Display module and manufacturing method therefor, and display device

Abstract

A display module and a manufacturing method therefor, and a display device. The display module comprises: a display panel (10), comprising a display area (100) and a bonding area (200), wherein the bonding area (200) is connected to one side of the display area (100) in a second direction, the bonding area (200) comprises a first flat area (11), a bending area (13), and a second flat area (12), and the second flat area (12) is located on a backlight side of the display area (100); and a flexible circuit board (20), at least comprising a bonding portion (41) and at least one extension portion which are connected to each other, wherein the bonding portion (41) is arranged on the side of the second flat area (12) distant from the display area (100), the bonding portion (41) is reversely bonded to the second flat area (12), the extension portion is located on at least one side of the second flat area (12) in a first direction, the extension portion is configured to be connected to an extension portion device, and the first direction intersects the second direction.

Description

A display module, its manufacturing method, and a display device.

[0001] This application claims priority to Chinese Patent Application No. 202510009745.2, filed on January 2, 2025, entitled "A display module and its preparation method, display device", the contents of which shall be construed as incorporated herein by reference. Technical Field

[0002] This disclosure relates to, but is not limited to, the field of display technology, and particularly to a display module and its manufacturing method, and a display device. Background Technology

[0003] Organic light-emitting diodes (OLEDs) and quantum dot light-emitting diodes (QLEDs) are active-matrix display devices with advantages such as self-illumination, wide viewing angle, high contrast, low power consumption, extremely high response speed, thinness, flexibility, and low cost. With the continuous development of display technology, flexible displays using OLEDs or QLEDs as light-emitting devices and controlled by thin-film transistors (TFTs) have become the mainstream products in the display field.

[0004] Flexible printed circuits (FPCs), also known as flexible circuit boards or flexographic circuit boards, are favored for their excellent characteristics such as light weight, thinness, and ability to be freely bent and folded. They can be used to realize the electrical connection of at least some components in electronic devices. Summary of the Invention

[0005] This application provides a display module, including:

[0006] The display panel includes a display area and a bonding area. The bonding area is connected to the display area on one side in a second direction. The bonding area includes a first flat area, a bent area, and a second flat area. The first flat area is connected to the display area. The bent area is connected to both the first flat area and the second flat area. The bent area is curved. The second flat area is located on the backlight side of the display area.

[0007] A flexible circuit board is located on the backlight side of the display area. The flexible circuit board includes at least a bonding portion and at least one extension portion that are interconnected. The bonding portion is disposed on the side of the second flat area away from the display area and is bonded to the second flat area in the opposite direction. The extension portion is located on at least one side of the second flat area in a first direction and is configured to be connected to an extension portion device. The first direction and the second direction intersect.

[0008] In an exemplary embodiment, the orthographic projection of the extension portion onto the plane where the display area is located does not overlap with the orthographic projection of the second flat area onto the plane where the display area is located.

[0009] In an exemplary embodiment, the thickness of the extension portion is less than the thickness of the binding portion.

[0010] In an exemplary embodiment, the extension portion includes a single conductive layer, or the extension portion includes a double conductive layer; the bonding portion includes m conductive layers, where m is a natural number greater than 2.

[0011] In an exemplary embodiment, the extension includes an extension device region and an edge region located on at least one side of the extension device region, the extension device region being configured to be connected to the extension device, and the thickness of the extension device region being less than the thickness of the edge region.

[0012] In an exemplary embodiment, the extended device region includes a single conductive layer, or the extended device region includes a double conductive layer; the edge region includes n conductive layers, where n is a natural number greater than 2.

[0013] In an exemplary embodiment, the at least one extension includes a first extension located on one side of the binding portion in the first direction; or, the at least one extension includes a first extension and a second extension, the first extension and the second extension being located on opposite sides of the binding portion in the first direction.

[0014] In an exemplary embodiment, the flexible circuit board further includes a connecting portion, one end of which is connected to the side of the extension portion near the binding portion, and the other end of which is connected to the side of the binding portion near the extension portion.

[0015] In an exemplary embodiment, a clearance groove is provided on the side of the second flat area near the extension portion, and at least a portion of the extension portion is located in the clearance groove.

[0016] In an exemplary embodiment, the backlight side of the display panel includes a complete component area, the complete component area being rectangular in shape, the complete component area being located on the side of the flexible circuit board away from the bending area, and the complete component area being configured to house complete components.

[0017] In an exemplary embodiment, the bonding portion includes a bonding terminal area, the bonding terminal area being strip-shaped extending along the first direction, the bonding terminal area being located on the edge region of the bonding portion away from the bending region, and the bonding portion being reverse-bonded to the second flat region through the bonding terminal area; or, the bonding portion includes a bonding terminal area and a bonding device area, the bonding terminal area being strip-shaped extending along the first direction, the bonding terminal area being located on the edge region of the bonding portion away from the bending region, the bonding portion being reverse-bonded to the second flat region through the bonding terminal area, and the bonding device area being disposed on the side of the bonding terminal area near the bending region, the bonding device area being configured to connect to a bonding device.

[0018] In an exemplary embodiment, the flexible circuit board further includes a strip portion, the strip portion being rectangular in shape extending along the second direction, the strip portion being disposed on the side of the second flat area away from the display area, and one end of the strip portion being connected to the side of the bonding portion near the bending area in the second direction.

[0019] In an exemplary embodiment, the thickness of the strip portion is less than the thickness of the binding portion; or, the thickness of the strip portion is approximately the same as the thickness of the binding portion.

[0020] This application also provides a display device, including the display module described above.

[0021] This application also provides a method for manufacturing a display module, including:

[0022] A display panel is formed, the display panel including a display area and a bonding area, the bonding area being connected to the display area on one side in a second direction, the bonding area including a first flat area, a bent area and a second flat area, the first flat area being connected to the display area, the bent area being connected to the first flat area and the second flat area respectively, the bent area being curved, and the second flat area being located on the backlight side of the display area;

[0023] A flexible circuit board is formed, the flexible circuit board being located on the backlight side of the display area, the flexible circuit board including at least a bonding portion and at least one extension portion connected to each other, the bonding portion being disposed on the side of the second flat area away from the display area, the bonding portion being bonded to the second flat area in the opposite direction; the extension portion being located on at least one side of the bonding portion in a first direction, the extension portion being configured to be connected to an extension portion device, the first direction and the second direction intersecting.

[0024] Other features and advantages of this application will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the application. Other advantages of this application can be realized and obtained by means of the solutions described in the description and the accompanying drawings.

[0025] Overview of the attached figures

[0026] The accompanying drawings are used to provide an understanding of the technical solutions of this application and constitute a part of the specification. They are used together with the embodiments of this application to explain the technical solutions of this application and do not constitute a limitation on the technical solutions of this application.

[0027] Figure 1 is a schematic diagram of the planar structure of the backlight side of a display module in a related technology;

[0028] Figure 2 is a schematic diagram of the planar structure of a display panel according to an embodiment of the present disclosure;

[0029] Figure 3a is a schematic diagram of the backlight side of a display module according to an embodiment of the present disclosure;

[0030] Figure 3b is a cross-sectional structural diagram of a display module according to an embodiment of the present disclosure;

[0031] Figure 4a is a schematic diagram of the backlight side of another display module according to an embodiment of the present disclosure;

[0032] Figure 4b is a cross-sectional structural diagram of another display module according to an embodiment of the present disclosure;

[0033] Figure 5 is a schematic diagram of the backlight side of another display module according to an embodiment of the present disclosure;

[0034] Figure 6a is a schematic diagram of the backlight side of another display module according to an embodiment of the present disclosure;

[0035] Figure 6b is a cross-sectional structural diagram of another display module according to an embodiment of the present disclosure;

[0036] Figure 7 is a schematic diagram of the backlight side of another display module according to an embodiment of the present disclosure.

[0037] Detailed Explanation

[0038] This application describes several embodiments, but these descriptions are exemplary and not restrictive, and it will be apparent to those skilled in the art that many more embodiments and implementations are possible within the scope of the embodiments described herein. Although many possible combinations of features are shown in the drawings and discussed in the detailed description, many other combinations of the disclosed features are also possible. Unless specifically limited, any feature or element of any embodiment may be used in combination with, or may replace, any feature or element of any other embodiment.

[0039] This application includes and contemplates combinations of features and elements known to those skilled in the art. The embodiments, features, and elements disclosed in this application can also be combined with any conventional features or elements to form unique inventive solutions. Any feature or element of any embodiment can also be combined with features or elements from other inventive solutions to form another unique inventive solution. Therefore, it should be understood that any feature shown and / or discussed in this application can be implemented individually or in any suitable combination. Therefore, the embodiments are not limited except by the limitations imposed by the appended claims and their equivalents. Furthermore, various modifications and changes can be made within the scope of the appended claims.

[0040] Furthermore, in describing representative embodiments, the specification may have presented methods and / or processes as a specific sequence of steps. However, the method or process should not be limited to the specific order of steps described herein, to the extent that it does not depend on such a specific order. As will be understood by those skilled in the art, other sequences of steps are also possible. Therefore, the specific order of steps set forth in the specification should not be construed as a limitation of the claims. Moreover, the claims concerning the method and / or process should not be limited to the steps performed in the written order, and those skilled in the art will readily understand that these orders can be varied and still remain within the spirit and scope of the embodiments of this application.

[0041] Figure 1 is a schematic diagram of the backlight side of a display module according to related technology. As shown in Figure 1, the display module of related technology includes a display panel 10' and a flexible circuit board 20'. The display panel 10' includes a display area 100' and a bonding area 200', with the bonding area 200' located on one side of the display area 100 in the second direction Y. The bonding area 200' includes a first flat area 11', a bending area 13', and a second flat area 12'. The first flat area 11' is connected to the display area 100' on one side of the second direction Y, and is connected to the bending area 13' on the other side of the second direction Y. One side of the bending area 13' is connected to the first flat area 11', and the other side of the bending area 13' is connected to the second flat area 12'. The bending area 13' is configured to bend the second flat area 12' to the backlight side of the display area 100'. The second flat area 12' is disposed on the backlight side of the display area 100'. The flexible circuit board 20' is disposed on the backlight side of the display area 100' and is forward-bonded to the second flat area 12'. The flexible circuit board 20' includes a bonding portion 41' and a strip portion 42'. The bonding portion 41' includes a bonding terminal area 41-1', a first bonding device area 41-2', and a second bonding device area 41-3'. The bonding terminal area 41-1' is configured to be bonded to the second flat area 12, the first bonding device area 41-2' is configured to be connected to a first bonding device, and the second bonding device area 41-3' is configured to be connected to a second bonding device.

[0042] In the display module of the related technology, the bonding part 41' of the flexible circuit board 20' includes a first bonding part device area 41-2' and a second bonding part device area 41-3', which results in a large area of ​​the flexible circuit board 20'. It needs to occupy the space of the backlight side of the display panel in the second direction Y, and cannot avoid components such as the battery compartment, thus limiting the volume of components such as the battery compartment.

[0043] This application provides a display module, including:

[0044] The display panel includes a display area and a bonding area. The bonding area is connected to the display area on one side in a second direction. The bonding area includes a first flat area, a bent area, and a second flat area. The first flat area is connected to the display area. The bent area is connected to both the first flat area and the second flat area. The bent area is curved. The second flat area is located on the backlight side of the display area.

[0045] A flexible circuit board is located on the backlight side of the display area. The flexible circuit board includes at least a bonding portion and at least one extension portion that are interconnected. The bonding portion is disposed on the side of the second flat area away from the display area and is bonded to the second flat area in the opposite direction. The extension portion is located on at least one side of the second flat area in a first direction and is configured to be connected to an extension portion device. The first direction and the second direction intersect.

[0046] In an exemplary embodiment, the orthographic projection of the extension portion onto the plane where the display area is located does not overlap with the orthographic projection of the second flat area onto the plane where the display area is located.

[0047] In an exemplary embodiment, the thickness of the extension portion is less than the thickness of the binding portion.

[0048] In an exemplary embodiment, the extension portion includes a single conductive layer, or the extension portion includes a double conductive layer; the bonding portion includes m conductive layers, where m is a natural number greater than 2.

[0049] In an exemplary embodiment, the extension includes an extension device region and an edge region located on at least one side of the extension device region, the extension device region being configured to be connected to the extension device, and the thickness of the extension device region being less than the thickness of the edge region.

[0050] In an exemplary embodiment, the extended device region includes a single conductive layer, or the extended device region includes a double conductive layer; the edge region includes n conductive layers, where n is a natural number greater than 2.

[0051] Figure 2 is a schematic diagram of the planar structure of a display panel according to an embodiment of the present disclosure. As shown in Figure 2, the display panel may include a display area 100, a binding area 200 located on one side of the display area 100 in the second direction Y, and a border area 300 located on other sides of the display area 100.

[0052] In an exemplary embodiment, the display area 100 may be a flat area, including multiple sub-pixels forming multiple pixel rows and multiple pixel columns, the multiple sub-pixels being configured to display an image, and the display area 100 may be referred to as the active area (AA).

[0053] In an exemplary embodiment, a plurality of sub-pixels arranged sequentially along a first direction X can be referred to as a pixel row, and a plurality of sub-pixels arranged sequentially along a second direction Y can be referred to as a pixel column. The plurality of pixel rows and the plurality of pixel columns constitute a pixel array arranged in an array. Wherein, the first direction X intersects the second direction Y, and for example, the first direction X and the second direction Y are perpendicular to each other.

[0054] In an exemplary embodiment, the shape of the sub-pixel can be rectangular, rhomboid, pentagonal, or hexagonal.

[0055] In an exemplary embodiment, the multiple sub-pixels of the display area 100 may include a first sub-pixel emitting a first color light, a second sub-pixel emitting a second color light, and a third and fourth sub-pixels emitting a third color light. The first sub-pixel may be a red sub-pixel (R) emitting red light, the second sub-pixel may be a blue sub-pixel (B) emitting blue light, and the third and fourth sub-pixels may be green sub-pixels (G) emitting green light. The light-emitting devices of the four sub-pixels may be arranged in a diamond shape to form an RGBG pixel arrangement. In other exemplary embodiments, the light-emitting devices of the four sub-pixels may be arranged horizontally side-by-side, vertically side-by-side, or in a square, etc., which are not limited herein.

[0056] In some other exemplary embodiments, the multiple sub-pixels of the display area 100 may include a first sub-pixel emitting a first color light, a second sub-pixel emitting a second color light, and a third sub-pixel emitting a third color light. The light-emitting devices of the three sub-pixels may be arranged in a horizontal, vertical, or triangular manner, etc., which is not limited herein.

[0057] In an exemplary embodiment, a subpixel may include a pixel driving circuit and a light-emitting device connected to the pixel driving circuit. The pixel driving circuit may be configured to output a corresponding current to the light-emitting device connected thereto, and the light-emitting device may be configured to emit light of a corresponding brightness in response to the current output by the pixel driving circuit connected thereto.

[0058] In an exemplary embodiment, the light-emitting device may include one of organic light-emitting diodes (OLEDs), micro light-emitting diodes (LEDs), and quantum dot light-emitting diodes (QLEDs).

[0059] In an exemplary embodiment, the bonding region 200 may include a lead-out area, a bending area, a driver chip area, and a bonding pin area sequentially arranged along a direction away from the display area 100. The lead-out area is connected to the display area 100 on one side of the second direction Y, and to the bending area on the other side of the second direction Y. The lead-out area includes at least data leads connected to the display area 100. The bending area is connected to the side of the lead-out area away from the display area on one side of the second direction Y, and to the driver chip area on the other side of the second direction Y. The bending area is configured to bend the driver chip area and the bonding pin area toward the backlight side of the display area 100. The driver chip area is connected to the side of the bending area away from the display area on one side of the second direction Y, and to the bonding pin area on the other side of the second direction Y. The driver chip area may include an integrated circuit (IC) configured to connect to multiple data leads. The bonding pin area is connected to the side of the driver chip area away from the display area 100 on one side of the second direction Y. The bonding pin area may include bonding pads, which are configured to bond to an external flexible printed circuit (FPC). The backlight side refers to the side away from the light emission direction of the display area 100.

[0060] Figure 3a is a schematic diagram of the backlight side of a display module according to an embodiment of the present disclosure. In an exemplary embodiment, as shown in Figure 3a, the display module includes a display panel 10 and a flexible circuit board 20. The flexible circuit board 20 is located on the backlight side of the display panel 10, and is reverse-bonded to the display panel 10. Reverse bonding means that after the flexible circuit board 20 is bonded to the bonding pin area of ​​the display panel 10, the main body of the flexible circuit board 20 is located on the side of the bonding pin area closer to the bending area of ​​the display panel 10.

[0061] In an exemplary embodiment, the display panel 10 includes a display area 100 and a bonding area 200, the bonding area 200 being connected to the display area 100 on one side of the second direction Y. The bonding area 200 includes a first flat area 11, a bending area 13, and a second flat area 12. The first flat area 11 is connected to the display area 100 on one side of the second direction Y, and is connected to the bending area 13 on the other side of the second direction Y. The first flat area 11 includes at least a data lead, which is connected to the display area 100. One side of the bending area 13 is connected to the first flat area 11, and the other side of the bending area 13 is connected to the second flat area 12. The bending area 13 is configured to bend the second flat area 12 to the backlight side of the display area 100. The second flat area 12 is disposed on the backlight side of the display area 100, is connected to the bending area 13 on one side of the second direction Y, and extends along a direction away from the bending area 13 on the other side of the second direction Y. The second flat region 12 includes a driver chip region for setting up integrated circuits and a bonding pin region for connecting to the flexible circuit board 20. The bonding pin region is located on the edge of the second flat region 12 away from the bending region 13, and the driver chip region is located on the side of the bonding pin region closer to the bending region 13.

[0062] In an exemplary embodiment, the flexible circuit board 20 includes a bonding portion 41, a strip portion 42, and a first extension portion 43-1. The bonding portion 41 is rectangular in shape. In a direction perpendicular to the display area 100, the bonding portion 41 is disposed on the side of the second flat area 12 away from the display area 100 and contacts the surface of the second flat area 12 away from the display area 100. The orthographic projection of the bonding portion 41 on the plane of the display area 100 overlaps at least partially with the orthographic projection of the second flat area 12 on the plane of the display area 100. In a direction parallel to the display area 100, the bonding portion 41 is bonded to the bonding pin area of ​​the second flat area 12 on one side of the second direction Y, and the bonding portion 41 extends along the direction close to the bending area 13 on the other side of the second direction Y.

[0063] In an exemplary embodiment, the bonding portion 41 includes a bonding terminal area 41-1 and a bonding device area 41-2. The bonding terminal area 41-1 is strip-shaped extending along a first direction X. The bonding terminal area 41-1 includes a plurality of terminals arranged along the first direction X, and the plurality of terminals are correspondingly connected to a plurality of pins in the bonding pin area of ​​the second flat area 12. In a direction perpendicular to the display area 100, the bonding terminal area 41-1 is disposed on the side surface of the bonding portion 41 near the second flat area 12. In a direction parallel to the display area 100, the bonding terminal area 41-1 is located on the edge region of the bonding portion 41 away from the bending area 13, and the bonding terminal area 41-1 is bonded to the bonding pin area of ​​the second flat area 12. The bonding device area 41-2 is rectangular in shape, and in a direction perpendicular to the display area 100, the bonding device area 41-2 is disposed on the side surface of the bonding portion 41 away from the second flat area 12. In a direction parallel to the display area 100, the bonding part device area 41-2 is disposed on the side of the bonding terminal area 41-1 near the bending area 13. The bonding part device area 41-2 may be located in the middle of the bonding part 41 in the second direction Y. The bonding part device area 41-2 is configured to be connected to the bonding part device.

[0064] In some embodiments, the bonding portion includes a bonding terminal area, but does not include a bonding device area, meaning that no bonding device is disposed on the bonding portion. Further details are omitted here.

[0065] In an exemplary embodiment, the bonding device may be a connector for controlling the display effect within the display area 100. It may also be at least one of a touch integrated circuit (T-IC), flash memory, resistor, and capacitor.

[0066] In an exemplary embodiment, the strip portion 42 is shaped as a rectangular strip extending along the second direction Y. In a direction perpendicular to the display area 100, the strip portion 42 is disposed on the side of the second flat area 12 away from the display area 100 and contacts the surface of the second flat area 12 away from the display area 100. At least a portion of the orthographic projection of the strip portion 42 onto the plane of the display area 100 overlaps with the orthographic projection of the second flat area 12 onto the plane of the display area 100. In a direction parallel to the display area 100, one end of the strip portion 42 is connected to the side of the binding portion 41 near the bending area 13 in the second direction Y, and the other end of the strip portion 42 extends along the direction near the bending area 13. The dimension of the strip portion 42 in the first direction X is smaller than the dimension of the binding portion 41 in the first direction X.

[0067] In an exemplary embodiment, the first extension portion 43-1 is rectangular in shape. In a direction perpendicular to the display area 100, the first extension portion 43-1 is disposed on the backlight side of the display area 100, and the orthographic projection of the first extension portion 43-1 onto the plane of the display area 100 does not overlap with the orthographic projection of the second flat area 12 onto the plane of the display area 100. In a direction parallel to the display area 100, the first extension portion 43-1 is located on one side of the binding portion 41 and the second flat area 12 in the first direction X. The first extension portion 43-1 is connected to the side of the binding portion 41 closest to the first extension portion 43-1 on the side of the first direction X, and the first extension portion 43-1 extends along a direction away from the binding portion 41 on the other side of the first direction X.

[0068] In an exemplary embodiment, the first extension portion 43-1 includes a first extension portion binding area 43-1-1, which is rectangular in shape and located on one side of the binding portion 41 and the second flat area 12 in the first direction X. The first extension portion binding area 43-1-1 is configured to be connected to the first extension portion device.

[0069] In an exemplary embodiment, the first extension device may be a connector for controlling the display effect within the display area 100. It may also be at least one of a touch integrated circuit (T-IC), flash memory, resistor, and capacitor.

[0070] In an exemplary embodiment, a first clearance groove 61 is provided on the side of the second flat region 12 near the first extension portion 43-1. The first clearance groove 61 is in the shape of a mirror L, and the portion of the first extension portion 43-1 near the second flat region 12 is located in the first clearance groove 61.

[0071] This embodiment of the display module shows that the first extension portion 43-1 extends into the first clearance groove 61, avoiding the first extension portion 43-1 from overlapping with the second flat area 12, and reducing the space occupied by the flexible circuit board 20 in the direction (third direction Z) of the display module perpendicular to the plane where the display area 100 is located.

[0072] In an exemplary embodiment, the flexible circuit board 20 further includes a first connecting portion 44-1, which is strip-shaped and extends along a first direction X. One end of the first connecting portion 44-1 is connected to the side of the first extension portion 43-1 near the binding portion 41, and the other end of the first connecting portion 44-1 is connected to the side of the binding portion 41 near the first extension portion 43-1.

[0073] In an exemplary embodiment, the backlight side of the display panel 10 includes a component area 53. The component area 53 is rectangular in shape and is located on the side of the flexible circuit board 20 away from the bending area 13. The orthographic projection of the component area 53 on the plane of the display area 100 does not overlap with the orthographic projection of the flexible circuit board 20 and the second flat area 12 on the plane of the display area 100. The component area 53 is configured to house components (such as a battery compartment).

[0074] The present invention discloses a display module by reverse bonding the flexible circuit board 20 to the display panel 10, thereby reducing the space occupied by the flexible circuit board 20 in the display module in the second direction Y, making more space available for the whole machine component area 53, and thus increasing the space of the whole machine component area 53.

[0075] This embodiment of the display module shows that by placing the first extension portion 43-1 on one side of the second flat area 12 in the first direction X, the space occupied by the flexible circuit board 20 in the display module in the second direction Y is reduced, and more space is made up for the whole component area 53, thereby increasing the space of the whole component area 53.

[0076] In this embodiment of the display module, the orthographic projection of the first extension portion 43-1 on the plane where the display area 100 is located does not overlap with the orthographic projection of the second flat area 12 on the plane where the display area 100 is located, thereby reducing the space occupied by the flexible circuit board 20 in the display module in the direction perpendicular to the plane where the display area 100 is located (third direction Z).

[0077] In an exemplary embodiment, the thickness of the first extension portion 43-1 is less than the thickness of the binding portion 41, thereby reducing the space occupied by the first extension portion 43-1 in the direction (third direction Z) of the display module perpendicular to the plane where the display area 100 is located.

[0078] In an exemplary embodiment, the first extension portion 43-1 can be a single-layer board structure or a double-layer board structure. The single-layer board structure includes a substrate and a conductive layer disposed on the substrate, the conductive layer including a plurality of leads connected to the bonding portion 41. The double-layer board structure includes a substrate, a first conductive layer disposed on one side of the substrate, and a second conductive layer disposed on the other side of the substrate, the first conductive layer including a plurality of first leads connected to the bonding portion 41, and the second conductive layer including a plurality of second leads connected to the bonding portion 41.

[0079] In an exemplary embodiment, the bonding portion 41 can be a multilayer board structure. The bonding portion 41 includes m conductive layers, where m is a natural number greater than 2. For example, the bonding portion 41 can be a four-layer board structure, which includes a substrate, a first conductive layer disposed on one side of the substrate, a second conductive layer disposed on the side of the first conductive layer away from the substrate, a third conductive layer disposed on the other side of the substrate, and a fourth conductive layer disposed on the side of the third conductive layer away from the substrate; or, the bonding portion 41 can be a six-layer board structure, which includes a substrate, a first conductive layer disposed on one side of the substrate, a second conductive layer disposed on the side of the first conductive layer away from the substrate, a third conductive layer disposed on the side of the second conductive layer away from the substrate, a fourth conductive layer disposed on the other side of the substrate, a fifth conductive layer disposed on the side of the fourth conductive layer away from the substrate, and a sixth conductive layer disposed on the side of the fifth conductive layer away from the substrate.

[0080] In some embodiments, the first extension portion further includes a first edge region located on at least one side of the first extension portion bonding area, for example, the first edge region is disposed around the perimeter of the first extension portion bonding area. The thickness of the first extension portion bonding area is less than the thickness of the first edge region, thereby reducing the space occupied by the first extension portion bonding area in the direction perpendicular to the plane of the display area (third direction Z). The first extension portion bonding area can be a single-layer board structure or a double-layer board structure. The first edge region can be a multi-layer board structure, the first edge region including n conductive layers, where n is a natural number greater than 2, and each conductive layer includes multiple leads connected to the bonding portion 41. For example, the first edge region can be a four-layer board structure or a six-layer board structure.

[0081] Figure 3b is a cross-sectional view of a display module according to an embodiment of the present disclosure, wherein Figure 3b can be a cross-sectional view of Figure 3a along the A-A' direction. In an exemplary embodiment, as shown in Figure 3b, the display module of the present disclosure includes a display panel 10, a flexible circuit board 20, and a cover plate 30. The flexible circuit board 20 is located on the backlight side of the display panel 10, and the bonding portion 41 of the flexible circuit board 20 is disposed on the surface of the second flat area 12 of the display panel 10 away from the display area 100, and is bonded in the opposite direction to the bonding pin area of ​​the second flat area 12. The cover plate 30 is located on the light-emitting side of the display panel 10, and the cover plate 20 can be a transparent substrate (e.g., a glass substrate).

[0082] In an exemplary embodiment, an integrated circuit 52 is disposed on the side of the second flat area 12 of the display panel 10 away from the display area 100. A receiving groove 20-1 is disposed on the surface of the flexible circuit board 20 near the second flat area 12. The orthographic projection of the receiving groove 20-1 on the plane where the display area 100 is located covers the orthographic projection of the integrated circuit 52 on the plane where the display area 100 is located. Moreover, the size of the receiving groove 20-1 in the direction perpendicular to the plane where the display area 100 is located (third direction Z) is greater than the size of the integrated circuit 52 in the direction perpendicular to the plane where the display area 100 is located (third direction Z), so that the receiving groove 20-1 can completely accommodate the integrated circuit 52 and avoid the integrated circuit 52 interfering with the bonding between the flexible circuit board 20 and the second flat area 12.

[0083] In an exemplary embodiment, a bonding component 51 is provided on the side of the flexible circuit board 20 away from the second flat area 12, and the orthographic projection of the bonding component 51 on the plane where the display area 100 is located overlaps at least partially with the orthographic projection of the integrated circuit 52 on the plane where the display area 100 is located.

[0084] In an exemplary embodiment, the bonding terminal area 41-1 of the flexible circuit board 20 is located on the side of the bonding part 51 away from the bending area 13, and the bonding terminal area 41-1 is bonded to the bonding terminal area of ​​the second flat area 12.

[0085] In an exemplary embodiment, the component area 53 of the display panel 10 is located on the side of the flexible circuit board 20 away from the bending area 13. The orthographic projection of the component area 53 on the plane where the display area 100 is located does not overlap with the orthographic projection of the flexible circuit board 20 and the second flat area 12 on the plane where the display area 100 is located. The component area 53 is configured to house components (such as battery compartments).

[0086] In an exemplary embodiment, the display module of this disclosure further includes a spacer layer 40 and an adhesive layer 50, both of which are stacked between the backlight side of the display area 100 and the second flat area 12. The spacer layer 40 is located on the side of the adhesive layer 50 closest to the backlight side of the display area 100. The surface of the spacer layer 40 in a direction perpendicular to the plane of the display area 100 (third direction Z) is connected to the backlight side of the display area 100, and the other surface of the spacer layer 40 in the same direction (third direction Z) is connected to the adhesive layer 50. The adhesive layer 50 is located on the side of the spacer layer 40 furthest from the backlight side of the display area 100. The surface of the adhesive layer 50 in a direction perpendicular to the plane of the display area 100 (third direction Z) is connected to the spacer layer 40, and the other surface of the spacer layer 40 in the same direction (third direction Z) is connected to the second flat area 12.

[0087] In an exemplary embodiment, the display module of this disclosure further includes a protective layer 60, which is disposed on the side surface of the bending area 13 away from the display area 100 and is in contact with the side surface of the bending area 13 away from the display area 100. The protective layer 60 is configured to protect the bending area 13 and prevent damage to the bending area 13.

[0088] Figure 4a is a schematic diagram of the backlight side of another display module according to an embodiment of this disclosure. As shown in Figure 4a, the main structure of the display module in this embodiment is basically the same as that in the embodiment shown in Figure 3a. The difference is that the structure of the flexible circuit board 20 in this embodiment is different, and the flexible circuit board 20 is positively bonded to the second flat area 12 of the display panel 10. Here, positive bonding means that after the flexible circuit board 20 is bonded to the bonding pin area of ​​the display panel 10, the main body of the flexible circuit board 20 is located on the side of the bonding pin area away from the bending area 13 of the display panel 10.

[0089] In an exemplary embodiment, the flexible circuit board 20 includes a bonding portion 41, a strip portion 42, and a first extension portion 43-1. The bonding portion 41 is rectangular in shape. In a direction perpendicular to the display area 100, the bonding portion 41 is disposed on the backlight side of the display area 100. In a direction parallel to the display area 100, the bonding portion 41 is bonded to the bonding pin area of ​​the second flat area 12 on one side of the second direction Y, and the bonding portion 41 extends along a direction away from the bending area 13 on the other side of the second direction Y.

[0090] In an exemplary embodiment, the bonding portion 41 includes a bonding terminal area 41-1 and a bonding device area 41-2. The bonding terminal area 41-1 is strip-shaped extending along a first direction X. The bonding terminal area 41-1 is located on the edge region of the bonding portion 41 near the bending region 13, and is bonded to the bonding pin area of ​​the second flat region 12. The bonding device area 41-2 is rectangular in shape and is located on the side of the bonding terminal area 41-1 away from the bending region 13. The bonding device area 41-2 is configured to connect to a bonding device.

[0091] In some embodiments, the bonding portion includes a bonding terminal area, but does not include a bonding device area, meaning that no bonding device is disposed on the bonding portion. Further details are omitted here.

[0092] In an exemplary embodiment, the strip portion 42 is shaped as a rectangular strip extending along the second direction Y. The orthographic projection of the strip portion 42 on the plane where the display area 100 is located does not overlap with the orthographic projection of the second flat area 12 on the plane where the display area 100 is located. One end of the strip portion 42 in the second direction Y is connected to the side of the binding portion 41 away from the bending area 13, and the other end of the strip portion 42 in the second direction Y extends in a direction away from the bending area 13. The dimension of the strip portion 42 in the first direction X is smaller than the dimension of the binding portion 41 in the first direction X.

[0093] In an exemplary embodiment, the first extension portion 43-1 is rectangular in shape. The orthographic projection of the first extension portion 43-1 on the plane where the display area 100 is located does not overlap with the orthographic projection of the second flat area 12 on the plane where the display area 100 is located. The first extension portion 43-1 is located on one side of the binding portion 41 and the second flat area 12 in the first direction X. The first extension portion 43-1 is connected to the side of the binding portion 41 near the first extension portion 43-1 on one side of the first direction X. The first extension portion 43-1 extends along the direction away from the binding portion 41 on the other side of the first direction X.

[0094] In an exemplary embodiment, the first extension portion 43-1 includes a first extension portion binding area 43-1-1, which is rectangular in shape and located on one side of the second flat area 12 in the first direction X. The first extension portion binding area 43-1-1 is configured to be connected to the first extension portion device.

[0095] In an exemplary embodiment, the flexible circuit board 20 further includes a first connecting portion 44-1, which is strip-shaped and extends along a first direction X. One end of the first connecting portion 44-1 is connected to the side of the first extension portion 43-1 near the binding portion 41, and the other end of the first connecting portion 44-1 is connected to the side of the binding portion 41 near the first extension portion 43-1.

[0096] In an exemplary embodiment, an integrated circuit 52 is disposed on the side of the second flat area 12 of the display panel 10 away from the display area 100. The orthographic projection of the integrated circuit 52 on the plane where the display area 100 is located does not overlap with the orthographic projection of the bonding part device area 41-2 on the plane where the display area 100 is located.

[0097] This embodiment of the display module shows that by placing the first extension portion 43-1 on one side of the second flat area 12 in the first direction X, the space occupied by the flexible circuit board 20 in the display module in the second direction Y is reduced, and more space is made up for the whole component area 53, thereby increasing the space of the whole component area 53.

[0098] Figure 4b is a cross-sectional view of another display module according to an embodiment of the present disclosure, wherein Figure 4b can be a cross-sectional view of Figure 4a along the B-B' direction. In an exemplary embodiment, as shown in Figure 4b, the display module of the present disclosure includes a display panel 10, a flexible circuit board 20, and a cover plate 30. The flexible circuit board 20 is located on the backlight side of the display panel 10, and the bonding portion 41 of the flexible circuit board 20 is disposed on the surface of the second flat area 12 of the display panel 10 on the side away from the display area 100, and is positively bonded to the bonding pin area of ​​the second flat area 12. The cover plate 30 is located on the light-emitting side of the display panel 10, and the cover plate 20 can be a transparent substrate (e.g., a glass substrate).

[0099] In an exemplary embodiment, an integrated circuit 52 is disposed on the side of the second flat area 12 of the display panel 10 away from the display area 100.

[0100] In an exemplary embodiment, at least a portion of the bonding terminal area 41-1 of the bonding portion 41 of the flexible circuit board 20 is disposed on the side of the second flat area 12 away from the display area, and is bonded to the bonding pin area of ​​the second flat area 12. A bonding device 51 is disposed on the bonding device area of ​​the bonding portion 41. The bonding device 51 is disposed on the side of the bonding terminal area 41-1 away from the bending area 13. The orthographic projection of the bonding device 51 on the plane where the display area 100 is located does not overlap with the orthographic projection of the integrated circuit 52 on the plane where the display area 100 is located.

[0101] In an exemplary embodiment, the bonding portion 41 can be a multilayer board structure. The bonding portion 41 includes m conductive layers, where m is a natural number greater than 2. The conductive layer of the bonding portion 41 near the display area 100 extends to the side of the second flat area 12 away from the display area, serving as a bonding terminal area 41-1, and is bonded to the bonding pin area of ​​the second flat area 12.

[0102] Figure 5 is a schematic diagram of the backlight side of another display module according to an embodiment of this disclosure. As shown in Figure 5, the main structure of the display module in this embodiment is basically the same as that in the embodiment shown in Figure 3a. The difference is that the structure of the flexible circuit board 20 in this embodiment is different. The bonding portion 41 of the flexible circuit board 20 includes a bonding terminal area 41-1, and the bonding portion 41 does not include a bonding device area, that is, no bonding device is provided on the bonding portion.

[0103] In an exemplary embodiment, the flexible circuit board 20 further includes a second extension portion 43-2. ​​The second extension portion 43-2 is rectangular in shape. In the direction perpendicular to the display area 100, the second extension portion 43-2 is disposed on the backlight side of the display area 100. The orthographic projection of the second extension portion 43-2 on the plane of the display area 100 does not overlap with the orthographic projection of the second flat area 12 on the plane of the display area 100. In the direction parallel to the display area 100, the second extension portion 43-2 is located on the side of the bonding portion 41 and the second flat area 12 away from the first extension portion 43-1. That is, the first extension portion 43-1 and the second extension portion 43-2 are respectively located on opposite sides of the bonding portion 41 and the second flat area 12 in the first direction X. The side of the second extension portion 43-2 near the bonding portion 41 is connected to the side of the bonding portion 41 near the second extension portion 43-2.

[0104] This embodiment of the display module shows that by placing the first extension portion 43-1 and the second extension portion 43-2 on opposite sides of the bonding portion 41 and the second flat area 12 in the first direction X, the space occupied by the flexible circuit board 20 in the display module in the second direction Y is reduced, and more space is made up for the whole component area 53, thereby increasing the space of the whole component area 53.

[0105] In this embodiment of the display module, the orthographic projections of the first extension portion 43-1 and the second extension portion 43-2 on the plane where the display area 100 is located do not overlap with the orthographic projection of the second flat area 12 on the plane where the display area 100 is located, thereby reducing the space occupied by the flexible circuit board 20 in the display module in the direction perpendicular to the plane where the display area 100 is located (third direction Z).

[0106] In an exemplary embodiment, the first extension portion 43-1 includes a first extension portion bonding area 43-1-1 and a first edge region 43-1-2. The first extension portion bonding area 43-1-1 is rectangular in shape and is located on one side of the bonding portion 41 and the second flat area 12 in the first direction X. The first extension portion bonding area 43-1-1 is configured to connect with the first extension portion device. The first edge region 43-1-2 is located on at least one side of the first extension portion bonding area 43-1-1. For example, the first edge region 43-1-2 is rectangular and is disposed around the first extension portion bonding area 43-1-1.

[0107] In an exemplary embodiment, the thickness of the first extension binding area 43-1-1 is less than the thickness of the first edge area 43-1-2, and the thickness of the first extension binding area 43-1-1 is less than the thickness of the binding part 41, thereby reducing the space occupied by the first extension binding area 43-1-1 in the direction (third direction Z) of the display module perpendicular to the plane where the display area 100 is located.

[0108] In an exemplary embodiment, the first extension bonding area 43-1-1 can be a single-layer board structure or a double-layer board structure. The single-layer board structure includes a substrate and a conductive layer disposed on the substrate, the conductive layer including a plurality of leads connected to the bonding portion 41. The double-layer board structure includes a substrate, a first conductive layer disposed on one side of the substrate, and a second conductive layer disposed on the other side of the substrate, the first conductive layer including a plurality of first leads connected to the bonding portion 41, and the second conductive layer including a plurality of second leads connected to the bonding portion 41.

[0109] In an exemplary embodiment, the bonding portion 41 can be a multilayer board structure. The bonding portion 41 can include m conductive layers, where m is a natural number greater than 2. For example, the bonding portion 41 can be a four-layer board structure, which includes a substrate, a first conductive layer disposed on one side of the substrate, a second conductive layer disposed on the side of the first conductive layer away from the substrate, a third conductive layer disposed on the other side of the substrate, and a fourth conductive layer disposed on the side of the third conductive layer away from the substrate; or, the bonding portion 41 can be a six-layer board structure, which includes a substrate, a first conductive layer disposed on one side of the substrate, a second conductive layer disposed on the side of the first conductive layer away from the substrate, a third conductive layer disposed on the side of the second conductive layer away from the substrate, a fourth conductive layer disposed on the other side of the substrate, a fifth conductive layer disposed on the side of the fourth conductive layer away from the substrate, and a sixth conductive layer disposed on the side of the fifth conductive layer away from the substrate.

[0110] In an exemplary embodiment, the thickness of the first edge region 43-1-2 can be approximately the same as the thickness of the bonding portion 41. The first edge region 43-1-2 can be a multilayer board structure. The first edge region 43-1-2 can include n1 conductive layers, where n1 is a natural number greater than 2. For example, the first edge region 43-1-2 can be a four-layer board structure, which includes a substrate, a first conductive layer disposed on one side of the substrate, a second conductive layer disposed on the side of the first conductive layer away from the substrate, a third conductive layer disposed on the other side of the substrate, and a fourth conductive layer disposed on the side of the third conductive layer away from the substrate; or, the first edge region 43-1-2 can be a six-layer board structure, which includes a substrate, a first conductive layer disposed on one side of the substrate, a second conductive layer disposed on the side of the first conductive layer away from the substrate, a third conductive layer disposed on the side of the second conductive layer away from the substrate, a fourth conductive layer disposed on the other side of the substrate, a fifth conductive layer disposed on the side of the fourth conductive layer away from the substrate, and a sixth conductive layer disposed on the side of the fifth conductive layer away from the substrate.

[0111] In some embodiments, the thickness of the first extension binding region may be approximately the same as the thickness of the first edge region, and both the thickness of the first extension binding region and the thickness of the first edge region are less than the thickness of the binding portion. Both the first extension binding region and the first edge region may be a single-layer plate structure or a double-layer plate structure.

[0112] In an exemplary embodiment, a first clearance groove 61 is provided on the side of the second flat region 12 near the first extension portion 43-1. The first clearance groove 61 is in the shape of a mirror L, and the portion of the first extension portion 43-1 near the second flat region 12 is located in the first clearance groove 61.

[0113] This embodiment of the display module shows that the first extension portion 43-1 extends into the first clearance groove 61, avoiding the first extension portion 43-1 from overlapping with the second flat area 12, and reducing the space occupied by the flexible circuit board 20 in the direction (third direction Z) of the display module perpendicular to the plane where the display area 100 is located.

[0114] In an exemplary embodiment, the flexible circuit board 20 further includes a first connecting portion 44-1, which is strip-shaped and extends along a first direction X. One end of the first connecting portion 44-1 is connected to the side of the second extension portion 43-2 near the binding portion 41, and the other end of the first connecting portion 44-1 is connected to the side of the binding portion 41 near the second extension portion 43-2.

[0115] In an exemplary embodiment, the second extension portion 43-2 includes a second extension portion bonding area 43-2-1 and a second edge region 43-2-2. The second extension portion bonding area 43-2-1 is rectangular in shape and is located on the side of the bonding portion 41 and the second flat area 12 away from the first extension portion bonding area 43-1-1. The second extension portion bonding area 43-2-1 is configured to connect with the second extension portion device. The second edge region 43-2-2 is located on at least one side of the second extension portion bonding area 43-2-1. For example, the second edge region 43-2-2 is rectangular and is disposed around the second extension portion bonding area 43-2-1.

[0116] In an exemplary embodiment, the thickness of the second extension binding area 43-2-1 is less than the thickness of the second edge area 43-2-2, and the thickness of the second extension binding area 43-2-1 is less than the thickness of the binding part 41, thereby reducing the space occupied by the second extension binding area 43-2-1 in the direction (third direction Z) of the display module perpendicular to the plane where the display area 100 is located.

[0117] In an exemplary embodiment, the second extension bonding area 43-2-1 can be a single-layer board structure or a double-layer board structure. The single-layer board structure includes a substrate and a conductive layer disposed on the substrate, the conductive layer including a plurality of leads connected to the bonding portion 41. The double-layer board structure includes a substrate, a first conductive layer disposed on one side of the substrate, and a second conductive layer disposed on the other side of the substrate, the first conductive layer including a plurality of first leads connected to the bonding portion 41, and the second conductive layer including a plurality of second leads connected to the bonding portion 41.

[0118] In an exemplary embodiment, the thickness of the second edge region 43-2-2 can be approximately the same as the thickness of the bonding portion 41. The second edge region 43-2-2 can be a multilayer board structure. The second edge region 43-2-2 can include n2 conductive layers, where n2 is a natural number greater than 2. For example, the second edge region 43-2-2 can be a four-layer board structure, which includes a substrate, a first conductive layer disposed on one side of the substrate, a second conductive layer disposed on the side of the first conductive layer away from the substrate, a third conductive layer disposed on the other side of the substrate, and a fourth conductive layer disposed on the side of the third conductive layer away from the substrate; or, the second edge region 43-2-2 can be a six-layer board structure, which includes a substrate, a first conductive layer disposed on one side of the substrate, a second conductive layer disposed on the side of the first conductive layer away from the substrate, a third conductive layer disposed on the side of the second conductive layer away from the substrate, a fourth conductive layer disposed on the other side of the substrate, a fifth conductive layer disposed on the side of the fourth conductive layer away from the substrate, and a sixth conductive layer disposed on the side of the fifth conductive layer away from the substrate.

[0119] In some embodiments, the thickness of the second extension binding region may be approximately the same as the thickness of the second edge region, and both the thickness of the second extension binding region and the thickness of the second edge region are less than the thickness of the binding portion. Both the second extension binding region and the second edge region may be a single-layer plate structure or a double-layer plate structure.

[0120] In an exemplary embodiment, a second clearance groove 62 is provided on the side of the second flat region 12 near the second extension portion 43-2. ​​The second clearance groove 62 is L-shaped, and the portion of the second extension portion 43-2 near the second flat region 12 is located in the second clearance groove 62.

[0121] This embodiment of the display module shows that the second extension portion 43-2 extends into the second clearance groove 62, avoiding the second extension portion 43-2 from overlapping with the second flat area 12, and reducing the space occupied by the flexible circuit board 20 in the direction (third direction Z) of the display module perpendicular to the plane where the display area 100 is located.

[0122] In an exemplary embodiment, the flexible circuit board 20 further includes a second connecting portion 44-2, which is strip-shaped and extends along a first direction X. One end of the second connecting portion 44-2 is connected to the side of the second extension portion 43-2 near the binding portion 41, and the other end of the second connecting portion 44-2 is connected to the side of the binding portion 41 near the second extension portion 43-2.

[0123] Figure 6a is a schematic diagram of the backlight side of another display module according to an embodiment of the present disclosure. As shown in Figure 6a, the main structure of the display module in this embodiment is basically the same as that in the embodiment shown in Figure 5. The difference is that the structure of the flexible circuit board 20 of the display module in this embodiment is different, and the flexible circuit board 20 is positively bonded to the second flat area 12 of the display panel 10.

[0124] In an exemplary embodiment, the bonding portion 41 is disposed on the backlight side of the display area 100 in a direction perpendicular to the display area 100. In a direction parallel to the display area 100, the bonding portion 41 is bonded to the bonding pin area of ​​the second flat area 12 on one side of the second direction Y, and the bonding portion 41 extends along a direction away from the bending area 13 on the other side of the second direction Y.

[0125] In an exemplary embodiment, the bonding portion 41 includes a bonding terminal area 41-1, which is strip-shaped and extends along the first direction X. The bonding terminal area 41-1 is located on the edge region of the bonding portion 41 near the bending region 13, and is bonded to the bonding pin area of ​​the second flat region 12.

[0126] In an exemplary embodiment, the strip portion 42 is shaped as a rectangular strip extending along the second direction Y. The orthographic projection of the strip portion 42 on the plane where the display area 100 is located does not overlap with the orthographic projection of the second flat area 12 on the plane where the display area 100 is located. One end of the strip portion 42 in the second direction Y is connected to the side of the binding portion 41 away from the bending area 13, and the other end of the strip portion 42 in the second direction Y extends along the direction away from the bending area 13.

[0127] In an exemplary embodiment, the flexible circuit board 20 includes a first connecting portion 44-1 and a second connecting portion 44-2. Both the first connecting portion 44-1 and the second connecting portion 44-2 are L-shaped. One end of the first connecting portion 44-1 is connected to the first extension portion 43-1 on one side of the second direction Y, and the other end of the first connecting portion 44-1 is connected to the binding portion 41 on one side of the first direction X. One end of the second connecting portion 44-2 is connected to the second extension portion 43-2 on one side of the second direction Y, and the other end of the second connecting portion 44-2 is connected to the binding portion 41 on the other side of the first direction X.

[0128] In an exemplary embodiment, a first clearance groove 61 is provided on the side of the second flat region 12 near the first extension portion 43-1. The first clearance groove 61 is in the shape of a mirror C, and the portion of the first extension portion 43-1 near the second flat region 12 is located in the first clearance groove 61.

[0129] In an exemplary embodiment, a second clearance groove 62 is provided on the side of the second flat area 12 near the second extension portion 43-2. ​​The second clearance groove 62 is C-shaped, and the portion of the second extension portion 43-2 near the second flat area 12 is located in the second clearance groove 62.

[0130] Figure 6b is a cross-sectional view of another display module according to an embodiment of the present disclosure, wherein Figure 6b can be a cross-sectional view of Figure 6a along the C-C' direction. In an exemplary embodiment, as shown in Figure 6b, the display module of the present disclosure includes a display panel 10, a flexible circuit board 20, and a cover plate 30. The flexible circuit board 20 is located on the backlight side of the display panel 10, and the bonding portion 41 of the flexible circuit board 20 is disposed on the surface of the second flat area 12 of the display panel 10 away from the display area 100, and is positively bonded to the bonding pin area of ​​the second flat area 12. The cover plate 30 is located on the light-emitting side of the display panel 10, and the cover plate 20 can be a transparent substrate (e.g., a glass substrate).

[0131] In an exemplary embodiment, at least a portion of the bonding terminal area 41-1 of the bonding portion 41 of the flexible circuit board 20 is disposed on the side of the second flat area 12 away from the display area, and is bonded to the bonding pin area of ​​the second flat area 12.

[0132] In an exemplary embodiment, the bonding portion 41 can be a multilayer board structure. The bonding portion 41 includes m conductive layers, where m is a natural number greater than 2. The conductive layer of the bonding portion 41 on the side away from the display area 100 extends to the side of the second flat area 12 away from the display area, serving as a bonding terminal area 41-1, and is bonded to the bonding pin area of ​​the second flat area 12.

[0133] The present invention discloses a display module by using the conductive layer on the side of the bonding portion 41 away from the display area 100 as the bonding terminal area 41-1, thereby reducing the distance L between the bonding portion 41 and the second flat area 12 in the second direction Y, and reducing the space occupied by the flexible circuit board 20 in the display module in the second direction Y.

[0134] Figure 7 is a schematic diagram of the backlight side of another display module according to an embodiment of the present disclosure. As shown in Figure 7, the main structure of the display module in this embodiment is basically the same as that in the embodiment shown in Figure 4a. The difference is that the structure of the flexible circuit board 20 of the display module in this embodiment is different.

[0135] In an exemplary embodiment, the bonding portion 41 of the flexible circuit board 20 includes a bonding terminal area 41-1, and the bonding portion 41 does not include a bonding device area, that is, no bonding device is provided on the bonding portion 41.

[0136] In an exemplary embodiment, the first extension bonding area 43-1-1 of the first extension 43-1 may include a plurality of sub-bonding areas, each of which is configured to be connected to the first extension device. The first extension device may include at least one of a connector, a touch integrated circuit (T-IC), flash memory, a resistor, and a capacitor.

[0137] In exemplary embodiments, the display module of this disclosure can be applied to display devices, such as OLED, quantum dot display (QLED), light-emitting diode display (Micro LED or Mini LED) or quantum dot light-emitting diode display (QDLED), etc., and this disclosure does not limit it.

[0138] This disclosure also provides a display device, including the aforementioned display module. The display device can be a flexible display device, a foldable display device, a splicing display device, or a wearable device.

[0139] This disclosure also provides a method for manufacturing a display module, including:

[0140] A display panel is formed, the display panel including a display area and a bonding area, the bonding area being connected to the display area on one side in a second direction, the bonding area including a first flat area, a bent area and a second flat area, the first flat area being connected to the display area, the bent area being connected to the first flat area and the second flat area respectively, the bent area being curved, and the second flat area being located on the backlight side of the display area;

[0141] A flexible circuit board is formed, the flexible circuit board being located on the backlight side of the display area, the flexible circuit board including at least a bonding portion and at least one extension portion connected to each other, the bonding portion being disposed on the side of the second flat area away from the display area, the bonding portion being bonded to the second flat area in the opposite direction; the extension portion being located on at least one side of the bonding portion in a first direction, the extension portion being configured to be connected to an extension portion device, the first direction and the second direction intersecting.

[0142] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0143] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include at least one of those features.

[0144] In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise expressly and specifically limited.

[0145] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0146] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0147] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0148] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A display module, comprising: The display panel includes a display area and a bonding area. The bonding area is connected to the display area on one side in a second direction. The bonding area includes a first flat area, a bent area, and a second flat area. The first flat area is connected to the display area. The bent area is connected to both the first flat area and the second flat area. The bent area is curved. The second flat area is located on the backlight side of the display area. A flexible circuit board is located on the backlight side of the display area. The flexible circuit board includes at least a bonding portion and at least one extension portion that are interconnected. The bonding portion is disposed on the side of the second flat area away from the display area, and the bonding portion is bonded to the second flat area in the opposite direction. The extension portion is located on at least one side of the second flat region in the first direction, and the extension portion is configured to be connected to an extension portion device, wherein the first direction and the second direction intersect.

2. The display module according to claim 1, wherein, The orthographic projection of the extended portion onto the plane of the display area does not overlap with the orthographic projection of the second flat area onto the plane of the display area.

3. The display module according to claim 1, wherein, The thickness of the extension portion is less than the thickness of the binding portion.

4. The display module according to claim 3, wherein, The extension portion includes a single conductive layer, or the extension portion includes a double conductive layer; the bonding portion includes m conductive layers, where m is a natural number greater than 2.

5. The display module according to claim 1, wherein, The extension includes an extension device area and an edge region located on at least one side of the extension device area. The extension device area is configured to be connected to the extension device, and the thickness of the extension device area is less than the thickness of the edge region.

6. The display module according to claim 5, wherein, The extended device region includes a single conductive layer, or the extended device region includes a double conductive layer; the edge region includes n conductive layers, where n is a natural number greater than 2.

7. The display module according to any one of claims 1 to 6, wherein, The at least one extension includes a first extension located on one side of the binding portion in the first direction; or, the at least one extension includes a first extension and a second extension, the first extension and the second extension being located on opposite sides of the binding portion in the first direction.

8. The display module according to any one of claims 1 to 6, wherein, The flexible circuit board also includes a connecting portion, one end of which is connected to the side of the extension portion near the binding portion, and the other end of which is connected to the side of the binding portion near the extension portion.

9. The display module according to any one of claims 1 to 6, wherein, The second flat area has a clearance groove on the side near the extension portion, and at least a portion of the extension portion is located in the clearance groove.

10. The display module according to any one of claims 1 to 6, wherein, The backlight side of the display panel includes a complete component area, which is rectangular in shape and located on the side of the flexible circuit board away from the bending area. The complete component area is configured to house complete components.

11. The display module according to any one of claims 1 to 6, wherein, The bonding portion includes a bonding terminal area, the bonding terminal area being strip-shaped extending along the first direction, the bonding terminal area being located on the edge region of the bonding portion away from the bending region, and the bonding portion being bonded to the second flat region in reverse through the bonding terminal area; or, the bonding portion includes a bonding terminal area and a bonding component area, the bonding terminal area being strip-shaped extending along the first direction, the bonding terminal area being located on the edge region of the bonding portion away from the bending region, the bonding portion being bonded to the second flat region in reverse through the bonding terminal area, and the bonding component area being disposed on the side of the bonding terminal area near the bending region, the bonding component area being configured to connect to a bonding component.

12. The display module according to any one of claims 1 to 6, wherein, The flexible circuit board further includes a strip portion, which is rectangular in shape extending along the second direction. The strip portion is disposed on the side of the second flat area away from the display area, and one end of the strip portion in the second direction is connected to the side of the bonding portion near the bending area.

13. The display module according to claim 12, wherein, The thickness of the strip portion is less than the thickness of the binding portion; or, the thickness of the strip portion is approximately the same as the thickness of the binding portion.

14. A display device comprising a display module as described in any one of claims 1 to 13.

15. A method for manufacturing a display module, comprising: A display panel is formed, the display panel including a display area and a bonding area, the bonding area being connected to the display area on one side in a second direction, the bonding area including a first flat area, a bent area and a second flat area, the first flat area being connected to the display area, the bent area being connected to the first flat area and the second flat area respectively, the bent area being curved, and the second flat area being located on the backlight side of the display area; A flexible circuit board is formed, the flexible circuit board is located on the backlight side of the display area, the flexible circuit board includes at least a bonding portion and at least one extension portion that are interconnected, the bonding portion is disposed on the side of the second flat area away from the display area, and the bonding portion is bonded to the second flat area in the opposite direction; The extension portion is located on at least one side of the bonding portion in a first direction, and the extension portion is configured to connect to the extension portion device, wherein the first direction and the second direction intersect.

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