Photosensitive resin composition, photosensitive resin film, printed wiring board and production method for same, and semiconductor package

Abstract

Provided is a photosensitive resin composition that contains (A) a photopolymerizable compound that has an ethylenically unsaturated group and an acidic substituent, (B) at least one of a silane coupling agent that has a (meth)acryloyl group and an alkoxysilyl group and a component derived from a silane coupling agent that has a (meth)acryloyl group and an alkoxysilyl group, (C) a thermosetting resin, and (D) an organic peroxide, the (C) thermosetting resin containing at least one of a maleimide resin and an allyl resin. Also provided are a photosensitive resin film that uses the photosensitive resin composition, a printed wiring board and a production method for the printed wiring board, and a semiconductor package.

Description

Photosensitive resin composition, photosensitive resin film, printed circuit board and method for manufacturing the same, and semiconductor package

[0001] This embodiment relates to a photosensitive resin composition, a photosensitive resin film, a printed circuit board, a method for manufacturing the same, and a semiconductor package.

[0002] In recent years, electronic devices have become smaller and more high-performance, leading to increased density in printed circuit boards through an increase in the number of circuit layers and miniaturization of wiring. In particular, the density of semiconductor package substrates such as BGA (Ball Grid Array) and CSP (Chip Size Package), on which semiconductor chips are mounted, is remarkable. This requires not only miniaturization of wiring but also thinning of the insulating layer and further reduction in the diameter of vias used for interlayer connections.

[0003] A conventional method for manufacturing printed circuit boards (PCBs) is the build-up method (see, for example, Patent Document 1), in which an interlayer insulating layer and a conductor layer are sequentially laminated. In PCBs, with the miniaturization of wiring, the semi-additive method, in which the conductor layer is formed by plating, has become mainstream. In the conventional semi-additive method, for example, (1) a thermosetting resin film is laminated onto the conductor layer, and then the thermosetting resin film is cured by heating to form an "interlayer insulating layer". (2) Next, vias for interlayer connection are formed by laser processing, and then desmear treatment and roughening treatment are performed by alkaline permanganate treatment, etc. (3) After that, electroless copper plating is applied to the substrate, a pattern is formed using a resist, and then copper circuits, which are the conductor layers, are formed by electroplating. (4) Subsequently, after peeling off the resist, the copper circuits are formed by flash etching of the electroless plated layer.

[0004] As mentioned above, laser processing is the mainstream method for forming vias in the interlayer insulating layer formed by curing thermosetting resin film, but the ability to reduce the diameter of vias by laser irradiation using a laser processing machine is reaching its limits. Furthermore, when forming vias with a laser processing machine, it is necessary to form each via hole one by one, and when a large number of vias are required for high density, it takes a lot of time to form the vias, resulting in poor manufacturing efficiency.

[0005] Under these circumstances, a method has been proposed for forming multiple small-diameter vias simultaneously by photolithography using a photosensitive resin composition containing an acid-modified vinyl group-containing epoxy resin, a photopolymerizable compound, a photopolymerization initiator, an inorganic filler, and a silane compound, wherein the inorganic filler content is 10 to 80% by mass (see, for example, Patent Document 2).

[0006] Japanese Patent Publication No. 7-304931 Japanese Patent Publication No. 2017-116652

[0007] Incidentally, in electronic devices, the speed and capacity of signals used are increasing year by year. Accordingly, printed circuit board substrate materials are required to have dielectric properties that can reduce the transmission loss of high-frequency signals, namely low relative permittivity and low dielectric loss tangent. Furthermore, before forming a conductor layer on an insulating layer formed from a photosensitive resin composition, the insulating layer is subjected to a surface roughening treatment to improve adhesion with the conductor layer. However, if the chemical resistance of the insulating layer is low, the insulating layer may dissolve excessively in the roughening treatment solution, causing the diameter of holes such as through-holes to change from their predetermined size, or insufficient adhesion with the conductor layer (hereinafter also referred to as "conductor adhesion") to be obtained. Therefore, it has been difficult to achieve both chemical resistance of the insulating layer and conductor adhesion.

[0008] In view of the current situation, this embodiment aims to provide a photosensitive resin composition that has good dielectric properties and can achieve both chemical resistance and conductor adhesion, a photosensitive resin film using the photosensitive resin composition, a printed circuit board and a method for manufacturing the same, and a semiconductor package.

[0009] The present inventors have conducted studies to solve the above problems and have found that the above problems can be solved by the following embodiment. That is, this embodiment relates to the following [1] to

[12] . [1] A photosensitive resin composition comprising: (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent; (B) one or more selected from the group consisting of a silane coupling agent having a (meth)acryloyl group and an alkoxysilyl group and components derived from the silane coupling agent; (C) a thermosetting resin; and (D) an organic peroxide, wherein the (C) thermosetting resin contains one or more selected from the group consisting of maleimide resins and allyl resins. [2] The photosensitive resin composition according to [1], further comprising (E) an inorganic filler. [3] The photosensitive resin composition according to [2], wherein the (E) inorganic filler is surface-treated with the silane coupling agent having a (meth)acryloyl group and an alkoxysilyl group. [4] The photosensitive resin composition according to [2] or [3] above, wherein the (E) inorganic filler is silica. [5] The photosensitive resin composition according to any one of [2] to [4] above, wherein the content of the (E) inorganic filler is 5 to 80% by mass on a basis of the total solid content of the photosensitive resin composition. [6] The photosensitive resin composition according to any one of [1] to [5] above, further comprising (F) a compound having two or more ethylenically unsaturated groups and not having an acidic substituent or an alkoxysilyl group. [7] The photosensitive resin composition according to any one of [1] to [6] above, further comprising (G) a photopolymerization initiator. [8] The photosensitive resin composition according to any one of [1] to [7] above, used for forming an interlayer insulating layer having a photovia. [9] A photosensitive resin film comprising the photosensitive resin composition according to any one of [1] to [8] above.

[10] A printed circuit board comprising a cured product of the photosensitive resin composition according to any one of [1] to [8] above.

[11] A semiconductor package comprising the printed circuit board described in

[10] above and a semiconductor element.

[12] A method for manufacturing a printed circuit board, comprising (1) to (4) below: (1) Laminating the photosensitive resin film described in [9] above to one or both sides of a circuit board.(2): Forming an interlayer insulating layer having vias by exposing and developing the photosensitive resin film laminated in (1). (3): Heat-curing the interlayer insulating layer having the vias. (4): Forming a circuit pattern on the interlayer insulating layer.

[0010] According to this embodiment, it is possible to provide a photosensitive resin composition having good dielectric properties and capable of achieving both chemical resistance and conductor adhesion, a photosensitive resin film using the photosensitive resin composition, a printed wiring board and a method for manufacturing the same, and a semiconductor package.

[0011] It is a schematic diagram showing one aspect of the manufacturing process of a printed wiring board using the photosensitive resin film of this embodiment as a material for an interlayer insulating layer.

[0012] In the numerical ranges described in this specification, the lower limit value and the upper limit value of the numerical range may be replaced with the values shown in the examples. Further, the lower limit value and the upper limit value of the numerical range can be arbitrarily combined with the lower limit value or the upper limit value of other numerical ranges respectively. In the notation of the numerical range "AA to BB", the numerical values AA and BB at both ends are included in the numerical range as the lower limit value and the upper limit value respectively.

[0013] In this specification, for example, the description "10 or more" means 10 and numerical values exceeding 10, and the same applies when the numerical values are different. Further, for example, the description "10 or less" means 10 and numerical values less than 10, and the same applies when the numerical values are different.

[0014] In this specification, the content of each component means the total content of a plurality of substances corresponding to each component, unless otherwise specified when there are a plurality of substances corresponding to each component.

[0015] In this specification, "solid content" means a non-volatile component excluding volatile substances such as solvents, and includes those that are liquid at room temperature. Here, room temperature in this specification means 25°C.

[0016] In this specification, "resin component" means resin and compounds that form resin through a curing reaction. In the photosensitive resin composition of this embodiment, for example, components (A), (C), and (F) described later are resin components, while components (B), (D), (E), (G), and (H) are not resin components.

[0017] In this specification, "ring-forming carbon number" refers to the number of carbon atoms required to form a ring, and does not include the number of carbon atoms in substituents on the ring. For example, both the cyclohexane skeleton and the methylcyclohexane skeleton have a ring-forming carbon number of 6.

[0018] The notation "(meth)acrylic XX" refers to either or both acrylic XX and its corresponding methacrylic XX. Similarly, "(meth)acryloyl group" refers to either or both an acryloyl group and a methacryloyl group.

[0019] In this specification, when the term "layer" is used, for example, as in "interlayer insulating layer," it includes not only solid layers, but also layers that are not solid but have some island-like structures, layers with holes, and layers where the interface with the adjacent layer is unclear.

[0020] In this specification, weight-average molecular weight (Mw) and number-average molecular weight (Mn) refer to values ​​measured in polystyrene equivalent by gel permeation chromatography (GPC). Specifically, the weight-average molecular weight (Mw) in this specification can be measured by the method described in the examples.

[0021] The mechanism of action described herein is speculative and does not limit the mechanism by which the effects of this embodiment are achieved.

[0022] Embodiments that combine any combination of the information described herein are also included.

[0023] [Photosensitive resin composition] The photosensitive resin composition of this embodiment contains: (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent; (B) one or more selected from the group consisting of a silane coupling agent having a (meth)acryloyl group and an alkoxysilyl group and components derived from the silane coupling agent; (C) a thermosetting resin; and (D) an organic peroxide, wherein the (C) thermosetting resin contains one or more selected from the group consisting of maleimide resins and allyl resins.

[0024] In this specification, each component may be referred to as "Component (A)," "Component (B)," etc., as appropriate.

[0025] The photosensitive resin composition of this embodiment can form patterns such as vias by exposure and development. Therefore, the photosensitive resin composition of this embodiment is suitable for use in forming interlayer insulating layers having photovias. In this specification, "photovia" means a via formed by photolithography, i.e., exposure and development. Furthermore, the photosensitive resin composition of this embodiment is suitable for negative-type photosensitive resin compositions. Moreover, the photosensitive resin composition of this embodiment is also useful as a surface protective film such as solder resist.

[0026] <(A) Photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent> The photosensitive resin composition of this embodiment contains (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent. Component (A) may be used alone or in combination of two or more.

[0027] Component (A) is a compound that exhibits photopolymerization, particularly radical polymerization, because it has an ethylenically unsaturated group. Examples of ethylenically unsaturated groups in component (A) include vinyl group, allyl group, propargyl group, butenyl group, ethynyl group, phenylethynyl group, maleimide group, nadiimide group, and (meth)acryloyl group. Among these, the (meth)acryloyl group is preferred from the viewpoint of reactivity and via resolution.

[0028] Component (A) has an acidic substituent from the viewpoint of enabling alkaline development. Examples of acidic substituents on component (A) include carboxyl groups, sulfonic acid groups, and phenolic hydroxyl groups. Among these, a carboxyl group is preferred from the viewpoint of via resolution. The acid value of component (A) is preferably 20 to 200 mg KOH / g, more preferably 40 to 180 mg KOH / g, even more preferably 60 to 150 mg KOH / g, and particularly preferably 80 to 120 mg KOH / g. When the acid value of component (A) is above the lower limit, the via resolution tends to be superior. Also, when the acid value of component (A) is below the upper limit, the dielectric properties tend to be superior. The acid value of component (A) can be measured by the method described in the examples.

[0029] The weight-average molecular weight (Mw) of component (A) is preferably 300 to 10000, more preferably 500 to 7000, even more preferably 700 to 5000, even more preferably 1000 to 3000, and particularly preferably 1500 to 2500. When the weight-average molecular weight (Mw) of component (A) is within the above range, the conductive adhesion, heat resistance, and dielectric properties tend to be excellent.

[0030] Component (A) preferably contains an alicyclic skeleton from the viewpoint of dielectric properties. From the viewpoint of via resolution, conductor adhesion, and dielectric properties, an alicyclic skeleton with 5 to 20 ring-forming carbon atoms is preferred for component (A), more preferably an alicyclic skeleton with 5 to 18 ring-forming carbon atoms, even more preferably an alicyclic skeleton with 6 to 18 ring-forming carbon atoms, even more preferably an alicyclic skeleton with 8 to 14 ring-forming carbon atoms, and particularly preferably an alicyclic skeleton with 8 to 12 ring-forming carbon atoms. Furthermore, from the viewpoint of via resolution, conductor adhesion, and dielectric properties, the above alicyclic skeleton preferably consists of two or more rings, more preferably two to four rings, and even more preferably three rings. Examples of alicyclic skeletons with two or more rings include norbornane skeletons, decalin skeletons, bicycloundecane skeletons, and saturated dicyclopentadiene skeletons. These alicyclic skeletons may or may not have substituents. In this specification, a saturated dicyclopentadiene skeleton means a skeleton containing a ring structure in which the unsaturated bonds in the dicyclopentadiene ring are saturated, and tricyclo[5.2.1.0 ２，６ This can also be called a decane structure. Among these, a saturated dicyclopentadiene skeleton is preferred from the viewpoint of via resolution, conductor adhesion, and dielectric properties. From a similar viewpoint, component (A) is preferably one that includes an alicyclic skeleton represented by the following general formula (A-1).

[0031] (In the formula, R Ａ１ m represents an alkyl group having 1 to 12 carbon atoms and may be substituted anywhere in the above alicyclic skeleton. １ (This is an integer between 0 and 6. * indicates a connection site to another structure.)

[0032] In the above general formula (A-1), R Ａ１ Examples of C1-C12 alkyl groups represented by include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, and n-pentyl groups. C1-C6 alkyl groups are preferred, C1-C3 alkyl groups are more preferred, and methyl groups are even more preferred. １is an integer from 0 to 6, preferably an integer from 0 to 2, more preferably 0. m １ When １ is an integer from 2 to 6, the plurality of Rs Ａ１ may be the same as each other or different from each other. Further, the plurality of Rs Ａ１ may be substituted on the same carbon atom within the possible range or on different carbon atoms. * is a bonding site to another structure and may be bonded to any carbon atom on the alicyclic skeleton, but is preferably bonded to the carbon atom of the site represented by 1 or 2 and the carbon atom of the site represented by either 3 or 4 in the following general formula (A-1').

[0033] (In the formula, R Ａ１ , m １ and * are the same as those in the general formula (A-1).)

[0034] Component (A) is, from the viewpoints of the resolution of vias, conductor adhesion, and dielectric properties, a compound obtained by modifying (a1) an epoxy resin with (a2) an ethylenically unsaturated group-containing organic acid [hereinafter sometimes referred to as component (A')], and reacting it with (a3) a saturated group- or unsaturated group-containing polybasic acid anhydride, which is preferably an acid-modified vinyl group-containing epoxy resin. Here, "acid modification" of the acid-modified vinyl group-containing epoxy resin means having an acidic substituent, "vinyl group" means an ethylenically unsaturated group, "epoxy resin" means using an epoxy resin as a raw material, and the acid-modified vinyl group-containing epoxy resin does not necessarily have to have an epoxy group and may not have an epoxy group. Hereinafter, preferred embodiments of component (A) obtained from (a1) an epoxy resin, (a2) an ethylenically unsaturated group-containing organic acid, and (a3) a saturated group- or unsaturated group-containing polybasic acid anhydride will be described.

[0035] (a1) Epoxy resin) The epoxy resin (a1) is preferably an epoxy resin having two or more epoxy groups. The epoxy resin (a1) may be used alone or in combination of two or more types. The epoxy resin (a1) is classified into glycidyl ether type epoxy resin, glycidylamine type epoxy resin, glycidyl ester type epoxy resin, etc. Among these, the glycidyl ether type epoxy resin is preferred.

[0036] (a1) Epoxy resins can be classified into various types based on differences in their main skeleton, including epoxy resins with an alicyclic skeleton, novolac-type epoxy resins, bisphenol-type epoxy resins, aralkyl-type epoxy resins, and other epoxy resins. Among these, epoxy resins with an alicyclic skeleton and bisphenol-type epoxy resins are preferred.

[0037] -Epoxy resin having an alicyclic skeleton- The alicyclic skeleton of the epoxy resin having an alicyclic skeleton will be described in the same way as the alicyclic skeleton of component (A) described above, and the preferred embodiments are also the same. As the epoxy resin having an alicyclic skeleton, the epoxy resin represented by the following general formula (A-2) is preferred.

[0038] (In the formula, R Ａ１ R represents an alkyl group having 1 to 12 carbon atoms and may be substituted anywhere in the above alicyclic skeleton. Ａ２ m represents an alkyl group with 1 to 12 carbon atoms. １ is an integer from 0 to 6, m ２ n is an integer between 0 and 3. n is a number between 0 and 50.

[0039] In general formula (A-2), R Ａ１ R in general formula (A-1) Ａ１ It is the same as and the preferred embodiment is also the same. R in general formula (A-2) Ａ２Examples of C1-C12 alkyl groups represented by include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, t-butyl group, n-pentyl group, etc. C1-C6 alkyl groups are preferred, C1-C3 alkyl groups are more preferred, and methyl groups are even more preferred. In general formula (A-2), m １ m in general formula (A-1) １ It is the same as, and the preferred embodiment is also the same. m in general formula (A-2) ２ n is an integer from 0 to 3, preferably 0 or 1, and more preferably 0. In general formula (A-2), n represents the number of repetitions of the structural unit in parentheses, and is a number from 0 to 50. Since epoxy resins are usually mixtures of structural units with different numbers of repetitions in parentheses, in that case, n is represented by the average value of the mixture. A number from 0 to 30 is preferred for n.

[0040] -Bisphenol-type epoxy resin- Examples of bisphenol-type epoxy resins include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, and 3,3',5,5'-tetramethyl-4,4'-diglycidyloxydiphenylmethane. Among these, bisphenol A type epoxy resin is preferred. As a bisphenol-type epoxy resin, an epoxy resin having a structural unit represented by the following general formula (A-3) is preferred.

[0041] (In the formula, R Ａ３ Y represents a hydrogen atom or a methyl group. Ａ１ Each of these independently represents a hydrogen atom or a glycidyl group. Multiple R Ａ３ These may be the same or different. ２ (This represents a number greater than or equal to 0.)

[0042] R Ａ３ From the viewpoint of improving the resolution of the via, it is preferable that both are methyl groups. Also, from the same viewpoint, Y Ａ１ It is preferable that it is a glycidyl group.

[0043] n ２The integer represents a number greater than or equal to 0, and can be appropriately selected from, for example, integers from 10 to 100, integers from 10 to 80, or integers from 15 to 60.

[0044] It is expressed by the above general formula (A-3), Y Ａ１ A bisphenol A-type epoxy resin or a bisphenol F-type epoxy resin in which is a glycidyl group is, for example, represented by the above general formula (A-3), Y Ａ１ The hydroxyl group (-OY) of a bisphenol A type epoxy resin or bisphenol F type epoxy resin is a hydrogen atom. Ａ１ It can be obtained by reacting it with epichlorohydrin.

[0045] Examples of novolac-type epoxy resins include bisphenol novolac-type epoxy resins such as bisphenol A novolac-type epoxy resin, bisphenol F novolac-type epoxy resin, and bisphenol S novolac-type epoxy resin; phenol novolac-type epoxy resin, cresol novolac-type epoxy resin, biphenyl novolac-type epoxy resin, and naphthol novolac-type epoxy resin. Examples of aralkyl-type epoxy resins include phenol aralkyl-type epoxy resin, biphenyl aralkyl-type epoxy resin, and naphthol aralkyl-type epoxy resin. Other epoxy resins include stilbene-type epoxy resin, naphthalene skeleton-containing epoxy resin, biphenyl-type epoxy resin, dihydroanthracene-type epoxy resin, cyclohexanedimethanol-type epoxy resin, trimethylol-type epoxy resin, alicyclic epoxy resin, aliphatic chain epoxy resin, heterocyclic epoxy resin, spiroring-containing epoxy resin, and rubber-modified epoxy resin.

[0046] (a2) Organic acid containing an ethylenically unsaturated group (a2) As the organic acid containing an ethylenically unsaturated group (a2), a monocarboxylic acid containing an ethylenically unsaturated group is preferred. The ethylenically unsaturated group that component (a2) has is the same as that listed as the ethylenically unsaturated group that component (A) has. Examples of component (a2) include acrylic acid derivatives such as acrylic acid, acrylic acid dimers, methacrylic acid, β-furfurylacrylic acid, β-styrylacrylic acid, cinnamic acid, crotonic acid, and α-cyanocinnamic acid; semi-ester compounds which are reaction products of hydroxyl group-containing acrylates and dibasic acid anhydrides; and semi-ester compounds which are reaction products of vinyl group-containing monoglycidyl ethers or vinyl group-containing monoglycidyl esters and dibasic acid anhydrides. Component (a2) may be used alone or in combination of two or more.

[0047] The above-mentioned semi-ester compounds are obtained by reacting one or more ethylenically unsaturated group-containing compounds selected from the group consisting of hydroxyl group-containing acrylates, vinyl group-containing monoglycidyl ethers, and vinyl group-containing monoglycidyl esters with a dibasic acid anhydride. In this reaction, it is preferable to react the ethylenically unsaturated group-containing compound and the dibasic acid anhydride in equimolar amounts.

[0048] Examples of hydroxyl group-containing acrylates used in the synthesis of the above-mentioned semi-ester compounds include hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, polyethylene glycol mono(meth)acrylate, trimethylolpropanedi(meth)acrylate, pentaerythritol tri(meth)acrylate, and dipentaerythritol penta(meth)acrylate. Examples of vinyl group-containing monoglycidyl ethers include glycidyl (meth)acrylate.

[0049] The dibasic acid anhydride used in the synthesis of the above-mentioned semi-ester compound may contain saturated groups or unsaturated groups. Examples of dibasic acid anhydrides include succinic anhydride, maleic anhydride, tetrahydrophthalic anhydride, phthalic anhydride, methyltetrahydrophthalic anhydride, ethyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, ethylhexahydrophthalic anhydride, and itaconic anhydride.

[0050] Component (A'), obtained by reacting component (a1) and component (a2), has hydroxyl groups formed by a ring-opening addition reaction between the epoxy group of component (a1) and the carboxyl group of component (a2) when an ethylenically unsaturated monocarboxylic acid is used as component (a2). Next, by further reacting component (a3) ​​with component (A'), an acid-modified vinyl group-containing epoxy resin can be obtained in which the hydroxyl groups of component (A') (including hydroxyl groups originally present in component (a1)) and the acid anhydride group of component (a3) ​​are semi-esterified.

[0051] (a3) Polybasic acid anhydride containing saturated or unsaturated groups The (a3) ​​component may contain saturated groups or unsaturated groups. Examples of (a3) ​​components include succinic anhydride, maleic anhydride, tetrahydrophthalic anhydride, phthalic anhydride, methyltetrahydrophthalic anhydride, ethyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, ethylhexahydrophthalic anhydride, itaconic anhydride, etc. Among these, tetrahydrophthalic anhydride is preferred from the viewpoint of via resolution. The (a3) ​​component may be used alone or in combination of two or more.

[0052] In the reaction between component (A') and component (a3), for example, the acid value of the acid-modified vinyl group-containing epoxy resin can be adjusted by reacting 0.1 to 1.0 equivalents of component (a3) ​​with 1 equivalent of hydroxyl groups in component (A').

[0053] (Content of component (A)) The content of component (A) in the photosensitive resin composition of this embodiment is preferably 5 to 80% by mass, more preferably 10 to 70% by mass, even more preferably 15 to 60% by mass, even more preferably 20 to 55% by mass, and particularly preferably 30 to 50% by mass, based on the total amount of resin components in the photosensitive resin composition of this embodiment, from the viewpoint of heat resistance, dielectric properties, chemical resistance and conductor adhesion.

[0054] <One or more selected from the group consisting of (B) a silane coupling agent having a (meth)acryloyl group and an alkoxysilyl group and components derived from the silane coupling agent> The photosensitive resin composition of this embodiment contains one or more selected from the group consisting of (B) a silane coupling agent having a (meth)acryloyl group and an alkoxysilyl group and components derived from the silane coupling agent. In the photosensitive resin composition of this embodiment, component (B) contributes to improving the dielectric properties, chemical resistance and conductor adhesion of the cured product of the photosensitive resin composition. Although the detailed reasons are unknown, it is presumed that one reason is that component (B) has a (meth)acryloyl group which has excellent photopolymerization reactivity and can contribute to the crosslinking structure of the photosensitive resin composition, and that it has an alkoxysilyl group which can contribute to improving the strength of the inorganic-organic adhesive interface. Component (B) may be used alone or two or more may be used in combination.

[0055] In the following description, a silane coupling agent having a (meth)acryloyl group and an alkoxysilyl group, which is one embodiment of component (B), will be referred to as "silane coupling agent (B1)".

[0056] The number of (meth)acryloyl groups in the silane coupling agent (B1) may be one or more, preferably 1 to 3, more preferably 1 or 2, and even more preferably 1, from the viewpoint of dielectric properties, chemical resistance, and conductor adhesion.

[0057] The number of carbon atoms in the alkyl group constituting the alkoxysilyl group of the silane coupling agent (B1) is preferably 1 to 10, more preferably 1 to 5, even more preferably 1 to 3, and particularly preferably 1 or 2, from the viewpoint of dielectric properties, chemical resistance, and conductor adhesion. The alkyl group may be linear or branched. The alkoxysilyl group may be a monoalkoxysilyl group having one alkoxy group directly bonded to a silicon atom, a dialkoxysilyl group having two alkoxy groups directly bonded to a silicon atom, or a trialkoxysilyl group having three alkoxy groups directly bonded to a silicon atom, but the trialkoxysilyl group is preferred. Examples of trialkoxysilyl groups include trimethoxysilyl, triethoxysilyl, and tripropoxysilyl groups. Among these, the trimethoxysilyl group is preferred. Examples of substituents other than the alkoxy group that the alkoxysilyl group may have when it is a monoalkoxysilyl or dialkoxysilyl group include alkyl groups. The number of carbon atoms in the alkyl group is preferably 1 to 10, more preferably 1 to 5, even more preferably 1 to 3, and particularly preferably 1 or 2. The alkyl group may be linear or branched. From the viewpoint of dielectric properties, chemical resistance, and conductor adhesion, the number of alkoxysilyl groups in one molecule of the silane coupling agent having a (meth)acryloyl group and an alkoxysilyl group may be one or more, preferably 1 to 3, more preferably 1 or 2, and even more preferably 1.

[0058] Examples of silane coupling agents (B1) include 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, and 3-acryloxypropyltrimethoxysilane. Among these, 3-methacryloxypropyltrimethoxysilane is preferred from the viewpoint of dielectric properties, chemical resistance, and conductor adhesion.

[0059] One embodiment of component (B), "a component derived from a silane coupling agent having a (meth)acryloyl group and an alkoxysilyl group," includes, for example, a product formed by the condensation of silane coupling agents (B1) with each other, or a product formed by the reaction of silane coupling agent (B1) with the surface of the inorganic filler (E) described later.

[0060] (Content of component (B)) When the photosensitive resin composition of this embodiment contains component (B), the content of component (B) in the photosensitive resin composition of this embodiment is preferably 0.001 to 5% by mass, more preferably 0.01 to 3% by mass, even more preferably 0.05 to 1% by mass, and particularly preferably 0.1 to 0.5% by mass, based on the total solid content of the photosensitive resin composition of this embodiment, from the viewpoint of dielectric properties, chemical resistance and conductive adhesion.

[0061] <(C) Thermosetting Resin> The photosensitive resin composition of this embodiment further contains (C) thermosetting resin. By containing (C) thermosetting resin in the photosensitive resin composition of this embodiment, the heat resistance of the cured product of the photosensitive resin composition of this embodiment is further improved. Compounds that satisfy the requirements of component (A), component (B), or component (F) are classified as component (A), component (B), or component (F), respectively, even if they are thermosetting, and are not included in the concept of (C) thermosetting resin. (C) thermosetting resin may be used alone or in combination of two or more types.

[0062] The photosensitive resin composition of this embodiment contains, from the viewpoint of heat resistance, conductive adhesion, and dielectric properties, one or more thermosetting resins selected from the group consisting of maleimide resins and allyl resins.

[0063] (Maleimide Resins) Maleimide resins include aromatic maleimide compounds having an N-substituted maleimide group directly bonded to an aromatic ring, and aliphatic maleimide compounds having an N-substituted maleimide group directly bonded to an aliphatic hydrocarbon. Among these, aromatic maleimide compounds are preferred from the viewpoint of heat resistance and ease of handling, and aromatic bismaleimide compounds are more preferred. Examples of aromatic maleimide compounds include bis(4-maleimidophenyl)methane, 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethanebismaleimide, polyphenylmethanemaleimide, biphenylaralkyl type maleimide resins, and aromatic bismaleimide resins having an indan skeleton. Among these, aromatic bismaleimide resins having an indan skeleton are preferred. As aromatic bismaleimide resins having an indan skeleton, compounds represented by the following general formula (C-1) are preferred.

[0064] (In the formula, R Ｃ１ Each of these is independently a C1-C10 alkyl group, a C1-C10 alkyloxy group, a C1-C10 alkylthio group, a C6-C10 aryl group, a C6-C10 aryloxy group, a C6-C10 arylthio group, a C3-C10 cycloalkyl group, a halogen atom, a hydroxyl group, or a mercapto group. Ｃ１ Each of these is an integer between 0 and 3, independently of the others. Ｃ２ ~R Ｃ４ Each of these is an alkyl group having 1 to 10 carbon atoms. Ｃ５ Each of these is independently a C1-C10 alkyl group, a C1-C10 alkyloxy group, a C1-C10 alkylthio group, a C6-C10 aryl group, a C6-C10 aryloxy group, a C6-C10 arylthio group, a C3-C10 cycloalkyl group, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group. Ｃ２ Each of these is an integer between 0 and 4, independently of the others. Ｃ３ (This is a number between 0.95 and 10.0.)

[0065] In the above general formula (C-1), R Ｃ１ ~RＣ５ Examples of C1-C10 alkyl groups represented by include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, and decyl groups. These alkyl groups may be linear or branched. Ｃ１ or R Ｃ５ Examples of alkyl groups included in the C1-C10 alkyloxy group and C1-C10 alkylthio group represented by the above include the same C1-C10 alkyl groups. Ｃ１ or R Ｃ５ Examples of aryl groups having 6 to 10 carbon atoms represented by R include the phenyl group and the naphthyl group. Ｃ１ or R Ｃ５ The aryl groups included in the aryloxy group and arylthio group having 6 to 10 carbon atoms represented by the above-mentioned aryl group having 6 to 10 carbon atoms are the same as those mentioned above. Ｃ１ or R Ｃ５ Examples of cycloalkyl groups having 3 to 10 carbon atoms represented by the above general formula (C-1) include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, cyclononyl, and cyclodecyl groups. Ｃ３ From the viewpoint of dielectric properties, conductor adhesion, solvent solubility, handling properties, and heat resistance, the values ​​are preferably a number from 0.98 to 8.0, more preferably a number from 1.0 to 7.0, and even more preferably a number from 1.1 to 6.0.

[0066] (Allyl Resins) Examples of allyl resins include compounds having two or more allyl groups. Examples of compounds having two or more allyl groups include allyl group-containing isocyanurate compounds, allyl group-containing cyanurate compounds, and allyl group-containing glycoluryl compounds. Examples of allyl group-containing isocyanurate compounds include isocyanurate compounds having two allyl groups, such as diallyl isocyanurate, and isocyanurate compounds having three allyl groups, such as triallyl isocyanurate. Examples of allyl group-containing cyanurate compounds include cyanurate compounds having two allyl groups, such as diallyl cyanurate, and cyanurate compounds having three allyl groups, such as triallyl cyanurate. Examples of allyl group-containing glycoluryl compounds include 1,3,4,6-tetraallyl glycoluryl. Among these, allyl group-containing isocyanurate compounds are preferred, and isocyanurate compounds having two allyl groups are more preferred. As an isocyanurate compound having two allyl groups, the compound represented by the following general formula (C-2) is preferred.

[0067] (In the formula, R Ｃ６ (This refers to a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms.)

[0068] In the above general formula (C-2), R Ｃ６ The substituted or unsubstituted alkyl group having 1 to 20 carbon atoms represented by is preferably an unsubstituted alkyl group having 1 to 20 carbon atoms, more preferably an unsubstituted alkyl group having 3 to 15 carbon atoms, and even more preferably an unsubstituted alkyl group having 5 to 12 carbon atoms.

[0069] If the photosensitive resin composition of this embodiment contains a maleimide resin as (C) a thermosetting resin, the maleimide resin content in the photosensitive resin composition of this embodiment is preferably 1 to 35% by mass, more preferably 3 to 25% by mass, and even more preferably 5 to 15% by mass, based on the total amount of resin components in the photosensitive resin composition of this embodiment, from the viewpoint of heat resistance, dielectric properties and conductive adhesion.

[0070] If the photosensitive resin composition of this embodiment contains an allyl resin as (C) a thermosetting resin, the allyl resin content in the photosensitive resin composition of this embodiment is preferably 1 to 35% by mass, more preferably 3 to 25% by mass, and even more preferably 5 to 15% by mass, based on the total amount of resin components in the photosensitive resin composition of this embodiment, from the viewpoint of heat resistance, dielectric properties, and conductive adhesion.

[0071] (C) The total content of maleimide resin and allyl resin contained in the thermosetting resin (or, if only one of maleimide resin or allyl resin is contained, the content of the contained component) is preferably 20% by mass or more, more preferably 30% by mass or more, even more preferably 50% by mass or more, and may be 100% by mass, 90% by mass or less, or 80% by mass or less.

[0072] The photosensitive resin composition of this embodiment may or may not contain one or more thermosetting resins other than those selected from the group consisting of maleimide resins and allyl resins (hereinafter also referred to as "other thermosetting resins"). Examples of other thermosetting resins include epoxy resins, isocyanate resins, phenolic resins, cyanate resins, benzoxazine resins, oxetane resins, amino resins, unsaturated polyester resins, vinyl resins, dicyclopentadiene resins, silicone resins, triazine resins, melamine resins, and other known thermosetting resins. Among these, one or more selected from the group consisting of epoxy resins and isocyanate resins are preferred.

[0073] (Epoxy resin) As the epoxy resin, an epoxy resin having two or more epoxy groups is preferred. Epoxy resins are classified into, for example, glycidyl ether type epoxy resins, glycidyl amine type epoxy resins, glycidyl ester type epoxy resins, etc. Among these, glycidyl ether type epoxy resins are preferred.

[0074] Furthermore, epoxy resins are classified into various types based on differences in their main skeleton, and each of the aforementioned types of epoxy resins is further classified as follows: Specifically, epoxy resins include, for example, bisphenol-type epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, and bisphenol S type epoxy resin; bisphenol-based novolac type epoxy resins such as bisphenol A novolac type epoxy resin and bisphenol F novolac type epoxy resin; novolac type epoxy resins other than the aforementioned bisphenol-based novolac type epoxy resins, such as phenol novolac type epoxy resin, cresol novolac type epoxy resin, and biphenyl novolac type epoxy resin; phenol aralkyl type epoxy resin; and stilbene type epoxy resin. Epoxy resins are classified into the following categories: lipids; naphthalene skeleton-containing epoxy resins such as naphthol novolac type epoxy resin, naphthol type epoxy resin, naphthol aralkyl type epoxy resin, and naphthylene ether type epoxy resin; biphenyl type epoxy resin; biphenyl aralkyl type epoxy resin; xylylene type epoxy resin; dihydroanthracene type epoxy resin; alicyclic epoxy resins such as saturated dicyclopentadiene type epoxy resin; heterocyclic epoxy resin; spiroring-containing epoxy resin; cyclohexanedimethanol type epoxy resin; trimethylol type epoxy resin; aliphatic chain epoxy resin; rubber-modified epoxy resin; and so on. Among these, bisphenol type epoxy resin, naphthalene skeleton-containing epoxy resin, and biphenyl aralkyl type epoxy resin are preferred, with naphthalene skeleton-containing epoxy resin being more preferred.

[0075] (Isocyanate resins) Examples of isocyanate resins include compounds having two or more isocyanate groups. Compounds having two or more isocyanate groups include aliphatic isocyanates having two or more isocyanate groups, such as trimethylene diisocyanate, tetramethylene diisocyanate, pentamethylene diisocyanate, hexamethylene diisocyanate, and trimethylhexamethylene diisocyanate; alicyclic isocyanates having two or more isocyanate groups, such as 1,3-cyclopentane diisocyanate, 1,4-cyclohexane diisocyanate, 1,2-cyclohexane diisocyanate, isophorone diisocyanate, and norbornane diisocyanate; aromatic isocyanates having two or more isocyanate groups, such as xylylene diisocyanate, 2,4-tolylene diisocyanate, and 2,6-tolylene diisocyanate; their biuret forms; and their nurates. Among these, aliphatic isocyanates having two or more isocyanate groups are preferred, and hexamethylene diisocyanate is more preferred.

[0076] If the photosensitive resin composition of this embodiment contains an epoxy resin as (C) thermosetting resin, the epoxy resin content in the photosensitive resin composition of this embodiment is preferably 1 to 30% by mass, more preferably 2 to 20% by mass, and even more preferably 3 to 10% by mass, based on the total amount of resin components in the photosensitive resin composition of this embodiment, from the viewpoint of heat resistance, dielectric properties and conductive adhesion.

[0077] If the photosensitive resin composition of this embodiment contains an isocyanate resin as (C) thermosetting resin, the isocyanate resin content in the photosensitive resin composition of this embodiment is preferably 0.5 to 20% by mass, more preferably 1 to 10% by mass, and even more preferably 2 to 7% by mass, based on the total amount of resin components in the photosensitive resin composition of this embodiment, from the viewpoint of heat resistance, dielectric properties and conductive adhesion.

[0078] (Content of (C) Thermosetting Resin) The total content of (C) thermosetting resin in the photosensitive resin composition of this embodiment is preferably 5 to 60% by mass, more preferably 10 to 50% by mass, even more preferably 15 to 40% by mass, and particularly preferably 20 to 30% by mass, based on the total amount of resin components in the photosensitive resin composition of this embodiment, from the viewpoint of heat resistance, dielectric properties and conductive adhesion.

[0079] <(D) Organic Peroxide> The photosensitive resin composition of this embodiment further contains (D) organic peroxide. (D) organic peroxide is a polymerization initiator for the thermal radical polymerization reaction of ethylenically unsaturated groups. The inclusion of (D) organic peroxide in the photosensitive resin composition of this embodiment further improves the dielectric properties of the cured product of the photosensitive resin composition of this embodiment. One type of (D) organic peroxide may be used alone, or two or more types may be used in combination.

[0080] (D) Examples of organic peroxides include peroxyketals such as 1,1-di(t-butylperoxy)cyclohexane, 2,2-di(t-butylperoxy)butane, 2,2-di(4,4-di-t-butylperoxycyclohexyl)propane, and 1,1-di(t-amylperoxy)cyclohexane; hydroperoxides such as cumene hydroperoxide and t-butyl hydroperoxide; alkyl peroxides such as t-butylperoxyacetate and t-amylperoxyisononanoate; and t-butylcumylperoxide and di-t-butyl Examples include dialkyl peroxides such as t-butyl peroxide, dicumyl peroxide, di-t-hexyl peroxide, and 1,3-di(t-butylperoxyisopropyl)benzene; peroxyesters such as t-butyl peroxyacetate, t-butyl peroxybenzoate, and t-butylperoxyisopropyl monocarbonate; peroxycarbonates such as t-butylperoxyisopropyl carbonate and polyethertetrakis(t-butylperoxycarbonate); and diacyl peroxides such as dibenzoyl peroxide. Among these, 1,3-di(t-butylperoxyisopropyl)benzene is preferred.

[0081] (Content of (D) Organic Peroxide) When the photosensitive resin composition of this embodiment contains (D) organic peroxide, the content of (D) organic peroxide in the photosensitive resin composition of this embodiment is preferably 0.05 to 15 parts by mass, more preferably 0.1 to 10 parts by mass, even more preferably 0.5 to 7 parts by mass, even more preferably 1 to 5 parts by mass, and particularly preferably 2 to 4 parts by mass, based on 100 parts by mass of the total amount of resin components in the photosensitive resin composition of this embodiment.

[0082] If the photosensitive resin composition of this embodiment contains (D) organic peroxide, the content of (D) organic peroxide in the photosensitive resin composition of this embodiment is preferably 0.01 to 10% by mass, more preferably 0.05 to 8% by mass, even more preferably 0.1 to 6% by mass, even more preferably 0.3 to 4% by mass, and particularly preferably 0.5 to 2% by mass, based on the total solid content of the photosensitive resin composition of this embodiment, from the viewpoint of heat resistance, dielectric properties, chemical resistance and conductor adhesion.

[0083] <(E) Inorganic Filler> The photosensitive resin composition of this embodiment preferably further contains (E) an inorganic filler. The inclusion of (E) an inorganic filler in the photosensitive resin composition of this embodiment tends to further improve the low thermal expansion, heat resistance, and flame retardancy of the cured product of the photosensitive resin composition of this embodiment. One type of (E) inorganic filler may be used alone, or two or more types may be used in combination.

[0084] (E) Examples of inorganic fillers include silica, alumina, titanium oxide, mica, beryllium, barium titanate, potassium titanate, strontium titanate, calcium titanate, aluminum carbonate, magnesium hydroxide, aluminum silicate, calcium carbonate, calcium silicate, magnesium silicate, silicon nitride, boron nitride, clay, molybdate compounds, talc, aluminum borate, silicon carbide, etc. Among these, silica and alumina are preferred from the viewpoint of thermal expansion coefficient, heat resistance and flame retardancy, and silica is more preferred. Examples of silica include crushed silica, fumed silica, and fused silica. (E) Examples of inorganic filler shapes include spherical and crushed shapes, with spherical being preferred.

[0085] (E) Volume average particle size of inorganic filler (D ５０ The volume average particle diameter (D) is preferably 0.01 to 10 μm, more preferably 0.05 to 5 μm, even more preferably 0.1 to 2 μm, and particularly preferably 0.2 to 1.2 μm. In this specification, the volume average particle diameter (D) is used. ５０ The particle size can be determined by using a submicron particle analyzer (manufactured by Beckman Coulter, Inc., product name: N5) in accordance with the international standard ISO 13321, measuring particles dispersed in a solvent with a refractive index of 1.38, and determining the particle size as the particle diameter corresponding to 50% of the cumulative value (by volume) in the particle size distribution.

[0086] (E) The inorganic filler is preferably surface-treated with a surface treatment agent, and more preferably is an inorganic filler (E1) surface-treated with a silane coupling agent (B1), from the viewpoint of dielectric properties, chemical resistance and conductive adhesion. When a coupling agent is used, the treatment method may be a so-called integral blend treatment method in which the inorganic filler is blended into the photosensitive resin composition and then the coupling agent is added, or it may be a method in which the surface is treated with the coupling agent beforehand, either dry or wet.

[0087] When the photosensitive resin composition of this embodiment contains an inorganic filler (E1) surface-treated with a silane coupling agent (B1), the content of the inorganic filler (E1) surface-treated with the silane coupling agent (B1) in the photosensitive resin composition of this embodiment is preferably 5 to 80% by mass, more preferably 10 to 75% by mass, even more preferably 20 to 70% by mass, even more preferably 40 to 65% by mass, and particularly preferably 50 to 60% by mass, based on the total solid content of the photosensitive resin composition of this embodiment, from the viewpoint of low thermal expansion, heat resistance, flame retardancy, dielectric properties, chemical resistance, and conductor adhesion.

[0088] The photosensitive resin composition of this embodiment may or may not contain an inorganic filler that has not been surface-treated with the silane coupling agent (B1). From the viewpoint of dielectric properties, chemical resistance and conductor adhesion, the content of the inorganic filler that has not been surface-treated with the silane coupling agent (B1) in the photosensitive resin composition of this embodiment is preferably 20% by mass or less, more preferably 10% by mass or less, even more preferably 5% by mass or less, even more preferably 1% by mass or less, and particularly preferably 0% by mass, based on the total solid content of the photosensitive resin composition of this embodiment.

[0089] (Content of (E) Inorganic Filler) When the photosensitive resin composition of this embodiment contains (E) an inorganic filler, the total content of (E) an inorganic filler in the photosensitive resin composition of this embodiment is preferably 5 to 80% by mass, more preferably 10 to 75% by mass, even more preferably 20 to 70% by mass, even more preferably 40 to 65% by mass, and particularly preferably 50 to 60% by mass, based on the total solid content of the photosensitive resin composition of this embodiment, from the viewpoint of low thermal expansion, heat resistance, flame retardancy, dielectric properties, chemical resistance and conductor adhesion.

[0090] <(F) Compound having two or more ethylenically unsaturated groups and lacking acidic substituents and alkoxysilyl groups> The photosensitive resin composition of this embodiment preferably further contains (F) a compound having two or more ethylenically unsaturated groups and lacking acidic substituents and alkoxysilyl groups. Component (F) reacts with the ethylenically unsaturated groups of component (A) to increase the crosslinking density of the photosensitive resin composition after curing. The inclusion of component (F) in the photosensitive resin composition of this embodiment tends to further improve the heat resistance and dielectric properties of the cured product of the photosensitive resin composition of this embodiment. Component (F) may be used alone or in combination of two or more types.

[0091] Examples of ethylenically unsaturated groups in component (F) include vinyl groups, allyl groups, propargyl groups, butenyl groups, ethynyl groups, phenylethynyl groups, maleimide groups, nadiimide groups, and (meth)acryloyl groups. Among these, (meth)acryloyl groups are preferred from the viewpoint of reactivity and via resolution.

[0092] Examples of component (F) include difunctional monomers having two (meth)acryloyl groups and polyfunctional monomers having three or more (meth)acryloyl groups. It is preferable that component (F) contains the above-mentioned polyfunctional monomers.

[0093] Examples of the above-mentioned difunctional monomers include aliphatic di(meth)acrylates such as trimethylolpropane di(meth)acrylate, polypropylene glycol di(meth)acrylate, and polyethylene glycol di(meth)acrylate; di(meth)acrylates having an alicyclic skeleton such as dicyclopentadiene di(meth)acrylate and tricyclodecanedimethanol di(meth)acrylate; and aromatic di(meth)acrylates such as 2,2-bis(4-(meth)acryloxypolyethoxypolypropoxyphenyl)propane and bisphenol A diglycidyl ether di(meth)acrylate.

[0094] Examples of the above-mentioned polyfunctional monomers include (meth)acrylate compounds having a trimethylolpropane-derived skeleton such as trimethylolpropane tri(meth)acrylate; (meth)acrylate compounds having a tetramethylolmethane-derived skeleton such as tetramethylolmethane tri(meth)acrylate and tetramethylolmethane tetra(meth)acrylate; (meth)acrylate compounds having a pentaerythritol-derived skeleton such as pentaerythritol tri(meth)acrylate and pentaerythritol tetra(meth)acrylate; (meth)acrylate compounds having a dipentaerythritol-derived skeleton such as dipentaerythritol penta(meth)acrylate and dipentaerythritol hexa(meth)acrylate; (meth)acrylate compounds having a ditrimethylolpropane-derived skeleton such as ditrimethylolpropane tetra(meth)acrylate; and (meth)acrylate compounds having a diglycerin-derived skeleton. Among these, from the viewpoint of via resolution and conductor adhesion, (meth)acrylate compounds having a trimethylolpropane-derived skeleton, such as trimethylolpropane tri(meth)acrylate, are preferred, and trimethylolpropane tri(meth)acrylate is more preferred. Here, the above-mentioned "(meth)acrylate compound having a skeleton derived from XXX" (where XXX is the name of the compound) means an esterified product of XXX and (meth)acrylic acid, and this esterified product also includes compounds modified with alkylene oxy groups.

[0095] (Content of component (F)) When the photosensitive resin composition of this embodiment contains component (F), the content of component (F) in the photosensitive resin composition of this embodiment is preferably 5 to 70% by mass, more preferably 10 to 60% by mass, even more preferably 15 to 50% by mass, and particularly preferably 20 to 40% by mass, based on the total amount of resin components of the photosensitive resin composition of this embodiment, from the viewpoint of heat resistance and dielectric properties.

[0096] <(G) Photopolymerization Initiator> The photosensitive resin composition of this embodiment preferably further contains (G) a photopolymerization initiator. The photosensitive resin composition of this embodiment tends to have improved via resolution by containing (G) a photopolymerization initiator. (G) A single type of photopolymerization initiator may be used, or two or more types may be used in combination.

[0097] (G) The photopolymerization initiator is not particularly limited as long as it can photopolymerize ethylenically unsaturated groups, and can be appropriately selected from commonly used photopolymerization initiators. (G) Examples of photopolymerization initiators include benzoin compounds such as benzoin, benzoin methyl ether, and benzoin isopropyl ether; acetophenone compounds such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone, 1-hydroxycyclohexylphenyl ketone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone, 2-[4-(methylthio)benzoyl]-2-(4-morpholinyl)propane, and N,N-dimethylaminoacetophenone; 2-methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, 1-chloroanthraquinone, 2-amylanthraquinone, 2 Examples include anthraquinone compounds such as aminoanthraquinone; ketal compounds such as acetophenone dimethyl ketal and benzyl dimethyl ketal; acridine compounds such as 9-phenylacridine and 1,7-bis(9,9'-acridinyl)heptane; acylphosphine oxide compounds such as bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide; and oxime ester compounds such as 1,2-octanedione-1-[4-(phenylthio)phenyl]-2-(O-benzoyl oxime), 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]ethanone-1-(O-acetyl oxime), and 1-phenyl-1,2-propanedione-2-[O-(ethoxycarbonyl)oxime]. Among these, acylphosphine oxide compounds are preferred from the viewpoint of improving bottom curability, and bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide is more preferred.

[0098] (Content of (G) Photopolymerization Initiator) When the photosensitive resin composition of this embodiment contains (G) a photopolymerization initiator, the content of (G) in the photosensitive resin composition of this embodiment is preferably 0.01 to 20 parts by mass, more preferably 0.1 to 10 parts by mass, even more preferably 0.5 to 5 parts by mass, and particularly preferably 1 to 3 parts by mass, based on 100 parts by mass of the total amount of resin components in the photosensitive resin composition of this embodiment.

[0099] <(H) Curing Accelerator> The photosensitive resin composition of this embodiment preferably further contains (H) a curing accelerator. The inclusion of (H) a curing accelerator in the photosensitive resin composition of this embodiment tends to further improve the heat resistance, dielectric properties, etc. of the cured product of the photosensitive resin composition of this embodiment. (H) A curing accelerator may be used alone or in combination of two or more types.

[0100] (H) As curing accelerators, imidazole compounds such as 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 2-phenylimidazole, 2-phenyl-1-benzyl-1H-imidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, isocyanate-masquimidazole (addition reaction product of hexamethylene diisocyanate resin and 2-ethyl-4-methylimidazole); trimethylamine, N,N-dimethyloctylamine, N-benzyldimethylamine, pyridine, N-methylmorpholine, hexa(N-methyl)melamine, 2,4,6-tris(dimethylaminophenol), tetramethyl Examples include tertiary amines such as luguanidine and m-aminophenol; organic phosphines such as tributylphosphine, triphenylphosphine, and tris-2-cyanoethylphosphine; phosphonium salts such as tri-n-butyl(2,5-dihydroxyphenyl)phosphonium bromide and hexadecyltributylphosphonium chloride; quaternary ammonium salts such as benzyltrimethylammonium chloride and phenyltributylammonium chloride; the polybasic anhydrides mentioned above; diphenyliodonium tetrafluoroborate, triphenylsulfonium hexafluoroantimonate, and 2,4,6-triphenylthiopyrillium hexafluorophosphate. Among these, imidazole compounds are preferred from the viewpoint of obtaining excellent curing properties.

[0101] (Content of (H) curing accelerator) When the photosensitive resin composition of this embodiment contains (H) curing accelerator, the content of (H) curing accelerator in the photosensitive resin composition of this embodiment is preferably 0.01 to 10 parts by mass, more preferably 0.05 to 5 parts by mass, and even more preferably 0.1 to 1 part by mass, based on 100 parts by mass of the total amount of resin components in the photosensitive resin composition of this embodiment, from the viewpoint of improving heat resistance and dielectric properties.

[0102] <(I) Other Components> The photosensitive resin composition of this embodiment may optionally contain (I) other components. Examples of (I) other components include resins other than the above components; curing agents; organic fillers; sensitizers; polymerization inhibitors; foam stabilizers; pigments; adhesive aids such as melamine; foam stabilizers such as silicone compounds; thickeners; flame retardants; organic solvents, etc. Each of these may be used alone or in combination of two or more. The content of (I) other components in the photosensitive resin composition of this embodiment may be adjusted as appropriate according to the respective purpose, but each may be 0.01 to 10% by mass, 0.05 to 5% by mass, or 0.1 to 1% by mass based on the total solid content of the photosensitive resin composition.

[0103] <Method for producing the photosensitive resin composition> The photosensitive resin composition of this embodiment can be obtained by kneading and mixing each component in a roll mill, bead mill, or the like.

[0104] [Photosensitive Resin Film] The photosensitive resin film of this embodiment is a photosensitive resin film containing the photosensitive resin composition of this embodiment. This photosensitive resin film is useful as a photosensitive layer for forming an interlayer insulating layer. The components in the photosensitive resin film of this embodiment and their content are as described in the description of the components in the photosensitive resin composition of this embodiment and their content.

[0105] The photosensitive resin film of this embodiment may be provided on a carrier film. Examples of carrier films include polyesters such as polyethylene terephthalate and polybutylene terephthalate; and polyolefins such as polypropylene and polyethylene. The thickness of the carrier film is preferably 5 to 100 μm, more preferably 10 to 60 μm, and even more preferably 15 to 45 μm. The photosensitive resin film of this embodiment may also have a protective film on the side opposite to the side in contact with the carrier film.

[0106] The photosensitive resin film of this embodiment can be formed, for example, by applying and drying the photosensitive resin composition of this embodiment onto a carrier film using a known coating apparatus such as a comma coater, bar coater, kiss coater, roll coater, gravure coater, or die coater. The coating film formed by applying the photosensitive resin composition can be dried using a hot air dryer, a far-infrared ray dryer, or a near-infrared ray dryer. The drying temperature is preferably 60 to 150°C, more preferably 70 to 120°C, and even more preferably 80 to 110°C. The drying time is preferably 1 to 60 minutes, more preferably 2 to 30 minutes, and even more preferably 5 to 20 minutes. The content of residual diluent in the photosensitive resin film after drying is preferably 3% by mass or less, more preferably 2% by mass or less, and even more preferably 1% by mass or less, from the viewpoint of avoiding the diffusion of the diluent during the manufacturing process of printed circuit boards.

[0107] The thickness of the photosensitive resin film in this embodiment is preferably 1 to 100 μm, more preferably 3 to 60 μm, and even more preferably 5 to 40 μm, from the viewpoint of thinning the printed circuit board.

[0108] [Printed Wiring Board] The printed wiring board of this embodiment is a printed wiring board that includes a cured product of the photosensitive resin composition of this embodiment. Preferably, the printed wiring board of this embodiment has an interlayer insulating layer which is a cured product of the photosensitive resin film of this embodiment. The "interlayer insulating layer" of the printed wiring board of this embodiment also includes the state after various processing or treatments such as the formation of vias and wiring and roughening treatment have been performed.

[0109] The method for manufacturing a printed circuit board according to this embodiment is not particularly limited as long as it uses the photosensitive resin film of this embodiment, but a method for manufacturing a printed circuit board that includes the following (1) to (4) is preferred. (1): Laminating the photosensitive resin film of this embodiment to one or both sides of a circuit board (hereinafter also referred to as the "laminating step (1)"). (2): Forming an interlayer insulating layer having vias by exposing and developing the photosensitive resin film laminated in (1) (hereinafter also referred to as the "via formation step (2)"). (3): Heat curing the interlayer insulating layer having vias (hereinafter also referred to as the "heat curing step (3)"). (4): Forming a circuit pattern on the interlayer insulating layer (hereinafter also referred to as the "circuit pattern formation step (4)").

[0110] The method for manufacturing a printed circuit board according to this embodiment will be described below with reference to Figure 1 as appropriate. In this specification, for convenience, certain operations may be referred to as "step XX," but "step XX" is not limited to the embodiments specifically described herein.

[0111] (Laminating process (1)) In laminating process (1), the photosensitive resin film of this embodiment is laminated to one or both sides of the circuit board. Figure 1(a) illustrates the process of forming a photosensitive layer 103 on both sides of a substrate 101 having a circuit pattern 102. The photosensitive layer 103 can be formed by laminating the photosensitive resin film of this embodiment to both sides of the substrate 101. Lamination can be performed, for example, by pressing and heating using a vacuum laminator. If a carrier film is attached to the photosensitive layer 103 after lamination, the carrier film may be peeled off before exposure, as described later, or after exposure.

[0112] (Via formation process (2)) In via formation process (2), an interlayer insulating layer having vias is formed by exposing and developing the photosensitive layer formed in lamination process (1). Figure 1(b) illustrates the process of forming an interlayer insulating layer 104 having vias 105 by exposing and developing the photosensitive layer 103. Exposing the photosensitive layer 103 initiates a photoradical polymerization reaction, thereby curing the photosensitive resin film.

[0113] The method for exposing the photosensitive layer 103 may be, for example, a mask exposure method in which active light is irradiated in an image pattern through a negative or positive mask pattern called artwork, or a direct drawing exposure method such as LDI (Laser Direct Imaging) exposure or DLP (Digital Light Processing) exposure, in which active light is irradiated in an image pattern. Examples of light sources for the active light include gas lasers such as carbon arc lamps, mercury vapor arc lamps, high-pressure mercury lamps, xenon lamps, and argon lasers; solid-state lasers such as YAG lasers; and known light sources such as semiconductor lasers that effectively emit ultraviolet or visible light. The exposure amount can be appropriately adjusted depending on the light source used and the thickness of the photosensitive layer. For example, when exposing a photosensitive layer with a thickness of 1 to 100 μm using ultraviolet irradiation from a high-pressure mercury lamp, the exposure amount is preferably 10 to 1,000 mJ / cm². ２ , more preferably 50 to 700 mJ / cm² ２ More preferably 150 to 400 mJ / cm² ２ That is the case.

[0114] Next, if a carrier film is present on the photosensitive layer 103, the carrier film is removed before development. During development, the uncured portion of the photosensitive layer 103 is removed, and the photocured portion is formed on the substrate as the interlayer insulating layer 104. The development method may be wet development or dry development, but wet development is preferred. As for the wet development method, a spray method is preferred from the viewpoint of improving resolution. Examples of developer solutions include alkaline aqueous solutions, aqueous developers, and organic solvent-based developers, and among these, alkaline aqueous solutions are preferred. After exposure and development, post-exposure may be performed from the viewpoint of increasing the degree of hardening of the interlayer insulating layer. The exposure amount in post-exposure is preferably 0.2 to 10 J / cm ２ A more preferable 0.5 to 5 J / cm ２ That is the case.

[0115] There are no particular restrictions on the shape of the via. In terms of cross-sectional shape, examples include a square or an inverted trapezoid. Note that an inverted trapezoid is a shape in which the top side is longer than the bottom side. In terms of plan view, examples include a circle or a square. In the photolithography method of via formation in this embodiment, vias with an inverted trapezoidal cross-section can be formed. Vias having this shape are preferable because they have high adhesion of plated copper to the via wall surface. In the photolithography method of via formation in this embodiment, the diameter of the via can be made smaller than the diameter of a via produced by laser processing. The diameter of a via formed by the manufacturing method of this embodiment may be, for example, 40 μm or less, 35 μm or less, or 30 μm or less. There are no particular restrictions on the lower limit of the via diameter, but for example, it may be 15 μm or more, or 20 μm or more.

[0116] (Heat curing step (3)) In heat curing step (3), the interlayer insulating layer having vias is heat cured. That is, in heat curing step (3), heating is used to promote the curing reaction of the thermosetting components contained in the photosensitive resin film of this embodiment. The heating temperature is preferably 100 to 300°C, more preferably 120 to 200°C, and even more preferably 150 to 180°C. The heating time is preferably 0.3 to 3 hours, more preferably 0.5 to 2 hours, and even more preferably 0.75 to 1.5 hours.

[0117] (Circuit pattern formation process (4)) Next, a circuit pattern is formed on the interlayer insulating layer formed above. From the viewpoint of forming fine wiring, it is preferable to form the circuit pattern by a semi-additive process in which roughening treatment, seed layer formation, resist pattern formation, copper circuit layer formation, and resist pattern removal are performed in this order.

[0118] The roughening treatment is a process that roughens the surface of the interlayer insulating layer to form anchors of irregularities. If smearing occurs in the via formation process (2), the roughening treatment and removal of the smear may be performed simultaneously using a roughening solution. Examples of roughening solutions include alkaline permanganate roughening solutions such as sodium permanganate roughening solution; chromium / sulfuric acid roughening solution; sodium fluoride / chromium / sulfuric acid roughening solution.

[0119] Figure 1(c) illustrates the process of forming the seed layer 106. The seed layer 106 is for forming a power supply layer for electrolytic copper plating. The seed layer 106 can be formed by applying electroless copper plating treatment using a palladium catalyst or the like to the via bottom, via wall surface, and the entire surface of the interlayer insulating layer.

[0120] Figure 1(d) illustrates the process of forming a resist pattern 107 on the seed layer 106. The resist pattern 107 can be formed, for example, by heat-pressing a dry film resist onto the seed layer 106 using a roll laminator or the like, and then exposing and developing it. Commercially available dry film resists can be used.

[0121] The dry film resist can be exposed by passing it through a mask on which the desired wiring pattern is drawn. After exposure, the dry film resist is developed using an alkaline aqueous solution to remove unexposed areas and form the resist pattern 107. Subsequently, plasma treatment may be performed to remove any development residue of the dry film resist, if necessary.

[0122] Figure 1(e) illustrates the process of forming a copper circuit layer 108. The copper circuit layer 108 is preferably formed by electrolytic copper plating. As the electrolytic copper plating solution used for electrolytic copper plating, commercially available electrolytic copper plating solutions, such as those containing copper sulfate, can be used. After electrolytic copper plating, the resist pattern 107 is removed using an alkaline aqueous solution or an amine-based stripping agent, and then flash etching to remove the seed layer 106 between the wirings, removal of the palladium catalyst, etc., are performed as appropriate by known methods. Furthermore, if necessary, a post-bake treatment may be performed to sufficiently heat-cur any unreacted thermosetting components.

[0123] Figure 1(f) shows a multilayer printed circuit board 100A that is formed by repeating the above steps and has a solder resist layer 109 on its outermost surface. The solder resist layer 109 can be formed using a known photosensitive resin film for solder resist.

[0124] The above describes a method for manufacturing a printed circuit board using the photosensitive resin film of this embodiment to form vias. However, since the photosensitive resin film of this embodiment has excellent pattern resolution, it is also suitable for forming cavities for embedding chips or passive elements, for example. The cavities can be suitably formed, for example, in the description of the printed circuit board above, by making the drawing pattern when exposing the photosensitive resin film to form a pattern such that it can form the desired cavity.

[0125] [Semiconductor Package] The semiconductor package of this embodiment is a semiconductor package that includes the printed circuit board of this embodiment and semiconductor elements. The semiconductor package of this embodiment can be manufactured, for example, by mounting semiconductor elements such as semiconductor chips and memory at predetermined positions on the printed circuit board of this embodiment and sealing the semiconductor elements with a sealing resin or the like.

[0126] The embodiments will be described in more detail below with reference to examples, but the embodiments are not limited to these examples.

[0127] [Method for measuring acid value] The acid value was calculated from the amount of potassium hydroxide solution required to neutralize the substance being measured.

[0128] [Method for Measuring Weight-Average Molecular Weight (Mw)] The weight-average molecular weight (Mw) was measured using the following GPC measuring device and measurement conditions, and then converted using a calibration curve for standard polystyrene. The calibration curve was created using a set of five sample polystyrene samples ("PStQuick MP-H" and "PStQuick B," manufactured by Tosoh Corporation) as standard polystyrene. (GPC Measuring Device) GPC device: High-speed GPC device "HCL-8320GPC", detector: differential refractometer or UV, manufactured by Tosoh Corporation. Column: TSKgel SuperMultipore HZ-H column (column length: 15 cm, column inner diameter: 4.6 mm), manufactured by Tosoh Corporation. (Measurement Conditions) Solvent: Tetrahydrofuran (THF) Measurement temperature: 40°C Flow rate: 0.35 ml / min Sample concentration: 10 mg / THF 5 ml Injection volume: 20 μl

[0129] [Production of Photosensitive Resin Compositions and Photosensitive Resin Films] Examples 1-9, Comparative Examples 1-6 (1) Production of Photosensitive Resin Compositions Each component was blended according to the formulation shown in Table 1 (the units of the numerical values ​​in the table are parts by mass, and in the case of solutions, the amount is on a solid content basis), and kneaded using a three-roll mill and a self-rotating mixer. Then, methyl ethyl ketone was added so that the solid content concentration was 65% by mass to obtain a photosensitive resin composition.

[0130] (2) A polyethylene terephthalate film with a manufacturing thickness of 25 μm (manufactured by Toyobo Co., Ltd., trade name "Toyobo Ester HPE") was prepared as a carrier film. The photosensitive resin composition prepared in each example was applied onto the carrier film so that the film thickness after drying was 25 μm, and a photosensitive resin film was formed by drying it at 100°C for 10 minutes using a hot air convection dryer. Subsequently, a polyethylene film (manufactured by Unitika Ltd., trade name "TRFA") was laminated as a protective film onto the surface of the photosensitive resin film opposite to the side in contact with the carrier film, and a photosensitive resin film was prepared by laminating the carrier film and the protective film.

[0131] [Method for measuring relative permittivity (Dk) and dielectric loss tangent (Df)] Two photosensitive resin films, with the protective film removed, are laminated together, and with the carrier films on both sides still attached, they are exposed to light at 400 mJ / cm² using a flatbed exposure machine. ２ , using a UV conveyor type exposure machine at 2 J / cm ２ The material was irradiated. Then, it was heat-treated at 170°C for 1 hour using a hot air circulating dryer, and cut into 7cm x 10cm pieces to be used as evaluation samples. The obtained evaluation samples were sealed with a desiccant and dried for more than 10 hours, and the relative permittivity (Dk) and dielectric loss tangent (Df) in the 10GHz band were measured using the split-post dielectric resonator method (SPDR method) and evaluated based on the following criteria: (Evaluation criteria for relative permittivity (Dk)) A: Less than 3.0 B: 3.0 or more, 3.3 or less C: Greater than 3.3 (Evaluation criteria for dielectric loss tangent (Df)) A: Less than 0.005 B: 0.005 or more, 0.008 or less C: Greater than 0.008

[0132] [Method for measuring adhesive strength with plated copper] (1) Measurement of minimum development time The copper foil surface of a printed circuit board substrate (manufactured by Resonac Co., Ltd., product name "MCL-E-679"), which is made by laminating copper foil (thickness 12 μm) onto a glass epoxy substrate, was pre-treated with a roughening pre-treatment solution (manufactured by MEC Co., Ltd., product name "CZ-8101"), then washed with water and dried. Next, a photosensitive resin film from which the protective film had been peeled off was laminated onto the copper foil of the pre-treated printed circuit board substrate with the photosensitive resin film facing the adhesive surface. A press-type vacuum laminator (manufactured by Meiki Seisakusho Co., Ltd., product name "MVLP-500") was used for lamination, and the lamination conditions were: atmospheric pressure 4 kPa or less, vacuuming time 20 seconds, press hot plate temperature 75°C, lamination press time 30 seconds, and pressing pressure 0.4 MPa. After lamination, the laminate was left at room temperature for more than one hour to obtain an evaluation laminate in which a photosensitive resin film and a carrier film were laminated in that order on the copper foil surface of a printed circuit board substrate. The carrier film of the evaluation laminate obtained above was removed, and the photosensitive resin film was spray developed using a 1% by mass sodium carbonate aqueous solution at 30°C. At this time, the minimum time that could be developed was defined as the minimum development time. (2) Sensitivity measurement of the photosensitive resin film An evaluation laminate was prepared using the same procedure as in [(1) Measurement of minimum development time] above, and 41 step tablets were placed on the carrier film of the evaluation laminate. Next, exposure was performed using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd., product name "EXM-1201") with an ultra-high pressure mercury lamp as the light source. After exposure, the laminate was left at room temperature for 30 minutes, then the carrier film of the evaluation laminate obtained above was removed, and the photosensitive resin film was spray developed using a 1% by mass sodium carbonate aqueous solution at 30°C. Determine the exposure energy amount at which the gloss retention step count is 8.0, and use this to determine the sensitivity of the photosensitive resin film (unit: mJ / cm²). ２) (3) Exposure and Development Process The entire surface of the evaluation laminate was exposed with the exposure energy amount that was the sensitivity determined above, and the photosensitive resin film was cured. After exposure, it was left at room temperature for 30 minutes, then the carrier film of the evaluation laminate was peeled off and the photosensitive resin film was spray developed using a 1% by mass sodium carbonate aqueous solution at 30°C for a development time twice the minimum development time. (4) Post-Cure Treatment Subsequently, using a high-pressure mercury lamp irradiation type UV conveyor device (manufactured by Oak Manufacturing Co., Ltd.), the exposure amount was 2 J / cm ２ Post-UV curing was performed at the conveyor speed. Then, using a hot air circulating dryer, the laminate was heated at 170°C for 1 hour to cure the photosensitive resin film and obtain an evaluation laminate having an interlayer insulating layer. (5) Roughening treatment The evaluation laminate having the obtained interlayer insulating layer was treated with the swelling solution "Swelling Dip Securigant P" at 70°C for 5 minutes and then washed with water. Next, it was roughened with the roughening solution "Dosing Securigant P500J" at 60°C for 15 minutes and then washed with water at 50°C for 1 minute. Subsequently, it was neutralized with the neutralizing solution "Reduction Conditioner Securigant P500" at 50°C for 5 minutes and then washed with water. After that, it was treated with buffered hydrofluoric acid "LAL1800 SA High Purity Buffered Hydrofluoric Acid" at room temperature for 10 minutes and then washed with water. The swelling solution, roughening solution, and neutralizing solution were all manufactured by Atotec Japan Co., Ltd., and the buffered hydrofluoric acid was manufactured by Stella Chemifa Co., Ltd. (6) Plating Treatment The evaluation laminate after the roughening treatment was subjected to electroless plating treatment at 30°C for 15 minutes using the electroless plating solution "Print Gun MSK-DK" (manufactured by Atotec Japan Co., Ltd.), and then rinsed with water. Subsequently, the evaluation laminate with electroless plating was dried in a dryer at 150°C for 30 minutes. Then, electroplating treatment was performed at 24°C and 2 A / dm using the electroplating solution "Caparaside HL" (manufactured by Atotec Japan Co., Ltd.) ２This was done for 1.5 hours. After that, it was annealed in a 150°C dryer for 1 hour to form plated copper on the interlayer insulating layer. The thickness of the plated copper was 25 μm. (7) Measurement of adhesion strength with plated copper The adhesion strength with plated copper was measured by vertical peel strength at 23°C in accordance with JIS C 6481:1996 and evaluated based on the following criteria. (Evaluation criteria) A: Adhesion strength with plated copper is greater than 0.5 kN / m. B: Adhesion strength with plated copper is 0.4 kN / m or more and 0.5 kN / m or less. C: Adhesion strength with plated copper is less than 0.4 kN / m.

[0133] [Method for measuring weight loss after roughening treatment] An evaluation laminate having an interlayer insulating layer was prepared using the same procedure as in [Method for measuring adhesion strength to plated copper] above. The evaluation laminate was immersed in the swelling solution "Swelling Dip Securigant P" (aqueous solution of glycol ethers and sodium hydroxide, manufactured by Attec Japan Co., Ltd.) at 70°C for 10 minutes, and then washed with water at 25°C for 3 minutes. Next, the roughening solution "Dosing Securigant P500J" (KMnO ４ The laminate was immersed in an aqueous solution of 60 g / L of sodium sulfate and 40 g / L of NaOH (manufactured by Atotec Japan Co., Ltd.) at 60°C for 15 minutes, then washed with water at 50°C for 1 minute. Finally, it was immersed in the neutralizing solution "Reduction Sulfuric Acid Securigant P" (an aqueous solution of sulfuric acid, manufactured by Atotec Japan Co., Ltd.) at 40°C for 5 minutes, then washed with water at 25°C for 3 minutes. After that, it was dried at 105°C for 10 minutes to obtain the evaluation laminate after roughening treatment. The difference between the weight of the evaluation laminate before roughening treatment and the weight of the evaluation laminate after the roughening treatment [before roughening treatment - after roughening treatment] was defined as the weight loss after roughening treatment and was evaluated based on the following criteria. (Evaluation criteria) A: Weight loss after roughening treatment is 3.0 g / m ２ It is less than . B: Weight loss after roughening treatment is 3.0 g / m ２ Above, 5.0g / m ２ The following applies: C: Weight loss after roughening treatment is 5.0 g / m². ２ It's incredible.

[0134]

[0135] The components used in Table 1 are as follows: [Component (A)] Compound having a carboxyl group and an acryloyl group: Manufactured by Nippon Kayaku Co., Ltd., trade name "ZXR-1807H", acid value: 100 mg KOH / g, weight-average molecular weight (Mw): 2,000, a compound having a carboxyl group and an acryloyl group, and containing an alicyclic skeleton represented by the above general formula (A-1).

[0136] [Components (B) and (E)] ・Silica surface-treated with methacrylatesilane: Molten spherical silica surface-treated with 3-methacrylatexypropyltrimethoxysilane, volume average particle size (D ５０ ) are of a size of 0.3 μm, 0.5 μm, or 1.0 μm.

[0137] [Comparative components and (E) component] ・Silica surface-treated with epoxysilane: Molten spherical silica surface-treated with 3-glycidoxypropyltrimethoxysilane, volume average particle size (D ５０ ): 0.5 μm • Silica surface-treated with vinylsilane: Molten spherical silica surface-treated with vinyltrimethoxysilane, volume-average particle size (D ５０ ): 0.3 μm

[0138] [(C) Components] ・Epoxy resin: Naphthol-type epoxy resin: Manufactured by Nippon Steel & Sumitomo Metal Corporation, product name "ESN-475V", epoxy group equivalent: 325 g / eq ・Maleimide resin: Aromatic bismaleimide resin having an indan skeleton, compound represented by the above general formula (C-1) ・Allyl resin: Diallyl isocyanurate compound, manufactured by Shikoku Chemicals, Ltd., product name "L-DAIC", compound represented by the above general formula (C-2) ・Isocyanate resin: Hexamethylene diisocyanate

[0139] [Component (D)] Organic peroxide: 1,3-di(t-butylperoxyisopropyl)benzene

[0140] [Component (F)] Trimethylolpropane triacrylate

[0141] [Component (G)] • Photopolymerization initiator: Bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide

[0142] [(H) component] • Curing accelerator: 1-benzyl-2-phenylimidazole

[0143] [(I) Components] Sensitizer: 4,4'-bis-(diethylamino)benzophenone Polymerization inhibitor: t-butylcatechol

[0144] Table 1 shows that the photosensitive resin compositions of Examples 1 to 9 of this embodiment all have good dielectric properties and excellent chemical resistance and conductor adhesion.

[0145] 100A Multilayer Printed Wiring Board 101 Substrate 102 Circuit Pattern 103 Photosensitive Layer 104 Interlayer Insulation Layer 105 Via 106 Seed Layer 107 Resist Pattern 108 Copper Circuit Layer 109 Solder Resist Layer

Claims

1. A photosensitive resin composition comprising: (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent; (B) one or more selected from the group consisting of a silane coupling agent having a (meth)acryloyl group and an alkoxysilyl group and components derived from the silane coupling agent; (C) a thermosetting resin; and (D) an organic peroxide, wherein the (C) thermosetting resin contains one or more selected from the group consisting of maleimide resins and allyl resins.

2. The photosensitive resin composition according to claim 1, further comprising (E) an inorganic filler.

3. The photosensitive resin composition according to claim 2, wherein the inorganic filler (E) is surface-treated with a silane coupling agent having the (meth)acryloyl group and the alkoxysilyl group.

4. The photosensitive resin composition according to claim 2, wherein the inorganic filler (E) is silica.

5. The photosensitive resin composition according to claim 2, wherein the content of the inorganic filler (E) is 5 to 80% by mass based on the total solid content of the photosensitive resin composition.

6. The photosensitive resin composition according to any one of claims 1 to 5, further comprising (F) a compound having two or more ethylenically unsaturated groups and not having an acidic substituent or an alkoxysilyl group.

7. The photosensitive resin composition according to any one of claims 1 to 5, further comprising (G) a photopolymerization initiator.

8. A photosensitive resin composition according to any one of claims 1 to 5, used for forming an interlayer insulating layer having a photovia.

9. A photosensitive resin film comprising the photosensitive resin composition according to any one of claims 1 to 5.

10. A printed circuit board comprising a cured product of the photosensitive resin composition according to any one of claims 1 to 5.

11. A semiconductor package comprising a printed circuit board according to claim 10 and a semiconductor element.

12. A method for manufacturing a printed circuit board, comprising the following (1) to (4): (1) Laminating the photosensitive resin film described in claim 9 to one or both sides of a circuit board; (2) Forming an interlayer insulating layer having vias by exposing and developing the photosensitive resin film laminated in (1); (3) Heat-curing the interlayer insulating layer having vias; (4) Forming a circuit pattern on the interlayer insulating layer.

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