Polyamide resin composition

WO2026141451A1PCT designated stage Publication Date: 2026-07-02MITSUI CHEMICALS INC

Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
MITSUI CHEMICALS INC
Filing Date
2025-12-24
Publication Date
2026-07-02

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Abstract

Provided is a polyamide resin composition comprising a polyamide resin (A) and a phenolic compound (B), wherein the phenolic compound (B) is at least one compound selected from the group consisting of triphenolic compounds (B-1) represented by general formula (1) (wherein R1, R2, R3, R4, R5, and R6 are each independently a hydrogen atom, a halogen atom, a C1-C5 alkyl group, or a C1-C5 alkoxy group) and phenolic compounds (B-2) having a dicyclopentadiene-derived skeleton.
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