Substrate cleaning device, substrate cleaning method, and method for controlling substrate cleaning device

Abstract

The present invention boosts substrate cleaning power.　Provided is a substrate cleaning device comprising: a two-fluid nozzle that supplies two fluids to a rotating substrate; a first rinsing nozzle that supplies a rinsing liquid to the rotating substrate; and a movement mechanism that holds and moves the two-fluid nozzle and the first rinsing nozzle. When the center-side of the rotating substrate is defined as upstream and the outer circumference-side of the substrate is defined as downstream, the first rinsing nozzle supplies the rinsing liquid to a location that is on the upstream side or the downstream side of a location where the two fluids are supplied.

Description

Substrate cleaning apparatus, substrate cleaning method, and control method for substrate cleaning apparatus

[0001] The present invention relates to a substrate cleaning apparatus, a substrate cleaning method, and a control method for a substrate cleaning apparatus.

[0002] A technique of cleaning a substrate by injecting two fluids of liquid and gas (for example, Patent Document 1) is known.

[0003] Japanese Patent No. 6250924

[0004] It is to improve the cleaning power of the substrate, or to provide a new substrate cleaning apparatus, substrate cleaning method, and control method for a substrate cleaning apparatus different from Patent Document 1.

[0005] As an example, the following configurations are provided.

[0006] [1] A two-fluid nozzle that supplies two fluids to a rotating substrate, a first rinse nozzle that supplies a rinse liquid to the rotating substrate, and a moving mechanism that holds and moves the two-fluid nozzle and the first rinse nozzle. The first rinse nozzle supplies a rinse liquid to a position upstream or downstream of the position where the two fluids are supplied when the center side of the rotating substrate is the upstream and the outer peripheral side of the substrate is the downstream. Substrate cleaning apparatus.

[0007] [2] A second rinse nozzle that supplies a rinse liquid to a rotating substrate, the moving mechanism holds and moves the two-fluid nozzle, the first rinse nozzle, and the second rinse nozzle, the first rinse nozzle supplies a rinse liquid to a position upstream of the position where the two fluids are supplied, and the second rinse nozzle supplies a rinse liquid to a position downstream of the position where the two fluids are supplied. The substrate cleaning apparatus according to [1].

[0008] [3] A substrate cleaning apparatus according to [1], further comprising a second rinse nozzle for supplying rinse liquid to a rotating substrate, wherein the moving mechanism holds and moves the two-fluid nozzle, the first rinse nozzle, and the second rinse nozzle, and when one of the first rinse and the second rinse supplies rinse liquid to a position upstream of the position where the two fluids are supplied, the other of the first rinse and the second rinse supplies rinse liquid to a position downstream of the position where the two fluids are supplied, and when one of the first rinse and the second rinse supplies rinse liquid to a position downstream of the position where the two fluids are supplied, the other of the first rinse and the second rinse supplies rinse liquid to a position upstream of the position where the two fluids are supplied.

[0009] [4] The substrate cleaning apparatus according to [2] or [3], wherein the amount of rinse liquid supplied per unit time to the downstream position is greater than the amount of rinse liquid supplied per unit time to the upstream position.

[0010] [5] The substrate cleaning apparatus according to any one of [2] to [4], wherein the amount of rinse liquid supplied per unit time to the downstream position is greater than the amount of liquid supplied per unit time from the two fluid nozzles.

[0011] [6] A substrate cleaning apparatus according to any one of [2] to [4], comprising a control unit that controls at least one of the amount of rinse liquid supplied per unit time from the first rinse nozzle and the amount of rinse liquid supplied per unit time from the second rinse nozzle, depending on the position on the substrate to which the two fluids are supplied.

[0012] [7] The substrate cleaning apparatus according to [6], wherein the control unit controls at least one of the amount of rinse liquid supplied per unit time from the first rinse nozzle and the amount of rinse liquid supplied per unit time from the second rinse nozzle such that the amount of rinse liquid supplied per unit time from the downstream position is greater than the amount of rinse liquid supplied per unit time from the upstream position.

[0013] [8] The moving mechanism moves the two fluid nozzles such that the position where the two fluids are supplied moves between the first edge and the second edge passing through the center of the substrate, the second rinse nozzle is positioned closer to the first edge than the first rinse nozzle, and the first rinse nozzle is positioned closer to the second edge than the second rinse nozzle, and the control unit, when the position where the two fluids are supplied is between the center of the substrate and the first edge, adjusts the amount of rinse liquid supplied per unit time from the second rinse nozzle to be greater than the amount of rinse liquid supplied per unit time from the first rinse nozzle, when the position where the two fluids are supplied is between the center of the substrate and the second edge, adjusts the amount of rinse liquid supplied per unit time from the first rinse nozzle to be greater than the amount of rinse liquid supplied per unit time from the second rinse nozzle, A substrate cleaning apparatus according to [6] or [7], which controls at least one of the amount of rinse liquid supplied per unit time from the first rinse nozzle and the amount of rinse liquid supplied per unit time from the second rinse nozzle.

[0014] [9] The substrate cleaning apparatus according to any one of [2] to [4], wherein the moving mechanism moves the two fluid nozzles such that the position where the two fluids are supplied moves between the center of the substrate and a specific edge, the second rinse nozzle is positioned closer to the specific edge than the first rinse nozzle, and the control unit controls at least one of the amount of rinse liquid supplied per unit time from the first rinse nozzle and the amount of rinse liquid supplied per unit time from the second rinse nozzle such that the amount of rinse liquid supplied per unit time from the second rinse nozzle is greater than the amount of rinse liquid supplied per unit time from the first rinse nozzle.

[0015]

[10] A method for cleaning a substrate, in which two fluids are supplied to a rotating substrate, and a rinsing solution is supplied to a position upstream or downstream of the position where the two fluids are supplied, with the center of the rotating substrate being upstream and the outer circumference of the substrate being downstream.

[0016]

[11] A control method for a substrate cleaning apparatus comprising: a two-fluid nozzle for supplying two fluids to a rotating substrate; a first rinse nozzle for supplying rinse liquid to the rotating substrate; a second rinse nozzle for supplying rinse liquid to the rotating substrate; and a moving mechanism for holding and moving the two-fluid nozzle, the first rinse nozzle, and the second rinse nozzle, the method comprising a cleaning step of controlling at least one of the amount of rinse liquid supplied per unit time from the first rinse nozzle and the amount of rinse liquid supplied per unit time from the second rinse nozzle according to the position on the substrate to which the two fluids are supplied.

[0017]

[12] The method according to

[11] , wherein in the cleaning step, when the center of the rotating substrate is considered upstream and the outer circumference of the substrate is considered downstream, at least one of the amount of rinse liquid supplied per unit time from the first rinse nozzle and the amount of rinse liquid supplied per unit time from the second rinse nozzle is controlled such that, depending on the position on the substrate to which the two fluids are supplied, the amount of rinse liquid supplied per unit time to the downstream position is greater than the amount of rinse liquid supplied per unit time to the upstream position.

[0018]

[13] The method according to

[11] or

[12] , wherein the moving mechanism moves the two-fluid nozzles such that the position where the two fluids are supplied moves between the first edge and the second edge passing through the center of the substrate, and in the cleaning step, at least one of the amount of rinse liquid supplied per unit time from the first rinse nozzle and the amount of rinse liquid supplied per unit time from the second rinse nozzle is changed at the position where the two fluids are supplied to the center of the substrate.

[0019]

[14] The method according to any one of

[11] to

[13] , which includes a stopping step of stopping the supply of the two fluids and then stopping the supply of rinse liquid supplied downstream from the position on the substrate where the two fluids are supplied.

[0020]

[15] The method according to any one of

[11] to

[14] , wherein, when the center of the rotating substrate is considered upstream and the outer circumference of the substrate is considered downstream, the cleaning step includes temporarily stopping the supply of rinse liquid from the rinse nozzle that supplies rinse liquid to the downstream position of the first rinse nozzle and the second rinse nozzle when supplying the two fluids from the two fluid nozzle to the edge of the substrate.

[0021] Cleaning power improves.

[0022] A schematic perspective view of a substrate cleaning apparatus according to one embodiment. A schematic perspective view showing two-fluid cleaning by a substrate cleaning apparatus without rinse nozzles N1 and N2. An enlarged view of the vicinity of the position where the two fluids are supplied. A schematic perspective view showing two-fluid cleaning by a substrate cleaning apparatus according to this embodiment having rinse nozzles N1 and N2. An enlarged view of the vicinity of the position where the two fluids are supplied. A schematic diagram showing an example in which the two-fluid nozzle N0 reciprocates between above the center C of the substrate W and above an arbitrary edge E (position on the outer circumference). A flowchart showing an example of control of the substrate cleaning apparatus in the reciprocating movement shown in Figure 4. A flowchart showing another example of control of the substrate cleaning apparatus in the reciprocating movement shown in Figure 4. A schematic diagram showing the vicinity of the edge E. A schematic diagram showing an example in which the two-fluid nozzle N0 reciprocates between above an arbitrary edge E1 of the substrate W and above the center C of another edge E2. A schematic diagram illustrating an example in which a two-fluid nozzle N0 reciprocates between an arbitrary edge E1 of the substrate W and the center C of another edge E2. A flowchart showing an example of control of the substrate cleaning device during the reciprocating movement shown in Figure 4. A flowchart showing another example of control of the substrate cleaning device during the reciprocating movement shown in Figure 4. A schematic diagram illustrating a modified substrate cleaning device. A schematic diagram illustrating a modified substrate cleaning device. A schematic diagram illustrating a modified substrate cleaning device.

[0023] Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings.

[0024] Figure 1 is a schematic perspective view of a substrate cleaning apparatus according to one embodiment. The substrate cleaning apparatus comprises a substrate holding and rotating mechanism 1, a moving mechanism 2, a control unit 3, a two-fluid nozzle N0, and rinse nozzles N1 and N2.

[0025] The substrate holding and rotating mechanism 1 comprises a holding part 11, a rotating shaft 12, and a motor 13. The holding part 11 is, for example, a chuck that holds the substrate W horizontally. The rotating shaft 12 extends vertically, and the center of the substrate W held by the holding part 11 is on its extension. The holding part 11 is fixed above the rotating shaft 12, and the motor 13 is connected below it. The motor 13 rotates the rotating shaft 12. With this configuration, the substrate holding and rotating mechanism 1 holds the substrate W horizontally and rotates the substrate W in the horizontal plane. In two-fluid cleaning, a high rotation speed of, for example, about 500 rpm is desirable.

[0026] The two-fluid nozzle N0 is located above the substrate W and supplies a mixed fluid of liquid and gas (hereinafter referred to as "two fluids") vertically downward. The rinse nozzles N1 and N2 are located above the substrate W and supply a rinsing liquid (e.g., pure water) vertically downward. The two-fluid nozzle N0 is positioned between the rinse nozzles N1 and N2. More specifically, in the definitions of "upstream" and "downstream" described later, one of the rinse nozzles N1 and N2 is positioned upstream of the two-fluid nozzle N0, and the other is positioned downstream. One of the features of this embodiment is the provision of rinse nozzles N1 and N2, and its effects will be described later.

[0027] The moving mechanism 2 includes a swing arm 21, a swing shaft 22, and a motor 23. A two-fluid nozzle N0 and rinse nozzles N1 and N2 are fixed to the lower end of the tip of the swing arm 21. The swing shaft 22 is fixed to the lower end of the base of the swing arm 21. The swing shaft 22 extends vertically, and the motor 23 is connected to its lower part. The motor 23 rotates the swing shaft 22. With this configuration, the moving mechanism 2 holds the two-fluid nozzle N0 and rinse nozzles N1 and N2 and moves them above the substrate W.

[0028] As one example of movement, the movement mechanism 2 swings the two-fluid nozzle N0 and the rinse nozzles N1 and N2 so that the two-fluid nozzle N0 reciprocates between above the center of the substrate W and above any edge. As another example, the movement mechanism 2 swings the two-fluid nozzle N0 and the rinse nozzles N1 and N2 so that the two-fluid nozzle N0 reciprocates between above one edge of the substrate W and above another edge, passing above the center of the substrate W. The method of movement is not limited to these, but it is desirable to move the two-fluid nozzle N0 so that it passes above the center of the substrate W in order to reliably clean the center of the substrate W.

[0029] The control unit 3 controls the substrate holding and rotating mechanism 1 and the moving mechanism 2. The control unit 3 also controls the supply of two fluids from the two-fluid nozzle N0. Furthermore, the control unit 3 controls the supply of rinsing liquid from at least one of the rinsing nozzles N1 and N2. These controls include controlling the supply timing and the supply amount. For example, the control unit 3 may be any computer, and the processing operations described later can be realized by the processor executing a program stored in memory.

[0030] The significance of providing rinse nozzles N1 and N2 will now be explained. Figure 2A is a schematic perspective view showing two-fluid cleaning by a substrate cleaning apparatus without rinse nozzles N1 and N2. Figure 2B is an enlarged view of the vicinity of the position where the two fluids are supplied. The liquid in the two fluids supplied to the substrate W flows from the center of the substrate W toward the outer periphery due to the centrifugal force of the rotating substrate W. In this sense, in this specification, the center side of the substrate is referred to as "upstream" and the outer periphery side as "downstream".

[0031] Here, as shown in Figure 2B, the liquid from the two-fluid nozzle N0 is supplied as droplets. Gas is also supplied from the two-fluid nozzle N0. As a result, the gas generates an airflow, which can cause the droplets to be lifted up. These lifted droplets may then reattach to areas on the substrate W upstream where no liquid film has formed. In such cases, the drying of the reattached droplets can create watermarks. Thus, the inventors have identified a problem to be solved: droplets from the two-fluid nozzle N0 reattach to areas on the substrate W upstream where no liquid film has formed.

[0032] Furthermore, because the amount of liquid supplied from the two-fluid nozzle N0 is limited, a sufficient liquid film may not be formed downstream. In that case, the particles that should be removed (defects) cannot be discharged and may re-adhere to the substrate W. Thus, the inventors have identified a problem to be solved: particles are not discharged and re-adhere downstream.

[0033] Figure 3A is a schematic perspective view showing the two-fluid cleaning process using the substrate cleaning apparatus according to this embodiment, which has rinse nozzles N1 and N2. Figure 3B is an enlarged view of the vicinity of the location where the two fluids are supplied. In these figures, rinse nozzle N1 is located upstream of the two-fluid nozzle N0, and rinse nozzle N2 is located downstream of the two-fluid nozzle N0.

[0034] In this case, the rinse nozzle N1 supplies the rinse liquid to a position upstream of the position where the two fluids are supplied from the two-fluid nozzle N0. As a result, as shown in Figure 3B, a liquid film is formed on the upstream side as well. This prevents droplets from being scattered from the two-fluid nozzle N0, from reattaching to areas on the substrate W where no liquid film has been formed.

[0035] Furthermore, the rinse nozzle N2 supplies the rinse liquid to a position downstream of the point where the two fluids are supplied from the two-fluid nozzle N0. As a result, the rinse liquid from the rinse nozzle N2 is added to the liquid from the two-fluid nozzle N0, increasing the amount of liquid and allowing for sufficient particle removal.

[0036] Here, the purpose of supplying rinse liquid from rinse nozzle N1 is to form a liquid film on the upstream side. Therefore, the amount of rinse liquid supplied per unit time does not need to be very large. Specifically, the amount of rinse liquid supplied from rinse nozzle N1, in other words, the amount of rinse liquid supplied to the upstream side, can be 100 to 200 ml / min.

[0037] Furthermore, the purpose of supplying rinsing fluid from rinsing nozzle N2 is to ensure the removal of particles. Therefore, it is desirable that the amount of rinsing fluid supplied per unit time be high. Specifically, the amount of rinsing fluid supplied from rinsing nozzle N1, in other words, the amount of rinsing fluid supplied to the downstream side, may be 1 l / min. In particular, it is desirable that the amount of rinsing fluid supplied to the downstream side be greater than the amount of rinsing fluid supplied to the upstream side, and also greater than the amount of liquid supplied from the two-fluid nozzle N0 (for example, 300 ml / min).

[0038] Next, we will describe a specific control example. Figure 4 schematically shows an example in which a two-fluid nozzle N0 moves back and forth between above the center C of the substrate W and above an arbitrary edge E (position on the outer circumference). In the illustrated example, rinse nozzle N1 is on the center C side, and rinse nozzle N2 is on the edge E side. Therefore, regardless of the position of the two-fluid nozzle N0, rinse nozzle N1 supplies rinse liquid upstream of the position from which the two fluids are supplied from two-fluid nozzle N0. Rinse nozzle N2 supplies rinse liquid upstream of the position from which the two fluids are supplied from two-fluid nozzle N0.

[0039] Figure 5A is a flowchart showing an example of control for a substrate cleaning apparatus in the reciprocating motion shown in Figure 4. This figure assumes that two fluids are supplied when the two-fluid nozzle N0 moves from the center C of the substrate W toward the edge E, and when it moves from the edge E of the substrate W toward the center C (in other words, both in the forward and return movements).

[0040] First, the control unit 3 controls the movement mechanism 2 so that the two-fluid nozzle N0, which is in a predetermined standby position, moves to above the center C of the substrate W (step S1).

[0041] When the two-fluid nozzle N0 moves above the center C of the substrate W, the control unit 3 starts supplying liquid to the two-fluid nozzle N0 and the rinse nozzles N1, N2 (step S2). Specifically, the control unit 3 controls the two-fluid nozzle N0 so that the two fluids are supplied at a predetermined flow rate. Further, the control unit 3 controls the rinse nozzles N1, N2 so that the amount of rinse liquid supplied from the downstream rinse nozzle N2 is greater than the amount of rinse liquid supplied from the upstream rinse nozzle N1.

[0042] Then, the control unit 3 moves the swing arm 21 from the center C of the substrate W to the edge E (step S3). In order to surely clean the vicinity of the edge E of the substrate W, it is desirable that the control unit 3 moves the swing arm 21 to a position where the two fluids from the two-fluid nozzle N0 are supplied to the edge E (see FIG. 6). At this position, if the rinse liquid from the rinse nozzle N2 goes outside the substrate W, the control unit 3 may temporarily stop the supply of the rinse liquid from the rinse nozzle N2.

[0043] When the two-fluid nozzle N0 moves above the edge E of the substrate W, the control unit 3 moves the swing arm 21 from the edge E of the substrate W to the center C while continuing to supply liquid from the two-fluid nozzle N0 and the rinse nozzles N1, N2 (step S4 in FIG. 5A). Steps S3 and S4 (i.e., the reciprocation of the swing arm 21) are repeated until the cleaning is completed.

[0044] At the end of cleaning, the control unit 3 may stop supplying liquid from the two-fluid nozzle N0 and the rinse nozzles N1, N2 at the same time, but preferably stops supplying the two fluids from the two-fluid nozzle N0 first, and then stops supplying the rinse liquid from the rinse nozzle N2. Thereby, the liquid from the two-fluid nozzle N0 can be more surely discharged by the rinse liquid from the rinse nozzle N2.

[0045] FIG. 5B is a flowchart showing another example of the control of the substrate cleaning apparatus in the reciprocating movement shown in FIG. 4. This figure assumes that no two fluids are supplied when moving from the edge E to the center C of the substrate W, and two fluids are supplied when moving the two-fluid nozzle N0 from the center C to the edge E of the substrate W (in other words, only on the forward path from the center C to the edge E). Hereinafter, the differences from FIG. 5A will be mainly described.

[0046] Steps S1 to S3 are the same as those in FIG. 5A. When the two-fluid nozzle N0 moves above the edge E of the substrate W, the control unit 3 stops the liquid supply from the two-fluid nozzle N0 and the rinse nozzles N1 and N2 (step S11). Then, in a state where no liquid is supplied, the control unit 3 moves the swing arm 21 from the edge E of the substrate W to the center C (step S4).

[0047] When the two-fluid nozzle N0 moves above the center C of the substrate W, the control unit 3 starts the liquid supply from the two-fluid nozzle N0 and the rinse nozzles N1 and N2 again (step S2). The above steps S2, S3, S11, and S4 (i.e., the reciprocation of the swing arm 21 (however, liquid supply is only performed on the forward path)) are repeated until the cleaning is completed.

[0048] In FIGS. 5A and 5B, the liquid supply starts at the center C of the substrate W, but the liquid supply may start at another position (for example, the edge E). Also, the position where the cleaning ends is arbitrary, and it may be, for example, the center C or the edge E.

[0049] FIGS. 7A and 7B are diagrams schematically showing an example in which the two-fluid nozzle N0 reciprocates between above an arbitrary edge E1 of the substrate W and above the center C of another edge E2. In the illustrated example, the rinse nozzle N1 is on the edge E2 side, and the rinse nozzle N2 is on the edge E1 side. Therefore, when the two-fluid nozzle N0 is between the center C and the edge E1 (FIG. 7A), the rinse nozzle N1 supplies the rinse liquid upstream of the position where the two fluids are supplied from the two-fluid nozzle N0, and the rinse nozzle N2 supplies the rinse liquid downstream of the position where the two fluids are supplied from the two-fluid nozzle N0. On the other hand, when the two-fluid nozzle N0 is between the center C and the edge E2 (FIG. 7B), the rinse nozzle N1 supplies the rinse liquid downstream of the position where the two fluids are supplied from the two-fluid nozzle N0, and the rinse nozzle N2 supplies the rinse liquid upstream of the position where the two fluids are supplied from the two-fluid nozzle N0.

[0050] Paying attention to this point, it is desirable for the control unit 3 to control the supply amount of the rinse liquid per unit time in at least one of the rinse nozzles N1 and N1 according to the position on the substrate W where the two fluids are supplied. The specific examples will be described below.

[0051] Figure 8A is a flowchart showing an example of control for a substrate cleaning apparatus in the reciprocating motion shown in Figure 4. This figure assumes that two fluids are supplied when the two-fluid nozzle N0 is moved from edge E1 to edge E2 of the substrate W, and when it is moved from edge E2 to edge E1 of the substrate W (in other words, both in the forward and return movements).

[0052] First, the control unit 3 controls the movement mechanism 2 so that the two-fluid nozzle N0, which is in a predetermined standby position, moves above the edge E1 (step S21).

[0053] When the two-fluid nozzle N0 moves above the edge E1 of the substrate W, the control unit 3 starts supplying liquid from the two-fluid nozzle N0 and the rinse nozzles N1 and N2 (step S22). Specifically, the control unit 3 controls the two-fluid nozzle N0 so that the two fluids are supplied at a predetermined flow rate. The control unit 3 also controls the rinse nozzles N1 and N2 so that the amount of rinse liquid supplied from the downstream rinse nozzle N2 is greater than the amount of rinse liquid supplied from the upstream rinse nozzle N1.

[0054] Then, the control unit 3 moves the oscillating arm 21 from the edge E1 of the substrate W to the center C (step S23). As described above, when the oscillating arm 21 is between the edge E1 and the center C of the substrate W, the rinse nozzle N1 is located on the upstream side and the rinse nozzle N2 is located on the downstream side.

[0055] When the two-fluid nozzle N0 moves above the center C of the substrate W, the control unit 3 changes the liquid supply amount from the rinse nozzles N1 and N2 (step S24). Specifically, the control unit 3 controls the rinse nozzles N1 and N2 so that the amount of rinse liquid supplied from rinse nozzle N1 is greater than the amount of rinse liquid supplied from rinse nozzle N2. This is because when the oscillating arm 21 is between the edge E2 and the center C of the substrate W, rinse nozzle N2 is located on the upstream side and rinse nozzle N1 is located on the downstream side.

[0056] Then, the control unit 3 moves the oscillating arm 21 from the center C to the edge E2 (step S25). When the two-fluid nozzle N0 moves above the edge E2 of the substrate W, the control unit 3 continues to supply liquid from the two-fluid nozzle N0 and the rinse nozzles N1 and N2, while moving the oscillating arm 21 from the edge E2 of the substrate W back to the center C (step S26).

[0057] When the two-fluid nozzle N0 moves above the center C of the substrate W, the control unit 3 changes the liquid supply amount from the rinse nozzles N1 and N2 (step S27). Specifically, the control unit 3 controls the rinse nozzles N1 and N2 so that the amount of rinse liquid supplied from rinse nozzle N2 is greater than the amount of rinse liquid supplied from rinse nozzle N1. This is because when the oscillating arm 21 is between the edge E1 and the center C of the substrate W, rinse nozzle N1 is located on the upstream side and rinse nozzle N2 is located on the downstream side.

[0058] Then, the control unit 3 moves the swing arm 21 from the center C to the edge E1 (step S28). Steps S23 to S28 (i.e., the back-and-forth movement of the swing arm 21) are repeated until the cleaning is complete. The position where the cleaning is completed is arbitrary; for example, it may be the edge E1 or the edge E2.

[0059] In steps S24 and S27, the control unit 3 may switch the liquid supply amount without stopping the movement of the swinging arm 21. Alternatively, the control unit 3 may temporarily stop the movement of the swinging arm 21 at the center C, switch the liquid supply amount, and then resume movement.

[0060] Figure 8B is a flowchart showing another example of the control of the substrate cleaning apparatus during the reciprocating movement shown in Figure 4. This figure assumes that two fluids are not supplied when moving the substrate W from edge E2 to edge E1, but that two fluids are supplied when moving the two-fluid nozzle N0 from edge E1 to edge E2 of the substrate W (in other words, only on the forward path from edge E1 to edge E2). The following explanation will focus on the differences from Figure 8A.

[0061] Steps S21 to S25 are the same as in Figure 8A. When the two-fluid nozzle N0 moves above the edge E2 of the substrate W, the control unit 3 stops the supply of liquid from the two-fluid nozzle N0 and the rinse nozzles N1 and N2 (step S31). Then, with no liquid being supplied, the control unit 3 moves the swing arm 21 from the edge E1 to the edge E2 of the substrate W (step S32).

[0062] When the two-fluid nozzle N0 moves above the edge E2 of the substrate W, the control unit 3 restarts the supply of liquid from the two-fluid nozzle N0 and the rinse nozzles N1 and N2 (step S22). Steps S22 to S25, S31, and S32 (i.e., the reciprocating motion of the oscillating arm 21 (with liquid supply only on the forward path)) are repeated until the cleaning is complete.

[0063] As described above, by supplying the rinsing liquid upstream of the point where the two fluids are supplied, a liquid film is formed upstream, preventing droplets from the two-fluid nozzle N0 from re-adhering to areas on the substrate W where no liquid film has formed. Furthermore, by supplying the rinsing liquid downstream of the point where the two fluids are supplied, the amount of liquid supplied increases, allowing for sufficient discharge of particles downstream. As a result, the cleaning power is improved. Note that even if only one of the rinsing nozzles N1 or N2 is provided, the cleaning power is improved compared to when neither is present. Therefore, it is acceptable to provide only one of the rinsing nozzles N1 or N2.

[0064] The method of moving the two-fluid nozzle N0 and the rinse nozzles N1 and N2 is not limited to those described above. For example, as shown in Figure 9, the arm 21' that holds the two-fluid nozzle N0 and the rinse nozzles N1 and N2 may be moved in the radial direction of the substrate W. More specifically, the control unit 3 may move the arm 21' linearly so that the two-fluid nozzle N0 reciprocates between above the center of the substrate W and above the edge. Alternatively, the arm 21' may be moved linearly so that the two-fluid nozzle N0 reciprocates above the diameter of the substrate (i.e., between above the edge and above the opposite edge).

[0065] Furthermore, two or more swing arms 21 may be provided. For example, as shown in Figure 10, swing arms 21a to 21c may be provided to hold the two-fluid nozzle N0 and the rinse nozzles N1 and N2, respectively. Alternatively, as shown in Figure 11, a swing arm 21d may be provided to hold the two-fluid nozzle N0 and the rinse nozzle N1, and a swing arm 21e may be provided to hold the rinse nozzle N2. In any case, the control unit 3 interlocks the swing arms so that rinse nozzles are supplied from one of the rinse nozzles N1 and N2 to the upstream side and from the other to the downstream side.

[0066] Any part or all of the functional components described herein may be implemented by program. Programs referred to herein may be recorded non-temporarily on a computer-readable recording medium.

[0067] Such programs may be installed on a computer (so-called native apps). In that case, the program may be downloaded to the computer via a communication line such as the internet (including wireless communication), or it may be distributed already installed on the computer.

[0068] Alternatively, the program may run on a web browser (a so-called web application). In that case, the computer may receive the program, written in a markup language file (e.g., an HTML file), from a server and execute it through the web browser.

[0069] Based on the above description, those skilled in the art may be able to conceive of additional effects and various modifications of the present invention, but the embodiments of the present invention are not limited to the individual embodiments described above. For example, inventions that take only a part of each embodiment, or inventions that combine multiple embodiments, are naturally conceivable. Various additions, modifications, and partial deletions are possible as long as they do not depart from the conceptual idea and spirit of the present invention derived from the contents of the claims and their equivalents.

[0070] For example, what is described herein as a single device (or component, hereinafter the same) (including what is depicted as a single device in the drawings) may be implemented by multiple devices. Conversely, what is described herein as multiple devices (including what is depicted as multiple devices in the drawings) may be implemented by a single device. Alternatively, some or all of the means or functions that are included in one device may be included in another device. Furthermore, a "system" may consist of one device or two or more devices.

[0071] Furthermore, not all matters described herein are mandatory requirements. In particular, matters described herein but not included in the claims can be considered optional additional matters.

[0072] Furthermore, unless otherwise specified, the term “means” in this specification and the claims means hardware (or functions realized by hardware) and does not include human beings (or human mental activity).

[0073] It should also be noted that the applicant is only aware of the prior art inventions described in the "Prior Art Documents" section of this specification, and the present invention is not necessarily intended to solve the problems described in those prior art inventions. The problems that the present invention aims to solve should be determined by considering this specification as a whole. For example, if this specification describes that a certain effect is achieved by a particular configuration, it can also be said that the problem that is the inverse of that predetermined effect is solved. However, this does not necessarily mean that such a particular configuration is an essential requirement.

[0074] 1. Substrate holding and rotating mechanism 11. Holding part 12. Rotating shaft 13. Motor 2. Moving mechanism 21, 21a-21e. Swiveling arm 21'. Arm 22. Swiveling shaft 23. Motor N0. 2. Fluid nozzles N1, N2. Rinse nozzles

Claims

1. A substrate cleaning device comprising: a two-fluid nozzle for supplying two fluids to a rotating substrate; a first rinse nozzle for supplying rinse liquid to the rotating substrate; and a moving mechanism for holding and moving the two-fluid nozzle and the first rinse nozzle, wherein the first rinse nozzle supplies rinse liquid to a position upstream or downstream of the position where the two fluids are supplied, when the center of the rotating substrate is considered upstream and the outer circumference of the substrate is considered downstream.

2. A substrate cleaning apparatus according to claim 1, comprising a second rinse nozzle for supplying rinse liquid to a rotating substrate, wherein the moving mechanism holds and moves the two-fluid nozzle, the first rinse nozzle, and the second rinse nozzle, the first rinse nozzle supplies rinse liquid to a position upstream of the position to which the two fluids are supplied, and the second rinse nozzle supplies rinse liquid to a position downstream of the position to which the two fluids are supplied.

3. A substrate cleaning apparatus according to claim 1, comprising a second rinse nozzle for supplying rinse liquid to a rotating substrate, wherein the moving mechanism holds and moves the two fluid nozzles, the first rinse nozzle and the second rinse nozzle, and when one of the first rinse and the second rinse supplies rinse liquid to a position upstream of the position where the two fluids are supplied, the other of the first rinse and the second rinse supplies rinse liquid to a position downstream of the position where the two fluids are supplied, and when one of the first rinse and the second rinse supplies rinse liquid to a position downstream of the position where the two fluids are supplied, the other of the first rinse and the second rinse supplies rinse liquid to a position upstream of the position where the two fluids are supplied.

4. The substrate cleaning apparatus according to claim 2 or 3, wherein the amount of rinse liquid supplied per unit time to the downstream position is greater than the amount of rinse liquid supplied per unit time to the upstream position.

5. The substrate cleaning apparatus according to claim 2 or 3, wherein the amount of rinse liquid supplied per unit time to the downstream position is greater than the amount of liquid supplied per unit time from the two-fluid nozzle.

6. A substrate cleaning apparatus according to claim 2 or 3, comprising a control unit that controls at least one of the amount of rinse liquid supplied per unit time from the first rinse nozzle and the amount of rinse liquid supplied per unit time from the second rinse nozzle, depending on the position on the substrate to which the two fluids are supplied.

7. The substrate cleaning apparatus according to claim 6, wherein the control unit controls at least one of the amount of rinse liquid supplied per unit time from the first rinse nozzle and the amount of rinse liquid supplied per unit time from the second rinse nozzle such that the amount of rinse liquid supplied per unit time from the downstream position is greater than the amount of rinse liquid supplied per unit time from the upstream position.

8. The substrate cleaning apparatus according to claim 6, wherein the moving mechanism moves the two fluid nozzles such that the position where the two fluids are supplied moves between the first edge and the second edge passing through the center of the substrate, the second rinse nozzle is positioned closer to the first edge than the first rinse nozzle, and the first rinse nozzle is positioned closer to the second edge than the second rinse nozzle, and the control unit controls at least one of the amount of rinse liquid supplied per unit time from the first rinse nozzle and the amount of rinse liquid supplied per unit time from the second rinse nozzle such that, when the position where the two fluids are supplied is between the center of the substrate and the first edge, the amount of rinse liquid supplied per unit time from the second rinse nozzle is greater than the amount of rinse liquid supplied per unit time from the first rinse nozzle, when the position where the two fluids are supplied is between the center of the substrate and the second edge, the amount of rinse liquid supplied per unit time from the first rinse nozzle is greater than the amount of rinse liquid supplied per unit time from the second rinse nozzle.

9. The substrate cleaning apparatus according to claim 2 or 3, wherein the moving mechanism moves the two fluid nozzles such that the position to which the two fluids are supplied moves between the center of the substrate and a specific edge, the second rinse nozzle is positioned closer to the specific edge than the first rinse nozzle, and the apparatus includes a control unit that controls at least one of the amount of rinse liquid supplied per unit time from the first rinse nozzle and the amount of rinse liquid supplied per unit time from the second rinse nozzle such that the amount of rinse liquid supplied per unit time from the second rinse nozzle is greater than the amount of rinse liquid supplied per unit time from the first rinse nozzle.

10. A method for cleaning a substrate, in which two fluids are supplied to a rotating substrate, and a rinsing solution is supplied to a position upstream or downstream of the position where the two fluids are supplied, with the center of the rotating substrate being considered upstream and the outer circumference of the substrate being considered downstream.

11. A control method for a substrate cleaning apparatus comprising: a two-fluid nozzle for supplying two fluids to a rotating substrate; a first rinse nozzle for supplying rinse liquid to the rotating substrate; a second rinse nozzle for supplying rinse liquid to the rotating substrate; and a moving mechanism for holding and moving the two-fluid nozzle, the first rinse nozzle, and the second rinse nozzle, the method comprising a cleaning step of controlling at least one of the amount of rinse liquid supplied per unit time from the first rinse nozzle and the amount of rinse liquid supplied per unit time from the second rinse nozzle according to the position on the substrate to which the two fluids are supplied.

12. The method according to claim 11, wherein, in the cleaning step, when the center of the rotating substrate is considered upstream and the outer circumference of the substrate is considered downstream, at least one of the amount of rinse liquid supplied per unit time from the first rinse nozzle and the amount of rinse liquid supplied per unit time from the second rinse nozzle is controlled such that, depending on the position on the substrate to which the two fluids are supplied, the amount of rinse liquid supplied per unit time to the downstream position is greater than the amount of rinse liquid supplied per unit time to the upstream position.

13. The method according to claim 11 or 12, wherein the moving mechanism moves the two-fluid nozzles such that the position where the two fluids are supplied moves between the first edge and the second edge, passing through the center of the substrate, and in the cleaning step, at least one of the amount of rinse liquid supplied per unit time from the first rinse nozzle and the amount of rinse liquid supplied per unit time from the second rinse nozzle is changed at the position where the two fluids are supplied to the center of the substrate.

14. The method according to claim 11 or 12, further comprising a stopping step of stopping the supply of the two fluids and then stopping the supply of the rinse liquid supplied downstream from the position on the substrate where the two fluids are supplied.

15. The method according to claim 11 or 12, wherein, when the center of the rotating substrate is considered upstream and the outer circumference of the substrate is considered downstream, the cleaning step includes temporarily stopping the supply of rinse liquid from the rinse nozzle that supplies rinse liquid to the downstream position of the first rinse nozzle and the second rinse nozzle when supplying the two fluids from the two fluid nozzle to the edge of the substrate.

Images