Transmission line and electronic device

Abstract

A transmission line according to the present invention comprises a laminate (10) obtained by lamination of insulator layers (L1, L2, L3) and a conductor layer patterned along the insulator layers (L1, L2, L3). The conductor layer includes a ground conductor pattern (GL) and signal line conductor patterns (SL1, SL2), and the laminate (10) has a curved-shaped portion (CP) at a position along the extension direction of the signal line conductor patterns (SL1, SL2). Thus, a spatial area (SA) is provided by the curved-shaped portion (CP) of the laminate (10).

Description

Transmission Line and Electronic Device

[0001] The present invention relates to a transmission line and an electronic device including the same.

[0002] In an electronic device that handles high-frequency signals, for example, the high-frequency circuit unit in the electronic device may be configured by connecting between the high-frequency circuit on the main board and the high-frequency circuit on the sub-board with a transmission line corresponding to high frequencies.

[0003] In a thin electronic device, in order to arrange the transmission line in a limited space, it is effective to use a thin microstrip line as the transmission line.

[0004] Japanese Patent Application Laid-Open No. 2005-217199

[0005] When the battery inside the electronic device or the metal housing of the electronic device is adjacent to the signal line side of the microstrip line in a state where the transmission line is arranged inside the electronic device, it is expected that the electrical characteristics of the transmission line will deteriorate.

[0006] Patent Document 1 shows a signal line circuit device in which a resin spacer is arranged on the signal line side of a microstrip line, and a space is arranged between the signal line and a metal body adjacent thereto.

[0007] In the structure of the signal line circuit device described in this Patent Document 1, a spacer layer is required separately from the layer constituting the transmission line. In addition, processing for providing spacer layers on the left and right sides of the signal line is required. Therefore, the manufacturing difficulty is high.

[0008] Therefore, an object of the present invention is to provide a transmission line that facilitates manufacturing by eliminating the need for a dedicated spacer layer, and an electronic device including the same.

[0009] A transmission line in the expression according to an aspect of the present invention includes a laminate formed by laminating an insulator layer and a conductor layer patterned along the insulator layer, the conductor layer includes a ground conductor pattern and a signal line conductor pattern, the laminate has a three-dimensional shape portion at a position along the extending direction of the signal line conductor pattern, and a space region is formed by the three-dimensional shape portion of the laminate.

[0010] An electronic device, as expressed in one aspect of the present invention, comprises a transmission line and an electronic circuit connected to the transmission line.

[0011] Furthermore, an electronic device in one aspect of the present invention comprises a transmission line and a conductive object or dielectric material that is in contact with or adjacent to the spatial area of ​​the transmission line.

[0012] According to the present invention, a transmission line that eliminates the need for a dedicated spacer layer and facilitates manufacturing, as well as electronic equipment equipped therewith, can be obtained.

[0013] The upper part of Figure 1 is a plan view of a transmission line according to the first embodiment. The lower part of Figure 1 is a plan view of the transmission line during the manufacturing process. Figure 2 is a partial perspective view of the curved section RS of the transmission line. The upper part of Figure 3 is a cross-sectional view of section C-C in the plan view shown in the upper part of Figure 1, and the middle part of Figure 3 is a cross-sectional view of section C-C in the plan view shown in the lower part of Figure 1. The lower part of Figure 3 is a cross-sectional view of section A-A in the plan view shown in the lower part of Figure 1. Figure 4 is an exploded plan view of the laminate before the curved section CP is formed. The upper part of Figure 5 is a cross-sectional view of section V-V shown in Figure 4, and the lower part of Figure 5 is a cross-sectional view of section T-T shown in Figure 4. Figure 6 is a plan view of electronic equipment according to the second embodiment. Figure 7 is a cross-sectional view of section T-T in Figure 6. The upper part of Figure 8 is a cross-sectional view of section C-C in Figure 6. The lower part of Figure 8 is a schematic diagram of the capacitance generated in each part and space of the transmission line. The upper part of Figure 9 is a cross-sectional view of a transmission line comprising an insulating layer, an insulating layer with a ground conductor pattern on its upper surface, and an insulating layer with a signal line conductor pattern on its upper surface, before the stacking of each insulating layer. The lower part of Figure 9 is a cross-sectional view of a transmission line comprising an insulating layer, an insulating layer with a ground conductor pattern on its upper surface and a signal line conductor pattern on its lower surface, and an insulating layer, before the stacking of each insulating layer. The upper part of Figure 10 is a cross-sectional view of an electronic device. The lower part of Figure 10 is a cross-sectional view of the electronic device along the A-A plane in the upper part of the figure. The upper part of Figure 11 is a cross-sectional view of an electronic device. The lower part of Figure 11 is a cross-sectional view of the electronic device along the A-A plane in the upper part of the figure. Figure 12 is a partial perspective view of the curved portion of the transmission line according to the sixth embodiment. Figure 13 is a cross-sectional view of the transmission line according to the seventh embodiment. Figure 14 is a cross-sectional view showing the relationship between the transmission line and a conductive object according to the eighth embodiment. The upper part of Figure 15 is a cross-sectional view of the board connection area when the transmission line according to the ninth embodiment is mounted on a circuit board. The lower part of Figure 15 is a cross-sectional view of the curved portion of the transmission line. The upper part of Figure 16 is a cross-sectional view of the transmission line according to the 10th embodiment when mounted on a circuit board. The lower part of Figure 16 is a cross-sectional view of the curved portion of the transmission line. Figure 17 is a cross-sectional view of another transmission line according to the 10th embodiment. The upper part of Figure 18 is a cross-sectional view of the transmission line in the board connection area.The middle part of Figure 18 is a cross-sectional view of the transmission line within the curved section. The lower part of Figure 18 is a cross-sectional view of a predetermined portion within the curved section. Figure 19 is a cross-sectional view of another transmission line according to the 11th embodiment. Figure 20 is an exploded plan view of the laminate of the transmission line according to the 12th embodiment, prior to the formation of the curved section. Figure 21 is a cross-sectional view of each part in Figure 20 prior to lamination. The upper and lower parts of Figure 22 are plan views of the transmission line according to the 13th embodiment. Figure 23 is a cross-sectional view of the transmission line according to the 14th embodiment. Figure 24 is a cross-sectional view of the transmission line according to the 15th embodiment. Figure 25 is a plan view of the transmission line according to the 16th embodiment. Figure 26 is a cross-sectional view of the C-C portion in the plan view shown in Figure 25. Figure 27 is an exploded plan view of the transmission line. The upper part of Figure 28 is a plan view of the transmission line. The lower part of Figure 28 is a bottom view of the transmission line. The upper part of Figure 29 is a plan view of a transmission line according to the 17th embodiment, and the lower part of Figure 29 is a cross-sectional view of the C-C portion in the upper part of Figure 29. Figure 30 is a cross-sectional view of an electronic device according to the 18th embodiment. The upper part of Figure 31 is a cross-sectional view of an electronic device according to the 19th embodiment. The middle part of Figure 31 is a plan view of a transmission line provided by the electronic device. The lower part of Figure 31 is a plan view of another transmission line. Figure 32 is a perspective view of a transmission line according to the 20th embodiment. Figure 33 is a cross-sectional view of the C-C portion in Figure 32. Figure 34 is a cross-sectional view of the A-A portion in Figure 32. The upper part of Figure 35 is a cross-sectional view showing the position of the signal line conductor pattern SL. The lower part of Figure 35 shows two examples of partial plan views of the signal line conductor pattern SL. Figure 36 is a cross-sectional view of a transmission line according to the 21st embodiment. Figure 37 is a cross-sectional view of a transmission line according to the 22nd embodiment. Figure 38 is a cross-sectional view of a transmission line according to the 23rd embodiment. The upper part of Figure 39 is a cross-sectional view of a transmission line according to the 24th embodiment, and the lower part of Figure 39 is a plan view of two examples of signal line conductor patterns provided by the transmission line.

[0014] Hereafter, with reference to the figures, several specific examples will be given to illustrate multiple embodiments for carrying out the present invention. The same reference numerals are used for the same parts in each figure. For the sake of ease of explanation and understanding, the embodiments for carrying out the invention will be shown in multiple embodiments, but it is possible to partially omit, substitute, or combine the configurations shown in different embodiments. In the second embodiment and subsequent embodiments, descriptions of matters common to the first embodiment will be omitted, and only the differences will be described. In particular, similar effects and advantages due to similar configurations will not be mentioned sequentially in each embodiment.

[0015] 《First Embodiment》 In the first embodiment, a transmission line is given as an example.

[0016] The lower part of Figure 1 is a plan view of the transmission line 101 according to the first embodiment. The upper part of Figure 1 is a plan view of the transmission line 101 during the manufacturing process.

[0017] As will be shown later, the transmission line 101 comprises an insulating layer and a conductor layer patterned along the insulating layer. The conductor layer comprises a ground conductor pattern and a signal line conductor pattern. A laminate is formed by laminating the insulating layer and the conductor layer. This laminate has a curved shape at a position along the extending direction of the signal line conductor pattern.

[0018] In the diagram shown at the bottom of Figure 1, the transmission line 101 has substrate connection areas RC1 and RC2 at both ends, and a curved shape area RS in the portion other than the substrate connection areas RC1 and RC2. The curved shape area RS is the area in which the curved shape area CP is formed. The diagram shown at the top of Figure 1 shows the transmission line in the stage before the formation of the curved shape area CP.

[0019] Figure 2 is a partial perspective view of the curved portion area RS of the transmission line 101. The transmission line 101 includes a ground conductor pattern GL and signal line conductor patterns SL1 and SL2 inside the laminate 10. Thus, in this embodiment, the curved portion CP is continuous along the extension direction of the signal line conductor patterns SL1 and SL2. Also, in this embodiment, the signal line conductor patterns are a plurality of linear patterns parallel to each other. The aforementioned "curved portion" is an example of a "three-dimensional portion" in the present invention.

[0020] The upper part of Figure 3 is a cross-sectional view of section C-C in the plan view shown at the top of Figure 1, and the middle part of Figure 3 is a cross-sectional view of section C-C in the plan view shown at the bottom of Figure 1. The lower part of Figure 3 is a cross-sectional view of section A-A in the plan view shown at the bottom of Figure 1.

[0021] In the cross-sectional view, lines appearing in the cross-section (lines appearing due to cutting) are drawn, while lines behind the cross-section are omitted from the illustration. This is also the case in the embodiments shown later. In addition, the directional symbols X, Y, and Z in each figure indicate the direction from which the figure is viewed.

[0022] As shown in Figure 3, the laminate 10 is composed of a lamination of insulating layers L1, L2, and L3. A ground conductor pattern GL is formed on the lower surface of insulating layer L1. Signal line conductor patterns SL1 and SL2 are formed on the lower surface of insulating layer L2. The insulating layers L1, L2, and L3 are thermoplastic resin sheets such as LCP resin (liquid crystal polymer), and the ground conductor pattern GL and signal line conductor patterns SL1 and SL2 are patterned materials such as copper foil.

[0023] As shown in the upper part of Figure 3, a flat laminate including the laminate 10, ground conductor pattern GL, and signal line conductor patterns SL1 and SL2 is formed, and then the outer shape is cut into units of transmission lines. Subsequently, a curved shape portion CP is formed in the curved shape portion range RS by heating and pressing with a mold. Alternatively, after forming the flat laminate, a curved shape portion CP is formed in the curved shape portion range RS by heating and pressing with a mold, and then the outer shape is cut into units of individual transmission lines.

[0024] Thus, the laminate 10 has a curved portion CP at a position along the extension direction of the signal line conductor pattern in the curved portion range RS. In this embodiment, the "curve" in "curved portion" CP is a concept that includes "bending". Even if it is bent sharply like a fold, it can be considered to be curved at a microscopic level.

[0025] As shown in the middle of Figure 3, the presence of the curved portion CP of the laminate 10 creates a recess, and the interior of this recess is formed as a spatial area SA. In other words, when the recess faces the flat surface, a spatial area SA is created between the recess and the flat surface.

[0026] Thus, the signal line conductor patterns SL1 and SL2 are parallel linear patterns, and the ground conductor pattern GL, the signal line conductor pattern SL1, and the insulating layer L2 between them constitute a first microstrip line. Furthermore, the ground conductor pattern GL, the signal line conductor pattern SL2, and the insulating layer L2 between them constitute a second microstrip line.

[0027] Figure 4 is an exploded plan view of the laminate 10 in the stage prior to the formation of the curved portion CP. A ground conductor pattern GL is formed on almost the entire lower surface of the insulator layer L1. Signal line conductor patterns SL1, SL2, signal line terminal electrodes TSL1, TSL2, ground conductor terminal electrodes TGL1, TGL2, and interlayer connecting conductors (vias) V are formed on the lower surface of the insulator layer L2. Signal line terminal electrode openings ASL1, ASL2 and ground conductor terminal electrode openings AGL1, AGL2 are formed on the insulator layer L3. These openings form mounting lands for the transmission lines.

[0028] Figure 5 is a cross-sectional view of the transmission line 101. The upper part of Figure 5 is a cross-sectional view of the V-V section shown in Figure 4, and the lower part of Figure 5 is a cross-sectional view of the T-T section shown in Figure 4. The cross-sectional view of C-C shown in Figure 4 is already shown at the top of Figure 3.

[0029] Figures 4 and 5 show a single multilayer substrate. However, during the manufacturing process of such a single multilayer substrate, it is a continuum of multiple multilayer substrates, and the continuum is cut at the final stage of the manufacturing process or just before the final stage to unify it. This relationship between continuum and unification is the same in the other figures as well.

[0030] This embodiment provides the following effects.

[0031] (a) By curving (bending) a portion of the insulating layer and conductor layer constituting the transmission line, a curved shape CP is formed, thereby creating a spatial area SA, eliminating the need to add or form special components such as spacer layers. Since an air layer is formed between the signal line conductor pattern and the nearby conductor, changes in the electrical characteristics of the transmission line are reduced.

[0032] (b) The curved section CP acts as a rib in the mechanical structure, thus increasing its mechanical rigidity.

[0033] (c) As shown in the middle of Figure 3, the ground conductor pattern GL surrounds the spatial area SA, thus enhancing the shielding effect of the transmission line.

[0034] 《Second Embodiment》 In the second embodiment, an example of electronic equipment equipped with the transmission line shown in the first embodiment is provided.

[0035] Figure 6 is a plan view of the electronic device 301 according to this embodiment. This electronic device 301 includes circuit boards 201A and 201B, a transmission line 101, and a conductive object CON. The transmission line 101 connects the high-frequency circuit of circuit board 201A and the high-frequency circuit of circuit board 201B. The conductive object CON is an example of a conductive object according to the present invention. The high-frequency circuit is an example of an electronic circuit according to the present invention.

[0036] Figure 7 shows two examples of cross-sectional views at the T-T point in Figure 6.

[0037] In the example shown at the top of Figure 7, each terminal electrode of the transmission line 101 is connected to a pad electrode PE formed on the upper surface of the circuit board 201A via a solder ball SB.

[0038] In the diagram shown at the bottom of Figure 7, connector CN1 is mounted on the transmission line 101, and connector CN2 is mounted on the circuit board 201A. Connectors CN1 and CN2 form a pair, and are electrically and mechanically connected by inserting one into the other and mating them together. In this example shown at the bottom of Figure 7, connectors CN1 and CN2 are shown mated together.

[0039] The upper part of FIG. 8 is a cross-sectional view taken along the line C-C in FIG. 6. The lower part of FIG. 8 is a schematic diagram of each part of the transmission line 101 and the capacitance generated in the spatial region SA.

[0040] Here, if the capacitance generated between the ground conductor pattern GL and the signal line conductor pattern SL1, that is, the capacitance generated in the insulator layer L2 is represented by C2, the capacitance generated in the insulator layer L3 is represented by C3, and the capacitance generated in the spatial region SA is represented by C0, then the relationships are as follows: C0 = ε0 × (S / t0), C3 = ε3 × (S / t3), C2 = ε2 × (S / t2). Here, S is the opposing area of the conductor layer. Also, the series combined capacitance of C0 and C3 is C0 × C3 / (C0 + C3).

[0041] Since a microstrip line is formed by the ground conductor pattern GL, the signal line conductor pattern SL1, and the insulator layer L2 therebetween, the electrical characteristics of this microstrip line are determined by the distance t2 between the ground conductor pattern GL and the signal line conductor pattern SL1, the line width of the signal line conductor pattern SL1, and the dielectric constant of the insulator layer L2.

[0042] Therefore, it is preferable that the relationship is C2 > C0 × C3 / (C0 + C3). With this relationship, the effect of suppressing the change in the electrical characteristics of the transmission line due to the presence of the conductive object CON is high. That is, due to the presence of the spatial region SA, the change in the electrical characteristics of the transmission line accompanying the change in the distance from the conductive object CON is effectively suppressed.

[0043] <<Third Embodiment>> In the third embodiment, a transmission line is shown in which the positional relationship between the insulator layer and the conductor layer of the transmission line is different from the example shown in the first embodiment.

[0044] The upper part of FIG. 9 is a cross-sectional view of a transmission line including the insulator layer L1, the insulator layer L2 provided with the ground conductor pattern GL on the upper surface, and the insulator layer L3 provided with the signal line conductor patterns SL1 and SL2 on the upper surface, in the state before the lamination of each insulator layer.

[0045] In the first embodiment, an example was shown in which a ground conductor pattern GL was provided on the lower surface of the insulator layer L1, and signal line conductor patterns SL1 and SL2 were provided on the lower surface of the insulator layer L2. However, as shown in the upper part of FIG. 9, a conductor layer may be provided on the upper surface of different insulator layers.

[0046] The lower part of FIG. 9 is a cross-sectional view of a transmission line including an insulator layer L1, an insulator layer L2 provided with a ground conductor pattern GL on the upper surface and signal line conductor patterns SL1 and SL2 on the lower surface, and an insulator layer L3, in a state before the stacking of each insulator layer. Thus, conductor layers may be provided on both surfaces of the insulator layer.

[0047] 《Fourth Embodiment》 In the fourth embodiment, an electronic device including a battery, a transmission line, and a housing will be exemplified.

[0048] The upper part of FIG. 10 is a cross-sectional view of the electronic device 302. This cross-sectional view is a longitudinal cross-sectional view in a plane along the signal transmission direction of the transmission line 101. The lower part of FIG. 10 is a cross-sectional view of the electronic device 302 at the A - A plane in the upper figure.

[0049] The electronic device 302 includes circuit boards 201A and 201B, a transmission line 101, a battery 202, and a housing 203 containing metal.

[0050] The transmission line 101 has substrate connection ranges RC1 and RC2 at both ends, and a curved shape portion range RS in a portion other than the substrate connection ranges RC1 and RC2. The curved shape portion range RS is a range in which a curved shape portion CP is formed.

[0051] In the transmission line 101 of the electronic device 302, a flat surface on the side opposite to the bending direction of the curved shape portion CP protrudes in the direction of the inner top surface of the housing 203 (+Z direction). This flat surface is in contact with or close to the inner surface of the housing 203. And the curved shape portion CP of the transmission line 101 is curved toward the battery 202 side.

[0052] The outer surface of the battery 202 is coated with a dielectric resin. Therefore, when the transmission line 101 is close to the battery 202, the signal line conductor pattern is affected by the dielectric constant of the coating resin. However, since there is a space formed by the curved portion CP between the coating resin and the signal line conductor pattern, even when the distance between the transmission line 101 and the battery 202 fluctuates, deterioration of electrical characteristics such as fluctuations in the characteristic impedance of the transmission line 101 due to the coating resin is suppressed.

[0053] Furthermore, although a space formed by the resin coating and the curved portion CP is interposed between the signal line conductor pattern of the transmission line and the conductor inside the battery 202, the dielectric constant of the space is small, so even when the distance between the transmission line 101 and the battery 202 fluctuates, deterioration of electrical characteristics such as fluctuations in the characteristic impedance of the transmission line 101 is suppressed.

[0054] Furthermore, there is no curved section CP between the board connection ranges RC1 and RC2 of the transmission line 101 and the curved section range RS. As a result, the space between the board connection ranges RC1 and RC2 of the transmission line 101 and the curved section range RS is flexible around an axis parallel to the Y-axis. This allows the transmission line 101 to be easily positioned between circuit boards 201A and 201B, as shown in the upper part of Figure 10.

[0055] 《Fifth Embodiment》 In the fifth embodiment, similar to the sixth embodiment, an example of an electronic device comprising a battery, a transmission line, and a housing is provided.

[0056] The upper part of Figure 11 is a cross-sectional view of the electronic device 303. This cross-sectional view is a longitudinal cross-section along the signal transmission direction of the transmission line 101. The lower part of Figure 11 is a cross-sectional view of the electronic device 303 along the line A-A in the upper part of the figure.

[0057] The electronic device 303 includes circuit boards 201A and 201B, a transmission line 101, a battery 202, and a housing 203 made of metal.

[0058] The transmission line 101 of the electronic device 303 has a flat surface opposite to the direction of curvature of its curved portion CP that is in contact with or close to the battery 202. The curved portion CP of the transmission line 101 is curved toward the housing 203.

[0059] Since the ground conductor pattern GL of the transmission line 101 is curved toward the housing 203 at the curved section CP, the electromagnetic field shielding effect of the signal line conductor patterns SL1 and SL2 is enhanced by the ground conductor pattern GL at this curved section CP and the housing 203.

[0060] 《Sixth Embodiment》 In the sixth embodiment, an example is given of a transmission line in which curved sections are discretely arranged.

[0061] Figure 12 is a partial perspective view of the curved portion of the transmission line according to the sixth embodiment. The range shown in Figure 12 corresponds to the range shown in Figure 2 in the first embodiment.

[0062] In the example shown in Figure 2, the curved portion CP was continuous in the X direction, but in the example shown in Figure 12, the curved portion CP, which is recessed along the Z axis from top to bottom, is discretely arranged. The fact that the stacked laminate contains a ground conductor pattern GL and signal line conductor patterns SL1 and SL2 is the same as the transmission line shown in the first embodiment.

[0063] Thus, the curved portion CP may be discretely distributed in a direction along the signal line conductor patterns SL1 and SL2. In other words, the curved portion CP may be arranged locally.

[0064] In the example shown in Figure 12, the curved sections CP are distributed discretely. Therefore, the spaces between the curved sections CP are flat. As a result, overall flexibility can be maintained.

[0065] Furthermore, in this example, the ground conductor pattern GL is provided in a range that does not reach the curved portion CP, but the ground conductor pattern GL may be provided in a range that reaches the curved portion CP. In this case, the mechanical strength and rigidity of the curved portion CP can be increased.

[0066] 《Seventh Embodiment》 In the seventh embodiment, an example is given of a transmission line having two or more curved sections in the laminate along the extension direction of the signal line conductor pattern.

[0067] Figure 13 is a cross-sectional view of a transmission line 107 according to the seventh embodiment. In this example, the laminate 10 includes three signal line conductor patterns SL1, SL2, and SL3 extending in the direction along the X direction, and one ground conductor pattern GL extending in the direction along the X direction. The transmission line 107 is a transmission line in which three microstrip lines are integrated.

[0068] The laminate 10 has curved sections CP formed on both sides along the extension direction of the signal line conductor patterns SL1, SL2, and SL3. In the direction shown in Figure 13, the right curved section CP of the signal line conductor pattern SL1 along the extension direction is integrated with the left curved section CP of the signal line conductor pattern SL2 along the extension direction. Similarly, the right curved section CP of the signal line conductor pattern SL2 along the extension direction is integrated with the left curved section CP of the signal line conductor pattern SL3 along the extension direction. In other words, in the transmission line 107, multiple sets of curved sections CP and signal line conductor patterns SL1, SL2, and SL3 are arranged in the left-right direction relative to the extension direction of the signal line conductor patterns SL1, SL2, and SL3.

[0069] The ground conductor pattern GL extends continuously in the Y direction along the curved section CP.

[0070] According to this embodiment, since a ground conductor pattern GL is interposed between adjacent signal line conductor patterns at the shortest distance, high electromagnetic isolation can be obtained between signal line conductor pattern SL1 and signal line conductor pattern SL2. Similarly, high electromagnetic isolation can be obtained between signal line conductor pattern SL2 and signal line conductor pattern SL3.

[0071] Furthermore, the presence of three or more curved sections CP results in a highly rigid transmission line.

[0072] The shape of the laminate is as shown in Figure 13, and the ground conductor pattern GL may be separated by the curved section CP. Even in this case, a transmission line with high rigidity can be obtained.

[0073] 《Eighth Embodiment》 In the eighth embodiment, an example of a transmission line in which the ground conductor pattern conducts to a conductive object within the curved shape range is provided.

[0074] Figure 14 is a cross-sectional view showing the relationship between the transmission line 108 and the conductive object CON according to the eighth embodiment. The transmission line 108 includes a ground conductor pattern GL and a signal line conductor pattern SL. An electrode TGL is formed on the lower surface (protruding surface due to curvature) of the curved portion CP of the laminate, which is electrically connected to the ground conductor pattern GL via an interlayer connecting conductor V.

[0075] When the transmission line 108 is arranged in the same manner as in the example shown in Figure 6, the electrode TGL contacts the conductive object CON. Alternatively, the electrode TGL is intentionally connected to the conductive object CON. This method of use surrounds the signal line conductor pattern SL with ground, thereby enhancing the shielding effect of the signal line conductor pattern SL. Furthermore, the conductive object CON becomes at the same potential as the ground conductor pattern GL, stabilizing the electrical characteristics of the transmission line 108, such as its characteristic impedance.

[0076] 《Ninth Embodiment》 In the ninth embodiment, an example of a transmission line in which spatial areas are formed on both sides of a laminate is provided.

[0077] The upper part of Figure 15 is a cross-sectional view of the board connection area when the transmission line 109 according to the ninth embodiment is mounted on the circuit board 201. The lower part of Figure 15 is a cross-sectional view of the curved portion of the transmission line 109.

[0078] The transmission line 109 includes a ground conductor pattern GL and a signal line conductor pattern SL. As shown in the upper part of Figure 15, within the board connection range, the ground conductor pattern GL and the signal line conductor pattern SL are connected to the circuit board 201.

[0079] As shown in the lower part of Figure 15, the transmission line 109 has a curved section CP1 that curves downward and a curved section CP2 that curves upward within its curved shape range. As a result, the curved section of the laminate is curved in both directions with respect to the layer on which the signal line conductor pattern SL is formed, and spatial areas SA1 and SA2 are formed in both directions with respect to the signal line conductor pattern SL.

[0080] In the example shown at the bottom of Figure 15, a conductive object CON is located at the top of the curved section, and an insulating object INS is located at the bottom. A spatial area SA1 is formed between a portion of the transmission line 109 and the conductive object CON, and a spatial area SA2 is formed between a portion of the transmission line 109 and the insulating object INS.

[0081] According to this embodiment, the distance between the signal line conductor pattern SL and the conductive object CON can be maintained at a constant level, thereby maintaining the electrical characteristics of the transmission line. Furthermore, the presence of curved sections CP1 and CP2 increases the rigidity of the curved section area. For example, even if stress is applied to the transmission line 109 from the insulating object INS, the distance between the signal line conductor pattern SL and the conductive object CON can be kept constant. In addition, since the signal line conductor pattern SL is located in the space between the conductive object CON and the insulating object INS, there is no damage to the signal line conductor pattern SL due to contact between the conductive object CON and the insulating object INS, resulting in superior reliability.

[0082] 《Tenth Embodiment》 In the tenth embodiment, a coplanar waveguide type transmission line is illustrated.

[0083] The upper part of Figure 16 is a cross-sectional view of the transmission line 110A according to the tenth embodiment, mounted on the circuit board 201. The lower part of Figure 16 is a cross-sectional view of the curved portion of the transmission line 110A.

[0084] The transmission line 110A is a coplanar waveguide composed of a laminate of an insulating layer, a signal line conductor pattern SL, and ground conductor patterns GL1 and GL2. In the curved section, a curved section CP is formed in the laminate, creating a spatial area SA between the transmission line 110A and the conductive object CON. This prevents the signal line conductor pattern SL and the conductive object CON from being too close together, thereby suppressing changes in the transmission line's characteristics due to this proximity.

[0085] Thus, the transmission line of the present invention is also applicable to coplanar waveguide type transmission lines.

[0086] Figure 17 is a cross-sectional view of another transmission line 110B according to the tenth embodiment. This transmission line 110B is a laminate of an insulating layer, a ground conductor pattern GL0, a signal line conductor pattern SL, and ground conductor patterns GL1 and GL2, forming a grounded coplanar waveguide (GCPW). The ground conductor pattern GL0, which is opposite to the signal line conductor pattern SL in the lamination direction, is located further away from the spatial area SA than the signal line conductor pattern SL. With this structure, the ground conductor pattern GL0 is present between the signal line conductor pattern SL and a nearby conductive object, so that changes in electrical characteristics due to changes in the proximity distance between the transmission line and the conductive object are reduced.

[0087] 《Eleventh Embodiment》 In the eleventh embodiment, an example is given of a transmission line that includes a coplanar waveguide and in which spatial areas are formed on both sides of the laminate.

[0088] The upper part of Figure 18 is a cross-sectional view of the transmission line 111A within the substrate connection area. The middle part of Figure 18 is a cross-sectional view of the transmission line 111A within the curved shape area. The lower part of Figure 18 is a cross-sectional view of a predetermined portion within the curved shape area.

[0089] The transmission line 111A is a coplanar waveguide composed of a laminate of an insulating layer, a signal line conductor pattern SL, and ground conductor patterns GL1 and GL2. Signal line terminal electrodes and ground conductor terminal electrodes are exposed in the substrate connection area of ​​the transmission line 111A.

[0090] As shown in the middle of Figure 18, the transmission line 111A has a curved section CP1 that curves downward and a curved section CP2 that curves upward within its curved shape range. As a result, the curved section of the laminate is curved in both directions relative to the layer on which the signal line conductor pattern SL is formed, and the spatial area is formed in both directions relative to the signal line conductor pattern SL.

[0091] In the example shown at the bottom of Figure 18, conductive objects CON are present at the upper and lower parts of the curved shape. A spatial area SA1 is formed between a portion of the transmission line 111A and the upper conductive object CON, and a spatial area SA2 is formed between a portion of the transmission line 111A and the lower conductive object CON.

[0092] According to this embodiment, the distance between the signal line conductor pattern SL and the conductive object CON can be maintained above a certain level, thereby maintaining the electrical characteristics of the transmission line. In addition, the presence of the curved sections CP1 and CP2 increases the rigidity of the curved section area.

[0093] Figure 19 is a cross-sectional view of another transmission line 111B according to the 11th embodiment. Unlike the transmission line 111A shown in Figure 18, the ground conductor patterns GL1 and GL2 extend to a position where they reach the curved sections CP1 and CP2.

[0094] According to the structure of the transmission line 111B, the presence of the ground conductor pattern GL in the curved sections CP1 and CP2 results in high rigidity in the curved section area. Furthermore, the presence of the ground conductor pattern GL in the curved sections CP1 and CP2 also results in a high electromagnetic shielding effect.

[0095] 《Twelfth Embodiment》 In the twelfth embodiment, an example is given of a transmission line in which each terminal electrode is on the ground conductor pattern side.

[0096] Figure 20 is an exploded plan view of the laminate of the transmission line 112 according to the twelfth embodiment, before the formation of the curved shape. Figure 21 is a cross-sectional view of each part in Figure 20 before lamination.

[0097] The insulating layer L1 has signal line terminal electrode openings ASL1 and ASL2 and ground conductor terminal electrode openings AGL1 and AGL2. These openings form the mounting lands for the transmission line. The lower surface of the insulating layer L1 has a ground conductor pattern GL covering almost the entire surface and signal line terminal electrodes TSL1 and TSL2. The lower surface of the insulating layer L2 has signal line conductor patterns SL1 and SL2. In addition, the insulating layer L2 has interlayer connecting conductors (vias) V. The insulating layer L3 does not have a conductor layer.

[0098] In this embodiment, the curved portion is formed in the same manner as the curved portion CP in the embodiments described above.

[0099] In this embodiment, the transmission line 112 may have its terminal electrodes mounted on a circuit board, or electronic components may be mounted on each terminal electrode.

[0100] 《Third Embodiment》 In the thirteenth embodiment, we provide an example of a transmission line in which the shape of the curved portion CP of the transmission line shown above differs from the shape of the curved portion CP in the state before curving.

[0101] The upper and lower parts of Figure 22 are plan views of the transmission line according to the thirteenth embodiment. In both transmission lines 113A and 113B, the curved section CP widens in the width direction of the transmission line (width in the Y direction in Figure 22). By curving this curved section CP, the Y-direction width of the curved section range RS is made to match the width represented by the width symbol in Figure 22.

[0102] According to this embodiment, the width of the curved portion area RS in the Y direction can be made approximately the same as the width of the area adjacent to the curved portion area. In addition, the bending process of the curved portion CP becomes easier.

[0103] In the example shown in Figure 22, the curved sections are indicated by dashed lines, but the direction of this curvature can be either a mountain fold or a valley fold, as shown in Figure 2, etc. Alternatively, the curvature may consist only of mountain folds or only of valley folds.

[0104] 《Fourteenth Embodiment》 In the fourteenth embodiment, we illustrate a transmission line in which the formation range of the ground conductor pattern GL differs from that of the embodiments shown so far.

[0105] Figure 23 is a cross-sectional view of the transmission line 114 according to the 14th embodiment. This cross-sectional location is, for example, the C-C section in the diagram shown at the bottom of Figure 1.

[0106] The ground conductor pattern GL of the transmission line 114 does not reach the curved portion CP in the Y direction, but remains within the flat area of ​​the laminate 10. The other configurations are as shown in the first embodiment.

[0107] According to this embodiment, since there is no ground conductor pattern GL in the curved portion CP, the change in the electrical characteristics of the transmission line due to the degree of curvature of the curved portion CP is small. Furthermore, since the rigidity of the curved portion CP and the flat portion are different, the formation of the curved portion CP becomes easier.

[0108] 《Fifth Embodiment》 In the fifteenth embodiment, we provide an example of a transmission line in which the shape of the curved portion CP differs from that of the transmission lines in the embodiments described so far.

[0109] Figure 24 is a cross-sectional view of a transmission line according to the 15th embodiment. This cross-sectional location is, for example, the C-C section in the diagram shown at the bottom of Figure 1.

[0110] The transmission line 115 is curved at the curved section CP, but it is also curved at the position where it overlaps with the signal line conductor patterns SL1 and SL2 when viewed in the Z direction. It can also be said that the left and right curved sections CP are continuous in the direction shown in Figure 24. The other configurations are as shown in the first embodiment.

[0111] Thus, the curved portion of the laminate 10 does not necessarily need to have a flat portion. According to this embodiment, the rigidity of the entire curved portion can be easily increased.

[0112] 《16th Embodiment》 In the 16th embodiment, a transmission line is shown in which the structure near the signal line conductor pattern is different from the examples shown so far.

[0113] Figure 25 is a plan view of the transmission line 116 according to the 16th embodiment. Figure 26 is a cross-sectional view taken along section C-C in the plan view shown in Figure 25.

[0114] Figure 27 is an exploded plan view of the transmission line 116. A ground conductor pattern GL is formed on almost the entire lower surface of the insulator layer L1. Multiple cylindrical hollow sections OP and interlayer connecting conductors (vias) V are formed on the insulator layer L2. A signal line conductor pattern SL, a signal line terminal electrode TSL, and ground conductor terminal electrodes TGL1 and TGL2 are formed on the upper surface of the insulator layer L3.

[0115] The upper part of Figure 28 is a plan view of the transmission line 116. The lower part of Figure 28 is a bottom view of the transmission line 116.

[0116] As shown in the upper part of Figures 27 and 28, when viewed in the stacking direction of the ground conductor pattern GL and the signal line conductor pattern SL, the hollow portion OP exists at a position that overlaps with the signal line conductor pattern SL or is adjacent to the signal line conductor pattern SL. In other words, the signal line conductor pattern SL and the multiple hollow portions OP overlap when viewed in the Z direction.

[0117] The insulating layer L3 has signal line terminal electrode openings ASL and ground conductor terminal electrode openings AGL1 and AGL2. These openings form the mounting lands for the transmission line.

[0118] Furthermore, since the dielectric constant of the dielectric between the ground conductor pattern GL and the signal line conductor pattern SL becomes smaller, the line width of the signal line conductor pattern SL required to obtain the predetermined characteristic impedance may be increased. This reduces conductor loss and thus transmission loss.

[0119] According to this embodiment, the combined dielectric constant of the dielectric between the ground conductor pattern GL and the signal line conductor pattern SL becomes smaller, and the combined dielectric loss tangent of the dielectric between the ground conductor pattern GL and the signal line conductor pattern SL becomes smaller, thus reducing dielectric loss and transmission loss.

[0120] 《Embodiment 17》 In the seventeenth embodiment, a transmission line is shown in which the structure near the signal line conductor pattern is different from the examples shown so far.

[0121] The upper part of Figure 29 is a plan view of the transmission line 117 according to the 17th embodiment, and the lower part of Figure 29 is a cross-sectional view of the section C-C in the upper part of Figure 29.

[0122] In the transmission line 117, an insulating layer L2 exists between the ground conductor pattern GL and the signal line conductor pattern SL. Furthermore, square cylindrical hollow sections OP are distributed on both sides of the signal line conductor pattern SL. The other configurations are as shown in the 16th embodiment.

[0123] According to this embodiment, since the space between the ground conductor pattern GL and the signal line conductor pattern SL is supported by an insulating layer, the distance between the signal line conductor pattern SL and the ground conductor pattern GL is stably maintained. In other words, the structural strength is high and deformation due to external stress is small. Furthermore, because the presence of the hollow portion OP reduces the dielectric constant and dielectric loss tangent between the ground conductor pattern GL and the signal line conductor pattern SL, dielectric loss is reduced and transmission loss can be reduced.

[0124] 《Eighteenth Embodiment》 The eighteenth embodiment provides an example of electronic equipment comprising a transmission line and an object adjacent thereto.

[0125] Figure 30 is a cross-sectional view of an electronic device 304 according to the 18th embodiment. This electronic device 304 includes a transmission line 101 and a conductive object CON as an example of an object adjacent thereto.

[0126] Figure 30 is a cross-sectional view of the transmission line 101 in a plane (Y-Z plane) perpendicular to the extension direction of the signal line conductor pattern. The configuration of the transmission line 101 is as shown in the first embodiment. The curved portion CP of the transmission line 101 forms a spatial area SA between the transmission line 101 and the conductive object CON. The coaxial cable CC, optical cable OC, and electronic component EC are arranged in this spatial area SA. The conductive object CON is a substrate equipped with a conductive film, such as a printed circuit board.

[0127] According to this embodiment, the spatial area SA can be effectively utilized, thus enabling miniaturization of electronic devices. Furthermore, the ground conductor pattern GL of the transmission line 101 can provide electromagnetic shielding for the coaxial cable CC and electronic components EC.

[0128] Alternatively, a dielectric object may be provided in place of the conductive object CON.

[0129] 《Ninthest Embodiment》 The ninth embodiment provides an example of an electronic device equipped with an antenna.

[0130] The upper part of Figure 31 is a cross-sectional view of the electronic device 305 according to the 19th embodiment. The middle part of Figure 31 is a plan view of the transmission line 119A provided by the electronic device 305. The lower part of Figure 31 is a plan view of another transmission line 119B.

[0131] The electronic device 305 includes circuit boards 201A and 201B, a transmission line 119A, a battery 202, and a housing 204.

[0132] The transmission line 119A has a signal line conductor pattern SL, an antenna conductor pattern ACP that conducts at one end thereof, and a signal line terminal electrode TSL that conducts at the other end. The curved portion CP extends to the area where the antenna conductor pattern ACP is formed.

[0133] The antenna conductor pattern ACP acts as a patch antenna. The antenna conductor pattern ACP formed on the transmission line 119B shown in the lower part of Figure 31 has a wider width in the Y direction compared to the antenna conductor pattern ACP formed on the transmission line 119A.

[0134] According to this embodiment, the number of parts can be reduced by integrating the antenna with the transmission line. Furthermore, since the curved shape is formed in the area where the antenna conductor pattern ACP is formed, the antenna conductor pattern ACP is less likely to deform, and the antenna characteristics are stabilized. In addition, since the ends of the antenna conductor pattern ACP where the electric field is concentrated can be separated from the housing 204 (especially in the case of the antenna conductor pattern ACP shown at the bottom of Figure 31), the influence of the housing can be reduced, and the variation in antenna characteristics is small.

[0135] 《Twentieth Embodiment》 In the twentieth embodiment, an example of a transmission line having multiple spatial areas is provided.

[0136] Figure 32 is a perspective view of the transmission line 120 according to the 20th embodiment. A protruding portion PS1 is visible on the outside of this transmission line 120.

[0137] Figure 33 is a cross-sectional view of section C-C in Figure 32. The transmission line 120 is composed of a laminate formed by stacking insulating layers L1, L2, and L3. However, a protrusion PS1 is formed in this laminate, and a protrusion PS2 is formed inside it. A spatial area SA1 is formed inside the protrusion PS1. The protrusion PS2 protrudes into the spatial area SA1. Furthermore, a spatial area SA2 is formed inside the protrusion PS2. The aforementioned "protrusions" PS1 and PS2 are examples of "three-dimensional shapes" in the present invention. In addition, the insulating layer L3 closes the spatial area SA2. As a result, the laminate has a flat shape due to the insulating layer L3.

[0138] Spatial region SA1 is formed between insulating layer L1 and insulating layer L2, and spatial region SA2 is formed between insulating layer L2 and insulating layer L3.

[0139] A signal line conductor pattern SL is formed on the upper surface of the insulator layer L2 and on the protruding portion PS2. A ground conductor pattern GL1 is formed on the upper surface of the insulator layer L1, and a ground conductor pattern GL2 is formed on the lower surface of the insulator layer L3. The outer surfaces of the ground conductor patterns GL1 and GL2 are covered with a resist film RF.

[0140] The laminate has interlayer connecting conductors V that connect ground conductor pattern GL1 and ground conductor pattern GL2. In Figure 33, two interlayer connecting conductors V are shown, but multiple interlayer connecting conductors V are arranged in the X direction.

[0141] Figure 34 is a cross-sectional view of section A-A in Figure 32. The signal line conductor pattern SL extends in the X direction. In most of the interior of the protruding portion PS1, the distance between the signal line conductor pattern SL and the ground conductor patterns GL1 and GL2 is wide, and spatial areas SA1 and SA2 exist in that distance.

[0142] The upper part of Figure 35 is a cross-sectional view showing the position of the signal line conductor pattern SL. This cross-sectional view is the same as that of Figure 34. The lower part of Figure 35 shows two examples of partial plan views of the signal line conductor pattern SL.

[0143] Within the protruding portion PS1, in region T1 where the distance between the signal line conductor pattern SL and the ground conductor patterns GL1 and GL2 is wide, the line width of the signal line conductor pattern SL is thick. On the other hand, in region T4 where the distance between the signal line conductor pattern SL and the ground conductor patterns GL1 and GL2 is narrow, the line width of the signal line conductor pattern SL is thin. Furthermore, in the region of the protruding portion PS2 (the part where the protrusion of the protruding portion PS2 ends) T2, the line width of the signal line conductor pattern SL gradually becomes thinner. In the region of the protruding portion PS1 (the part where the protrusion of the protruding portion PS1 ends) T3, the line width of the signal line conductor pattern SL gradually becomes even thinner.

[0144] In region T1, the capacitance component between the signal line conductor pattern SL and the ground conductor patterns GL1 and GL2 is relatively small, so the line width of the signal line conductor pattern SL is thick to set the characteristic impedance of the transmission line in this region to a predetermined value. In region T4, the capacitance component between the signal line conductor pattern SL and the ground conductor patterns GL1 and GL2 is relatively large, so the line width of the signal line conductor pattern SL is thin to set the characteristic impedance of the transmission line in this region to a predetermined value. Then, in the intermediate regions T2 and T3, the line width of the signal line conductor pattern SL to set the characteristic impedance of the transmission line in this region to a predetermined value gradually becomes thinner.

[0145] Therefore, by setting the line width of the signal line conductor pattern SL as described above, the characteristic impedance of the transmission line is made constant not only in the aforementioned region, and thus signal reflection is suppressed.

[0146] Of the two signal line conductor patterns shown at the bottom of Figure 35, the upper example shows the signal line conductor pattern SL with a constant width section and a tapered section. However, as shown in the lower example of the signal line conductor pattern SL, the pattern may also have a smoothly changing line width.

[0147] In this embodiment, a transmission line having a double three-dimensional shape is shown, but it is not limited to a double three-dimensional shape; multiple three-dimensional shapes can be distributed in the direction of stacking, and a transmission line having three or more three-dimensional shapes can be configured in the same way.

[0148] According to this embodiment, signal reflection in each part of the transmission line is suppressed, and low reflection loss characteristics are obtained.

[0149] 《21st Embodiment》 In the 21st embodiment, a transmission line having multiple spatial areas is illustrated.

[0150] Figure 36 is a cross-sectional view of a transmission line 121 according to the 21st embodiment. The transmission line 121 is composed of a laminate formed by stacking insulating layers L1, L2, and L3. A protrusion PS1 is formed on this laminate, and a protrusion PS2 is formed inside it. A spatial area SA1 is formed inside the protrusion PS1. The protrusion PS2 protrudes into the spatial area SA1. Furthermore, a spatial area SA2 is formed inside the protrusion PS2.

[0151] In the 20th embodiment, unlike the transmission line 120 shown in Figure 33, both the protruding portion PS1 and the protruding portion PS2 have a substantially cylindrical partial shape (arch-shaped in cross-section). The other structures are as shown in the 20th embodiment.

[0152] According to this embodiment, the structural strength of the protruding portions PS1 and PS2 is high. Furthermore, as the structural strength increases, the protruding portions PS1 and PS2 and the spatial regions SA1 and SA2 can be formed even in laminates where the thickness of each insulating layer is thin.

[0153] 《Twenty-Second Embodiment》 In the twenty-second embodiment, we will illustrate a transmission line with a transmission line structure different from the examples shown so far.

[0154] Figure 37 is a cross-sectional view of a transmission line 122 according to the 22nd embodiment. The transmission line 122 is composed of a laminate formed by stacking insulating layers L1, L2, and L3. A protrusion PS1 is formed on this laminate, and a protrusion PS2 is formed inside it. A spatial area SA1 is formed inside the protrusion PS1. The protrusion PS2 protrudes into the spatial area SA1. Furthermore, a spatial area SA2 is formed inside the protrusion PS2.

[0155] A signal line conductor pattern SL is formed on the upper surface of the insulator layer L2 and on the protruding portion PS2. A ground conductor pattern GL3 is also formed on the upper surface of the insulator layer L2, extending from the interlayer connection conductor V to the vicinity of the signal line conductor pattern SL. A ground conductor pattern GL1 is formed on the upper surface of the insulator layer L1, and a ground conductor pattern GL2 is formed on the lower surface of the insulator layer L3. The outer surfaces of the ground conductor patterns GL1 and GL2 are covered with a resist film RF.

[0156] The grounded coplanar waveguide is formed by the ground conductor patterns GL1 and GL2, the signal line conductor pattern SL, the ground conductor patterns GL3 on both sides thereof, and the surrounding dielectric.

[0157] Thus, the present invention can also be applied to grounded coplanar waveguides that are shielded in all directions.

[0158] 《Twenty-Third Embodiment》 In the twenty-third embodiment, we illustrate a transmission line with a transmission line structure different from the examples shown so far.

[0159] Figure 38 is a cross-sectional view of a transmission line 123 according to the 23rd embodiment. The transmission line 123 is composed of a laminate formed by stacking insulating layers L1, L2, and L3. A protrusion PS1 is formed on this laminate, and two protrusions PS2 are formed inside it. A spatial area SA1 is formed inside the protrusion PS1. The two protrusions PS2 each protrude into the spatial area SA1. Furthermore, a spatial area SA2 is formed inside each of the protrusions PS2.

[0160] Signal line conductor patterns SL are formed on the upper surface of the insulating layer L2 and on the two protrusions PS2. A ground conductor pattern GL1 is formed on the upper surface of the insulating layer L1, and a ground conductor pattern GL2 is formed on the lower surface of the insulating layer L3. The outer surfaces of the ground conductor patterns GL1 and GL2 are covered with a resist film RF.

[0161] The ground conductor patterns GL1 and GL2, the two signal line conductor patterns SL, and the surrounding dielectric form a parallel two-wire transmission line that is shielded around its periphery. Alternatively, two striplines are formed.

[0162] Thus, the present invention can also be applied to transmission lines in which multiple internal protrusions are arranged side by side. Although Figure 38 shows a transmission line having two signal line conductor patterns, the invention can also be applied to transmission lines having three or more signal line conductor patterns.

[0163] According to this embodiment, by forming a signal line conductor pattern on each individual protrusion, the spacing between each signal line conductor pattern and the ground conductor pattern can be stabilized.

[0164] 《Twenty-fourth Embodiment》 In the twenty-fourth embodiment, a transmission line equipped with a frequency filter is provided as an example.

[0165] The upper part of Figure 39 is a cross-sectional view of the transmission line 124 according to the 24th embodiment, and is the same as the example shown in Figure 34. The lower part of Figure 39 is a plan view of two examples of signal line conductor patterns provided by the transmission line 124 (the part enclosed by the dashed line in the upper part of Figure 39). In the upper of these two examples of signal line conductor patterns, the portion of the conductor pattern with a wider line width (width in the Y direction) is used as a resonator that resonates at a predetermined frequency, and multiple such resonators are coupled together. In the lower of the two examples of signal line conductor patterns, a U-shaped (hairpin-shaped) conductor pattern is used as a resonator, and multiple such resonators are coupled together.

[0166] In this way, a transmission line with band-pass filter characteristics can be constructed. According to this embodiment, air is present in spatial areas SA1 and SA2, and the dielectric constant and dielectric loss tangent around the conductor pattern of the filter circuit are small, resulting in low dielectric loss. As a result, a transmission line with a filter circuit that has a high Q value can be constructed.

[0167] Various embodiments of the present invention have been presented so far, but these are all examples, and these presentations are not intended to limit the scope of the present invention. Embodiments of the present invention can be omitted, replaced, or modified in various ways without departing from the spirit of the invention. Embodiments with such omissions, replacements, or modifications are included in the scope and spirit of the present invention, as well as in the scope of the invention and its equivalents as described in the claims of this application.

[0168] For example, in the first embodiment, a transmission line is configured using two microstrip lines by providing two signal line conductor patterns SL1 and SL2 and one ground conductor pattern GL. However, the two signal line conductor patterns SL1 and SL2 may also be used as a balanced transmission line for transmitting differential signals. In the case of such a balanced transmission line, the characteristic impedance can be stabilized by ensuring a stable distance between the two signal line conductor patterns SL1 and SL2 and the external conductive object CON.

[0169] Furthermore, in each embodiment, the ground conductor pattern GL and signal line conductor patterns SL, SL1, SL2, SL3, etc., are provided in the inner layer of the laminate, but the ground conductor pattern GL and signal line conductor patterns may also be provided on the outer surface of the laminate.

[0170] Furthermore, while some embodiments have shown transmission lines having two parallel signal line conductor patterns SL1 and SL2, a transmission line may be configured having three or more parallel signal line conductor patterns.

[0171] In the 10th and 11th embodiments, a dual coplanar transmission path is shown in which ground conductor patterns GL1 and GL2 are arranged on both the left and right sides of the signal line conductor pattern SL. However, a single coplanar transmission path may be configured by arranging the ground conductor pattern on one of the left or right sides of the signal line conductor pattern SL.

[0172] ACP... Antenna conductor pattern AGL1, AGL2... Ground conductor terminal electrode opening ASL, ASL1, ASL2... Signal line terminal electrode opening CC... Coaxial cable CN1, CN2... Connector CON... Conductive object CP, CP1, CP1, CP2... Curved shape section EC... Electronic component GL, GL0, GL1, GL2, GL3... Ground conductor pattern INS... Insulating object L1, L2, L3... Insulator layer OC... Optical cable OP... Hollow section PE... Pad electrode PS1, PS2... Protrusion RC1, RC2... Substrate connection area RF... Resist film RS... Curved shape area SA, SA1, SA2... Spatial area SB... Solder ball SL, SL1, SL2, SL3... Signal line conductor pattern TGL... Electrode TGL1, TGL2... Ground conductor terminal electrodes TSL, TSL1, TSL2... Signal line terminal electrodes V... Interlayer connection conductor 10... Laminate 101, 107, 108, 109, 110A, 110B, 111A, 111B, 112, 113A, 113B, 114, 115, 116, 117, 119A, 119B, 120, 121, 122, 123, 124... Transmission lines 201, 201A, 201B... Circuit board 202... Battery 203, 204... Enclosure 301, 302, 303, 304, 305... Electronic equipment

Claims

1. A transmission line comprising a laminate formed by laminating an insulating layer and a conductor layer patterned along the insulating layer, wherein the conductor layer includes a ground conductor pattern and a signal line conductor pattern, the laminate has a three-dimensional shaped portion at a position along the extension direction of the signal line conductor pattern, and a spatial area is formed by the three-dimensional shaped portion of the laminate.

2. The transmission line according to claim 1, wherein the ground conductor pattern and the signal line conductor pattern are arranged opposite each other with the insulating layer in between, and the signal line conductor pattern is located closer to the spatial area than the ground conductor pattern.

3. The transmission line according to claim 1, wherein the ground conductor pattern is formed in the same layer as the signal line conductor pattern, and the signal line conductor pattern is formed at a position along the edge of the ground conductor pattern.

4. The transmission line according to claim 2 or 3, wherein the ground conductor pattern is formed to a position that reaches the three-dimensional shape portion.

5. The transmission line according to any one of claims 1 to 4, wherein the three-dimensional shape is curved in a bilateral direction with respect to the layer on which the signal line conductor pattern is formed within the laminate, and the spatial area is formed on both sides with respect to the signal line conductor pattern.

6. The transmission line according to any one of claims 1 to 5, wherein the three-dimensional shape portion is continuous along the extension direction of the signal line conductor pattern.

7. The transmission line according to any one of claims 1 to 5, wherein the three-dimensional shaped portions are spaced apart along the extension direction of the signal line conductor pattern.

8. The transmission line according to any one of claims 1 to 7, wherein the signal line conductor pattern is a plurality of linear patterns that are parallel to each other.

9. The transmission line according to any one of claims 1 to 8, wherein the three-dimensional shape portion and the signal line conductor pattern are arranged in multiple sets in the left-right direction with respect to the extension direction of the signal line conductor pattern.

10. The transmission line according to any one of claims 1 to 9, wherein the insulating layer between the ground conductor pattern and the signal line conductor pattern has a hollow portion, and the hollow portion is located at a position that overlaps with the signal line conductor pattern or at a position adjacent to the signal line conductor pattern when viewed in the stacking direction of the ground conductor pattern and the signal line conductor pattern.

11. The transmission line according to any one of claims 1 to 10, wherein the conductor layer includes an antenna conductor pattern, and the end of the signal line conductor pattern is electrically connected to the power supply portion of the antenna conductor pattern.

12. The transmission line according to claim 11, wherein the antenna conductor pattern extends from the region where the signal line conductor pattern is formed to the three-dimensional shape portion when viewed in the stacking direction of the ground conductor pattern and the signal line conductor pattern.

13. A transmission line according to any one of claims 1 to 12, wherein there are a plurality of three-dimensional shapes, and the plurality of three-dimensional shapes are distributed in the direction of the stacking, the stacked body further comprises flat shapes that block the spatial areas formed by the three-dimensional shapes, the inner layer of the plurality of three-dimensional shapes has a narrower width in the direction perpendicular to the extension direction of the signal line conductor pattern, the inner layer of the plurality of three-dimensional shapes has the signal line conductor pattern, the outer layer of the three-dimensional shapes has the ground conductor pattern, the flat shapes have the ground conductor pattern, and the spatial areas are formed between adjacent three-dimensional shapes and between the three-dimensional shapes and the flat shapes.

14. An electronic device comprising a transmission line according to any one of claims 1 to 13, and an electronic circuit connected to the transmission line.

15. An electronic device comprising a transmission line according to any one of claims 1 to 13, and a conductive object or dielectric material in contact with or adjacent to the spatial area of ​​the transmission line.

16. The electronic device according to claim 14 or 15, comprising a signal line cable or electronic components in the spatial area.

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