Polyarylene sulfide resin composition and molded article obtained by molding same

The polyarylene sulfide resin composition addresses color stability and moldability issues by blending specific resins and additives, enhancing hue stability and mechanical properties for diverse applications.

WO2026140720A1PCT designated stage Publication Date: 2026-07-02TEIJIN LTD

Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
TEIJIN LTD
Filing Date
2025-12-02
Publication Date
2026-07-02

AI Technical Summary

Technical Problem

Polyarylene sulfide resin exhibits poor color stability, moldability, and a balance between tensile strength and tensile fracture strain due to discoloration with heat and light, and mold release defects during injection molding.

Method used

A polyarylene sulfide resin composition comprising specific proportions of polyarylene sulfide resins with defined hue change, an olefin resin with functional groups, and a thermoplastic resin with a high cooling crystallization temperature, along with antioxidants, to enhance hue stability, moldability, and tensile properties.

Benefits of technology

The composition achieves excellent color stability, moldability, and improved tensile strength and fracture strain, suitable for various applications including semiconductor manufacturing and automotive parts.

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Abstract

The present invention provides: a polyarylene sulfide resin composition having excellent hue stability, moldability, tensile strength, and nominal tensile strain at break; and a molded article obtained by molding the same. A polyarylene sulfide resin composition according to the present invention contains: (A) 100 parts by weight of a resin component composed of 30 to 85 parts by weight of a polyarylene sulfide resin (component A-1) satisfying formula (I) and 70 to 15 parts by weight of a polyarylene sulfide resin (component A-2) satisfying formula (II); (B) 1 to 10 parts by weight of an olefin resin having a functional group capable of reacting with component A; and (C) 0.1 to 5 parts by weight of a thermoplastic resin other than component A, the thermoplastic resin having a cooling crystallization temperature of 160°C or higher. Formula (I): 2<ΔL*+Δa*+Δb*≤8. Formula (II): -6≤ΔL*+Δa*+Δb*≤0. (In formulae (I) and (II), ΔL*, Δa*, and Δb* respectively represent values obtained by subtracting L*, a*, and b* of a molded article that is injection-molded at a cylinder temperature of 290°C from L*, a*, and b* of a molded article that is injection-molded at a cylinder temperature of 300°C.)
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Description

Polyarylene sulfide resin composition and molded article obtained by molding therefrom

[0001] The present invention relates to a polyarylene sulfide resin composition that exhibits excellent color stability, moldability, tensile strength, and tensile fracture strain, and to a molded article obtained by molding the same.

[0002] Polyarylene sulfide resin is an engineering plastic with excellent chemical resistance, heat resistance, and mechanical properties. For this reason, polyarylene sulfide resin is widely used in electrical and electronic components, semiconductor manufacturing process components, vehicle-related parts, aircraft parts, and housing equipment parts. In particular, in semiconductor manufacturing processes, polyarylene sulfide resin is increasingly used as a resin material with excellent chemical resistance, water resistance, and abrasion resistance, for example, in wet process equipment components and printed circuit board inspection jigs. Good mechanical properties are required for application to these components, especially a balance between tensile strength and tensile fracture strain. On the other hand, polyarylene sulfide resin is known to discolor and stain relatively easily with heat and light, leading to problems with the stability of the hue of molded products due to changes in molding conditions. Furthermore, because polyarylene sulfide resin has a relatively slow crystallization rate, mold release defects may occur during injection molding.

[0003] As means of achieving good mechanical properties and moldability, Patent Document 1 discloses a resin composition consisting of polyarylene sulfide resin, reinforcing fibers, an olefin copolymer containing epoxy groups, an organic silane compound, and a metal oxoate salt of phosphorus; Patent Document 2 discloses a resin composition consisting of polyarylene sulfide resin and thermoplastic elastomer particles with a volume-average particle diameter of 0.1 mm to 3.0 mm; and Patent Document 3 discloses a resin composition consisting of polyarylene sulfide resin and an olefin resin. However, none of these documents describe color stability or release properties in injection molding.

[0004] Japanese Patent Publication No. 2021-155694, Japanese Patent Publication No. 2008-163112, Japanese Patent Publication No. 2017-179203

[0005] The object of the present invention is to provide a polyarylene sulfide resin composition and a molded article made therefrom that has excellent color stability, moldability, tensile strength, and tensile fracture strain.

[0006] As a result of diligent research to solve the above-mentioned problems, the present inventors have found that the above objective can be achieved by blending a polyarylene sulfide resin that exhibits a specific hue change with a specific olefin resin and a thermoplastic resin having a specific cooling crystallization temperature in specific proportions, leading to the present invention.

[0007] In other words, the present invention is as follows: 1. A polyarylene sulfide resin composition containing: (A) 100 parts by weight of a resin component consisting of 30 to 85 parts by weight of a polyarylene sulfide resin (component A-1) satisfying the following formula (I) and 70 to 15 parts by weight of a polyarylene sulfide resin (component A-2) satisfying the following formula (II); (B) 1 to 10 parts by weight of an olefin resin having a functional group that can react with component A; and (C) 0.1 to 5 parts by weight of a thermoplastic resin other than component A having a cooling crystallization temperature of 160°C or higher. 2 < ΔL* + Δa* + Δb* ≤ 8 (I) -6 ≤ ΔL* + Δa* + Δb* ≤ 0 (II) (In formulas (I) and (II), ΔL*, Δa*, and Δb* represent the values ​​obtained by subtracting the values ​​of L*, a*, and b* of a molded product injected at a cylinder temperature of 290°C from the values ​​of L*, a*, and b* of a molded product injected at a cylinder temperature of 300°C, respectively.) 2. The polyarylene sulfide resin composition according to item 1 above, wherein component C is at least one thermoplastic resin selected from the group consisting of semi-aromatic polyester resin, polyetheretherketone resin, and polyamide resin. 3. The polyarylene sulfide resin composition according to item 1 or 2 above, wherein component B is a modified polyethylene resin modified with maleic anhydride. 4. The polyarylene sulfide resin composition according to any one of items 1 to 3 above, wherein component C is a polybutylene naphthalate resin. 5. 1. A polyarylene sulfide resin composition according to any one of items 1 to 4 above, wherein component A-1 is a polyarylene sulfide resin produced by reacting a dihalo-aromatic compound with a sulfidating agent under an organic polar solvent. 6. A polyarylene sulfide resin composition according to any one of items 1 to 5 above, wherein component A-2 is a polyarylene sulfide resin produced by reacting a diiodoaryl compound with solid sulfur under a solvent-free environment. 7. A polyarylene sulfide resin composition according to any one of items 1 to 6 above, containing 0.01 to 1 part by weight of at least one antioxidant (component D) selected from the group consisting of (D) hindered phenol-based antioxidants and phosphorus-based antioxidants, per 100 parts by weight of component A. 8. A polyarylene sulfide resin composition according to any one of items 1 to 7 above, used as a component for semiconductor manufacturing processes.9. A molded article obtained by molding a polyarylene sulfide resin composition as described in any of items 1 to 8 above.

[0008] According to the present invention, it is possible to provide a polyarylene sulfide resin composition that is excellent in hue stability, moldability, tensile strength, and tensile fracture strain, as well as a molded article made therefrom. Molded articles made by molding the polyarylene sulfide resin composition of the present invention can be used for various applications including: wet process equipment parts, semiconductor manufacturing process components such as printed circuit board inspection jigs; housings and internal components such as trays and chassis for electrical and electronic equipment such as personal computers, tablets, mobile phones, displays, office automation equipment, mobile phones, personal digital assistants, facsimile machines, compact discs, portable MDs, portable radio cassette players, PDAs (personal digital assistants such as electronic organizers), video cameras, digital still cameras, optical equipment, audio equipment, air conditioners, lighting equipment, entertainment goods, toys, and other home appliances; cases and mechanical parts; panels and other building materials; motor parts; alternator terminals, alternator connectors, IC regulators, light dew potentiometer bases, suspension parts; various valves such as exhaust gas valves; fuel-related parts; various pipes for exhaust or intake systems; air intake nozzle snorkels; intake manifolds; various arms; various frames; various hinges; various bearings; fuel pumps; and gasoline tanks. CNG tank, engine coolant joint, carburetor main body, carburetor spacer, exhaust gas sensor, coolant sensor, oil temperature sensor, brake pad wear sensor, throttle position sensor, crankshaft position sensor, air flow meter, brake butt wear sensor, air conditioning thermostat base, heating hot air flow control valve, radiator motor brush holder, water pump impeller, turbine vane, wiper motor related parts, distributor, starter switch, starter relay, transmission wire harness, window washer nozzle, air conditioning panel switch circuit board, fuel-related solenoid valve coil, fuse connector, battery tray, AT bracket, headlamp support, pedal housing, steering wheel, door beam, protector, chassis, frame, armrest, horn terminal, step motor rotor, lamp socket, lamp reflector, lamp housing,It is widely useful in automotive and motorcycle-related parts, components, and body panels such as brake pistons, noise shields, radiator supports, spare tire covers, seat shells, solenoid bobbins, engine oil filters, ignition system cases, undercovers, scuff plates, pillar trims, propeller shafts, wheels, fenders, fascias, bumpers, bumper beams, bonnets, aero parts, platforms, cowl louvers, roofs, instrument panels, spoilers, and various modules, as well as aircraft-related parts, components, and body panels such as landing gear pods, winglets, spoilers, edges, rudders, elevators, fillings, and ribs, and wind turbine blades. In particular, due to its excellent color stability, formability, tensile strength, and tensile fracture strain, it can be suitably used as a component for semiconductor manufacturing processes, such as wet process equipment parts and printed circuit board inspection jigs.

[0009] Further details of the present invention will be described below.

[0010] <Regarding Component A> Any polyarylene sulfide resin that belongs to the category of polyarylene sulfide resin may be used as Component A of the present invention.

[0011] Examples of polyarylene sulfide resins include those whose constituent units consist of, for example, p-phenylene sulfide units, m-phenylene sulfide units, o-phenylene sulfide units, phenylene sulfide sulfone units, phenylene sulfide ketone units, phenylene sulfide ether units, diphenylene sulfide units, substituent-containing phenylene sulfide units, branched structure-containing phenylene sulfide units, etc. Among these, those containing 70 mol% or more, particularly 90 mol% or more, of p-phenylene sulfide units are preferred, and poly(p-phenylene sulfide) is even more preferred.

[0012] In the present invention, component A must contain component A-1 that satisfies the following formula (I) and component A-2 that satisfies the following formula (II). 2 < ΔL* + Δa* + Δb* ≤ 8 (I) -6 ≤ ΔL* + Δa* + Δb* ≤ 0 (II) (In formulas (I) and (II), ΔL*, Δa*, and Δb* represent the values ​​obtained by subtracting the L*, a*, and b* of a molded product injected at a cylinder temperature of 290°C from the L*, a*, and b* of a molded product injected at a cylinder temperature of 300°C, respectively.) Here, L*, a*, and b* refer to L*, a*, and b* in the CIE Lab color system, and are the values ​​when the colorimetric standard illuminant is D65 and the spectral sensitivity is a 10° field of view. For the measurement, the 10th molded product from a continuous molding process of 2 mm thick plate-shaped molded parts using an injection molding machine with cylinder temperatures set to 290°C and 300°C will be used.

[0013] In formula (I), ΔL* + Δa* + Δb* is preferably between 3 and 7, and more preferably between 4 and 6. If ΔL* + Δa* + Δb* in formula (I) is 2 or less, the tensile fracture strain deteriorates due to less molecular entanglement, while if it exceeds 8, the formability deteriorates due to insufficient crystallinity. Furthermore, in formula (II), ΔL* + Δa* + Δb* is preferably between -5 and -1, and more preferably between -4 and -2. If ΔL* + Δa* + Δb* in formula (II) is less than -6, the formability deteriorates due to insufficient crystallinity, while if it exceeds 0, the hue stability and formability deteriorate.

[0014] The method for producing component A-1 is not particularly limited and can be achieved by appropriately adjusting and selecting polymerization conditions, washing conditions, monomers, polymerization catalysts, polymerization aids, colorants, and other additives using known methods. As an example of the production of component A-1, the method described in U.S. Patent No. 2,513,188 and U.S. Patent No. 2,583,941, etc., is preferred, which involves reacting a dihalo-aromatic compound represented by p-dichlorobenzene and a sulfidating agent represented by sodium sulfide or sodium hydrosulfide and sodium hydroxide as raw materials under an organic polar solvent represented by an amide solvent such as N-methylpyrrolidone and dimethylacetamide, or a sulfone solvent such as sulfolane. In the above method, it is preferable to add an alkali metal salt of a carboxylic acid or an alkali metal salt of a sulfonic acid, or to add alkali hydroxide, in order to adjust the degree of polymerization. The preferred weight-average molecular weight (Mw) range for component A-1 is 30,000 to 80,000, and more preferably in the range of 40,000 to 70,000. Having a weight-average molecular weight within this range can facilitate the securing of tensile fracture strain and moldability. The weight-average molecular weight was calculated in polystyrene equivalent using gel permeation chromatography (GPC). 1-chloronaphthalene was used as the solvent, and the column temperature was 210°C.

[0015] The method for producing component A-2 is not particularly limited and can be achieved by appropriately adjusting and selecting polymerization conditions, washing conditions, monomers, polymerization catalysts, polymerization aids, colorants, and other additives using known methods. As an example of producing component A-2, the method described in U.S. Patent Nos. 4,746,758, 4,786,713, JP 2013-522385, JP 2012-233210, and JP 5167276, etc., is preferred, that is, a method of polymerizing a diiodoaryl compound and solid sulfur by direct heating in a solvent-free environment.

[0016] The above manufacturing method includes an iodization step and a polymerization step. In the iodization step, an aryl compound is reacted with iodine to obtain a diiodoaryl compound. In the subsequent polymerization step, the diiodoaryl compound is polymerized with solid sulfur using a polymerization inhibitor to produce a polyarylene sulfide resin. Iodine is generated in gaseous form in this step, which is recovered and reused in the iodization step. The iodine is substantially a catalyst.

[0017] Typical solid sulfur used in the above manufacturing method is cyclooctasulfur (S), which has eight atoms linked together at room temperature. 8 ) are examples. However, the sulfur compounds used in polymerization reactions are not limited and can be used in any form as long as they are solid or liquid at room temperature.

[0018] Typical diiodoaryl compounds used in the above-mentioned manufacturing method include at least one selected from the group consisting of diiodobenzene, diiodonaphthalene, diiodobiphenyl, diiodobisphenol, and diiodobenzophenone. Derivatives of iodoaryl compounds that have alkyl or sulfone groups attached, or into which oxygen or nitrogen has been introduced, are also used. Iodoaryl compounds are classified into different isomers depending on the bond position of the iodine atom. Preferred examples of these isomers are compounds in which iodine is symmetrically located at both ends of the aryl compound molecule, such as p-diiodobenzene, 2,6-diiodonaphthalene, and p,p'-diiodobiphenyl. The content of the iodoaryl compound is preferably 500 to 10,000 parts by weight per 100 parts by weight of solid sulfur. This amount is determined considering the formation of disulfide bonds.

[0019] Typical polymerization inhibitors used in the above-mentioned manufacturing method include monoiodoaryl compounds, benzothiazoles, benzothiazole sulfenamides, thiurams, dithiocarbamates, and aromatic sulfide compounds. Preferred examples of monoiodoaryl compounds include at least one selected from the group consisting of iodobiphenyl, iodophenol, iodoaniline, and iodobenzophenone. Preferred examples of benzothiazoles include at least one selected from the group consisting of 2-mercaptobenzothiazole and 2,2'-dithiobisbenzothiazole. Preferred examples of benzothiazole sulfenamides include at least one selected from the group consisting of N-cyclohexylbenzothiazole 2-sulfenamide, N,N-dicyclohexyl-2-benzothiazole sulfenamide, 2-morpholinothiobenzothiazole, benzothiazole sulfenamide, dibenzothiazole disulfide, and N-dicyclohexylbenzothiazole 2-sulfenamide. A preferred example among thiurams is at least one selected from the group consisting of tetramethylthiuram monosulfide and tetramethylthiuram disulfide. A preferred example among dithiocarbamates is at least one selected from the group consisting of zinc dimethyldithiocarbamate and zinc diethyldithiocarbamate. A preferred example among aromatic sulfide compounds is at least one selected from the group consisting of diphenyl sulfide, diphenyl disulfide, diphenyl ether, biphenyl, and benzophenone. In addition, one or more functional groups may be substituted on the conjugated aromatic ring skeleton of any of the polymerization inhibitors. Examples of the functional groups include hydroxyl groups, carboxyl groups, mercapto groups, amino groups, cyano groups, sulfo groups, and nitro groups, with preferred examples being hydroxyl groups, amino groups, and carboxyl groups, and even more preferred examples being those with an FT-IR spectrum of 3200 to 3600 cm⁻¹. -1 , 1600-1800cm -1 and 3300-3500 cm -1Examples of groups exhibiting peaks include hydroxyl groups, amino groups, and carboxyl groups. The content of the polymerization inhibitor is preferably 1 to 30 parts by weight per 100 parts by weight of the solid sulfur. This amount is determined considering the formation of disulfide bonds.

[0020] In the above manufacturing method, a polymerization catalyst may be used, and a typical polymerization catalyst is a nitrobenzene-based catalyst. Preferred examples of nitrobenzene-based catalysts include at least one selected from the group consisting of 1,3-diiodo-4-nitrobenzene, 1-iodo-4-nitrobenzene, 2,6-diiodo-4-nitrophenol, iodonitrobenzene, and 2,6-diiodo-4-nitroamine. The content of the polymerization catalyst is preferably 0.01 to 20 parts by weight per 100 parts by weight of the solid sulfur. This amount is determined considering the formation of disulfide bonds.

[0021] By using this polymerization method, it is possible to obtain a cost-effective polyarylene sulfide resin without substantially reducing the chlorine and sodium content. Furthermore, the polyarylene sulfide resin of the present invention may also contain polyarylene sulfide resin obtained by other polymerization methods.

[0022] The terminal functional groups of component A are not particularly limited, but polyarylene sulfide resins comprising polyarylene sulfide resins having at least one terminal functional group selected from the group consisting of mercapto terminal groups, sodium mercapto terminal groups, chloro terminal groups, hydroxy terminal groups, amino terminal groups, and carboxy terminal groups, and polyarylene sulfide resins not having the aforementioned functional groups at the terminals are preferred.

[0023] The content of component A-1 is 30 to 85 parts by weight, preferably 40 to 80 parts by weight, and more preferably 50 to 75 parts by weight, out of 100 parts by weight of the total of components A-1 and A-2. If the content of component A-1 is less than 30 parts by weight, the hue stability and tensile fracture strain deteriorate. On the other hand, if it exceeds 85 parts by weight, the hue stability and moldability deteriorate.

[0024] <Regarding Component B> The olefin resin having a functional group that can react with component A, which is component B of the present invention, can be a known resin, and is a modified olefin (co)polymer obtained by introducing monomer components having functional groups such as epoxy groups, acid anhydride groups, and carboxylic acid metal complexes (hereinafter abbreviated as functional group-containing components) into a polymer obtained by (co)polymerizing olefins. If an olefin resin that does not have a functional group that can react with component A is used as component B, the compatibility with component A is impaired, and the tensile fracture nominal strain worsens.

[0025] Examples of olefin polymers include polymers obtained by polymerizing α-olefins such as ethylene, propylene, butene-1, pentene-1, 4-methylpentene-1, and isobutylene, either alone or two or more; and copolymers of α-olefins with α,β-unsaturated acids such as acrylic acid, methyl acrylate, ethyl acrylate, butyl acrylate, methacrylic acid, methyl methacrylate, ethyl methacrylate, and butyl methacrylate, and their alkyl esters. Suitable specific examples of olefin polymers include polyethylene, polypropylene, ultra-high molecular weight polyethylene, polyethylene obtained by polymerizing ultra-high molecular weight polyethylene with high molecular weight or low molecular weight polyethylene by a multi-stage polymerization method, ethylene / propylene copolymer, ethylene / butene-1 copolymer, ethylene / methyl acrylate copolymer, ethylene / ethyl acrylate copolymer, ethylene / butyl acrylate copolymer, ethylene / methyl methacrylate copolymer, ethylene / ethyl methacrylate copolymer, and ethylene / butyl methacrylate copolymer. In particular, from the viewpoint of ensuring compatibility with polyarylene sulfide resin and tensile fracture strain, at least one olefin polymer selected from the group consisting of polyethylene and polyethylene obtained by polymerizing ultra-high molecular weight polyethylene with high molecular weight or low molecular weight polyethylene by a multi-stage polymerization method is preferred.

[0026] The olefin polymer may be further copolymerized with other copolymerizable unsaturated monomers, such as vinyl ether, vinyl acetate, vinyl propionate, acrylonitrile, and styrene, in an amount of 40% by weight or less, and within a range that does not impair the objectives of the present invention.

[0027] Various conventionally known methods can be used to introduce functional groups into the above-mentioned olefin polymer. Examples include copolymerizing the olefin polymer with a functional group-containing component at the stage of obtaining the olefin polymer; suspending or dissolving the olefin polymer in a solvent and adding and mixing a functional group-containing component and a radical polymerization initiator at a temperature of usually 80 to 200°C to perform graft copolymerization; contacting the functional group-containing component and a radical polymerization initiator under melt kneading at a temperature above the melting point, for example, 180 to 300°C; and introducing functional groups by oxidation reaction by introducing air into the olefin polymer in a molten state at 140 to 180°C. Examples of functional group-containing components include monomers containing acid anhydride groups such as maleic anhydride, itaconic anhydride, citraconic anhydride, and endobicyclo-(2,2,1)-5-heptene-2,3-dicarboxylic acid anhydride; monomers containing epoxy groups such as glycidyl acrylate, glycidyl methacrylate, glycidyl ethacrylate, glycidyl itaconic acid, and glycidyl citraconic acid; and monomers containing carboxylic acid metal complexes. Among these, from the viewpoint of ensuring compatibility with polyarylene sulfide resins, olefin resins modified with at least one functional group-containing component selected from the group consisting of maleic anhydride, glycidyl acrylate, and glycidyl methacrylate are preferred, olefin resins modified with maleic anhydride are more preferred, and polyethylene resins modified with maleic anhydride are particularly preferred.

[0028] The viscosity-average molecular weight (Mv) of the above-mentioned olefin resin is preferably in the range of 10,000 to 1,000,000, and more preferably in the range of 100,000 to 900,000. If the viscosity-average molecular weight is less than 10,000, the effect of improving the tensile fracture nominal strain may be insufficient, and if it exceeds 1,000,000, stable production during extrusion may become difficult. The viscosity-average molecular weight of the olefin resin is determined using the intrinsic viscosity [η] measured in decalin solvent at 135°C from the following general formula (III): Mv = 5.37 × 10⁻⁶ 4 [η] 1.37 (III) In the present invention, one or more olefin resins may be used.

[0029] The content of component B is 1 to 10 parts by weight, preferably 1 to 8 parts by weight, and more preferably 1 to 5 parts by weight, per 100 parts by weight of component A. If the content is less than 1 part by weight, the hue stability and tensile fracture strain decrease. On the other hand, if the content exceeds 10 parts by weight, the tensile strength deteriorates and the moldability is impaired.

[0030] <Regarding Component C> Any thermoplastic resin other than component A used as component C in this invention may be used as long as it has a cooling crystallization temperature of 160°C or higher, and known crystalline thermoplastic resins can be used. The cooling crystallization temperature is the temperature at which the exothermic peak appears in the heat flow curve when 4 to 7 mg of thermoplastic resin is heated from 25 to 35°C to the melting point of the thermoplastic resin + 35°C at a heating rate of 20°C / min using a differential scanning calorimeter (DSC), held at an isothermal temperature for 5 minutes, rapidly cooled to 25 to 35°C at a rate of 100°C / min or higher, heated again to the melting point of the thermoplastic resin + 35°C at a heating rate of 10°C / min, held at an isothermal temperature for 5 minutes, and cooled to 25 to 35°C at a cooling rate of 10°C / min. The cooling crystallization temperature is preferably 165°C or higher, and more preferably 170°C or higher. If a thermoplastic resin with a cooling crystallization temperature of less than 160°C or one that does not exhibit an exothermic peak is used, the crystallization of the resin composition will not be promoted, resulting in poor moldability. While there is no particular upper limit to the cooling crystallization temperature, it is preferably 320°C or lower.

[0031] Examples of thermoplastic resins used as component C include semi-aromatic polyester resins such as polybutylene terephthalate resin, polybutylene naphthalate resin, and polyethylene terephthalate resin; aliphatic polyester resins; polyamide resins such as polytetramethylene adipamide (polyamide 46), polyhexamethylene adipamide (polyamide 66), polyhexamethylene sevacamide (polyamide 610), polyhexamethylene dodecamide (polyamide 612), polyundecamethylene adipamide (polyamide 116), polyundecanamide (polyamide 11), polydodecanamide (polyamide 12), polyhexamethylene terephthalamide (polyamide 6T), polynonamethylene terephthalamide (polyamide 9T), and polydecamethylene terephthalamide (polyamide 10T); aromatic polyether ketone resins such as polyether ether ketone resins, and copolymers and derivatives thereof. Among these, it is preferable that the component C is at least one thermoplastic resin selected from the group consisting of semi-aromatic polyester resins, polyetheretherketone resins, and polyamide resins, and more preferably a polybutylene naphthalate resin. In the present invention, one or more components of C may be used.

[0032] The content of component C is 0.1 to 5 parts by weight, preferably 0.2 to 4 parts by weight, more preferably 0.2 to 3 parts by weight, and even more preferably 0.3 to 3 parts by weight, per 100 parts by weight of component A. If the content of component C exceeds 5 parts by weight, the hue stability, moldability, and tensile fracture strain deteriorate. On the other hand, if the content is less than 0.1 parts by weight, the hue stability and moldability deteriorate.

[0033] <Regarding Component D> The resin composition of the present invention preferably contains at least one antioxidant selected from the group consisting of hindered phenol antioxidants and phosphorus antioxidants as component D, and more preferably contains both a hindered phenol antioxidant and a phosphorus antioxidant. Including such antioxidants may improve the tensile fracture strain.

[0034] As hindered phenol antioxidants, known compounds commonly incorporated into resins can be used. Examples of such hindered phenol antioxidants include α-tocopherol, butylhydroxytoluene, cinapyl alcohol, vitamin E, octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, 2-tert-butyl-6-(3'-tert-butyl-5'-methyl-2'-hydroxybenzyl)-4-methylphenyl acrylate, 2,6-di-tert-butyl-4-(N,N-dimethylaminomethyl)phenol, and 3,5-di-tert-butyl-4-hydroxyben Zylphosphonate diethyl ester, 2,2'-methylenebis(4-methyl-6-tert-butylphenol), 2,2'-methylenebis(4-ethyl-6-tert-butylphenol), 4,4'-methylenebis(2,6-di-tert-butylphenol), 2,2'-methylenebis(4-methyl-6-cyclohexylphenol), 2,2'-dimethylenebis(6-α-methylbenzyl-p-cresol), 2,2'-ethylidenebis(4,6-di-tert-butylphenol), 2,2'-butylidenebis (4-methyl-6-tert-butylphenol), 4,4'-butylidenebis(3-methyl-6-tert-butylphenol), triethylene glycol-N-bis-3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate, 1,6-hexanediol bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], bis[2-tert-butyl-4-methyl6-(3-tert-butyl-5-methyl-2-hydroxybenzyl)phenyl]terephthalate, 3,9 -Bis{2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionyloxy]-1,1,-dimethylethyl}-2,4,8,10-tetraoxaspiro[5,5]undecane, 4,4'-thiobis(6-tert-butyl-m-cresol), 4,4'-thiobis(3-methyl-6-tert-butylphenol), 2,2'-thiobis(4-methyl-6-tert-butylphenol), bis(3,5-di-tert-butyl-4-hydroxybenzyl)sulfide, 4,4'-di-thiobis(2,6-di-tert-butylphenol), 4,4'-tri-thiobis(2,6-di-tert-butylphenol), 2,2-thiodiethylenebis-[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], 2,4-bis(n-octylthio)-6-(4-hydroxy-3,5-di-tert-butylanilino)-1,3,5-triazine, N,N'-hexamethylenebis-(3,5-di-tert-butyl-4-hydroxyhydrocinnamide), N,N'-bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl) [Droxyphenyl)propionyl]hydrazine, 1,1,3-tris(2-methyl-4-hydroxy-5-tert-butylphenyl)butane, 1,3,5-trimethyl-2,4,6-tris(3,5-di-tert-butyl-4-hydroxybenzyl)benzene, tris(3,5-di-tert-butyl-4-hydroxyphenyl)isocyanurate, tris(3,5-di-tert-butyl-4-hydroxybenzyl)isocyanurate, 1,3,5-tris(4-tert-butyl-3-hydroxy-2,6-dimethylbenzyl)isocyanurate Nurate, 1,3,5-Tris-2[3(3,5-di-tert-butyl-4-hydroxyphenyl)propionyloxy]ethyl isocyanurate, Tetrakis[methylene-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]methane, Triethylene glycol-N-bis-3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate, Triethylene glycol-N-bis-3-(3-tert-butyl-4-hydroxy-5-methylphenyl)acetate, 3,9-bis[2-{3- Examples include (3-tert-butyl-4-hydroxy-5-methylphenyl)acetyloxy}-1,1-dimethylethyl]-2,4,8,10-tetraoxaspiro[5,5]undecane, tetrakis[methylene-3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate]methane, 1,3,5-trimethyl-2,4,6-tris(3-tert-butyl-4-hydroxy-5-methylbenzyl)benzene, and tris(3-tert-butyl-4-hydroxy-5-methylbenzyl)isocyanurate.

[0035] Phosphate compounds are examples of phosphorus-based antioxidants, such as triphenyl phosphite, tris(nonylphenyl) phosphite, tridecyl phosphite, trioctyl phosphite, trioctadecyl phosphite, didecyl monophenyl phosphite, dioctyl monophenyl phosphite, diisopropyl monophenyl phosphite, monobutyldiphenyl phosphite, monodecyldiphenyl phosphite, monooctyldiphenyl phosphite, tris(diethylphenyl) phosphite, tris(di-iso-propylphenyl) phosphite, tris(di-n-butylphenyl) phosphite, tris(2,4-di-tert-butylphenyl) phosphite, and tris(2,6-di-t Examples include tert-butylphenyl) phosphite, distearyl pentaerythritol diphosphite, bis(2,4-di-tert-butylphenyl) pentaerythritol diphosphite, bis(2,6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphite, bis(2,6-di-tert-butyl-4-ethylphenyl) pentaerythritol diphosphite, bis{2,4-bis(1-methyl-1-phenylethyl)phenyl} pentaerythritol diphosphite, phenylbisphenol A pentaerythritol diphosphite, bis(nonylphenyl) pentaerythritol diphosphite, and dicyclohexyl pentaerythritol diphosphite. Furthermore, other phosphite compounds that react with divalent phenols to form cyclic structures can also be used. Examples include 2,2'-methylenebis(4,6-di-tert-butylphenyl)(2,4-di-tert-butylphenyl) phosphite, 2,2'-methylenebis(4,6-di-tert-butylphenyl)(2-tert-butyl-4-methylphenyl) phosphite, and 2,2-methylenebis(4,6-di-tert-butylphenyl)octyl phosphite.

[0036] The content of component D is preferably 0.01 to 1 part by weight, more preferably 0.02 to 0.5 part by weight, based on 100 parts by weight of component A. When the content of component D is less than 0.01 part by weight, the tensile fracture elongation may deteriorate. On the other hand, when it exceeds 1 part by weight, the hue stability may deteriorate.

[0037] <Other Components> The resin composition of the present invention may contain, within a range not contrary to the gist of the present invention, thermoplastic resins other than components A, B, and C, antioxidants other than component D, impact modifiers, plasticizers, organic and inorganic fillers, flame retardants, colorants, light stabilizers, heat stabilizers, antistatic agents, antiblocking agents, lubricants, dispersants, flow modifiers, crystal nucleating agents, etc.

[0038] <Method for Producing Resin Composition> To produce the resin composition of the present invention, any method can be adopted. For example, a method of preliminarily mixing each component and optionally other components, followed by melt-kneading and pelletizing can be mentioned. Examples of the means for preliminary mixing include Nauta mixer, V-type blender, Henschel mixer, mechanochemical apparatus, extrusion mixer, etc. In preliminary mixing, granulation can also be carried out by an extrusion granulator, briquetting machine, etc. in some cases. After preliminary mixing, melt-kneading is performed using a melt-kneading machine typified by a vented twin-screw extruder, and pelletizing is carried out using equipment such as a pelletizer. Other examples of the melt-kneading machine include Banbury mixer, kneading roll, constant-temperature stirring vessel, etc., but a vented twin-screw extruder is preferred. Alternatively, a method of independently supplying each component and optionally other components to a melt-kneading machine typified by a twin-screw extruder without preliminary mixing can also be adopted.

[0039] <Regarding the molded product> The molded product formed by molding the resin composition of the present invention can be obtained by molding the pellets manufactured as described above. Preferably, it can be obtained by injection molding or extrusion molding. In injection molding, not only ordinary molding methods but also injection compression molding, injection press molding, gas assist injection molding, foam molding (including the method of injecting a supercritical fluid), insert molding, in-mold coating molding, adiabatic mold molding, rapid heating and cooling mold molding, two-color molding, multi-color molding, sandwich molding, and ultra-high speed injection molding, etc. can be mentioned. Also, either a cold runner system or a hot runner system can be selected for molding. In extrusion molding, a method of obtaining a molded product by extruding a round bar and then cutting it into a disk shape, or a method of obtaining a molded product by extruding a thick sheet and then punching it into a predetermined shape can be used.

[0040] Hereinafter, embodiments of implementing the present invention will be described by way of examples, but the present invention is not limited thereto. Also, the evaluation of various physical properties was carried out by the following methods.

[0041] [Evaluation of resin composition] (1) Hue stability (color difference ΔE) After drying the pellets obtained by the following method at 130 °C for 3 hours, injection molding was performed using an injection molding machine (EC130SXI - 4Y manufactured by Toshiba Machine Co., Ltd.) at a cylinder set temperature of 290 and 300 °C and a mold temperature of 140 °C to continuously mold a plate-shaped molded product with a thickness of 2 mm, a width and a length of 50 mm, and the molded product of the 10th shot was used for measurement. Using a spectrophotometer (Ci7800, manufactured by X-Rite, Incorporated), the L*, a*, and b* of the molded product were measured under the conditions of a light source D65, a viewing angle of 10°, a UV filter of 400 nm cut-off, and an aperture Φ25 mm, and the color difference ΔE was calculated according to the following formula (IV). It is necessary that the color difference ΔE is 1.8 or less. ΔE = (ΔL* 2 + Δa* 2 + Δb* 2 ) 0.5 (IV) (In formula (IV), ΔL*, Δa*, and Δb* respectively represent the values obtained by subtracting the L*, a*, and b* of the molded product injection-molded at a cylinder temperature of 290 °C from the L*, a*, and b* of the molded product injection-molded at a cylinder temperature of 300 °C.)

[0042] (2) Formability After drying the pellets obtained by the following method at 130°C for 3 hours, 10 pieces of dumbbell-shaped tensile test specimens of type A described in JIS K7139 were continuously injection-molded using an injection molding machine (EC130SXI - 4Y manufactured by Toshiba Machine Co., Ltd.) under the conditions of a cylinder set temperature of 290 and 300°C, a mold temperature of 140°C, an injection speed of 5 mm / sec, a holding pressure of 80% of the injection pressure, a holding pressure time of 25 seconds, and a cycle time of 65 seconds. When even one molded product could not be demolded from the cavity or was taken on the fixed side, it was designated as "F", and when all could be demolded, it was designated as "P".

[0043] (3) Tensile strength Using the pellets obtained by the following method, the tensile strength at a test speed of 50 mm / min was measured in accordance with JIS K7161. The test was conducted 3 times, and the average value thereof was taken as the tensile strength of the composition. The tensile strength needs to be 80 MPa or more.

[0044] (4) Tensile fracture elongation Using the pellets obtained by the following method, the tensile fracture elongation was measured in accordance with JIS K7161. The test was conducted 3 times, and the average value thereof was taken as the tensile fracture elongation of the composition. The tensile fracture elongation needs to be 4% or more.

[0045] [Examples 1 - 10, Comparative Examples 1 - 12] Components A to D were separately supplied to a twin-screw extruder from the first supply port in accordance with the addition amounts shown in Table 1. Here, the first supply port refers to the supply port at the root. Extrusion was carried out using a vented twin-screw extruder with a diameter of 30 mmΦ (TEX30α - 31.5BW - 2V manufactured by Japan Steel Works, Ltd.) at an extrusion temperature of 290°C, a screw rotation speed of 200 rpm, a discharge amount of 20 kg / h, and a vacuum degree of 3 kPa at the vent to obtain pellets.

[0046] (Component A) A-1a: Polyarylene sulfide resin (manufactured by Solvay Specialty Polymers USA, L.L.C, QA200N (product name), ΔL* + Δa* + Δb* = 6) A-1b: Polyarylene sulfide resin (manufactured by Solvay Specialty Polymers USA, L.L.C, QA281N (product name), ΔL* + Δa* + Δb* = 4) A-1c (Comparative Example): Polyarylene sulfide resin obtained by melt-kneading components A-1a and A-2a in a ratio of 2:8 (ΔL* + Δa* + Δb* = -2) A-1d (Comparative Example): Polyarylene sulfide resin obtained in Production Example I <Production Example I> In a 15-liter autoclave equipped with a stirrer, flake-shaped sodium sulfide (Na) 2 S・2.9H 2 1814 g of granular caustic soda (100% NaOH: Wako Pure Chemical Industries special grade) and 8.7 g of N-methyl-2-pyrrolidone were charged, and the mixture was gradually heated to 200°C while stirring under a nitrogen stream, and 339 g of water was distilled off. After cooling to 190°C, 2129 g of p-dichlorobenzene and 1783 g of N-methyl-2-pyrrolidone were added, and the system was sealed under a nitrogen stream. The system was heated to 225°C over 2 hours, polymerized at 225°C for 1 hour, then heated to 250°C over 25 minutes, and polymerized at 250°C for 2 hours. Next, 509 g of distilled water was injected into the system at 250°C, and the polymerization reaction was carried out for a further 3 hours at a temperature of 255°C. After polymerization was complete, the mixture was cooled to room temperature, and the polymerization slurry was separated into solid and liquid components using a centrifugal filter. The cake was washed three times sequentially with N-methyl-2-pyrrolidone and acetone under a nitrogen stream, and then sequentially with 0.2% hydrochloric acid and warm water under a nitrogen stream. The resulting poly(p-phenylene sulfide) was dried at 105°C overnight to obtain a polyphenylene sulfide resin containing mercapto groups at the ends. The ΔL* + Δa* + Δb* of the polyphenylene sulfide resin was 9.

[0047] A-2a: Polyphenylene sulfide resin obtained in Production Example II <Production Example II> In a 5L reactor equipped with a thermocouple capable of measuring the internal temperature of the reactor, nitrogen filling, and a vacuum line for applying vacuum, a reaction mixture containing 5130g of paradiiodobenzene (p-DIB), 450g of sulfur, and 4g of 1,3-diiodo-4-nitrobenzene mercaptobenzothiazole as a reaction initiator was heated to 180°C to completely melt and mix. The polymerization reaction was then carried out starting with initial reaction conditions of 220°C and 350 Torr, gradually increasing the temperature and decreasing the pressure until the final reaction temperature was 300°C and the pressure was 1 Torr or less. When the polymerization reaction had progressed to 80% (the degree of polymerization progress was determined by measuring the relative ratio of the current viscosity to the target viscosity [(current viscosity / target viscosity) × 100 (%)]. The current viscosity was measured using a viscometer on a sample taken during polymerization), 60 g of diphenyl disulfide was added as a polymerization termination agent, and the reaction was allowed to proceed under a nitrogen atmosphere for 10 minutes. After gradually applying a vacuum to 0.5 Torr or less to reach the target viscosity, the reaction was terminated to synthesize a polyarylene sulfide resin having phenyl groups at the ends of the main chain. The completed resin was produced in pellet form using a small strand cutter machine. The weight-average molecular weight of the resin was 53,000, and ΔL* + Δa* + Δb* was -4.

[0048] A-2b: Polyphenylene sulfide resin obtained in Production Example III <Production Example III> 300.00 g of paradiiodobenzene and 27.00 g of sulfur were mixed with 0.60 g of diphenyl disulfide (containing 0.65% by weight based on the final polymerized PPS) as a polymerization inhibitor, and heated to 180°C to completely melt and mix them. Then the temperature was raised to 220°C and the pressure was reduced to 200 Torr. The resulting mixture was polymerized for 8 hours while gradually changing the temperature and pressure so that the final temperature and pressure were 320°C and 1 Torr, respectively, to obtain a polyphenylene sulfide resin containing phenyl groups at the ends. The weight-average molecular weight of the resin was 40,000, and ΔL* + Δa* + Δb* was -2.

[0049] A-2c (Comparative Example): Polyarylene sulfide resin (ΔL* + Δa* + Δb* = 4) obtained by melt-kneading components A-1a and A-2a in an 8:2 ratio. A-2d (Comparative Example): Polyarylene sulfide resin obtained in Production Example IV. <Production Example IV> In a 5L reactor equipped with a thermocouple capable of measuring the internal temperature of the reactor, nitrogen filling, and a vacuum line for applying vacuum, a reaction mixture containing 5130g of paradiiodobenzene (p-DIB), 450g of sulfur, and 4g of 1,3-diiodo-4-nitrobenzene mercaptobenzothiazole as a reaction initiator was heated to 180°C to completely melt and mix. Then, starting from initial reaction conditions of 220°C and 350 Torr, the polymerization reaction was carried out while gradually increasing the temperature and decreasing the pressure until the final reaction temperature was 300°C and the pressure was 1 Torr or less. When the polymerization reaction had progressed 90% (the degree of polymerization progress was determined by measuring the relative ratio of the current viscosity to the target viscosity [(current viscosity / target viscosity) × 100 (%)]. The current viscosity was measured using a viscometer on a sample taken during polymerization), 60 g of diphenyl disulfide was added as a polymerization termination agent, and the reaction was allowed to proceed under a nitrogen atmosphere for 10 minutes. After gradually applying a vacuum to 0.5 Torr or less to reach the target viscosity, the reaction was terminated to synthesize a polyarylene sulfide resin having phenyl groups at the ends of the main chain. The completed resin was produced in pellet form using a small strand cutter. The weight-average molecular weight of the resin was 74,000, and ΔL* + Δa* + Δb* was -7.

[0050] (Component B) B-1: Maleic anhydride-modified polyethylene resin obtained in Production Example V <Production Example V> 100 parts by weight of a polyethylene resin mixture consisting of 15% by weight of ultra-high molecular weight polyethylene (Hyzex Million 630M, manufactured by Mitsui Chemicals, Inc.) with an intrinsic viscosity of 31 dl / g measured in decalin solvent at 135°C and 85% by weight of polyethylene (Hyzex 2200J, manufactured by Prime Polymer Co., Ltd.) with an intrinsic viscosity of 2 dl / g measured in decalin solvent at 135°C, 1 part by weight of maleic anhydride and 0.07 parts by weight of organic peroxide (Perhexine-25B, manufactured by Nippon Oil & Fats Co., Ltd.) was mixed in a Nauter mixer, and the resulting mixture was melt-kneaded in a single-screw extruder (EXT40mm extruder, manufactured by Isuzu Chemical Machinery Co., Ltd.) set to 250°C to obtain component B-1. The intrinsic viscosity [η] of the obtained modified polyethylene resin, measured in decalin at 135°C, was 5.5 dl / g, and the viscosity-average molecular weight Mv was 550,000. B-2: Ethylene-glycidyl methacrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., BondFirst E (product name)) B-3 (Comparative example): Polyethylene resin without functional groups obtained in Production Example VI <Production Example VI> A polyethylene resin mixture consisting of 10% by weight of ultra-high molecular weight polyethylene (Hyzex Million 630M, manufactured by Mitsui Chemicals, Inc.) with an intrinsic viscosity of 31 dl / g measured in decalin solvent at 135°C and 90% by weight of polyethylene (Hyzex 2200J, manufactured by Prime Polymer Co., Ltd.) with an intrinsic viscosity of 2 dl / g measured in decalin solvent at 135°C was mixed in a Nauter mixer, and the resulting mixture was melt-kneaded in a single-screw extruder (EXT40mm extruder, manufactured by Isuzu Chemical Machinery Co., Ltd.) set to 250°C to obtain component B-3. The intrinsic viscosity [η] of the obtained polyethylene resin, measured in decalin at 135°C, was 4.3 dl / g, and the viscosity-average molecular weight Mv was 400,000.

[0051] (Component C) C-1: Polybutylene naphthalate resin obtained in Production Example VII <Production Example VII> 315.0 parts of 2,6-naphthalenedicarboxylic acid dimethyl ester, 200.0 parts of 1,4-butanediol, and 0.062 parts of tetra-n-butyl titanate were placed in a transesterification reaction vessel, and the transesterification reaction was carried out for 150 minutes while raising the temperature of the transesterification reaction vessel to 210°C. The reaction product obtained was then transferred to a polycondensation reaction vessel and the polycondensation reaction was started. In the polycondensation reaction, the pressure inside the polycondensation reaction vessel was gradually reduced from atmospheric pressure to 0.13 kPa (1 torr) or less over 40 minutes, and at the same time the temperature was raised to a predetermined reaction temperature of 260°C. Thereafter, the polycondensation reaction was carried out for 140 minutes while maintaining a polycondensation reaction temperature of 260°C and a pressure of 0.13 kPa (1 torr). After 140 minutes, the polycondensation reaction was terminated, and the polybutylene naphthalate resin was extracted in strand form and cut into chips using a cutter while being cooled with water. Next, the obtained polybutylene naphthalate resin was subjected to solid-phase polymerization for 8 hours under conditions of a temperature of 213°C and a pressure of 0.13 kPa (1 Torr) or less to obtain a polybutylene naphthalate resin with an intrinsic viscosity of 1.05 dl / g. The cooling crystallization temperature of this resin was 173°C. C-2: Polyether ether ketone resin (manufactured by Victrex plc, product name: Victrex 450G, cooling crystallization temperature: 285°C) C-3 (Comparative example): Polyamide 6 resin (manufactured by Ube Industries, Ltd., product name: UBENYLON 1011FB, cooling crystallization temperature: 158°C)

[0052] (Component D) D-1: Hindered phenol antioxidant (manufactured by ADEKA Corporation, ADEKA Stab AO-50 (product name)) D-2: Phosphorus antioxidant (manufactured by ADEKA Corporation, ADEKA Stab 2112 (product name))

[0053]

[0054] <Examples 1-10> As these resin compositions fall within the scope of the claims, they exhibited excellent color stability, moldability, tensile strength, and tensile fracture strain. <Comparative Example 1> Because the content of component A-1 exceeded the upper limit, the color stability and moldability were poor. <Comparative Example 2> Because the content of component A-1 was below the lower limit, the color stability was poor and the tensile fracture strain was low. <Comparative Example 3> Because the content of component B exceeded the upper limit, the moldability was poor and the tensile strength was low. <Comparative Example 4> Because the content of component B was below the lower limit, the color stability was poor and the tensile fracture strain was low. <Comparative Example 5> Because component B does not have functional groups that can react with component A, the tensile fracture strain was low. <Comparative Example 6> Because the content of component C exceeded the upper limit, the color stability and moldability were poor, and the tensile fracture strain was low. <Comparative Example 7> Because the content of component C was below the lower limit, the color stability and moldability were poor. <Comparative Example 8> Because the cooling crystallization temperature of component C was below the lower limit, the moldability was poor. <Comparative Example 9> Because ΔL* + Δa* + Δb* of component A-1 was below the lower limit, the tensile fracture nominal strain was low. <Comparative Example 10> Because ΔL* + Δa* + Δb* of component A-1 was above the upper limit, the moldability was poor. <Comparative Example 11> Because ΔL* + Δa* + Δb* of component A-2 was above the upper limit, the color stability and moldability were poor. <Comparative Example 12> Because ΔL* + Δa* + Δb* of component A-2 was below the lower limit, the moldability was poor.

Claims

1. A polyarylene sulfide resin composition comprising: (A) 100 parts by weight of a resin component consisting of 30 to 85 parts by weight of a polyarylene sulfide resin (component A-1) satisfying the following formula (I) and 70 to 15 parts by weight of a polyarylene sulfide resin (component A-2) satisfying the following formula (II); (B) 1 to 10 parts by weight of an olefin resin having a functional group that can react with component A; and (C) 0.1 to 5 parts by weight of a thermoplastic resin other than component A having a cooling crystallization temperature of 160°C or higher. 2 < ΔL* + Δa* + Δb* ≤ 8 (I) -6 ≤ ΔL* + Δa* + Δb* ≤ 0 (II) (In equations (I) and (II), ΔL*, Δa*, and Δb* represent the values ​​obtained by subtracting the values ​​of L*, a*, and b* of a molded product injected at a cylinder temperature of 290°C from the values ​​of L*, a*, and b* of a molded product injected at a cylinder temperature of 300°C, respectively.) 2. The polyarylene sulfide resin composition according to claim 1, wherein component C is at least one thermoplastic resin selected from the group consisting of semi-aromatic polyester resins, polyetheretherketone resins, and polyamide resins.

3. The polyarylene sulfide resin composition according to claim 1 or 2, wherein component B is a modified polyethylene resin modified with maleic anhydride.

4. The polyarylene sulfide resin composition according to any one of claims 1 to 3, wherein component C is polybutylene naphthalate resin.

5. The polyarylene sulfide resin composition according to any one of claims 1 to 4, wherein component A-1 is a polyarylene sulfide resin produced by reacting a dihalo-aromatic compound with a sulfidating agent under an organic polar solvent.

6. The polyarylene sulfide resin composition according to any one of claims 1 to 5, wherein component A-2 is a polyarylene sulfide resin produced by reacting a diiodoaryl compound with solid sulfur in the absence of a solvent.

7. A polyarylene sulfide resin composition according to any one of claims 1 to 6, comprising 0.01 to 1 part by weight of at least one antioxidant (component D) selected from the group consisting of (D) hindered phenol-based antioxidants and phosphorus-based antioxidants, per 100 parts by weight of component A.

8. A polyarylene sulfide resin composition according to any one of claims 1 to 7, used as a component for semiconductor manufacturing processes.

9. A molded article obtained by molding a polyarylene sulfide resin composition according to any one of claims 1 to 8.