Semiconductor manufacturing device

Abstract

This semiconductor manufacturing device comprises: a work stage that holds a workpiece; a work head that is disposed above the work stage and performs predetermined work on the workpiece held by the work stage; a cover member that has a top surface and a side surface and accommodates the work stage and the work head in a space defined by the top surface and the side surface; a fan filter unit that supplies air to the space; and an exhaust means that exhausts air from the space. The fan filter unit is provided on the top surface or the side surface of the cover member, and the exhaust means is disposed above the work head.

Description

Semiconductor manufacturing apparatus

[0001] This disclosure relates to a semiconductor manufacturing apparatus.

[0002] Conventionally, a semiconductor manufacturing apparatus that manufactures a semiconductor by performing a predetermined operation on a workpiece such as a substrate using a work head is known (for example, Patent Document 1).

[0003] The semiconductor manufacturing apparatus of Patent Document 1 is a hybrid bonding apparatus that directly bonds a semiconductor chip to a substrate without using bumps or bonding materials.

[0004] Japanese Patent Application Laid-Open No. 2024-111149

[0005] In a semiconductor manufacturing apparatus, a ventilation system such as a down blow is introduced to keep the semiconductor manufacturing space clean. On the other hand, in a hybrid bonding apparatus such as Patent Document 1, in particular, the bonding accuracy is likely to decrease due to particles being mixed into a workpiece such as a substrate, and it is required to suppress the adhesion of particles to the workpiece.

[0006] This disclosure provides a semiconductor manufacturing apparatus capable of suppressing the adhesion of particles to a workpiece.

[0007] A semiconductor manufacturing apparatus according to an aspect of this disclosure includes a work stage that holds a workpiece, a work head that is disposed above the work stage and performs a predetermined operation on the workpiece held by the work stage, a cover member that has a top surface and side surfaces and houses the work stage and the work head in a space defined by the top surface and the side surfaces, a fan filter unit that supplies air to the space, and an exhaust means that discharges air from the space, wherein the fan filter unit is provided on the top surface or the side surface of the cover member, and the exhaust means is disposed above the work head.

[0008] According to the semiconductor manufacturing apparatus of this disclosure, the adhesion of particles to a workpiece can be suppressed.

[0009] A schematic perspective view showing the external appearance of the semiconductor manufacturing apparatus according to Embodiment 1. A schematic perspective view showing the external appearance of the semiconductor manufacturing apparatus according to Embodiment 1. A schematic cross-sectional view showing the XZ cross-section of the semiconductor manufacturing apparatus according to Embodiment 1. A cross-sectional view of A-A in Figure 3. A cross-sectional view of B-B in Figure 3. A cross-sectional view of the semiconductor manufacturing apparatus (A-A cross-section) showing the airflow in the semiconductor manufacturing space indicated by dotted arrows. A cross-sectional view of the semiconductor manufacturing apparatus (B-B cross-section) showing the airflow in the semiconductor manufacturing space indicated by dotted arrows. A schematic cross-sectional view showing the YZ cross-section of the semiconductor manufacturing apparatus according to Embodiment 2. A schematic cross-sectional view showing the YZ cross-section of the semiconductor manufacturing apparatus according to Embodiment 2.

[0010] According to a first aspect of the present disclosure, a semiconductor manufacturing apparatus is provided, comprising: a work stage for holding a workpiece; a work head positioned above the work stage and performing a predetermined operation on the workpiece held on the work stage; a cover member having a top surface and side surfaces, housing the work stage and the work head in a space defined by the top surface and the side surfaces; a fan filter unit for supplying air to the space; and an exhaust means for discharging air from the space, wherein the fan filter unit is provided on the top surface or the side surface of the cover member, and the exhaust means is positioned above the work head.

[0011] A second aspect of the present disclosure provides a semiconductor manufacturing apparatus according to the first aspect, wherein the side surface has a first side surface and a second side surface facing each other in a first direction, and the work head and the exhaust means are positioned closer to the second side surface than to the first side surface with respect to the fan filter unit.

[0012] According to a third aspect of the present disclosure, the fan filter unit is positioned closer to the first side surface than the second side surface in the first direction, providing a semiconductor manufacturing apparatus according to the second aspect.

[0013] According to a fourth aspect of this disclosure, the semiconductor manufacturing apparatus described in the third aspect is provided, wherein the direction of air discharge by the fan filter unit is set diagonally downward toward the first side surface.

[0014] According to a fifth aspect of this disclosure, the semiconductor manufacturing apparatus according to the fourth aspect is provided, wherein the fan filter unit is arranged at an oblique angle.

[0015] According to a sixth aspect of this disclosure, a semiconductor manufacturing apparatus according to any one of the second to fifth aspects is provided, wherein the second side surface is further provided with an exhaust means other than the exhaust means.

[0016] According to a seventh aspect of this disclosure, a semiconductor manufacturing apparatus according to any one of the second to sixth aspects is provided, wherein the first side surface is not provided with an exhaust means.

[0017] According to an eighth aspect of the present disclosure, the semiconductor manufacturing apparatus according to any one of the second to seventh aspects is provided, wherein the exhaust means comprises a first exhaust means and a second exhaust means arranged at different positions in the first direction.

[0018] According to a ninth aspect of this disclosure, the fan filter unit is provided on the top surface, providing a semiconductor manufacturing apparatus according to any one of the first to eighth aspects.

[0019] According to a tenth aspect of this disclosure, the semiconductor manufacturing apparatus described in any one of the first to ninth aspects is provided, wherein the direction of air discharge by the fan filter unit is set to a direction different from the direction toward the work head.

[0020] According to an eleventh aspect of this disclosure, the exhaust means is provided on the top surface, and the semiconductor manufacturing apparatus is described in any one of the first to tenth aspects.

[0021] According to a twelfth aspect of the present disclosure, the top surface has a first top surface and a second top surface lower than the first top surface, the fan filter unit is provided on the first top surface, and the exhaust means is provided on the second top surface, providing a semiconductor manufacturing apparatus according to any one of the first to eleventh aspects.

[0022] According to a thirteenth aspect of this disclosure, the work head provides a semiconductor manufacturing apparatus according to any one of the first to twelfth aspects, which hybrid bonds components to the workpiece, which is a substrate.

[0023] (Embodiment 1) Hereinafter, embodiments will be described based on the drawings.

[0024] [Overall Configuration] Figures 1 and 2 are schematic perspective views showing the external appearance of a semiconductor manufacturing apparatus 100 according to Embodiment 1 of the present disclosure, respectively. The X, Y, and Z directions in the figures represent the width, depth, and height directions of the semiconductor manufacturing apparatus 100.

[0025] The semiconductor manufacturing apparatus 100 shown in Figures 1 and 2 is an apparatus that manufactures semiconductors by performing predetermined processing on a workpiece such as a substrate using a work head.

[0026] The semiconductor manufacturing apparatus 100 of Embodiment 1 is a component mounting apparatus for mounting chip components onto a substrate, and is a hybrid bonding apparatus that directly bonds the electrodes of the substrate and the electrodes of the chip components without the use of bumps or bonding materials.

[0027] As shown in Figures 1 and 2, the semiconductor manufacturing apparatus 100 comprises a cover member 4, a base member 5, a plurality of fan filter units 6, and a plurality of exhaust means 8.

[0028] The cover member 4 is a component that constitutes the outer frame of the semiconductor manufacturing apparatus 100. The cover member 4 may also be called the "housing". A semiconductor manufacturing space for manufacturing semiconductors is formed inside the cover member 4. The cover member 4 is supported from below by the base member 5.

[0029] The base member 5 supports the cover member 4 from below and is a component that constitutes the base of the semiconductor manufacturing apparatus 100. The space enclosed by the cover member 4 and the base member 5 is the semiconductor manufacturing space, which is kept clean by the fan filter unit 6 and the exhaust means 8.

[0030] The fan filter unit 6 is a unit that supplies clean air to the semiconductor manufacturing space. The fan filter unit 6 has a fan and a filter (e.g., a HEPA filter). In Embodiment 1, three fan filter units 6 are arranged in a line in the X direction. The number of fan filter units 6 is not limited to three, but may be any number.

[0031] The exhaust means 8 is a means for exhausting air from the semiconductor manufacturing space. In Embodiment 1, the exhaust means 8 is an exhaust fan that forcibly exhausts air. Not limited to an exhaust fan, any exhaust means that discharges air to the outside may be used (for example, a simple exhaust port or exhaust duct).

[0032] As shown in Figure 1, multiple exhaust means 8 (8A to 8F) are provided on the top and side surfaces of the cover member 4. The specific arrangement of the exhaust means 8A to 8F will be described later.

[0033] The cover member 4 shown in Figures 1 and 2 has a top surface 10 and side surfaces 12. The side surfaces 12 are provided so as to surround the top surface 10, and each of the side surfaces 12 extends in the Z direction to connect the top surface 10 and the base member 5.

[0034] The top surface 10 has a first top surface 14 and a second top surface 16.

[0035] A fan filter unit 6 is provided on the first top surface 14, and exhaust means 8A and 8B are provided on the second top surface 16. The first top surface 14 is inclined with respect to the horizontal plane (XY plane), and the second top surface 16 is parallel to the horizontal plane.

[0036] By making the first top surface 14 protrude above the second top surface 16, the height of the fan filter unit 6 becomes greater than the height of the exhaust means 8A and 8B. Furthermore, by tilting the first top surface 14, the fan filter unit 6 is positioned at an angle. Compared to the case where a fan filter unit 6 of the same size is positioned horizontally, the footprint of the semiconductor manufacturing equipment 100 can be reduced.

[0037] The exhaust means 8A and exhaust means 8B, which are located on the second top surface 16, are positioned differently in the Y direction. Specifically, exhaust means 8A is positioned closer to the fan filter unit 6 than exhaust means 8B.

[0038] In Embodiment 1, three exhaust means 8A are provided at intervals in the X direction, and two exhaust means 8B are provided at intervals in the X direction. In the example shown in FIGS. 1 and 2, the exhaust means 8A and the exhaust means 8B are arranged at positions shifted from each other in the X direction. The number of each of the exhaust means 8A and the exhaust means 8B may be any number, and the arrangement may be changed as appropriate.

[0039] In Embodiment 1, three exhaust means 8A are provided corresponding to the three fan filter units 6. Thereby, it becomes easier to smoothly exhaust the air sucked from the fan filter unit 6 into the semiconductor manufacturing space S, and the retention of air can be suppressed. Further, by arranging the exhaust means 8B different from the exhaust means 8A, the retention of air can be further suppressed.

[0040] The side surface 12 has a first side surface 18 (FIG. 2), a second side surface 20 (FIG. 1), and a third side surface 22.

[0041] The first side surface 18 shown in FIG. 2 is a surface facing the second side surface 20 shown in FIG. 1 in the Y direction. No exhaust means 8 is provided on the first side surface 18.

[0042] The first side surface 18 has a side surface 18A and a side surface 18B. The side surface 18A is a portion protruding in the +Z direction so as to connect to the upper end of the first top surface 14, and the side surface 18B is a portion provided at the same height as the other side surfaces 20 and 22 below the side surface 18A.

[0043] The second side surface 20 shown in FIG. 1 is a surface facing the first side surface 18 in the Y direction, and a plurality of exhaust means 8C, 8D, and 8E are provided. The exhaust means 8C, 8D, and 8E are arranged at different heights, and the exhaust means 8C is arranged in the upper stage, the exhaust means 8D is arranged in the middle stage, and the exhaust means 8E is arranged in the lower stage.

[0044] The second side surface 20 has a side surface 20A and a side surface 20B. The side surface 20A is located above the side surface 20B and is shifted in the -Y direction with respect to the side surface 20B. The exhaust means 8C and 8D are provided on the side surface 20A, and the exhaust means 8E is provided on the side surface 20B.

[0045] In Embodiment 1, two exhaust means 8C are provided at the same height position with a gap therebetween in the X direction, and three exhaust means 8D are provided at the same height position with a gap therebetween in the X direction. Only one exhaust means 8E is provided. The number of each of the exhaust means 8C to 8E may be any number, and the arrangement may also be changed as appropriate.

[0046] On the third side surface 22 shown in FIGS. 1 and 2, one exhaust means 8F is provided. A pair of third side surfaces 22 are provided at positions facing each other in the X direction, and one exhaust means 8F is provided on each of the third side surfaces 22.

[0047] Next, the internal configuration of the semiconductor manufacturing apparatus 100 will be described with reference to FIGS. 3 to 5.

[0048] FIG. 3 is a cross-sectional view schematically showing an XZ cross-section when the semiconductor manufacturing apparatus 100 is viewed in the +Y direction. FIG. 4 is a cross-sectional view taken along line A-A of FIG. 3, and FIG. 5 is a cross-sectional view taken along line B-B of FIG. 3.

[0049] As shown in FIGS. 3 to 5, the semiconductor manufacturing apparatus 100 includes a gantry 30 in a semiconductor manufacturing space S formed by a cover member 4 and a base member 5, and various members for manufacturing a semiconductor are provided on the gantry 30.

[0050] As shown in FIGS. 4 and 5, the blowing direction F1 of the air by the fan filter unit 6 arranged obliquely is obliquely downward. Thereby, the air blown out from the fan filter unit 6 travels obliquely downward toward the first side surfaces 18A and 18B.

[0051] The semiconductor manufacturing apparatus 100 includes a table moving unit 32, a chip supply table 34, a pickup tool 36, a pickup head 38, and a head moving unit 40 as members for supplying chip components.

[0052] The table moving unit 32 is a member for moving the chip supply table 34. The table moving unit 32 of Embodiment 1 moves the chip supply table 34 in the X direction.

[0053] The chip supply table 34 is a table for supplying chip components. The chip supply table 34 holds a chip carrier C that supports multiple chip components (not shown). The chip components supported by the chip carrier C are picked up sequentially by the pickup tool 36.

[0054] The pickup tool 36 is a tool for picking up chip components. The pickup tool 36, for example, holds chip components by suction. The pickup tool 36 is supported by the pickup head 38 and has a function to invert upside down. After the pickup tool 36 holds the chip component in a downward position, it inverts upside down and transfers the chip component to the bonding tool 50, which will be described later, in an upward position.

[0055] The head moving section 40 is a component for moving the pickup head 38. The head moving section 40 includes a drive unit, rails, etc., for moving the pickup head 38. In Embodiment 1, the head moving section 40 moves the pickup head 38 in the Y direction. The head moving section 40 is attached to the support column 44.

[0056] The semiconductor manufacturing apparatus 100 further includes a table moving section 46, a substrate holding table 48, a bonding tool 50, a bonding head 52, and a bonding head support section 54 as components for mounting chip components onto a substrate W.

[0057] The table moving part 46 is a component for moving the substrate holding table 48. In Embodiment 1, the table moving part 46 moves the substrate holding table 48 in the Y direction.

[0058] The substrate holding table 48 is a table that holds the substrate W. The substrate holding table 48 is a stage on which the bonding tool 50 performs its work and may also be called a "working stage".

[0059] The bonding tool 50 is a tool that mounts chip components received from the pickup tool 36 onto the substrate W. The bonding tool 50, for example, adsorbs and holds the chip components. The bonding tool 50 has a function to heat the chip components. The bonding tool 50 is supported by the bonding head 52.

[0060] The bonding head 52 is a member that supports the bonding tool 50. The bonding head 52 also has the function of moving the bonding tool 50 up and down and rotating it. The bonding head 52 is supported so as to be movable in the horizontal direction by the bonding head support 54.

[0061] The bonding head support 54 is a member that supports the bonding head 52 so that it can move horizontally. The bonding head support 54 has a drive unit, rails, etc. for moving the bonding head 52. In Embodiment 1, the bonding head support 54 moves the bonding head 52 in the X direction. The bonding head support 54 is supported by a pair of support columns 44 that are spaced apart in the X direction.

[0062] The semiconductor manufacturing apparatus 100 further includes an imaging unit 60 and an imaging unit moving unit 62 (Figure 5).

[0063] The imaging unit 60 is a unit (e.g., a camera) that images the chip component held by the bonding tool 50 from below. The imaging unit 60 is supported by an imaging unit movement unit 62 so as to be movable in the Y direction, and moves between a first position located directly below the bonding tool 50 and a second position retracted from directly below. Figure 5 shows the imaging unit 60 in the second position.

[0064] The imaging unit moving section 62 is a member that supports the imaging unit 60 so that it can move, and includes a drive unit, rails, etc. In Embodiment 1, the imaging unit moving section 62 moves the imaging unit 60 in the Y direction.

[0065] The semiconductor manufacturing apparatus 100 having the above configuration picks up chip components from the chip carrier C using a pickup tool 36 in the semiconductor manufacturing space S, transfers them to a bonding tool 50, and sequentially mounts the chip components onto the substrate W using the bonding tool 50. In this way, multiple chip components are mounted on the substrate W to manufacture a semiconductor.

[0066] The main sources of particles in the semiconductor manufacturing space S are the bonding head 52 and bonding head support 54, which move frequently and by large amounts. Since the substrate W and chip carrier C, which are the workpieces, are located below the bonding head 52 and bonding head support 54, when a down-blow method is adopted, particles generated around the bonding head 52 are likely to adhere to the substrate W and chip components, which may reduce bonding accuracy.

[0067] In the semiconductor manufacturing apparatus 100 of Embodiment 1, an "upward exhaust method" is employed to expel air blown from the fan filter unit 6 into the semiconductor manufacturing space S by raising it. To this end, exhaust means 8A and 8B are provided above the bonding head 52 and the bonding head support 54. The air blown from the fan filter unit 6 passes around the bonding head 52 and the bonding head support 54, then rises and is discharged from the exhaust means 8A and 8B. As a result, it is possible to suppress particles generated around the bonding head 52 from adhering to the substrate W and chip carrier C below, and to improve the bonding accuracy when hybrid bonding chip components to the substrate W.

[0068] Next, Figures 6 and 7 show the airflow in the semiconductor manufacturing space S.

[0069] Figures 6 and 7 are cross-sectional views of the YZ section of a semiconductor manufacturing apparatus 100, with the airflow in the semiconductor manufacturing space S indicated by dotted arrows. Figure 6 corresponds to the A-A section in Figure 4, and Figure 7 corresponds to the B-B section in Figure 5.

[0070] As shown in Figures 6 and 7, when the diagonally positioned fan filter unit 6 operates, air is drawn in from the first top surface 14 into the semiconductor manufacturing space S. The air drawn in from the fan filter unit 6 moves diagonally downward toward the first side surfaces 18A and 18B, and then curves away from the first side surfaces 18A and 18B (in the +Y direction) (arrow A1).

[0071] By directing air onto the first sides 18A and 18B, the rate at which the air descends is slowed, making it easier to generate an upward airflow toward the exhaust means 8A and 8B.

[0072] The bonding head 52 and bonding head support 54, which are the main sources of dust generation, are positioned offset in the +Y direction relative to the fan filter unit 6, while the direction of air blown from the fan filter unit 6 is set to the -Y direction. This prevents air from directly hitting the bonding head 52 and bonding head support 54. As a result, it is possible to suppress the scattering of particles generated around the bonding head 52 and the reaching of particles on the substrate W and chip carrier C below.

[0073] The air is then mainly exhausted to the outside through the exhaust means 8A (arrow A2). By positioning the exhaust means 8A above the bonding head 52 and the bonding head support 54, the air that has passed around the bonding head 52 can be raised and exhausted. As a result, even if particles are generated around the bonding head 52, they can be exhausted through the exhaust means 8A without reaching the substrate W or chip carrier C below.

[0074] As shown in Figures 6 and 7, the exhaust means 8A and the bonding head 52 are positioned on the same side (+Y direction) relative to the fan filter unit 6. This allows the exhaust means 8A to be positioned close to the bonding head 52, enabling the rapid exhaust of particles generated around the bonding head 52 from the exhaust means 8A.

[0075] Furthermore, in Embodiment 1, the exhaust means 8A is positioned lower than the fan filter unit 6. This allows the exhaust means 8A to be positioned closer to the bonding head 52.

[0076] A portion of the air that rises and passes around the bonding head 52 is exhausted by an exhaust means 8B, which is separate from the exhaust means 8A. By providing the exhaust means 8B, the stagnation of air in the upper part of the semiconductor space S can be suppressed.

[0077] In Embodiment 1, a plurality of exhaust means 8C, 8D, and 8E are provided on the second side 20, which is below the exhaust means 8A and 8B and opposite to the first side 18.

[0078] Some of the air passing around the bonding head 52 is exhausted, for example, from the upper exhaust means 8C (arrow A4). Also, air that passes around the substrate W and chip carrier C below the bonding head 52 and bonding head support 54 is exhausted, for example, from the middle exhaust means 8D (arrow A5). Also, air that passes around the table moving parts 32, 46 and the frame 30 below the substrate W and chip carrier C is exhausted, for example, from the lower exhaust means 8E (arrow A6).

[0079] By providing exhaust means 8C in addition to exhaust means 8B, it is possible to suppress the stagnation of air in the upper part of the semiconductor manufacturing space S. Furthermore, by providing exhaust means 8D and 8E, it is possible to exhaust the air passing through the region below the bonding head 52, thereby suppressing the stagnation of air in the lower part of the semiconductor manufacturing space S.

[0080] The air passing through the lower left region of Figures 7 and 8 is exhausted from the exhaust means 8F (arrow A7). By providing the exhaust means 8F, air stagnation in the corners of the semiconductor manufacturing space S can be suppressed.

[0081] Furthermore, in Embodiment 1, exhaust means are not provided on the first side surface 18, so as not to obstruct the flow of air that hits the first side surface 18 and moves away from the first side surface 18 (+Y direction). This makes it possible to stably generate an airflow that rises towards the exhaust means 8A and 8B, and an airflow that flows laterally towards the exhaust means 8C to 8E.

[0082] (Function and Effects) The semiconductor manufacturing apparatus 100 of Embodiment 1 includes a substrate holding table 48 (working stage) for holding a substrate W (workpiece), a bonding head 52 (working head) positioned above the substrate holding table 48 and performing predetermined operations on the substrate W held by the substrate holding table 48, a cover member 4 having a top surface 10 and side surfaces 12, which houses the substrate holding table 48 and the bonding head 52 in a semiconductor manufacturing space S defined by the top surface 10 and side surfaces 12, a fan filter unit 6 for supplying air to the semiconductor manufacturing space S, and exhaust means 8A and 8B for discharging air from the semiconductor manufacturing space S. The fan filter unit 6 is provided on the top surface 10 of the cover member 4, and the exhaust means 8A and 8B are positioned above the bonding head 52.

[0083] With this configuration, air can be generated that rises around the bonding head 52 toward the exhaust means 8A and 8B, thereby suppressing the adhesion of particles generated around the bonding head 52 to the substrate W below.

[0084] Furthermore, in the semiconductor manufacturing apparatus 100 of Embodiment 1, the side surface 12 has a first side surface 18 and a second side surface 20 that face each other in the Y direction (first direction), and the bonding head 52 (working head) and exhaust means 8A are positioned closer to the second side surface 20 than to the first side surface 18 (+Y direction) relative to the fan filter unit 6. With this configuration, particles generated around the bonding head 52 can be quickly exhausted from the exhaust means 8A and 8B.

[0085] Furthermore, in the semiconductor manufacturing apparatus 100 of Embodiment 1, the fan filter unit 6 is positioned closer to the first side surface 18 than to the second side surface 20 in the Y direction (first direction). With this configuration, particles generated around the bonding head 52 can be exhausted from the exhaust means 8A and 8B while keeping the area close to the first side surface 18 clean.

[0086] Furthermore, in the semiconductor manufacturing apparatus 100 of Embodiment 1, the air outlet direction F1 of the fan filter unit 6 is set diagonally downward toward the first side surface 18. With this configuration, by directing the air toward the first side surface 18, the downward speed of the air is slowed down, making it easier to generate an upward flow of air toward the exhaust means 8A.

[0087] Furthermore, in the semiconductor manufacturing apparatus 100 of Embodiment 1, the fan filter unit 6 is positioned at an angle. With this configuration, the footprint of the semiconductor manufacturing apparatus 100 can be reduced while setting the air outlet direction F1 by the fan filter unit 6 to an angle downward.

[0088] Furthermore, in the semiconductor manufacturing apparatus 100 of Embodiment 1, exhaust means 8C, 8D, and 8E, separate from the exhaust means 8A and 8B, are provided on the second side surface 20. With this configuration, it is possible to suppress the stagnation of air in the semiconductor manufacturing space S.

[0089] Furthermore, in the semiconductor manufacturing apparatus 100 of Embodiment 1, no exhaust means are provided on the first side surface 18. With this configuration, it becomes easier to stably generate a flow of air blown out from the fan filter unit 6 toward the exhaust means 8A to 8E.

[0090] Furthermore, in the semiconductor manufacturing apparatus 100 of Embodiment 1, the exhaust means 8A and 8B include exhaust means 8A (first exhaust means) and exhaust means 8B (second exhaust means) which are arranged at different positions in the Y direction (first direction). With this configuration, by dispersing the exhaust means 8A and 8B in the Y direction, air stagnation can be suppressed.

[0091] Furthermore, in the semiconductor manufacturing apparatus 100 of Embodiment 1, the fan filter unit 6 is provided on the top surface 10. With this configuration, the fan filter unit 6 can be easily installed.

[0092] Furthermore, in the semiconductor manufacturing apparatus 100 of Embodiment 1, the direction F1 of air blown out by the fan filter unit 6 is set to a direction different from the direction toward the bonding head 52 (working head) (+Y direction) (-Y direction). With this configuration, by not blowing air directly onto the bonding head 52, it is possible to suppress the scattering of particles generated around the bonding head 52 and their adhesion to the substrate W below.

[0093] Furthermore, in the semiconductor manufacturing apparatus 100 of Embodiment 1, the exhaust means 8A and 8B are provided on the top surface 10. With this configuration, the exhaust means 8A and 8B can be easily installed, and it becomes easier to generate an upward airflow.

[0094] Furthermore, in the semiconductor manufacturing apparatus 100 of Embodiment 1, the top surface 10 has a first top surface 14 and a second top surface 16 that is lower than the first top surface 14, the fan filter unit 6 is provided on the first top surface 14, and the exhaust means 8A and 8B are provided on the second top surface 16. With this configuration, the exhaust means 8A and 8B can be placed close to the bonding head 52, and particles generated around the bonding head 52 can be quickly exhausted.

[0095] Furthermore, in the semiconductor manufacturing apparatus 100 of Embodiment 1, the bonding head 52 (working head) hybrid-bonds chip components (components) to the substrate W (workpiece). With this configuration, the bonding accuracy of hybrid bonding, which is greatly affected by particle adhesion, can be improved.

[0096] (Embodiment 2) The semiconductor manufacturing apparatus 200 of Embodiment 2 will be described with reference to Figures 8 and 9. Descriptions that overlap with Embodiment 1 will be omitted as appropriate.

[0097] Figures 8 and 9 are schematic cross-sectional views of the YZ section of the semiconductor manufacturing apparatus 200 of Embodiment 2 when viewed in the +X direction. In Figure 9, the airflow in the semiconductor manufacturing space S is represented by dotted arrows.

[0098] The semiconductor manufacturing apparatus 200 of Embodiment 2 differs from the semiconductor manufacturing apparatus 100 of Embodiment 1 in that the fan filter unit 206 is oriented horizontally rather than diagonally.

[0099] The semiconductor manufacturing apparatus 200 shown in Figure 8 includes a cover member 204 that forms a semiconductor manufacturing space S, and the cover member 204 has a top surface 210 which includes a first top surface 214 and a second top surface 216.

[0100] A fan filter unit 206 is provided on the first top surface 214, and exhaust means 8A and 8B are provided on the second top surface 216.

[0101] In Embodiment 2, both the first top surface 214 and the second top surface 216 are oriented horizontally and extend continuously in the XY plane.

[0102] The fan filter unit 206 installed on the first top surface 214 is also positioned horizontally. The direction F2 of air discharge by the fan filter unit 206 is vertically downward (straight down).

[0103] By arranging the first top surface 214 and the fan filter unit 206 horizontally, the side surface 218 adjacent to the first top surface 214 is positioned to protrude in the -Y direction compared to the first top surface 14 in Embodiment 1.

[0104] As shown in Figure 9, the air blown from the fan filter unit 206 into the semiconductor manufacturing space S moves straight down, then curves in the +Y direction toward the side where the multiple exhaust means 8A to 8E are located. Some of the air moves straight down toward the exhaust means 8F.

[0105] The air is then exhausted to the outside through exhaust means 8A to 8F. In particular, by positioning the exhaust means 8A and 8B above the bonding head 52 and the bonding head support 54, the air that has passed around the bonding head 52 can be raised and exhausted. As a result, even if particles are generated around the bonding head 52, they can be exhausted through the exhaust means 8A and 8B without reaching the substrate W or chip carrier C below.

[0106] As described above, even when the fan filter unit 206 is installed horizontally and the air outlet direction F2 is set vertically downward, the exhaust means 8A and 8B are provided above the bonding head 52, which generates an upward airflow around the bonding head 52 and suppresses the adhesion of particles to the substrate W, etc.

[0107] (Other) In the above embodiment, the case in which the work head is a bonding head 52 and the workpiece to be worked on is a substrate W has been described, but the case is not limited to this, and any work head and any workpiece may be used as long as they are used in semiconductor manufacturing equipment for manufacturing semiconductors.

[0108] Furthermore, although the above embodiment described a case in which the fan filter units 6 and 206 are provided on the top surfaces 10 and 210 of the cover members 4 and 204, respectively, the case is not limited to this, and they may also be provided on the sides of the cover members 4 and 204. Even in such a case, by providing the exhaust means 8A and 8B above the bonding head 52 and the bonding head support portion 54, it is possible to create an airflow that rises around the bonding head 52 and is exhausted.

[0109] Furthermore, while Embodiment 2 described a case where the fan filter unit 206 is arranged horizontally and the air outlet direction F2 from the fan filter unit 206 is set vertically downward, the invention is not limited to this case. Even when the fan filter unit 206 is arranged horizontally, for example, by providing the fan filter unit 206 with a means to change the airflow direction, such as a louver, the air outlet direction can be set diagonally downward and the air can be blown out toward the side surface 218.

[0110] While this disclosure is adequately described in relation to preferred embodiments with reference to the accompanying drawings, various variations and modifications will be obvious to those skilled in the art. Such variations and modifications should be understood as being included within the scope of this disclosure as defined by the attached claims. Furthermore, variations in combinations and sequences of elements in each embodiment can be realized without departing from the scope and spirit of this disclosure.

[0111] Furthermore, by appropriately combining any of the above embodiments and various modifications, the effects of each can be achieved.

[0112] This invention is applicable to any semiconductor manufacturing equipment.

[0113] 100, 200 Semiconductor manufacturing equipment 4 Cover member 6 Fan filter unit 8A-8F Exhaust means 10 Top surface 12 Side surface 14 First top surface 16 Second top surface 18 First side surface 20 Second side surface 22 Third side surface 48 Substrate holding table (work stage) 52 Bonding head (work head) S Semiconductor manufacturing space W Substrate (workpiece)

Claims

1. A semiconductor manufacturing apparatus comprising: a work stage for holding a workpiece; a work head positioned above the work stage and performing a predetermined operation on the workpiece held on the work stage; a cover member having a top surface and side surfaces, housing the work stage and the work head in a space defined by the top surface and the side surfaces; a fan filter unit for supplying air to the space; and an exhaust means for discharging air from the space, wherein the fan filter unit is provided on the top surface or the side surface of the cover member, and the exhaust means is positioned above the work head.

2. The semiconductor manufacturing apparatus according to claim 1, wherein the side surface has a first side surface and a second side surface facing each other in a first direction, and the work head and the exhaust means are positioned closer to the second side surface than to the first side surface with respect to the fan filter unit.

3. The semiconductor manufacturing apparatus according to claim 2, wherein the fan filter unit is positioned closer to the first side surface than the second side surface in the first direction.

4. The semiconductor manufacturing apparatus according to claim 3, wherein the direction of air discharge by the fan filter unit is set diagonally downward toward the first side surface.

5. The semiconductor manufacturing apparatus according to claim 4, wherein the fan filter unit is arranged at an angle.

6. The semiconductor manufacturing apparatus according to claim 2, wherein an exhaust means other than the exhaust means is further provided on the second side surface.

7. The semiconductor manufacturing apparatus according to claim 2, wherein the first side surface is not provided with an exhaust means.

8. The semiconductor manufacturing apparatus according to claim 2, wherein the exhaust means comprises a first exhaust means and a second exhaust means arranged at different positions in the first direction.

9. The semiconductor manufacturing apparatus according to claim 1, wherein the fan filter unit is provided on the top surface.

10. The semiconductor manufacturing apparatus according to claim 1, wherein the direction of air discharge by the fan filter unit is set to a direction different from the direction toward the work head.

11. The semiconductor manufacturing apparatus according to claim 1, wherein the exhaust means is provided on the top surface.

12. The semiconductor manufacturing apparatus according to claim 1, wherein the top surface has a first top surface and a second top surface lower than the first top surface, the fan filter unit is provided on the first top surface, and the exhaust means is provided on the second top surface.

13. The semiconductor manufacturing apparatus according to claim 1, wherein the work head hybrid bonds components to the workpiece, which is a substrate.

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