Methods of repairing casings using a red mud sealant composition

Abstract

This disclosure methods of sealing casing-casing annual leaks and repairing casings using a sealant composition, including red mud, an epoxy resin, and a crosslinker.

Description

Attorney Docket No. 38136-2610WO1 / SA73010METHODS OF REPAIRING CASINGS USING A RED MUD SEALANT COMPOSITIONCLAIM OF PRIORITY

[0001] This application claims priority to U.S. Patent Application No. 19 / 010,304 filed on January 06, 2025, the entire contents of which are hereby incorporated by reference.TECHNICAL FIELD

[0002] This document relates to methods of sealing casing-casing annual leaks and repairing casings using a sealant composition, including red mud, an epoxy resin, and a crosslinker.BACKGROUND

[0003] Red mud, or bauxite residue, is an industrial waste by-product that is formed during the production of aluminum oxide (alumina, AI2O3) using the Bayer process. Red mud is composed of a mixture of solid, metallic oxides, primarily aluminum oxide and silicon dioxide (silica, SiO?). It is basic and typically has a pH ranging from 10-12. About 1-2 tons of red mud is produced for every 1 ton of aluminum oxide production. Over 175 million tons of red mud are produced globally each year.

[0004] The storage of red mud waste requires large spaces of land and poses environmental hazards. Thus, the development of new uses and processes using red mud is desirable.

[0005] Natural resources such as gas, oil, and water residing in a subterranean formation or zone are usually recovered by drilling a wellbore into the subterranean formation while circulating a drilling fluid in the wellbore. After terminating the circulation of the drilling fluid, a string of pipe (e.g., casing) is run in the wellbore. The drilling fluid is then usually circulated downward through the interior of the pipe and upward through the annulus, which is located between the exterior of the pipe and the walls of the wellbore. Casings and casing-casing annuli may become damaged with micro-cracks over time. The use of sealant formulations to repair the damage is needed to maintain the casings and casing-casing annuli for longer lifetimes. Thus, the development of sealant formulations for casing repair applications is desirable.Attorney Docket No. 38136-2610WO1 / SA73010SUMMARY

[0006] Provided in the present disclosure are methods of sealing a casing or a casing-casing annulus, including applying a sealant composition to the casing or the casing-casing annulus, the sealant composition including: red mud; an epoxy resin; and a crosslinker; where the sealant composition does not include cement.

[0007] In some embodiments, the sealant composition includes from about 0.01 wt% to about 75 wt% red mud.

[0008] In some embodiments, the sealant composition includes from about 5 wt% to about 15 wt% red mud.

[0009] In some embodiments, about 80% of the red mud particles have a diameter of less than about 50 pm.

[0010] In some embodiments, the sealant composition includes from about 50 wt% to about 97 wt% epoxy resin.

[0011] In some embodiments, sealant composition includes from about 85 wt% to about 90 wt% epoxy resin.

[0012] In some embodiments, the epoxy resin includes:an aliphatic epoxy resin of formula (I):><where R1is C4-24 hydrocarbylenyl;an alkyl glycidyl ether of formula (II):where m is an integer from 10 to 12;a bisphenol-A-based epoxy resin;a bisphenol-F-based epoxy resin;a Novalak resin; orcombinations thereof.

[0013] In some embodiments, the epoxy resin includes 1,6-hexanediol diglycidyl ether, butyl glycidyl ether, 2,3 -epoxypropyl o-tolyl ether, cyclohexanedimethanol diglydicyl ether, bisphenol-A-epichlorohydrin epoxy, resin-2254, or combinations thereof.Attorney Docket No. 38136-2610WO1 / SA73010

[0014] In some embodiments, the epoxy resin further includes a reactive diluent selected from:a cardanol glycidyl ether derivative;an aliphatic monoglycidyl ether of a C13-15 alcohol;a compound of formula (III):>where R2is a C12-14 hydrocarbyl;or a combination thereof.

[0015] In some embodiments, the epoxy resin includes bisphenol-A-(epichlorohydrin) epoxy resin and an oxirane mono [(Ci2-i4)-alkyloxy)methyl] derivative.

[0016] In some embodiments, the sealant composition includes from about 1 wt% to about 5 wt% crosslinker selected from trimethyl hexamethylene diamine (TMD), diethylenetriamine (DETA), triethylenetetramine (TETA), meta-xylenediamine (MXDA), aminoethylpiperazine (AEP), tetraethylenepentamine (TEPA), polyetheramine, isophoronediamine (IPDA), beta-hydroxyalkyl amide (HAA), diethyltoluenediamine (DETDA), polyoxypropylene diamine (POPDA), and combinations thereof.

[0017] In some embodiments, the sealant composition further includes an accelerator, retarder, and / or weighting material.

[0018] In some embodiments, the sealant composition further includes an emulsifier selected from Table A.

[0019] In some embodiments, the sealant composition includes from about 0.01 wt% to about 50 wt% emulsifier.

[0020] In some embodiments, the sealant composition includes:about 5 wt% to about 15 wt% red mud;about 80 wt% to about 90 wt% epoxy resin; andabout 2 wt% to about 4 wt% crosslinker.

[0021] In some embodiments, the sealant composition includes:about 5 wt% to about 15 wt% red mud;about 80 wt% to about 90 wt% bisphenol-A-epichlorohydrin epoxy resin including an oxirane mono [(C12-14)-alkyloxy)methyl] derivative; andabout 2 wt% to about 4 wt% diethylenetriamine (DETA).

[0022] In some embodiments, the method further includes:mixing the epoxy resin and the crosslinker to form a liquid mixture; andAttorney Docket No. 38136-2610WO1 / SA73010adding the red mud to the liquid mixture to form the sealant composition; before applying the sealant composition to the casing or the casing-casing annulus.

[0023] In some embodiments, an emulsifier is mixed with the epoxy resin and the crosslinker to form the liquid mixture.

[0024] In some embodiments, the liquid mixture is mixed for about 3 min to about 5 min to form the liquid mixture.

[0025] In some embodiments, the sealant composition is mixed for about 3 min to about 5 min after adding the red mud.DESCRIPTION OF DRAWINGS

[0026] FIG. 1 is a photograph showing an exemplary sealant composition including red mud, resin-2254 as the epoxy resin, and Razeen cure-931 as the crosslinker in liquid form in a plastic cup.

[0027] FIG. 2 is a photograph showing an exemplary sealant composition including red mud, resin-2254 as the epoxy resin, and Razeen cure-931 as the crosslinker in solid form in a plastic cup.

[0028] FIG. 3 is a photograph showing an exemplary sealant composition including red mud, resin-2254 as the epoxy resin, and Razeen cure-931 as the crosslinker in solid form after being kept in a water bath at 120 °F for 24 hours.

[0029] FIG. 4 is a photograph showing an exemplary sealant composition including red mud, resin-2254 as the epoxy resin, and Razeen cure-931 as the crosslinker in solid form after being kept in a water bath at 120 °F for 24 hours.DETAILED DESCRIPTION

[0030] The present disclosure relates to sealant compositions including red mud, an epoxy resin, and a crosslinker that can be used for methods of sealing casing-casing annual leaks and repairing casings. The incorporation of red mud into the sealant composition allows for the generation of a hard, rigid gel that can be used to remediate micro-cracks and corrosions in casings and casing-casing annulus.

[0031] In some embodiments, the incorporation of red mud into the sealant compositions produces a hard, rigid material. In some embodiments, the incorporation of red mud into the sealant compositions produces a material with desirable mechanical, thermal, and chemical properties. In some embodiments, the incorporation of red mud into the sealant compositions produces a material with resistance to high temperatures and acids.Attorney Docket No. 38136-2610WO1 / SA73010

[0032] Reference will now be made in detail to certain embodiments of the disclosed subject matter. While the disclosed subject matter will be described in conjunction with the enumerated claims, it will be understood that the exemplified subject matter is not intended to limit the claims to the disclosed subject matter.Definitions

[0033] In this disclosure, the terms “a,” “an,” and “the” are used to include one or more than one unless the context clearly dictates otherwise. The term “or” is used to refer to a nonexclusive “or” unless otherwise indicated. The statement “at least one of A and B” has the same meaning as “A, B, or A and B.” In addition, it is to be understood that the phraseology or terminology employed in this disclosure, and not otherwise defined, is for the purpose of description only and not of limitation. Any use of section headings is intended to aid reading of the document and is not to be interpreted as limiting; information that is relevant to a section heading may occur within or outside of that particular section.

[0034] The term “about” as used herein can allow for a degree of variability in a value or range, for example, within 10% of a stated value or of a stated limit of a range.

[0035] Values expressed in a range format should be interpreted in a flexible manner to include not only the numerical values explicitly recited as the limits of the range, but also to include all the individual numerical values or sub-ranges encompassed within that range as if each numerical value and sub-range is explicitly recited. For example, a range of “about 0.1% to about 5%” or “about 0.1% to 5%” should be interpreted to include not just about 0.1% to about 5%, but also the individual values (for example, 1%, 2%, 3%, and 4%) and the subranges (for example, 0.1% to 0.5%, 1.1% to 2.2%, 3.3% to 4.4%) within the indicated range. The statement “about X to Y” has the same meaning as “about X to about Y,” unless indicated otherwise. Likewise, the statement “about X, Y, or about Z” has the same meaning as “about X, about Y, or about Z,” unless indicated otherwise.

[0036] In the methods described in the present disclosure, the acts can be carried out in any order, except when a temporal or operational sequence is explicitly recited. Furthermore, specified acts can be carried out concurrently unless explicit claim language recites that they be carried out separately. For example, a claimed act of doing X and a claimed act of doing Y can be conducted simultaneously within a single operation, and the resulting process will fall within the literal scope of the claimed process.Red MudAttorney Docket No. 38136-2610WO1 / SA73010

[0037] The sealant compositions of the present disclosure include red mud. In some embodiments, the sealant composition includes about 0.01 percentage by weight (wt%) to about 75 wt%, about 0.05 wt% to about 60 wt%, about 0.1 wt% to about 50 wt%, about 1.0 wt% to about 40 wt%, about 2.0 wt% to about 30 wt%, about 3.0 wt% to about 20 wt%, about 4.0 wt% to about 10 wt%, or about 5.0 wt% to about 8.0 wt% red mud. In some embodiments, the sealant composition includes about 0.01 wt% to about 75 wt% red mud. In some embodiments, the sealant composition includes about 0.05 wt% to about 60 wt% red mud. In some embodiments, the sealant composition includes about 0.1 wt% to about 50 wt% red mud. In some embodiments, the sealant composition includes about 1.0 wt% to about 40 wt% red mud. In some embodiments, the sealant composition includes about 2.0 wt% to about 30 wt% red mud. In some embodiments, the sealant composition includes about 3.0 wt% to about 20 wt% red mud. In some embodiments, the sealant composition includes about 4.0 wt% to about 10 wt% red mud. In some embodiments, the sealant composition includes about 5.0 wt% to about 8.0 wt% red mud.

[0038] In some embodiments, the sealant composition includes about 0.05 wt% to about 75 wt%, about 5 wt% to about 75 wt%, about 10 wt% to about 75 wt%, about 25 wt% to about 75 wt%, or about 50 wt% to about 75 wt% red mud. In some embodiments, the sealant composition includes about 0.05 wt% to about 75 wt% red mud. In some embodiments, the sealant composition includes about 5 wt% to about 75 wt% red mud. In some embodiments, the sealant composition includes about 10 wt% to about 75 wt% red mud. In some embodiments, the sealant composition includes about 25 wt% to about 75 wt% red mud. In some embodiments, the sealant composition includes about 50 wt% to about 75 wt% red mud.

[0039] In some embodiments, the sealant composition includes about 0.01 wt% to about 50 wt%, about 0.01 wt% to about 25 wt%, about 0.01 wt% to about 15 wt%, about 0.01 wt% to about 10 wt%, or about 0.01 wt% to about 5 wt% red mud. In some embodiments, the sealant composition includes about 0.01 wt% to about 50 wt% red mud. In some embodiments, the sealant composition includes about 0.01 wt% to about 25 wt% red mud. In some embodiments, the sealant composition includes about 0.01 wt% to about 15 wt% red mud. In some embodiments, the sealant composition includes about 0.01 wt% to about 10 wt% red mud. In some embodiments, the sealant composition includes about 0.01 wt% to about 5 wt% red mud.

[0040] In some embodiments, the sealant composition includes about 0.1 wt% to about 25 wt%, about 1 wt% to about 20 wt%, about 5 wt% to about 15 wt%, or about 6 wt% to about 14 wt%.Attorney Docket No. 38136-2610WO1 / SA73010

[0041] In some embodiments, the sealant composition includes about 0.1 wt% to about 25 wt% red mud. In some embodiments, the sealant composition includes about 1 wt% to about 20 wt% red mud. In some embodiments, the sealant composition includes about 5 wt% to about 15 wt% red mud. In some embodiments, the sealant composition includes about 6 wt% to about 14 wt% red mud.

[0042] In some embodiments, the sealant composition includes about 6 wt% to about 20 wt%, about 6.5 wt% to about 18 wt%, about 7 wt% to about 16 wt%, about 7.5 wt% to about 15 wt%, or about 8 wt% to about 14 wt% red mud. In some embodiments, the sealant composition includes about 6 wt% to about 20 wt% red mud. In some embodiments, the sealant composition includes about 6.5 wt% to about 18 wt% red mud. In some embodiments, the sealant composition includes about 7 wt% to about 16 wt% red mud. In some embodiments, the sealant composition includes about 7.5 wt% to about 15 wt% red mud. In some embodiments, the sealant composition includes about 8 wt% to about 14 wt% red mud.

[0043] In some embodiments, the sealant composition includes about 8.4 wt% red mud. In some embodiments, the sealant composition includes about 13.5 wt% red mud.

[0044] In some embodiments, about 50% of the red mud particles have a diameter of about 50 micrometers (pm) or less. In some embodiments, about 60% of the red mud particles have a diameter of about 50 pm or less. In some embodiments, about 70% of the red mud particles have a diameter of about 50 pm or less. In some embodiments, about 80% of the red mud particles have a diameter of about 50 pm or less. In some embodiments, about 90% of the red mud particles have a diameter of about 50 pm or less.

[0045] In some embodiments, the red mud particles are about 10 pm to about 100 pm, about 20 pm to about 90 pm, about 30 pm to about 80 pm, about 40 pm to about 70 pm, or about 50 pm to about 60 pm in diameter. In some embodiments, the red mud particles are about 10 pm to about 100 pm in diameter. In some embodiments, the red mud particles are about 20 pm to about 90 pm in diameter. In some embodiments, the red mud particles are about 30 pm to about 80 pm in diameter. In some embodiments, the red mud particles are about 40 pm to about 70 pm in diameter. In some embodiments, the red mud particles are about 50 pm to about 60 pm in diameter.

[0046] In some embodiments, the red mud particles are about 10 pm in diameter. In some embodiments, the red mud particles about 20 pm in diameter. In some embodiments, the red mud particle size is about 30 pm in diameter. In some embodiments, the red mud particle size is about 40 pm in diameter. In some embodiments, the red mud particle size is about 50 pm in diameter. In some embodiments, the red mud particle size is about 60 pm in diameter. In someAttorney Docket No. 38136-2610WO1 / SA73010embodiments, the red mud particle size is about 70 pm in diameter. In some embodiments, the red mud particle size is about 80 pm in diameter. In some embodiments, the red mud particle size is about 90 pm. In some embodiments, the red mud particle size is about 100 pm in diameter.

[0047] In some embodiments, about 80% of the red mud particles have a diameter of about 10 pm or less. In some embodiments, about 80% of the red mud particles have a diameter of about 20 pm or less. In some embodiments, about 80% of the red mud particles have a diameter of about 30 pm or less. In some embodiments, about 80% of the red mud particles have a diameter of about 40 pm or less. In some embodiments, about 80% of the red mud particles have a diameter of about 50 pm or less. In some embodiments, about 80% of the red mud particles have a diameter of about 60 pm or less. In some embodiments, about 80% of the red mud particles have a diameter of about 70 pm or less. In some embodiments, about 80% of the red mud particles have a diameter of about 80 pm or less. In some embodiments, about 80% of the red mud particles have a diameter of about 90 pm or less. In some embodiments, about 80% of the red mud particles have a diameter of about 100 pm or less.

[0048] In some embodiments, the red mud includes a plurality of oxides. In some embodiments, the red mud includes calcium oxide (CaO), silicon dioxide (SiCh), aluminum oxide (AI2O3), iron III oxide (Fe20s), magnesium oxide (MgO), potassium oxide (K2O), and combinations thereof. In some embodiments, the red mud includes a plurality of oxides. In some embodiments, the red mud includes calcium oxide (CaO), silicon dioxide (SiO2), aluminum oxide (AI2O3), iron III oxide (Fe2O3), magnesium oxide (MgO), and potassium oxide (K2O). In some embodiments, the red mud includes calcium oxide (CaO). In some embodiments, the red mud includes silicon dioxide (SiO2). In some embodiments, the red mud includes aluminum oxide (AI2O3). In some embodiments, the red mud includes iron III oxide (Fe2O3). In some embodiments, the red mud includes magnesium oxide (MgO). In some embodiments, the red mud includes potassium oxide (K2O).

[0049] In some embodiments, the red mud includes oxygen (O), sodium (Na), iron (Fe), aluminum (Al), silicon (Si), calcium (Ca), titanium (Ti), sulfur (S), fluorine (F), chlorine (Cl), strontium (Sr), zirconium (Zr), phosphorus (P), magnesium (Mg), chromium (Cr), and combinations thereof. In some embodiments, the red mud includes oxygen (O), sodium (Na), titanium (Ti), sulfur (S), fluorine (F), chlorine (Cl), strontium (Sr), zirconium (Zr), phosphorus (P), magnesium (Mg), and chromium (Cr). In some embodiments, the red mud includes oxygen (O).Attorney Docket No. 38136-2610WO1 / SA73010In some embodiments, the red mud includes sodium (Na). In some embodiments, the red mud includes iron (Fe). In some embodiments, the red mud includes aluminum (Al). In some embodiments, the red mud includes silicon (Si). In some embodiments, the red mud includes calcium (Ca). In some embodiments, the red mud includes titanium (Ti). In some embodiments, the red mud includes sulfur (S). In some embodiments, the red mud includes fluorine (F). In some embodiments, the red mud includes chlorine (Cl). In some embodiments, the red mud includes strontium (Sr). In some embodiments, the red mud includes zirconium (Zr). In some embodiments, the red mud includes phosphorus (P). In some embodiments, the red mud includes magnesium (Mg). In some embodiments, the red mud includes chromium (Cr).Epoxy Resin

[0050] The sealant compositions of the present disclosure contain an epoxy resin. The type of epoxy resin and the concentration of the epoxy resin in the sealant composition may affect the viscosity of the sealant composition before setting.

[0051] The epoxy resin may have a viscosity that enables the sealing composition to be transferred into an annulus between the exterior surface of the tubular string and the wellbore wall or the interior surface of a casing surrounding the tubular string. In some embodiments, the epoxy resin has a viscosity that enables introduction of the sealing composition having the epoxy resin into a wellbore.

[0052] In some embodiments, the sealant composition includes about 30 wt% to about 99 wt%, about 50 wt% to about 95 wt%, about 70 wt% to about 92 wt%, or about 80 wt% to about 90 wt%.

[0053] In some embodiments, the sealant composition includes about 30 wt% to about 99 wt% epoxy resin. In some embodiments, the sealant composition includes about 50 wt% to about 95 wt% epoxy resin. In some embodiments, the sealant composition includes about 70 wt% to about 92 wt% epoxy resin. In some embodiments, the sealant composition includes about 80 wt% to about 90 wt% epoxy resin.

[0054] In some embodiments, the sealant composition includes about 84.4 wt% epoxy resin. In some embodiments, the sealant composition includes about 88.1 wt% epoxy resin.

[0055] In some embodiments, the epoxy resin includes an aliphatic epoxy resin, an alkyl glycidyl ether, a bisphenol-A-based epoxy resin, a bisphenol-F-based epoxy resin, aNovalak resin, or a combination thereof.

[0056] In some embodiments, the epoxy resin includes:an aliphatic epoxy resin of formula (I):Attorney Docket No. 38136-2610WO1 / SA73010<where R1is C4-24 hydrocarbylenyl;an alkyl glycidyl ether of formula (II):where m is an integer 10 to 12;a bisphenol-A-based epoxy resin;a bisphenol-F-based epoxy resin;a Novalak resin; orcombinations thereof.

[0057] In some embodiments, the epoxy resin includes an aliphatic epoxy resin of formula (I):<where R1is C4-24 hydrocarbylenyl.

[0058] In some embodiments, the epoxy resin is of formula (I) and R1is C4-20 hydrocarbylenyl, C4-16 hydrocarbylenyl, C4-12 hydrocarbylenyl, C4-8 hydrocarbylenyl, Ce-24 hydrocarbylenyl, C6-20 hydrocarbylenyl, Ce-i6 hydrocarbylenyl, or Ce-16 hydrocarbylenyl.

[0059] In some embodiments, R1is C4-24 alkylenyl. In some embodiments, R1is C4-24 alkenylenyl. In some embodiments, R1is C4-24 alkynylenyl. In some embodiments, R1is C4-24 cycloalkylenyl. In some embodiments, R1is C4-24 arylenyl.

[0060] In some embodiments, R1is butylenyl. In some embodiments, R1is pentylenyl. In some embodiments, R1is hexylenyl. In some embodiments, R1is heptylenyl. In some embodiments, R1is octylenyl.

[0061] In some embodiments, the epoxy resin includes an alkyl glycidyl ether of formula (II):Attorney Docket No. 38136-2610WO1 / SA73010where m is an integer 10 to 12.

[0062] In some embodiments, m is 10. In some embodiments, m is 11. In some embodiments, m is 12.

[0063] In some embodiments, the epoxy resin includes a bisphenol-A-based epoxy resin.

[0064] In some embodiments, the epoxy resin includes a bisphenol-F-based epoxy resin.

[0065] In some embodiments, the epoxy resin includes a Novalak resin.

[0066] In some embodiments, the epoxy resin includes 1,6-hexanediol diglycidyl ether, butyl glycidyl ether, 2, 3 -epoxypropyl o-tolyl ether, cyclohexanedimethanol diglydicyl ether, bisphenol-A-epichlorohydrin epoxy, or combinations thereof. In some embodiments, the epoxy resin includes 1,6-hexanediol diglycidyl ether. In some embodiments, the epoxy resin includes butyl glycidyl ether. In some embodiments, the epoxy resin includes 2,3-epoxypropyl o-tolyl ether. In some embodiments, the epoxy resin includes cyclohexanedimethanol diglydicyl ether. In some embodiments, the epoxy resin includes bisphenol-A-epichlorohydrin epoxy.

[0067] An epoxy resin may have an epoxy equivalent weight. In some embodiments, the epoxy equivalent weight is equal to the molecular weight of the epoxy resin divided by the average number of epoxy groups in the epoxy resin. In some embodiments, the epoxy equivalent weight of an epoxy resin may be determined according to the ASTM-D1652 method.

[0068] In some embodiments, the epoxy resin has an epoxy equivalent weight of about 100 to about 500, about 150 to about 450, about 200 to about 400, or about 250 to about 350 epoxy equivalents per gram. In some embodiments, the epoxy resin has an epoxy equivalent weight of about 100 to about 500 epoxy equivalents per gram. In some embodiments, the epoxy resin has an epoxy equivalent weight of about 150 to about 450 epoxy equivalents per gram. In some embodiments, the epoxy resin has an epoxy equivalent weight of about 200 to about 400 epoxy equivalents per gram. In some embodiments, the epoxy resin has an epoxy equivalent weight of about 250 to about 350 epoxy equivalents per gram.

[0069] In some embodiments, the epoxy resin has an epoxy equivalent weight of about 170 to about 350 epoxy equivalents per gram.

[0070] In some embodiments, the epoxy resin has an epoxy value of 2.0 to 8.0, 3.0 to 7.0, or 4.0 to 6.0 epoxy equivalents per kilogram of the epoxy resin. In some embodiments, the epoxy resin has an epoxy value of 2.0 to 8.0 epoxy equivalents per kilogram of the epoxy resin. In some embodiments, the epoxy resin has an epoxy value of 3.0 to 7.0 epoxy equivalents per kilogram of the epoxy resin. In some embodiments, the epoxy resin has an epoxy value of 4.0 to 6.0 epoxy equivalents per kilogram of the epoxy resin.Attorney Docket No. 38136-2610WO1 / SA73010

[0071] In some embodiments, the epoxy resin has an epoxy value of 4.5 to 5.5 epoxy equivalents per kilogram of the epoxy resin.

[0072] In some embodiments, the epoxy resin further includes a reactive diluent. The type and concentration of reactive diluent may influence the viscosity, flexibility, hardness, chemical resistance, mechanical properties, plasticizing effect, reactivity, crosslinking density, or other properties of the epoxy resin. In some embodiments, the reactive diluent may be added to the epoxy resin to change the viscosity of the epoxy resin, such as to reduce the viscosity of the epoxy resin. In some embodiments, the reactive diluents may be added to improve at least one of the adhesion, the flexibility, and the solvent resistance of the epoxy resin.

[0073] In some embodiments, the epoxy resin includes an amount of reactive diluent that reduces the viscosity of the epoxy resin. In some embodiments, the epoxy resin includes an amount of reactive diluent that modifies one or more of the adhesion, flexibility, or solvent resistance of the epoxy resin.

[0074] In some embodiments, the reactive diluent is:a cardanol glycidyl ether derivative;an aliphatic monoglycidyl ether of a C13-15 alcohol;a compound of formula (III):where R2is a C12-14 hydrocarbyl;or a combination thereof.

[0075] In some embodiments, the reactive diluent is a cardanol glycidyl ether derivative.

[0076] In some embodiments, the reactive diluent is an aliphatic monoglycidyl ether of a C13-15 alcohol.

[0077] In some embodiments, the reactive diluent is a compound of formula (III):where R2is a C12-14 hydrocarbyl;or a combination thereof.

[0078] In some embodiments, R2is C12 hydrocarbylenyl. In some embodiments, R2is C13 hydrocarbyl enyl. In some embodiments, R2is C14 hydrocarbylenyl.

[0079] In some embodiments, R2is C12-14 alkylenyl. In some embodiments, R2is C12-14 alkenylenyl. In some embodiments, R2is C12-14 alkynylenyl. In some embodiments, R2is C12-14 cycloalkylenyl. In some embodiments, R2is C12-14 arylenyl.Attorney Docket No. 38136-2610WO1 / SA73010

[0080] In some embodiments, the reactive diluent is propylene glycol diglycidyl ether, butanediol diglycidyl ether, propanetriol triglycidyl ether, an oxirane mono [(Ci2-i4)-alkyloxy) methyl] derivative, or a combination thereof. In some embodiments, the reactive diluent is propylene glycol diglycidyl ether. In some embodiments, the reactive diluent is butanediol diglycidyl ether. In some embodiments, the reactive diluent is propanetriol triglycidyl ether. In some embodiments, the reactive diluent is an oxirane mono [(Ci2-i4)-alkyloxy) methyl] derivative.

[0081] In some embodiments, the epoxy resin includes about 0.1 wt% to about 50 wt% reactive diluent with respect to the total weight of the epoxy resin.

[0082] In some embodiments, the epoxy resin includes about 1.0 wt% to about 30 wt%, about 5.0 wt% to about 20 wt%, or about 10 wt% to about 15 wt% reactive diluent with respect to the total weight of the epoxy resin. In some embodiments, the epoxy resin includes about 1.0 wt% to about 30 wt% reactive diluent with respect to the total weight of the epoxy resin. In some embodiments, the epoxy resin includes about 5.0 wt% to about 20 wt% reactive diluent with respect to the total weight of the epoxy resin. In some embodiments, the epoxy resin includes about 10 wt% to about 15 wt% reactive diluent with respect to the total weight of the epoxy resin.

[0083] In some embodiments, the epoxy resin includes about 1.0 wt% reactive diluent with respect to the total weight of the epoxy resin. In some embodiments, the epoxy resin includes about 5.0 wt% reactive diluent with respect to the total weight of the epoxy resin. In some embodiments, the epoxy resin includes about 10 wt% reactive diluent with respect to the total weight of the epoxy resin. In some embodiments, the epoxy resin includes about 15 wt% reactive diluent with respect to the total weight of the epoxy resin. In some embodiments, the epoxy resin includes about 20 wt% reactive diluent with respect to the total weight of the epoxy resin. In some embodiments, the epoxy resin includes about 30 wt% reactive diluent with respect to the total weight of the epoxy resin.

[0084] In some embodiments, the epoxy resin includes bisphenol-A-(epichlorohydrin) epoxy resin and an oxirane mono [(Ci2-i4)-alkyloxy)methyl] derivative and has:an epoxy value of about 4.76 to about 5.26 epoxy equivalents per kilogram of epoxy resin;an epoxy equivalent weight of about 190 grams per equivalent (g / eq) to about 210 g / eq; and / ora dynamic viscosity of about 600 millipascal-second (mPa s) to about 1200 mPa s.Attorney Docket No. 38136-2610WO1 / SA73010

[0085] In some embodiments, the epoxy resin includes bisphenol-A-(epichlorohydrin) epoxy resin and an oxirane mono [(Ci2-i4)-alkyloxy)methyl] derivative and has:an epoxy value of about 4.76 epoxy equivalents per kilogram of epoxy resin to about 5.26 epoxy equivalents per kilogram of epoxy resin;an epoxy equivalent weight of about 190 g / eq to about 210 g / eq; and / ora dynamic viscosity of about 600 mPa- s to about 900 mPa s.

[0086] In some embodiments, the epoxy resin includes 2,3-epoxypropyl-o-tolyl ether and has:an epoxy equivalent weight of about 170 g / eq to about 190 g / eq; and / or a dynamic viscosity of about 7 mPa- s to about 10 mPa s.

[0087] In some embodiments, the epoxy resin includes an alkyl glycidyl ether of formula (II):where m is an integer 10 to 12, and has:an epoxy equivalent weight of about 270 g / eq to about 305 g / eq; and / ora dynamic viscosity of about 5 mPa s to about 12 mPa s.

[0088] In some embodiments, the epoxy resin includes 1,6-hexanediol diclycidyl ether and has:an epoxy equivalent weight of 270 g / eq to 305 g / eq; and / ora dynamic viscosity of 5 mPa- s to 12 mPa s.

[0089] In some embodiments, the epoxy resin has:an epoxy equivalent weight of about 150 g / eq to about 170 g / eq; and / ora dynamic viscosity of about 20 mPa s to about 30 mPa s.

[0090] In some embodiments, the epoxy resin is selected from Table 1. In some embodiments, the epoxy resin includes one or more epoxy resin selected from Table 1.

[0091] Table 1. List of Exemplary Epoxy Resin and Trade NamesAttorney Docket No. 38136-2610WO1 / SA73010Crosslinker

[0092] The sealant compositions of the present disclosure include a crosslinker. The type of crosslinker and the concentration of the crosslinker in the sealant composition may affect the viscosity of the sealant composition before setting. In some embodiments, the crosslinker increases the viscosity of the sealant composition before setting. In some embodiments, an increased concentration of the crosslinker in the sealant composition increases the viscosity of the sealant composition before setting.

[0093] The type of crosslinker and the concentration of the crosslinker in the sealant composition may affect the setting time of the sealant composition. In some embodiments, the crosslinker is used to control the setting time of the sealant composition. In some embodiments, an increased concentration of the crosslinker in the sealant composition decreases the setting time of the sealant composition.

[0094] In some embodiments, the crosslinker includes an aliphatic amine, a cycloaliphatic amine, a modified cycloaliphatic amine, an aliphatic polyamine, a cycloaliphatic polyamine, a modified polyamines, an amine adducts, and combinations thereof.

[0095] In some embodiments, the crosslinker includes trimethyl hexamethylene diamine (TMD), diethylenetriamine (DETA), triethylenetetramine (TETA), meta-xylenediamine (MXDA), aminoethylpiperazine (AEP), tetraethylenepentamine (TEPA), polyetheramine, isophoronediamine (IPDA), Ac / a-hydroxy alkyl amide (HAA), diethyltoluenediamine (DETDA), polyoxypropylene diamine (POPDA), and combinations thereof.

[0096] In some embodiments, the crosslinker includes diethylenetriamine (DETA), diethyltoluenediamine (DETDA), polyoxypropylene diamine (POPDA), and combinations thereof.

[0097] In some embodiments, the crosslinker includes trimethyl hexamethylene diamine (TMD). In some embodiments, the crosslinker includes meta-xylenediamine (MXDA). InAttorney Docket No. 38136-2610WO1 / SA73010some embodiments, the crosslinker includes aminoethylpiperazine (AEP). In some embodiments, the crosslinker includes tetraethylenepentamine (TEPA). In some embodiments, the crosslinker includes polyetheramine, isophoronediamine (IPDA). In some embodiments, the crosslinker includes Ac / a-hydroxy alkyl amide (HAA). In some embodiments, the crosslinker includes diethylenetriamine (DETA). In some embodiments, the crosslinker includes diethyltoluenediamine (DETDA). In some embodiments, the crosslinker includes polyoxypropylene diamine (POPDA).

[0098] In some embodiments, the sealant composition includes about 0.1 wt% to about 50 wt% crosslinker. In some embodiments, the sealant composition includes about 1.0 wt% to about 40 wt% crosslinker. In some embodiments, the sealant composition includes about 5.0 wt% to about 30 wt% crosslinker. In some embodiments, the sealant composition includes about 10 wt% to about 25 wt% crosslinker. In some embodiments, the sealant composition includes about 12 wt% to about 20 wt% crosslinker.

[0099] In some embodiments, the sealant composition includes about 1.0 wt% to about 10 wt% crosslinker. In some embodiments, the sealant composition includes about 1.5 wt% to about 8.0 wt% crosslinker. In some embodiments, the sealant composition includes about 2.0 wt% to about 6.0 wt% crosslinker. In some embodiments, the sealant composition includes about 2.0 wt% to about 4.0 wt% crosslinker.

[0100] In some embodiments, the sealant composition includes about 1.0 wt% crosslinker. In some embodiments, the sealant composition includes about 1.5 wt% crosslinker. In some embodiments, the sealant composition includes about 2.0 wt% crosslinker. In some embodiments, the sealant composition includes about 2.1 wt% crosslinker. In some embodiments, the sealant composition includes about 3.0 wt% crosslinker. In some embodiments, the sealant composition includes about 4.0 wt% crosslinker. In some embodiments, the sealant composition includes about 5.0 wt% crosslinker. In some embodiments, the sealant composition includes about 6.0 wt% crosslinker. In some embodiments, the sealant composition includes about 7.0 wt% crosslinker. In some embodiments, the sealant composition includes about 8.0 wt% crosslinker. In some embodiments, the sealant composition includes about 9.0 wt% crosslinker. In some embodiments, the sealant composition includes about 10 wt% crosslinker.

[0101] In some embodiments, the crosslinker is selected from Table 2. In some embodiments, the crosslinker includes one or more crosslinkers selected from Table 2.

[0102] Table 2. List of Exemplary Epoxy Resin and Trade NamesAttorney Docket No. 38136-2610WO1 / SA73010Emulsifiers

[0103] The sealant compositions of the present disclosure can include an emulsifier. The type of emulsifier and the concentration of the emulsifier in the sealant composition may affect the mixing of the sealant composition.

[0104] In some embodiments, the sealant composition further includes an emulsifier.

[0105] In some embodiments, the emulsifier is selected Table 3.

[0106] In some embodiments, the emulsifier includes one or more emulsifiers selected from Table 3.

[0107] Table 3. List of Emulsifiers

[0108] In some embodiments, the sealant composition includes about 0.01 wt% to about 50 wt% emulsifier. In some embodiments, the sealant composition includes about 0.1 wt% to about 40 wt% emulsifier. In some embodiments, the sealant composition includes about 1.0 wt% to about 30 wt% emulsifier. In some embodiments, the sealant composition includes aboutAttorney Docket No. 38136-2610WO1 / SA730105.0 wt% to about 25 wt% emulsifier. In some embodiments, the sealant composition includes about 10 wt% to about 20 wt% emulsifier.

[0109] In some embodiments, the sealant composition does not include water.Additional Components

[0110] The sealant compositions of the present disclosure can contain one or more additional components. In some embodiments, the sealant composition further includes an accelerator.

[0111] In some embodiments, the accelerator is an alcohol, a phenol, an aminoalcohol, an amine, or combinations thereof. In some embodiments, the accelerator is an alcohol. In some embodiments, the accelerator a phenol. In some embodiments, the accelerator is an aminoalcohol. In some embodiments, the accelerator is an amine.

[0112] In some embodiments, the accelerator is benzyl alcohol, mono-nonylphenol, triethanolamine (TEA), amino-n-propyl diethanolamine, n,n-dimethyldipropylenetramine, and combinations thereof. In some embodiments, the accelerator is benzyl alcohol. In some embodiments, the accelerator is mono-nonylphenol. In some embodiments, the accelerator is triethanolamine (TEA). In some embodiments, the accelerator is amino-n-propyl diethanolamine. In some embodiments, the accelerator is n,n-dimethyldipropylenetramine.

[0113] In some embodiments, the sealant composition includes about 0.01 wt% to about 5.0 wt% accelerator. In some embodiments, the sealant composition includes about 0.1 wt% to about 4.0 wt% accelerator. In some embodiments, the sealant composition includes about 1.0 wt% to about 3.0 wt% accelerator. In some embodiments, the sealant composition includes about 1.5 wt% to about 2.5 wt% accelerator.

[0114] In some embodiments, the sealant composition further includes a retarder.

[0115] In some embodiments, the retarder is a lignin, a gum, a starch, a lignosulphonate derivative, and combinations thereof. In some embodiments, the retarder is a lignin. In some embodiments, the retarder is a gum. In some embodiments, the retarder is a starch. In some embodiments, the retarder is a lignosulphonate derivative.

[0116] In some embodiments, the sealant composition further includes a weighting material.

[0117] In some embodiments, the weighting material has a specific gravity about 2 to about 6. In some embodiments, the weighting material has a specific gravity about 3 to about 5.

[0118] In some embodiments, the weighting material is sand. In some embodiments, the weighting material is hematite. In some embodiments, the weighting material is barite (bariumAttorney Docket No. 38136-2610WO1 / SA73010sulfate). In some embodiments, the weighting material is calcium carbonate. In some embodiments, the weighting material is siderite. In some embodiments, the weighting material is ilmenite. In some embodiments, the weighting material is silica sand. In some embodiments, the weighting material is manganese oxide (MnO). In some embodiments, the weighting material is hausmanite. In some embodiments, the weighting material is manganese tetraoxide (MmC ). In some embodiments, the weighting material is zinc oxide. In some embodiments, the weighting material is zirconium oxide. In some embodiments, the weighting material is iron oxide. In some embodiments, the weighting material is fly ash.

[0119] In some embodiments, the sealant composition includes about 0.1 wt% to about 40 wt% weighting material. In some embodiments, the sealant composition includes about 1.0 wt% to about 30 wt% weighting material. In some embodiments, the sealant composition includes about 5.0 wt% to about 20 wt% weighting material. In some embodiments, the sealant composition includes about 10 wt% to about 15 wt% weighting material.

[0120] In some embodiments, the sealant composition further includes cardanol liquid, polyacrylate flow agents, and combinations thereof. In some embodiments, the sealant composition further includes cardanol liquid and polyacrylate flow agents. In some embodiments, the sealant composition further includes cardanol liquid. In some embodiments, the sealant composition further includes polyacrylate flow agents.

[0121] In some embodiments, the sealant composition does not include an alkaline activator. In some embodiments, the sealant composition does not include a sodium hydroxide solution. In some embodiments, the sealant composition does not include a sodium hydroxide solution having a pH of 10.0 or greater. In some embodiments, the sealant composition does not include a sodium hydroxide solution having a pH of 12.0 or greater.Sealant Compositions

[0122] In some embodiments, the sealant composition includes:about 5 wt% to about 15 wt% red mud;about 80 wt% to about 90 wt% epoxy resin; andabout 2 wt% to about 4 wt% crosslinker.

[0123] In some embodiments, the sealant composition includes:about 13.5 wt% red mud;about 84.4 wt% epoxy resin; andabout 2.1 wt% crosslinker.

[0124] In some embodiments, the sealant composition includes:Attorney Docket No. 38136-2610WO1 / SA73010about 8.4 wt% red mud;about 88.1 wt% epoxy resin; andabout 3.5 wt% crosslinker.

[0125] In some embodiments, the sealant composition includes:about 5 wt% to about 15 wt% red mud;about 80 wt% to about 90 wt% bisphenol-A-epichlorohydrin epoxy resin including an oxirane mono [(Ci2-i4)-alkyloxy)methyl] derivative; andabout 2 wt% to about 4 wt% diethylenetriamine (DETA).

[0126] In some embodiments, the sealant composition includes:about 13.5 wt% red mud;about 84.4 wt% bisphenol-A-epichlorohydrin epoxy resin including an oxirane mono [(Ci2-i4)-alkyloxy)methyl] derivative; andabout 2.1 wt% diethylenetriamine (DETA).

[0127] In some embodiments, the sealant composition includes:about 8.4 wt% red mud;about 88.1 wt% bisphenol-A-epichlorohydrin epoxy resin including an oxirane mono [(Ci2-i4)-alkyloxy)methyl] derivative; andabout 3.5 wt% di ethylenetriamine (DETA).

[0128] In some embodiments, the sealant composition has a density of about 25 pound mass per cubic foot (lbm / ft3) to about 250 lbm / ft3. In some embodiments, the sealant composition has a density of about 35 lbm / ft3to about 225 lbm / ft3. In some embodiments, the sealant composition has a density of about 45 lbm / ft3to about 200 lbm / ft3. In some embodiments, the sealant composition has a density of about 55 lbm / ft3to about 170 lbm / ft3. In some embodiments, the sealant composition has a density of about 60 lbm / ft3to about 140 lbm / ft3. In some embodiments, the sealant composition has a density of about 65 lbm / ft3to about 110 lbm / ft3. In some embodiments, the sealant composition has a density of about 70 lbm / ft3to about 80 lbm / ft3.

[0129] In some embodiments, the sealant composition has a density of about 25 lbm / ft3. In some embodiments, the sealant composition has a density of about 35 lbm / ft3. In some embodiments, the sealant composition has a density of about 45 lbm / ft3. In some embodiments, the sealant composition has a density of about 55 lbm / ft3. In some embodiments, the sealant composition has a density of about 65 lbm / ft3. In some embodiments, the sealant composition has a density of about 70 lbm / ft3. In some embodiments, the sealant composition has a density of about 72 lbm / ft3. In some embodiments, the sealant composition has a density of about 74Attorney Docket No. 38136-2610WO1 / SA73010lbm / ft3. In some embodiments, the sealant composition has a density of about 75 lbm / ft3. In some embodiments, the sealant composition has a density of about 80 lbm / ft3. In some embodiments, the sealant composition has a density of about 110 lbm / ft3. In some embodiments, the sealant composition has a density of about 140 lbm / ft3. In some embodiments, the sealant composition has a density of about 170 lbm / ft3. In some embodiments, the sealant composition has a density of about 200 lbm / ft3. In some embodiments, the sealant composition has a density of about 225 lbm / ft3. In some embodiments, the sealant composition has a density of about 250 lbm / ft3.

[0130] Thickening time is a measurement of the time during which the sealant composition remains in a fluid state and is capable of being pumped. In some embodiments, the thickening time is measured from the time that mixing stops after the addition of red mud, epoxy resin, crosslinker, accelerator, retarder, weighting material, and / or emulsifier until the sealant composition can no longer be pumped.

[0131] In some embodiments, the sealant composition has a thickening time of about 0.5 hours (h) to about 12.0 h at 38 °C. In some embodiments, the sealant composition has a thickening time of about 1.0 h to about 10.0 h at 38 °C. In some embodiments, the sealant composition has a thickening time of about 2.0 h to about 8.0 h at 38 °C. In some embodiments, the sealant composition has a thickening time of about 3.0 h to about 6.0 h at 38 °C. In some embodiments, the sealant composition has a thickening time of about 4.0 h to about 5.0 h at 38

[0132] In some embodiments, the sealant composition has a thickening time of about 6.0 h to about 7.0 h at 38 °C.

[0133] In some embodiments, the sealant composition has a thickening time of greater than about 0.5 h, about 1.0 h, about 1.25 h, about 1.5 h, about 1.75 h, about 2.0 h, about 2.5 h, about 3.0 h, about 3.5 h, about 4.0 h, about 5.0 h, about 6.0 h, about 7.0 h, about 8.0 h, about 10.0 h, or about 12.0 h at 38 °C.

[0134] In some embodiments, the sealant composition has a thickening time of greater than about 1.0 h at 38 °C. In some embodiments, the sealant composition has a thickening time of greater than about 1.25 h at 38 °C. In some embodiments, the sealant composition has a thickening time of greater than about 1.5 h at 38 °C. In some embodiments, the sealant composition has a thickening time of greater than about 1.75 h at 38 °C. In some embodiments, the sealant composition has a thickening time of greater than about 2.0 h at 38 °C. In some embodiments, the sealant composition has a thickening time of greater than about 2.5 h at 38 °C. In some embodiments, the sealant composition has a thickening time of greater than aboutAttorney Docket No. 38136-2610WO1 / SA730103.0 h at 38 °C. In some embodiments, the sealant composition has a thickening time of greater than about 3.5 h at 38 °C. In some embodiments, the sealant composition has a thickening time of greater than about 4.0 h at 38 °C. In some embodiments, the sealant composition has a thickening time of greater than about 5.0 h at 38 °C. In some embodiments, the sealant composition has a thickening time of greater than about 6.0 h at 38 °C. In some embodiments, the sealant composition has a thickening time of greater than about 8.0 h at 38 °C. In some embodiments, the sealant composition has a thickening time of greater than about 10.0 h at 38 °C. In some embodiments, the sealant composition has a thickening time of greater than about 12.0 h at 38 °C.

[0135] In some embodiments, the sealant composition has a thickening time of about 0.5 h to about 50.0 h at room temperature. In some embodiments, the sealant composition has a thickening time of about 5.0 h to about 40.0 h at room temperature.

[0136] In some embodiments, the sealant composition has a thickening time of about 0.5 h to about 15.0 h at room temperature. In some embodiments, the sealant composition has a thickening time of about 5.0 h to about 10.0 h at room temperature.

[0137] In some embodiments, the sealant composition has a thickening time of about 25.0 h to about 50.0 h at room temperature. In some embodiments, the sealant composition has a thickening time of about 30.0 h to about 40.0 h at room temperature.

[0138] In some embodiments, the sealant composition has a thickening time of greater than about 0.5 h, about 1.0 h, about 1.5 h, about 2.0 h, about 5.0 h, about 10.0 h, about 25.0 h, about 30.0 h, about 35.0 h, about 40.0 h, about 45.0 h, or about 50.0 h at room temperature.

[0139] In some embodiments, the sealant composition has a curing time of about 2.0 h to about 10.0 h. In some embodiments, the sealant composition has a curing time of about 3.0 h to about 8.0 h. In some embodiments, the sealant composition has a curing time of about 4.0 h to about 6.0 h.

[0140] Curing time is a measurement of the time during which the sealant composition reaches maximum hardness. In some embodiments, the curing time is measured from the time that mixing stops after the addition of red mud, epoxy resin, crosslinker, accelerator, retarder, weighting material, and / or emulsifier until the sealant composition reaches maximum hardness.

[0141] In some embodiments, the sealant composition has a curing time of about 2.0 h. In some embodiments, the sealant composition has a curing time of about 3.0 h. In some embodiments, the sealant composition has a curing time of about 4.0 h. In some embodiments, the sealant composition has a curing time of about 5.0 h. In some embodiments, the sealant composition has a curing time of about 6.0 h. In some embodiments, the sealant compositionAttorney Docket No. 38136-2610WO1 / SA73010has a curing time of about 7.0 h. In some embodiments, the sealant composition has a curing time of about 8.0 h. In some embodiments, the sealant composition has a curing time of about 9.0 h. In some embodiments, the sealant composition has a curing time of about 10.0 h.Methods of Preparing Sealant Compositions

[0142] The present disclosure relates to methods of preparing sealant compositions including red mud; an epoxy resin; and a crosslinker, the method including:combining liquid materials, including the epoxy resin and the crosslinker; mixing the liquid materials;combining solid materials with the liquid materials, where the solid materials include red mud;mixing the combined solid materials and liquid materials, thereby forming the sealant composition.

[0143] In some embodiments, an emulsifier is combined with the epoxy resin and the crosslinker.

[0144] In some embodiments, the liquid materials are mixed for about 0.5 minutes (min) to about 60 min, about 1 min to about 30 min, about 2 min to about 15 min, or about 3 min to about 5 min. In some embodiments, the liquid materials are mixed for about 0.5 min to about 60 min. In some embodiments, the liquid materials are mixed for about 1 min to about 30 min. In some embodiments, the liquid materials are mixed for about 2 min to about 15 min. In some embodiments, the liquid materials are mixed for about 3 min to about 5 min.

[0145] In some embodiments, the combined solid materials and liquid materials are mixed for about 0.5 min to about 60 min, about 1 min to about 30 min, about 2 min to about 15 min, or about 3 min to about 5 min. In some embodiments, the combined solid materials and liquid materials are mixed for about 0.5 min to about 60 min. In some embodiments, the combined solid materials and liquid materials are mixed for about 1 min to about 30 min. In some embodiments, the combined solid materials and liquid materials are mixed for about 2 min to about 15 min. In some embodiments, the combined solid materials and liquid materials are mixed for about 3 min to about 5 min.

[0146] In some embodiments, the combined solid materials and liquid materials are mixed until the sealant composition is homogeneous.Methods of Repairing Casings and Sealing Casing-Casing Annulus LeaksAttorney Docket No. 38136-2610WO1 / SA73010

[0147] The present disclosure relates to methods of sealing a casing or a casing-casing annulus, including: applying a sealant composition to the casing or the casing-casing annulus, the sealant composition including: red mud; an epoxy resin; and a crosslinker; where the sealant composition does not include cement.

[0148] In some embodiments, the method further includes: mixing the epoxy resin and the crosslinker to form a liquid mixture; and adding the red mud to the liquid mixture to form the sealant composition; before applying the sealant composition to the casing or the casing-casing annulus.

[0149] In some embodiments, the sealant composition is applied to a casing.

[0150] In some embodiments, the sealant composition is applied to a casing-casing annulus.

[0151] In some embodiments, an emulsifier is mixed with the epoxy resin and the crosslinker to form the liquid mixture.

[0152] In some embodiments, the liquid mixture is mixed for about 0.5 min to about 30 min, about 1 min to about 15 min, about 2 min to about 10 min, or about 3 min to about 5 min to form the liquid mixture.

[0153] In some embodiments, the liquid mixture is mixed for about 0.5 min to about 30 min to form the liquid mixture. In some embodiments, the liquid mixture is mixed for about 1 min to about 15 min to form the liquid mixture. In some embodiments, the liquid mixture is mixed for about 2 min to about 10 min to form the liquid mixture. In some embodiments, the liquid mixture is mixed for about 3 min to about 5 min to form the liquid mixture.

[0154] In some embodiments, the sealant composition is mixed for about 0.5 minutes (min) to about 30 min, about 1 min to about 15 min, about 2 min to about 10 min, or about 3 min to about 5 min after adding the red mud.

[0155] In some embodiments, the sealant composition is mixed for about 0.5 min to about 30 min after adding the red mud. In some embodiments, the sealant composition is mixed for about 1 min to about 15 min after adding the red mud. In some embodiments, the sealant composition is mixed for about 2 min to about 10 min after adding the red mud. In some embodiments, the sealant composition is mixed for about 3 min to about 5 min after adding the red mud.

[0156] In some embodiments, the cured sealant composition is capable of withstanding about 10 pounds per square inch (psi) to about 5,000,000 psi without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding about 14 psi to about 4,000,000 psi without failing or deteriorating to allow liquids or gases to penetrate into orAttorney Docket No. 38136-2610WO1 / SA73010through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding about 1,000 psi to about 3,500,000 psi without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding about 10,000 psi to about 3,000,000 psi without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding about 100,000 psi to about 2,500,000 psi without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding about 1,000,000 psi to about 2,000,000 psi without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition.

[0157] In some embodiments, the cured sealant composition is capable of withstanding about 10 psi without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding about 14 psi without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding about 1,000 psi without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding about 10,000 psi without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding about 100,000 psi without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding about 1,000,000 psi without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding about 1,500,000 psi without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding about 2,000,000 psi without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding about 2,500,000 psi without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding about 3,000,000 psi without failing or deteriorating to allow liquids or gases to penetrate intoAttorney Docket No. 38136-2610WO1 / SA73010or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding about 3,500,000 psi without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding about 4,000,000 psi without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding about 4,500,000 psi without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding about 5,000,000 psi without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition.

[0158] In some embodiments, the cured sealant composition is capable of withstanding temperatures of about 10 °C to about 225 °C without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding temperatures of about 20 °C to about 205 °C without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding temperatures of about 40 °C to about 200 °C without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding temperatures of about 60 °C to about 180 °C without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding temperatures of about 80 °C to about 160 °C without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding temperatures of about 100 °C to about 140 °C without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition.

[0159] In some embodiments, the cured sealant composition is capable of withstanding temperatures of about 20 °C without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding temperatures of about 40 °C without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding temperatures of about 60 °C without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the curedAttorney Docket No. 38136-2610WO1 / SA73010sealant composition is capable of withstanding temperatures of about 80 °C without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding temperatures of about 100 °C without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding temperatures of about 120 °C without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding temperatures of about 140 °C without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding temperatures of about 160 °C without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding temperatures of about 180 °C without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding temperatures of about 200 °C without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding temperatures of about 205 °C without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition. In some embodiments, the cured sealant composition is capable of withstanding temperatures of about 225 °C without failing or deteriorating to allow liquids or gases to penetrate into or through the cured sealant composition.EXAMPLES

[0160] Example 1. Analysis of Red Mud Samples

[0161] Wavelength dispersive X-ray fluorescence (WDXRF) may be used to conduct elemental analysis. A sample of red mud was homogenized and manually grounded by an agate mortar and pestle for several minutes to achieve fine particle size. Then, 4 grams of the red mud powder was mixed well and homogenized with 0.9 grams of a binder (Licowax C micropowder PM (Hoechstwax)). The powder was pressed with 20 tons of pressure to a pellet with 31 mm diameter. WDXRF analysis was performed on the sample using the standard-less Omnian 27 method. The composition is shown in Table 4.

[0162] Table 4. WDXRF Analysis of a Red Mud SampleAttorney Docket No. 38136-2610WO1 / SA73010

[0163] Elemental analysis of ten red mud sample was conducted. Table 5 below shows the average elemental composition from each sample, as well as the average element composition. The analyzed samples show a high percentage of sodium.

[0164] Table 5. Elemental Analysis of Ten Red Mud Samples

[0165] Example 2. Preparation and Evaluation of Sealant Compositions

[0166] Two testing formulations were prepared for further evaluation, Formula #1 and Formula #2. The composition and density of each of Formula #1 and Formula #2 is summarized below in Table 6.

[0167] Table 6. Composition and Density of Formula #1 and Formula #2Attorney Docket No. 38136-2610WO1 / SA73010

[0168] Example 3. Evaluation of the Rheology of Formulation #1

[0169] A sealant composition slurry having red mud behaves as a rigid body at lesser shear stress but flows as a viscous fluid at a greater shear stress. The rheological behavior of the sealant composition may be determined by measuring the shear stress on the resin system at different shear rates, which may be accomplished by measuring the shear stress and / or shear rate on the resin system using a FANN® Model 35 viscometer operated at 3 rpm, 6 rpm, 100 rpm, 200 rpm, 300 rpm, or 600 rpm, for example. A Bingham plastic fluid may be modeled by Equation 1.T = (PV)Y + 4.79YP Equation 1 whereT = shear stress (measured in dynes per square centimeter (dyne / cm2))PV = plastic viscosity (measured in cP)Y = shear rate (measured in s'1)YP = yield point (measured in lbf / 100ft2)

[0170] The rheology of the sealant composition slurry may be evaluated from the plastic viscosity (PV) and the yield point (YP), which are parameters from the Bingham plastic rheology model. PV is related to the resistance of the sealant composition to flow due to mechanical interaction between the solids of the mixture and represents the viscosity of the sealant composition slurry extrapolated to infinite shear rate. In other words, the PV is the slope of the shear stress versus shear rate curve of the Bingham plastic model. The PV reflects the type and concentration of the solids in the sealant composition, and a lesser PV is preferred. The PV of the sealant composition may be estimated by measuring the shear stress of theAttorney Docket No. 38136-2610WO1 / SA73010sealant composition using a FANN® Model 35 viscometer at shear rates of 300 rpm and 600 rpm and subtracting the 300 rpm shear stress measurement from the 600 rpm shear stress measurement according to Equation 2.PV = 06oo - 03oo Equation 2wherePV = plastic viscosity (measured in cP)Oeoo = shear stress viscometer reading at 600 rpm (measured in Ibf / 100ft2)6300 = shear stress viscometer reading at 300 rpm (measured in Ibf / 100ft2)

[0171] YP represents the shear stress less than which the sealant composition behaves as a rigid body and greater than which the sealant composition flows as a viscous fluid. In other words, the YP represents the amount of stress required to move the resin system from a static condition. The yield point is the resistance of initial flow of a fluid, or the stress required in order to move the fluid. It can be simply stated that the yield point is the attractive force among colloidal particles in the resin system mixture. The YP of the resin system composition may be estimated from the PV from Equation 1 by subtracting the PV from Equation 3 from the shear stress of the sealant composition measured at 300 rpm according to Equation 3.YP = 03OO— PV Equation 3

[0172] The YP is expressed as a force per area, such as in field units of lbf / 100ft2, for example. The YP may be converted to SI units of dyne / cm2, as 1 lbf / 100ft2= 4.79 dyne / cm2. The rheology of Formulation #1 was evaluated at room temperature. The results are summarized below in Table 7.

[0173] Table 7. Rheology Testing of Formulation #1Attorney Docket No. 38136-2610WO1 / SA73010

[0174] Example 4. Evaluation of the Thickening Time of Formulation #1 and Formulation #2

[0175] The thickening time of Formulation #1 and Formulation #2 were evaluated at room temperature. Visual measurement and observation were used to evaluate the thickening time of each formulation. The results are summarized below in Table 8. FIG. 1 shows a photograph of Formulation #1 before thickening and FIG. 2 shows a photograph of Formulation #2 after thickening.

[0176] Table 8. Summary of Thickening Time for Formulation #1 and Formulation #2

[0177] Example 5. Sealing a Casing or Casing-Casing Annulus

[0178] A sealant composition (e.g., Formulation #1 or Formulation #2) is prepared by combining any liquid materials, including an epoxy resin, a crosslinker, and, if using, an emulsifier, and mixing for 3 to 5 minutes. The red mud is then added to the liquid materials, and the resulting mixture is mixed for 3 to 5 minutes until the formulation is homogeneous, thereby forming the sealant composition. The resulting sealant composition can then be applied to a casing or casing-casing annulus for repair.OTHER EMBODIMENTS

[0179] It is to be understood that while the invention has been described in conjunction with the detailed description thereof, the foregoing description is intended to illustrate and not limitAttorney Docket No. 38136-2610WO1 / SA73010the scope of the invention, which is defined by the scope of the appended claims. Other aspects, advantages, and modifications are within the scope of the following claims.EMBODIMENTSEmbodiment 1. A method of sealing a casing or a casing-casing annulus, comprising:applying a sealant composition to the casing or the casing-casing annulus, the sealant composition comprising:red mud;an epoxy resin; anda crosslinker;wherein the sealant composition does not comprise cement.Embodiment 2. The method of embodiment 1, wherein the sealant composition comprises from about 0.01 wt% to about 75 wt% red mud.Embodiment 3. The method of embodiment 1 or 2, wherein the sealant composition comprises from about 5 wt% to about 15 wt% red mud.Embodiment 4. The method of any one of embodiments 1-3, wherein about 80% of the red mud particles have a diameter of less than about 50 pm.Embodiment 5. The method of any one of embodiments 1-5, wherein the sealant composition comprises from about 50 wt% to about 97 wt% epoxy resin.Embodiment 6. The method of any one of embodiments 1-5, wherein the sealant composition comprises from about 80 wt% to about 90 wt% epoxy resin.Embodiment 7. The method of any one of embodiments 1-6, wherein the epoxy resin comprises:an aliphatic epoxy resin of formula (I):Attorney Docket No. 38136-2610WO1 / SA73010wherein R1is C4-24 hydrocarbylenyl;an alkyl glycidyl ether of formula (II):wherein m is an integer from 10 to 12;a bisphenol-A-based epoxy resin;a bisphenol-F-based epoxy resin;a Novalak resin; orcombinations thereof.Embodiment 8. The method of any one of embodiments 1-6, wherein the epoxy resin comprises 1,6-hexanediol diglycidyl ether, butyl glycidyl ether, 2,3 -epoxypropyl o-tolyl ether, cyclohexanedimethanol diglydicyl ether, bisphenol-A-epichlorohydrin epoxy, resin-2254, or combinations thereof.Embodiment 9. The method of any one of embodiments 1-8, wherein the epoxy resin further comprises a reactive diluent selected from:a cardanol glycidyl ether derivative;an aliphatic monoglycidyl ether of a C13-15 alcohol;a compound of formula (III):wherein R2is a C12-14 hydrocarbyl;or a combination thereof.Embodiment 10. The method of any one of embodiments 1-6, wherein the epoxy resin comprises bisphenol-A-(epichlorohydrin) epoxy resin and an oxirane mono [(C12-14)-alkyloxy)methyl] derivative.Embodiment 11. The method of any one of embodiments 1-10, wherein the sealant composition comprises from about 1 wt% to about 5 wt% crosslinker selected from trimethyl hexamethylene diamine (TMD), diethylenetriamine (DETA), triethylenetetramine (TETA), meta-xylenedi amine (MXDA), aminoethylpiperazine (AEP), tetraethylenepentamine (TEPA), polyetheramine, isophoronediamine (IPDA), Ac / a-hydroxy alkyl amide (HAA),Attorney Docket No. 38136-2610WO1 / SA73010diethyltoluenediamine (DETDA), polyoxypropylene diamine (POPDA), and combinations thereof.Embodiment 12. The method of any one of embodiments 1-11, wherein the sealant composition further comprises an accelerator, retarder, and / or weighting material.Embodiment 13. The method of any one of embodiments 1-12, wherein the sealant composition further comprises an emulsifier selected from Table A.Embodiment 14. The method of embodiment 13, wherein the sealant composition comprises from about 0.01 wt% to about 50 wt% emulsifier.Embodiment 15. The method of embodiment 1, wherein the sealant composition comprises:about 5 wt% to about 15 wt% red mud;about 80 wt% to about 90 wt% epoxy resin; andabout 2 wt% to about 4 wt% crosslinker.Embodiment 16. The method of embodiment 1, wherein the sealant composition comprises:about 5 wt% to about 15 wt% red mud;about 80 wt% to about 90 wt% bisphenol-A-epichlorohydrin epoxy resin comprising an oxirane mono [(Ci2-i4)-alkyloxy)methyl] derivative; andabout 2 wt% to about 4 wt% diethylenetriamine (DETA).Embodiment 17. The method of any one of embodiments 1-17, wherein the method further comprises:mixing the epoxy resin and the crosslinker to form a liquid mixture; and adding the red mud to the liquid mixture to form the sealant composition; before applying the sealant composition to the casing or the casing-casing annulus.Embodiment 18. The method of any one of embodiments 1-18, wherein an emulsifier is mixed with the epoxy resin and the crosslinker to form the liquid mixture.Attorney Docket No. 38136-2610WO1 / SA73010Embodiment 19. The method of any one of embodiments 1-18, wherein the liquid mixture is mixed for about 3 min to about 5 min to form the liquid mixture.Embodiment 20. The method of any one of embodiments 1-18, wherein the sealant composition is mixed for about 3 min to about 5 min after adding the red mud.

Claims

Attorney Docket No. 38136-2610WO1 / SA73010WHAT IS CLAIMED IS:

1. A method of sealing a casing or a casing-casing annulus, comprising:applying a sealant composition to the casing or the casing-casing annulus, the sealant composition comprising:red mud;an epoxy resin; anda crosslinker;wherein the sealant composition does not comprise cement.

2. The method of claim 1, wherein the sealant composition comprises from about 0.01 wt% to about 75 wt% red mud.

3. The method of claim 1, wherein the sealant composition comprises from about 5 wt% to about 15 wt% red mud.

4. The method of claim 1, wherein about 80% of the red mud particles have a diameter of less than about 50 pm.

5. The method of claim 1, wherein the sealant composition comprises from about 50 wt% to about 97 wt% epoxy resin.

6. The method of claim 1, wherein the sealant composition comprises from about 85 wt% to about 90 wt% epoxy resin.

7. The method of claim 1, wherein the epoxy resin comprises:an aliphatic epoxy resin of formula (I):wherein R1is C4-24 hydrocarbylenyl;an alkyl glycidyl ether of formula (II):Attorney Docket No. 38136-2610WO1 / SA73010wherein m is an integer from 10 to 12;a bisphenol-A-based epoxy resin;a bisphenol-F-based epoxy resin;a Novalak resin; orcombinations thereof.

8. The method of claim 1, wherein the epoxy resin comprises 1,6-hexanediol diglycidyl ether, butyl glycidyl ether, 2,3-epoxypropyl o-tolyl ether, cyclohexanedimethanol diglydicyl ether, bisphenol-A-epichlorohydrin epoxy, resin-2254, or combinations thereof.

9. The method of claim 1, wherein the epoxy resin further comprises a reactive diluent selected from:a cardanol glycidyl ether derivative;an aliphatic monoglycidyl ether of a C13-15 alcohol;a compound of formula (III):>wherein R2is a C12-14 hydrocarbyl;or a combination thereof.

10. The method of claim 1, wherein the epoxy resin comprises bisphenol-A-(epichlorohydrin) epoxy resin and an oxirane mono [(Ci2-i4)-alkyloxy)methyl] derivative.

11. The method of claim 1, wherein the sealant composition comprises from about 1 wt% to about 5 wt% crosslinker selected from trimethyl hexamethylene diamine (TMD), diethylenetriamine (DETA), triethylenetetramine (TETA), meta-xylenediamine (MXDA), aminoethylpiperazine (AEP), tetraethylenepentamine (TEPA), polyetheramine, isophoronediamine (IPDA), beta-hydroxy alkyl amide (HAA), diethyltoluenediamine (DETDA), polyoxypropylene diamine (POPDA), and combinations thereof.Attorney Docket No. 38136-2610WO1 / SA7301012. The method of claim 1, wherein the sealant composition further comprises an accelerator, retarder, and / or weighting material.

13. The method of claim 1, wherein the sealant composition further comprises an emulsifier selected from Table A.

14. The method of claim 13, wherein the sealant composition comprises from about 0.01 wt% to about 50 wt% emulsifier.

15. The method of claim 1, wherein the sealant composition comprises:about 5 wt% to about 15 wt% red mud;about 80 wt% to about 90 wt% epoxy resin; andabout 2 wt% to about 4 wt% crosslinker.

16. The method of claim 1, wherein the sealant composition comprises:about 5 wt% to about 15 wt% red mud;about 80 wt% to about 90 wt% bisphenol-A-epichlorohydrin epoxy resin comprising an oxirane mono [(C12-14)-alkyloxy)methyl] derivative; andabout 2 wt% to about 4 wt% diethylenetriamine (DETA).

17. The method of claim 1, wherein the method further comprises:mixing the epoxy resin and the crosslinker to form a liquid mixture; and adding the red mud to the liquid mixture to form the sealant composition; before applying the sealant composition to the casing or the casing-casing annulus.

18. The method of claim 1, wherein an emulsifier is mixed with the epoxy resin and the crosslinker to form the liquid mixture.

19. The method of claim 1, wherein the liquid mixture is mixed for about 3 min to about 5 min to form the liquid mixture.

20. The method of claim 1, wherein the sealant composition is mixed for about 3 min to about 5 min after adding the red mud.

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