Test table and handler for testing electronic components

Abstract

The present invention relates to a test table for testing electronic components. The test table for testing electronic components according to the present invention comprises a table body supporting electronic components loaded on the top surface thereof, wherein the table body includes vacuum flow paths and cooling flow paths formed therein, and each of the vacuum flow paths has a pneumatic tank with an expanded inner diameter. According to the present invention, the temperature of the electronic components can be controlled relatively quickly, thereby increasing throughput and improving the reliability of the test.

Description

Test table and handler for testing electronic components

[0001] The present invention relates to a handler for supporting the testing of an electronic component by electrically connecting the electronic component and a tester.

[0002] An electronic component test handler is equipment that handles electronic components to electrically connect them to a tester.

[0003] As the integration density of electronic components, such as semiconductor devices, continues to increase, circuit line widths are becoming increasingly narrow. Consequently, greater precision is required when connecting electronic components to testers.

[0004] For example, previously, it was possible to make a proper electrical connection between electronic components and testers with an error range of 20㎛, but now, the reality is that an error range of 10㎛ or less, or even a few㎛, is required.

[0005] Meanwhile, among electronic components, there are dies that are separated into individual units from the wafer state.

[0006] The die can be completed as a final product by undergoing a packaging process or by stacking it for HBM (High Bandwidth Memory) production and then undergoing a packaging process.

[0007] To perform post-die operations, testing of the die is required.

[0008] Electronic components in die form can be tested by electrically connecting contact pads to a tester.

[0009] Since the gaps between the contact pads on the die are fine and the die is very thin, it can easily break or shatter, so automated testing capable of adequately supporting testing of electronic components in the die or HBM state has not been proposed until now. Accordingly, the applicant has proposed Korean Published Patent No. 10-2021-0088373 (hereinafter referred to as the 'prior art').

[0010] The prior art proposes a technique for aligning the positions of electronic components by repositioning them before connecting them to a tester.

[0011] The prior art scans an electronic component on a test table (named a 'chuck' in the prior art) with a camera to determine its current position and readjusts the position of the electronic component to reduce the error range.

[0012] According to the prior art, the precise positioning of electronic components enables automated testing of electronic components at the die level.

[0013] According to the prior art, electronic components loaded on a test table are electrically connected to a tester via a test board, such as a probe card, while maintaining their positions by vacuum pressure.

[0014] Furthermore, electronic components can be used in various temperature environments. Therefore, it is necessary to artificially create a test temperature environment. To this end, the electronic components loaded on the test table need to be heated or cooled.

[0015] The test table must be formed with a vacuum channel to transmit vacuum pressure to the electronic components and a cooling channel to cool the electronic components, and must have a heater for heating the electronic components.

[0016] A large number of electronic components are loaded on a test table, and according to the prior art, vacuum pressure needs to be controlled individually for each electronic component to rearrange the electronic components.

[0017] All electronic components must be controlled to have a uniform temperature within the margin of error.

[0018] However, the requirement to form vacuum channels corresponding to the number of electronic components causes the thickness of the test table to increase. In this case, the time it takes for the cold air from the cooling channels or the heat from the heaters to reach the electronic components loaded on the upper surface of the test table increases. This makes it difficult to control the temperature of the electronic components immediately in real time, thereby causing a decrease in the quality of the test.

[0019] [Prior Art Literature]

[0020] [Patent Literature]

[0021] (Patent Document 1) Republic of Korea Published Patent No. 10-2021-0088373

[0022] There is a need to reduce the height (thickness) of the test table in the vertical direction.

[0023] A test table for testing electronic components according to the first embodiment of the present invention comprises: a table body that supports electronic components loaded on an upper surface; a heater coupled to the table body and for heating electronic components loaded on the upper surface of the table body; wherein the table body has vacuum passages for transmitting vacuum pressure to electronic components loaded on the upper surface of the table body and cooling passages for cooling electronic components loaded on the upper surface of the table body formed therein, and the vacuum passages have an expanded tank with an expanded inner diameter.

[0024] One end of the vacuum passage is positioned on the upper surface of the table body, and the other end of the vacuum passage is positioned on the side of the table body.

[0025] The expansion tank is formed closer to one end of the vacuum channel than to the other end of the vacuum channel.

[0026] The above expansion tank has at least a portion of its area overlapping a vertical line passing through one end of the above vacuum channel.

[0027] The above expansion tank is positioned higher than the above cooling channel.

[0028] Some of the vacuum channels have their other ends positioned higher than the cooling channel, and the remaining ends are positioned lower than the cooling channel.

[0029] The other end of some of the above vacuum channels is formed in a structure that extends from the side of the expansion tank to the side of the table body.

[0030] The other end of the remaining vacuum passages is formed in a structure that extends downward from the expansion tank, passes the location of the cooling passage, and then extends downward from the cooling passage to the side of the table body.

[0031] The table body is manufactured by a 3D printer with a closed upper surface structure that does not have one end of the vacuum channel, and one end of the vacuum channel is formed by drilling from the upper surface downward to the expansion tank using a drilling tool.

[0032] The point connecting from the expansion tank to one end of the vacuum channel and the point connecting from the expansion tank to the other end of the vacuum channel lie on different vertical lines.

[0033] The heater is positioned lower than the cooling channel.

[0034] The heater is positioned lower than the vacuum passages.

[0035] It further includes an insulating plate positioned below the heater.

[0036] A test table for testing electronic components according to a second embodiment of the present invention comprises: a table body that supports electronic components loaded on an upper surface; and a heater coupled to the table body and for heating electronic components loaded on the upper surface of the table body; wherein the table body has vacuum channels for transmitting vacuum pressure to electronic components loaded on the upper surface of the table body and cooling channels for cooling electronic components loaded on the upper surface of the table body formed therein, and the table body is manufactured by a 3D printer with the vacuum channels blocked toward the upper surface, and the formation of the vacuum channels is completed by perforating downward from the upper surface by a perforating tool.

[0037] A test table for testing electronic components according to a third embodiment of the present invention comprises: a table body that supports electronic components loaded on an upper surface; and a heater coupled to the table body and for heating electronic components loaded on the upper surface of the table body. The table body has vacuum channels for transmitting vacuum pressure to electronic components loaded on the upper surface of the table body and cooling channels for cooling electronic components loaded on the upper surface of the table body formed therein. One end of the vacuum channel is positioned on the upper surface of the table body and the other end of the vacuum channel is positioned on the side of the table body. Some of the other ends of the vacuum channels are positioned at a higher position than the cooling channel, and the remaining other ends are positioned at a lower position than the cooling channel.

[0038] The heater is positioned lower than the cooling channel.

[0039] The heater is positioned lower than the vacuum passages.

[0040] It further includes an insulating plate positioned below the heater.

[0041] A handler for testing electronic components according to the present invention comprises: a transport shuttle having a transport table capable of transporting electronic components by moving while the electronic components are loaded; a first hand that loads electronic components to be tested onto the transport table in a first area by the operation of the transport shuttle, or unloads electronic components that have completed testing and have arrived at the first area by loading them onto the transport table; a second hand that unloads electronic components from the transport table that has been moved from the first area to a second area separated from the first area by the operation of the transport shuttle; a test table on which the electronic components to be tested unloaded from the transport table by the second hand are loaded; and a moving mechanism that moves the test table by the second hand between a loading space where electronic components are loaded onto the test table and a test space having a test board for electrically connecting the electronic components to a tester, and electrically connects or disconnects the terminals of the electronic components loaded on the test table and the test pins of the test board. It includes a controller that controls the above transport shuttle, the above first hand, the above second hand, and the above moving mechanism.

[0042] According to the present invention, by reducing the thickness of the test table in the vertical direction and rapidly controlling the temperature of electronic components loaded on the upper surface of the test table, the processing capacity is increased and the reliability of the test is improved.

[0043] FIG. 1 is a conceptual plan view of a handler for testing electronic components according to the present invention.

[0044] FIGS. 2 to 11 are reference diagrams for explaining the electronic component test handler of FIG. 1.

[0045] FIGS. 12 to 22 are reference drawings for explaining an electronic component test table according to an embodiment of the present invention applied to the electronic component test handler of FIG. 1.

[0046] Preferred embodiments according to the present invention are described by example with reference to the attached drawings, provided that for the sake of brevity, descriptions of well-known or redundant components are omitted or compressed as much as possible.

[0047] <Description of Basic Configuration for Electronic Component Test Handlers>

[0048] FIG. 1 is a conceptual plan view of an electronic component test handler (TH, hereinafter abbreviated as 'handler') according to a first embodiment of the present invention.

[0049] The handler (TH) according to the present invention may be divided into a moving part (MP), a loading / unloading part (LU), a relocation part (RP), and a connecting part (CP), and includes a transport shuttle (100), a first hand (210), a second hand (220), a test table (300), a vacuum device (400), a relocation mechanism (500), a moving mechanism (600), and a controller (800).

[0050] In the moving section (MF), electronic components can be moved to exchange electronic components between the unloading section (LU) and the relocation section (RP). To this end, a transport shuttle (100) for carrying electronic components is installed in the moving section (MP).

[0051] A transport shuttle (100) is provided to transport electronic components between the unloading section (LU) and the relocation section (RP).

[0052] The transport shuttle (100) has a movable transport table (110).

[0053] The transport shuttle (100) may have at least one transport table (110).

[0054] The transport table (110) can move back and forth in one direction.

[0055] The transport table (110) can move back and forth in the X-axis direction.

[0056] In the case where there are multiple transport tables (100), the multiple transport tables (110) may be provided in parallel in the Y-axis direction. In this case, the multiple transport tables (110) need to be implemented to move back and forth in the X-axis direction independently of each other.

[0057] The transport table (110) can move between the first area (A1) on the unloading side (LU) and the second area (A2) on the relocation side (RP).

[0058] Electronic components can be loaded on the transport table (110).

[0059] The transport table (110) is not a pocket structure having a mounting groove on which an electronic component can be mounted, but a vacuum structure that fixes an electronic component mounted on a flat surface by vacuum pressure.

[0060] As shown in the schematic plan view of FIG. 2, the transport table (110) has vacuum holes (VH) and vacuum grooves (VG) formed therein for vacuum-adsorbing electronic components.

[0061] One vacuum hole (VH) and one vacuum groove (VG) form a pair.

[0062] The vacuum pressure coming through the vacuum hole (VH) acts on the electronic component as it is evenly distributed through the vacuum groove (VG).

[0063] Since the electronic component can be fixed to the transport table (110) by vacuum pressure, no movement of the electronic component occurs during the process of moving in the X-axis direction while being carried on the transport table (110). Therefore, as long as the electronic component is placed precisely on the transport table (110), the error of misalignment of the electronic component, which has been a problem, can be minimized.

[0064] The vacuum holes (VH) and vacuum grooves (VG) can be arranged in a 2x8 matrix form.

[0065] Since the loading capacity of the transport table (110) can be increased or decreased, the number of vacuum holes (VH) and vacuum grooves (VG) can also be increased or decreased.

[0066] In the unloading section (LU), electronic components are supplied to the handler (TH) or recovered from the handler (TH).

[0067] Electronic components to be tested are supplied to the handler (TH) through the unloading section (LU), and electronic components that have completed testing are recovered from the handler (TH) through the unloading section (LU).

[0068] Electronic components can be loaded onto a Jetec Tray, Ring Frame, or other types of customer tray and supplied to or retrieved from the handler (TH).

[0069] Electronic components to be tested in the unloading section (LU) are loaded onto a transport table (110) in the first area (A1), and electronic components that have completed testing and are loaded onto the transport table (110) in the first area (A1) are unloaded from the transport table (110). To this end, a first hand (210) is provided in the unloading section (LU).

[0070] The first hand (210) is provided to load electronic components onto the transport table (110) or to take them from the transport table (110).

[0071] For unloading operations by the first hand (210), the transport table (110) must be moved toward the unloading section (LU) and be in the first area (A1).

[0072] The first hand (210) loads electronic components to be tested onto a transport table (110) in the first area (A1) or unloads electronic components that have been tested from a transport table (110) in the first area (A1).

[0073] The first hand (210) may have one or more pickers capable of gripping or releasing electronic components. The pickers may grip electronic components by vacuum pressure.

[0074] Preferably, four pickers can be installed in pairs on the first hand (210) to improve processing capacity.

[0075] For example, as shown in the schematic diagram of FIG. 3, the first hand (210) may have four pickers (P) arranged in a 2x2 matrix. Of course, depending on the implementation, the number of pickers (P) provided in the first hand (210) may be increased or decreased.

[0076] The first hand (210) may further include a camera (C).

[0077] The first hand (210) is controlled by the controller (800) to grasp an electronic component whose position is accurately calculated from an image captured by the camera (C) before grasping the electronic component from the customer tray.

[0078] The first hand (210) is controlled so that the center of the electronic component is aligned with the vacuum hole (VH), the position of which is accurately calculated from an image captured by the camera (C) by the controller (800) before the electronic component is placed on the transport tray (110).

[0079] The first hand (210) is controlled to load electronic components at a position accurately calculated from an image captured by a camera (C) by a controller (800) when moving electronic components from a transport table (110) to a customer tray.

[0080] Therefore, the picker (P) can grasp or load electronic components at a more precise position, and thus enables precise positioning of the electronic components.

[0081] In the relocation section (RP), electronic components (ED) to be tested are unloaded from the transport table (110) and loaded onto the test table (300), and the electronic components loaded onto the test table (300) are relocated. To this end, a relocation space (RS) is formed in the relocation section (RP) for the relocation of electronic components.

[0082] According to the present embodiment, the relocation portion (RP) is positioned on one side of the connection portion (CP) in the X-axis direction.

[0083] The repositioning part (RP) is equipped with a second hand (220).

[0084] The second hand (220) takes an electronic component (ED) to be tested from the transport table (110) or loads an electronic component (ED) that has been tested onto the transport table (110).

[0085] For unloading operations by the second hand (220), the transport table (110) must be moved toward the relocation section (RP) and be in the second area (A2).

[0086] The second hand (220) takes electronic components to be tested from the transport table (110) in the second area (A2) or loads electronic components that have been tested from the transport table (110) in the second area (A2).

[0087] The second hand (220) may be configured in the same way as the first hand (210). Of course, the number of pickers (P) provided in the first hand (210) and the number of pickers (P) provided in the second hand (220) may be different.

[0088] The second hand (220) loads the electronic components to be tested from the transport table (110) in the second area (A2) onto the test table (300) that has been moved to the relocation section (RP).

[0089] In order for electronic components to be tested by the second hand (220) to be loaded onto the test table (300), the test table (300) must be located in the relocation space (RS). Therefore, the relocation space (RP) can be renamed as the loading space.

[0090] The second hand (220) loads the electronic components that have been tested and are loaded on the test table (300) onto the transport table (110) in the second area (A2).

[0091] The test table (300) is provided to load electronic components (ED) that are unloaded from the transport table (110) by the second hand (220).

[0092] As shown in the schematic excerpt of FIG. 4, the test table (300) is rectangular in shape and has a flat top surface.

[0093] The test table (300) may be in the shape of a disc when viewed from a flat surface, and in this case, the top surface is also flat.

[0094] The electronic components are loaded onto the test table (300) in a manner such that they are placed on the flat upper surface of the test table (300).

[0095] The test table (300) can be moved in the X-axis, Y-axis, and Z-axis directions.

[0096] The test table (300) can be rotated in the Θ-axis direction with the vertical line (V) passing through the center of the test table (300) in the Z-axis direction as the axis of rotation.

[0097] Generally, during the process of moving electronic components (ED) to the test table (300), shock or inertia accompanying the movement occurs. Shock or inertia can disrupt the position of the electronic components loaded on the test table (300). To prevent this, vacuum channels (311) are formed in the test table (300) to fix the electronic components by vacuum pressure.

[0098] The vacuum structure of the test table (300) for fixing electronic components may be the same as the vacuum structure of the transport table (110) with reference to FIG. 2.

[0099] When an electronic component is placed on the test table (300) by the second hand (220), the electronic component can be settled in the position where it was placed by vacuum pressure. In that state, when the second hand (220) releases the grip on the electronic component, the electronic component is fixed in the position where it was settled without shifting.

[0100] The vacuum device (400) provides vacuum pressure to the electronic components on the test table (300) through the vacuum channel (311).

[0101] The vacuum pressure provided by the vacuum device (400) is transmitted to the electronic components (ED) through the vacuum path (311), and the electronic components loaded on the test table (300) are fixed in position by the vacuum pressure.

[0102] Since the vacuum channels (311) can be individually controlled, the vacuum pressure can be controlled for each electronic component. Since the vacuum channels (311) are implemented to be selectively opened and closed, the electronic components (ED) can be selectively fixed to the test table (300) or removed from the test table (300).

[0103] The specific configuration of the test table (300) as described above is the most important feature of the present invention, so it will be explained later in a separate section.

[0104] The electronic components are electrically connected to the tester while loaded on the test table (300).

[0105] The electrical connection between the electronic components loaded on the test table (300) and the tester is made via a test board (20).

[0106] The test board (20) has test pins that are electrically in contact with electronic components.

[0107] The test board (20) is connected to the handler (TH) at the connection part (CP).

[0108] The electronic components loaded on the test table (300) that has been moved to the connection part (CP) and the test pins of the test board (20) are electrically contacted.

[0109] The test board (20) may have any structure as long as it has a configuration that can be electrically connected to electronic components.

[0110] The test board (20) may be a widely known probe card. In this case, it is preferable that the test table (300) be provided in the form of a disc.

[0111] The test board (20) may have a structure having socket modules. Test pins are provided in the socket modules, and the socket modules are installed in the socket body. In this case, it is preferable that the test table (300) be provided in the shape of a square plate.

[0112] As shown in the bottom view of FIG. 5, test boards (20) have test zones (TZ) arranged therein, each corresponding to one electronic component.

[0113] The test zones (TZ) correspond one-to-one with the electronic components loaded on the test table (300).

[0114] One test zone (TZ) is equipped with test pins (t) for electrically connecting to one electronic component.

[0115] The test pins (t) in one test zone (TZ) form a set of clusters that form the test zone (TZ) and are electrically connected to the electronic component (ED).

[0116] If the test board (20) is a probe card, a set of test pins (t) are densely arranged in the test area (TZ). Here, the set of test pins (t) corresponds to terminals on an electronic component.

[0117] In the case where the test board (20) has a structure with a socket module, a set of test pins (t) are installed in one socket module (22), and one socket module (22) forms one test zone (TZ). Therefore, when one socket module (22) is replaced, one test zone (TZ) is replaced.

[0118] The test area (TZ) and the electronic component (ED) must be aligned. If the coordinates of the electronic component (ED) on the test table (300) on the XY plane do not match the coordinates of the test area (TZ), a failure occurs in the electrical connection between the electronic component (ED) and the tester.

[0119] As shown in the conceptual example of FIG. 6, if an electronic component (ED) on the test table (300) is at an angular position having a rotation angle (Θ1) twisted in the Θ-axis direction with respect to the test zone (TZ), a failure occurs in the electrical connection between the electronic component (ED) and the tester. Therefore, all test zones (TZ) of the test board (20) and all electronic components (ED) on the test table (300) must be aligned.

[0120] A relocation mechanism (500) is provided to realize alignment between the test zone (TZ) and the electronic component (ED).

[0121] According to the present embodiment, the electronic component (ED) is moved from the transport table (110) to the test table (300) by the second hand (220). During this process, an error in the position of the electronic component (ED) may occur due to an operating error or operating shock of the second hand (220).

[0122] The positions of the electronic components (ED) loaded onto the test table (300) by the second hand (220) on the XY plane or each position may be different, and the electronic components (ED) loaded onto the test table (300) and the test zones (TZ) of the test board (20) may not coincide with each other.

[0123] It does not matter if the error tolerance between the electronic component (ED) and the test zone (TZ) is wide. However, the reality is that the packaged semiconductor device requires a precision of within 30㎛, and in the case of the die or HBM, a precision of within 5㎛ is required.

[0124] In the present invention, when the second hand (220) moves electronic components (ED) from the transport table (110) to the test table (300), the electronic components (ED) are loaded into temporary zones and then relocated from the temporary zones to the fixed zones.

[0125] The temporary area is not a set location, but an arbitrary location where the electronic component (ED) is placed on the test table (300) by the second hand (220).

[0126] The temporary zone is a location that is not set or fixed by the controller (800) but is arbitrarily determined by the second hand (220). For example, when the second hand (220) places an electronic component (ED) on the test table (300), the area where the electronic component (ED) is placed becomes the temporary zone.

[0127] Exaggerated Figure 7 shows an example of a temporary zone (BZ) on a test table (300).

[0128] The fixed position zone refers to the location where the electronic component and the test zone (TZ) coincide. An exaggerated figure 8 shows the relationship between the temporary zone (BZ) and the fixed position zone (RZ) on the test table (300).

[0129] The position zone (RZ) may be pre-set, but it may also be set to match the positions of the test zones (TZ) on the test board (20) after the electronic components (ED) to be tested are loaded onto the test table (300).

[0130] In Fig. 8, the temporary zone (BZ) has errors in the X-axis, Y-axis, and Θ-axis directions with respect to the fixed zone (RZ).

[0131] A relocation mechanism (500) is provided to precisely relocate the position of an electronic component (ED) loaded on a test table (300) in a relocation space (RS).

[0132] The relocation mechanism (500) is provided to relocate the position of an electronic component (ED) loaded on a test table (300) by the second hand (220) from a temporary zone (BZ) to a fixed zone (RZ).

[0133] According to the present embodiment, the second hand (220) loads the electronic components (ED) to be tested, which are unloaded from the transport table (110), into a temporary zone (BZ). Then, a relocation mechanism (500) is utilized to move the electronic components (ED) in the temporary zone (BZ) to the designated zone (RZ).

[0134] As shown in the schematic diagram of FIG. 9, the relocation mechanism (500) includes a relocation picker (510) and a relocation camera (520).

[0135] The relocation mechanism (500) has its position fixed.

[0136] The relocation mechanism (500) can be fixedly mounted on the frame forming the skeleton of the handler (TH).

[0137] The repositioning picker (510) can grasp or release the electronic component (ED). The repositioning picker (510) can grasp the electronic component (ED) by vacuum pressure.

[0138] The repositioning picker (510) is fixed in a horizontal position in the X-axis and Y-axis directions.

[0139] The relocation camera (520) is positioned apart from the relocation picker (510).

[0140] A repositioning camera (520) is provided to photograph electronic components (ED).

[0141] As in the example of FIG. 10, the repositioning camera (520) photographs identification marks (M: M1, M2) on the electronic component (ED). The identification marks (M) may be arranged diagonally opposite each other.

[0142] However, the object photographed by the relocation camera (520) to relocate the electronic component (ED) does not need to be limited to the identification mark (M). The object photographed by the relocation camera (520) may be replaced with the corner of the electronic component (ED), the identification pad or identification pattern of the electronic component (ED), etc.

[0143] The relocation picker (510) and the relocation camera (520) are combined into a single module. Therefore, the relative placement positions of the relocation picker (510) and the relocation camera (520) are fixed.

[0144] The moving mechanism (600) can move the test table (300) in the horizontal direction, which is the X-axis and Y-axis direction.

[0145] The moving mechanism (600) can rotate the test table (300) in the Θ-axis direction.

[0146] The moving mechanism (600) can move the test table (300) up and down in the Z-axis direction.

[0147] As shown in the schematic excerpt of FIG. 11, the moving mechanism (600) includes a rotating mechanism (610), an elevator (620), a first moving mechanism (640), and a second moving mechanism (660).

[0148] The rotator (610) rotates the test table (300) in the Θ-axis direction.

[0149] The angular position of the electronic component (ED) can be adjusted by rotating the test table (300) by means of the rotating device (610).

[0150] The elevator (620) raises the test table (300).

[0151] The test table (300) is connected to the elevator (620) via a rotating mechanism (610).

[0152] When the test table (300) is raised by the elevator (620), the electronic components (ED) of the test table (300) come into contact with the test pins (t), thereby electrically connecting the electronic components (ED) to the tester. When the test table (300) is lowered by the elevator (620), the contact between the electronic components (ED) and the test pins (t) is released, and the test table (300) becomes capable of moving in a horizontal direction.

[0153] The first moving device (640) moves the test table (300) in the X-axis direction.

[0154] By moving the test table (300) in the X-axis direction by the first moving device (640), the test table (300) can be selectively positioned in the relocation space (RS) and the test space (TS). Here, the test space (TS) is a space formed in the connection part (CP), and when the test table (300) is in the test space (TS), an electrical connection is made between the electronic component (ED) and the tester by raising the test table (300).

[0155] The second mover (660) moves the test table (300) in the Y-axis direction.

[0156] The above-mentioned moving mechanism (600) has three functions.

[0157] The first function is to move the test table (300) between the relocation space (RS) and the test space (TS).

[0158] The second function is to electrically connect or disconnect electronic components (ED) to the tester.

[0159] The third function is for the relocation of electronic components (ED) in the relocation space (RS).

[0160] Further explanation of the third function.

[0161] Since the repositioning picker (510) is fixed, the test table (300) moves in the horizontal X-axis and Y-axis directions or rotates in the Θ-axis direction to adjust the position of the electronic component (ED) on the horizontal plane.

[0162] Depending on the implementation, the test table (300) is raised and lowered during the relocation process of the electronic component (ED), thereby enabling the relocation picker (510) to grasp or release the electronic component (ED).

[0163] Here, the operation during the relocation of electronic components (ED) is explained.

[0164] As shown in Fig. 8, the temporary zone (BZ) of the electronic component (ED) may differ from the fixed zone (RZ) in the X-axis, Y-axis, and Θ-axis directions.

[0165] The relocation camera (520) photographs the electronic component (ED) on the test table (300) and identifies the temporary zone (BZ) through the location of the identification mark (M).

[0166] When the temporary zone (BZ) is identified, the rotating machine (610), the first moving machine (640), and the second moving machine (660) operate to position the center of the temporary zone (BZ) below the relocation picker (510), and the elevator (620) operates to raise the test table (300).

[0167] When the repositioning picker (510) adsorbs and grips the electronic component (ED) of the raised test table (300) by vacuum pressure, the elevator (620) operates to lower the test table (300). Afterward, the first moving device (640) and the second moving device (660) operate to align the center of the positioning zone (RZ) with the center of the electronic component (ED) gripped by the repositioning picker (510), and the rotating device (610) operates to align the electronic component (ED) with the positioning zone (RZ). In this state, the elevator (620) operates to raise the test table (300), thereby allowing the electronic component (ED) held by the repositioning picker (510) to settle in the positioning zone (RZ).

[0168] When the electronic component (ED) is fixed to the test table (300) by vacuum pressure applied through the vacuum channel (310) while the electronic component (ED) is seated in the positioning zone (RZ), the repositioning picker (510) releases the grip of the electronic component (ED). Then, the test table (300) lowers and begins repositioning the next electronic component (ED).

[0169] The controller (800) controls the components necessary for the proper operation of the handler (TH), such as the transport shuttle (100), the first hand (210), the second hand (220), the vacuum device (400), the relocation mechanism (500), and the moving mechanism (600).

[0170] Next, the method of operation of the handler (TH) according to the present invention will be described from the perspective of rearranging electronic components (ED).

[0171] In the unloading section (LU), the first hand (210) loads electronic components (ED) to be tested onto a transport table (110) in the first area (A1).

[0172] When all the electronic components (ED) are loaded onto the transport table (110), the transport shuttle (100) operates and moves the transport table (110) to the second area (A2).

[0173] The second hand (220) unloads electronic components (ED) from the transport table (110) in the second area (A2) and moves them to the test table (300) in the relocation area (RS). At this time, the locations of the electronic components (ED) loaded onto the test table (300) by the second hand (220) are temporary zones (BZ).

[0174] When all the electronic components (ED) to be tested are loaded onto the test table (300), the controller (800) operates the relocation mechanism (500) and the moving mechanism (600) to relocate the electronic components (ED) from the temporary zones (BZ) to the fixed zones (RZ).

[0175] When the rearrangement of electronic components (ED) on the test table (300) is completed, the moving mechanism (600) operates to move the test table (300) to the test space (TS). Afterwards, the elevator (620) operates to raise the test table (300) toward the test board (20) so that the electronic components (ED) are electrically connected to the tester.

[0176] When the testing of the electronic components (ED) is finished, the test table (300) is moved to the relocation section (RP) by the moving mechanism (600). Then, the second hand (220) moves the electronic components (ED) that have completed testing to the transport tray (110) in the second area (A2), and the transport tray (110) filled with the electronic components (ED) that have completed testing moves to the first area (A1). Subsequently, the first hand (210) unloads the electronic components (ED) that have completed testing from the transport table (110) and loads them onto an empty customer tray.

[0177] Based on the basic operation method described above, the electronic component (ED) is supplied to the tester for testing, and is retrieved after the test is completed.

[0178] Meanwhile, tests requiring high or low temperature environments may be required.

[0179] The controller (800) controls the temperature of the electronic components (ED) loaded on the test table (300).

[0180] The temperatures of all electronic components (EDs) must be uniformly controlled within a set range and, if possible, controlled immediately. To this end, a test table (300) according to the present invention will be described in more detail.

[0181] <Explanation of Test Tables>

[0182] FIGS. 12 and FIGS. 13 illustrate the basic structure of a test table (300) according to one embodiment of the present invention in an exaggerated manner.

[0183] FIG. 12 is an assembled view of the test table (300), and FIG. 13 is an exploded view of the test table (300).

[0184] The test table (300) includes a table body (310), a heater (320), and an insulation plate (330).

[0185] The table body (310) is formed of a metal material and supports electronic components (ED) loaded on the upper surface.

[0186] A plurality of vacuum channels (311) are formed in the table body (310).

[0187] The vacuum channels (311) are formed to transmit the vacuum pressure provided by the vacuum device (400) to the electronic components (ED) loaded on the upper surface of the table body (310).

[0188] The vacuum passage (311) is formed in a number equal to the number of electronic components (ED) to be loaded on the test table (300) and corresponds one-to-one with the electronic components (ED).

[0189] In order to individually relocate the electronic components (ED) loaded on the upper surface (TF) of the table body (310), the vacuum channels (311) are each opened and closed independently.

[0190] 256 or 128 or more electronic components (ED) can be loaded at once on the upper surface (TF) of the table body (310). Accordingly, the number of vacuum passages (311) is equal to the number of electronic components (ED) that can be loaded on the upper surface (TF). However, in FIG. 14 and below, only the vacuum passages (311) necessary for clear explanation are shown, and the rest are omitted.

[0191] Referring to the cross-sectional view of FIG. 14, one end (311a) of the vacuum channel (311) is positioned on the upper surface (TF) of the table body (310), and the other end (311b) of the vacuum channel (311) is positioned on the side surface (SF) of the table body (310).

[0192] The vacuum channels (311) are formed to have various shapes of paths so as not to overlap with each other while avoiding interference with the cooling channels (312).

[0193] All vacuum channels (311) have an expansion tank (311c) with an expanded inner diameter compared to other parts.

[0194] The vacuum pressure provided by the vacuum device (400) can act strongly instantaneously. At this time, the expansion tank (311c) functions to mitigate the vacuum pressure that can act strongly instantaneously, thereby preventing damage to the electronic component (ED) or unintended positional change.

[0195] When the electronic component (ED) needs to be removed from the upper surface of the table body (310), it can be implemented to blow air into the vacuum passage (310) instead of vacuum pressure. At this time, the expansion tank (311c) functions to mitigate the air pressure that can act strongly instantaneously, thereby preventing unintended positional changes of the electronic component (ED).

[0196] The expansion tank (311c) also has the function of preventing blockage of the vacuum passage (311), and this will be explained separately in the relevant section.

[0197] The expansion tank (311c) is formed closer to one end (311a) of the vacuum channel (311) than to the other end (311b) of the vacuum channel (311) along the entire length of the vacuum channel (311).

[0198] The expansion tank (311c) has at least a portion of its area overlapping the vertical line (V1) passing through one end (311a) of the vacuum channel (311).

[0199] The expansion tank (311c) is formed to be positioned higher than the cooling channel (312).

[0200] Some of the vacuum channels (311) have their other ends (311b) positioned higher than the cooling channels (312), and the remaining other ends (311b) are positioned lower than the cooling channels (312). Accordingly, the vacuum channels (311) can be formed so that their other ends (311b) are properly positioned on the side (SF) of the table body (310) while avoiding overlap with the cooling channels (312).

[0201] A vacuum groove (311d) is formed on one side of the vacuum channel (311).

[0202] As shown in the plan view of FIG. 15, the vacuum groove (311d) functions to ensure that vacuum pressure is evenly distributed and acts on the electronic component (ED), thereby stably fixing the electronic component (ED) to the upper surface (TF) of the table body (310).

[0203] The vacuum groove (311d) also has the function of mitigating vacuum pressure that can act strongly instantaneously, such as in the expansion tank (311c), thereby preventing damage to the electronic component (ED) or unintended positional change.

[0204] A cooling channel (312) is formed to cool electronic components (ED) loaded on the upper surface of the table body (310).

[0205] FIG. 16 shows an example of a cooling channel (312).

[0206] The cooling channel (312) and the vacuum channel (311) must be formed so that they overlap and do not interfere with each other.

[0207] A low-temperature cooling medium flows through the cooling channel (312).

[0208] The cooling medium cools the electronic components (ED) loaded on the table body (310) by cooling the table body (310).

[0209] The cooling medium can be supplied by a chiller, and the chiller can be installed in the handler (TH) or provided in the test house and connected to the handler (TH).

[0210] The vacuum channel (311) or cooling channel (312) formed in the table body (310) must be well sealed so that vacuum pressure or cooling medium does not leak. Therefore, it is desirable for the table body (310) to be manufactured to be formed integrally by a 3D printer.

[0211] However, the position of the end (311a) of the vacuum channel (311) needs to be accurately set. To this end, as shown in FIG. 17, the table body (310) is first manufactured by a 3D printer with a structure in which the upper surface (TF) without the end (311a) of the vacuum channel (311) is closed. Afterward, the end (311a) of the vacuum channel (311) is formed by drilling downward from the upper surface (TF) of the table body (310) to the expansion tank (311c) using a drilling tool such as a drill, thereby completing the formation of the vacuum channel (311). At this time, the vacuum groove (311d) can also be processed together.

[0212] Meanwhile, metal foreign matter is generated during the process of forming one end (311a) of the vacuum channel (311).

[0213] Metal foreign matter enters the vacuum passage (311). However, some of the metal foreign matter accumulates on the expansion tank (311c), thereby suppressing the phenomenon of the vacuum passage (311) being blocked by the metal foreign matter. That is, in the absence of the expansion tank (311c), the metal foreign matter could block the vacuum passage (311), which has a relatively narrow inner diameter compared to the expansion tank (311c), but the presence of the expansion tank (311c) prevents the vacuum passage (311) from being blocked.

[0214] Of course, after the table body (310) is manufactured, a process of removing metal foreign matter is performed.

[0215] The removal of metal foreign matter can be achieved by providing vacuum pressure or air pressure to the vacuum channel (311) to cause a flow of air within the vacuum channel (311).

[0216] Since the vacuum channel (311) is formed in a diverse and complex manner, if the vacuum channel (311) is blocked by metal foreign matter, the air flow within the vacuum channel (311) may not be properly maintained. Therefore, it may be difficult to remove metal foreign matter adhering to the wall of the vacuum channel (311). The expansion tank (311c) prevents such difficulty and functions to help easily and completely remove metal foreign matter generated during the process of drilling one end (311a) of the vacuum channel (311) from the vacuum channel (311).

[0217] A heater (320) is provided to heat an electronic component (ED) loaded on the upper surface (TF) of the table body (310).

[0218] The heater (320) is connected to the table body (310).

[0219] The heater (320) is made in a flat plate-like structure to uniformly heat all the electronic components (ED) loaded on the upper surface of the table body (310).

[0220] The heater (320) is attached to the bottom of the table body (310).

[0221] Therefore, the heater (320) is positioned lower than the vacuum channel (311) and the cooling channel (312).

[0222] The insulation plate (330) prevents heat from the heater (320) from leaking downward and allows it to be conducted to the table body (310). To this end, the insulation plate (330) is placed below the heater (320).

[0223] The insulation plate (330) can be made of ceramic with extremely low thermal conductivity.

[0224] Meanwhile, temperature control of the electronic component (ED) by the cooling channel (312) or heater (320) needs to be performed as quickly as possible.

[0225] Rapid temperature control of electronic components (EDs) contributes to expanding processing capacity by reducing the time required for testing.

[0226] Rapid temperature control of electronic components (EDs) contributes to improving test reliability by immediately responding to temperature changes in electronic components (EDs) that occur during the test process.

[0227] To rapidly control the temperature of the electronic component (ED), the cooling channel (312) should be formed as close as possible to the electronic component, and the heater (320) should also be positioned as close as possible to the electronic component. To this end, the cooling channel (312) is positioned directly below the expansion tank (311c) so as to be positioned close to the electronic component (ED) without interfering with the vacuum channel (311). Additionally, some of the vacuum channels (311) are formed such that their other end (311b) extends straight from the side of the expansion tank (311c) to the side of the table body (310).

[0228] As shown in FIG. 18, the ends (311a) of the vacuum passages (311) are arranged in a matrix form on a plane. Among these vacuum passages (311), at least some of the other ends (311a) of the vacuum passages (311) whose ends (311a) are placed in the outermost region (OS) are formed in a structure that extends straight from the expansion tank (311c) to the side of the table body (310). The other ends of the remaining vacuum passages (311) are formed in a structure that extends downward from the expansion tank (311c), passes the location of the cooling passage (312), and then extends from below the cooling passage (312) to the side of the table body (310).

[0229] As described above, by arranging the cooling channel (312) as close as possible to the expansion tank (311c) and arranging the other end (311b) of the vacuum channels (311) without wasting the height occupied by the expansion tank (311c), the cooling channel (312) can be arranged close to the electronic component (ED) even though a large number of vacuum channels (311) are formed.

[0230] In addition, since the vacuum channel (211) is formed without wasting the height occupied by the expansion tank (311c), the height of the table body (310) in the vertical direction can be reduced, so the heater (320) can also be placed closer to the electronic component (ED).

[0231] FIG. 19 illustrates a case where the test table (300) is in the shape of a disc.

[0232] That is, the test table (300) can be provided in the form of a square plate or a circular plate depending on the required structure.

[0233] The disc-shaped test table (300) is also identical to the previously described vacuum channel (311) and cooling channel (312) formation structure and the arrangement structure of the table body (310), heater (320), and insulation plate (330).

[0234] Additional Explanation

[0235] 1. Variation Example

[0236] As shown in FIG. 20, the first joint point (P1) extending from the expansion tank (311c) of the vacuum channel (311) toward one end (311a) of the vacuum channel (311) and the second joint point (P2) extending from the expansion tank (311c) toward the other end (311b) of the vacuum channel (311) are not on the same vertical line.

[0237] The first vertical line (V2) passing through the first joint point (P1) and the second vertical line (V3) passing through the second joint point (P2) are spaced apart from each other.

[0238] According to the modified example of FIG. 20, metal sludge generated during the process of drilling one end of the vacuum channel (311) with a drilling tool is further captured in the expansion tank (311c), so the phenomenon of metal sludge blocking the vacuum channel (311) is further prevented.

[0239] 2. Supplementary explanation of vacuum structure

[0240] As shown in FIG. 21, the vacuum groove (311d) has a horizontal length (L1) and a vertical length (L2) that are shorter than the horizontal length (L3) and vertical length (L4) of the electronic component (ED), respectively.

[0241] That is, the planar area of ​​the region encompassing the edge of the vacuum groove (311d) is narrower than the planar area of ​​the electronic component (ED).

[0242] Therefore, during the relocation process of electronic components (ED), the position of the electronic components (ED) can be sufficiently adjusted within a certain range.

[0243] FIG. 22 shows an exaggerated representation of the various mutual positional relationships between the electronic component (ED) and the vacuum groove (311d) when the electronic component (ED) is loaded onto the test table (300).

[0244] If the relative positions of the vacuum groove (311d) and the electronic component (ED) are set so that the electronic component (ED) can completely cover the vacuum groove (311d) on a flat surface, the position of the electronic component (ED) can be fixed by the vacuum channel (311).

[0245] In particular, even if the position of the vacuum groove (311d) changes slightly due to thermal expansion or contraction of the table body (310), it is possible to fix the electronic component (ED) placed in the positioning zone (RZ) to the vacuum channel (311).

[0246] The embodiments described above are merely preferred examples of the present invention and may have various applications. Therefore, the present invention should not be understood as being limited only to the contents described above. Instead, the scope of the present invention should be understood as the separately described claims and their equivalents.

Claims

1. A table body that supports electronic components loaded on an upper surface; A heater coupled to the table body and for heating an electronic component loaded on the upper surface of the table body; comprising The table body has vacuum passages for transmitting vacuum pressure to electronic components loaded on the upper surface of the table body and cooling passages for cooling electronic components loaded on the upper surface of the table body formed therein. The above vacuum channel has an expansion tank with an expanded inner diameter. Test table for testing electronic components.

2. In Paragraph 1, One end of the vacuum passage is positioned on the upper surface of the table body, and the other end of the vacuum passage is positioned on the side of the table body. Test table for testing electronic components.

3. In Paragraph 2, The above expansion tank is formed closer to one end of the vacuum channel than to the other end of the vacuum channel. Test table for testing electronic components.

4. In Paragraph 3, The above expansion tank has at least a portion of its area overlapping a vertical line passing through one end of the vacuum channel. Test table for testing electronic components.

5. In Paragraph 3, The above expansion tank is positioned higher than the above cooling channel. Test table for testing electronic components.

6. In Paragraph 2, Some of the vacuum passages have their other ends positioned higher than the cooling passage, and the remaining ends are positioned lower than the cooling passage. Test table for testing electronic components.

7. In Paragraph 2, Some of the vacuum passages are formed such that the other end extends from the side of the expansion tank to the side of the table body. Handler for testing electronic components.

8. In Paragraph 7, The other end of the remaining vacuum passages is formed in a structure that extends downward from the expansion tank, passes the location of the cooling passage, and then extends downward from the cooling passage to the side of the table body. Test table for testing electronic components.

9. In Paragraph 2, The above table body is manufactured by a 3D printer with a closed upper surface structure having no end of the vacuum channel, and One end of the above vacuum channel is formed by drilling from the upper surface downward to the expansion tank using a drilling tool. Test table for testing electronic components.

10. In Paragraph 2, The point connecting from the expansion tank to one end of the vacuum channel and the point connecting from the expansion tank to the other end of the vacuum channel are on different vertical lines. Test table for testing electronic components.

11. In Paragraph 12, The heater is positioned at a lower location than the cooling channel. Test table for testing electronic components.

12. In Paragraph 11, The heater is positioned at a lower location than the vacuum passages. Test table for testing electronic components.

13. In Paragraph 1, Further including an insulating plate disposed below the heater Test table for testing electronic components.

14. A table body that supports electronic components loaded on the upper surface; A heater coupled to the table body and for heating an electronic component loaded on the upper surface of the table body; comprising The table body has vacuum passages for transmitting vacuum pressure to electronic components loaded on the upper surface of the table body and cooling passages for cooling electronic components loaded on the upper surface of the table body formed therein. The above table body is manufactured by a 3D printer with the vacuum passage blocked toward the upper surface, and The formation of the vacuum channel is completed by drilling downward from the upper surface with a drilling tool. Test table for testing electronic components.

15. A table body that supports electronic components loaded on the upper surface; A heater coupled to the table body and for heating an electronic component loaded on the upper surface of the table body; comprising The table body has vacuum passages for transmitting vacuum pressure to electronic components loaded on the upper surface of the table body and cooling passages for cooling electronic components loaded on the upper surface of the table body formed therein. One end of the vacuum passage is positioned on the upper surface of the table body, and the other end of the vacuum passage is positioned on the side of the table body. Some of the vacuum passages have their other ends positioned higher than the cooling passage, and the remaining ends are positioned lower than the cooling passage. Test table for testing electronic components.

16. In Paragraph 15, The heater is positioned at a lower location than the cooling channel. Test table for testing electronic components.

17. In Paragraph 15, The heater is positioned at a lower location than the vacuum passages. Test table for testing electronic components.

18. In Paragraph 15, Further including an insulating plate disposed below the heater Test table for testing electronic components.

19. A transport shuttle having a transport table capable of transporting electronic components by moving while the electronic components are loaded; A first hand that loads electronic components to be tested onto the transport table in the first area by the operation of the above transport shuttle, or unloads electronic components that have completed testing and have arrived at the first area by being loaded onto the said transport table; A second hand that retrieves electronic components from a transport table moved from the first area to a second area separated from the first area by the operation of the above transport shuttle; Electronic components to be tested, which are released from the transport table by the second hand, are loaded onto a test table according to any one of claims 1 to 18; A moving mechanism that moves the above test table by the second hand between a loading space where electronic components are loaded on the test table and a test space containing a test board for electrically connecting the electronic components to a tester, and electrically connects or disconnects the terminals of the electronic components loaded on the test table and the test pins of the test board; A controller controlling the above transport shuttle, the above first hand, the above second hand, and the above moving mechanism; comprising Handler for testing electronic components.

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