving members 392a and 392b when supplying 100 leaded components 410A is 9 (8.33 = 100 / (2 × 6)), which is less than 1 / 10 of the conventional number. This makes it possible to efficiently supply components in the loose component supply device 32.
[0063] Furthermore, with respect to the lead components 410A, two component receiving members 392b and 392c are provided for one stage 156a, and six component receiving recesses 416A are formed in each of the two component receiving members 392a and 392b. As a result, the lead components 410A are preferentially placed on one of the two component receiving members 392a and 392b. After six lead components 410A have been placed on one of the two component receiving members 392a and 392b, the lead components 410A are then placed on the other component receiving member 392a and 392b. In this way, by preferentially placing the lead components 410A on one of the two component receiving members 392a and 392b, components can be supplied even more efficiently.
[0064] In more detail, when lead components 410A are preferentially placed on one of the two component receiving members 392a and 392b, six lead components 410A are placed on one component receiving member 392, and then lead components 410A are placed on the other component receiving member 392. Therefore, one component receiving member 392 with six lead components 410A placed on it is moved to the component supply position, and while that component receiving member 392 is moving to the supply position, lead components 410A can be placed on the other component receiving member 392 at the component receiving position. This makes it possible to continuously perform the operation of placing lead components 410A on the component receiving members 392 and to sequentially move the component receiving members 392 with lead components 410A placed on them to the component supply position, thereby enabling more efficient component supply.
[0065] Incidentally, the component receiving members 392a and 392b are shaped like steps, as shown in Figure 18. Figure 18 includes diagrams showing the component receiving members 392a and 392b from a top view and from a side view. More specifically, the component receiving members 392a and 392b are generally block-shaped, and the upper surfaces of the component receiving members 392a and 392b are stepped surfaces divided into an upper section 460 and a lower section 462. Three component receiving recesses 416A are formed side by side on the upper section 460, and three component receiving recesses 416A are formed side by side on the lower section 462.
[0066] Furthermore, the component receiving members 392a and 392b are configured to have a priority order for when lead components 410A are placed. Specifically, the priority order for when lead components 410A are placed is set such that the three component receiving recesses 416A on the upper section 460 are given a higher priority than the three component receiving recesses 416A on the lower section 462. By setting this priority order for when lead components 410A are placed, the cycle time can be shortened.
[0067] Specifically, when the component holding head 302 places the lead component 410A into the component receiving recess 416A, it descends from above the component receiving recess 416A toward the component receiving recess 416A. At this time, the descending distance when the component holding head 302 places the lead component 410 into the upper component receiving recess 416A of the upper stage 460 is shorter than the descending distance when the component holding head 302 places the lead component 410 into the lower component receiving recess 416A of the lower stage 462. As a result, the lead component 410A is preferentially placed into the upper component receiving recess 416A of the upper stage 460 over the lower component receiving recess 416A of the lower stage 462, thereby shortening the cycle time when the component holding head 302 places the lead component into the component receiving recess 416A.
[0068] Furthermore, if the component holding head 302 places the lead component 410A in the component receiving recess 416A of the lower stage 462 with priority over the component receiving recess 416A of the upper stage 460, the detection sensor 432 needs to confirm whether the lead component 410A is housed in the component receiving recess 416A of the lower stage 462 in the correct orientation. Specifically, if the lead component 410A is placed in the component receiving recess 416A of the lower stage 462 with priority over the component receiving recess 416A of the upper stage 460, the lead component 410A will be placed in the component receiving recess 416A of the upper stage 460 while the lead component 410A is already placed in the component receiving recess 416A of the lower stage 462. In such a case, if there is any gap in the lead component 410A placed in the component receiving recess 416A of the lower stage 462, there is a risk that the lead component 410A placed in the component receiving recess 416A of the upper stage 460 may interfere with the lead component 410A placed in the component receiving recess 416A of the lower stage 462. For this reason, after the lead component 410A is placed in the component receiving recess 416A of the lower stage 462, it is necessary to check with the detection sensor 432 whether the lead component 410A is housed in the component receiving recess 416A of the lower stage 462 in the correct orientation. In order to check with the detection sensor 432 whether the lead component 410A is housed in the component receiving recess 416A of the lower stage 462 in the correct orientation, it is necessary to move the component receiving recess 416A to the position where the detection sensor 432 is installed.
[0069] On the other hand, if the lead component 410A is preferentially placed in the component receiving recess 416A of the upper stage 460 over the component receiving recess 416A of the lower stage 462, then the lead component 410A will be placed in the component receiving recess 416A of the lower stage 462 while the lead component 410A is already placed in the component receiving recess 416A of the upper stage 460. In such a case, even if there is some gap in the lead component 410A placed in the component receiving recess 416A of the upper stage 460, the lead component 410A placed in the component receiving recess 416A of the lower stage 462 will not interfere with the lead component 410A placed in the component receiving recess 416A of the upper stage 460. Therefore, the lead component 410A is preferentially placed in the component receiving recess 416A of the upper stage 460 over the component receiving recess 416A of the lower stage 462. As a result, when the lead component 410A is placed in the component receiving recess 416A, it is no longer necessary to move the component receiving recess 416A to the position where the detection sensor 432 is located, thus shortening the cycle time.
[0070] Furthermore, the priority for placing lead components 410A is set such that the leftmost of the three component receiving recesses 416A in both the upper 460 and lower 462 has a higher priority. By setting this priority for placing lead components 410A, the cycle time can be shortened. Specifically, as shown in Figure 17, the distance between the component receiving recess 416A and the stage 156a is shorter the further to the left the component receiving recess 416A is located on the component receiving member 392. This tendency is particularly strong on the component receiving member 392b. Therefore, by setting the priority so that the leftmost of the three component receiving recesses 416A in both the upper 460 and lower 462 has a higher priority, the cycle time when the component holding head 302 places lead components on the component receiving recesses 416A is shortened.
[0071] Therefore, in the component receiving members 392a and 392b, the priority order for placing the lead component 410A is set in the order of component receiving recess 416A1, component receiving recess 416A2, component receiving recess 416A3, component receiving recess 416A4, component receiving recess 416A5, and component receiving recess 416A6. In addition, a priority order is also set when the work heads 60 and 62 hold the lead component 410A from the component receiving members 392a and 392b at the component supply position, and this priority order is the same as the priority order when the lead component 410A is placed.
[0072] Furthermore, when the work heads 60 and 62 hold the lead components 410A from the component receiving members 392a and 392b at the component supply position, the work heads 60 and 62 are configured to hold six lead components 410A from the component receiving members 392a and 392b using six suction nozzles. In other words, one component receiving member 392 has six component receiving recesses 416A formed therein, and one component receiving member 392 can supply six lead components 410A at once at the component supply position. Therefore, by having the work heads 60 and 62 hold six lead components 410A from one component receiving member 392 using six suction nozzles, the time required to attach the lead components 410A to the circuit board 12 can be shortened.
[0073] Furthermore, as shown in Figure 17, a 2D code 470 is inscribed on the component receiving member 392. The 2D code 470 contains information for acquiring information about the component receiving recess 416 formed in the component receiving member 392, and when the camera 290 images the 2D code 470, the individual control device 452 acquires information about the component receiving recess 416. Specifically, the storage device 458 of the individual control device 452 stores information about the component receiving recess 416. The information about the component receiving recess 416 includes the coordinates of the position where the component receiving recess 416 is formed in the component receiving member 392, the dimensions of the component receiving recess 416, and information about the component to be placed in the component receiving recess 416. The information about the component receiving recess 416 and the information indicating the component receiving member 392 in which the component receiving recess 416 is formed are associated and stored in the storage device 458. Therefore, in association with the component receiving member 392a, the position coordinates of the six component receiving recesses 416A formed in the component receiving member 392a, the dimensions of the component receiving recesses 416A formed in the component receiving member 392a, and information on the lead component 410A placed in the component receiving recesses 416A are stored. Similarly, in association with the component receiving member 392b, the position coordinates of the six component receiving recesses 416A formed in the component receiving member 392b, the dimensions of the component receiving recesses 416A formed in the component receiving member 392b, and information on the lead component 410A placed in the component receiving recesses 416A are stored. Furthermore, in association with the component receiving member 392c, the position coordinates of the one component receiving recess 416B formed in the component receiving member 392c, the dimensions of the component receiving recess 416B formed in the component receiving member 392c, and information on the lead component 410B placed in the component receiving recess 416B are stored.
[0074] Furthermore, the 2D code 470 contains coded information indicating the component receiving member 392 on which the 2D code 470 is written. In other words, the 2D code 470a written on component receiving member 392a contains coded information indicating component receiving member 392a. Similarly, the 2D code 470b written on component receiving member 392b contains coded information indicating component receiving member 392b. And the 2D code 470c written on component receiving member 392c contains coded information indicating component receiving member 392c.
[0075] Furthermore, 2D code 470 is assigned to one component receiving recess 416. Therefore, one 2D code 470c is assigned to one component receiving recess 416B on the component receiving member 392c. On the other hand, one 2D code 470a and one 470b are assigned to each of the six component receiving recesses 416A on the component receiving members 392a and 392b. In other words, six 2D codes 470a and 470b are assigned to the component receiving members 392a and 392b. Thus, the 2D codes 470a and 470b of component receiving members 392a and 392b, which have multiple component receiving recesses 416A formed thereon, also encode information indicating which of the multiple component receiving recesses 416A it is (hereinafter referred to as "receiving recess No."). The receiving recess No. is the same number as the priority order mentioned above. In other words, the 2D codes 470a and 470b corresponding to the component receiving recess 416A1 (see Figure 18) encode receiving recess No. 1. Also, the 2D codes 470a and 470b corresponding to the component receiving recess 416A6 (see Figure 18) encode receiving recess No. 6.
[0076] Therefore, for example, when camera 290 captures a 2D code 470a, the individual control device 452 calculates information indicating the component receiving member 392a and the receiving recess No. from the captured data of the 2D code 470a. In this case, for example, when camera 290 captures a 2D code 470a corresponding to the component receiving recess 416A1 (see Figure 18), the individual control device 452 calculates information indicating the component receiving member 392a and the receiving recess No. 1 from the captured data of the 2D code 470a. Then, the individual control device 452 extracts information about the component receiving recess 416A stored in the storage device 458 in association with the information indicating the component receiving member 392a. The information about the component receiving recess 416A includes the position coordinates of the six component receiving recesses 416A, and the position coordinates of each of the six component receiving recesses 416A are associated with the receiving recess No. Therefore, the individual control device 452 associates the position coordinates of the component receiving recess 416A1, which is associated with the calculated receiving recess No. 1, with the component receiving member 392a and stores this as placement information for the lead component 410A. The information regarding the component receiving recess 416A also includes the dimensions of the component receiving recess 416A and information about the lead component 410A to be placed in the component receiving recess 416A. Therefore, the individual control device 452 associates the position coordinates of the component receiving recess 416A1, the dimensions of the component receiving recess 416A, the information about the lead component 410A to be placed in the component receiving recess 416A, and the component receiving member 392a and stores this as placement information for the lead component 410.
[0077] Furthermore, the camera 290 also captures images of the 2D codes 470a that correspond to each of the five component receiving recesses 416A of the component receiving member 392a, excluding the component receiving recess 416A1 (see Figure 18). The individual control device 452 then performs the same processing as the processing for the captured data of the 2D code 470a corresponding to the component receiving recess 416A1. As a result, the individual control device 452 associates the position coordinates of each of the component receiving recesses 416A1 to 416A6, the dimensions of the component receiving recess 416A, the information of the lead component 410A placed in the component receiving recess 416A, and the component receiving member 392a, and stores this information in the storage device as information on the placement of the lead component 410A on the component receiving member 392a.
[0078] Furthermore, the camera 290 also captures images of the 2D codes 470b that are written on each of the six component receiving recesses 416A of the component receiving member 392b. The individual control device 452 then performs the same processing as described above for the image data of the 2D codes 470a. As a result, the individual control device 452 associates the position coordinates of each of the six component receiving recesses 416A, the dimensions of the component receiving recesses 416A, the information of the lead component 410A placed in the component receiving recesses 416A, and the component receiving member 392b, and stores this information in the storage device as information on the placement of the lead component 410A on the component receiving member 392b.
[0079] Furthermore, the camera 290 captures the 2D code 470c of the component receiving member 392c, and the individual control device 452 calculates information indicating the component receiving member 392c from the captured data of the 2D code 470c. The individual control device 452 then extracts information regarding the component receiving recess 416B stored in the storage device 458 in association with the information indicating the component receiving member 392c. At this time, the individual control device 452 associates the extracted information regarding the component receiving recess 416B with the component receiving member 392c and stores it as information regarding the placement of the lead component 410B on the component receiving member 392c. The information regarding the component receiving recess 416B includes the position coordinates of the component receiving recess 416B, the dimensions of the component receiving recess 416B, and information regarding the lead component 410B to be placed in the component receiving recess 416B.
[0080] Furthermore, the imaging of the 2D code 470 and the storage of the information on the placement of the lead component 410 on the component receiving member 392 in the storage device are performed before the supply operation is executed by the loose component supply device 32. Then, when the supply operation is executed by the loose component supply device 32 and the lead component 410 held by the component holding head 302 from the stage 156 is placed on the component receiving member 392, the placement operation of the lead component 410 is performed based on the placement information stored in the storage device. In other words, for example, when the lead component 410A held by the component holding head 302 from the stage 156a is placed on the component receiving member 392a, the placement operation of the lead component 410A is performed based on the placement information for the component receiving member 392a stored in the storage device. Specifically, when the lead component 410A held by the component holding head 302 is placed in the component receiving recess 416A1 of the component receiving member 392a, the individual control device 452 controls the operation of the component holding head moving device 300 based on the position coordinates of the component receiving recess 416A1 and the dimensions of the component receiving recess 416A included in the placement information to the component receiving member 392a. This ensures that the lead component 410A held by the component holding head 302 is properly placed in the component receiving recess 416A1 of the component receiving member 392a.
[0081] Furthermore, for example, when the component holding head 302 places the lead component 410B, which it has held from the stage 156c, onto the component receiving member 392c, the placement of the lead component 410B is performed based on the placement information for the component receiving member 392c stored in the storage device. At this time, when the component holding head 302 places the lead component 410B it has held onto the component receiving recess 416B of the component receiving member 392c, the individual control device 452 controls the operation of the component holding head moving device 300 based on the position coordinates of the component receiving recess 416B and the dimensions of the component receiving recess 416B included in the placement information for the component receiving member 392c. This ensures that the lead component 410B it has held onto the component receiving recess 416B of the component receiving member 392c is placed appropriately.
[0082] Furthermore, the individual control unit 452 transmits the placement information stored in the storage device 458 to the central control unit 450. The central control unit 450 then performs the operation of holding the lead component 410 from the component receiving member 392 based on the position coordinates and dimensions of the component receiving recess 416 included in the placement information. In other words, when the work heads 60 and 62 in the component mounting machine 10 hold the lead component 410 from the component receiving member 392 at the component supply position, the central control unit 450 controls the operation of the work head moving device 64 based on the position coordinates and dimensions of the component receiving recess 416 included in the placement information. This allows the work heads 60 and 62 to properly hold the lead component 410 placed in the component receiving recess 416 of the component receiving member 392.
[0083] Furthermore, the 2D code 470 contains not only information about the component receiving member 392 but also information about the 2D code 470 itself. The individual control device 452 uses the information about the 2D code 470 to read one or more 2D codes 470 written on the component receiving member 392.
[0084] Specifically, since the imaging range of the camera 290 is larger than the outer dimensions of the component receiving member 392, the camera 290 images the entirety of one component receiving member 392 in a single image. When the camera 290 images the entirety of one component receiving member 392 in this way, one or more 2D codes 470 written on the component receiving member 392 are captured. The individual control device 452 then analyzes the image data of one or more 2D codes 470 to obtain the information indicated by the 2D codes 470. However, in conventional methods, even if multiple 2D codes 470 are written on the component receiving member 392, the individual control device 452 can only recognize one 2D code 470 when analyzing the image data, and therefore could not analyze multiple 2D codes 470.
[0085] More specifically, as shown in Figure 19, the component receiving member 392c has one 2D code 470c marked on it. When the camera 290 images the component receiving member 392c, the image data contains only the image data of one 2D code 470c. Therefore, when the individual control device 452 analyzes the image data of the component receiving member 392c, it can recognize one 2D code 470c and perform analysis on that 2D code 470c. On the other hand, the component receiving member 392a has six 2D codes 470a marked on it. When the camera 290 images the component receiving member 392a, the image data contains the image data of six 2D codes 470a. Therefore, when the individual control device 452 analyzes the image data of the component receiving member 392a, it can randomly recognize only one of the six 2D codes 470a and perform analysis on that one 2D code 470a, but it cannot analyze the remaining five 2D codes 470a. Furthermore, even if the individual control device 452 analyzes the image data of the component receiving member 392a again, it randomly recognizes one 2D code 470a when recognizing a 2D code 470a, so there is a risk that it will recognize the same 2D code 470a that was previously analyzed. In other words, even if the individual control device 452 analyzes the image data of the component receiving member 392a again, it cannot recognize any one 2D code 470a from the five 2D codes 470a that have not been analyzed. For this reason, with the conventional method, the individual control device 452 was unable to analyze all six 2D codes 470a when analyzing the image data of the component receiving member 392a which has six 2D codes 470a written on it. Similarly, the individual control device 452 was unable to analyze all six 2D codes 470b for the component receiving member 392b.
[0086] In light of this, the 2D code 470 contains coded code count information for obtaining the number of 2D codes 470 inscribed on the component receiving member 392. For example, when the camera 290 images the component receiving member 392c and the individual control device 452 analyzes the image data of the component receiving member 392c, it recognizes one 2D code 470c inscribed on the component receiving member 392c and analyzes that 2D code 470c. At this time, the individual control device 452 calculates that the code count information is 1. In other words, the individual control device 452 calculates that only one 2D code 470 is inscribed on the component receiving member 392c. Therefore, once the analysis of one 2D code 470c is complete, the individual control device 452 determines that the analysis of all 2D codes 470c inscribed on the component receiving member 392c is complete and terminates the analysis of the 2D codes 470c on the component receiving member 392c.
[0087] Furthermore, for example, when camera 290 images the component receiving member 392a and the individual control device 452 analyzes the image data of the component receiving member 392a, it randomly recognizes one of the six 2D codes 470a written on the component receiving member 392a and analyzes that 2D code 470a. At this time, the individual control device 452 calculates that the code count information is 6. In other words, the individual control device 452 calculates that there are six 2D codes 470a written on the component receiving member 392a. Therefore, once the analysis of one 2D code 470c is completed, the individual control device 452 determines that only one of the six 2D codes 470a written on the component receiving member 392c has been analyzed and continues the analysis of the 2D codes 470a on the component receiving member 392a.
[0088] As mentioned above, the 2D code 470a contains coded information indicating the component receiving member 392a. When the individual control device 452 analyzes the 2D code 470a, it calculates the information indicating the component receiving member 392a. The storage device 458 also stores area information for each component receiving member 392, indicating the area where each of the multiple 2D codes 470 is written, in cases where multiple 2D codes 470 are written on the component receiving member 392. For example, as area information for the component receiving member 392a, the storage device 458 stores information indicating the area demarcated by the dotted line in the component receiving member 392a in Figure 19, that is, six individual areas demarcated in a 2x3 grid. Therefore, when the individual control device 452 calculates the information indicating the component receiving member 392a by analyzing one 2D code 470a, it extracts the area information stored in association with the component receiving member 392a. In this case, the individual control device 452 extracts information indicating the individual areas demarcated in a 2x3 grid.
[0089] Furthermore, the individual control device 452 calculates the position of the 2D code 470a that has been analyzed based on the imaging data and identifies an individual area that includes the position of that 2D code 470a. Next, the individual control device 452 excludes the identified individual area from the six individual areas to identify five individual areas. Subsequently, the individual control device 452 analyzes each of the five individual areas and recognizes one 2D code 470a from each individual area. Then, by analyzing the 2D code 470a recognized from each of the five individual areas, the individual control device 452 can analyze all six 2D codes 470a written on the component receiving member 392a. Similarly, the individual control device 452 can analyze all six 2D codes 470a written on the component receiving member 392b by analyzing it in the same way as the component receiving member 392a.
[0090] Thus, even if multiple 2D codes 470 are inscribed on the component receiving member 392, all of the multiple 2D codes 470 inscribed on the component receiving member 392 can be analyzed by utilizing the code count information and area information. When the individual control device 452 identifies five individual areas and recognizes and analyzes one 2D code 470 from each individual area, it may use the imaging data from when the first 2D code 470 was analyzed for analysis, or the camera 290 may image the component receiving member 392 again and use the newly captured imaging data for analysis.
[0091] Note that the loose parts supply device 32 is an example of a parts supply device. The stage 156 is an example of a stage. The camera 290 is an example of a code reader. The parts holding head 302 is an example of a holding head. The parts receiving member 392 is an example of a mounting table. The lead part 410 is an example of a part. The parts receiving recess 416 is an example of a mounting section. The individual control device 452 is an example of a code reader. The upper stage 460 is an example of an upper stage. The lower stage 462 is an example of a lower stage. The 2D code 470 is an example of an identification code.
[0092] In the embodiments described above, the following effects are achieved.
[0093] The loose parts supply device 32 comprises a plurality of stages 156, a parts holding head 302, and a plurality of parts receiving members 392. The stages 156 are on which lead parts 410 are scattered, and the parts holding head 302 holds the lead parts 410 scattered on any of the plurality of stages 156. The parts receiving members 392 are on which the lead parts 410 held by the parts holding head 302 are placed. The number of parts receiving members 392 on which the lead parts 410 held from the stages 156 are placed is predetermined, and the ratio of the number of stages 156 on which predetermined parts are scattered to the number of parts receiving members 392 on which predetermined parts are placed is arbitrarily set for each part. Specifically, the ratio of the number of stages 156a on which lead parts 410A are scattered to the number of parts receiving members 392a and 392b on which lead parts 410A are placed is set to 1:2. On the other hand, the ratio of the number of stages 156b and 156c on which the lead components 410B are scattered to the number of component receiving members 392c on which the lead components 410B are placed is set to 2:1. This makes it possible to efficiently supply components in the loose component supply device 32.
[0094] Furthermore, six component receiving recesses 416A for placing one component are provided on component receiving members 392a and 392b, among the multiple component receiving members 392. This makes it possible to place a large number of lead components 410 on component receiving members 392a and 392b, enabling the bulk component supply device 32 to supply components more efficiently.
[0095] Furthermore, in the component receiving members 392a and 392b, which have six component receiving recesses 416A formed thereon, three component receiving recesses 416A are arranged on the upper section 460 and three component receiving recesses 416A are arranged on the lower section 462. This allows the component holding head 302 to efficiently place the lead component 410 into the component receiving recesses 416A.
[0096] Furthermore, the component holding head 302 preferentially places the lead component 410 held from the stage 156 onto the component receiving recess 416A located on the upper stage 460 rather than the component receiving recess 416A located on the lower stage 462. This makes it possible to shorten the cycle time.
[0097] Furthermore, each of the multiple component receiving members 392 is provided with one or more component receiving recesses 416 for placing one component. Each of the multiple component receiving members 392 is marked with one or more 2D codes 470 for obtaining information about the component receiving recesses 416. This allows the lead component 410 to be properly placed in the component receiving recesses 416.
[0098] Furthermore, each of the one or more 2D codes 470 includes information for obtaining the number of each 2D code 470. This allows, for example, the individual control device 452 to recognize the number of 2D codes 470 to be analyzed.
[0099] Furthermore, each of the one or more 2D codes 470 includes information for acquiring the area in which each 2D code 470 is located. This allows the individual control device 452 to recognize the location of the 2D code 470 to be acquired.
[0100] Furthermore, the loose parts supply device 32 is equipped with an individual control device 452 that reads one or more 2D codes 470 from the imaging data. When multiple 2D codes 470 are written on the parts receiving member 392, the individual control device 452 reads one of the multiple 2D codes 470 and reads the other 2D codes 470 from the area information obtained based on the information contained in that one 2D code 470. In this way, the individual control device 452 can read all of the multiple 2D codes 470 written on the parts receiving member 392.
[0101] It should be noted that the present invention is not limited to the above embodiments, and can be implemented in various modified or improved forms based on the knowledge of those skilled in the art. Specifically, for example, although six component receiving recesses 416A are formed in the component receiving members 392a and 392b, any number of component receiving recesses 416A may be formed depending on the size of the component receiving members 392a and 392b.
[0102] Furthermore, in the above embodiment, 2D codes 470a and 470b are marked on the component receiving members 392a and 392b, which have six component receiving recesses 416A formed thereon, corresponding to each of the six component receiving recesses 416A. However, one 2D code may be marked for each of the six component receiving recesses 416A. In this case, one 2D code is marked for each of the six component receiving recesses 416A, and the positional information of the six component receiving recesses 416A is included in the one 2D code.
[0103] Furthermore, in the above embodiment, the individual control device 452 calculates information indicating the component receiving member 392 from the 2D code 470 and obtains location information of the component receiving recess 416 stored in the storage device 458 in association with the information indicating the component receiving member 392. In other words, the individual control device 452 indirectly obtains location information of the component receiving recess 416 based on the 2D code 470. On the other hand, the individual control device 452 may directly obtain location information of the component receiving recess 416 based on the 2D code 470. In other words, the location information of the component receiving recess 416 is encoded in the 2D code 470, and the individual control device 452 may obtain location information of the component receiving recess 416 by analyzing the 2D code 470. Alternatively, the individual control device 452 may directly obtain code number information and area information based on the 2D code 470. In other words, the code number information and area information are encoded in the 2D code 470, and the individual control device 452 may obtain code number information and area information by analyzing the 2D code 470.
[0104] Furthermore, although the present invention is applied to the leaded component 410 in the above embodiment, the present invention can be applied to various types of components. Specifically, for example, the present invention can be applied to components of solar cells, components of power modules, electronic circuit components without leads, and the like.
[0105] This specification also discloses a technical concept in which the "parts supply device described in claim 1" in claim 5 of the original application was changed to "parts supply device described in any one of claims 1 to 4".
[0106] 32: Loose parts supply device (parts supply device) 156: Stage 290: 2D camera (code reader) 302: Part holding head (holding head) 392: Part receiving member (mounting platform) 410: Lead part (part) 416: Part receiving recess (mounting part) 452: Individual control device (code reader) 460: Upper stage 462: Lower stage 470: 2D code (identification code)
Claims
1. A parts supply device comprising: a plurality of stages on which parts are scattered; a holding head for holding parts scattered on any of the plurality of stages; and a plurality of mounting tables on which parts held by the holding head are placed, wherein the number of mounting tables on which parts held from the stages are placed is predetermined, and the ratio of the number of stages on which predetermined parts are scattered to the number of mounting tables on which predetermined parts are placed is arbitrarily set for each part.
2. The parts supply device according to claim 1, wherein one or more of the plurality of mounting tables are provided with a plurality of mounting sections for mounting a single part.
3. The component supply device according to claim 2, wherein a mounting base having a plurality of the aforementioned mounting sections is provided, some of the mounting sections are arranged on the upper level, and the mounting sections other than the aforementioned portion are arranged on the lower level below the upper level.
4. The component supply device according to claim 3, wherein the holding head preferentially places the component held from the stage onto the mounting section arranged on the upper stage rather than the mounting section arranged on the lower stage.
5. The component supply device according to claim 1, wherein each of the plurality of mounting tables is provided with one or more mounting sections for mounting one component, and each of the plurality of mounting tables is marked with one or more identification codes for obtaining information about the aforementioned mounting section.
6. The component supply device according to claim 5, wherein each of the one or more identification codes includes information for obtaining the number of each identification code.
7. The component supply device according to claim 5 or 6, wherein each of the one or more identification codes includes information for obtaining the area on which each identification code is written.
8. A component supply device according to claim 7, comprising a code reader for reading one or more identification codes, wherein, when the one or more identification codes are multiple identification codes, the code reader reads one of the multiple identification codes and reads the identification codes other than the first identification code from an area obtained based on the information contained in the first identification code.