Negative photosensitive resin composition, cured film thereof, and optical member and display device comprising same

Abstract

The present invention provides a negative photosensitive resin composition comprising: hollow silica particles; an alkali-soluble siloxane resin; and an epoxy-based first monomer or oligomer.

Description

Negative photosensitive resin composition, cured film thereof, optical member and display device including the same

[0001] The present invention relates to a negative photosensitive resin composition, a cured film thereof, and an optical member and a display device comprising the same.

[0002] Various electronic devices are being developed to provide video information on multimedia devices such as televisions, mobile phones, tablet computers, navigation systems, and game consoles. In particular, electronic devices including liquid crystal displays and organic electroluminescent displays are introducing quantum dots to improve display quality.

[0003] There is a growing demand for technologies that apply low-refractive index materials to further increase light efficiency in electronic devices utilizing quantum dots. By leveraging the characteristics of low refractive index, efficiency can be enhanced by reducing light loss within the device as light travels. When low-refractive index silicon materials are used between the layers of a panel, the amount of light lost during internal movement can be recycled, thereby increasing luminous efficiency. In particular, given the difficulty in increasing the luminous efficiency of Green QD emitters within QD PR (Quantum Dot Photoreflectance), the luminous efficiency of Green QD emitters can be improved by introducing a low-refractive index coating film on the upper layer of the QD.

[0004] The theoretical lower limit of the low refractive index range controllable by organic compounds is known to be approximately 1.45. Fluorinated acrylic resins are suitable for producing low refractive index coating solutions because they have high transmittance and a refractive index of 1.42 or lower. However, fluorinated acrylic resins have low compatibility with organic compounds, which causes haze issues during photopolymerization or problems in inkjet processes such as coating properties, chemical resistance, and ejection properties.

[0005] While the addition of hollow silica can be considered to lower the refractive index, technological development is required due to issues such as transmittance, haze, residual film rate, and patternability resulting from compatibility problems with organic compounds.

[0006] The present invention aims to provide a negative photosensitive resin composition having excellent optical properties such as low refractive index, high transmittance, haze, and light efficiency, excellent curability even under low-temperature curing conditions to minimize film deformation caused by moisture, and excellent adhesion to surrounding films, a cured film thereof, and an optical member and a display device including the same.

[0007] The above tasks and additional tasks are described in detail below.

[0008] In order to solve the aforementioned problem,

[0009] In one embodiment, the present invention provides a negative photosensitive resin composition comprising hollow silica particles, an alkali-soluble siloxane resin, and an epoxy-based first monomer or oligomer.

[0010] In addition, the present invention provides, in one embodiment, a cured film comprising a cured product of the photosensitive resin composition.

[0011] In addition, the present invention provides an optical member comprising the hardened film in one embodiment.

[0012] In addition, the present invention provides a display device comprising the cured film as an optical film in one embodiment.

[0013] A negative photosensitive resin composition according to one embodiment of the present invention has excellent optical properties such as low refractive index, high transmittance, haze, and light efficiency, and has excellent curing degree even under low-temperature curing conditions, thereby minimizing film deformation caused by moisture and having excellent adhesion to surrounding films.

[0014] Accordingly, the negative photosensitive resin composition according to one embodiment of the present invention can be usefully applied to a cured film, an optical member, and a display device.

[0015] The above effects and additional effects are described in detail below.

[0016] Before describing the present invention in detail below, it should be understood that the terms used in this specification are intended only to describe specific embodiments and are not intended to limit the scope of the invention, which is defined solely by the appended claims. Unless otherwise stated, all technical and scientific terms used in this specification have the same meaning as generally understood by those skilled in the art.

[0017] Throughout this specification and claims, unless otherwise noted, the terms "comprise," "comprising," and "comprising" mean including the mentioned article, step, or group of articles and steps, and are not used to mean excluding any other article, step, or group of articles or groups of steps.

[0018] Also, in the chemical formula, L x (where x is an integer) means, unless otherwise specifically defined, a directly bonded, substituted, or unsubstituted C6–C50 arylene group, or a substituted or unsubstituted C2–C50 heteroarylene group.

[0019] Throughout this specification and claims, the term “substituted or unsubstituted” refers to a deuterium, halogen, amino group, cyano group, nitrile group, nitro group, nitroso group, sulfamoyl group, isothiocyanate group, thiocyanate group, carboxyl group, carbonyl group, or a C1–C30 alkyl group, a C1–C30 alkylsulfinyl group, a C1–C30 alkylsulfonyl group, a C1–C30 alkylsulfanyl group, a C1–C12 fluoroalkyl group, a C2–C30 alkenyl group, a C1–C30 alkoxy group, a C1–C12 N-alkylamino group, a C2–C20 N,N-dialkylamino group, a substituted or unsubstituted C1–C30 sulfide group, a C1–C6 N-alkylsulfamoyl group, a C2–C12 N,N-dialkylsulfamoyl group, It may mean that it is substituted or not substituted with one or more groups selected from the group consisting of C0-C30 silyl groups, C3-C20 cycloalkyl groups, C3-C20 heterocycloalkyl groups, C6-C50 aryl groups, and C3-C50 heteroaryl groups. Additionally, throughout this specification, the same symbols may have the same meaning unless specifically stated otherwise.

[0020] In addition, when ranges such as "C2 to C50" or "0 to 7" are described in this specification, they may be reduced to various ranges within the described ranges even without special description, and are deemed to be described in this specification. For example, C2 to C50 is deemed to describe various reduced ranges such as C5 to C50, C6 to C30, C6 to C20, C6 to C15, C6 to C10, and C12 to C30, in addition to C2 to C50. Accordingly, the description of numerical ranges in this specification may be reduced and corrected later.

[0021] Meanwhile, various embodiments of the present invention may be combined with any other embodiments unless explicitly stated otherwise. Hereinafter, embodiments of the present invention and the effects thereof will be described.

[0022] A photosensitive resin composition according to one embodiment of the present invention comprises hollow silica particles, an alkali-soluble siloxane resin, and an epoxy-based first monomer or oligomer.

[0023] Hollow Silica Particles

[0024] The above hollow silica particles are hollow silica-based particles that have low refractive index characteristics and are not limited to any specific type.

[0025] The hollow silica may be crystalline or amorphous particles, and while it is preferable that they be monodisperse particles, they are not limited thereto. Additionally, while spherical particles are most preferable for the hollow silica, irregular particles may also be used.

[0026] The method of manufacturing the above hollow silica is not particularly limited and can be manufactured by a method generally known in the industry.

[0027] Meanwhile, the refractive index of the hollow silica is 1.4 or less, specifically, it may be within the range of 1.17 to 1.4 or within the range of 1.17 to 1.35. Here, the refractive index does not refer to the refractive index of the hollow silica, that is, the refractive index of the outer layer forming the hollow silica, but rather to the refractive index of the entire particle. When the refractive index of the hollow silica is within the above range, it is advantageous for achieving the desired low refractive index characteristics.

[0028] In addition, the porosity within the hollow silica is in the range of 10 to 60%, specifically in the range of 20 to 60%, and more specifically in the range of 30 to 60%. When satisfying the above range, superior low refractive index characteristics can be achieved.

[0029] In addition, the average particle diameter of the hollow silica may be 10 to 200 nm, and specifically, 30 to 150 nm. When the average particle diameter of the hollow silica is within the range described above, it is advantageous for low refractive index, transmittance, and haze characteristics.

[0030] Meanwhile, the hollow silica may be included in the composition in an amount of 20 to 70 weight%. Specifically, it may be included in an amount of 30 to 60 weight%, 30 to 55 weight%, 25 to 60 weight%, 35 to 60 weight%, 35 to 55 weight%, 40 to 60 weight%, or 40 to 55 weight%, and more specifically, in an amount of 45 to 55 weight%. Within the above range, optical properties such as low refractive index, high transmittance, and light efficiency may be excellent.

[0031] Alkali-soluble siloxane resin

[0032] The above siloxane resin is an alkali-soluble siloxane resin, and when titrated with KOH, the acid value may be 10 to 300 mgKOH / g, specifically 10 to 100 mgKOH / g, 10 to 50 mgKOH / g, 15 to 300 mgKOH / g, 15 to 100 mgKOH / g, 15 to 50 mgKOH / g, 20 to 300 mgKOH / g, 20 to 100 mgKOH / g, or 20 to 50 mgKOH / g. More specifically, the acid value may be 30 to 50 mgKOH / g. Within the above range, it has excellent solubility and good developability, making it excellent for pattern formation.

[0033] The weight-average molecular weight (Mw) of the alkali-soluble siloxane resin equivalent to polystyrene can be 1,000 g / mol to 50,000 g / mol. Specifically, 1,000 g / mol to 50,000 g / mol, 1,000 g / mol to 30,000 g / mol, 1,000 g / mol to 10,000 g / mol, 2,000 g / mol to 50,000 g / mol, 2,000 g / mol to 30,000 g / mol, 2,000 g / mol to 10,000 g / mol, 3,000 g / mol to 50,000 g / mol, 3,000 g / mol to 30,000 g / mol, 3,000 g / mol to 10,000 g / mol, 4,000 g / mol to 50,000 g / mol, 4,000 g / mol to 30,000 g / mol, or 4,000 g / mol to It can be 10,000 g / mol. More specifically, it can be 5,000 g / mol to 10,000 g / mol. Within the above range, not only the residual film rate but also the haze characteristics can be excellent.

[0034] The type of alkali-soluble siloxane resin is not limited and commercially known ones may be used. For example, it may be obtained by hydrolyzing and condensing a reactive silane monomer containing a carbon-1-4 alkyl group, a tetrafunctional reactive silane monomer, and a reactive silane monomer containing a phenolic group, a carboxyl group, an acryl group, or a vinyl group.

[0035] The above siloxane resin may be included in the photosensitive resin composition in an amount of 2 to 50 weight%, specifically 5 to 50 weight%, 10 to 50 weight%, 15 to 50 weight%, 20 to 50 weight%, 25 to 50 weight%, 5 to 40 weight%, 10 to 40 weight%, 15 to 40 weight%, 20 to 40 weight%, 25 to 40 weight%, 5 to 35 weight%, 10 to 35 weight%, 15 to 35 weight%, or 20 to 35 weight%. More specifically, it may be included in an amount of 25 to 35 weight%. Within the above range, optical properties such as high transmittance, haze, and light efficiency may be excellent.

[0036] <Epoxy-based first monomer or oligomer>

[0037] The above-mentioned epoxy-based first monomer or oligomer may have an epoxy structure. Specifically, it may have an alicyclic epoxy structure. Through the alicyclic epoxy structure, reactivity can be increased and the degree of curing can be increased.

[0038] For example, the above epoxy-based first monomer or oligomer may be represented by any one of the following chemical formulas 1 to 3.

[0039] <Chemical Formula 1>

[0040]

[0041] In the above chemical formula 1,

[0042] A is a substituted or unsubstituted C1-C50 alkylene group, a substituted or unsubstituted C1-C50 alkylene oxide group, a substituted or unsubstituted C2-C50 alkenylene group, a substituted or unsubstituted C0-C50 silyl group, a substituted or unsubstituted C3-C50 cycloalkylene group, a substituted or unsubstituted C1-C50 heterocycloalkylene group, a substituted or unsubstituted C3-C50 cycloalkenylene group, a substituted or unsubstituted C2-C50 heterocycloalkenylene group, a substituted or unsubstituted C5-C50 aryl group, a substituted or unsubstituted C5-C50 heteroaryl group, or a combination thereof.

[0043] The -CH2- present in the above A can be replaced with -O-, -S-, -CO-, -C(OR)R-, -NR-, -C(=NR)-, -COOR-, -COO-, -Si(R)2-, or -P(R)2-, and

[0044] R and R1 are each independently hydrogen, deuterium, halogen, nitrile group, nitro group, hydroxyl group, thiol group, substituted or unsubstituted C0-C30 amine group, substituted or unsubstituted C1-C30 alkyl group, substituted or unsubstituted C2-C30 alkenyl group, substituted or unsubstituted C1-C30 alkoxy group, substituted or unsubstituted C1-C30 sulfide group, substituted or unsubstituted C0-C30 silyl group, substituted or unsubstituted C3-C30 cycloalkyl group, substituted or unsubstituted C1-C30 heterocycloalkyl group, substituted or unsubstituted C3-C30 cycloalkenyl group, substituted or unsubstituted C2-C30 heterocycloalkenyl group, substituted or unsubstituted C3-C30 aryl group, or substituted or unsubstituted C2-C30 heteroaryl group, and

[0045] L1 and L2 are each independently a directly bonded, substituted or unsubstituted C1-C50 alkylene group, a substituted or unsubstituted C1-C50 alkylene oxide group, a substituted or unsubstituted C2-C50 alkenylene group, a substituted or unsubstituted C0-C50 silyl group, a substituted or unsubstituted C3-C50 cycloalkylene group, a substituted or unsubstituted C1-C50 heterocycloalkylene group, a substituted or unsubstituted C3-C50 cycloalkenylene group, a substituted or unsubstituted C2-C50 heterocycloalkenylene group, a substituted or unsubstituted C5-C50 aryl group, a substituted or unsubstituted C5-C50 heteroaryl group, or a combination thereof.

[0046] n is an integer from 1 to 8, each independently, and

[0047] m is an integer from 1 to 5, each independently, and

[0048] q are each independently integers from 0 to 5, and

[0049] p is an integer from 0 to 5.

[0050] <Chemical Formula 2>

[0051]

[0052] In the above chemical formula 2,

[0053] The B ring is a substituted or unsubstituted C5-C50 condensed cycloalkyl group.

[0054] <Chemical Formula 3>

[0055] (D)u-(L1)q-(A)q-(L1)q-(D)v

[0056] In the above chemical formula 3,

[0057] D is an epoxy group, and

[0058] A and L1 are identical to the definitions of Chemical Formula 1 above, and

[0059] u is an integer from 1 to 30, specifically 1 to 20, 1 to 10, 1 to 5, or 1 to 3.

[0060] v is an integer from 0 to 30, specifically 1 to 20, 1 to 10, 1 to 5, or 1 to 3.

[0061] Each q is independently an integer from 1 to 30, specifically 1 to 20, 1 to 10, 1 to 5, or 1 to 3.

[0062]

[0063] Specifically, the epoxy monomer or oligomer can be represented by any one of the following chemical structural formulas A.

[0064] Chemical Structure Formula A

[0065]

[0066]

[0067]

[0068]

[0069]

[0070]

[0071]

[0072]

[0073]

[0074]

[0075]

[0076]

[0077]

[0078]

[0079]

[0080]

[0081]

[0082]

[0083]

[0084] In the above chemical structural formula A,

[0085] R is a substituted or unsubstituted C1-C50 alkylene group, a substituted or unsubstituted C2-C50 alkenylene group, a substituted or unsubstituted C0-C50 silyl group, a substituted or unsubstituted C3-C50 cycloalkylene group, a substituted or unsubstituted C1-C50 heterocycloalkylene group, a substituted or unsubstituted C3-C50 cycloalkenylene group, a substituted or unsubstituted C2-C50 heterocycloalkenylene group, or a combination thereof.

[0086] l, m, n and o are each independently integers from 1 to 30, specifically from 1 to 20, from 1 to 10, from 1 to 5, or from 1 to 3.

[0087] The epoxy-based first monomer may be included in the photosensitive resin composition in an amount of 2 to 30 weight%. Specifically, it may be included in an amount of 2 to 20 weight%, 2 to 15 weight%, 2 to 12 weight%, 4 to 30 weight%, 4 to 20 weight%, 4 to 15 weight%, 5 to 12 weight%, 8 to 30 weight%, 8 to 20 weight%, or 8 to 15 weight%. More specifically, it may be included in an amount of 8 to 12 weight%. Within the above range, optical properties such as low refractive index, high transmittance, haze, and light efficiency are excellent, and the degree of curing is excellent even under low-temperature curing conditions, thereby minimizing film deformation caused by moisture and ensuring excellent adhesion to the surrounding film.

[0088] <Polyfunctional Acrylate Second Monomer or Oligomer>

[0089] A photosensitive resin composition according to one embodiment of the present invention may further comprise a polyfunctional acrylate second monomer or oligomer. Specifically, the polyfunctional acrylate second monomer or oligomer may be selected from one or more of a polyfunctional urethane acrylate second-second monomer or oligomer and a polyfunctional acrylate second-second monomer or oligomer having a linear, branched, or cyclic alkylene structure of C1 to C30 in which -CH2- is substituted with oxygen or is not substituted.

[0090] The above-mentioned polyfunctional acrylate second monomer or oligomer is specifically pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tripentaerythritol hepta(meth)acrylate, trilene diisocyanate, xylene diisocyanate, hexamethylene diisocyanate, trimethylolpropane tri(meth)acrylate, trimethylolpropane polyethoxy tri(meth)acrylate, trimethylolpropane trimethacrylate, ethylene glycol dimethacrylate, butanediol dimethacrylate, hexaethyl methacrylate, butyl methacrylate, or a mixture of two or more of these, or a urethane-modified acrylate oligomer, an epoxide acrylate oligomer, or an ether acrylate. One or more of oligomers and dendritic acrylate oligomers may be selected.

[0091] The above-mentioned polyfunctional acrylate second monomer or oligomer may be included in the photosensitive resin composition in an amount of 1 to 50 weight%. Specifically, it may be included in an amount of 2 to 50 weight%, 2 to 40 weight%, 2 to 30 weight%, 2 to 20 weight%, 3 to 50 weight%, 3 to 40 weight%, 3 to 30 weight%, 3 to 20 weight%, 5 to 50 weight%, 5 to 40 weight%, 5 to 30 weight%, or 5 to 20 weight%.

[0092] The above-mentioned 2-1 monomer or oligomer may be included in the photosensitive resin composition in an amount of 0 to 30 weight%. Specifically, it may be included in an amount of 2 to 30 weight%, 2 to 20 weight%, 2 to 12 weight%, 2 to 10 weight%, 2 to 4.5 weight%, 3 to 30 weight%, 3 to 20 weight%, 3 to 12 weight%, or 3 to 10 weight%, and more specifically, it may be included in an amount of 3 to 4.5 weight%.

[0093] The above-mentioned second-second monomer or oligomer may be included in the photosensitive resin composition in an amount of 0 to 20 weight%. Specifically, it may be included in an amount of 2 to 20 weight%, 2 to 15 weight%, 2 to 10 weight%, 2 to 8 weight%, 4 to 20 weight%, 4 to 15 weight%, 4 to 10 weight%, 4 to 8 weight%, 5 to 20 weight%, 5 to 15 weight%, 5 to 10 weight%, 5 to 8 weight%, 6 to 20 weight%, 6 to 15 weight%, or 6 to 10 weight%, and more specifically, in an amount of 6 to 8 weight%.

[0094] Meanwhile, the weight ratio of the siloxane resin to the second monomer or oligomer may be in the range of 6:1 to 9:1. Specifically, the weight ratio of the siloxane resin to the second monomer or oligomer may be in the range of 7:1 to 8:1. If the proportion of the siloxane resin is higher outside of the above range, there may be a problem with the film-forming ability of the photosensitive resin composition, such as a decrease in the residual film rate, and if the proportion of the polyfunctional urethane acrylate oligomer is higher, there may be a problem with an increase in haze.

[0095] In addition, the weight ratio of the siloxane resin to the second-second monomer or oligomer may be in the range of 3:1 to 6:1, and specifically, the weight ratio of the siloxane resin to the second-second monomer or oligomer may be in the range of 4:1 to 5:1. If the proportion of the siloxane resin is higher outside of the above range, there may be a problem with the film-forming ability of the photosensitive resin composition, and if the proportion of the second-second monomer or oligomer is higher, the refractive index may increase.

[0096] In addition, the weight ratio of the epoxy monomer or oligomer to the second-1 monomer or oligomer may be 1:1 to 4:1, specifically 2:1 to 3:1. If the ratio of the epoxy monomer is lower outside of the above range, the QD initial efficiency value may decrease and the QD efficiency stability may be lowered, and if the ratio of the second-1 monomer is lower, there may be problems with the film-forming ability of the photosensitive resin composition, such as a decrease in the residual film rate.

[0097] Photopolymerization Initiator

[0098] According to one embodiment of the present invention, a photopolymerization initiator may be included. For example, 2-(O-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(O-acetyloxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-ethanone, O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one, 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholine-4-yl-phenyl)-butan-1-one, 1-(4-phenylsulfanylphenyl)-butan-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octan-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1-on-oxime-O-acetate, 1-(4-phenylsulfanylphenyl)-butane-1-on-oxime-O-acetate, 2-(O-benzoyloxime)-1-[4-(phenylthio)p-methylphenyl]-1,2-octanedione, 2-(O-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-phenyldione, 2-(O-acetyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 2-(O-acetyloxime)-1-[4-(phenylthio)phenyl]-1,2-phenyldione, 2-(O-acetyloxime)-1-[4-(phenylthio)phenyl]-1,2-methyldione, Oxime compounds and oxime ester compounds such as O-(acetyl)-N-(1-phenyl-2-oxo-2-(4'-methoxy-naphthyl)ethylidene)hydroxylamine, etc.

[0099] Acetophenone compounds such as 4-phenoxydichloroacetophenone, 4-t-butyl-dichloroacetophenone, diethoxyacetophenone, p-dimethylaninoacetophenone, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 1-hydroxycyclohexylphenylketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone, etc.

[0100] Benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzyl dimethyl ketal; benzophenone compounds such as benzophenone, benzoyl benzoic acid, methyl benzoyl benzoate, 4-phenylbenzophenone, hydroxybenzophenone, benzophenone acrylate, 4-benzoyl-4'-methyldiphenyl sulfide, and 3,3',4,4'-tetra(t-butylphooxycarbonyl)benzophenone;

[0101] Thioxantone compounds such as thioxantone, 2-chlorothioxantone, 2-methyldioxantone, isopropylthioxantone, 2,4-diisopropylthioxantone, and 2,4-diethylthioxantone, 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-pifenonyl-4,6-bis(trichloromethyl)-s-triazine, 2,4-bis(trichloromethyl)-6-styryl-s-triazine, and 2-(naphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine. Triazine compounds such as 2-(4-methoxy-naphth-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2,4-trichloromethyl-(piperonyl)-6-triazine, and 2,4-trichloromethyl(4'-methoxystyryl)-6-triazine,

[0102] Phosphine compounds such as bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, imidazole compounds such as 2,2'-bis(o-chlorophenyl)-4,5,4',5'-tetraphenyl-1,2'-biimidazole, 2,2'-bis(o-methoxyphenyl)-4,4',5,5'-tetraphenylbiimidazole and 2,2'-bis(o-methoxyphenyl)-4,4',5,5'-tetra(p-methylphenyl)biimidazole, quinone compounds such as 9,10-phenanthrenquinone, camperquinone, and ethylanthraquinone,

[0103] Borate compounds, carbazole compounds, and titanocene compounds may be used, and these may be used individually or in combination of two or more, but are not limited to the above examples.

[0104] According to one embodiment of the present invention, the content of the photopolymerization initiator may be included in an amount of 0.1 to 20 weight%, specifically 0.1 to 15 weight%, 0.1 to 10 weight%, 0.1 to 5 weight%, 0.5 to 20 weight%, 0.5 to 15 weight%, 0.5 to 10 weight%, 0.5 to 5 weight%, 1 to 20 weight%, 1 to 15 weight%, 1 to 10 weight%, and 1 to 5 weight%. By controlling the content of the photopolymerization initiator to the aforementioned range, the polymerization reaction can be carried out effectively and stably.

[0105] Silane coupling agents

[0106] A photosensitive resin composition according to one embodiment of the present invention may further include a silane coupling agent. Adhesion strength may be increased by adding a silane coupling agent. The silane coupling agent may be contained in an amount of 0.01 to 1 weight% in the composition.

[0107] The above silane coupling agents are, for example, (3-glycidoxypropyl)trimethoxysilane, (3-glycidoxypropyl)triethoxysilane, (3-glycidoxypropyl)methyldimethoxysilane, (3-glycidoxypropyl)methyldiethoxysilane, (3-glycidoxypropyl)dimethylethoxysilane, 3,4-epoxybutyltrimethoxysilane, 3,4-epoxybutyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane, aminopropyltrimethoxysilane, aminopropyltriethoxysilane, 3-triethoxysilly-N-(1,3-dimethyl-butylidene)propylamine, N-2(aminoethyl)3-aminopropyltrimethoxysilane, It may include one or more selected from the group consisting of N-2(aminoethyl)3-aminopropyltriethoxysilane, N-2(aminoethyl)3-aminopropylmethyldimethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, and (3-isocyanatepropyl)triethoxysilane, but is not limited to the above examples.

[0108] Other ingredients

[0109] In addition to the components described above, the photosensitive resin composition according to one embodiment of the present invention may optionally use solvents, antioxidants, UV absorbers, thermal polymerization inhibitors, leveling agents, surfactants, lubricants, etc., but is not limited thereto.

[0110] A cured product according to another embodiment of the present invention is a cured product obtained by curing the above-mentioned photocurable composition, and the cured product is cured on a substrate to form a coating layer having high transmittance, low haze, excellent QD quantum efficiency, and excellent stability while exhibiting low refractive index characteristics.

[0111] The above cured material may specifically be a patterned cured film, for example, a cured film patterned into a polyhedron.

[0112] The refractive index of the above-mentioned cured material may be 1.35 or less based on light with a wavelength of 550 nm. Specifically, it may have a refractive index of 1.27 or less.

[0113] The above cured material may have a haze of 1 or less, specifically a haze of 0.5 or less.

[0114] A display device, which is another embodiment of the present invention, includes the cured material. The display device may be, for example, an organic light-emitting display device and may include the cured material as a light extraction layer. When the cured material is included as a light extraction layer, the light extraction performance of the display device can be improved, thereby enabling the realization of a brighter display device under the same conditions. Hereinafter, the present invention will be described in detail with reference to examples to specifically explain the present invention. However, the embodiments according to the present invention may be modified in various different forms, and the scope of the present invention is not to be interpreted as being limited to the embodiments described below. The embodiments of this specification are provided to more completely explain the present invention to those with average knowledge in the art.

[0115] Chinese silica

[0116] The following particles were prepared as hollow silica or as substitute particles.

[0117] No. Type of Hollow Silica 1 Hollow silica with average particle size of 20 nm 2 Hollow silica with average particle size of 40 nm 3 Hollow silica with average particle size of 80 nm 4 Hollow silica with average particle size of 120 nm 5 Hollow silica with average particle size of 140 nm 6 Hollow silica with average particle size of 200 nm 7 Non-hollow silica with average particle size of 40 nm 8 Titanium dioxide particles with average particle size of 400 nm

[0118] Silroksan Suji

[0119] The following compounds were prepared as alkali-soluble siloxane resins, and acrylic resin was also prepared instead of siloxane resin for a comparative experiment.

[0120] No. Siloxane Resin Type 1 MW=7,000~8,000, Acid value = 35~40 KOH mg / g 2. Siloxane Resin Substitute Acrylic Resin MW=7,000~8,000, Acid value = 35~40 KOH mg / g 3 MW=9,000~10,000, Acid value = 35~40 KOH mg / g 4 MW=7,000~8,000, Acid value = 15~20 KOH mg / g

[0121] Epoxy-based first monomer or oligomer

[0122] The following compounds were prepared as epoxy-based first monomers or oligomers.

[0123]

[0124] Polyfunctional urethane acrylate 2-1 monomer or oligomer

[0125] The following compounds were prepared as the 2-1 monomer or oligomer of polyfunctional urethane acrylate.

[0126] No. 2-1 Monomer or oligomer 1 Aliphatic multi-functional Acrylate (MU-9500, Miwon) 2 Aliphatic hexafunctional acrylate (PU5000, Miwon)

[0127] Polyfunctional acrylate 2-2 monomer or oligomer

[0128] The following compounds were prepared as polyfunctional acrylate monomers or oligomers.

[0129] No. 2-2 monomer or oligomer 1 Dipentaerythritol hexadiaacrylate (DPHA) 2 hexamethylene diacrylate

[0130] Photoinitiator

[0131] The following compounds were prepared as photoinitiators.

[0132] Photopolymerization Initiator 1OXE-1: Keto-oxime ester-based photoinitiator

[0133] Silane coupling agent

[0134] The following compounds were prepared as silane coupling agents.

[0135] KBE-9007N: Silane coupling agent of isocyanate group

[0136] surfactants

[0137] The following compounds were prepared as surfactants.

[0138] FZ-2122: Silicone-based surfactant

[0139] Examples 1 to 37 and Comparative Examples 1 to 7

[0140] Preparation of a photosensitive resin composition

[0141] The ingredients were prepared and mixed according to the components and contents of Table 6 below. Propylene glycol monoethyl acetate was added and dissolved so that the solid content of the mixture was 5 to 20 parts by weight, and then filtered through a 0.2 μm Millipore filter to prepare a negative photosensitive resin composition. The contents in Table 7 below refer to parts by weight.

[0142] Preparation of hardened film

[0143] The negative photosensitive resin compositions prepared in Examples 1 to 18 and Comparative Example 1 were applied to a bare glass substrate using a spin coater, and then pre-baked on a hot plate at 100°C for 120 seconds to form a 2 μm film. The coated film was exposed to light using a Canon MPA-600 exposure machine at an intensity of 200 mW / cm² with an exposure amount corresponding to the sensitivity (Eop) of each sample. Subsequently, the film was developed with an aqueous solution of 0.37 wt% potassium hydroxide at 23°C for 80 seconds, followed by rinsing with purified water (DI water) for 40 seconds. For final curing, the film was heated in an oven at 100°C for 20 minutes to obtain a patterned film.

[0144]

[0145] Hollow silica siloxane resin epoxy First monomer 2-1 monomer 2-2 monomer (1) Second monomer (2) Photoinitiator Silane coupling agent Surfactant Classification Type Content Type Content Type Content Type Content Content Content Content Content Example 1 446.7138.3111.5---1.51.10.30.6 Example 2 446.7133.9111.514.4-1.51.10.30.6 Example 3 446.7129.411013.87.01.31.00.20.6 Example 4 446.712911014.17.01.41.00.20.6 Example 5 446.7129.511013.77.01.31.00 .20.6 Example 6 446.7 128.4 11014.7 7.01.4 1.00.20.6 Example 7 446.7 129.9 11013.3 7.01.3 1.00.20.6 Example 8 446.5 14.8 19.9 128.3 7.11.4 1.10.30.6 Example 9 446.7 116.5110116.67.01.31.00.20.7 Example 10446.7122110111.17.01.31.00.20.7 Example 11446.611119.9122.17.11.31.10.20.7 Example 12446.7130110.113.96 .11.41.00.20.6 Example 13 446.7130.8110.4144.81.41.10.20.6 Example 14 446.7128.619.713.78.21.31.00.20.6 Example 15 446.7131.4110.714.13.81.41.10 .20.6 Example 16 446.7126.218.913.411.91.20.90.20.6 Example 17 446.7114.91511.929.60.70.50.10.6 Example 18 446.71712.410.941.80.30.20.10.6 Example 194 46.7130.818147.31.41.00.20.6 Example 20446.7128.6111.113.76.81.31.00.20.6 Example 21446.7133.314.314.37.91.51.10.30.6 Example 22446.7126.7113 .913.56.31.20.90.20.6 Example 23446.713511.514.78.41.61.20.30.6 Example 24446.7128.3111.413.76.81.31.00.20.6 Example 25446.7129.619.813.87.01.31.00.20.6 Example 26 446.7127113.513.56.41.20.90.20.6 Example 27 446.7121.4121.512.85.11.00.70.20.6 Example 28 446.7132.515.414.27.71.51.10.30.6 Example 29 346.7129.411013.87.01.31.00.20.6 Example 30 446.7129. 411013.87.01.31.00.20.6 Example 315 46.7129.411013.87.01.31.00.20.6 Example 32 1 46.7129.411013.87.01.31.00.20.6 Example 33 6 46.7129.411013.87.01.31.00.20.6 Example 34 46.7329.411013.87.01.31.00.20.6 Example 35 446.7429.411013.87.01.31.00.20.6 Example 36 446.7129.421013.87.01.31.00.20.6 Example 37 446.7129.411023.87.01.31.00.20.6 Comparative Example 1--155.4118.817.213.22.51.90.40.6 Comparative Example 2 446.7--19.9133.17.01.31.00.30. 7 Comparative Example 3 446.7136.3--14.78.61.61.20.30.6 Comparative Example 4 446.7141----8.61.61.20.30.6 Comparative Example 5 446.7229.411013.87.01.31.00.20.6 Comparative Example 6 746.7129.411013.87.01.31.00.20.6 Comparative Example 7 846.7129.411013.87.01.31.00.20.6.

[0146] Experimental Example

[0147] The following experiments were conducted on the photosensitive resin compositions and cured films prepared in Examples 1 to 37 and the photosensitive resin compositions and cured films prepared in Comparative Examples 1 to 7, and the results are listed in Table 8 below.

[0148] Experimental Example 1: Measurement of Light Refractive Index of Optical Film

[0149] For the 1 μm thick cured film formed on the above silicon wafer substrate, the refractive index (average of 550 ± 20 nm) was measured using an ellipsometer and indicated in the table below using symbols according to the following criteria.

[0150] ○ : When the measured refractive index of the optical film is 1.27 or less

[0151] Δ: When the measured refractive index of the optical film is 1.27 ~ 1.35

[0152] X: When the measured refractive index of the optical film exceeds 1.35

[0153] Experimental Example 2: Measurement of Light Transmittance of Optical Film

[0154] The average transmittance of the 10㎛ thick cured film formed on the bare glass substrate was measured at 380–780 nm using a UV-VIS spectrophotometer (Cary4000, Agilent).

[0155] ○ : When the average transmittance value is 95% or higher

[0156] Δ: When the average transmittance value is greater than 90% and less than 95%

[0157] X: When the average transmittance value is less than 90%

[0158] Experimental Example 3: Measurement of Haze in Optical Film

[0159] Haze was measured using NIPPON DENSHOKU’s COH 400 haze meter and indicated in the table below using symbols according to the standards below.

[0160] ○ : When the haze measurement value is 0.5 or less

[0161] Δ: When the haze measurement value is greater than 0.5 and less than or equal to 1.0

[0162] X: When the haze measurement value is greater than 1.0

[0163] Experimental Example 4: PCT (Pressure Cooker Test) Evaluation

[0164] For a 2㎛ thick cured film formed on the above silicon wafer substrate, PCT was performed for 12 hours under conditions of 100°C, 100% RH humidity, and 2 atm pressure. The mass change of the obtained coating film was measured and evaluated according to the following criteria.

[0165] ○: When the change in mass is 1% or less

[0166] △: When the mass change value is greater than 1% and less than or equal to 10%,

[0167] X: If the mass change value exceeds 10%,

[0168] Experimental Example 5: Quantum Efficiency Evaluation

[0169] The above 2㎛ thick cured film was placed on top of a substrate for quantum dot efficiency evaluation, and the quantum dot efficiency on the substrate was measured using an Absolute PL Quantum yield spectrometer QE 2100 (Otsuka Electronics) and evaluated according to the following criteria.

[0170] ○: When the quantum efficiency value is 95% or higher

[0171] △: When the quantum efficiency value is 85% or higher and less than 95%,

[0172] X: When the quantum efficiency value is less than 85%

[0173] Experimental Example 5: Stability Evaluation

[0174] The above 2㎛ thick cured film was placed on the substrate for quantum dot efficiency evaluation and left at room temperature for 7 days. Afterward, the quantum dot efficiency on the substrate was measured using an Absolute PL Quantum yield spectrometer QE 2100 (Otsuka Electronics) and evaluated according to the following criteria.

[0175] ○: When the quantum efficiency value is 85% or higher

[0176] △: When the quantum efficiency value is 75% or higher and less than 85%,

[0177] X: When the quantum efficiency value is less than 75%

[0178] Experimental Example 7: Evaluation of Patterns

[0179] The negative photosensitive resin compositions prepared in Examples 1 to 18 and Comparative Example 1 were applied to a bare glass substrate using a spin coater, and then pre-baked on a hot plate at 100°C for 120 seconds to form a 2 μm film. The coated film was exposed to an exposure gap of 25 μm using a Canon MPA-600 exposure machine under an intensity of 200 mW / cm² with an exposure amount corresponding to the sensitivity (Eop) of each sample, through a negative mask with a pattern formed with a width of 100 μm. Subsequently, the film was developed with an aqueous solution of 0.37 wt% potassium hydroxide at 23°C for 80 seconds, followed by washing with purified water (DI water) for 40 seconds. For final curing, the film was heated in an oven at 100°C for 20 minutes to obtain a patterned film. The obtained cured film was observed using a scanning electron microscope (SEM) at 5000x magnification,

[0180] ○: When a pattern with a width of 100μm was formed

[0181] X: Case where a pattern with a width of 100μm was not formed

[0182] Experimental Example 7: Evaluation of Residue Rate

[0183] The negative photosensitive resin compositions prepared in Examples 1 to 18 and Comparative Example 1 were applied to a bare glass substrate using a spin coater, and then pre-baked on a hot plate at 100°C for 120 seconds to form a 2 μm film. The coated film was exposed to an exposure gap of 25 μm using a Canon exposure machine MPA-600 with an exposure amount corresponding to the sensitivity (Eop) of each sample under an intensity of 200 mW / cm², through a negative mask with a pattern of 100 μm width. Subsequently, the film was developed with an aqueous solution of 0.37 wt% potassium hydroxide at 23°C for 80 seconds, followed by washing with purified water (DI water) for 40 seconds. After development, the residual film rate in the exposure area was measured.

[0184] ○: When the film residue rate is 80% or higher

[0185] △: When the film residue rate is 60 to 80%

[0186] X: When the film residue rate is less than 60%

[0187] Classification Haze Transmittance Refractive Index PCT Optical Efficiency Stability Residual Film Rate Pattern Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Example 9 Example 1 Example 1 Example 1 Example 1 Example 1 Example 1 Example 1 ○○Example 11X△○○△△○○Example 12○○○○○○○○Example 13○○○○○○○○Example 14○○△○○○○○Example 15○○○○○△△○Example 16○○△○△○○○Example 17△○△○△△△XExample 18△○X○△△△XExample 19○○○○○○○○Example 20○○○○○○○○Example 21○○○○○△○○Example Example 22 Example 23 Example 24 Example 25 Example 26 Example 27 Example 28 Example 29 Example 31 Example 32 Example 3 33△△○○△△○○ Example 34△○○○○○○○ Example 35△○○○○○○○ Example 36△○○○○○○○ Example 37△○○○○○○○ Comparative Example 1○○X○XX○○ Comparative Example 2X○XX△△○○ Comparative Example 3○○○X△X○○ Comparative Example 4○○○X△X△X Comparative Example 5X△X△XX○○ Comparative Example 6XXX○XX○△ Comparative Example 7XXX○XX○△

[0188] As can be seen from the results in Table 8 above,

[0189] It can be confirmed that the photosensitive resin composition according to one embodiment of the present invention exhibits superior haze, transmittance, refractive index, PCT, light efficiency, stability, residual film rate, and pattern characteristics compared to the photosensitive resin composition of the comparative example.

[0190] In particular, the cases of Examples 3 to 5 and 12 to 13 had the best overall characteristics.

[0191] When comparing the embodiments and comparative examples of the present invention,

[0192] In the case of Examples 3 and 29 to 33, it was confirmed that depending on the size of the hollow silica, not only do haze, transmittance, and refractive index affect light efficiency and stability, and

[0193] In the case of Examples 3, 34, and 35, it can be seen that the haze characteristics deteriorate depending on the acid value and molecular weight of the siloxane resin.

[0194] In the case of Comparative Example 1, it was confirmed that the refractive index, luminous efficiency, and stability characteristics were reduced due to the absence of hollow silica.

[0195] In the case of Comparative Example 2, it was confirmed that haze, refractive index, and PCT properties were reduced due to the absence of siloxane resin.

[0196] In the case of Comparative Example 3, it was confirmed that PCT and stability characteristics were reduced due to the absence of the epoxy-based first monomer, and

[0197] In the case of Comparative Example 4, it was confirmed that PCT, stability, and pattern characteristics were reduced due to the absence of the epoxy-based first monomer and second-first monomer.

[0198] In the case of Comparative Example 5, it was confirmed that using an acrylic resin instead of a siloxane resin resulted in reduced haze, refractive index, luminous efficiency, and stability characteristics.

[0199] In the case of Comparative Example 6, it was confirmed that haze, transmittance, refractive index, light efficiency, and stability were reduced by using non-hollow silica particles, and

[0200] In the case of Comparative Example 7, using 400 nm titanium dioxide particles, it was confirmed that haze, transmittance, refractive index, light efficiency, and stability were reduced.

[0201] Furthermore, a person skilled in the art will be able to fully understand the effects of the present invention from the experimental results of the above examples and comparative examples and Table 7.

Claims

1. Hollow silica particles; alkali-soluble siloxane resin; and A negative photosensitive resin composition comprising an epoxy-based first monomer or oligomer.

2. In Paragraph 1, A negative photosensitive resin composition in which the D50 of the hollow silica particles is within the range of 30 nm to 150 nm.

3. In Paragraph 1, The above siloxane resin is a negative photosensitive resin composition having an acid value in the range of 10 to 300 mgKOH / g and a weight-average molecular weight (Mw) equivalent to polystyrene of 1,000 g / mol to 50,000 g / mol.

4. In Paragraph 1, The above epoxy-based first monomer or oligomer is a negative photosensitive resin composition having a cycloaliphatic epoxy structure.

5. In Paragraph 1, A negative photosensitive resin composition further comprising a polyfunctional acrylate second monomer or oligomer.

6. In Paragraph 5, A negative photosensitive resin composition wherein the above-mentioned polyfunctional acrylate second monomer or oligomer is selected from one or more of a polyfunctional urethane acrylate second-second monomer or oligomer and a polyfunctional acrylate second-second monomer or oligomer having a linear, branched, or cyclic alkylene structure having C1 to C30 in which -CH2- is substituted with oxygen or not substituted.

7. In Paragraph 5, A negative photosensitive resin composition in which the weight ratio of the siloxane resin and the second monomer or oligomer is 6:1 to 9:

1.

8. In Paragraph 5, A negative photosensitive resin composition in which the weight ratio of the siloxane resin to the 2-1 monomer or oligomer is 7:1 to 8:

1.

9. In Paragraph 6, A negative photosensitive resin composition in which the weight ratio of the above siloxane resin to the above 2-2 monomer or oligomer is 3:1 to 6:

1.

10. In Paragraph 6, A negative photosensitive resin composition in which the weight ratio of the epoxy monomer or oligomer to the second-first monomer or oligomer is 1:1 to 4:

1.

11. In Paragraph 1, A negative photosensitive resin composition comprising 20 to 35 weight% of the above siloxane resin, 30 to 60 weight% of hollow silica, and 4 to 15 weight% of an epoxy monomer or oligomer.

12. In Paragraph 5, A negative photosensitive resin composition comprising 5 to 30 weight% of the above-mentioned polyfunctional acrylate second monomer or oligomer.

13. In Paragraph 6, A negative photosensitive resin composition comprising 3 to 12 weight% of the above-mentioned 2-1 monomer or oligomer and 5 to 15 weight% of the above-mentioned 2-2 monomer or oligomer.

14. In Paragraph 1, The above epoxy monomer or oligomer is a negative photosensitive resin composition represented by any one of the following chemical formulas 1 to 3. <Chemical Formula 1> In the above chemical formula 1, A is a substituted or unsubstituted C1-C50 alkylene group, a substituted or unsubstituted C1-C50 alkylene oxide group, a substituted or unsubstituted C2-C50 alkenylene group, a substituted or unsubstituted C0-C50 silyl group, a substituted or unsubstituted C3-C50 cycloalkylene group, a substituted or unsubstituted C1-C50 heterocycloalkylene group, a substituted or unsubstituted C3-C50 cycloalkenylene group, a substituted or unsubstituted C2-C50 heterocycloalkenylene group, a substituted or unsubstituted C5-C50 aryl group, a substituted or unsubstituted C5-C50 heteroaryl group, or a combination thereof. The -CH2- present in the above A can be replaced with -O-, -S-, -CO-, -C(OR)R-, -NR-, -C(=NR)-, -COOR-, -COO-, -Si(R)2-, or -P(R)2-, and R and R1 are each independently hydrogen, deuterium, halogen, nitrile group, nitro group, hydroxyl group, thiol group, substituted or unsubstituted C0-C30 amine group, substituted or unsubstituted C1-C30 alkyl group, substituted or unsubstituted C2-C30 alkenyl group, substituted or unsubstituted C1-C30 alkoxy group, substituted or unsubstituted C1-C30 sulfide group, substituted or unsubstituted C0-C30 silyl group, substituted or unsubstituted C3-C30 cycloalkyl group, substituted or unsubstituted C1-C30 heterocycloalkyl group, substituted or unsubstituted C3-C30 cycloalkenyl group, substituted or unsubstituted C2-C30 heterocycloalkenyl group, substituted or unsubstituted C3-C30 aryl group, or substituted or unsubstituted C2-C30 heteroaryl group, and L1 and L2 are each independently a directly bonded, substituted or unsubstituted C1-C50 alkylene group, a substituted or unsubstituted C1-C50 alkylene oxide group, a substituted or unsubstituted C2-C50 alkenylene group, a substituted or unsubstituted C0-C50 silyl group, a substituted or unsubstituted C3-C50 cycloalkylene group, a substituted or unsubstituted C1-C50 heterocycloalkylene group, a substituted or unsubstituted C3-C50 cycloalkenylene group, a substituted or unsubstituted C2-C50 heterocycloalkenylene group, a substituted or unsubstituted C5-C50 aryl group, a substituted or unsubstituted C5-C50 heteroaryl group, or a combination thereof. n is an integer from 1 to 8, each independently, and m is an integer from 1 to 5, each independently, and q are each independently integers from 0 to 5, and p is an integer from 0 to 5. <Chemical Formula 2> In the above chemical formula 2, The B ring is a substituted or unsubstituted C5-C50 condensed cycloalkyl group. <Chemical Formula 3> (D)u-(L1)q-(A)q-(L1)q-(D)v In the above chemical formula 3, D is an epoxy group, and A and L1 are identical to the definitions of Chemical Formula 1 above, and u is an integer from 1 to 30, and v is an integer from 0 to 30, and q are each independently integers from 1 to 30.

15. In Paragraph 1, The above epoxy monomer or oligomer is a negative photosensitive resin composition represented by any one of the following chemical structural formulas A. Chemical Structure Formula A In the above chemical structural formula A, R is a substituted or unsubstituted C1-C50 alkylene group, a substituted or unsubstituted C2-C50 alkenylene group, a substituted or unsubstituted C0-C50 silyl group, a substituted or unsubstituted C3-C50 cycloalkylene group, a substituted or unsubstituted C1-C50 heterocycloalkylene group, a substituted or unsubstituted C3-C50 cycloalkenylene group, a substituted or unsubstituted C2-C50 heterocycloalkenylene group, or a combination thereof. l, m, n and o are each independently integers from 1 to 30.

16. In Paragraph 5, The above-mentioned polyfunctional acrylate second monomer or oligomer is pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tripentaerythritol hepta(meth)acrylate, trilene diisocyanate, xylene diisocyanate, hexamethylene diisocyanate, trimethylolpropane tri(meth)acrylate, trimethylolpropane polyethoxy tri(meth)acrylate, trimethylolpropane trimethacrylate, ethylene glycol dimethacrylate, butanediol dimethacrylate, hexaethyl methacrylate, butyl methacrylate, or a mixture of two or more of these, or a urethane-modified acrylate oligomer, an epoxide acrylate oligomer, or an ether acrylate oligomer A negative photosensitive resin composition selected from one or more of and dendritic acrylate oligomers.

17. In Paragraph 1, A negative photosensitive resin composition further comprising a photopolymerization initiator and a silane coupling agent.

18. A display device comprising a cured film formed by curing the negative photosensitive resin composition of claim 1.

19. In Paragraph 18, A display device in which the refractive index of the above-mentioned hardened film is 1.35 or less.

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