Method for producing end effector, end effector, and robot arm

Abstract

A method for producing an end effector 10 according to the present disclosure comprises a step for integrally forming wiring W in a prescribed pattern on a resin surface A of a body part 11 which contains a resin and, on the basis of the wiring W itself, configuring a circuit part 12 which includes a circuit that contributes to a prescribed function, wherein the step includes a first step for applying a metal bonding agent G to the surface A of the body part 11, a second step for forming a first seed layer S1 by first plating on the metal bonding agent G, a third step for covering the first seed layer S1 with a mask M that corresponds to the prescribed pattern and forming a second seed layer S2 by second plating on a surface of the first seed layer S1 that is exposed from the mask M, and a fourth step for removing the mask M and removing the first seed layer S1 and the second seed layer S2 so as to form at least one plating layer at a position that corresponds to the exposed surface.

Description

Method for manufacturing an end effector, end effector, and robotic arm

[0001] The present disclosure relates to a method for manufacturing an end effector, an end effector, and a robotic arm. This application claims the priority of Japanese Patent Application No. 2025-003124, which was filed in Japan on January 8, 2025, and the entire disclosure of that application is incorporated herein by reference for that purpose.

[0002] Conventionally, robotic arms for various applications such as industrial, medical, and caregiving ones used in manufacturing sites and the like are known. In addition, technologies related to end effectors including robotic hands and robotic grippers attached to the tip of a robotic arm are known. For example, Patent Document 1 discloses an end effector that can contribute to more functions with a simpler configuration.

[0003] In addition, technologies for bonding resin and metal are known. For example, Patent Document 2 discloses a molecular adhesive that enables electroless resin plating not affected by the type of resin, and in which countermeasures against high frequency, high-temperature solder, heat generation, and manufacturing costs are respectively related to the smoothness of copper wires, adhesive strength, dielectric constant, and productivity (production time, number of processes, defect rate), etc., and solves the interfacial chemical problems between resin and copper wires.

[0004] International Publication No. 2024 / 157664 Patent No. 5135575

[0005] In the prior arts described in Patent Documents 1 and 2, sufficient consideration has not been given to improving the quality of circuits that contribute to predetermined functions in end effectors.

[0006] An object of the present disclosure is to provide a method for manufacturing an end effector, an end effector, and a robotic arm capable of improving the quality of circuits that contribute to predetermined functions.

[0007] A method for manufacturing an end effector to solve the above problems is a method for manufacturing an end effector used in a robot, comprising the steps of forming wiring integrally on the surface of a resin body in a predetermined pattern, and constructing a circuit part that includes a circuit that contributes to a predetermined function based on the wiring itself, the steps comprising: a first step of applying a metal bonding agent to the surface of the body; a second step of forming a first seed layer on the metal bonding agent by first plating; a third step of covering the first seed layer with a mask corresponding to the predetermined pattern and forming a second seed layer on the exposed surface of the first seed layer from the mask by second plating; and a fourth step of peeling off the mask, peeling off the first seed layer and the second seed layer and forming at least one plating layer at a position corresponding to the exposed surface.

[0008] An end effector for solving the above problems is an end effector used in a robot, comprising: a main body containing resin; and a circuit part having wiring integrally formed in a predetermined pattern on the surface of the resin in the main body, and including a circuit that contributes to a predetermined function based on the wiring itself, wherein the wiring has a metal bonding layer disposed between the surface of the main body and a plating layer, and at least one plating layer laminated on the metal bonding layer.

[0009] The robotic arm that solves the above problems is equipped with the above-mentioned end effector.

[0010] According to this disclosure, it is possible to provide a method for manufacturing an end effector, an end effector, and a robot arm that can improve the quality of a circuit contributing to a predetermined function.

[0011] This is a schematic diagram showing an example of the appearance of a robot arm according to one embodiment of the present disclosure. This is a schematic diagram showing an example of the appearance of the end effector of the robot arm in Figure 1. This is a block diagram showing an example of the configuration of the robot arm in Figure 1. This is a first schematic diagram illustrating an example of a method for manufacturing the end effector in Figure 2. This is a second schematic diagram illustrating an example of a method for manufacturing the end effector in Figure 2. This is a third schematic diagram illustrating an example of a method for manufacturing the end effector in Figure 2. This is a fourth schematic diagram illustrating an example of a method for manufacturing the end effector in Figure 2. This is a fifth schematic diagram illustrating an example of a method for manufacturing the end effector in Figure 2. This is a sixth schematic diagram illustrating an example of a method for manufacturing the end effector in Figure 2. This is a seventh schematic diagram illustrating an example of a method for manufacturing the end effector in Figure 2. This is an eighth schematic diagram illustrating an example of a method for manufacturing the end effector in Figure 2. This is a ninth schematic diagram illustrating an example of a method for manufacturing the end effector in Figure 2. This is a schematic diagram showing a first example of a laminate constituting the wiring of the circuit in the circuit section of Figure 2. This is a schematic diagram showing a second example of a laminate constituting the wiring of the circuit in the circuit section of Figure 2. This figure shows an example of a laminate formed on the resin surface of the main body by conventional technology. This figure shows an example of a laminate formed on the resin surface of the main body of the end effector shown in Figure 2. This is a schematic diagram showing the first wiring pattern of the first circuit in Figure 2. This is a schematic diagram showing the second wiring pattern of the second circuit in Figure 2. This is a schematic diagram showing the third wiring pattern of the third circuit in Figure 2. This is a schematic diagram of each configuration shown in Figure 9A viewed from the side. This is a schematic diagram showing the first wiring pattern of the first circuit according to a modified example of the present disclosure. This is a schematic diagram showing the second wiring pattern of the second circuit according to a modified example of the present disclosure. This is a schematic diagram showing the appearance of the end effector according to a modified example of the present disclosure.

[0012] In the following, one embodiment of this disclosure will be mainly described with reference to the attached drawings.

[0013] Figure 1 is a schematic diagram showing an example of the external appearance of a robot arm 1 according to one embodiment of the present disclosure. Figure 2 is a schematic diagram showing an example of the external appearance of the end effector 10 of the robot arm 1 in Figure 1. Figure 3 is a block diagram showing an example of the configuration of the robot arm 1 in Figure 1. An example of the configuration of the robot arm 1 including the end effector 10 will be mainly described with reference to Figures 1 to 3.

[0014] As shown in Figures 1 and 2, the robot arm 1 comprises a housing 1a that constitutes the main body and an end effector 10 attached to the housing 1a at the tip of the robot arm 1. The end of the end effector 10 opposite to the part for gripping an object is attached to the housing 1a, so that the end effector 10 is supported by the housing 1a. The end effector 10 is driven while supported by the housing 1a and grips an object.

[0015] The end effector 10 is used in a robot. For example, the end effector 10 functions as part of a robot having a robot arm 1. In this disclosure, “robot” includes, for example, industrial robots, caregiving robots, marine robots, medical robots, and mobile devices such as vehicles and drones that make autonomous decisions and move. “Industrial robot” includes, for example, collaborative robots that can work together with a worker in the same space and other robots that work in isolation from the worker. The end effector 10 is configured as a robot hand or robot gripper in such a robot.

[0016] As shown in Figure 3, the end effector 10 has a main body portion 11 containing resin and a circuit portion 12 including a circuit integrally formed with the resin in the main body portion 11. In addition to the end effector 10 having the main body portion 11 and the circuit portion 12, the robot arm 1 has a storage unit 20, a drive unit 30, and a control unit 40. The storage unit 20, the drive unit 30, and the control unit 40 are housed, for example, in the housing 1a of the robot arm 1.

[0017] The storage unit 20 includes, for example, semiconductor memory, magnetic memory, optical memory, or any combination thereof. The storage unit 20 functions, for example, as main memory, auxiliary memory, or cache memory. The storage unit 20 stores information used for the operation of the robot arm 1 and information obtained by the operation of the robot arm 1. For example, the storage unit 20 stores system programs, application programs, and various data acquired by any means such as communication.

[0018] The drive unit 30 includes, for example, an arbitrary drive mechanism for driving the end effector 10. The drive mechanism includes, for example, a plurality of gears and a motor for rotating the gears. The drive unit 30 drives the end effector 10 according to a control signal from the control unit 40. The drive unit 30 drives the claw portion 11b of the main body portion 11 of the end effector 10, as described later, according to a control signal from the control unit 40, so that the claw portion 11b grips an object.

[0019] The control unit 40 includes a microcontroller, a processor, a programmable circuit, a dedicated circuit, or any combination thereof. The processor is a general-purpose processor such as a CPU or GPU, or a dedicated processor specialized for a specific process. "CPU" is an abbreviation for Central Processing Unit. "GPU" is an abbreviation for Graphics Processing Unit. The programmable circuit is, for example, an FPGA. "FPGA" is an abbreviation for Field-Programmable Gate Array. The dedicated circuit is, for example, an ASIC. "ASIC" is an abbreviation for Application Specific Integrated Circuit. The control unit 40 is communicated with each component constituting the robot arm 1 and executes various processes related to the operation of the robot arm 1 while controlling each component.

[0020] The following section will primarily describe the configuration and functions of the end effector 10.

[0021] The main body portion 11 constitutes the entire outer shape of the end effector 10. The main body portion 11 has a mounting portion 11a that is attached to the housing 1a of the robot arm 1. The main body portion 11 has a pair of claw portions 11b that protrude from the end of the mounting portion 11a that is on the opposite side from the housing 1a. The pair of claw portions 11b grip an object by, for example, reducing the distance between them to be approximately the same as the width of the object. As an example, the entire main body portion 11, including the mounting portion 11a and the claw portions 11b, is made of resin.

[0022] As described later, in this disclosure, “resin” includes, for example, thermoplastic resins. “Thermoplastic resin” includes, for example, at least one selected from the group consisting of engineering plastics or super engineering plastics. Thermoplastic resin is, for example, a polyarylene sulfide resin. More specifically, thermoplastic resin includes a polyarylene sulfide resin such as a polyphenylene sulfide resin.

[0023] The circuit section 12 of the end effector 10 contributes to a predetermined function. In this disclosure, the "predetermined function" includes, for example, a first function, a second function, and a third function. The first function is to detect when the main body 11 comes into contact with a first object. The second function is to detect the height of the second object. The third function is to detect the magnitude of the pressure generated when the end effector 10 grips the third object. The first object, the second object, and the third object may be the same as each other or may be different from each other.

[0024] As shown in Figure 2, the circuit of the circuit section 12 has wiring integrally formed in a predetermined pattern on the resin surface of the main body section 11, and contributes to a predetermined function based on the wiring itself. The circuit of the circuit section 12 includes a first circuit 121, a second circuit 122, and a third circuit 123.

[0025] The first circuit 121 is formed, for example, on each of the outer surfaces of a pair of claw portions 11b in the separation direction D1 where the pair of claw portions 11b are separated from each other. The outer surface of the claw portion 11b is the surface located on the dorsal side opposite to the ventral side of the claw portion 11b, which is the side that grips the object. The first circuit 121 is formed on the outer surface of the claw portion 11b, for example, over the entire portion of the main body portion 11 excluding the tip in the extending direction D2 perpendicular to the separation direction D1. The first circuit 121 is located in the first region R1. The first circuit 121 contributes to the first function.

[0026] The second circuit 122 is formed, for example, on the inner surface of each of the pair of claw portions 11b in the separation direction D1. The inner surface of the claw portion 11b is the surface located on the ventral side of the claw portion 11b that grips the object. The second circuit 122 is located on the inner surface of the claw portion 11b, for example, in the central part in the extending direction D2 of the main body portion 11. The second circuit 122 is located in the second region R2. The second circuit 122 contributes to the second function.

[0027] The third circuit 123 is formed, for example, on the inner surface of each of a pair of claw portions 11b arranged in the separation direction D1. The third circuit 123 is located on the inner surface of the claw portion 11b, for example, at the tip in the extending direction D2 of the main body portion 11. However, it is not limited to this, and the third circuit 123 may be located at a position different from the tip in the extending direction D2 on the inner surface of the claw portion 11b, or it may be located on the outer surface of the claw portion 11b. The third circuit 123 is located in the third region R3. The third circuit 123 contributes to the third function.

[0028] The circuit of the circuit section 12 is formed, for example, by drawing on the surface of the resin that forms the claw portion 11b of the main body 11. In the circuit of the circuit section 12, the wiring and electrodes are formed in each region of the resin surface that forms the claw portion 11b. The circuit of the circuit section 12 is formed on the surface of the main body 11, which is a molded product, by plating.

[0029] Figure 4A is a first schematic diagram illustrating an example of a manufacturing method for the end effector 10 shown in Figure 2. Figure 4B is a second schematic diagram illustrating an example of a manufacturing method for the end effector 10 shown in Figure 2. Figure 4C is a third schematic diagram illustrating an example of a manufacturing method for the end effector 10 shown in Figure 2. Figure 4D is a fourth schematic diagram illustrating an example of a manufacturing method for the end effector 10 shown in Figure 2. Figure 4E is a fifth schematic diagram illustrating an example of a manufacturing method for the end effector 10 shown in Figure 2.

[0030] Figure 4F is the sixth schematic diagram illustrating an example of a manufacturing method for the end effector 10 shown in Figure 2. Figure 4G is the seventh schematic diagram illustrating an example of a manufacturing method for the end effector 10 shown in Figure 2. Figure 4H is the eighth schematic diagram illustrating an example of a manufacturing method for the end effector 10 shown in Figure 2. Figure 4I is the ninth schematic diagram illustrating an example of a manufacturing method for the end effector 10 shown in Figure 2. An example of a manufacturing method for an end effector 10 used in a robot will be mainly described with reference to Figures 4A to 4I.

[0031] The manufacturing method for the end effector 10 includes the step of integrally forming wiring in a predetermined pattern on the surface A of the resin in the main body 11 containing resin, and constructing a circuit section 12 that includes a circuit that contributes to a predetermined function based on the wiring itself. This step mainly includes a first step, a second step, a third step, and a fourth step.

[0032] The first step is to apply the metal bonding agent G to the surface A of the main body 11. For example, as shown in Figure 4A, the metal bonding agent G is applied to the resin surface A of the main body 11 as a molded product, as shown in Figure 4B. The manufacturing method of the end effector 10 does not include a step of roughening the surface A of the main body 11, but instead includes a step of applying the metal bonding agent G to the surface A of the main body 11.

[0033] In this disclosure, "metal bonding agent G" includes, for example, a triazine derivative. The triazine derivative functions as a dissimilar material bonding agent. The dissimilar materials include, for example, a resin contained in the main body portion 11 of the end effector 10 and a metal in the plating layer that constitutes the wiring of the circuit portion 12. The triazine derivative is, for example, an organic compound having an unsaturated six-membered ring structure containing three nitrogen atoms and three functional groups, and preferably contains one or more functional groups that have affinity for both the resin contained in the main body portion 11 and the metal in the plating layer that constitutes the wiring of the circuit portion 12. Examples of functional groups that have affinity for the resin material include ester groups, vinyl groups, thiol groups, carboxyl groups, and hydroxyl groups, with ester groups, vinyl groups, thiol groups, and carboxyl groups being particularly preferred. Examples of functional groups that have affinity for metallic materials include amino groups, hydroxyl groups, silanol groups, thiol groups, ester groups, amide groups, and alkoxy groups, with amino groups, hydroxyl groups, silanol groups, and thiol groups being particularly preferred.

[0034] The second to fourth steps are steps that mainly perform plating on the resin surface A of the main body 11. In this disclosure, the "step of performing plating" includes, for example, a step of forming at least one plating layer made of metal and / or ceramics on the resin molded product surface A of the main body 11 by electroless plating, electroplating, sputtering, or a combination thereof.

[0035] The second step is to form a first seed layer S1 by first plating on the metal bonding agent G. For example, as shown in Figure 4C, the first seed layer S1 is formed over a wide area of ​​the metal bonding agent G applied to the resin surface A of the main body portion 11 as a molded product. In this disclosure, "first plating" includes, for example, electroless copper plating.

[0036] Electroless plating is a method of forming an electroless plating layer (film) consisting of a metal film by contacting an electroless plating solution with a metal bonding agent G applied to the surface A of a resin molded product of the main body 11, thereby depositing metals such as copper contained in the electroless plating solution. Examples of electroless plating solutions include those containing at least one metal selected from the group consisting of nickel, copper, chromium, zinc, iron, gold, silver, aluminum, tin, cobalt, palladium, lead, platinum, cadmium, manganese, lithium, strontium, lanthanum, titanium, barium, zirconium, lead, and rhodium, a reducing agent, and a solvent such as an aqueous medium or an organic solvent.

[0037] Examples of reducing agents include dimethylaminoborane, hypophosphite, sodium hypophosphite, dimethylamineborane, hydrazine, formaldehyde, sodium borohydride, and phenol.

[0038] As an electroless plating solution, you may use one that contains, as needed, monocarboxylic acids such as acetic acid and formic acid; dicarboxylic acid compounds such as malonic acid, succinic acid, adipic acid, maleic acid, and fumaric acid; hydroxycarboxylic acid compounds such as malic acid, lactic acid, glycolic acid, gluconic acid, and citric acid; amino acid compounds such as glycine, alanine, iminodiacetic acid, arginine, aspartic acid, and glutamic acid; organic acids such as iminodiacetic acid, nitrilotriacetic acid, ethylenediaminediacetic acid, ethylenediaminetetraacetic acid, and diethylenetriaminepentaacetic acid; or complexing agents such as soluble salts of these organic acids (sodium salts, potassium salts, ammonium salts, etc.), amine compounds such as ethylenediamine, diethylenetriamine, and triethylenetetramine.

[0039] Electroless plating solutions are preferably used in a temperature range of 20°C to 98°C.

[0040] The third step includes the step of covering the first seed layer S1 with a mask M corresponding to a predetermined pattern of the wiring of the circuit portion 12. In the present disclosure, the "mask M" includes, for example, a photomask. For example, as shown in FIG. 4D, a portion of the first seed layer S1 that does not contribute to the wiring is protected from subsequent plating processes by a mask M in which a cut corresponding to a predetermined pattern of the wiring of the circuit portion 12 is arranged.

[0041] The third step further includes the step of forming a second seed layer S2 on the exposed surface of the first seed layer S1 from the mask M by second plating. For example, as shown in FIG. 4D, the surface of the first seed layer S1 is exposed from a cut of the mask M corresponding to a predetermined pattern of the wiring of the circuit portion 12. As shown in FIG. 4E, a second seed layer S2 is formed on the exposed surface by second plating. In the present disclosure, the "second plating" includes, for example, electrolytic copper plating.

[0042] The electrolytic plating method is, for example, a method of depositing a metal such as copper contained in an electrolytic plating solution on the surface of a electroless plating layer (film) formed by an electroless plating process in a state where the electrolytic plating solution is in contact and energizing, to form an electrolytic plating layer (film) on the surface of the electroless plating layer (film) formed by the electroless plating process provided on the cathode.

[0043] Examples of the electrolytic plating solution include those containing at least one metal sulfate selected from the group consisting of nickel, copper, chromium, zinc, iron, gold, silver, aluminum, tin, cobalt, palladium, lead, platinum, cadmium, manganese, lithium, strontium, lanthanum, titanium, barium, zirconium, lead, and rhodium, an acid, and an aqueous medium. Specifically, it is preferable to use a solution containing iron(II) sulfate, nickel(II) sulfate, boric acid, and an aqueous medium because a permalloy plating layer can be obtained. When having a permalloy layer, it has a high magnetic permeability and can exhibit good magnetic field shielding properties.

[0044] The electrolytic plating solution is preferably used in the range of 20°C to 98°C.

[0045] The fourth step includes peeling off the mask M, as shown in Figure 4F. The fourth step also includes peeling off the first seed layer S1 and the second seed layer S2, as shown in Figure 4G. At this time, in the portions on both sides that are covered by the mask M and where only the first seed layer S1 exists without the formation of the second seed layer S2, the metal bonding agent G may also be peeled off to expose the resin surface A of the main body 11. The fourth step also includes forming at least one plating layer at a position corresponding to the exposed surface of the first seed layer S1 from the mask M, as shown in Figures 4G to 4I.

[0046] For example, as shown in Figure 4F, the central portion where the first seed layer S1 and the second seed layer S2 are formed at a position corresponding to the exposed surface of the first seed layer S1 from the mask M is thicker than the side portions covered by the mask M where only the first seed layer S1 exists and the second seed layer S2 is not formed. Therefore, as shown in Figure 4G, when the first seed layer S1 and the second seed layer S2 are peeled off using a solvent or the like, the plating layer remains in the central portion.

[0047] Therefore, the fourth step of forming the plating layer includes, as shown in Figure 4G, a step of leaving a first layer 125a containing the first metal after peeling off the first seed layer S1 and the second seed layer S2. The fourth step of forming the plating layer includes, as shown in Figure 4H, a step of laminating a second layer 125b containing a second metal having a higher resistivity than the first metal onto the first layer 125a by plating. In this disclosure, the "first metal" is, for example, copper. The "second metal" is, for example, nickel.

[0048] In addition, the fourth step of forming the plating layer may further include a step of laminating a third layer 125c containing gold onto the second layer 125b by plating, as shown in Figure 4I.

[0049] Figure 5A is a schematic diagram showing a first example of a laminate 125 that constitutes the wiring W of the circuit in the circuit section 12 of Figure 2. Referring to Figure 5A, a first example of the structure of the laminate 125 formed on the resin surface A of the main body section 11 by the manufacturing method shown in Figures 4A to 4I will be mainly described.

[0050] In one embodiment, the wiring W of the circuit section 12 of the end effector 10 includes a laminate 125 obtained by forming at least one plating layer on the surface A of the main body 11 as a molded product. The wiring W has a metal bonding layer 124 disposed between the surface A of the main body 11 and the plating layer, and at least one plating layer laminated on the metal bonding layer 124.

[0051] On the resin surface A of the main body 11, metal bonding agent G may remain in the portion where the laminate 125 is formed, forming a metal bonding layer 124. The laminate 125, which is composed of at least one plating layer, is integrally formed with the resin of the main body 11 via the metal bonding layer 124 and has a first layer 125a containing a first metal. The laminate 125 has a second layer 125b laminated on the first layer 125a and containing a second metal having a higher resistivity than the first metal. The laminate 125 further has a third layer 125c laminated on the second layer 125b and containing gold.

[0052] The total thickness h of the multiple plating layers formed by the plating process is not particularly limited, but may be, for example, 0.03 μm or more and 300 μm or less, more preferably 0.02 μm or more and 200 μm or less, and even more preferably 0.01 μm or more and 100 μm or less. The total thickness h of the multiple plating layers formed by the plating process can be adjusted by the processing time, number of processing steps, current density, amount of plating additive used in each plating process. The roughness of the resin surface A of the main body 11 is not particularly limited, but may be, for example, 0.1 μm or more and 1.0 μm or less.

[0053] Figure 5B is a schematic diagram showing a second example of the laminate 125 that constitutes the wiring W of the circuit in the circuit section 12 of Figure 2. Referring to Figure 5B, a second example of the configuration of the laminate 125 formed on the resin surface A of the main body section 11 by the manufacturing method shown in Figures 4A to 4I will be mainly described.

[0054] In the first example shown in Figure 5A, the laminate 125 is described as having a three-layer structure including a first layer 125a made of copper as the first metal, a second layer 125b made of nickel as the second metal, and a third layer 125c made of gold, but it is not limited to this. As shown in Figure 5B, the laminate 125 may also have a two-layer structure.

[0055] On the resin surface A of the main body 11, metal bonding agent G may remain in the portion where the laminate 125 is formed, forming a metal bonding layer 124. The laminate 125, which is composed of at least one plating layer, is integrally formed with the resin of the main body 11 via the metal bonding layer 124 and has a second layer 125b containing a second metal. The laminate 125 further has a third layer 125c containing gold, which is laminated on the second layer 125b. The laminate 125 may have a two-layer structure in which the thickness of the first layer 125a containing the first metal is replaced by the thickness of the second layer 125b containing a second metal with a higher resistivity than the first metal, and the thickness of the second layer 125b is increased compared to the first example.

[0056] The total thickness h of the multiple plating layers formed by the plating process is not particularly limited, but for example, as in the first example, it may be 0.03 μm or more and 300 μm or less, more preferably 0.02 μm or more and 200 μm or less, and even more preferably 0.01 μm or more and 100 μm or less. The total thickness h of the multiple plating layers formed by the plating process can be adjusted by the processing time, number of processing steps, current density, amount of plating additive used in each plating process. The roughness of the resin surface A of the main body 11 is not particularly limited, but for example, as in the first example, it may be 0.1 μm or more and 1.0 μm or less.

[0057] Figure 6A shows an example of a laminate formed on the resin surface of the main body by conventional technology. Figure 6A is a cross-sectional image when, for example, the surface of the resin of the main body is roughened, and a laser is directly irradiated onto the surface of the molded product of the main body using LDS (Laser Direct Structuring) to form the wiring of the circuit of the circuit by plating. Figure 6B shows an example of a laminate 125 formed on the resin surface A of the main body 11 of the end effector 10 in Figure 2. Figure 6B is a cross-sectional image of a laminate 125 formed on the resin surface A of the main body 11 by, for example, the manufacturing method shown in Figures 4A to 4I.

[0058] As can be easily understood by comparing the image in Figure 6A, which is based on the prior art, with the image in Figure 6B, which is based on the manufacturing method of the present disclosure, the resin surface A of the main body portion 11 of the end effector 10 is smoother than that of the prior art, in which the surface is roughened by a roughening treatment. Consequently, the surface of the laminate 125 is also smoother. The laminate 125 has a planar surface with few irregularities on both the inner surface on the side of the resin surface A of the main body portion 11 and the outer surface on the opposite side of surface A.

[0059] Figure 7 is a schematic diagram showing the first pattern P1 of the wiring W1 of the first circuit 121 in Figure 2. In Figure 7, the first region R1 of Figure 2 is enlarged, and only the first circuit 121 of the circuit section 12 is shown.

[0060] The first circuit 121 has an input electrode E1 and an output electrode E2 formed on the resin surface of the claw portion 11b. The input electrode E1 and the output electrode E2 are formed in parallel with each other. The first circuit 121 has wiring W1 formed in a first pattern P1 on the resin surface of the claw portion 11b, and contributes to a first function based on the wiring W1 itself. The first pattern P1 corresponding to the first function includes at least one straight line connecting the input electrode E1 and the output electrode E2 which are integrally formed with the resin in the main body portion 11.

[0061] For example, the first pattern P1 includes three straight lines. The first pattern P1 includes a first straight line L1 extending from the input electrode E1, a second straight line L2 bending at 90° from the first straight line L1, and a third straight line L3 bending at another 90° from the second straight line L2 and extending to the output electrode E2. The first pattern P1 extends elongated along the extending direction D2 of the main body 11 over substantially the entire extending region of the claw portion 11b. The first pattern P1 corresponds to the shape of the Japanese character "コ" rotated 90° clockwise.

[0062] Figure 8 is a schematic diagram showing the second pattern P2 of the wiring W2 of the second circuit 122 in Figure 2. In Figure 8, the second region R2 of Figure 2 is enlarged, and only the second circuit 122 of the circuit section 12 is shown.

[0063] The second circuit 122 has four input electrodes E11, E12, E13, and E14 formed on the resin surface of the claw portion 11b. The second circuit 122 also has four output electrodes E21, E22, E23, and E24 formed on the resin surface of the claw portion 11b. The input electrodes E11, E12, E13, and E14, and the output electrodes E21, E22, E23, and E24 are formed in parallel with each other.

[0064] The second circuit 122 has wiring W2 formed in a second pattern P2 on the resin surface of the claw portion 11b, and contributes to a second function based on the wiring W2 itself. The second pattern P2 corresponding to the second function includes a plurality of first patterns P1. In the second pattern P2, one straight line included in each of the plurality of first patterns P1 is arranged along the extending direction D2 of the main body portion 11. More specifically, a second straight line L2 included in each of the plurality of first patterns P1 is arranged along the extending direction D2 of the main body portion 11.

[0065] The input electrode E11 and the output electrode E21 are connected by the first pattern P11. The input electrode E12 and the output electrode E22 are connected by the first pattern P12. The input electrode E13 and the output electrode E23 are connected by the first pattern P13. The input electrode E14 and the output electrode E24 are connected by the first pattern P14.

[0066] The second straight line L21 of the first pattern P11, the second straight line L22 of the first pattern P12, the second straight line L23 of the first pattern P13, and the second straight line L24 of the first pattern P14 are arranged along the extending direction D2 of the main body 11. In the second pattern P2, the first pattern P11 is located furthest inward, and the first patterns P12, P13, and P14 are located further out from the first pattern P11 in this order. As a result, the second straight lines L21, L22, L23, and L24 are discretely arranged along the extending direction D2 of the main body 11, from the base of the mounting portion 11a of the claw portion 11b to the tip.

[0067] Figure 9A is a schematic diagram showing the third pattern P3 of the wiring W3 of the third circuit 123 in Figure 2. In Figure 9A, the third region R3 of Figure 2 is enlarged to show the tip of the claw portion 11b along with the third circuit 123 of the circuit portion 12. In addition to the third circuit 123 and the tip of the claw portion 11b, a resistor R and a third object S, which are not shown in Figure 2, are also shown in Figure 9A.

[0068] The third circuit 123 has an input electrode E1 and an output electrode E2 formed on the resin surface of the claw portion 11b. The input electrode E1 and the output electrode E2 are formed in parallel with each other. The third circuit 123 has wiring W3 formed in a third pattern P3 on the resin surface of the claw portion 11b, and contributes to a third function based on the wiring W3 itself. The third pattern P3 corresponding to the third function functions as a strain gauge. For example, the third pattern P3 repeatedly folds a straight line 180° at one end and then folds the folded straight line another 180° at the other end.

[0069] The third circuit 123 has two gauge leads L5 that connect one end and the other end of the wiring W3 formed in the third pattern P3 to the input electrode E1 and the output electrode E2, respectively. The gauge leads L5 are also formed on the surface of the resin of the claw portion 11b, for example, similar to the input electrode E1, the output electrode E2, and the wiring W3.

[0070] Figure 9B is a schematic diagram of each configuration shown in Figure 9A viewed from the side. As shown in Figure 9B, a resistor R is attached to the wiring W3 in the third circuit 123 on the side opposite to the claw portion 11b by any method such as adhesive. Therefore, when the end effector 10 grips the third object S, the third object S makes direct contact with the resistor R, not with the wiring W3.

[0071] In one embodiment, a thermoplastic resin is preferred as the resin used. The thermoplastic resin is not particularly limited, but examples include polyolefin resins such as polypropylene, polyethylene, and polybutene; polyester resins such as polyethylene terephthalate and polybutylene terephthalate; polyamide resins or aromatic polyamide resins such as nylon-6 and nylon 6,6; thermoplastic polyimide resins; polyamide-imide resins; polystyrene resins such as polystyrene, syndiotactic polystyrene, acrylonitrile-styrene copolymer resin, or acrylonitrile-butadiene-styrene copolymer resin; polyarylene sulfide resins such as polyphenylene sulfide; polyphenylene ether resins; polyurethane resins; polylactic acid; polyether ether ketone resins; polyetherimide resins; polyketone resins; polyarylate resins such as amorphous polyarylate and liquid crystalline polyarylate; and liquid crystalline polyester resins.

[0072] Among these, the thermoplastic resin used in one embodiment is preferably a thermoplastic polyimide resin, polyamide-imide resin, polyarylene sulfide resin, polyphenylene ether resin, polyether ether ketone resin, polyetherimide resin, polyketone resin, polyarylate resin, and liquid crystalline polyester resin, which are so-called engineering plastics or super engineering plastics that have excellent heat resistance and mechanical properties. From the viewpoint of chemical resistance, heat resistance, and mechanical properties, polyarylene sulfide resin is more preferred, and among polyarylene sulfide resins (hereinafter also referred to as "PAS resin"), polyphenylene sulfide resin (hereinafter also referred to as "PPS resin") is particularly preferred.

[0073] In one embodiment, the above resin may be used alone or in the form of a polymer alloy in which multiple resins are mixed. The resin according to one embodiment may contain a filler. The resin according to one embodiment may also be in the form of a composition containing, if necessary, any of the additive components described below (fillers, colorants, antistatic agents, antioxidants, heat stabilizers, UV stabilizers, UV absorbers, foaming agents, flame retardants, flame retardant aids, rust inhibitors, coupling agents, silane coupling agents, thermoplastic elastomers, or synthetic resins).

[0074] Polyarylene sulfide resins have a resin structure in which aromatic rings and sulfur atoms are bonded together as repeating units. Specifically, they are resins in which structural units represented by the following general formula (1) and, if necessary, trifunctional structural units represented by the following general formula (2) are repeated.

[0075] In formula (1), R １ and R ２ Each of these independently represents a hydrogen atom, an alkyl group with 1 to 4 carbon atoms, a nitro group, an amino group, a phenyl group, a methoxy group, or an ethoxy group.

[0076] The trifunctional structural site represented by formula (2) is preferably in the range of 0.001 to 3 mol%, and particularly preferably in the range of 0.01 to 1 mol%, relative to the total number of moles of the other structural sites.

[0077] Here, the structural part represented by the general formula (1) above is particularly R in the formula. １ and R ２ From the viewpoint of the mechanical strength of the above-mentioned PAS resin, it is preferable that the atom is a hydrogen atom, and in that case, examples include those bonded at the para position represented by the following formula (3) and those bonded at the meta position represented by the following formula (4).

[0078] Among these, the bond of the sulfur atom to the aromatic ring in the repeating unit is particularly preferable in terms of the heat resistance and crystallinity of the PAS resin if it is bonded at the para position as represented by the general formula (3) above.

[0079] The above-mentioned PAS resin may contain not only the structural parts represented by the above-mentioned general formulas (1) and (2), but also structural parts represented by the following structural formulas (5) to (8) in an amount of 30 mol% or less of the total of the structural parts represented by the above-mentioned general formulas (1) and (2).

[0080] In particular, in one embodiment, it is preferable that the structural parts represented by the above general formulas (5) to (8) be 10 mol% or less, from the viewpoint of heat resistance and mechanical strength of the PAS resin. When the above PAS resin contains the structural parts represented by the above general formulas (5) to (8), the bonding mode may be either a random copolymer or a block copolymer.

[0081] The above-mentioned PAS resin may have naphthyl sulfide bonds or the like in its molecular structure, but it is preferable that the amount of naphthyl sulfide bonds is 3 mol% or less, and particularly preferable that it is 1 mol% or less, relative to the total number of moles of other structural parts.

[0082] The physical properties of the PAS resin are not particularly limited as long as they do not impair the effects of one embodiment, but are as follows.

[0083] (Melting Viscosity) The melting viscosity of the PAS resin is not particularly limited, but in order to achieve a good balance between fluidity and mechanical strength, the melting viscosity (V6) measured at 300°C is preferably in the range of 2 Pa·s or more, preferably in the range of 1000 Pa·s or less, more preferably in the range of 500 Pa·s or less, and even more preferably in the range of 200 Pa·s or less. However, the melting viscosity (V6) is measured using a polyarylene sulfide resin with a Shimadzu flow tester, CFT-500D, at 300°C, with a load of 1.96 × 10⁻⁶. ６ The measured melt viscosity was obtained after holding the sample for 6 minutes at Pa and L / D = 10 (mm) / 1 (mm).

[0084] (Non-Newtonian Index) The non-Newtonian index of PAS resin is not particularly limited, but it is preferably in the range of 0.90 or higher and 2.00 or lower. When using linear polyarylene sulfide resin, the non-Newtonian index is preferably in the range of 0.90 or higher, more preferably in the range of 0.95 or higher, more preferably in the range of 1.50 or lower, and more preferably in the range of 1.20 or lower. Such polyarylene sulfide resins have excellent mechanical properties, fluidity, and abrasion resistance. However, in one embodiment, the non-Newtonian index (N value) is a value calculated using the following formula by measuring the shear rate (SR) and shear stress (SS) using a capillograph under the conditions of melting point + 20°C, orifice length (L) to orifice diameter (D), L / D = 40. The closer the non-Newtonian index (N value) is to 1, the closer the structure is to linear, and the higher the non-Newtonian index (N value), the more branched the structure is.

[0085] However, SR is the shear rate (seconds) －１ ) indicates the shear stress (dyne / cm²). SS is the shear stress (dyne / cm²). ２ This indicates that K is a constant.

[0086] The resin used in one embodiment may optionally contain a silane coupling agent as an optional component. The silane coupling agent is not particularly limited as long as it does not impair the effects of the embodiment, but silane coupling agents having a functional group that reacts with a carboxyl group, such as an epoxy group, isocyanate group, amino group, or hydroxyl group, are preferred. Examples of such silane coupling agents include epoxy group-containing alkoxysilane compounds such as γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, and β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane; isocyanato group-containing alkoxysilane compounds such as γ-isocyanatopropyltrimethoxysilane, γ-isocyanatopropyltriethoxysilane, γ-isocyanatopropylmethyldimethoxysilane, γ-isocyanatopropylmethyldiethoxysilane, γ-isocyanatopropylethyldimethoxysilane, γ-isocyanatopropylethyldiethoxysilane, and γ-isocyanatopropyltrichlorosilane; amino group-containing alkoxysilane compounds such as γ-(2-aminoethyl)aminopropylmethyldimethoxysilane, γ-(2-aminoethyl)aminopropyltrimethoxysilane, and γ-aminopropyltrimethoxysilane; and hydroxyl group-containing alkoxysilane compounds such as γ-hydroxypropyltrimethoxysilane and γ-hydroxypropyltriethoxysilane. In one embodiment, the silane coupling agent is not an essential component, but if it is included, the amount added is not particularly limited as long as it does not impair the effects of the embodiment. However, it is preferably in the range of 0.01 parts by mass or more, more preferably 0.1 parts by mass or more, preferably 10 parts by mass or less, and more preferably 5 parts by mass or less, per 100 parts by mass of resin. This range is preferable because the resin has good corona resistance and moldability, especially release properties, and the molded product exhibits excellent adhesion to epoxy resin while also improving mechanical strength.

[0087] The resin used in one embodiment may optionally contain a thermoplastic elastomer as an optional component. Examples of thermoplastic elastomers include polyolefin-based elastomers, fluorine-based elastomers, or silicone-based elastomers, of which polyolefin-based elastomers are preferred. When these elastomers are added, the amount added is not particularly limited as long as it does not impair the effects of the embodiment, but is preferably in the range of 0.01 parts by mass or more, more preferably 0.1 parts by mass or more, preferably 10 parts by mass or less, and more preferably 5 parts by mass or less, per 100 parts by mass of resin (A). This range is preferable because it improves the impact resistance of the resulting resin.

[0088] For example, the polyolefin-based elastomers mentioned above include homopolymers of α-olefins, copolymers of two or more α-olefins, and copolymers of one or more α-olefins with a vinyl polymerizable compound having a functional group. In this case, the α-olefins include ethylene, propylene, 1-butene, and other α-olefins having 2 to 8 carbon atoms. The functional groups include carboxyl groups, acid anhydride groups (-C(=O)OC(=O)-), epoxy groups, amino groups, hydroxyl groups, mercapto groups, isocyanate groups, and oxazoline groups. Examples of vinyl polymerizable compounds having the above-mentioned functional groups include vinyl acetate; α,β-unsaturated carboxylic acids such as (meth)acrylic acid; alkyl esters of α,β-unsaturated carboxylic acids such as methyl acrylate, ethyl acrylate, and butyl acrylate; metal salts of α,β-unsaturated carboxylic acids such as ionomers (metals include alkali metals such as sodium, alkaline earth metals such as calcium, and zinc); glycidyl esters of α,β-unsaturated carboxylic acids such as glycidyl methacrylate; α,β-unsaturated dicarboxylic acids such as maleic acid, fumaric acid, and itaconic acid; and derivatives of the above-mentioned α,β-unsaturated dicarboxylic acids (monoesters, diesters, acid anhydrides), one or more of these. The above-mentioned thermoplastic elastomers may be used individually or in combination of two or more types.

[0089] Furthermore, in addition to the above components, the resin used in one embodiment may optionally contain synthetic resins (hereinafter simply referred to as "synthetic resins") such as polyester resin, polyamide resin, polyimide resin, polyetherimide resin, polycarbonate resin, polyphenylene ether resin, polysulfone resin, polyethersulfone resin, polyetheretherketone resin, polyetherketone resin, polyarylene resin, polyethylene resin, polypropylene resin, polytetrafluoroethylene resin, polydifluoroethylene resin, polystyrene resin, ABS resin, phenolic resin, urethane resin, and liquid crystal polymer, depending on the application. In one embodiment, the above synthetic resins are not essential components, but when they are included, the proportion of the synthetic resin is not particularly limited as long as it does not impair the effects of the embodiment, and it will vary depending on the purpose and cannot be defined in general terms. However, as an example of the proportion of synthetic resin to be included in the resin according to one embodiment, it may be in the range of 5 parts by mass or more and 15 parts by mass or less per 100 parts by mass of resin. In other words, the ratio of resin (A) to the total of resin (A) and synthetic resin is preferably in the range of (100 / 115) or more, and more preferably in the range of (100 / 105) or more, on a mass basis.

[0090] The resin used in one embodiment may also contain, as necessary, other known and conventional additives such as fillers, colorants, antistatic agents, antioxidants, heat stabilizers, UV stabilizers, UV absorbers, foaming agents, flame retardants, flame retardant aids, rust inhibitors, and coupling agents as optional components. These additives are not essential components, and for example, they may be used in an amount of preferably 0.01 parts by mass or more, and preferably 1000 parts by mass or less, per 100 parts by mass of resin, adjusted appropriately according to the purpose and application so as not to impair the effects of the embodiment.

[0091] The method for producing the resin used in one embodiment will be described in detail below.

[0092] The resin used in one embodiment is made by blending each essential component and, if necessary, other optional components. The method for producing the resin used in one embodiment is not particularly limited, but includes a method of blending the essential components and, if necessary, optional components and then melt-kneading them, or more specifically, a method of uniformly dry-mixing them in a tumbler or Henschel mixer as needed, and then feeding them into a twin-screw extruder and melt-kneading them.

[0093] Melt mixing can be carried out by heating the resin to a temperature range in which the resin temperature is above the melting point of the resin, preferably a temperature range of 10°C or more above the melting point, more preferably 10°C or more above the melting point, even more preferably from 20°C or more above the melting point, preferably 100°C or less above the melting point, and more preferably 50°C or less above the melting point.

[0094] As the melting and mixing machine described above, a twin-screw extruder is preferred from the viewpoint of dispersibility and productivity. For example, it is preferable to melt and mix while appropriately adjusting the discharge rate of the resin component in the range of 5 to 500 kg / hr and the screw rotation speed in the range of 50 to 500 rpm, and it is even more preferable to melt and mix under conditions in which the ratio of these (discharge rate / screw rotation speed) is in the range of 0.02 to 5 kg / hr / rpm. The addition and mixing of each component to the melting and mixing machine may be done simultaneously or in stages. For example, when adding an additive among the above components, it is preferable from the viewpoint of dispersibility to introduce it into the extruder from the side feeder of the twin-screw extruder. The position of such a side feeder is preferably such that the ratio of the distance from the resin input section (top feeder) of the extruder to the total length of the screw of the twin-screw extruder is 0.1 or more, and more preferably 0.3 or more. This ratio is preferably 0.9 or less, and more preferably 0.7 or less.

[0095] The resin obtained by melt-kneading in this manner according to one embodiment is a molten mixture containing the above-mentioned essential components, optional components to be added as needed, and their derived components. After melt-kneading, it is preferable to use a known method, for example, to extrude the molten resin into strands, then process it into the form of pellets, chips, granules, powder, etc., and then pre-dry it at a temperature range of 100 to 150°C as needed.

[0096] The molded article of one embodiment is made by molding resin. The manufacturing method of the molded article of one embodiment includes a step of melt-molding the above-mentioned resin. This will be described in detail below.

[0097] The resin used in one embodiment is subjected to injection molding. Various molding conditions are not particularly limited and can be molded using generally accepted methods. For example, the resin may be melted in an injection molding machine at a temperature range above the melting point of the resin, preferably at a temperature range of 10°C or higher than the melting point, more preferably at a temperature range of 10°C to 100°C, and even more preferably at a temperature range of 20°C to 50°C. After this process, the resin may be injected into a mold from the resin outlet for molding. In this case, the mold temperature may also be set to a known temperature range, for example, room temperature (23°C) to 300°C, preferably 120 to 180°C.

[0098] According to the end effector 10 of the above embodiment, it is possible to improve the quality of the circuit that contributes to a predetermined function. The manufacturing method of the end effector 10 includes the first and fourth steps described above, but does not include the surface roughening step of the resin surface A of the main body 11. Therefore, unlike wiring formation methods using MID (Molded Interconnect Device) technology such as LDS, the end effector 10 is capable of improving the plating quality, such as the resistance value or surface roughness required for the circuit of the circuit section 12 that functions as a sensor. For example, the end effector 10 can reduce variations in the resistance value, surface roughness, and plating thickness of the circuit of the circuit section 12 that functions as a sensor. Generally, the plating quality depends on the surface roughness of the base material to be plated.

[0099] For example, in conventional technologies using MID technology, surface roughening treatments such as blasting or laser treatment are performed to promote the formation of a conductive film by plating. An anchoring effect occurs between the roughened resin and the resin or plating formed on top of it, resulting in interfacial strength. However, roughened areas can be a source of stress concentration, leading to a decrease in reliability such as repeatability. To form a circuit on the roughened resin, a plating layer thicker than the roughness is required, making it difficult to control the resistance value. If the circuit has, for example, a strain gauge pattern, it is desirable to thin the plating layer to improve the resistance value and make it applicable to general-purpose systems.

[0100] In one embodiment, the end effector 10 improves plating quality by reducing the surface roughness of the resin of the main body portion 11, which is the base material to be plated, and as a result, it is possible to improve the quality of the circuit that contributes to a predetermined function. The end effector 10 makes at least one plated layer of the circuit of the circuit portion 12 thinner, improves the resistance value, and is applicable to general-purpose systems. The end effector 10 makes it easy to obtain wiring W with a high resistance value within a range applicable to general-purpose systems. Therefore, users can easily use general-purpose systems and enjoy high convenience.

[0101] The end effector 10 can achieve high performance in various aspects, for example, with respect to at least one plating layer constituting the circuit of the circuit section 12. These aspects include, for example, initial stability corresponding to variations in the resistance value of the plating at the time of molding. These aspects include, for example, load-bearing stability corresponding to variations in the change in resistance value between products when a load is applied to the circuit of the circuit section 12, or the reversibility of the resistance value before and after load application. These aspects include, for example, repeatability corresponding to variations in the repeated change in resistance value when a load is repeatedly applied to the circuit of the circuit section 12, or the reversibility of the repeated resistance value. As a result, the end effector 10 can improve the stability, accuracy, and durability of the circuit of the circuit section 12, thereby realizing a highly reliable circuit.

[0102] In addition, since the end effector 10 can improve its resistance by making the plating layer thin and uniform, it can generate a large resistance change due to the high resistance value, thereby improving its sensitivity to load. Therefore, the end effector 10 can improve the sensitivity of the circuit section 12, which includes a circuit that contributes to a predetermined function as a sensor, and thereby improve the accuracy of the sensor.

[0103] Unlike conventional technologies using MID, the end effector 10 can make the resin surface A of the main body 11 relatively smooth, thus easing the precision required for various manufacturing conditions related to the plating process. The end effector 10 can reduce the roughness of surface A and widen the process window, which is the range of settings for the plating conditions. As a result, the end effector 10 can lower the required precision for the manufacturing process of drawing the circuit of the circuit section 12 on the resin surface A of the main body 11, making the manufacturing process easier to carry out.

[0104] Unlike conventional technologies using LDS, the end effector 10 does not require laser surface roughening, and therefore does not require the incorporation of special fillers into the resin of the main body 11. The end effector 10 allows for easy formation of a plating layer simply by applying a metal bonding agent G to the surface A of the resin of the main body 11. Therefore, the end effector 10 can also improve the design flexibility of the physical properties of the molded main body 11. For example, the end effector 10 can be constructed using a softer material for the main body 11. For example, the end effector 10 can use a molded product rich in rubber components or thermoplastic elastomer components as the main body 11.

[0105] Thus, the end effector 10 can also alleviate the constraints on the material of the main body 11. The end effector 10 can also alleviate the constraint that it is necessary to incorporate specific components. In addition, the end effector 10 can also alleviate the constraints on the color of the main body 11. In conventional techniques that roughen surfaces using lasers, there has been a tendency to adopt a dark color for the main body 11. However, in the end effector 10 according to one embodiment, since the metal bonding agent G is applied only to the surface A of the resin of the main body 11, it is less subject to constraints on the color of the main body 11. Furthermore, by appropriately selecting the functional groups of the triazine derivative contained in the metal bonding agent G, the end effector 10 can achieve high affinity with any resin, including PPS resin and other resins.

[0106] The total thickness h of at least one plating layer is, for example, 0.01 μm or more and 100 μm or less. This allows the end effector 10 to easily improve the resistance value of the circuit in the circuit section 12.

[0107] The surface roughness of the resin surface A of the main body 11 is 0.1 μm or more and 1.0 μm or less. As a result, the end effector 10 can improve the plating quality and the quality of the circuit that contributes to the predetermined function, as described above.

[0108] The plating layer is integrally formed with the resin of the main body 11 via a metal bonding layer 124 and has a first layer 125a containing a first metal and a second layer 125b laminated on the first layer 125a and containing a second metal having a higher resistivity than the first metal. As a result, the end effector 10 can easily improve the resistance value of the circuit of the circuit section 12. Alternatively, as shown in Figure 5B, the end effector 10 can further improve the resistance value of the circuit of the circuit section 12 by replacing the portion of the first layer 125a with the second layer 125b.

[0109] The plating layer is laminated on the second layer 125b and further comprises a third layer 125c containing gold. This allows the end effector 10 to be easily protected as a whole by the gold of the third layer 125c.

[0110] It will be apparent to those skilled in the art that this disclosure can be implemented in other predetermined forms besides the embodiments described above without deviating from its spirit or essential features. Therefore, the prior description is illustrative and not limiting. The scope of the disclosure is defined not by the prior description but by the added claims. Any modifications within their equivalent scope are included therein.

[0111] For example, the shape, pattern, size, arrangement, orientation, type, and number of each component described above are not limited to those shown in the above description and drawings. The shape, pattern, size, arrangement, orientation, type, and number of each component may be configured arbitrarily as long as they can realize their function. The components of the end effector 10 and robot arm 1 shown are functional concepts, and the specific form of each component is not limited to those shown.

[0112] In the above embodiment, it was explained that in the laminate 125, the second metal constituting the second layer 125b has a higher resistivity than the first metal constituting the first layer 125a, but this is not limited to this. The resistivity of the second metal may be less than or equal to the resistivity of the first metal. The first metal was explained as, for example, copper, but this is not limited to this. The first metal may be a metal other than copper. The second metal was explained as, for example, nickel, but this is not limited to this. The second metal may be a metal other than nickel. The first metal and the second metal may be different from each other or may be the same.

[0113] In the above embodiment, the first function, second function, and third function were given as examples of predetermined functions, but the types and number of functions are not limited to these. The predetermined function may include only a part of the first function, second function, and third function. The predetermined function may include at least one other type of function in place of or in addition to at least a part of the first function, second function, and third function.

[0114] In the above embodiment, the first pattern P1 was described as including three first lines L1, second lines L2, and third lines L3, but is not limited thereto. The first pattern P1 may be any other pattern that can contribute to the first function.

[0115] Figure 10 is a schematic diagram showing a first pattern P1 of the wiring W1 of a first circuit 121 according to a modified example of the present disclosure. In Figure 10, as in Figure 7, the first region R1 of Figure 2 is enlarged to show only the first circuit 121 of the circuit section 12. As shown in Figure 10, in the first circuit 121, the first pattern P1 may include only a fourth straight line L4 extending from the input electrode E1 to the output electrode E2. In the first circuit 121, the input electrode E1 and the output electrode E2 do not have to be formed in parallel with each other, and may be formed on one end and the other end of the fourth straight line L4, respectively.

[0116] In the above embodiment, the second pattern P2 was described as including four first patterns P11, P12, P13, and P14, but is not limited thereto. The second pattern P2 may be any other pattern that can contribute to the second function, instead of the pattern shown in Figure 8. For example, the second pattern P2 may include more first patterns P1 and be formed at finer intervals along the extending direction D2. This makes it possible for the end effector 10 to narrow the predetermined numerical range for height measurement and improve resolution.

[0117] Figure 11 is a schematic diagram showing a second pattern P2 of the wiring W2 of a second circuit 122 according to a modified example of the present disclosure. In Figure 11, as in Figure 8, the second region R2 of Figure 2 is enlarged to show only the second circuit 122 of the circuit section 12. For example, the second pattern P2 may be configured as shown in Figure 11 to match the first pattern P1 shown in Figure 10. For example, in the second pattern P2, one fourth straight line L4 included in each of the multiple first patterns P1 may be arranged along the extending direction D2 of the main body section 11.

[0118] The fourth straight line L41 of the first pattern P11, the fourth straight line L42 of the first pattern P12, the fourth straight line L43 of the first pattern P13, and the fourth straight line L44 of the first pattern P14 are arranged along the extending direction D2 of the main body 11. In the second pattern P2, the first pattern P11 is located furthest away from the tip of the claw portion 11b, and the first patterns P12, P13, and P14 are located in this order closer to the tip of the claw portion 11b. As a result, the fourth straight lines L41, L42, L43, and L44 are discretely arranged along the extending direction D2 of the main body 11, from the base of the claw portion 11b on the mounting portion 11a side toward the tip.

[0119] In the above embodiment, the second pattern P2 was described as contributing to a second function of detecting the height of a second object, but it is not limited to this. The second pattern P2 may also contribute to a function of detecting the position of a second object along the horizontal direction by having the robot arm 1 move the end effector 10 in the horizontal direction instead of the height direction.

[0120] In the above embodiment, the third pattern P3 was described as repeatedly folding a straight line 180° at one end and then folding the folded straight line another 180° at the other end, but it is not limited to this. The third pattern P3 may be any other pattern that can contribute to the third function.

[0121] In the above embodiment, the circuit of the circuit section 12 was described as contributing to a predetermined function based on the wiring itself, but this is not limited to this. The circuit section 12 may have sensor elements that contribute to a predetermined function, which are mounted on the circuit of the circuit section 12 by soldering or the like, in place of or in addition to the wiring that contributes to a predetermined function. In this disclosure, "sensor elements" may include, for example, microphones, proximity sensors, vibration sensors, PH sensors, LiDAR (Light Detection And Ranging) sensors, and image sensors. As a result, the end effector 10 can contribute to even more functions.

[0122] In addition, the circuit section 12 may have control elements that are mounted on the circuit of the circuit section 12 by soldering or the like and that perform processing necessary to realize a predetermined function. In this disclosure, "control elements" may include, for example, a microcontroller, a processor, a programmable circuit, a dedicated circuit, or any combination thereof. This makes it possible for the end effector 10 to perform the various processing described above that is performed by the control unit 40 of the robot arm 1. The end effector 10 can also perform judgment processing, learning processing, and other arbitrary processing on its own.

[0123] In the above embodiment, it was explained that the entire main body portion 11, including the mounting portion 11a and the claw portion 11b, is made of resin, but this is not limited to that. It is sufficient that at least the portion of the main body portion 11 in which the circuit is formed is made of resin, and other parts of the main body portion 11 may be made of any material other than resin.

[0124] In the above embodiment, the circuits of the circuit section 12 were described as including a first circuit 121, a second circuit 122, and a third circuit 123, but are not limited thereto. The number, types, and arrangement of the circuits included in the circuit section 12, as well as their arrangement in the main body 11, may be determined in any configuration that can contribute to each function. For example, if a predetermined function includes only a part of the first, second, and third functions, the circuits of the circuit section 12 may include only those corresponding to that part. For example, if a predetermined function includes at least one other type of function in place of or in addition to at least a part of the first, second, and third functions, the circuits of the circuit section 12 may include those corresponding to these functions.

[0125] In the above embodiment, each circuit of the circuit section 12 is formed on the surface of the claw portion 11b and is configured to be entirely exposed to the outside, but is not limited to this. Each circuit of the circuit section 12 may be sealed with a resin that has high waterproof and water-resistant properties, such as PPS resin, except for the part that contributes to a predetermined function. This can further improve the waterproof and water-resistant properties of the end effector 10.

[0126] Figure 12 is a schematic diagram showing the appearance of an end effector 10 according to a modified example of the present disclosure. In the above embodiment, the end effector 10 was described as having a pair of claw portions 11b, i.e., two claw portions 11b, but is not limited thereto. The end effector 10 may have three or more claw portions 11b. For example, as shown in Figure 12, the end effector 10 may have three claw portions 11b.

[0127] Some embodiments of the present disclosure are described below. However, it should be noted that embodiments of the present disclosure are not limited to these. [Note 1] A method for manufacturing an end effector used in a robot, comprising the steps of: forming wiring integrally on the surface of a resin body containing resin in a predetermined pattern, and configuring a circuit part including a circuit that contributes to a predetermined function based on the wiring itself, wherein the steps include: a first step of applying a metal bonding agent to the surface of the body; a second step of forming a first seed layer on the metal bonding agent by first plating; a third step of covering the first seed layer with a mask corresponding to the predetermined pattern and forming a second seed layer on the exposed surface of the first seed layer from the mask by second plating; and a fourth step of peeling off the mask and peeling off the first seed layer and the second seed layer to form at least one plating layer at a position corresponding to the exposed surface. [Note 2] A method for manufacturing an end effector as described in Note 1, wherein the fourth step of forming the plating layer comprises the steps of leaving a first layer containing a first metal intact when peeling off the first seed layer and the second seed layer, and laminating a second layer containing a second metal onto the first layer by plating. [Note 3] A method for manufacturing an end effector as described in Note 2, wherein the first metal is copper, and the second metal is nickel. [Note 4] A method for manufacturing an end effector as described in Note 2 or 3, wherein the fourth step of forming the plating layer further comprises the step of laminating a third layer containing gold onto the second layer by plating. [Note 5] An end effector for use in a robot, comprising: a main body containing resin; and a circuit section having wiring integrally formed on the surface of the resin in the main body in a predetermined pattern, and including a circuit that contributes to a predetermined function based on the wiring itself, wherein the wiring comprises a metal bonding layer disposed between the surface of the main body and a plating layer, and at least one plating layer laminated on the metal bonding layer.[Note 6] An end effector according to Note 5, wherein the total thickness of at least one plating layer is 0.01 μm or more and 100 μm or less. [Note 7] An end effector according to Note 5 or 6, wherein the surface roughness of the resin of the main body is 0.1 μm or more and 1.0 μm or less. [Note 8] An end effector according to any one of Notes 5 to 7, wherein the plating layer comprises a first layer integrally formed with the resin via the metal bonding layer and containing a first metal, and a second layer laminated on the first layer and containing a second metal. [Note 9] An end effector according to Note 8, wherein the first metal is copper and the second metal is nickel. [Note 10] An end effector according to Note 8 or 9, wherein the plating layer further comprises a third layer containing gold, which is laminated on the second layer. [Note 11] A robot arm comprising the end effector according to any one of Notes 5 to 10.

[0128] 1 Robot arm 1a Housing 10 End effector 11 Main body 11a Mounting part 11b Claw part 12 Circuit part 121 First circuit 122 Second circuit 123 Third circuit 124 Metal bonding layer 125 Laminate 125a First layer 125b Second layer 125c Third layer 20 Memory unit 30 Drive unit 40 Control unit A Surface D1 Separation direction D2 Extension direction E1, E11, E12, E13, E14 Input electrodes E2, E21, E22, E23, E24 Output electrodes G Metal bonding agent L1 First straight line L2, L21, L22, L23, L24 Second straight line L3 Third straight line L4, L41, L42, L43, L44 Fourth straight line L5 Gauge lead M Mask P1, P11, P12, P13, P14 First pattern P2 Second pattern P3 Third pattern R Resistor R1 First region R2 Second region R3 Third region S Third object S1 First seed layer S2 Second seed layer W, W1, W2, W3 Wiring h Thickness

Claims

1. A method for manufacturing an end effector used in a robot, comprising the steps of: forming wiring integrally on the surface of a resin body in a predetermined pattern, and constructing a circuit part including a circuit that contributes to a predetermined function based on the wiring itself, wherein the steps include: a first step of applying a metal bonding agent to the surface of the body; a second step of forming a first seed layer on the metal bonding agent by first plating; a third step of covering the first seed layer with a mask corresponding to the predetermined pattern and forming a second seed layer on the exposed surface of the first seed layer from the mask by second plating; and a fourth step of peeling off the mask, peeling off the first seed layer and the second seed layer, and forming at least one plating layer at a position corresponding to the exposed surface.

2. A method for manufacturing an end effector according to claim 1, wherein the fourth step of forming the plating layer includes a step of leaving a first layer containing a first metal intact when peeling off the first seed layer and the second seed layer, and a step of laminating a second layer containing a second metal onto the first layer by plating.

3. A method for manufacturing an end effector according to claim 2, wherein the first metal is copper and the second metal is nickel.

4. A method for manufacturing an end effector according to claim 2 or 3, wherein the fourth step of forming the plating layer further comprises a step of laminating a third layer containing gold onto the second layer by plating.

5. An end effector for use in a robot, comprising: a main body containing resin; and a circuit section having wiring integrally formed on the surface of the resin in the main body in a predetermined pattern, and including a circuit that contributes to a predetermined function based on the wiring itself, wherein the wiring comprises a metal bonding layer disposed between the surface of the main body and a plating layer, and at least one plating layer laminated on the metal bonding layer.

6. An end effector according to claim 5, wherein the total thickness of at least one plating layer is 0.01 μm or more and 100 μm or less.

7. An end effector according to claim 5, wherein the surface roughness of the resin of the main body is 0.1 μm or more and 1.0 μm or less.

8. An end effector according to any one of claims 5 to 7, wherein the plating layer comprises a first layer integrally formed with the resin via the metal bonding layer and containing a first metal, and a second layer laminated on the first layer and containing a second metal.

9. An end effector according to claim 8, wherein the first metal is copper and the second metal is nickel.

10. An end effector according to claim 8, wherein the plating layer further comprises a third layer containing gold, which is laminated on the second layer.

11. A robotic arm comprising an end effector according to any one of claims 5 to 7.

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